WO2019228055A1 - 支架结构、输入输出组件和电子装置 - Google Patents

支架结构、输入输出组件和电子装置 Download PDF

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Publication number
WO2019228055A1
WO2019228055A1 PCT/CN2019/080726 CN2019080726W WO2019228055A1 WO 2019228055 A1 WO2019228055 A1 WO 2019228055A1 CN 2019080726 W CN2019080726 W CN 2019080726W WO 2019228055 A1 WO2019228055 A1 WO 2019228055A1
Authority
WO
WIPO (PCT)
Prior art keywords
input
bracket
cavity
output module
camera
Prior art date
Application number
PCT/CN2019/080726
Other languages
English (en)
French (fr)
Inventor
曾赞坚
Original Assignee
Oppo广东移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201810559997.2A external-priority patent/CN108712533B/zh
Priority claimed from CN201810559996.8A external-priority patent/CN108848210B/zh
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Publication of WO2019228055A1 publication Critical patent/WO2019228055A1/zh

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/0249—Details of the mechanical connection between the housing parts or relating to the method of assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M2250/00—Details of telephonic subscriber devices
    • H04M2250/12—Details of telephonic subscriber devices including a sensor for measuring a physical value, e.g. temperature or motion

Definitions

  • the present application relates to the field of consumer electronics technology, and more particularly, to a bracket structure, an input-output component, and an electronic device.
  • the mobile phone can be configured with multiple function modules, and multiple function modules often need to cooperate with each other to work properly. However, when the mobile phone is impacted during use, the relative positions of the multiple function modules are easily changed and do not work well. to cooperate in work.
  • Embodiments of the present application provide a bracket structure, an input-output component, and an electronic device.
  • the bracket structure of the present application includes a first bracket, and the first bracket is used to install a first input / output module, and the number of the first input / output module includes at least two.
  • the input-output component of the present application includes a first input-output module and a bracket structure.
  • the number of the first input-output modules includes at least two.
  • the bracket structure includes a first bracket.
  • the first input-output module is installed. On the support structure.
  • the electronic device of the present application includes a casing and the input-output component described in the foregoing embodiment.
  • the input-output component can be movably installed in the casing to selectively expose the first input-output module or hide the first input-output module.
  • 1 to 5 are schematic perspective views of a bracket structure according to some embodiments of the present application.
  • FIG. 6 is a schematic perspective view of a second bracket of a bracket structure according to some embodiments of the present application.
  • FIG. 7 to 10 are schematic perspective views of a bracket structure according to some embodiments of the present application.
  • FIG. 11 is a schematic perspective view of a supporting member in a support structure of some embodiments of the present application.
  • the first feature "on” or “down” of the second feature may be the first and second features in direct contact, or the first and second features indirectly through an intermediate medium. contact.
  • the first feature is “above”, “above”, and “above” the second feature.
  • the first feature is directly above or obliquely above the second feature, or it only indicates that the first feature is higher in level than the second feature.
  • the first feature is “below”, “below”, and “below” of the second feature.
  • the first feature may be directly below or obliquely below the second feature, or it may simply indicate that the first feature is less horizontal than the second feature.
  • the bracket structure 100 includes a first bracket 10.
  • the first bracket 10 is used to install a first input-output module 20 (as shown in FIGS. 13 and 15).
  • the number of the output modules 20 includes at least two.
  • the bracket structure 100 includes a first bracket 10 and a second bracket 80.
  • the first bracket 10 is used to install a first input-output module 20 (see FIGS. 13 and 15).
  • the first input-output module 20 includes at least an infrared light source 27, an infrared camera 25, and a first visible light camera 26.
  • the second bracket 80 is combined with the first bracket 10.
  • the second bracket 80 is used to install a second input-output module 70 (see FIG. 17).
  • the second input-output module 70 includes at least a second visible light camera 71.
  • the first bracket 10 and the second bracket 80 may be separate structures. Among them, the first bracket 10 and the second bracket 80 may be integrated structures, and the first bracket 10 and the second bracket 80 may be welded, bonded, and threaded. Any one or more of the methods of connection and engagement are combined together; or, the first bracket 10 and the second bracket 80 are an integrally formed structure.
  • the first bracket 10 can be provided with a receiving cavity 105 (see FIG. 1), and the first input / output module 20 can be installed on the first bracket 10.
  • the second bracket 80 can be provided with a receiving cavity 83 and the second input / output.
  • the module 70 is mounted on the second bracket 80.
  • the infrared light source 27 can form a structured light depth camera with the infrared camera 25; or, the infrared light source 27 can form a time-of-flight (TOF) depth camera with the infrared camera 25.
  • the light entering direction of the first visible light camera 26 may be opposite to the light entering direction of the second visible light camera 71.
  • bracket structure 100 when the first input / output module 20 is mounted on the first bracket 10, the relative positions of the infrared light source 27, the infrared camera 25, and the first visible light camera 26 mounted on the first bracket 10 The position is not easy to change, so that the infrared light source 27, the infrared camera 25, and the first visible light camera 26 can work better together; further, the second bracket 80 is combined with the first bracket 10 to form a bracket structure 100, which is mounted on the second The second I / O module 70 on the bracket 80 and the first I / O module 20 installed on the first bracket 10 can be fixed together, thereby facilitating different manufacturers to assemble the first I / O module 20 to the first The bracket 10 and the second input-output module 70 are assembled on the second bracket 80.
  • the bracket structure 100 includes a first bracket 10 and a second bracket 70.
  • the first bracket 10 includes a first surface 101, a second surface 102, and a third surface 103.
  • the first surface 101 and the second surface 102 are located on opposite sides of the first bracket 10, and the third surface 103 connects the first surface 101 and ⁇ ⁇ 102 ⁇ The second side 102.
  • the second surface 102 is provided with at least two receiving cavities 105, and the first surface 101 is provided with at least two through holes 106 corresponding to the at least two receiving cavities 105.
  • the third surface 103 is provided with a mounting hole 107 penetrating the first surface 101 and the second surface 102.
  • the mounting hole 107 is located between the two receiving chambers 105.
  • the at least two receiving chambers 105 are used for installing the first input-output module 20 (see FIG. 15) and exposing the first input-output module 20 from the first surface 101.
  • the second bracket 70 is installed in the mounting hole 107 and is combined with the first bracket 10.
  • the second bracket 70 is provided with a receiving cavity 83.
  • the receiving cavity 83 is used for installing the second input-output module 70.
  • the number of the receiving cavities 105 on the first bracket 10 may be two, three, four, five, six, seven, or any plurality.
  • the number of the through holes 106 is the same as the number of the receiving chambers 105, and each of the through holes 106 is correspondingly communicated with one receiving chamber 105.
  • Each receiving cavity 105 is used to install a first input / output module 20.
  • the first input / output module 20 installed in the receiving cavity 105 can be exposed from the first surface 101 through the through hole 106. In the embodiment of the present application, the exposure means that the first input / output module 20 can be seen from the first surface 101.
  • the first input / output module 20 can pass through the through hole 106 of the first surface 101 from the first The surface 101 is exposed outside the first bracket 10; or the first input / output module 20 may not pass through the through hole 106, but the first input / output module 20 can be seen through the through hole 106.
  • the number of the accommodating cavities 83 may be one, two, three, four, or any plurality.
  • the number of the second input-output modules 70 installed in the accommodating cavity 83 may be one, two, three, four, or any plurality.
  • the number of the input-output modules 70 may be greater than, less than or equal to the number of the accommodation chambers 83.
  • the mounting hole 107 is located at a middle position in the length direction of the first bracket 10 and is located between the two receiving chambers 105.
  • the mounting structure 107 is provided between the two receiving cavities 105 to prevent the second input / output module 70 installed at the mounting hole 107 from being blocked by the first bracket 10. It is convenient to arrange the second input-output module 70 on the bracket structure 100 to make the structure of the bracket structure 100 more compact.
  • the bracket structure 100 includes a first bracket 10.
  • the first bracket 10 includes a first surface 101, a second surface 102, and a third surface 103.
  • the first surface 101 and the second surface 102 are located on opposite sides of the first bracket 10, and the third surface 103 connects the first surface 101 and ⁇ ⁇ 102 ⁇ The second side 102.
  • the second surface 102 is provided with at least two receiving cavities 105, and the first surface 101 is provided with at least two through holes 106 corresponding to the at least two receiving cavities 105.
  • the third surface 103 is provided with a mounting hole 107 penetrating the first surface 101 and the second surface 102.
  • the mounting hole 107 is located between the two receiving chambers 105. At least two receiving chambers 105 are used to install the first input-output module 20 (see FIG. 13) and expose the first input-output module 20 from the first surface 101, and the mounting hole 107 is used to expose the first input-output module 20.
  • the first bracket 10 is a one-piece structure.
  • the number of the receiving cavities 105 on the first bracket 10 may be two, three, four, five, six, seven, or any plurality.
  • the number of the through holes 106 is the same as the number of the receiving chambers 105, and each of the through holes 106 is correspondingly communicated with one receiving chamber 105.
  • Each receiving cavity 105 is used to install a first input / output module 20.
  • the first input / output module 20 installed in the receiving cavity 105 can be exposed from the first surface 101 through the through hole 106. In the embodiment of the present application, the exposure means that the first input / output module 20 can be seen from the first surface 101.
  • the first input / output module 20 can pass through the through hole 106 of the first surface 101 from the first The surface 101 is exposed outside the first bracket 10; or the first input / output module 20 may not pass through the through hole 106, but the first input / output module 20 can be seen through the through hole 106.
  • the mounting hole 107 is located at a middle position in the length direction of the first bracket 10 and is located between the two receiving chambers 105.
  • the mounting hole 107 can be used to mount the first input-output module 20 and allow the first input-output module 20 to be exposed from the first surface 101.
  • the first input-output module 20 and the mounting hole 107 have no direct mounting relationship.
  • the mounting hole 107 is formed in a bracket 10 only to prevent the first bracket 10 from blocking the first input-output module 20 disposed at the mounting hole 107.
  • bracket structure 100 since the positions of at least two receiving chambers 105 on the first bracket 10 will not change, when a plurality of first input-output modules 20 are installed in the receiving chamber 105, a plurality of The relative position of the first I / O module 20 is not easy to change, so that multiple first I / O modules 20 can work better together. Further, the bracket structure 100 is provided with a mounting hole between the two receiving chambers 105. 107, thereby preventing the first input / output module 20 installed at the mounting hole 107 from being blocked by the first bracket 10, which facilitates the arrangement of the first input / output module 20 on the bracket structure 100 to make the structure of the bracket structure 100 more compact.
  • the bracket structure 100 includes a first bracket 10, a front case 30, and a rear case 40.
  • the first bracket 10 includes a first surface 101, a second surface 102, a third surface 103, and a fourth surface 104.
  • the first surface 101 and the second surface 102 are located on opposite sides of the first bracket 10, and the third surface 103 and The fourth surface 104 is located on opposite sides of the first bracket 10 and is connected to the third surface 103 and the fourth surface 104.
  • the second surface 102 is provided with four receiving chambers 105.
  • the four receiving chambers 105 are a first chamber 1051, a second chamber 1502, a third chamber 1053, and a fourth chamber 1054.
  • the first chamber 1051, the second chamber 1502, the first chamber The three cavities 1053 and the fourth cavity 1054 are sequentially arranged along the length direction of the first bracket 10, and the fourth cavity 1054 is located at one end of the first bracket 10.
  • the centers of the first cavity 1051, the third cavity 1053, and the fourth cavity 1054 are on the same straight line.
  • the first surface 101 is provided with four through holes 106 corresponding to the four receiving cavities 105, and each through hole 106 is correspondingly communicated with one receiving cavity 105.
  • the opening size of the through hole 106 is smaller than the size of the corresponding receiving cavity 105 to form a limiting ring 108.
  • the receiving cavity 105 is formed by the limiting ring 108 and an inner wall extending around the limiting ring 108.
  • the third surface 103 is provided with a mounting hole 107 penetrating the first surface 101 and the second surface 102.
  • the mounting hole 107 is located between the first cavity 1051 and the third cavity 1053.
  • the mounting hole 107 includes a first sub-mounting hole 1071 near the side of the first cavity 1051 and a second sub-mounting hole 1072 near the third cavity 1053.
  • the third cavity 1053 is located in the second sub-mounting hole 1072 and the fourth surface 104. between.
  • the first sub-mounting hole 1071 communicates with the second sub-mounting hole 1072 and the size of the first sub-mounting hole 1071 is larger than the size of the second sub-mounting hole 1072. In other embodiments, the size of the first sub-mounting hole 1071 may be smaller than or equal to the size of the second sub-mounting hole 1072.
  • the first bracket 10 includes a mounting portion 11, a fixing portion 12, an extension portion 14, a positioning post 111, an engaging post 141, and a clamping post 142.
  • the mounting portion 11 is located between the mounting hole 107 (the first sub-mounting portion 1071) and the fourth surface 104, and the mounting portion 11 is located between the first cavity 1051 and the second cavity 1052.
  • a groove may be formed on the side where the first surface 101 of the mounting portion 11 is located, so that the first input-output module 20 is positioned and mounted on the mounting portion 11.
  • the fourth surface 104 at the mounting portion 11 defines a receiving groove 112 penetrating the first surface 101 and the second surface 102.
  • the positioning posts 111 are protruded and formed on the side of the first surface 101 of the mounting portion 11.
  • the number of the positioning posts 111 may be one, two, three, or any plurality.
  • a boss is formed on the side of the first surface 101 of the mounting portion 11; or, the first surface 101 at the mounting portion 11 is flush with the first surface 101 corresponding to the outer wall of the first cavity 1051.
  • the fixing portion 12 is located between the mounting hole 107 (the second sub-mounting portion 1072) and the fourth surface 104, and the fixing portion 12 is located between the mounting portion 11 and the third cavity 1053.
  • the fixing portion 12 is connected to a side wall of the mounting portion 11 away from the first cavity 1051.
  • the second cavity 1052 is provided at the fixing portion 12. Specifically, the second cavity 1052 is provided at the side of the fixing portion 12 on the second surface 102.
  • the extending portion 14 is located on a side of the first cavity 1051 away from the third cavity 1053. Specifically, the extending portion 14 is located at an end of the first bracket 10 opposite to the fourth cavity 1054. A groove may be formed on the side where the first surface 101 of the mounting portion 11 is located, so that the first input-output module 20 is positioned and mounted on the extension portion 14.
  • the engaging pillars 141 are protruded and formed on the side of the first surface 101 of the extension portion 14.
  • the number of the engaging pillars 141 can be one, two, three, or any number.
  • the clamping posts 142 are protruded and formed on the side of the fourth surface 104 of the extending portion 14.
  • the number of the clamping posts 142 can be one, two, three, or any number.
  • a boss is formed on the side of the first surface 101 of the extension portion 14; or, the first surface 101 at the extension portion 14 is flush with the first surface 101 corresponding to the outer wall of the first cavity 1051.
  • the front case 30 is formed with a front case cavity 31 and a front case light-passing hole 32 penetrating the front case 30 and communicating with the front case cavity 31.
  • the rear case 40 is formed with a rear case cavity 41 and a rear case light-passing hole 42 penetrating the rear case 40 and communicating with the rear case cavity 41.
  • the front case 30 is fixed on the rear case 40 and the front case cavity 31 and the rear case cavity 41 together form a receiving cavity (not shown).
  • the first bracket 10 and the first input-output module 20 are housed in a receiving cavity.
  • a light guide hole 44 communicating with the accommodating cavity is also formed on a side of the rear case 40 corresponding to the fourth surface 104.
  • a side of the front case 30 opposite to the front case cavity 31 is provided with a transparent front case protection cover 33, and the front case protection cover 33 may be a glass cover.
  • a light-transmissive rear case protection cover 43 is provided on a side of the rear case 40 opposite to the rear case cavity 41, and the rear case protection cover 43 may be a glass cover.
  • the front case protection cover 33 and the rear case protection cover 43 can also be used to seal the receiving cavity.
  • bracket structure 100 since the positions of at least two receiving chambers 105 on the first bracket 10 will not change, when a plurality of first input-output modules 20 are installed in the receiving chamber 105, a plurality of The relative position of the first I / O module 20 is not easy to change, so that multiple first I / O modules 20 can work better together. Further, the bracket structure 100 is provided with a mounting hole between the two receiving chambers 105. 107, thereby preventing the first input / output module 20 installed at the mounting hole 107 from being blocked by the first bracket 10, which facilitates the arrangement of the first input / output module 20 on the bracket structure 100 to make the structure of the bracket structure 100 more compact.
  • the bracket structure 100 also has the following beneficial effects: first, a limiting ring 108 is formed on the first bracket 10 so as to facilitate the first input / output module 20 to be mounted to the first under the limitation of the limiting ring 108; On the bracket 10; second, a positioning column 111 and a receiving groove 112 are provided on the mounting portion 11, so that the first input-output module 20 (proximity sensor circuit board 212) is mounted on the mounting portion 11; third, the first bracket 10A mounting portion 11 and a fixing portion 12 for mounting the first input-output module 20 are provided between the fourth surface 104 and the mounting hole 107, so that the structure of the bracket structure 100 is more compact; the extension portion 14 is provided with an engagement The post 141 and the clamping post 142 facilitate the installation of the first input-output module 20 on the extension 14; the centers of the first cavity 1051, the third cavity 1053, and the fourth cavity 1054 are on the same straight line, thereby facilitating installation on the first The first input / output module 20
  • the bracket structure 100 further includes a second bracket 80.
  • the second bracket 80 includes a bracket sidewall 81 and a partition 82.
  • the bracket side wall 81 is combined with the first bracket 10.
  • the bracket side wall 81 may be combined with the side wall of the mounting hole 107 by at least one of bonding, engaging, welding, and screwing.
  • a receiving cavity 83 is surrounded by the side wall 81 of the stent, and a partition 82 is disposed in the receiving cavity 83 and divides the receiving cavity 83 into a first sub-receiving cavity 831 and a second sub-receiving cavity 832.
  • the central connection line between the first sub-receiving cavity 831 and the second sub-receiving cavity 832 is parallel to the central connection line between the first cavity 1051 and the third cavity 1053.
  • the size of the first sub-receiving cavity 831 is larger than the size of the second sub-receiving cavity 832.
  • the first sub-receiving cavity 831 corresponds to the first sub-mounting hole 1071, and the second sub-receiving cavity 832 and the second sub-mounting hole 1072. correspond.
  • the thickness of each position of the bracket side wall 81 may be the same or different.
  • the partition portion 82 is provided with an accommodation hole 821, and the accommodation hole 821 penetrates the surfaces of the partition portion 82 corresponding to the first surface 101 and the second surface 102.
  • the second bracket 80 may not be provided with the partitioning portion 82.
  • the first sub-receiving cavity 831 is in communication with the second sub-receiving cavity 832; or, the receiving hole 821 may be the one of the partitioning portion 82.
  • the first bracket 10, the second bracket 80, the first input-output module 20 and the second input-output module 70 are all housed in the front casing cavity 31 and the rear casing cavity 41. Containing cavity.
  • the first bracket 10 and the second bracket 80 may be mounted on the front case 30 and the rear case 40 so that the first bracket 10 and the second bracket 80 are combined together.
  • the bracket structure 100 of this embodiment since the positions of at least two receiving chambers 105 on the first bracket 10 do not change, when a plurality of first input-output modules 20 are installed in the receiving chamber 105, a plurality of first The relative position of an I / O module 20 is not easy to change, so that multiple first I / O modules 20 can work better together.
  • the first bracket 10 is provided with a mounting hole between the two receiving chambers 105. 107, thereby preventing the second input / output module 70 installed at the mounting hole 107 from being blocked by the first bracket 10, which facilitates the arrangement of the second bracket 80 and the second input / output module 70 on the bracket structure 100 so that the bracket The structure of the structure 100 is more compact.
  • the size of the first sub-mounting hole 1071 is different from the size of the second sub-mounting hole 1072, so that the second bracket 80 can be installed in the mounting hole 107; the first sub-receiving cavity 831 and the second sub-receiving cavity
  • the center line of 832 is parallel to the center line of the first cavity 1051 and the third cavity 1053, so that the external light of the bracket structure 100 is more beautiful.
  • the second cavity 1052 penetrates the third surface 103 and the fourth surface 104 at the fixing portion 12.
  • the bracket structure 100 further includes a supporting member 13 for fixing the supporting member 13.
  • the first input-output module 20 is mounted on the supporting member 13.
  • the supporting member 13 includes a supporting bottom plate 131 and a supporting side wall 132 extending from an edge of the supporting bottom plate 131.
  • the supporting bottom plate 131 and the supporting side wall 132 together form a supporting cavity 130.
  • a through hole 1311 is opened in the middle position of the supporting base plate 131.
  • the supporting side wall 132 includes a first supporting side wall 133, a second supporting side wall 134, and a third supporting side wall 135.
  • the first supporting side wall 133 is located on the supporting base plate 131 side near the third cavity 1053.
  • the second supporting side wall 134 is located on the supporting base plate 131 side near the mounting hole 107 (or the third surface 103), and the third supporting side wall 135 is located on the supporting base plate 131 side near the mounting portion 11.
  • the second supporting side wall 134 can block the opening of the second cavity 1052 on the side of the third surface 103.
  • the first supporting side wall 133 includes a first side wall body 1331 and a first joint portion 1332.
  • the first joint portion 1332 faces away from the third supporting side from an end of the first side wall body 1331 away from the second supporting side wall 134.
  • One side of the side wall 135 is formed.
  • the third supporting side wall 135 includes a third side wall body 1351 and a third joint portion 1352.
  • the third joint portion 1352 faces away from the first supporting side from an end of the third side wall body 1351 that is far from the second supporting side wall 134.
  • One side of the side wall 133 is extended.
  • the first coupling portion 1332 is combined with the fourth surface 104 at the third cavity 1053, and the third coupling portion 1352 is combined with the fourth surface 104 at the mounting portion 11, so that The holder 13 can be fixed to the fixing portion 12.
  • the supporting member 13 in this embodiment may be made of a material with high strength.
  • the material of the supporting member 13 is steel, aluminum alloy, or titanium alloy.
  • the thickness of the supporting sidewall 132 of the supporting member 13 It can be made thinner than the corresponding side wall of the receiving cavity 105, thereby reducing the volume of the bracket structure 100 and increasing the size of the mounting hole 107.
  • the second cavity 1052 may not penetrate the fourth surface 104.
  • the first supporting side wall 133 further includes a first connecting portion (not shown) extending from an end of the first side wall body 1331 away from the supporting base plate 131 toward a side away from the third supporting side wall 135.
  • the third supporting sidewall 135 further includes a third connecting portion (not shown) extending from an end of the third sidewall body 1351 away from the supporting bottom plate 131 toward a side away from the first sidewall 131.
  • the input / output module 200 disclosed in the present application includes a plurality of first input / output modules 20, the bracket structure 100 and the main board 50 of the above embodiment.
  • the first input / output module 20 is mounted on the bracket structure 100. on. More specifically, the first input-output module 20 is mounted on the first bracket 10.
  • the input-output module 200 further includes a second input-output module 70 and the bracket structure 100 further includes a second bracket 80, the second input-output module 70 is mounted on the second bracket 80.
  • the first input-output module 20 includes a proximity sensor 21, a receiver 22, a fill light 23, a light sensor 24, an infrared camera 25, a first visible light camera 26, and an infrared light source 2771.
  • the second input-output module 70 includes a second visible light camera 71.
  • the proximity sensor 21 includes a proximity sensing body 211 and a proximity sensing circuit board 212.
  • One end of the proximity sensor circuit board 212 is disposed on the first surface 101 at the mounting portion 11 and is engaged with the positioning post 111.
  • the other end of the proximity sensor circuit board 212 passes through the receiving groove 112 and extends to the first portion of the mounting portion 11.
  • the two sides 102 are on the side.
  • the proximity sensing body 211 is disposed on a side of the proximity sensing circuit board 212 opposite to the first surface 101, or the proximity sensing body 211 is disposed on a side of the proximity sensing circuit board 212 away from the first bracket 10.
  • an adhesive may be provided between the proximity sensing circuit board 212 and the first surface 101, so that the proximity sensing circuit board 212 is more firmly mounted on the mounting portion 11.
  • the receiver 22 includes a receiver body 221 and a receiver circuit board 222.
  • the receiver body 221 is contained in the second cavity 1052.
  • One end of the receiver circuit board 222 is disposed on the side of the receiver 221 away from the first bracket 10, and the other end of the receiver circuit board 222 extends along the side of the mounting hole 107 and passes through the center position of the mounting hole 107 (as shown in FIG. 12 or 14). (Shown); or, the other end of the receiver circuit board 222 extends along one side of the mounting hole 107 and is located on the side of the mounting hole 107 near the third cavity 1053.
  • the supporting member 13 is provided on the fixing portion 12
  • the receiver body 221 is received in the supporting cavity 130.
  • the fill light 23 includes a fill light body 231 and a fill light circuit board 232.
  • One end of the fill light circuit board 232 is disposed on the first surface 101 of the extension portion 14 and engages with the engaging 141, and the other end of the fill light circuit board 232 extends along the side of the extension portion 14 away from the first cavity 1051.
  • the fill-light body 231 is disposed on the side of the fill-light circuit board 232 opposite to the first surface 101, or the fill-light body 231 is disposed on the side of the fill-light circuit board 232 away from the first bracket 10. .
  • the proximity sensing circuit board 212 on the second surface 102 side is connected to the fill light circuit board 232 on the second surface 102 along the side of the first bracket 10 near the fourth surface 104 and through the first cavity 1051. In order to prevent the proximity sensor circuit board 212 from covering the mounting hole 107.
  • an adhesive may be further provided between the fill light circuit board 232 and the first surface 101, so that the fill light circuit board 232 is more firmly mounted on the extension portion 14.
  • the photo sensor 24 includes a photo sensor body 241 and a photo sensor circuit board 242.
  • One end of the light sensor circuit board 242 is disposed on the fourth surface 104 of the extension portion 14 and engages with the clamping post 142.
  • the other end of the light sensor circuit board 242 is located on the side of the extension portion 14 away from the first cavity 1051. Connection to the proximity sensing circuit board 232 (as shown in FIG. 12 or 14); or, the other end of the photo sensor circuit board 242 is connected to the proximity sensing circuit board 232 on the second surface 102 side of the extension 14 .
  • the photo sensor body 241 is disposed on a side of the photo sensor circuit board 242 opposite to the fourth surface 104, or the photo sensor body 241 is disposed on a side of the photo sensor circuit board 242 away from the first bracket 10. .
  • the photo sensor 24 (photo sensor body 241) is aligned with the light guide hole 44 to receive light outside the cavity. It can be transmitted to the light sensor 24 through the light guide hole 44.
  • the infrared camera 25 is installed in the first cavity 1051 and can receive light entering from the first surface 101 side.
  • the infrared light source 27 is installed in the fourth cavity 1054 and can generate infrared light toward the first surface 101 side.
  • the infrared light source 27 can form a structured light depth camera with the infrared camera 25; or the infrared light source 27 can communicate with
  • the infrared camera 25 constitutes a time-of-flight (TOF) depth camera.
  • TOF time-of-flight
  • the first visible light camera 26 is installed in the third cavity 1053 and can receive light entering from the first surface 101 side. At this time, the first visible light camera 26 is a front camera; or, the first visible light The camera 26 can receive light entering from the second surface 102 side. At this time, the first visible light camera 26 is a rear camera.
  • the second visible light camera 71 is disposed at the mounting hole 107 and is exposed from the mounting hole 107. More specifically, the second visible light camera 71 is disposed in the receiving cavity 83 (the first sub-receiving cavity 831) and is exposed from the mounting hole 107.
  • the light entering direction of the first visible light camera 26 is opposite to the light entering direction of the second visible light camera 71.
  • the first visible light camera 26 is a front camera
  • the second visible light camera 71 is a rear camera
  • the first visible light camera 26 is When the camera is a rear camera, the second visible light camera 71 is a front camera.
  • the motherboard 50 is provided with a plurality of connectors 51.
  • the proximity sensor 21, the receiver 22, the fill light 23, the light sensor 24, the infrared camera 25, the first visible light camera 26, the infrared light source 27, and the second visible light camera 71 all pass through the connector 51. It is electrically connected to the motherboard 50.
  • the first bracket 10 and the first input-output module 20 are housed in a receiving cavity formed by the front case 30 and the rear case 40.
  • the number of the front housing through-holes 32 is multiple and is the same as the extension portion 14, the first cavity 1051, the fixing portion 12, and the second cavity 1052 (or the mounting portion 11).
  • the third cavity 1503 and the fourth cavity 1054 correspond to the front shell through holes 32, so that the light outside the input-output module 200 can enter the infrared camera 25, the proximity sensor 21 and the first visible light camera 26, and the fill light 23 and The light emitted by the infrared light source 27 can be projected outside the input-output component 200, and the sound emitted by the receiver 22 can be transmitted outside the input-output component 200.
  • the second visible light camera 71 is a rear camera
  • the rear shell light-through hole 42 corresponds to the second visible light camera 71 so that light outside the input-output component 200 can enter the second visible light camera 71.
  • the first input-output module 20 When the first input-output module 20 is mounted on the receiving cavity 105, the first input-output module 20 may be installed in the receiving cavity 105 along the direction of the second surface 102 pointing to the first surface 101 until the first input-output The module 20 is in contact with the stop ring 108, indicating that the first input / output module 20 is installed in place. At this time, the adhesive can be dispensed into the receiving cavity 105. Specifically, the first input / output module 20 and the inner wall of the receiving cavity 105 can be dispensed. Dispense the glue between the gaps, and after the glue is cured, the first input-output module 20 is fixedly installed in the receiving cavity 105.
  • the bracket structure 100 since the positions of at least two receiving chambers 105 on the first bracket 10 will not change, when a plurality of first input-output modules 20 are installed in the receiving chamber 105 When inside, the relative positions of the plurality of first input-output modules 20 are difficult to change, so that the plurality of first input-output modules 20 can work better together; further, the bracket structure 100 Mounting holes 107 are provided therebetween, so that the first input / output module 20 installed at the mounting hole 107 can be prevented from being blocked by the first bracket 10, and the first input / output module 20 is conveniently arranged on the bracket structure 100 so that the bracket The structure of the structure 100 is more compact.
  • the input-output component 200 of the embodiment of the present application also has the following beneficial effects: since the centers of the first cavity 1051, the third cavity 1053, and the fourth cavity 1054 are on the same straight line, the infrared light source 27, the first visible light camera 26, and the infrared camera 25 After being installed on the first cavity 1051, the third cavity 1053, and the fourth cavity 1054 respectively, the optical axes of the three are located in the same plane, and it is easy for the three to cooperate with each other.
  • the input-output module 200 (the second input-output module 70) further includes a third visible light camera 72, and the third visible light camera 72 is disposed in the second sub-receiving cavity 832. And is exposed from the mounting hole 107, the light entering direction of the third visible light camera 72 is the same as that of the second visible light camera 71, the third visible light camera 72 is provided at the mounting hole 107 and is exposed from the mounting hole 107, and the third visible light camera 72 is also connected to the motherboard 50 through the connector 51.
  • the first visible light camera 26 is a front camera
  • the second visible light camera 71 and the third visible light camera 72 together form a dual camera module
  • the dual camera module is a rear camera module.
  • the first visible light camera 26 is a rear camera
  • the second visible light camera 71 and the third visible light camera 72 together form a dual camera module
  • the dual camera module is a front camera module.
  • the input-output module 200 (the second input-output module 70) further includes a visible light fill light (or flood light) 73 disposed in the mounting hole 107.
  • the lamp 73 is configured to supplement light to the second visible light camera 71 and / or the third visible light camera 72.
  • the flood light 73 is disposed in the accommodation hole 821 and is located between the second visible light camera 71 and the third visible light camera 72.
  • the circuit board of the flood light 73 and the circuit board of the second visible light camera 71 may be the same circuit board. Therefore, it is convenient for the flood light 73 to be installed in the accommodation hole 821. Please refer to FIG. 2.
  • the bracket structure 100 further includes a protective cover 822, which is disposed on the floodlight 73.
  • the protective cover 822 is made of a light-transmitting material.
  • the protective cover 822 is made of a glass material. production.
  • Part of the surface of the protective cover 822 may also be provided (for example, plated) with a light-shielding material (light-shielding ink), which can prevent the light emitted by the flood light 73 from being directly transmitted to the second visible light camera 71 or the third visible light camera 72 .
  • the input-output module 200 further includes a light guide module 243, and the light guide module 243 is disposed on the light sensor body 241 to guide light to the light sensor 24.
  • the light guide module 243 includes a light guide plate 2431, a light guide side wall 2432, and a light guide post 2433.
  • the light guide side wall 2432 and the light guide post 2433 are located on opposite sides of the light guide plate 2431.
  • the light guide side wall 2432 is formed to extend outward from the edge of the light guide plate 2431, and the light guide post 2433 is disposed at a middle position of the light guide plate 2431.
  • the light guide plate 2431 and the light guide side wall 2432 together form a light guide cavity 2430.
  • the light sensor body 241 is housed in the light guide cavity 2430.
  • the light guide post 2433 is coaxial with the light guide hole 44, and the light outside the receiving cavity can pass through.
  • the light guide post 2433 is guided to the light sensor body 241, and the light guide plate 2431 and the light guide side wall 2432 have a light guide effect or a light reflection effect for guiding light to the light sensor body 241.
  • the electronic device 300 disclosed in the present application includes a housing 60 and the input / output component 200 of any one of the above embodiments.
  • the input-output module 200 can be movably installed in the casing 60 to selectively expose the first input-output module 20 or hide the first input-output module 20.
  • the electronic device 300 may be a mobile phone, a tablet computer, a laptop computer, a game console, a headset device, an access control system, a teller machine, or the like.
  • the width W1 of the input-output module 200 is the same as the width W2 of the casing 60, and a housing space (not shown) capable of receiving the input-output module 200 is defined in the casing 60.
  • the input-output component 200 can be manually moved in the accommodation space; or, the electronic device 300 further includes a driving component (not shown).
  • the driving component includes a driving motor, and the driving component can drive the input-output component 200 to move.
  • the input / output component 200 in the electronic device 300 can selectively expose the first input / output module 20 or hide the first input / output module 20, so that the first input / output module 20 does not need to be disposed on the casing 60.
  • a full screen can be provided on the surface corresponding to the first surface 101, and further on the surface corresponding to the first surface 101 of the casing 60.
  • the input-output module 200 when the input-output module 200 further includes a second input-output module 70, the input-output module 200 can be movably installed in the casing 60 to selectively expose the first input-output module 20 and the second input-output module. Group 70, or hide the first I / O module 20 and the second I / O module 70.
  • the input-output component 200 in the electronic device 300 can selectively expose the first input-output module 20 and the second input-output module 70 or hide the first input-output module 20 so that the first input-output module 20
  • the group 20 and the second I / O module 70 need not be disposed on the surface of the casing 60 corresponding to the first surface 101, and further, a full screen can be disposed on the surface of the casing 60 corresponding to the first surface 101.
  • first and second are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as “first” and “second” may explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality" is at least two, for example, two, three, unless it is specifically and specifically defined otherwise.

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Abstract

一种电子装置(300)、输入输出组件(200)及支架结构(100)。支架结构(100)包括第一支架(10)，第一支架(10)用于安装第一输入输出模组(20)，第一输入输出模组(20)的数量至少包括两个。

Description

支架结构、输入输出组件和电子装置
优先权信息
本申请请求2018年06月02日向中国国家知识产权局提交的、专利申请号为201810559996.8以及201810559997.2的专利申请的优先权和权益，并且通过参照将其全文并入此处。
技术领域
本申请涉及消费性电子技术领域，更具体而言，涉及一种支架结构、输入输出组件和电子装置。
背景技术
手机可以配置有多个功能模组，而多个功能模组往往需要互相配合才能正常工作，然而，手机在使用中受到撞击时，多个功能模组的相对位置容易发生改变而不能很好地配合工作。
发明内容
本申请实施方式提供一种支架结构、输入输出组件和电子装置。
本申请的支架结构包括第一支架，所述第一支架用于安装第一输入输出模组，所述第一输入输出模组的数量至少包括两个。
本申请的输入输出组件包括第一输入输出模组及支架结构，所述第一输入输出模组的数量至少包括两个；所述支架结构包括第一支架，所述第一输入输出模组安装在所述支架结构上。
本申请的电子装置包括壳体及上述实施方式所述的输入输出组件，所述输入输出组件能够移动地安装在所述壳体内以选择性露出所述第一输入输出模组或隐藏所述第一输入输出模组。
本申请的实施方式的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本申请的实施方式的实践了解到。
附图说明
本申请的上述和/或附加的方面和优点从结合下面附图对实施方式的描述中将变得明显和容易理解，其中：
图1至图5是本申请某些实施方式的支架结构的立体示意图；
图6是本申请某些实施方式的支架结构的第二支架的立体示意图；
图7至图10是本申请某些实施方式的支架结构的立体示意图；
图11是本申请某些实施方式的支架结构中的承托件的立体示意图；
图12至图17是本申请某些实施方式的输入输出组件的立体示意图；和
图18和图19是本申请某些实施方式的电子装置的结构示意图。
具体实施方式
以下结合附图对本申请的实施方式作进一步说明。附图中相同或类似的标号自始至终表示相同或类似的元件或具有相同或类似功能的元件。
另外，下面结合附图描述的本申请的实施方式是示例性的，仅用于解释本申请的实施方式，而不能理解为对本申请的限制。
在本申请中，除非另有明确的规定和限定，第一特征在第二特征“上”或“下”可以是第一和第二特征直接接触，或第一和第二特征通过中间媒介间接接触。而且，第一特征在第二特征“之上”、“上方”和“上面”可是第一特征在第二特征正上方或斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”可以是第一特征在第二特征正下方或斜下方，或仅仅表示第一特征水平高度小于第二特征。
请参阅图1至图5，本申请实施方式的支架结构100包括第一支架10，第一支架10用于安装第一输入输出模组20(如图13及图15所示)，第一输入输出模组20的数量至少包括两个。
请参阅图4至图6，本申请实施方式的支架结构100包括第一支架10及第二支架80。第一支架10用于安装第一输入输出模组20(请参阅图13及图15)，第一输入输出模组20至少包括红外光源27、红外摄像头25及第一可见光摄像头26。第二支架80与第一支架10结合，第二支架80用于安装第二输入输出模组70(请参阅图17)，第二输入输出模组70至少包括第二可见光摄像头71。
第一支架10与第二支架80可以为分体结构，其中，第一支架10及第二支架80均可为一体成型结构，第一支架10与第二支架80可通过焊接、粘接、螺纹连接、卡合中的任意一种或多种方式结合在一起；或者，第一支架10与第二支架80为一体成型结构。
第一支架10上可开设有收容腔105(请参阅图1)，第一输入输出模组20安装在第一支架10上； 第二支架80上可开设有容置腔83，第二输入输出模组70安装在第二支架80上。
红外光源27能够与红外摄像头25组成结构光深度摄像头；或者，红外光源27能够与红外摄像头25组成飞行时间(Time of flight，TOF)深度摄像头。本实施方式中，第一可见光摄像头26的进光方向可以与第二可见光摄像头71的进光方向相反。
本申请实施方式的支架结构100中，当第一输入输出模组20安装在第一支架10上时，安装在第一支架10上的红外光源27、红外摄像头25及第一可见光摄像头26的相对位置不易发生变化，从而便于红外光源27、红外摄像头25及第一可见光摄像头26能够更好地配合工作；进一步地，第二支架80与第一支架10结合形成支架结构100，使安装在第二支架80上的第二输入输出模组70与安装在第一支架10上的第一输入输出模组20能够固定在一起，从而便于不同生产厂商分别将第一输入输出模组20组装到第一支架10上、及将第二输入输出模组70组装到第二支架80上。
请参阅图1及图4，本申请实施方式的支架结构100包括第一支架10及第二支架70。第一支架10包括第一面101、第二面102及第三面103，第一面101与第二面102位于第一支架10的相背两侧，第三面103连接第一面101及第二面102。第二面102开设有至少两个收容腔105，第一面101开设有与至少两个收容腔105对应的至少两个通孔106。第三面103开设有贯穿第一面101及第二面102的安装孔107，安装孔107位于两个收容腔105之间。至少两个收容腔105用于安装第一输入输出模组20(请参阅图15)并使第一输入输出模组20从第一面101暴露。第二支架70安装在安装孔107内并与第一支架10结合，第二支架70开设有容置腔83，容置腔83用于安装第二输入输出模组70。
第一支架10上的收容腔105的数量可以为两个、三个、四个、五个、六个、七个或任意多个。通孔106的数量与收容腔105的数量一致，每个通孔106与一个收容腔105对应连通。每个收容腔105用于安装一个第一输入输出模组20，安装在收容腔105内的第一输入输出模组20能够通过通孔106从第一面101暴露。在本申请实施方式中，暴露指的是可以从第一面101看到第一输入输出模组20，例如，第一输入输出模组20可以穿过第一面101的通孔106从第一面101露出在第一支架10外；或者，第一输入输出模组20也可以未穿过通孔106，但通过通孔106可以看到第一输入输出模组20。
请结合图6，容置腔83的数量可以为一个、两个、三个、四个或任意多个。安装在容置腔83内的第二输入输出模组70的数量可以为一个、两个、三个、四个或任意多个。输入输出模组70的数量可以大于、小于或等于容置腔83的数量。
安装孔107位于第一支架10的长度方向的中间位置并位于两个收容腔105之间。第二输入输出模组70安装在第二支架80上时，第二输入输出模组70能够从第二支架80及第一支架10的第一面101暴露。
本申请实施方式的支架结构100中支架结构100通过在两个收容腔105之间开设安装孔107，从而能够避免安装在安装孔107处的第二输入输出模组70被第一支架10遮挡，便于将第二输入输出模组70布置在支架结构100上，以使支架结构100的结构更加紧凑。
请参阅图1至图3，本申请实施方式的支架结构100包括第一支架10。第一支架10包括第一面101、第二面102及第三面103，第一面101与第二面102位于第一支架10的相背两侧，第三面103连接第一面101及第二面102。第二面102开设有至少两个收容腔105，第一面101开设有与至少两个收容腔105对应的至少两个通孔106。第三面103开设有贯穿第一面101及第二面102的安装孔107，安装孔107位于两个收容腔105之间。至少两个收容腔105用于安装第一输入输出模组20(请参阅图13)并使第一输入输出模组20从第一面101暴露，安装孔107用于暴露第一输入输出模组20。
第一支架10为一体成型结构。第一支架10上的收容腔105的数量可以为两个、三个、四个、五个、六个、七个或任意多个。通孔106的数量与收容腔105的数量一致，每个通孔106与一个收容腔105对应连通。每个收容腔105用于安装一个第一输入输出模组20，安装在收容腔105内的第一输入输出模组20能够通过通孔106从第一面101暴露。在本申请实施方式中，暴露指的是可以从第一面101看到第一输入输出模组20，例如，第一输入输出模组20可以穿过第一面101的通孔106从第一面101露出在第一支架10外；或者，第一输入输出模组20也可以未穿过通孔106，但通过通孔106可以看到第一输入输出模组20。
安装孔107位于第一支架10的长度方向的中间位置并位于两个收容腔105之间。安装孔107可用于安装第一输入输出模组20并使第一输入输出模组20能够从第一面101暴露；或者，第一输入输出模组20与安装孔107没有直接的安装关系，第一支架10上开设安装孔107仅用于避免第一支架10遮挡设置在安装孔107处的第一输入输出模组20。
本申请实施方式的支架结构100中，由于第一支架10上的至少两个收容腔105的位置不会发生变化，当多个第一输入输出模组20安装在收容腔105内时，多个第一输入输出模组20的相对位置不易发生变化，从而便于多个第一输入输出模组20能够更好地配合工作；进一步地，支架结构100通过在两 个收容腔105之间开设安装孔107，从而能够避免安装在安装孔107处的第一输入输出模组20被第一支架10遮挡，便于将第一输入输出模组20布置在支架结构100上，以使支架结构100的结构更加紧凑。
请一并参阅图1至图3，本申请实施方式的支架结构100包括第一支架10、前壳30及后壳40。
第一支架10包括第一面101、第二面102、第三面103及第四面104，第一面101与第二面102位于第一支架10的相背两侧，第三面103及第四面104位于第一支架10的相背两侧并均连接第三面103及第四面104。
第二面102开设有四个收容腔105，四个收容腔105分别为第一腔1051、第二腔1502、第三腔1053及第四腔1054，第一腔1051、第二腔1502、第三腔1053及第四腔1054沿第一支架10的长度方向上依次设置，第四腔体1054位于第一支架10的一端。第一腔1051、第三腔1053及第四腔1054的中心在同一直线上。第一面101开设有与四个收容腔105对应的四个通孔106，每个通孔106与一个收容腔105对应连通。通孔106的开口尺寸小于对应的收容腔105的尺寸以形成限位环108，收容腔105由限位环108及环绕限位环108延伸的内壁形成。
第三面103开设有贯穿第一面101及第二面102的安装孔107，安装孔107位于第一腔1051与第三腔1053之间。安装孔107包括靠近第一腔1051一侧的第一子安装孔1071及靠近第三腔1053的第二子安装孔1072，并且，第三腔1053位于第二子安装孔1072与第四面104之间。第一子安装孔1071与第二子安装孔1072连通并且第一子安装孔1071的尺寸大于第二子安装孔1072的尺寸。在其他实施方式中，第一子安装孔1071的尺寸也可以小于或等于第二子安装孔1072的尺寸。
第一支架10包括安装部11、固定部12、延伸部14、定位柱111、卡合柱141及卡紧柱142。
安装部11位于安装孔107(第一子安装部1071)及第四面104之间，并且安装部11位于第一腔1051与第二腔1052之间。安装部11的第一面101所在一侧可形成有凹槽，以便于第一输入输出模组20定位安装到安装部11上。安装部11处的第四面104开设有贯穿第一面101及第二面102的收容槽112。定位柱111凸出形成在安装部11的第一面101所在一侧，定位柱111的数量可以为一个、两个、三个或任意多个。在其他实施方式中，安装部11的第一面101所在一侧形成有凸台；或者，安装部11处的第一面101与第一腔1051的外壁对应的第一面101齐平。
固定部12位于安装孔107(第二子安装部1072)及第四面104之间，并且固定部12位于安装部11与第三腔1053之间。固定部12连接在安装部11的远离第一腔1051的侧壁上。第二腔1052开设在固定部12处，具体地，第二腔1052开设在固定部12的位于第二面102所在一侧。
延伸部14位于第一腔1051的远离第三腔1053的一侧。具体地，延伸部14位于第一支架10的与第四腔1054相背的一端。安装部11的第一面101所在一侧可形成有凹槽，以便于第一输入输出模组20定位安装到延伸部14上。卡合柱141凸出形成在延伸部14的第一面101所在一侧，卡合柱141的数量可以为一个、两个、三个或任意多个。卡紧柱142凸出形成在延伸部14的第四面104所在一侧，卡紧柱142的数量可以为一个、两个、三个或任意多个。在其他实施方式中，延伸部14的第一面101所在一侧形成有凸台；或者，延伸部14处的第一面101与第一腔1051的外壁对应的第一面101齐平。
前壳30形成有前壳腔体31及贯穿前壳30并与前壳腔体31连通的前壳通光孔32。
请结合图7，后壳40形成有后壳腔体41及贯穿后壳40并与后壳腔体41连通的后壳通光孔42。前壳30固定在后壳40上并使前壳腔体31与后壳腔体41共同形成收容腔体(图未示)。第一支架10及第一输入输出模组20收容在收容腔体内。后壳40的与第四面104对应的一面还开设有与收容腔体连通的导光孔44。
在其他实施方式中，前壳30的与前壳腔体31相背的一侧设置有透光的前壳保护盖33，前壳保护盖33可以为玻璃盖板。后壳40的与后壳腔体41相背的一侧设置有透光的后壳保护盖43，后壳保护盖43可以为玻璃盖板。前壳保护盖33及后壳保护盖43还可用于密封收容腔体。
本申请实施方式的支架结构100中，由于第一支架10上的至少两个收容腔105的位置不会发生变化，当多个第一输入输出模组20安装在收容腔105内时，多个第一输入输出模组20的相对位置不易发生变化，从而便于多个第一输入输出模组20能够更好地配合工作；进一步地，支架结构100通过在两个收容腔105之间开设安装孔107，从而能够避免安装在安装孔107处的第一输入输出模组20被第一支架10遮挡，便于将第一输入输出模组20布置在支架结构100上，以使支架结构100的结构更加紧凑。
本申请实施方式的支架结构100还具有以下有益效果：第一，第一支架10上形成有限位环108从而便于第一输入输出模组20在限位环108的限位作用下安装到第一支架10上；第二，安装部11上设置定位柱111及收容槽112，从而便于第一输入输出模组20(接近传感电路板212)安装到安装部11上；第三，第一支架10在第四面104与安装孔107之间设置用于安装第一输入输出模组20的安装部11及固定部12，从而使支架结构100的结构更加紧凑；延伸部14上设置有卡合柱141及卡紧柱142，从而便于第一输入输出模组20安装在延伸部14上；第一腔1051、第三腔1053及第四腔1054的中心在同一 直线上，从而便于安装在第一腔1051、第三腔1053及第四腔1054内的第一输入输出模组20配合工作；支架结构100通过设置前壳30及后壳40，从而便于固定第一支架10及第一输入输出模组20。
请参阅图1、图4及图6，在某些实施方式中，支架结构100还包括第二支架80。第二支架80包括支架侧壁81及分隔部82。支架侧壁81与第一支架10结合，具体地，支架侧壁81可以通过粘接、卡合、焊接、螺纹连接中的至少一种的方式与安装孔107的侧壁结合在一起。支架侧壁81围成有容置腔83，分隔部82设置在容置腔83内并将容置腔83分隔为第一子容置腔831与第二子容置腔832。第一子容置腔831与第二子容置腔832的中心连线平行于第一腔1051与第三腔1053的中心连线。第一子容置腔831的尺寸大于第二子容置腔832的尺寸，第一子容置腔831与第一子安装孔1071对应，第二子容置腔832与第二子安装孔1072对应。支架侧壁81各个位置处的厚度可以相同或不相同。
分隔部82开设有容置孔821，容置孔821贯穿分隔部82的与第一面101及第二面102对应的表面。在其他实施方式中，第二支架80可以不设置分隔部82，此时，第一子容置腔831与第二子容置腔832连通；或者，容置孔821也可以为分隔部82的与第二面102同侧的表面开设的盲孔。
请参阅图8及图9，第一支架10、第二支架80、第一输入输出模组20及第二输入输出模组70均收容在前壳腔体31与后壳腔体41共同形成的收容腔体内。第一支架10与第二支架80可通过安装在前壳30和后壳40上而实现第一支架10与第二支架80结合在一起。
本实施方式的支架结构100中，由于第一支架10上的至少两个收容腔105的位置不会发生变化，当多个第一输入输出模组20安装在收容腔105内时，多个第一输入输出模组20的相对位置不易发生变化，从而便于多个第一输入输出模组20能够更好地配合工作；进一步地，第一支架10通过在两个收容腔105之间开设安装孔107，从而能够避免安装在安装孔107处的第二输入输出模组70被第一支架10遮挡，便于将第二支架80及第二输入输出模组70布置在支架结构100上，以使支架结构100的结构更加紧凑。进一步地，第一子安装孔1071的尺寸与第二子安装孔1072的尺寸不相同，从而便于第二支架80安装到安装孔107内；第一子容置腔831与第二子容置腔832的中心连线平行于第一腔1051与第三腔1053的中心连线，从而使支架结构100的外光更加美观。
请参阅图10及图11，在某些实施方式中，第二腔1052贯穿固定部12处的第三面103及第四面104，支架结构100还包括承托件13，承托件13固定在第二腔1052内，第一输入输出模组20安装在承托件13上。
具体地，承托件13包括承托底板131及自承托底板131的边缘延伸形成的承托侧壁132，承托底板131与承托侧壁132共同围成承托腔130。承托底板131的中间位置开设有贯穿孔1311，承托件13固定在第二腔1052内时，光穿孔1311和与第二腔1052对应的通孔106连通。承托侧壁132包括第一承托侧壁133、第二承托侧壁134及第三承托侧壁135，第一承托侧壁133位于承托底板131的靠近第三腔1053一侧，第二承托侧壁134位于承托底板131的靠近安装孔107(或第三面103)一侧，第三承托侧壁135位于承托底板131的靠近安装部11一侧。第二承托侧壁134能够遮挡第二腔1052位于第三面103所在侧的开口。
第一承托侧壁133包括第一侧壁本体1331及第一结合部1332，第一结合部1332自第一侧壁本体1331的远离第二承托侧壁134的一端朝远离第三承托侧壁135一侧延伸形成。第三承托侧壁135包括第三侧壁本体1351及第三结合部1352，第三结合部1352自第三侧壁本体1351的远离第二承托侧壁134的一端朝远离第一承托侧壁133一侧延伸形成。当承托件13安装在第二腔1052内时，第一结合部1332与第三腔1053处的第四面104结合，第三结合部1352与安装部11处的第四面104结合，从而承托件13能够固定在固定部12上。
本实施方式的承托件13可以由强度较高的材料制成，例如，承托件13的材料为钢、铝合金、钛合金，此时，承托件13的承托侧壁132的厚度可以做得比收容腔105对应的侧壁更薄，进而能够减小支架结构100体积，并增到安装孔107的尺寸。
请结合图11，在其他实施方式中，第二腔1052也可不贯穿第四面104。第一承托侧壁133还包括自第一侧壁本体1331的远离承托底板131一端朝远离第三承托侧壁135一侧延伸形成第一连接部(图未示)。第三承托侧壁135还包括自第三侧壁本体1351的远离承托底板131一端朝远离第一侧壁131一侧延伸形成第三连接部(图未示)。当承托件13安装在第二腔1052内时，第一连接部与第三腔1053的靠近固定部12的侧壁结合，第三连接部与安装部11的靠近固定部12的侧壁结合，从而承托件13能够固定在固定部12上。此时，第一承托侧壁133可以不设置第一结合部1332，第三承托侧壁135也可以不设置第三结合部1352。
请参阅图12及图13，本申请公开的输入输出组件200包括多个第一输入输出模组20、上述实施方式的支架结构100及主板50，第一输入输出模组20安装在支架结构100上。更具体地，第一输入输出模组20安装在第一支架10上。请参阅图14及图15，当输入输出组件200还包括第二输入输出模组70 并且支架结构100还包括第二支架80时，第二输入输出模组70安装在第二支架80上。
第一输入输出模组20包括接近传感器21、受话器22、补光灯23、光感器24、红外摄像头25、第一可见光摄像头26、红外光源2771。
第二输入输出模组70包括第二可见光摄像头71。
请结合图2，接近传感器21包括接近传感本体211及接近传感电路板212。接近传感电路板212的一端设置在安装部11处的第一面101上并与定位柱111卡合，接近传感电路板212的另一端穿过收容槽112并延伸至安装部11的第二面102所在一侧。接近传感本体211设置在接近传感电路板212的与第一面101相背的一侧，或者说，接近传感本体211设置在接近传感电路板212的远离第一支架10的一侧。在其他实施方式中，接近传感电路板212与第一面101之间还可以设置粘胶，从而使接近传感电路板212更加牢固地安装在安装部11上。
请结合图2，受话器22包括受话器本体221及受话器电路板222。受话器本体221收容在第二腔1052内。受话器电路板222的一端设置在受话器221的远离第一支架10的一侧，受话器电路板222的另一端沿安装孔107一侧延伸并穿过安装孔107的中心位置(如图12或14所示)；或者，受话器电路板222的另一端沿安装孔107一侧延伸并位于安装孔107的靠近第三腔1053的一侧。在其他实施方式中，当固定部12上设置有承托件13时，受话器本体221收容在承托腔130内。
请结合图2，补光灯23包括补光灯本体231及补光灯电路板232。补光灯电路板232的一端设置在延伸部14的第一面101上并与卡合住141卡合，补光灯电路板232的另一端沿延伸部14的远离第一腔1051的侧面延伸至延伸部14的第二面102所在一侧。补光灯本体231设置在补光灯电路板232的与第一面101相背的一侧，或者说，补光灯本体231设置在补光灯电路板232的远离第一支架10的一侧。进一步地，位于第二面102一侧的接近传感电路板212沿第一支架10的靠近第四面104一侧并经过第一腔1051连接到第二面102的补光灯电路板232上，以避免接近传感电路板212遮挡安装孔107。在其他实施方式中，补光灯电路板232与第一面101之间还可以设置粘胶，从而使补光灯电路板232更加牢固地安装在延伸部14上。
请结合图2，光感器24包括光感器本体241及光感器电路板242。光感器电路板242的一端设置在延伸部14的第四面104上并与卡紧柱142卡合，光感器电路板242的另一端与位于延伸部14的远离第一腔1051的侧面上的接近传感电路板232连接(如图12或14所示)；或者，光感器电路板242的另一端与位于延伸部14的第二面102一侧的接近传感电路板232连接。光感器本体241设置在光感器电路板242的与第四面104相背的一侧，或者说，光感器本体241设置在光感器电路板242的远离第一支架10的一侧。当第一支架10及光感器24安装到前壳30与后壳40形成的收容腔体内时，光感器24(光感器本体241)与导光孔44对齐，收容腔体外部的光线能够穿过导光孔44传输到光感器24上。
请结合图2，红外摄像头25安装在第一腔1051内，并能够接收由第一面101一侧进入的光线。
请结合图2，红外光源27安装在第四腔1054内，并能够朝第一面101一侧发生红外光线，红外光源27能够与红外摄像头25组成结构光深度摄像头；或者，红外光源27能够与红外摄像头25组成飞行时间(Time of fligh，TOF)深度摄像头。
请结合图2，第一可见光摄像头26安装在第三腔1053内，并能够接收由第一面101一侧进入的光线，此时，第一可见光摄像头26为前置摄像头；或者，第一可见光摄像头26能够接收由第二面102一侧进入的光线，此时，第一可见光摄像头26为后置摄像头。
请结合图16及图17，第二可见光摄像头71设置在安装孔107处并从安装孔107暴露。更具体地，第二可见光摄像头71设置在容置腔83(第一子容置腔831)内并从安装孔107暴露。第一可见光摄像头26的进光方向与第二可见光摄像头71的进光方向相背，当第一可见光摄像头26为前置摄像头时，第二可见光摄像头71为后置摄像头；当第一可见光摄像头26为后置摄像头时，第二可见光摄像头71为前置摄像头。
主板50上设置有多个接头51，接近传感器21、受话器22、补光灯23、光感器24、红外摄像头25、第一可见光摄像头26、红外光源27及第二可见光摄像头71均通过接头51电性连接到主板50上。
请结合图3及图7至图9，第一支架10及第一输入输出模组20收容在前壳30及后壳40形成的收容腔体内。当第一可见光摄像头26为前置摄像头时，前壳通光孔32的数量为多个并分别为与延伸部14、第一腔1051、固定部12、第二腔1052(或安装部11)、第三腔1503及第四腔1054对应的前壳通光孔32，从而输入输出组件200外部的光线能够进入红外摄像头25、接近传感21及第一可见光摄像头26，并且补光灯23及红外光源27发出的光线能够投射到输入输出组件200外，以及受话器22发出的声音能够传输到输入输出组件200外。当第二可见光摄像头71为后置摄像头时，后壳通光孔42与第二可见光摄像头71对应，以使输入输出组件200外部的光线能够进入第二可见光摄像头71。
在将第一输入输出模组20安装到收容腔105上时，可以将第一输入输出模组20沿第二面102指向 第一面101的方向安装在收容腔105内，直至第一输入输出模组20与限位环108相抵，表明第一输入输出模组20安装到位，此时可以向收容腔105内点胶，具体地，可以向第一输入输出模组20与收容腔105的内壁之间的间隙内点胶，等胶水固化后，第一输入输出模组20被固定安装在收容腔105。
本申请实施方式的输入输出组件200及支架结构100中，由于第一支架10上的至少两个收容腔105的位置不会发生变化，当多个第一输入输出模组20安装在收容腔105内时，多个第一输入输出模组20的相对位置不易发生变化，从而便于多个第一输入输出模组20能够更好地配合工作；进一步地，支架结构100通过在两个收容腔105之间开设安装孔107，从而能够避免安装在安装孔107处的第一输入输出模组20被第一支架10遮挡，便于将第一输入输出模组20布置在支架结构100上，以使支架结构100的结构更加紧凑。
本申请实施方式的输入输出组件200还具有以下有益效果：由于第一腔1051、第三腔1053及第四腔1054的中心在同一直线上，红外光源27、第一可见光摄像头26和红外摄像头25分别安装在第一腔1051、第三腔1053及第四腔1054上后，三者的光轴位于同一平面内，易于三者互相配合工作。
请参阅图16及图17，在其他实施方式中，输入输出组件200(第二输入输出模组70)还包括第三可见光摄像头72，第三可见光摄像头72设置在第二子容置腔832内并从安装孔107暴露，第三可见光摄像头72的进光方向与第二可见光摄像头71的进光方向相同，第三可见光摄像头72设置在安装孔107处并从安装孔107暴露，第三可见光摄像头72也通过接头51连接到主板50上。当第一可见光摄像头26为前置摄像头时，第二可见光摄像头71与第三可见光摄像头72共同形成双摄模组，该双摄模组为后置摄像头模组。当第一可见光摄像头26为后置摄像头时，第二可见光摄像头71与第三可见光摄像头72共同形成双摄模组，该双摄模组为前置摄像头模组。
请参阅图16及图17，在其他实施方式中，输入输出组件200(第二输入输出模组70)还包括设置在安装孔107内的可见光补光灯(或泛光灯)73，泛光灯73用于给第二可见光摄像头71和/或第三可见光摄像头72补光。泛光灯73设置在容置孔821内并位于第二可见光摄像头71与第三可见光摄像头72之间。泛光灯73的电路板与第二可见光摄像头71的电路板可以为同一个电路板。从而便于泛光灯73安装到容置孔821内。请结合图2，在其他实施方式中，支架结构100还包括保护罩822，保护罩822罩设在泛光灯73上，保护罩822有透光材料制成，例如，保护罩822由玻璃材料制成。保护罩822的部分表面还可以设置(例如，镀设)有遮光材料(遮光油墨)，该遮光材料能够避免泛光灯73发出的光线直接传输至第二可见光摄像头71或第三可见光摄像头72上。
请参阅图3及图12，在某些实施方式中，输入输出组件200还包括导光模组243，导光模组243罩设在光感器本体241上以将光线导向光感器24。具体地，导光模组243包括导光板2431、导光侧壁2432及导光柱2433，导光侧壁2432与导光柱2433位于导光板2431的相背两侧。导光侧壁2432自导光板2431的边缘向外延伸形成，导光柱2433设置在导光板2431的中间位置。导光板2431与导光侧壁2432共同围成导光腔2430，光感器本体241收容在导光腔2430内。当第一支架10、光感器24及导光组件243安装到前壳30与后壳40形成的收容腔体内时，导光柱2433与导光孔44同轴，收容腔体外部的光线能够通过导光柱2433引导至光感器本体241上，导光板2431及导光侧壁2432具有导光作用或具有反光作用以用于将光线引导至光感器本体241上。
请参阅图18，本申请公开的电子装置300包括壳体60及上述任一实施方式的输入输出组件200。输入输出组件200能够移动地安装在壳体60内以选择性露出第一输入输出模组20或隐藏第一输入输出模组20。电子装置300可以是手机、平板电脑、手提电脑、游戏机、头显设备、门禁系统、柜员机等。
具体地，输入输出组件200的宽度W1与壳体60的宽度W2相同，壳体60上开设有能够收容输入输出组件200的收容空间(图未示)。输入输出组件200可以通过手动的方式在收容空间内移动；或者，电子装置300还包括驱动组件(图未示)，驱动组件包括驱动电机，驱动组件能够驱动输入输出组件200移动。
本申请实施方式的电子装置300中的输入输出组件200能够选择性露出第一输入输出模组20或隐藏第一输入输出模组20，从而第一输入输出模组20不需要设置在壳体60的与第一面101对应的一面上，进而壳体60的与第一面101对应的一面上可以设置全面屏。
请参阅图19，当输入输出组件200还包括第二输入输出组件70时，输入输出组件200能够移动地安装在壳体60内以选择性露出第一输入输出模组20与第二输入输出模组70，或隐藏第一输入输出模组20与第二输入输出模组70。本实施方式中，电子装置300中的输入输出组件200能够选择性露出第一输入输出模组20与第二输入输出模组70，或隐藏第一输入输出模组20，从而第一输入输出模组20与第二输入输出模组70不需要设置在壳体60的与第一面101对应的一面上，进而壳体60的与第一面101对应的一面上可以设置全面屏。
在本说明书的描述中，参考术语“某些实施方式”、“一个实施方式”、“一些实施方式”、“示意性实 施方式”、“示例”、“具体示例”、或“一些示例”的描述意指结合所述实施方式或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施方式或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施方式或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施方式或示例中以合适的方式结合。
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个所述特征。在本申请的描述中，“多个”的含义是至少两个，例如两个，三个，除非另有明确具体的限定。
尽管上面已经示出和描述了本申请的实施例，可以理解的是，上述实施例是示例性的，不能理解为对本申请的限制，本领域的普通技术人员在本申请的范围内可以对上述实施例进行变化、修改、替换和变型，本申请的范围由权利要求及其等同物限定。

Claims (44)

  1. 一种支架结构，其特征在于，所述支架结构包括第一支架，所述第一支架用于安装第一输入输出模组，所述第一输入输出模组的数量至少包括两个。
  2. 根据权利要求1所述的支架结构，其特征在于，所述第一输入输出模组至少包括红外光源、红外摄像头及第一可见光摄像头；所述支架结构还包括第二支架，所述第二支架与所述第一支架结合，所述第二支架用于安装第二输入输出模组，所述第二输入输出模组至少包括第二可见光摄像头。
  3. 根据权利要求2所述的支架结构，其特征在于，所述第一支架与所述第二支架一体成形为单体结构；或
    所述第一支架与所述第二支架为分体成形结构。
  4. 根据权利要求2所述的支架结构，其特征在于，所述第一支架包括第一面、第二面及第三面，所述第一面与所述第二面位于所述第一支架的相背两侧，所述第三面连接所述第一面及所述第二面，所述第二面开设有至少两个收容腔，所述第一面开设有与至少两个所述收容腔对应的至少两个通孔，所述第三面开设有贯穿所述第一面及所述第二面的安装孔，所述安装孔位于两个所述收容腔之间，至少两个所述收容腔用于安装所述第一输入输出模组并使所述第一输入输出模组从所述第一面暴露；
    所述第二支架安装在所述安装孔内，所述第二支架开设有容置腔，所述容置腔用于安装所述第二输入输出模组。
  5. 根据权利要求1所述的支架结构，其特征在于，所述第一支架包括第一面、第二面及第三面，所述第一面与所述第二面位于所述第一支架的相背两侧，所述第三面连接所述第一面及所述第二面，所述第二面开设有至少两个收容腔，所述第一面开设有与至少两个所述收容腔对应的至少两个通孔，所述第三面开设有贯穿所述第一面及所述第二面的安装孔，所述安装孔位于两个所述收容腔之间，至少两个所述收容腔用于安装所述第一输入输出模组并使所述第一输入输出模组从所述第一面暴露，所述安装孔用于暴露所述第一输入输出模组。
  6. 根据权利要求4或5所述的支架结构，其特征在于，所述通孔的开口尺寸小于对应的所述收容腔的尺寸以形成限位环，所述收容腔由所述限位环及环绕所述限位环延伸的内壁形成。
  7. 根据权利要求4或5所述的支架结构，其特征在于，所述第一支架还包括与所述第三面相背并连接所述第一面与所述第二面的第四面，所述第一支架在所述安装孔与所述第四面之间形成有安装部，所述第一支架还包括自所述安装部的所述第一面所在侧凸出形成的定位柱。
  8. 根据权利要求7所述的支架结构，其特征在于，所述安装部开设有贯穿所述第一面与所述第二面的收容槽。
  9. 根据权利要求4或5所述的支架结构，其特征在于，所述第一支架还包括与所述第三面相背并连接所述第一面与所述第二面的第四面，所述第一支架在所述安装孔与所述第四面之间形成固定部，所述固定部的位于所述第二面所在一侧开设有所述收容腔，所述收容腔的位于所述第一面所在一侧开设有与所述收容腔对应的所述通孔，所述通孔的开口尺寸小于所述收容腔的尺寸。
  10. 根据权利要求9所述的支架结构，其特征在于，所述通孔的开口尺寸小于所述收容腔的尺寸以形成限位环，所述收容腔为所述限位环及环绕所述限位环延伸的内壁形成；或者
    所述支架结构还包括承托件，所述收容腔贯穿所述第三面及第四面，所述承托件安装在所述收容腔内以遮挡所述收容腔的位于所述第三面所在侧的开口。
  11. 根据权利要求4或5所述的支架结构，其特征在于，所述第一支架形成有延伸部，所述第一支架还包括自所述延伸部的所述第一面所在侧凸出形成的卡合柱。
  12. 根据权利要求11所述的支架结构，其特征在于，所述第一支架还包括与所述第三面相背并连接所述第一面与所述第二面的第四面，所述第一支架还包括自所述延伸部的所述第四面所在侧凸出形成的卡紧柱。
  13. 根据权利要求4或5所述的支架结构，其特征在于，所述第一支架还包括与所述第三面相背并连接所述第一面与所述第二面的第四面，至少两个所述收容腔包括依次设置的第一腔、第二腔、第三腔和第四腔，所述安装孔位于所述第一腔与所述第三腔之间，所述第二腔位于所述安装孔与所述第四面之间，所述第四腔位于所述第三腔的远离所述第一腔的一侧。
  14. 根据权利要求4所述的支架结构，其特征在于，所述第一支架还包括与所述第三面相背并连接所述第一面与所述第二面的第四面，至少两个所述收容腔包括依次设置的第一腔、第二腔、第三腔和第四腔，所述安装孔位于所述第一腔与所述第三腔之间，所述第二腔位于所述安装孔与所述第四面之间，所述第四腔位于所述第三腔的远离所述第一腔的一侧；所述第二支架包括支架侧壁及分隔部，所述支架侧壁与第一支架结合，所述支架侧壁围成容置腔，所述分隔部设置在所述容置腔内并将所述容置腔分隔为第一子容置腔与第二子容置腔。
  15. 根据权利要求14所述的支架结构，其特征在于，所述第一子容置腔与所述第二子容置腔的中心连线平行于所述第一腔与所述第三腔的中心连线。
  16. 根据权利要求14所述的支架结构，其特征在于，所述分隔部的与所述第二面同侧的表面开设有容置孔。
  17. 根据权利要求1至5任意一项所述的支架结构，其特征在于，所述支架结构还包括后壳及前壳，所述前壳安装在所述后壳上，所述第一支架安装在所述后壳和所述前壳之间。
  18. 一种输入输出组件，其特征在于，包括：
    第一输入输出模组，所述第一输入输出模组的数量至少包括两个；及
    支架结构，所述支架结构包括第一支架，所述第一输入输出模组安装在所述支架结构上。
  19. 根据权利要求18所述的输入输出组件，其特征在于，所述第一输入输出模组至少包括红外光源、红外摄像头及第一可见光摄像头；所述输入输出组件还包括第二输入输出组件，所述第二输入输出模组至少包括第二可见光摄像头；所述支架结构还包括第二支架，所述第二支架与所述第一支架结合，所述第二输入输出模组安装在所述第二支架上。
  20. 根据权利要求19所述的输入输出组件，其特征在于，所述第一支架与所述第二支架一体成形为单体结构；或
    所述第一支架与所述第二支架为分体成形结构。
  21. 根据权利要求19所述的输入输出组件，其特征在于，所述第一支架包括第一面、第二面及第三面，所述第一面与所述第二面位于所述第一支架的相背两侧，所述第三面连接所述第一面及所述第二面，所述第二面开设有至少两个收容腔，所述第一面开设有与至少两个所述收容腔对应的至少两个通孔，所述第三面开设有贯穿所述第一面及所述第二面的安装孔，所述安装孔位于两个所述收容腔之间，至少两个所述收容腔用于安装所述第一输入输出模组并使所述第一输入输出模组从所述第一面暴露；
    所述第二支架安装在所述安装孔内，所述第二支架开设有容置腔，所述容置腔用于安装所述第二输入输出模组。
  22. 根据权利要求18所述的输入输出组件，其特征在于，所述第一支架包括第一面、第二面及第三面，所述第一面与所述第二面位于所述第一支架的相背两侧，所述第三面连接所述第一面及所述第二面，所述第二面开设有至少两个收容腔，所述第一面开设有与至少两个所述收容腔对应的至少两个通孔，所述第三面开设有贯穿所述第一面及所述第二面的安装孔，所述安装孔位于两个所述收容腔之间，至少两个所述收容腔用于安装所述第一输入输出模组并使所述第一输入输出模组从所述第一面暴露，所述安装孔用于暴露所述第一输入输出模组。
  23. 根据权利要求21或22所述的输入输出组件，其特征在于，所述通孔的开口尺寸小于对应的所述收容腔的尺寸以形成限位环，所述收容腔由所述限位环及环绕所述限位环延伸的内壁形成。
  24. 根据权利要求21或22所述的输入输出组件，其特征在于，所述第一输入输出模组包括接近传感器，所述接近传感器包括接近传感电路板及接近传感本体，所述第一支架还包括与所述第三面相背并连接所述第一面与所述第二面的第四面，所述第一支架在所述安装孔与所述第四面之间形成有安装部，所述第一支架还包括自所述安装部的所述第一面所在侧凸出形成的定位柱，所述接近传感电路板设置在所述安装部的所述第一面上并与所述定位柱卡合，所述接近传感本体设置在所述接近传感电路板的与所述第一面相背的一侧。
  25. 根据权利要求24所述的输入输出组件，其特征在于，所述安装部开设有贯穿所述第一面与所述第二面的收容槽，所述接近传感电路板穿过所述收容槽并延伸至所述第二面所在的一侧。
  26. 根据权利要求21或22所述的输入输出组件，其特征在于，所述第一输入输出模组包括受话器，所述受话器包括受话器本体及受话器电路板，所述第一支架还包括与所述第三面相背并连接所述第一面与所述第二面的第四面，所述第一支架在所述安装孔与所述第四面之间形成固定部，所述固定部的位于所述第二面所在一侧开设有所述收容腔，所述收容腔的位于所述第一面所在一侧开设有与所述收容腔对应的所述通孔，所述通孔的开口尺寸小于所述收容腔的尺寸，所述受话器本体收容在所述收容腔内并承载在述受话器电路板上。
  27. 根据权利要求26所述的输入输出组件，其特征在于，所述通孔的开口尺寸小于所述收容腔的尺寸以形成限位环，所述收容腔为所述限位环及环绕所述限位环延伸的内壁形成；或者
    所述支架结构还包括承托件，所述收容腔贯穿所述第三面及第四面，所述承托件安装在所述收容腔内并承托住所述受话器本体。
  28. 根据权利要求21或22所述的输入输出组件，其特征在于，所述第一输入输出模组包括补光灯，所述补光灯包括补光灯本体及补光灯电路板，所述第一支架形成有延伸部，所述第一支架还包括自所述延伸部的所述第一面所在侧凸出形成的卡合柱，所述补光灯电路板设置在所述延伸部的所述第一面上并 与所述卡合柱卡合，所述补光灯本体设置在所述补光灯电路板的与所述第一面相背的一侧。
  29. 根据权利要求28所述的输入输出组件，其特征在于，所述第一输入输出模组包括光感器，所述光感器包括光感器本体及光感器电路板，所述第一支架还包括与所述第三面相背并连接所述第一面与所述第二面的第四面，所述第一支架还包括自所述延伸部的所述第四面所在侧凸出形成的卡紧柱，所述补光灯电路板设置在所述延伸部的所述第四面上并与所述卡紧柱卡合，所述光感器本体设置在所述光感器电路板的与所述第四面相背的一侧。
  30. 根据权利要求28所述的输入输出组件，其特征在于，所述输入输出组件还包括导光模组，所述导光模组罩设在所述光感器本体上以将光线导向所述光感器。
  31. 根据权利要求21所述的输入输出组件，其特征在于，所述第一输入输出模组还包括受话器，所述第一支架还包括与所述第三面相背并连接所述第一面与所述第二面的第四面，至少两个所述收容腔包括依次设置的第一腔、第二腔、第三腔和第四腔，所述安装孔位于所述第一腔与所述第三腔之间，所述第二腔位于所述安装孔与所述第四面之间，所述第四腔位于所述第三腔的远离所述第一腔的一侧，所述第一可见光摄像头安装在所述第三腔内，所述受话器安装在所述第二腔内，所述红外摄像头安装在所述第一腔内，所述红外光源安装在所述第四腔内，所述第二输入输出模组安装在所述安装孔内。
  32. 根据权利要求22所述的输入输出组件，其特征在于，所述第一输入输出模组包括红外摄像头、第一可见光摄像头、受话器、及红外光源，所述第一支架还包括与所述第三面相背并连接所述第一面与所述第二面的第四面，至少两个所述收容腔包括依次设置的第一腔、第二腔、第三腔和第四腔，所述安装孔位于所述第一腔与所述第三腔之间，所述第二腔位于所述安装孔与所述第四面之间，所述第四腔位于所述第三腔的远离所述第一腔的一侧，所述第一可见光摄像头安装在所述第三腔内，所述受话器安装在所述第二腔内，所述红外摄像头安装在所述第一腔内，所述红外光源安装在所述第四腔内，所述安装孔用于暴露第二可见光摄像头。
  33. 根据权利要求31或32所述的输入输出组件，其特征在于，所述第一可见光摄像头的进光方向与所述第二可见光摄像头的进光方向相背。
  34. 根据权利要求32所述的输入输出组件，其特征在于，所述安装孔还用于暴露第三可见光摄像头，所述第二可见光摄像头与所述第三可见光摄像头共同形成双摄模组。
  35. 根据权利要求34所述的输入输出组件，其特征在于，所述第一可见光摄像头为前置摄像头，所述双摄模组为后置摄像头模组；或者
    所述第一可见光摄像头为后置摄像头，所述双摄模组为前置摄像头模组。
  36. 根据权利要求31或32所述的输入输出组件，其特征在于，所述红外光源与所述红外摄像头组成结构光深度摄像头；或
    所述红外光源与所述红外摄像头组成飞行时间深度摄像头。
  37. 根据权利要求31或32所述的输入输出组件，其特征在于，所述输入输出组件还包括主板，所述红外摄像头、所述第一可见光摄像头、所述受话器、及所述红外光源均与所述主板电性连接。
  38. 根据权利要求22所述的输入输出组件，其特征在于，所述支架结构还包括后壳及前壳，所述前壳安装在所述后壳上，所述第一支架安装在所述后壳和所述前壳之间，所述前壳开设有与所述第一输入输出模组对应的前壳通光孔，所述后壳开设有与所述第一输入输出模组对应的后壳通光孔，所述第一输入输出模组外部的光线能够穿过所述前壳通光孔或所述后壳通光孔传输到所述第一输入输出模组上，或者所述第一输入输出模组发出的光线能够穿过所述前壳通光孔或所述后壳通光孔传输至所述输入输出组件外。
  39. 根据权利要求31所述的输入输出组件，其特征在于，所述第二支架包括支架侧壁及分隔部，所述支架侧壁与第一支架结合，所述支架侧壁围成容置腔，所述分隔部设置在所述容置腔内并将所述容置腔分隔为第一子容置腔与第二子容置腔，所述第二输入输出模组还包括第三可见光摄像头，第二可见光摄像头及第三可见光摄像头分别安装在所述第一子容置腔及所述第二子容置腔内。
  40. 根据权利要求39所述的输入输出组件，其特征在于，所述第一子容置腔与所述第二子容置腔的中心连线平行于所述第一腔与所述第三腔的中心连线。
  41. 根据权利要求39所述的输入输出组件，其特征在于，所述分隔部的与所述第二面同侧的表面开设有容置孔，所述第二输入输出模组还包括泛光灯，所述泛光灯安装在所述容置孔内。
  42. 根据权利要求21所述的输入输出组件，其特征在于，所述支架结构还包括后壳及前壳，所述前壳安装在所述后壳上，所述第一支架、所述第二支架、所述第一输入输出模组及所述第二输入输出模组安装在所述后壳和所述前壳之间，所述前壳开设有与所述第一输入输出模组对应的前壳通光孔，所述后壳开设有与所述第二输入输出模组对应的后壳通光孔，所述输入输出模组外部的光线能够穿过所述前壳通光孔或所述后壳通光孔传输到所述第一输入输出模组或所述第二输入输出模组上，或者
    所述第一输入输出模组或所述第二输入输出模组发出的光线能够穿过所述前壳通光孔或所述后壳通光孔传输至所述输入输出组件外。
  43. 一种电子装置，其特征在于，包括：
    壳体；及
    权利要求18至42任意一项所述的输入输出组件，所述输入输出组件能够移动地安装在所述壳体内以选择性露出所述第一输入输出模组或隐藏所述第一输入输出模组。
  44. 根据权利要求43所述的电子装置，其特征在于，当所述输入输出组件还包括第二输入输出组件时，所述输入输出组件能够移动地安装在所述壳体内以选择性露出所述第一输入输出模组与所述第二输入输出模组，或隐藏所述第一输入输出模组与所述第二输入输出模组。
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