WO2019142256A1 - Module électronique - Google Patents

Module électronique Download PDF

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Publication number
WO2019142256A1
WO2019142256A1 PCT/JP2018/001167 JP2018001167W WO2019142256A1 WO 2019142256 A1 WO2019142256 A1 WO 2019142256A1 JP 2018001167 W JP2018001167 W JP 2018001167W WO 2019142256 A1 WO2019142256 A1 WO 2019142256A1
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WO
WIPO (PCT)
Prior art keywords
substrate
exposed
position corresponding
side region
exposed portion
Prior art date
Application number
PCT/JP2018/001167
Other languages
English (en)
Japanese (ja)
Inventor
康亮 池田
理 松嵜
Original Assignee
新電元工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 新電元工業株式会社 filed Critical 新電元工業株式会社
Priority to PCT/JP2018/001167 priority Critical patent/WO2019142256A1/fr
Priority to JP2019566025A priority patent/JP7018459B2/ja
Publication of WO2019142256A1 publication Critical patent/WO2019142256A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector

Definitions

  • the present invention relates to an electronic module including an electronic element in a sealing portion and having a heat dissipation layer.
  • An electronic module in which a plurality of electronic elements are provided in a sealing resin is conventionally known (see, for example, JP-A-2014-45157). There is a need for more electronic devices in such electronic modules.
  • the size in the plane direction of the first substrate and the second substrate is increased.
  • the first substrate and the second substrate may be warped in the heat treatment process.
  • a first insulating substrate, a first conductor layer provided on the mounting surface of the first insulating substrate, a first power device provided on the first conductor layer, and a first power device connected A first member having one connection portion, a second insulating substrate, a second conductor layer provided on the mounting surface of the second insulating substrate, and a second power device provided in the second conductor layer
  • the first power device and the second power device are disposed to face each other, and are connected to each other by a conductor post.
  • the present invention has been made in view of such a point, and provides an electronic module capable of preventing distortion in a substrate, in particular, distortion of the substrate starting from a connecting body such as a conductor post.
  • the electronic module according to the invention is The first heat radiation layer, A first substrate provided on one side of the first heat radiation layer; A first electronic element provided on one side of the first substrate; A second electronic device provided on one side of the first electronic device; A second substrate provided on one side of the second electronic device; A second heat dissipation layer provided on one side of the second substrate; A sealing portion for sealing at least the first electronic element and the second electronic element; A connector provided between the first electronic device and the second electronic device or between the second electronic device and the second substrate; Equipped with The first heat dissipation layer has a first exposed portion to which the first substrate is exposed at a position corresponding to the other side area of the connection body, or the second heat dissipation layer corresponds to one side area of the connection body It may have a 2nd exposure part to which the 2nd substrate is exposed in a position.
  • the first exposed portion includes only a part of the position corresponding to the other side region of the connector, or
  • the second exposed portion may include only a part of the position corresponding to the one side region of the connection body.
  • the first exposed portion includes all of the positions corresponding to the other side region of the connector, or
  • the second exposed portion may include all of the positions corresponding to the one side region of the connection body.
  • the first exposed portion includes a peripheral edge of a position corresponding to the other side region of the connector, or
  • the second exposed portion may include a peripheral edge at a position corresponding to the one side region of the connection body.
  • connection body is a first connection body provided between the first electronic element and the second electronic element, and a second connection body provided between the second electronic element and the second substrate.
  • the first heat dissipation layer has a first exposed portion at which the first substrate is exposed at a position corresponding to the other side region of the first connection body, or the second heat dissipation layer is on one side of the second connection body
  • connection body includes a head portion and a pillar portion extending from the head portion in the thickness direction of the head portion.
  • the first heat dissipation layer has a first exposed portion where the first substrate is exposed at all of the positions corresponding to the other side region of the pillar portion, or the second heat dissipation layer is formed on one side region of the pillar portion
  • the second substrate may have a second exposed portion where the second substrate is exposed at all of the corresponding positions.
  • connection body includes a head portion and a pillar portion extending from the head portion in the thickness direction of the head portion.
  • the first heat dissipation layer has a first exposed portion where the first substrate is exposed at the periphery of a position corresponding to the other side region of the pillar portion, or the second heat dissipation layer is formed on one side region of the pillar portion It may have a 2nd exposure part which the 2nd substrate exposes in the circumference of a corresponding position.
  • the first substrate is exposed in the other side region of the connection body to which heat is transmitted in the first heat dissipation layer, or the second substrate is exposed to the one side area of the connection body in which heat is easily transmitted
  • substrate exposes is employ
  • FIG. 1 is a side sectional view of an electronic module that can be used in the first embodiment of the present invention.
  • FIG. 2 is a plan view of an electronic module that can be used in the first embodiment of the present invention, and is a plan view showing the relationship between the second connection body and the second exposed portion.
  • FIG. 3 is an aspect different from the aspect shown in FIG. 2 and is a plan view of an electronic module that can be used in the first embodiment of the present invention, wherein the relationship between the second connector and the second exposed portion It is the top view which showed.
  • FIG. 4 is an aspect different from the aspect shown in FIGS.
  • FIG. 2 and 3 is a plan view of an electronic module that can be used in the first embodiment of the present invention, wherein the second connecting member and the second exposed portion It is the top view which showed the relationship between and.
  • FIG. 5 is a plan view of an electronic module that can be used in the first embodiment of the present invention, and is a plan view showing the relationship between the first connector and the second exposed portion.
  • FIG. 6 is an aspect different from the aspect shown in FIG. 5 and is a plan view of an electronic module that can be used in the first embodiment of the present invention, wherein the relationship between the first connector and the second exposed portion It is the top view which showed.
  • FIG. 7 is an aspect different from the aspect shown in FIGS.
  • FIG. 5 and 6 is a plan view of an electronic module that can be used in the first embodiment of the present invention, wherein the first connecting member and the second exposed portion It is the top view which showed the relationship between and.
  • FIG. 8 is an aspect different from the aspect shown in FIGS. 2 to 4 and is a plan view of an electronic module that can be used in the first embodiment of the present invention, wherein the second connecting member and the second exposed portion It is the top view which showed the relationship between and.
  • FIG. 9 is an aspect different from the aspect shown in FIG. 2 to FIG. 4 and FIG. 8 and is a plan view of an electronic module that can be used in the first embodiment of the present invention. It is the top view which showed the relationship with 2 exposure parts.
  • FIG. 10 is an aspect different from the aspect shown in FIGS.
  • FIG. 5 to 7 is a plan view of an electronic module that can be used in the first embodiment of the present invention, wherein the first connecting member and the second exposed portion It is the top view which showed the relationship between and.
  • FIG. 11 is an aspect different from the aspect shown in FIG. 5 to FIG. 7 and FIG. 10, and is a plan view of an electronic module which can be used in the first embodiment of the present invention. It is the top view which showed the relationship with 2 exposure parts.
  • FIG. 12 is a plan view of an electronic module that can be used in the first embodiment of the present invention, showing a mode in which a plurality of second exposed portions are provided.
  • FIG. 13 is a side sectional view of an electronic module that can be used in the second embodiment of the present invention.
  • FIG. 14 is a plan view of an electronic module that can be used in the second embodiment of the present invention, and is a plan view showing the relationship between the first connector and the first exposed portion.
  • FIG. 15 is an aspect different from the aspect shown in FIG. 14 and is a plan view of an electronic module that can be used in the second embodiment of the present invention, wherein the relationship between the first connector and the first exposed portion It is the top view which showed.
  • FIG. 16 is an aspect different from the aspect shown in FIGS. 14 and 15, and is a plan view of an electronic module that can be used in the second embodiment of the present invention, wherein the first connecting member and the first exposed portion It is the top view which showed the relationship between and.
  • FIG. 15 is an aspect different from the aspect shown in FIG. 14 and is a plan view of an electronic module that can be used in the second embodiment of the present invention, wherein the first connecting member and the first exposed portion It is the top view which showed the relationship between and.
  • FIG. 16 is an aspect different from the aspect shown in FIGS. 14 and 15,
  • FIG. 17 is a plan view of an electronic module that can be used in the second embodiment of the present invention, and is a plan view showing the relationship between the second connection body and the first exposed portion.
  • FIG. 18 is a plan view different from the mode shown in FIG. 17 and is a plan view of an electronic module that can be used in the second embodiment of the present invention, wherein the relationship between the second connection body and the first exposed portion It is the top view which showed.
  • FIG. 19 is an aspect different from the aspect shown in FIGS. 17 and 18, and is a plan view of an electronic module which can be used in the second embodiment of the present invention, wherein the second connecting member and the first exposed portion It is the top view which showed the relationship between and.
  • FIG. 20 is an aspect different from the aspect shown in FIGS.
  • FIG. 14 to 16 is a plan view of an electronic module that can be used in the second embodiment of the present invention, wherein the first connecting member and the first exposed portion It is the top view which showed the relationship between and.
  • FIG. 21 is an aspect different from the aspect shown in FIG. 14 to FIG. 16 and FIG. 20, and is a plan view of an electronic module that can be used in the first embodiment of the present invention. It is the top view which showed the relationship with one exposure part.
  • FIG. 22 is an aspect different from the aspect shown in FIGS. 17 to 19 and is a plan view of an electronic module that can be used in the second embodiment of the present invention, wherein the second connecting member and the first exposed portion It is the top view which showed the relationship between and.
  • FIG. 23 is an aspect different from the aspect shown in FIG. 17 to FIG.
  • FIG. 19 and FIG. 22 is a plan view of an electronic module that can be used in the second embodiment of the present invention. It is the top view which showed the relationship with one exposure part.
  • FIG. 24 is a plan view of an electronic module that can be used in the second embodiment of the present invention, showing a mode in which a plurality of first exposed portions are provided.
  • first direction the horizontal direction
  • second direction the front and back direction of the paper surface
  • in-plane direction An in-plane direction including the second direction and the third direction
  • plane view when viewed from one side to the other side, referred to as “plan view”, viewed from the other side to the one side.
  • bottom view When it is called "bottom view”.
  • the electronic module includes a first heat dissipation layer 19, a first substrate 11 provided on one side of the first heat dissipation layer 19, and a first conductor provided on one side of the first substrate 11.
  • a sealing portion 90 made of a sealing resin or the like for sealing the element 13 and the second electronic element 23 may be included.
  • Both or any one of the first conductor layer 12 and the second conductor layer 22 may be connected to the terminal portion 100, and the tip end side of the terminal portion 100 is exposed to the outside of the sealing portion 90, and the control substrate etc. It may be connectable to an external device of The terminal unit 100 may have a first terminal unit 110 and a second terminal unit 120.
  • the first terminal portion 110 includes a first terminal portion base end portion 111, a first terminal portion outer portion 113 exposed at least partially from the sealing portion 90, a first terminal portion base end portion 111, and a first terminal. It may be provided between the part outer direction part 113, and may have the 1st bending part 112 bent on the other side by the 1st terminal-part proximal-end part 111 side.
  • the second terminal portion 120 includes a second terminal portion base end portion 121, a second terminal portion outer portion 123 exposed at least partially from the sealing portion 90, a second terminal portion base end portion 121, and a second terminal. It may be provided between the part outer direction part 123, and may have the 2nd bending part 122 bent to one side by the 2nd terminal part base end part 121 side.
  • a non-connecting conductor layer 50 which is not electrically connected to the first electronic element 13 and the second electronic element 23, which is pressed by a mold when resin sealing is provided Also good (see Figure 2).
  • the electronic module of the present embodiment may have connectors 60 and 70.
  • the connection bodies 60 and 70 are provided on the opposite side of the first connection body 60 provided between the first electronic element 13 and the second electronic element 23 and the first connection body 60 of the second electronic element 23.
  • the second connector 70 may be included.
  • the present invention an embodiment in which the first connection body 60 and the second connection body 70 are provided will be described, but the present invention is not limited to such an aspect, and the first connection body 60 and the second connection body 70 are described. Only one of them may be provided.
  • the connecting members 60 and 70 may have head portions 61 and 71 and pillar portions 62 and 72 extending from the head portions 61 and 71 in the thickness direction (first direction) of the head portions 61 and 71.
  • the first connecting member 60 includes the first head portion 61 and the thickness direction of the first head portion 61 from the first head portion 61.
  • the first post portion 62 extending in the
  • the second connection body 70 may have a second head portion 71 and a second pillar portion 72 extending from the second head portion 71 in the thickness direction of the second head portion 71.
  • the first heat radiation layer 19 may be configured not to expose the first substrate 11 at a position corresponding to the other side region of the connection body 60, 70.
  • the “position corresponding to the one side area” of the connection body 60, 70 is a position (area) included when a straight line is drawn along the first direction from the connection body 60, 70 to the one side, and the connection body
  • the “position corresponding to the other side area” of 60 and 70 is a position (area) included when a straight line is drawn along the first direction from the connecting body 60 and 70 to the other side.
  • connection body 60 is a plan view (or bottom surface)
  • Connection means that the connecting members 60 and 70 and the second exposed portion 140 overlap with each other at least in part, and the first heat dissipation layer 19 is connected to the connecting members 60 and 70 as in the second embodiment described later.
  • the second exposed portion 140 may include only a part of the position corresponding to the one side region of the connecting members 60 and 70. In other words, in plan view, the second exposed portion 140 is only a portion of the connecting members 60 and 70. May be included. Thus, when including only a part of the position corresponding to the one side area of the connectors 60 and 70, the second exposed portion 140 includes the periphery of the position corresponding to the one side area of the connectors 60 and 70. May be provided. Moreover, it is not restricted to such an aspect, The 2nd exposure part 140 may be made to include all the positions corresponding to the one side area
  • the second exposed portion 140 may expose the surface on one side (upper surface in FIG. 1) of the second substrate 21 at all or part of the position corresponding to the one side region of the first column portion 62, or The surface on one side of the second substrate 21 may be exposed at all or part of the position corresponding to the one side region of the one head portion 61. Alternatively, the surface on one side of the second substrate 21 may be exposed at all or part of the position corresponding to the one side region of the second pillar portion 72, or corresponds to the one side region of the second head portion 71. The surface on one side of the second substrate 21 may be exposed at all or part of the position.
  • one side of the second substrate 21 is a part of the position corresponding to one side region of the second column portion 72 and one side region of the second head portion 71.
  • the top surface (upper surface in FIG. 1) is exposed.
  • the second exposed portion 140 is provided so as to include all of the second pillar portion 72 and a portion of the second head portion 71 in a plan view.
  • one side of the second substrate 21 is a part of the position corresponding to one side area of the first column portion 62 and one side area of the first head part 61.
  • the top surface (upper surface in FIG. 1) is exposed.
  • the second exposed portion 140 is provided so as to include all of the first column portion 62 and a portion of the first head portion 61 in plan view.
  • the second exposed portion 140 When the second exposed portion 140 is provided so as to include the peripheral edge of the position corresponding to the one side region of the connection body 60, 70, the second exposed portion 140 corresponds to the one side region of the first column portion 62. It may be provided to include the peripheral edge of the position, or may be provided to include the peripheral edge of the position corresponding to the one side region of the first head portion 61. In addition, the second exposed portion 140 may be provided so as to include the peripheral edge of the position corresponding to the one side region of the second column 72, or the peripheral edge of the position corresponding to the one side region of the second head portion 71. May be provided.
  • the second exposed portion 140 is provided so as to include the peripheral edge of the position corresponding to the one side region of the second pillar portion 72, and the second exposed portion 140 is provided at the center of the one side region of the second pillar portion 72 The surface on one side of the substrate 21 is not exposed.
  • the second exposed portion 140 is provided so as to include the periphery of the second column 72 and not include the center of the second column 72 in a plan view.
  • the second exposed portion 140 is provided so as to include the periphery of the position corresponding to the one side region of the second head portion 71, and the center of the one side region of the second head portion 71 and the second The surface on one side of the second substrate 21 is not exposed in the one side region of the column portion 72.
  • the second exposed portion 140 includes the periphery of the second head portion 71 and does not include the center of the second head portion 71 and the second pillar portion 72 in plan view. Is provided.
  • the second exposed portion 140 is provided so as to include the peripheral edge of the position corresponding to the one side region of the first pillar portion 62, and the second exposed portion 140 is second at the center of the one side region of the first pillar portion 62.
  • the surface on one side of the substrate 21 is not exposed.
  • the second exposed portion 140 is provided so as to include the peripheral edge of the first pillar 62 and not include the center of the first pillar 62 in a plan view.
  • the second exposed portion 140 is provided so as to include the periphery of the position corresponding to the one side region of the first head portion 61, and the center of the one side region of the first head portion 61 and the first The surface on one side of the second substrate 21 is not exposed in the one side region of the column portion 62.
  • the second exposed portion 140 includes the periphery of the first head portion 61 and does not include the center of the first head portion 61 and the first pillar portion 62 in plan view. Is provided.
  • a plurality of connectors 60 and 70 may be provided in the in-plane direction.
  • the second exposed portion 140 corresponding to each of the connectors 60 and 70 may be provided.
  • the present invention is not limited to such an aspect, and the second exposed portion 140 corresponding to only a part of the connectors 60 and 70 may be provided.
  • first conductor layers 12 may be provided on one side of the first substrate 11.
  • Each or any one of the first electronic element 13 and the second electronic element 23 may be a switching element or a control element.
  • a MOSFET, an IGBT or the like may be used as the switching element.
  • Each of the first electronic element 13 and the second electronic element 23 may be composed of a semiconductor element, and the semiconductor material may be silicon, silicon carbide, gallium nitride or the like.
  • a conductive adhesive such as solder is provided between the first electronic element 13 and the first connection body 60, and the first electronic element 13 and the first connection body 60 are connected via the conductive adhesive. May be connected.
  • a conductive adhesive such as solder is provided between the first connection body 60 and the second electronic element 23, and the first connection body 60 and the second electronic element 23 are conductively bonded. It may be connected via an agent.
  • a conductive adhesive such as a solder is provided between the second electronic element 23 and the second connection body 70, and the second electronic element 23 and the second connection body 70 have a conductive adhesive. It may be connected via an agent.
  • an insulating substrate such as a ceramic substrate or an insulating resin layer can be employed.
  • a material having Ag or Cu as a main component can also be used.
  • a metal such as Cu can be used as a material of the first connection body 60 and the second connection body 70.
  • a metal substrate subjected to circuit patterning can be used as the substrates 11 and 21. In this case, the substrates 11 and 21 also serve as the conductor layers 12 and 22, respectively.
  • the first electronic element 13 is a switching element such as a MOSFET
  • the first gate electrode 13 g and the first source electrode 13 s are provided on the surface (surface on one side) of the first connection body 60. May be provided.
  • the second electronic element 23 is a switching element such as a MOSFET, even if the second gate electrode 23g and the second source electrode 23s are provided on the surface (surface on one side) on the second connection body 70 side. Good.
  • the second connection body 70 may be connected to the second source electrode 23s of the second electronic element 23 via a conductive adhesive.
  • a second drain electrode in which the first connection body 60 is provided on the surface (the surface on the other side) of the first source electrode 13 s of the first electronic element 13 and the second connection body 70 of the second electronic element 23. 23 d may be connected via a conductive adhesive.
  • a first drain electrode 13d is provided on the surface of the first electronic element 13 opposite to the first connection body 60 (the surface on the other side), and the first drain electrode 13d includes the first conductor layer 12 and a conductive adhesive. It may be connected via.
  • the first gate electrode 13 g may be connected to the connector 30 via a conductive adhesive, and the connector 30 may be connected to the first conductor layer 12 via a conductive adhesive.
  • the second gate electrode 23 g may be connected to the connector 40 via a conductive adhesive, and the connector 40 may be connected to the second conductor layer 22 via a conductive adhesive.
  • the bonding between the terminal portion 100 and the conductor layers 12 and 22 may be performed not only by using a conductive adhesive such as solder, but also by laser welding or ultrasonic bonding.
  • the in-plane of the connection body 60, 70 is employed. It is possible to prevent the second substrate 21 from being distorted from the position in the direction.
  • the first heat radiation layer 19 is configured not to expose the first substrate 11 at a position corresponding to the other side region of the connection body 60, 70, a mold is formed via the non-connection conductor layer 50. It is possible to suppress the reduction of the heat radiation effect by reducing the area (area) of the first heat radiation layer 19 on the side of the first substrate 11 in which distortion is unlikely to occur by pressing.
  • the second exposed portion 140 exposes the surface on one side of the second substrate 21 at all (see FIG. 3) or a part (see FIGS. 2 and 4) of the position corresponding to the one side region of the second head portion 71. It is expected that the second substrate 21 can be prevented from being distorted by exposing the surface on one side of the second substrate 21 in the region corresponding to the second connection body 70 to which heat is easily transmitted. it can.
  • a mode in which the second exposed portion 140 exposes the surface on one side of the second substrate 21 at all (see FIG. 2) or a part (see FIG. 4) of the position corresponding to the one side region of the second column 72 When employed, it is expected that the second substrate 21 can be efficiently prevented from being distorted by exposing the surface on one side of the second substrate 21 particularly in the region corresponding to the second column portion 72 where heat is easily transmitted. it can.
  • the second substrate 21 is distorted while the reduction of the heat radiation effect due to the reduction of the area of the second heat dissipation layer 29 is reduced. Can be prevented efficiently.
  • the second exposed portion 140 exposes the surface on one side of the second substrate 21 at all (see FIG. 6) or a portion (see FIGS. 5 and 7) of the position corresponding to the one side region of the first head portion 61.
  • the second substrate 21 it is expected that the second substrate 21 can be prevented from being distorted by exposing the surface on one side of the second substrate 21 in the region corresponding to the first connection body 60 where heat is easily transmitted. it can.
  • a mode in which the second exposed portion 140 exposes the surface on one side of the second substrate 21 at all (see FIG. 5) or a part (see FIG. 7) of the positions corresponding to the one side region of the first column portion 62 When adopted, it is expected that the second substrate 21 can be efficiently prevented from being distorted by exposing the surface on one side of the second substrate 21 particularly in the region corresponding to the first column portion 62 where heat is easily transmitted. it can.
  • the second substrate 21 is distorted while the reduction of the heat radiation effect due to the reduction of the area of the second heat dissipation layer 29 is reduced. Can be prevented efficiently.
  • the distortion of the second substrate 21 can be eliminated in some cases by exposing the surface on one side of the second substrate 21 in the peripheral region of the connecting members 60 and 70.
  • the second exposed portion 140 is provided to include the periphery of the position corresponding to the one side region of the second head portion 71, and the position corresponding to the one side region of the second head portion 71. It can be expected that the second substrate 21 can be prevented from being distorted by adopting a mode in which the surface on one side of the second substrate 21 is exposed at the peripheral edge of the second substrate 21.
  • the second exposed portion 140 is provided to include the periphery of a position corresponding to one side region of the second column portion 72 to which heat is particularly easily transmitted.
  • the second exposed portion 140 is provided so as to include the peripheral edge of the position corresponding to the one side region of the first head portion 61, and the position corresponding to the one side region of the first head portion 61.
  • the second exposed portion 140 is provided to include the periphery of the position corresponding to the one side region of the first pillar portion 62 to which heat is particularly easily transmitted, and one side of the first pillar portion 62
  • the second substrate 21 can be prevented from being distorted.
  • the first heat radiation layer 19 has a first exposed portion 150 that exposes the other side surface of the first substrate 11 at a position corresponding to the other side region of the connecting members 60 and 70.
  • any aspect described in the first embodiment can be adopted.
  • the members described in the first embodiment will be described using the same reference numerals.
  • the first exposed portion 150 may include only a part of the position corresponding to the other side area of the connection body 60, 70.
  • the first exposed portion 150 when including only a part of the position corresponding to the other side region of the connectors 60, 70, the first exposed portion 150 includes the periphery of the position corresponding to the other side region of the connectors 60, 70. May be provided.
  • the 1st exposure part 150 may be made to include all the positions corresponding to the other side area
  • the first exposed portion 150 may expose the other side surface (the lower surface in FIG. 13) of the first substrate 11 at all or part of the position corresponding to the other side region of the first column portion 62, or The surface on the other side of the first substrate 11 may be exposed at all or part of the position corresponding to the other side region of the one head portion 61. In addition, the surface on the other side of the first substrate 11 may be exposed at all or a part of the position corresponding to the other side region of the second pillar portion 72, or corresponds to the other side region of the second head portion 71 The other surface of the second substrate 21 may be exposed at all or part of the position.
  • one side of the second substrate 21 is a part of the position corresponding to one side area of the first column portion 62 and is one part of the position corresponding to one side area of the first head portion 61.
  • the lower surface of FIG. 13 (the lower surface in FIG. 13) is exposed.
  • the first exposed portion 150 is provided so as to include the whole of the first column portion 62 and a portion of the first head portion 61 in a bottom view.
  • one side of the second substrate 21 is a part of the position corresponding to one side area of the second column part 72 and the one side area of the second head part 71.
  • the lower surface of FIG. 13 (the lower surface in FIG. 13) is exposed.
  • the first exposed portion 150 is provided so as to include all of the second column portion 72 and include a portion of the second head portion 71 in bottom view.
  • the first exposed portion 150 When the first exposed portion 150 is provided so as to include the peripheral edge of the position corresponding to the other side region of the connector 60, 70, the first exposed portion 150 corresponds to the other side region of the first column portion 62. It may be provided to include the peripheral edge of the position, or may be provided to include the peripheral edge of the position corresponding to the other side region of the first head portion 61. In addition, the first exposed portion 150 may be provided so as to include the periphery of the position corresponding to the other side region of the second pillar portion 72, or the position corresponding to the other side region of the second head portion 71. It may be provided to include the peripheral edge.
  • the first exposed portion 150 is provided so as to include the periphery of the position corresponding to the other side region of the first pillar portion 62, and the first exposed portion 150 is first at the center of the other side region of the first pillar portion 62.
  • the other side of the substrate 11 is not exposed.
  • the first exposed portion 150 is provided so as to include the peripheral edge of the first pillar portion 62 and not include the center of the first pillar portion 62 in bottom view.
  • the first exposed portion 150 is provided so as to include the periphery of the position corresponding to the other side region of the first head portion 61, and the center of the other side region of the first head portion 61 and the first The other side surface of the first substrate 11 is not exposed in the other side region of the column portion 62.
  • the first exposed portion 150 includes the periphery of the first head portion 61 and does not include the center of the first head portion 61 and the first column portion 62 in a bottom view. Is provided.
  • the first exposed portion 150 is provided to include the peripheral edge of the position corresponding to the other side region of the second pillar portion 72, and the first exposed portion 150 is first at the center of the other side region of the second pillar portion 72.
  • the other side of the substrate 11 is not exposed.
  • the first exposed portion 150 is provided so as to include the periphery of the second column 72 and not include the center of the second column 72 in a bottom view.
  • the first exposed portion 150 is provided so as to include the peripheral edge of the position corresponding to the other side region of the second head portion 71, and the center of the one side region of the second head portion 71 and the second In the other side region of the column portion 72, the surface on one side of the second substrate 21 is not exposed.
  • the first exposed portion 150 includes the periphery of the second head portion 71 and does not include the center of the second head portion 71 and the second pillar portion 72 in a bottom view. Is provided.
  • the first exposed portion 150 exposes the other surface of the first substrate 11 at all (see FIG. 15) or a portion (see FIGS. 14 and 16) of the position corresponding to the other side region of the first head portion 61.
  • the first substrate 11 can be prevented from being distorted by exposing the other surface of the first substrate 11 in the region corresponding to the first connection body 60 where heat is easily transmitted. it can.
  • the first substrate 11 can be efficiently prevented from being distorted by exposing the surface on the other side of the first substrate 11 particularly in the region corresponding to the first column portion 62 where heat is easily transmitted. it can.
  • the first exposed portion 150 exposes the other surface of the first substrate 11 at all (see FIG. 18) or a portion (see FIGS. 17 and 19) of the position corresponding to the other side region of the second head portion 71.
  • the first substrate 11 it is expected that the first substrate 11 can be prevented from being distorted by exposing the other surface of the first substrate 11 in the region corresponding to the second connection body 70 where heat is easily transmitted it can.
  • the first substrate 11 can be efficiently prevented from being distorted by exposing the surface on the other side of the first substrate 11 particularly in the region corresponding to the second column portion 72 where heat is easily transmitted. it can.
  • the first exposed portion 150 is provided so as to include the peripheral edge of the position corresponding to the other side region of the first head portion 61, and the position corresponding to the other side region of the first head portion 61 It can be expected that the first substrate 11 can be prevented from being distorted by adopting a mode in which the surface on the other side of the first substrate 11 is exposed at the peripheral edge of the first substrate 11. Further, as shown in FIG. 21,
  • the first exposed portion 150 is provided to include the peripheral edge of the position corresponding to the other side region of the first pillar portion 62 to which heat is particularly easily transmitted, and the other side of the first pillar portion 62
  • the first substrate 11 can be prevented from being distorted.
  • the first exposed portion 150 is provided so as to include the periphery of the position corresponding to the other side region of the second head portion 71, and the position corresponding to the other side region of the second head portion 71.
  • the first exposed portion 150 is provided to include the periphery of the position corresponding to the other side region of the second column 72 which is particularly easy to transmit heat, and the other side of the second column 72 By adopting a mode in which the surface on the other side of the first substrate 11 is exposed at the periphery of the position corresponding to the region, it can be expected that the first substrate 11 can be prevented from being distorted.
  • first electronic element 13 and the second electronic element 23 are provided on the other side of the second substrate 21 with the non-connecting conductor layer 50 which is not electrically connected to be pressed by a mold. Good. By providing such a non-connecting conductor layer 50, warpage of the second substrate 21 can be prevented. Also, as shown in FIG. 24, a plurality of first exposed portions 150 may be provided.
  • the first heat dissipation layer 19 has the first exposed portion 150 that exposes the first substrate 11 at a position corresponding to the other side region of the connecting members 60 and 70, and the second heat dissipation layer 29 is connected A second exposed portion 140 which exposes the second substrate 21 at a position corresponding to one side region of the body 60, 70 is provided.
  • any of the aspects described in the above embodiments can be adopted. About the member demonstrated by said each embodiment, it demonstrates using the same code
  • Various modes can be considered as a combination of the modes adopted for the first exposed portion 150 and the second exposed portion 140.
  • the first exposed portion 150 is a first column portion
  • the surface on the other side of the first substrate 11 may be exposed at a part of the position corresponding to the other side area of the surface 62.
  • the first exposed portion 150 is the first head portion 61.
  • the surface on the other side of the first substrate 11 may be exposed at all of the positions corresponding to the other side region of the substrate.
  • the first exposed portion 150 of the first column portion 62 It may be provided to include the peripheral edge of the position corresponding to the other side region.
  • the second exposed portion 140 is provided so as to include the peripheral edge of the position corresponding to the one side region of the second head portion 71, and the first exposed portion 150 is at the position corresponding to the other side region of the first column portion 62.
  • the other surface of the first substrate 11 may be exposed in all.
  • the aspect adopted for the first exposed portion 150 and the second exposed portion 140 may be the same, and the second exposed portion 140 corresponds to the one side region of the second head portion 71 in all the first positions.
  • the surface of the other side of the first substrate 11 may be exposed at all of the positions where the first exposed portion 150 corresponds to the other side region of the first head portion 61 while exposing the surface of the one side of the two substrates 21 .
  • the second exposed portion 140 exposes the surface on one side of the second substrate 21 at a part of the position corresponding to the one side region of the second column portion 72
  • the first exposed portion 150 corresponds to the first column portion 62.
  • the surface on the other side of the first substrate 11 may be exposed at a part of the position corresponding to the other side region of the substrate.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

Le module électronique d'après la présente invention comprend : une première couche de rayonnement de chaleur (19) ; un premier substrat (11) ; un premier élément électronique (13) ; un second élément électronique (23) ; un second substrat (21) ; une seconde couche de rayonnement de chaleur (29) ; une partie d'étanchéité (90) ; et des connecteurs (60, 70) situés entre le premier élément électronique (13) et le second élément électronique (23) ou entre le second élément électronique (23) et le second substrat (21). La première couche de rayonnement de chaleur (19) comprend une première partie d'exposition (150) qui se situe en une position correspondant à une autre région latérale des connecteurs (60, 70) et au niveau de laquelle le premier substrat (11) est exposé, ou la seconde couche de rayonnement de chaleur (29) comprend une seconde partie d'exposition (140) qui se situe en une position correspondant à une région latérale des connecteurs (60, 70) et au niveau de laquelle le second substrat (21) est exposé.
PCT/JP2018/001167 2018-01-17 2018-01-17 Module électronique WO2019142256A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2018/001167 WO2019142256A1 (fr) 2018-01-17 2018-01-17 Module électronique
JP2019566025A JP7018459B2 (ja) 2018-01-17 2018-01-17 電子モジュール

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2018/001167 WO2019142256A1 (fr) 2018-01-17 2018-01-17 Module électronique

Publications (1)

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WO2019142256A1 true WO2019142256A1 (fr) 2019-07-25

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008235852A (ja) * 2007-02-23 2008-10-02 Hitachi Metals Ltd セラミックス基板及びこれを用いた半導体モジュール
WO2014132397A1 (fr) * 2013-02-28 2014-09-04 新電元工業株式会社 Module, ensemble module, et procédé de fabrication de module
WO2016174697A1 (fr) * 2015-04-28 2016-11-03 新電元工業株式会社 Module semi-conducteur et son procédé de production
JP2017017297A (ja) * 2015-07-07 2017-01-19 株式会社リコー 半導体装置及びレーザ装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008235852A (ja) * 2007-02-23 2008-10-02 Hitachi Metals Ltd セラミックス基板及びこれを用いた半導体モジュール
WO2014132397A1 (fr) * 2013-02-28 2014-09-04 新電元工業株式会社 Module, ensemble module, et procédé de fabrication de module
WO2016174697A1 (fr) * 2015-04-28 2016-11-03 新電元工業株式会社 Module semi-conducteur et son procédé de production
JP2017017297A (ja) * 2015-07-07 2017-01-19 株式会社リコー 半導体装置及びレーザ装置

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JP7018459B2 (ja) 2022-02-10
JPWO2019142256A1 (ja) 2020-10-22

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