CN206931570U - A kind of automatic test, packing integral machine and light emitting diode - Google Patents
A kind of automatic test, packing integral machine and light emitting diode Download PDFInfo
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- CN206931570U CN206931570U CN201720745397.6U CN201720745397U CN206931570U CN 206931570 U CN206931570 U CN 206931570U CN 201720745397 U CN201720745397 U CN 201720745397U CN 206931570 U CN206931570 U CN 206931570U
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- line mould
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- 238000012360 testing method Methods 0.000 title claims abstract description 62
- 238000012856 packing Methods 0.000 title claims abstract description 22
- 239000013078 crystal Substances 0.000 claims abstract description 85
- 239000004568 cement Substances 0.000 claims abstract description 8
- 230000007246 mechanism Effects 0.000 claims description 54
- 239000003292 glue Substances 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 11
- 239000004593 Epoxy Substances 0.000 claims description 9
- 239000000843 powder Substances 0.000 claims description 3
- 238000003491 array Methods 0.000 claims description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 2
- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- 239000001301 oxygen Substances 0.000 claims description 2
- 238000011144 upstream manufacturing Methods 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- 238000005538 encapsulation Methods 0.000 abstract description 11
- 238000000034 method Methods 0.000 abstract description 8
- 230000008569 process Effects 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 239000000523 sample Substances 0.000 description 6
- 239000007921 spray Substances 0.000 description 5
- 239000002245 particle Substances 0.000 description 4
- 238000000605 extraction Methods 0.000 description 3
- 238000000386 microscopy Methods 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000005622 photoelectricity Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The utility model belongs to semiconductor applications, a kind of more particularly to automatic test, packing integral machine and light emitting diode, it will be tested, encapsulation is integrated in one, the time of die package can be shortened, reduce board cost, improve production efficiency, reduce blue film, the loss of release liners, shorten technological process, reduce the technique detected again after encapsulation, light emitting diode prepared by this all-in-one, including lead-foot-line mould, and the crystal grain in lead-foot-line mould, two electrodes of crystal grain are connected on the counter electrode on lead-foot-line mould by bonding wire respectively, filled with insulating cement for fixing lead-foot-line mould and crystal grain between lead-foot-line mould and crystal grain.
Description
Technical field
The utility model belongs to semiconductor applications, more particularly to a kind of automatic test, packing integral machine, is surveyed for realizing
Examination, the institutional operation of encapsulation.
Background technology
Light emitting diode is formed by LED crystal particle encapsulation, and whether its quality is qualified to depend primarily on light emitting diode
Crystal grain, the quality influence encapsulated on LED crystal particle are smaller.However, LED crystal particle need to often encapsulate at present
The devices such as Cheng Houyong optical fiber auxiliary could measure photoelectric characteristic to judge whether quality is qualified, usually in LED crystal particle not
Also it is packaged in the case of qualified, causes to waste, improves the cost of light emitting diode.
At present crystal grain make rear road flow be：1st, draw to split machine and chip draw and split, form single crystal grain；2nd, test machine
In CCD crystal grain is scanned and surveyed entirely；3rd, automatic microscopy machine carries out microscopy to grain appearance；4th, analysis machine is according to complete
Survey and microscopy data, are sorted by parameters such as certain light intensity, voltage, wavelength to crystal grain；5th, manually using microscope to crystal grain
Visual inspection is carried out again, is chosen except underproof crystal grain, is then packaged.Caused in current flow blue film release liners, manpower and
Board is sorted to waste.Also, the crystal grain after sorting, need to be according to the wavelength of different crystal grain in encapsulation, fluorescent material corresponding to preparation
Amount, this process easily causes dirty and electrode and the yield yield loss such as weighs wounded.
The content of the invention
In order to solve the above technical problems, the utility model provides a kind of automatic test, packing integral machine, it is comprised at least：
One workbench, in a casing；
One fixed disk, on the workbench, for fixing wafer, the wafer by a plurality of die arrays and
Into；
One drive device, positioned at the top of the fixed disk, including the first manipulator, the first drive mechanism, extensible member, ring
The lead-foot-line mould of shape, first drive mechanism connect the first manipulator and extensible member, the lead-foot-line mold ring around and it is solid
It is scheduled on extensible member；
A pair of test routing units, respectively positioned at the both sides of the fixed disk, each test routing unit includes pair
Crystal grain carries out the mechanism for testing and type throwing mechanism of photoelectric properties test；
One main control unit, control the running of the all-in-one.
Preferably, the integrating sphere that automatic test, the packing integral machine are also included above fixed disk is received photosystem and shown
Micro mirror.
Preferably, automatic test, the packing integral machine also include one first glue applying mechanism and the second glue applying mechanism, pass through
One glue applying mechanism instills certain insulating cement, fixed crystal grain between lead-foot-line mould and crystal grain；Used by the second glue applying mechanism
Bonding wire is fixed in instilling certain conducting resinl on lead-foot-line mould and on crystal grain electrode.
Preferably, the first spray that the drive device also includes the second drive mechanism and is connected with the second drive mechanism
Mouth.
Preferably, the second spray that the drive device also includes the 3rd drive mechanism and is connected with the 3rd drive mechanism
Mouth.
Preferably, the first jet is fluorescent material coater nozzle.
Preferably, the second nozzle is epoxy coated unit.
Preferably, the test routing unit is fixed on workbench by corresponding second manipulator respectively.
The utility model also proposes a kind of light emitting diode, and it includes lead-foot-line mould, and in lead-foot-line mould
Crystal grain, two electrodes of crystal grain are connected on the counter electrode on lead-foot-line mould by bonding wire respectively, lead-foot-line mould with it is brilliant
The insulating cement of fixed crystal grain has been filled between grain.
Preferably, the light emitting diode is also included coated on the fluorescent material on crystal grain and positioned at lead-foot-line mould upstream
Coat the epoxy packages body of whole crystal grain.
All-in-one provided by the utility model, will test, encapsulation be integrated in one, can contracting grain encapsulation time, reduce board
Cost, production efficiency is improved, reduce the loss of blue film, release liners, shorten technological process, reduce what is detected again after encapsulating
Technique, and the light emitting diode construction thus prepared is simple, light extraction efficiency is higher.
Brief description of the drawings
Fig. 1 is the automatic test of the utility model, the front view of packing integral machine.
Fig. 2 is the automatic test of the utility model, the top view of packing integral machine.
Fig. 3 is the front view of the drive device of the utility model.
Fig. 4 is the front view of the light emitting diode through the utility model.
Accompanying drawing marks：100：Workbench；110：Casing；200：Fixed disk；210：Crystal grain；211：Electrode；212：Bonding wire；
300：Drive device；310：First manipulator；320：Extensible member；330：Lead-foot-line mould 340：First drive mechanism；350：The
Two drive mechanisms；351：First jet；352：Fluorescent material；360：3rd drive mechanism；361：Second nozzle；362：Epoxy packages
Body；400：Test routing unit；410：Second manipulator；420：Mechanism for testing；421：Test probe；422：Charge coupling device
Imaging sensor；430：Type throwing mechanism；510：First glue applying mechanism；520：Second glue applying mechanism；600：Microscope；610：4th
Manipulator；700：Integrating sphere receives photosystem；710：3rd manipulator；800：Main control unit.
Embodiment
Below by way of example, with clear explanation content of the present utility model, it is understood that, it is of the present utility model interior
Appearance is not restricted to following examples, and other are by the improvement of the conventional technical means of those of ordinary skill in the art also in this reality
Within new thought range.
Referring to accompanying drawing 1 ~ 3, the utility model proposes automatic test, packing integral machine, including：
One workbench 100, in a casing 110；
It is used for the fixed disk 200 for placing wafer retainer ring on workbench 100, has on the solid blue film of wafer retainer ring
A plurality of crystal grain 210 for being spaced apart arrangement, crystal grain 210 equally arrange after expanding film on blue film；
Drive device 300 above fixed disk 200, it includes the first manipulator 310, the first drive mechanism 340, stretched
The lead-foot-line mould 330 of contracting part 320, annular, lifting, the rotation of the first manipulator 310 control drive device 300, lead-foot-line mould
Tool 330 surround and is fixed on extensible member 320, stretching for the first drive mechanism 340 control extensible member 320, makes lead-foot-line mould
330 are come off from extensible member 320, and the lead-foot-line mould 330 when coming off is pacified under gravity to be placed on around crystal grain 210, and
The adhesive attraction of logical blue toner is tentatively fixed on blue film, and crystal grain 210 is located at the inside of annular lead-foot-line mould 330；
A pair of test routing units 400, are located at the both sides of fixed disk 200 by a pair of second manipulators 410 respectively, each
Test mechanism for testing 420 and type throwing mechanism 430 that routing unit 400 includes carrying out crystal grain 210 photoelectric properties test；Photoelectricity
The satisfactory crystal grain 210 of performance is placed in lead-foot-line mould 330 by the first drive mechanism 340, and type throwing mechanism 430 is right respectively
Electrode 211 on crystal grain 210 is connected to the incoming end of electrode 211 on lead-foot-line mould 330 by bonding wire 212, once completes brilliant
The test of grain 210 works with routing, for the undesirable crystal grain of photoelectric properties 210, then without installing lead-foot-line mould
330 and routing work；Mechanism for testing includes test probe 421 and the ccd image sensing on test probe
Device 422（Abbreviation CCD）；
One main control unit 800, controls the running of all-in-one.
With continued reference to accompanying drawing 1 ~ 2, the offer of the present embodiment is tested automatically, packing integral machine also includes the first glue applying mechanism
510 and second glue applying mechanism 520, instilled by the first glue applying mechanism 510 between lead-foot-line mould 330 and crystal grain 210 certain
Insulating cement fix crystal grain 210 and lead-foot-line mould 330.By the second glue applying mechanism 520 on lead-foot-line mould 330 and crystal grain
Certain conducting resinl is instilled on 210 electrodes 211 to fix bonding wire 212.
Automatic test, packing integral machine with continued reference to 1 ~ 2 offer of the present utility model of accompanying drawing also include being located at fixed disk
The integrating sphere of top receives photosystem 700 and microscope 600, and integrating sphere receives photosystem 700 and microscope 600 passes through the 3rd machine respectively
The manipulator 610 of tool hand 710 and the 4th adjusts its position relative to fixed disk 200.
Meanwhile the incandescent lamp for being currently used for illumination is to coordinate yellow fluorescent powder 352 to make in encapsulation with blue light crystal grain 210 mostly
Into, therefore, referring to accompanying drawing 3, drive device 300 provided by the utility model also includes the second drive mechanism 350 and with the
The first jet 351 of two drive mechanisms 350 connection, first jet 351 is fluorescent material coater nozzle, the second drive mechanism 350
According to the photoelectric parameter adjust automatically fluorescent material of crystal grain 210 quantity for spray and control the position of first jet 351 so that blue light crystal grain
210 finally send white light.In addition, drive device 300 also includes the 3rd drive mechanism 360 and connected with the 3rd drive mechanism 360
The second nozzle 361 connect, second nozzle 361 are epoxy nozzle, and the 3rd drive mechanism 360 is used for the quantity for spray and tune for controlling epoxy
The position of whole second nozzle 361, an epoxy packages is carried out to crystal grain 210, to protect the outward appearance of crystal grain 210 to avoid being damaged, reduction water,
The erosion of the materials such as air and cause electric property to reduce, while lead-foot-line and crystal grain 210 are combined together.
A kind of test, the specific works mode of packing integral machine automatically provided by the utility model are as follows：
First, the crystal grain 210 for having expanded film is positioned on fixed disk 200, passes through ccd image sensor 422
After Scan orientation, according to the good off origin of film source origin indication of settable, adjust in mechanism for testing 420 and survey by microscope 600
The needle falling point of pin 421 is soundd out, the then swing arm of the second manipulator 410 will test routing unit 400 and go to the top of crystal grain 210, test
Test probe 421 in mechanism 420 carries out a survey to every crystal grain 210 on blue film, and integrating sphere receives photosystem 700 and measures crystal grain
210 luminous flux, electrical data are sent to main control unit 800 by mechanism for testing 420, and main control unit 800 is according to setting
The photoelectric parameter scope such as LOP, VF, WLD judges whether the crystal grain 210 reaches established standardses, if undesirable, mechanism for testing
420 continue a next crystal grain 210 of survey, if photoelectric parameter reaches established standardses, test probe 422, which is retracted, tests routing unit
In 400, the rotation of the arm of the second manipulator 410, test routing unit 400 is shifted, away from the top of crystal grain 210, complete test job；
Then the first manipulator 310 control drive device 300 rotates to the top of crystal grain 210, and drive device 300 passes through control
It exports the extensible member 320 of lower section to a lead-foot-line mould 330 on the positioning sleeve of lower die 210, and utilizes the adhesion of blue film
Property lead-foot-line mould 330 is fixed on to the surrounding of crystal grain 210, the small big size for depending on crystal grain 210 of lead-foot-line mould 330,
Subsequent first glue applying mechanism 510 sprays insulating cement in crystal grain 210 between lead-foot-line mould 330, by lead-foot-line mould 330 and crystalline substance
Grain 210 is further fixed.
After lead-foot-line mould 330 is fixed, conductive silver glue is plated by the second glue applying mechanism 520 on lead-foot-line mould 330, so
The second manipulator 410 rotates test routing unit 400 to the top of crystal grain 210 again afterwards, the wire bonder tested in routing unit 400
The electrode 211 that structure 430 is connected on lead-foot-line mould 330 to the P/N electrodes 211 on crystal grain 210 by bonding wire 212 respectively accesses
End, complete 211 outer termination process of electrode.
After the completion of routing, test probe 422 is retracted into test routing unit 400, and the second manipulator 410 again will test
Routing unit 400 rotate after away from crystal grain 210, now the first jet 351 in drive device 300 to crystal grain 210 apply fixed
Yellow fluorescent powder is measured, the coated weight of fluorescent material is surveyed wavelength when being tested according to crystal grain 210 and allocated, and is then passing through point second
Nozzle 361 carries out an epoxy packages to crystal grain 210, and the protection outward appearance of crystal grain 210 avoids being damaged, and completes the encapsulation of single crystal grain 210,
And blue light crystal grain 210 is set finally to emit white light.
Finally, then by microscope 600 performance is inspected by random samples at random, all test, the encapsulation of the crystal grain 210 on whole blue film
After the completion of, then counting packaging is carried out to crystal grain 210.
Pass through the automatic test of the present embodiment, packing integral machine, referring to accompanying drawing 4, light-emitting diode bag manufactured in the present embodiment
Lead-foot-line mould 330, and the crystal grain 210 in lead-foot-line mould 330 are included, two electrodes 211 of crystal grain 210 pass through weldering respectively
Line 212 is connected on the counter electrode 211 on lead-foot-line mould 330, filled with exhausted between lead-foot-line mould 330 and crystal grain 210
Edge glue.
To make blue light crystal grain 210 finally to send white light, the hair diode in the present embodiment also includes being coated on crystal grain 210
On fluorescent material 352, on the other hand, avoid being damaged for the protection outward appearance of crystal grain 210, reduce water, the erosion of material such as air and make
Into electric property reduce, and lead-foot-line mould 330 and crystal grain 210 are melted and are also wrapped on a ring for entirety, the outward appearance of crystal grain 210
Oxygen packaging body 362, it coats the top of whole crystal grain 210 and lead-foot-line mould 330, to increase light extraction efficiency, epoxy packages body
362 hemispherical structures.
All-in-one provided by the utility model, test, encapsulation are integrated in one, when die package can be shortened, reduced
Board cost, production efficiency is improved, reduce blue film, shorten technological process, using the fixation of insulating cement, reduced after encapsulating again
The technique detected, and the light emitting diode construction thus prepared is simple, light extraction efficiency is high.
It should be appreciated that above-mentioned specific embodiment is preferred embodiment of the present utility model, model of the present utility model
Enclose and be not limited to the embodiment, all any changes done according to the utility model, all belong within the scope of protection of the utility model.
Claims (10)
1. a kind of automatic test, packing integral machine, it is comprised at least：
One workbench, in a casing；
One fixed disk, on the workbench, for fixing wafer, the wafer is formed by a plurality of die arrays；
One drive device, positioned at the top of the fixed disk, including the first manipulator, the first drive mechanism, extensible member, annular
Lead-foot-line mould, first drive mechanism connect the first manipulator and extensible member, the lead-foot-line mold ring around and be fixed on
On extensible member；
A pair of test routing units, include respectively positioned at the both sides of the fixed disk, each test routing unit to crystal grain
Carry out the mechanism for testing and type throwing mechanism of photoelectric properties test；
One main control unit, control the running of the all-in-one.
2. a kind of automatic test according to claim 1, packing integral machine, it is characterised in that：This tests, encapsulates one automatically
The integrating sphere that body machine is also included above fixed disk receives photosystem and microscope.
3. a kind of automatic test according to claim 1, packing integral machine, it is characterised in that：This tests, encapsulates one automatically
Body machine also includes one first glue applying mechanism and the second glue applying mechanism, and first glue applying mechanism is between lead-foot-line mould and crystal grain
Instill certain insulating cement, fixed crystal grain；Second glue applying mechanism instills necessarily on lead-foot-line mould and on crystal grain electrode
Conducting resinl fix bonding wire.
4. a kind of automatic test according to claim 1, packing integral machine, it is characterised in that：The drive device is also wrapped
Include the second drive mechanism and the first jet being connected with the second drive mechanism.
5. a kind of automatic test according to claim 1, packing integral machine, it is characterised in that：The drive device is also wrapped
Include the 3rd drive mechanism and the second nozzle being connected with the 3rd drive mechanism.
6. a kind of automatic test according to claim 4, packing integral machine, it is characterised in that：The first jet is glimmering
Light powder coater nozzle.
7. a kind of automatic test according to claim 5, packing integral machine, it is characterised in that：The second nozzle is ring
Oxygen coating unit.
8. a kind of automatic test according to claim 1, packing integral machine, it is characterised in that：The test routing unit
It is fixed on respectively by corresponding second manipulator on workbench.
9. a kind of light emitting diode, it includes lead-foot-line mould, and the crystal grain in lead-foot-line mould, two electrodes of crystal grain
It is connected to respectively by bonding wire on the counter electrode on lead-foot-line mould, fixed crystal grain has been filled between lead-foot-line mould and crystal grain
Insulating cement.
A kind of 10. light emitting diode according to claim 9, it is characterised in that：The light emitting diode also includes coating
Coat in the fluorescent material on crystal grain and positioned at lead-foot-line mould upstream the epoxy packages body of whole crystal grain.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720745397.6U CN206931570U (en) | 2017-06-26 | 2017-06-26 | A kind of automatic test, packing integral machine and light emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720745397.6U CN206931570U (en) | 2017-06-26 | 2017-06-26 | A kind of automatic test, packing integral machine and light emitting diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206931570U true CN206931570U (en) | 2018-01-26 |
Family
ID=61345795
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720745397.6U Active CN206931570U (en) | 2017-06-26 | 2017-06-26 | A kind of automatic test, packing integral machine and light emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206931570U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110911436A (en) * | 2019-12-03 | 2020-03-24 | 京东方科技集团股份有限公司 | Transfer device and transfer method for driving backboard and light emitting diode |
| CN114901060A (en) * | 2022-05-19 | 2022-08-12 | 深圳市昌富祥智能科技有限公司 | Chip mounting automation equipment and use method thereof |
-
2017
- 2017-06-26 CN CN201720745397.6U patent/CN206931570U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110911436A (en) * | 2019-12-03 | 2020-03-24 | 京东方科技集团股份有限公司 | Transfer device and transfer method for driving backboard and light emitting diode |
| CN110911436B (en) * | 2019-12-03 | 2022-05-31 | 京东方科技集团股份有限公司 | Transfer device and transfer method for driving backboard and light emitting diode |
| CN114901060A (en) * | 2022-05-19 | 2022-08-12 | 深圳市昌富祥智能科技有限公司 | Chip mounting automation equipment and use method thereof |
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