CN110911436A - Transfer device and transfer method for driving backboard and light emitting diode - Google Patents
Transfer device and transfer method for driving backboard and light emitting diode Download PDFInfo
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- CN110911436A CN110911436A CN201911220627.7A CN201911220627A CN110911436A CN 110911436 A CN110911436 A CN 110911436A CN 201911220627 A CN201911220627 A CN 201911220627A CN 110911436 A CN110911436 A CN 110911436A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
Abstract
The invention discloses a transfer device and a transfer method for a driving backboard and a light emitting diode, wherein the transfer device for the light emitting diode comprises: the transfer substrate, a plurality of transfer head structures positioned on the transfer substrate, a plurality of photosensitive sensors and a plurality of detection probes; the transfer head structure is provided with a photosensitive sensor and two detection probes on one side departing from the transfer substrate; the transfer head structure is provided with an accommodating area for accommodating the light-emitting diode, and the two detection probes are respectively positioned at two opposite sides of the accommodating area; the detection probe is used for being electrically connected with the contact electrode at the corresponding position on the driving backboard after the transfer device is pressed with the driving backboard and providing driving voltage for the contact electrode; and the photosensitive sensor is used for detecting whether the light emitting diode at the corresponding position emits light or not after the detection probe provides the driving voltage for the contact electrode, and outputting a photosensitive detection signal. The transfer device provided by the embodiment of the invention realizes the detection of the light emitting diode in the transfer process.
Description
Technical Field
The invention relates to the technical field of display, in particular to a transfer device and a transfer method for a driving back plate and a light emitting diode.
Background
A micro light Emitting Diode (μ LED) has a self-Emitting characteristic without a backlight, is similar to an organic light-Emitting Diode (OLED), but has a color that can be adjusted more easily and accurately than an OLED, and has advantages of simple structure, almost no light consumption, very long service life, high brightness, low power consumption, ultra-high resolution, and color saturation. The greatest advantage of micro-leds comes from its greatest feature, namely, micron-scale pitch, addressing control and single-point driving of light emission for each pixel (pixel), and thus the highest luminous efficiency compared to other display modes.
At present, the application field of the micro light emitting diode is very wide, and the micro light emitting diode spans a plurality of fields such as wearable equipment, a super large indoor Display screen, a Head-mounted Display, a Head Up Display (HUD), a tail lamp, wireless optical communication (Li-Fi) and a projector.
However, since the micro led has a very small size and requires a fine operation technique, the micro led is more vulnerable than a conventional led, and therefore, the success rate of the micro led transfer printing process is related to the overall display effect.
Disclosure of Invention
The embodiment of the invention provides a driving backboard, a transfer device of a light emitting diode and a transfer method, which are used for solving the problem that the micro light emitting diode cannot be detected in the transfer process in the prior art.
In a first aspect, an embodiment of the present invention provides a light emitting diode transfer device, including: the transfer substrate is provided with a plurality of transfer head structures, a plurality of photosensitive sensors and a plurality of detection probes, wherein the plurality of transfer head structures are positioned on the transfer substrate;
the photosensitive sensor and the two detection probes are arranged on one side of the transfer head structure, which is far away from the transfer substrate;
the transfer head structure is provided with an accommodating area for accommodating the light-emitting diode, and the two detection probes are respectively positioned at two opposite sides of the accommodating area;
the detection probe is used for being electrically connected with the contact electrode at the corresponding position on the driving backboard after the transfer device is pressed with the driving backboard, and providing driving voltage for the contact electrode;
and the photosensitive sensor is used for detecting whether the light-emitting diode at the corresponding position emits light or not and outputting a photosensitive detection signal after the detection probe provides a driving voltage for the contact electrode.
In a possible implementation manner, in the above transfer device provided by the embodiment of the present invention, the detection probe is retractable in a direction perpendicular to the transfer substrate.
In a possible implementation manner, in the above transfer device provided in an embodiment of the present invention, the detection probe includes: an elastic conductive structure and a conductive probe electrically connected to each other.
In a possible implementation manner, in the above transfer device provided in the embodiment of the present invention, the transfer head structure has a groove at a position corresponding to the detection probe;
the elastic conductive structure is positioned inside the groove;
the conductive probe is provided with a clamping part at one end close to the elastic conductive structure; the clamping part is positioned in the groove and cannot penetrate through the opening of the groove, and the part of the conductive probe except the clamping part can penetrate through the opening of the groove.
In a possible implementation manner, in the above transfer device provided in an embodiment of the present invention, the elastic conductive structure includes: a plurality of elastic conductive microspheres;
and the elastic conductive microspheres are filled in the grooves on one side of the clamping part close to the transfer substrate.
In a possible implementation manner, in the above transfer device provided by the embodiment of the present invention, the material of the conductive probe is one or an alloy of at least two of copper, aluminum, silver, and gold.
In a second aspect, an embodiment of the present invention further provides a driving backplane, including: a substrate base plate, a plurality of contact electrode groups and a plurality of conductive structures, wherein the contact electrode groups are positioned on the substrate base plate;
the contact electrode group is used for being electrically connected with a light emitting diode and comprises two oppositely arranged contact electrodes;
the contact electrode group corresponds to two oppositely arranged conductive structures, and two contact electrodes in the contact electrode group are positioned between the two corresponding conductive structures; the conductive structure is contacted with the corresponding contact electrode;
the conductive structure corresponds to the position of the detection probe in the transfer device;
and the conductive structure is used for contacting with the detection probe in the transfer device after the transfer device is pressed with the driving backboard.
In a possible implementation manner, in the driving back plate provided by the embodiment of the present invention, the contact electrode is an elastic conductive adhesive.
In a possible implementation manner, in the driving backplane provided by the embodiment of the present invention, the height of the conductive structure is lower than the height of the corresponding contact electrode.
In a third aspect, an embodiment of the present invention further provides a method for transferring a light emitting diode, including:
adsorbing a plurality of light emitting diodes by using the transfer device;
moving the transfer device to the position above the driving backboard, wherein the surface of the transfer device, on which the light emitting diodes are adsorbed, is opposite to the surface of the driving backboard, which is provided with the contact electrode;
aligning and pressing the transfer device and the driving backboard so that the detection probe in the transfer device is in contact with the corresponding conductive structure on the driving backboard;
applying a driving voltage to each of the detection probes;
and determining whether the light-emitting diodes are successfully transferred or not according to photosensitive detection signals output by the photosensitive sensors in the transfer device.
The invention has the following beneficial effects:
the embodiment of the invention provides a driving backboard, a light emitting diode transfer device and a light emitting diode transfer method, wherein the light emitting diode transfer device comprises: the transfer substrate, a plurality of transfer head structures positioned on the transfer substrate, a plurality of photosensitive sensors and a plurality of detection probes; the transfer head structure is provided with a photosensitive sensor and two detection probes on one side departing from the transfer substrate; the transfer head structure is provided with an accommodating area for accommodating the light-emitting diode, and the two detection probes are respectively positioned at two opposite sides of the accommodating area; the detection probe is used for being electrically connected with the contact electrode at the corresponding position on the driving backboard after the transfer device is pressed with the driving backboard and providing driving voltage for the contact electrode; and the photosensitive sensor is used for detecting whether the light emitting diode at the corresponding position emits light or not after the detection probe provides the driving voltage for the contact electrode, and outputting a photosensitive detection signal. According to the light emitting diode transfer device provided by the embodiment of the invention, the photosensitive sensor and the detection probe are arranged on the side of the transfer head structure, which is far away from the transfer substrate, after the transfer device is pressed with the driving backboard, the detection probe can be electrically connected with the contact electrode at the corresponding position on the driving backboard and provides driving voltage for the contact electrode, and then the photosensitive sensor can be used for detecting whether the light emitting diode at the corresponding position emits light, so that the light emitting diode can be detected in the process of transferring the light emitting diode.
Drawings
Fig. 1 is a schematic structural diagram of a transfer device for light emitting diodes according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a transfer device after picking up LEDs in an embodiment of the present invention;
FIG. 3 is a schematic view of the transfer device viewed from the detection probe side toward the transfer substrate side;
FIG. 4 is a schematic structural diagram of a transfer head structure for picking up LEDs according to an embodiment of the present invention;
FIG. 5 is a schematic structural diagram of a detection probe in an embodiment of the present invention;
fig. 6 is a schematic structural diagram of a driving backplate according to an embodiment of the present invention;
FIG. 7 is a schematic top view of a driving plate according to an embodiment of the present invention;
FIG. 8 is a schematic structural diagram of a transfer device and a driving backplane in the prior art after being pressed together;
fig. 9 is a schematic structural diagram of the transfer device and the driving backplane after being pressed together according to the embodiment of the present disclosure;
fig. 10 is a flowchart of a transfer method of an led according to an embodiment of the present invention;
fig. 11 to fig. 13 are schematic structural diagrams corresponding to steps in the transfer method according to an embodiment of the present invention;
fig. 14 to fig. 16 are schematic structural diagrams illustrating a situation of transfer failure of the light emitting diode according to the embodiment of the present invention.
Detailed Description
Aiming at the problem that the micro light-emitting diode cannot be detected in the transfer process in the prior art, the embodiment of the invention provides a transfer device and a transfer method for a driving backboard and a light-emitting diode.
The following describes in detail specific embodiments of a driving backplane, a transfer apparatus for leds, and a transfer method according to embodiments of the present invention with reference to the accompanying drawings. The thicknesses and shapes of the various film layers in the drawings are not to be considered true proportions, but are merely intended to illustrate the present invention.
In a first aspect, an embodiment of the present invention provides a light emitting diode transfer apparatus, as shown in fig. 1, including: a transfer substrate 10, a plurality of transfer head structures 11 positioned on the transfer substrate 10, a plurality of photosensors 12, and a plurality of detection probes 13;
the transfer head structure 11 is provided with a photosensitive sensor 12 and two detection probes 13 on one side away from the transfer substrate 10;
the transfer head structure 11 has an accommodating area D for accommodating the light emitting diode, and the two detection probes 13 are respectively located at two opposite sides of the accommodating area D;
the detection probe 13 is used for being electrically connected with the contact electrode at the corresponding position on the driving backboard after the transfer device is pressed with the driving backboard, and providing driving voltage for the contact electrode;
and a photosensor 12 for detecting whether the light emitting diode at the corresponding position emits light after the detection probe 13 supplies a driving voltage to the contact electrode, and outputting a photosensitive detection signal.
According to the light emitting diode transfer device provided by the embodiment of the invention, the photosensitive sensor and the detection probe are arranged on the side of the transfer head structure, which is far away from the transfer substrate, after the transfer device is pressed with the driving backboard, the detection probe can be electrically connected with the contact electrode at the corresponding position on the driving backboard and provides driving voltage for the contact electrode, then the photosensitive sensor can be used for detecting whether the light emitting diode at the corresponding position emits light, and the fixed-point transfer effect can be fed back in real time through the photosensitive detection signal output by the photosensitive sensor, so that the light emitting diode can be detected in the process of transferring the light emitting diode.
The transfer device provided by the embodiment of the invention can be used for transferring micro light emitting diodes (μ LEDs) with the size of micron, a large number of micro light emitting diodes can be transferred and mounted on the corresponding driving back plate, and in addition, the transfer device can also be applied to a process for transferring light emitting diodes with larger size, and the application scene of the transfer device is not limited herein.
In order to be able to pick up a plurality of light emitting diodes at the same time, the above-mentioned transfer device includes a plurality of transfer head structures 11, in each drawing in the embodiment of the present invention, in order to more clearly illustrate the structure of the transfer device, only one of the transfer head structures 11 in the transfer device is taken as an example for illustration, and in the specific implementation, the number and distribution of the transfer head structures 11 may be set according to actual needs, and the present disclosure is not limited herein.
In the embodiment of the present invention, the transfer head structure 11 may be an electrostatic adsorption type or electromagnetic adsorption type transfer head, and the light emitting diode is adsorbed to the accommodating area by an adsorption force, so that the photosensitive sensor 12 is disposed on a side of the transfer head structure 11 away from the transfer substrate 10, and the adsorption of the light emitting diode by the transfer head structure 11 is not affected. Specifically, the electrostatic adsorption type transfer head comprises electrostatic units which are arranged periodically, and electrostatic loading and unloading can be realized by controlling the on-off of the electrostatic units, so that the electrostatic units at the transfer part can be selectively connected to absorb the light emitting diodes, and after the transfer head structure is moved to a corresponding position, the electrostatic units are disconnected to release the light emitting diodes, and the transfer of the light emitting diodes is realized. The electromagnetic adsorption type transfer head comprises a conductive coil, and the magnetic existence is controlled by controlling current to realize the pick-up and release of the light emitting diode.
The photosensor 12 may be any device having a function of detecting light, such as a photodiode, or other photosensitive devices, which are not limited herein. The photosensitive sensor 12 is located at one side of the transfer head structure 11 deviating from the transfer substrate 10, so that light emitted by the light emitting diode can be more easily detected, specifically, a containing groove can be arranged at a corresponding position on the transfer head structure 11, the photosensitive sensor 12 can be embedded into the corresponding containing groove, or the photosensitive diode 12 can be directly fixed on the surface of the transfer head structure 11, and no limitation is made here.
In order to ensure that the light emitted from the light emitting diode can be detected, at least one light sensor 12 is disposed on a side of the transfer head structure 11 away from the transfer substrate 10, and more light sensors 12 may also be disposed, which is not limited herein. The detection probes 13 are arranged to subsequently provide driving voltages to the contact electrodes on the driving backplane, and since each led corresponds to two contact electrodes, two detection probes 13 are generally arranged on the side of the transfer head structure 11 away from the transfer substrate 10. In order to provide driving voltage for the contact electrode on the driving back plate, the detection probes 13 are further electrically connected to an internal circuit of the transfer device, the internal circuit provides corresponding driving voltage for the detection probes 13, the two detection probes 13 corresponding to the transfer head structure 11 are respectively connected to positive voltage and negative voltage, and the voltage difference between the positive voltage and the negative voltage can be set according to the excitation threshold voltage of the corresponding light emitting diode.
Fig. 2 is a schematic structural diagram of the transfer device after picking up the light emitting diode, and fig. 3 is a schematic structural diagram of the transfer device viewed from the side of the detection probe 13 toward the side of the transfer substrate 10, as shown in fig. 2 and 3, the light emitting diode 20 includes an epitaxial structure 201 and two extraction electrodes 202 located on the same side of the epitaxial structure 201, and the embodiment of the present invention is mainly used for transferring and detecting the light emitting diode 20 where the extraction electrodes 202 are located on the same side of the epitaxial structure 201 as shown in fig. 2 and 3. In order to facilitate the electrical connection between the subsequent detection probes and the contact electrodes at the corresponding positions, the light emitting diodes 20 are required to be located in the accommodating area D, and the arrangement of the extraction electrodes 202 of the light emitting diodes 20 after the transfer is required to be consistent with the arrangement of the detection probes 13, that is, the arrangement is arranged in the manner shown in fig. 3, that is, the arrangement is arranged in the manner of the detection probes 13, the extraction electrodes 202, and the detection probes 13.
In the actual transferring process, the transferring device shown in fig. 2 after picking up the leds 20 is moved to the position above the corresponding driving backplane, the positions of the plurality of transferring head structures 11 in the transferring device respectively correspond to the positions of the plurality of contact electrode sets on the driving backplane, after aligning and pressing the transferring device and the driving backplane, the detecting probes are respectively electrically connected with the contact electrodes at the corresponding positions on the driving backplane, and then the detecting probes respectively provide driving voltages to the corresponding contact electrodes, so that the leds that are successfully transferred can emit light, the leds that are failed to transfer cannot emit light, the photosensors can detect whether the leds at the corresponding positions emit light, and the photosensors can determine whether the leds at the corresponding positions emit light by detecting the photosensitive detecting signals output by the photosensors, thereby detecting whether the leds are successfully transferred, real-time detection of the light emitting diode in the transfer process is realized. If a transfer failure occurs at a certain position, the light emitting diode can be replaced before the contact electrode is completely solidified, so that the cost for replacing the dead pixel after the whole transfer is completed is greatly reduced.
Further, in the above transfer device provided in the embodiment of the present invention, in order to ensure that the detection probes can be electrically connected to the contact electrodes at the corresponding positions on the driving backplane after the transfer device is pressed on the driving backplane, referring to fig. 1, the detection probes 13 are retractable in a direction perpendicular to the transfer substrate 10.
When the detection probe is specifically implemented, the conductive structure can be arranged in the driving back plate and is contacted with the corresponding contact electrode, the detection probe can be contacted with the conductive structure to realize the electrical connection with the corresponding contact electrode wire, the specific arrangement mode of the conductive structure can be described in detail in the second mode, and the detailed description is omitted here.
If the lengths of the detection probes and the conductive structures in the direction perpendicular to the transfer substrate are fixed, after the transfer device is pressed on the drive backboard, the contact of the light-emitting diodes and the corresponding contact electrodes is difficult to be ensured at the same time, and the detection probes are contacted with the corresponding conductive structures, and the cost and the process difficulty of manufacturing the telescopic conductive structures on the drive backboard on a large scale are high, so that the detection probes are arranged to be telescopic in the direction perpendicular to the transfer substrate, the detection probes can be ensured to be electrically connected with the corresponding contact electrodes on the basis of low cost and easy process realization, and the contact of the light-emitting diodes and the corresponding contact electrodes is not influenced.
In practical applications, as shown in fig. 4, in order to ensure that the detection probe 13 can contact with the corresponding conductive structure, the lower end of the detection probe 13 in the extended state, i.e. the position of the dashed line H2 in the figure, can be lower than the lower edge of the led 20 to be transferred, i.e. the position of the dashed line H1 in the figure.
Specifically, in the above transfer device provided in the embodiment of the present invention, as shown in fig. 5, the detection probe 13 includes: an elastic conductive structure 131 and a conductive probe 132 electrically connected to each other.
The detection probe 13 is composed of an elastic conductive structure 131 and a conductive probe 132 electrically connected with each other, which can ensure that the detection probe 13 can be stretched in a direction perpendicular to the transfer substrate, and can ensure that the detection probe 13 has certain hardness, thereby ensuring the stability of the detection probe 13.
More specifically, in the above-mentioned transfer device provided by the embodiment of the present invention, as shown in fig. 5, the transfer head structure 11 has a groove U at a position corresponding to the detection probe 13;
the elastic conductive structure 131 is positioned inside the groove U;
the conductive probe 132 has a fastening portion K at one end close to the elastic conductive structure 131; the clamping portion K is located inside the groove U, and the clamping portion K cannot pass through the opening of the groove U, and the conductive probe 132 except for the clamping portion K can pass through the opening of the groove U.
Arranging the elastic conductive structure 131 inside the groove U can ensure that the elastic conductive structure 131 stretches in the direction perpendicular to the transfer substrate, and prevent the stretching direction of the elastic conductive structure 131 from deviating. Through set up block portion K at the one end that electrically conductive probe 132 is close to elasticity conductive structure 131, and block portion K is located inside recess U, and block portion K can not pass the opening of recess U to be fixed in the corresponding position department of the first structure 11 of transfer with detecting probe 13. Detection probe 13 is under the extension state, and opening and shutting portion K can block the opening part of recess U, guarantees that conductive probe 132 can not break away from and shift first structure 11, receives the extrusion and when shortening when detection probe 13, because conductive probe 132 except that the opening of recess U can be passed to other parts of block portion K, makes conductive probe 132 can extrude elasticity conductive structure 131, makes detection probe 13 shorten.
In order to ensure that the engaging portion K cannot pass through the opening of the groove U, the width of the engaging portion K at least in one direction parallel to the transfer substrate may be set larger than the opening size of the groove U, and in order to ensure that the other portions of the conductive probe 132 except the engaging portion K can pass through the opening of the groove U, the other portions of the conductive probe 132 may be set to have a width in any direction parallel to the transfer substrate smaller than the opening size of the groove U, for example, the conductive probe 132 is set to have a T-shaped cross section in fig. 5.
In addition, at the bottom of the groove U in the transfer head structure 11, a connection structure 14 may be further provided, and the detection probe 13 may be electrically connected with the internal circuit of the transfer device through the connection structure.
In practical implementation, in the above transfer device provided in the embodiment of the present invention, as shown in fig. 5, the elastic conductive structure 131 includes: a plurality of elastic conductive microspheres Q;
and a plurality of elastic conductive microspheres Q are filled in the groove U at one side of the clamping part K close to the transfer substrate.
When the detection probe 13 is in an extended state, the interaction force between the elastic conductive microspheres Q is small, and when the detection probe 13 is compressed and shortened, the elastic conductive microspheres Q are compressed with each other, so that the detection probe 13 is shortened.
Moreover, in order to avoid the elastic conductive microspheres Q from falling off, the distance between the clamping part K and the inner part of the groove U can be set to be smaller than the size of the elastic conductive microspheres Q. Specifically, the elastic conductive microspheres Q may be directly made of an elastic conductive material, or may be made of an elastic insulating material, and then a layer of conductive material is wrapped on the surfaces of the microspheres to form the elastic conductive microspheres Q.
In practical applications, in the above transfer device provided by the embodiment of the present invention, the material of the conductive probe is one or an alloy of at least two of copper, aluminum, silver, and gold. The conductive probe is made of metal materials or alloy materials made of metal materials, so that the conductive probe has certain hardness on the basis of ensuring that the conductive probe has better conductive performance, and the stability of the conductive probe is ensured.
In a second aspect, based on the same inventive concept, the embodiment of the present invention further provides a driving backplane. Because the principle of solving the problem of the driving back plate is similar to that of the transfer device, the implementation of the driving back plate can refer to the implementation of the transfer device, and repeated details are not repeated.
Fig. 6 is a schematic structural diagram of a driving backplate according to an embodiment of the present invention, and fig. 7 is a schematic structural diagram of a top view of the structure shown in fig. 6, where the driving backplate according to the embodiment of the present invention, as shown in fig. 6 and 7, includes: a substrate base plate 30, a plurality of contact electrode sets 31 and a plurality of conductive structures 32 located on the substrate base plate 30;
the contact electrode group 31 is used for electrically connecting with a light emitting diode, and the contact electrode group 31 comprises two oppositely arranged contact electrodes 311;
the contact electrode group 31 corresponds to two oppositely arranged conductive structures 32, and two contact electrodes 311 in the contact electrode group 31 are located between the two corresponding conductive structures 32; the conductive structure 32 is in contact with the corresponding contact electrode 311;
the conductive structure 32 corresponds to the position of the detection probe in the transfer device;
and the conductive structure 32 is used for contacting with the detection probe in the transfer device after the transfer device is pressed with the driving back plate.
According to the driving back plate provided by the embodiment of the invention, the plurality of conductive structures are arranged on the substrate and are in contact with the corresponding contact electrodes, so that after the transfer device is pressed with the driving back plate, the conductive structures are in contact with the detection probes, the detection probes are electrically connected with the corresponding contact electrodes, and whether the transfer printing of the light emitting diodes at the corresponding positions is successful or not can be detected through the photosensitive sensors after the detection probes provide driving voltages for the corresponding contact electrodes.
The embodiment of the present invention is mainly used for transferring and detecting the light emitting diodes 20 of which the extraction electrodes 202 are located on the same side of the epitaxial structure 201 as shown in fig. 2 and fig. 3, so that one contact electrode group 31 in the driving backplane corresponds to one light emitting diode, and the contact electrode group 31 includes two oppositely disposed contact electrodes 311.
In order to make the conductive structures 32 more easily contact and electrically connect with the corresponding contact electrodes 311, and the contact area is large enough, the two contact electrodes 311 in the contact electrode group 31 are disposed between the two corresponding conductive structures 32, and in addition, the two conductive structures 32 are disposed on two sides of the two contact electrodes 311, so that the conductive structures 32 can correspond to the positions of the detection probes in the transfer device, and the detection probes and the conductive structures can be electrically connected after the transfer device and the driving backboard are pressed together.
Furthermore, as shown in fig. 6 and 7, an insulating layer 33 is further provided between the base substrate 30 and the conductive structures 32, and an orthogonal projection of each conductive structure 32 on the base substrate is located within an orthogonal projection range of a pattern of the insulating layer 33 on the base substrate 30, so that each conductive structure 32 is insulated from other circuits in the driving backplane.
In a specific implementation, in the driving backplate provided by the embodiment of the present invention, the contact electrode is an elastic conductive adhesive. Therefore, the contact electrode has certain elasticity, and after the transfer device is pressed with the driving back plate, the contact of the light-emitting diode and the corresponding contact electrode and the contact of the detection probe and the corresponding conductive structure are ensured more easily.
In addition, the contact electrode has certain elasticity, so the stability of the contact electrode is poor, the contact electrode is easily extruded and deformed in the process of pressing the transfer device and the driving backboard, and when the direction or the size of the pressure is not uniform, the contact electrode is easily inclined, so that the corresponding light-emitting diode is also inclined, the phenomenon of reduced collimation degree occurs, and the whole display effect of the display device is influenced.
Fig. 8 is a schematic structural diagram of a transfer device and a driving backplane after being bonded together in the prior art, as shown in fig. 8, due to non-uniform direction or magnitude of a pressure force in the process of bonding the transfer device and the driving backplane, a pressure force applied to the light emitting diode 20 may deviate from a direction perpendicular to the driving backplane, for example, the light emitting diode 20 shown in fig. 8 is subjected to a pressure force F, so that the pressure force applied to the two contact electrodes is non-uniform, and the light emitting diode 20 is seriously tilted.
Fig. 9 is a schematic structural diagram of the transfer device and the driving backplane after being pressed together, as shown in fig. 9, in the embodiment of the present invention, the conductive structures 32 are respectively disposed on two sides of the two opposite contact electrodes 311, and under the same action of the pressure F, the contact electrodes 311 also receive the reaction force F of the conductive structures 32, so that the conductive structures 32 block the deformation of the contact electrodes 311, thereby alleviating the phenomenon that the light emitting diodes 20 are inclined, and comparing the light emitting diodes 20 on the right side in fig. 8 with the light emitting diodes 20 on the right side in fig. 9, it can be obviously seen that the inclination phenomenon of the light emitting diodes 20 in fig. 9 is obviously alleviated, that is, the collimation degree of the light emitting diodes 20 in fig. 9 is better.
In practical implementation, in the driving backplane provided by the embodiment of the present invention, as shown in fig. 6, the height of the conductive structure 32 is lower than that of the corresponding contact electrode 311.
If the conductive structure 32 is too high, when the transfer device is pressed against the driving backplane, the light emitting diode is easily supported by the conductive structure 32, i.e. the light emitting diode and the contact electrode are easily in poor contact, so that in the embodiment of the present invention, the height of the conductive structure 32 is set to be lower than the height of the corresponding contact electrode 311, which can prevent the conductive structure 32 from affecting the fixing effect of the contact electrode 311 on the light emitting diode.
Specifically, the height of the contact electrode 311 is generally 2 to 4 μm, and the height of the conductive structure 32 may be set to be in the range of 1 to 3 μm. In addition, the width of the conductive structure 32 can be set in combination with the space on the driving backplane, and the width of the conductive structure 32 can be set within a range of 3-20 μm.
In an actual process, the driving back plate provided by the embodiment of the invention can be manufactured according to the following manufacturing method:
forming an insulating layer on the substrate, and patterning the insulating layer;
depositing a conductive layer on the insulating layer, for example, forming a metal layer by a sputtering process, where the material of the metal layer may be copper, aluminum, or other metal;
coating a photoresist layer on the conductive layer, and carrying out exposure and development processes on the photoresist layer;
the conductive layer is processed by an etching process (for example, wet etching may be used) to obtain each conductive structure.
In an actual process, in order to improve efficiency and save manufacturing cost of the driving back plate, a plurality of driving back plates are manufactured on one motherboard, and due to process requirements such as subsequent packaging, the driving back plates must be kept in integrity in the light emitting diode transfer process, however, under the condition that the integrity of the driving back plates is kept, the light emitting diodes cannot be lightened and detected through the driving back plates. In the embodiment of the invention, the detection probe and the photosensitive sensor are arranged in the transfer device, and the conductive structure is arranged in the driving back plate, so that the driving voltage can be applied to the light-emitting diode through the structure except the driving back plate to realize the detection of the light-emitting diode, the driving back plate does not need to be cut or otherwise processed, and the process control and the manufacturing difficulty are low.
In a third aspect, based on the same inventive concept, the embodiment of the invention further provides a transfer method of the light emitting diode. Because the principle of the transfer method for solving the problems is similar to that of the transfer device and the driving backboard, the implementation of the transfer method can be referred to the implementation of the transfer device and the driving backboard, and repeated details are not repeated.
As shown in fig. 10, the method for transferring a light emitting diode according to an embodiment of the present invention includes:
s401, referring to fig. 2, the transfer device 1 is used to absorb a plurality of light emitting diodes 20;
s402, referring to fig. 11, moving the transfer device 1 above the driving backplane 3, wherein the surface of the transfer device 1 on which the light emitting diodes 20 are absorbed is opposite to the surface of the driving backplane 3 having the contact electrode 311;
s403, referring to fig. 12, aligning and pressing the transfer device 1 and the driving backplane 3 to make the detection probes 13 in the transfer device 1 contact with the corresponding conductive structures 32 on the driving backplane 3; further, the extraction electrode of the light emitting diode 20 is also in contact with the corresponding contact electrode 311 while the detection probe 13 is in contact with the conductive structure 32.
S404, simultaneously applying a drive voltage to each detection probe 13 with reference to fig. 13; as shown in the figure, a positive voltage is applied to the left detection probe 13, the positive voltage is applied to one extraction electrode of the light emitting diode 20 through the conductive structure 32 and the contact electrode 311, a negative voltage is applied to the right detection probe 13, and the negative voltage is applied to the other extraction electrode of the light emitting diode 20 through the conductive structure 32 and the contact electrode 311, so that the light emitting diode 20 is turned on, if the transfer is successful, the light emitting diode 20 can emit light, and if the transfer is failed, the light emitting diode 20 cannot emit light.
S405, determining whether the transfer of each light emitting diode 20 is successful according to the photosensitive detection signal output by each photosensitive sensor 12 in the transfer device 1.
In the transfer method provided by the embodiment of the invention, after the transfer device and the driving backboard are aligned and pressed, the detection probes are contacted with the corresponding conductive structures, so that the driving voltage can be applied to the light emitting diodes in a manner of applying the driving voltage to each detection probe subsequently, if the light emitting diodes are transferred successfully, the photosensitive sensors at the corresponding positions can detect light, otherwise, the photosensitive sensors cannot detect the light, and therefore, whether the light emitting diodes are transferred successfully or not can be determined through photosensitive detection signals output by the photosensitive sensors, so that the light emitting diodes are detected in real time in the transfer process.
In addition, if the light emitting diode does not detect light, the light emitting diode at the corresponding position fails to be transferred, and the following situations may occur: as shown in fig. 14, it may occur that the transfer device 1 has not successfully picked up the light emitting diode; as shown in fig. 15, it may happen that the alignment precision during the transfer process exceeds the space where the light emitting diode 20 is located, so that the light emitting diode 20 is not electrically connected to the corresponding contact electrode 311; as shown in fig. 16, a damage of the light emitting diode 20 may occur, for example, the light emitting diode lacks such an electrode.
According to the transfer device and the transfer method for the driving back plate and the light emitting diode, the photosensitive sensor and the detection probe are arranged on the side, away from the transfer substrate, of the transfer head structure, after the transfer device and the driving back plate are pressed, the detection probe can be electrically connected with the contact electrode at the corresponding position on the driving back plate and provides driving voltage for the contact electrode, and then the photosensitive sensor can be used for detecting whether the light emitting diode at the corresponding position emits light or not, so that the light emitting diode can be detected in the process of transferring the light emitting diode. In addition, the conductive structure on the driving back plate can also play a role in blocking the deformation of the contact electrode and preventing the contact electrode from inclining, so that the phenomenon that the light-emitting diode inclines is relieved 7, and the collimation degree of the light-emitting diode is improved.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (10)
1. A light emitting diode transfer apparatus, comprising: the transfer substrate is provided with a plurality of transfer head structures, a plurality of photosensitive sensors and a plurality of detection probes, wherein the plurality of transfer head structures are positioned on the transfer substrate;
the photosensitive sensor and the two detection probes are arranged on one side of the transfer head structure, which is far away from the transfer substrate;
the transfer head structure is provided with an accommodating area for accommodating the light-emitting diode, and the two detection probes are respectively positioned at two opposite sides of the accommodating area;
the detection probe is used for being electrically connected with the contact electrode at the corresponding position on the driving backboard after the transfer device is pressed with the driving backboard, and providing driving voltage for the contact electrode;
and the photosensitive sensor is used for detecting whether the light-emitting diode at the corresponding position emits light or not and outputting a photosensitive detection signal after the detection probe provides a driving voltage for the contact electrode.
2. The transfer device of claim 1, wherein the detection probes are retractable in a direction perpendicular to the transfer substrate.
3. The transfer device of claim 2, wherein the detection probe comprises: an elastic conductive structure and a conductive probe electrically connected to each other.
4. The transfer device of claim 3, wherein the transfer head structure has a groove at a position corresponding to the detection probe;
the elastic conductive structure is positioned inside the groove;
the conductive probe is provided with a clamping part at one end close to the elastic conductive structure; the clamping part is positioned in the groove and cannot penetrate through the opening of the groove, and the part of the conductive probe except the clamping part can penetrate through the opening of the groove.
5. The transfer device of claim 4, wherein the resilient conductive structure comprises: a plurality of elastic conductive microspheres;
and the elastic conductive microspheres are filled in the grooves on one side of the clamping part close to the transfer substrate.
6. The transfer device of claim 3, wherein the conductive probe is made of one or an alloy of at least two of copper, aluminum, silver and gold.
7. A drive backplate, comprising: a substrate base plate, a plurality of contact electrode groups and a plurality of conductive structures, wherein the contact electrode groups are positioned on the substrate base plate;
the contact electrode group is used for being electrically connected with a light emitting diode and comprises two oppositely arranged contact electrodes;
the contact electrode group corresponds to two oppositely arranged conductive structures, and two contact electrodes in the contact electrode group are positioned between the two corresponding conductive structures; the conductive structure is contacted with the corresponding contact electrode;
the conductive structure corresponds to the position of the detection probe in the transfer device;
and the conductive structure is used for contacting with the detection probe in the transfer device after the transfer device is pressed with the driving backboard.
8. The driving backplate of claim 7, wherein the contact electrodes are resilient conductive adhesive.
9. The driving back plate of claim 7, wherein the conductive structures have a height that is lower than a height of the corresponding contact electrodes.
10. A method for transferring a Light Emitting Diode (LED), comprising:
adsorbing a plurality of light emitting diodes by using the transfer device according to any one of claims 1 to 6;
moving the transfer device to the position above the driving backboard according to any one of claims 7 to 9, wherein the side of the transfer device, on which the light emitting diode is adsorbed, is opposite to the side of the driving backboard, which is provided with the contact electrode;
aligning and pressing the transfer device and the driving backboard so that the detection probe in the transfer device is in contact with the corresponding conductive structure on the driving backboard;
applying a driving voltage to each of the detection probes;
and determining whether the light-emitting diodes are successfully transferred or not according to photosensitive detection signals output by the photosensitive sensors in the transfer device.
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