WO2019144684A1 - 一种用于集成电路外观颜色和纹理装饰的叠层结构 - Google Patents

一种用于集成电路外观颜色和纹理装饰的叠层结构 Download PDF

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WO2019144684A1
WO2019144684A1 PCT/CN2018/116789 CN2018116789W WO2019144684A1 WO 2019144684 A1 WO2019144684 A1 WO 2019144684A1 CN 2018116789 W CN2018116789 W CN 2018116789W WO 2019144684 A1 WO2019144684 A1 WO 2019144684A1
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layer
integrated circuit
texture
color
structure according
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PCT/CN2018/116789
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French (fr)
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付建访
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付建访
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape

Definitions

  • the present application relates to the field of integrated circuit appearance, and in particular to a laminated structure for the appearance color and texture decoration of an integrated circuit.
  • ICs integrated circuits
  • the integrated circuit (IC) is directly exposed on the outside of the electronic product, and needs to be consistent with the color and texture of the peripheral components to meet the overall appearance requirements of the electronic product, such as (including but not limited to these applications) mobile phone fingerprint recognition module or Door lock fingerprint module, etc.
  • the current technology is to spray various colors of ink on the outer surface of the IC to realize the color of the fingerprint recognition module IC. As close as possible to the color of the phone cover.
  • ink spray is generally only suitable for matte effect due to the graininess of the ink. Although a small part can achieve high light effect, the high light effect achieved is far from the similarity to the mobile phone cover. Moreover, since the product defects are more pronounced under high light, resulting in a sharp drop in the appearance yield, this is also the reason why ink spraying is basically only used for matte appearance.
  • the current appearance of the fingerprint module IC is usually a single color, and the difficulty is further increased if a customer-specific logo pattern is to be implemented thereon.
  • logo usually needs a strong metal texture, it needs to add more metal components in the Logo ink, but the high metal composition will affect the electrical performance of the integrated circuit, such as electromagnetic shielding, which is for the fingerprint module IC. It will reduce the sensitivity and accuracy of fingerprint recognition, which further improves the difficulty of implementing Logo on the fingerprint module IC.
  • the present application provides a laminate structure for the appearance color and texture decoration of an integrated circuit, the laminate structure including a coating layer, a texture layer, and an integrated circuit board which are sequentially disposed from top to bottom.
  • the present application provides a laminated structure for the appearance color and texture decoration of an integrated circuit, the laminated structure comprising a coating layer, a texture layer and an integrated circuit board which are sequentially disposed from top to bottom.
  • the laminated structure comprising a coating layer, a texture layer and an integrated circuit board which are sequentially disposed from top to bottom.
  • Figure 1 is a cross-sectional view of a laminate structure for use in the color and texture decoration of an integrated circuit as provided herein.
  • top-down or the like contained in the term refers only to the orientation of the term in the normal use state, or a common name understood by those skilled in the art, without the contrary. It should not be considered as a limitation on the term.
  • the present application provides a laminated structure for the appearance color and texture decoration of an integrated circuit, which comprises a coating layer 4 , a texture layer 3 and an integrated circuit which are sequentially disposed from top to bottom. Board 1.
  • the current integrated circuit usually uses ink spraying to change the color and texture of the surface, but the decorative layer formed by the ink spraying is difficult to achieve high light, It is difficult to formulate specific logo patterns and the like, and various glare textures, colors, textures, patterns, and the like can be realized, so that the appearance of the exposed integrated circuit board surface can be more closely matched with the color and texture of the peripheral components.
  • the texture layer 3 is a planar pattern layer having a micron-scale microstructure.
  • the texture layer 3 is a three-dimensional pattern layer having a micron-scale microstructure.
  • a three-dimensional pattern layer or a planar pattern layer having a micron-scale microstructure can complete a special convergence of external light to achieve a glare texture effect; generally, it can be coated with an ultraviolet glue on an integrated circuit (including but not limited to) by UV transfer.
  • the coating layer 4 material is one or more of a conductor, an insulator, and a semiconductor
  • the conductor may be a metal
  • the insulator may be a non-metal.
  • the coating layer 4 is an optical coating layer which can be plated in a vacuum coating machine, and can realize any specific color by designing different optical film structures, and at the same time, we can limit (mask) the area of the coating to realize a specific area.
  • the color coating produces a coating (color) effect of a specific pattern (Logo).
  • the laminated structure further includes a background layer 2 fixed between the integrated circuit board 1 and the texture layer 3, and the color of the background layer 2 is usually (including Not limited to) white or black. If it is black, you can directly use the black color of the IC packaging material; if it is white, you can form the background white that meets the requirements by one or more silk screen printing. Since the appearance color of the upper surface of the IC is mainly realized by the plating layer 4, the background layer 2 can be set according to actual needs.
  • the laminated structure further includes a protective layer 5 fixed to an upper surface of the coating layer 4.
  • the protective layer 5 can be coated with a material such as transparent or colored UV glue by, for example, but not limited to, UV transfer, and the protective layer 5 can be disposed according to actual needs.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laminated Bodies (AREA)

Abstract

本申请公开了一种用于集成电路外观颜色和纹理装饰的叠层结构，所述叠层结构包括自上而下顺次设置的镀膜层(4)、纹理层(3)和集成电路板(1)。

Description

一种用于集成电路外观颜色和纹理装饰的叠层结构
相关申请的交叉引用
本申请基于申请号为201820123541.7、申请日为2018年01月25日的中国专利申请提出，并要求该中国专利申请的优先权，该中国专利申请的全部内容在此引入本申请作为参考。
技术领域
本申请涉及集成电路外观领域，具体地，涉及一种用于集成电路外观颜色和纹理装饰的叠层结构。
背景技术
目前，几乎所有集成电路(IC)都是用树脂封装的黑色外表。但有些应用场合，集成电路(IC)直接裸露在电子产品外面，需要与周边部件颜色、质感一致才能满足电子产品整体外表美观的要求，如(包含但不限于这些应用)手机指纹识别模组或门锁指纹模组等。为了使手机指纹模组IC通常的黑色变成手机前后盖所需要的金色、白色、蓝色等颜色，目前的技术是在IC外表面喷涂各种颜色的油墨，以实现指纹识别模组IC颜色与手机盖板颜色尽量一致。但随着手机外观越来越美观精致，手机前后盖所选用的材料越来越多，如塑胶、金属、玻璃、陶瓷、复合板材等，同时其颜色实现也越来越多地采用非油墨丝印或喷涂工艺，如用光学镀膜来实现颜色，通过UV转印或水转印来实现纹理或图案等，使得与手机盖板相配的指纹模组即使油墨颜色反复调整，仍很难做到指纹模组IC外观颜色、纹理、质感与手机盖板一致。
同时，油墨喷涂污染较大，很多地区都对喷涂生产线实施限制。
还有，油墨喷涂由于油墨的颗粒感一般只适合做出哑光的效果，虽然 也有少部分能实现高光的效果，但实现的高光效果远远达不到与手机盖板相近的程度。并且，由于在高光下产品瑕疵会更加明显从而导致外观良率急剧下降，这也是目前油墨喷涂基本上仅用于哑光外表的原因。
此外，目前的指纹模组IC外表通常都为单一颜色，如果要在其上实现客户特定的Logo图案，难度将进一步加大。因为Logo通常都需要有较强的金属质感，这需要在Logo油墨中加入更多的金属成分，但高的金属成分会影响集成电路的电气性能，如电磁屏蔽，对指纹模组IC来讲就是会降低指纹识别的灵敏度与准确性，这就进一步提高了在指纹模组IC上实现Logo的难度。
发明内容
本申请提供了一种用于集成电路外观颜色和纹理装饰的叠层结构，所述叠层结构包括自上而下顺次设置的镀膜层、纹理层和集成电路板。
根据上述技术方案，本申请提供了一种用于集成电路外观颜色和纹理装饰的叠层结构，所述叠层结构包括自上而下顺次设置的镀膜层、纹理层和集成电路板。在集成电路板上表面通过增加纹理层和镀膜层，可以改变集成电路IC通常的黑色外观，实现各种炫光纹理、颜色、质感、图案等效果，以便使裸露在外面的集成电路板外观能够与周边部件颜色、质感更加匹配。
本申请的其他特征和优点将在随后的具体实施方式部分予以详细说明。
附图说明
附图是用来提供对本申请的进一步理解，并且构成说明书的一部分，与下面的具体实施例一起用于解释本申请，但并不构成对本申请的限制。在附图中：
图1是本申请提供的用于集成电路外观颜色和纹理装饰的叠层结构剖 视图。
附图标记说明
1-集成电路板       2-背景层
3-纹理层           4-镀膜层
5-保护层
具体实施方式
以下结合附图对本申请的具体实施例进行详细说明。应当理解的是，此处所描述的具体实施例仅用于说明和解释本申请，并不用于限制本申请。
在本申请中，在未作相反说明的情况下，“自上而下”等包含在术语中的方位词仅代表该术语在常规使用状态下的方位，或为本领域技术人员理解的俗称，而不应视为对该术语的限制。
如图1所示：本申请提供了一种用于集成电路外观颜色和纹理装饰的叠层结构，所述叠层结构包括自上而下顺次设置的镀膜层4、纹理层3和集成电路板1。在集成电路板1上表面通过增加纹理层3和镀膜层4，解决了目前集成电路(IC)通常使用油墨喷涂来改变其表面的颜色和质感，但是油墨喷涂形成的装饰层存在难以实现高光、难以制定特定Logo图案等问题，可以实现各种炫光纹理、颜色、质感、图案等效果，以便使裸露在外面的集成电路板表面外观能够与周边部件颜色、质感更加匹配。
在本申请的一种实施例中，所述纹理层3为具有微米级微观结构的平面图案层。
在本申请的一种实施例中，所述纹理层3为具有微米级微观结构的立体图案层。具有微米级微观结构的立体图案层或平面图案层可以完成对外界光线的特殊汇聚，实现炫光的纹理效果；通常可用(包含但不限于)UV转印的方式用UV胶涂布在集成电路板1的表面。
在本申请的一种实施例中，所述镀膜层4材料为导体、绝缘体和半导 体中的一种或多种，所述导体可为金属，所述绝缘体可为非金属。该镀膜层4是可以在真空镀膜机中镀制的光学镀膜层，可以通过设计不同的光学薄膜结构来实现任何特定的颜色，同时，我们可以限制(遮蔽)镀膜的区域，从而实现特定区域的颜色镀膜，产生特定图案(Logo)的镀膜(颜色)效果。通过选用镀膜材料的种类(导体、绝缘体、半导体等)来确保对IC有关电气性能的实现，如电磁屏蔽、介电常数、导电与非导电等性能。
在本申请的一种实施例中，所述叠层结构还包括固定于所述集成电路板1和所述纹理层3之间的背景层2，所述背景层2的颜色通常为(包含但不限于)白色或黑色。如果为黑色，可以直接利用IC封装材料的黑色本色；如果是白色，可以通过一次或多次丝印的方式形成满足要求的背景白色。由于IC上表面的外观颜色主要由镀膜层4实现，所以背景层2可以根据实际需要进行设置。
在本申请的一种实施例中，所述叠层结构还包括固定于所述镀膜层4上表面的保护层5。保护层5可以用透明或有颜色的UV胶等材料通过(包含但不限于)UV转印等办法涂布上去，保护层5可以根据实际需要进行设置。
以上结合附图详细描述了本申请的实施例，但是，本申请并不限于上述实施例中的具体细节，在本申请的技术构思范围内，可以对本申请的技术方案进行多种简单变型，这些简单变型均属于本申请的保护范围。
另外需要说明的是，在上述具体实施例中所描述的各个具体技术特征，在不矛盾的情况下，可以通过任何合适的方式(包括叠层结构的顺序调整)进行组合，为了避免不必要的重复，本申请对各种可能的组合方式不再另行说明。
此外，本申请的各种不同的实施例之间也可以进行任意组合，只要其不违背本申请的思想，其同样应当视为本申请所公开的内容。

Claims (9)

  1. 一种用于集成电路外观颜色和纹理装饰的叠层结构，所述叠层结构包括自上而下顺次设置的镀膜层(4)、纹理层(3)和集成电路板(1)。
  2. 根据权利要求1所述的叠层结构，其中，所述纹理层(3)为具有微米级微观结构的平面图案层。
  3. 根据权利要求1所述的叠层结构，其中，所述纹理层(3)为具有微米级微观结构的立体图案层。
  4. 根据权利要求1所述的叠层结构，其中，所述镀膜层(4)材料为导体、绝缘体和半导体中的一种或多种。
  5. 根据权利要求1所述的叠层结构，其中，所述叠层结构还包括固定于所述集成电路板(1)和所述纹理层(3)之间的背景层(2)。
  6. 根据权利要求5所述的叠层结构，其中，所述背景层(2)的颜色包含但不限于白色或黑色。
  7. 根据权利要求1所述的叠层结构，其中，所述叠层结构还包括固定于所述镀膜层(4)上表面的保护层(5)。
  8. 根据权利要求1所述的叠层结构，其中，所述纹理层(3)通过以UV转印的方式用UV胶涂布在所述集成电路板(1)的表面而形成。
  9. 根据权利要求7所述的叠层结构，其中，所述保护层(5)通过以UV转印的方式用UV胶涂布在所述镀膜层(4)的上表面而形成。
PCT/CN2018/116789 2018-01-25 2018-11-21 一种用于集成电路外观颜色和纹理装饰的叠层结构 WO2019144684A1 (zh)

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