CN208538843U - A kind of lead frame of semiconductor packaging structure - Google Patents
A kind of lead frame of semiconductor packaging structure Download PDFInfo
- Publication number
- CN208538843U CN208538843U CN201821226015.XU CN201821226015U CN208538843U CN 208538843 U CN208538843 U CN 208538843U CN 201821226015 U CN201821226015 U CN 201821226015U CN 208538843 U CN208538843 U CN 208538843U
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- Prior art keywords
- packaging body
- fixedly connected
- lead frame
- wire
- packaging structure
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Abstract
The utility model relates to lead frame technical fields; and disclose a kind of lead frame of semiconductor packaging structure; including packaging body; the protection sleeve pipe for being through to package interior is fixedly connected on the left of the packaging body; seal pipe is fixedly connected on the left of the protection sleeve pipe; the left and right side of the packaging body is fixedly connected to two mounting bases, and the front of the mounting base offers mounting hole.The lead frame of the semiconductor packaging structure, by with electrified wire and connecting wire by below packaging body four conductor rods and four attachment bases with above packaging body four conductor rods and four attachment bases be together in series respectively, it is connected on light emitting diode, when normal work, lumination of light emitting diode, when there is wire dropping between attachment base and conductor rod, light emitting diode open circuit is extinguished, staff can be debugged in time by the light emitting diode on the right side of observation semiconductor packages in this way.
Description
Technical field
The utility model relates to lead frame technical field, specially a kind of lead frame of semiconductor packaging structure.
Background technique
In existing semiconductor packaging structure manufacturing process, wire bonding technologies have been widely used in semiconductor chip and envelope
It fills in the electric connection between substrate or lead frame, the purpose is to the contact on chip is connected to lead frame with superfine conducting wire
Within upper on pin, and then the circuit signal of chip is transferred to the external world, after lead frame is transferred into positioning, applying electronic shadow
Determined as processing technique each contact on chip and each contact it is corresponding within contact on pin position, then
Do the movement of routing engagement.
It is connected between the chip and lead frame of semiconductor packaged inner by conducting wire, is generally passed through between conducting wire and lead frame
Soldering connection, when using the time to grow or be easy to happen disengaging by strenuous vibration, leads to half although connection is convenient in this way
Conductor encapsulation is broken down, however an equipment may use multiple semiconductor packages, can not judge abort situation in time in this way,
Increase and repairs difficulty.
Utility model content
(1) the technical issues of solving
In view of the deficiencies of the prior art, the utility model provides a kind of lead frame of semiconductor packaging structure, and having can
The advantages of judging abort situation in time is solved and is generally connected by soldering between conducting wire and lead frame, easy to connect in this way, but
It is to cause semiconductor packages not to be available, however one sets when using the time to grow or be easy to happen disengaging by strenuous vibration
It is standby to use multiple semiconductor packages, it can not judge abort situation in time in this way, increase the problem of repairing difficulty.
(2) technical solution
To realize the above-mentioned purpose that can judge abort situation in time, the utility model is provided the following technical solutions: Yi Zhongban
The lead frame of conductor packaging structure, including packaging body are fixedly connected on the left of the packaging body and are through to package interior
Protection sleeve pipe is fixedly connected with seal pipe on the left of the protection sleeve pipe, and the left and right side of the packaging body is fixedly connected with
There are two mounting bases, and the front of the mounting base offers mounting hole, is fixedly connected with light-emitting diodes on the right side of the packaging body
Pipe, the bottom and top of the packaging body are fixedly connected to the conductor rod for being through to package interior, and the conductor rod is separate
The side of packaging body is fixedly connected with connecting rod, and the conductor rod offers wire guide, the conducting wire far from the side of connecting rod
The front of bar is interspersed to be provided with the screw being through to inside wire guide, is fixedly connected between the conductor rod and light emitting diode
Electrified wire, the front of the packaging body offer sliding slot, and the interior rear wall of the packaging body is fixedly connected with fixed link, described solid
The front of fixed pole is fixedly connected with fixed ball, and the front of the fixed ball offers dashpot, the inside installation of the packaging body
There is pedestal, the front of the pedestal is fixedly connected with chip, output line is fixedly connected on the left of the chip, the chip
It is fixedly connected to four attachment bases above and below positive, is fixedly connected on the outside of the attachment base and extends to wire guide
Internal connecting wire, the connecting wire are fixedly connected with copper sheet, the front and position of the pedestal far from one end of attachment base
Fixation hole corresponding with fixed link is offered in the two sides of chip, the internal slide of the sliding slot is connected with sliding block, described
The front of sliding block is fixedly connected with top cover, is fixedly connected with grab on the left of the top cover.
Preferably, the output line is located at the inside of protection sleeve pipe and seal pipe, and the quantity of the light emitting diode has two
It is a.
Preferably, the quantity of the conductor rod has eight, and is spaced substantially equidistant between connecting rod and packaging body.
Preferably, the copper sheet is located at the inside of wire guide, and copper sheet is located at the back side of screw, and the bottom of the top cover is fixed
It is connected with sealing ring.
Preferably, the fixed link, fixed ball, dashpot and fixation hole it is equal there are four, the radius of fixation hole, which is greater than, to be fixed
The radius of bar, the radius of fixation hole are less than the radius of fixed ball.
Preferably, the pedestal is flexibly connected by fixed link, fixed ball, dashpot and fixation hole with packaging body.
Preferably, the electrified wire and connecting wire by four conductor rods and four attachment bases below packaging body and are sealed
Four conductor rods and four attachment bases above dress body are together in series respectively.
(3) beneficial effect
Compared with prior art, the utility model provides a kind of lead frame of semiconductor packaging structure, and having following has
Beneficial effect:
1, the lead frame of the semiconductor packaging structure, by with electrified wire and connecting wire by four below packaging body
Conductor rod and four attachment bases with above packaging body four conductor rods and four attachment bases be together in series respectively, be connected to luminous two
In pole pipe, when normal work, lumination of light emitting diode, when there is wire dropping between attachment base and conductor rod, light emitting diode
Open circuit is extinguished, and such staff can be debugged in time by the light emitting diode on the right side of observation semiconductor packages.
2, the lead frame of the semiconductor packaging structure, by being used cooperatively for wire guide, screw and copper sheet, by copper when connection
Piece is put into the inner bottom wall of wire guide, rotates clockwise screw, and screw is screwed into wire guide, and copper sheet is stuck, is led when such
What is connected between line and conductor rod is stronger, prevents from being made wire dropping by external world's influence.
3, the lead frame of the semiconductor packaging structure is made by the cooperation of fixed link, fixed ball, dashpot and fixation hole
When with, mounting seat, fixation hole alignment and fixation ball to be pressed backward, fixed ball, which is squeezed, to be clamped radius into dashpot and becomes smaller,
After fixation hole, restore that as former state, pedestal is secured firmly on the interior rear wall of packaging body.
Detailed description of the invention
Fig. 1 is the utility model encapsulating structure main view；
Fig. 2 is the utility model fabric chip main view；
Fig. 3 is the utility model cap structure schematic diagram；
Fig. 4 is the utility model fixed rod structure schematic diagram；
Fig. 5 is the utility model construction guidelines bar overhead sectional view.
In figure: 1 packaging body, 2 protection sleeve pipes, 3 seal pipes, 4 mounting bases, 5 mounting holes, 6 light emitting diodes, 7 conductor rods, 8
Connecting rod, 9 wire guides, 10 screws, 11 electrified wires, 12 sliding slots, 13 fixed links, 14 fixed balls, 15 dashpots, 16 pedestals, 17
Fixation hole, 18 chips, 19 output lines, 20 attachment bases, 21 connecting wires, 22 copper sheets, 23 top covers, 24 sliding blocks, 25 grabs.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Fig. 1-5, a kind of lead frame of semiconductor packaging structure, including packaging body 1 are please referred to, packaging body 1 uses PVC system
At the left side of packaging body 1 is fixedly connected with the protection sleeve pipe 2 being through to inside packaging body 1, and protection pipe 2 is made of rubber, protects
The left side of protecting pipe 2 is fixedly connected with seal pipe 3, and the left and right side of packaging body 1 is fixedly connected to two mounting bases 4, peace
The front of dress seat 4 offers mounting hole 5, and the right side of packaging body 1 is fixedly connected with light emitting diode 6, the model of light emitting diode 6
For S530-A3 performance parameter: 430 nanometers of wavelength, 20 milliamperes of electric current, five millimeters of size, the quantity of light emitting diode 6
There are two, the bottom and top of packaging body 1 are fixedly connected to the conductor rod 7 being through to inside packaging body 1, the number of conductor rod 7
Amount has eight, and is spaced substantially equidistant between connecting rod 8 and packaging body 1, and side of the conductor rod 7 far from packaging body 1 is fixed to be connected
It is connected to connecting rod 8, conductor rod 7 offers wire guide 9 far from the side of connecting rod 8, and interspersed be provided in the front of conductor rod 7 is run through
Screw 10 inside to wire guide 9, screw 10 are made of copper alloy, are fixedly connected between conductor rod 7 and light emitting diode 6
Electrified wire 11,11 diameter of conducting wire are two millimeters, the front of packaging body 1 offer sliding slot 12, the interior rear wall of packaging body 1 is fixed
It is connected with fixed link 13, the front of fixed link 13 is fixedly connected with fixed ball 14, and the front of fixed ball 14 offers dashpot 15,
The inside of packaging body 1 is equipped with pedestal 16, and pedestal 16 passes through fixed link 13, fixed ball 14, dashpot 15 and fixation hole 17 and envelope
It fills body 1 to be flexibly connected, the front of pedestal 16 is fixedly connected with chip 18, the model TEC1-12705 of chip 18, performance parameter:
15 volts of maximum voltage, maximum current five is pacified, and three millimeters of thickness, the left side of chip 18 is fixedly connected with output line 19, output line
19 be located at protection sleeve pipe 2 and seal pipe 3 inside, chip 18 it is positive above and below be fixedly connected to four attachment bases
20, the outside of attachment base 20 is fixedly connected with the connecting wire 21 extended to inside wire guide 9, electrified wire 11 and connecting wire
21 four conductor rods 7 and four companies by four conductor rods 7 of 1 lower section of packaging body and four attachment bases 20 with 1 top of packaging body
Joint chair 20 is together in series respectively, and connecting wire 21 is fixedly connected with copper sheet 22 far from one end of attachment base 20, and copper sheet 22, which is located at, leads
The inside of string holes 9, copper sheet 22 are located at the back side of screw 10, and the front of pedestal 16 and the two sides for being located at chip 18 offer and consolidate
The corresponding fixation hole 17 of fixed pole 13, fixed link 13, fixed ball 14, dashpot 15 and fixation hole 17 there are four, fixation hole 17
Radius be greater than the radius of fixed link 13, the radius of fixation hole 17 is less than the radius of fixed ball 14, and the internal slide of sliding slot 12 connects
It is connected to sliding block 24, the front of sliding block 24 is fixedly connected with top cover 23, and the bottom of top cover 23 is fixedly connected with sealing ring, top cover 23
Left side is fixedly connected with grab 25.
Working principle: by with electrified wire 11 and connecting wire 21 by four conductor rods 7 of 1 lower section of packaging body and four
Attachment base 20 is together in series respectively with four conductor rods 7 of 1 top of packaging body and four attachment bases 20, is connected to light emitting diode 6
On, when normal work, light emitting diode 6 shines, when having wire dropping between attachment base 20 and conductor rod 7, light emitting diode 6
Open circuit is extinguished.
In conclusion the lead frame of the semiconductor packaging structure, by that will be encapsulated with electrified wire 11 and connecting wire 21
Four conductor rods 7 and four attachment bases 20 of 1 lower section of body divide with four conductor rods 7 of 1 top of packaging body and four attachment bases 20
Be not together in series, be connected on light emitting diode 6, when normal work, light emitting diode 6 shines, when attachment base 20 and conductor rod 7 it
Between when having wire dropping, 6 open circuit of light emitting diode is extinguished, such staff can be by observation semiconductor packages on the right side of
Light emitting diode 6 is debugged in time.
The lead frame of the semiconductor packaging structure, by being used cooperatively for wire guide 9, screw 10 and copper sheet 22, when connection
Copper sheet 22 is put into the inner bottom wall of wire guide 9, rotates clockwise screw 10, screw 10 is screwed into wire guide 9, by copper sheet 22
Stuck, what is connected between conducting wire and conductor rod 7 when such is stronger, prevents from being made wire dropping by external world's influence.
The lead frame of the semiconductor packaging structure passes through matching for fixed link 13, fixed ball 14, dashpot 15 and fixation hole 17
It closes and uses, when mounting seat 16,17 alignment and fixation ball 14 of fixation hole is pressed backward, fixed ball 14 is squeezed into dashpot 15
It clamps radius to become smaller, after passing through fixation hole 17, restores that as former state, pedestal 16 is secured firmly on the interior rear wall of packaging body 1.
It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment
Intrinsic element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that
There is also other identical elements in process, method, article or equipment including the element.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (7)
1. the lead frame of kind of semiconductor packaging structure, including packaging body (1), it is characterised in that: the left side of the packaging body (1) is solid
Surely it is connected with and is through to the internal protection sleeve pipe (2) of packaging body (1), be fixedly connected with sealing on the left of the protection sleeve pipe (2)
It manages (3), the left and right side of the packaging body (1) is fixedly connected to two mounting bases (4), the front of the mounting base (4)
It offers mounting hole (5), is fixedly connected with light emitting diode (6) on the right side of the packaging body (1), the bottom of the packaging body (1)
Portion and top, which are fixedly connected to, is through to the internal conductor rod (7) of packaging body (1), and the conductor rod (7) is far from packaging body (1)
Side be fixedly connected with connecting rod (8), the conductor rod (7) offers wire guide (9), institute far from the side of connecting rod (8)
Interspersed be provided in front for stating conductor rod (7) is through to the internal screw (10) of wire guide (9), the conductor rod (7) and luminous
It is fixedly connected between diode (6) electrified wire (11), the front of the packaging body (1) offers sliding slot (12), the envelope
The interior rear wall of dress body (1) is fixedly connected with fixed link (13), and the front of the fixed link (13) is fixedly connected with fixed ball (14),
The front of the fixed ball (14) offers dashpot (15), and the inside of the packaging body (1) is equipped with pedestal (16), the bottom
The front of seat (16) is fixedly connected with chip (18), is fixedly connected with output line (19), the core on the left of the chip (18)
Piece (18) it is positive above and below be fixedly connected to four attachment bases (20), the outside of the attachment base (20) is fixed to be connected
It is connected to and extends to the internal connecting wire (21) of wire guide (9), the one end of the connecting wire (21) far from attachment base (20) is solid
Surely be connected with copper sheet (22), the front of the pedestal (16) and be located at chip (18) two sides offer and fixed link (13) phase
The internal slide of corresponding fixation hole (17), the sliding slot (12) is connected with sliding block (24), and the front of the sliding block (24) is fixed
It is connected with top cover (23), is fixedly connected with grab (25) on the left of the top cover (23).
2. a kind of lead frame of semiconductor packaging structure according to claim 1, it is characterised in that: the output line (19)
Positioned at the inside of protection sleeve pipe (2) and seal pipe (3), there are two the quantity of the light emitting diode (6).
3. a kind of lead frame of semiconductor packaging structure according to claim 1, it is characterised in that: the conductor rod (7)
Quantity have eight, and be spaced substantially equidistant between connecting rod (8) and packaging body (1).
4. a kind of lead frame of semiconductor packaging structure according to claim 1, it is characterised in that: copper sheet (22) position
In the inside of wire guide (9), copper sheet (22) is located at the back side of screw (10), and the bottom of the top cover (23) is fixedly connected with sealing
Circle.
5. a kind of lead frame of semiconductor packaging structure according to claim 1, it is characterised in that: the fixed link
(13), fixed ball (14), dashpot (15) and fixation hole (17) there are four, the radius of fixation hole (17) is greater than fixed link (13)
Radius, the radius of fixation hole (17) is less than the radius of fixed ball (14).
6. a kind of lead frame of semiconductor packaging structure according to claim 1, it is characterised in that: the pedestal (16) is logical
Fixed link (13), fixed ball (14), dashpot (15) and fixation hole (17) is crossed to be flexibly connected with packaging body (1).
7. a kind of lead frame of semiconductor packaging structure according to claim 1, it is characterised in that: the electrified wire
(11) and connecting wire (21) will be on four conductor rods (7) and four attachment bases (20) and packaging body (1) below packaging body (1)
Four conductor rods (7) and four attachment bases (20) of side are together in series respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821226015.XU CN208538843U (en) | 2018-08-01 | 2018-08-01 | A kind of lead frame of semiconductor packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821226015.XU CN208538843U (en) | 2018-08-01 | 2018-08-01 | A kind of lead frame of semiconductor packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208538843U true CN208538843U (en) | 2019-02-22 |
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ID=65386570
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821226015.XU Expired - Fee Related CN208538843U (en) | 2018-08-01 | 2018-08-01 | A kind of lead frame of semiconductor packaging structure |
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| Country | Link |
|---|---|
| CN (1) | CN208538843U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113496956A (en) * | 2020-03-18 | 2021-10-12 | 三菱电机株式会社 | Semiconductor device and method for manufacturing semiconductor device |
-
2018
- 2018-08-01 CN CN201821226015.XU patent/CN208538843U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113496956A (en) * | 2020-03-18 | 2021-10-12 | 三菱电机株式会社 | Semiconductor device and method for manufacturing semiconductor device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190222 Termination date: 20190801 |
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| CF01 | Termination of patent right due to non-payment of annual fee |