WO2019184036A1 - Mini LED背光模组及荧光膜层的制作方法 - Google Patents

Mini LED背光模组及荧光膜层的制作方法 Download PDF

Info

Publication number
WO2019184036A1
WO2019184036A1 PCT/CN2018/084179 CN2018084179W WO2019184036A1 WO 2019184036 A1 WO2019184036 A1 WO 2019184036A1 CN 2018084179 W CN2018084179 W CN 2018084179W WO 2019184036 A1 WO2019184036 A1 WO 2019184036A1
Authority
WO
WIPO (PCT)
Prior art keywords
mini led
film layer
backlight module
led backlight
fluorescent
Prior art date
Application number
PCT/CN2018/084179
Other languages
English (en)
French (fr)
Inventor
程艳
Original Assignee
武汉华星光电技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 武汉华星光电技术有限公司 filed Critical 武汉华星光电技术有限公司
Priority to US16/069,303 priority Critical patent/US10859240B2/en
Publication of WO2019184036A1 publication Critical patent/WO2019184036A1/zh

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V13/00—Producing particular characteristics or distribution of the light emitted by means of a combination of elements specified in two or more of main groups F21V1/00 - F21V11/00
    • F21V13/12—Combinations of only three kinds of elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • F21V9/30—Elements containing photoluminescent material distinct from or spaced from the light source
    • F21V9/32—Elements containing photoluminescent material distinct from or spaced from the light source characterised by the arrangement of the photoluminescent material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133606—Direct backlight including a specially adapted diffusing, scattering or light controlling members
    • G02F1/133607—Direct backlight including a specially adapted diffusing, scattering or light controlling members the light controlling member including light directing or refracting elements, e.g. prisms or lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133614—Illuminating devices using photoluminescence, e.g. phosphors illuminated by UV or blue light

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a method for fabricating a Mini LED backlight module and a fluorescent film layer.
  • Mini LED shrinks the direct-lit LED backlight module, making the panel color very good and the contrast is very high.
  • Mini LED and Micro LED are completely different process technologies. Mini LED is placed in the backlight module, which may be as long as seven thousand, but the Micro LED is a display, which is placed directly on the pixel, which may be as high as six million. At this time, the yield becomes very important, and the application of Micro LED will be a very big challenge.
  • the Mini LED turns dozens of LED beads on the side backlight into thousands of illuminators with tens of thousands, tens of thousands, or even more backlights.
  • the HDR fineness is unprecedented, although not like OLED theory. The value is adjusted pixel by pixel, but at least enough to meet the extreme needs of the future HDR image signal for the adjustment interval.
  • the LCD panel with Mini LED backlight design has better color rendering, but the thickness can be the same as OLED.
  • the Local Dimming design can achieve a high dynamic range (HDR) screen effect, showing a more detailed screen, not only with OLED
  • the thickness is the same, and the color rendering is better than OLED.
  • Mini LED technology plays an important role in the implementation of high dynamic range image sensors and full screens.
  • the Hotspot and the surrounding light leakage are all difficult to solve.
  • the frame requirements of the small-sized module are getting narrower and narrower, and the thickness requirement is getting thinner and thinner.
  • the Mini LED can not be protected by light leakage by surrounding the wall, nor can it be added like a large-sized module to change the light type to solve the problem. Hotspot, which causes problems such as light shadows and light leakage around small-sized modules, is more difficult to solve, and it is an obstacle to the application of Mini LEDs.
  • the present invention provides a method for fabricating a Mini LED backlight module and a fluorescent film layer, which can effectively solve the problem of light shadow and surrounding light leakage in the process of Mini LED backlighting, which is simple and easy, and reduces production cost.
  • a Mini LED backlight module comprising an LED light source and a fluorescent film layer, the LED light source comprising a substrate and a mini LED lamp bead arranged on the substrate, wherein the fluorescent film layer is disposed in a light emitting direction of the LED light source
  • the fluorescent film layer is provided with an array of grooves toward the surface of the mini LED lamp bead.
  • the number of the grooves is not less than the number of the mini LED bead, and each of the mini LED bead is opposite to at least one of the grooves.
  • the grooves have a radial dimension that is not less than a radial dimension of the mini LED bead with which they are facing, each of the mini LED bead being facing the one of the grooves.
  • the recess has a radial dimension that is less than a radial dimension of the mini LED bead with which it is facing, each of the mini LED bead being contiguous with a plurality of the grooves.
  • the bottom surface of the groove is a concave curved surface.
  • the fluorescent film layer further includes a plurality of spaced apart protrusions disposed along an edge thereof, the protrusions and the grooves being respectively disposed on opposite surfaces of the fluorescent film layer.
  • the Mini LED backlight module further includes a diffusion film, and an edge of the bottom surface of the diffusion film is in close contact with the surface of the stud.
  • the Mini LED backlight module further includes a light shielding glue adhered to an edge of the upper surface of the diffusion film and extended to be attached to the side of the protrusion and the same The bottom surface of the substrate.
  • Another object of the present invention is to provide a method for fabricating a fluorescent film layer, comprising:
  • the mold Coating a fluorescent material in the mold, the mold comprising a cavity surrounded by a bottom wall and a side wall, the bottom wall being arranged in an array with a plurality of protrusions;
  • the formed fluorescent material is peeled off from the mold to obtain a fluorescent film layer having grooves arranged in an array.
  • the mold further includes a cylindrical body portion disposed on an outer edge of the bottom wall, and when the fluorescent material is coated in the mold, the method further includes filling the cylindrical portion with a fluorescent material.
  • the invention solves the problem of light shadow and surrounding light leakage in the process of Mini LED backlight by designing a fluorescent film layer with a specific shape and placing it in front of the mini LED lamp bead to avoid light leakage and changing the light path. Simple and easy to implement, and reduce production costs.
  • FIG. 1 is a schematic structural diagram of a display device according to an embodiment of the present invention.
  • FIG. 2 is a schematic structural view of a fluorescent film layer according to an embodiment of the present invention.
  • FIG. 3 is a schematic view showing an application state of another fluorescent film layer according to an embodiment of the present invention.
  • FIG. 4 is a schematic view showing a method of fabricating a fluorescent film layer according to an embodiment of the present invention.
  • FIG. 5 is a schematic top plan view of a mold according to an embodiment of the present invention.
  • Figure 6 is a cross-sectional view of a mold in accordance with an embodiment of the present invention.
  • a Mini LED backlight module of an embodiment of the present invention includes an LED light source 10 and a fluorescent film layer 20 .
  • the LED light source 10 includes a substrate 11 and a plurality of mini LED lamp beads 12 arranged in the substrate 11 , and the size is about 100. Micron Mini LEDs do not need to overcome the technical threshold of massive transfer, and their mass production is feasible. It can be applied to backlights of large-size displays (such as TVs), and can also be used as backlights for small-sized displays (such as mobile phones). .
  • the fluorescent film layer 20 is disposed in the light emitting direction of the LED light source 10, and the fluorescent film layer 20 is provided with an array of grooves 200 facing the surface of the mini LED lamp bead 12.
  • the bottom surface of the groove 200 of the embodiment is a concave curved surface.
  • the groove 200 can also have other shapes, for example, a tapered cross section, but it can better promote the uniformity of illumination of the mini LED bead 12.
  • the number of the grooves 200 is not less than the number of the mini LED bead 12, and each of the mini LED bead 12 is opposite to the at least one groove 200. 1 and 2, in the case where the number of the grooves 200 is equal to the number of the mini LED bead 12, each of the mini LED bead 12 faces a groove 200, and the radial dimension of the groove 200 is not less than The radial dimension of the pair of mini LED beads 12, further, the radial dimension of the recess 200 is greater than the radial dimension of the opposite mini LED bead 12, the mini LED bead 12 is partially embedded in the recess 200 In the groove 200, most of the light emitted from the mini LED lamp bead 12 is processed by the groove 200 and enters the fluorescent film layer 20, which has better divergence performance and more uniform illumination, and can also reduce the thickness of the direct-type backlight. thickness.
  • each mini LED bead 12 is directly opposite the plurality of recesses 200, from a mini
  • the light emitted from the LED lamp bead 12 is diverged by the plurality of minute grooves 200 and then enters the fluorescent film layer 20, so that the light of the fluorescent film layer 20 is almost uniform, and the uniform light performance is better.
  • the fluorescent film layer 20 further includes a plurality of spaced apart studs 21 disposed along the edges thereof.
  • the studs 21 and the recesses 200 are respectively disposed on opposite surfaces of the phosphor film layer 20, and the studs 21 are respectively provided.
  • the groove 200 is enclosed therein.
  • the Mini LED backlight module further includes a diffusion film 30 and a light shielding adhesive 40.
  • the edge of the bottom surface of the diffusion film 30 is closely attached to the surface of the protrusion 21, and the diffusion film 30 is fixed by the protrusions 21 around the fluorescent film layer 20, and simultaneously
  • the light-shielding glue 40 is adhered to the edge of the upper surface of the diffusion film 30 and extends to the side surface of the pillar 21 and the bottom surface of the substrate 11 at the same time, thereby avoiding light leakage at the edge and the side of the backlight module.
  • the edge of the substrate 11 of the LED light source 10 is designed with a registration mark.
  • the outline and alignment mark of the fluorescent film layer 20 are utilized. The alignment is sufficient, and then the diffusion film 30 is fixed on the fluorescent film layer 20 by the light shielding adhesive 40.
  • the backlight module may further include an upper brightness enhancement sheet L1 and a lower brightness enhancement sheet L2.
  • the upper brightness enhancement sheet L1 and the lower brightness enhancement sheet L2 are disposed in front of the diffusion film 30 from top to bottom, and the lower brightness enhancement sheet L2 and the diffusion film 30 will be The shading adhesive 40 is sandwiched therein.
  • the present invention also provides a method for fabricating a fluorescent film layer, which mainly comprises:
  • the mold 1 includes a cavity 1a surrounded by a bottom wall and a side wall, and the bottom wall is provided with a plurality of protrusions 1b, the bottom of the mold 1
  • the outer wall of the wall further has a ring body portion 1c, and the fluorescent material is coated in the cavity 1a to cover all the protrusions 1b, and is also filled in the barrel portion 1c;
  • the fluorescent material and the mold are placed in the curing cavity to shape the fluorescent material, and the temperature in the curing cavity is 60-90 ° C, and the fluorescent material in the bottom wall of the mold 1 and the fluorescent material in the cylindrical portion 1c are simultaneously aged;
  • the cylindrical portion 1c has a rectangular cross section, and the finally formed protruding post 21 has a square cylindrical shape, so that the support can be reliably supported, and the fixing and fixing of the light shielding adhesive 40 can be facilitated.
  • the invention solves the problem of light shadow and surrounding light leakage in the process of Mini LED backlight by designing a fluorescent film layer having a specific shape and placing it in front of the mini LED lamp bead, thereby avoiding light leakage at the edge and changing the light path.
  • the invention is simple and easy to implement, and the manufacturing cost is reduced.
  • the backlight module of the present invention can also achieve compactness and thinness of the structure, and can realize side leakage by a simple structure.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Optics & Photonics (AREA)
  • Nonlinear Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Mathematical Physics (AREA)
  • Planar Illumination Modules (AREA)
  • Liquid Crystal (AREA)

Abstract

一种Mini LED背光模组，包括LED光源（10）和荧光膜层（20），LED光源（10）包括基板（11）和阵列排布在基板（11）的mini LED灯珠（12），荧光膜层（20）设置在LED光源（10）的出光方向上，荧光膜层（20）朝向mini LED灯珠（12）的表面开设有阵列设置的凹槽（200）。还公开了一种荧光膜层（20）的制作方法。通过设计一种具有特定形状的荧光膜层（20），并将其放置在mini LED灯珠（12）正前方，可避免漏光并改变光线路径，从而解决了Mini LED背光过程中的灯影和四周漏光的问题，简单易行，降低了制作成本。

Description

Mini LED背光模组及荧光膜层的制作方法 技术领域
本发明涉及一种显示技术领域，尤其涉及一种Mini LED背光模组及荧光膜层的制作方法。
背景技术
Mini LED是把直下式LED背光模块缩小化，使面板色彩非常好，对比非常高。Mini LED与Micro LED是完全不同的制程技术，Mini LED是放在背光模块中，可能只要七千颗，但Micro LED是显示器，是直接放在画素(pixel)上，可能高达六百万颗，这时良率就变得很重要，Micro LED的应用将是非常大的挑战。Mini LED把侧边背光源几十颗的LED灯珠，变成了直下背光源数千颗、数万颗，甚至更多的灯珠，其HDR精细度达到前所未有水平——虽然不像OLED理论值的逐像素调节，但是至少足以满足未来HDR影像信号对调节区间的极致需要。此外采用Mini LED背光设计的LCD面板拥有更好的衍色性，但厚度可以做到跟OLED一样。
尽管单颗Mini LED尺寸较小，但由于采取直下式背光，将可透过Local Dimming(局部调光)设计达到高动态范围(HDR)的屏幕效果，呈现更细致的屏幕画面，不仅与OLED的厚度一样，且演色性比OLED好。
Mini LED技术对于高动态范围图像传感器以及全面屏的实现起到了重要作用，但目前该技术在实现全面屏的过程中，灯影(Hotspot)和四周漏光等都是很难解决的问题。而且小尺寸模组的边框要求越来越窄，且其厚度要求越来越薄，Mini LED既不能靠四周加挡墙来防漏光，也不能像大尺寸模组一样增加lens改变光型来解决Hotspot，导致小尺寸模组的灯影和四周漏光等问题更难解决，对于Mini LED的应用带来障碍。
发明内容
鉴于现有技术存在的不足，本发明提供了一种Mini LED背光模组及荧光膜层的制作方法，可以有效解决Mini LED背光过程中的灯影和四周漏光的问题， 简单易行，且降低了制作成本。
为了实现上述的目的，本发明采用了如下的技术方案：
一种Mini LED背光模组，包括LED光源和荧光膜层，所述LED光源包括基板和阵列排布在所述基板的mini LED灯珠，所述荧光膜层设置在所述LED光源的出光方向上，所述荧光膜层朝向所述mini LED灯珠的表面开设有阵列设置的凹槽。
作为其中一种实施方式，所述凹槽的数量不少于所述mini LED灯珠的数量，且每个所述mini LED灯珠与至少一个所述凹槽正对。
作为其中一种实施方式，所述凹槽的径向尺寸不小于与其正对的所述mini LED灯珠的径向尺寸，每个所述mini LED灯珠与一个所述凹槽正对。
或者，所述凹槽的径向尺寸小于与其正对的所述mini LED灯珠的径向尺寸，每个所述mini LED灯珠与多个所述凹槽正对。
作为其中一种实施方式，所述凹槽的底面为凹陷的弧面。
作为其中一种实施方式，所述荧光膜层还包括沿其边缘布置的一圈间隔设置的凸柱，所述凸柱与所述凹槽分别设于所述荧光膜层的两相对表面。
作为其中一种实施方式，所述的Mini LED背光模组还包括扩散膜，所述扩散膜底面的边缘紧贴在所述凸柱的表面。
作为其中一种实施方式，所述的Mini LED背光模组还包括遮光胶，所述遮光胶粘贴在所述扩散膜上表面的边缘，并延伸至同时贴附在所述凸柱侧面以及所述基板的底面。
本发明的另一目的在于提供一种荧光膜层的制作方法，包括：
在模具内涂布荧光材料，所述模具包括底壁和侧壁围成的腔体，所述底壁阵列地设置有若干凸起；
将荧光材料连同模具放入固化腔内，使所述荧光材料老化成型；
从所述模具剥离成型后的所述荧光材料，得到表面具有阵列设置的凹槽的荧光膜层。
作为其中一种实施方式，所述模具还包括设置在所述底壁外沿的一圈筒体部，在模具内涂布荧光材料时，还包括在所述筒体部内填充荧光材料。
本发明通过设计一种具有特定形状的荧光膜层，并将其放置在mini LED灯珠正前方，即可避免漏光并改变光线路径，从而解决了Mini LED背光过程中的灯影和四周漏光的问题，简单易行，且降低了制作成本。
附图说明
图1为本发明实施例的显示装置的结构示意图；
图2为本发明实施例的一种荧光膜层的结构示意图；
图3为本发明实施例的另一种荧光膜层的应用状态示意图；
图4为本发明实施例的荧光膜层的制作方法示意图；
图5为本发明实施例的模具的俯视结构示意图；
图6为本发明实施例的模具的一个剖面图。
具体实施方式
为了使本发明的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本发明进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
参阅图1，本发明实施例的Mini LED背光模组包括LED光源10和荧光膜层20，LED光源10包括基板11和阵列排布在基板11的若干mini LED灯珠12，由于尺寸约在100微米的Mini LED无需克服巨量转移的技术门槛，其量产具有可行性，可应用在大尺寸显示屏的背光(如电视)中，也可以作为小尺寸显示屏(如手机等)的背光应用。荧光膜层20设置在LED光源10的出光方向上，荧光膜层20朝向mini LED灯珠12的表面开设有阵列设置的凹槽200。
如图2所示，其中，本实施例的凹槽200的底面为凹陷的弧面，例如，仅凹槽200的底面为弧面，或者，凹槽的截面为弧面。可以理解的是，在其他实施方式中，凹槽200也可以为其它形状，例如，呈锥形截面，但其对于mini LED灯珠12的发光均匀性能够起到更好的促进作用。
需要注意的是，凹槽200的数量不少于mini LED灯珠12的数量，且每个mini LED灯珠12与至少一个凹槽200正对。如图1和图2，为凹槽200的数量等于mini LED灯珠12的数量的情形，每个mini LED灯珠12与一个凹槽200正对，凹槽200的径向尺寸不小于与其正对的mini LED灯珠12的径向尺寸， 进一步地，凹槽200的径向尺寸大于与其正对的mini LED灯珠12的径向尺寸，mini LED灯珠12部分嵌入凹槽200正对的凹槽200内，使得自mini LED灯珠12发出的绝大部分光线均由凹槽200处理后进入荧光膜层20，发散性能更好，发光更均匀，同时还能减薄直下式背光源的厚度。
如图3所示，为凹槽200的径向尺寸小于与其正对的mini LED灯珠12的径向尺寸的情形，每个mini LED灯珠12与多个凹槽200正对，自一个mini LED灯珠12射出的光线，分别经多个微小的凹槽200发散处理后进入荧光膜层20，使得荧光膜层20各处的光线几乎一致，匀光性能更好。
除了具有凹槽200外，荧光膜层20还包括沿其边缘布置的一圈间隔设置的凸柱21，凸柱21与凹槽200分别设于荧光膜层20的两相对表面，且凸柱21将凹槽200包围于其中。此外，Mini LED背光模组还包括扩散膜30合遮光胶40，扩散膜30底面的边缘紧贴在凸柱21的表面，通过荧光膜层20四周的凸柱21对扩散膜30进行固定，同时，遮光胶40粘贴在扩散膜30上表面的边缘，并延伸至同时贴附在凸柱21侧面以及基板11的底面，避免了背光模组的边缘及侧面漏光。
为实现荧光膜层20与LED光源10的对位设置，LED光源10的基板11边缘设计有对位mark(标记)，在组装荧光膜层20时，利用荧光膜层20的轮廓与对位mark对齐即可，然后再将扩散膜30通过遮光胶40固定在荧光膜层20上。
结合图1，背光模组还可包括上增光片L1、下增光片L2，上增光片L1、下增光片L2自上而下依次设于扩散膜30前方，下增光片L2与扩散膜30将遮光胶40夹设于其中。当背光模组与显示面板P组装后，显示面板P位于上增光片L1的前方，自mini LED灯珠12发出的光依次经荧光膜层20、下增光片L2、上增光片L1后，自显示面板P底部进入，从而为显示面板P提供背光源。
如图4所示，本发明还提供了一种荧光膜层的制作方法，主要包括：
S01、在模具1内涂布荧光材料，如图5和图6所示，模具1包括底壁和侧壁围成的腔体1a，底壁阵列地设置有若干凸起1b，模具1的底壁外沿还具有一圈筒体部1c，荧光材料涂布在腔体1a内覆盖所有的凸起1b的同时，还填充在筒体部1c内；
S02、将荧光材料连同模具放入固化腔内，使荧光材料老化成型，固化腔内的温度为60-90℃，模具1底壁的荧光材料和筒体部1c内的荧光材料同步进行 老化；
S03、从模具剥离成型后的荧光材料，得到表面具有阵列设置的凹槽200的荧光膜层20，与此同时，凹槽200外围还形成一圈凸柱21，可用作支撑固定扩散膜30。其中，筒体部1c的截面为矩形，最终制作出的凸柱21相应地位方形柱体，即可实现可靠地支撑，也能方便遮光胶40的贴附固定。
本发明通过设计种具有特定形状的荧光膜层，并将其放置在mini LED灯珠正前方，可以避免边缘漏光并改变光线路径，从而解决了Mini LED背光过程中的灯影和四周漏光的问题，简单易行，且降低了制作成本，本发明的背光模组还能实现结构的紧凑性和薄型化，并能利用简单的结构实现侧面漏光。
以上所述仅是本申请的具体实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本申请原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本申请的保护范围。

Claims (20)

  1. 一种Mini LED背光模组，其中，包括LED光源和荧光膜层，所述LED光源包括基板和阵列排布在所述基板的mini LED灯珠，所述荧光膜层设置在所述LED光源的出光方向上，所述荧光膜层朝向所述mini LED灯珠的表面开设有阵列设置的凹槽。
  2. 根据权利要求1所述的Mini LED背光模组，其中，所述凹槽的底面为凹陷的弧面。
  3. 根据权利要求2所述的Mini LED背光模组，其中，所述荧光膜层还包括沿其边缘布置的一圈间隔设置的凸柱，所述凸柱与所述凹槽分别设于所述荧光膜层的两相对表面。
  4. 根据权利要求3所述的Mini LED背光模组，其中，还包括扩散膜，所述扩散膜底面的边缘紧贴在所述凸柱的表面。
  5. 根据权利要求4所述的Mini LED背光模组，其中，还包括遮光胶，所述遮光胶粘贴在所述扩散膜上表面的边缘，并延伸至同时贴附在所述凸柱侧面以及所述基板的底面。
  6. 根据权利要求1所述的Mini LED背光模组，其中，所述凹槽的数量不少于所述mini LED灯珠的数量，且每个所述mini LED灯珠与至少一个所述凹槽正对。
  7. 根据权利要求6所述的Mini LED背光模组，其中，所述凹槽的底面为凹陷的弧面。
  8. 根据权利要求7所述的Mini LED背光模组，其中，所述荧光膜层还包括沿其边缘布置的一圈间隔设置的凸柱，所述凸柱与所述凹槽分别设于所述荧光膜层的两相对表面。
  9. 根据权利要求8所述的Mini LED背光模组，其中，还包括扩散膜，所述扩散膜底面的边缘紧贴在所述凸柱的表面。
  10. 根据权利要求9所述的Mini LED背光模组，其中，还包括遮光胶，所述遮光胶粘贴在所述扩散膜上表面的边缘，并延伸至同时贴附在所述凸柱侧面以及所述基板的底面。
  11. 根据权利要求6所述的Mini LED背光模组，其中，所述凹槽的径向尺寸不小于与其正对的所述mini LED灯珠的径向尺寸，每个所述mini LED灯珠与一个所述凹槽正对。
  12. 根据权利要求11所述的Mini LED背光模组，其中，所述凹槽的底面为凹陷的弧面。
  13. 根据权利要求12所述的Mini LED背光模组，其中，所述荧光膜层还包括沿其边缘布置的一圈间隔设置的凸柱，所述凸柱与所述凹槽分别设于所述荧光膜层的两相对表面。
  14. 根据权利要求13所述的Mini LED背光模组，其中，还包括扩散膜，所述扩散膜底面的边缘紧贴在所述凸柱的表面。
  15. 根据权利要求14所述的Mini LED背光模组，其中，还包括遮光胶，所述遮光胶粘贴在所述扩散膜上表面的边缘，并延伸至同时贴附在所述凸柱侧面以及所述基板的底面。
  16. 根据权利要求6所述的Mini LED背光模组，其中，所述凹槽的径向尺寸小于与其正对的所述mini LED灯珠的径向尺寸，每个所述mini LED灯珠与多个所述凹槽正对。
  17. 根据权利要求16所述的Mini LED背光模组，其中，还包括扩散膜和遮光胶，所述凹槽的底面为凹陷的弧面，所述荧光膜层还包括沿其边缘布置的一圈间隔设置的凸柱，所述凸柱与所述凹槽分别设于所述荧光膜层的两相对表面，所述扩散膜底面的边缘紧贴在所述凸柱的表面，所述遮光胶粘贴在所述扩散膜上表面的边缘，并延伸至同时贴附在所述凸柱侧面以及所述基板的底面。
  18. 一种荧光膜层的制作方法，其中，包括：
    在模具内涂布荧光材料，所述模具包括底壁和侧壁围成的腔体，所述底壁阵列地设置有若干凸起；
    将荧光材料连同模具放入固化腔内，使所述荧光材料老化成型；
    从所述模具剥离成型后的所述荧光材料，得到表面具有阵列设置的凹槽的荧光膜层。
  19. 根据权利要求18所述的荧光膜层的制作方法，其中，所述模具还包括设置在所述底壁外沿的一圈筒体部，在模具内涂布荧光材料时，还包括在所述 筒体部内填充荧光材料。
  20. 根据权利要求18所述的荧光膜层的制作方法，其中，所述固化腔内的温度为60-90℃。
PCT/CN2018/084179 2018-03-28 2018-04-24 Mini LED背光模组及荧光膜层的制作方法 WO2019184036A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US16/069,303 US10859240B2 (en) 2018-03-28 2018-04-24 Mini light emitting diode backlight module and manufacturing method of fluorescent film layer

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201810265118.5A CN108488693A (zh) 2018-03-28 2018-03-28 Mini LED背光模组及荧光膜层的制作方法
CN201810265118.5 2018-03-28

Publications (1)

Publication Number Publication Date
WO2019184036A1 true WO2019184036A1 (zh) 2019-10-03

Family

ID=63316537

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2018/084179 WO2019184036A1 (zh) 2018-03-28 2018-04-24 Mini LED背光模组及荧光膜层的制作方法

Country Status (3)

Country Link
US (1) US10859240B2 (zh)
CN (1) CN108488693A (zh)
WO (1) WO2019184036A1 (zh)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109061945B (zh) * 2018-08-23 2021-09-17 厦门天马微电子有限公司 背光模组和显示装置
CN109367869B (zh) * 2018-10-24 2021-06-01 佛山市佳世达薄膜科技有限公司 一种荧光保护膜
CN109445180B (zh) * 2018-10-31 2022-06-10 厦门天马微电子有限公司 一种背光模组及显示装置
CN109358450B (zh) * 2018-11-28 2023-12-01 武汉华星光电技术有限公司 薄型背光模组及其制作方法
KR102664002B1 (ko) * 2019-11-29 2024-05-08 엘지디스플레이 주식회사 백라이트 유닛 및 그를 포함하는 표시장치
KR20210098708A (ko) 2020-02-03 2021-08-11 삼성전자주식회사 디스플레이 장치
CN111901968B (zh) * 2020-07-29 2021-08-24 厦门爱谱生电子科技有限公司 一种Micro LED柔性电路板制作方法
CN112289896B (zh) * 2020-09-11 2022-08-05 罗化芯显示科技开发(江苏)有限公司 一种集成RGB三色光的单颗mini led的制作方法
CN113053940B (zh) * 2021-03-02 2022-07-12 Tcl华星光电技术有限公司 一种Mini LED背光板的制作方法及Mini LED背光板
CN113138493B (zh) * 2021-04-07 2022-09-27 武汉华星光电技术有限公司 背光模组及其制作方法
EP4250000A1 (en) 2021-06-09 2023-09-27 Samsung Electronics Co., Ltd. Display device
CN114613268B (zh) * 2022-03-09 2024-01-23 深圳市南极光电子科技股份有限公司 一种背光光源、背光模组及显示器
CN114879408B (zh) * 2022-05-25 2023-05-02 厦门天马微电子有限公司 背光模组和显示模组

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202101059U (zh) * 2011-05-16 2012-01-04 深圳市华星光电技术有限公司 背光模块及显示装置
CN203273509U (zh) * 2013-03-29 2013-11-06 苏州东山精密制造股份有限公司 一种直下式背光模组
CN103676315A (zh) * 2013-12-06 2014-03-26 京东方科技集团股份有限公司 一种导光板、背光源及液晶显示装置
CN104006334A (zh) * 2014-05-20 2014-08-27 京东方科技集团股份有限公司 一种背光模组及显示装置
CN107422529A (zh) * 2017-08-04 2017-12-01 纳晶科技股份有限公司 背光单元及包括其的显示装置
CN107784968A (zh) * 2017-11-06 2018-03-09 武汉华星光电技术有限公司 背光检测电路及相关产品

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002042738A (ja) * 2000-07-26 2002-02-08 Nec Kansai Ltd 平面型発光素子
KR101002279B1 (ko) * 2004-02-05 2010-12-20 삼성에스디아이 주식회사 전계 방출형 백라이트 소자용 패널 및 그 제조방법
CN101649975A (zh) * 2008-08-13 2010-02-17 先进开发光电股份有限公司 背光模块
KR101039957B1 (ko) * 2008-11-18 2011-06-09 엘지이노텍 주식회사 발광 장치 및 이를 구비한 디스플레이 장치
CN201621532U (zh) * 2010-02-10 2010-11-03 深圳帝光电子有限公司 直下式超薄led背光模组
CN201757335U (zh) * 2010-07-28 2011-03-09 创维液晶器件(深圳)有限公司 一种led背光模组、液晶显示器及显示终端
US20120153311A1 (en) * 2010-12-17 2012-06-21 Intematix Corporation Low-cost solid-state based light emitting devices with photoluminescent wavelength conversion and their method of manufacture
DE102011112710A1 (de) * 2011-09-07 2013-03-07 Osram Ag Beleuchtungsvorrichtung
US20130187540A1 (en) * 2012-01-24 2013-07-25 Michael A. Tischler Discrete phosphor chips for light-emitting devices and related methods
CN102565921A (zh) * 2012-02-16 2012-07-11 深圳市华星光电技术有限公司 一种导光板、背光模组及液晶显示装置
CN102829392A (zh) * 2012-07-26 2012-12-19 深圳市华星光电技术有限公司 背光模块及显示装置
CN103244872B (zh) * 2013-05-10 2015-07-22 晶科电子（广州）有限公司 一种无透镜的超薄直下式背光模组
US9572305B2 (en) * 2014-06-10 2017-02-21 National Central University Phosphor diffusion sheet luminaire for agricultural lighting
CN105259700A (zh) * 2015-10-27 2016-01-20 深圳市华星光电技术有限公司 液晶显示装置及电子设备
CN106226949B (zh) * 2016-07-28 2020-11-10 京东方科技集团股份有限公司 扩散板及其制造方法、背光模组、显示装置
CN206411377U (zh) * 2016-12-28 2017-08-15 合肥惠科金扬科技有限公司 直下式量子点背光模组及显示器
CN206450928U (zh) * 2017-01-24 2017-08-29 北京中电中天电子工程有限公司 一种显示装置
CN206863415U (zh) * 2017-06-16 2018-01-09 深圳Tcl新技术有限公司 背光模组及显示装置
CN107092051A (zh) * 2017-06-20 2017-08-25 合肥惠科金扬科技有限公司 导光板、背光模组及显示设备
CN107403861B (zh) * 2017-07-31 2019-03-26 深圳市华星光电技术有限公司 发光二极管、背光模组及发光二极管的制备方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202101059U (zh) * 2011-05-16 2012-01-04 深圳市华星光电技术有限公司 背光模块及显示装置
CN203273509U (zh) * 2013-03-29 2013-11-06 苏州东山精密制造股份有限公司 一种直下式背光模组
CN103676315A (zh) * 2013-12-06 2014-03-26 京东方科技集团股份有限公司 一种导光板、背光源及液晶显示装置
CN104006334A (zh) * 2014-05-20 2014-08-27 京东方科技集团股份有限公司 一种背光模组及显示装置
CN107422529A (zh) * 2017-08-04 2017-12-01 纳晶科技股份有限公司 背光单元及包括其的显示装置
CN107784968A (zh) * 2017-11-06 2018-03-09 武汉华星光电技术有限公司 背光检测电路及相关产品

Also Published As

Publication number Publication date
CN108488693A (zh) 2018-09-04
US10859240B2 (en) 2020-12-08
US20200355348A1 (en) 2020-11-12

Similar Documents

Publication Publication Date Title
WO2019184036A1 (zh) Mini LED背光模组及荧光膜层的制作方法
US10078158B2 (en) Manufacturing display panels with integrated micro lens array
TWI714990B (zh) 顯示裝置
US9823522B2 (en) COA type liquid crystal display panel and method for manufacturing the same
US9638969B2 (en) Liquid crystal display (LCD) panel, manufacturing method thereof and display device
WO2018227958A1 (zh) 掩膜板模组、膜层的制作方法及有机电致发光显示面板的制作方法
TW202209279A (zh) 顯示裝置
WO2020019421A1 (zh) Led背光装置及led显示装置
US20190086715A1 (en) Display substrate, display panel and display device
US10741796B2 (en) Light-emitting panel capable of emitting uniform light and method for manufacturing the same
EP3088947B1 (en) Display device
US9612474B2 (en) Backlight assembly and display device including the same
US20190219853A1 (en) Coa substrate, manufacturing method therefor, display panel, and display device
US10783825B2 (en) Driving substrates and display panels
WO2016187987A1 (zh) 一种显示面板及其制作方法、显示装置
US11494014B2 (en) Touch panel, touch display device, and fabrication method thereof
CN102023400A (zh) 液晶显示器件
CN106990603B (zh) 显示面板及其应用的显示装置
EP4170721A1 (en) Display panel and manufacturing method therefor
US20180341145A1 (en) Method for manufacturing an organic functional layer in a display panel
WO2018120506A1 (zh) 液晶显示面板及其制造方法
TWI391026B (zh) 雙面顯示裝置及其製造方法
KR102088872B1 (ko) 백라이트 유닛 및 이를 구비한 액정표시장치
WO2021114525A1 (zh) 显示面板及显示装置
WO2019085062A1 (zh) 液晶面板及其制作方法、液晶显示装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18912866

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18912866

Country of ref document: EP

Kind code of ref document: A1