WO2019172707A1 - Led testing device and transfer device - Google Patents

Led testing device and transfer device Download PDF

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Publication number
WO2019172707A1
WO2019172707A1 PCT/KR2019/002728 KR2019002728W WO2019172707A1 WO 2019172707 A1 WO2019172707 A1 WO 2019172707A1 KR 2019002728 W KR2019002728 W KR 2019002728W WO 2019172707 A1 WO2019172707 A1 WO 2019172707A1
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WO
WIPO (PCT)
Prior art keywords
led
unit
layer
positive electrode
micro led
Prior art date
Application number
PCT/KR2019/002728
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French (fr)
Korean (ko)
Inventor
박두진
장필국
Original Assignee
주식회사 나노엑스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority claimed from KR1020180170590A external-priority patent/KR102386932B1/en
Application filed by 주식회사 나노엑스 filed Critical 주식회사 나노엑스
Publication of WO2019172707A1 publication Critical patent/WO2019172707A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof

Definitions

  • the present invention relates to an LED inspection device and a transfer device. More specifically, the present invention relates to an inspection apparatus for inspecting whether the micro LED chip formed on the wafer is in normal operation and a transfer device for selecting and transferring only the normal operation micro LED by the normal operation inspection.
  • Micro LEDs ranging in size from several to tens of micrometers, can be widely used in optical applications that require low power, miniaturization, and light weight.
  • the process of screening and inspecting whether the product is electrically good is necessary, the size of the micro LED is very small, there is no proper transfer and inspection method, In this method, the problem of cracking or breaking, or the cost increase due to manual labor is caused.
  • the wafer is transferred to the target substrate without inspecting the electrical good state of the plurality of micro LEDs directly from the wafer, there is a problem that the target substrate itself may be defective when a defect of the micro LED occurs later on the target substrate.
  • the conventional method is a method of transferring only one micro LED chip, there is a problem that the transfer time is long and the mass production cost increases due to the large number of repetitions of the transfer.
  • Prior art documents include Korean Patent No. 10-1183978 (Prior Document 1) and Korean Patent No. 10-1585818 (Prior Document 2).
  • Prior Art 1 relates to a jig unit for fixing an LED chip to inspect a single LED chip, and according to the prior art as in Prior Art 1, it is cumbersome and time-consuming since the LEDs must be inspected separately one by one. There is a micro LED is very small and weak, so it is impossible to check as in the prior art.
  • Prior art 2 has a problem that can not distinguish the chip.
  • Prior art 2 relates to a micro element transfer method, which can pick up a micro element with a current applied to a transfer head, but it is impossible to inspect the micro element. There is a problem that it is necessary.
  • the conventional LED inspection apparatus and the transfer apparatus cannot be applied in the case of micro LEDs which are downsized to several micro units in size, thereby inspecting the quality of the micro LEDs on the wafer with high precision, and selecting and transferring only the normal operating micro LEDs. Since the development of the technology is required, the present invention proposes a technology for conducting a good product inspection on a wafer before the transfer of the micro LEDs and simultaneously transferring only the micro LEDs determined as good products.
  • the technical problem of the present invention is to determine the LED of the good product on the wafer.
  • the present invention provides an LED inspection apparatus that is capable of determining a normal operating state of an LED separated on a wafer and mounted on a substrate.
  • the present invention also provides an LED inspection apparatus capable of simultaneously checking whether a plurality of LEDs listed on a wafer are normally operated.
  • the present invention provides an LED inspection apparatus and a transfer apparatus having a buffer layer that can inspect and transfer the LED without damaging the LED.
  • an LED transfer device for selectively transferring only the LEDs identified as good products and at the same time to determine the LEDs of good products in normal operation.
  • the LED inspection apparatus of the present invention is characterized in that it comprises two or more prober (Prober), the inspection unit for checking whether the LED is operating normally by contacting and energizing the electrode of the LED.
  • the two or more prober parts may be arranged in parallel in a plurality of horizontal and vertical matrices so as to correspond to the arrangement of the LEDs on the wafer, and may be provided in a circuit layer made of a soft material.
  • the upper surface of the circuit layer is characterized in that it further comprises a buffer layer provided with the same material as the circuit layer.
  • the LED transfer device of the present invention includes a pick-up unit for picking up the LED, a check unit for checking whether the LED is operating normally by contacting and energizing the electrode of the LED, the pick-up unit LED checked by the normal operation in the check unit It is characterized in that it selectively picks up only the LED checked only or abnormal operation.
  • the cost for the inspection of the LED is reduced, and only the LEDs of the normal state are determined and then transferred, so that no separate determination process is required, and only the LEDs of the good products can be selected and arranged quickly.
  • FIG. 1 is a perspective view showing an LED inspection apparatus of an embodiment of the present invention.
  • FIG. 2 is an enlarged perspective view of a portion of a wafer of one embodiment of the present invention.
  • FIG. 3 is a cross-sectional view showing an LED inspection apparatus of an embodiment of the present invention.
  • FIG. 4 is a cross-sectional view showing an inspection state of the LED inspection apparatus of an embodiment of the present invention.
  • FIG. 5 is a cross-sectional view showing an inspection state of the LED inspection apparatus of another embodiment of the present invention.
  • FIG. 6 is an exploded perspective view showing each layer of the LED inspection apparatus of an embodiment of the present invention.
  • FIG. 7 is a cross-sectional view showing an upper surface of the circuit layer according to the first embodiment.
  • FIG. 8 is a cross-sectional view illustrating a top surface of a circuit layer according to a second embodiment.
  • FIG. 9 is a cross-sectional view illustrating an upper surface of a circuit layer according to a third embodiment.
  • FIG. 10 is a cross-sectional view showing a process of aligning the auxiliary line of the LED inspection apparatus and the wafer of an embodiment of the present invention.
  • FIG. 11 is a cross-sectional view showing an LED transport apparatus of an embodiment of the present invention.
  • FIG. 13 is a perspective view illustrating a bottom surface of a first layer according to an embodiment of the present invention.
  • FIG. 14 is a perspective view showing a bottom surface of a first layer of another embodiment of the present invention.
  • 15 is a cross-sectional view showing a side of the LED transfer device of another embodiment of the present invention.
  • 16 is a cross-sectional view illustrating a top surface of a second layer according to a fourth embodiment of the present invention.
  • 17 is a cross-sectional view illustrating a top surface of a second layer according to a fifth embodiment of the present invention.
  • FIG. 18 is an exploded perspective view showing each layer of a modified embodiment of the present invention.
  • 19 is a cross-sectional view illustrating an upper surface of a third layer according to a sixth embodiment of the present invention.
  • FIG. 20 is a cross-sectional view illustrating a top surface of a third layer according to a seventh embodiment of the present invention.
  • 21 and 22 are cross-sectional views showing the side of the LED transfer device of a further embodiment of the present invention.
  • 23 and 24 are exploded perspective views showing each layer of a further embodiment of the present invention.
  • 25 is a cross-sectional view showing a micro LED transfer step of an embodiment of the present invention.
  • 26 is a cross-sectional view showing a micro LED transfer step of another embodiment of the present invention.
  • Figure 27 is a cross sectional view showing a micro LED transfer step of a further embodiment of the present invention.
  • the present invention is an LED inspection device including two or more prober (Prober), characterized in that the inspection unit is included in the prober.
  • the inspection unit checks whether the LED operates normally by contacting and energizing the LED electrode.
  • the micro LED 10 described below is described as the most preferred embodiment, the micro LED 10 is applied to any LED, semiconductor device that emits light when the current is supplied. This may be possible.
  • the micro LED 10 is a very small device in a few micro units, and may be most effective when the present invention is applied.
  • the micro LED 10 will be described in detail with reference to the accompanying drawings.
  • FIG. 1 is a perspective view showing an LED inspection apparatus of an embodiment of the present invention
  • Figure 2 is an enlarged perspective view of a part of the wafer of an embodiment of the present invention.
  • the LED inspection apparatus 1 of the present invention inspects whether a plurality of micro LEDs 10 manufactured on a wafer W and micro LEDs 10 separated on a wafer W operate normally.
  • the LED inspection device 1 can be vertically lowered to be in contact with the micro LED 10 to inspect whether the micro LED 10 is operating normally.
  • the LED inspection apparatus 1 may be vertically lowered to be in contact with the wafer W to simultaneously check whether two or more micro LEDs 10 manufactured on the wafer W are normally operated, and the wafer W
  • the micro LED 10 may be inspected whether the micro LED 10 is normally removed from the substrate and disposed on the target substrate or transferred to a separate substrate or a tape.
  • the LED inspection apparatus 1 includes two or more prober units 110, and each prober unit 110 may correspond to each micro LED 10.
  • a plurality of micro LEDs 10 may be arranged side by side in a plurality of matrices in a horizontal and vertical direction on a wafer W according to an embodiment of the present invention.
  • the structure of the micro LED 10 may be a horizontal structure, a vertical structure or a flip chip type structure. However, for convenience of description, the description will be made with a flip chip type structure.
  • the micro LED 10 is a PN junction semiconductor having a P pole and an N pole, and may be provided to expose the P pole and the N pole, respectively, on an upper surface thereof.
  • the P pole of the micro LED 10 will be referred to as a positive electrode 11 and the N pole as a negative electrode 12.
  • the micro LEDs 10 are arranged on the top surface of the wafer W in an array of three rows and three rows. However, this is illustrated for convenience of description and in practice, the micro LEDs 10 may be arranged in several micro units. Since the wafer W is large enough and the spacing between the wires to be described below can be ensured, billions of micro LEDs 10 may be provided on one wafer W without limitation.
  • the photodetector 400 may be further provided on a lower surface of the wafer W provided with the plurality of micro LEDs 10.
  • the photo detector 400 detects light generated by the operation of each micro LED 10 by applying a current to the micro LED 10 to determine whether each micro LED 10 operates normally. to be. A more detailed description will be made in detail with reference to FIG. 10 to be described later after describing the LED inspection device 1 in more detail.
  • FIGS. 3 to 5 is a cross-sectional view showing an LED inspection apparatus of an embodiment of the present invention
  • Figure 4 is a cross-sectional view showing the inspection state of the LED inspection apparatus of an embodiment of the present invention
  • Figure 5 is a view of the LED inspection apparatus of another embodiment of the present invention It is sectional drawing which showed the inspection state.
  • the LED inspection apparatus 1 includes a circuit layer 100 having two or more prober portions 110 on a bottom surface thereof in direct contact with a micro LED, and a buffer layer 200 provided on an upper surface of the circuit layer 100. And a protective layer 300 provided on the upper surface of the buffer layer 200.
  • Each of the two or more prober units 110 may include an inspection unit 111 and 112 for inspecting whether the micro LED 10 operates normally by contacting and energizing the electrodes 11 and 12 of the micro LED 10.
  • the inspection units 111 and 112 may be respectively provided as an anode inspection unit 111 that may contact the positive electrode 11 of the micro LED 10 and a cathode inspection unit 112 that may contact the negative electrode 12. Can be. As shown in FIG.
  • the LED inspection apparatus 1 having the two or more anode inspecting portions 111 and the cathode inspecting portion 112 protruding from the lower surface of the circuit layer 110 descends in a vertical direction to determine whether the micro LED 10 operates normally. You can check whether it is. More specifically, referring to FIG. 4, the LED inspection apparatus 1 vertically lowered toward the wafer W may be in contact with each micro LED 10 provided on the wafer W. Referring to FIG. Specifically, each of the positive electrode inspection unit 111 and the negative electrode inspection unit 112 provided in each prober unit 110 of the LED inspection device 1 of each of the micro LED 10 provided on the wafer (W) It may be in contact with the positive electrode 11 and the negative electrode 12. Referring to FIG.
  • the LED inspection apparatus 1 may be mounted on a substrate or separated from the wafer W, as well as a micro LED 10 provided on the wafer W, or may be a separate substrate or the like. It is also possible to inspect the micro LED 10 transferred to a tape or the like.
  • the LED inspection apparatus 1 according to another embodiment of the present invention includes a plurality of prober parts 110 on the positive electrode 11 and the negative electrode 12 of the micro LED 10 separated from the wafer W. One of the positive electrode inspection unit 111 and the negative electrode inspection unit 112 may be brought into contact with each other so as to check whether the micro LED 10 operates normally in a space other than the wafer W.
  • FIGS. 6 to 9 is an exploded perspective view showing each layer of the LED inspection apparatus of an embodiment of the present invention
  • Figure 7 to Figure 9 is a cross-sectional view showing the upper surface of the circuit layer according to each embodiment.
  • the LED inspection apparatus 1 may be sequentially provided as the circuit layer 100, the buffer layer 200, and the protective layer 300 as described above.
  • the circuit layer 100 may include two or more prober portions 110, and the number of prober portions 110 may correspond to a plurality of micro LEDs on the wafer W, and the number of the probe layers 110 may be billion or more. 110 may be provided.
  • an anode inspecting portion 111 and a cathode inspecting portion 112 may be provided on each of the plurality of prober portions 110 on the bottom surface of the circuit layer 100.
  • the positive electrode inspecting unit 111 and the negative electrode inspecting unit 112 are configured to contact and energize the positive electrode 11 and the negative electrode 12 of the micro LED 10, respectively.
  • each inspection unit 111, 112 is preferably provided with a conductor so that it can be energized.
  • An upper surface of the circuit layer 100 may be provided with a positive electrode wire 113 and a negative electrode wire 114 having one end electrically connected to each of the positive electrode inspection unit 111 and the negative electrode inspection unit 112 protruding from the lower surface.
  • the positive electrode wire 113 and the negative electrode wire 114 may be provided in plural to correspond to the plurality of positive electrode inspection parts 111 and the negative electrode inspection part 112, and the positive electrode wire 113 and the negative electrode wire 114 may be electrically connected. It is preferable that the separation is provided.
  • one end of the positive electrode wire 113 and the negative electrode wire 114 may be provided through the circuit layer 100 to be electrically connected to the positive electrode inspection unit 111 or the negative electrode inspection unit 112, but one end Except for the positive electrode 113 and the negative electrode 114 is preferably provided only on the upper surface so as not to contact the lower surface of the circuit layer (100).
  • the circuit layer 100 is preferably provided with a soft material so as to prevent damage of the micro and weak micro LED 10 when in contact with the micro LED (10).
  • the circuit layer 100 is made of a soft material having elasticity and restoring force, so that the upper surface of the micro LED 10 may not be damaged, such as scratches, on the upper surface of the micro LED 10 even when contacted with the micro LED 10.
  • the above-described soft material is preferably provided with a transparent material having elasticity such as UV Resin, SU-8, or PDMS (Polydimethylsiloxane).
  • the buffer layer 200 is provided to be in contact with the upper surface of the circuit layer 100 to protect the plurality of wires 113 and 114 provided on the upper surface of the circuit layer 100, and the inspection device 1 in the micro LED 10. Is a configuration that serves as a buffer to prevent damage to the micro LED 10 when the contact. That is, since the circuit layer 100 is thinly provided, the buffer layer 200 may not function properly to prevent damage to the micro LED 10. Thus, the circuit layer 100 may further include a thick buffer layer 200 to completely prevent damage to the micro LED 10. It is a structure for doing so.
  • the buffer layer 200 is preferably provided with a soft material in order to cushion the micro LED 10 so as to prevent damage to the micro LED 10 when the micro layer is in contact with the micro LED 10.
  • a transparent material having elasticity such as UV Resin, SU-8 or PDMS (Polydimethylsiloxane).
  • the protective layer 300 is configured to protect the buffer layer 200 provided with a soft material in contact with the upper surface of the buffer layer 200.
  • the protective layer 300 is configured to protect the buffer layer 200 and the circuit layer 100, and to maintain the shape of the LED inspection device 1 is preferably provided with a hard material.
  • the protective layer 300 is provided with a hard material, but is preferably provided with a transparent material so that alignment can be easily aligned through the auxiliary line AL, which will be described later.
  • the protective layer 300 is preferably made of a transparent and hard material such as transparent acrylic, sapphire, quartz or glass.
  • circuit layer 100 according to each embodiment will be described in detail with reference to FIGS. 7 to 9.
  • the circuit layer 100 may be provided in various forms as in the following embodiments, and the plurality of positive electrode wires 113 and the negative electrode wires 114 provided on the upper surface of the circuit layer 100 are imprinted. After the groove is formed on the upper surface of the circuit layer 100 by imprinting, the groove may be manufactured by a metal mesh method of filling a conductive material in the formed groove.
  • the above-described method of manufacturing the positive electrode wire 113 and the negative electrode wire 114 is only an embodiment, and any method may be used as long as it can form an electric wire.
  • the anode wires 113 and the cathode wires 114 of the circuit layer 100 according to the first embodiment may be electrically connected to one ends of the anode inspection unit 111 and the cathode inspection unit 112, respectively. Although connected, each of the wires 113 and 114 may be provided to be spaced apart from one another so as not to be electrically connected to each other. Therefore, according to the first exemplary embodiment, the same prober unit 110 may be electrically connected to the positive electrode inspecting unit 111 and the negative electrode inspecting unit 112 provided at the same prober unit 110 among the plurality of prober units 110 at the same time.
  • the anode test unit 111 and the cathode test unit 112 and the anode wire 113 and the cathode wire 114 electrically connected to each other are separately energized so that the anode test unit 111 and the cathode of the prober unit 110. It may be determined whether the micro LED 10 in contact with the inspection unit 112 operates normally.
  • FIG. 8 is a cross-sectional view illustrating a top surface of a circuit layer according to a second embodiment.
  • the plurality of positive electrode wires 113 and the negative electrode wires 114 each have a positive electrode inspection unit 111 and a negative electrode inspection unit 112. It may be electrically connected to correspond to one end of the).
  • two or more cathode wires 114 may be electrically connected to one, and the anode wires 115 may be provided to be electrically separated from each other.
  • two or more cathode wires 114 are electrically connected to one, and the cathode inspection unit 112 provided in one row or one column is electrically connected to one cathode wire. And may be connected to 114. Therefore, the negative wire 114 of one row or column electrically connected to one is connected to the negative (-) pole of the power supply, and current is sequentially supplied to the positive wire 113 separately connected to each positive electrode inspection unit 111.
  • Each of the two or more micro LEDs 10 may be sequentially applied to each other. More specifically, the cathode wires 114 electrically connected to one are grounded, and then the normal operation of two or more micro LEDs 10 may be inspected by the energization of the anode wires 113 electrically connected to each other. have.
  • FIG. 9 is a cross-sectional view illustrating an upper surface of a circuit layer according to a third embodiment.
  • the plurality of positive electrode wires 113 and the negative electrode wires 114 each have a positive electrode inspection unit 111 as in the first or second embodiment. And it may be electrically connected to correspond to one end of the negative electrode inspection unit 112.
  • two or more cathode wires 114 may be electrically connected to one, and the anode wires 115 may be provided to be electrically separated from each other.
  • two or more cathode wires 114 provided on the circuit layer 100 may be electrically connected to each other. Therefore, the cathode wires 114 electrically connected as one are connected to the negative (-) pole of the power supply, and the current is sequentially applied to the anode wires 113 separately connected to each anode check unit 111, so that at least two micros are connected.
  • Each of the LEDs 10 can be sequentially checked for normal operation. More specifically, the cathode wires 114 electrically connected to one are grounded, and then the normal operation of two or more micro LEDs 10 may be inspected by the energization of the anode wires 113 electrically connected to each other. have.
  • the circuit layer 100 of the first to third embodiments described above is just an embodiment, and the anode wires 113 may be electrically connected to each other, and the cathode wires 114 and the anode wires 113 may be formed in respective rows or Each column is electrically connected to each other, and current may be sequentially applied to the cathode wires 114 and the anode wires 113 of each matrix to check whether the micro LED 10 operates normally. In addition, the current may be simultaneously applied to the entire cathode wire 114 and the anode wire 113 to simultaneously check whether the micro LED 10 in contact with each of the inspection units 111 and 112 operates normally.
  • FIG. 10 is a cross-sectional view illustrating a process of aligning an auxiliary line and an alignment mark for alignment of a wafer with an LED inspection apparatus according to an exemplary embodiment of the present invention.
  • the auxiliary lines AL1 and AL2 corresponding to each other may be further included in the wafer W, the circuit layers 100, the buffer layers 200, and the protection layers 300.
  • the first auxiliary line AL1 having the same shape may be provided in the circuit layer 100, the buffer layer 200, and the protective layer 300 at positions corresponding to each other, and the upper surface of the wafer W may be provided.
  • the second auxiliary line AL2 having the same shape may be provided at a position corresponding to the first auxiliary line AL1.
  • the first auxiliary line AL1 may be provided only in any one of the circuit layer 100, the buffer layer 200, and the protective layer 300, but more preferably, each of the first auxiliary lines AL1 is provided in each layer. Do.
  • the circuit layer 100, the buffer layer 200, and the protective layer 300 are preferably all made of a transparent material. Accordingly, the first auxiliary line AL1 provided in each layer penetrates each other. When viewed from the top of the protective layer 300 is preferably provided so that all can be seen. Therefore, when the first auxiliary line AL1 is provided at a position corresponding to each other, when the respective layers of the LED inspection apparatus 1 are combined, there is an effect that can be combined at the correct position.
  • a second auxiliary line AL2 corresponding to the first auxiliary line AL1 is also provided on the upper surface of the wafer W, and each of the first auxiliary lines when the LED inspection apparatus 1 contacts the upper surface of the wafer W is provided.
  • the prober unit 110 and the micro LEDs 10 may be brought into contact with each other at an accurate position.
  • the positive electrode inspecting portion 111 and the negative electrode inspecting portion 112 protruding from the prober portion 110 are separated from the wafer (
  • Each of the micro LEDs 10 provided on the W) may be in contact with the correct position of the positive electrode 11 and the negative electrode 12, respectively. Therefore, it is possible to inspect the plurality of micro LEDs 10 provided on the wafer W sequentially or simultaneously.
  • the first auxiliary line AL1 and the second auxiliary line AL2 described above may be directly provided in each layer and the wafer W, or may be provided in separate sheets and disposed on an upper surface of each layer and the wafer W. It may be provided by bonding the sheet
  • the light detector 400 may be further provided on the lower surface of the wafer W as described above.
  • the photodetector 400 may be provided to contact the bottom surface of the wafer (W).
  • the light detector 400 is configured to detect light generated by the operation of the micro LED 10 and inspect the optical characteristics of the micro LED.
  • Each of the anode inspecting unit 111 and the cathode inspecting unit 112 includes a wafer (W). When a current is applied to the micro LED 10 by contacting and energizing the positive electrode 11 and the negative electrode 12 of the plurality of micro LEDs 10 provided thereon, each of the micro LEDs 10 may operate.
  • the light detector 400 detects the light emitted from each micro LED 10 through a photodiode built in the light detector 400 It is possible to determine whether the micro LED 10 of good or bad through the optical characteristics of each micro LED.
  • the LED transfer device 6 of the present invention is a device for transferring a plurality of micro LEDs 10 manufactured on the wafer W, and the LED transfer device 6 is vertically lowered to be brought into contact with the wafer W.
  • the above micro LEDs 10 can be checked and picked up simultaneously.
  • FIG. 11 is a cross-sectional view showing an LED transport apparatus of an embodiment of the present invention.
  • the LED transport device 6 is positioned on the first layer 600 and the upper surface of the first layer 600 having two or more micro LED check pickups 610 on a lower surface thereof in direct contact with the micro LEDs.
  • the second layer 700 and the third layer 800 positioned on the upper surface of the second layer 700 are included.
  • the LED transfer device 6 includes a first layer 600 having two or more micro LED check pickups 610 on a bottom surface in contact with an upper surface of the micro LED 10.
  • the first layer 600 includes two or more micro LED check pickups 610.
  • the micro LED check pickup unit 610 checks whether the micro LED 10 operates normally and simultaneously grips and picks it up in order to lift the micro LED 10 in a vertical direction. It is preferable to be provided to correspond to the number.
  • the micro LED check pick-up unit 610 may be arranged side by side in the horizontal and vertical directions to correspond to the arrangement of the micro LED 10 on the wafer (W).
  • the micro LED check pickup unit 610 may be arranged side by side in a plurality of matrices in the horizontal and vertical directions.
  • the plurality of micro LEDs 10 are named in order of the first micro LED 10, the second micro LED 10, and the third micro LED 10 according to the position order of the matrix. can do.
  • Figure 12 for convenience of description is arranged in three horizontal and three vertical, if the distance between the wires to be described later can be provided without limitation in the number.
  • the micro LED check pickup unit 610 includes check units 611 and 612 for checking the micro LED 10 and a pickup unit 613 for picking up the micro LED 10 in a vertical direction.
  • the inspection units 611 and 612 may play the same role as the inspection units 111 and 112 of the LED inspection device 1, but the transfer device 6 and the inspection device 1 may be different from each other in the configuration of different devices. The description will be made with a name and a drawing number.
  • the inspection units 611 and 612 are configured to check whether the micro LED 10 operates normally by contacting and energizing the P and N electrodes 11 and 12 of the micro LED 10. And a negative electrode check unit 612.
  • the positive electrode checker 611 and the negative electrode checker 612 of the checkers 611 and 612 are positioned to correspond to the positive electrode 11 and the negative electrode 12 of the micro LED 10, respectively.
  • the positive electrode check unit 611 and the negative electrode check unit 612 are respectively the positive electrode 11 and the negative electrode ( 12 may be applied to the micro LED 10. Therefore, the positive electrode check unit 611 and the negative electrode check unit 612 are preferably composed of a conductor.
  • a conventional method such as selecting a micro LED that exceeds or falls below the range by using a predetermined range of electrical characteristics such as a specific resistance or current value in advance as a normal operating range can be used.
  • the scope of rights is not limited thereto.
  • the positive electrode checker 611 and the negative electrode checker 612 are metal mesh methods for filling the grooves with conductive materials after the grooves are formed on the first layer 600 through imprinting. It can be prepared by.
  • the pickup unit 613 is located between the check unit (611, 612).
  • the pickup unit 613 may be located between the positive electrode check unit 611 and the negative electrode check unit 612.
  • the pickup portion 613 is preferably formed with a wide contact surface with the micro LED (10).
  • the pick-up unit 613 according to the present invention can operate normally as described below.
  • the pick-up part 613 according to the present invention preferably picks up the micro LED 10 through static electricity in an electrostatic manner.
  • FIG. 13 is a perspective view illustrating a bottom surface of a first layer according to an embodiment of the present invention.
  • the inspection units 611 and 612 and the pickup unit 613 may have a shape in which grooves having a rectangular shape are formed on the bottom surface of the first layer 600.
  • the upper surface may have a shape having a circular hole to which an electrode may be applied. The grooves of the lower surface and the holes of the upper surface are connected to penetrate each other, and both the inner groove and the circular hole are preferably filled with a conductive material.
  • the micro LED pickup checker 610 may include a positive electrode checker 611, a negative electrode checker 612, and a positive electrode checker 611 and a cathode checker ( It may be formed to include a pickup unit 613 provided between the 612.
  • the positive electrode check unit 611, the negative electrode check unit 612, and the pickup unit 613 formed as rectangular grooves may be provided side by side with a predetermined interval therebetween.
  • a predetermined interval between the positive electrode check unit 611, the negative electrode check unit 612, and the pickup unit 613 may be a positive electrode check unit 611, a negative electrode check unit 612, and a pickup unit 613.
  • the micro LED pickup checker 610 may have a shape in which a circular hole is formed on upper surfaces of the anode checker 611, the cathode checker 612, and the pickup 613 formed as the rectangular grooves.
  • the positive electrode check unit 611, the negative electrode check unit 612, and the pickup unit 613 are each formed only in a circular hole shape, the contact area with the micro LED 10 is narrow, so that the electrode 11 of the micro LED 10 is narrow. , 12) it is difficult to make accurate contact. Accordingly, there is a problem that the micro LED 10 in the normal state may also be determined to be in an abnormal state due to incorrect contact.
  • the positive electrode check unit 611, the negative electrode check unit 612, and the pick-up unit 613 are formed on a lower surface of the micro LED pick-up inspection unit 610 as a rectangular groove disposed at predetermined intervals as described above. Is preferably provided.
  • the contact area with the micro LED 10 is widened to contact the electrodes 11 and 12. It may be easy, and the contact area of the pickup portion 613 is also widened to make it easier to pick up the micro LED 10.
  • the upper surfaces of the anode check unit 611, the cathode check unit 612, and the pickup unit 613 are provided with circular holes, it may be easier to design circuits disposed on the upper side of the first layer 600 so as not to overlap each other. Can be.
  • the first layer 600 may be made of a soft material, for example, a transparent material having elasticity such as UV Resin, SU-8, or PDMS (Polydimethylsiloxane). It is a relatively conductive material because the thickness of the micro LED 10 is very thin and the micro when the hard inspection unit 611, 612 or the pickup unit 613 touches the top surface of the micro LED 10 for inspection and pickup. This is to prevent the impact applied to the LED 10 as much as possible.
  • a soft material for example, a transparent material having elasticity such as UV Resin, SU-8, or PDMS (Polydimethylsiloxane). It is a relatively conductive material because the thickness of the micro LED 10 is very thin and the micro when the hard inspection unit 611, 612 or the pickup unit 613 touches the top surface of the micro LED 10 for inspection and pickup. This is to prevent the impact applied to the LED 10 as much as possible.
  • FIGS. 14 and 15 is a perspective view showing a bottom surface of a first layer of another embodiment of the present invention
  • FIG. 15 is a cross-sectional view showing a side surface of the LED transfer device according to another embodiment of the present invention.
  • the first layer 600 ′ of another embodiment of FIGS. 14 and 15 will be referred to as 600 ′ in order to distinguish it from the first layer 600 of the embodiment described above with reference to FIG. 13.
  • the inspection units 611 and 612 may have a shape in which grooves having a rectangular shape are formed on the bottom surface of the first layer 600 ′ as in the exemplary embodiment.
  • the grooves of the lower surface and the holes of the upper surface are connected to penetrate each other, and both the inner groove and the circular hole are preferably filled with a conductive material. Detailed description is the same as in the above embodiment and will be omitted, and will be described in detail in different parts.
  • the first layer 600 ′ of another embodiment of the present invention may be provided so that the pickup unit 613 is not exposed to the lower surface. That is, the upper surface of the first layer 600 ′ may be filled with a conductive material through a circular hole as shown in FIG. 12, but it is preferable that the upper surface of the first layer 600 ′ is not penetrated and exposed to the lower surface.
  • the pickup unit 613 may be provided so as not to be exposed to the lower surface, and the micro LED 10 may be picked up by static electricity by generating static electricity on the unexposed lower surface.
  • the lower surface of the pickup unit 613 is made of a transparent material having elasticity such as UV Resin, SU-8, or PDMS (Polydimethylsiloxane), and the UV is applied by applying a voltage to the pickup unit 613 to form an electric field.
  • Static electricity may be generated on the contact surface of a transparent material having elasticity such as Resin, SU-8, or polydimethylsiloxane (PDMS).
  • the micro LED 10 may be contacted and picked up by the static electricity generated in the contact surface.
  • the second layer 700 may be positioned to contact the top surface of the first layer 600.
  • the second layer 700 includes a first positive electrode wire 721 and a first negative electrode wire 722 having one end electrically connected to the positive electrode check part 611 and the negative electrode check part 612 of the first layer 600, respectively. It is provided with, the pick-up conduction point 713 is further provided.
  • a layer in which inspection wires 721 and 222 are arranged in two layers and a pickup wire 823 are arranged in two layers to arrange two kinds of wires having different purposes within a small range due to the characteristics of the micro LED 10.
  • the first positive electrode wire 721 and the first negative electrode wire 722 are provided on the second layer 700, and are electrically connected to the pickup unit 613 to supply power.
  • the blocking wire is preferably provided in the third layer 800 after passing through the second layer 700 through the pickup conduction point 713.
  • the first positive electrode wire 721 may be provided as a conductor so that one end thereof may be electrically connected to the positive electrode check unit 611.
  • the first negative electrode wire 722 may also be provided as a conductor so that one end thereof may be electrically connected to the negative electrode check unit 612. Can be connected.
  • the first positive electrode wire 721 and the first negative electrode wire 722 are preferably disposed so as not to cross each other.
  • a plurality of first positive electrode wires 721 and first negative electrode wires 722 may be provided in plurality so that one end thereof is electrically connected to the positive electrode check part 611 and the negative electrode check part 612, respectively.
  • each of the first positive electrode wire 721 and the first negative electrode wire 722 may be electrically connected to a separate positive electrode switch unit and a negative electrode switch unit, respectively.
  • the positive electrode switch unit and the negative electrode switch unit according to the first embodiment may be provided with the number of the first positive electrode wires 721 and the first negative electrode wires 722.
  • FIG. 16 is a cross-sectional view illustrating a top surface of a second layer according to a fourth embodiment of the present invention.
  • one column is defined based on the longitudinal (vertical) direction, and the first, second, and third columns are sequentially defined from the left to the right in the horizontal (horizontal) direction.
  • it is defined as one "row” on the basis of the lateral (horizontal) direction, and defined as one row, two rows, and three rows sequentially from the upper side to the lower direction in the longitudinal (vertical) direction.
  • the first positive electrode wire 721 and the first negative electrode wire 722 of the fourth embodiment may include the positive electrode check part 611 and the negative electrode check part 612. It may be provided as many as.
  • each of the first positive electrode wire 721 and the first negative electrode wire 722 may be electrically connected to and controlled by a separate positive electrode switch unit and a negative electrode switch unit, respectively.
  • the first positive electrode wires 721 in one row and one column are electrically connected to the first positive electrode switch unit
  • the first positive electrode wires 721 in the first row and two columns are the second positive electrode switch unit and the first one in the first row and three columns.
  • the positive electrode wire 721 is the third positive electrode switch part, the first positive electrode wire 721 in the second row and the first row is the fourth positive electrode switch part, and the first positive electrode wire 721 in the second row and the second row is the fifth positive electrode switch part, respectively. It may be connected to a separate positive electrode switch. Accordingly, each of the first positive electrode wires 721 may be separately applied and cut off by a separate positive electrode switch.
  • the first negative electrode wire 722 may also be sequentially connected to a separate negative electrode switch unit. Accordingly, each of the first negative electrode wires 722 may be individually applied and cut off by a separate negative electrode switch unit.
  • the current when current is sequentially applied to the first positive electrode switch part and the first negative electrode switch part, the current is applied to the first positive electrode wire 721 and the first negative electrode wire 722 corresponding to the first position, thereby providing a first current. 1 You can check the micro LED (10). Subsequently, when a current is applied to the second positive electrode switch part and the second negative electrode switch part, the current is applied to the first positive electrode wire 721 and the first negative electrode wire 722 corresponding to the second position so that the second micro LED You can check (10).
  • 17 is a cross-sectional view illustrating a top surface of a second layer according to a fifth embodiment of the present invention.
  • the first positive electrode wire 721 of the fifth embodiment may be provided by the number of columns or rows, and the first negative electrode wire 722 may be provided by the number of micro LEDs 10 to be inspected.
  • the anode check unit 611 in the same column or the same row may be electrically connected through one first anode wire 721. More specifically, the first positive electrode wire 721 electrically connected to the positive electrode check unit 611 in the same column or the same row may be connected to one positive electrode switch unit to simultaneously control the application or interruption of the current.
  • the positive electrode check unit 611 of one row, two rows and three rows of one column may be connected to one first positive electrode switch unit.
  • the anode check unit 611 in two columns, one row, two rows and three rows has one second anode switch unit, and the anode check unit 611 in three rows, one row, two rows and three rows has one anode. 3 can be connected to the positive switch unit. Therefore, the anode check units 611 in the same row may be simultaneously applied and interrupted by the same switch unit, respectively.
  • the negative electrode checker 612 is connected to a separate first negative electrode wire 722 so that current can be applied and cut off individually by each negative switch unit.
  • the micro LEDs 10 corresponding to the micro LEDs 10 may be inspected, and when the current is applied to the cathode switch units of the first and second rows, the micro LEDs 10 corresponding to the positions of the first and second rows may be checked. In this way, when the first positive electrode wire 721 is connected to the same switch unit, the wiring of the circuit can be reduced, so that each micro LED 10 can be sequentially inspected even through a circuit having a small area.
  • the third layer 800 is positioned to contact the upper surface of the second layer 700 and is provided in the second layer 700.
  • a plurality of pick-up electrification points 713 and a plurality of first pick-up wires 823 each having one end electrically connected thereto may be provided.
  • the first pickup wire 823 may be provided in the third layer 800.
  • a plurality of first pick-up wires 823 are preferably provided so that one end is electrically connected to each of a plurality of pick-up electrification points 713, wherein the plurality of pick-up wires are micro It is preferable that the number of LEDs 10 be the same.
  • the first pickup wire 823 may be a wire to which an electrostatic generating current is supplied to pick up the micro LED 10.
  • Each of the first pickup wires 823 may be connected to a separate pickup switch unit. Therefore, the pickup switch units connected separately, respectively, are controlled separately, so that each first pickup wire 823 can be powered on and off individually.
  • an electrode is not applied to the corresponding pickup switch unit of the pickup unit 613 corresponding to the micro LED 10 whose electrical operation is determined to be abnormal.
  • the pickup unit 613 controls the power to be applied only to the pickup switch unit corresponding to the micro LED 10 of the good article checked by the check units 611 and 612 in a normal operation, thereby ensuring that the micro LED ( Only 10) can be picked up and transported selectively.
  • FIGS. 18 to 20 is an exploded perspective view showing each layer of a modified embodiment of the present invention.
  • the second layer 700 may be positioned to contact the top surface of the first layer 600.
  • the second layer 700 includes two or more pickups 613 provided in the first layer 600 and second pickup wires 723, one end of which is electrically connected to each other, and includes a positive electrode conduction point 711 and a negative electrode.
  • a conduction point 712 is further provided.
  • a layer in which pickup wires 723 are arranged in two layers and inspection wires 821 and 322 are arranged in order to arrange two kinds of wires having different purposes within a small range due to the characteristics of the micro LED 10. It is preferable to provide a layer to be the second layer 700 and the third layer 800, respectively.
  • the second pickup wire 723 is provided on the second layer 700, and is electrically connected to the positive electrode check unit 611 and the negative electrode check unit 612 to supply power. And the wires to be blocked are provided in the third layer 800 after passing through the second layer 700 through the positive electrode current point 711 and the negative electrode current point 712.
  • the second pick-up wire 723 provided on the second layer 700 may be provided as a conductor so that one end thereof may be electrically connected to the pick-up part 613, and the positive electrode current point 711 and the negative electrode current point 712 may also be provided. It is provided as a conductor and one end may be electrically connected to the positive electrode check unit 611 and the negative electrode check unit 612.
  • the second pick-up wire 723, the positive electrode conduction point 711 and the negative electrode conduction point 712 are preferably disposed at predetermined intervals so as not to contact each other.
  • the second positive electrode wire 821 and the second negative electrode wire 822 provided in the third layer 800 are respectively provided with the positive electrode conduction point 711 and the negative electrode conduction provided in the second layer 700. Point 712 and one end may be electrically connected.
  • a plurality of second positive electrode wires 821 and second negative electrode wires 822 according to a modified embodiment may be provided in plurality so that one end is electrically connected to the positive electrode conductive point 711 and the negative electrode conductive point 712, respectively.
  • each of the second positive electrode wire 821 and the second negative electrode wire 822 may be electrically connected to a separate positive electrode switch unit and a negative electrode switch unit, respectively.
  • the positive electrode switch unit and the negative electrode switch unit according to the sixth embodiment may be provided with the number of the second positive electrode wires 821 and the second negative electrode wires 822.
  • FIG. 19 is a cross-sectional view illustrating an upper surface of a third layer according to a sixth embodiment of the present invention.
  • the second positive electrode wire 821 and the second negative electrode wire 822 may be provided as many as the number of the positive electrode check unit 611 and the negative electrode check unit 612. Can be.
  • each of the second positive electrode wire 821 and the second negative electrode wire 822 may be electrically connected to and controlled by a separate positive electrode switch unit and a negative electrode switch unit, respectively.
  • the second positive electrode wire 821 in one row and one column is electrically connected to the first positive electrode switch unit
  • the second positive electrode wire 821 in two rows and one row is the second positive electrode switch unit and the second row in three rows.
  • the positive electrode wire 821 is the third positive electrode switch part, the first positive electrode wire 821 in the second row and the first column is the fourth positive electrode switch part, and the second positive electrode wire 821 in the second row and the second column is the fifth positive electrode switch part, respectively. It may be connected to a separate positive electrode switch. Accordingly, each of the second positive electrode wires 821 may be individually applied and cut off by separate anode switches.
  • the second negative electrode wire 822 may also be sequentially connected to the separate negative electrode switch part. Accordingly, each of the second negative electrode wires 822 may be separately applied and cut off by a separate negative electrode switch.
  • the current when current is sequentially applied to the first positive electrode switch part and the first negative electrode switch part, the current is applied to the second positive electrode wire 821 and the second negative electrode wire 822 corresponding to the first position, thereby providing a first current. 1 You can check the micro LED (10). Subsequently, when a current is applied to the second positive electrode switch part and the second negative electrode switch part, the current is applied to the second positive electrode wire 821 and the second negative electrode wire 822 corresponding to the second position so that the second micro LED You can check (10).
  • 20 is a cross-sectional view illustrating a top surface of a third layer according to a seventh embodiment of the present invention.
  • the second positive electrode wire 821 of the seventh embodiment may be provided by the number of columns or rows, and the second negative electrode wire 822 may be provided by the number of micro LEDs 10 to be inspected.
  • the anode check unit 611 in the same column or the same row may be electrically connected through one second anode wire 821. More specifically, the second positive electrode wire 821 electrically connected to the positive electrode check unit 611 in the same column or the same row may be connected to one positive electrode switch unit to simultaneously control the application or interruption of the current.
  • the anode check unit 611 of one row, two columns, and three columns of one row may be connected to one first anode switch unit.
  • the anode check unit 611 in two rows, one column, two columns, and three columns includes one second anode switch unit, and the anode check unit 611 in three rows, one column, two columns, and three columns includes one single anode. 3 can be connected to the positive switch unit. Therefore, the anode check units 611 in the same row may be simultaneously applied and interrupted by the same switch unit, respectively.
  • the negative electrode check unit 612 may be connected to a separate second negative electrode wire 822 so that current may be applied and cut off individually by each negative switch unit.
  • the current is applied to the position of one row and one column.
  • the corresponding micro LED 10 may be checked, and when the current is applied to the cathode switch unit of the first row and the second column, the micro LED 10 corresponding to the position of the first row and the second column may be checked.
  • the second positive electrode wire 821 is connected to the same switch unit, wiring of the circuit can be reduced, and each micro LED 10 can be sequentially inspected even through a circuit having a small area.
  • the first layer 600 is not included, and only the second layer 700 and the third layer 800 may be included.
  • Further preferred embodiments to be described below are modified embodiments of the one embodiment and the other embodiments, and the description of the same parts will be omitted, and thus different features will be described in detail.
  • 21 and 22 are cross-sectional views showing the side of the LED transfer device of a further embodiment of the present invention.
  • the LED transfer device 6 of the additional embodiment may include only the second layer 700 and the third layer 800.
  • Each of the second layer 700 and the third layer 800 may be formed of the soft material described above in one embodiment, and may be made of a transparent material having elasticity such as UV Resin, SU-8, or polydimethylsiloxane (PDMS). It is preferable to make.
  • PDMS polydimethylsiloxane
  • the second layer 700 of a further embodiment includes a positive electrode checker 611 and a negative electrode checker 612 on a lower surface thereof, and one end of the positive electrode checker 611 and a negative electrode checker 612 is electrically connected to the upper surface of the second layer 700.
  • a first positive electrode wire 721 and a first negative electrode wire 722 connected thereto may be provided.
  • the positive electrode check unit 611 and the negative electrode check unit 612 are provided to protrude downward.
  • the protruding positive electrode checker 611 and the negative electrode checker 612 are in contact with the positive electrode 11 and the negative electrode 12 of the micro LED 10 by vertically moving the LED transfer device 6 downward. Each micro LED 10 can be checked.
  • the first positive electrode wire 721 and the first negative electrode wire 722 may be provided on the upper surface of the second layer 700 as described above in the above embodiment. At one end of each of the first positive electrode wire 721 and the first negative electrode wire 722, the positive electrode check part 611 and the negative electrode check part 612 may be provided to protrude through the second layer 700. Each of the first positive electrode wire 721 and the first negative electrode wire 722 may be provided according to various embodiments as in the above-described one embodiment and the other embodiments.
  • the third layer 800 is positioned to be in contact with the top surface of the second layer 700, and includes a pickup part 613 on the bottom surface, and a plurality of first pickup wires having one end electrically connected to the pickup part 613. 823 may be further provided.
  • Each of the first positive electrode wire 721, the first negative electrode wire 722, and the first pick-up wire 823 may be provided at different layers as shown in FIG. 23.
  • the pickup unit 613 may be provided so as not to protrude from the lower surface of the third layer 800 as shown in FIG. 21, and more preferably, the lower surface of the third layer 800 as shown in FIG. 22.
  • Pickup portion 613 may be provided to protrude from.
  • the pick-up part 613 protruding may be inserted into and coupled to an upper surface of the second layer 700. Therefore, the pick-up unit 613 may not be in direct contact with the micro LED 10, but may be positioned relatively close to the micro LED 10 to facilitate pick-up due to static electricity.
  • each layer of a further embodiment of the present invention will be described in detail with reference to FIGS. 23 and 24.
  • the second positive electrode wire 721 and the first negative electrode wire 722 are separately provided in each of the inspection pickup parts 610 in the second layer 700 as in the above-described embodiment.
  • a first pick-up wire 823 may be provided to correspond to one check pick-up unit 610.
  • each of the wires 721, 722, 823 may be provided so that the same wires are electrically connected to each other so that the supply of power can be controlled by one power source. Arrangement of each of the wires 721, 722, and 823 has been described in detail through the above embodiment, and thus will be omitted below. Referring to FIG.
  • pickup wires connected to the pickup part 613 for each inspection pickup part 610 are separately provided as the positive pick-up wire 8231 and the negative pick-up wire 8232. It may be provided to correspond.
  • the pickup unit 613 is also provided in two so as to protrude downward in one end of each of the positive electrode pick-up wires 8231 and the negative pick-up wires 8232. That is, even if the pick-up unit 613 is separately provided as a positive pick-up unit and a negative pick-up unit, respectively, as shown in FIGS. 21 and 22, each pick-up unit 613 may be configured so as not to directly contact the micro LED 10. It is preferable to be provided so as not to penetrate the layer 700.
  • This passing top and bottom surfaces are preferably coated with an insulator.
  • the conduction points 711, 712, 713 provided on the second layer 700 pass through the second layer 700 and the wires 821, 822, 823 provided in the third layer 800. It is preferable to be provided to be electrically connected.
  • the wires 721, 722, and 723 provided on the second layer 700 and the wires 821, 822, and 823 provided on the third layer 800 should not be electrically connected to each other.
  • the upper and lower surfaces through which 721, 722, 723, 821, 822, and 823 pass are preferably coated with an insulator so as not to be energized with each other.
  • the insulator may be an insulator made of a different material, but it is more preferable that the insulator is provided with an insulator made of the same soft material as each of the second layer 700 and the third layer 800.
  • UV resin, SU-8 or PDMS Polydimethylsiloxane
  • UV resin, SU-8 or PDMS Polydimethylsiloxane
  • the arrangement of the wires of the above-described embodiments is only an embodiment, and may be variously modified according to the distance, the number, the area of the layer, etc. of the micro LED 10 to be inspected.
  • FIGS. 25 to 27 are cross-sectional views showing a micro LED transfer step of an embodiment of the present invention
  • Figure 26 is a cross-sectional view showing a micro LED transfer step of another embodiment of the present invention
  • Figure 27 is a micro LED transfer step of a further embodiment of the present invention It is sectional drawing shown.
  • the micro LED transfer step of the present invention may include a micro LED checking step and a micro LED selection pick-up step, and selectively transfer only the micro LED 10 picked up by the micro LED selection pick-up step.
  • the LED transfer device 6 is placed on the upper surface of the wafer W on which the plurality of micro LEDs 10 are arranged, and the LED transfer device 6 is connected to the micro LED 10.
  • the inspection units 611 and 612 move downward to contact each electrode.
  • a power is applied to the anode wire 721 and the cathode wire 722 provided in the second layer 700 to check whether the micro LED 10 is electrically operated normally.
  • the plurality of positive electrode wires 721 and the negative electrode wires Power may be applied to the 722 to check whether the micro LED 10 operates normally.
  • the plurality of micro LEDs 10 may be simultaneously checked by the application of electrodes, but according to an exemplary embodiment, the electrodes may be sequentially applied and checked one by one.
  • the micro LED transfer step is performed only in the pickup unit 613 corresponding to the micro LED 10 checked in the normal operation according to the normal operation of the micro LED 10 checked in the micro LED checking step. Can be applied.
  • the pick-up wire 823 provided in the third layer 800 has the LED transfer device 6 in a state in which power is applied only to the pick-up wire 823 at a position corresponding to the micro LED 10 checked for normal operation. ) Is lifted to the upper side, only the normal operation micro LED 10 of the portion to which power is applied may be gripped by the corresponding pickup unit 613 to be selectively picked up and transported.
  • the normal operation micro LED 10 is picked up by the check pick-up unit 610, the abnormal micro LED 10 is left on the wafer (W). Therefore, only the normally operating micro LED 10 picked up by the LED transfer device 6 can be selectively transferred to the desired space. In addition, the abnormal micro LED 10 can be discarded together with the wafer W used to shorten the inspection step and the transfer step.
  • the micro LED pick-up inspection unit 610 is moved to each micro by placing the LED transfer device 6 on the upper surface of the wafer W and vertically moving the LED transfer device 6 downward. To the LED 10. Thereafter, in the micro LED checking step, power is applied to the positive electrode wire 821 and the negative electrode wire 822 provided in the third layer 800 to check whether the micro LED 10 is electrically operated normally. After selecting the micro LED 10 in the normal state and the abnormal state by the micro LED check step, the micro LED transfer step can be made. In detail, the micro LED transfer step may apply current only to the pickup unit 613 corresponding to the micro LED 10 checked in the normal operation according to whether the micro LED 10 checked in the micro LED checking step operates normally. Can be.
  • the pick-up wire 723 of the second layer 700 may be supplied with power only to the pick-up wire at a position corresponding to the micro LED 10 checked for normal operation. Therefore, only the micro LED 10 in the normal operating state is gripped by the corresponding pickup unit 610 and can be selectively picked up and transported. That is, the normal operation micro LED 10 is picked up by the check pick-up unit 610, the abnormal micro LED 10 is left on the wafer (W). Therefore, only the normally operating micro LED 10 picked up by the LED transfer device 6 can be selectively transferred to the desired space. In addition, the abnormal micro LED 10 can be discarded together with the wafer W used to shorten the inspection step and the transfer step.
  • the LED transfer device 6 is positioned on the top surface of the wafer W. As shown in FIG. Thereafter, the LED transfer device 6 is vertically moved downward so that the check units 611 and 612 contact each electrode of the micro LED 10, and the pickup unit 613 is positioned to correspond to each micro LED 10. . At this time, it is preferable that the pickup unit 613 according to an additional embodiment does not directly contact the micro LED 10.
  • the micro LEDs When the inspection units 611 and 612 are in contact with the micro LEDs 10, the micro LEDs are applied to supply the power to the positive and negative wires 721 and 722 provided in the second layer 700. Checking whether the electrical operation of the normal (10) can be carried out.
  • the electrodes 11 and 12 of the plurality of micro LEDs 10 are electrically contacted with the positive electrode check unit 611 and the negative electrode check unit 612, respectively, the plurality of positive electrode wires 721 and the negative electrode wires. Power may be applied to the 722 to check whether the micro LED 10 operates normally.
  • the plurality of micro LEDs 10 may be simultaneously checked by the application of electrodes, but according to an exemplary embodiment, the electrodes may be sequentially applied and checked one by one.
  • the micro LED transfer step includes a current only in the pickup unit 613 corresponding to the micro LED 10 checked in the normal operation according to whether the micro LED 10 checked in the micro LED checking step operates normally. Can be applied.
  • the pick-up wire 823 provided in the third layer 800 has the LED transfer device 6 in a state in which power is applied only to the pick-up wire 823 at a position corresponding to the micro LED 10 checked for normal operation. ) Is lifted to the upper side, only the normal operation micro LED 10 of the portion to which power is applied may be gripped by the corresponding pickup unit 613 to be selectively picked up and transported.
  • the pick-up unit 613 is not directly in contact with the micro LED 10, the electric field is formed by the power supplied to the corresponding pick-up unit 613 of the position checked in the normal operation to generate the static electricity by the corresponding micro LED 10 can be picked up. That is, the normal operation micro LED 10 is picked up by the check pick-up unit 610, the abnormal micro LED 10 is left on the wafer (W). Therefore, only the normally operating micro LED 10 picked up by the LED transfer device 6 can be selectively transferred to the desired space. In addition, the abnormal micro LED 10 can be discarded together with the wafer W used to shorten the inspection step and the transfer step.
  • the cost for the inspection of the LED is reduced, and only the LEDs of the normal state are determined and then transferred, so that no separate determination process is required, and only the LEDs of the good products can be selected and arranged quickly.

Abstract

The present invention relates to an LED testing device for testing whether a micro LED normally operates on a wafer, and to an LED transfer device for sorting out only normally operating micro LEDs by the normal operation test and transferring same. To this end, an LED testing device of the present invention comprises: two or more prober units; and a testing unit conducting electricity by making contact with an electrode of a micro LED, thereby testing whether the micro LED normally operates. In addition, the two or more prober units are arranged side by side into a plurality of matrices in horizontal and vertical directions so as to correspond to an array of micro LEDs on the wafer, and are provided in a circuit layer of a soft material. Additionally, a buffer layer made of the same material as the circuit layer is further provided on the upper surface of the circuit layer. Moreover, an LED transfer device of the present invention comprises: a pickup unit for picking up an micro LED; and a checking unit conducting electricity by making contact with an electrode of a micro LED, thereby testing whether the micro LED normally operates, wherein the pickup unit selectively picks up only micro LEDs having been checked to be operating normally by the checking unit.

Description

LED 검사 장치 및 이송 장치LED inspection device and transfer device
본 발명은 LED 검사 장치 및 이송 장치에 관한 것이다. 보다 자세하게는 웨이퍼 상에 형성한 마이크로 LED칩의 정상 동작 여부를 검사하는 검사 장치 및 정상 동작 여부 검사에 의해 정상 동작 마이크로 LED만을 선별하여 이송하는 이송 장치에 관한 것이다.The present invention relates to an LED inspection device and a transfer device. More specifically, the present invention relates to an inspection apparatus for inspecting whether the micro LED chip formed on the wafer is in normal operation and a transfer device for selecting and transferring only the normal operation micro LED by the normal operation inspection.
크기가 수 내지 수십 마이크로 미터 정도의 마이크로 LED는 저전력화, 소형화 및 경량화가 필요한 광 응용분야에 널리 사용될 수 있어 현재 개발이 활발히 진행되고 있다.Micro LEDs, ranging in size from several to tens of micrometers, can be widely used in optical applications that require low power, miniaturization, and light weight.
하지만, 완성된 마이크로 LED를 웨이퍼에서부터 목적 기판에 이송을 하기 전에, 전기적으로 양품인지를 선별 및 검사하는 과정이 반드시 필요함에도 불구하고, 마이크로 LED의 크기가 매우 작아 적절한 이송 및 검사 방법이 없고, 종래의 방법으로는 깨지거나 망가지는 문제 또는 수작업에 따른 단가 상승 문제가 발생되고 있다. 또한, 웨이퍼에서 직접 복수의 마이크로 LED의 전기적 양품 상태를 검사하지 않고 목적 기판으로 이송하면, 목적 기판에서 나중에 마이크로 LED의 불량이 발생된 경우 목적 기판 자체가 불량이 될 수 있는 문제점이 있다. 추가적으로, 종래의 방법은 하나의 마이크로 LED칩만을 이송하는 방식으로, 이송 시간이 길고 이송의 반복횟수가 많아 양산 비용이 증가하는 문제점이 있다.However, even before the transfer of the finished micro LED from the wafer to the target substrate, although the process of screening and inspecting whether the product is electrically good is necessary, the size of the micro LED is very small, there is no proper transfer and inspection method, In this method, the problem of cracking or breaking, or the cost increase due to manual labor is caused. In addition, if the wafer is transferred to the target substrate without inspecting the electrical good state of the plurality of micro LEDs directly from the wafer, there is a problem that the target substrate itself may be defective when a defect of the micro LED occurs later on the target substrate. In addition, the conventional method is a method of transferring only one micro LED chip, there is a problem that the transfer time is long and the mass production cost increases due to the large number of repetitions of the transfer.
선행문헌으로 대한민국 등록특허 제10-1183978호(선행문헌 1) 및 대한민국 등록특허 제10-1585818호(선행문헌 2)가 있다. 선행문헌 1은 하나의 LED칩을 검사하기 위해 LED 칩을 고정하는 지그 유닛에 관한 것으로, 선행문헌 1에서와 같이 종래의 기술에 따르면 LED를 하나씩 각각 별도로 검사해야 하므로 번거로우며 시간이 많이 소요되는 문제점이 있으며, 마이크로 LED는 매우 작고 약하기 때문에 선행문헌 1과 같이 검사하는 것이 불가능하다. 선행문헌 2는 칩을 구별할 수 없다는 문제점이 있다.Prior art documents include Korean Patent No. 10-1183978 (Prior Document 1) and Korean Patent No. 10-1585818 (Prior Document 2). Prior Art 1 relates to a jig unit for fixing an LED chip to inspect a single LED chip, and according to the prior art as in Prior Art 1, it is cumbersome and time-consuming since the LEDs must be inspected separately one by one. There is a micro LED is very small and weak, so it is impossible to check as in the prior art. Prior art 2 has a problem that can not distinguish the chip.
선행문헌 2는 마이크로 소자 이송 방법에 관한 것으로, 이송 헤드에 인가된 전류로 마이크로 소자를 픽업할 수 있지만, 마이크로 소자의 양품 검사가 불가하며, 불량 상태의 마이크로 소자까지도 동시에 픽업하여 별도의 양품 검사가 필요하다는 문제점이 있다.Prior art 2 relates to a micro element transfer method, which can pick up a micro element with a current applied to a transfer head, but it is impossible to inspect the micro element. There is a problem that it is necessary.
이와 같이, 종래의 LED 검사 장치 및 이송 장치는 크기가 수 마이크로 단위까지 소형화된 마이크로 LED의 경우 적용될 수 없기 때문에 고정밀도로 웨이퍼 상에서 마이크로 LED의 양품 여부를 검사하고, 정상 동작 마이크로 LED만을 선별하여 이송하는 기술 개발이 요구되는 바, 이에 본 발명에서는 마이크로 LED의 이송 전 웨이퍼 상에서 양품 검사를 진행하고, 동시에 양품으로 판정된 마이크로 LED만을 선택적으로 이송하는 기술을 제안하고자 한다.As such, the conventional LED inspection apparatus and the transfer apparatus cannot be applied in the case of micro LEDs which are downsized to several micro units in size, thereby inspecting the quality of the micro LEDs on the wafer with high precision, and selecting and transferring only the normal operating micro LEDs. Since the development of the technology is required, the present invention proposes a technology for conducting a good product inspection on a wafer before the transfer of the micro LEDs and simultaneously transferring only the micro LEDs determined as good products.
[특허문헌][Patent Documents]
대한민국 등록특허 제10-1183978호 (2012.09.12 등록)Republic of Korea Patent No. 10-1183978 (Registered 12/12/2012)
대한민국 등록특허 제10-1585818호 (2016.01.08 등록)Republic of Korea Registered Patent No. 10-1585818 (2016.01.08 registration)
본 발명의 기술적 과제는 웨이퍼 상에서 양품의 LED를 판별하는 것이다.The technical problem of the present invention is to determine the LED of the good product on the wafer.
또한, 웨이퍼 상에서 분리되어 기판에 실장된 LED의 정상 동작 상태도 판별 가능한 LED 검사 장치를 제공하는 것이다.In addition, the present invention provides an LED inspection apparatus that is capable of determining a normal operating state of an LED separated on a wafer and mounted on a substrate.
또한, 웨이퍼 상에 나열된 복수의 LED가 정상 동작하는지 여부를 동시에 검사할 수 있는 LED 검사 장치를 제공하는 것이다.The present invention also provides an LED inspection apparatus capable of simultaneously checking whether a plurality of LEDs listed on a wafer are normally operated.
또한, 웨이퍼 상에 나열된 복수의 LED의 전극에 각각의 검사부를 정확하게 대응시킬 수 있는 LED 검사 장치를 제공하는 것이다.Moreover, it is providing the LED test | inspection apparatus which can match each test | inspection part correctly with the electrode of the some LED arranged on the wafer.
또한, 완충층을 구비하여LED에 손상을 입히지 않고 검사 및 이송을 할 수 있는 LED 검사 장치 및 이송 장치를 제공하는 것이다.In addition, the present invention provides an LED inspection apparatus and a transfer apparatus having a buffer layer that can inspect and transfer the LED without damaging the LED.
또한, 둘 이상의 음극 또는 양극 전선을 전기적으로 하나로 연결하여, 각각의 양극 또는 음극 전선의 통전 여부만을 통해 LED의 정상 동작여부를 신속하게 검사할 수 있는 LED 검사 장치를 제공하는 것이다.In addition, by connecting two or more negative or positive wires to one electrically, it is to provide an LED inspection device that can quickly check whether the normal operation of the LED only through the power of each positive or negative wire.
또한, 정상 동작하는 양품의 LED를 판별함과 동시에 양품으로 판별된 LED만을 선택적으로 이송하는 LED 이송 장치를 제공하는 것이다.In addition, it is to provide an LED transfer device for selectively transferring only the LEDs identified as good products and at the same time to determine the LEDs of good products in normal operation.
또한, 점검 및 픽업의 두 가지 목적을 가지는 전선을 복수의 층에 집적시켜 한정된 배치 공간 상에서 최적화된 전선 배치를 할 수 있는 회로를 설계하는 것이다.In addition, by designing a circuit capable of optimizing the wire arrangement in a limited layout space by integrating the wires having two purposes of inspection and pickup in a plurality of layers.
한편, 본 발명이 이루고자 하는 기술적 과제들은 이상에서 언급한 예시적 기술적 과제들로 제한되지 않으며, 언급되지 않은 또 다른 기술적 과제들은 하기의 기재로부터 당업자에게 명확하게 이해될 수 있을 것이다.On the other hand, the technical problem to be achieved by the present invention is not limited to the above-mentioned exemplary technical problems, other technical problems that are not mentioned will be clearly understood by those skilled in the art from the following description.
상기 과제를 달성하기 위하여 본 발명의 LED 검사 장치는 둘 이상의 프로버(Prober)부, LED의 전극에 접촉하여 통전시킴으로써 LED가 정상 동작하는지 여부를 검사하는 검사부를 포함하는 것을 특징으로 한다. 또한, 둘 이상의 프로버부는 웨이퍼 상의 LED의 배열에 대응되도록 가로 및 세로 방향의 복수의 행렬로 나란히 배치되며, 연질의 재질인 회로층에 구비되는 것을 특징으로 한다. 또한, 회로층의 상면에 회로층과 동일한 재질로 구비되는 완충층을 더 포함하는 것을 특징으로 한다.In order to achieve the above object, the LED inspection apparatus of the present invention is characterized in that it comprises two or more prober (Prober), the inspection unit for checking whether the LED is operating normally by contacting and energizing the electrode of the LED. In addition, the two or more prober parts may be arranged in parallel in a plurality of horizontal and vertical matrices so as to correspond to the arrangement of the LEDs on the wafer, and may be provided in a circuit layer made of a soft material. In addition, the upper surface of the circuit layer is characterized in that it further comprises a buffer layer provided with the same material as the circuit layer.
또한, 본 발명의 LED 이송 장치는 LED를 픽업하는 픽업부, LED의 전극에 접촉하여 통전시킴으로써 LED가 정상 동작하는지 여부를 점검하는 점검부를 포함하고, 상기 픽업부는 점검부에서 정상 동작으로 점검된 LED만을 또는 비정상 동작으로 점검된 LED만을 선택적으로 픽업하는 것을 특징으로 한다.In addition, the LED transfer device of the present invention includes a pick-up unit for picking up the LED, a check unit for checking whether the LED is operating normally by contacting and energizing the electrode of the LED, the pick-up unit LED checked by the normal operation in the check unit It is characterized in that it selectively picks up only the LED checked only or abnormal operation.
본 발명에 따르면, 웨이퍼 상에서 LED의 정상 및 비정상 동작을 판별할 수 있는 효과가 있다.According to the present invention, there is an effect that can determine the normal and abnormal operation of the LED on the wafer.
또한, 웨이퍼 상에서 분리된 LED의 정상 및 비정상 동작도 판별할 수 있는 효과가 있다.In addition, there is an effect that can determine the normal and abnormal operation of the LED separated on the wafer.
또한, 웨이퍼 상에 나열된 복수의 LED의 정상 동작 여부를 동시에 판별할 수 있으며, 신속하게 검사를 할 수 있는 효과가 있다.In addition, it is possible to simultaneously determine whether or not the normal operation of the plurality of LEDs listed on the wafer, there is an effect that can be quickly tested.
또한, 마이크로 단위의 약한 마이크로 LED를 손상없이 검사 및 이송할 수 있는 효과가 있다.In addition, there is an effect capable of inspecting and transporting the weak micro LED of the micro unit without damage.
또한, LED의 정상 및 비정상을 선별함과 동시에 양품의 LED만을 선택적으로 이송할 수 있는 효과가 있어, 빠르게 정상 상태의 LED만 목적 기판에 배치할 수 있는 효과가 있다.In addition, there is an effect that can selectively transfer only the LEDs of good products at the same time as screening the normal and abnormal of the LED, there is an effect that can be quickly placed only the LED of the normal state on the target substrate.
이로써, LED의 검사를 위한 비용이 절감되고, 정상 상태의 LED만을 판별한 후 이송시켜 별도의 판별 과정이 필요 없으며, 신속하게 양품의 LED만을 선별하여 배치할 수 있는 효과가 있다.As a result, the cost for the inspection of the LED is reduced, and only the LEDs of the normal state are determined and then transferred, so that no separate determination process is required, and only the LEDs of the good products can be selected and arranged quickly.
도 1은 본 발명의 일 실시예의 LED 검사 장치를 나타낸 사시도이다.1 is a perspective view showing an LED inspection apparatus of an embodiment of the present invention.
도 2는 본 발명의 일 실시예의 웨이퍼의 일부를 확대한 사시도이다.2 is an enlarged perspective view of a portion of a wafer of one embodiment of the present invention;
도 3은 본 발명의 일 실시예의 LED 검사 장치를 나타낸 단면도이다.3 is a cross-sectional view showing an LED inspection apparatus of an embodiment of the present invention.
도 4는 본 발명의 일 실시예의 LED 검사 장치의 검사 상태를 나타낸 단면도이다.4 is a cross-sectional view showing an inspection state of the LED inspection apparatus of an embodiment of the present invention.
도 5는 본 발명의 다른 실시예의 LED 검사 장치의 검사 상태를 나타낸 단면도이다.5 is a cross-sectional view showing an inspection state of the LED inspection apparatus of another embodiment of the present invention.
도 6은 본 발명의 일 실시예의 LED 검사 장치의 각 층을 나타낸 분해 사시도이다.6 is an exploded perspective view showing each layer of the LED inspection apparatus of an embodiment of the present invention.
도 7은 제 1 실시예에 따른 회로층의 상면을 나타낸 단면도이다.7 is a cross-sectional view showing an upper surface of the circuit layer according to the first embodiment.
도 8은 제 2 실시예에 따른 회로층의 상면을 나타낸 단면도이다.8 is a cross-sectional view illustrating a top surface of a circuit layer according to a second embodiment.
도 9는 제 3 실시예에 따른 회로층의 상면을 나타낸 단면도이다.9 is a cross-sectional view illustrating an upper surface of a circuit layer according to a third embodiment.
도 10은 본 발명의 일 실시예의 LED 검사 장치와 웨이퍼의 보조선을 맞추는 과정을 나타낸 단면도이다.10 is a cross-sectional view showing a process of aligning the auxiliary line of the LED inspection apparatus and the wafer of an embodiment of the present invention.
도 11은 본 발명의 일 실시예의 LED 이송 장치를 나타낸 단면도이다.11 is a cross-sectional view showing an LED transport apparatus of an embodiment of the present invention.
도 12는 본 발명의 일 실시예의 각 레이어를 나타낸 분해 사시도이다.12 is an exploded perspective view showing each layer of an embodiment of the present invention.
도 13은 본 발명의 일 실시예의 제 1 레이어의 하면을 나타낸 사시도이다.FIG. 13 is a perspective view illustrating a bottom surface of a first layer according to an embodiment of the present invention. FIG.
도 14는 본 발명의 다른 실시예의 제 1 레이어의 하면을 나타낸 사시도이다.14 is a perspective view showing a bottom surface of a first layer of another embodiment of the present invention.
도 15는 본 발명의 다른 실시예의 LED 이송 장치의 측면을 나타낸 단면도이다.15 is a cross-sectional view showing a side of the LED transfer device of another embodiment of the present invention.
도 16은 본 발명의 제 4 실시예에 따른 제 2 레이어의 상면을 나타낸 단면도이다.16 is a cross-sectional view illustrating a top surface of a second layer according to a fourth embodiment of the present invention.
도 17은 본 발명의 제 5 실시예에 따른 제 2 레이어의 상면을 나타낸 단면도이다.17 is a cross-sectional view illustrating a top surface of a second layer according to a fifth embodiment of the present invention.
도 18은 본 발명의 변형 실시예의 각 레이어를 나타낸 분해 사시도이다.18 is an exploded perspective view showing each layer of a modified embodiment of the present invention.
도 19는 본 발명의 제 6 실시예에 따른 제 3 레이어의 상면을 나타낸 단면도이다.19 is a cross-sectional view illustrating an upper surface of a third layer according to a sixth embodiment of the present invention.
도 20은 본 발명의 제 7 실시예에 따른 제 3 레이어의 상면을 나타낸 단면도이다.20 is a cross-sectional view illustrating a top surface of a third layer according to a seventh embodiment of the present invention.
도 21 및 도 22는 본 발명의 추가적인 실시예의 LED 이송 장치의 측면을 나타낸 단면도이다.21 and 22 are cross-sectional views showing the side of the LED transfer device of a further embodiment of the present invention.
도 23 및 도 24는 본 발명의 추가적인 실시예의 각 레이어를 나타낸 분해 사시도이다.23 and 24 are exploded perspective views showing each layer of a further embodiment of the present invention.
도 25는 본 발명의 일 실시예의 마이크로 LED 이송 단계를 나타낸 단면도이다.25 is a cross-sectional view showing a micro LED transfer step of an embodiment of the present invention.
도 26은 본 발명의 다른 실시예의 마이크로 LED 이송 단계를 나타낸 단면도이다.26 is a cross-sectional view showing a micro LED transfer step of another embodiment of the present invention.
도 27은 본 발명의 추가적인 실시예의 마이크로 LED 이송 단계를 나타낸 단면도이다.Figure 27 is a cross sectional view showing a micro LED transfer step of a further embodiment of the present invention.
본 발명은 둘 이상의 프로버(Prober)부를 포함하는 LED 검사 장치로서, 프로버부에 검사부가 포함되어 있는 것을 특징으로 한다.The present invention is an LED inspection device including two or more prober (Prober), characterized in that the inspection unit is included in the prober.
검사부는 LED 전극에 접촉하여 통전시킴으로써 LED가 정상 동작하는지 여부를 검사하게 된다.The inspection unit checks whether the LED operates normally by contacting and energizing the LED electrode.
이하, 첨부된 도면을 참조하여 본 발명의 실시예에 대하여 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자가 용이하게 실시할 수 있도록 상세히 설명한다. 그러나 본 발명은 여러가지 상이한 형태로 구현될 수 있어, 이하에서 기재되거나 도면에 도시되는 실시예에 한정되지 않는다. 또한 도면에서 본 발명을 명확하게 설명하기 위해서 본 발명과 관계없는 부분은 생략하였으며, 도면에서 동일하거나 유사한 부호들은 동일하거나 유사한 구성요소들을 나타낸다.DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. Also, in order to clearly describe the present invention, parts not related to the present invention are omitted, and the same or similar reference numerals in the drawings indicate the same or similar elements.
본 발명의 목적 및 효과는 하기의 설명에 의해서 자연스럽게 이해되거나 보다 분명해질 수 있으며, 하기의 기재만으로 본 발명의 목적 및 효과가 제한되는 것은 아니다.The objects and effects of the present invention may be naturally understood or more apparent from the following description, and the objects and effects of the present invention are not limited only by the following description.
본 발명의 상세한 설명에 앞서, 이하 설명되는 마이크로 LED(10)는 가장 바람직한 실시예로 기재되는 것이며, 마이크로 LED(10)는 전류가 공급되면, 빛을 방출하는 LED, 반도체 소자는 어느 것이든 적용이 가능할 수 있다. 특히, 마이크로 LED(10)는 수 마이크로 단위로 매우 작은 소자로, 본 발명을 적용하는 경우 가장 효과적일 수 있으므로 이하, 첨부된 도면을 참조하여 마이크로 LED(10)를 실시예로 상세히 설명하도록 한다.Prior to the detailed description of the present invention, the micro LED 10 described below is described as the most preferred embodiment, the micro LED 10 is applied to any LED, semiconductor device that emits light when the current is supplied. This may be possible. In particular, the micro LED 10 is a very small device in a few micro units, and may be most effective when the present invention is applied. Hereinafter, the micro LED 10 will be described in detail with reference to the accompanying drawings.
도 1은 본 발명의 일 실시예의 LED 검사 장치를 나타낸 사시도이며, 도 2는 본 발명의 일 실시예의 웨이퍼의 일부를 확대한 사시도이다.1 is a perspective view showing an LED inspection apparatus of an embodiment of the present invention, Figure 2 is an enlarged perspective view of a part of the wafer of an embodiment of the present invention.
도 1을 참조하면, 본 발명의 LED 검사 장치(1)는 웨이퍼(W) 상에 제조된 복수개의 마이크로 LED(10) 및 웨이퍼(W) 상에서 분리된 마이크로 LED(10)의 정상 동작 여부를 검사하는 장치로, LED 검사 장치(1)가 수직으로 하강하여 마이크로 LED(10)와 접함으로써 마이크로 LED(10)의 정상 동작 여부를 검사할 수 있다. 상세하게, LED 검사 장치(1)를 수직으로 하강하여 웨이퍼(W)와 접함으로써 웨이퍼(W) 상에 제조된 둘 이상의 마이크로 LED(10)의 정상 동작 여부를 동시에 검사할 수 있으며, 웨이퍼(W)로부터 분리되어 목적 기판에 배치되거나 별도의 기판 또는 테이프(Tape) 등에 이송된 마이크로 LED(10)의 정상 동작 여부도 검사할 수 있다. 보다 상세하게, LED 검사 장치(1)는 둘 이상의 프로버(Prober)부(110)를 포함하며, 각각의 프로버부(110)는 각각의 마이크로 LED(10)에 대응될 수 있다. 도 2를 참조하면, 본 발명의 일 실시예에 따른 웨이퍼(W)상에는 복수개의 마이크로 LED(10)가 가로 및 세로 방향의 복수의 행렬로 나란히 배치되어 제조될 수 있다. 마이크로 LED(10)의 구조는 수평형 구조, 수직형 구조 또는 플립 칩형 구조일 수 있다. 그러나, 설명의 편의를 위하여 본 명세서에서는 플립 칩형 구조로 설명하도록 한다. 상세하게, 마이크로 LED(10)는 P극 및 N극을 갖는 PN접합 반도체로서, 상면에 P극과 N극이 각각 노출되도록 구비될 수 있다. 이하, 설명의 편의를 위하여 마이크로 LED(10)의 P극은 양전극(11), N극은 음전극(12)으로 칭하여 설명하도록 한다. 도 2의 경우, 웨이퍼(W)의 상면에 마이크로 LED(10)가 가로 3줄 및 세로 3줄의 배열로 구비되어 있으나, 이는 설명의 편의상 나타낸 것이며 실제로는 마이크로 LED(10)가 수 마이크로 단위의 사이즈이고, 웨이퍼(W)가 충분히 크므로 후술되는 전선 사이의 간격이 보장될 수 있다면 개수에 제한 없이 하나의 웨이퍼(W)상에 수십억개 이상의 마이크로 LED(10)가 구비될 수도 있다.Referring to FIG. 1, the LED inspection apparatus 1 of the present invention inspects whether a plurality of micro LEDs 10 manufactured on a wafer W and micro LEDs 10 separated on a wafer W operate normally. In this case, the LED inspection device 1 can be vertically lowered to be in contact with the micro LED 10 to inspect whether the micro LED 10 is operating normally. In detail, the LED inspection apparatus 1 may be vertically lowered to be in contact with the wafer W to simultaneously check whether two or more micro LEDs 10 manufactured on the wafer W are normally operated, and the wafer W The micro LED 10 may be inspected whether the micro LED 10 is normally removed from the substrate and disposed on the target substrate or transferred to a separate substrate or a tape. In more detail, the LED inspection apparatus 1 includes two or more prober units 110, and each prober unit 110 may correspond to each micro LED 10. Referring to FIG. 2, a plurality of micro LEDs 10 may be arranged side by side in a plurality of matrices in a horizontal and vertical direction on a wafer W according to an embodiment of the present invention. The structure of the micro LED 10 may be a horizontal structure, a vertical structure or a flip chip type structure. However, for convenience of description, the description will be made with a flip chip type structure. In detail, the micro LED 10 is a PN junction semiconductor having a P pole and an N pole, and may be provided to expose the P pole and the N pole, respectively, on an upper surface thereof. Hereinafter, for convenience of description, the P pole of the micro LED 10 will be referred to as a positive electrode 11 and the N pole as a negative electrode 12. In the case of FIG. 2, the micro LEDs 10 are arranged on the top surface of the wafer W in an array of three rows and three rows. However, this is illustrated for convenience of description and in practice, the micro LEDs 10 may be arranged in several micro units. Since the wafer W is large enough and the spacing between the wires to be described below can be ensured, billions of micro LEDs 10 may be provided on one wafer W without limitation.
또한, 도 1을 참조하면, 복수의 마이크로 LED(10)가 구비된 웨이퍼(W)의 하면에 광검출부(400)가 더 구비될 수 있다. 광검출부(400)는 마이크로 LED(10)에 전류를 인가시킴으로써 각각의 마이크로 LED(10)의 동작에 의해 발생되는 빛을 검출하여 각각의 마이크로 LED(10)가 정상 동작을 하는지 여부를 판단하는 구성이다. 보다 상세한 설명은 LED 검사 장치(1)를 보다 상세히 설명한 후, 후술될 도 10을 통해 상세히 설명하도록 한다.In addition, referring to FIG. 1, the photodetector 400 may be further provided on a lower surface of the wafer W provided with the plurality of micro LEDs 10. The photo detector 400 detects light generated by the operation of each micro LED 10 by applying a current to the micro LED 10 to determine whether each micro LED 10 operates normally. to be. A more detailed description will be made in detail with reference to FIG. 10 to be described later after describing the LED inspection device 1 in more detail.
이하, 도 3 내지 도 5를 참조하여 본 발명의 일 실시예에 따른 LED 검사 장치를 보다 상세히 설명하도록 한다. 도 3은 본 발명의 일 실시예의 LED 검사 장치를 나타낸 단면도이고, 도 4는 본 발명의 일 실시예의 LED 검사 장치의 검사 상태를 나타낸 단면도이며, 도 5는 본 발명의 다른 실시예의 LED 검사 장치의 검사 상태를 나타낸 단면도이다.Hereinafter, the LED inspection apparatus according to an embodiment of the present invention will be described in more detail with reference to FIGS. 3 to 5. 3 is a cross-sectional view showing an LED inspection apparatus of an embodiment of the present invention, Figure 4 is a cross-sectional view showing the inspection state of the LED inspection apparatus of an embodiment of the present invention, Figure 5 is a view of the LED inspection apparatus of another embodiment of the present invention It is sectional drawing which showed the inspection state.
도 3을 참조하면, LED 검사 장치(1)는 마이크로 LED와 직접 접촉하는 저면에 둘 이상의 프로버부(110)를 구비하는 회로층(100), 회로층(100)의 상면에 구비되는 완충층(200) 및 완충층(200)의 상면에 구비되는 보호층(300)을 포함한다. 둘 이상의 프로버부(110) 각각은 마이크로 LED(10)의 전극(11, 12)에 접촉하여 통전시킴으로써 마이크로 LED(10)가 정상 동작하는지 여부를 검사하는 검사부(111, 112)를 포함할 수 있다. 보다 상세하게, 검사부(111, 112)는 마이크로 LED(10)의 양전극(11)과 접촉할 수 있는 양극 검사부(111) 및 음전극(12)과 접촉할 수 있는 음극 검사부(112)로 각각 구비될 수 있다. 도 3에서와 같이 회로층(110)의 하면에 둘 이상의 양극 검사부(111) 및 음극 검사부(112)가 돌출 형성된 LED 검사 장치(1)는 수직방향으로 하강하여 마이크로 LED(10)가 정상 동작하는지 여부를 검사할 수 있다. 보다 상세하게, 도 4를 참조하면, 웨이퍼(W) 방향으로 수직 하강한 LED 검사 장치(1)는 웨이퍼(W)상에 구비된 각각의 마이크로 LED(10)와 접할 수 있다. 구체적으로, LED 검사 장치(1)의 각각의 프로버부(110)에 구비된 각각의 양극 검사부(111) 및 음극 검사부(112)는 웨이퍼(W)상에 구비된 각각의 마이크로 LED(10)의 양전극(11) 및 음전극(12)과 대응되도록 접할 수 있다. 도 5를 참조하면, 본 발명의 다른 실시예의 LED 검사 장치(1)는 웨이퍼(W) 상에 구비된 마이크로 LED(10)뿐만 아니라, 기판에 실장되거나 웨이퍼(W)로부터 분리되어 별도의 기판 또는 테이프(Tape) 등에 이송된 마이크로 LED(10)의 검사도 가능하다. 보다 상세하게, 본 발명의 다른 실시예에 따른 LED 검사 장치(1)는 웨이퍼(W)로부터 분리된 마이크로 LED(10)의 양전극(11) 및 음전극(12)에 복수의 프로버부(110)중 어느 하나의 양극 검사부(111) 및 음극 검사부(112)가 대응되도록 접촉시켜 웨이퍼(W)이외의 공간에서도 마이크로 LED(10)의 정상 동작여부를 검사할 수 있다.Referring to FIG. 3, the LED inspection apparatus 1 includes a circuit layer 100 having two or more prober portions 110 on a bottom surface thereof in direct contact with a micro LED, and a buffer layer 200 provided on an upper surface of the circuit layer 100. And a protective layer 300 provided on the upper surface of the buffer layer 200. Each of the two or more prober units 110 may include an inspection unit 111 and 112 for inspecting whether the micro LED 10 operates normally by contacting and energizing the electrodes 11 and 12 of the micro LED 10. . In more detail, the inspection units 111 and 112 may be respectively provided as an anode inspection unit 111 that may contact the positive electrode 11 of the micro LED 10 and a cathode inspection unit 112 that may contact the negative electrode 12. Can be. As shown in FIG. 3, the LED inspection apparatus 1 having the two or more anode inspecting portions 111 and the cathode inspecting portion 112 protruding from the lower surface of the circuit layer 110 descends in a vertical direction to determine whether the micro LED 10 operates normally. You can check whether it is. More specifically, referring to FIG. 4, the LED inspection apparatus 1 vertically lowered toward the wafer W may be in contact with each micro LED 10 provided on the wafer W. Referring to FIG. Specifically, each of the positive electrode inspection unit 111 and the negative electrode inspection unit 112 provided in each prober unit 110 of the LED inspection device 1 of each of the micro LED 10 provided on the wafer (W) It may be in contact with the positive electrode 11 and the negative electrode 12. Referring to FIG. 5, the LED inspection apparatus 1 according to another embodiment of the present invention may be mounted on a substrate or separated from the wafer W, as well as a micro LED 10 provided on the wafer W, or may be a separate substrate or the like. It is also possible to inspect the micro LED 10 transferred to a tape or the like. In more detail, the LED inspection apparatus 1 according to another embodiment of the present invention includes a plurality of prober parts 110 on the positive electrode 11 and the negative electrode 12 of the micro LED 10 separated from the wafer W. One of the positive electrode inspection unit 111 and the negative electrode inspection unit 112 may be brought into contact with each other so as to check whether the micro LED 10 operates normally in a space other than the wafer W.
이하, 도 6 내지 도 9를 참조하여 본 발명의 LED 검사 장치(1)를 보다 상세히 설명하도록 한다. 도 6은 본 발명의 일 실시예의 LED 검사 장치의 각 층을 나타낸 분해 사시도이고, 도 7 내지 도 9는 각각의 실시예에 따른 회로층의 상면을 나타낸 단면도이다.Hereinafter, the LED inspection apparatus 1 of the present invention will be described in more detail with reference to FIGS. 6 to 9. 6 is an exploded perspective view showing each layer of the LED inspection apparatus of an embodiment of the present invention, Figure 7 to Figure 9 is a cross-sectional view showing the upper surface of the circuit layer according to each embodiment.
도 6을 참조하여 본 발명의 일 실시예의 LED 검사 장치(1)를 설명하면, 상술한 바와 같이 회로층(100), 완충층(200) 및 보호층(300)으로 순차적으로 구비될 수 있다. 회로층(100)은 둘 이상의 프로버부(110)를 구비할 수 있으며, 프로버부(110)는 웨이퍼(W)상의 복수의 마이크로 LED에 각각 대응될 수 있도록 개수에 제한이 없으며 수십억개 이상의 프로버부(110)가 구비될 수 있다. 상세하게, 회로층(100)의 하면에는 복수개의 프로버부(110) 각각에 양극 검사부(111) 및 음극 검사부(112)가 구비될 수 있다. 양극 검사부(111) 및 음극 검사부(112)는 마이크로 LED(10)의 양전극(11) 및 음전극(12)에 각각 접촉하여 통전시키는 구성으로, 회로층(100)의 하면으로부터 하측 방향으로 돌출된 팁 형상으로 구비될 수 있다. 보다 상세하게, 각각의 검사부(111, 112)는 통전될 수 있도록 도체로 구비되는 것이 바람직하다. 회로층(100)의 상면에는 하면에 돌출된 각각의 양극 검사부(111) 및 음극 검사부(112)와 전기적으로 일단이 연결되는 양극 전선(113) 및 음극 전선(114)이 구비될 수 있다. 상세하게, 양극 전선(113) 및 음극 전선(114)은 복수의 양극 검사부(111) 및 음극 검사부(112)와 대응되도록 복수개 구비될 수 있으며, 양극 전선(113) 및 음극 전선(114)은 전기적으로 분리되어 구비되는 것이 바람직하다. 보다 상세하게, 양극 전선(113) 및 음극 전선(114)의 일단은 양극 검사부(111) 또는 음극 검사부(112)와 전기적으로 연결될 수 있도록 회로층(100)을 관통하여 구비될 수 있으나, 일단을 제외한 양극 전선(113) 및 음극 전선(114)은 회로층(100)의 하면에서 접촉되지 않도록 상면에만 구비되는 것이 바람직하다. 여기서, 회로층(100)은 마이크로 LED(10)와 접하였을 때 미세하고 약한 마이크로 LED(10)의 손상을 방지할 수 있도록 연질의 재질로 구비되는 것이 바람직하다. 보다 상세하게, 회로층(100)은 탄성력 및 복원력이 있는 연질의 재질로 구비되어 마이크로 LED(10)와 접하더라도 마이크로 LED(10)의 상면에 스크레치 등의 손상을 주지 않고 마이크로 LED(10)의 형상에 따라 상측 방향으로 눌릴 수 있는 재질로 구비되며, 마이크로 LED(10)로부터 떨어지면 다시 본상태로 복원될 수 있는 재질로 구비되는 것이 바람직하다. 구체적으로, 상술한 연질의 재질은 UV Resin, SU-8이나 PDMS(Polydimethylsiloxane) 등의 탄성을 가진 투명한 소재로 구비되는 것이 바람직하다.Referring to FIG. 6, the LED inspection apparatus 1 according to an exemplary embodiment of the present invention may be sequentially provided as the circuit layer 100, the buffer layer 200, and the protective layer 300 as described above. The circuit layer 100 may include two or more prober portions 110, and the number of prober portions 110 may correspond to a plurality of micro LEDs on the wafer W, and the number of the probe layers 110 may be billion or more. 110 may be provided. In detail, an anode inspecting portion 111 and a cathode inspecting portion 112 may be provided on each of the plurality of prober portions 110 on the bottom surface of the circuit layer 100. The positive electrode inspecting unit 111 and the negative electrode inspecting unit 112 are configured to contact and energize the positive electrode 11 and the negative electrode 12 of the micro LED 10, respectively. The tip protrudes downward from the lower surface of the circuit layer 100. It may be provided in a shape. In more detail, each inspection unit 111, 112 is preferably provided with a conductor so that it can be energized. An upper surface of the circuit layer 100 may be provided with a positive electrode wire 113 and a negative electrode wire 114 having one end electrically connected to each of the positive electrode inspection unit 111 and the negative electrode inspection unit 112 protruding from the lower surface. In detail, the positive electrode wire 113 and the negative electrode wire 114 may be provided in plural to correspond to the plurality of positive electrode inspection parts 111 and the negative electrode inspection part 112, and the positive electrode wire 113 and the negative electrode wire 114 may be electrically connected. It is preferable that the separation is provided. More specifically, one end of the positive electrode wire 113 and the negative electrode wire 114 may be provided through the circuit layer 100 to be electrically connected to the positive electrode inspection unit 111 or the negative electrode inspection unit 112, but one end Except for the positive electrode 113 and the negative electrode 114 is preferably provided only on the upper surface so as not to contact the lower surface of the circuit layer (100). Here, the circuit layer 100 is preferably provided with a soft material so as to prevent damage of the micro and weak micro LED 10 when in contact with the micro LED (10). In more detail, the circuit layer 100 is made of a soft material having elasticity and restoring force, so that the upper surface of the micro LED 10 may not be damaged, such as scratches, on the upper surface of the micro LED 10 even when contacted with the micro LED 10. It is preferably provided with a material that can be pressed in an upward direction according to the shape, and is provided with a material that can be restored to its original state when it is separated from the micro LED 10. Specifically, the above-described soft material is preferably provided with a transparent material having elasticity such as UV Resin, SU-8, or PDMS (Polydimethylsiloxane).
완충층(200)은 회로층(100)의 상면에 접하도록 구비되어 회로층(100)의 상면에 구비된 복수의 전선(113, 114)을 보호하고, 마이크로 LED(10)에 검사 장치(1)가 접촉될 때 마이크로 LED(10)의 손상을 방지하기 위한 완충 역할을 하는 구성이다. 즉, 회로층(100)이 얇게 구비됨으로써 마이크로 LED(10)의 손상을 방지하기 위한 완충 역할을 제대로 할 수 없기 때문에 두꺼운 완충층(200)을 더 구비하여 마이크로 LED(10)의 손상을 완벽하게 방지하기 위한 구성이다. 상세하게, 완충층(200)은 마이크로 LED(10)와 접촉시 마이크로 LED(10)의 손상을 방지할 수 있도록 완충 작용을 하기 위해 연질의 재질로 구비되는 것이 바람직하며, 특히 탄성력 및 복원력이 있는 연질의 재질로 구비되는 것이 더 바람직하다. 구체적으로, 회로층(100)과 동일한 재질로 구비될 수 있으며, UV Resin, SU-8이나 PDMS(Polydimethylsiloxane) 등의 탄성을 가진 투명한 소재로 구비되는 것이 바람직하다.The buffer layer 200 is provided to be in contact with the upper surface of the circuit layer 100 to protect the plurality of wires 113 and 114 provided on the upper surface of the circuit layer 100, and the inspection device 1 in the micro LED 10. Is a configuration that serves as a buffer to prevent damage to the micro LED 10 when the contact. That is, since the circuit layer 100 is thinly provided, the buffer layer 200 may not function properly to prevent damage to the micro LED 10. Thus, the circuit layer 100 may further include a thick buffer layer 200 to completely prevent damage to the micro LED 10. It is a structure for doing so. In detail, the buffer layer 200 is preferably provided with a soft material in order to cushion the micro LED 10 so as to prevent damage to the micro LED 10 when the micro layer is in contact with the micro LED 10. It is more preferably provided with a material of. Specifically, it may be provided with the same material as the circuit layer 100, it is preferably provided with a transparent material having elasticity, such as UV Resin, SU-8 or PDMS (Polydimethylsiloxane).
보호층(300)은 완충층(200)의 상면에 접하여 연질의 재질로 구비된 완충층(200)을 보호하는 구성이다. 상세하게, 보호층(300)은 완충층(200) 및 회로층(100)을 보호하고, LED 검사 장치(1)의 형상을 유지하기 위한 구성으로 단단한 경질의 재질로 구비되는 것이 바람직하다. 보다 상세하게, 보호층(300)은 경질의 재질로 구비되되 후술될 보조선(AL)을 통해 얼라인먼트(alignment)를 용이하게 맞출 수 있도록 투명한 소재로 구비되는 것이 바람직하다. 구체적으로, 보호층(300)은 투명한 아크릴, 사파이어, 쿼츠 또는 유리 등의 투명하고 단단한 소재로 구비되는 것이 바람직하다.The protective layer 300 is configured to protect the buffer layer 200 provided with a soft material in contact with the upper surface of the buffer layer 200. In detail, the protective layer 300 is configured to protect the buffer layer 200 and the circuit layer 100, and to maintain the shape of the LED inspection device 1 is preferably provided with a hard material. In more detail, the protective layer 300 is provided with a hard material, but is preferably provided with a transparent material so that alignment can be easily aligned through the auxiliary line AL, which will be described later. Specifically, the protective layer 300 is preferably made of a transparent and hard material such as transparent acrylic, sapphire, quartz or glass.
이하, 도 7 내지 도 9를 참조하여 각 실시예에 따른 회로층(100)를 상세히 설명하도록 한다.Hereinafter, the circuit layer 100 according to each embodiment will be described in detail with reference to FIGS. 7 to 9.
회로층(100)은 후술될 각 실시예에서와 같이 여러 형태로 구비될 수 있으며, 회로층(100)의 상면에 구비된 복수의 양극 전선(113) 및 음극 전선(114)은 임프린팅을 통해 회로층(100)의 상면에 임프린팅을 통해 홈이 형성된 후, 형성된 홈에 전도 물질을 충전하는 메탈 메쉬 방법에 의하여 제조될 수 있다. 전술한 양극 전선(113) 및 음극 전선(114)을 제조하는 방법은 실시예일 뿐이며, 전선을 형성할 수 있는 방법이라면 어느 방법이든 사용될 수 있다.The circuit layer 100 may be provided in various forms as in the following embodiments, and the plurality of positive electrode wires 113 and the negative electrode wires 114 provided on the upper surface of the circuit layer 100 are imprinted. After the groove is formed on the upper surface of the circuit layer 100 by imprinting, the groove may be manufactured by a metal mesh method of filling a conductive material in the formed groove. The above-described method of manufacturing the positive electrode wire 113 and the negative electrode wire 114 is only an embodiment, and any method may be used as long as it can form an electric wire.
도 7은 제 1 실시예에 따른 회로층의 상면을 나타낸 단면도이다. 도 7을 참조하면, 제 1 실시예에 따른 회로층(100)의 양극 전선(113) 및 음극 전선(114)은 각각의 양극 검사부(111) 및 음극 검사부(112)의 일단과 대응되도록 전기적으로 연결되되, 각각의 전선(113, 114)은 서로 전기적으로 연결되지 않도록 일 간격 떨어지도록 구비될 수 있다. 따라서, 제 1 실시예에 따르면, 복수의 프로버부(110) 중 동일한 프로버부(110)에 구비된 양극 검사부(111) 및 음극 검사부(112)가 동시에 전기적으로 연결될 수 있도록, 동일한 프로버부(110)에 구비된 양극 검사부(111) 및 음극 검사부(112)와 전기적으로 연결된 양극 전선(113) 및 음극 전선(114)각각을 별개로 통전시켜 해당 프로버부(110)의 양극 검사부(111) 및 음극 검사부(112)와 접촉한 마이크로 LED(10)의 정상 동작 여부를 판단할 수 있다.7 is a cross-sectional view showing an upper surface of the circuit layer according to the first embodiment. Referring to FIG. 7, the anode wires 113 and the cathode wires 114 of the circuit layer 100 according to the first embodiment may be electrically connected to one ends of the anode inspection unit 111 and the cathode inspection unit 112, respectively. Although connected, each of the wires 113 and 114 may be provided to be spaced apart from one another so as not to be electrically connected to each other. Therefore, according to the first exemplary embodiment, the same prober unit 110 may be electrically connected to the positive electrode inspecting unit 111 and the negative electrode inspecting unit 112 provided at the same prober unit 110 among the plurality of prober units 110 at the same time. The anode test unit 111 and the cathode test unit 112 and the anode wire 113 and the cathode wire 114 electrically connected to each other are separately energized so that the anode test unit 111 and the cathode of the prober unit 110. It may be determined whether the micro LED 10 in contact with the inspection unit 112 operates normally.
도 8은 제 2 실시예에 따른 회로층의 상면을 나타낸 단면도이다. 도 8을 참조하면, 제 2 실시예에 따른 회로층(100)의 제 1 실시예와 같이 복수의 양극 전선(113) 및 음극 전선(114)이 각각의 양극 검사부(111) 및 음극 검사부(112)의 일단과 대응되도록 전기적으로 연결될 수 있다. 여기서, 제 2 실시예에 따른 회로층(100)은 둘 이상의 음극 전선(114)이 전기적으로 하나로 연결될 수 있으며, 양극 전선(115)은 전기적으로 서로 분리되도록 구비될 수 있다. 구체적으로, 제 2 실시예에 따른 회로층(100)은 둘 이상의 음극 전선(114)이 전기적으로 하나로 연결되되, 하나의 행 또는 하나의 열에 구비된 음극 검사부(112)는 전기적으로 하나의 음극 전선(114)과 연결될 수 있다. 따라서, 전기적으로 하나로 연결된 하나의 행 또는 열의 음극 전선(114)을 전원의 마이너스(-)극에 연결하고, 각각의 양극 검사부(111)에 하나씩 별개로 연결된 양극 전선(113)에 순차적으로 전류를 인가시켜 둘 이상의 마이크로 LED(10)의 정상 동작여부를 각각 순차적으로 검사할 수 있다. 보다 구체적으로, 전기적으로 하나로 연결된 음극 전선(114)은 접지시킨 후, 각각 전기적으로 분리되어 연결된 양극 전선(113)의 통전여부에 의해 둘 이상의 마이크로 LED(10)의 정상 동작여부를 각각 검사할 수 있다.8 is a cross-sectional view illustrating a top surface of a circuit layer according to a second embodiment. Referring to FIG. 8, as in the first embodiment of the circuit layer 100 according to the second embodiment, the plurality of positive electrode wires 113 and the negative electrode wires 114 each have a positive electrode inspection unit 111 and a negative electrode inspection unit 112. It may be electrically connected to correspond to one end of the). Here, in the circuit layer 100 according to the second embodiment, two or more cathode wires 114 may be electrically connected to one, and the anode wires 115 may be provided to be electrically separated from each other. Specifically, in the circuit layer 100 according to the second embodiment, two or more cathode wires 114 are electrically connected to one, and the cathode inspection unit 112 provided in one row or one column is electrically connected to one cathode wire. And may be connected to 114. Therefore, the negative wire 114 of one row or column electrically connected to one is connected to the negative (-) pole of the power supply, and current is sequentially supplied to the positive wire 113 separately connected to each positive electrode inspection unit 111. Each of the two or more micro LEDs 10 may be sequentially applied to each other. More specifically, the cathode wires 114 electrically connected to one are grounded, and then the normal operation of two or more micro LEDs 10 may be inspected by the energization of the anode wires 113 electrically connected to each other. have.
도 9는 제 3 실시예에 따른 회로층의 상면을 나타낸 단면도이다. 도 9를 참조하면, 제 3 실시예에 따른 회로층(100)은 제 1 실시예 또는 제 2 실시예와 같이 복수의 양극 전선(113) 및 음극 전선(114)이 각각의 양극 검사부(111) 및 음극 검사부(112)의 일단과 대응되도록 전기적으로 연결될 수 있다. 여기서, 제 3 실시예에 따른 회로층(100)은 둘 이상의 음극 전선(114)이 전기적으로 하나로 연결될 수 있으며, 양극 전선(115)은 전기적으로 서로 분리되도록 구비될 수 있다. 구체적으로, 제 3 실시예에 따른 회로층(100)은 회로층(100) 상에 구비된 둘 이상의 음극 전선(114)이 모두 전기적으로 하나로 연결될 수 있다. 따라서, 전기적으로 하나로 연결된 음극 전선(114)을 전원의 마이너스(-)극으로 연결하고, 각각의 양극 검사부(111)에 하나씩 별개로 연결된 양극 전선(113)에 순차적으로 전류를 인가시켜 둘 이상의 마이크로 LED(10)의 정상 동작여부를 각각 순차적으로 검사할 수 있다. 보다 구체적으로, 전기적으로 하나로 연결된 음극 전선(114)은 접지시킨 후, 각각 전기적으로 분리되어 연결된 양극 전선(113)의 통전여부에 의해 둘 이상의 마이크로 LED(10)의 정상 동작여부를 각각 검사할 수 있다.9 is a cross-sectional view illustrating an upper surface of a circuit layer according to a third embodiment. Referring to FIG. 9, in the circuit layer 100 according to the third exemplary embodiment, the plurality of positive electrode wires 113 and the negative electrode wires 114 each have a positive electrode inspection unit 111 as in the first or second embodiment. And it may be electrically connected to correspond to one end of the negative electrode inspection unit 112. Here, in the circuit layer 100 according to the third embodiment, two or more cathode wires 114 may be electrically connected to one, and the anode wires 115 may be provided to be electrically separated from each other. Specifically, in the circuit layer 100 according to the third embodiment, two or more cathode wires 114 provided on the circuit layer 100 may be electrically connected to each other. Therefore, the cathode wires 114 electrically connected as one are connected to the negative (-) pole of the power supply, and the current is sequentially applied to the anode wires 113 separately connected to each anode check unit 111, so that at least two micros are connected. Each of the LEDs 10 can be sequentially checked for normal operation. More specifically, the cathode wires 114 electrically connected to one are grounded, and then the normal operation of two or more micro LEDs 10 may be inspected by the energization of the anode wires 113 electrically connected to each other. have.
상술한 제 1 실시예 내지 제 3 실시예의 회로층(100)은 실시예일 뿐이며, 양극 전선(113)이 전기적으로 하나로 연결될 수도 있으며, 음극 전선(114) 및 양극 전선(113)이 각각의 행 또는 열 마다 전기적으로 하나로 연결되어 각각의 행렬의 음극 전선(114) 및 양극 전선(113)에 순차적으로 전류를 인가시켜 마이크로 LED(10)의 정상 동작 여부를 검사할 수 있다. 또한, 전체의 음극 전선(114) 및 양극 전선(113)에 동시에 전류를 인가시켜 각각의 검사부(111, 112)와 접촉된 마이크로 LED(10)의 정상 동작 여부를 동시에 검사할 수도 있다.The circuit layer 100 of the first to third embodiments described above is just an embodiment, and the anode wires 113 may be electrically connected to each other, and the cathode wires 114 and the anode wires 113 may be formed in respective rows or Each column is electrically connected to each other, and current may be sequentially applied to the cathode wires 114 and the anode wires 113 of each matrix to check whether the micro LED 10 operates normally. In addition, the current may be simultaneously applied to the entire cathode wire 114 and the anode wire 113 to simultaneously check whether the micro LED 10 in contact with each of the inspection units 111 and 112 operates normally.
이하, 도 10을 참조하여 본 발명의 일 실시예의 LED 검사 장치를 통한 양품의 LED를 판별하는 방법을 상세히 설명하도록 한다. 도 10은 본 발명의 일 실시예의 LED 검사 장치와 웨이퍼의 정렬을 위해 보조선 및 정렬을 위한 표식(Align mark)을 맞추는 과정을 나타낸 단면도이다.Hereinafter, with reference to Figure 10 to explain in detail the method of determining the LED of the good product through the LED inspection device of an embodiment of the present invention. 10 is a cross-sectional view illustrating a process of aligning an auxiliary line and an alignment mark for alignment of a wafer with an LED inspection apparatus according to an exemplary embodiment of the present invention.
도 10을 참조하면, 웨이퍼(W) 및 각각의 회로층(100), 완충층(200) 및 보호층(300)에는 서로 대응되는 보조선(AL1, AL2)이 더 포함될 수 있다. 상세하게, 회로층(100), 완충층(200) 및 보호층(300)에는 서로 대응되는 위치에 동일한 형상의 제 1 보조선(AL1)이 구비될 수 있으며, 웨이퍼(W)의 상면에는 상기 제 1 보조선(AL1)과 대응되는 위치에 동일한 형상의 제 2 보조선(AL2)이 구비될 수 있다. 보다 상세하게, 제 1 보조선(AL1)은 회로층(100), 완충층(200) 및 보호층(300) 중 어느 한 층에만 구비될 수도 있으나 보다 바람직하게는 각 층마다 각각 구비되는 것이 가장 바람직하다. 상술한 바와 같이, 회로층(100), 완충층(200) 및 보호층(300)은 모두 투명한 소재로 구비되는 것이 바람직하며, 이에 따라 각 층에 구비된 제 1 보조선(AL1)이 각각 관통되어 보호층(300)의 상면에서 바라보았을 때 모두 시인될 수 있도록 구비되는 것이 바람직하다. 따라서, 서로 대응되는 위치에 제 1 보조선(AL1)이 구비됨으로써 LED 검사 장치(1)의 각층을 결합할 때, 정확한 위치로 결합할 수 있는 효과가 있다. 또한, 웨이퍼(W)의 상면에도 제 1 보조선(AL1)과 대응되는 제 2 보조선(AL2)이 구비되어, LED 검사 장치(1)를 웨이퍼(W)의 상면에 접할 때 각각의 제 1 보조선(AL1) 및 제 2 보조선(AL2)을 대응시킴으로써 각각의 프로버부(110) 및 마이크로 LED(10)를 정확한 위치로 접촉시킬 수 있다. 상세하게, 각각의 제 1 보조선(AL1) 및 제 2 보조선(AL2)을 서로 대응시킴에 따라 각각의 프로버부(110)에 돌출된 양극 검사부(111) 및 음극 검사부(112)가 웨이퍼(W) 상에 구비된 각각의 마이크로 LED(10)의 양전극(11) 및 음전극(12)의 정확한 위치에 각각 접촉될 수 있다. 따라서, 웨이퍼(W) 상에 구비된 복수의 마이크로 LED(10)를 순차적 또는 동시에 검사하는 것이 가능하다. 상술한 제 1 보조선(AL1) 및 제 2 보조선(AL2)은 각각의 층 및 웨이퍼(W)에 직접 구비될 수도 있으며, 별도의 시트에 구비되어 각각의 층 및 웨이퍼(W)의 상면에 보조선(AL1, AL2)이 구비된 시트가 접합됨으로써 구비될 수도 있다.Referring to FIG. 10, the auxiliary lines AL1 and AL2 corresponding to each other may be further included in the wafer W, the circuit layers 100, the buffer layers 200, and the protection layers 300. In detail, the first auxiliary line AL1 having the same shape may be provided in the circuit layer 100, the buffer layer 200, and the protective layer 300 at positions corresponding to each other, and the upper surface of the wafer W may be provided. The second auxiliary line AL2 having the same shape may be provided at a position corresponding to the first auxiliary line AL1. In more detail, the first auxiliary line AL1 may be provided only in any one of the circuit layer 100, the buffer layer 200, and the protective layer 300, but more preferably, each of the first auxiliary lines AL1 is provided in each layer. Do. As described above, the circuit layer 100, the buffer layer 200, and the protective layer 300 are preferably all made of a transparent material. Accordingly, the first auxiliary line AL1 provided in each layer penetrates each other. When viewed from the top of the protective layer 300 is preferably provided so that all can be seen. Therefore, when the first auxiliary line AL1 is provided at a position corresponding to each other, when the respective layers of the LED inspection apparatus 1 are combined, there is an effect that can be combined at the correct position. In addition, a second auxiliary line AL2 corresponding to the first auxiliary line AL1 is also provided on the upper surface of the wafer W, and each of the first auxiliary lines when the LED inspection apparatus 1 contacts the upper surface of the wafer W is provided. By making the auxiliary line AL1 and the second auxiliary line AL2 correspond to each other, the prober unit 110 and the micro LEDs 10 may be brought into contact with each other at an accurate position. In detail, as the first auxiliary line AL1 and the second auxiliary line AL2 correspond to each other, the positive electrode inspecting portion 111 and the negative electrode inspecting portion 112 protruding from the prober portion 110 are separated from the wafer ( Each of the micro LEDs 10 provided on the W) may be in contact with the correct position of the positive electrode 11 and the negative electrode 12, respectively. Therefore, it is possible to inspect the plurality of micro LEDs 10 provided on the wafer W sequentially or simultaneously. The first auxiliary line AL1 and the second auxiliary line AL2 described above may be directly provided in each layer and the wafer W, or may be provided in separate sheets and disposed on an upper surface of each layer and the wafer W. It may be provided by bonding the sheet | seat provided with auxiliary line AL1, AL2.
도 10을 참조하면, 상술한 바와 같이 웨이퍼(W)의 하면에 광검출부(400)가 더 구비될 수 있다. 상세하게, 광검출부(400)는 웨이퍼(W)의 하면에 접하도록 구비될 수 있다. 광검출부(400)는 마이크로 LED(10)의 동작에 의해 발생되는 빛을 검출 및 마이크로 LED의 광 특성을 검사하는 구성으로, 각각의 양극 검사부(111) 및 음극 검사부(112)가 웨이퍼(W) 상에 구비된 복수의 마이크로 LED(10)의 양전극(11) 및 음전극(12)에 접촉하여 통전시킴으로써 마이크로 LED(10)에 전류가 인가되면 각각의 마이크로 LED(10)는 동작할 수 있다. 이 때, 마이크로 LED(10)가 동작하면 빛을 방출하게 되는데, 광검출부(400)는 각각의 마이크로 LED(10)에서 방출되는 빛을 광 검출부(400)에 내장되어 있는 포토다이오드를 통해 검출하여 각각의 마이크로 LED의 광 특성 판별을 통해 양품 또는 불량의 마이크로 LED(10)를 판별할 수 있다.Referring to FIG. 10, the light detector 400 may be further provided on the lower surface of the wafer W as described above. In detail, the photodetector 400 may be provided to contact the bottom surface of the wafer (W). The light detector 400 is configured to detect light generated by the operation of the micro LED 10 and inspect the optical characteristics of the micro LED. Each of the anode inspecting unit 111 and the cathode inspecting unit 112 includes a wafer (W). When a current is applied to the micro LED 10 by contacting and energizing the positive electrode 11 and the negative electrode 12 of the plurality of micro LEDs 10 provided thereon, each of the micro LEDs 10 may operate. At this time, when the micro LED 10 is operating to emit light, the light detector 400 detects the light emitted from each micro LED 10 through a photodiode built in the light detector 400 It is possible to determine whether the micro LED 10 of good or bad through the optical characteristics of each micro LED.
이하, 도 11 내지 도 27을 참조하여 본 발명의 LED 이송 장치를 설명하도록 한다.Hereinafter, the LED transfer device of the present invention will be described with reference to FIGS. 11 to 27.
본 발명의 LED 이송 장치(6)는 웨이퍼(W) 상에 제조된 복수개의 마이크로 LED(10)를 이송하는 장치로, LED 이송 장치(6)가 수직으로 하강하여 웨이퍼(W)와 접함으로써 둘 이상의 마이크로 LED(10)를 동시에 점검 및 픽업할 수 있다.The LED transfer device 6 of the present invention is a device for transferring a plurality of micro LEDs 10 manufactured on the wafer W, and the LED transfer device 6 is vertically lowered to be brought into contact with the wafer W. The above micro LEDs 10 can be checked and picked up simultaneously.
이하, 도 11을 참조하여 보다 상세히 설명하도록 한다. 도 11은 본 발명의 일 실시예의 LED 이송 장치를 나타낸 단면도이다.Hereinafter, a detailed description will be given with reference to FIG. 11. 11 is a cross-sectional view showing an LED transport apparatus of an embodiment of the present invention.
도 11을 참조하면, LED 이송 장치(6)는 마이크로 LED와 직접 접촉하는 하면에 둘 이상의 마이크로 LED 점검 픽업부(610)를 구비하는 제 1 레이어(600), 제 1 레이어(600) 상면에 위치하는 제 2 레이어(700) 및 제 2 레이어(700) 상면에 위치하는 제 3 레이어(800)를 포함한다.Referring to FIG. 11, the LED transport device 6 is positioned on the first layer 600 and the upper surface of the first layer 600 having two or more micro LED check pickups 610 on a lower surface thereof in direct contact with the micro LEDs. The second layer 700 and the third layer 800 positioned on the upper surface of the second layer 700 are included.
이하, 각 레이어(600, 700, 800)의 상세한 설명은 도 12 내지 도 20을 참조하여 설명하도록 한다. 도 12는 본 발명의 일 실시예의 각 레이어를 나타낸 분해 사시도이다. LED 이송 장치(6)는 도 12를 참조하면, 마이크로 LED(10)의 상면과 접촉하는 저면에 둘 이상의 마이크로 LED 점검 픽업부(610)를 구비하는 제 1 레이어(600)를 구비한다.Hereinafter, the detailed description of each of the layers 600, 700, and 800 will be described with reference to FIGS. 12 to 20. 12 is an exploded perspective view showing each layer of an embodiment of the present invention. Referring to FIG. 12, the LED transfer device 6 includes a first layer 600 having two or more micro LED check pickups 610 on a bottom surface in contact with an upper surface of the micro LED 10.
제 1 레이어(600)는 둘 이상의 마이크로 LED 점검 픽업부(610)를 구비한다. 마이크로 LED 점검 픽업부(610)는 마이크로 LED(10)가 정상적으로 동작하는지 점검함과 동시에 이를 수직방향으로 들어올리기 위해서 그립 및 픽업하는 부분으로서, 웨이퍼(W)상에 배치된 마이크로 LED(10)의 수에 대응되도록 구비되는 것이 바람직하다. 또한, 마이크로 LED 점검 픽업부(610)는 웨이퍼(W)상의 마이크로 LED(10) 배열과 대응되도록 가로 및 세로 방향으로 나란히 배치될 수 있다. 상세하게, 마이크로 LED 점검 픽업부(610)는 가로 및 세로 방향의 복수의 행렬로 나란히 배치될 수 있다. 또한, 본 발명에서 설명의 편의를 위해 행렬의 위치 순서에 따라 복수의 마이크로 LED(10)를 제 1 마이크로 LED(10), 제 2 마이크로 LED(10), 제 3 마이크로 LED(10) 순으로 명칭할 수 있다. 도 12의 경우, 설명의 편의상 가로 3개 및 세로 3개로 배열되어 있지만, 후술되는 전선 사이의 간격이 보장될 수 있다면 개수에 제한 없이 구비될 수 있다.The first layer 600 includes two or more micro LED check pickups 610. The micro LED check pickup unit 610 checks whether the micro LED 10 operates normally and simultaneously grips and picks it up in order to lift the micro LED 10 in a vertical direction. It is preferable to be provided to correspond to the number. In addition, the micro LED check pick-up unit 610 may be arranged side by side in the horizontal and vertical directions to correspond to the arrangement of the micro LED 10 on the wafer (W). In detail, the micro LED check pickup unit 610 may be arranged side by side in a plurality of matrices in the horizontal and vertical directions. In addition, in the present invention, for convenience of description, the plurality of micro LEDs 10 are named in order of the first micro LED 10, the second micro LED 10, and the third micro LED 10 according to the position order of the matrix. can do. In the case of Figure 12, for convenience of description is arranged in three horizontal and three vertical, if the distance between the wires to be described later can be provided without limitation in the number.
마이크로 LED 점검 픽업부(610)는 마이크로 LED(10)를 점검하는 점검부(611, 612) 및 마이크로 LED(10)를 수직방향으로 잡아 올려 픽업하는 픽업부(613)를 포함한다. 여기서, 점검부(611, 612)는 LED 검사 장치(1)의 검사부(111, 112)와 동일한 역할을 할 수 있으나 이송 장치(6) 및 검사 장치(1)는 각각 다른 장치의 구성으로 서로 다른 명칭 및 도면 번호를 통해 설명하도록 한다.The micro LED check pickup unit 610 includes check units 611 and 612 for checking the micro LED 10 and a pickup unit 613 for picking up the micro LED 10 in a vertical direction. Here, the inspection units 611 and 612 may play the same role as the inspection units 111 and 112 of the LED inspection device 1, but the transfer device 6 and the inspection device 1 may be different from each other in the configuration of different devices. The description will be made with a name and a drawing number.
점검부(611, 612)는 마이크로 LED(10)의 P 및 N 전극(11, 12)에 접촉하여 통전시킴으로써 마이크로 LED(10)가 정상 동작하는지 여부를 점검하는 구성으로, 양극 점검부(611) 및 음극 점검부(612)로 구비될 수 있다. 상세하게, 점검부(611, 612)의 양극 점검부(611) 및 음극 점검부(612)는 각각 마이크로 LED(10)의 양전극(11) 및 음전극(12)에 대응하도록 위치한다. 구체적으로, 제 1 레이어(600)의 하면이 웨이퍼(W)의 상면에 접한 경우, 양극 점검부(611) 및 음극 점검부(612)는 각각 마이크로 LED(10)의 양전극(11) 및 음전극(12)에 접촉하여 마이크로 LED(10)에 전류가 인가될 수 있다. 따라서, 양극 점검부(611) 및 음극 점검부(612)는 전도체로 구성되는 것이 바람직하다. 정상적으로 작동하는지를 판단하는 방법으로는 특정 저항 또는 전류값 등의 전기적 특성 범위를 정상 동작 범위로 사전에 결정하여 해당 범위를 초과 또는 미달하는 마이크로 LED를 선택하는 등의 종래 방법을 사용할 수 있지만, 본 발명의 권리범위가 이에 한정되는 것은 아니다.The inspection units 611 and 612 are configured to check whether the micro LED 10 operates normally by contacting and energizing the P and N electrodes 11 and 12 of the micro LED 10. And a negative electrode check unit 612. In detail, the positive electrode checker 611 and the negative electrode checker 612 of the checkers 611 and 612 are positioned to correspond to the positive electrode 11 and the negative electrode 12 of the micro LED 10, respectively. Specifically, when the bottom surface of the first layer 600 is in contact with the top surface of the wafer W, the positive electrode check unit 611 and the negative electrode check unit 612 are respectively the positive electrode 11 and the negative electrode ( 12 may be applied to the micro LED 10. Therefore, the positive electrode check unit 611 and the negative electrode check unit 612 are preferably composed of a conductor. As a method of determining whether it operates normally, a conventional method such as selecting a micro LED that exceeds or falls below the range by using a predetermined range of electrical characteristics such as a specific resistance or current value in advance as a normal operating range can be used. The scope of rights is not limited thereto.
상세하게, 일 실시예에 따르면 양극 점검부(611) 및 음극 점검부(612)는 제 1 레이어(600)상에 임프린팅을 통해 홈이 형성된 후, 상기 홈에 전도 물질을 충전하는 메탈 메쉬 방법에 의하여 제조될 수 있다.In detail, according to one embodiment, the positive electrode checker 611 and the negative electrode checker 612 are metal mesh methods for filling the grooves with conductive materials after the grooves are formed on the first layer 600 through imprinting. It can be prepared by.
일 실시예에 따르면, 픽업부(613)는 점검부(611, 612) 사이에 위치한다. 상세하게, 픽업부(613)는 양극 점검부(611)와 음극 점검부(612) 사이에 위치할 수 있다. 픽업부(613)는 마이크로 LED(10)와의 접촉면이 넓게 형성되는 것이 바람직하다. 마이크로 LED의 경우, 종래기술에서 설명한 바와 같이, 그 크기가 매우 작고 가볍기 때문에, 종래의 픽업 방식을 사용할 수 없고, 본 발명에 따른 픽업부(613)는 후술되듯이 정상 동작하는 마이크로 LED(10)만을 선택적으로 픽업하기 위해서, 본 발명에 따른 픽업부(613)는 정전식 방식으로 정전기를 통해 마이크로 LED(10)를 픽업하는 것이 바람직하다.According to one embodiment, the pickup unit 613 is located between the check unit (611, 612). In detail, the pickup unit 613 may be located between the positive electrode check unit 611 and the negative electrode check unit 612. The pickup portion 613 is preferably formed with a wide contact surface with the micro LED (10). In the case of the micro LED, as described in the prior art, since its size is very small and light, the conventional pick-up method cannot be used, and the pick-up unit 613 according to the present invention can operate normally as described below. In order to selectively pick up the bay, the pick-up part 613 according to the present invention preferably picks up the micro LED 10 through static electricity in an electrostatic manner.
도 13은 본 발명의 일 실시예의 제 1 레이어의 하면을 나타낸 사시도이다. 도 13을 참조하면, 점검부(611, 612) 및 픽업부(613)는 제 1 레이어(600)의 하면에 직사각 형상의 홈이 형성된 형상일 수 있다. 또한, 상면은 전극이 인가될 수 있는 원형 홀이 구비된 형상일 수 있다. 상기 하면의 홈 및 상면의 홀은 서로 관통되도록 연결되어 있으며, 내측 홈 및 원형 홀 모두 전도 물질로 채워지는 것이 바람직하다. 상세하게, 일 실시예에 따르면 마이크로 LED 픽업 점검부(610)는 하면에 직사각 형상의 홈으로 형성된 양극 점검부(611), 음극 점검부(612) 및 양극 점검부(611)와 음극 점검부(612) 사이에 구비된 픽업부(613)를 포함하여 형성될 수 있다. 보다 상세하게, 직사각 형상의 홈으로 형성된 양극 점검부(611), 음극 점검부(612) 및 픽업부(613)는 각각의 사이에 소정의 간격을 두고 나란히 구비될 수 있다. 이 때, 각각의 양극 점검부(611), 음극 점검부(612) 및 픽업부(613) 사이에 소정의 간격을 두는 것은 양극 점검부(611), 음극 점검부(612) 및 픽업부(613)가 서로 전기적으로 통전하지 않고, 이하에서 설명되는 바와 같이 마이크로 LED(10)에 충격을 방지하기 위함이다. 상세하게, 마이크로 LED 점검 픽업부(610)의 소정의 간격에 이하에서 설명될 UV Resin, SU-8이나 PDMS(Polydimethylsiloxane) 등의 탄성을 가진 소재가 구비되는 경우, 마이크로 LED(10)의 점검 및 픽업 시 충격을 방지할 수 있다. 마이크로 LED 픽업 점검부(610)는 상기 직사각 형상의 홈으로 형성된 양극 점검부(611), 음극 점검부(612) 및 픽업부(613)의 상면에 원형의 홀이 형성된 형상일 수 있다. 양극 점검부(611), 음극 점검부(612) 및 픽업부(613)가 각각 원형의 홀 형상으로만 형성될 경우, 마이크로 LED(10)와의 접촉 면적이 좁아 마이크로 LED(10)의 전극(11, 12)과 정확하게 접촉하는 것이 어렵다. 따라서, 정확하지 못한 접촉에 의해 정상 상태의 마이크로 LED(10)도 비정상 상태로 판단될 수 있는 문제점이 있다. 이러한 문제를 해결하기 위해 상기와 같이 마이크로 LED 픽업 점검부(610)의 하면에는 각각 소정의 간격 떨어져 배치된 직사각 형상의 홈으로 양극 점검부(611), 음극 점검부(612) 및 픽업부(613)가 구비되는 것이 바람직하다. 이처럼, 양극 점검부(611), 음극 점검부(612) 및 픽업부(613)의 하면이 직사각 형상으로 구비되는 경우, 마이크로 LED(10)와의 접촉면적이 넓어져 전극(11, 12)과 접하는 것이 용이할 수 있으며, 픽업부(613)의 접촉면적 또한 넓어져 마이크로 LED(10)를 보다 수월하게 픽업할 수 있다. 또한, 양극 점검부(611), 음극 점검부(612) 및 픽업부(613)의 상면은 원형 홀로 구비됨으로써, 제 1 레이어(600)의 상측에서 배치되는 회로를 서로 겹치지 않도록 설계하는 것이 수월해질 수 있다.FIG. 13 is a perspective view illustrating a bottom surface of a first layer according to an embodiment of the present invention. FIG. Referring to FIG. 13, the inspection units 611 and 612 and the pickup unit 613 may have a shape in which grooves having a rectangular shape are formed on the bottom surface of the first layer 600. In addition, the upper surface may have a shape having a circular hole to which an electrode may be applied. The grooves of the lower surface and the holes of the upper surface are connected to penetrate each other, and both the inner groove and the circular hole are preferably filled with a conductive material. In detail, according to an exemplary embodiment, the micro LED pickup checker 610 may include a positive electrode checker 611, a negative electrode checker 612, and a positive electrode checker 611 and a cathode checker ( It may be formed to include a pickup unit 613 provided between the 612. In more detail, the positive electrode check unit 611, the negative electrode check unit 612, and the pickup unit 613 formed as rectangular grooves may be provided side by side with a predetermined interval therebetween. At this time, a predetermined interval between the positive electrode check unit 611, the negative electrode check unit 612, and the pickup unit 613 may be a positive electrode check unit 611, a negative electrode check unit 612, and a pickup unit 613. ) Do not electrically conduct electricity with each other, and to prevent impact on the micro LED 10 as described below. In detail, when a material having elasticity such as UV Resin, SU-8, or PDMS (Polydimethylsiloxane) to be described below is provided at a predetermined interval of the micro LED check pick-up unit 610, the micro LED 10 is checked and Shock can be prevented when picking up. The micro LED pickup checker 610 may have a shape in which a circular hole is formed on upper surfaces of the anode checker 611, the cathode checker 612, and the pickup 613 formed as the rectangular grooves. When the positive electrode check unit 611, the negative electrode check unit 612, and the pickup unit 613 are each formed only in a circular hole shape, the contact area with the micro LED 10 is narrow, so that the electrode 11 of the micro LED 10 is narrow. , 12) it is difficult to make accurate contact. Accordingly, there is a problem that the micro LED 10 in the normal state may also be determined to be in an abnormal state due to incorrect contact. In order to solve this problem, the positive electrode check unit 611, the negative electrode check unit 612, and the pick-up unit 613 are formed on a lower surface of the micro LED pick-up inspection unit 610 as a rectangular groove disposed at predetermined intervals as described above. Is preferably provided. As described above, when the anode inspecting portion 611, the cathode inspecting portion 612, and the pickup portion 613 are provided in a rectangular shape, the contact area with the micro LED 10 is widened to contact the electrodes 11 and 12. It may be easy, and the contact area of the pickup portion 613 is also widened to make it easier to pick up the micro LED 10. In addition, since the upper surfaces of the anode check unit 611, the cathode check unit 612, and the pickup unit 613 are provided with circular holes, it may be easier to design circuits disposed on the upper side of the first layer 600 so as not to overlap each other. Can be.
보다 구체적으로 일 실시예에 따르면, 제 1 레이어(600)는 연질의 재질, 예를 들어 UV Resin, SU-8이나 PDMS(Polydimethylsiloxane) 등의 탄성을 가진 투명한 소재로 이루어지는 것이 바람직하다. 이는 마이크로 LED(10)의 두께가 매우 얇기 때문에 상대적으로 전도 물질이고 경질의 점검부(611, 612) 또는 픽업부(613)가 점검 및 픽업을 위하여 마이크로 LED(10)의 상면에 닿았을 때 마이크로 LED(10)에 가하는 충격을 최대한 방지하기 위함이다.In more detail, according to an embodiment, the first layer 600 may be made of a soft material, for example, a transparent material having elasticity such as UV Resin, SU-8, or PDMS (Polydimethylsiloxane). It is a relatively conductive material because the thickness of the micro LED 10 is very thin and the micro when the hard inspection unit 611, 612 or the pickup unit 613 touches the top surface of the micro LED 10 for inspection and pickup. This is to prevent the impact applied to the LED 10 as much as possible.
이하, 도 14 및 도 15를 참조하여 본 발명의 다른 실시예의 제 1 레이어(600`)를 설명하도록 한다. 도 14는 본 발명의 다른 실시예의 제 1 레이어의 하면을 나타낸 사시도이면, 도 15는 본 발명의 다른 실시예의 LED 이송 장치의 측면을 나타낸 단면도이다. 상기 도 13을 통해 상술한 일 실시예의 제 1 레이어(600)와의 구분을 위해 도 14 및 도 15의 다른 실시예의 제 1 레이어(600`)는 도면부호를 600`으로 설명한다. 도 14 및 도 15를 참조하면, 점검부(611, 612)는 상기 일 실시예와 동일하게 제 1 레이어(600`)의 하면에 직사각 형상의 홈이 형성된 형상일 수 있다. 상기 하면의 홈 및 상면의 홀은 서로 관통되도록 연결되어 있으며, 내측 홈 및 원형 홀 모두 전도 물질로 채워지는 것이 바람직하다. 보다 구체적인 설명은 상기 일 실시예와 동일하므로 생략하며, 상이한 부분에 있어서 상세히 설명하도록 한다. 본 발명의 다른 실시예의 제 1 레이어(600`)는 픽업부(613)가 하면에 노출되지 않도록 구비될 수 있다. 즉, 제 1 레이어(600`)의 상면은 도 12에서와 같이 원형 홀을 통해 전도 물질이 채워질 수 있으나, 하면까지 관통되어 노출되지 않도록 구비되는 것이 바람직하다. 픽업부(613)가 하면까지 노출되어 마이크로 LED(10)에 직접적으로 맞닿는 경우, 전류가 너무 강하여 마이크로 LED(10)가 파손되는 문제가 생길 수 있다. 따라서, 도 14의 다른 실시예에서는 픽업부(613)를 하면에 노출되지 않도록 구비하고, 노출되지 않은 하면에 정전기를 발생시킴으로써 정전기에 의해 마이크로 LED(10)를 픽업할 수 있다. 구체적으로, 픽업부(613)의 하면은 상술한 UV Resin, SU-8이나 PDMS(Polydimethylsiloxane) 등의 탄성을 가진 투명한 소재로 구비되며, 픽업부(613)에 전압을 인가하여 전기장을 형성함으로써 UV Resin, SU-8이나 PDMS(Polydimethylsiloxane) 등의 탄성을 가진 투명한 소재의 접촉면에 정전기가 발생될 수 있다. 접촉면에 발생된 정전기에 의해 마이크로 LED(10)가 접촉되어 픽업될 수 있다.Hereinafter, the first layer 600 ′ of another embodiment of the present invention will be described with reference to FIGS. 14 and 15. 14 is a perspective view showing a bottom surface of a first layer of another embodiment of the present invention, and FIG. 15 is a cross-sectional view showing a side surface of the LED transfer device according to another embodiment of the present invention. The first layer 600 ′ of another embodiment of FIGS. 14 and 15 will be referred to as 600 ′ in order to distinguish it from the first layer 600 of the embodiment described above with reference to FIG. 13. 14 and 15, the inspection units 611 and 612 may have a shape in which grooves having a rectangular shape are formed on the bottom surface of the first layer 600 ′ as in the exemplary embodiment. The grooves of the lower surface and the holes of the upper surface are connected to penetrate each other, and both the inner groove and the circular hole are preferably filled with a conductive material. Detailed description is the same as in the above embodiment and will be omitted, and will be described in detail in different parts. The first layer 600 ′ of another embodiment of the present invention may be provided so that the pickup unit 613 is not exposed to the lower surface. That is, the upper surface of the first layer 600 ′ may be filled with a conductive material through a circular hole as shown in FIG. 12, but it is preferable that the upper surface of the first layer 600 ′ is not penetrated and exposed to the lower surface. When the pickup 613 is exposed to the lower surface and directly contacts the micro LED 10, a current may be too strong to cause the micro LED 10 to be damaged. Therefore, in another exemplary embodiment of FIG. 14, the pickup unit 613 may be provided so as not to be exposed to the lower surface, and the micro LED 10 may be picked up by static electricity by generating static electricity on the unexposed lower surface. Specifically, the lower surface of the pickup unit 613 is made of a transparent material having elasticity such as UV Resin, SU-8, or PDMS (Polydimethylsiloxane), and the UV is applied by applying a voltage to the pickup unit 613 to form an electric field. Static electricity may be generated on the contact surface of a transparent material having elasticity such as Resin, SU-8, or polydimethylsiloxane (PDMS). The micro LED 10 may be contacted and picked up by the static electricity generated in the contact surface.
이하, 일 실시예에 따른 제 2 레이어(700)를 상세히 설명한다. 도 12를 참조하면, 제 2 레이어(700)는 제 1 레이어(600)의 상면에 접하도록 위치될 수 있다. 제 2 레이어(700)는 제 1 레이어(600)의 양극 점검부(611) 및 음극 점검부(612)와 각각 일단이 전기적으로 연결되는 제 1 양극 전선(721) 및 제 1 음극 전선(722)을 구비하며, 픽업 통전점(713)을 더 구비한다. 상세하게, 마이크로 LED(10)의 특성 상 작은 범위 내에서 목적이 상이한 두 종류의 전선을 배치하기 위해 두 개층으로 점검용 전선(721, 222)이 배열되는 층 및 픽업용 전선(823)이 배열되는 층을 각각 제 2 레이어(700) 및 제 3 레이어(800)로 구비하는 것이 바람직하다. 따라서, 상기와 같이 일 실시예에 따르면 제 2 레이어(700)상에 제 1 양극 전선(721) 및 제 1 음극 전선(722)을 구비하고, 픽업부(613)와 전기적으로 연결되어 전력을 공급 및 차단하는 전선은 픽업 통전점(713)을 통해 제 2 레이어(700)를 통과한 후 제 3 레이어(800)에 구비되는 것이 바람직하다. 제 1 양극 전선(721)은 전도체로 구비되어 일단이 양극 점검부(611)와 전기적으로 연결될 수 있으며, 제 1 음극 전선(722) 또한 전도체로 구비되어 일단이 음극 점검부(612)와 전기적으로 연결될 수 있다. 제 1 양극 전선(721) 및 제 1 음극 전선(722)은 각각 서로 교차되지 않도록 배치되는 것이 바람직하다.Hereinafter, the second layer 700 according to an embodiment will be described in detail. Referring to FIG. 12, the second layer 700 may be positioned to contact the top surface of the first layer 600. The second layer 700 includes a first positive electrode wire 721 and a first negative electrode wire 722 having one end electrically connected to the positive electrode check part 611 and the negative electrode check part 612 of the first layer 600, respectively. It is provided with, the pick-up conduction point 713 is further provided. In detail, a layer in which inspection wires 721 and 222 are arranged in two layers and a pickup wire 823 are arranged in two layers to arrange two kinds of wires having different purposes within a small range due to the characteristics of the micro LED 10. It is preferable to provide a layer to be the second layer 700 and the third layer 800, respectively. Therefore, according to the exemplary embodiment as described above, the first positive electrode wire 721 and the first negative electrode wire 722 are provided on the second layer 700, and are electrically connected to the pickup unit 613 to supply power. And the blocking wire is preferably provided in the third layer 800 after passing through the second layer 700 through the pickup conduction point 713. The first positive electrode wire 721 may be provided as a conductor so that one end thereof may be electrically connected to the positive electrode check unit 611. The first negative electrode wire 722 may also be provided as a conductor so that one end thereof may be electrically connected to the negative electrode check unit 612. Can be connected. The first positive electrode wire 721 and the first negative electrode wire 722 are preferably disposed so as not to cross each other.
일 실시예에 따르면, 제 1 양극 전선(721) 및 제 1 음극 전선(722)은 각각 양극 점검부(611) 및 음극 점검부(612)와 일단이 전기적으로 연결되도록 복수개 구비될 수 있다. 또한, 각각의 제 1 양극 전선(721) 및 제 1 음극 전선(722)은 각각 별도의 양극 스위치부 및 음극 스위치부와 전기적으로 연결될 수 있다. 상세하게, 제 1 실시예의 양극 스위치부 및 음극 스위치부는 제 1 양극 전선(721) 및 제 1 음극 전선(722)의 수만큼 구비될 수 있다.According to an exemplary embodiment, a plurality of first positive electrode wires 721 and first negative electrode wires 722 may be provided in plurality so that one end thereof is electrically connected to the positive electrode check part 611 and the negative electrode check part 612, respectively. In addition, each of the first positive electrode wire 721 and the first negative electrode wire 722 may be electrically connected to a separate positive electrode switch unit and a negative electrode switch unit, respectively. In detail, the positive electrode switch unit and the negative electrode switch unit according to the first embodiment may be provided with the number of the first positive electrode wires 721 and the first negative electrode wires 722.
이하, 도 16을 참조하여 본 발명의 제 4 실시예에 따른 제 2 레이어를 상세히 설명하도록 한다. 도 16은 본 발명의 제 4 실시예에 따른 제 2 레이어의 상면을 나타낸 단면도이다.Hereinafter, the second layer according to the fourth embodiment of the present invention will be described in detail with reference to FIG. 16. 16 is a cross-sectional view illustrating a top surface of a second layer according to a fourth embodiment of the present invention.
먼저, 구체적인 설명을 위하여 종(세로)방향을 기준으로 1개의 "열"이라고 정의하고, 횡(가로)방향으로 좌측에서 우측 방향으로 순차적으로 1열, 2열, 3열이라고 정의한다. 또한, 횡(가로)방향을 기준으로 1개의 "행"이라고 정의하고, 종(세로)방향으로 상측에서 하측 방향으로 순차적으로 1행, 2행, 3행이라고 정의한다.First, for a detailed description, one column is defined based on the longitudinal (vertical) direction, and the first, second, and third columns are sequentially defined from the left to the right in the horizontal (horizontal) direction. In addition, it is defined as one "row" on the basis of the lateral (horizontal) direction, and defined as one row, two rows, and three rows sequentially from the upper side to the lower direction in the longitudinal (vertical) direction.
도 16을 참조하여, 본 발명의 제 4 실시예에 따르면, 제 4 실시예의 제 1 양극 전선(721) 및 제 1 음극 전선(722)은 양극 점검부(611) 및 음극 점검부(612)의 수만큼 구비될 수 있다. 또한, 각각의 제 1 양극 전선(721) 및 제 1 음극 전선(722)은 각각 별도의 양극 스위치부 및 음극 스위치부와 전기적으로 연결되어 제어될 수 있다. 구체적으로, 1행 1열의 제 1 양극 전선(721)은 제 1 양극 스위치부와 전기적으로 연결되고, 1행 2열의 제 1 양극 전선(721)은 제 2 양극 스위치부, 1행 3열의 제 1 양극 전선(721)은 제 3 양극 스위치부, 2행 1열의 제 1 양극 전선(721)은 제 4 양극 스위치부, 2행 2열의 제 1 양극 전선(721)은 제 5 양극 스위치부 순으로 각각 별도의 양극 스위치부와 연결될 수 있다. 따라서, 각각의 제 1 양극 전선(721)은 각각 별도의 양극 스위치부에 의해 개별적으로 전류가 인가 및 차단될 수 있다.Referring to FIG. 16, according to the fourth embodiment of the present invention, the first positive electrode wire 721 and the first negative electrode wire 722 of the fourth embodiment may include the positive electrode check part 611 and the negative electrode check part 612. It may be provided as many as. In addition, each of the first positive electrode wire 721 and the first negative electrode wire 722 may be electrically connected to and controlled by a separate positive electrode switch unit and a negative electrode switch unit, respectively. Specifically, the first positive electrode wires 721 in one row and one column are electrically connected to the first positive electrode switch unit, and the first positive electrode wires 721 in the first row and two columns are the second positive electrode switch unit and the first one in the first row and three columns. The positive electrode wire 721 is the third positive electrode switch part, the first positive electrode wire 721 in the second row and the first row is the fourth positive electrode switch part, and the first positive electrode wire 721 in the second row and the second row is the fifth positive electrode switch part, respectively. It may be connected to a separate positive electrode switch. Accordingly, each of the first positive electrode wires 721 may be separately applied and cut off by a separate positive electrode switch.
제 1 음극 전선(722) 또한, 순차적으로 각각 별도의 음극 스위치부와 연결될 수 있다. 따라서, 각각의 제 1 음극 전선(722)은 각각 별도의 음극 스위치부에 의해 개별적으로 전류가 인가 및 차단될 수 있다. 상세하게, 순차적으로 제 1 양극 스위치부 및 제 1 음극 스위치부에 전류가 인가되는 경우, 제 1 위치에 대응되는 제 1 양극 전선(721) 및 제 1 음극 전선(722)에 전류가 인가되어 제 1 마이크로 LED(10)를 점검할 수 있다. 이후, 제 2 양극 스위치부 및 제 2 음극 스위치부에 전류가 인가되는 경우, 제 2 위치에 대응되는 제 1 양극 전선(721) 및 제 1 음극 전선(722)에 전류가 인가되어 제 2 마이크로 LED(10)를 점검할 수 있다.The first negative electrode wire 722 may also be sequentially connected to a separate negative electrode switch unit. Accordingly, each of the first negative electrode wires 722 may be individually applied and cut off by a separate negative electrode switch unit. In detail, when current is sequentially applied to the first positive electrode switch part and the first negative electrode switch part, the current is applied to the first positive electrode wire 721 and the first negative electrode wire 722 corresponding to the first position, thereby providing a first current. 1 You can check the micro LED (10). Subsequently, when a current is applied to the second positive electrode switch part and the second negative electrode switch part, the current is applied to the first positive electrode wire 721 and the first negative electrode wire 722 corresponding to the second position so that the second micro LED You can check (10).
이하, 후술되는 추가 실시예들은 상술한 제 4 실시예에 따른 LED 이송 장치(6)를 기준으로 구성이 추가 및 변형되는 실시예로서 중복되는 설명은 생략하기로 한다.Hereinafter, further embodiments will be omitted as an embodiment in which the configuration is added and modified based on the LED transport device 6 according to the fourth embodiment described above.
도 17을 참조하여, 본 발명의 제 5 실시예에 따른 제 2 레이어를 상세히 설명하도록 한다. 도 17은 본 발명의 제 5 실시예에 따른 제 2 레이어의 상면을 나타낸 단면도이다.Referring to FIG. 17, the second layer according to the fifth embodiment of the present invention will be described in detail. 17 is a cross-sectional view illustrating a top surface of a second layer according to a fifth embodiment of the present invention.
도 17을 참조하면, 제 5 실시예의 제 1 양극 전선(721)은 열 또는 행의 수만큼 구비될 수 있으며, 제 1 음극 전선(722)은 점검 대상의 마이크로 LED(10) 수만큼 구비될 수 있다. 상세하게, 같은 열 또는 같은 행의 양극 점검부(611)는 하나의 제 1 양극 전선(721)을 통해 전기적으로 연결될 수 있다. 보다 상세하게, 같은 열 또는 같은 행의 양극 점검부(611)와 전기적으로 연결된 제 1 양극 전선(721)은 하나의 양극 스위치부로 연결되어 동시에 전류의 인가 또는 차단이 제어될 수 있다. 구체적으로, 제 5 실시예에 따르면, 1열의 1행, 2행 및 3행의 양극 점검부(611)는 하나의 제 1 양극 스위치부와 연결될 수 있다. 또한, 2열의 1행, 2행 및 3행의 양극 점검부(611)는 하나의 제 2 양극 스위치부와, 3열의 1행, 2행 및 3행의 양극 점검부(611)는 하나의 제 3 양극 스위치부와 연결될 수 있다. 따라서, 같은 열의 양극 점검부(611)는 각각 동일한 스위치부에 의해 동시에 전류가 인가 및 차단될 수 있다.Referring to FIG. 17, the first positive electrode wire 721 of the fifth embodiment may be provided by the number of columns or rows, and the first negative electrode wire 722 may be provided by the number of micro LEDs 10 to be inspected. have. In detail, the anode check unit 611 in the same column or the same row may be electrically connected through one first anode wire 721. More specifically, the first positive electrode wire 721 electrically connected to the positive electrode check unit 611 in the same column or the same row may be connected to one positive electrode switch unit to simultaneously control the application or interruption of the current. Specifically, according to the fifth embodiment, the positive electrode check unit 611 of one row, two rows and three rows of one column may be connected to one first positive electrode switch unit. In addition, the anode check unit 611 in two columns, one row, two rows and three rows, has one second anode switch unit, and the anode check unit 611 in three rows, one row, two rows and three rows has one anode. 3 can be connected to the positive switch unit. Therefore, the anode check units 611 in the same row may be simultaneously applied and interrupted by the same switch unit, respectively.
반면, 음극 점검부(612)는 상기한 제 4 실시예에서와 같이 각각 별도의 제 1 음극 전선(722) 과 연결되어 각각의 음극 스위치부에 의해 개별적으로 전류가 인가 및 차단될 수 있다. 상세하게, 순차적으로 마이크로 LED(10)를 검사하기 위해서, 1열의 제 1 양극 스위치부에 전류를 인가시킨 후, 1열 1행의 음극 스위치부에 전류를 인가시키는 경우, 1열 1행의 위치에 대응되는 마이크로 LED(10)를 점검할 수 있으며, 1열 2행의 음극 스위치부에 전류를 인가시키는 경우, 1열 2행의 위치에 대응되는 마이크로 LED(10)를 점검할 수 있다. 이와 같이 제 1 양극 전선(721)을 동일한 스위치부에 연결하는 경우, 회로의 배선을 줄일 수 있어 좁은 면적의 회로를 통해서도 각각의 마이크로 LED(10)를 순차적으로 검사할 수 있다.On the other hand, as shown in the fourth embodiment, the negative electrode checker 612 is connected to a separate first negative electrode wire 722 so that current can be applied and cut off individually by each negative switch unit. In detail, in order to inspect the micro LED 10 sequentially, when a current is applied to the first anode switch unit in one column, and then a current is applied to the cathode switch unit in one column and one row, the position of one column and one row. The micro LEDs 10 corresponding to the micro LEDs 10 may be inspected, and when the current is applied to the cathode switch units of the first and second rows, the micro LEDs 10 corresponding to the positions of the first and second rows may be checked. In this way, when the first positive electrode wire 721 is connected to the same switch unit, the wiring of the circuit can be reduced, so that each micro LED 10 can be sequentially inspected even through a circuit having a small area.
도 12를 참조하면, 본 발명의 제 4 실시예 및 제 5 실시예에 따른 제 3 레이어(800)는 제 2 레이어(700)의 상면에 접하도록 위치되며, 제 2 레이어(700)에 구비된 복수의 픽업 통전점(713)과 각각 일단이 전기적으로 연결되는 복수의 제 1 픽업 전선(823)을 구비할 수 있다. 상세하게, 마이크로 LED(10)의 특성 상 좁은 범위 내에서 다수의 회로선을 배치하기 위해 제 2 레이어(700) 및 제 3 레이어(800)를 통해 2층으로 회로를 배열하는 것이 바람직하다. 따라서, 제 1 실시예 및 제 2 실시예와 같이 제 2 레이어(700) 상에 제 1 양극 전선(721) 및 제 1 음극 전선(722)이 구비된 경우, 마이크로 LED(10)의 픽업을 제어하는 제 1 픽업 전선(823)은 제 3 레이어(800)에 구비될 수 있다. 제 1 실시예 및 제 2 실시예에 따르면, 제 1 픽업 전선(823)은 복수의 픽업 통전점(713)과 각각 일단이 전기적으로 연결되도록 복수개 구비되는 것이 바람직하며, 여기서 복수개는 픽업 대상의 마이크로 LED(10)의 수와 동일 하도록 구비되는 것이 바람직하다. 상세하게, 제 1 픽업 전선(823)은 마이크로 LED(10)를 픽업 할 수 있도록 정전기 발생 전류가 공급되는 전선일 수 있다. 제 1 픽업 전선(823)은 각각 별도의 픽업 스위치부와 연결될 수 있다. 따라서, 각각 별도로 연결된 픽업 스위치부는 각각 별도로 제어되어, 각 제 1 픽업 전선(823)은 개별적으로 전원이 인가 및 차단될 수 있다. 상세하게, 전기적인 동작이 비정상으로 판별된 마이크로 LED(10)에 대응되는 픽업부(613)의 해당 픽업 스위치부에는 전극이 인가되지 않는 것이 바람직하다. 보다 상세하게, 픽업부(613)는 점검부(611, 612)에 의해 정상 동작으로 점검된 양품의 마이크로 LED(10)에 해당하는 픽업 스위치부에만 전원이 인가되도록 제어하여, 양품의 마이크로 LED(10)만을 선택적으로 픽업하여 이송시킬 수 있다.Referring to FIG. 12, the third layer 800 according to the fourth and fifth embodiments of the present invention is positioned to contact the upper surface of the second layer 700 and is provided in the second layer 700. A plurality of pick-up electrification points 713 and a plurality of first pick-up wires 823 each having one end electrically connected thereto may be provided. In detail, it is preferable to arrange the circuit in two layers through the second layer 700 and the third layer 800 in order to arrange a plurality of circuit lines within a narrow range due to the characteristics of the micro LED 10. Therefore, when the first positive electrode wire 721 and the first negative electrode wire 722 are provided on the second layer 700 as in the first and second embodiments, the pickup of the micro LED 10 is controlled. The first pickup wire 823 may be provided in the third layer 800. According to the first and second embodiments, a plurality of first pick-up wires 823 are preferably provided so that one end is electrically connected to each of a plurality of pick-up electrification points 713, wherein the plurality of pick-up wires are micro It is preferable that the number of LEDs 10 be the same. In detail, the first pickup wire 823 may be a wire to which an electrostatic generating current is supplied to pick up the micro LED 10. Each of the first pickup wires 823 may be connected to a separate pickup switch unit. Therefore, the pickup switch units connected separately, respectively, are controlled separately, so that each first pickup wire 823 can be powered on and off individually. In detail, it is preferable that an electrode is not applied to the corresponding pickup switch unit of the pickup unit 613 corresponding to the micro LED 10 whose electrical operation is determined to be abnormal. In more detail, the pickup unit 613 controls the power to be applied only to the pickup switch unit corresponding to the micro LED 10 of the good article checked by the check units 611 and 612 in a normal operation, thereby ensuring that the micro LED ( Only 10) can be picked up and transported selectively.
이하, 도 18 내지 도 20을 참조하여 본 발명의 변형 실시예에 따른 LED 이송 장치를 설명하도록 한다. 도 16은 본 발명의 변형 실시예의 각 레이어를 나타낸 분해 사시도이다.Hereinafter, an LED transport apparatus according to a modified embodiment of the present invention will be described with reference to FIGS. 18 to 20. 16 is an exploded perspective view showing each layer of a modified embodiment of the present invention.
먼저, 이하 후술되는 변형 실시예들은 상술한 일 실시예에 따른 LED 이송 장치(6)를 기준으로 구성이 추가 및 변형되는 실시예로서 중복되는 설명은 생략하기로 한다.First, the modified embodiments described below will be omitted as an embodiment in which the configuration is added and modified based on the LED transfer device 6 according to the above-described embodiment.
도 18을 참조하면, 본 발명의 변형 실시예에 따른 제 2 레이어(700)는 제 1 레이어(600)의 상면에 접하도록 위치될 수 있다. 제 2 레이어(700)는 제 1 레이어(600)에 구비된 둘 이상의 픽업부(613)와 각각 일단이 전기적으로 연결되는 제 2 픽업 전선(723)을 구비하며, 양극 통전점(711) 및 음극 통전점(712)을 더 구비한다. 상세하게, 마이크로 LED(10)의 특성 상 작은 범위 내에서 목적이 상이한 두 종류의 전선을 배치하기 위해 두개층으로 픽업용 전선(723)이 배열되는 층 및 점검용 전선(821, 322)이 배열되는 층을 각각 제 2 레이어(700) 및 제 3 레이어(800)로 구비하는 것이 바람직하다. 따라서, 상기와 같이 다른 실시예에 따르면 제 2 레이어(700)상에 제 2 픽업 전선(723)을 구비하고, 양극 점검부(611) 및 음극 점검부(612)와 전기적으로 연결되어 전력을 공급 및 차단하는 전선은 양극 통전점(711) 및 음극 통전점(712)을 통해 제 2 레이어(700)를 통과한 후 제 3 레이어(800)에 구비되는 것이 바람직하다. 제 2 레이어(700) 상에 구비된 제 2 픽업전선(723)은 전도체로 구비되어 일단이 픽업부(613)와 전기적으로 연결될 수 있으며, 양극 통전점(711) 및 음극 통전점(712) 또한 전도체로 구비되어 일단이 양극 점검부(611) 및 음극 점검부(612)와 전기적으로 연결될 수 있다. 여기서, 제 2 픽업전선(723)과 양극 통전점(711) 및 음극 통전점(712)은 각각 서로 접하지 않도록 소정의 간격을 두고 배치되는 것이 바람직하다.Referring to FIG. 18, the second layer 700 according to a modified embodiment of the present invention may be positioned to contact the top surface of the first layer 600. The second layer 700 includes two or more pickups 613 provided in the first layer 600 and second pickup wires 723, one end of which is electrically connected to each other, and includes a positive electrode conduction point 711 and a negative electrode. A conduction point 712 is further provided. Specifically, a layer in which pickup wires 723 are arranged in two layers and inspection wires 821 and 322 are arranged in order to arrange two kinds of wires having different purposes within a small range due to the characteristics of the micro LED 10. It is preferable to provide a layer to be the second layer 700 and the third layer 800, respectively. Accordingly, according to another embodiment as described above, the second pickup wire 723 is provided on the second layer 700, and is electrically connected to the positive electrode check unit 611 and the negative electrode check unit 612 to supply power. And the wires to be blocked are provided in the third layer 800 after passing through the second layer 700 through the positive electrode current point 711 and the negative electrode current point 712. The second pick-up wire 723 provided on the second layer 700 may be provided as a conductor so that one end thereof may be electrically connected to the pick-up part 613, and the positive electrode current point 711 and the negative electrode current point 712 may also be provided. It is provided as a conductor and one end may be electrically connected to the positive electrode check unit 611 and the negative electrode check unit 612. Here, the second pick-up wire 723, the positive electrode conduction point 711 and the negative electrode conduction point 712 are preferably disposed at predetermined intervals so as not to contact each other.
변형 실시예에 따르면, 제 3 레이어(800)에 구비되는 제 2 양극 전선(821) 및 제 2 음극 전선(822)은 각각 제 2 레이어(700)에 구비된 양극 통전점(711) 및 음극 통전점(712)과 일단이 전기적으로 연결될 수 있다. 상세하게, 변형 실시예에 따른 제 2 양극 전선(821) 및 제 2 음극 전선(822)은 각각 양극 통전점(711) 및 음극 통전점(712)과 일단이 전기적으로 연결되도록 복수개 구비될 수 있다. 또한, 각각의 제 2 양극 전선(821) 및 제 2 음극 전선(822)은 각각 별도의 양극 스위치부 및 음극 스위치부와 전기적으로 연결될 수 있다. 상세하게, 제 6 실시예의 양극 스위치부 및 음극 스위치부는 제 2 양극 전선(821) 및 제 2 음극 전선(822)의 수만큼 구비될 수 있다.According to a modified embodiment, the second positive electrode wire 821 and the second negative electrode wire 822 provided in the third layer 800 are respectively provided with the positive electrode conduction point 711 and the negative electrode conduction provided in the second layer 700. Point 712 and one end may be electrically connected. In detail, a plurality of second positive electrode wires 821 and second negative electrode wires 822 according to a modified embodiment may be provided in plurality so that one end is electrically connected to the positive electrode conductive point 711 and the negative electrode conductive point 712, respectively. . In addition, each of the second positive electrode wire 821 and the second negative electrode wire 822 may be electrically connected to a separate positive electrode switch unit and a negative electrode switch unit, respectively. In detail, the positive electrode switch unit and the negative electrode switch unit according to the sixth embodiment may be provided with the number of the second positive electrode wires 821 and the second negative electrode wires 822.
이하, 도 19를 참조하여 본 발명의 제 6 실시예에 따른 제 3 레이어를 상세히 설명하도록 한다. 도 19는 본 발명의 제 6 실시예에 따른 제 3 레이어의 상면을 나타낸 단면도이다.Hereinafter, the third layer according to the sixth embodiment of the present invention will be described in detail with reference to FIG. 19. 19 is a cross-sectional view illustrating an upper surface of a third layer according to a sixth embodiment of the present invention.
도 19를 참조하여, 본 발명의 제 6 실시예에 따르면, 제 2 양극 전선(821) 및 제 2 음극 전선(822)은 양극 점검부(611) 및 음극 점검부(612)의 수만큼 구비될 수 있다. 또한, 각각의 제 2 양극 전선(821) 및 제 2 음극 전선(822)은 각각 별도의 양극 스위치부 및 음극 스위치부와 전기적으로 연결되어 제어될 수 있다. 구체적으로, 1행 1열의 제 2 양극 전선(821)은 제 1 양극 스위치부와 전기적으로 연결되고, 1행 2열의 제 2 양극 전선(821)은 제 2 양극 스위치부, 1행 3열의 제 2 양극 전선(821)은 제 3 양극 스위치부, 2행 1열의 제 1 양극 전선(821)은 제 4 양극 스위치부, 2행 2열의 제 2 양극 전선(821)은 제 5 양극 스위치부 순으로 각각 별도의 양극 스위치부와 연결될 수 있다. 따라서, 각각의 제 2 양극 전선(821)은 각각 별도의 양극 스위치부에 의해 개별적으로 전류가 인가 및 차단될 수 있다.Referring to FIG. 19, according to the sixth embodiment of the present invention, the second positive electrode wire 821 and the second negative electrode wire 822 may be provided as many as the number of the positive electrode check unit 611 and the negative electrode check unit 612. Can be. In addition, each of the second positive electrode wire 821 and the second negative electrode wire 822 may be electrically connected to and controlled by a separate positive electrode switch unit and a negative electrode switch unit, respectively. Specifically, the second positive electrode wire 821 in one row and one column is electrically connected to the first positive electrode switch unit, and the second positive electrode wire 821 in two rows and one row is the second positive electrode switch unit and the second row in three rows. The positive electrode wire 821 is the third positive electrode switch part, the first positive electrode wire 821 in the second row and the first column is the fourth positive electrode switch part, and the second positive electrode wire 821 in the second row and the second column is the fifth positive electrode switch part, respectively. It may be connected to a separate positive electrode switch. Accordingly, each of the second positive electrode wires 821 may be individually applied and cut off by separate anode switches.
제 2 음극 전선(822) 또한, 순차적으로 각각 별도의 음극 스위치부와 연결될 수 있다. 따라서, 각각의 제 2 음극 전선(822)은 각각 별도의 음극 스위치부에 의해 개별적으로 전류가 인가 및 차단될 수 있다. 상세하게, 순차적으로 제 1 양극 스위치부 및 제 1 음극 스위치부에 전류가 인가되는 경우, 제 1 위치에 대응되는 제 2 양극 전선(821) 및 제 2 음극 전선(822)에 전류가 인가되어 제 1 마이크로 LED(10)를 점검할 수 있다. 이후, 제 2 양극 스위치부 및 제 2 음극 스위치부에 전류가 인가되는 경우, 제 2 위치에 대응되는 제 2 양극 전선(821) 및 제 2 음극 전선(822)에 전류가 인가되어 제 2 마이크로 LED(10)를 점검할 수 있다.The second negative electrode wire 822 may also be sequentially connected to the separate negative electrode switch part. Accordingly, each of the second negative electrode wires 822 may be separately applied and cut off by a separate negative electrode switch. In detail, when current is sequentially applied to the first positive electrode switch part and the first negative electrode switch part, the current is applied to the second positive electrode wire 821 and the second negative electrode wire 822 corresponding to the first position, thereby providing a first current. 1 You can check the micro LED (10). Subsequently, when a current is applied to the second positive electrode switch part and the second negative electrode switch part, the current is applied to the second positive electrode wire 821 and the second negative electrode wire 822 corresponding to the second position so that the second micro LED You can check (10).
도 20을 참조하여, 제 7 실시예에 따른 제 3 레이어를 상세히 설명하도록 한다. 도 20은 본 발명의 제 7 실시예에 따른 제 3 레이어의 상면을 나타낸 단면도이다.Referring to FIG. 20, the third layer according to the seventh embodiment will be described in detail. 20 is a cross-sectional view illustrating a top surface of a third layer according to a seventh embodiment of the present invention.
도 20을 참조하면, 제 7 실시예의 제 2 양극 전선(821)은 열 또는 행의 수만큼 구비될 수 있으며, 제 2 음극 전선(822)은 점검 대상의 마이크로 LED(10) 수만큼 구비될 수 있다. 상세하게, 같은 열 또는 같은 행의 양극 점검부(611)는 하나의 제 2 양극 전선(821)을 통해 전기적으로 연결될 수 있다. 보다 상세하게, 같은 열 또는 같은 행의 양극 점검부(611)와 전기적으로 연결된 제 2 양극 전선(821)은 하나의 양극 스위치부로 연결되어 동시에 전류의 인가 또는 차단이 제어될 수 있다. 구체적으로, 제 7 실시예에 따르면, 1행의 1열, 2열 및 3열의 양극 점검부(611)는 하나의 제 1 양극 스위치부와 연결될 수 있다. 또한, 2행의 1열, 2열 및 3열의 양극 점검부(611)는 하나의 제 2 양극 스위치부와, 3행의 1열, 2열 및 3열의 양극 점검부(611)는 하나의 제 3 양극 스위치부와 연결될 수 있다. 따라서, 같은 열의 양극 점검부(611)는 각각 동일한 스위치부에 의해 동시에 전류가 인가 및 차단될 수 있다.Referring to FIG. 20, the second positive electrode wire 821 of the seventh embodiment may be provided by the number of columns or rows, and the second negative electrode wire 822 may be provided by the number of micro LEDs 10 to be inspected. have. In detail, the anode check unit 611 in the same column or the same row may be electrically connected through one second anode wire 821. More specifically, the second positive electrode wire 821 electrically connected to the positive electrode check unit 611 in the same column or the same row may be connected to one positive electrode switch unit to simultaneously control the application or interruption of the current. Specifically, according to the seventh exemplary embodiment, the anode check unit 611 of one row, two columns, and three columns of one row may be connected to one first anode switch unit. In addition, the anode check unit 611 in two rows, one column, two columns, and three columns includes one second anode switch unit, and the anode check unit 611 in three rows, one column, two columns, and three columns includes one single anode. 3 can be connected to the positive switch unit. Therefore, the anode check units 611 in the same row may be simultaneously applied and interrupted by the same switch unit, respectively.
반면, 음극 점검부(612)는 상기한 제 6 실시예에서와 같이 각각 별도의 제 2음극 전선(822)과 연결되어 각각의 음극 스위치부에 의해 개별적으로 전류가 인가 및 차단될 수 있다. 상세하게, 순차적으로 마이크로 LED(10)를 검사하기 위해서, 1행의 제 1 양극 스위치부에 전류를 인가시킨 후, 1행 1열의 음극 스위치부에 전류를 인가시키는 경우, 1행 1열의 위치에 대응되는 마이크로 LED(10)를 점검할 수 있으며, 1행 2열의 음극 스위치부에 전류를 인가시키는 경우, 1행 2열의 위치에 대응되는 마이크로 LED(10)를 점검할 수 있다. 이와 같이 제 2 양극 전선(821)을 동일한 스위치부에 연결하는 경우, 회로의 배선을 줄일 수 있어 좁은 면적의 회로를 통해서도 각각의 마이크로 LED(10)를 순차적으로 검사할 수 있다.On the other hand, as shown in the sixth embodiment, the negative electrode check unit 612 may be connected to a separate second negative electrode wire 822 so that current may be applied and cut off individually by each negative switch unit. In detail, in order to inspect the micro LED 10 sequentially, when a current is applied to the first anode switch unit in one row, and then a current is applied to the cathode switch unit in one row and one column, the current is applied to the position of one row and one column. The corresponding micro LED 10 may be checked, and when the current is applied to the cathode switch unit of the first row and the second column, the micro LED 10 corresponding to the position of the first row and the second column may be checked. As described above, when the second positive electrode wire 821 is connected to the same switch unit, wiring of the circuit can be reduced, and each micro LED 10 can be sequentially inspected even through a circuit having a small area.
이하, 도 21내지 도 24를 참고하여, 본 발명의 바람직한 추가적인 실시예에 대해서 상술하도록 한다. 본 발명의 바람직한 추가적인 실시예에 따르면, 제 1 레이어(600)를 포함하지 않으며, 제 2 레이어(700)와 제 3 레이어(800)만 포함하여 구성될 수 있다. 이하 상술할 바람직한 추가적인 실시예는 상기 일 실시예 및 다른 실시예의 변형된 실시예로, 동일한 부분의 설명은 생략하고 상이한 특징에 대하여 상세히 설명하도록 한다.Hereinafter, a preferred additional embodiment of the present invention will be described in detail with reference to FIGS. 21 to 24. According to a further preferred embodiment of the present invention, the first layer 600 is not included, and only the second layer 700 and the third layer 800 may be included. Further preferred embodiments to be described below are modified embodiments of the one embodiment and the other embodiments, and the description of the same parts will be omitted, and thus different features will be described in detail.
도 21 및 도 22는 본 발명의 추가적인 실시예의 LED 이송 장치의 측면을 나타낸 단면도이다. 도 21 및 도 22를 참조하면, 추가적인 실시예의 LED 이송 장치(6)는 제 2 레이어(700) 및 제 3 레이어(800)만을 포함하여 구성될 수 있다. 각각의 제 2 레이어(700) 및 제 3 레이어(800)는 일 실시예에서 상술한 연질의 재질로 구비될 수 있으며, UV Resin, SU-8이나 PDMS(Polydimethylsiloxane) 등의 탄성을 가진 투명한 소재로 이루어지는 것이 바람직하다.21 and 22 are cross-sectional views showing the side of the LED transfer device of a further embodiment of the present invention. 21 and 22, the LED transfer device 6 of the additional embodiment may include only the second layer 700 and the third layer 800. Each of the second layer 700 and the third layer 800 may be formed of the soft material described above in one embodiment, and may be made of a transparent material having elasticity such as UV Resin, SU-8, or polydimethylsiloxane (PDMS). It is preferable to make.
추가적인 실시예의 제 2 레이어(700)는 하면에 양극 점검부(611) 및 음극 점검부(612)를 포함하고, 상면에 양극 점검부(611) 및 음극 점검부(612)와 각각 일단이 전기적으로 연결되는 제 1 양극 전선(721) 및 제 1 음극 전선(722)을 구비할 수 있다. 이때, 양극 점검부(611) 및 음극 점검부(612)는 하측 방향으로 돌출되도록 구비되는 것이 보다 바람직하다. 돌출된 양극 점검부(611) 및 음극 점검부(612)는 LED 이송 장치(6)가 하측 방향으로 수직 이동하여 마이크로 LED(10)의 양전극(11) 및 음전극(12)에 대응되도록 접함에 따라, 각각의 마이크로 LED(10)를 점검할 수 있다. 제 2 레이어(700)의 상면에는 상기 일 실시예에서 상술한 바와 같이 제 1 양극 전선(721) 및 제 1 음극 전선(722)이 구비될 수 있다. 각각의 제 1 양극 전선(721) 및 제 1 음극 전선(722)의 일단에는 양극 점검부(611) 및 음극 점검부(612)가 제 2 레이어(700)를 관통하여 돌출되도록 구비될 수 있다. 각각의 제 1 양극 전선(721) 및 제 1 음극 전선(722)은 상술한 일 실시예 및 다른 실시예에서와 같이 다양한 실시예에 따라 구비될 수 있다.The second layer 700 of a further embodiment includes a positive electrode checker 611 and a negative electrode checker 612 on a lower surface thereof, and one end of the positive electrode checker 611 and a negative electrode checker 612 is electrically connected to the upper surface of the second layer 700. A first positive electrode wire 721 and a first negative electrode wire 722 connected thereto may be provided. At this time, it is more preferable that the positive electrode check unit 611 and the negative electrode check unit 612 are provided to protrude downward. The protruding positive electrode checker 611 and the negative electrode checker 612 are in contact with the positive electrode 11 and the negative electrode 12 of the micro LED 10 by vertically moving the LED transfer device 6 downward. Each micro LED 10 can be checked. The first positive electrode wire 721 and the first negative electrode wire 722 may be provided on the upper surface of the second layer 700 as described above in the above embodiment. At one end of each of the first positive electrode wire 721 and the first negative electrode wire 722, the positive electrode check part 611 and the negative electrode check part 612 may be provided to protrude through the second layer 700. Each of the first positive electrode wire 721 and the first negative electrode wire 722 may be provided according to various embodiments as in the above-described one embodiment and the other embodiments.
제 3 레이어(800)는 제 2 레이어(700)의 상면에 접하도록 위치되며, 하면에 픽업부(613)를 구비하고, 픽업부(613)와 일단이 전기적으로 연결되는 복수의 제 1 픽업 전선(823)을 더 구비할 수 있다. 각각의 제 1 양극 전선(721), 제 1 음극 전선(722) 및 제 1 픽업 전선(823)은 도 23에서와 같이 서로 다른 층에 구비될 수 있으며, 상술한 일 실시예 및 다른 실시예에서와 같이 다양한 실시예에 따라 구비될 수 있다. 추가적인 실시예에 따르면, 도 21과 같이 제 3 레이어(800)의 하면에 돌출되지 않도록 픽업부(613)가 구비될 수도 있으며, 보다 바람직하게는 도 22에서와 같이 제 3 레이어(800)의 하면으로부터 돌출되도록 픽업부(613)가 구비될 수 있다. 여기서 돌출된 픽업부(613)는 제 2 레이어(700)의 상면에 삽입되어 결합될 수 있다. 따라서, 픽업부(613)가 마이크로 LED(10)에 직접적으로 접촉하지는 않되, 마이크로 LED(10)에 비교적 가깝도록 위치되어 정전기로 인한 픽업이 수월할 수 있도록 할 수 있다.The third layer 800 is positioned to be in contact with the top surface of the second layer 700, and includes a pickup part 613 on the bottom surface, and a plurality of first pickup wires having one end electrically connected to the pickup part 613. 823 may be further provided. Each of the first positive electrode wire 721, the first negative electrode wire 722, and the first pick-up wire 823 may be provided at different layers as shown in FIG. 23. In the above-described embodiments and other embodiments, It may be provided according to various embodiments as shown. According to a further embodiment, the pickup unit 613 may be provided so as not to protrude from the lower surface of the third layer 800 as shown in FIG. 21, and more preferably, the lower surface of the third layer 800 as shown in FIG. 22. Pickup portion 613 may be provided to protrude from. In this case, the pick-up part 613 protruding may be inserted into and coupled to an upper surface of the second layer 700. Therefore, the pick-up unit 613 may not be in direct contact with the micro LED 10, but may be positioned relatively close to the micro LED 10 to facilitate pick-up due to static electricity.
이하, 도 23 및 도 24를 참조하여 본 발명의 추가적인 실시예의 각 레이어를 상세히 설명하도록 한다. 도 23을 참조하면, 상술한 일 실시예에서와 같이 제 2 레이어(700)에는 각각의 점검 픽업부(610)마다 제 1 양극 전선(721) 및 제 1 음극 전선(722)이 각각 별도로 구비되고, 제 3 레이어(800)에는 제 1 픽업 전선(823)이 각각의 점검 픽업부(610)마다 하나씩 대응되도록 구비될 수 있다. 이때, 각각의 전선(721, 722, 823)은 동일한 전선은 하나의 전원으로 전원의 공급 차단이 조절될 수 있도록 서로 전기적으로 연결되도록 구비될 수 있다. 각각의 전선(721, 722, 823)의 배치에 대해서는 상기 일 실시예를 통해 상세히 설명하였으므로, 이하 생략하도록 한다. 도 24를 참조하면, 제 3 레이어(800)에 있어서 각각의 점검 픽업부(610)마다 픽업부(613)와 연결되는 픽업 전선이 양극 픽업 전선(8231) 및 음극 픽업 전선(8232)으로 각각 별도로 대응되도록 구비될 수도 있다. 이 때, 픽업부(613) 또한 각각의 양극 픽업 전선(8231) 및 음극 픽업 전선(8232)의 일단에 하측 방향으로 돌출되도록 둘로 구비되는 것이 바람직하다. 즉, 픽업부(613)가 양극 픽업부 및 음극 픽업부로 각각 별개로 구비되더라도, 도 21 및 도 22에서와 같이 각각의 픽업부(613)는 마이크로 LED(10)와 직접 접촉하지 않기 위해서 제 1 레이어(700)를 관통하지 않도록 구비되는 것이 바람직하다.Hereinafter, each layer of a further embodiment of the present invention will be described in detail with reference to FIGS. 23 and 24. Referring to FIG. 23, the second positive electrode wire 721 and the first negative electrode wire 722 are separately provided in each of the inspection pickup parts 610 in the second layer 700 as in the above-described embodiment. In the third layer 800, a first pick-up wire 823 may be provided to correspond to one check pick-up unit 610. At this time, each of the wires 721, 722, 823 may be provided so that the same wires are electrically connected to each other so that the supply of power can be controlled by one power source. Arrangement of each of the wires 721, 722, and 823 has been described in detail through the above embodiment, and thus will be omitted below. Referring to FIG. 24, in the third layer 800, pickup wires connected to the pickup part 613 for each inspection pickup part 610 are separately provided as the positive pick-up wire 8231 and the negative pick-up wire 8232. It may be provided to correspond. At this time, it is preferable that the pickup unit 613 is also provided in two so as to protrude downward in one end of each of the positive electrode pick-up wires 8231 and the negative pick-up wires 8232. That is, even if the pick-up unit 613 is separately provided as a positive pick-up unit and a negative pick-up unit, respectively, as shown in FIGS. 21 and 22, each pick-up unit 613 may be configured so as not to directly contact the micro LED 10. It is preferable to be provided so as not to penetrate the layer 700.
상기 일 실시예, 다른 실시예 및 추가적인 실시예와 같이 두개의 층으로 회로를 구성하는 경우, 좁은 면적 내에서 복잡한 회로를 배치하는 것이 수월할 수 있다. 여기서, 제 2 레이어(700) 및 제 3 레이어(800) 상의 회로가 서로 전기적으로 통하지 않도록, 통전점(711, 712, 713)을 제외한 각 전선(721, 722, 723, 821, 822, 823)이 지나는 상면 및 하면은 절연체로 코팅되는 것이 바람직하다. 상세하게, 제 2 레이어(700)상에 구비된 통전점(711, 712, 713)은 제 2 레이어(700)를 통과하여 제 3 레이어(800)에 구비된 전선(821, 822, 823)과 전기적으로 연결될 수 있도록 구비되는 것이 바람직하다. 반면, 제 2 레이어(700) 상에 구비된 전선(721, 722, 723)과 제 3 레이어(800) 상에 구비된 전선(821, 822, 823)은 서로 전기적으로 연결되지 않아야 하므로, 각 전선(721, 722, 723, 821, 822, 823)이 지나는 상면 및 하면은 서로 통전되지 않도록 절연체로 코팅되어 구비되는 것이 바람직하다. 이때, 절연체는 다른 재질의 절연체 일 수도 있으나, 각각의 제 2 레이어(700) 및 제 3 레이어(800)와 동일한 연질의 재질의 절연체로 구비되는 것이 보다 바람직하다. 구체적으로, UV Resin, SU-8이나 PDMS(Polydimethylsiloxane) 등의 탄성을 가진 투명한 소재로 구비되는 것이 보다 바람직하다.In the case of constructing a circuit in two layers as in the above embodiment, another embodiment, and an additional embodiment, it may be easy to arrange a complicated circuit in a small area. Here, the wires 721, 722, 723, 821, 822, 823 except for the conduction points 711, 712, 713 so that the circuits on the second layer 700 and the third layer 800 do not electrically communicate with each other. This passing top and bottom surfaces are preferably coated with an insulator. In detail, the conduction points 711, 712, 713 provided on the second layer 700 pass through the second layer 700 and the wires 821, 822, 823 provided in the third layer 800. It is preferable to be provided to be electrically connected. On the other hand, the wires 721, 722, and 723 provided on the second layer 700 and the wires 821, 822, and 823 provided on the third layer 800 should not be electrically connected to each other. The upper and lower surfaces through which 721, 722, 723, 821, 822, and 823 pass are preferably coated with an insulator so as not to be energized with each other. In this case, the insulator may be an insulator made of a different material, but it is more preferable that the insulator is provided with an insulator made of the same soft material as each of the second layer 700 and the third layer 800. Specifically, UV resin, SU-8 or PDMS (Polydimethylsiloxane) is more preferably provided with a transparent material having elasticity.
상기한 실시예들의 전선의 배열은 실시예일뿐이며, 검사 대상의 마이크로 LED(10)의 간격, 개수 및 레이어의 면적 등에 따라 다양하게 변형될 수 있다.The arrangement of the wires of the above-described embodiments is only an embodiment, and may be variously modified according to the distance, the number, the area of the layer, etc. of the micro LED 10 to be inspected.
이하, 도 25 내지 도 27을 참조하여 본 발명의 일 실시예에 따른 마이크로 LED 이송 단계를 설명하도록 한다. 도 25는 본 발명의 일 실시예의 마이크로 LED 이송 단계를 나타낸 단면도이고, 도 26은 본 발명의 다른 실시예의 마이크로 LED 이송 단계를 나타낸 단면도이며, 도 27은 본 발명의 추가적인 실시예의 마이크로 LED 이송 단계를 나타낸 단면도이다.Hereinafter, the micro LED transfer step according to an embodiment of the present invention will be described with reference to FIGS. 25 to 27. 25 is a cross-sectional view showing a micro LED transfer step of an embodiment of the present invention, Figure 26 is a cross-sectional view showing a micro LED transfer step of another embodiment of the present invention, Figure 27 is a micro LED transfer step of a further embodiment of the present invention It is sectional drawing shown.
본 발명의 마이크로 LED 이송 단계는 마이크로 LED 점검 단계 및 마이크로 LED 선택 픽업 단계를 포함할 수 있으며, 마이크로 LED 선택 픽업 단계에 의해 픽업 된 마이크로 LED(10)만을 선택적으로 이송한다.The micro LED transfer step of the present invention may include a micro LED checking step and a micro LED selection pick-up step, and selectively transfer only the micro LED 10 picked up by the micro LED selection pick-up step.
일 실시예에 따르면, 먼저 복수의 마이크로 LED(10)가 배열된 웨이퍼(W)의 상면에 본 발명에 따른 LED 이송 장치(6)를 위치시키고 LED 이송 장치(6)는 마이크로 LED(10)의 각 전극에 점검부(611, 612)가 접하도록 하측으로 이동한다.According to one embodiment, first, the LED transfer device 6 according to the present invention is placed on the upper surface of the wafer W on which the plurality of micro LEDs 10 are arranged, and the LED transfer device 6 is connected to the micro LED 10. The inspection units 611 and 612 move downward to contact each electrode.
이후, 마이크로 LED 점검 단계로서 제 2 레이어(700)에 구비된 양극 전선(721) 및 음극 전선(722)에 전원을 인가하여 마이크로 LED(10)의 전기적인 정상 동작 여부를 점검하는 단계이다. 상세하게, 복수의 마이크로 LED(10)의 각 전극(11, 12)과 양극 점검부(611) 및 음극 점검부(612)를 각각 전기적으로 접촉시킨 후, 복수의 양극 전선(721) 및 음극 전선(722)에 전원을 인가하여 마이크로 LED(10)의 정상 동작 여부를 점검할 수 있다. 이 때, 복수의 마이크로 LED(10)는 동시에 전극이 인가되어 동시에 점검될 수도 있지만, 일 실시예에 따라 순차적으로 전극이 인가되어 한 개씩 순차적으로 점검되는 것이 바람직하다.Thereafter, as a micro LED checking step, a power is applied to the anode wire 721 and the cathode wire 722 provided in the second layer 700 to check whether the micro LED 10 is electrically operated normally. In detail, after the electrodes 11 and 12 of the plurality of micro LEDs 10 are electrically contacted with the positive electrode check unit 611 and the negative electrode check unit 612, respectively, the plurality of positive electrode wires 721 and the negative electrode wires. Power may be applied to the 722 to check whether the micro LED 10 operates normally. In this case, the plurality of micro LEDs 10 may be simultaneously checked by the application of electrodes, but according to an exemplary embodiment, the electrodes may be sequentially applied and checked one by one.
이후, 마이크로 LED 이송 단계가 이루어 질 수 있다. 도 25를 참조하면, 마이크로 LED 이송 단계는 상기 마이크로 LED 점검 단계에서 점검된 마이크로 LED(10)의 정상 동작 여부에 따라 정상 동작으로 점검된 마이크로 LED(10)에 대응되는 픽업부(613)에만 전류가 인가될 수 있다. 상세하게, 제 3 레이어(800)에 구비된 픽업 전선(823)은 정상 동작으로 점검된 마이크로 LED(10)에 대응되는 위치의 픽업 전선(823)에만 전원이 인가된 상태에서 LED 이송 장치(6)를 다시 상측으로 들어 올리면, 전원이 인가된 부분의 정상 동작 마이크로 LED(10)만 각 해당 픽업부(613)에 의해 그립되어 선택적으로 픽업되어 이송될 수 있다. 즉, 정상 동작 마이크로 LED(10)는 점검 픽업부(610)에 의하여 픽업되며, 비정상 마이크로 LED(10)는 웨이퍼(W) 상에 남아있게 된다. 따라서, LED 이송 장치(6)에 의해 픽업된 정상 동작 마이크로 LED(10)만 선택적으로 원하는 공간으로 이송할 수 있다. 또한, 비정상 마이크로 LED(10)는 사용된 웨이퍼(W)와 함께 버릴 수 있어 점검 단계와 이송 단계를 단축시킬 수 있다.Thereafter, a micro LED transfer step can be made. Referring to FIG. 25, the micro LED transfer step is performed only in the pickup unit 613 corresponding to the micro LED 10 checked in the normal operation according to the normal operation of the micro LED 10 checked in the micro LED checking step. Can be applied. In detail, the pick-up wire 823 provided in the third layer 800 has the LED transfer device 6 in a state in which power is applied only to the pick-up wire 823 at a position corresponding to the micro LED 10 checked for normal operation. ) Is lifted to the upper side, only the normal operation micro LED 10 of the portion to which power is applied may be gripped by the corresponding pickup unit 613 to be selectively picked up and transported. That is, the normal operation micro LED 10 is picked up by the check pick-up unit 610, the abnormal micro LED 10 is left on the wafer (W). Therefore, only the normally operating micro LED 10 picked up by the LED transfer device 6 can be selectively transferred to the desired space. In addition, the abnormal micro LED 10 can be discarded together with the wafer W used to shorten the inspection step and the transfer step.
도 26을 참조하여 다른 실시예에 따르면, 웨이퍼(W)의 상면에 LED 이송 장치(6)를 위치시키고 LED 이송 장치(6)를 하측으로 수직이동시켜 마이크로 LED 픽업 점검부(610)를 각 마이크로 LED(10)에 접촉시킨다. 이후, 마이크로 LED 점검 단계에서 제 3 레이어(800)에 구비된 양극 전선(821) 및 음극 전선(822)에 전원을 인가하여 마이크로 LED(10)의 전기적인 정상 동작 여부를 점검한다. 마이크로 LED 점검 단계에 의해 정상 상태 및 비정상 상태의 마이크로 LED(10)를 선별한 후, 마이크로 LED 이송 단계가 이루어 질 수 있다. 상세하게, 마이크로 LED 이송 단계는 상기 마이크로 LED 점검 단계에서 점검된 마이크로 LED(10)의 정상 동작 여부에 따라 정상 동작으로 점검된 마이크로 LED(10)에 대응되는 픽업부(613)에만 전류가 인가될 수 있다. 보다 상세하게, 제 2 레이어(700)에 구비된 픽업 전선(723)은 정상 동작으로 점검된 마이크로 LED(10)에 대응하는 위치의 픽업 전선에만 전원이 인가될 수 있다. 따라서, 정상 동작 상태의 마이크로 LED(10)만 각 해당 픽업부(610)에 의해 그립되어 선택적으로 픽업되어 이송될 수 있다. 즉, 정상 동작 마이크로 LED(10)는 점검 픽업부(610)에 의하여 픽업되며, 비정상 마이크로 LED(10)는 웨이퍼(W) 상에 남아있게 된다. 따라서, LED 이송 장치(6)에 의해 픽업된 정상 동작 마이크로 LED(10)만 선택적으로 원하는 공간으로 이송할 수 있다. 또한, 비정상 마이크로 LED(10)는 사용된 웨이퍼(W)와 함께 버릴 수 있어 점검 단계와 이송 단계를 단축시킬 수 있다.According to another embodiment with reference to FIG. 26, the micro LED pick-up inspection unit 610 is moved to each micro by placing the LED transfer device 6 on the upper surface of the wafer W and vertically moving the LED transfer device 6 downward. To the LED 10. Thereafter, in the micro LED checking step, power is applied to the positive electrode wire 821 and the negative electrode wire 822 provided in the third layer 800 to check whether the micro LED 10 is electrically operated normally. After selecting the micro LED 10 in the normal state and the abnormal state by the micro LED check step, the micro LED transfer step can be made. In detail, the micro LED transfer step may apply current only to the pickup unit 613 corresponding to the micro LED 10 checked in the normal operation according to whether the micro LED 10 checked in the micro LED checking step operates normally. Can be. In more detail, the pick-up wire 723 of the second layer 700 may be supplied with power only to the pick-up wire at a position corresponding to the micro LED 10 checked for normal operation. Therefore, only the micro LED 10 in the normal operating state is gripped by the corresponding pickup unit 610 and can be selectively picked up and transported. That is, the normal operation micro LED 10 is picked up by the check pick-up unit 610, the abnormal micro LED 10 is left on the wafer (W). Therefore, only the normally operating micro LED 10 picked up by the LED transfer device 6 can be selectively transferred to the desired space. In addition, the abnormal micro LED 10 can be discarded together with the wafer W used to shorten the inspection step and the transfer step.
도 27을 참조하여 보다 바람직한 추가적인 실시예에 따르면, 웨이퍼(W)의 상면에 LED 이송 장치(6)를 위치시킨다. 이후, LED 이송 장치(6)를 하측으로 수직이동시켜 마이크로 LED(10)의 각 전극에 점검부(611, 612)가 접하고, 픽업부(613)는 각 마이크로 LED(10)에 대응되도록 위치시킨다. 이때, 추가적인 실시예에 따른 픽업부(613)는 마이크로 LED(10)에 직접 접촉하지 않는 것이 바람직하다.According to a further preferred embodiment with reference to FIG. 27, the LED transfer device 6 is positioned on the top surface of the wafer W. As shown in FIG. Thereafter, the LED transfer device 6 is vertically moved downward so that the check units 611 and 612 contact each electrode of the micro LED 10, and the pickup unit 613 is positioned to correspond to each micro LED 10. . At this time, it is preferable that the pickup unit 613 according to an additional embodiment does not directly contact the micro LED 10.
점검부(611, 612)가 각 마이크로 LED(10)에 접하면, 마이크로 LED 점검 단계로서 제 2 레이어(700)에 구비된 양극 전선(721) 및 음극 전선(722)에 전원을 인가하여 마이크로 LED(10)의 전기적인 정상 동작 여부를 점검하는 단계가 진행될 수 있다. 상세하게, 복수의 마이크로 LED(10)의 각 전극(11, 12)과 양극 점검부(611) 및 음극 점검부(612)를 각각 전기적으로 접촉시킨 후, 복수의 양극 전선(721) 및 음극 전선(722)에 전원을 인가하여 마이크로 LED(10)의 정상 동작 여부를 점검할 수 있다. 이 때, 복수의 마이크로 LED(10)는 동시에 전극이 인가되어 동시에 점검될 수도 있지만, 일 실시예에 따라 순차적으로 전극이 인가되어 한 개씩 순차적으로 점검되는 것이 바람직하다.When the inspection units 611 and 612 are in contact with the micro LEDs 10, the micro LEDs are applied to supply the power to the positive and negative wires 721 and 722 provided in the second layer 700. Checking whether the electrical operation of the normal (10) can be carried out. In detail, after the electrodes 11 and 12 of the plurality of micro LEDs 10 are electrically contacted with the positive electrode check unit 611 and the negative electrode check unit 612, respectively, the plurality of positive electrode wires 721 and the negative electrode wires. Power may be applied to the 722 to check whether the micro LED 10 operates normally. In this case, the plurality of micro LEDs 10 may be simultaneously checked by the application of electrodes, but according to an exemplary embodiment, the electrodes may be sequentially applied and checked one by one.
이후, 마이크로 LED 이송 단계가 이루어 질 수 있다. 도 27을 참조하면, 마이크로 LED 이송 단계는 상기 마이크로 LED 점검 단계에서 점검된 마이크로 LED(10)의 정상 동작 여부에 따라 정상 동작으로 점검된 마이크로 LED(10)에 대응되는 픽업부(613)에만 전류가 인가될 수 있다. 상세하게, 제 3 레이어(800)에 구비된 픽업 전선(823)은 정상 동작으로 점검된 마이크로 LED(10)에 대응되는 위치의 픽업 전선(823)에만 전원이 인가된 상태에서 LED 이송 장치(6)를 다시 상측으로 들어 올리면, 전원이 인가된 부분의 정상 동작 마이크로 LED(10)만 각 해당 픽업부(613)에 의해 그립되어 선택적으로 픽업되어 이송될 수 있다. 이때, 픽업부(613)는 마이크로 LED(10)에 직접적으로 접촉하지 않되, 정상 동작으로 점검된 위치의 해당 픽업부(613)에 공급된 전원에 의해 전기장이 형성되어 정전기를 발생시킴으로써 해당 마이크로 LED(10)를 픽업할 수 있다. 즉, 정상 동작 마이크로 LED(10)는 점검 픽업부(610)에 의하여 픽업되며, 비정상 마이크로 LED(10)는 웨이퍼(W) 상에 남아있게 된다. 따라서, LED 이송 장치(6)에 의해 픽업된 정상 동작 마이크로 LED(10)만 선택적으로 원하는 공간으로 이송할 수 있다. 또한, 비정상 마이크로 LED(10)는 사용된 웨이퍼(W)와 함께 버릴 수 있어 점검 단계와 이송 단계를 단축시킬 수 있다.Thereafter, a micro LED transfer step can be made. Referring to FIG. 27, the micro LED transfer step includes a current only in the pickup unit 613 corresponding to the micro LED 10 checked in the normal operation according to whether the micro LED 10 checked in the micro LED checking step operates normally. Can be applied. In detail, the pick-up wire 823 provided in the third layer 800 has the LED transfer device 6 in a state in which power is applied only to the pick-up wire 823 at a position corresponding to the micro LED 10 checked for normal operation. ) Is lifted to the upper side, only the normal operation micro LED 10 of the portion to which power is applied may be gripped by the corresponding pickup unit 613 to be selectively picked up and transported. At this time, the pick-up unit 613 is not directly in contact with the micro LED 10, the electric field is formed by the power supplied to the corresponding pick-up unit 613 of the position checked in the normal operation to generate the static electricity by the corresponding micro LED 10 can be picked up. That is, the normal operation micro LED 10 is picked up by the check pick-up unit 610, the abnormal micro LED 10 is left on the wafer (W). Therefore, only the normally operating micro LED 10 picked up by the LED transfer device 6 can be selectively transferred to the desired space. In addition, the abnormal micro LED 10 can be discarded together with the wafer W used to shorten the inspection step and the transfer step.
상기한 본 발명은 바람직한 실시 예를 참고하여 설명되었으나 이는 실시 예에 불과하며, 본 기술 분야에서 통상의 지식을 가진 자는 이로부터 다양한 변형 및 균등한 다른 실시예도 가능할 수 있다. 따라서, 본 발명의 권리범위는 상기한 실시 예 및 첨부된 도면에 의해 한정되는 것은 아니다.Although the present invention has been described with reference to a preferred embodiment, this is only an embodiment, and those skilled in the art may have various modifications and equivalent other embodiments. Therefore, the scope of the present invention is not limited by the above-described embodiment and the accompanying drawings.
본 발명에 따르면, 웨이퍼 상에서 LED의 정상 및 비정상 동작을 판별할 수 있는 효과가 있다.According to the present invention, there is an effect that can determine the normal and abnormal operation of the LED on the wafer.
또한, 웨이퍼 상에서 분리된 LED의 정상 및 비정상 동작도 판별할 수 있는 효과가 있다.In addition, there is an effect that can determine the normal and abnormal operation of the LED separated on the wafer.
또한, 웨이퍼 상에 나열된 복수의 LED의 정상 동작 여부를 동시에 판별할 수 있으며, 신속하게 검사를 할 수 있는 효과가 있다.In addition, it is possible to simultaneously determine whether or not the normal operation of the plurality of LEDs listed on the wafer, there is an effect that can be quickly tested.
또한, 마이크로 단위의 약한 마이크로 LED를 손상없이 검사 및 이송할 수 있는 효과가 있다.In addition, there is an effect capable of inspecting and transporting the weak micro LED of the micro unit without damage.
또한, LED의 정상 및 비정상을 선별함과 동시에 양품의 LED만을 선택적으로 이송할 수 있는 효과가 있어, 빠르게 정상 상태의 LED만 목적 기판에 배치할 수 있는 효과가 있다.In addition, there is an effect that can selectively transfer only the LEDs of good products at the same time as screening the normal and abnormal of the LED, there is an effect that can be quickly placed only the LED of the normal state on the target substrate.
이로써, LED의 검사를 위한 비용이 절감되고, 정상 상태의 LED만을 판별한 후 이송시켜 별도의 판별 과정이 필요 없으며, 신속하게 양품의 LED만을 선별하여 배치할 수 있는 효과가 있다.As a result, the cost for the inspection of the LED is reduced, and only the LEDs of the normal state are determined and then transferred, so that no separate determination process is required, and only the LEDs of the good products can be selected and arranged quickly.

Claims (15)

  1. 둘 이상의 프로버(Prober)부를 포함하는 LED 검사 장치로서,An LED inspection device comprising two or more probers,
    상기 프로버부는,The prober part,
    LED의 전극에 접촉하여 통전시킴으로써 LED가 정상 동작하는지 여부를 검사하는 검사부;를 포함하는 것을 특징으로 하는 LED 검사 장치.And an inspection unit for inspecting whether the LED operates normally by contacting and energizing the electrode of the LED.
  2. 제 1 항에 있어서,The method of claim 1,
    상기 프로버부는 가로 및 세로 방향의 복수의 행렬로 나란히 배치되는 것을 특징으로 하는 LED 검사 장치.The prober unit LED inspection apparatus, characterized in that arranged side by side in a plurality of matrices in the horizontal and vertical directions.
  3. 제 2 항에 있어서,The method of claim 2,
    상기 검사부는,The inspection unit,
    LED의 두 전극에 각각 접촉하는 양극 검사부 및 음극 검사부로 구비되는 것을 특징으로 하는 LED 검사 장치.LED inspection apparatus, characterized in that provided with an anode inspection unit and a cathode inspection unit in contact with each of the two electrodes of the LED.
  4. 제 3 항에 있어서,The method of claim 3, wherein
    상기 둘 이상의 프로버부를 구비하는 회로층은,The circuit layer having two or more prober portions,
    상기 양극 검사부 및 음극 검사부와 각각 전기적으로 일단이 연결되는 양극 전선 및 음극 전선이 구비되는 것을 특징으로 하는 LED 검사 장치.LED inspection device, characterized in that provided with a positive electrode wire and a negative electrode wire electrically connected to the positive electrode and the negative electrode inspection unit, respectively.
  5. 제 4 항에 있어서,The method of claim 4, wherein
    둘 이상의 상기 음극 전선은 전기적으로 하나로 연결되어 있으며,Two or more of the cathode wires are electrically connected to one,
    각각의 상기 양극 검사부에 각각 전기적으로 분리되어 연결된 양극 전선의 통전여부에 의해 둘 이상의 상기 LED의 정상 동작여부를 각각 검사할 수 있는 것을 특징으로 하는 LED 검사 장치.LED inspection apparatus, characterized in that the normal operation of the two or more LEDs can be inspected by the energization of the anode wire electrically connected to each of the anode inspection unit, respectively.
  6. 제 4 항에 있어서,The method of claim 4, wherein
    상기 양극 검사부, 음극 검사부, 양극 전선 및 음극 전선은The positive electrode inspection unit, the negative electrode inspection unit, the positive electrode wire and the negative electrode wire
    상기 회로층의 상면에 임프린팅을 통해 홈이 형성된 후, 형성된 홈에 전도 물질을 충전하는 메탈 메쉬 방법에 의해 제조되는 것을 특징으로 하는 LED 검사 장치.After the groove is formed on the upper surface of the circuit layer through the imprinting, LED inspection apparatus, characterized in that manufactured by a metal mesh method of filling a conductive material in the formed groove.
  7. 제 4 항에 있어서,The method of claim 4, wherein
    상기 회로층의 상면에 완충층을 더 포함하고,Further comprising a buffer layer on the upper surface of the circuit layer,
    상기 완충층은 회로층과 동일한 연질의 재질로 구비되는 것을 특징으로 하는 LED 검사 장치.The buffer layer is an LED inspection device, characterized in that provided with the same soft material as the circuit layer.
  8. 제 7 항에 있어서,The method of claim 7, wherein
    상기 연질의 재질은 투명한 소재로 구비되며, UV Resin, SU-8 및 PDMS(Polydimethylsiloxane) 중 어느 하나로 구비되는 것을 특징으로 하는 LED 검사 장치.The soft material is provided with a transparent material, LED inspection device, characterized in that provided with any one of UV Resin, SU-8 and PDMS (Polydimethylsiloxane).
  9. 제 8 항에 있어서,The method of claim 8,
    상기 LED는 웨이퍼의 상면에 둘 이상 구비되고,At least two LEDs are provided on the upper surface of the wafer,
    상기 웨이퍼의 하면에 광검출부가 더 구비되며,The photodetector is further provided on the lower surface of the wafer,
    상기 광검출부는 상기 LED의 전극에 접촉하여 통전시킴으로써 각각의 상기 LED의 동작에 의해 발생되는 빛을 검출하여 각각의 상기 LED의 정상 동작 여부를 판단하는 것을 특징으로 하는 LED 검사 장치.The light detecting unit detects light generated by the operation of each LED by contacting and energizing the electrode of the LED to determine whether each of the LED is operating normally.
  10. 제 9 항에 있어서,The method of claim 9,
    상기 회로층 또는 상기 완충층에는 제 1 보조선이 구비되고,The circuit layer or the buffer layer is provided with a first auxiliary line,
    상기 웨이퍼에는 상기 제 1 보조선과 대응되는 제 2 보조선이 구비되어, 제 1 보조선 및 제 2 보조선을 대응시킴으로써 각각의 프로버부 및 LED를 정확한 위치로 접촉시킬 수 있는 것을 특징으로 하는 LED 검사 장치.The wafer is provided with a second auxiliary line corresponding to the first auxiliary line, by matching the first auxiliary line and the second auxiliary line, each prober and LED can be contacted to the correct position, characterized in that Device.
  11. 둘 이상의 점검 픽업부를 포함하는 LED 이송 장치로서, An LED transport device comprising two or more check pickups,
    상기 점검 픽업부는, The check pickup unit,
    상기 LED를 픽업하는 픽업부; 및 A pickup unit for picking up the LED; And
    상기 LED의 전극에 접촉하여 통전시킴으로써 상기 LED가 정상 동작하는지 여부를 점검하는 점검부;를 포함하는 것을 특징으로 하는 LED 이송 장치.And a checker configured to check whether the LED operates normally by contacting and energizing the electrode of the LED.
  12. 제 11 항에 있어서, The method of claim 11,
    상기 픽업부는,The pickup unit,
    상기 점검부가 정상 동작한다고 점검한 LED만을 선택적으로 픽업하는 것을 특징으로 하는 LED 이송 장치.LED transfer device, characterized in that for selectively picking up only the LED that the inspection unit checks that the normal operation.
  13. 제 12 항에 있어서, The method of claim 12,
    상기 점검부는, The inspection unit,
    LED의 두 전극에 각각 접촉하는 양극 점검부 및 음극 점검부로 구비되고,It is provided with an anode check unit and a cathode check unit that respectively contact the two electrodes of the LED,
    상기 픽업부는, The pickup unit,
    양극 픽업부 및 음극 픽업부가 각각 별개로 구비되는 것을 특징으로 하는 LED 이송 장치.LED transfer device, characterized in that the positive and negative pickup portion is provided separately.
  14. 제 13항에 있어서,The method of claim 13,
    상기 양극 점검부 및 음극 점검부와 각각 일단이 전기적으로 연결되는 제 1 양극 전선 및 제 1 음극 전선이 구비되는 제 2 레이어; 및A second layer having a first positive electrode wire and a first negative electrode wire electrically connected to one end of the positive electrode checker and the negative electrode checker, respectively; And
    상기 제 2 레이어의 상면에 위치하고, 상기 픽업부와 일단이 전기적으로 연결되는 제 1 픽업 전선 또는 상기 양극 픽업부 및 음극 픽업부와 각각 일단이 전기적으로 연결되는 양극 픽업 전선 및 음극 픽업 전선이 구비되는 제 3 레이어;를 포함하는 것을 특징으로 하는 LED 이송 장치.Located on the upper surface of the second layer, the first pickup wire and one end electrically connected to the pick-up portion or the positive and negative pick-up wire and the cathode pick-up wire and the one end is electrically connected to each of the positive and negative pick-up portion is provided LED transport apparatus comprising a; third layer.
  15. 제 14항에 있어서,The method of claim 14,
    상기 점검부는, 상기 LED에 접하여 상기 LED가 정상 동작하는지 여부를 점검하고,The inspection unit checks whether the LED is in normal operation in contact with the LED,
    상기 픽업부는, 상기 LED에 접하지 않고 정전기를 통해 상기 LED를 픽업하는 것을 특징으로 하는 LED 이송 장치.The pickup unit, the LED transfer device, characterized in that for picking up the LED through the static electricity without contact with the LED.
PCT/KR2019/002728 2018-03-09 2019-03-08 Led testing device and transfer device WO2019172707A1 (en)

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