WO2019172707A1 - Dispositif de test et dispositif de transfert de del - Google Patents

Dispositif de test et dispositif de transfert de del Download PDF

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Publication number
WO2019172707A1
WO2019172707A1 PCT/KR2019/002728 KR2019002728W WO2019172707A1 WO 2019172707 A1 WO2019172707 A1 WO 2019172707A1 KR 2019002728 W KR2019002728 W KR 2019002728W WO 2019172707 A1 WO2019172707 A1 WO 2019172707A1
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WIPO (PCT)
Prior art keywords
led
unit
layer
positive electrode
micro led
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PCT/KR2019/002728
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English (en)
Korean (ko)
Inventor
박두진
장필국
Original Assignee
주식회사 나노엑스
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Priority claimed from KR1020180170590A external-priority patent/KR102386932B1/ko
Application filed by 주식회사 나노엑스 filed Critical 주식회사 나노엑스
Publication of WO2019172707A1 publication Critical patent/WO2019172707A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof

Definitions

  • the present invention relates to an LED inspection device and a transfer device. More specifically, the present invention relates to an inspection apparatus for inspecting whether the micro LED chip formed on the wafer is in normal operation and a transfer device for selecting and transferring only the normal operation micro LED by the normal operation inspection.
  • Micro LEDs ranging in size from several to tens of micrometers, can be widely used in optical applications that require low power, miniaturization, and light weight.
  • the process of screening and inspecting whether the product is electrically good is necessary, the size of the micro LED is very small, there is no proper transfer and inspection method, In this method, the problem of cracking or breaking, or the cost increase due to manual labor is caused.
  • the wafer is transferred to the target substrate without inspecting the electrical good state of the plurality of micro LEDs directly from the wafer, there is a problem that the target substrate itself may be defective when a defect of the micro LED occurs later on the target substrate.
  • the conventional method is a method of transferring only one micro LED chip, there is a problem that the transfer time is long and the mass production cost increases due to the large number of repetitions of the transfer.
  • Prior art documents include Korean Patent No. 10-1183978 (Prior Document 1) and Korean Patent No. 10-1585818 (Prior Document 2).
  • Prior Art 1 relates to a jig unit for fixing an LED chip to inspect a single LED chip, and according to the prior art as in Prior Art 1, it is cumbersome and time-consuming since the LEDs must be inspected separately one by one. There is a micro LED is very small and weak, so it is impossible to check as in the prior art.
  • Prior art 2 has a problem that can not distinguish the chip.
  • Prior art 2 relates to a micro element transfer method, which can pick up a micro element with a current applied to a transfer head, but it is impossible to inspect the micro element. There is a problem that it is necessary.
  • the conventional LED inspection apparatus and the transfer apparatus cannot be applied in the case of micro LEDs which are downsized to several micro units in size, thereby inspecting the quality of the micro LEDs on the wafer with high precision, and selecting and transferring only the normal operating micro LEDs. Since the development of the technology is required, the present invention proposes a technology for conducting a good product inspection on a wafer before the transfer of the micro LEDs and simultaneously transferring only the micro LEDs determined as good products.
  • the technical problem of the present invention is to determine the LED of the good product on the wafer.
  • the present invention provides an LED inspection apparatus that is capable of determining a normal operating state of an LED separated on a wafer and mounted on a substrate.
  • the present invention also provides an LED inspection apparatus capable of simultaneously checking whether a plurality of LEDs listed on a wafer are normally operated.
  • the present invention provides an LED inspection apparatus and a transfer apparatus having a buffer layer that can inspect and transfer the LED without damaging the LED.
  • an LED transfer device for selectively transferring only the LEDs identified as good products and at the same time to determine the LEDs of good products in normal operation.
  • the LED inspection apparatus of the present invention is characterized in that it comprises two or more prober (Prober), the inspection unit for checking whether the LED is operating normally by contacting and energizing the electrode of the LED.
  • the two or more prober parts may be arranged in parallel in a plurality of horizontal and vertical matrices so as to correspond to the arrangement of the LEDs on the wafer, and may be provided in a circuit layer made of a soft material.
  • the upper surface of the circuit layer is characterized in that it further comprises a buffer layer provided with the same material as the circuit layer.
  • the LED transfer device of the present invention includes a pick-up unit for picking up the LED, a check unit for checking whether the LED is operating normally by contacting and energizing the electrode of the LED, the pick-up unit LED checked by the normal operation in the check unit It is characterized in that it selectively picks up only the LED checked only or abnormal operation.
  • the cost for the inspection of the LED is reduced, and only the LEDs of the normal state are determined and then transferred, so that no separate determination process is required, and only the LEDs of the good products can be selected and arranged quickly.
  • FIG. 1 is a perspective view showing an LED inspection apparatus of an embodiment of the present invention.
  • FIG. 2 is an enlarged perspective view of a portion of a wafer of one embodiment of the present invention.
  • FIG. 3 is a cross-sectional view showing an LED inspection apparatus of an embodiment of the present invention.
  • FIG. 4 is a cross-sectional view showing an inspection state of the LED inspection apparatus of an embodiment of the present invention.
  • FIG. 5 is a cross-sectional view showing an inspection state of the LED inspection apparatus of another embodiment of the present invention.
  • FIG. 6 is an exploded perspective view showing each layer of the LED inspection apparatus of an embodiment of the present invention.
  • FIG. 7 is a cross-sectional view showing an upper surface of the circuit layer according to the first embodiment.
  • FIG. 8 is a cross-sectional view illustrating a top surface of a circuit layer according to a second embodiment.
  • FIG. 9 is a cross-sectional view illustrating an upper surface of a circuit layer according to a third embodiment.
  • FIG. 10 is a cross-sectional view showing a process of aligning the auxiliary line of the LED inspection apparatus and the wafer of an embodiment of the present invention.
  • FIG. 11 is a cross-sectional view showing an LED transport apparatus of an embodiment of the present invention.
  • FIG. 13 is a perspective view illustrating a bottom surface of a first layer according to an embodiment of the present invention.
  • FIG. 14 is a perspective view showing a bottom surface of a first layer of another embodiment of the present invention.
  • 15 is a cross-sectional view showing a side of the LED transfer device of another embodiment of the present invention.
  • 16 is a cross-sectional view illustrating a top surface of a second layer according to a fourth embodiment of the present invention.
  • 17 is a cross-sectional view illustrating a top surface of a second layer according to a fifth embodiment of the present invention.
  • FIG. 18 is an exploded perspective view showing each layer of a modified embodiment of the present invention.
  • 19 is a cross-sectional view illustrating an upper surface of a third layer according to a sixth embodiment of the present invention.
  • FIG. 20 is a cross-sectional view illustrating a top surface of a third layer according to a seventh embodiment of the present invention.
  • 21 and 22 are cross-sectional views showing the side of the LED transfer device of a further embodiment of the present invention.
  • 23 and 24 are exploded perspective views showing each layer of a further embodiment of the present invention.
  • 25 is a cross-sectional view showing a micro LED transfer step of an embodiment of the present invention.
  • 26 is a cross-sectional view showing a micro LED transfer step of another embodiment of the present invention.
  • Figure 27 is a cross sectional view showing a micro LED transfer step of a further embodiment of the present invention.
  • the present invention is an LED inspection device including two or more prober (Prober), characterized in that the inspection unit is included in the prober.
  • the inspection unit checks whether the LED operates normally by contacting and energizing the LED electrode.
  • the micro LED 10 described below is described as the most preferred embodiment, the micro LED 10 is applied to any LED, semiconductor device that emits light when the current is supplied. This may be possible.
  • the micro LED 10 is a very small device in a few micro units, and may be most effective when the present invention is applied.
  • the micro LED 10 will be described in detail with reference to the accompanying drawings.
  • FIG. 1 is a perspective view showing an LED inspection apparatus of an embodiment of the present invention
  • Figure 2 is an enlarged perspective view of a part of the wafer of an embodiment of the present invention.
  • the LED inspection apparatus 1 of the present invention inspects whether a plurality of micro LEDs 10 manufactured on a wafer W and micro LEDs 10 separated on a wafer W operate normally.
  • the LED inspection device 1 can be vertically lowered to be in contact with the micro LED 10 to inspect whether the micro LED 10 is operating normally.
  • the LED inspection apparatus 1 may be vertically lowered to be in contact with the wafer W to simultaneously check whether two or more micro LEDs 10 manufactured on the wafer W are normally operated, and the wafer W
  • the micro LED 10 may be inspected whether the micro LED 10 is normally removed from the substrate and disposed on the target substrate or transferred to a separate substrate or a tape.
  • the LED inspection apparatus 1 includes two or more prober units 110, and each prober unit 110 may correspond to each micro LED 10.
  • a plurality of micro LEDs 10 may be arranged side by side in a plurality of matrices in a horizontal and vertical direction on a wafer W according to an embodiment of the present invention.
  • the structure of the micro LED 10 may be a horizontal structure, a vertical structure or a flip chip type structure. However, for convenience of description, the description will be made with a flip chip type structure.
  • the micro LED 10 is a PN junction semiconductor having a P pole and an N pole, and may be provided to expose the P pole and the N pole, respectively, on an upper surface thereof.
  • the P pole of the micro LED 10 will be referred to as a positive electrode 11 and the N pole as a negative electrode 12.
  • the micro LEDs 10 are arranged on the top surface of the wafer W in an array of three rows and three rows. However, this is illustrated for convenience of description and in practice, the micro LEDs 10 may be arranged in several micro units. Since the wafer W is large enough and the spacing between the wires to be described below can be ensured, billions of micro LEDs 10 may be provided on one wafer W without limitation.
  • the photodetector 400 may be further provided on a lower surface of the wafer W provided with the plurality of micro LEDs 10.
  • the photo detector 400 detects light generated by the operation of each micro LED 10 by applying a current to the micro LED 10 to determine whether each micro LED 10 operates normally. to be. A more detailed description will be made in detail with reference to FIG. 10 to be described later after describing the LED inspection device 1 in more detail.
  • FIGS. 3 to 5 is a cross-sectional view showing an LED inspection apparatus of an embodiment of the present invention
  • Figure 4 is a cross-sectional view showing the inspection state of the LED inspection apparatus of an embodiment of the present invention
  • Figure 5 is a view of the LED inspection apparatus of another embodiment of the present invention It is sectional drawing which showed the inspection state.
  • the LED inspection apparatus 1 includes a circuit layer 100 having two or more prober portions 110 on a bottom surface thereof in direct contact with a micro LED, and a buffer layer 200 provided on an upper surface of the circuit layer 100. And a protective layer 300 provided on the upper surface of the buffer layer 200.
  • Each of the two or more prober units 110 may include an inspection unit 111 and 112 for inspecting whether the micro LED 10 operates normally by contacting and energizing the electrodes 11 and 12 of the micro LED 10.
  • the inspection units 111 and 112 may be respectively provided as an anode inspection unit 111 that may contact the positive electrode 11 of the micro LED 10 and a cathode inspection unit 112 that may contact the negative electrode 12. Can be. As shown in FIG.
  • the LED inspection apparatus 1 having the two or more anode inspecting portions 111 and the cathode inspecting portion 112 protruding from the lower surface of the circuit layer 110 descends in a vertical direction to determine whether the micro LED 10 operates normally. You can check whether it is. More specifically, referring to FIG. 4, the LED inspection apparatus 1 vertically lowered toward the wafer W may be in contact with each micro LED 10 provided on the wafer W. Referring to FIG. Specifically, each of the positive electrode inspection unit 111 and the negative electrode inspection unit 112 provided in each prober unit 110 of the LED inspection device 1 of each of the micro LED 10 provided on the wafer (W) It may be in contact with the positive electrode 11 and the negative electrode 12. Referring to FIG.
  • the LED inspection apparatus 1 may be mounted on a substrate or separated from the wafer W, as well as a micro LED 10 provided on the wafer W, or may be a separate substrate or the like. It is also possible to inspect the micro LED 10 transferred to a tape or the like.
  • the LED inspection apparatus 1 according to another embodiment of the present invention includes a plurality of prober parts 110 on the positive electrode 11 and the negative electrode 12 of the micro LED 10 separated from the wafer W. One of the positive electrode inspection unit 111 and the negative electrode inspection unit 112 may be brought into contact with each other so as to check whether the micro LED 10 operates normally in a space other than the wafer W.
  • FIGS. 6 to 9 is an exploded perspective view showing each layer of the LED inspection apparatus of an embodiment of the present invention
  • Figure 7 to Figure 9 is a cross-sectional view showing the upper surface of the circuit layer according to each embodiment.
  • the LED inspection apparatus 1 may be sequentially provided as the circuit layer 100, the buffer layer 200, and the protective layer 300 as described above.
  • the circuit layer 100 may include two or more prober portions 110, and the number of prober portions 110 may correspond to a plurality of micro LEDs on the wafer W, and the number of the probe layers 110 may be billion or more. 110 may be provided.
  • an anode inspecting portion 111 and a cathode inspecting portion 112 may be provided on each of the plurality of prober portions 110 on the bottom surface of the circuit layer 100.
  • the positive electrode inspecting unit 111 and the negative electrode inspecting unit 112 are configured to contact and energize the positive electrode 11 and the negative electrode 12 of the micro LED 10, respectively.
  • each inspection unit 111, 112 is preferably provided with a conductor so that it can be energized.
  • An upper surface of the circuit layer 100 may be provided with a positive electrode wire 113 and a negative electrode wire 114 having one end electrically connected to each of the positive electrode inspection unit 111 and the negative electrode inspection unit 112 protruding from the lower surface.
  • the positive electrode wire 113 and the negative electrode wire 114 may be provided in plural to correspond to the plurality of positive electrode inspection parts 111 and the negative electrode inspection part 112, and the positive electrode wire 113 and the negative electrode wire 114 may be electrically connected. It is preferable that the separation is provided.
  • one end of the positive electrode wire 113 and the negative electrode wire 114 may be provided through the circuit layer 100 to be electrically connected to the positive electrode inspection unit 111 or the negative electrode inspection unit 112, but one end Except for the positive electrode 113 and the negative electrode 114 is preferably provided only on the upper surface so as not to contact the lower surface of the circuit layer (100).
  • the circuit layer 100 is preferably provided with a soft material so as to prevent damage of the micro and weak micro LED 10 when in contact with the micro LED (10).
  • the circuit layer 100 is made of a soft material having elasticity and restoring force, so that the upper surface of the micro LED 10 may not be damaged, such as scratches, on the upper surface of the micro LED 10 even when contacted with the micro LED 10.
  • the above-described soft material is preferably provided with a transparent material having elasticity such as UV Resin, SU-8, or PDMS (Polydimethylsiloxane).
  • the buffer layer 200 is provided to be in contact with the upper surface of the circuit layer 100 to protect the plurality of wires 113 and 114 provided on the upper surface of the circuit layer 100, and the inspection device 1 in the micro LED 10. Is a configuration that serves as a buffer to prevent damage to the micro LED 10 when the contact. That is, since the circuit layer 100 is thinly provided, the buffer layer 200 may not function properly to prevent damage to the micro LED 10. Thus, the circuit layer 100 may further include a thick buffer layer 200 to completely prevent damage to the micro LED 10. It is a structure for doing so.
  • the buffer layer 200 is preferably provided with a soft material in order to cushion the micro LED 10 so as to prevent damage to the micro LED 10 when the micro layer is in contact with the micro LED 10.
  • a transparent material having elasticity such as UV Resin, SU-8 or PDMS (Polydimethylsiloxane).
  • the protective layer 300 is configured to protect the buffer layer 200 provided with a soft material in contact with the upper surface of the buffer layer 200.
  • the protective layer 300 is configured to protect the buffer layer 200 and the circuit layer 100, and to maintain the shape of the LED inspection device 1 is preferably provided with a hard material.
  • the protective layer 300 is provided with a hard material, but is preferably provided with a transparent material so that alignment can be easily aligned through the auxiliary line AL, which will be described later.
  • the protective layer 300 is preferably made of a transparent and hard material such as transparent acrylic, sapphire, quartz or glass.
  • circuit layer 100 according to each embodiment will be described in detail with reference to FIGS. 7 to 9.
  • the circuit layer 100 may be provided in various forms as in the following embodiments, and the plurality of positive electrode wires 113 and the negative electrode wires 114 provided on the upper surface of the circuit layer 100 are imprinted. After the groove is formed on the upper surface of the circuit layer 100 by imprinting, the groove may be manufactured by a metal mesh method of filling a conductive material in the formed groove.
  • the above-described method of manufacturing the positive electrode wire 113 and the negative electrode wire 114 is only an embodiment, and any method may be used as long as it can form an electric wire.
  • the anode wires 113 and the cathode wires 114 of the circuit layer 100 according to the first embodiment may be electrically connected to one ends of the anode inspection unit 111 and the cathode inspection unit 112, respectively. Although connected, each of the wires 113 and 114 may be provided to be spaced apart from one another so as not to be electrically connected to each other. Therefore, according to the first exemplary embodiment, the same prober unit 110 may be electrically connected to the positive electrode inspecting unit 111 and the negative electrode inspecting unit 112 provided at the same prober unit 110 among the plurality of prober units 110 at the same time.
  • the anode test unit 111 and the cathode test unit 112 and the anode wire 113 and the cathode wire 114 electrically connected to each other are separately energized so that the anode test unit 111 and the cathode of the prober unit 110. It may be determined whether the micro LED 10 in contact with the inspection unit 112 operates normally.
  • FIG. 8 is a cross-sectional view illustrating a top surface of a circuit layer according to a second embodiment.
  • the plurality of positive electrode wires 113 and the negative electrode wires 114 each have a positive electrode inspection unit 111 and a negative electrode inspection unit 112. It may be electrically connected to correspond to one end of the).
  • two or more cathode wires 114 may be electrically connected to one, and the anode wires 115 may be provided to be electrically separated from each other.
  • two or more cathode wires 114 are electrically connected to one, and the cathode inspection unit 112 provided in one row or one column is electrically connected to one cathode wire. And may be connected to 114. Therefore, the negative wire 114 of one row or column electrically connected to one is connected to the negative (-) pole of the power supply, and current is sequentially supplied to the positive wire 113 separately connected to each positive electrode inspection unit 111.
  • Each of the two or more micro LEDs 10 may be sequentially applied to each other. More specifically, the cathode wires 114 electrically connected to one are grounded, and then the normal operation of two or more micro LEDs 10 may be inspected by the energization of the anode wires 113 electrically connected to each other. have.
  • FIG. 9 is a cross-sectional view illustrating an upper surface of a circuit layer according to a third embodiment.
  • the plurality of positive electrode wires 113 and the negative electrode wires 114 each have a positive electrode inspection unit 111 as in the first or second embodiment. And it may be electrically connected to correspond to one end of the negative electrode inspection unit 112.
  • two or more cathode wires 114 may be electrically connected to one, and the anode wires 115 may be provided to be electrically separated from each other.
  • two or more cathode wires 114 provided on the circuit layer 100 may be electrically connected to each other. Therefore, the cathode wires 114 electrically connected as one are connected to the negative (-) pole of the power supply, and the current is sequentially applied to the anode wires 113 separately connected to each anode check unit 111, so that at least two micros are connected.
  • Each of the LEDs 10 can be sequentially checked for normal operation. More specifically, the cathode wires 114 electrically connected to one are grounded, and then the normal operation of two or more micro LEDs 10 may be inspected by the energization of the anode wires 113 electrically connected to each other. have.
  • the circuit layer 100 of the first to third embodiments described above is just an embodiment, and the anode wires 113 may be electrically connected to each other, and the cathode wires 114 and the anode wires 113 may be formed in respective rows or Each column is electrically connected to each other, and current may be sequentially applied to the cathode wires 114 and the anode wires 113 of each matrix to check whether the micro LED 10 operates normally. In addition, the current may be simultaneously applied to the entire cathode wire 114 and the anode wire 113 to simultaneously check whether the micro LED 10 in contact with each of the inspection units 111 and 112 operates normally.
  • FIG. 10 is a cross-sectional view illustrating a process of aligning an auxiliary line and an alignment mark for alignment of a wafer with an LED inspection apparatus according to an exemplary embodiment of the present invention.
  • the auxiliary lines AL1 and AL2 corresponding to each other may be further included in the wafer W, the circuit layers 100, the buffer layers 200, and the protection layers 300.
  • the first auxiliary line AL1 having the same shape may be provided in the circuit layer 100, the buffer layer 200, and the protective layer 300 at positions corresponding to each other, and the upper surface of the wafer W may be provided.
  • the second auxiliary line AL2 having the same shape may be provided at a position corresponding to the first auxiliary line AL1.
  • the first auxiliary line AL1 may be provided only in any one of the circuit layer 100, the buffer layer 200, and the protective layer 300, but more preferably, each of the first auxiliary lines AL1 is provided in each layer. Do.
  • the circuit layer 100, the buffer layer 200, and the protective layer 300 are preferably all made of a transparent material. Accordingly, the first auxiliary line AL1 provided in each layer penetrates each other. When viewed from the top of the protective layer 300 is preferably provided so that all can be seen. Therefore, when the first auxiliary line AL1 is provided at a position corresponding to each other, when the respective layers of the LED inspection apparatus 1 are combined, there is an effect that can be combined at the correct position.
  • a second auxiliary line AL2 corresponding to the first auxiliary line AL1 is also provided on the upper surface of the wafer W, and each of the first auxiliary lines when the LED inspection apparatus 1 contacts the upper surface of the wafer W is provided.
  • the prober unit 110 and the micro LEDs 10 may be brought into contact with each other at an accurate position.
  • the positive electrode inspecting portion 111 and the negative electrode inspecting portion 112 protruding from the prober portion 110 are separated from the wafer (
  • Each of the micro LEDs 10 provided on the W) may be in contact with the correct position of the positive electrode 11 and the negative electrode 12, respectively. Therefore, it is possible to inspect the plurality of micro LEDs 10 provided on the wafer W sequentially or simultaneously.
  • the first auxiliary line AL1 and the second auxiliary line AL2 described above may be directly provided in each layer and the wafer W, or may be provided in separate sheets and disposed on an upper surface of each layer and the wafer W. It may be provided by bonding the sheet
  • the light detector 400 may be further provided on the lower surface of the wafer W as described above.
  • the photodetector 400 may be provided to contact the bottom surface of the wafer (W).
  • the light detector 400 is configured to detect light generated by the operation of the micro LED 10 and inspect the optical characteristics of the micro LED.
  • Each of the anode inspecting unit 111 and the cathode inspecting unit 112 includes a wafer (W). When a current is applied to the micro LED 10 by contacting and energizing the positive electrode 11 and the negative electrode 12 of the plurality of micro LEDs 10 provided thereon, each of the micro LEDs 10 may operate.
  • the light detector 400 detects the light emitted from each micro LED 10 through a photodiode built in the light detector 400 It is possible to determine whether the micro LED 10 of good or bad through the optical characteristics of each micro LED.
  • the LED transfer device 6 of the present invention is a device for transferring a plurality of micro LEDs 10 manufactured on the wafer W, and the LED transfer device 6 is vertically lowered to be brought into contact with the wafer W.
  • the above micro LEDs 10 can be checked and picked up simultaneously.
  • FIG. 11 is a cross-sectional view showing an LED transport apparatus of an embodiment of the present invention.
  • the LED transport device 6 is positioned on the first layer 600 and the upper surface of the first layer 600 having two or more micro LED check pickups 610 on a lower surface thereof in direct contact with the micro LEDs.
  • the second layer 700 and the third layer 800 positioned on the upper surface of the second layer 700 are included.
  • the LED transfer device 6 includes a first layer 600 having two or more micro LED check pickups 610 on a bottom surface in contact with an upper surface of the micro LED 10.
  • the first layer 600 includes two or more micro LED check pickups 610.
  • the micro LED check pickup unit 610 checks whether the micro LED 10 operates normally and simultaneously grips and picks it up in order to lift the micro LED 10 in a vertical direction. It is preferable to be provided to correspond to the number.
  • the micro LED check pick-up unit 610 may be arranged side by side in the horizontal and vertical directions to correspond to the arrangement of the micro LED 10 on the wafer (W).
  • the micro LED check pickup unit 610 may be arranged side by side in a plurality of matrices in the horizontal and vertical directions.
  • the plurality of micro LEDs 10 are named in order of the first micro LED 10, the second micro LED 10, and the third micro LED 10 according to the position order of the matrix. can do.
  • Figure 12 for convenience of description is arranged in three horizontal and three vertical, if the distance between the wires to be described later can be provided without limitation in the number.
  • the micro LED check pickup unit 610 includes check units 611 and 612 for checking the micro LED 10 and a pickup unit 613 for picking up the micro LED 10 in a vertical direction.
  • the inspection units 611 and 612 may play the same role as the inspection units 111 and 112 of the LED inspection device 1, but the transfer device 6 and the inspection device 1 may be different from each other in the configuration of different devices. The description will be made with a name and a drawing number.
  • the inspection units 611 and 612 are configured to check whether the micro LED 10 operates normally by contacting and energizing the P and N electrodes 11 and 12 of the micro LED 10. And a negative electrode check unit 612.
  • the positive electrode checker 611 and the negative electrode checker 612 of the checkers 611 and 612 are positioned to correspond to the positive electrode 11 and the negative electrode 12 of the micro LED 10, respectively.
  • the positive electrode check unit 611 and the negative electrode check unit 612 are respectively the positive electrode 11 and the negative electrode ( 12 may be applied to the micro LED 10. Therefore, the positive electrode check unit 611 and the negative electrode check unit 612 are preferably composed of a conductor.
  • a conventional method such as selecting a micro LED that exceeds or falls below the range by using a predetermined range of electrical characteristics such as a specific resistance or current value in advance as a normal operating range can be used.
  • the scope of rights is not limited thereto.
  • the positive electrode checker 611 and the negative electrode checker 612 are metal mesh methods for filling the grooves with conductive materials after the grooves are formed on the first layer 600 through imprinting. It can be prepared by.
  • the pickup unit 613 is located between the check unit (611, 612).
  • the pickup unit 613 may be located between the positive electrode check unit 611 and the negative electrode check unit 612.
  • the pickup portion 613 is preferably formed with a wide contact surface with the micro LED (10).
  • the pick-up unit 613 according to the present invention can operate normally as described below.
  • the pick-up part 613 according to the present invention preferably picks up the micro LED 10 through static electricity in an electrostatic manner.
  • FIG. 13 is a perspective view illustrating a bottom surface of a first layer according to an embodiment of the present invention.
  • the inspection units 611 and 612 and the pickup unit 613 may have a shape in which grooves having a rectangular shape are formed on the bottom surface of the first layer 600.
  • the upper surface may have a shape having a circular hole to which an electrode may be applied. The grooves of the lower surface and the holes of the upper surface are connected to penetrate each other, and both the inner groove and the circular hole are preferably filled with a conductive material.
  • the micro LED pickup checker 610 may include a positive electrode checker 611, a negative electrode checker 612, and a positive electrode checker 611 and a cathode checker ( It may be formed to include a pickup unit 613 provided between the 612.
  • the positive electrode check unit 611, the negative electrode check unit 612, and the pickup unit 613 formed as rectangular grooves may be provided side by side with a predetermined interval therebetween.
  • a predetermined interval between the positive electrode check unit 611, the negative electrode check unit 612, and the pickup unit 613 may be a positive electrode check unit 611, a negative electrode check unit 612, and a pickup unit 613.
  • the micro LED pickup checker 610 may have a shape in which a circular hole is formed on upper surfaces of the anode checker 611, the cathode checker 612, and the pickup 613 formed as the rectangular grooves.
  • the positive electrode check unit 611, the negative electrode check unit 612, and the pickup unit 613 are each formed only in a circular hole shape, the contact area with the micro LED 10 is narrow, so that the electrode 11 of the micro LED 10 is narrow. , 12) it is difficult to make accurate contact. Accordingly, there is a problem that the micro LED 10 in the normal state may also be determined to be in an abnormal state due to incorrect contact.
  • the positive electrode check unit 611, the negative electrode check unit 612, and the pick-up unit 613 are formed on a lower surface of the micro LED pick-up inspection unit 610 as a rectangular groove disposed at predetermined intervals as described above. Is preferably provided.
  • the contact area with the micro LED 10 is widened to contact the electrodes 11 and 12. It may be easy, and the contact area of the pickup portion 613 is also widened to make it easier to pick up the micro LED 10.
  • the upper surfaces of the anode check unit 611, the cathode check unit 612, and the pickup unit 613 are provided with circular holes, it may be easier to design circuits disposed on the upper side of the first layer 600 so as not to overlap each other. Can be.
  • the first layer 600 may be made of a soft material, for example, a transparent material having elasticity such as UV Resin, SU-8, or PDMS (Polydimethylsiloxane). It is a relatively conductive material because the thickness of the micro LED 10 is very thin and the micro when the hard inspection unit 611, 612 or the pickup unit 613 touches the top surface of the micro LED 10 for inspection and pickup. This is to prevent the impact applied to the LED 10 as much as possible.
  • a soft material for example, a transparent material having elasticity such as UV Resin, SU-8, or PDMS (Polydimethylsiloxane). It is a relatively conductive material because the thickness of the micro LED 10 is very thin and the micro when the hard inspection unit 611, 612 or the pickup unit 613 touches the top surface of the micro LED 10 for inspection and pickup. This is to prevent the impact applied to the LED 10 as much as possible.
  • FIGS. 14 and 15 is a perspective view showing a bottom surface of a first layer of another embodiment of the present invention
  • FIG. 15 is a cross-sectional view showing a side surface of the LED transfer device according to another embodiment of the present invention.
  • the first layer 600 ′ of another embodiment of FIGS. 14 and 15 will be referred to as 600 ′ in order to distinguish it from the first layer 600 of the embodiment described above with reference to FIG. 13.
  • the inspection units 611 and 612 may have a shape in which grooves having a rectangular shape are formed on the bottom surface of the first layer 600 ′ as in the exemplary embodiment.
  • the grooves of the lower surface and the holes of the upper surface are connected to penetrate each other, and both the inner groove and the circular hole are preferably filled with a conductive material. Detailed description is the same as in the above embodiment and will be omitted, and will be described in detail in different parts.
  • the first layer 600 ′ of another embodiment of the present invention may be provided so that the pickup unit 613 is not exposed to the lower surface. That is, the upper surface of the first layer 600 ′ may be filled with a conductive material through a circular hole as shown in FIG. 12, but it is preferable that the upper surface of the first layer 600 ′ is not penetrated and exposed to the lower surface.
  • the pickup unit 613 may be provided so as not to be exposed to the lower surface, and the micro LED 10 may be picked up by static electricity by generating static electricity on the unexposed lower surface.
  • the lower surface of the pickup unit 613 is made of a transparent material having elasticity such as UV Resin, SU-8, or PDMS (Polydimethylsiloxane), and the UV is applied by applying a voltage to the pickup unit 613 to form an electric field.
  • Static electricity may be generated on the contact surface of a transparent material having elasticity such as Resin, SU-8, or polydimethylsiloxane (PDMS).
  • the micro LED 10 may be contacted and picked up by the static electricity generated in the contact surface.
  • the second layer 700 may be positioned to contact the top surface of the first layer 600.
  • the second layer 700 includes a first positive electrode wire 721 and a first negative electrode wire 722 having one end electrically connected to the positive electrode check part 611 and the negative electrode check part 612 of the first layer 600, respectively. It is provided with, the pick-up conduction point 713 is further provided.
  • a layer in which inspection wires 721 and 222 are arranged in two layers and a pickup wire 823 are arranged in two layers to arrange two kinds of wires having different purposes within a small range due to the characteristics of the micro LED 10.
  • the first positive electrode wire 721 and the first negative electrode wire 722 are provided on the second layer 700, and are electrically connected to the pickup unit 613 to supply power.
  • the blocking wire is preferably provided in the third layer 800 after passing through the second layer 700 through the pickup conduction point 713.
  • the first positive electrode wire 721 may be provided as a conductor so that one end thereof may be electrically connected to the positive electrode check unit 611.
  • the first negative electrode wire 722 may also be provided as a conductor so that one end thereof may be electrically connected to the negative electrode check unit 612. Can be connected.
  • the first positive electrode wire 721 and the first negative electrode wire 722 are preferably disposed so as not to cross each other.
  • a plurality of first positive electrode wires 721 and first negative electrode wires 722 may be provided in plurality so that one end thereof is electrically connected to the positive electrode check part 611 and the negative electrode check part 612, respectively.
  • each of the first positive electrode wire 721 and the first negative electrode wire 722 may be electrically connected to a separate positive electrode switch unit and a negative electrode switch unit, respectively.
  • the positive electrode switch unit and the negative electrode switch unit according to the first embodiment may be provided with the number of the first positive electrode wires 721 and the first negative electrode wires 722.
  • FIG. 16 is a cross-sectional view illustrating a top surface of a second layer according to a fourth embodiment of the present invention.
  • one column is defined based on the longitudinal (vertical) direction, and the first, second, and third columns are sequentially defined from the left to the right in the horizontal (horizontal) direction.
  • it is defined as one "row” on the basis of the lateral (horizontal) direction, and defined as one row, two rows, and three rows sequentially from the upper side to the lower direction in the longitudinal (vertical) direction.
  • the first positive electrode wire 721 and the first negative electrode wire 722 of the fourth embodiment may include the positive electrode check part 611 and the negative electrode check part 612. It may be provided as many as.
  • each of the first positive electrode wire 721 and the first negative electrode wire 722 may be electrically connected to and controlled by a separate positive electrode switch unit and a negative electrode switch unit, respectively.
  • the first positive electrode wires 721 in one row and one column are electrically connected to the first positive electrode switch unit
  • the first positive electrode wires 721 in the first row and two columns are the second positive electrode switch unit and the first one in the first row and three columns.
  • the positive electrode wire 721 is the third positive electrode switch part, the first positive electrode wire 721 in the second row and the first row is the fourth positive electrode switch part, and the first positive electrode wire 721 in the second row and the second row is the fifth positive electrode switch part, respectively. It may be connected to a separate positive electrode switch. Accordingly, each of the first positive electrode wires 721 may be separately applied and cut off by a separate positive electrode switch.
  • the first negative electrode wire 722 may also be sequentially connected to a separate negative electrode switch unit. Accordingly, each of the first negative electrode wires 722 may be individually applied and cut off by a separate negative electrode switch unit.
  • the current when current is sequentially applied to the first positive electrode switch part and the first negative electrode switch part, the current is applied to the first positive electrode wire 721 and the first negative electrode wire 722 corresponding to the first position, thereby providing a first current. 1 You can check the micro LED (10). Subsequently, when a current is applied to the second positive electrode switch part and the second negative electrode switch part, the current is applied to the first positive electrode wire 721 and the first negative electrode wire 722 corresponding to the second position so that the second micro LED You can check (10).
  • 17 is a cross-sectional view illustrating a top surface of a second layer according to a fifth embodiment of the present invention.
  • the first positive electrode wire 721 of the fifth embodiment may be provided by the number of columns or rows, and the first negative electrode wire 722 may be provided by the number of micro LEDs 10 to be inspected.
  • the anode check unit 611 in the same column or the same row may be electrically connected through one first anode wire 721. More specifically, the first positive electrode wire 721 electrically connected to the positive electrode check unit 611 in the same column or the same row may be connected to one positive electrode switch unit to simultaneously control the application or interruption of the current.
  • the positive electrode check unit 611 of one row, two rows and three rows of one column may be connected to one first positive electrode switch unit.
  • the anode check unit 611 in two columns, one row, two rows and three rows has one second anode switch unit, and the anode check unit 611 in three rows, one row, two rows and three rows has one anode. 3 can be connected to the positive switch unit. Therefore, the anode check units 611 in the same row may be simultaneously applied and interrupted by the same switch unit, respectively.
  • the negative electrode checker 612 is connected to a separate first negative electrode wire 722 so that current can be applied and cut off individually by each negative switch unit.
  • the micro LEDs 10 corresponding to the micro LEDs 10 may be inspected, and when the current is applied to the cathode switch units of the first and second rows, the micro LEDs 10 corresponding to the positions of the first and second rows may be checked. In this way, when the first positive electrode wire 721 is connected to the same switch unit, the wiring of the circuit can be reduced, so that each micro LED 10 can be sequentially inspected even through a circuit having a small area.
  • the third layer 800 is positioned to contact the upper surface of the second layer 700 and is provided in the second layer 700.
  • a plurality of pick-up electrification points 713 and a plurality of first pick-up wires 823 each having one end electrically connected thereto may be provided.
  • the first pickup wire 823 may be provided in the third layer 800.
  • a plurality of first pick-up wires 823 are preferably provided so that one end is electrically connected to each of a plurality of pick-up electrification points 713, wherein the plurality of pick-up wires are micro It is preferable that the number of LEDs 10 be the same.
  • the first pickup wire 823 may be a wire to which an electrostatic generating current is supplied to pick up the micro LED 10.
  • Each of the first pickup wires 823 may be connected to a separate pickup switch unit. Therefore, the pickup switch units connected separately, respectively, are controlled separately, so that each first pickup wire 823 can be powered on and off individually.
  • an electrode is not applied to the corresponding pickup switch unit of the pickup unit 613 corresponding to the micro LED 10 whose electrical operation is determined to be abnormal.
  • the pickup unit 613 controls the power to be applied only to the pickup switch unit corresponding to the micro LED 10 of the good article checked by the check units 611 and 612 in a normal operation, thereby ensuring that the micro LED ( Only 10) can be picked up and transported selectively.
  • FIGS. 18 to 20 is an exploded perspective view showing each layer of a modified embodiment of the present invention.
  • the second layer 700 may be positioned to contact the top surface of the first layer 600.
  • the second layer 700 includes two or more pickups 613 provided in the first layer 600 and second pickup wires 723, one end of which is electrically connected to each other, and includes a positive electrode conduction point 711 and a negative electrode.
  • a conduction point 712 is further provided.
  • a layer in which pickup wires 723 are arranged in two layers and inspection wires 821 and 322 are arranged in order to arrange two kinds of wires having different purposes within a small range due to the characteristics of the micro LED 10. It is preferable to provide a layer to be the second layer 700 and the third layer 800, respectively.
  • the second pickup wire 723 is provided on the second layer 700, and is electrically connected to the positive electrode check unit 611 and the negative electrode check unit 612 to supply power. And the wires to be blocked are provided in the third layer 800 after passing through the second layer 700 through the positive electrode current point 711 and the negative electrode current point 712.
  • the second pick-up wire 723 provided on the second layer 700 may be provided as a conductor so that one end thereof may be electrically connected to the pick-up part 613, and the positive electrode current point 711 and the negative electrode current point 712 may also be provided. It is provided as a conductor and one end may be electrically connected to the positive electrode check unit 611 and the negative electrode check unit 612.
  • the second pick-up wire 723, the positive electrode conduction point 711 and the negative electrode conduction point 712 are preferably disposed at predetermined intervals so as not to contact each other.
  • the second positive electrode wire 821 and the second negative electrode wire 822 provided in the third layer 800 are respectively provided with the positive electrode conduction point 711 and the negative electrode conduction provided in the second layer 700. Point 712 and one end may be electrically connected.
  • a plurality of second positive electrode wires 821 and second negative electrode wires 822 according to a modified embodiment may be provided in plurality so that one end is electrically connected to the positive electrode conductive point 711 and the negative electrode conductive point 712, respectively.
  • each of the second positive electrode wire 821 and the second negative electrode wire 822 may be electrically connected to a separate positive electrode switch unit and a negative electrode switch unit, respectively.
  • the positive electrode switch unit and the negative electrode switch unit according to the sixth embodiment may be provided with the number of the second positive electrode wires 821 and the second negative electrode wires 822.
  • FIG. 19 is a cross-sectional view illustrating an upper surface of a third layer according to a sixth embodiment of the present invention.
  • the second positive electrode wire 821 and the second negative electrode wire 822 may be provided as many as the number of the positive electrode check unit 611 and the negative electrode check unit 612. Can be.
  • each of the second positive electrode wire 821 and the second negative electrode wire 822 may be electrically connected to and controlled by a separate positive electrode switch unit and a negative electrode switch unit, respectively.
  • the second positive electrode wire 821 in one row and one column is electrically connected to the first positive electrode switch unit
  • the second positive electrode wire 821 in two rows and one row is the second positive electrode switch unit and the second row in three rows.
  • the positive electrode wire 821 is the third positive electrode switch part, the first positive electrode wire 821 in the second row and the first column is the fourth positive electrode switch part, and the second positive electrode wire 821 in the second row and the second column is the fifth positive electrode switch part, respectively. It may be connected to a separate positive electrode switch. Accordingly, each of the second positive electrode wires 821 may be individually applied and cut off by separate anode switches.
  • the second negative electrode wire 822 may also be sequentially connected to the separate negative electrode switch part. Accordingly, each of the second negative electrode wires 822 may be separately applied and cut off by a separate negative electrode switch.
  • the current when current is sequentially applied to the first positive electrode switch part and the first negative electrode switch part, the current is applied to the second positive electrode wire 821 and the second negative electrode wire 822 corresponding to the first position, thereby providing a first current. 1 You can check the micro LED (10). Subsequently, when a current is applied to the second positive electrode switch part and the second negative electrode switch part, the current is applied to the second positive electrode wire 821 and the second negative electrode wire 822 corresponding to the second position so that the second micro LED You can check (10).
  • 20 is a cross-sectional view illustrating a top surface of a third layer according to a seventh embodiment of the present invention.
  • the second positive electrode wire 821 of the seventh embodiment may be provided by the number of columns or rows, and the second negative electrode wire 822 may be provided by the number of micro LEDs 10 to be inspected.
  • the anode check unit 611 in the same column or the same row may be electrically connected through one second anode wire 821. More specifically, the second positive electrode wire 821 electrically connected to the positive electrode check unit 611 in the same column or the same row may be connected to one positive electrode switch unit to simultaneously control the application or interruption of the current.
  • the anode check unit 611 of one row, two columns, and three columns of one row may be connected to one first anode switch unit.
  • the anode check unit 611 in two rows, one column, two columns, and three columns includes one second anode switch unit, and the anode check unit 611 in three rows, one column, two columns, and three columns includes one single anode. 3 can be connected to the positive switch unit. Therefore, the anode check units 611 in the same row may be simultaneously applied and interrupted by the same switch unit, respectively.
  • the negative electrode check unit 612 may be connected to a separate second negative electrode wire 822 so that current may be applied and cut off individually by each negative switch unit.
  • the current is applied to the position of one row and one column.
  • the corresponding micro LED 10 may be checked, and when the current is applied to the cathode switch unit of the first row and the second column, the micro LED 10 corresponding to the position of the first row and the second column may be checked.
  • the second positive electrode wire 821 is connected to the same switch unit, wiring of the circuit can be reduced, and each micro LED 10 can be sequentially inspected even through a circuit having a small area.
  • the first layer 600 is not included, and only the second layer 700 and the third layer 800 may be included.
  • Further preferred embodiments to be described below are modified embodiments of the one embodiment and the other embodiments, and the description of the same parts will be omitted, and thus different features will be described in detail.
  • 21 and 22 are cross-sectional views showing the side of the LED transfer device of a further embodiment of the present invention.
  • the LED transfer device 6 of the additional embodiment may include only the second layer 700 and the third layer 800.
  • Each of the second layer 700 and the third layer 800 may be formed of the soft material described above in one embodiment, and may be made of a transparent material having elasticity such as UV Resin, SU-8, or polydimethylsiloxane (PDMS). It is preferable to make.
  • PDMS polydimethylsiloxane
  • the second layer 700 of a further embodiment includes a positive electrode checker 611 and a negative electrode checker 612 on a lower surface thereof, and one end of the positive electrode checker 611 and a negative electrode checker 612 is electrically connected to the upper surface of the second layer 700.
  • a first positive electrode wire 721 and a first negative electrode wire 722 connected thereto may be provided.
  • the positive electrode check unit 611 and the negative electrode check unit 612 are provided to protrude downward.
  • the protruding positive electrode checker 611 and the negative electrode checker 612 are in contact with the positive electrode 11 and the negative electrode 12 of the micro LED 10 by vertically moving the LED transfer device 6 downward. Each micro LED 10 can be checked.
  • the first positive electrode wire 721 and the first negative electrode wire 722 may be provided on the upper surface of the second layer 700 as described above in the above embodiment. At one end of each of the first positive electrode wire 721 and the first negative electrode wire 722, the positive electrode check part 611 and the negative electrode check part 612 may be provided to protrude through the second layer 700. Each of the first positive electrode wire 721 and the first negative electrode wire 722 may be provided according to various embodiments as in the above-described one embodiment and the other embodiments.
  • the third layer 800 is positioned to be in contact with the top surface of the second layer 700, and includes a pickup part 613 on the bottom surface, and a plurality of first pickup wires having one end electrically connected to the pickup part 613. 823 may be further provided.
  • Each of the first positive electrode wire 721, the first negative electrode wire 722, and the first pick-up wire 823 may be provided at different layers as shown in FIG. 23.
  • the pickup unit 613 may be provided so as not to protrude from the lower surface of the third layer 800 as shown in FIG. 21, and more preferably, the lower surface of the third layer 800 as shown in FIG. 22.
  • Pickup portion 613 may be provided to protrude from.
  • the pick-up part 613 protruding may be inserted into and coupled to an upper surface of the second layer 700. Therefore, the pick-up unit 613 may not be in direct contact with the micro LED 10, but may be positioned relatively close to the micro LED 10 to facilitate pick-up due to static electricity.
  • each layer of a further embodiment of the present invention will be described in detail with reference to FIGS. 23 and 24.
  • the second positive electrode wire 721 and the first negative electrode wire 722 are separately provided in each of the inspection pickup parts 610 in the second layer 700 as in the above-described embodiment.
  • a first pick-up wire 823 may be provided to correspond to one check pick-up unit 610.
  • each of the wires 721, 722, 823 may be provided so that the same wires are electrically connected to each other so that the supply of power can be controlled by one power source. Arrangement of each of the wires 721, 722, and 823 has been described in detail through the above embodiment, and thus will be omitted below. Referring to FIG.
  • pickup wires connected to the pickup part 613 for each inspection pickup part 610 are separately provided as the positive pick-up wire 8231 and the negative pick-up wire 8232. It may be provided to correspond.
  • the pickup unit 613 is also provided in two so as to protrude downward in one end of each of the positive electrode pick-up wires 8231 and the negative pick-up wires 8232. That is, even if the pick-up unit 613 is separately provided as a positive pick-up unit and a negative pick-up unit, respectively, as shown in FIGS. 21 and 22, each pick-up unit 613 may be configured so as not to directly contact the micro LED 10. It is preferable to be provided so as not to penetrate the layer 700.
  • This passing top and bottom surfaces are preferably coated with an insulator.
  • the conduction points 711, 712, 713 provided on the second layer 700 pass through the second layer 700 and the wires 821, 822, 823 provided in the third layer 800. It is preferable to be provided to be electrically connected.
  • the wires 721, 722, and 723 provided on the second layer 700 and the wires 821, 822, and 823 provided on the third layer 800 should not be electrically connected to each other.
  • the upper and lower surfaces through which 721, 722, 723, 821, 822, and 823 pass are preferably coated with an insulator so as not to be energized with each other.
  • the insulator may be an insulator made of a different material, but it is more preferable that the insulator is provided with an insulator made of the same soft material as each of the second layer 700 and the third layer 800.
  • UV resin, SU-8 or PDMS Polydimethylsiloxane
  • UV resin, SU-8 or PDMS Polydimethylsiloxane
  • the arrangement of the wires of the above-described embodiments is only an embodiment, and may be variously modified according to the distance, the number, the area of the layer, etc. of the micro LED 10 to be inspected.
  • FIGS. 25 to 27 are cross-sectional views showing a micro LED transfer step of an embodiment of the present invention
  • Figure 26 is a cross-sectional view showing a micro LED transfer step of another embodiment of the present invention
  • Figure 27 is a micro LED transfer step of a further embodiment of the present invention It is sectional drawing shown.
  • the micro LED transfer step of the present invention may include a micro LED checking step and a micro LED selection pick-up step, and selectively transfer only the micro LED 10 picked up by the micro LED selection pick-up step.
  • the LED transfer device 6 is placed on the upper surface of the wafer W on which the plurality of micro LEDs 10 are arranged, and the LED transfer device 6 is connected to the micro LED 10.
  • the inspection units 611 and 612 move downward to contact each electrode.
  • a power is applied to the anode wire 721 and the cathode wire 722 provided in the second layer 700 to check whether the micro LED 10 is electrically operated normally.
  • the plurality of positive electrode wires 721 and the negative electrode wires Power may be applied to the 722 to check whether the micro LED 10 operates normally.
  • the plurality of micro LEDs 10 may be simultaneously checked by the application of electrodes, but according to an exemplary embodiment, the electrodes may be sequentially applied and checked one by one.
  • the micro LED transfer step is performed only in the pickup unit 613 corresponding to the micro LED 10 checked in the normal operation according to the normal operation of the micro LED 10 checked in the micro LED checking step. Can be applied.
  • the pick-up wire 823 provided in the third layer 800 has the LED transfer device 6 in a state in which power is applied only to the pick-up wire 823 at a position corresponding to the micro LED 10 checked for normal operation. ) Is lifted to the upper side, only the normal operation micro LED 10 of the portion to which power is applied may be gripped by the corresponding pickup unit 613 to be selectively picked up and transported.
  • the normal operation micro LED 10 is picked up by the check pick-up unit 610, the abnormal micro LED 10 is left on the wafer (W). Therefore, only the normally operating micro LED 10 picked up by the LED transfer device 6 can be selectively transferred to the desired space. In addition, the abnormal micro LED 10 can be discarded together with the wafer W used to shorten the inspection step and the transfer step.
  • the micro LED pick-up inspection unit 610 is moved to each micro by placing the LED transfer device 6 on the upper surface of the wafer W and vertically moving the LED transfer device 6 downward. To the LED 10. Thereafter, in the micro LED checking step, power is applied to the positive electrode wire 821 and the negative electrode wire 822 provided in the third layer 800 to check whether the micro LED 10 is electrically operated normally. After selecting the micro LED 10 in the normal state and the abnormal state by the micro LED check step, the micro LED transfer step can be made. In detail, the micro LED transfer step may apply current only to the pickup unit 613 corresponding to the micro LED 10 checked in the normal operation according to whether the micro LED 10 checked in the micro LED checking step operates normally. Can be.
  • the pick-up wire 723 of the second layer 700 may be supplied with power only to the pick-up wire at a position corresponding to the micro LED 10 checked for normal operation. Therefore, only the micro LED 10 in the normal operating state is gripped by the corresponding pickup unit 610 and can be selectively picked up and transported. That is, the normal operation micro LED 10 is picked up by the check pick-up unit 610, the abnormal micro LED 10 is left on the wafer (W). Therefore, only the normally operating micro LED 10 picked up by the LED transfer device 6 can be selectively transferred to the desired space. In addition, the abnormal micro LED 10 can be discarded together with the wafer W used to shorten the inspection step and the transfer step.
  • the LED transfer device 6 is positioned on the top surface of the wafer W. As shown in FIG. Thereafter, the LED transfer device 6 is vertically moved downward so that the check units 611 and 612 contact each electrode of the micro LED 10, and the pickup unit 613 is positioned to correspond to each micro LED 10. . At this time, it is preferable that the pickup unit 613 according to an additional embodiment does not directly contact the micro LED 10.
  • the micro LEDs When the inspection units 611 and 612 are in contact with the micro LEDs 10, the micro LEDs are applied to supply the power to the positive and negative wires 721 and 722 provided in the second layer 700. Checking whether the electrical operation of the normal (10) can be carried out.
  • the electrodes 11 and 12 of the plurality of micro LEDs 10 are electrically contacted with the positive electrode check unit 611 and the negative electrode check unit 612, respectively, the plurality of positive electrode wires 721 and the negative electrode wires. Power may be applied to the 722 to check whether the micro LED 10 operates normally.
  • the plurality of micro LEDs 10 may be simultaneously checked by the application of electrodes, but according to an exemplary embodiment, the electrodes may be sequentially applied and checked one by one.
  • the micro LED transfer step includes a current only in the pickup unit 613 corresponding to the micro LED 10 checked in the normal operation according to whether the micro LED 10 checked in the micro LED checking step operates normally. Can be applied.
  • the pick-up wire 823 provided in the third layer 800 has the LED transfer device 6 in a state in which power is applied only to the pick-up wire 823 at a position corresponding to the micro LED 10 checked for normal operation. ) Is lifted to the upper side, only the normal operation micro LED 10 of the portion to which power is applied may be gripped by the corresponding pickup unit 613 to be selectively picked up and transported.
  • the pick-up unit 613 is not directly in contact with the micro LED 10, the electric field is formed by the power supplied to the corresponding pick-up unit 613 of the position checked in the normal operation to generate the static electricity by the corresponding micro LED 10 can be picked up. That is, the normal operation micro LED 10 is picked up by the check pick-up unit 610, the abnormal micro LED 10 is left on the wafer (W). Therefore, only the normally operating micro LED 10 picked up by the LED transfer device 6 can be selectively transferred to the desired space. In addition, the abnormal micro LED 10 can be discarded together with the wafer W used to shorten the inspection step and the transfer step.
  • the cost for the inspection of the LED is reduced, and only the LEDs of the normal state are determined and then transferred, so that no separate determination process is required, and only the LEDs of the good products can be selected and arranged quickly.

Abstract

La présente invention porte sur un dispositif de test de diodes électroluminescentes (DEL) servant à tester si une micro-DEL fonctionne normalement sur une tranche, et sur un dispositif de transfert de DEL servant à trier uniquement des micro-DEL fonctionnant normalement selon le test de fonctionnement normal et les transférer. À cet effet, un dispositif de test de DEL de la présente invention comprend : deux unités de test sous pointes ou plus ; et une unité de test conduisant l'électricité par établissement d'un contact avec une électrode d'une micro-DEL, ce qui permet de tester si la micro-DEL fonctionne normalement. De plus, les deux unités de test sous pointes ou plus sont disposées côte à côte en une pluralité de matrices dans des directions horizontale et verticale de façon à correspondre à un groupement de micro-DEL sur la tranche, et sont disposées dans une couche de circuit d'un matériau souple. De plus, une couche tampon constituée du même matériau que la couche de circuit est en outre disposée sur la surface supérieure de la couche de circuit. En outre, un dispositif de transfert de DEL de la présente invention comprend : une unité de préhension pour saisir une micro-DEL ; et une unité de vérification conduisant l'électricité par établissement d'un contact avec une électrode d'une micro-DEL, ce qui permet de tester si la micro-DEL fonctionne normalement, l'unité de préhension saisissant de manière sélective uniquement des micro-DEL ayant été vérifiées comme fonctionnant normalement par l'unité de vérification.
PCT/KR2019/002728 2018-03-09 2019-03-08 Dispositif de test et dispositif de transfert de del WO2019172707A1 (fr)

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Application Number Priority Date Filing Date Title
KR10-2018-0027855 2018-03-09
KR20180027855 2018-03-09
KR10-2018-0170590 2018-12-27
KR1020180170590A KR102386932B1 (ko) 2018-03-09 2018-12-27 Led 검사 장치 및 이송 장치

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110911436A (zh) * 2019-12-03 2020-03-24 京东方科技集团股份有限公司 一种驱动背板、发光二极管的转移装置及转移方法
CN111584538A (zh) * 2020-06-05 2020-08-25 武汉华星光电技术有限公司 微型发光二极管显示装置及其制造方法
CN112967945A (zh) * 2020-04-16 2021-06-15 重庆康佳光电技术研究院有限公司 微型发光二极管测试装置、制作方法、系统和测试方法
CN112997288A (zh) * 2020-09-22 2021-06-18 泉州三安半导体科技有限公司 一种用于发光二极管转移的压印及其转移方法
CN113358998A (zh) * 2021-06-10 2021-09-07 中国科学院半导体研究所 一种通用led测试装置及测试方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101319785B1 (ko) * 2013-03-18 2013-10-18 주식회사 야스 정전기 부상을 이용한 기판이송장치
KR20140074468A (ko) * 2012-12-10 2014-06-18 엘지이노텍 주식회사 반도체 검사 장치
KR101532393B1 (ko) * 2014-06-26 2015-07-01 주식회사 아이에스시 전기적 검사소켓
US20160155892A1 (en) * 2014-11-27 2016-06-02 Sct Technology, Ltd. Method for manufacturing a light emitted diode display
WO2018005118A1 (fr) * 2016-06-29 2018-01-04 Applied Materials, Inc. Systèmes et procédés pour le transfert de micro-dispositifs

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140074468A (ko) * 2012-12-10 2014-06-18 엘지이노텍 주식회사 반도체 검사 장치
KR101319785B1 (ko) * 2013-03-18 2013-10-18 주식회사 야스 정전기 부상을 이용한 기판이송장치
KR101532393B1 (ko) * 2014-06-26 2015-07-01 주식회사 아이에스시 전기적 검사소켓
US20160155892A1 (en) * 2014-11-27 2016-06-02 Sct Technology, Ltd. Method for manufacturing a light emitted diode display
WO2018005118A1 (fr) * 2016-06-29 2018-01-04 Applied Materials, Inc. Systèmes et procédés pour le transfert de micro-dispositifs

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110911436A (zh) * 2019-12-03 2020-03-24 京东方科技集团股份有限公司 一种驱动背板、发光二极管的转移装置及转移方法
CN110911436B (zh) * 2019-12-03 2022-05-31 京东方科技集团股份有限公司 一种驱动背板、发光二极管的转移装置及转移方法
CN112967945A (zh) * 2020-04-16 2021-06-15 重庆康佳光电技术研究院有限公司 微型发光二极管测试装置、制作方法、系统和测试方法
CN111584538A (zh) * 2020-06-05 2020-08-25 武汉华星光电技术有限公司 微型发光二极管显示装置及其制造方法
CN112997288A (zh) * 2020-09-22 2021-06-18 泉州三安半导体科技有限公司 一种用于发光二极管转移的压印及其转移方法
CN113358998A (zh) * 2021-06-10 2021-09-07 中国科学院半导体研究所 一种通用led测试装置及测试方法
CN113358998B (zh) * 2021-06-10 2023-01-06 中国科学院半导体研究所 一种通用led测试装置及测试方法

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