WO2019185012A1 - 基底边缘保护装置、光刻设备及基底边缘保护方法 - Google Patents

基底边缘保护装置、光刻设备及基底边缘保护方法 Download PDF

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Publication number
WO2019185012A1
WO2019185012A1 PCT/CN2019/080394 CN2019080394W WO2019185012A1 WO 2019185012 A1 WO2019185012 A1 WO 2019185012A1 CN 2019080394 W CN2019080394 W CN 2019080394W WO 2019185012 A1 WO2019185012 A1 WO 2019185012A1
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WO
WIPO (PCT)
Prior art keywords
ring
substrate
base
edge protection
robot
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Application number
PCT/CN2019/080394
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English (en)
French (fr)
Inventor
曹文
郎东春
Original Assignee
上海微电子装备（集团）股份有限公司
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Publication of WO2019185012A1 publication Critical patent/WO2019185012A1/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight

Definitions

  • Embodiments of the present disclosure relate to the field of semiconductor fabrication, for example, to a substrate edge protection device, a lithography apparatus, and a substrate edge protection method.
  • the lithographic apparatus is configured to be an integrated circuit (IC) or other micro device.
  • the reticle pattern can be imaged onto a photoresist coated substrate by a lithographic apparatus, typically a silicon wafer.
  • the substrate is usually fixed by vacuum suction on the suction cup on the workpiece table, and the workpiece table drives the suction cup with the silicon wafer to move, and reaches the correct position according to the predetermined route and speed to complete the photolithography process.
  • the reduction of the reliability of the silicon wafer will affect the focus and overlay of the lithographic apparatus, and the surface accuracy of the upper and lower surfaces and the amount of clamping deformation of the lithography apparatus will affect the exposure quality of the silicon wafer. And wafer yield.
  • the related art cannot expose the silicon wafer with a large warpage amount.
  • an additional wafer edge protection device is provided, and the protection ring is transmitted to complete the upper ring covering of the edge of the silicon wafer, and the edge of the silicon wafer is not exposed during the exposure process.
  • the protective ring is a light-shielding shielding member whose central portion is hollowed out and whose edge is a solid. This undoubtedly increases the flow and time of the entire exposure process and reduces production efficiency.
  • Embodiments of the present disclosure provide a substrate edge protection device, a lithography apparatus, and a substrate edge protection method to achieve leveling of a large warpage substrate, improve substrate exposure quality and yield, and simplify exposure process, thereby improving production. effectiveness.
  • an embodiment of the present disclosure provides a substrate edge protection device, the substrate edge protection device comprising:
  • a gripping member disposed at a working side edge of the base, the gripping member being configured to grasp and fix the base edge protection ring;
  • the warpage processing mechanism disposed on a working side of the base, the warpage processing mechanism includes a plurality of air blowing holes formed on the working surface, and an air inlet hole connected in communication with the plurality of air blowing holes, and the warping processing mechanism is configured to pass through A blow hole blows the substrate to level the substrate.
  • an embodiment of the present disclosure further provides a lithographic apparatus including the substrate edge protection device described in the above embodiments, further comprising a workpiece stage, the workpiece stage is disposed to place the substrate; and the substrate edge protection The working side of the device faces the working surface of the workpiece table.
  • an embodiment of the present disclosure further provides a substrate edge protection method, including:
  • the robot transfers the substrate to a predetermined position on the workpiece table
  • the substrate edge protection device is moved to the intersection position, and the warpage processing mechanism of the substrate edge protection device blows the base on the workpiece table through the air blowing hole to level the substrate;
  • the grasping member of the base edge protection device releases the base edge protection ring, and the base edge protection ring is placed on the base to cover the edge of the base;
  • the substrate edge protector is moved to the transfer position, and the gripping member grasps the base edge guard ring from the workpiece table.
  • FIG. 1 is a perspective view of a substrate edge protection device according to an embodiment of the present disclosure
  • FIG. 2 is a schematic structural view of a warpage processing mechanism in a substrate edge protection device according to an embodiment of the present disclosure
  • FIG. 3 is a schematic diagram of a partial structure of a lithographic apparatus according to an embodiment of the present disclosure
  • FIG. 4 is a schematic diagram of an internal structure of a layer of a ring-closing box in a lithographic apparatus according to an embodiment of the present disclosure
  • FIG. 5 is a flowchart of a method for protecting a substrate edge according to an embodiment of the present disclosure
  • FIG. 6 is a flowchart of another method for protecting a substrate edge according to an embodiment of the present disclosure.
  • FIG. 1 is a perspective view of a substrate edge protection device according to an embodiment of the present disclosure
  • FIG. 2 is a warpage processing mechanism in a substrate edge protection device according to an embodiment of the present disclosure.
  • the base edge protector 100 includes a base 110, a gripping member 120 disposed at a working side edge of the base 110, and the gripping member 120 is configured to grip and mount (or secure) the base edge guard ring 130.
  • the substrate edge protection device 100 is located in the lithographic apparatus, directly above the workpiece stage of the lithographic apparatus, and is movable in a vertical direction; the working side of the substrate edge protection device 100 faces the working surface of the workpiece stage, and the workpiece stage A suction cup is arranged on the working surface and is arranged to adsorb the substrate.
  • the working side of the substrate edge protector 100 is the same as the working side of the base 110.
  • the working principle of the substrate edge protection device 100 is as follows:
  • the suction cup After the substrate is transferred to the workpiece table, the suction cup starts to work, and the substrate is initially adsorbed from the substrate side. However, since the substrate may have a large amount of warpage, the substrate is not completely absorbed by the suction cup; the substrate edge protection ring is clamped.
  • the base edge protection device 100 of the 130 is lowered to the intersection position, which is a position where the working surface of the warpage processing mechanism 140 is slightly higher than the highest warpage point of the substrate, ensuring that the substrate edge protection device 100 is not in contact with the substrate, thereby avoiding affecting the surface of the substrate.
  • the base edge protection device 100 blows a positive pressure gas into the warpage processing mechanism 140 through the air intake hole on the warpage processing mechanism 140, and the warpage processing mechanism 140 passes the air blowing hole on the working surface to the base on the workpiece table. Blowing, forming a gas film above the substrate, leveling the warpage substrate by the pressure of the gas film, and completely adjusting the warped substrate to the suction cup after being flattened; the gripping member 120 releases the base edge protection ring 130, The substrate edge protection ring 130 is placed on the substrate to cover the edge of the substrate, and the substrate edge protection ring 130 is also held by the suction cup (adsorption, holding, etc.), avoiding During the continuous exposure process, the substrate moves relative to the substrate; after the substrate exposure is completed, the workpiece table suction cup releases the adsorption of the substrate and the substrate edge protection ring 130 is retained; the substrate edge protection device 100 descends to the intersection position, and the gripping member 120 The substrate edge guard ring 130 is grasped on the workpiece table.
  • the substrate edge protection device provided by the embodiment of the present disclosure is provided with a warpage processing mechanism on the working side of the base, and the positive pressure gas is blown to the warped substrate on the workpiece table by the warpage processing mechanism, and a gas film is formed above the substrate, and the gas is passed through the gas.
  • the pressure of the film flattens the warpage substrate, so that the substrate is completely adsorbed on the suction cup, which achieves the leveling of the large warpage substrate, high adsorption reliability, improved substrate exposure quality and yield; in addition, substrate shaping and substrate edge
  • the placement of the guard ring can be achieved by the substrate edge protector, which simplifies the exposure process and increases production efficiency.
  • the warpage processing mechanism 140 is an annular structure concentric with the base edge guard ring 130 (or the base edge guard ring 130 fixed region), and the edge of the annular structure is provided.
  • the air inlet hole and the working surface are provided with a plurality of air blowing holes, and the warpage processing mechanism 140 is located inside the base edge guard ring 130 (or the fixed area of the base edge guard ring 130). That is, the outer diameter of the warpage processing mechanism 140 is smaller than the inner diameter of the base edge guard ring 130, and the warpage processing mechanism 140 does not interfere with the grasping and releasing of the base edge guard ring 130.
  • the inner diameter of the warpage processing mechanism 140 can be set according to the warped shape of the substrate.
  • the warpage processing mechanism 140 can also be a disc structure having a smaller radius than the inner diameter of the base edge guard ring 130.
  • the warpage processing mechanism 140 is an annular structure, and the plurality of blow holes are formed in a concentric arrangement with the center of the working surface of the warpage processing mechanism 140.
  • the plurality of blow holes have the same size of the apertures, and the bases of different warpage amounts are leveled by adjusting the gas pressure input by the intake holes during operation.
  • the warpage processing mechanism 140 has an annular structure, and the plurality of blow holes are arranged in a concentric circle at a center where the working surface of the warpage processing mechanism 140 is located, and the warpage processing mechanism 140 is provided with a plurality of air intake holes.
  • a plurality of blow holes located on the same circle communicate with each other, and a plurality of blow holes on the same circle are connected to one intake hole.
  • the base 110 includes a gas supply conduit, and the air outlet of the air supply conduit communicates with the air inlet of the warpage processing mechanism 140, and is configured to input a positive pressure gas to the warpage processing mechanism 140.
  • the gripping member 120 includes at least three jaws that are equally spaced along the working side edge of the base 110, the jaws being radially along the working side of the base 110 of the base edge protector 100.
  • the motion is set to grab or release the base edge guard ring 130.
  • a corresponding position on the edge of the base edge guard ring 130 is provided with a groove matching the claw for facilitating the gripping of the base edge guard ring 130 by the claw.
  • the substrate edge protection device 100 includes a base 110 and is disposed at the base 110. a side edge gripping member 120, the gripping member 120 is configured to grip and fix the base edge guard ring 130; a warpage processing mechanism 140 disposed on the working side of the base 110, the warpage processing mechanism 140 including the working surface A plurality of blow holes, and an intake hole communicating with the plurality of blow holes, the warpage processing mechanism 140 is configured to blow the substrate through the plurality of blow holes to level the substrate.
  • the lithographic apparatus further includes a workpiece stage, the substrate edge protection device 100 is located directly above the workpiece stage of the lithographic apparatus, and is movable in a vertical direction; the working side of the substrate edge protection device 100 is opposite to the working surface of the workpiece stage, and the workpiece A suction cup is arranged on the working surface of the table, and is arranged to adsorb the substrate.
  • a substrate edge protection device is disposed directly above the workpiece table, and a warpage processing mechanism is disposed on the working side of the base edge protection device, and is blown to the warped substrate on the workpiece table by the warpage processing mechanism.
  • Positive pressure gas forms a gas film above the substrate, and the warpage substrate is leveled by the pressure of the gas film, so that the substrate is completely adsorbed on the suction cup, and the flattening of the large warpage substrate is achieved, and the adsorption reliability is high.
  • the substrate exposure quality and yield are improved; in addition, the substrate shaping and substrate edge guard ring placement can be achieved by the substrate edge protector, which simplifies the exposure process and increases production efficiency.
  • the lithographic apparatus includes a substrate edge protection device 100, a transmission substrate and a substrate edge protection ring 130.
  • the robot 200 and the ring box 300, the ring box 300 is provided with a plurality of ring spaces (for example, at least two ring spaces), and the plurality of ring spaces are arranged to store the base edge protection rings 130 of different specifications.
  • the ring-closing box 300 is provided in a multi-layered structure in which a base edge guard ring 130 of one specification is stored.
  • the robot 200 takes out the substrate edge guard ring 130 that matches the size of the substrate from a corresponding layer of the ring box 300 and transfers it to a predetermined position on the workpiece table; the substrate edge protection device 100 is lowered to the handoff Position, the gripping member 120 grabs the base edge guard ring 130 and rises to the idle position; the robot 200 transfers the substrate to a predetermined position on the workpiece table, the suction cup on the workpiece table adsorbs the substrate; and the base edge protection device 100 descends to the intersection position,
  • the warpage processing mechanism 140 blows the substrate on the workpiece table, flattens the warpage substrate, and after the warpage substrate is leveled, is completely adsorbed on the suction cup; the gripping member 120 releases the base edge guard ring 130, and the base edge is
  • the protection ring 130 is placed on the substrate, and the substrate edge protection ring 130 is held by the suction cup to cover the edge of the substrate.
  • the suction pad of the workpiece table unabsorbs the substrate and unfastens the substrate edge protection ring 130.
  • the substrate edge protection device 100 Dropping to the intersection, the gripping member 120 grabs the base edge guard ring 130 from the workpiece table and rises to the idle position; the robot 200 moves to Below the bottom edge of the protection device 100, gripping member 120 to release the substrate edge protection ring 130, which is placed on the manipulator 200; 200 to protect the edges of the substrate manipulator cycloalkyl ring 130 into the cassette 300 is set corresponding to one layer.
  • the inner diameter of the base edge guard ring 130 is the size at which the edge of the base is to be blocked, and one base edge guard ring 130 corresponds to one occlusion size. A plurality of sizes of the substrate edge guard ring 130 are replaced for different exposure edge size requirements of the substrate.
  • the associated lithographic equipment replacement substrate edge guard ring is manually removed and replaced, and the wafer edge protection device does not automatically replace the guard ring function and is manually aligned when replaced. This undoubtedly reduces the production efficiency of the product and increases the labor cost.
  • the lithographic apparatus provided by the embodiment provides a ring box in the lithographic apparatus while achieving flattening of the large warpage substrate, improving the substrate exposure quality and yield, simplifying the exposure process, and improving the production efficiency.
  • the base edge protection ring of different specifications is stored, and the robot is used to complete the upper ring covering of the substrate and the replacement and alignment of the base edge protection ring, thereby improving production efficiency and saving labor cost.
  • each of the ring spaces of the ring box 300 is provided with a positioning mechanism configured to position the base edge guard ring 130.
  • the ring box 300 is provided with a positioning mechanism in each layer to ensure that the position of the base edge guard ring 130 in each layer of the ring box is correct, thereby ensuring that the robot 200 is transmitting the base edge guard ring 130.
  • the position of the base edge guard ring 130 on the robot 200 is correct, thereby ensuring that the base edge guard ring 130 is transferred to a predetermined position on the workpiece table and can be accurately grasped by the gripping member 120, thereby ensuring that the base edge guard ring 130 can be accurately
  • the ground is covered by the edge of the substrate.
  • the positioning mechanism includes two pin 301 and one movable cylinder ejector 302.
  • the exemplary two pin 301 and one movable cylinder ejector 302 are equally spaced along the outer edge of the base edge guard ring 130, and are secured within the ring box 300 by pins 301 that can be pushed through the cylinder, locking The base edge guard ring 130 is tightened or loosened.
  • the robot 200 before the robot 200 removes the base edge guard ring 130 from the ring box 300, the cylinder ejector pin 302 is released, the robot 200 removes the base edge guard ring 130 from the ring box; the base 200 edge protection is provided at the robot 200 After the ring 130 is sent back to the ring box 300, the cylinder thimble is locked and the base edge guard ring 130 is fixed.
  • the lithographic apparatus further includes a sensing element 400 configured to detect whether the position of the substrate edge protection 130 on the robot 200 is correct during the transfer to further ensure that the substrate edge guard ring 130 accurately faces the substrate edge Cover it.
  • the positioning mechanism in the ring-setting box and the detecting element during transmission by adding the positioning mechanism in the ring-setting box and the detecting element during transmission, the manual replacement of the edge protection ring of the substrate, the position error during manual alignment is avoided, and the edge-precision accuracy is improved.
  • Embodiment 3 of the present disclosure provides a substrate edge protection method
  • FIG. 5 is a flowchart of a substrate edge protection method according to an embodiment of the present disclosure.
  • the base edge protection device 100 includes a base 110, a gripping member 120 disposed at a working side edge of the base 110, the gripping member 120 is configured to grasp and fix the base edge guard ring 130; and is disposed at the base 110
  • the side warpage processing mechanism 140 includes a plurality of air blowing holes formed on the working surface, and an air inlet hole communicating with the plurality of air blowing holes, the warpage processing mechanism being disposed to pass through the plurality of air blowing holes
  • the substrate is blown to level the substrate.
  • the substrate edge protection device 100 is located within a lithographic apparatus that also includes a robot 200 and a workpiece stage. As shown in FIG. 5, the method includes: S110 to S140.
  • the suction cup starts to work, and the substrate is initially adsorbed from the substrate side, but the substrate is not completely adsorbed by the suction cup due to the possibility that the substrate may have a large amount of warpage.
  • the base edge protection device moves to the intersection position, and the warpage processing mechanism of the base edge protection device blows the base on the workpiece table through the air blowing hole to level the substrate.
  • the base edge protection device 100 holding the base edge guard ring 130 is lowered to the intersection position, and the warpage processing mechanism 140 blows the base on the workpiece table through the air blowing hole on the working surface to form a gas film on the base.
  • the warpage substrate is leveled by the pressure of the gas film, and after the warpage substrate is leveled, it is completely adsorbed on the suction cup.
  • the gripping member 120 releases the base edge guard ring 130, and the base edge guard ring 130 is placed on the base to cover the edge of the base, and the base edge guard ring 130 is also held by the suction cup to avoid subsequent
  • the substrate moves relative to the substrate during exposure; the substrate edge protector 100 rises to an idle position.
  • the substrate edge protection device moves to the intersection position, and the grasping member grasps the substrate edge protection ring from the workpiece table.
  • the suction of the workpiece table releases the adsorption of the substrate and the retention of the substrate edge guard ring 130, the substrate edge protection device 100 is lowered to the intersection position, and the gripping member 120 grasps the substrate edge protection from the workpiece table. Ring 130.
  • the positive pressure gas is blown to the warpage substrate on the workpiece table by the warpage processing mechanism, a gas film is formed above the substrate, and the warpage substrate is leveled by the pressure of the gas film.
  • the substrate is completely adsorbed on the suction cup, and the flattening of the large warpage substrate is achieved, the adsorption reliability is high, and the substrate exposure quality and yield are improved; in addition, the substrate shaping and the substrate edge protection ring can be disposed by the method. , which simplifies the exposure process and increases productivity.
  • FIG. 6 is a flowchart of another method for protecting a substrate edge according to an embodiment of the present disclosure.
  • the lithographic apparatus further includes a ring set box 300, and the ring set box 300 is provided with a plurality of places. Ring space, exemplarily, the ring box 300 is configured in a multi-layered structure, and is configured to store different specifications of the substrate edge guard ring 130.
  • the method further includes:
  • the robot removes the base edge protection ring matching the base specification from the corresponding ring space of the ring box, and transmits the base edge protection ring to a predetermined position on the workpiece table;
  • the base edge protector is moved to the transfer position, and the gripping member grabs the base edge guard ring from the workpiece table and rises to the idle position.
  • the method further includes:
  • the robot moves below the base edge protection device
  • the grabbing member releases the base edge protection ring and places the protective ring on the robot;
  • the robot returns the base edge protection ring back to the corresponding ring space of the ring box.
  • the method includes: Step 21 to Step 28.
  • Step 21 The robot takes out the base edge protection ring matching the base specification from the corresponding ring space of the ring box, and transmits the base edge protection ring to a predetermined position on the workpiece table.
  • Step 22 The base edge protection device is moved to the intersection position, and the gripping member grabs the base edge protection ring from the workpiece table and rises to the idle position.
  • Step 23 The robot transfers the substrate to a predetermined position on the workpiece table.
  • Step 24 The substrate edge protection device moves to the intersection position, and the warpage processing mechanism blows the substrate on the workpiece table through the air blowing hole to level the substrate.
  • Step 25 The warpage processing mechanism stops blowing, the grasping member releases the base edge protection ring, and the base edge protection ring is placed on the substrate to cover the edge of the substrate.
  • Step 26 After the substrate is exposed, the substrate edge protection device is moved to the intersection position, and the grasping member grasps the substrate edge protection ring from the workpiece table.
  • Step 27 The robot moves to the underside of the substrate edge protector, the grabbing member releases the base edge guard ring, and the guard ring is placed on the robot.
  • Step 28 The robot returns the base edge protection ring to the corresponding ring space of the ring box.
  • the substrate edge protection method provided by the embodiment provides a ring box in the lithographic apparatus while achieving flattening of the large warpage substrate, improving the substrate exposure quality and yield, simplifying the exposure process, and improving the production efficiency.
  • the automation of the upper ring covering of the substrate and the replacement of the edge protection ring of the substrate is improved, the production efficiency is improved, and the labor cost of the manual upper ring or the replacement of the substrate edge protection ring is saved.
  • each ring-forming space of the ring-closing box 300 is provided with a positioning mechanism, and the positioning mechanism includes two pin 301 and one movable cylinder ejector 302.
  • the method further includes:
  • the cylinder ejector 302 Prior to removal of the base edge guard ring 130 by the robot 200 from the bellows 300, the cylinder ejector 302 is released to allow the robot 200 to remove the base edge guard ring 130 from the ring space.
  • the cylinder thimble 302 is locked to fix the base edge guard ring 130.
  • the lithographic apparatus further includes a detection element 400.
  • the robot 200 transports the substrate edge guard ring 130 to a predetermined location on the workpiece table, including:
  • the robot 200 transmits the base edge guard ring 130 to the lower side of the detecting element 400.
  • the detecting element 400 detects whether the position of the base edge guard ring 130 on the robot 200 is correct. If the position of the base edge guard ring 130 on the robot 200 is correct, the robot 200 transports the substrate edge guard ring 130 to a predetermined location on the workpiece table.
  • the positioning mechanism in the ring-setting box and the detecting element during transmission by adding the positioning mechanism in the ring-setting box and the detecting element during transmission, the manual replacement of the edge protection ring of the substrate, the position error during manual alignment is avoided, and the edge-precision accuracy is improved.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

提供了一种基底边缘保护装置（100）包括：底座（110），设置在底座（110）的工作侧边缘的抓取部件（120），设置为抓取和固定基底边缘保护环（130），设置在底座的工作侧的翘曲处理机构（140），翘曲处理机构（140）包括在工作面上的多个吹气孔，以及与多个吹气孔联连通的进气孔，通过多个吹气孔对基底吹气以对基底进行整平。还提供了包括该基底边缘保护装置（100）的光刻设备以及对应的基底边缘保护方法。

Description

基底边缘保护装置、光刻设备及基底边缘保护方法
本申请要求在2018年03月30日提交中国专利局、申请号为201810293658.4的中国专利申请的优先权，该申请的全部内容通过引用结合在本申请中。
技术领域
本公开实施例涉及半导体制造领域，例如涉及一种基底边缘保护装置、光刻设备及基底边缘保护方法。
背景技术
光刻设备设置为集成电路(Integrated Circuit，IC)或其他微型器件的制造。通过光刻设备，可将掩膜版图案成像到涂覆有光刻胶的基底上，基底通常为硅片。基底通常由工件台上的吸盘通过真空吸附的方式固定，工件台带动吸附有硅片的吸盘移动，按照预定的路线和速度到达正确的位置，完成光刻过程。
随着穿过硅片通道(Through Silicon Vias，TSV)技术的发展，硅片的不断减薄以及硅片键合工艺，导致硅片自身存在不确定的翘曲，在硅片翘曲处和吸盘表面形成了间隙，当吸盘打开真空时，吸盘与硅片之间就会出现真空泄露，无法满足正常情况下的真空阈值，导致硅片吸附的可靠性降低，甚至出现据片的情况，大大影响了生产效率。此外，硅片吸附可靠性降低将影响光刻设备的焦深(focus)和套刻精度(overlay)，体现在其上下表面的面型精度以及自身的夹持变形量，从而影响硅片曝光质量和硅片良率。
相关技术无法对大翘曲量的硅片进行曝光，此外，额外设置硅片边缘保护装置，传送保护环，完成对硅片边缘的上环遮盖，保护硅片边缘在曝光过程中不会被曝光，其中，保护环是一种中央部分镂空，边缘为实体的遮光屏蔽物件。这无疑增加了整个曝光工艺的流程和时间，降低了生产效率。
发明内容
本公开实施例提供一种基底边缘保护装置、光刻设备及基底边缘保护方法，以实现对大翘曲量基底的整平，提高了基底曝光质量和良率；简化了曝光流程， 从而提高了生产效率。
在一实施例中，本公开实施例提供了一种基底边缘保护装置，该基底边缘保护装置包括：
底座；
设置在底座的工作侧边缘的抓取部件，抓取部件设置为抓取和固定基底边缘保护环；
设置在底座的工作侧的翘曲处理机构，翘曲处理机构包括形成在工作面上的多个吹气孔，以及与多个吹气孔联连通的进气孔，翘曲处理机构设置为于通过多个吹气孔对基底吹气以对基底进行整平。
在一实施例中，本公开实施例还提供了一种光刻设备，该光刻设备包括上述实施例所述的基底边缘保护装置，还包括工件台，工件台设置为放置基底；基底边缘保护装置的工作侧与工件台的工作面正对。
在一实施例中，本公开实施例还提供了一种基底边缘保护方法，包括：
机械手将基底传送至工件台上的预定位置；
基底边缘保护装置移动至交接位，基底边缘保护装置的翘曲处理机构通过吹气孔向工件台上的基底吹气，将基底整平；
在翘曲处理机构停止吹气的情况下，基底边缘保护装置的抓取部件释放基底边缘保护环，将基底边缘保护环放置在基底上，对基底的边缘进行遮盖；
在基底曝光后，基底边缘保护装置移动至交接位，抓取部件从工件台上抓取基底边缘保护环。
附图说明
图1是本公开实施例提供的一种基底边缘保护装置的立体图；
图2是本公开实施例提供的一种基底边缘保护装置中翘曲处理机构的结构示意图；
图3是本公开实施例提供的一种光刻设备的部分结构的示意图；
图4是本公开实施例提供的光刻设备中置环盒其中一层的内部结构示意图；
图5是本公开实施例提供的一种基底边缘保护方法的流程图；
图6是本公开实施例提供的另一种基底边缘保护方法的流程图。
具体实施方式
下面结合附图和实施例对本公开进行说明。此处所描述的实施例仅仅用于解释本公开，而非对本公开的限定。为了便于描述，附图中仅示出了与本公开相关的部分而非全部结构。
实施例一
本公开实施例提供一种基底边缘保护装置，图1是本公开实施例提供的一种基底边缘保护装置的立体图，图2是本公开实施例提供的一种基底边缘保护装置中翘曲处理机构的结构示意图。如图1所示，该基底边缘保护装置100包括底座110，设置在底座110的工作侧边缘的抓取部件120，抓取部件120设置为抓取和安放(或固定)基底边缘保护环130。
设置在底座110的工作侧的翘曲处理机构140，如图2所示，翘曲处理机构140包括形成在工作面上的多个吹气孔，以及与多个吹气孔联连通的进气孔，翘曲处理机构140设置为通过多个吹气孔对基底吹气以对基底进行整平。
该基底边缘保护装置100位于光刻设备内，位于光刻设备的工件台的正上方，可沿竖直方向移动；基底边缘保护装置100的工作侧与工件台的工作面正对，工件台的工作面上设有吸盘，设置为吸附基底。在一实施例中，基底边缘保护装置100的工作侧与底座110的工作侧相同。该基底边缘保护装置100的工作原理如下：
基底被传送至工件台上后，吸盘开始工作，从基底一侧初步吸附基底，但由于基底可能存在翘曲量较大的情况，导致基底并未被吸盘完全吸附；夹持有基底边缘保护环130的基底边缘保护装置100下降至交接位，该交接位为翘曲处理机构140的工作面比基底最高翘曲点稍高的位置，保证基底边缘保护装置100不与基底接触，避免影响基底表面质量；基底边缘保护装置100通过翘曲处理机构140上的进气孔向翘曲处理机构140内吹入正压气体，翘曲处理机构140通过工作面上的吹气孔，对工件台上的基底吹气，在基底上方形成一层气膜，通过气膜的压力将翘曲基底整平，翘曲基底被整平后，被完全吸附在吸盘上； 抓取部件120释放基底边缘保护环130，将基底边缘保护环130放置在基底上，对基底边缘进行遮盖，同时基底边缘保护环130也被吸盘固持(吸附、加持等)，避免在后续曝光过程中与基底发生相对移动；在完成基底曝光后，工件台吸盘解除对基底的吸附作用和对基底边缘保护环130固持作用；基底边缘保护装置100下降至交接位，抓取部件120从工件台上抓取基底边缘保护环130。
本公开实施例提供的基底边缘保护装置，在底座工作侧设置翘曲处理机构，通过翘曲处理机构向工件台上的翘曲基底吹正压气体，在基底上方形成一层气膜，通过气膜的压力将翘曲基底整平，使基底完全吸附在吸盘上，实现了对大翘曲量基底的整平，吸附可靠性高，提高了基底曝光质量和良率；此外，基底整形和基底边缘保护环的放置都可以通过该基底边缘保护装置实现，简化了曝光流程，从而提高了生产效率。
在一实施例中，如图1和图2所示，翘曲处理机构140为与基底边缘保护环130(或基底边缘保护环130固定区域)同心的环状结构，环状结构的边缘设有进气孔，工作面设有多个吹气孔，且翘曲处理机构140位于基底边缘保护环130(或基底边缘保护环130固定区域)的内侧。即翘曲处理机构140的外径小于基底边缘保护环130的内径，翘曲处理机构140不会对基底边缘保护环130的抓取和释放造成干扰。翘曲处理机构140的内径可以根据基底的翘曲形状进行设定，在一实施例中，翘曲处理机构140也可以是半径小于基底边缘保护环130内径的圆盘结构。
继续参考图2，在一实施例中，翘曲处理机构140为环状结构，多个吹气孔以翘曲处理机构140的工作面所在的圆心形成同心圆排布。示例性的，多个吹气孔的孔径大小相等，工作时通过调整进气孔输入的气体气压，对不同翘曲量的基底进行整平。在其他实施例中，也可以控制进气孔输入的气体气压不变，吹气孔的孔径大小不相等，对不同翘曲形状的基底进行整平。例如，基底翘曲量大的位置，翘曲处理机构140上对应位置的孔径较大。
在一实施例中，翘曲处理机构140上的多个吹气孔中至少部分连通，进气孔为一个或多个。示例性的，翘曲处理机构140为环状结构，多个吹气孔以翘曲处理机构140工作面所在的圆心形成同心圆排布，翘曲处理机构140设有多个进气孔。位于同一圆上的多个吹气孔互相连通，同一圆上的多个吹气孔与一 个进气孔相连。当进行基底整平时，分别控制输入每个进气孔的气体气压，对不同翘曲形状的基底进行整平。
在一实施例中，底座110内包括送气管道，送气管道的出气孔与翘曲处理机构140的进气孔连通，设置为向翘曲处理机构140输入正压气体。
继续参考图1，在一实施例中，抓取部件120包括至少3个沿底座110工作侧边缘等距排布的卡爪，卡爪可沿基底边缘保护装置100的底座110工作侧的径向运动，设置为抓取或释放基底边缘保护环130。基底边缘保护环130的边缘上对应的位置设有与卡爪匹配的凹槽，便于卡爪抓取基底边缘保护环130。
实施例二
本公开实施例提供一种光刻设备，该光刻设备包括实施例一所述的基底边缘保护装置100，如图1所示，该基底边缘保护装置100包括底座110，设置在底座110的工作侧边缘的抓取部件120，抓取部件120设置为抓取和固定基底边缘保护环130；设置在底座110的工作侧的翘曲处理机构140，翘曲处理机构140包括形成在工作面上的多个吹气孔，以及与多个吹气孔联连通的进气孔，翘曲处理机构140设置为通过多个吹气孔对基底吹气以对基底进行整平。
该光刻设备还包括工件台，基底边缘保护装置100位于光刻设备的工件台的正上方，可沿竖直方向移动；基底边缘保护装置100的工作侧与工件台的工作面正对，工件台的工作面上设有吸盘，设置为吸附基底。
本公开实施例提供的光刻设备，在工件台的正上方设置基底边缘保护装置，基底边缘保护装置的底座工作侧设置翘曲处理机构，通过翘曲处理机构向工件台上的翘曲基底吹正压气体，在基底上方形成一层气膜，通过气膜的压力将翘曲基底整平，使基底完全吸附在吸盘上，实现了对大翘曲量基底的整平，吸附可靠性高，提高了基底曝光质量和良率；此外，基底整形和基底边缘保护环的放置都可以通过该基底边缘保护装置实现，简化了曝光流程，从而提高了生产效率。
图3是本公开实施例提供的一种光刻设备的部分结构的示意图，如图1至图3所示，该光刻设备包括基底边缘保护装置100、设置为传送基底和基底边缘保护环130的机械手200及置环盒300，置环盒300设有多个置环空间(例如，至少2个置环空间)，多个置环空间设置为存放不同规格的基底边缘保护环130。 示例性的，在本实施例中，置环盒300设置成多层的结构，每层中存放有一种规格的基底边缘保护环130。
在一实施例中，机械手200从置环盒300对应的一层中取出与基底尺寸相匹配的基底边缘保护环130，并将其传送至工件台上预定位置；基底边缘保护装置100下降至交接位，抓取部件120抓取基底边缘保护环130，并上升至空闲位置；机械手200将基底传送至工件台上预定位置，工件台上的吸盘吸附基底；基底边缘保护装置100下降至交接位，翘曲处理机构140对工件台上的基底吹气，将翘曲基底整平，翘曲基底被整平后，被完全吸附在吸盘上；抓取部件120释放基底边缘保护环130，将基底边缘保护环130放置在基底上，基底边缘保护环130被吸盘固持，对基底边缘进行遮盖；基底曝光后，工件台的吸盘对基底解除吸附和对基底边缘保护环130解除固持，基底边缘保护装置100下降至交接位，抓取部件120从工件台上抓取基底边缘保护环130，并上升至空闲位置；机械手200移动至基底边缘保护装置100的下方，抓取部件120释放基底边缘保护环130，将其放置在机械手200上；机械手200将基底边缘保护环130送入置环盒300对应的一层中。
基底边缘保护环130的内径尺寸，即为基底边缘要被遮挡的尺寸，一个基底边缘保护环130对应一个遮挡规格尺寸。对于基底不同的曝光遮边尺寸要求，更换多个规格的基底边缘保护环130。
相关的光刻设备更换基底边缘保护环都是通过人工取出和替换，硅片边缘保护装置没有自动更换保护环功能，且在替换时手工对准位置。这无疑降低了产品的生产效率，同时提高了人工成本。而本实施例提供的光刻设备，在实现对大翘曲量基底的整平，提高了基底曝光质量和良率，简化曝光流程，提高生产效率的同时，通过在光刻设备内设置环盒，存放不同规格的基底边缘保护环，配合机械手，完成对基底的上环遮盖及基底边缘保护环的更换和对准的自动化，提高了生产效率、节省了人力成本。
在一实施例中，置环盒300的每一个置环空间内设有定位机构，设置为对基底边缘保护环130进行定位。在本实施例中，置环盒300每一层中都设有定位机构，确保基底边缘保护环130在置环盒每层中的位置正确，从而确保机械手200在传送基底边缘保护环130时，基底边缘保护环130在机械手200上的 位置正确，进而确保基底边缘保护环130被传送到工件台上预定位置，并能被抓取部件120准确地抓取，进而确保基底边缘保护环130能精确地对基底边缘进行遮盖。
图4是本公开实施例提供的光刻设备中置环盒其中一层的内部结构示意图，在一实施例中，定位机构包括2个靠销301和1个活动的气缸顶针302。示例性的2个靠销301和1个活动的气缸顶针302沿基底边缘保护环130的外沿等距排布，靠销301固定在置环盒300内，气缸顶针302可通过气缸推动，锁紧或松开基底边缘保护环130。在一实施例中，在机械手200从置环盒300中取出基底边缘保护环130之前，气缸顶针302松开，机械手200从置环盒中取出基底边缘保护环130；在机械手200将基底边缘保护环130送回置环盒300后，气缸顶针锁紧，固定基底边缘保护环130。
在一实施例中，该光刻设备还包括检测元件400，设置为检测传送过程中，基底边缘保护130在机械手200上的位置是否正确，从而进一步确保基底边缘保护环130能精确地对基底边缘进行遮盖。
本公开实施例中，通过增加置环盒内的定位机构，和传输时的检测元件，避免了人工更换基底边缘保护环，手工对准时的位置误差，提高了遮边精度。
实施例三
本公开实施例三提供一种基底边缘保护方法，图5是本公开实施例提供的一种基底边缘保护方法的流程图。参考图1，该基底边缘保护装置100包括底座110，设置在底座110的工作侧边缘的抓取部件120，抓取部件120设置为抓取和固定基底边缘保护环130；设置在底座110的工作侧的翘曲处理机构140，翘曲处理机构140包括形成在工作面上的多个吹气孔，以及与多个吹气孔联连通的进气孔，翘曲处理机构设置为通过多个吹气孔对基底吹气以对基底进行整平。该基底边缘保护装置100位于光刻设备内，该光刻设备还包括机械手200和工件台。如图5所示，该方法包括：S110至S140。
S110：机械手将基底传送至工件台上的预定位置。
机械手200将基底传送至工件台上后，吸盘开始工作，从基底一侧初步吸附基底，但由于基底可能存在翘曲量较大的情况，基底并未被吸盘完全吸附。
S120：基底边缘保护装置移动至交接位，基底边缘保护装置的翘曲处理机构通过吹气孔向工件台上的基底吹气，将基底整平。
夹持有基底边缘保护环130的基底边缘保护装置100下降至交接位，翘曲处理机构140通过工作面上的吹气孔，向工件台上的基底吹气，在基底上方形成一层气膜，通过气膜的压力将翘曲基底整平，翘曲基底被整平后，被完全吸附在吸盘上。
S130：在翘曲处理机构停止吹气的情况下，基底边缘保护装置的抓取部件释放基底边缘保护环，将基底边缘保护环放置在基底上，对基底的边缘进行遮盖。
在基底被吸盘完全吸附后，抓取部件120释放基底边缘保护环130，将基底边缘保护环130放置在基底上，对基底边缘进行遮盖，同时基底边缘保护环130也被吸盘固持，避免在后续曝光过程中与基底发生相对移动；基底边缘保护装置100上升至空闲位置。
S140：在基底曝光后，基底边缘保护装置移动至交接位，抓取部件从工件台上抓取基底边缘保护环。
在完成基底曝光后，工件台的吸盘解除对基底的吸附作用和对基底边缘保护环130的固持作用，基底边缘保护装置100下降至交接位，抓取部件120从工件台上抓取基底边缘保护环130。
本公开实施例提供的基底边缘保护方法，通过翘曲处理机构向工件台上的翘曲基底吹正压气体，在基底上方形成一层气膜，通过气膜的压力将翘曲基底整平，使基底完全吸附在吸盘上，实现了对大翘曲量基底的整平，吸附可靠性高，提高了基底曝光质量和良率；此外，基底整形和基底边缘保护环的放置都可以通过该方法实现，简化了曝光流程，从而提高了生产效率。
图6是本公开实施例提供的另一种基底边缘保护方法的流程图，在一实施例中，参考图3，光刻设备还包括置环盒300，该置环盒300设有多个置环空间，示例性的，置环盒300设置成多层的结构，设置为存放不同规格的基底边缘保护环130，在机械手将基底传送至工件台上的预定位置之前，该方法还包括：
机械手从置环盒对应的置环空间中取出与基底规格匹配的基底边缘保护环， 并将基底边缘保护环传送至工件台上的预定位置；
基底边缘保护装置移动至交接位，抓取部件从工件台上抓取基底边缘保护环，并上升至空闲位置。
在一实施例中，在抓取部件从工件台上抓取基底边缘保护环之后，还包括：
机械手移动至基底边缘保护装置下方；
抓取部件释放基底边缘保护环，将保护环放置在机械手上；
机械手将基底边缘保护环送回置环盒对应的置环空间内。
如图6所示，该方法包括：步骤21至步骤28。
步骤21：机械手从置环盒对应的置环空间中取出与基底规格匹配的基底边缘保护环，并将基底边缘保护环传送至工件台上的预定位置。
步骤22：基底边缘保护装置移动至交接位，抓取部件从工件台上抓取基底边缘保护环，并上升至空闲位置。
步骤23：机械手将基底传送至工件台上的预定位置。
步骤24：基底边缘保护装置移动至交接位，翘曲处理机构通过吹气孔向工件台上的基底吹气，将基底整平。
步骤25：翘曲处理机构停止吹气，抓取部件释放基底边缘保护环，将基底边缘保护环放置在基底上，对基底边缘进行遮盖。
步骤26：对基底曝光后，基底边缘保护装置移动至交接位，抓取部件从工件台上抓取基底边缘保护环。
步骤27：机械手移动至基底边缘保护装置下方，抓取部件释放基底边缘保护环，将保护环放置在机械手上。
步骤28：机械手将基底边缘保护环送回置环盒对应的置环空间内。
本实施例提供的基底边缘保护方法，在实现对大翘曲量基底的整平，提高了基底曝光质量和良率，简化曝光流程，提高生产效率的同时，通过在光刻设备内设置环盒，配合机械手，完成基底的上环遮盖及更换基底边缘保护环的自动化，提高了生产效率、节省了人工上环或更换基底边缘保护环的人力成本。
在一实施例中，参考图1至图4，置环盒300每个置环空间设有定位机构，定位机构包括2个靠销301和1个活动的气缸顶针302，该方法还包括：
在机械手200从置环盒300中取出基底边缘保护环130之前，气缸顶针302松开，以使机械手200从置环空间中取出基底边缘保护环130。
在机械手200将基底边缘保护环130送回置环盒300对应的置环空间内后，气缸顶针302锁紧，以固定基底边缘保护环130。
在一实施例中，参考图1至图5，光刻设备还包括检测元400。机械手200将基底边缘保护环130传送至工件台上的预定位置，包括：
机械手200将基底边缘保护环130传送至检测元件400的下方，检测元件400检测基底边缘保护环130在机械手200上的位置是否正确，若基底边缘保护环130在机械手200上的位置正确，则机械手200将基底边缘保护环130传送至工件台上的预定位置。
本公开实施例中，通过增加置环盒内的定位机构，和传输时的检测元件，避免了人工更换基底边缘保护环，手工对准时的位置误差，提高了遮边精度。

Claims (17)

  1. 一种基底边缘保护装置，包括：
    底座；
    设置在所述底座的工作侧边缘的抓取部件，所述抓取部件设置为抓取和固定基底边缘保护环；
    设置在所述底座的工作侧的翘曲处理机构，所述翘曲处理机构包括形成在工作面上的多个吹气孔，以及与所述多个吹气孔联连通的进气孔，所述翘曲处理机构设置为通过所述多个吹气孔对基底吹气以对所述基底进行整平。
  2. 根据权利要求1所述的装置，其中，所述翘曲处理机构为与所述基底边缘保护环同心的环状结构，且所述翘曲处理机构位于所述基底边缘保护环的内侧。
  3. 根据权利要求2所述的装置，其中，所述多个吹气孔以所述翘曲处理机构的工作面所在的圆心形成同心圆排布。
  4. 根据权利要求1或3所述的装置，其中，所述翘曲处理机构上的多个吹气孔中至少部分连通。
  5. 根据权利要求4所述的装置，其中，所述进气孔为一个或多个。
  6. 根据权利要求1所述的装置，其中，所述底座内包括送气管道，所述送气管道的出气孔与所述翘曲处理机构的进气孔连通。
  7. 根据权利要求1所述的装置，其中，所述抓取部件包括至少3个沿所述底座工作侧边缘等距排布的卡爪。
  8. 一种光刻设备，包括权利要求1-7中任一项所述的基底边缘保护装置，还包括工件台，所述工件台设置为放置基底；所述基底边缘保护装置的工作侧与所述工件台的工作面正对。
  9. 根据权利要求8所述的光刻设备，还包括：置环盒，所述置环盒设有至少2个置环空间，所述至少2个置环空间设置为存放不同规格的基底边缘保护环。
  10. 根据权利要求9所述的光刻设备，其中，所述置环盒的每一个置环空间内设有定位机构，所述定位机构设置为对所述基底边缘保护环进行定位。
  11. 根据权利要求10所述的光刻设备，其中，所述定位机构包括2个靠销和1个活动的气缸顶针。
  12. 根据权利要求8所述的光刻设备，还包括：机械手和检测元件；
    所述机械手，设置为传送所述基底边缘保护环和所述基底；
    所述检测元件，设置为在传送所述基底边缘保护环的过程中，检测所述基底边缘保护环在所述机械手上的位置是否正确。
  13. 一种基底边缘保护方法，包括：
    机械手将基底传送至工件台上的预定位置；
    基底边缘保护装置移动至交接位，所述基底边缘保护装置的翘曲处理机构通过吹气孔向所述工件台上的所述基底吹气，将所述基底整平；
    在所述翘曲处理机构停止吹气的情况下，所述基底边缘保护装置的抓取部件释放基底边缘保护环，将所述基底边缘保护环放置在所述基底上，对所述基底的边缘进行遮盖；
    在所述基底曝光后，所述基底边缘保护装置移动至所述交接位，所述抓取部件从所述工件台上抓取所述基底边缘保护环；
    其中，所述基底边缘保护装置位于光刻设备内，所述光刻设备还包括所述机械手和所述工件台。
  14. 根据权利要求13所述的方法，其中，在所述机械手将基底传送至工件台上的预定位置之前，包括：
    所述机械手从置环盒对应的置环空间中取出与所述基底规格匹配的基底边缘保护环，并将所述基底边缘保护环传送至所述工件台上的预定位置；
    所述基底边缘保护装置移动至所述交接位，所述抓取部件从所述工件台上抓取所述基底边缘保护环，并上升至空闲位置；
    其中，所述光刻设备还包括所述置环盒，所述置环盒设有至少2个所述置环空间，所述至少2个所述置环空间设置为存放不同规格的基底边缘保护环。
  15. 根据权利要求14所述的方法，在所述抓取部件从所述工件台上抓取所述基底边缘保护环之后，还包括：
    所述机械手移动至所述基底边缘保护装置下方；
    所述抓取部件释放所述基底边缘保护环，将所述基底边缘保护环放置在所述机械手上；
    所述机械手将所述基底边缘保护环送回所述置环盒对应的置环空间内。
  16. 根据权利要求15所述的方法，还包括：
    在所述机械手从所述置环盒中取出所述基底边缘保护环之前，气缸顶针松开；
    在所述机械手将所述基底边缘保护环送回所述置环盒对应的置环空间内后，所述气缸顶针锁紧，以固定所述基底边缘保护环；
    其中，所述置环盒的每个置环空间设有定位机构，所述定位机构包括2个靠销和1个活动的气缸顶针。
  17. 根据权利要求15所述的方法，其中，所述机械手将所述基底边缘保护环传送至所述工件台上的预定位置，包括：
    所述机械手将基底边缘保护环传送至检测元件的下方，响应于所述检测元件检测所述基底边缘保护环在所述机械手上的位置正确，所述机械手将所述基底边缘保护环传送至所述工件台上的预定位置。
PCT/CN2019/080394 2018-03-30 2019-03-29 基底边缘保护装置、光刻设备及基底边缘保护方法 WO2019185012A1 (zh)

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