WO2019142256A1

WO2019142256A1 - Electronic module

Info

Publication number: WO2019142256A1
Application number: PCT/JP2018/001167
Authority: WO
Inventors: 康亮池田; 理松嵜
Original assignee: 新電元工業株式会社
Priority date: 2018-01-17
Filing date: 2018-01-17
Publication date: 2019-07-25
Also published as: JP7018459B2; JPWO2019142256A1

Abstract

This electronic module has: a first heat radiation layer 19; a first substrate 11; a first electronic element 13; a second electronic element 23; a second substrate 21; a second heat radiation layer 29; a sealing part 90; and connectors 60, 70 provided between the first electronic element 13 and the second electronic element 23 or between the second electronic element 23 and the second substrate 21. The first heat radiation layer 19 has a first exposure portion 150 which is at a position corresponding to another side region of the connectors 60, 70, and at which the first substrate 11 is exposed, or the second heat radiation layer 29 has a second exposure portion 140 which is at a position corresponding to one side region of the connectors 60, 70 and at which the second substrate 21 is exposed.

Description

Electronic module

The present invention relates to an electronic module including an electronic element in a sealing portion and having a heat dissipation layer.

An electronic module in which a plurality of electronic elements are provided in a sealing resin is conventionally known (see, for example, JP-A-2014-45157). There is a need for more electronic devices in such electronic modules.

As means for providing more electronic elements, it is conceivable to adopt an aspect in which the electronic elements are stacked in layers. In that case, it is conceivable to provide another electronic element (second electronic element) on one side (for example, the front surface side) of the electronic element (first electronic element).

When the number of electronic devices is further increased, the size in the plane direction of the first substrate and the second substrate is increased. As described above, when the size in the plane direction of the first substrate and the second substrate is increased, the first substrate and the second substrate may be warped in the heat treatment process.

On the other hand, a first insulating substrate, a first conductor layer provided on the mounting surface of the first insulating substrate, a first power device provided on the first conductor layer, and a first power device connected A first member having one connection portion, a second insulating substrate, a second conductor layer provided on the mounting surface of the second insulating substrate, and a second power device provided in the second conductor layer A semiconductor module having a second member having a second connection portion connected to the second power device, and a conductor post extending in the vertical direction between the first member and the second member; It is proposed in publication 2016/174698. In this aspect, the first power device and the second power device are disposed to face each other, and are connected to each other by a conductor post.

According to the inventors of the present invention, it was found that in the heat treatment process when pouring the sealing resin, etc., the substrate is distorted starting from the place where the heat is easily transmitted, that is, the conductor column in International Publication No. 2016/174698.

The present invention has been made in view of such a point, and provides an electronic module capable of preventing distortion in a substrate, in particular, distortion of the substrate starting from a connecting body such as a conductor post.

[Concept 1]
The electronic module according to the invention is
The first heat radiation layer,
A first substrate provided on one side of the first heat radiation layer;
A first electronic element provided on one side of the first substrate;
A second electronic device provided on one side of the first electronic device;
A second substrate provided on one side of the second electronic device;
A second heat dissipation layer provided on one side of the second substrate;
A sealing portion for sealing at least the first electronic element and the second electronic element;
A connector provided between the first electronic device and the second electronic device or between the second electronic device and the second substrate;
Equipped with
The first heat dissipation layer has a first exposed portion to which the first substrate is exposed at a position corresponding to the other side area of the connection body, or the second heat dissipation layer corresponds to one side area of the connection body It may have a 2nd exposure part to which the 2nd substrate is exposed in a position.

[Concept 2]
In an electronic module according to concept 1 of the invention
The first exposed portion includes only a part of the position corresponding to the other side region of the connector, or
The second exposed portion may include only a part of the position corresponding to the one side region of the connection body.

[Concept 3]
In an electronic module according to concept 1 of the invention
The first exposed portion includes all of the positions corresponding to the other side region of the connector, or
The second exposed portion may include all of the positions corresponding to the one side region of the connection body.

[Concept 4]
In an electronic module according to concept 1 of the invention
The first exposed portion includes a peripheral edge of a position corresponding to the other side region of the connector, or
The second exposed portion may include a peripheral edge at a position corresponding to the one side region of the connection body.

[Concept 5]
In an electronic module according to the concepts 1 to 4 of the invention,
A plurality of the connectors are provided,
An exposed portion corresponding to each of the connectors may be provided.

[Concept 6]
In an electronic module according to the concepts 1 to 5 of the invention,
The connection body is a first connection body provided between the first electronic element and the second electronic element, and a second connection body provided between the second electronic element and the second substrate. Have and
The first heat dissipation layer has a first exposed portion at which the first substrate is exposed at a position corresponding to the other side region of the first connection body, or the second heat dissipation layer is on one side of the second connection body You may have a 2nd exposure part which the said 2nd board | substrate exposes in the position corresponding to an area | region.

[Concept 7]
In an electronic module according to the concepts 1 to 6 of the invention,
The connection body includes a head portion and a pillar portion extending from the head portion in the thickness direction of the head portion.
The first heat dissipation layer has a first exposed portion where the first substrate is exposed at all of the positions corresponding to the other side region of the pillar portion, or the second heat dissipation layer is formed on one side region of the pillar portion The second substrate may have a second exposed portion where the second substrate is exposed at all of the corresponding positions.

[Concept 8]
In an electronic module according to the concepts 1 to 6 of the invention,
The connection body includes a head portion and a pillar portion extending from the head portion in the thickness direction of the head portion.
The first heat dissipation layer has a first exposed portion where the first substrate is exposed at the periphery of a position corresponding to the other side region of the pillar portion, or the second heat dissipation layer is formed on one side region of the pillar portion It may have a 2nd exposure part which the 2nd substrate exposes in the circumference of a corresponding position.

In the present invention, the first substrate is exposed in the other side region of the connection body to which heat is transmitted in the first heat dissipation layer, or the second substrate is exposed to the one side area of the connection body in which heat is easily transmitted When the aspect which a board | substrate exposes is employ | adopted, it can prevent that a 1st board | substrate or a 2nd board | substrate is distorted from the position in the surface direction of a connection body as a starting point.

FIG. 1 is a side sectional view of an electronic module that can be used in the first embodiment of the present invention. FIG. 2 is a plan view of an electronic module that can be used in the first embodiment of the present invention, and is a plan view showing the relationship between the second connection body and the second exposed portion. FIG. 3 is an aspect different from the aspect shown in FIG. 2 and is a plan view of an electronic module that can be used in the first embodiment of the present invention, wherein the relationship between the second connector and the second exposed portion It is the top view which showed. FIG. 4 is an aspect different from the aspect shown in FIGS. 2 and 3 and is a plan view of an electronic module that can be used in the first embodiment of the present invention, wherein the second connecting member and the second exposed portion It is the top view which showed the relationship between and. FIG. 5 is a plan view of an electronic module that can be used in the first embodiment of the present invention, and is a plan view showing the relationship between the first connector and the second exposed portion. FIG. 6 is an aspect different from the aspect shown in FIG. 5 and is a plan view of an electronic module that can be used in the first embodiment of the present invention, wherein the relationship between the first connector and the second exposed portion It is the top view which showed. FIG. 7 is an aspect different from the aspect shown in FIGS. 5 and 6, and is a plan view of an electronic module that can be used in the first embodiment of the present invention, wherein the first connecting member and the second exposed portion It is the top view which showed the relationship between and. FIG. 8 is an aspect different from the aspect shown in FIGS. 2 to 4 and is a plan view of an electronic module that can be used in the first embodiment of the present invention, wherein the second connecting member and the second exposed portion It is the top view which showed the relationship between and. FIG. 9 is an aspect different from the aspect shown in FIG. 2 to FIG. 4 and FIG. 8 and is a plan view of an electronic module that can be used in the first embodiment of the present invention. It is the top view which showed the relationship with 2 exposure parts. FIG. 10 is an aspect different from the aspect shown in FIGS. 5 to 7 and is a plan view of an electronic module that can be used in the first embodiment of the present invention, wherein the first connecting member and the second exposed portion It is the top view which showed the relationship between and. FIG. 11 is an aspect different from the aspect shown in FIG. 5 to FIG. 7 and FIG. 10, and is a plan view of an electronic module which can be used in the first embodiment of the present invention. It is the top view which showed the relationship with 2 exposure parts. FIG. 12 is a plan view of an electronic module that can be used in the first embodiment of the present invention, showing a mode in which a plurality of second exposed portions are provided. FIG. 13 is a side sectional view of an electronic module that can be used in the second embodiment of the present invention. FIG. 14 is a plan view of an electronic module that can be used in the second embodiment of the present invention, and is a plan view showing the relationship between the first connector and the first exposed portion. FIG. 15 is an aspect different from the aspect shown in FIG. 14 and is a plan view of an electronic module that can be used in the second embodiment of the present invention, wherein the relationship between the first connector and the first exposed portion It is the top view which showed. FIG. 16 is an aspect different from the aspect shown in FIGS. 14 and 15, and is a plan view of an electronic module that can be used in the second embodiment of the present invention, wherein the first connecting member and the first exposed portion It is the top view which showed the relationship between and. FIG. 17 is a plan view of an electronic module that can be used in the second embodiment of the present invention, and is a plan view showing the relationship between the second connection body and the first exposed portion. FIG. 18 is a plan view different from the mode shown in FIG. 17 and is a plan view of an electronic module that can be used in the second embodiment of the present invention, wherein the relationship between the second connection body and the first exposed portion It is the top view which showed. FIG. 19 is an aspect different from the aspect shown in FIGS. 17 and 18, and is a plan view of an electronic module which can be used in the second embodiment of the present invention, wherein the second connecting member and the first exposed portion It is the top view which showed the relationship between and. FIG. 20 is an aspect different from the aspect shown in FIGS. 14 to 16 and is a plan view of an electronic module that can be used in the second embodiment of the present invention, wherein the first connecting member and the first exposed portion It is the top view which showed the relationship between and. FIG. 21 is an aspect different from the aspect shown in FIG. 14 to FIG. 16 and FIG. 20, and is a plan view of an electronic module that can be used in the first embodiment of the present invention. It is the top view which showed the relationship with one exposure part. FIG. 22 is an aspect different from the aspect shown in FIGS. 17 to 19 and is a plan view of an electronic module that can be used in the second embodiment of the present invention, wherein the second connecting member and the first exposed portion It is the top view which showed the relationship between and. FIG. 23 is an aspect different from the aspect shown in FIG. 17 to FIG. 19 and FIG. 22 and is a plan view of an electronic module that can be used in the second embodiment of the present invention. It is the top view which showed the relationship with one exposure part. FIG. 24 is a plan view of an electronic module that can be used in the second embodiment of the present invention, showing a mode in which a plurality of first exposed portions are provided.

First Embodiment << Configuration >>
In the present embodiment, “one side” means the upper side of FIG. 1 and “other side” means the lower side of FIG. The vertical direction in FIG. 1 is referred to as the “first direction”, the horizontal direction is referred to as the “third direction”, and the front and back direction of the paper surface is referred to as the “second direction”. An in-plane direction including the second direction and the third direction is referred to as “in-plane direction”, and when viewed from one side to the other side, referred to as “plan view”, viewed from the other side to the one side. When it is called "bottom view".

As shown in FIG. 1, the electronic module includes a first heat dissipation layer 19, a first substrate 11 provided on one side of the first heat dissipation layer 19, and a first conductor provided on one side of the first substrate 11. Layer 12, first electronic element 13 provided on one side of first conductor layer 12, second electronic element 23 provided on one side of first electronic element 13, and one side of second electronic element 23 , A second substrate 21 provided on one side of the second conductor layer 22, a second heat dissipation layer 29 provided on one side of the second substrate 21, and a first electron A sealing portion 90 made of a sealing resin or the like for sealing the element 13 and the second electronic element 23 may be included.

Both or any one of the first conductor layer 12 and the second conductor layer 22 may be connected to the terminal portion 100, and the tip end side of the terminal portion 100 is exposed to the outside of the sealing portion 90, and the control substrate etc. It may be connectable to an external device of The terminal unit 100 may have a first terminal unit 110 and a second terminal unit 120. The first terminal portion 110 includes a first terminal portion base end portion 111, a first terminal portion outer portion 113 exposed at least partially from the sealing portion 90, a first terminal portion base end portion 111, and a first terminal. It may be provided between the part outer direction part 113, and may have the 1st bending part 112 bent on the other side by the 1st terminal-part proximal-end part 111 side. The second terminal portion 120 includes a second terminal portion base end portion 121, a second terminal portion outer portion 123 exposed at least partially from the sealing portion 90, a second terminal portion base end portion 121, and a second terminal. It may be provided between the part outer direction part 123, and may have the 2nd bending part 122 bent to one side by the 2nd terminal part base end part 121 side.

On one side of the first substrate 11, a non-connecting conductor layer 50 which is not electrically connected to the first electronic element 13 and the second electronic element 23, which is pressed by a mold when resin sealing is provided Also good (see Figure 2).

The electronic module of the present embodiment may have connectors 60 and 70. The connection bodies 60 and 70 are provided on the opposite side of the first connection body 60 provided between the first electronic element 13 and the second electronic element 23 and the first connection body 60 of the second electronic element 23. The second connector 70 may be included. In the present embodiment, an embodiment in which the first connection body 60 and the second connection body 70 are provided will be described, but the present invention is not limited to such an aspect, and the first connection body 60 and the second connection body 70 are described. Only one of them may be provided.

The connecting members 60 and 70 may have

head portions

61 and 71 and

pillar portions

62 and 72 extending from the

head portions

61 and 71 in the thickness direction (first direction) of the

head portions

61 and 71. In the aspect in which the connecting members 60 and 70 include the first connecting member 60 and the second connecting member 70, the first connecting member 60 includes the first head portion 61 and the thickness direction of the first head portion 61 from the first head portion 61. And the first post portion 62 extending in the In addition, the second connection body 70 may have a second head portion 71 and a second pillar portion 72 extending from the second head portion 71 in the thickness direction of the second head portion 71.

You may have the 2nd exposure part 140 which exposes the surface of one side of the 2nd board | substrate 21 in the position where the 2nd thermal radiation layer 29 respond | corresponds to one side area | region of the connection bodies 60 and 70. FIG. On the other hand, the first heat radiation layer 19 may be configured not to expose the first substrate 11 at a position corresponding to the other side region of the connection body 60, 70. The “position corresponding to the one side area” of the connection body 60, 70 is a position (area) included when a straight line is drawn along the first direction from the connection body 60, 70 to the one side, and the connection body The “position corresponding to the other side area” of 60 and 70 is a position (area) included when a straight line is drawn along the first direction from the connecting body 60 and 70 to the other side. For this reason, having the second exposed portion 140 which exposes the surface on one side of the second substrate 21 at a position where the second heat dissipation layer 29 corresponds to the one side region of the connection body 60, 70 is a plan view (or bottom surface) Connection means that the connecting members 60 and 70 and the second exposed portion 140 overlap with each other at least in part, and the first heat dissipation layer 19 is connected to the connecting members 60 and 70 as in the second embodiment described later. Having the first exposed portion 150 that exposes the other surface of the first substrate 11 at a position corresponding to the other side region of the connector 11 in the bottom view (or plan view) It means that 150 and at least partially overlap.

The second exposed portion 140 may include only a part of the position corresponding to the one side region of the connecting members 60 and 70. In other words, in plan view, the second exposed portion 140 is only a portion of the connecting members 60 and 70. May be included. Thus, when including only a part of the position corresponding to the one side area of the connectors 60 and 70, the second exposed portion 140 includes the periphery of the position corresponding to the one side area of the connectors 60 and 70. May be provided. Moreover, it is not restricted to such an aspect, The 2nd exposure part 140 may be made to include all the positions corresponding to the one side area | region of the connection bodies 60 and 70. As shown in FIG.

The second exposed portion 140 may expose the surface on one side (upper surface in FIG. 1) of the second substrate 21 at all or part of the position corresponding to the one side region of the first column portion 62, or The surface on one side of the second substrate 21 may be exposed at all or part of the position corresponding to the one side region of the one head portion 61. Alternatively, the surface on one side of the second substrate 21 may be exposed at all or part of the position corresponding to the one side region of the second pillar portion 72, or corresponds to the one side region of the second head portion 71. The surface on one side of the second substrate 21 may be exposed at all or part of the position.

In the aspect shown in FIG. 2, one side of the second substrate 21 is a part of the position corresponding to one side region of the second column portion 72 and one side region of the second head portion 71. The top surface (upper surface in FIG. 1) is exposed. In other words, in the aspect illustrated in FIG. 2, the second exposed portion 140 is provided so as to include all of the second pillar portion 72 and a portion of the second head portion 71 in a plan view.

In the mode shown in FIG. 3, all the positions corresponding to the one side area of the second head portion 71 are exposed, and the second exposed portion 140 is provided so as to include the entire second head portion 71 in a plan view. There is. In the mode shown in FIG. 4, a part of the position corresponding to the one side region of the second pillar 72 is exposed, and the second exposed part 140 is provided so as to include a part of the second pillar 72 in plan view. It is done.

In the aspect shown in FIG. 5, one side of the second substrate 21 is a part of the position corresponding to one side area of the first column portion 62 and one side area of the first head part 61. The top surface (upper surface in FIG. 1) is exposed. In other words, in the aspect illustrated in FIG. 5, the second exposed portion 140 is provided so as to include all of the first column portion 62 and a portion of the first head portion 61 in plan view.

In the mode shown in FIG. 6, all of the positions corresponding to the one side area of the first head portion 61 are exposed, and the second exposed portion 140 is provided so as to include the entire first head portion 61 in plan view. There is. In the mode shown in FIG. 7, a part of the position corresponding to the one side region of the first pillar 62 is exposed, and the second exposed part 140 is provided so as to include a part of the first pillar 62 in plan view. It is done.

When the second exposed portion 140 is provided so as to include the peripheral edge of the position corresponding to the one side region of the connection body 60, 70, the second exposed portion 140 corresponds to the one side region of the first column portion 62. It may be provided to include the peripheral edge of the position, or may be provided to include the peripheral edge of the position corresponding to the one side region of the first head portion 61. In addition, the second exposed portion 140 may be provided so as to include the peripheral edge of the position corresponding to the one side region of the second column 72, or the peripheral edge of the position corresponding to the one side region of the second head portion 71. May be provided.

In the aspect shown in FIG. 8, the second exposed portion 140 is provided so as to include the peripheral edge of the position corresponding to the one side region of the second pillar portion 72, and the second exposed portion 140 is provided at the center of the one side region of the second pillar portion 72 The surface on one side of the substrate 21 is not exposed. In other words, in the aspect illustrated in FIG. 8, the second exposed portion 140 is provided so as to include the periphery of the second column 72 and not include the center of the second column 72 in a plan view.

In the aspect shown in FIG. 9, the second exposed portion 140 is provided so as to include the periphery of the position corresponding to the one side region of the second head portion 71, and the center of the one side region of the second head portion 71 and the second The surface on one side of the second substrate 21 is not exposed in the one side region of the column portion 72. In other words, in the aspect illustrated in FIG. 9, the second exposed portion 140 includes the periphery of the second head portion 71 and does not include the center of the second head portion 71 and the second pillar portion 72 in plan view. Is provided.

In the mode shown in FIG. 10, the second exposed portion 140 is provided so as to include the peripheral edge of the position corresponding to the one side region of the first pillar portion 62, and the second exposed portion 140 is second at the center of the one side region of the first pillar portion 62. The surface on one side of the substrate 21 is not exposed. In other words, in the aspect illustrated in FIG. 10, the second exposed portion 140 is provided so as to include the peripheral edge of the first pillar 62 and not include the center of the first pillar 62 in a plan view.

In the aspect shown in FIG. 11, the second exposed portion 140 is provided so as to include the periphery of the position corresponding to the one side region of the first head portion 61, and the center of the one side region of the first head portion 61 and the first The surface on one side of the second substrate 21 is not exposed in the one side region of the column portion 62. In other words, in the aspect illustrated in FIG. 11, the second exposed portion 140 includes the periphery of the first head portion 61 and does not include the center of the first head portion 61 and the first pillar portion 62 in plan view. Is provided.

As shown in FIG. 12, a plurality of connectors 60 and 70 may be provided in the in-plane direction. In this case, the second exposed portion 140 corresponding to each of the connectors 60 and 70 may be provided. The present invention is not limited to such an aspect, and the second exposed portion 140 corresponding to only a part of the connectors 60 and 70 may be provided.

As shown in FIG. 1, a plurality of first conductor layers 12 may be provided on one side of the first substrate 11. Each or any one of the first electronic element 13 and the second electronic element 23 may be a switching element or a control element. A MOSFET, an IGBT or the like may be used as the switching element. Each of the first electronic element 13 and the second electronic element 23 may be composed of a semiconductor element, and the semiconductor material may be silicon, silicon carbide, gallium nitride or the like.

A conductive adhesive (not shown) such as solder is provided between the first electronic element 13 and the first connection body 60, and the first electronic element 13 and the first connection body 60 are connected via the conductive adhesive. May be connected. Similarly, a conductive adhesive (not shown) such as solder is provided between the first connection body 60 and the second electronic element 23, and the first connection body 60 and the second electronic element 23 are conductively bonded. It may be connected via an agent. Similarly, a conductive adhesive (not shown) such as a solder is provided between the second electronic element 23 and the second connection body 70, and the second electronic element 23 and the second connection body 70 have a conductive adhesive. It may be connected via an agent.

As the first substrate 11 and the second substrate 21, an insulating substrate such as a ceramic substrate or an insulating resin layer can be employed. As the conductive adhesive, other than solder, a material having Ag or Cu as a main component can also be used. As a material of the first connection body 60 and the second connection body 70, a metal such as Cu can be used. For example, a metal substrate subjected to circuit patterning can be used as the

substrates

11 and 21. In this case, the

substrates

11 and 21 also serve as the conductor layers 12 and 22, respectively.

When the first electronic element 13 is a switching element such as a MOSFET, as shown in FIG. 1, the first gate electrode 13 g and the first source electrode 13 s are provided on the surface (surface on one side) of the first connection body 60. May be provided. When the second electronic element 23 is a switching element such as a MOSFET, even if the second gate electrode 23g and the second source electrode 23s are provided on the surface (surface on one side) on the second connection body 70 side. Good. In this case, the second connection body 70 may be connected to the second source electrode 23s of the second electronic element 23 via a conductive adhesive. In addition, a second drain electrode in which the first connection body 60 is provided on the surface (the surface on the other side) of the first source electrode 13 s of the first electronic element 13 and the second connection body 70 of the second electronic element 23. 23 d may be connected via a conductive adhesive. A first drain electrode 13d is provided on the surface of the first electronic element 13 opposite to the first connection body 60 (the surface on the other side), and the first drain electrode 13d includes the first conductor layer 12 and a conductive adhesive. It may be connected via. The first gate electrode 13 g may be connected to the connector 30 via a conductive adhesive, and the connector 30 may be connected to the first conductor layer 12 via a conductive adhesive. The second gate electrode 23 g may be connected to the connector 40 via a conductive adhesive, and the connector 40 may be connected to the second conductor layer 22 via a conductive adhesive.

The bonding between the terminal portion 100 and the conductor layers 12 and 22 may be performed not only by using a conductive adhesive such as solder, but also by laser welding or ultrasonic bonding.

<< Operation / Effect >>
Next, an example of the operation and effect according to the present embodiment configured as described above will be described. In addition, all the aspects demonstrated by "the effect | action and effect" are employable by the said structure.

In the present embodiment, in the case where the second substrate 21 is exposed in the one side region of the connection body 60, 70 in the second heat dissipation layer 29 to which heat is easily transmitted, the in-plane of the connection body 60, 70 is employed. It is possible to prevent the second substrate 21 from being distorted from the position in the direction.

In the case of adopting a mode in which a non-connecting conductor layer 50 not electrically connected to be pressed by a mold is provided on one side of the first substrate 11 to the first electronic element 13 and the second electronic element 23, non-connection Since the conductor layer 50 is pressed by the mold, warpage of the first substrate 11 can be prevented.

When an embodiment is adopted in which the first heat radiation layer 19 is configured not to expose the first substrate 11 at a position corresponding to the other side region of the connection body 60, 70, a mold is formed via the non-connection conductor layer 50. It is possible to suppress the reduction of the heat radiation effect by reducing the area (area) of the first heat radiation layer 19 on the side of the first substrate 11 in which distortion is unlikely to occur by pressing.

The second exposed portion 140 exposes the surface on one side of the second substrate 21 at all (see FIG. 3) or a part (see FIGS. 2 and 4) of the position corresponding to the one side region of the second head portion 71. It is expected that the second substrate 21 can be prevented from being distorted by exposing the surface on one side of the second substrate 21 in the region corresponding to the second connection body 70 to which heat is easily transmitted. it can.

A mode in which the second exposed portion 140 exposes the surface on one side of the second substrate 21 at all (see FIG. 2) or a part (see FIG. 4) of the position corresponding to the one side region of the second column 72 When employed, it is expected that the second substrate 21 can be efficiently prevented from being distorted by exposing the surface on one side of the second substrate 21 particularly in the region corresponding to the second column portion 72 where heat is easily transmitted. it can. In addition, while exposing the surface on one side of the second substrate 21 only by a part of the position corresponding to the one side region of the second head portion 71, all or the position corresponding to the one side region of the second pillar portion 72 In the case of adopting a mode in which the surface of one side of the second substrate 21 is exposed in part, the second substrate 21 is distorted while the reduction of the heat radiation effect due to the reduction of the area of the second heat dissipation layer 29 is reduced. Can be prevented efficiently.

The second exposed portion 140 exposes the surface on one side of the second substrate 21 at all (see FIG. 6) or a portion (see FIGS. 5 and 7) of the position corresponding to the one side region of the first head portion 61. In the case where the second substrate 21 is exposed, it is expected that the second substrate 21 can be prevented from being distorted by exposing the surface on one side of the second substrate 21 in the region corresponding to the first connection body 60 where heat is easily transmitted. it can.

A mode in which the second exposed portion 140 exposes the surface on one side of the second substrate 21 at all (see FIG. 5) or a part (see FIG. 7) of the positions corresponding to the one side region of the first column portion 62 When adopted, it is expected that the second substrate 21 can be efficiently prevented from being distorted by exposing the surface on one side of the second substrate 21 particularly in the region corresponding to the first column portion 62 where heat is easily transmitted. it can. Note that while the surface on one side of the second substrate 21 is exposed only by a part of the position corresponding to the one side area of the first head portion 61, all or the position corresponding to the one side area of the first column 62 In the case of adopting a mode in which the surface of one side of the second substrate 21 is exposed in part, the second substrate 21 is distorted while the reduction of the heat radiation effect due to the reduction of the area of the second heat dissipation layer 29 is reduced. Can be prevented efficiently.

As a result of experiments conducted by the inventor, it has been found that the distortion of the second substrate 21 can be eliminated in some cases by exposing the surface on one side of the second substrate 21 in the peripheral region of the connecting members 60 and 70.

For this reason, as shown in FIG. 9, the second exposed portion 140 is provided to include the periphery of the position corresponding to the one side region of the second head portion 71, and the position corresponding to the one side region of the second head portion 71. It can be expected that the second substrate 21 can be prevented from being distorted by adopting a mode in which the surface on one side of the second substrate 21 is exposed at the peripheral edge of the second substrate 21. In addition, as shown in FIG. 8, the second exposed portion 140 is provided to include the periphery of a position corresponding to one side region of the second column portion 72 to which heat is particularly easily transmitted. By adopting the aspect in which the surface on one side of the second substrate 21 is exposed at the periphery of the position corresponding to the region, it can be expected that the second substrate 21 can be prevented from being distorted.

Further, as shown in FIG. 11, the second exposed portion 140 is provided so as to include the peripheral edge of the position corresponding to the one side region of the first head portion 61, and the position corresponding to the one side region of the first head portion 61. By adopting a mode in which the surface on one side of the second substrate 21 is exposed at the periphery, it can be expected that the second substrate 21 can be prevented from being distorted. Further, as shown in FIG. 10, the second exposed portion 140 is provided to include the periphery of the position corresponding to the one side region of the first pillar portion 62 to which heat is particularly easily transmitted, and one side of the first pillar portion 62 By adopting the aspect in which the surface on one side of the second substrate 21 is exposed at the periphery of the position corresponding to the region, it can be expected that the second substrate 21 can be prevented from being distorted.

Second Embodiment Next, a second embodiment of the present invention will be described.

In the present embodiment, the first heat radiation layer 19 has a first exposed portion 150 that exposes the other side surface of the first substrate 11 at a position corresponding to the other side region of the connecting members 60 and 70. In the present embodiment, any aspect described in the first embodiment can be adopted. The members described in the first embodiment will be described using the same reference numerals.

The first exposed portion 150 may include only a part of the position corresponding to the other side area of the connection body 60, 70. Thus, when including only a part of the position corresponding to the other side region of the connectors 60, 70, the first exposed portion 150 includes the periphery of the position corresponding to the other side region of the connectors 60, 70. May be provided. Moreover, it is not restricted to such an aspect, the 1st exposure part 150 may be made to include all the positions corresponding to the other side area | region of the connection bodies 60 and 70. As shown in FIG.

The first exposed portion 150 may expose the other side surface (the lower surface in FIG. 13) of the first substrate 11 at all or part of the position corresponding to the other side region of the first column portion 62, or The surface on the other side of the first substrate 11 may be exposed at all or part of the position corresponding to the other side region of the one head portion 61. In addition, the surface on the other side of the first substrate 11 may be exposed at all or a part of the position corresponding to the other side region of the second pillar portion 72, or corresponds to the other side region of the second head portion 71 The other surface of the second substrate 21 may be exposed at all or part of the position.

In the mode shown in FIG. 14, one side of the second substrate 21 is a part of the position corresponding to one side area of the first column portion 62 and is one part of the position corresponding to one side area of the first head portion 61. The lower surface of FIG. 13 (the lower surface in FIG. 13) is exposed. In other words, in the aspect illustrated in FIG. 14, the first exposed portion 150 is provided so as to include the whole of the first column portion 62 and a portion of the first head portion 61 in a bottom view.

In the mode shown in FIG. 15, all the positions corresponding to one side area of the first head portion 61 are exposed, and the first exposed portion 150 is provided so as to include the entire first head portion 61 in plan view. There is. In the mode shown in FIG. 16, a part of the position corresponding to the one side region of the first pillar 62 is exposed, and the first exposed part 150 is provided to include a part of the first pillar 62 in a bottom view. It is done.

In the aspect shown in FIG. 17, one side of the second substrate 21 is a part of the position corresponding to one side area of the second column part 72 and the one side area of the second head part 71. The lower surface of FIG. 13 (the lower surface in FIG. 13) is exposed. In other words, in the aspect illustrated in FIG. 17, the first exposed portion 150 is provided so as to include all of the second column portion 72 and include a portion of the second head portion 71 in bottom view.

In the mode shown in FIG. 18, all of the positions corresponding to one side region of the second head portion 71 are exposed, and the first exposed portion 150 is provided to include the entire second head portion 71 in bottom view. There is. In the mode shown in FIG. 19, a part of the position corresponding to the one side region of the second pillar 72 is exposed, and the first exposed part 150 is provided so as to include a part of the second pillar 72 in a bottom view. It is done.

When the first exposed portion 150 is provided so as to include the peripheral edge of the position corresponding to the other side region of the connector 60, 70, the first exposed portion 150 corresponds to the other side region of the first column portion 62. It may be provided to include the peripheral edge of the position, or may be provided to include the peripheral edge of the position corresponding to the other side region of the first head portion 61. In addition, the first exposed portion 150 may be provided so as to include the periphery of the position corresponding to the other side region of the second pillar portion 72, or the position corresponding to the other side region of the second head portion 71. It may be provided to include the peripheral edge.

In the embodiment shown in FIG. 20, the first exposed portion 150 is provided so as to include the periphery of the position corresponding to the other side region of the first pillar portion 62, and the first exposed portion 150 is first at the center of the other side region of the first pillar portion 62. The other side of the substrate 11 is not exposed. In other words, in the aspect shown in FIG. 20, the first exposed portion 150 is provided so as to include the peripheral edge of the first pillar portion 62 and not include the center of the first pillar portion 62 in bottom view.

In the aspect shown in FIG. 21, the first exposed portion 150 is provided so as to include the periphery of the position corresponding to the other side region of the first head portion 61, and the center of the other side region of the first head portion 61 and the first The other side surface of the first substrate 11 is not exposed in the other side region of the column portion 62. In other words, in the aspect illustrated in FIG. 21, the first exposed portion 150 includes the periphery of the first head portion 61 and does not include the center of the first head portion 61 and the first column portion 62 in a bottom view. Is provided.

In the aspect shown in FIG. 22, the first exposed portion 150 is provided to include the peripheral edge of the position corresponding to the other side region of the second pillar portion 72, and the first exposed portion 150 is first at the center of the other side region of the second pillar portion 72. The other side of the substrate 11 is not exposed. In other words, in the aspect illustrated in FIG. 22, the first exposed portion 150 is provided so as to include the periphery of the second column 72 and not include the center of the second column 72 in a bottom view.

In the embodiment shown in FIG. 23, the first exposed portion 150 is provided so as to include the peripheral edge of the position corresponding to the other side region of the second head portion 71, and the center of the one side region of the second head portion 71 and the second In the other side region of the column portion 72, the surface on one side of the second substrate 21 is not exposed. In other words, in the embodiment shown in FIG. 23, the first exposed portion 150 includes the periphery of the second head portion 71 and does not include the center of the second head portion 71 and the second pillar portion 72 in a bottom view. Is provided.

The first exposed portion 150 exposes the other surface of the first substrate 11 at all (see FIG. 15) or a portion (see FIGS. 14 and 16) of the position corresponding to the other side region of the first head portion 61. In the case where an aspect to be caused is expressed, it is expected that the first substrate 11 can be prevented from being distorted by exposing the other surface of the first substrate 11 in the region corresponding to the first connection body 60 where heat is easily transmitted. it can.

A mode in which the first exposed portion 150 exposes the other side surface of the first substrate 11 at all (see FIG. 14) or a portion (see FIG. 16) of the positions corresponding to the other side region of the first column portion 62 When employed, it is expected that the first substrate 11 can be efficiently prevented from being distorted by exposing the surface on the other side of the first substrate 11 particularly in the region corresponding to the first column portion 62 where heat is easily transmitted. it can. Note that while the surface on the other side of the first substrate 11 is exposed only by a part of the position corresponding to the other side region of the first head portion 61, all or a position corresponding to the other side region of the first column portion 62 When a mode is adopted in which the surface on the other side of the first substrate 11 is partially exposed, the reduction of the heat radiation effect due to the reduction of the area of the second heat radiation layer 29 causes the first substrate 11 to be distorted. Can be expected to prevent.

The first exposed portion 150 exposes the other surface of the first substrate 11 at all (see FIG. 18) or a portion (see FIGS. 17 and 19) of the position corresponding to the other side region of the second head portion 71. In the case of the embodiment in which the first substrate 11 is exposed, it is expected that the first substrate 11 can be prevented from being distorted by exposing the other surface of the first substrate 11 in the region corresponding to the second connection body 70 where heat is easily transmitted it can.

A mode in which the first exposed portion 150 exposes the other surface of the first substrate 11 at all (see FIG. 17) or a portion (see FIG. 19) of the positions corresponding to the other side region of the second column 72. When adopted, it is expected that the first substrate 11 can be efficiently prevented from being distorted by exposing the surface on the other side of the first substrate 11 particularly in the region corresponding to the second column portion 72 where heat is easily transmitted. it can. Note that while the surface on the other side of the first substrate 11 is exposed only by a part of the position corresponding to the other side area of the second head portion 71, all or a position corresponding to the other side area of the second column 72 When a mode is adopted in which the surface on the other side of the first substrate 11 is partially exposed, the reduction of the heat radiation effect due to the reduction of the area of the second heat radiation layer 29 causes the first substrate 11 to be distorted. Can be expected to prevent.

As described above, it has been found from experiments by the inventor that distortion of the substrate may easily occur in the peripheral region of the connecting members 60 and 70.

Therefore, as shown in FIG. 21, the first exposed portion 150 is provided so as to include the peripheral edge of the position corresponding to the other side region of the first head portion 61, and the position corresponding to the other side region of the first head portion 61 It can be expected that the first substrate 11 can be prevented from being distorted by adopting a mode in which the surface on the other side of the first substrate 11 is exposed at the peripheral edge of the first substrate 11. Further, as shown in FIG. 20, the first exposed portion 150 is provided to include the peripheral edge of the position corresponding to the other side region of the first pillar portion 62 to which heat is particularly easily transmitted, and the other side of the first pillar portion 62 By adopting a mode in which the surface on the other side of the first substrate 11 is exposed at the periphery of the position corresponding to the region, it can be expected that the first substrate 11 can be prevented from being distorted.

Further, as shown in FIG. 23, the first exposed portion 150 is provided so as to include the periphery of the position corresponding to the other side region of the second head portion 71, and the position corresponding to the other side region of the second head portion 71. By adopting the aspect of exposing the surface on the other side of the first substrate 11 at the periphery, it can be expected that the first substrate 11 can be prevented from being distorted. Further, as shown in FIG. 22, the first exposed portion 150 is provided to include the periphery of the position corresponding to the other side region of the second column 72 which is particularly easy to transmit heat, and the other side of the second column 72 By adopting a mode in which the surface on the other side of the first substrate 11 is exposed at the periphery of the position corresponding to the region, it can be expected that the first substrate 11 can be prevented from being distorted.

In the present embodiment, even if the first electronic element 13 and the second electronic element 23 are provided on the other side of the second substrate 21 with the non-connecting conductor layer 50 which is not electrically connected to be pressed by a mold. Good. By providing such a non-connecting conductor layer 50, warpage of the second substrate 21 can be prevented. Also, as shown in FIG. 24, a plurality of first exposed portions 150 may be provided.

Third Embodiment Next, a third embodiment of the present invention will be described.

In the present embodiment, the first heat dissipation layer 19 has the first exposed portion 150 that exposes the first substrate 11 at a position corresponding to the other side region of the connecting members 60 and 70, and the second heat dissipation layer 29 is connected A second exposed portion 140 which exposes the second substrate 21 at a position corresponding to one side region of the body 60, 70 is provided. In the present embodiment, any of the aspects described in the above embodiments can be adopted. About the member demonstrated by said each embodiment, it demonstrates using the same code | symbol.

In the present embodiment, since the exposed portions are provided in each of the first heat dissipation layer 19 and the second heat dissipation layer 29, warpage occurs in each of the first heat dissipation layer 19 and the second heat dissipation layer 29. Can be expected to suppress

Various modes can be considered as a combination of the modes adopted for the first exposed portion 150 and the second exposed portion 140.

As an example, while the second exposed portion 140 exposes the surface on one side of the second substrate 21 at all of the positions corresponding to the one side region of the second head portion 71, the first exposed portion 150 is a first column portion The surface on the other side of the first substrate 11 may be exposed at a part of the position corresponding to the other side area of the surface 62. In addition, while the second exposed portion 140 exposes the surface on one side of the second substrate 21 at a part of the position corresponding to the one side region of the second column portion 62, the first exposed portion 150 is the first head portion 61. The surface on the other side of the first substrate 11 may be exposed at all of the positions corresponding to the other side region of the substrate.

In addition, while the second exposed portion 140 exposes the surface on one side of the second substrate 21 at all of the positions corresponding to the one side region of the second head portion 71, the first exposed portion 150 of the first column portion 62 It may be provided to include the peripheral edge of the position corresponding to the other side region. In addition, the second exposed portion 140 is provided so as to include the peripheral edge of the position corresponding to the one side region of the second head portion 71, and the first exposed portion 150 is at the position corresponding to the other side region of the first column portion 62. The other surface of the first substrate 11 may be exposed in all.

Also, the aspect adopted for the first exposed portion 150 and the second exposed portion 140 may be the same, and the second exposed portion 140 corresponds to the one side region of the second head portion 71 in all the first positions. The surface of the other side of the first substrate 11 may be exposed at all of the positions where the first exposed portion 150 corresponds to the other side region of the first head portion 61 while exposing the surface of the one side of the two substrates 21 . In addition, while the second exposed portion 140 exposes the surface on one side of the second substrate 21 at a part of the position corresponding to the one side region of the second column portion 72, the first exposed portion 150 corresponds to the first column portion 62. The surface on the other side of the first substrate 11 may be exposed at a part of the position corresponding to the other side region of the substrate.

The description of the above-described embodiments and the disclosure of the drawings are merely an example for describing the invention described in the claims, and the disclosure of the embodiments described above or the disclosure of the drawings may be included in the claims. The invention is not limited. Further, the description of the claims at the beginning of the application is merely an example, and the description of the claims can be changed as appropriate based on the description of the specification, the drawings and the like.

11 first substrate 13 first electronic element 19 first heat radiation layer 21 second substrate 23 second electronic element 29 second heat radiation layer 50 non-connection conductor layer 60 first connection body (connection body)
70 Second connection (connection)
90 sealing portion 140 second exposed portion 150 first exposed portion

Claims

The first heat radiation layer,
A first substrate provided on one side of the first heat radiation layer;
A first electronic element provided on one side of the first substrate;
A second electronic device provided on one side of the first electronic device;
A second substrate provided on one side of the second electronic device;
A second heat dissipation layer provided on one side of the second substrate;
A sealing portion for sealing at least the first electronic element and the second electronic element;
A connector provided between the first electronic device and the second electronic device or between the second electronic device and the second substrate;
Equipped with
The first heat dissipation layer has a first exposed portion to which the first substrate is exposed at a position corresponding to the other side area of the connection body, or the second heat dissipation layer corresponds to one side area of the connection body An electronic module having a second exposed portion where the second substrate is exposed at a position.
The first exposed portion includes only a part of the position corresponding to the other side region of the connector, or
The electronic module according to claim 1, wherein the second exposed portion includes only a part of the position corresponding to the one side region of the connection body.
The first exposed portion includes all of the positions corresponding to the other side region of the connector, or
The electronic module according to claim 1, wherein the second exposed portion includes the entire position corresponding to the one side region of the connection body.
The first exposed portion includes a peripheral edge of a position corresponding to the other side region of the connector, or
The electronic module according to claim 1, wherein the second exposed portion includes a peripheral edge of a position corresponding to the one side region of the connection body.
A plurality of the connectors are provided,
The electronic module according to claim 1, wherein an exposed portion corresponding to each of the connectors is provided.
The connection body is a first connection body provided between the first electronic element and the second electronic element, and a second connection body provided between the second electronic element and the second substrate. Have and
The first heat dissipation layer has a first exposed portion at which the first substrate is exposed at a position corresponding to the other side region of the first connection body, or the second heat dissipation layer is on one side of the second connection body The electronic module according to claim 1, further comprising a second exposed portion that exposes the second substrate at a position corresponding to the region.
The connection body includes a head portion and a pillar portion extending from the head portion in the thickness direction of the head portion.
The first heat dissipation layer has a first exposed portion where the first substrate is exposed at all of the positions corresponding to the other side region of the pillar portion, or the second heat dissipation layer is formed on one side region of the pillar portion The electronic module according to claim 1, further comprising a second exposed portion in which the second substrate is exposed at all of the corresponding positions.
The connection body includes a head portion and a pillar portion extending from the head portion in the thickness direction of the head portion.
The first heat dissipation layer has a first exposed portion where the first substrate is exposed at the periphery of a position corresponding to the other side region of the pillar portion, or the second heat dissipation layer is formed on one side region of the pillar portion The electronic module according to claim 1, further comprising a second exposed portion exposing the second substrate at the periphery of the corresponding position.