KR102386932B1 - Led probe device and transport deveice - Google Patents

Abstract

The present invention relates to an LED inspection device that inspects whether a micro LED operates normally on a wafer, and an LED transport device that selects and transports only normally operating micro LEDs by normal operation inspection.
In order to achieve the above object, the LED inspection apparatus of the present invention is characterized in that it includes two or more prober units, and an inspection unit for inspecting whether the micro LED operates normally by energizing the electrodes in contact with the micro LED. In addition, two or more prober units are arranged side by side in a plurality of matrices in the horizontal and vertical directions to correspond to the arrangement of micro LEDs on the wafer, and are characterized in that they are provided in a circuit layer made of a soft material. In addition, it is characterized in that it further comprises a buffer layer provided on the upper surface of the circuit layer and the same material as the circuit layer.
In addition, the LED transport device of the present invention includes a pickup unit that picks up the micro LED, and an inspection unit that checks whether the micro LED operates normally by contacting and energizing the electrode of the micro LED, and the pickup unit returns to normal operation in the inspection unit. It is characterized in that it selectively picks up only checked micro LEDs.

Description

LED inspection device and transport device {LED PROBE DEVICE AND TRANSPORT DEVEICE}

The present invention relates to an LED inspection device and a transport device. In more detail, it relates to an inspection device for inspecting whether a micro LED chip formed on a wafer operates normally, and a transfer device for selecting and transporting only normally operating micro LEDs by inspection of whether the micro LED chip is in normal operation.

Micro LEDs having a size of several to several tens of micrometers can be widely used in optical applications requiring low power, miniaturization, and light weight, and thus development is being actively conducted.

However, before transferring the finished micro LED from the wafer to the target substrate, although the process of electrically selecting and inspecting whether it is a good product is absolutely necessary, the size of the micro LED is very small, so there is no suitable transfer and inspection method, In this method, there is a problem of breaking or breaking, or an increase in unit price due to manual work. In addition, if the wafer is transferred to the target substrate without directly inspecting the electrical quality of the plurality of micro LEDs, there is a problem in that the target substrate itself may become defective if defects of the micro LEDs occur later on the target substrate. Additionally, the conventional method is a method of transferring only one micro LED chip, and there is a problem in that the transfer time is long and the number of repetitions of transfer is large, which increases the mass production cost.

As prior documents, there are Korean Patent Registration No. 10-1183978 (Prior Document 1) and Korean Patent Registration No. 10-1585818 (Prior Document 2). Prior Document 1 relates to a jig unit for fixing an LED chip to inspect one LED chip, and as in Prior Document 1, according to the prior art, each LED must be individually inspected, which is cumbersome and time-consuming. However, since the micro LED is very small and weak, it is impossible to inspect it as in Prior Document 1. Prior Document 2 has a problem that the chip cannot be distinguished.

Prior Document 2 relates to a micro-element transfer method. Although a micro-element can be picked up with the current applied to the transfer head, it is impossible to inspect the micro-element, and even micro-element in a defective state can be picked up at the same time to perform a separate inspection of the micro-element. There is a problem with the need.

In this way, since the conventional LED inspection device and transport device cannot be applied to micro LEDs down to several micro units in size, it is possible to inspect the quality of the micro LEDs on the wafer with high precision, and select and transport only the normal micro LEDs. As technology development is required, the present invention intends to propose a technique for inspecting a good product on a wafer before transferring the micro LED and at the same time selectively transferring only the micro LED determined to be good quality.

Republic of Korea Patent Registration No. 10-1183978 (Registered on September 12, 2012) Republic of Korea Patent No. 10-1585818 (registered on Jan. 8, 2016)

The technical problem of the present invention is to determine the LED of good quality on the wafer.

Another object of the present invention is to provide an LED inspection apparatus capable of discriminating the normal operating state of an LED that is separated on a wafer and mounted on a substrate.

Another object of the present invention is to provide an LED inspection apparatus capable of simultaneously inspecting whether a plurality of LEDs listed on a wafer operate normally.

In addition, it is to provide an LED inspection apparatus capable of accurately matching each inspection unit to electrodes of a plurality of LEDs arranged on a wafer.

In addition, it is to provide an LED inspection device and a transport device that can be inspected and transported without damaging the LED by providing a buffer layer.

In addition, by electrically connecting two or more cathode or anode wires to one, it is to provide an LED inspection device capable of quickly inspecting whether the LED operates normally only through whether each anode or cathode wire is energized.

In addition, it is to provide an LED transporting device that selectively transports only the LEDs determined to be good at the same time as determining the LEDs of good quality operating normally.

In addition, it is to design a circuit capable of optimally arranging electric wires in a limited space by integrating electric wires having the dual purpose of inspection and pickup in a plurality of layers.

On the other hand, the technical problems to be achieved by the present invention are not limited to the exemplary technical problems mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art from the following description.

In order to achieve the above object, the LED inspection apparatus of the present invention is characterized in that it includes two or more prober units, and an inspection unit for inspecting whether the LED operates normally by energizing the electrodes in contact with the LED. In addition, two or more prober units are arranged side by side in a plurality of matrices in the horizontal and vertical directions to correspond to the arrangement of LEDs on the wafer, and are characterized in that they are provided in a circuit layer made of a soft material. In addition, it characterized in that it further comprises a buffer layer provided on the upper surface of the circuit layer and the same material as the circuit layer.

In addition, the LED transport device of the present invention includes a pickup unit for picking up the LED, a check unit for checking whether the LED operates normally by contacting the electrode of the LED to conduct electricity, and the pickup unit is the LED checked for normal operation by the inspection unit. It is characterized in that it selectively picks up only the LEDs checked for only or abnormal operation.

According to the present invention, there is an effect that can determine the normal and abnormal operation of the LED on the wafer.

In addition, there is an effect that can also determine the normal and abnormal operation of the LED separated on the wafer.

In addition, it is possible to simultaneously determine whether a plurality of LEDs listed on the wafer are operating normally, and there is an effect that can be quickly inspected.

In addition, there is an effect of inspecting and transporting micro-scale weak micro LEDs without damage.

In addition, there is an effect of selectively transferring only good LEDs while selecting normal and abnormal LEDs, so that only LEDs in a normal state can be quickly placed on the target substrate.

Thereby, the cost for the inspection of LEDs is reduced, and only LEDs in a normal state are identified and transported, thereby eliminating the need for a separate identification process, and there is an effect that only good LEDs can be selected and placed quickly.

1 is a perspective view showing an LED inspection device according to an embodiment of the present invention.
2 is an enlarged perspective view of a portion of a wafer according to an embodiment of the present invention.
3 is a cross-sectional view showing an LED inspection device according to an embodiment of the present invention.
4 is a cross-sectional view showing an inspection state of the LED inspection device according to an embodiment of the present invention.
5 is a cross-sectional view showing the inspection state of the LED inspection device according to another embodiment of the present invention.
6 is an exploded perspective view showing each layer of the LED inspection device according to an embodiment of the present invention.
7 is a cross-sectional view showing an upper surface of the circuit layer according to the first embodiment.
8 is a cross-sectional view showing an upper surface of a circuit layer according to the second embodiment.
9 is a cross-sectional view showing an upper surface of a circuit layer according to the third embodiment.
10 is a cross-sectional view illustrating a process of matching the auxiliary line of the wafer with the LED inspection device according to an embodiment of the present invention.
11 is a cross-sectional view showing an LED transport device according to an embodiment of the present invention.
12 is an exploded perspective view showing each layer according to an embodiment of the present invention.
13 is a perspective view illustrating a lower surface of a first layer according to an embodiment of the present invention.
14 is a perspective view illustrating a lower surface of a first layer according to another embodiment of the present invention.
15 is a cross-sectional view showing a side of the LED transport device of another embodiment of the present invention.
16 is a cross-sectional view illustrating an upper surface of a second layer according to a fourth embodiment of the present invention.
17 is a cross-sectional view illustrating an upper surface of a second layer according to a fifth embodiment of the present invention.
18 is an exploded perspective view showing each layer of a modified embodiment of the present invention.
19 is a cross-sectional view illustrating a top surface of a third layer according to a sixth embodiment of the present invention.
20 is a cross-sectional view illustrating an upper surface of a third layer according to a seventh embodiment of the present invention.
21 and 22 are cross-sectional views showing a side of an LED transport device of a further embodiment of the present invention.
23 and 24 are exploded perspective views showing each layer of a further embodiment of the present invention.
25 is a cross-sectional view showing a micro LED transfer step of an embodiment of the present invention.
26 is a cross-sectional view showing a micro LED transfer step of another embodiment of the present invention.
27 is a cross-sectional view showing a micro LED transfer step of a further embodiment of the present invention.

Hereinafter, with reference to the accompanying drawings, the embodiments of the present invention will be described in detail so that those of ordinary skill in the art can easily implement them. However, the present invention may be implemented in various different forms, and is not limited to the embodiments described below or illustrated in the drawings. In addition, in order to clearly explain the present invention in the drawings, parts irrelevant to the present invention are omitted, and the same or similar symbols in the drawings indicate the same or similar components.

Objects and effects of the present invention can be naturally understood or more clearly understood by the following description, and the objects and effects of the present invention are not limited only by the following description.

Prior to the detailed description of the present invention, the micro LED 10 to be described below will be described as the most preferred embodiment, and the micro LED 10 is an LED that emits light when a current is supplied, and any semiconductor device is applied. This may be possible. In particular, the micro LED 10 is a very small device in units of several micrometers, and since it can be most effective when the present invention is applied, the micro LED 10 will be described in detail as an embodiment with reference to the accompanying drawings.

1 is a perspective view illustrating an LED inspection apparatus according to an embodiment of the present invention, and FIG. 2 is an enlarged perspective view of a portion of a wafer according to an embodiment of the present invention.

Referring to FIG. 1 , the LED inspection apparatus 1 of the present invention inspects whether a plurality of micro LEDs 10 manufactured on a wafer W and the micro LED 10 separated on the wafer W are normally operated. As a device, the LED inspection device 1 descends vertically and comes into contact with the micro LED 10 , thereby inspecting whether the micro LED 10 operates normally. In detail, by vertically descending the LED inspection device 1 to come into contact with the wafer W, it is possible to simultaneously inspect whether two or more micro LEDs 10 manufactured on the wafer W are in normal operation, and the wafer W ) and disposed on the target substrate or transferred to a separate substrate or tape, it is also possible to check whether the micro LED 10 operates normally. In more detail, the LED inspection apparatus 1 includes two or more prober units 110 , and each prober unit 110 may correspond to each micro LED 10 . Referring to FIG. 2 , on a wafer W according to an embodiment of the present invention, a plurality of micro LEDs 10 may be arranged side by side in a plurality of matrices in horizontal and vertical directions to be manufactured. The structure of the micro LED 10 may be a horizontal type structure, a vertical type structure, or a flip chip type structure. However, for convenience of description, in the present specification, a flip-chip structure will be described. In detail, the micro LED 10 is a PN junction semiconductor having a P pole and an N pole, and may be provided such that the P pole and the N pole are respectively exposed on the top surface. Hereinafter, for convenience of description, the P pole of the micro LED 10 will be referred to as the positive electrode 11 and the N pole will be referred to as the negative electrode 12 . In the case of FIG. 2 , the micro LED 10 is provided in an arrangement of 3 horizontal and 3 vertical lines on the upper surface of the wafer W, but this is shown for convenience of description and in fact, the micro LED 10 is a number of micro LEDs. Since the size and the wafer W are large enough, if the distance between the wires to be described later can be ensured, billions or more of micro LEDs 10 may be provided on one wafer W without limitation in number.

In addition, referring to FIG. 1 , a photodetector 400 may be further provided on the lower surface of the wafer W provided with the plurality of micro LEDs 10 . The photodetector 400 detects light generated by the operation of each micro LED 10 by applying a current to the micro LED 10 and determines whether each micro LED 10 operates normally. am. For a more detailed description, after the LED inspection device 1 is described in more detail, it will be described in detail with reference to FIG. 10 to be described later.

Hereinafter, an LED inspection apparatus according to an embodiment of the present invention will be described in more detail with reference to FIGS. 3 to 5 . Figure 3 is a cross-sectional view showing the LED inspection device of an embodiment of the present invention, Figure 4 is a cross-sectional view showing the inspection state of the LED inspection device of an embodiment of the present invention, Figure 5 is the LED inspection device of another embodiment of the present invention It is a cross-sectional view showing the inspection state.

Referring to FIG. 3 , the LED inspection device 1 includes a circuit layer 100 having two or more prober units 110 on a bottom surface in direct contact with the micro LED, and a buffer layer 200 provided on the top surface of the circuit layer 100 . ) and a protective layer 300 provided on the upper surface of the buffer layer 200 . Each of the two or more prober units 110 may include inspection units 111 and 112 for checking whether the micro LED 10 operates normally by contacting and energizing the electrodes 11 and 12 of the micro LED 10 . . In more detail, the inspection units 111 and 112 may be provided as a positive electrode inspection unit 111 capable of contacting the positive electrode 11 of the micro LED 10 and a negative electrode inspection unit 112 capable of contacting the negative electrode 12, respectively. can As shown in FIG. 3 , the LED inspection device 1 in which two or more anode inspection units 111 and cathode inspection units 112 are formed protruding from the lower surface of the circuit layer 110 descends in the vertical direction to determine whether the micro LED 10 operates normally. You can check whether In more detail, referring to FIG. 4 , the LED inspection apparatus 1 vertically descended in the wafer W direction may come into contact with each micro LED 10 provided on the wafer W. As shown in FIG. Specifically, each of the anode inspection unit 111 and the cathode inspection unit 112 provided in each prober unit 110 of the LED inspection device 1 is the micro LED 10 provided on the wafer W. The positive electrode 11 and the negative electrode 12 may be in contact with each other. Referring to FIG. 5 , the LED inspection apparatus 1 of another embodiment of the present invention is mounted on a substrate or separated from the wafer W as well as the micro LED 10 provided on the wafer W to a separate substrate or It is also possible to inspect the micro LED 10 transferred to a tape or the like. In more detail, the LED inspection apparatus 1 according to another embodiment of the present invention includes a plurality of prober units 110 on the positive electrode 11 and the negative electrode 12 of the micro LED 10 separated from the wafer W. It is possible to check whether the micro LED 10 is operating normally even in a space other than the wafer W by contacting any one of the anode inspection unit 111 and the cathode inspection unit 112 to correspond to each other.

Hereinafter, the LED inspection apparatus 1 of the present invention will be described in more detail with reference to FIGS. 6 to 9 . 6 is an exploded perspective view showing each layer of the LED inspection device according to an embodiment of the present invention, and FIGS. 7 to 9 are cross-sectional views showing the upper surface of the circuit layer according to each embodiment.

When the LED inspection apparatus 1 of an embodiment of the present invention is described with reference to FIG. 6 , the circuit layer 100 , the buffer layer 200 and the protective layer 300 may be sequentially provided as described above. The circuit layer 100 may include two or more prober units 110 , and the number of the prober units 110 is not limited so as to respectively correspond to a plurality of micro LEDs on the wafer W, and there are billions or more of the prober units. 110 may be provided. In detail, on the lower surface of the circuit layer 100 , a positive electrode inspection unit 111 and a negative electrode inspection unit 112 may be provided in each of the plurality of prober units 110 . The positive electrode inspection unit 111 and the negative electrode inspection unit 112 are configured to conduct electricity by contacting the positive electrode 11 and the negative electrode 12 of the micro LED 10, respectively, and the tip protruding downward from the lower surface of the circuit layer 100 It may be provided in a shape. In more detail, each of the inspection units 111 and 112 is preferably provided with a conductor to be energized. A positive electrode wire 113 and a negative electrode wire 114 electrically connected to each of the positive electrode inspection unit 111 and the negative electrode inspection unit 112 protruding from the lower surface may be provided on the upper surface of the circuit layer 100 . In detail, the positive wire 113 and the negative wire 114 may be provided in plurality to correspond to the plurality of positive electrode inspection units 111 and negative electrode inspection units 112, and the positive electric wire 113 and the negative electrode wire 114 are electrically It is preferable to be provided separately. In more detail, one end of the positive wire 113 and the negative wire 114 may be provided through the circuit layer 100 so as to be electrically connected to the positive electrode inspection unit 111 or the negative electrode inspection unit 112 , but one end It is preferable that the positive electric wire 113 and the negative electric wire 114, except for, are provided only on the upper surface so as not to be in contact with the lower surface of the circuit layer 100 . Here, it is preferable that the circuit layer 100 is made of a soft material to prevent damage to the micro LED 10 when it is in contact with the micro LED 10 . In more detail, the circuit layer 100 is provided with a soft material having elasticity and restoring force, so even if it comes into contact with the micro LED 10, it does not damage the upper surface of the micro LED 10, such as scratches. It is preferably provided with a material that can be pressed upward according to the shape, and is provided with a material that can be restored to its original state when separated from the micro LED 10 . Specifically, it is preferable that the above-described soft material is made of a transparent material having elasticity, such as UV Resin, SU-8, or PDMS (Polydimethylsiloxane).

The buffer layer 200 is provided so as to be in contact with the upper surface of the circuit layer 100 to protect the plurality of wires 113 and 114 provided on the upper surface of the circuit layer 100, and the micro LED 10 is equipped with an inspection device (1) It is a configuration that serves as a buffer to prevent damage to the micro LED 10 when in contact. That is, since the circuit layer 100 is provided thinly and cannot properly serve as a buffer to prevent damage to the micro LED 10, a thicker buffer layer 200 is further provided to completely prevent damage to the micro LED 10. configuration to do In detail, the buffer layer 200 is preferably provided with a soft material to act as a buffer to prevent damage to the micro LED 10 when in contact with the micro LED 10 , and in particular, a soft material having elasticity and restoring force. It is more preferable to be provided with a material of Specifically, it may be made of the same material as the circuit layer 100 , and it is preferably made of a transparent material having elasticity, such as UV Resin, SU-8, or PDMS (Polydimethylsiloxane).

The protective layer 300 is configured to protect the buffer layer 200 provided with a soft material in contact with the upper surface of the buffer layer 200 . In detail, the protective layer 300 protects the buffer layer 200 and the circuit layer 100 , and is preferably provided with a hard and hard material in a configuration for maintaining the shape of the LED inspection device 1 . In more detail, the protective layer 300 is preferably made of a hard material and made of a transparent material so that alignment can be easily achieved through an auxiliary line AL, which will be described later. Specifically, the protective layer 300 is preferably made of a transparent and hard material such as transparent acrylic, sapphire, quartz, or glass.

Hereinafter, the circuit layer 100 according to each embodiment will be described in detail with reference to FIGS. 7 to 9 .

The circuit layer 100 may be provided in various forms as in each embodiment to be described later, and a plurality of positive wires 113 and negative wires 114 provided on the upper surface of the circuit layer 100 are formed through imprinting. After a groove is formed on the upper surface of the circuit layer 100 through imprinting, it may be manufactured by a metal mesh method in which a conductive material is filled in the formed groove. The method of manufacturing the above-described positive wire 113 and negative wire 114 is only an example, and any method may be used as long as it is a method capable of forming an electric wire.

7 is a cross-sectional view showing an upper surface of the circuit layer according to the first embodiment. Referring to FIG. 7 , the anode wire 113 and the cathode wire 114 of the circuit layer 100 according to the first embodiment are electrically connected to one end of each of the positive electrode inspection unit 111 and the negative electrode inspection unit 112 . Connected, each of the wires 113 and 114 may be provided to be spaced apart from each other so as not to be electrically connected to each other. Therefore, according to the first embodiment, the same prober unit 110 so that the positive electrode inspection unit 111 and the negative electrode inspection unit 112 provided in the same prober unit 110 among the plurality of prober units 110 can be electrically connected at the same time. ) by separately energizing the positive wire 113 and the negative wire 114 electrically connected to the positive electrode inspection unit 111 and the negative electrode inspection unit 112 provided in the prober unit 110, the positive electrode inspection unit 111 and the negative electrode of the corresponding prober unit 110 It may be determined whether the micro LED 10 in contact with the inspection unit 112 operates normally.

8 is a cross-sectional view showing an upper surface of a circuit layer according to the second embodiment. Referring to FIG. 8 , as in the first embodiment of the circuit layer 100 according to the second embodiment, a plurality of positive electric wires 113 and negative electric wires 114 are respectively formed by a positive electrode inspection unit 111 and a negative electrode inspection unit 112 . ) may be electrically connected to one end. Here, in the circuit layer 100 according to the second embodiment, two or more negative wires 114 may be electrically connected to one another, and the positive wires 115 may be provided such that they are electrically separated from each other. Specifically, in the circuit layer 100 according to the second embodiment, two or more negative wires 114 are electrically connected to one another, and the negative electrode inspection unit 112 provided in one row or one column is electrically one negative wire. (114) can be connected. Therefore, the negative wires 114 of one row or column electrically connected to one another are connected to the negative (-) pole of the power source, and the current is sequentially applied to the positive wires 113 separately connected one by one to each positive electrode inspection unit 111 . It is possible to sequentially check whether the two or more micro LEDs 10 are operating normally by applying the application. More specifically, after the anode wire 114 electrically connected to one is grounded, it can be inspected whether two or more micro LEDs 10 are operating normally by whether the anode wire 113 electrically separated and connected to each other is energized. there is.

9 is a cross-sectional view showing an upper surface of a circuit layer according to the third embodiment. Referring to FIG. 9 , in the circuit layer 100 according to the third embodiment, as in the first or second embodiment, a plurality of positive wires 113 and a plurality of negative wires 114 each have a positive inspection unit 111 . and one end of the negative electrode inspecting unit 112 may be electrically connected to each other. Here, in the circuit layer 100 according to the third embodiment, two or more negative wires 114 may be electrically connected to one another, and the positive wires 115 may be provided such that they are electrically separated from each other. Specifically, in the circuit layer 100 according to the third embodiment, two or more cathode wires 114 provided on the circuit layer 100 may all be electrically connected to one another. Accordingly, the negative wire 114 electrically connected to one is connected to the negative (-) pole of the power source, and a current is sequentially applied to the positive wire 113 separately connected to each positive electrode inspection unit 111, one by one to each of the two or more microelectrodes. It is possible to sequentially check whether the LED 10 is operating normally. More specifically, after the anode wire 114 electrically connected to one is grounded, it can be inspected whether two or more micro LEDs 10 are operating normally by whether the anode wire 113 electrically separated and connected to each other is energized. there is.

The circuit layer 100 of the first to third embodiments described above is only an embodiment, and the positive electric wire 113 may be electrically connected to one another, and the negative electric wire 114 and the positive electric wire 113 are connected in each row or Each column is electrically connected to one another, and current is sequentially applied to the cathode wire 114 and the anode wire 113 of each matrix to check whether the micro LED 10 operates normally. In addition, by simultaneously applying a current to the entire cathode wire 114 and the anode wire 113, it is also possible to simultaneously test whether the micro LED 10 in contact with the respective inspection units 111 and 112 operates normally.

Hereinafter, a method of determining a non-defective LED through the LED inspection device of an embodiment of the present invention will be described in detail with reference to FIG. 10 . 10 is a cross-sectional view illustrating a process of aligning an auxiliary line and an alignment mark for alignment of an LED inspection apparatus and a wafer according to an embodiment of the present invention.

Referring to FIG. 10 , auxiliary lines AL1 and AL2 corresponding to each other may be further included in the wafer W and each of the circuit layer 100 , the buffer layer 200 and the protective layer 300 . In detail, the first auxiliary line AL1 of the same shape may be provided in the circuit layer 100 , the buffer layer 200 , and the protective layer 300 at positions corresponding to each other, and the first auxiliary line AL1 is provided on the upper surface of the wafer W. A second auxiliary line AL2 having the same shape may be provided at a position corresponding to the first auxiliary line AL1 . In more detail, the first auxiliary line AL1 may be provided in only any one of the circuit layer 100 , the buffer layer 200 , and the protective layer 300 , but more preferably, it is most preferably provided in each layer. Do. As described above, the circuit layer 100 , the buffer layer 200 , and the protective layer 300 are all preferably made of a transparent material, and accordingly, the first auxiliary line AL1 provided in each layer passes through each It is preferable to be provided so that all of them can be visually recognized when viewed from the upper surface of the protective layer 300 . Therefore, since the first auxiliary lines AL1 are provided at positions corresponding to each other, when each layer of the LED inspection device 1 is combined, there is an effect that can be combined in an accurate position. In addition, a second auxiliary line AL2 corresponding to the first auxiliary line AL1 is also provided on the upper surface of the wafer W, and when the LED inspection apparatus 1 is in contact with the upper surface of the wafer W, each of the first By matching the auxiliary line AL1 and the second auxiliary line AL2, each of the prober unit 110 and the micro LED 10 can be brought into contact with an accurate position. In detail, as each of the first auxiliary lines AL1 and the second auxiliary lines AL2 correspond to each other, the positive electrode inspection unit 111 and the negative electrode inspection unit 112 protruding from each prober unit 110 are separated from the wafer ( W) may be in contact with the correct positions of the positive electrode 11 and the negative electrode 12 of each micro LED 10 provided on the W). Accordingly, it is possible to sequentially or simultaneously inspect the plurality of micro LEDs 10 provided on the wafer W. The above-described first auxiliary line AL1 and second auxiliary line AL2 may be provided directly on each layer and wafer W, or provided on a separate sheet to be disposed on the upper surface of each layer and wafer W. It may be provided by bonding the sheets provided with the auxiliary lines AL1 and AL2.

Referring to FIG. 10 , the photodetector 400 may be further provided on the lower surface of the wafer W as described above. In detail, the photodetector 400 may be provided to be in contact with the lower surface of the wafer (W). The photodetector 400 is configured to detect light generated by the operation of the microLED 10 and inspect the optical characteristics of the microLED. When a current is applied to the micro LED 10 by contacting the positive electrode 11 and the negative electrode 12 of the plurality of micro LED 10 provided thereon to conduct electricity, each micro LED 10 may operate. At this time, when the micro LED 10 operates, light is emitted, and the photo detection unit 400 detects the light emitted from each micro LED 10 through the photodiode built in the light detection unit 400 . It is possible to discriminate the micro LED 10 of good or bad quality by determining the optical characteristics of each micro LED.

Hereinafter, the LED transfer device of the present invention will be described with reference to FIGS. 11 to 27 .

The LED transport device 6 of the present invention is a device for transporting a plurality of micro LEDs 10 manufactured on the wafer W, and the LED transport device 6 vertically descends and comes into contact with the wafer W. The above micro LEDs 10 can be checked and picked up at the same time.

Hereinafter, it will be described in more detail with reference to FIG. 11 . 11 is a cross-sectional view showing an LED transport device according to an embodiment of the present invention.

Referring to FIG. 11 , the LED transport device 6 is located on the upper surface of the first layer 600 , the first layer 600 having two or more micro LED inspection pickup units 610 on the lower surface in direct contact with the micro LED. and a second layer 700 and a third layer 800 positioned on the upper surface of the second layer 700 .

Hereinafter, a detailed description of each of the layers 600 , 700 , and 800 will be described with reference to FIGS. 12 to 20 . 12 is an exploded perspective view showing each layer according to an embodiment of the present invention. Referring to FIG. 12 , the LED transport device 6 includes a first layer 600 having two or more micro LED inspection pickup units 610 on the bottom surface in contact with the top surface of the micro LED 10 .

The first layer 600 includes two or more micro LED inspection pickup units 610 . The micro LED inspection pickup unit 610 is a part that grips and picks up the micro LED 10 to vertically lift it while checking whether the micro LED 10 operates normally. It is preferable to be provided so as to correspond to the number. In addition, the micro LED inspection pickup unit 610 may be arranged side by side in the horizontal and vertical directions to correspond to the arrangement of the micro LEDs 10 on the wafer (W). In detail, the micro LED inspection pickup unit 610 may be arranged side by side in a plurality of matrices in the horizontal and vertical directions. In addition, in the present invention, for convenience of explanation, the plurality of micro LEDs 10 are named in the order of the first micro LED 10 , the second micro LED 10 , and the third micro LED 10 according to the positional order of the matrix. can do. In the case of FIG. 12, although they are arranged in three horizontally and three vertically for convenience of description, the number may be provided without limitation as long as the spacing between the wires to be described later can be ensured.

The micro LED inspection pickup unit 610 includes inspection units 611 and 612 for checking the micro LED 10 and a pickup unit 613 for picking up and lifting the micro LED 10 in the vertical direction. Here, the inspection units 611 and 612 may play the same role as the inspection units 111 and 112 of the LED inspection device 1, but the transfer device 6 and the inspection device 1 are different from each other due to the configuration of different devices. It will be described through names and drawing numbers.

The inspection units 611 and 612 are configured to check whether the micro LED 10 operates normally by contacting and energizing the P and N electrodes 11 and 12 of the micro LED 10, and the positive electrode inspection unit 611 and a negative electrode inspection unit 612 . In detail, the positive electrode inspection unit 611 and the negative electrode inspection unit 612 of the inspection units 611 and 612 are positioned to correspond to the positive electrode 11 and the negative electrode 12 of the micro LED 10 , respectively. Specifically, when the lower surface of the first layer 600 is in contact with the upper surface of the wafer W, the anode inspection unit 611 and the cathode inspection unit 612 are the positive electrode 11 and the negative electrode ( 12), a current may be applied to the micro LED (10). Therefore, it is preferable that the positive electrode inspection part 611 and the negative electrode inspection part 612 are made of a conductor. As a method of determining whether a normal operation is performed, a conventional method such as selecting a micro LED exceeding or less than the corresponding range by pre-determining an electrical characteristic range such as a specific resistance or current value as a normal operating range may be used, but the present invention The scope of the rights is not limited thereto.

In detail, according to an embodiment, the positive electrode inspection unit 611 and the negative electrode inspection unit 612 are formed with a groove on the first layer 600 through imprinting, and then fill the groove with a conductive material. can be manufactured by

According to an embodiment, the pickup unit 613 is positioned between the inspection units 611 and 612 . In detail, the pickup unit 613 may be positioned between the positive electrode inspection unit 611 and the negative electrode inspection unit 612 . The pickup unit 613 preferably has a wide contact surface with the micro LED 10 . In the case of the micro LED, as described in the prior art, since the size is very small and light, the conventional pickup method cannot be used, and the pickup unit 613 according to the present invention operates normally as described below. In order to selectively pick up only the micro LED 10 through static electricity in an electrostatic manner, the pickup unit 613 according to the present invention preferably picks up the micro LED 10 .

13 is a perspective view illustrating a lower surface of a first layer according to an embodiment of the present invention. Referring to FIG. 13 , the inspection units 611 and 612 and the pickup unit 613 may have a shape in which a rectangular groove is formed on a lower surface of the first layer 600 . In addition, the upper surface may have a shape provided with a circular hole through which an electrode can be applied. The groove on the lower surface and the hole on the upper surface are connected to pass through each other, and both the inner groove and the circular hole are preferably filled with a conductive material. In detail, according to an embodiment, the micro LED pickup inspection unit 610 includes a positive electrode inspection unit 611, a negative electrode inspection unit 612, and a positive electrode inspection unit 611 and a negative electrode inspection unit formed with a rectangular groove on the lower surface ( It may be formed to include a pickup unit 613 provided between the 612). In more detail, the positive electrode inspection unit 611 , the negative electrode inspection unit 612 , and the pickup unit 613 formed in a rectangular groove may be provided side by side with a predetermined interval therebetween. At this time, each of the positive electrode inspection unit 611 , the negative electrode inspection unit 612 , and the pickup unit 613 is to leave a predetermined distance between the positive electrode inspection unit 611 , the negative electrode inspection unit 612 , and the pickup unit 613 . ) do not conduct electricity with each other, and to prevent impact to the micro LED 10 as will be described below. In detail, when a material having elasticity, such as UV Resin, SU-8 or PDMS (Polydimethylsiloxane), which will be described below, is provided at a predetermined interval of the micro LED inspection pickup unit 610, the inspection and It can prevent shock during pickup. The micro LED pickup inspection unit 610 may have a shape in which a circular hole is formed in upper surfaces of the positive electrode inspection unit 611 , the negative electrode inspection unit 612 , and the pickup unit 613 formed with the rectangular grooves. When the positive electrode inspection unit 611 , the negative electrode inspection unit 612 , and the pickup unit 613 are each formed only in a circular hole shape, the contact area with the micro LED 10 is narrow and the electrode 11 of the micro LED 10 is narrow. , 12) is difficult to make accurate contact with. Accordingly, there is a problem in that even the micro LED 10 in a normal state may be determined to be in an abnormal state due to an incorrect contact. In order to solve this problem, the anode inspection unit 611, the cathode inspection unit 612 and the pickup unit 613 are rectangular grooves arranged at a predetermined distance apart from each other on the lower surface of the micro LED pickup inspection unit 610 as described above. ) is preferably provided. As such, when the lower surfaces of the positive electrode inspection unit 611 , the negative electrode inspection unit 612 , and the pickup unit 613 are provided in a rectangular shape, the contact area with the micro LED 10 is widened so that the electrodes 11 and 12 are in contact. This may be easy, and the contact area of the pickup unit 613 is also widened, so that the micro LED 10 can be more easily picked up. In addition, since the upper surfaces of the positive electrode inspection unit 611 , the negative electrode inspection unit 612 , and the pickup unit 613 are provided with circular holes, it becomes easier to design circuits disposed on the upper side of the first layer 600 so as not to overlap each other. can

More specifically, according to an embodiment, the first layer 600 is preferably made of a soft material, for example, a transparent material having elasticity such as UV Resin, SU-8 or PDMS (Polydimethylsiloxane). This is a relatively conductive material because the thickness of the micro LED 10 is very thin, and when the hard inspection parts 611 and 612 or the pickup part 613 touches the upper surface of the micro LED 10 for inspection and pickup, the micro This is to prevent the shock applied to the LED 10 as much as possible.

Hereinafter, the first layer 600 ′ according to another embodiment of the present invention will be described with reference to FIGS. 14 and 15 . Figure 14 is a perspective view showing the lower surface of the first layer of another embodiment of the present invention, Figure 15 is a cross-sectional view showing the side of the LED transport device of another embodiment of the present invention. In order to distinguish it from the first layer 600 of the embodiment described above with reference to FIG. 13, the first layer 600' of the other embodiments of FIGS. 14 and 15 will be referred to as 600'. 14 and 15 , the inspection units 611 and 612 may have a shape in which a rectangular groove is formed on the lower surface of the first layer 600 ′, as in the first embodiment. The groove on the lower surface and the hole on the upper surface are connected to pass through each other, and both the inner groove and the circular hole are preferably filled with a conductive material. A more detailed description will be omitted since it is the same as that of the above embodiment, and will be described in detail in different parts. The first layer 600 ′ according to another embodiment of the present invention may be provided so that the pickup unit 613 is not exposed on the lower surface. That is, the upper surface of the first layer 600 ′ may be filled with a conductive material through a circular hole as shown in FIG. 12 , but it is preferably provided so as not to penetrate to the lower surface and not be exposed. When the pickup unit 613 is exposed to the lower surface and directly contacts the micro LED 10 , the current is too strong and the micro LED 10 may be damaged. Accordingly, in another embodiment of FIG. 14 , the pickup unit 613 is provided so as not to be exposed on the lower surface, and the micro LED 10 can be picked up by static electricity by generating static electricity on the unexposed lower surface. Specifically, the lower surface of the pickup unit 613 is provided with a transparent material having elasticity, such as UV Resin, SU-8 or PDMS (Polydimethylsiloxane), as described above, and a voltage is applied to the pickup unit 613 to form an electric field to form a UV Static electricity may be generated on the contact surface of a transparent material with elasticity such as Resin, SU-8, or PDMS (Polydimethylsiloxane). The micro LED 10 may be contacted and picked up by static electricity generated on the contact surface.

Hereinafter, the second layer 700 according to an embodiment will be described in detail. Referring to FIG. 12 , the second layer 700 may be positioned to be in contact with the upper surface of the first layer 600 . The second layer 700 has a first positive electrode wire 721 and a first negative electrode wire 722 each electrically connected to the positive electrode inspection unit 611 and the negative electrode inspection unit 612 of the first layer 600 at one end. And, it further includes a pickup electrification point (713). In detail, in order to arrange two types of wires with different purposes within a small range due to the characteristics of the micro LED 10, the wire for inspection 721, 222 is arranged in two layers, and the wire for pickup 823 is arranged. It is preferable to include the used layers as the second layer 700 and the third layer 800, respectively. Therefore, according to an embodiment as described above, the first positive wire 721 and the first negative wire 722 are provided on the second layer 700 , and are electrically connected to the pickup unit 613 to supply power. And it is preferable that the blocking wire is provided in the third layer 800 after passing through the second layer 700 through the pickup conducting point 713 . The first anode wire 721 is provided as a conductor and one end may be electrically connected to the anode inspection unit 611 , and the first cathode wire 722 is also provided as a conductor so that one end is electrically connected to the cathode inspection unit 612 . can be connected The first anode wire 721 and the first cathode wire 722 are preferably disposed so as not to cross each other.

According to an embodiment, a plurality of first positive wire 721 and first negative wire 722 may be provided such that one end is electrically connected to the positive electrode inspection unit 611 and the negative electrode inspection unit 612 , respectively. In addition, each of the first positive wire 721 and the first negative wire 722 may be electrically connected to separate positive and negative switch units, respectively. In detail, the positive switch unit and the negative switch unit of the first embodiment may be provided as many as the number of the first positive wire 721 and the first negative wire 722 .

Hereinafter, the second layer according to the fourth embodiment of the present invention will be described in detail with reference to FIG. 16 . 16 is a cross-sectional view illustrating an upper surface of a second layer according to a fourth embodiment of the present invention.

First, for a detailed description, one "column" is defined based on the longitudinal (vertical) direction, and 1st, 2nd, and 3rd columns are defined sequentially from left to right in the lateral (horizontal) direction. In addition, one "row" is defined based on the horizontal (horizontal) direction, and 1, 2, and 3 rows are defined sequentially from the top to the bottom in the vertical (vertical) direction.

Referring to FIG. 16 , according to the fourth embodiment of the present invention, the first positive electrode wire 721 and the first negative electrode wire 722 of the fourth embodiment are the positive electrode inspection part 611 and the negative electrode inspection part 612 . It can be provided as many as possible. In addition, each of the first positive wire 721 and the first negative wire 722 may be electrically connected to and controlled with separate positive and negative switch units, respectively. Specifically, the first positive wire 721 in row 1, column 1 is electrically connected to the first positive switch unit, and the first positive wire 721 in row 1 and column 2 is the second positive electrode switch unit and the first positive switch unit in row 1 and column 3 The positive wire 721 is a third positive switch part, the first positive wire 721 of row 2, column 1 is a fourth positive switch part, and the first positive wire 721 of the second row and column 2 is a fifth positive switch part in this order, respectively It may be connected to a separate positive switch unit. Accordingly, each of the first positive wires 721 may be individually applied and blocked with current by a separate positive switch unit, respectively.

The first negative wire 722 may also be sequentially connected to a separate negative switch unit. Therefore, each of the first negative wires 722 can be individually applied and cut off current by a separate negative switch unit, respectively. In detail, when current is sequentially applied to the first positive switch unit and the first negative switch unit, the current is applied to the first positive wire 721 and the first negative wire 722 corresponding to the first position, 1 You can check the micro LED (10). After that, when current is applied to the second positive switch unit and the second negative switch unit, current is applied to the first positive wire 721 and the first negative wire 722 corresponding to the second position to the second micro LED (10) can be checked.

Hereinafter, additional embodiments described below are embodiments in which the configuration is added and modified based on the LED transport device 6 according to the fourth embodiment described above, and overlapping descriptions will be omitted.

Referring to FIG. 17, the second layer according to the fifth embodiment of the present invention will be described in detail. 17 is a cross-sectional view illustrating an upper surface of a second layer according to a fifth embodiment of the present invention.

Referring to FIG. 17 , the first anode wire 721 of the fifth embodiment may be provided as many as the number of columns or rows, and the first cathode wire 722 may be provided as many as the number of micro LEDs 10 to be inspected. there is. In detail, the positive electrode inspection units 611 in the same column or in the same row may be electrically connected through one first positive electrode wire 721 . In more detail, the first positive wire 721 electrically connected to the positive electrode inspection unit 611 in the same column or the same row is connected to one positive electrode switch unit, so that application or blocking of current can be controlled at the same time. Specifically, according to the fifth embodiment, the positive electrode check unit 611 in the first row, the second row, and the third row of the first column may be connected to one first positive electrode switch unit. In addition, the positive electrode inspection unit 611 of the first, second, and third rows of the second column is a single second positive switch unit, and the positive electrode inspection unit 611 of the first, second, and third rows of the third column is one product. 3 It can be connected to the positive switch unit. Accordingly, current can be applied and blocked at the same time by the same switch unit to each of the positive electrode check units 611 in the same column.

On the other hand, the negative electrode inspection unit 612 is connected to a separate first negative electrode wire 722 as in the above-described fourth embodiment, so that current can be individually applied and cut off by each negative electrode switch unit. In detail, in order to sequentially inspect the micro LED 10 , when a current is applied to the first anode switch unit in column 1, and then a current is applied to a cathode switch unit in column 1, row 1, position of column 1 It is possible to check the micro LED 10 corresponding to , and when a current is applied to the cathode switch unit of the first column and second row, the micro LED 10 corresponding to the position of the first column and second row can be checked. In this way, when the first anode wire 721 is connected to the same switch unit, the wiring of the circuit can be reduced, so that each micro LED 10 can be sequentially inspected even through a circuit having a small area.

Referring to FIG. 12 , the third layer 800 according to the fourth and fifth embodiments of the present invention is positioned so as to be in contact with the upper surface of the second layer 700 , and is provided in the second layer 700 . A plurality of pickup conducting points 713 and a plurality of first pickup wires 823 each having one end electrically connected may be provided. In detail, it is preferable to arrange the circuit in two layers through the second layer 700 and the third layer 800 in order to arrange a plurality of circuit lines within a narrow range due to the characteristics of the micro LED 10 . Therefore, when the first anode wire 721 and the first cathode wire 722 are provided on the second layer 700 as in the first and second embodiments, the pickup of the micro LED 10 is controlled. The first pickup wire 823 may be provided in the third layer 800 . According to the first embodiment and the second embodiment, it is preferable that a plurality of first pickup wires 823 are provided so that one end is electrically connected to the plurality of pickup conduction points 713, respectively, wherein the plurality is the pickup target micro It is preferable to be provided so as to be the same as the number of LEDs (10). In detail, the first pickup wire 823 may be a wire to which static electricity generation current is supplied to pick up the micro LED 10 . The first pickup wire 823 may be connected to a separate pickup switch unit, respectively. Accordingly, each separately connected pickup switch unit is controlled separately, so that power can be individually applied and cut off to each of the first pickup wires 823 . In detail, it is preferable that the electrode is not applied to the corresponding pickup switch unit of the pickup unit 613 corresponding to the micro LED 10 whose electrical operation is determined to be abnormal. In more detail, the pickup unit 613 controls so that power is applied only to the pickup switch unit corresponding to the micro LED 10 of the good product checked in normal operation by the inspection units 611 and 612, and the micro LED ( 10) can be selectively picked up and transported.

Hereinafter, an LED transport device according to a modified embodiment of the present invention will be described with reference to FIGS. 18 to 20 . 16 is an exploded perspective view showing each layer of a modified embodiment of the present invention.

First, the modified embodiments to be described below are embodiments in which the configuration is added and modified based on the LED transport device 6 according to the above-described embodiment, and overlapping descriptions will be omitted.

Referring to FIG. 18 , the second layer 700 according to a modified embodiment of the present invention may be positioned so as to be in contact with the upper surface of the first layer 600 . The second layer 700 includes two or more pickup units 613 provided in the first layer 600 and a second pickup wire 723 having one end electrically connected to each other, and includes a positive conduction point 711 and a negative electrode. It further includes an energization point 712 . In detail, in order to arrange two types of wires having different purposes within a small range due to the characteristics of the micro LED 10, the pickup wire 723 is arranged in two layers, and the inspection wires 821 and 322 are arranged. It is preferable to include the used layers as the second layer 700 and the third layer 800, respectively. Therefore, according to another embodiment as described above, the second pick-up wire 723 is provided on the second layer 700 and is electrically connected to the positive electrode inspection unit 611 and the negative electrode inspection unit 612 to supply power. And it is preferable that the blocking wire is provided in the third layer 800 after passing through the second layer 700 through the positive conduction point 711 and the negative conduction point 712 . The second pick-up wire 723 provided on the second layer 700 is provided with a conductor so that one end thereof can be electrically connected to the pickup unit 613, and the anode conducting point 711 and the cathode conducting point 712 are also It is provided as a conductor so that one end may be electrically connected to the positive electrode inspection unit 611 and the negative electrode inspection unit 612 . Here, it is preferable that the second pickup wire 723 and the positive conduction point 711 and the negative conduction point 712 are arranged at a predetermined distance so as not to contact each other.

According to a modified embodiment, the second positive electric wire 821 and the second negative electric wire 822 provided in the third layer 800 are the positive conduction point 711 and the negative conduction point 711 provided in the second layer 700, respectively. The point 712 and one end may be electrically connected. In detail, the second positive wire 821 and the second negative wire 822 according to the modified embodiment may be provided in plurality so that one end is electrically connected to the positive conductive point 711 and the negative conductive point 712, respectively. . In addition, each of the second positive wire 821 and the second negative wire 822 may be electrically connected to separate positive and negative switch units, respectively. In detail, the positive switch unit and the negative switch unit of the sixth embodiment may be provided as many as the number of the second positive wire 821 and the second negative wire 822 .

Hereinafter, the third layer according to the sixth embodiment of the present invention will be described in detail with reference to FIG. 19 . 19 is a cross-sectional view illustrating a top surface of a third layer according to a sixth embodiment of the present invention.

Referring to FIG. 19 , according to the sixth embodiment of the present invention, the second anode wire 821 and the second cathode wire 822 are to be provided as many as the number of the positive electrode inspection unit 611 and the negative electrode inspection unit 612 . can In addition, each of the second positive wire 821 and the second negative wire 822 may be electrically connected to and controlled with separate positive and negative switch units, respectively. Specifically, the second positive wire 821 of row 1, column 1 is electrically connected to the first positive switch unit, and the second positive wire 821 of row 1, column 2 is the second positive electrode switch unit, the second positive switch unit of row 1 and column 3 The positive wire 821 is a third positive switch part, the first positive wire 821 of row 2, column 1 is a fourth positive switch part, and the second positive wire 821 of the second row and column 2 is a fifth positive switch part in this order, respectively It may be connected to a separate positive switch unit. Accordingly, each of the second anode wires 821 may be individually applied and blocked with current by a separate anode switch unit, respectively.

The second negative wire 822 may also be sequentially connected to a separate negative switch unit. Accordingly, each of the second negative wires 822 may be individually applied and blocked with current by a separate negative switch unit. In detail, when current is sequentially applied to the first positive switch unit and the first negative switch unit, current is applied to the second positive wire 821 and the second negative wire 822 corresponding to the first position, 1 You can check the micro LED (10). Thereafter, when current is applied to the second positive switch unit and the second negative switch unit, current is applied to the second positive electrode wire 821 and the second negative electrode wire 822 corresponding to the second position to the second micro LED (10) can be checked.

Referring to FIG. 20, the third layer according to the seventh embodiment will be described in detail. 20 is a cross-sectional view illustrating an upper surface of a third layer according to a seventh embodiment of the present invention.

Referring to FIG. 20 , the second anode wire 821 of the seventh embodiment may be provided as many as the number of columns or rows, and the second cathode wire 822 may be provided as many as the number of micro LEDs 10 to be inspected. there is. In detail, the positive electrode inspection units 611 in the same column or in the same row may be electrically connected through one second positive electrode wire 821 . In more detail, the second positive wire 821 electrically connected to the positive electrode inspection unit 611 in the same column or the same row may be connected to one positive electrode switch unit, so that application or blocking of current may be controlled at the same time. Specifically, according to the seventh embodiment, the positive electrode check unit 611 in the first, second, and third columns of one row may be connected to one first positive switch unit. In addition, the positive electrode inspection unit 611 of the first, second, and third columns of the second row includes one second positive switch unit, and the positive electrode inspection unit 611 of the first, second, and third column of the third row includes one second positive switch unit. 3 It can be connected to the positive switch unit. Accordingly, current can be applied and blocked at the same time by the same switch unit to each of the positive electrode check units 611 in the same column.

On the other hand, the negative electrode inspection unit 612 is connected to a separate second negative electrode wire 822 as in the above-described sixth embodiment, so that current can be applied and cut off individually by each negative electrode switch unit. In detail, in order to sequentially inspect the microLED 10, when a current is applied to the first anode switch unit in row 1, and then a current is applied to the cathode switch unit in row 1 column 1, at the position of row 1 column The corresponding micro LED 10 can be checked, and when a current is applied to the cathode switch unit of the first row and second column, the micro LED 10 corresponding to the position of the first row and second column can be checked. In this way, when the second anode wire 821 is connected to the same switch unit, the wiring of the circuit can be reduced, so that each micro LED 10 can be sequentially inspected even through a circuit having a small area.

Hereinafter, with reference to FIGS. 21 to 24, a preferred additional embodiment of the present invention will be described in detail. According to a further preferred embodiment of the present invention, the first layer 600 may not be included, and only the second layer 700 and the third layer 800 may be included. A preferred additional embodiment to be described below is a modified embodiment of the one embodiment and another embodiment, and descriptions of the same parts will be omitted and different features will be described in detail.

21 and 22 are cross-sectional views showing a side of an LED transport device of a further embodiment of the present invention. 21 and 22 , the LED transport device 6 of an additional embodiment may be configured to include only the second layer 700 and the third layer 800 . Each of the second layer 700 and the third layer 800 may be made of the above-described soft material in an embodiment, and may be made of a transparent material having elasticity such as UV Resin, SU-8, or polydimethylsiloxane (PDMS). It is desirable to do

The second layer 700 of the additional embodiment includes a positive electrode inspection part 611 and a negative electrode inspection part 612 on the lower surface, and one end electrically with the positive electrode inspection part 611 and the negative electrode inspection part 612 on the upper surface, respectively. A first positive wire 721 and a first negative wire 722 that are connected may be provided. In this case, it is more preferable that the positive electrode inspection part 611 and the negative electrode inspection part 612 are provided to protrude downward. As the protruding positive electrode inspection unit 611 and negative electrode inspection unit 612 comes into contact with the LED conveying device 6 to correspond to the positive electrode 11 and the negative electrode 12 of the micro LED 10 by vertically moving downward, , each micro LED 10 can be checked. A first positive wire 721 and a first negative wire 722 may be provided on the upper surface of the second layer 700 as described above in the embodiment. At one end of each of the first positive wire 721 and the first negative wire 722 , a positive electrode inspection unit 611 and a negative electrode inspection unit 612 may be provided to protrude through the second layer 700 . Each of the first positive wire 721 and the first negative wire 722 may be provided according to various embodiments as in the above-described one embodiment and other embodiments.

The third layer 800 is positioned so as to be in contact with the upper surface of the second layer 700 , and has a pickup unit 613 on its lower surface, and a plurality of first pickup wires having one end electrically connected to the pickup unit 613 . (823) may be further provided. Each of the first positive wire 721 , the first negative wire 722 , and the first pickup wire 823 may be provided on different layers as shown in FIG. 23 , and in one embodiment and another embodiment described above, may be provided according to various embodiments. According to an additional embodiment, the pickup unit 613 may be provided so as not to protrude from the lower surface of the third layer 800 as shown in FIG. 21 , and more preferably, the lower surface of the third layer 800 as shown in FIG. 22 . A pickup unit 613 may be provided to protrude from the . Here, the protruding pickup unit 613 may be inserted into and coupled to the upper surface of the second layer 700 . Accordingly, the pickup unit 613 does not directly contact the micro LED 10 , but is positioned relatively close to the micro LED 10 to facilitate pickup due to static electricity.

Hereinafter, each layer of an additional embodiment of the present invention will be described in detail with reference to FIGS. 23 and 24 . Referring to FIG. 23 , as in the above-described embodiment, in the second layer 700 , a first positive wire 721 and a first negative wire 722 are separately provided for each inspection pickup unit 610 , respectively. , the third layer 800 may be provided with one first pickup wire 823 corresponding to each inspection pickup unit 610 . In this case, each of the wires 721 , 722 , and 823 may be provided such that the same wire is electrically connected to each other so that the power supply cutoff can be controlled with one power source. Since the arrangement of each of the wires 721 , 722 , and 823 has been described in detail through the above embodiment, the following will be omitted. Referring to FIG. 24 , in the third layer 800 , the pickup wires connected to the pickup part 613 for each inspection pickup part 610 are separately as positive pickup wires 8231 and negative pickup wires 8232 , respectively. It may be provided so as to correspond. At this time, it is preferable that the pickup unit 613 is also provided in two so as to protrude downwardly at one end of each of the positive pickup wire 8231 and the negative pickup wire 8232 . That is, even if the pickup unit 613 is separately provided as a positive electrode pickup unit and a negative electrode pickup unit, each pickup unit 613 is the first to avoid direct contact with the micro LED 10 as shown in FIGS. 21 and 22 . Preferably, it is provided so as not to penetrate the layer 700 .

When a circuit is configured with two layers as in the above embodiment, other embodiments, and additional embodiments, it may be easy to arrange a complex circuit within a narrow area. Here, each wire 721 , 722 , 723 , 821 , 822 , 823 excluding the conduction points 711 , 712 , 713 so that the circuits on the second layer 700 and the third layer 800 do not electrically communicate with each other It is preferable that the upper and lower surfaces passing through are coated with an insulator. In detail, the conducting points 711 , 712 , 713 provided on the second layer 700 pass through the second layer 700 , and the electric wires 821 , 822 , 823 provided on the third layer 800 and It is preferable to be provided so as to be electrically connected. On the other hand, since the wires 721 , 722 , 723 provided on the second layer 700 and the wires 821 , 822 , 823 provided on the third layer 800 should not be electrically connected to each other, each wire It is preferable that the upper and lower surfaces through which (721, 722, 723, 821, 822, 823) pass are coated with an insulator so as not to conduct electricity with each other. In this case, the insulator may be an insulator of a different material, but it is more preferable to be provided with an insulator made of the same soft material as the second layer 700 and the third layer 800, respectively. Specifically, it is more preferable to be provided with a transparent material having elasticity, such as UV Resin, SU-8, or PDMS (Polydimethylsiloxane).

The arrangement of the wires in the above embodiments is only an example, and may be variously modified according to the spacing, number, and area of the layers of the micro LED 10 to be inspected.

Hereinafter, the micro LED transfer step according to an embodiment of the present invention will be described with reference to FIGS. 25 to 27 . Figure 25 is a cross-sectional view showing the micro LED transfer step of an embodiment of the present invention, Figure 26 is a cross-sectional view showing the micro LED transfer step of another embodiment of the present invention, Figure 27 is a micro LED transfer step of an additional embodiment of the present invention A cross-sectional view is shown.

The micro LED transfer step of the present invention may include a micro LED inspection step and a micro LED selective pickup step, and only the micro LED 10 picked up by the micro LED selective pickup step is selectively transferred.

According to an embodiment, first, the LED transfer device 6 according to the present invention is positioned on the upper surface of the wafer W on which a plurality of micro LEDs 10 are arranged, and the LED transfer device 6 is the micro LED 10 . It moves downward so that the inspection parts 611 and 612 are in contact with each electrode.

Thereafter, as a micro LED inspection step, power is applied to the anode wire 721 and the cathode wire 722 provided in the second layer 700 to check whether the micro LED 10 electrically operates normally. In detail, after electrically contacting each of the electrodes 11 and 12 of the plurality of micro LEDs 10 and the positive electrode inspection unit 611 and the negative electrode inspection unit 612, respectively, a plurality of positive wires 721 and negative wires By applying power to 722, it is possible to check whether the micro LED 10 is operating normally. At this time, the plurality of micro LEDs 10 may be inspected simultaneously by applying the electrodes at the same time, but according to an embodiment, it is preferable that the electrodes are sequentially applied and sequentially inspected one by one.

After that, a micro LED transfer step may be performed. Referring to FIG. 25 , in the micro LED transfer step, current only exists in the pickup unit 613 corresponding to the micro LED 10 checked as a normal operation according to whether the micro LED 10 checked in the micro LED checking step operates normally. may be authorized. In detail, the pickup wire 823 provided in the third layer 800 is the LED transport device 6 in a state in which power is applied only to the pickup wire 823 at a position corresponding to the micro LED 10 checked for normal operation. ) is lifted upward again, only the normally operating micro LED 10 of the portion to which power is applied is gripped by each corresponding pickup unit 613 and can be selectively picked up and transported. That is, the normal operating micro LED 10 is picked up by the inspection pickup unit 610 , and the abnormal micro LED 10 remains on the wafer W . Therefore, only the normally operating micro LED 10 picked up by the LED transfer device 6 can be selectively transferred to a desired space. In addition, the abnormal micro LED 10 can be discarded together with the used wafer W, so that the inspection step and the transfer step can be shortened.

According to another embodiment with reference to FIG. 26, the LED transfer device 6 is positioned on the upper surface of the wafer W, and the LED transfer device 6 is vertically moved to the lower side to move the micro LED pickup inspection unit 610 to each micro The LED 10 is brought into contact. Thereafter, in the micro LED inspection step, power is applied to the anode wire 821 and the cathode wire 822 provided in the third layer 800 to check whether the micro LED 10 electrically operates normally. After selecting the micro LED 10 in a normal state and an abnormal state by the micro LED inspection step, a micro LED transfer step may be performed. In detail, in the micro LED transfer step, current is applied only to the pickup unit 613 corresponding to the micro LED 10 checked as a normal operation depending on whether the micro LED 10 checked in the micro LED checking step operates normally. can In more detail, power may be applied only to the pickup wire 723 provided in the second layer 700 at a position corresponding to the micro LED 10 checked for normal operation. Accordingly, only the micro LED 10 in a normal operating state can be selectively picked up and transported by being gripped by the respective pick-up units 610 . That is, the normal operating micro LED 10 is picked up by the inspection pickup unit 610 , and the abnormal micro LED 10 remains on the wafer W . Therefore, only the normally operating micro LED 10 picked up by the LED transfer device 6 can be selectively transferred to a desired space. In addition, the abnormal micro LED 10 can be discarded together with the used wafer W, so that the inspection step and the transfer step can be shortened.

According to a further preferred embodiment with reference to FIG. 27 , the LED transfer device 6 is positioned on the upper surface of the wafer W . Thereafter, the LED transfer device 6 is vertically moved downward so that the inspection units 611 and 612 are in contact with each electrode of the micro LED 10 , and the pickup unit 613 is positioned to correspond to each micro LED 10 . . At this time, it is preferable that the pickup unit 613 according to an additional embodiment does not directly contact the micro LED 10 .

When the inspection units 611 and 612 are in contact with each micro LED 10, as a micro LED inspection step, power is applied to the anode wire 721 and the cathode wire 722 provided in the second layer 700 to apply power to the micro LED. The step of checking whether the electrical operation of (10) is normal may proceed. In detail, after electrically contacting each of the electrodes 11 and 12 of the plurality of micro LEDs 10 and the positive electrode inspection unit 611 and the negative electrode inspection unit 612, respectively, a plurality of positive wires 721 and negative wires By applying power to 722, it is possible to check whether the micro LED 10 is operating normally. At this time, the plurality of micro LEDs 10 may be inspected simultaneously by applying the electrodes at the same time, but according to an embodiment, it is preferable that the electrodes are sequentially applied and sequentially inspected one by one.

After that, a micro LED transfer step may be performed. Referring to FIG. 27 , in the micro LED transfer step, current only exists in the pickup unit 613 corresponding to the micro LED 10 checked as a normal operation depending on whether the micro LED 10 checked in the micro LED checking step operates normally. may be authorized. In detail, the pickup wire 823 provided in the third layer 800 is the LED transport device 6 in a state in which power is applied only to the pickup wire 823 at a position corresponding to the micro LED 10 checked for normal operation. ) is lifted upward again, only the normally operating micro LED 10 of the portion to which power is applied is gripped by each corresponding pickup unit 613 and can be selectively picked up and transported. At this time, the pickup unit 613 does not directly contact the micro LED 10 , but an electric field is formed by the power supplied to the corresponding pickup unit 613 at a position checked for normal operation to generate static electricity, thereby generating static electricity to the micro LED. (10) can be picked up. That is, the normal operating micro LED 10 is picked up by the inspection pickup unit 610 , and the abnormal micro LED 10 remains on the wafer W . Therefore, only the normally operating micro LED 10 picked up by the LED transfer device 6 can be selectively transferred to a desired space. In addition, the abnormal micro LED 10 can be discarded together with the used wafer W, so that the inspection step and the transfer step can be shortened.

Although the present invention has been described with reference to a preferred embodiment, this is only an embodiment, and a person skilled in the art may be able to make various modifications and equivalent other embodiments therefrom. Accordingly, the scope of the present invention is not limited by the above embodiments and the accompanying drawings.

W: Wafer
1: LED inspection unit 6: LED transport unit
10: micro LED
100: circuit layer 110: prober unit
111: positive inspection unit 112: negative inspection unit
113: positive wire 114: negative wire
200: buffer layer 300: protective layer
400: light detection unit
600: first layer 610: check pickup unit
611: positive inspection unit 612: negative inspection unit
613: pickup unit
700: second layer 711: positive conduction point
712: negative conduction point 713: pickup conduction point
721: first positive wire 722: first negative wire
723: second pickup wire
800: third layer 821: second positive wire
822: second negative wire 823: first pickup wire

Claims (16)

delete delete delete delete delete delete delete delete delete delete An LED conveying device (6) comprising two or more inspection pickups (610), comprising:
The inspection pickup unit 610,
a pickup unit 613 for picking up the LED;
an anode check unit 611 and a cathode check unit 612 for checking whether the LED operates normally by contacting and energizing the two electrodes of the LED, respectively;
a second layer 700 provided with a first positive wire 721 and a first negative wire 722 electrically connected to the positive electrode inspection unit 611 and the negative electrode inspection unit 612, respectively; and
The third layer 800 is located on the upper surface of the second layer 700 and provided with a first pickup wire 823 having one end electrically connected to the pickup unit 613; LED comprising a; transport device.
12. The method of claim 11,
The pickup unit 613, LED transport device, characterized in that the check unit (611, 612) selectively picks up only the LED checked that the normal operation.
delete 12. The method of claim 11,
The pickup unit 613,
LED transport device, characterized in that the anode pickup unit and the cathode pickup unit are separately provided.
delete 12. The method of claim 11,
The inspection unit (611, 612) is in contact with the LED to check whether the LED operates normally,
The pickup unit (613), LED transport device, characterized in that for picking up the LED through static electricity without contacting the LED.

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