WO2019196524A1 - 输入输出组件和终端 - Google Patents

输入输出组件和终端 Download PDF

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Publication number
WO2019196524A1
WO2019196524A1 PCT/CN2019/070765 CN2019070765W WO2019196524A1 WO 2019196524 A1 WO2019196524 A1 WO 2019196524A1 CN 2019070765 W CN2019070765 W CN 2019070765W WO 2019196524 A1 WO2019196524 A1 WO 2019196524A1
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WO
WIPO (PCT)
Prior art keywords
input
cavity
output
module
bracket
Prior art date
Application number
PCT/CN2019/070765
Other languages
English (en)
French (fr)
Inventor
赵斌
Original Assignee
Oppo广东移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Publication of WO2019196524A1 publication Critical patent/WO2019196524A1/zh

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly

Definitions

  • the present application relates to the field of consumer technology, and more particularly to an input and output component and a terminal.
  • the function modules usually need to be electrically connected to the main board of the mobile phone. When installing the function module, it is often necessary to install the function module in a unique installation direction.
  • the module can be electrically connected to the motherboard, which reduces the assembly efficiency of the mobile phone.
  • Embodiments of the present application provide an input and output component and a terminal.
  • the input/output component of the embodiment of the present application includes a circuit board and an input/output module, the circuit board includes a board body and a plurality of sets of contacts formed on the board body; the input/output module includes a main body and a spring piece, The shrapnel is disposed on the main body and protrudes from the main body, and the elastic piece is used to contact any one of the contacts to electrically connect the input/output module and the circuit board.
  • the terminal of the embodiment of the present application includes a housing and an input and output assembly, the input and output assembly is mounted in the housing, the input and output assembly includes a circuit board and an input and output module, and the circuit board includes a board body and is formed on the board a plurality of sets of contacts on the board; the input/output module includes a main body and a spring piece, the elastic piece is disposed on the main body and protrudes from the main body, and the elastic piece is used for any group Contact contacts are used to electrically connect the input and output modules to the circuit board.
  • FIG. 1 is a perspective exploded view of a terminal according to an embodiment of the present application.
  • FIG. 2 is a plan view showing the planar assembly of the input and output assembly of the embodiment of the present application
  • FIG. 3 is a plan view showing a planar assembly of another angle of the input and output assembly of the embodiment of the present application;
  • FIG. 4 is a perspective exploded view of an input/output component according to an embodiment of the present application.
  • FIG. 5 is a perspective exploded view showing another angle of the input/output assembly of the embodiment of the present application.
  • FIG. 6 is a schematic diagram of installation of one direction of an input/output module according to an embodiment of the present application.
  • FIG. 7 is a schematic view showing the mounting of the input/output module of the embodiment of the present application in another direction;
  • FIG. 8 is a partial cross-sectional view of a terminal of an embodiment of the present application.
  • FIG. 9 to FIG. 12 are partial structural diagrams of a laser projection module of an input/output assembly according to an embodiment of the present application.
  • the first feature "on” or “below” the second feature may be the direct contact of the first and second features, or the first and second features are indirectly through the intermediate medium, unless otherwise explicitly stated and defined. contact.
  • the first feature "above”, “above” and “above” the second feature may be that the first feature is directly above or above the second feature, or merely that the first feature level is higher than the second feature.
  • the first feature “below”, “below” and “below” the second feature may be that the first feature is directly below or obliquely below the second feature, or merely that the first feature level is less than the second feature.
  • the input/output component 30 of the embodiment of the present application includes a circuit board 33 and an input and output module 34.
  • the circuit board 33 includes a board body 331 and a plurality of sets of contacts 332 formed on the board body 331; the input and output modules
  • the set 34 includes a body 342 and a resilient piece 343 disposed on the body 342 and projecting from the body 342 for contacting an arbitrary set of the contacts 332 for electrical connection.
  • the input/output module 34 and the circuit board 33 are described.
  • the input and output module 34 is a receiver.
  • the body 342 is centrally symmetric or axisymmetric in shape.
  • the input and output assembly 30 further includes a bracket 32 on which the circuit board 33 is mounted, the bracket 32 includes a body 321 including the opposite first side
  • the second surface 3212 defines at least one receiving cavity 322.
  • the first surface 3211 defines a through hole 323 corresponding to the receiving cavity 322.
  • the input/output module 34 is fixedly mounted.
  • the through hole 323 is used to expose the input/output module 34 from the first surface 3211 in the receiving cavity 322 and exposed from the second surface 3212.
  • the opening size of the through hole 323 is smaller than the size of the corresponding receiving cavity 322 to form a limiting ring 327.
  • the receiving cavity 322 is surrounded by the limiting ring 327 and surrounding the limiting hole.
  • the inner wall of the ring 327 extends.
  • At least one of the receiving cavities 322 includes a first cavity 3221, a second cavity 3222, a third cavity 3223, and a fourth cavity 3224, which are sequentially arranged, the body 321 including a sidewall, the sidewall
  • the first surface 3211 and the second surface 3212 are connected.
  • the sidewall 3213 includes a top sidewall 3214 and a bottom sidewall 3215.
  • the input/output assembly 30 further includes a plurality of optical modules 31.
  • the optical module 31 is fixedly mounted in the first cavity 3221, the second cavity 3222 and the fourth cavity 3224, and the input/output module 34 is installed in the third cavity 3223.
  • the plurality of optical modules 31 include a laser projection module 311, a visible light imaging module 312, and an infrared imaging module 314.
  • the centers of the first cavity 3221, the second cavity 3222, and the fourth cavity 3224 are on the same straight line, and the center of the third cavity 3223 is located at the straight line and the bottom. Between the side walls 3215.
  • the bracket 32 further includes a positioning post 324 protruding from the first surface 3211 and/or the second surface 3212, and the plate body 331 is provided with a positioning hole 3314.
  • a positioning post 324 extends into the positioning hole 3314 to position the mounting position of the circuit board 33 on the bracket 32.
  • the plate body 331 includes a first segment 3311 and a second segment 3312, the first segment 3311 is coupled to the first face 3211, and the second segment 3312 is coupled to the first segment On the two sides 3212, a plurality of sets of the contacts 332 are formed on the second section 3312.
  • the input and output assembly 30 further includes an infrared fill light 35, a proximity sensor 36, and a light sensor 37, the infrared fill light 35, the proximity sensor 36, and the light sensor 37 are both Connected to the first segment 3311.
  • the terminal 100 of the embodiment of the present application includes a housing 10 and an input/output assembly 30 according to any of the above embodiments, and the input/output assembly 30 is mounted in the housing 10.
  • the terminal 100 further includes a main board 20 fixed in the housing 10, and the circuit board 33 is configured to electrically connect the input/output module 34 and the main board 20.
  • the terminal 100 of the embodiment of the present application includes a housing 10 , a main board 20 , and an input and output assembly 30 .
  • the terminal 100 may be a mobile phone, a tablet computer, a laptop computer, a game machine, a head display device, an access control system, a teller machine, etc.
  • the embodiment of the present application is described by taking the terminal 100 as a mobile phone as an example. It can be understood that the specific form of the terminal 100 may be other There are no restrictions here.
  • the housing 10 can serve as a mounting carrier for the main board 20 and the input/output assembly 30.
  • the housing 10 can provide protection against dust, water, and fall of the main board 20 and the input/output assembly 30.
  • Components such as display screens and batteries are installed.
  • the housing 10 includes a front housing 11 and a rear housing 12, and the front housing 11 and the rear housing 12 are coupled to each other and the main board 20 and the input/output assembly 30 are received between the front housing 11 and the rear housing 12, and the front housing 11 and the rear housing 12 are Made of stainless steel, aluminum alloy, plastic and other materials.
  • the main board 20 is fixed in the casing 10.
  • the main board 20 can be fixed on the front shell 11 or the rear shell 12 by screwing, snapping or the like.
  • the main board 20 can be connected to the optical module 31 and the input/output module 34 of the input/output unit 30.
  • the main board 20 can also be connected to the processing chip, the control chip and the like of the terminal 100.
  • the lines laid on the main board 20 can be used for transmitting electrical signals.
  • the main board 20 is formed with a mounting opening for the input/output assembly 30 to pass through, reducing the space occupied by the main board 20 and the input/output unit 30 when installed in the housing 10.
  • the input and output assembly 30 is mounted in the housing 10.
  • the input and output assembly 30 includes an optical module 31, an input and output module 34, a bracket 32, and a circuit board 33.
  • the optical module 31, input and output The module 34 and the circuit board 33 are both mounted on the bracket 32.
  • the optical module 31 can be used to receive or emit light, wherein the light received or emitted can be visible light, infrared light or ultraviolet light or the like.
  • the optical module 31 includes an infrared imaging module 314, a visible light imaging module 312, and a laser projection module 311.
  • the infrared imaging module 314 can be configured to receive an infrared light signal from the outside to generate an infrared image.
  • the visible light imaging module 312 can receive visible light signals from the outside to generate a color image.
  • the laser projection module 311 can be used to project a laser pattern to a target object outside the terminal 100, and the laser can be an infrared laser.
  • the infrared imaging module 314 can receive the laser pattern emitted by the laser projection module 311 and reflected by the target object.
  • the laser projection module 311 and the infrared imaging module 314 are used together to obtain the depth information of the target object.
  • the infrared imaging module 314, the visible light imaging module 312, and the laser projection module 311 can be used together to obtain a depth image of the target user.
  • the optical module 31 can be provided with a connector 38.
  • the connector 38 can be inserted into a specific connecting base on the main board 20 to electrically and mechanically connect the optical module 31 and the main board 20, and pull the connector 38 from the connecting base.
  • the optical module 31 can be separated from the main board 20 and disconnected from each other.
  • the specific form and number of the optical modules 31 are not limited to the examples of the embodiments of the present application.
  • the input/output module 34 can send a signal to the outside world or receive an external signal, or have the function of sending a signal to the outside world and receiving a signal from the outside, wherein the signal can be a light signal, a sound signal, a touch signal, or the like. It can be understood that the specific types of the input and output modules 34 and the number of each of the input and output modules 34 may vary according to different functional requirements of the terminal 100.
  • the input/output module 34 is a receiver 341, and the receiver 341 emits sound waves to perform a call and the like under the action of the driving signal.
  • the specific form of the input/output module 34 is not limited to the receiver 341, and may be other, for example, the optical module 31 or the fingerprint sensor described above.
  • the input and output module 34 includes a main body 342 and a spring piece 343.
  • the main body 342 may be an outer casing of the input/output module 34.
  • the elastic piece 343 is disposed on the main body 342 and protrudes from the main body 342.
  • the input/output module 34 can receive an electrical signal from an external device through the elastic piece 343 or transmit an electrical signal to the external device through the elastic piece 343.
  • the input and output module 34 includes two elastic pieces 343.
  • the input/output module 34 is correctly electrically connected to the external device, and only one elastic piece 343 and the external device are connected. When turned on, it indicates that the input/output module 34 is not properly electrically connected to the external device.
  • the bracket 32 is an integrally formed structure, and the bracket 32 is used for mounting the optical module 31, the input/output module 34, and the circuit board 33.
  • the bracket 32 includes a body 321 .
  • the body 321 includes a first face 3211, a second face 3212, and a sidewall 3213.
  • the first side 3211 and the second side 3212 are opposite each other.
  • the side wall 3213 connects the first surface 3211 and the second surface 3212.
  • the side wall 3213 includes opposite top side walls 3214 and bottom side walls 3215.
  • the side wall 3213 of the bracket 32 can abut against the inner wall of the mounting opening, so that the bracket 32 is caught in the mounting opening. It is only necessary to fix the position of the main board 20 to prevent the input/output unit 30 from moving in the width direction of the terminal 100 (in the Y direction in FIG. 1).
  • the second surface 3212 defines a receiving cavity 322 .
  • the first surface 3211 defines a through hole 323 corresponding to the receiving cavity 322.
  • the receiving cavity 322 is located between the top sidewall 3214 and the bottom sidewall 3215.
  • the receiving cavity 322 is configured to receive the optical module 31 and the input and output module 34.
  • the specific shape of the receiving cavity 322 corresponds to the shape of the corresponding optical module 31 and the input/output module 34.
  • the cavity of the receiving cavity 322 can be slightly larger than the optical module 31 and the input/output module 34 to facilitate the insertion in the receiving cavity 322.
  • the cavity of the receiving cavity 322 can also be slightly smaller than the optical module 31 and the input/output module 34 so that the optical module 31 and the input/output module 34 can be installed in the receiving cavity 322 by an interference fit.
  • the number of receiving cavities 322 may be equal to the total number of optical modules 31 and input and output modules 34.
  • the exposure means that the optical module 31 and the input/output module 34 can be seen from the first surface 3211 or the second surface 3212.
  • the optical module 31 and the input/output module 34 can be worn.
  • the through hole 323 of the first surface 3211 is exposed from the first surface 3211, and the optical module 31 and the input/output module 34 may not pass through the through hole 323, but the input and output module 34 may be seen through the through hole 323.
  • the bracket 32 is formed with a limit ring 327. Specifically, the opening size of the through hole 323 is smaller than the corresponding receiving cavity 322 to form the limiting ring 327.
  • the receiving cavity 322 is defined by the limiting ring 327. It is formed with an inner wall that extends around the limit ring 327.
  • the input and output module 34 and the limiting ring 327 are opposite to each other, indicating that the optical module 31 and the input and output module 34 are mounted in position, and the glue can be dispensed into the receiving cavity 322 at this time, specifically, the optical module 31 and the receiving cavity can be The inner wall of the 322 and the gap between the input/output module 34 and the inner wall of the receiving cavity 322 are dispensed. After the glue is solidified, the optical module 31 and the input/output module 34 are fixedly mounted in the receiving cavity 322.
  • the receiving cavity 322 includes a first cavity 3221, a second cavity 3222, a third cavity 3223, and a fourth cavity 3224 which are sequentially arranged.
  • the ordering may be sequentially arranged along the length direction of the bracket 32, and may be sequentially arranged from left to right, or may be arranged from right to left.
  • the first cavity 3221 is for mounting the laser projection module 311
  • the second cavity 3222 is for mounting the visible light imaging module 312
  • the third cavity 3223 is for mounting the input and output module 34 (the receiver 341)
  • the fourth cavity 3224 is for mounting.
  • the laser projection module 311, the visible light imaging module 312, the input and output module 34, and the infrared imaging module 314 can be sequentially installed in the first cavity 3221, the second cavity 3222, the third cavity 3223, and the fourth.
  • the first cavity 3221, the second cavity 3222, the third cavity 3223, and the fourth cavity 3224 may be spaced apart from each other, or may be adjacent to two or three receiving cavities 322.
  • the input/output module 34 is mounted in the third cavity 3223, the main body 342 is received in the third cavity 3223, and the elastic piece 343 protrudes in the direction from the first surface 3211 to the second surface 3212.
  • the through hole 323 includes a first through hole 3231, a second through hole 3232, a third through hole 3233, and a fourth through hole 3234, a first through hole 3231, a second through hole 3232, a third through hole 3233, and a fourth through hole 3234 is respectively connected to the first cavity 3221, the second cavity 3222, the third cavity 3223 and the fourth cavity 3224, that is, the first through hole 3231 communicates with the first cavity 3221, and the second through hole 3232 and the second cavity
  • the third through hole 3233 is in communication with the third cavity 3223
  • the fourth through hole 3234 is in communication with the fourth cavity 3224.
  • the third through hole 3233 also corresponds to the sound outlet of the receiver 341.
  • the aperture of the third through hole 3233 may be smaller than the aperture of the sound outlet of the receiver 341.
  • the receiver 341 may not pass through the third through hole 3233, and the sound wave emitted by the receiver 341 may pass through the third through hole 3233 and enter the outside.
  • the centers of the first through holes 3231, the second through holes 3232 and the fourth through holes 3234 are located on the same straight line L, and the third through holes 3233 are located between the straight line L and the bottom side wall 3215 (as shown in FIG. 2), in one In the example, the centers of the first cavity 3221, the second cavity 3222, and the fourth cavity 3224 are also located on the straight line L, and the center of the third cavity 3223 is located between the straight line and the bottom sidewall 3215.
  • the laser projection module 311 passes through the first through hole 3231, and the visible light imaging module 312 passes through the second through hole 3232.
  • the imaging module 314 passes through the fourth through hole 3234, and the optical axes of the three are located in the same plane, which is easy for the three to work together.
  • the top surface of the through-hole 323 of the infrared imaging module 314, the visible light imaging module 312, and the laser projection module 311 is also flush, specifically, the light-incident surface of the infrared imaging module 314 and the visible light imaging module 312
  • the light surface and the light exit surface of the laser projection module 311 may be located on the same plane.
  • the circuit board 33 may be a flexible circuit board, a printed circuit board or a soft and hard combination board.
  • the circuit board 33 is used for electrically connecting the input/output module 34 and the main board 20 .
  • the circuit board 33 includes a board body 331 and a plurality of sets of contacts 332. A plurality of sets of contacts 332 are formed on the plate body 331.
  • the plate body 331 is provided with a connecting line, and the plate body 331 includes a first segment 3311 and a second segment 3312.
  • the first segment 3311 is combined with the first surface 3211
  • the second segment 3312 is combined with the second surface 3212, wherein the bonding may be combined by screwing, gluing, etc., in one example, the first segment 3311 is attached to the first surface 3211.
  • the second segment 3312 is attached to the second surface 3212.
  • a plurality of sets of contacts 332 are formed on the second segment 3312.
  • the shape of the main body 342 of the input/output module 34 is an axisymmetric shape, for example, a substantially rectangular parallelepiped shape, and the shape and input/output mode of the third cavity 3223
  • the shape of the group 34 corresponds.
  • the number of the contacts 332 is two.
  • the input/output module 34 is mounted in the first direction or the second direction, and the input/output module 34 can be electrically connected to the main board 20 through the circuit board 33.
  • the number of the contacts 332 may be four groups, and the input and output module 34 may be installed in the bracket 32 in at least four directions, and the elastic piece 343 and one set of the contacts 332 contact.
  • the shape of the main body 342 can also be a centrally symmetrical shape, for example, a substantially cylindrical shape, and the shape of the third cavity 3223 corresponds to the shape of the input/output module 34, and the input/output module 34 can be mounted on the bracket 32 in any direction. Inside, and the elastic piece 343 is brought into contact with one of the contacts 332.
  • the input/output module 34 can be in contact with any set of contacts 332 to electrically connect the input/output module 34 and the circuit board 33.
  • the input and output module 34 can be installed in multiple mounting directions, which improves the assembly efficiency of the terminal 100.
  • the brackets 32 are integrally formed, the plurality of optical modules 31 and the input and output modules 34 can be mounted on the same bracket 32 and housed in the receiving cavity 322.
  • the installation space inside the terminal 100 is saved, which is beneficial to realize the terminal. 100 is light and thin.
  • the optical module 31 and the input/output module 34 mounted on the same bracket 32 do not change the relative positions of the plurality of optical modules 31 and the input/output modules 34 due to the movement of the bracket 32, thereby making a plurality of opticals
  • the module 31 and the input and output module 34 can work better together.
  • the plate body 331 further includes a connecting portion 3313 connecting the first segment 3311 and the second segment 3312 , and the connecting segment 3313 can be coupled with the top sidewall 3214 .
  • the top sidewall 3214 may be provided with a notch 3216, and the connecting portion 3313 is disposed on the notch 3216 for positioning the connecting segment 3313.
  • the input and output assembly 30 further includes an infrared fill light 35, a proximity sensor 36, and a light sensor 37.
  • the infrared fill light 35, the proximity sensor 36, and the light sensor 37 are both Installed on the first segment 3311.
  • the input/output module 34, the infrared fill light 35, the proximity sensor 36, and the light sensor 37 can be connected through a circuit board 33, and the overall structure of the input/output assembly 30 is relatively simple and compact.
  • the bracket 32 further includes a positioning post 324.
  • the positioning post 324 can be formed from the first surface 3211, or can be formed from the second surface 3212, or can be positioned.
  • the post 324 is simultaneously formed to protrude from the first face 3211 and the second face 3212.
  • a positioning hole 3314 is defined in the plate body 331. When the circuit board 33 is mounted on the bracket 32, the positioning post 324 extends into the positioning hole 3314 to position the mounting position of the circuit board 33 on the bracket 32.
  • the positioning hole 3314 is simultaneously opened on the first segment 3311 and the second segment 3312, and the position where the positioning hole 3314 is opened may correspond to the position of the positioning post 324 described above.
  • the first surface 3211 is provided with a bracket positioning hole 325 for positioning the mounting position of the bracket 32 .
  • the number of the bracket positioning holes 325 may be one or more. In the embodiment of the present application, the number of the bracket positioning holes 325 is two, and the two bracket positioning holes 325 are opened at diagonally opposite positions of the body 321 .
  • a front housing positioning post 111 may be protruded from the front housing 11 . When the first surface 3211 abuts the front housing 11 , the front housing positioning post 111 protrudes into the bracket positioning hole 325 and the bracket.
  • the positioning holes 325 cooperate, and the cooperation of the front housing positioning post 111 and the bracket positioning hole 325 can quickly locate the mounting position of the bracket 32, and further prevent the bracket 32 from shaking in the housing 10.
  • the bracket 32 further includes a fixing protrusion 326 protruding outward from the side wall 3213 , and the fixing protrusion 326 is used for fixing the bracket 32 .
  • the number of the fixing protrusions 326 may be single or plural. When the number of the fixing protrusions 326 is plural, the plurality of fixing protrusions 326 may protrude from opposite sides of the side wall 3213.
  • the fixing protrusion 326 is used for fixing the bracket 32.
  • the fixing protrusion 326 can be directly fixed to the housing 10 by a fastener, or the bracket 32 and the main board 20 can be fixed to the housing 10 by fasteners. . In the embodiment shown in FIG. 1 and FIG.
  • the fixing protrusion 326 is provided with a fixing hole 3262, and the main board 20 and the front housing 11 are respectively provided with mounting holes at positions corresponding to the fixing holes 3262, and can be fastened by fasteners (such as The screw) passes through the fixing hole 3262 and the mounting hole to fix the bracket 32 and the main plate 20 to the front case 11.
  • the fixing of the bracket 32 by the fixing projection 326 further improves the stability of the bracket 32 installed in the housing 10. It can be understood that the fixing protrusion 326 is also not necessary, and the position of the bracket 32 is also better under the clamping action of the front case 11 and the rear case 12.
  • the terminal 100 further includes a cover 40 , and the cover 40 and the optical module 31 are respectively located on opposite sides of the front case 11 .
  • the front housing 11 is provided with a first through hole 111, a second through hole 112 and a third through hole 113.
  • the first through hole 111 corresponds to the laser projection module 311
  • the second through hole 112 corresponds to the visible light imaging module 312
  • the third through hole 113 corresponds to the infrared imaging module 314.
  • the cover plate 40 is formed with an infrared ray transmitting ink 50 at a position corresponding to the first through hole 111 and the third through hole 113.
  • the cover 40 may be light transmissive, and the material of the cover 40 may be light transmissive glass, resin, plastic, or the like.
  • the cover plate 40 covers the first through hole 111, the second through hole 112, and the third through hole 113.
  • the laser light emitted by the laser projection module 311 passes through the first through hole 111 and passes through the cover 40.
  • the external light passes through the cover 40 and passes through the second through hole 112 to enter the visible light imaging module 312.
  • the external light passes through the cover 40 and enters the infrared imaging module 314 through the third through hole 113.
  • the cover plate 40 is formed with an infrared ray transmitting ink 50 at a position corresponding to the first through hole 111 and the third through hole 113.
  • the infrared transmission ink 50 has a high transmittance to infrared light, for example, 85% or more, and has a high attenuation rate for visible light, for example, 70% or more, so that the user is difficult to use in normal use.
  • the area of the terminal 100 covered by the infrared ray transmitting ink 50 is seen. Therefore, it is difficult for the user to see the internal structure of the terminal 100 through the first through hole 111 and the third through hole 113 (that is, it is difficult to see the laser projection module 311 and the infrared imaging module 314), and the appearance of the terminal 100 is beautiful.
  • the laser projection module 311 includes a substrate assembly 3111, a lens barrel 3112, a light source 3113, a collimating element 3114, a diffractive optical element (DOE) 3115, and a protective cover 3116. .
  • DOE diffractive optical element
  • the substrate assembly 3111 includes a substrate 31111 and a wiring board 31112.
  • the circuit board 31112 is disposed on the substrate 31111, and the circuit board 31112 is used to connect the light source 3113 with the main board 20 of the terminal 100.
  • the circuit board 31112 may be a printed circuit board, a flexible circuit board or a soft and hard circuit board.
  • the lens barrel 3112 is fixedly connected to the substrate assembly 3111.
  • the lens barrel 3112 is formed with a receiving cavity 31121.
  • the lens barrel 3112 includes a top wall 31122 and an annular peripheral wall 31124 extending from the top wall 31122.
  • the peripheral wall 31124 is disposed on the substrate assembly 3111.
  • the through hole 31125 is communicated with the accommodating cavity 31121.
  • the peripheral wall 31124 can be connected to the wiring board 31112 by an adhesive.
  • a protective cover 3116 is disposed on the top wall 31122.
  • the protective cover 3116 includes a baffle 31162 having a light-emitting through hole 31160 and an annular side wall 31164 extending from the baffle 31162.
  • the light source 3113 and the collimating element 3114 are both disposed in the accommodating cavity 31121, and the diffractive optical element 3115 is mounted on the lens barrel 3112.
  • the collimating element 3114 and the diffractive optical element 3115 are sequentially disposed on the illuminating light path of the light source 3113.
  • the collimating element 3114 collimates the laser light emitted by the light source 3113, and the laser passes through the collimating element 3114 and then passes through the diffractive optical element 3115 to form a laser pattern.
  • the light source 3113 may be a Vertical Cavity Surface Emitting Laser (VCSEL) or an edge-emitting laser (EEL). In the embodiment shown in FIG. 9, the light source 3113 is an edge emitting laser.
  • the light source 3113 may be a Distributed Feedback Laser (DFB).
  • the light source 3113 is for emitting laser light into the accommodating cavity 31121. Referring to FIG. 10 , the light source 3113 has a columnar shape as a whole, and the light source 3113 forms a light emitting surface 31131 away from one end surface of the substrate assembly 3111. The laser light is emitted from the light emitting surface 31131, and the light emitting surface 31131 faces the collimating element 3114.
  • the light source 3113 is fixed on the substrate assembly 3111.
  • the light source 3113 can be adhered to the substrate assembly 3111 through the sealant 3117.
  • a side of the light source 3113 opposite to the light emitting surface 31131 is bonded to the substrate assembly 3111.
  • the side surface 31132 of the light source 3113 may also be adhered to the substrate assembly 3111.
  • the sealing material 3117 may surround the surrounding side surface 31132, or only one side of the side surface 31132 may be bonded to the substrate assembly 3111 or adhered.
  • a plurality of faces and substrate assemblies 3111 are bonded.
  • the sealant 3117 may be a thermal conductive adhesive to conduct heat generated by the operation of the light source 3113 to the substrate assembly 3111.
  • the diffractive optical element 3115 is carried on the top wall 31122 and housed in the protective cover 3116.
  • the opposite sides of the diffractive optical element 3115 are respectively in contact with the protective cover 3116 and the top wall 31122.
  • the baffle 31162 includes an abutting surface 31163 adjacent to the light-passing hole 31125, and the diffractive optical element 3115 is in contact with the abutting surface 31163.
  • the diffractive optical element 3115 includes opposite diffractive incident faces 31152 and diffractive exit faces 31154.
  • the diffractive optical element 3115 is carried on the top wall 31122, and the diffraction exit surface 31154 is in contact with the surface of the baffle 31162 near the light-passing hole 31125 (the abutting surface 31163), and the diffractive incident surface 31152 is in contact with the top wall 362.
  • the light-passing hole 31125 is aligned with the accommodating cavity 31121, and the light-emitting through-hole 31160 is aligned with the light-passing hole 31125.
  • the top wall 31122, the annular side wall 31164, and the baffle 31162 are in contact with the diffractive optical element 3115, thereby preventing the diffractive optical element 3115 from coming off the protective cover 3116 in the light exiting direction.
  • the protective cover 3116 is adhered to the top wall 31122 by glue.
  • the light source 3113 of the laser projection module 311 adopts an edge emitting laser.
  • the temperature of the transmitting laser is smaller than that of the VCSEL array.
  • the edge emitting laser is a single-point light emitting structure, it is not necessary to design an array structure, and the manufacturing is simple.
  • the laser projection module 311 has a lower light source cost.
  • the gain of the power is obtained through the feedback of the grating structure.
  • the side emitting laser is placed vertically, and since the edge emitting laser has a slender strip structure, the emitting laser is prone to accidents such as dropping, shifting, or shaking, so by setting
  • the sealant 3117 is capable of holding the edge emitting laser to prevent accidents such as dropping, displacement or shaking of the emitting laser.
  • the light source 3113 can also be fixed to the substrate assembly 3111 in a fixed manner as shown in FIG.
  • the laser projection module 311 includes a plurality of support blocks 3118.
  • the support block 3118 can be fixed on the substrate assembly 3111.
  • the plurality of support blocks 3118 collectively surround the light source 3113.
  • the light source 3113 can be directly mounted on the plurality of support blocks during installation. Between 3118. In one example, the plurality of support blocks 3118 collectively clamp the light source 3113 to further prevent the light source 3113 from shaking.
  • the protective cover 3116 can be omitted.
  • the diffractive optical element 3115 can be disposed in the accommodating cavity 31121, and the diffraction exit surface 31154 of the diffractive optical element 3115 can be opposed to the top wall 31122, and the laser passes through the diffractive optical element. After 3115, the light passing hole 31125 is further worn out. Thus, the diffractive optical element 3115 is not easily peeled off.
  • the substrate 31111 can be omitted, and the light source 3113 can be directly fixed on the circuit board 31112 to reduce the overall thickness of the laser projection module 311.
  • first and second are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated.
  • features defining “first” and “second” may include at least one of the features, either explicitly or implicitly.
  • the meaning of "a plurality” is at least two, for example two, three, unless specifically defined otherwise.

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Abstract

一种输入输出组件（30）及终端（100）。输入输出组件（30）包括电路板（33）和输入输出模组（34）。电路板（33）包括板体（331）和形成在板体（331）上的多组触点（332）。输入输出模组（34）包括主体（342）和弹片（343）。弹片（343）设置在主体（342）上且从主体（342）中凸出。弹片（343）用于与任意一组触点（332）接触以电连接输入输出模组（34）与电路板（33）。

Description

输入输出组件和终端
优先权信息
本申请请求2018年04月10日向中国国家知识产权局提交的、专利申请号为201810317194.6的专利申请的优先权和权益，并且通过参照将其全文并入此处。
技术领域
本申请涉及涉及消费性技术领域，更具体而言，涉及一种输入输出组件和终端。
背景技术
手机上配置有多个功能模组以实现不同的功能，功能模组通常需要电连接到手机的主板上，而在安装功能模组时，往往需要将功能模组按唯一的安装方向安装，功能模组才能电连接到主板上，降低了手机的组装效率。
发明内容
本申请实施方式提供一种输入输出组件和终端。
本申请实施方式的输入输出组件包括电路板及输入输出模组，所述电路板包括板体和形成在所述板体上的多组触点；所述输入输出模组包括主体和弹片，所述弹片设置在所述主体上且从所述主体中凸出，所述弹片用于与任意一组所述触点接触以电连接所述输入输出模组与所述电路板。
本申请实施方式的终端包括壳体和输入输出组件，所述输入输出组件安装在所述壳体内，所述输入输出组件包括电路板及输入输出模组，所述电路板包括板体和形成在所述板体上的多组触点；所述输入输出模组包括主体和弹片，所述弹片设置在所述主体上且从所述主体中凸出，所述弹片用于与任意一组所述触点接触以电连接所述输入输出模组与所述电路板。
本申请的实施方式的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本申请的实施方式的实践了解到。
附图说明
本申请的上述和/或附加的方面和优点从结合下面附图对实施方式的描述中将变得明显和容易理解，其中：
图1是本申请实施方式的终端的立体分解示意图；
图2是本申请实施方式的输入输出组件的平面装配示意图；
图3是本申请实施方式的输入输出组件的另一角度的平面装配示意图；
图4是本申请实施方式的输入输出组件的立体分解示意图；
图5是本申请实施方式的输入输出组件的另一角度的立体分解示意图；
图6是本申请实施方式的输入输出模组的一个方向的安装示意图；
图7是本申请实施方式的输入输出模组的另一个方向的安装示意图；
图8是本申请实施方式的终端的部分截面示意图；
图9至图12是本申请实施方式的输入输出组件的激光投射模组的部分结构示意图。
具体实施方式
以下结合附图对本申请的实施方式作进一步说明。附图中相同或类似的标号自始至终表示相同或类似的元件或具有相同或类似功能的元件。
另外，下面结合附图描述的本申请的实施方式是示例性的，仅用于解释本申请的实施方式，而不能理解为对本申请的限制。
在本申请中，除非另有明确的规定和限定，第一特征在第二特征“上”或“下”可以是第一和第二特征直接接触，或第一和第二特征通过中间媒介间接接触。而且，第一特征在第二特征“之上”、“上方”和“上面”可是第一特征在第二特征正上方或斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”可以是第一特征在第二特征正下方或斜下方，或仅仅表示第一特征水平高度小于第二特征。
本申请实施方式的输入输出组件30包括电路板33和输入输出模组34，所述电路板33包括板体331和形成在所述板体331上的多组触点332；所述输入输出模组34包括主体342和弹片343，所述弹片343设置在所述主体342上且从所述主体342中凸出，所述弹片343用于与任意一组所述触点332接触以电连接所述输入输出模组34与所述电路板33。
在某些实施方式中，所述输入输出模组34为受话器。
在某些实施方式中，所述主体342的形状呈中心对称或轴对称。
在某些实施方式中，所述输入输出组件30还包括支架32，所述电路板33安装在所述支架32上，所述支架32包括本体321，所述本体321包括相背的第一面3211和第二面3212，所述第二面3212开设有至少一个收容腔322，所述第一面3211开设有与所述收容腔322对应的通孔323，所述输入输出模组34固定安装在所述收容腔322内并从所述第二面3212暴露，所述通孔323用于从所述第一面3211暴露所述输入输出模组34。
在某些实施方式中，所述通孔323的开口尺寸小于对应的所述收容腔322的尺寸以形成限位环327，所述收容腔322由所述限位环327及环绕所述限位环327延伸的内壁形成。
在某些实施方式中，至少一个所述收容腔322包括依次排列的第一腔3221、第二腔 3222、第三腔3223和第四腔3224，所述本体321包括侧壁，所述侧壁连接所述第一面3211与所述第二面3212，所述侧壁3213包括相背的顶侧壁3214和底侧壁3215，所述输入输出组件30还包括多个光学模组31，多个所述光学模组31固定安装在所述第一腔3221、所述第二腔3222和所述第四腔3224内，所述输入输出模组34安装在所述第三腔3223内。
在某些实施方式中，多个所述光学模组31包括激光投射模组311、可见光成像模组312和红外成像模组314。
在某些实施方式中，所述第一腔3221、所述第二腔3222和所述第四腔3224的中心位于同一直线上，所述第三腔3223的中心位于所述直线与所述底侧壁3215之间。
在某些实施方式中，所述支架32还包括自所述第一面3211和/或所述第二面3212凸出的定位柱324，所述板体331上开设有定位孔3314，所述定位柱324伸入所述定位孔3314内以定位所述电路板33在所述支架32上的安装位置。
在某些实施方式中，所述板体331包括第一段3311和第二段3312，所述第一段3311结合在所述第一面3211上，所述第二段3312结合在所述第二面3212上，多组所述触点332形成在所述第二段3312上。
在某些实施方式中，所述输入输出组件30还包括红外补光灯35、接近传感器36和光感器37，所述红外补光灯35、所述接近传感器36和所述光感器37均连接在所述第一段3311上。
本申请实施方式的终端100包括壳体10和上述任一实施方式所述的输入输出组件30，所述输入输出组件30安装在所述壳体10内。
在某些实施方式中，所述终端100还包括固定在所述壳体10内的主板20，所述电路板33用于电连接所述输入输出模组34与所述主板20。
请参阅图1，本申请实施方式的终端100包括壳体10、主板20和输入输出组件30。终端100可以是手机、平板电脑、手提电脑、游戏机、头显设备、门禁系统、柜员机等，本申请实施例以终端100是手机为例进行说明，可以理解，终端100的具体形式可以是其他，在此不作限制。
请参阅图1，壳体10可以作为主板20和输入输出组件30的安装载体，壳体10可以给主板20和输入输出组件30提供防尘、防水、防摔的保护，壳体10上还可以安装有显示屏、电池等元器件。壳体10包括前壳11和后壳12，前壳11与后壳12互相结合并将主板20和输入输出组件30收容在前壳11与后壳12之间，前壳11与后壳12可以采用不锈钢、铝合金、塑料等材料制成。
请一并参阅图1至图3，主板20固定在壳体10内，具体地，主板20可以通过螺合、卡合等方式固定在前壳11或后壳12上。主板20可以与输入输出组件30的光学模组31和 输入输出模组34连接，主板20上还可以连接终端100的处理芯片、控制芯片等，主板20上铺设的线路可以用于传输电信号。主板20上形成有安装口，安装口供输入输出组件30穿过，减小主板20与输入输出组件30安装在壳体10内时占用的空间。
请继续参阅图1至图3，输入输出组件30安装在壳体10内，输入输出组件30包括光学模组31、输入输出模组34、支架32和电路板33，光学模组31、输入输出模组34和电路板33均安装在支架32上。
光学模组31可以用于接收或发射光线，其中接收或发射的光线可以是可见光、红外光或紫外光等。具体地，在本申请实施例中，光学模组31包括红外成像模组314、可见光成像模组312、激光投射模组311。其中，红外成像模组314可用于接收外界的红外光信号以生成红外图像。可见光成像模组312可接收外界的可见光信号以生成彩色图像。激光投射模组311可用于向终端100外的目标物体投射激光图案，激光可以是红外激光。在一个例子中，红外成像模组314可以接收激光投射模组311发射并由目标物体反射形成的激光图案，激光投射模组311和红外成像模组314共同用于获得目标物体的深度信息。红外成像模组314、可见光成像模组312和激光投射模组311可以共同用于获得目标用户的深度图像。光学模组31上可以设置有连接器38，连接器38可以插入到主板20上特定的连接座上，以电性及机械连接光学模组31与主板20，将连接器38从连接座上拔出则可以将光学模组31与主板20分离并断开二者之间的电性连接。当然，光学模组31的具体形式和数量不限于本申请实施方式的举例。
输入输出模组34可以向外界发出信号或者接收外界的信号，或者同时具备向外界发出信号和接收外界的信号的功能，其中信号可以是光线信号、声音信号、触摸信号等。可以理解，依据终端100的不同功能需求，输入输出模组34的具体种类和每种输入输出模组34的数量可以有所变化。在本申请实施例中，输入输出模组34为受话器341，受话器341在驱动信号的作用下向外发出声波实现通话等功能。当然，输入输出模组34的具体形式不限于为受话器341，还可以是其他，例如可以是上述的光学模组31或指纹传感器等。请结合图4，输入输出模组34包括主体342和弹片343。主体342可以是输入输出模组34的外壳，弹片343设置在主体342上且从主体342上凸出。输入输出模组34可以通过弹片343接收外部设备的电信号，或者通过弹片343向外部设备发送电信号。在本申请实施例中，输入输出模组34包括两个弹片343，两个弹片343均与外部设备导通时表示输入输出模组34与该外部设备正确电连接，只有一个弹片343与外部设备导通时表示输入输出模组34与该外部设备没有正确电连接。
请结合图4及图5，支架32为一体成型结构，支架32用于安装光学模组31、输入输出模组34和电路板33。支架32包括本体321。
本体321包括第一面3211、第二面3212和侧壁3213。第一面3211和第二面3212相背，侧壁3213连接第一面3211与第二面3212，侧壁3213包括相背的顶侧壁3214和底侧壁3215。在将输入输出组件30安装在壳体10内时，前壳11可以与第一面3211相抵，后壳12可以与第二面3212相抵以夹持支架32，避免输入输出组件30沿终端100的厚度方向(如图1中的Z方向)移动，同时，支架32与主板20的安装口的位置对应安装，支架32的侧壁3213可以与安装口的内壁相抵，使得支架32卡在安装口内，只需要将主板20的位置固定，就可避免输入输出组件30沿终端100的宽度方向(如图1中的Y方向)移动。
请结合图4和图5，第二面3212开设有收容腔322。第一面3211开设有与收容腔322对应的通孔323，收容腔322位于顶侧壁3214和底侧壁3215之间。收容腔322用于收容光学模组31和输入输出模组34。收容腔322的具体形状与对应的光学模组31和输入输出模组34的形状对应，收容腔322的腔体可以略大于光学模组31和输入输出模组34以便于在收容腔322内点胶，收容腔322的腔体也可以略小于光学模组31和输入输出模组34以使光学模组31和输入输出模组34可通过过盈配合安装在收容腔322内。收容腔322的数量可以与光学模组31和输入输出模组34的总的数量相等。当光学模组31和输入输出模组34安装在支架32上时，光学模组31和输入输出模组34从通孔323暴露。在本申请实施方式中，暴露指的是可以从第一面3211或从第二面3212看到光学模组31和输入输出模组34，例如，光学模组31和输入输出模组34可以穿过第一面3211的通孔323从第一面3211暴露，光学模组31和输入输出模组34也可以未穿过通孔323，但通过通孔323可以看到输入输出模组34。
请继续参阅图4和图5，支架32上形成有限位环327，具体地，通孔323的开口尺寸小于对应的收容腔322的尺寸以形成限位环327，收容腔322由限位环327和环绕限位环327延伸的内壁形成。在安装光学模组31和输入输出模组34时，可以将光学模组31和输入输出模组34沿第二面3212指向第一面3211的方向安装在收容腔322内，直至光学模组31和输入输出模组34与限位环327相抵，表明光学模组31和输入输出模组34安装到位，此时可以向收容腔322内点胶，具体地，可以向光学模组31与收容腔322的内壁，和输入输出模组34与收容腔322的内壁之间的间隙内点胶，等胶水固化后，光学模组31和输入输出模组34被固定安装在收容腔322。
具体地，收容腔322包括依次排列的第一腔3221、第二腔3222、第三腔3223和第四腔3224。其中依次排列可以是沿支架32的长度方向依次排列，具体可以是从左至右依次排列，也可以是从右至左依次排列。第一腔3221用于安装激光投射模组311，第二腔3222用于安装可见光成像模组312，第三腔3223用于安装输入输出模组34(受话器341)，第 四腔3224用于安装红外成像模组314。也即是说，可以将激光投射模组311、可见光成像模组312、输入输出模组34和红外成像模组314依次安装在第一腔3221、第二腔3222、第三腔3223和第四腔3234内。其中，第一腔3221、第二腔3222、第三腔3223和第四腔3224可以互相间隔，也可以是相邻的两个或三个收容腔322连通。当输入输出模组34安装在第三腔3223内时，主体342收容在第三腔3223内，弹片343沿从第一面3211向第二面3212的方向凸出。
通孔323包括第一通孔3231、第二通孔3232、第三通孔3233和第四通孔3234，第一通孔3231、第二通孔3232、第三通孔3233和第四通孔3234分别与第一腔3221、第二腔3222、第三腔3223和第四腔3224连通，也即是说，第一通孔3231与第一腔3221连通，第二通孔3232与第二腔3222连通，第三通孔3233与第三腔3223连通、第四通孔3234与第四腔3224连通。另外，第三通孔3233还与受话器341的出音口对应。第第三通孔3233的孔径可小于受话器341的出音口的孔径，如此，受话器341可以未穿过第三通孔3233，受话器341发出的声波可以穿过第三通孔3233并进入外界。第一通孔3231、第二通孔3232和第四通孔3234的中心位于同一直线L上，第三通孔3233位于直线L与底侧壁3215之间(如图2所示)，在一个例子中，第一腔3221、第二腔3222和第四腔3224的中心也位于直线L上，第三腔3223的中心位于直线与底侧壁3215之间。在红外成像模组314、可见光成像模组312和激光投射模组311安装后，激光投射模组311从第一通孔3231穿出，可见光成像模组312从第二通孔3232穿出，红外成像模组314从第四通孔3234穿出，三者的光轴位于同一平面内，易于三者互相配合工作。红外成像模组314、可见光成像模组312和激光投射模组311的穿出通孔323的顶面也齐平，具体地，红外成像模组314的入光面、可见光成像模组312的入光面和激光投射模组311的出光面可以是位于同一个平面上。
请参阅图4和图5，电路板33可以是柔性电路板、印刷电路板或软硬结合板，电路板33用于电连接输入输出模组34与主板20。电路板33包括板体331和多组触点332。多组触点332形成在板体331上。
板体331铺设有连接线路，板体331包括第一段3311和第二段3312。第一段3311与第一面3211结合，第二段3312与第二面3212结合，其中结合可以是通过螺合、胶合等方式结合，在一个例子中，第一段3311与第一面3211贴合，第二段3312与第二面3212贴合。多组触点332形成在第二段3312上。在安装输入输出组件30时，可以将输入输出模组34安装在第三腔3223内，再将电路板33安装在支架32上，以使第二段3312与第二面3212结合，同时，弹片343与其中一组触点332接触以电连接输入输出模组34与电路板33。
具体地，请参阅图6和图7，在本申请实施例上，输入输出模组34的主体342的形状为轴对称的形状，例如大致呈长方体状，第三腔3223的形状与输入输出模组34的形状对应。触点332的数量为两组，当输入输出模组34以第一方向安装在支架32内时(如图6所示)，弹片343与其中一组触点332接触，当输入输出模组34以第二方向安装在支架32内时(如图7所示)，弹片343与另一组触点332接触。也就是说，以第一方向或第二方向安装输入输出模组34均能通过电路板33将输入输出模组34与主板20电连接。当然，当主体342的形状为正方体状时，触点332的数量可以是四组，输入输出模组34可以以至少四个方向安装在支架32内，并使得弹片343与其中一组触点332接触。
可以理解，主体342的形状也可以是中心对称的形状，例如大致呈圆柱状，第三腔3223的形状与输入输出模组34的形状对应，输入输出模组34可以以任意方向安装在支架32内，并使得弹片343与其中一组触点332接触。
综上，本申请实施方式的终端100中，由于电路板33包括多组触点332，输入输出模组34可以与任意一组触点332接触以电连接输入输出模组34与电路板33，使得输入输出模组34可以以多安装方向安装，提高了终端100的组装效率。
另外，由于支架32一体成型，可以将多个光学模组31和输入输出模组34安装在同一个支架32上并收容在收容腔322内，如此，节约终端100内部的安装空间，利于实现终端100的轻薄化。安装在同一个支架32上的光学模组31和输入输出模组34不会因支架32发生移动而造成多个光学模组31和输入输出模组34的相对位置发生变化，从而使多个光学模组31和输入输出模组34能够更好地配合工作。
请参阅图4和图5，在某些实施方式中，板体331还包括连接第一段3311与第二段3312的连接段3313，连接段3313可以与顶侧壁3214结合。进一步地，顶侧壁3214可以开设有缺口3216，连接段3313设置在缺口3216上以用于定位连接段3313。
请继续参阅图4和图5，在某些实施方式中，输入输出组件30还包括红外补光灯35、接近传感器36和光感器37，红外补光灯35、接近传感器36和光感器37均安装在第一段3311上。如此，通过一个电路板33就可以连接输入输出模组34、红外补光灯35、接近传感器36和光感器37，输入输出组件30的整体结构较简单紧凑。
请继续参阅图4和图5，在某些实施方式中，支架32还包括定位柱324，定位柱324可以自第一面3211凸出形成，也可以自第二面3212凸出形成，或者定位柱324同时从第一面3211和第二面3212凸出形成。板体331上开设有定位孔3314，当电路板33安装在支架32上时，定位柱324伸入定位孔3314内以定位电路板33在支架32上的安装位置。在如图4和图5所示的实施例中，定位孔3314同时开设在第一段3311和第二段3312上，定位孔3314开设的位置可以与上述的定位柱324的位置对应。
请参阅图2和图4，在某些实施方式中，第一面3211上开设有支架定位孔325，支架定位孔325用于定位支架32的安装位置。具体地，支架定位孔325的数量可以是一个或多个，本申请实施例中，支架定位孔325的数量为两个，且两个支架定位孔325开设在本体321的斜对角的位置。对应的，请结合图1，前壳11上可以凸出形成有前壳定位柱111，当第一面3211与前壳11相抵时，前壳定位柱111伸入支架定位孔325中且与支架定位孔325配合，通过前壳定位柱111与支架定位孔325的配合可以快速定位支架32的安装位置，且进一步避免支架32在壳体10内晃动。
请参阅图2至图5，在某些实施方式中，支架32还包括固定凸出326，固定凸出326自侧壁3213向外凸出，固定凸出326用于固定支架32。固定凸出326的数量可以是单个或多个，当固定凸出326的数量是多个时，多个固定凸出326可以从侧壁3213的相背的两侧凸出。固定凸出326用于固定支架32，具体地，可以通过紧固件直接将固定凸出326固定在壳体10上，也可以通过紧固件将支架32和主板20共同固定在壳体10上。在如图1和图2所示的实施例中，固定凸出326上开设有固定孔3262，主板20和前壳11与固定孔3262对应的位置开设有安装孔，可以通过紧固件(如螺钉)穿过固定孔3262和安装孔，以将支架32和主板20固定在前壳11上。通过固定凸出326固定支架32，进一步提高支架32安装在壳体10内的稳定性。可以理解，固定凸出326也不是必须的，支架32在前壳11与后壳12的夹持作用下，支架32的位置也具有较好的稳定性。
请参阅图8，在某些实施方式中，终端100还包括盖板40，盖板40与光学模组31分别位于前壳11的相背两侧。前壳11开设有第一穿孔111、第二穿孔112和第三穿孔113。第一穿孔111与激光投射模组311对应，第二穿孔112与可见光成像模组312对应，第三穿孔113与红外成像模组314对应。盖板40在与第一穿孔111及第三穿孔113对应处形成有红外透过油墨50。
具体地，盖板40可以是透光的，盖板40的材料可以是透光的玻璃、树脂、塑料等。盖板40覆盖第一穿孔111、第二穿孔112和第三穿孔113。激光投射模组311发出的激光穿过第一穿孔111后穿出盖板40。外界光线穿过盖板40后经过第二穿孔112进入可见光成像模组312。外界光线穿过盖板40后经过第三穿孔113进入红外成像模组314。在本实施例中，盖板40在与第一穿孔111及第三穿孔113对应处形成有红外透过油墨50。红外透过油墨50对红外光有较高的透过率，例如可达到85％或以上，且对可见光有较高的衰减率，例如可达到70％以上，使得用户在正常使用中，肉眼难以看到终端100上被红外透过油墨50覆盖的区域。如此，用户难以通过第一穿孔111和第三穿孔113看到终端100的内部结构(即，难以看到激光投射模组311及红外成像模组314)，终端100的外形较美观。
请参阅图9，在某些实施方式中，激光投射模组311包括基板组件3111、镜筒3112、 光源3113、准直元件3114、衍射光学元件(diffractive optical elements，DOE)3115、及保护盖3116。
基板组件3111包括基板31111和线路板31112。线路板31112设置在基板31111上，线路板31112用于连接光源3113与终端100的主板20，线路板31112可以是印刷电路板、柔性电路板或软硬结合电路板。
镜筒3112与基板组件3111固定连接，镜筒3112形成有容置腔31121，镜筒3112包括顶壁31122及自顶壁31122延伸的环形的周壁31124，周壁31124设置在基板组件3111上，顶壁31122开设有与容置腔31121连通的通光孔31125。周壁31124可以与线路板31112通过粘胶连接。
保护盖3116设置在顶壁31122上。保护盖3116包括开设有出光通孔31160的挡板31162及自挡板31162延伸的环形侧壁31164。
光源3113与准直元件3114均设置在容置腔31121内，衍射光学元件3115安装在镜筒3112上，准直元件3114与衍射光学元件3115依次设置在光源3113的发光光路上。准直元件3114对光源3113发出的激光进行准直，激光穿过准直元件3114后再穿过衍射光学元件3115以形成激光图案。
光源3113可以是垂直腔面发射激光器(Vertical Cavity Surface Emitting Laser,VCSEL)或者边发射激光器(edge-emitting laser，EEL)，在如图9所示的实施例中，光源3113为边发射激光器，具体地，光源3113可以为分布反馈式激光器(Distributed Feedback Laser，DFB)。光源3113用于向容置腔31121内发射激光。请结合图10，光源3113整体呈柱状，光源3113远离基板组件3111的一个端面形成发光面31131，激光从发光面31131发出，发光面31131朝向准直元件3114。光源3113固定在基板组件3111上，具体地，光源3113可以通过封胶3117粘结在基板组件3111上，例如光源3113的与发光面31131相背的一面粘接在基板组件3111上。请结合图9和图11，光源3113的侧面31132也可以粘接在基板组件3111上，封胶3117包裹住四周的侧面31132，也可以仅粘结侧面31132的某一个面与基板组件3111或粘结某几个面与基板组件3111。此时封胶3117可以为导热胶，以将光源3113工作产生的热量传导至基板组件3111中。
请参阅图9，衍射光学元件3115承载在顶壁31122上并收容在保护盖3116内。衍射光学元件3115的相背两侧分别与保护盖3116及顶壁31122抵触，挡板31162包括靠近通光孔31125的抵触面31163，衍射光学元件3115与抵触面31163抵触。
具体地，衍射光学元件3115包括相背的衍射入射面31152和衍射出射面31154。衍射光学元件3115承载在顶壁31122上，衍射出射面31154与挡板31162的靠近通光孔31125的表面(抵触面31163)抵触，衍射入射面31152与顶壁362抵触。通光孔31125与容置腔 31121对准，出光通孔31160与通光孔31125对准。顶壁31122、环形侧壁31164及挡板31162与衍射光学元件3115抵触，从而防止衍射光学元件3115沿出光方向从保护盖3116内脱落。在某些实施方式中，保护盖3116通过胶水粘贴在顶壁31122上。
上述的激光投射模组311的光源3113采用边发射激光器，一方面边发射激光器较VCSEL阵列的温漂较小，另一方面，由于边发射激光器为单点发光结构，无需设计阵列结构，制作简单，激光投射模组311的光源成本较低。
分布反馈式激光器的激光在传播时，经过光栅结构的反馈获得功率的增益。要提高分布反馈式激光器的功率，需要通过增大注入电流和/或增加分布反馈式激光器的长度，由于增大注入电流会使得分布反馈式激光器的功耗增大并且出现发热严重的问题，因此，为了保证分布反馈式激光器能够正常工作，需要增加分布反馈式激光器的长度，导致分布反馈式激光器一般呈细长条结构。当边发射激光器的发光面31131朝向准直元件3114时，边发射激光器呈竖直放置，由于边发射激光器呈细长条结构，边发射激光器容易出现跌落、移位或晃动等意外，因此通过设置封胶3117能够将边发射激光器固定住，防止边发射激光器发生跌落、位移或晃动等意外。
请参阅图9和图12，在某些实施方式中，光源3113也可以采用如图12所示的固定方式固定在基板组件3111上。具体地，激光投射模组311包括多个支撑块3118，支撑块3118可以固定在基板组件3111上，多个支撑块3118共同包围光源3113，在安装时可以将光源3113直接安装在多个支撑块3118之间。在一个例子中，多个支撑块3118共同夹持光源3113，以进一步防止光源3113发生晃动。
在某些实施方式中，保护盖3116可以省略，此时衍射光学元件3115可以设置在容置腔31121内，衍射光学元件3115的衍射出射面31154可以与顶壁31122相抵，激光穿过衍射光学元件3115后再穿出通光孔31125。如此，衍射光学元件3115不易脱落。
在某些实施方式中，基板31111可以省去，光源3113可以直接固定在线路板31112上以减小激光投射模组311的整体厚度。
在本说明书的描述中，参考术语“某些实施方式”、“一个实施方式”、“一些实施方式”、“示意性实施方式”、“示例”、“具体示例”、或“一些示例”的描述意指结合所述实施方式或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施方式或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施方式或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施方式或示例中以合适的方式结合。
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示 或者隐含地包括至少一个所述特征。在本申请的描述中，“多个”的含义是至少两个，例如两个，三个，除非另有明确具体的限定。
尽管上面已经示出和描述了本申请的实施例，可以理解的是，上述实施例是示例性的，不能理解为对本申请的限制，本领域的普通技术人员在本申请的范围内可以对上述实施例进行变化、修改、替换和变型，本申请的范围由权利要求及其等同物限定。

Claims (23)

  1. 一种输入输出组件，其特征在于，包括：
    电路板，所述电路板包括板体和形成在所述板体上的多组触点；和
    输入输出模组，所述输入输出模组包括主体和弹片，所述弹片设置在所述主体上且从所述主体中凸出，所述弹片用于与任意一组所述触点接触以电连接所述输入输出模组与所述电路板。
  2. 根据权利要求1所述的输入输出组件，其特征在于，所述输入输出模组为受话器。
  3. 根据权利要求1或2所述的输入输出组件，其特征在于，所述主体的形状呈中心对称或轴对称。
  4. 根据权利要求1或2所述的输入输出组件，其特征在于，所述输入输出组件还包括支架，所述电路板安装在所述支架上，所述支架包括本体，所述本体包括相背的第一面和第二面，所述第二面开设有至少一个收容腔，所述第一面开设有与所述收容腔对应的通孔，所述输入输出模组固定安装在所述收容腔内并从所述第二面暴露，所述通孔用于从所述第一面暴露所述输入输出模组。
  5. 根据权利要求4所述的输入输出组件，其特征在于，所述通孔的开口尺寸小于对应的所述收容腔的尺寸以形成限位环，所述收容腔由所述限位环及环绕所述限位环延伸的内壁形成。
  6. 根据权利要求4所述的输入输出组件，其特征在于，至少一个所述收容腔包括依次排列的第一腔、第二腔、第三腔和第四腔，所述本体包括侧壁，所述侧壁连接所述第一面与所述第二面，所述侧壁包括相背的顶侧壁和底侧壁，所述输入输出组件还包括多个光学模组，多个所述光学模组固定安装在所述第一腔、所述第二腔和所述第四腔内，所述输入输出模组安装在所述第三腔内。
  7. 根据权利要求6所述的输入输出组件，其特征在于，多个所述光学模组包括激光投射模组、可见光成像模组和红外成像模组。
  8. 根据权利要求6所述的输入输出组件，其特征在于，所述第一腔、所述第二腔和所述第四腔的中心位于同一直线上，所述第三腔的中心位于所述直线与所述底侧壁之间。
  9. 根据权利要求4所述的输入输出组件，其特征在于，所述支架还包括自所述第一面和/或所述第二面凸出的定位柱，所述板体上开设有定位孔，所述定位柱伸入所述定位孔内以定位所述电路板在所述支架上的安装位置。
  10. 根据权利要求4所述的输入输出组件，其特征在于，所述板体包括第一段和第二段，所述第一段结合在所述第一面上，所述第二段结合在所述第二面上，多组所述触点形 成在所述第二段上。
  11. 根据权利要求10所述的输入输出组件，其特征在于，所述输入输出组件还包括红外补光灯、接近传感器和光感器，所述红外补光灯、所述接近传感器和所述光感器均连接在所述第一段上。
  12. 一种终端，其特征在于，包括壳体和输入输出组件，所述输入输出组件安装在所述壳体内，所述输入输出组件包括：
    电路板，所述电路板包括板体和形成在所述板体上的多组触点；和
    输入输出模组，所述输入输出模组包括主体和弹片，所述弹片设置在所述主体上且从所述主体中凸出，所述弹片用于与任意一组所述触点接触以电连接所述输入输出模组与所述电路板。
  13. 根据权利要求12所述的终端，其特征在于，所述输入输出模组为受话器。
  14. 根据权利要求12或13所述的终端，其特征在于，所述主体的形状呈中心对称或轴对称。
  15. 根据权利要求12或13所述的终端，其特征在于，所述输入输出组件还包括支架，所述电路板安装在所述支架上，所述支架包括本体，所述本体包括相背的第一面和第二面，所述第二面开设有至少一个收容腔，所述第一面开设有与所述收容腔对应的通孔，所述输入输出模组固定安装在所述收容腔内并从所述第二面暴露，所述通孔用于从所述第一面暴露所述输入输出模组。
  16. 根据权利要求15所述的终端，其特征在于，所述通孔的开口尺寸小于对应的所述收容腔的尺寸以形成限位环，所述收容腔由所述限位环及环绕所述限位环延伸的内壁形成。
  17. 根据权利要求15所述的终端，其特征在于，至少一个所述收容腔包括依次排列的第一腔、第二腔、第三腔和第四腔，所述本体包括侧壁，所述侧壁连接所述第一面与所述第二面，所述侧壁包括相背的顶侧壁和底侧壁，所述输入输出组件还包括多个光学模组，多个所述光学模组固定安装在所述第一腔、所述第二腔和所述第四腔内，所述输入输出模组安装在所述第三腔内。
  18. 根据权利要求17所述的终端，其特征在于，多个所述光学模组包括激光投射模组、可见光成像模组和红外成像模组。
  19. 根据权利要求17所述的终端，其特征在于，所述第一腔、所述第二腔和所述第四腔的中心位于同一直线上，所述第三腔的中心位于所述直线与所述底侧壁之间。
  20. 根据权利要求15所述的终端，其特征在于，所述支架还包括自所述第一面和/或所述第二面凸出的定位柱，所述板体上开设有定位孔，所述定位柱伸入所述定位孔内以定位所述电路板在所述支架上的安装位置。
  21. 根据权利要求15所述的终端，其特征在于，所述板体包括第一段和第二段，所述第一段结合在所述第一面上，所述第二段结合在所述第二面上，多组所述触点形成在所述第二段上。
  22. 根据权利要求21所述的终端，其特征在于，所述输入输出组件还包括红外补光灯、接近传感器和光感器，所述红外补光灯、所述接近传感器和所述光感器均连接在所述第一段上。
  23. 根据权利要求12所述的终端，其特征在于，所述终端还包括固定在所述壳体内的主板，所述电路板用于电连接所述输入输出模组与所述主板。
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