WO2020038052A1 - 输入输出组件和移动设备 - Google Patents

输入输出组件和移动设备 Download PDF

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Publication number
WO2020038052A1
WO2020038052A1 PCT/CN2019/090014 CN2019090014W WO2020038052A1 WO 2020038052 A1 WO2020038052 A1 WO 2020038052A1 CN 2019090014 W CN2019090014 W CN 2019090014W WO 2020038052 A1 WO2020038052 A1 WO 2020038052A1
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WO
WIPO (PCT)
Prior art keywords
camera
receiving cavity
sub
imaging
hole
Prior art date
Application number
PCT/CN2019/090014
Other languages
English (en)
French (fr)
Inventor
韦怡
Original Assignee
Oppo广东移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Publication of WO2020038052A1 publication Critical patent/WO2020038052A1/zh

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components

Definitions

  • the present application relates to the field of consumer electronics technology, and more particularly, to an input-output component and a mobile device.
  • Mobile phones can be configured with multiple function modules, and multiple function modules often need to cooperate with each other to work properly.
  • the embodiments of the present application provide an input-output component and a mobile device.
  • the input-output component of the embodiment of the present application includes a bracket and an input-output module.
  • the bracket is an integrated structure.
  • the bracket includes a first surface and a second surface opposite to each other.
  • the second surface is provided with a plurality of receiving chambers
  • the first surface is provided with a plurality of receiving chambers corresponding to the plurality of receiving chambers.
  • the input / output module includes an imaging module and a time-of-flight module, and the imaging module and the time-of-flight module are respectively fixedly installed in a plurality of the receiving chambers and are driven from the corresponding through-holes.
  • the first side is exposed.
  • the mobile device includes a casing and an input-output component, and the input-output component is mounted on the casing;
  • the input-output component includes a bracket and an input-output module, and the bracket is an integrated structure.
  • the bracket includes a first surface and a second surface opposite to each other, the second surface is provided with a plurality of receiving chambers, and the first surface is provided with a plurality of through holes corresponding to the plurality of receiving chambers;
  • the module includes an imaging module and a time-of-flight module, and the imaging module and the time-of-flight module are respectively fixedly installed in a plurality of the receiving chambers and are passed from the first surface through the corresponding through holes. Exposed.
  • FIG. 1 is a schematic perspective structural diagram of an input-output component according to an embodiment of the present application.
  • FIG. 2 and FIG. 3 are exploded perspective views of an input-output component according to an embodiment of the present application.
  • FIG. 4 is a schematic plan view of a bracket in an input-output module according to an embodiment of the present application.
  • FIG. 5 is a schematic perspective structural diagram of a bracket in an input / output module according to an embodiment of the present application.
  • FIG. 6 is a schematic diagram of a three-dimensional structure of a time-of-flight module in an input-output module according to an embodiment of the present application.
  • FIG. 7 is a schematic cross-sectional view of the time-of-flight module shown in FIG. 6 along the line VII-VII.
  • FIG 8 and 9 are schematic perspective structural diagrams of an electronic device according to an embodiment of the present application.
  • the input / output module 100 includes a bracket 10 and an input / output module 20.
  • the bracket 10 is an integrated structure.
  • the bracket 10 includes a first surface 111 and a second surface 112 opposite to each other.
  • the second surface 112 is provided with a plurality of receiving cavities 113
  • the first surface 111 is provided with a plurality of corresponding cavities 113. ⁇ ⁇ 114 ⁇ Through holes 114.
  • the input / output module 20 includes an imaging module 21 and a time-of-flight module 22, and the imaging module 21 and the time-of-flight module 22 are respectively fixedly installed in a plurality of receiving chambers 113 and all pass through the corresponding through holes 114 from the first surface 111. Exposed.
  • the bracket 10 may be an integrally formed structure, or may be an integral structure that is assembled after being separately formed. Exposure means that the input / output module 20 can be seen from the first surface 111. For example, the input / output module 20 can be exposed from the first surface 111 through the through hole 114 of the first surface 111, and the input / output module 20 can also be exposed. The through-hole 114 is not penetrated, but the input-output module 20 can be seen through the through-hole 114.
  • the bracket 10 in the input-output module 100 is an integrated structure.
  • the imaging module 21 and the time-of-flight module 22 are installed in the receiving cavity 113, the relative positions of the imaging module 21 and the time-of-flight module 22 are not easy. Changes are made, so that multiple I / O modules 20 can work better together. Specifically, the positions of the plurality of receiving chambers 113 will not change. As long as the input-output module 20 is fixed in the receiving chamber 113, the relative positions between the input-output modules 20 will not change.
  • the plurality of receiving chambers 113 include a first receiving chamber 1131 and a second receiving chamber 1132
  • the plurality of through holes 114 include a first receiving chamber.
  • the time-of-flight module 22 is fixedly installed in the first receiving cavity 1131 and passes through the first through hole 1141 from the first surface 111.
  • the imaging module 21 is installed in the second receiving cavity 1132 and is exposed from the first surface 111 through the second through hole 1142.
  • the imaging module 21 includes any one of a visible light camera, an infrared camera, a black and white camera, a telephoto camera, and a wide-angle camera.
  • the time-of-flight module 22 includes a light transmitter 221 and a light receiver 222.
  • the center of the light transmitter 221, the center of the light receiver 222, and the center of the imaging module 21 are located On the same straight line.
  • the imaging module 21 is located on a center line connecting the centers of the light transmitter 221 and the light receiver 222.
  • the imaging module 21 includes a main camera 211 and a sub camera 212, and the plurality of storage chambers 113 include a first storage chamber 1131, a second storage chamber 1132, and a third storage chamber.
  • the plurality of through holes 114 include a first through hole 1141 corresponding to the first receiving cavity 1131, a second through hole 1142 corresponding to the second receiving cavity 1132, and a third through hole corresponding to the third receiving cavity 1133 1143, the time-of-flight module 22 is fixedly installed in the first receiving cavity 1131 and exposed from the first surface 111 through the first through hole 1141, and the main camera 211 is installed in the second receiving cavity 1132 and from the first through the second through hole 1142.
  • One side 111 is exposed, and the secondary camera 212 is installed in the third receiving cavity 1133 and is exposed from the first side 111 through the third through hole 1143.
  • the time-of-flight module 22 includes a light transmitter 221 and a light receiver 222, a center of the light transmitter 221, a center of the light receiver 222, and a main camera 211 and a sub camera 212. At least one of is on the same line.
  • the time-of-flight module 22 is located on a center line connecting the center of the main camera 211 and the sub-camera 212.
  • the main camera 211 is a wide-angle camera, and the sub camera 212 is a telephoto camera; or, the main camera 211 is a color camera, and the sub camera 212 is a black and white camera; or, the main camera 211 is color
  • the sub camera 212 is a color camera; or, the main camera 211 is a color camera, and the sub camera 212 is an infrared camera; or, the main camera 211 is an infrared camera, and the sub camera 212 is a black and white camera.
  • the bracket 10 includes a side wall 11 connecting the first surface 111 and the second surface 112, and the side wall 11 surrounds a plurality of receiving chambers 113,
  • the second surface 112 is provided with a plurality of limiting slots 115 penetrating through the side wall 11 and correspondingly communicating with the plurality of receiving chambers 113;
  • the time-of-flight module 22 includes a first substrate assembly 223,
  • the imaging module 21 includes an imaging circuit board 202, A substrate assembly 223 and an imaging circuit board 202 are both disposed in the limiting slot 115.
  • the plurality of receiving chambers 113 include an imaging receiving chamber 1130 for mounting the imaging module 21, and the plurality of limiting slots 115 include a communication imaging receiving chamber 1130.
  • the imaging limiting slot 1150 and the second surface 112 are further provided with a mounting slot 116 penetrating the side wall 11 and communicating with the imaging receiving cavity 1130.
  • the mounting slot 116 and the imaging limiting slot 1150 are located on opposite sides of the imaging receiving cavity 1130;
  • the bracket 10 further includes a shielding portion 13 extending from the side wall 11 to a side away from the imaging accommodation cavity 1130.
  • the shielding portion 13 is located on the side wall 11 corresponding to the mounting groove 116.
  • the imaging circuit board 202 is inserted in the mounting groove 116.
  • the output module 20 further includes 227 groups of electronic components, which are disposed on the imaging circuit board 202 and correspond to the shielding portion 13.
  • the opening size of the through hole 114 is smaller than the opening size of the corresponding receiving cavity 113 to form the limiting ring 12.
  • the receiving cavity 113 is formed by the limiting ring 12 and the surrounding limiting ring. 12 extended inner walls are formed.
  • the bracket 10 includes a side wall 11 and a flange 14.
  • the side wall 11 connects the first surface 111 and the second surface 112 and surrounds a plurality of receiving chambers 113.
  • 14 is formed from the side wall 11 toward the side away from the receiving cavity 113, and the flange 14 is located at an end of the side wall 11 near the first surface 111 and is disposed around the receiving cavity 113.
  • the time-of-flight module 22 includes a first substrate assembly 223, a spacer 224, a light transmitter 221, and a light receiver 222.
  • the first substrate assembly 223 includes interconnected The first substrate 2231 and the flexible circuit board 2232; the spacer 224 is disposed on the first substrate 2231; the light emitter 221 is disposed on the spacer 224, the flexible circuit board 2232 is bent and one end of the flexible circuit board 2232 is connected to the first substrate 2231 The other end is connected to the light transmitter 221.
  • the light receiver 222 is disposed on the first substrate 2231.
  • the light receiver 222 includes a housing 2221 and an optical element 2222 provided on the housing 2221.
  • the housing 2221 is connected to the spacer 224 as a whole.
  • the plurality of receiving cavities 113 include a first receiving cavity 1131
  • the plurality of through holes 114 include a first through hole 1141 corresponding to the first receiving cavity 1131
  • the time of flight module 22 is fixed. It is installed in the first receiving cavity 1131 and exposed from the first surface 111 through the first through hole 1141.
  • the first receiving cavity 1131 includes a first sub-receiving cavity 1134 and a second sub-receiving cavity 1135
  • the first through hole 1141 includes the first sub through hole 1144
  • the first sub through hole 1144 corresponds to the first sub receiving cavity 1134
  • the second sub through hole 1145 corresponds to the second sub receiving cavity 1135
  • the light receiver 222 is installed in the first sub receiving cavity 1134
  • the light emitter 221 is installed in the second sub-receiving cavity 1135 and exposed from the second sub-through hole 1145.
  • a mobile device 200 includes a casing 40 and an input-output component 100.
  • the input-output component 100 is mounted on the casing 40; the input-output component 100 includes a bracket 10 and an input.
  • the output module 20 and the bracket 10 are an integrated structure.
  • the bracket 10 includes a first surface 111 and a second surface 112 opposite to each other.
  • the second surface 112 is provided with a plurality of receiving chambers 113, and the first surface 111 is provided with a plurality of receiving chambers.
  • input and output module 20 includes imaging module 21 and time of flight module 22, imaging module 21 and time of flight module 22 are fixedly installed in a plurality of receiving chambers 113 respectively
  • the through hole 114 is exposed from the first surface 111.
  • an input-output assembly 100 includes a bracket 10, an input-output module 20, and an electronic component group 30.
  • the bracket 10 is an integrated structure and includes a side wall 11, a stop ring 12, a shielding portion 13 and a flange 14.
  • the side wall 11 includes a first surface 111 and a second surface 112 opposite to each other.
  • the second surface 112 defines a plurality of spaced-apart accommodation chambers 113.
  • the first surface 111 is provided with a plurality of through holes 114 corresponding to the plurality of receiving cavities 113.
  • the number of the receiving cavities 113 may be two, three, four, or any number of them.
  • the number of the through holes 114 is the same as the number of the receiving cavities 113 and is provided one by one.
  • the plurality of receiving chambers 113 include an imaging receiving chamber 1130 for mounting the imaging module 21.
  • the imaging receiving chamber 1130 of this embodiment includes a second receiving chamber 1132 and a third receiving chamber 1133.
  • the number of the storage chambers 113 in this embodiment is three, and the three storage chambers 113 include a first storage chamber 1131, a second storage chamber 1132, and a third storage chamber 1133 which are spaced apart in sequence.
  • the first storage chamber 1131 includes a connection
  • the first sub-receiving cavity 1134 and the second sub-receiving cavity 1135 are communicated.
  • the through hole 114 includes a first through hole 1141, a second through hole 1142, and a third through hole 1143 respectively corresponding to the first receiving cavity 1131, the second receiving cavity 1132, and the third receiving cavity 1133.
  • the first through hole 114 The first sub-receiving cavity 1134 and the second sub-receiving cavity 1135 respectively include a first sub-through hole 1144 and a second sub-through hole 1145.
  • the center of the first sub through hole 1144, the center of the second sub through hole 1145, the center of the second through hole 1142, and the center of the third through hole 1143 are located on the same straight line L.
  • the second surface 112 is further provided with a plurality of limiting grooves 115 and mounting grooves 116.
  • Each of the plurality of limiting grooves 115 penetrates the side wall 11, and the plurality of limiting grooves 115 communicate with the plurality of receiving chambers 113 correspondingly.
  • the number of the limiting grooves 115 is the same as the number of the receiving chambers 113 and is located on the same side of the straight line L.
  • the plurality of limiting grooves 115 include a first limiting groove 1151, a second limiting groove 1152, and a third limiting groove 1153.
  • the first limiting slot 1151 is in communication with the first receiving cavity 1131
  • the second limiting slot 1152 is in communication with the second receiving cavity 1132
  • the third limiting slot 1153 is in communication with the third receiving cavity 1133.
  • the plurality of limiting slots 115 include an imaging limiting slot 1150 for mounting the imaging circuit board 202.
  • the imaging limiting slot 1150 of this embodiment includes a second limiting slot 1152 and a third limiting slot 1153.
  • the mounting groove 116 is located on a side of the second receiving cavity 1132 away from the second limiting groove 1152 and is opposite to the second limiting groove 1152.
  • the mounting groove 115 penetrates the side wall 11 and communicates with the second receiving cavity 1132.
  • the opening size of the through hole 114 is smaller than the opening size of the corresponding receiving cavity 113 to form the stop ring 12.
  • the limit ring 12 is used to limit the installation position of the input-output module 20 installed in the receiving cavity 113.
  • the shielding portion 13 extends from the sidewall 11 toward a side away from the second receiving cavity 1132, and the shielding portion 13 is located on the sidewall 11 corresponding to the mounting groove 116.
  • the shielding portion 13 is provided with a dispensing hole 131 penetrating the shielding portion 13.
  • the number of the dispensing holes 131 may be one, two, or any plurality.
  • the flange 14 extends from the side wall 11 to a side away from the receiving cavity 113.
  • the flange 14 is located at an end of the side wall 11 near the first surface 111 and is disposed around the receiving cavity 113.
  • the bracket 10 can pass through a circuit board (not shown) formed with a mounting hole in the mobile device 200 (as shown in FIG. 8), and the flange 14 interferes with the circuit board.
  • the input / output module 20 includes at least an imaging module 21 and a time-of-flight module 22.
  • the imaging module 21 and the time-of-flight module 22 are installed in a plurality of receiving chambers 113 and are located on the same straight line L.
  • the imaging module 21 includes an imaging body 201 and an imaging circuit board 202.
  • the imaging body 201 includes at least one of a first imaging body 2111 and a second imaging body 2121.
  • the imaging circuit board 202 corresponds to the imaging body 201 and includes at least one of the first circuit board 2112 and the second circuit board 2122. Specifically, when the imaging body 201 includes the first imaging body 2111, the imaging circuit board 202 includes the first circuit Board 2112; when the imaging body 201 includes a second imaging body 2121, the imaging circuit board 202 includes a second circuit board 2122.
  • the imaging body 201 is installed in the receiving cavity 113 (for example, the second receiving cavity 1132) and is exposed from the first surface 111 through the through hole 114 (for example, the second through hole 1142).
  • the imaging circuit board 202 is disposed in the limiting slot 115 (for example, the second limiting slot 1152).
  • the imaging module 21 includes any one of a visible light camera, an infrared camera, a black and white camera, a telephoto camera, and a wide-angle camera.
  • the number of the imaging modules 21 may be one, two, three, or any plurality.
  • the imaging module 21 of this embodiment includes a main camera 211 and a sub camera 212.
  • the main camera 211 is installed in the second receiving cavity 1132 and is exposed from the first surface 111 through the second through hole 1142.
  • the main camera 211 includes a first imaging body 2111 and a first circuit board 2112.
  • the first imaging body 2111 is installed in the second receiving cavity 1132 and is exposed from the second through hole 1142.
  • the first circuit board 2112 is disposed in the second limiting slot 1152 and the mounting slot 116.
  • the main camera 211 may be a wide-angle camera, a color camera (ie, an RGB camera), or an infrared camera.
  • the secondary camera 212 is installed in the third receiving cavity 1133 and is exposed from the first surface 111 through the third through hole 1143.
  • the secondary camera 212 includes a second imaging body 2121 and a second circuit board 2122.
  • the second imaging body 2121 is installed in the third receiving cavity 1133 and is exposed from the third through hole 1143.
  • the second circuit board 2122 is disposed in the third limiting slot 1153.
  • the secondary camera 212 may be a telephoto camera, a black and white camera (that is, a Mono camera), a color camera, or an infrared camera.
  • the sub camera 212 when the main camera 211 is a wide-angle camera, the sub camera 212 may be a telephoto camera; when the main camera 211 is a color camera, the sub camera 212 may be a black and white camera; when the main camera 211 is a color camera, the sub camera 212 may be a color camera When the main camera 211 is a color camera, the sub camera 212 may be an infrared camera; when the main camera 211 is an infrared camera, the sub camera 212 may be a black and white camera.
  • wide-angle and telephoto are relative terms.
  • the wide-angle camera has a larger field of view relative to the telephoto camera, and the telephoto camera has a longer focal length and a longer shooting distance than the wide-angle camera.
  • the black and white camera can improve the shooting quality of low-light / night scene images.
  • the time-of-flight module 22 includes a first substrate assembly 223, a pad 224, a light transmitter 221 and a light receiver 222. 3, the time-of-flight module 22 is fixedly installed in the first receiving cavity 1131 and is exposed from the first surface 111 through the first through hole 1141. Specifically, the first substrate assembly 223, the spacer 224, and the light emitter 221 The light receiver 222 and the light receiver 222 are both contained in the first receiving cavity 1131, and the light transmitter 221 and the light receiver 222 are exposed from the first surface 111 through the first through hole 1141.
  • the first substrate assembly 223 protrudes from the first limiting groove 1151.
  • the first substrate assembly 223 includes a first substrate 2231 and a flexible circuit board 2232 connected to each other.
  • the first substrate 2231 may be a printed circuit board or a flexible circuit board, and the control circuit of the time-of-flight module 22 may be laid on the first substrate 2231.
  • One end of the flexible circuit board 2232 may be connected to the first substrate 2231, and the other end of the flexible circuit board 2232 may be connected to the circuit board 2211 of the light transmitter 221.
  • the flexible circuit board 2232 can be bent at a certain angle, so that the relative positions of the devices connected at both ends of the flexible circuit board 2232 can have more choices.
  • the spacer 224 is disposed on the first substrate 2231.
  • the pad 224 is in contact with the first substrate 2231 and is carried on the first substrate 2231.
  • the pad 224 may be combined with the first substrate 2231 by means of adhesion or the like.
  • the material of the spacer 224 may be metal, plastic, or the like.
  • a surface where the pad 224 is combined with the first substrate 2231 may be a plane, and a surface opposite to the combined surface of the pad 224 may also be a plane, so that when the light emitter 221 is disposed on the pad 224 Has better stability.
  • the light emitter 221 is installed in the second sub-receiving cavity 1135 and is exposed through the second sub-through hole 1145.
  • the light emitter 221 is disposed on the pad 224.
  • the flexible circuit board 2232 is bent and one end of the flexible circuit board 2232 is connected to the first substrate 2231 and the other end is connected to the light emitter 221.
  • the optical transmitter 221 is configured to emit an optical signal outward.
  • the light receiver 222 is installed in the first sub-receiving cavity 1134 and is exposed from the first sub-through hole 1144.
  • the light receiver 222 is disposed on the first substrate 2231, and the contact surface between the light receiver 222 and the first substrate 2231 is substantially flush with the contact surface between the pad 224 and the first substrate 2231 (that is, the installation starting point of the two is On the same plane).
  • the light receiver 222 includes a housing 2221 and an optical element 2222.
  • the housing 2221 is provided on the first substrate 2231, and the optical element 2222 is provided on the housing 2221.
  • the housing 2221 may be a lens holder and a lens barrel of the light receiver 222, and the optical element 2222 may be a lens or other elements provided in the housing 2221.
  • the optical receiver 222 is configured to receive an optical signal emitted by the reflected optical transmitter 221.
  • the light receiver 222 may further include a photosensitive chip (not shown), and the optical signal reflected by the measured target is irradiated into the photosensitive chip through the action of the optical element 2222, and the photosensitive chip generates a response to the optical signal.
  • the time-of-flight module 22 calculates the time difference between the light signal emitted by the light transmitter 221 and the light chip receiving the light signal reflected by the measured object, and further obtains the depth information of the measured object, which can be used for ranging, For generating depth images or for 3D modeling.
  • the housing 2221 and the pad 224 are integrally connected.
  • the housing 2221 and the spacer 224 may be integrally molded.
  • the materials of the housing 2221 and the spacer 224 are the same and integrally formed by injection molding, cutting, or the like; or the materials of the housing 2221 and the spacer 224 are different, and the two are through two-color injection molding. Forming in one way.
  • the housing 2221 and the pad 224 may also be separately formed, and the two form a matching structure.
  • the housing 2221 and the pad 224 may be first integrated into one body, and then jointly disposed on the first substrate 2231; Alternatively, one of the housing 2221 and the pad 224 may be disposed on the first substrate 2231, and then the other is disposed on the first substrate 2231 and connected to form a whole.
  • the center of the light receiver 222, the center of the light transmitter 221, the center of the main camera 211, and the center of the sub camera 212 are located on the same straight line L1.
  • the electronic component group 30 is disposed on the first circuit board 2112 and corresponds to the shielding portion 13. Specifically, the electronic component group 30 is disposed on the same side of the shielding portion 13 as the second surface 112. The user can dispense between the electronic component group 30 and the shielding portion 13 through the dispensing hole 131 to fix the electronic component group 30 on the shielding portion 13.
  • the electronic component group 30 may be components such as a capacitor, an inductor, a transistor, a resistor, an optical device (including a fill light, a lens, etc.), a sensor (for anti-shake), and the like.
  • the electronic component group 30 may be a part of the imaging module 21.
  • the electronic component group 30 may be at least a part of the electronic components in the optical image stabilization component.
  • the electronic component group 30 may be used in conjunction with the imaging module 21, for example, the electronic component group 30 may also be a fill light, and the fill light is used to fill the imaging module 21 with light.
  • the portion 13 is provided with a light through hole, and the electronic component group 30 can be exposed from the first surface 111 through the light through hole.
  • the bracket 10 in the input-output module 100 is an integrated structure.
  • the imaging module 21 and the time-of-flight module 22 are installed in the receiving cavity 113, the relative positions of the imaging module 21 and the time-of-flight module 22 are not easy. Changes are made, so that multiple I / O modules 20 can work better together. Specifically, the positions of the plurality of receiving chambers 113 will not change. As long as the input-output module 20 is fixed in the receiving chamber 113, the relative positions between the input-output modules 20 will not change.
  • the pad 224 can raise the height of the light emitter 221, thereby increasing the height of the exit surface of the light emitter 221, and the light emitter 221
  • the transmitted light signal is not easily blocked by the light receiver 222, so that the light signal can be completely irradiated on the measured object;
  • the bracket 10 forms a limit ring 12, and when the input / output module 20 is installed in the receiving cavity 113, the input / output module The group 20 and the stop ring 12 oppose each other, thereby facilitating the positioning and installation of the input / output module 20;
  • the bracket 10 is provided with a shielding portion 13 and the electronic component group 30 is disposed on the same side of the shielding portion 13 and the second surface 112, so that When the input / output module 100 is installed on the mobile device 200, the electronic component group 30 can be protected from collision;
  • the bracket 10 is provided with a flange 14 to facilitate the positioning and installation of the bracket 10.
  • the two receiving cavities 113 are a first receiving cavity 1131 and a second receiving cavity 1132, respectively.
  • the first receiving cavity 1131 includes a first communicating cavity.
  • the through-hole 114 includes a first through-hole 1141 and a second through-hole 1142 corresponding to the first receiving cavity 1131 and the second receiving cavity 1132, respectively, wherein the first through-hole 114 includes a first sub-receiving cavity 1134 and The second sub-receiving cavity 1135 corresponds to the first sub-through hole 1144 and the second sub-through hole 1145, respectively.
  • the centers of the first sub through hole 1144, the second sub through hole 1145, and the second through hole 1142 are located on the same straight line.
  • the number of the imaging modules 21 is one, and the imaging modules 21 are any one of a visible light camera, an infrared camera, a black and white camera, a telephoto camera, and a wide-angle camera.
  • the light receiver 222, the light transmitter 221, and the imaging module 21 are sequentially installed in the first sub-receiving cavity 1134, the second sub-receiving cavity 1135, and the second accommodating cavity 1132, respectively.
  • the center of the light receiver 222, the center of the light transmitter 221, and the center of the imaging module 21 are located on the same straight line.
  • the imaging module 21 is located on a center line (mid-perpendicular line) connecting the centers of the light transmitter 221 and the light receiver 222.
  • the center of the first sub-through hole 1144 and the second sub-through hole The line connecting the center of 1145 is the first line segment, and the line connecting the center of the second through hole 1142 and the center of the first through hole 1141 is the second line segment.
  • the first line segment and the second line segment are perpendicular to each other, and the second line segment Located on the vertical line of the first line segment.
  • the line connecting the center of the light receiver 222 installed in the first sub-receiving cavity 1134 and the center of the light transmitter 221 installed in the second sub-receiving cavity 1135 is the third line segment, and the imaging module 21 is located in the third On the midline (perpendicular line) of the line segment.
  • the number of the receiving chambers 113 is three, and the three receiving chambers 113 include a first receiving chamber 1131, a second receiving chamber 1132, and a third receiving chamber 1133 which are disposed at intervals.
  • the through hole 114 includes a first through hole 1141, a second through hole 1142, and a third through hole 1143 respectively corresponding to the first receiving cavity 1131, the second receiving cavity 1132, and the third receiving cavity 1133.
  • the number of the imaging modules 21 is two, which are the main camera 211 and the sub camera 212, respectively.
  • the main camera 211 is a wide-angle camera, and the sub camera 212 is a telephoto camera; or, the main camera 211 is a color camera, and the sub camera 212 is a black and white camera; or, the main camera 211 is a color camera, and the sub camera 212 is a color camera;
  • the main camera 211 is a color camera, and the sub camera 212 is an infrared camera; or, the main camera 211 is an infrared camera, and the sub camera 212 is a black and white camera.
  • the center of the light transmitter 221 and the center of the light receiver 222 are on the same straight line as at least one of the main camera 211 and the sub camera 212.
  • the center of the light transmitter 221, the center of the light receiver 222, and the center of the main camera 211 are on the same straight line.
  • the line connecting the center of the main camera 211 and the center of the sub camera 212 may be perpendicular to the line;
  • the center of the light transmitter 221, the center of the light receiver 222, and the center of the sub camera 212 are located on the same straight line.
  • the line connecting the center of the main camera 211 and the center of the sub camera 212 may be perpendicular to the line.
  • the time-of-flight module 22 is located on the centerline of the center line of the main camera 211 and the sub-camera 212. Specifically, the line between the center of the main camera 211 and the center of the sub-camera 212 is perpendicular to the light transmitter 221 The center of the light source is connected to the center of the light receiver 222, and the light transmitter 221 and the light receiver 222 are located on the center line (midline) of the line of connection between the center of the main camera 211 and the center of the sub camera 212.
  • the line connecting the center of the main camera 211 and the center of the sub camera 212 is parallel to the line connecting the center of the light transmitter 221 and the center of the light receiver 222.
  • the connection between the center of the main camera 211 and the center line of the light transmitter 221 is perpendicular to the connection between the center of the main camera 211 and the center of the sub camera 212; or, the connection between the center of the main camera 211 and the center line of the light receiver 222 is perpendicular to the main
  • the connection between the center of the camera 211 and the center of the sub camera 212; or, the connection between the center of the sub camera 212 and the center line of the light receiver 222 is perpendicular to the line between the center of the main camera 211 and the center of the sub camera 212; the sub camera 212
  • the connection line between the center of the center and the light emitter 221 is perpendicular to the connection line between the center of the main camera 211 and the center of the sub camera 212.
  • an accommodating cavity 2241 is defined on a side where the pad 224 is combined with the first substrate 2231.
  • the time-of-flight module 22 further includes an electronic component 227 disposed on the first substrate 2231, and the electronic component 227 is received in the accommodation cavity 2241.
  • the electronic component 227 may be an element such as a capacitor, an inductor, a transistor, a resistor, etc.
  • the electronic component 227 may be electrically connected to a control line laid on the first substrate 2231 and used to drive or control the operation of the light transmitter 221 or the light receiver 222.
  • the electronic component 227 is housed in the accommodating cavity 2241, and the space in the pad 224 is used reasonably.
  • the number of the accommodating cavities 2241 may be one or more, and the plurality of accommodating cavities 2241 may be spaced apart from each other.
  • the positions of the accommodating cavities 2241 and the electronic components 227 can be aligned and the pads can be aligned.
  • 224 is disposed on the first substrate 2231.
  • the cushion block 224 is provided with an escape hole 225 communicating with the at least one receiving cavity 2241, and at least one electronic component 227 extends into the escape hole 225.
  • the height of the electronic component 227 is required to be not higher than the height of the accommodating cavity 2241.
  • an avoidance perforation 225 corresponding to the accommodation cavity 2241 may be provided, and the electronic component 227 may partially extend into the avoidance perforation 225 so as not to increase the height of the cushion block 224. Arranges the electronic component 227.
  • the first substrate assembly 223 further includes a reinforcing plate 2233.
  • the reinforcing plate 2233 is coupled to a side of the first substrate 2231 opposite to the pad 224.
  • the reinforcing plate 2233 may cover one side of the first substrate 2231, and the reinforcing plate 2233 may be used to increase the strength of the first substrate 2231 and prevent deformation of the first substrate 2231.
  • the reinforcing plate 2233 may be made of a conductive material, such as metal or alloy.
  • the time-of-flight module 22 further includes a connector 226.
  • the connector 226 is connected to the first substrate assembly 223 and is used to electrically connect with electronic components outside the time-of-flight module 22. connection.
  • the mobile device 200 includes a casing 40 and the input / output component 100 of any one of the foregoing embodiments.
  • the input / output component 100 is mounted on the casing 40.
  • the mobile device 200 includes any one of a mobile phone, a tablet computer, a notebook computer, a smart bracelet, and a smart helmet.
  • the housing 40 can provide protection for the input / output module 100 from dust, water, and drops.
  • the housing 40 is provided with a hole corresponding to the input / output module 20, and the input / output module 20 (for example, the light transmitter 221) emits light. Light can pass through the hole out of the casing 40; light outside the casing 40 can pass through the hole into the casing 40 and transmitted to the input-output module 20 (for example, the light receiver 222, the imaging module 21).
  • the input-output module 100 is housed in the housing 40 and can extend from the housing 40. At this time, the housing 40 does not need to be opened with the input and output directions of the input-output module 100.
  • the housing 40 includes a main body 41 and a movable portion 42.
  • the input / output assembly 100 is mounted on the movable portion 42.
  • the movable portion 42 can move relative to the main body 41 under the driving of a driving device. 42 can slide relative to the main body 41 to slide into the main body 41 (as shown in FIG. 8) or out of the main body 41 (as shown in FIG. 9).
  • the movable section 42 drives the input / output module 100 to protrude from the housing 40 to the outside of the housing 40; when the input / output module 100 is not needed, the movable section 42 drives the input / output module 100 It is received from the outside of the case 40 into the inside of the case 40.
  • the mobile device 200 further includes a display screen 50.
  • the input / output component 100 is housed in the casing 40 and located below the display screen 50. At this time, the casing 40 does not need to be opened. A hole corresponding to the direction of light entering and exiting the input-output module 100.
  • the bracket 10 in the mobile device 200 is an integrated structure.
  • the imaging module 21 and the time-of-flight module 22 are installed in the receiving cavity 113, the relative positions of the imaging module 21 and the time-of-flight module 22 are unlikely to occur. Change, so that the multiple I / O modules 20 can work better together. Specifically, the positions of the plurality of receiving chambers 113 will not change. As long as the input-output module 20 is fixed in the receiving chamber 113, the relative positions between the input-output modules 20 will not change.
  • first and second are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as “first” and “second” may explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "plurality” is at least two, for example, two, three, unless specifically defined otherwise.

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Abstract

一种移动设备(200)及输入输出组件(100)，输入输出组件(100)包括支架(10)及输入输出模组(20)，支架(10)为一体结构，支架(10)包括相背的第一面(111)和第二面(112)，第二面(112)开设有多个收容腔(113)，第一面(111)开设有与多个收容腔(113)对应的多个通孔(114)；输入输出模组(20)包括成像模组(21)及飞行时间模组(22)，成像模组(21)及飞行时间模组(22)分别固定安装在多个收容腔(113)内并均通过对应的通孔(114)从第一面(111)暴露。

Description

输入输出组件和移动设备
优先权信息
本申请请求2018年08月22日向中国国家知识产权局提交的、专利申请号为201810962820.7的专利申请的优先权和权益，并且通过参照将其全文并入此处。
技术领域
本申请涉及消费性电子技术领域，更具体而言，涉及一种输入输出组件和移动设备。
背景技术
手机可以配置有多个功能模组，而多个功能模组往往需要互相配合才能正常工作。
发明内容
本申请实施方式提供一种输入输出组件和移动设备。
本申请实施方式的输入输出组件包括支架及输入输出模组。所述支架为一体结构，所述支架包括相背的第一面和第二面，所述第二面开设有多个收容腔，所述第一面开设有与多个所述收容腔对应的多个通孔。所述输入输出模组包括成像模组及飞行时间模组，所述成像模组及所述飞行时间模组分别固定安装在多个所述收容腔内并均通过对应的所述通孔从所述第一面暴露。
本申请实施方式的移动设备包括壳体和输入输出组件，所述输入输出组件安装在所述壳体上；所述输入输出组件包括支架及输入输出模组，所述支架为一体结构，所述支架包括相背的第一面和第二面，所述第二面开设有多个收容腔，所述第一面开设有与多个所述收容腔对应的多个通孔；所述输入输出模组包括成像模组及飞行时间模组，所述成像模组及所述飞行时间模组分别固定安装在多个所述收容腔内并均通过对应的所述通孔从所述第一面暴露。
本申请的实施方式的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本申请的实施方式的实践了解到。
附图说明
本申请的上述和/或附加的方面和优点从结合下面附图对实施方式的描述中将变得明显和容易理解，其中：
图1是本申请实施方式的输入输出组件的立体结构示意图。
图2及图3是本申请实施方式的输入输出组件的立体分解示意图。
图4是本申请实施方式的输入输出组件中的支架的平面示意图。
图5是本申请实施方式的输入输出组件中的支架的立体结构示意图。
图6是本申请实施方式的输入输出组件中的飞行时间模组的立体结构示意图。
图7是图6所示的飞行时间模组沿VII-VII线的截面示意图。
图8及图9是本申请实施方式的电子设备的立体结构示意图。
具体实施方式
以下结合附图对本申请的实施方式作进一步说明。附图中相同或类似的标号自始至终表示相同或类似的元件或具有相同或类似功能的元件。
另外，下面结合附图描述的本申请的实施方式是示例性的，仅用于解释本申请的实施方式，而不能理解为对本申请的限制。
请参阅图1至图3，本申请实施方式的输入输出组件100包括支架10及输入输出模组20。支架10为一体结构，支架10包括相背的第一面111和第二面112，第二面112开设有多个收容腔113，第一面111开设有与多个收容腔113对应的多个通孔114。输入输出模组20包括成像模组21及飞行时间模组22，成像模组21及飞行时间模组22分别固定安装在多个收容腔113内并均通过对应的通孔114从第一面111暴露。
其中，支架10可以是一体成型的结构，也可以是分体成型后组装在一起的一体结构。暴露指的是可以从第一面111看到输入输出模组20，例如，输入输出模组20可以穿过第一面111的通孔114从第一面111暴露，输入输出模组20也可以未穿过通孔114，但通过通孔114可以看到输入输出模组20。
现有的手机在使用过程中受到撞击时，配置在手机上的多个功能模组的相对位置容易发生改变而不能很好地配合工作。
本申请实施方式的输入输出组件100中的支架10为一体结构，当成像模组21及飞行时间模组22安装在收容腔113内时，成像模组21及飞行时间模组22的相对位置不易发生变化，从而使多个输入输出模组20能够更好地配合工作。具体地，多个收容腔113的位置不会发生变化，只要将输入输出模组20固定在收容腔113内，输入输出模组20之间的相对位置也不会发生变化。
请参阅图3及图4，在某些实施方式中，在某些实施方式中，多个收容腔113包括第一收容腔1131与第二收容腔1132，多个通孔114包括与第一收容腔1131对应的第一通孔1141及与第二收容腔1132对应的第二通孔1142，飞行时间模组22固定安装在第一收容腔1131内并通过第一通孔1141从第一面111暴露，成像模组21安装在第二收容腔1132内并通过第二通孔1142从第一面111暴露。
请参阅图3及图4，在某些实施方式中，成像模组21包括可见光摄像头、红外摄像头、黑白摄像头、长焦摄像头、及广角摄像头中的任意一种。
请参阅图3，在某些实施方式中，飞行时间模组22包括光发射器221及光接收器222，光发射器221的中心、光接收器222的中心、与成像模组21的中心位于同一直线上。
请参阅图3，在某些实施方式中，成像模组21位于光发射器221与光接收器222的中心连线的中线上。
请参阅图3及图4，在某些实施方式中，成像模组21包括主摄像头211和副摄像头212，多个收容腔113包括第一收容腔1131、第二收容腔1132、及第三收容腔1133，多个通孔114包括与第一收容腔1131对应的第一通孔1141、与第二收容腔1132对应的第二通孔1142、及与第三收容腔1133对应的第三通孔1143，飞行时间模组22固定安装在第一收容腔1131内并通过第一通孔1141从第一面111暴露，主摄像头211安装在第二收容腔1132内并通过第二通孔1142从第一面111暴露，副摄像头212安装在第三收容腔1133内并通过第三通孔1143从第一面111暴露。
请参阅图3，在某些实施方式中，飞行时间模组22包括光发射器221及光接收器222，光发射器221的中心、光接收器222的中心与主摄像头211及副摄像头212中的至少一个位于同一直线上。
请参阅图3，在某些实施方式中，飞行时间模组22位于主摄像头211及副摄像头212的中心连线的中线上。
请参阅图3，在某些实施方式中，主摄像头211为广角摄像头，副摄像头212为长焦摄像头；或者，主摄像头211为彩色摄像头，副摄像头212为黑白摄像头；或者，主摄像头211为彩色摄像头，副摄像头212为彩色摄像头；或者，主摄像头211为彩色摄像头，副摄像头212为红外摄像头；或者，主摄像头211为红外摄像头，副摄像头212为黑白摄像头。
请参阅图2、图3、图5及图7，在某些实施方式中，支架10包括连接第一面111及第二面112的侧壁11，侧壁11围成多个收容腔113，第二面112开设有贯穿侧壁11并与多个收容腔113对应连通的多个限位槽115；飞行时间模组22包括第一基板组件223，成像模组21包括成像电路板202，第一基板组件223和成像电路板202均穿设在限位槽115内。
请参阅图3至图5、及图7，在某些实施方式中，多个收容腔113包括用于安装成像模组21的成像收容腔1130，多个限位槽115包括连通成像收容腔1130的成像限位槽1150，第二面112还开设有贯穿侧壁11并与成像收容腔1130连通的安装槽116，安装槽116和成像限位槽1150位于成像收容腔1130的相背两侧；支架10还包括自侧壁11朝远离成像收容腔1130一侧延伸的遮挡部13，遮挡部13位于与安装槽116对应的侧壁11上；成像电路 板202穿设在安装槽116内，输入输出模组20还包括电子元件227组，电子元件227组设置在成像电路板202上并与遮挡部13对应。
请参阅图3及图4，在某些实施方式中，通孔114的开口尺寸小于对应的收容腔113的开口尺寸以形成限位环12，收容腔113由限位环12及环绕限位环12延伸的内壁形成。
请参阅图3至图5，在某些实施方式中，支架10包括侧壁11及凸缘14，侧壁11连接第一面111及第二面112并围成多个收容腔113，凸缘14自侧壁11朝远离收容腔113一侧延伸形成，凸缘14位于侧壁11的靠近第一面111的一端并环绕收容腔113设置。
请参阅图6及图7，在某些实施方式中，飞行时间模组22包括第一基板组件223、垫块224、光发射器221及光接收器222，第一基板组件223包括互相连接的第一基板2231及柔性电路板2232；垫块224设置在第一基板2231上；光发射器221设置在垫块224上，柔性电路板2232弯折且柔性电路板2232的一端连接第一基板2231，另一端连接光发射器221；光接收器222设置在第一基板2231上，光接收器222包括外壳2221及设置在外壳2221上的光学元件2222，外壳2221与垫块224连接成一体。
请参阅图3，在某些实施方式中，多个收容腔113包括第一收容腔1131，多个通孔114包括与第一收容腔1131对应的第一通孔1141，飞行时间模组22固定安装在第一收容腔1131内并通过第一通孔1141从第一面111暴露。
请参阅图3，在某些实施方式中，第一收容腔1131包括相连通的第一子收容腔1134和第二子收容腔1135，第一通孔1141包括相连通的第一子通孔1144和第二子通孔1145，第一子通孔1144与第一子收容腔1134对应，第二子通孔1145与第二子收容腔1135对应，光接收器222安装在第一子收容腔1134内并从第一子通孔1144暴露，光发射器221安装在第二子收容腔1135内并从第二子通孔1145暴露。
请参阅图1至图3、及图8，本申请实施方式的移动设备200包括壳体40和输入输出组件100，输入输出组件100安装在壳体40上；输入输出组件100包括支架10及输入输出模组20，支架10为一体结构，支架10包括相背的第一面111和第二面112，第二面112开设有多个收容腔113，第一面111开设有与多个收容腔113对应的多个通孔114；输入输出模组20包括成像模组21及飞行时间模组22，成像模组21及飞行时间模组22分别固定安装在多个收容腔113内并均通过对应的通孔114从第一面111暴露。
请参阅图1，本申请实施方式的输入输出组件100包括支架10、输入输出模组20及电子元件组30。
请结合图4，支架10为一体结构并包括侧壁11、限位环12、遮挡部13及凸缘14。
侧壁11包括相背的第一面111及第二面112。第二面112开设有多个间隔设置的收容腔113。第一面111开设有与多个收容腔113对应连通的多个通孔114。收容腔113的数量 可以为两个、三个、四个或任意多个，通孔114的数量与收容腔113的数量相同并一一对应设置。请结合图3，多个收容腔113包括用于安装成像模组21的成像收容腔1130，本实施方式的成像收容腔1130包括第二收容腔1132和第三收容腔1133。
本实施方式的收容腔113的数量为三个，三个收容腔113包括依次间隔设置的第一收容腔1131、第二收容腔1132及第三收容腔1133，其中，第一收容腔1131包括相连通的第一子收容腔1134及第二子收容腔1135。通孔114包括与第一收容腔1131、第二收容腔1132及第三收容腔1133分别对应的第一通孔1141、第二通孔1142及第三通孔1143，其中，第一通孔114包括与第一子收容腔1134和第二子收容腔1135分别对应的第一子通孔1144和第二子通孔1145。第一子通孔1144的中心、第二子通孔1145的中心、第二通孔1142的中心及第三通孔1143的中心位于同一直线L上。
请结合图2及图5，第二面112还开设有多个限位槽115及安装槽116。多个限位槽115均贯穿侧壁11，并且多个限位槽115与多个收容腔113对应连通。限位槽115的数量与收容腔113的数量一致并位于直线L的同一侧，多个限位槽115包括第一限位槽1151、第二限位槽1152、和第三限位槽1153，第一限位槽1151与第一收容腔1131连通，第二限位槽1152与第二收容腔1132连通，第三限位槽1153与第三收容腔1133连通。多个限位槽115包括用于安装成像电路板202的成像限位槽1150，本实施方式的成像限位槽1150包括第二限位槽1152和第三限位槽1153。安装槽116位于第二收容腔1132的远离第二限位槽1152的一侧并与第二限位槽1152相对。安装槽115贯穿侧壁11并与第二收容腔1132连通。
通孔114的开口尺寸小于对应的收容腔113的开口尺寸以形成限位环12。限位环12用于限定安装在收容腔113内的输入输出模组20的安装位置。
遮挡部13自侧壁11朝远离第二收容腔1132一侧延伸形成，遮挡部13位于与安装槽116对应的侧壁11上。遮挡部13开设有贯穿遮挡部13的点胶孔131。点胶孔131的数量可以为一个、两个或任意多个。
凸缘14自侧壁11朝远离收容腔113一侧延伸形成，凸缘14位于侧壁11的靠近第一面111的一端并环绕收容腔113设置。支架10可以穿设在移动设备200(如图8所示)中的形成有安装孔的电路板(图未示)内，并且凸缘14与电路板相抵触。
请参阅图1至图3，输入输出模组20至少包括成像模组21和飞行时间模组22。成像模组21和飞行时间模组22安装在多个收容腔113内并位于同一直线L上。
成像模组21包括成像本体201和成像电路板202。成像本体201包括第一成像本体2111和第二成像本体2121中的至少一个。成像电路板202与成像本体201对应并包括第一电路板2112和第二电路板2122中的至少一个，具体地，当成像本体201包括第一成像本体2111时，成像电路板202包括第一电路板2112；当成像本体201包括第二成像本体2121时， 成像电路板202包括第二电路板2122。成像本体201安装在收容腔113(例如，第二收容腔1132)内并通过通孔114(例如，第二通孔1142)从第一面111暴露。成像电路板202穿设在限位槽115(例如，第二限位槽1152)内。成像模组21包括可见光摄像头、红外摄像头、黑白摄像头、长焦摄像头、及广角摄像头中的任意一种。成像模组21的数量可以为一个、两个、三个或任意多个。本实施方式的成像模组21包括主摄像头211和副摄像头212。
主摄像头211安装在第二收容腔1132内并通过第二通孔1142从第一面111暴露。具体地，主摄像头211包括第一成像本体2111及第一电路板2112。第一成像本体2111安装在第二收容腔1132内并从第二通孔1142暴露。第一电路板2112穿设在第二限位槽1152内及安装槽116内。主摄像头211可以为广角摄像头、彩色摄像头(即RGB摄像头)或红外摄像头。
副摄像头212安装在第三收容腔1133内并通过第三通孔1143从第一面111暴露。副摄像头212包括第二成像本体2121及第二电路板2122。第二成像本体2121安装在第三收容腔1133内并从第三通孔1143暴露。第二电路板2122穿设在第三限位槽1153内。副摄像头212可以为长焦摄像头、黑白摄像头(即Mono摄像头)、彩色摄像头或红外摄像头。
具体地，当主摄像头211为广角摄像头时，副摄像头212可以为长焦摄像头；当主摄像头211为彩色摄像头时，副摄像头212可以为黑白摄像头；当主摄像头211为彩色摄像头，副摄像头212可以为彩色摄像头；当主摄像头211为彩色摄像头时，副摄像头212可以为红外摄像头；当主摄像头211为红外摄像头时，副摄像头212可以为黑白摄像头。
需要指出是，“广角”和“长焦”是相对而言的。广角摄像头相对于长焦摄像头具有更大的视场角，长焦摄像头相对于广角摄像头焦距更长、拍摄距离更远。黑白摄像头相对于彩色摄像头能够提升暗光/夜景影像拍摄质量。
请参阅图6及图7，飞行时间模组22包括第一基板组件223、垫块224、光发射器221及光接收器222。请结合图3，飞行时间模组22固定安装在第一收容腔1131内并通过第一通孔1141从第一面111暴露，具体地，第一基板组件223、垫块224、光发射器221及光接收器222均收容在第一收容腔1131内，光发射器221及光接收器222通过第一通孔1141从第一面111暴露。
第一基板组件223从第一限位槽1151内伸出。第一基板组件223包括互相连接的第一基板2231及柔性电路板2232。第一基板2231可以是印刷线路板或柔性线路板，第一基板2231上可以铺设有飞行时间模组22的控制线路等。柔性电路板2232的一端可以连接在第一基板2231上，柔性电路板2232的另一端连接在光发射器221的电路板2211上。柔性电路板2232可以发生一定角度的弯折，使得柔性电路板2232两端连接的器件的相对位置可 以有较多选择。
垫块224设置在第一基板2231上。在一个例子中，垫块224与第一基板2231接触且承载在第一基板2231上，具体地，垫块224可以通过胶粘等方式与第一基板2231结合。垫块224的材料可以是金属、塑料等。在本申请实施例中，垫块224与第一基板2231结合的面可以是平面，垫块224与该结合的面相背的面也可以是平面，使得光发射器221设置在垫块224上时具有较好的平稳性。
光发射器221安装在第二子收容腔1135内并从第二子通孔1145暴露。光发射器221设置在垫块224上。柔性电路板2232弯折且柔性电路板2232的一端连接第一基板2231，另一端连接光发射器221。光发射器221用于向外发射光信号。
光接收器222安装在第一子收容腔1134内并从第一子通孔1144暴露。光接收器222设置在第一基板2231上，且光接收器222和第一基板2231的接触面与垫块224和第一基板2231的接触面基本齐平设置(即，二者的安装起点是在同一平面上)。具体地，光接收器222包括外壳2221及光学元件2222。外壳2221设置在第一基板2231上，光学元件2222设置在外壳2221上，外壳2221可以是光接收器222的镜座及镜筒，光学元件2222可以是设置在外壳2221内的透镜等元件。光接收器222用于接收被反射回的光发射器221发射的光信号。
进一步地，光接收器222还可以包括感光芯片(图未示)，由被测目标反射回的光信号通过光学元件2222作用后照射到感光芯片中，感光芯片对该光信号产生响应。飞行时间模组22计算光发射器221发出光信号与感光芯片接收经被测物体反射该光信号之间的时间差，并进一步获取被测物体的深度信息，该深度信息可以用于测距、用于生成深度图像或用于三维建模等。
本申请实施例中，外壳2221与垫块224连接成一体。具体地，外壳2221与垫块224可以是一体成型，例如外壳2221与垫块224的材料相同并通过注塑、切削等方式一体成型；或者外壳2221与垫块224的材料不同，二者通过双色注塑形成等方式一体成型。外壳2221与垫块224也可以是分别成型，二者形成配合结构，在组装飞行时间模组22时，可以先将外壳2221与垫块224连接成一体，再共同设置在第一基板2231上；也可以先将外壳2221与垫块224中的一个设置在第一基板2231上，再将另一个设置在第一基板2231上且连接成一体。
请结合图3，本实施方式中，光接收器222的中心、光发射器221的中心、主摄像头211的中心和副摄像头212的中心位于同一直线L1上。
电子元件组30设置在第一电路板2112上并与遮挡部13对应。具体地，电子元件组30设置在遮挡部13的与第二面112相同的一侧。用户可以通过点胶孔131在电子元件组 30与遮挡部13之间点胶，以将电子元件组30固定在遮挡部13上。电子元件组30可以是电容、电感、晶体管、电阻、光学器件(包括补光灯、镜片等)、传感器(防抖用)等元件。电子元件组30可以成像模组21的一部分，例如，成像模组21还包括光学防抖(Optical image stabilization,OIS)组件时，电子元件组30可以为光学防抖组件中的至少一部分电子元件。在其他实施方式中，电子元件组30可以用于配合成像模组21使用，例如，电子元件组30还可以为补光灯，补光灯用于给成像模组21补光，此时，遮挡部13开设有通光孔，电子元件组30能够通过通光孔从第一面111暴露。
本申请实施方式的输入输出组件100中的支架10为一体结构，当成像模组21及飞行时间模组22安装在收容腔113内时，成像模组21及飞行时间模组22的相对位置不易发生变化，从而使多个输入输出模组20能够更好地配合工作。具体地，多个收容腔113的位置不会发生变化，只要将输入输出模组20固定在收容腔113内，输入输出模组20之间的相对位置也不会发生变化。
进一步地，飞行时间模组22中，由于光发射器221设置在垫块224上，垫块224可以垫高光发射器221的高度，进而提高光发射器221的出射面的高度，光发射器221发射的光信号不易被光接收器222遮挡，使得光信号能够完全照射到被测物体上；支架10通过形成限位环12，当输入输出模组20安装在收容腔113内时，输入输出模组20与限位环12向抵触，从而便于输入输出模组20的定位安装；支架10通过设置遮挡部13并将电子元件组30设置在遮挡部13与第二面112相同侧，从而在将安装输入输出组件100安装到移动设备200上时能够保护电子元件组30不会受到碰撞；支架10通过设置凸缘14从而便于支架10的定位安装。
在某些实施方式中，当收容腔113的数量为两个时，两个收容腔113分别为第一收容腔1131及第二收容腔1132，其中，第一收容腔1131包括相连通的第一子收容腔1134及第二子收容腔1135。此时，通孔114包括与第一收容腔1131及第二收容腔1132分别对应的第一通孔1141及第二通孔1142，其中，第一通孔114包括与第一子收容腔1134和第二子收容腔1135分别对应的第一子通孔1144和第二子通孔1145。第一子通孔1144、第二子通孔1145及第二通孔1142的中心位于同一直线上。此时，成像模组21的数量为一个，成像模组21为可见光摄像头、红外摄像头、黑白摄像头、长焦摄像头、及广角摄像头中的任意一种。光接收器222、光发射器221、成像模组21依次分别安装在第一子收容腔1134、第二子收容腔1135及第二收容腔1132内。此时，光接收器222的中心、光发射器221的中心、与成像模组21的中心位于同一直线上。在其他实施方式中，成像模组21位于光发射器221与光接收器222的中心连线的中线(中垂线)上，具体地，第一子通孔1144的中心与第二子通孔1145的中心的连线为第一线段，第二通孔1142的中心与第一通孔1141的中 心的连线为第二线段，第一线段与第二线段相互垂直，并且第二线段位于第一线段的中垂线上。如此，安装在第一子收容腔1134内的光接收器222的中心与安装在第二子收容腔1135内的光发射器221的中心的连线为第三线段，成像模组21位于第三线段的中线(中垂线)上。
在某些实施方式中，收容腔113的数量为三个，三个收容腔113包括依次间隔设置的第一收容腔1131、第二收容腔1132及第三收容腔1133。通孔114包括与第一收容腔1131、第二收容腔1132及第三收容腔1133分别对应的第一通孔1141、第二通孔1142及第三通孔1143。此时，成像模组21的数量为两个，分别为主摄像头211和副摄像头212。其中，主摄像头211为广角摄像头，副摄像头212为长焦摄像头；或者，主摄像头211为彩色摄像头，副摄像头212为黑白摄像头；或者，主摄像头211为彩色摄像头，副摄像头212为彩色摄像头；或者，主摄像头211为彩色摄像头，副摄像头212为红外摄像头；或者，主摄像头211为红外摄像头，副摄像头212为黑白摄像头。其中，光发射器221的中心、光接收器222的中心，与主摄像头211及副摄像头212中的至少一个位于同一直线上。例如，光发射器221的中心、光接收器222的中心与主摄像头211的中心位于同一直线上，此时，主摄像头211的中心与副摄像头212的中心的连线与该直线可以垂直；或者，光发射器221的中心、光接收器222的中心与副摄像头212的中心位于同一直线上，此时，主摄像头211的中心与副摄像头212的中心的连线与该直线可以垂直。
在其他实施方式中，飞行时间模组22位于主摄像头211及副摄像头212的中心连线的中线上，具体地，主摄像头211的中心与副摄像头212的中心的连线垂直于光发射器221的中心与光接收器222的中心的连线，并且，光发射器221和光接收器222位于主摄像头211的中心与副摄像头212的中心的连线的中线(中垂线)上。
在其他实施方式中，主摄像头211的中心与副摄像头212的中心的连线平行于光发射器221的中心与光接收器222的中心的连线。主摄像头211的中心与光发射器221的中线连线垂直于主摄像头211的中心与副摄像头212的中心的连线；或者，主摄像头211的中心与光接收器222的中线连线垂直于主摄像头211的中心与副摄像头212的中心的连线；或者，副摄像头212的中心与光接收器222的中线连线垂直于主摄像头211的中心与副摄像头212的中心的连线；副摄像头212的中心与光发射器221的中线连线垂直于主摄像头211的中心与副摄像头212的中心的连线。
请参阅图6及图7，在某些实施方式中，垫块224与第一基板2231结合的一侧开设有容置腔2241。飞行时间模组22还包括设置在第一基板2231上的电子元件227，电子元件227收容在容置腔2241内。电子元件227可以是电容、电感、晶体管、电阻等元件，电子元件227可以与铺设在第一基板2231上的控制线路电连接，并用于驱动或控制光发射器 221或光接收器222工作。电子元件227收容在容置腔2241内，合理地利用了垫块224内的空间，不需要增加第一基板2231的宽度来设置电子元件227，利于减小飞行时间模组22的整体尺寸。容置腔2241的数量可以是一个或多个，多个容置腔2241可以是互相间隔的，在安装垫块224时，可以将容置腔2241与电子元件227的位置对准并将垫块224设置在第一基板2231上。
请参阅图6及图7，在某些实施方式中，垫块224开设有与至少一个容置腔2241连通的避让穿孔225，至少一个电子元件227伸入避让穿孔225内。可以理解，需要将电子元件227收容在容置腔2241内时，要求电子元件227的高度不高于容置腔2241的高度。而对于高度高于容置腔2241的电子元件227，可以开设与容置腔2241对应的避让穿孔225，电子元件227可以部分伸入避让穿孔225内，以在不提高垫块224高度的前提下布置电子元件227。
请参阅图6及图7，在某些实施方式中，第一基板组件223还包括加强板2233，加强板2233结合在第一基板2231的与垫块224相背的一侧。加强板2233可以覆盖第一基板2231的一个侧面，加强板2233可以用于增加第一基板2231的强度，避免第一基板2231发生形变。另外，加强板2233可以由导电的材料制成，例如金属或合金等，当飞行时间模组22安装在移动设备200(图8所示)上时，可以将加强板2233与壳体40(图8所示)电连接，以使加强板2233接地，并有效地减少外部元件的静电对飞行时间模组22的干扰。
请参阅图6及图7，在其他实施方式中，飞行时间模组22还包括连接器226，连接器226连接在第一基板组件223上并用于与飞行时间模组22外部的电子元件电性连接。
请参与图8及图9，本申请实施方式的移动设备200包括壳体40及上述任一实施方式的输入输出组件100，输入输出组件100安装在壳体40上。
具体地，移动设备200包括手机、平板电脑、笔记本电脑、智能手环、智能头盔中的任意一种。
壳体40可以给输入输出组件100提供防尘、防水、防摔等保护，壳体40上开设有与输入输出模组20对应的孔，输入输出模组20(例如，光发射器221)发出的光线能够从孔穿出壳体40；壳体40外部的光线能够从孔中穿入壳体40并传输至输入输出模组20(例如，光接收器222、成像模组21)。在其他实施方式中，请参阅图9，输入输出组件100收容在壳体40内并能够从壳体40内伸出，此时，壳体40上不需要开设与输入输出组件100的进出光方向对应的孔，例如，壳体40包括主体41及可动部42，输入输出组件100安装在可动部42上，可动部42在驱动装置的驱动下可以相对于主体41运动，可动部42可以相对于主体41滑动，以滑入主体41(如图8所示)内部或从主体41中滑出(如图9所示)。当需要使用输入输出组件100时，可动部42带动输入输出组件100从壳体40内伸出到壳 体40外；当不需要使用输入输出组件100时，可动部42带动输入输出组件100从壳体40外收容至壳体40内。在又一实施方式中，请参阅图8，移动设备200还包括显示屏50，输入输出组件100收容在壳体40内并位于显示屏50的下方，此时，壳体40上也不需要开设与输入输出组件100的进出光方向对应的孔。
本申请实施方式的移动设备200中的支架10为一体结构，当成像模组21及飞行时间模组22安装在收容腔113内时，成像模组21及飞行时间模组22的相对位置不易发生变化，从而使多个输入输出模组20能够更好地配合工作。具体地，多个收容腔113的位置不会发生变化，只要将输入输出模组20固定在收容腔113内，输入输出模组20之间的相对位置也不会发生变化。
在本说明书的描述中，参考术语“某些实施方式”、“一个实施方式”、“一些实施方式”、“示意性实施方式”、“示例”、“具体示例”、或“一些示例”的描述意指结合所述实施方式或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施方式或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施方式或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施方式或示例中以合适的方式结合。
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个所述特征。在本申请的描述中，“多个”的含义是至少两个，例如两个，三个，除非另有明确具体的限定。
尽管上面已经示出和描述了本申请的实施例，可以理解的是，上述实施例是示例性的，不能理解为对本申请的限制，本领域的普通技术人员在本申请的范围内可以对上述实施例进行变化、修改、替换和变型，本申请的范围由权利要求及其等同物限定。

Claims (28)

  1. 一种输入输出组件，其特征在于，所述输入输出组件包括：
    支架，所述支架为一体结构，所述支架包括相背的第一面和第二面，所述第二面开设有多个收容腔，所述第一面开设有与多个所述收容腔对应的多个通孔；及
    输入输出模组，所述输入输出模组包括成像模组及飞行时间模组，所述成像模组及所述飞行时间模组分别固定安装在多个所述收容腔内并均通过对应的所述通孔从所述第一面暴露。
  2. 根据权利要求1所述的输入输出组件，其特征在于，多个所述收容腔包括第一收容腔与第二收容腔，多个所述通孔包括与所述第一收容腔对应的第一通孔及与所述第二收容腔对应的第二通孔，所述飞行时间模组固定安装在所述第一收容腔内并通过所述第一通孔从所述第一面暴露，所述成像模组安装在所述第二收容腔内并通过所述第二通孔从所述第一面暴露。
  3. 根据权利要求1所述的输入输出组件，其特征在于，所述成像模组包括可见光摄像头、红外摄像头、黑白摄像头、长焦摄像头、及广角摄像头中的任意一种。
  4. 根据权利要求3所述的输入输出组件，其特征在于，所述飞行时间模组包括光发射器及光接收器，所述光发射器的中心、所述光接收器的中心、与所述成像模组的中心位于同一直线上；或
    所述成像模组位于所述光发射器与所述光接收器的中心连线的中线上。
  5. 根据权利要求1所述的输入输出组件，其特征在于，所述成像模组包括主摄像头和副摄像头，多个所述收容腔包括第一收容腔、第二收容腔、及第三收容腔，多个所述通孔包括与所述第一收容腔对应的第一通孔、与所述第二收容腔对应的第二通孔、及与所述第三收容腔对应的第三通孔，所述飞行时间模组固定安装在所述第一收容腔内并通过所述第一通孔从所述第一面暴露，所述主摄像头安装在所述第二收容腔内并通过所述第二通孔从所述第一面暴露，所述副摄像头安装在所述第三收容腔内并通过所述第三通孔从所述第一面暴露。
  6. 根据权利要求5所述的输入输出组件，其特征在于，所述飞行时间模组包括光发射器及光接收器，所述光发射器的中心、所述光接收器的中心与所述主摄像头及所述副摄像头中的至少一个位于同一直线上；或者
    所述飞行时间模组位于所述主摄像头及所述副摄像头的中心连线的中线上。
  7. 根据权利要求5所述的输入输出组件，其特征在于，所述主摄像头为广角摄像头，所述副摄像头为长焦摄像头；或者
    所述主摄像头为彩色摄像头，所述副摄像头为黑白摄像头；或者
    所述主摄像头为彩色摄像头，所述副摄像头为彩色摄像头；或者
    所述主摄像头为彩色摄像头，所述副摄像头为红外摄像头；或者
    所述主摄像头为红外摄像头，所述副摄像头为黑白摄像头。
  8. 根据权利要求1所述的输入输出组件，其特征在于，所述支架包括连接所述第一面及所述第二面的侧壁，所述侧壁围成多个所述收容腔，所述第二面开设有贯穿所述侧壁并与多个所述收容腔对应连通的多个限位槽；所述飞行时间模组包括第一基板组件，所述成像模组包括成像电路板，所述第一基板组件和所述成像电路板均穿设在所述限位槽内。
  9. 根据权利要求8所述的输入输出组件，其特征在于，多个所述收容腔包括用于安装所述成像模组的成像收容腔，多个所述限位槽包括连通所述成像收容腔的成像限位槽，所述第二面还开设有贯穿所述侧壁并与所述成像收容腔连通的安装槽，所述安装槽和所述成像限位槽位于所述成像收容腔的相背两侧；所述支架还包括自所述侧壁朝远离所述成像收容腔一侧延伸的遮挡部，所述遮挡部位于与所述安装槽对应的所述侧壁上；所述成像电路板穿设在所述安装槽内，所述输入输出模组还包括电子元件组，所述电子元件组设置在所述成像电路板上并与所述遮挡部对应。
  10. 根据权利要求1所述的输入输出组件，其特征在于，所述通孔的开口尺寸小于对应的所述收容腔的开口尺寸以形成限位环，所述收容腔由所述限位环及环绕所述限位环延伸的内壁形成。
  11. 根据权利要求1所述的输入输出组件，其特征在于，所述支架包括侧壁及凸缘，所述侧壁连接所述第一面及所述第二面并围成多个所述收容腔，所述凸缘自所述侧壁朝远离所述收容腔一侧延伸形成，所述凸缘位于所述侧壁的靠近所述第一面的一端并环绕所述收容腔设置。
  12. 根据权利要求1所述的输入输出组件，其特征在于，所述飞行时间模组包括：
    第一基板组件，所述第一基板组件包括互相连接的第一基板及柔性电路板；
    垫块，所述垫块设置在所述第一基板上；
    光发射器，所述光发射器设置在所述垫块上，所述柔性电路板弯折且所述柔性电路板的一端连接所述第一基板，另一端连接所述光发射器；及
    光接收器，所述光接收器设置在所述第一基板上，所述光接收器包括外壳及设置在所述外壳上的光学元件，所述外壳与所述垫块连接成一体。
  13. 根据权利要求12所述的输入输出组件，其特征在于，多个所述收容腔包括第一收容腔，多个所述通孔包括与所述第一收容腔对应的第一通孔，所述飞行时间模组固定安装在所述第一收容腔内并通过所述第一通孔从所述第一面暴露。
  14. 根据权利要求13所述的输入输出组件，其特征在于，所述第一收容腔包括相连通 的第一子收容腔和第二子收容腔，所述第一通孔包括相连通的第一子通孔和第二子通孔，所述第一子通孔与所述第一子收容腔对应，所述第二子通孔与所述第二子收容腔对应，所述光接收器安装在所述第一子收容腔内并从所述第一子通孔暴露，所述光发射器安装在所述第二子收容腔内并从所述第二子通孔暴露。
  15. 一种移动设备，其特征在于，所述移动设备包括：
    壳体；和
    输入输出组件，所述输入输出组件安装在所述壳体上；所述输入输出组件包括支架及输入输出模组，所述支架为一体结构，所述支架包括相背的第一面和第二面，所述第二面开设有多个收容腔，所述第一面开设有与多个所述收容腔对应的多个通孔；所述输入输出模组包括成像模组及飞行时间模组，所述成像模组及所述飞行时间模组分别固定安装在多个所述收容腔内并均通过对应的所述通孔从所述第一面暴露。
  16. 根据权利要求15所述的移动设备，其特征在于，多个所述收容腔包括第一收容腔与第二收容腔，多个所述通孔包括与所述第一收容腔对应的第一通孔及与所述第二收容腔对应的第二通孔，所述飞行时间模组固定安装在所述第一收容腔内并通过所述第一通孔从所述第一面暴露，所述成像模组安装在所述第二收容腔内并通过所述第二通孔从所述第一面暴露。
  17. 根据权利要求15所述的移动设备，其特征在于，所述成像模组包括可见光摄像头、红外摄像头、黑白摄像头、长焦摄像头、及广角摄像头中的任意一种。
  18. 根据权利要求17所述的移动设备，其特征在于，所述飞行时间模组包括光发射器及光接收器，所述光发射器的中心、所述光接收器的中心、与所述成像模组的中心位于同一直线上；或
    所述成像模组位于所述光发射器与所述光接收器的中心连线的中线上。
  19. 根据权利要求15所述的移动设备，其特征在于，所述成像模组包括主摄像头和副摄像头，多个所述收容腔包括第一收容腔、第二收容腔、及第三收容腔，多个所述通孔包括与所述第一收容腔对应的第一通孔、与所述第二收容腔对应的第二通孔、及与所述第三收容腔对应的第三通孔，所述飞行时间模组固定安装在所述第一收容腔内并通过所述第一通孔从所述第一面暴露，所述主摄像头安装在所述第二收容腔内并通过所述第二通孔从所述第一面暴露，所述副摄像头安装在所述第三收容腔内并通过所述第三通孔从所述第一面暴露。
  20. 根据权利要求19所述的移动设备，其特征在于，所述飞行时间模组包括光发射器及光接收器，所述光发射器的中心、所述光接收器的中心与所述主摄像头及所述副摄像头中的至少一个位于同一直线上；或者
    所述飞行时间模组位于所述主摄像头及所述副摄像头的中心连线的中线上。
  21. 根据权利要求19所述的移动设备，其特征在于，所述主摄像头为广角摄像头，所述副摄像头为长焦摄像头；或者
    所述主摄像头为彩色摄像头，所述副摄像头为黑白摄像头；或者
    所述主摄像头为彩色摄像头，所述副摄像头为彩色摄像头；或者
    所述主摄像头为彩色摄像头，所述副摄像头为红外摄像头；或者
    所述主摄像头为红外摄像头，所述副摄像头为黑白摄像头。
  22. 根据权利要求15所述的移动设备，其特征在于，所述支架包括连接所述第一面及所述第二面的侧壁，所述侧壁围成多个所述收容腔，所述第二面开设有贯穿所述侧壁并与多个所述收容腔对应连通的多个限位槽；所述飞行时间模组包括第一基板组件，所述成像模组包括成像电路板，所述第一基板组件和所述成像电路板均穿设在所述限位槽内。
  23. 根据权利要求22所述的移动设备，其特征在于，多个所述收容腔包括用于安装所述成像模组的成像收容腔，多个所述限位槽包括连通所述成像收容腔的成像限位槽，所述第二面还开设有贯穿所述侧壁并与所述成像收容腔连通的安装槽，所述安装槽和所述成像限位槽位于所述成像收容腔的相背两侧；所述支架还包括自所述侧壁朝远离所述成像收容腔一侧延伸的遮挡部，所述遮挡部位于与所述安装槽对应的所述侧壁上；所述成像电路板穿设在所述安装槽内，所述输入输出模组还包括电子元件组，所述电子元件组设置在所述成像电路板上并与所述遮挡部对应。
  24. 根据权利要求15所述的移动设备，其特征在于，所述通孔的开口尺寸小于对应的所述收容腔的开口尺寸以形成限位环，所述收容腔由所述限位环及环绕所述限位环延伸的内壁形成。
  25. 根据权利要求15所述的移动设备，其特征在于，所述支架包括侧壁及凸缘，所述侧壁连接所述第一面及所述第二面并围成多个所述收容腔，所述凸缘自所述侧壁朝远离所述收容腔一侧延伸形成，所述凸缘位于所述侧壁的靠近所述第一面的一端并环绕所述收容腔设置。
  26. 根据权利要求15所述的移动设备，其特征在于，所述飞行时间模组包括：
    第一基板组件，所述第一基板组件包括互相连接的第一基板及柔性电路板；
    垫块，所述垫块设置在所述第一基板上；
    光发射器，所述光发射器设置在所述垫块上，所述柔性电路板弯折且所述柔性电路板的一端连接所述第一基板，另一端连接所述光发射器；及
    光接收器，所述光接收器设置在所述第一基板上，所述光接收器包括外壳及设置在所述外壳上的光学元件，所述外壳与所述垫块连接成一体。
  27. 根据权利要求26所述的移动设备，其特征在于，多个所述收容腔包括第一收容腔，多个所述通孔包括与所述第一收容腔对应的第一通孔，所述飞行时间模组固定安装在所述第一收容腔内并通过所述第一通孔从所述第一面暴露。
  28. 根据权利要求27所述的移动设备，其特征在于，所述第一收容腔包括相连通的第一子收容腔和第二子收容腔，所述第一通孔包括相连通的第一子通孔和第二子通孔，所述第一子通孔与所述第一子收容腔对应，所述第二子通孔与所述第二子收容腔对应，所述光接收器安装在所述第一子收容腔内并从所述第一子通孔暴露，所述光发射器安装在所述第二子收容腔内并从所述第二子通孔暴露。
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CN108390969A (zh) * 2018-04-10 2018-08-10 Oppo广东移动通信有限公司 支架、输入输出组件和终端
CN108401045A (zh) * 2018-04-10 2018-08-14 Oppo广东移动通信有限公司 支架、输入输出组件和电子装置
CN108989507A (zh) * 2018-08-22 2018-12-11 Oppo广东移动通信有限公司 输入输出组件和移动设备

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