JP7264630B2 - electronic module - Google Patents

Description

The present invention relates to an electronic module having electronic components within an encapsulation.

2. Description of the Related Art Conventionally, there has been known a mode in which electronic components such as electronic elements, capacitors, and resistors are provided on a substrate and these electronic components are connected to terminals. For example, Patent Literature 1 discloses a substrate, an electronic element mounted on the substrate, and a mold resin portion that seals the electronic element. Electronic elements in such a mold resin portion are electrically connected to an external device through connection terminals.

As shown in this Patent Document 1, the connection between an electronic component such as an electronic element and an external device is generally performed by a connection terminal having an elongated shape.

WO2017/134774

The present invention provides a terminal for connecting an electronic component in a sealed portion and an external device based on a concept completely different from the conventional one.

The electronic module according to the invention comprises:
a first substrate;
an electronic component provided on one side of the first substrate;
a connector portion partially provided on one side of the first substrate, the connector portion having a connector resin portion and a connector terminal portion provided on the connector resin portion;
a sealing portion that seals a part of the electronic component and the connector;
with
The connector terminal portion may have an exposed portion exposed from the connector resin portion, and the electronic component and an external device may be electrically connected via the exposed portion.

The electronic module according to the invention comprises:
Further comprising a first conductor layer provided on the first substrate,
The exposed portion has an internal exposed portion exposed on the other side from the connector resin portion within the sealing portion,
The internal exposed portion may be electrically connected to the first conductor layer.

In the electronic module according to the invention,
The connector terminal portion includes an internally exposed portion exposed from the connector resin portion within the sealing portion, an externally exposed portion exposed from the connector resin portion outside the sealing portion, and an internally exposed portion within the connector resin portion. and an extension portion extending between the externally exposed portion.

In the electronic module according to the invention,
a plurality of the internally exposed portion, the externally exposed portion, and a plurality of extension portions extending between the internally exposed portion and the externally exposed portion;
At least some of the plurality of extending portions may extend at different positions in the thickness direction of the connector resin portion.

The electronic module according to the invention comprises:
Further comprising a second substrate provided on one side of the electronic component,
The connector resin portion may be provided between the first substrate and the second substrate.

In the electronic module according to the invention,
The connector resin portion may be sandwiched between the first substrate or a first conductor layer provided on the first substrate and the second substrate or a second conductor layer provided on the second substrate.

In the electronic module according to the invention,
The electronic component has a first electronic component and a second electronic component,
A first connector may be provided on one side of the first electronic component and on the other side of the second electronic component.

In the electronic module according to the invention,
The second electronic component has a one-side second electrode provided on one side,
The connector terminal portion has an internal exposed portion exposed on one side from the connector resin portion within the sealing portion,
A connection portion may be provided that extends along the in-plane direction and connects the one-side second electrode and the internal exposed portion.

In the electronic module according to the invention,
The connector terminal portion may have a one-side exposed portion exposed on one side from the connector resin portion and a other-side exposed portion exposed on the other side from the connector resin portion.

In the electronic module according to the invention,
The one-side exposed portion has a one-side internal exposed portion exposed from the connector resin portion within the sealing portion and a one-side externally exposed portion exposed from the connector resin portion outside the sealing portion,
The other-side exposed portion may have a second-side internal exposed portion exposed from the connector resin portion within the sealing portion, and a second-side externally exposed portion exposed from the connector resin portion outside the sealing portion. good.

In the electronic module according to the invention,
The connector resin portion is made of a first resin material,
The sealing portion may be made of a second resin material different from the first resin material.

In the electronic module according to the invention,
The connector section comprises a first side connector section provided on the first side of the sealing section and a second side connector section provided on the second side of the sealing section. may have.

In the present invention, when a connector portion having a connector resin portion and a connector terminal portion provided in the connector resin portion is adopted, electronic components in the sealed portion and an external device can be connected by a concept completely different from the conventional one. A member having a terminal function for connection can be provided.

FIG. 1 is a vertical cross-sectional view of an electronic module that can be used in a first embodiment of the invention. FIG. 2 is a vertical cross-sectional view of an electronic module that can be used in the first embodiment of the invention, and is a vertical cross-sectional view in a direction different from that of FIG. FIG. 3 is a vertical cross-sectional view in the width direction of a connector portion that can be used in the first embodiment of the present invention. FIG. 4 is a vertical cross-sectional view in the width direction of the connector portion that can be used in the first embodiment of the present invention, and is a vertical cross-sectional view at a location (where no exposed portion is provided) different from FIG. be. FIG. 5 is a plan view seen from one side or the other side of the connector portion that can be used in the first embodiment of the present invention, showing the relationship between the sealing portion, the inner exposed portion, and the outer exposed portion. It is a diagram. FIG. 6 is a vertical cross-sectional view of another electronic module that can be used in the first embodiment of the present invention. FIG. 7 is a longitudinal sectional view of still another electronic module that can be used in the first embodiment of the present invention. FIG. 8 is a plan view of a MOSFET as an electronic component that can be used in the first embodiment of the invention. FIG. 9 is a vertical cross-sectional view of an electronic module that can be used in the second embodiment of the invention. FIG. 10 is a vertical cross-sectional view of another electronic module that can be used in the second embodiment of the present invention. FIG. 11 is a longitudinal sectional view of still another electronic module that can be used in the second embodiment of the present invention. FIG. 12 is a vertical cross-sectional view of an electronic module that can be used in the third embodiment of the invention. FIG. 13 is a vertical cross-sectional view of another electronic module that can be used in the third embodiment of the present invention. FIG. 14 is a longitudinal sectional view of still another electronic module that can be used in the third embodiment of the present invention. FIG. 15 is a plan view from one side of an electronic module that can be used in the fourth embodiment of the present invention. FIG. 16 is a plan view from one side of another electronic module that can be used in the fourth embodiment of the present invention. FIG. 17(a) is a front view (right side of FIG. 18(a)) of a connector section that can be used in the fifth embodiment of the present invention, and FIG. 17(b) is a view of an external device. It is the figure which looked at the external connector main-body part from the front side (left side of Fig.18 (a)). FIG. 18(a) is a side cross-sectional view showing a connector portion and an external device that can be used in the fifth embodiment of the present invention, and FIG. 18(b) is the FIG. 4 is a side cross-sectional view showing a state in which the connector section and the external device are connected;

First Embodiment <<Configuration>>
In this embodiment, "one side" means the upper side in FIG. 1, and "the other side" means the lower side in FIG. The up-down direction in FIG. 1 is called the "first direction", the left-right direction is called the "second direction", and the front-back direction of the paper surface (the left-right direction in FIG. 2) is called the "third direction". An in-plane direction including the second direction and the third direction is called an “in-plane direction”.

As shown in FIG. 2, the electronic module of the present embodiment includes a first substrate 11, electronic components 13 and 23 provided on one side of the first substrate 11, and a portion of the first substrate 11 on one side. and a sealing portion 80 that seals the electronic components 13 and 23 and a part of the connector portion 100 . The connector portion 100 may have a connector resin portion 150 and connector terminal portions 110 (see FIGS. 3 and 4) provided on the connector resin portion 150 .

As shown in FIGS. 1 and 2, connector terminal portion 110 has exposed portions 116 and 117 exposed from connector resin portion 150, and electronic components 13 and 23 and an external device are connected via exposed portions 116 and 117. It may be electrically connected. Connector resin portion 150 may be made of an electrically insulating material. As the exposed portion, a mode that protrudes from the side surface of the connector resin portion 150 may be adopted.

As shown in FIGS. 1 and 2, a first conductor layer 12 made of copper or the like may be provided on one surface of the first substrate 11 . The exposed portions 116 and 117 have an inner exposed portion 116 exposed on the other side from the connector resin portion 150 within the sealing portion 80 , and the inner exposed portion 116 may be electrically connected to the first conductor layer 12 . .

As shown in FIG. 2 , the connector terminal portion 110 may have an externally exposed portion 117 exposed from the connector resin portion 150 outside the sealing portion 80 . An extension portion 118 extending between the inner exposed portion 116 and the outer exposed portion 117 may be provided in the connector resin portion 150 .

As shown in FIGS. 2 and 3, a plurality of internal exposed portions 116, external exposed portions 117, and extension portions 118 extending between these internal exposed portions 116 and external exposed portions 117 may be provided. A plurality of extension portions 118 are provided, and at least some of these extension portions 118 may extend at different positions in the thickness direction (first direction) of connector resin portion 150 .

As shown in FIGS. 1 and 2 , a second substrate 21 may be provided on one side of the electronic components 13 and 23 . A connector resin portion 150 may be provided between the first substrate 11 and the second substrate 21 . A second conductor layer 22 made of copper or the like may be provided on the other side of the second substrate 21 .

The connector resin portion 150 may be held between the first substrate 11 and the second substrate 21 . In this case, the gap between the first substrate 11 and the second substrate 21 matches the thickness of the connector resin portion 150 (thickness in the first direction). Alternatively, the connector resin portion 150 may be sandwiched between the first conductor layer 12 and the second conductor layer 22 as shown in FIGS. 1 and 2 .

As shown in FIG. 2, the electronic components 13 and 23 may have a first electronic component 13 provided on the first substrate 11 side and a second electronic component 23 provided on the second substrate 21 side. good. The first electronic component 13 is provided on the first substrate 11 or the first conductor layer 12 via a conductive adhesive such as solder, and the second substrate 21 or the second conductor layer 22 is provided via a conductive adhesive such as solder. A second electronic component 23 may be provided.

Connector terminal portion 110 may have one-side exposed portions 136 and 137 exposed on one side from connector resin portion 150 and other-side exposed portions 126 and 127 exposed on the other side from connector resin portion 150 . However, it is not limited to this, and only the one side exposed portions 136 and 137 may be provided and the other side exposed portions 126 and 127 may not be provided (see FIG. 7), or the other side exposed portions 126 and 127 may be provided. Only one side exposed portions 136 and 137 need not be provided (see FIG. 6). When only the one-side exposed portions 136 and 137 are provided, or when only the other-side exposed portions 126 and 127 are provided, a portion of the connector terminal portion 110 protrudes from the side surface of the connector resin portion 150, and the protruded portion Connections to external devices or electronic components 13, 23 may be made.

As shown in FIG. 5 , the one-side exposed portions 136 and 137 are the one-side inner exposed portion 136 exposed from the connector resin portion 150 inside the sealing portion 80 and the one-side exposed portion 136 exposed from the connector resin portion 150 outside the sealing portion 80 . It may also have a one-side externally exposed portion 137 . The other-side exposed portions 126 and 127 consist of the other-side internal exposed portion 126 exposed from the connector resin portion 150 inside the sealing portion 80 and the other-side externally exposed portion 127 exposed from the connector resin portion 150 outside the sealing portion 80 . may have

The connector resin portion 150 may be made of a first resin material, and the sealing portion 80 may be made of a second resin material different from the first resin material. However, it is not limited to such a mode, and the first resin material forming the connector resin portion 150 and the second resin material forming the sealing portion 80 may be made of the same material.

A ceramic substrate, an insulating resin layer, or the like can be used as the first substrate 11 and the second substrate 21 . As the conductive adhesive, in addition to solder, a material containing Ag or Cu as a main component can also be used.

The electronic components 13 and 23 may be switching elements, resistance components, capacitors, ICs, or the like. When the electronic components 13 and 23 are switching elements, the switching elements may be MOSFETs, IGBTs, or the like. The electronic components 13 and 23 may be made of a semiconductor material, such as silicon, silicon carbide, gallium nitride, or the like. When the electronic components 13 and 23 are MOSFETs, as shown in FIG. 8, the source electrodes 13s and 23s and the gate electrodes 13g and 23g are provided on the same side, and the drain electrode (not shown) is provided on another side. It may be provided on the side (back side of the paper surface of FIG. 8). As an example, the source electrodes 13s and 23s and the gate electrodes 13g and 23g may be provided on one surface and the drain electrode may be provided on the other surface, or the source electrodes 13s and 23s and the gate electrodes 13g and 13g may be provided on the other surface. 23g may be provided on the other surface and the drain electrode may be provided on the one surface. Further, the first electronic component 13 made of a MOSFET and the second electronic component 23 made of a MOSFET may have the same or different arrangement of electrodes. That is, in both the first electronic component 13 and the second electronic component 23, the source electrodes 13s, 23s and the gate electrodes 13g, 23g may be provided on the same side, or the first electronic component 13 and the second electronic component 23, the source electrodes 13s and 23s and the gate electrodes 13g and 23g are provided on the opposite surface side. A source electrode 23s and a gate electrode 23g may be provided on the other side of the component 23, for example.

As the substrates 11 and 12 provided with the conductor layers 12 and 22, a metal substrate having circuit patterning can be used. In this case, the substrates 11 and 21 also serve as the conductor layers 12 and 22 .

As shown in FIGS. 1 and 2, the other side of the first substrate 11 may be provided with a first radiator plate 91 made of a copper plate or the like. A second radiator plate 92 made of a copper plate or the like may be provided on one side of the second substrate 21 .

As shown in FIG. 2 , a single terminal portion 190 different from the connector terminal portion 110 provided on the connector resin portion 150 may be provided. However, such a single terminal portion 190 may not be provided, and the connector terminal portion 110 may perform all functions as a terminal connected to an external device. The single terminal portion 190 may be bent to one side or the other, unlike the embodiment shown in FIG.

Each of the first substrate 11 and the second substrate 21 may have a substantially rectangular shape when viewed along the first direction. The sealing portion 80 may also have a substantially rectangular shape when viewed along the first direction.

"effect"
Next, an example of the effects of this embodiment having the above-described configuration will be described. In addition, all aspects described in "Effect" can be adopted in the above configuration.

When the connector portion 100 as in the present embodiment is adopted, the electronic components 13 and 23 provided in the sealing portion 80 and an external device can be electrically connected using the connector terminal portion 110. can. Since the connector portion 100 has the connector resin portion 150 and the connector terminal portion 110 is embedded in the connector resin portion 150, the connector terminal portion 110 can be positioned at the position fixed by the connector resin portion 150. . As a result, a fine wiring structure can be adopted.

Especially when there are many electronic components 13 and 23, many terminals are required. As the number of terminals increases, it becomes necessary to increase the size of the electronic module in the in-plane direction, resulting in an increase in the size of the electronic module. In this regard, by adopting the connector terminal portions 110 as in the present embodiment, the connector terminal portions 110 can be provided at different positions in the thickness direction although they overlap in the in-plane direction (see FIG. 3). That is, by adopting the connector terminal portion 110 as in the present embodiment, the connector terminal portion 110 can be arranged three-dimensionally, thereby preventing the size of the electronic module in the in-plane direction from increasing. can.

As shown in FIGS. 1 and 2, the exposed portions 116 and 117 of the connector terminal portion 110 have the other side inner exposed portion 126 exposed on the other side from the connector resin portion 150 in the sealing portion 80, and the other side When the internal exposed portion 126 is electrically connected to the first conductor layer 12 , the connector terminal can be formed simply by placing the other internal exposed portion 126 on one surface of the first conductor layer 12 . This is advantageous in that the portion 110 and the first conductor layer 12 can be electrically connected. The other-side internal exposed portion 126 and the first conductor layer 12 may be connected via a conductive adhesive such as solder. May be directly connected.

A mode in which the one-side inner exposed portion 136 is electrically connected to the second conductor layer 22 may be employed. In this case, it is advantageous in that the connector terminal portion 110 and the second conductor layer 22 can be electrically connected simply by placing the one-side inner exposed portion 136 on the other side surface of the second conductor layer 22 . . The one-side inner exposed portion 136 and the second conductor layer 22 may be connected via a conductive adhesive such as solder. May be directly connected.

As shown in FIG. 2, the inner exposed portion 116 exposed from the connector resin portion 150 inside the sealing portion 80 and the externally exposed portion 117 exposed from the connector resin portion 150 outside the sealing portion 80 are placed inside the connector resin portion 150. When the connecting extending portion 118 is provided, the electronic components 13 and 23 in the sealing portion 80 and the internal exposed portion 116 are electrically connected by the extending portion 118, and the external portion outside the sealing portion 80 is electrically connected. It is advantageous in that the electronic components 13 and 23 in the sealing portion 80 and the external device can be electrically connected only by electrically connecting the device and the externally exposed portion 117 . In addition, by embedding extension portion 118 in connector resin portion 150 and providing extension portion 118, the risk of current flowing to an unexpected location can be reduced.

As shown in FIGS. 3 and 4, a plurality of extension portions 118 are provided, and at least some of the extension portions 118 extend at different positions in the thickness direction (first direction) of the connector resin portion 150. In this case, the extension 118 can be provided without considering the in-plane position of the extension 118 at different positions in the thickness direction, and the degree of freedom in design can be increased. useful in terms of According to this aspect, even when the number of electronic components 13 and 23 provided in the sealing portion 80 of the electronic module increases, a large number of connector terminal portions 110 can be accommodated without taking up a large area in the in-plane direction. It is also beneficial in that it can be provided.

As shown in FIGS. 3 and 4 , the connector resin portion 150 may be composed of a plurality of connector resin layers 151 and the extension portions 118 may be provided between the connector resin layers 151 . More limitedly, extension portions 118 may be provided between each connector resin layer 151 . In this case, it is advantageous in that more connector terminal portions 110 can be provided in the thickness direction in a simple manner. Although the connector resin portion 150 is composed of four connector resin layers 151 in FIGS. 3 and 4, the connector resin portion 150 is not limited to this, and a connector having two, three, or five or more connector resin portions 150 may be used. It may be composed of the resin layer 151 .

As shown in FIG. 3 , extension portion 118 and one-side exposed portions 136 and 137 may be connected by connecting portion 119 that penetrates connector resin layer 151 . Similarly, extension portion 118 and other-side exposed portions 126 and 127 may be connected by connecting portion 119 that penetrates connector resin layer 151 . The connecting portion 119 electrically connects the extending portion 118 to the one-side exposed portions 136 and 137 and/or the other-side exposed portions 126 and 127 . In addition, as shown in FIG. 2, such a connecting portion 119 may not be provided.

When the connector portion 100 (for example, the connector resin portion 150) is sandwiched between the first substrate 11 or the first conductor layer 12 and the second substrate 21 or the second conductor layer 22, the connector portion 100 can be used to hold the second conductor layer. Advantageously, the gap in the thickness direction between the first substrate 11 and the second substrate 21 can be determined, reducing or eliminating the need for jigs when producing the electronic module.

When the connector terminal portion 110 has the one-side exposed portions 136 and 137 and the other-side exposed portions 126 and 127, both the one side surface and the other side surface of the connector resin portion 150 are used. The electronic components 13 and 23 inside the sealing portion 80 can be connected to an external device.

The one-side exposed portions 136 and 137 have the one-side internal exposed portion 136 and the one-side external exposed portion 137, and the other-side exposed portions 126 and 127 have the other-side internal exposed portion 126 and the other-side external exposed portion 127. In this case, the electronic components 13 and 23 inside the sealing portion 80 and the outside are connected by using both the one side surface and the other side surface of the connector resin portion 150 both inside and outside the sealing portion 80 . It is useful in that it can be connected to a device.

When the first resin material forming the connector resin portion 150 and the second resin material forming the sealing portion 80 are different from each other, it is possible to adopt an aspect corresponding to each characteristic. For example, if the first resin material is made of a material with higher insulation than the second resin material, the insulation between the plurality of connector terminal portions 110 can be enhanced. Moreover, when the second resin material is made of a material having higher heat dissipation than the first resin material, the second resin material can realize high heat dissipation.

Second Embodiment Next, a second embodiment of the present invention will be described.

In this embodiment, as shown in FIGS. 9 to 11, the first connector 60 is provided on one side of the first electronic component 13 and on the other side of the second electronic component 23 . A conductive adhesive such as solder may be provided between the first electronic component 13 and the first connector 60 and between the second electronic component 23 and the first connector 60 . However, the first electronic component 13 and the first connection body 60 are in direct contact, and the two electronic components 13 and 23 and the first connection body 60 are in direct contact without providing a conductive adhesive such as solder. may be Other configurations are the same as those of the first embodiment, and all aspects described in the first embodiment can be adopted. The members described in the first embodiment are described using the same reference numerals.

In a mode in which the first connection body 60 is provided as in the present embodiment, the first substrate 11 and the second substrate 21 can be directly or indirectly supported by both the connector portion 100 and the first connection body 60. , and the distortion of the first substrate 11 and/or the second substrate 21 can be prevented.

The total thickness of the first connection body 60, the first electronic component 13 provided with the first connection body 60, and the second electronic component 23 provided on the first connection body 60 is the thickness of the connector section 100 (for example, connector resin 150). It is said that the total thickness of the first connection body 60 , the first electronic component 13 provided with the first connection body 60 , and the second electronic component 23 provided on the first connection body 60 corresponds to the thickness of the connector section 100 . is the sum of the thicknesses of the first connection body 60, the first electronic component 13 provided with the first connection body 60, and the second electronic component 23 provided on the first connection body 60, and the thickness of the connector portion 100; is within 5% of the thickness of the connector section 100.

A mode in which the total thickness of the first connection body 60, the first electronic component 13 provided with the first connection body 60, and the second electronic component 23 provided on the first connection body 60 corresponds to the thickness of the connector section 100. , the first substrate 11 and the second substrate 21 can be supported with substantially the same thickness by the connector portion 100, the first electronic component 13, the first connection body 60 and the second electronic component 23. This is advantageous in that it can more reliably prevent the first substrate 11 and/or the second substrate 21 from being distorted.

As shown in FIG. 9, the first connection body 60 may have a first head portion and a first column portion extending from the first head portion to the other side, and the cross section of the first connection body 60 is approximately It may be T-shaped. A metal such as Cu can be used as the material of the first connector 60 .

The second electronic component 23 may have a one-side second electrode provided on one side. When the second electronic component 23 is a MOSFET, the one-side second electrode may be, for example, the gate electrode 23g or the source electrode 23s shown in FIG. 8 or the gate electrode.

As shown in FIG. 10 , a connecting portion 180 may be provided that extends along the in-plane direction and connects the one-side second electrode and the inner exposed portion 116 .

As shown in FIG. 11, the second substrate 21 may not be provided. Then, the one-side second electrode of the second electronic component 23 provided on the first connector 60 and the internal exposed portion 116 may be electrically connected by the connecting portion 180 . A conductive adhesive such as solder may be provided between the one-side second electrode and the connecting portion 180 and between the internal exposed portion 116 and the connecting portion 180 .

The connecting portion 180 may be composed of a plate-like member linearly extending in the in-plane direction. However, it is not limited to such a mode, and the connecting portion 180 may have a stepped shape or may be inclined along the in-plane direction.

Third Embodiment Next, a third embodiment of the present invention will be described.

In this embodiment, as shown in FIGS. 12 to 14, the first connector 60 is provided on one side of the first electronic component 13 and the other side of the second electronic component 23, and the second electronic component 23 A second connector 70 is provided on one side of the . Other configurations are the same as those of the first embodiment or the second embodiment, and all aspects described in the first embodiment and the second embodiment can be adopted. The members described in the first embodiment and the second embodiment are described using the same reference numerals.

In a mode in which the first connector 60 and the second connector 70 are provided as in the present embodiment, the connector section 100 and the first connector 60 and the second connector 70 directly or indirectly connect the first The substrate 11 and the second substrate 21 can be supported, and the distortion of the first substrate 11 and/or the second substrate 21 can be prevented.

The total thickness of the first connection body 60, the second connection body 70, the first electronic component 13 provided with the first connection body 60, and the second electronic component 23 provided on the first connection body 60 is the connector portion 100. (for example, the connector resin portion 150). The total thickness of the first connection body 60, the second connection body 70, the first electronic component 13 provided with the first connection body 60, and the second electronic component 23 provided on the first connection body 60 is the connector portion 100. corresponds to the thickness of the first connection body 60, the second connection body 70, the first electronic component 13 provided with the first connection body 60, and the second electronic component 23 provided on the first connection body 60 and the thickness of the connector portion 100 is within 5% of the thickness of the connector portion 100.

The total thickness of the first connection body 60, the second connection body 70, the first electronic component 13 provided with the first connection body 60, and the second electronic component 23 provided on the first connection body 60 is the connector portion 100. , the connector portion 100, the first electronic component 13, the first connection body 60, the second electronic component 23, and the second connection body 70 have substantially the same thickness as the first This is advantageous in that the substrate 11 and the second substrate 21 can be supported, and the distortion of the first substrate 11 and/or the second substrate 21 can be prevented more reliably.

Unlike the illustrated embodiment, like the first connector 60 of the second embodiment, the second connector 70 has a second head portion and a second column extending from the second head portion to the other side. portion, and the cross section of the second connector 70 may be substantially T-shaped. A metal such as Cu can be used as the material of the second connector 70 .

As shown in FIG. 13 , in the present embodiment as well, a connecting portion 180 extending along the in-plane direction and connecting the one-side second electrode and the inner exposed portion 116 may be provided.

As shown in FIG. 14, the second substrate 21 may not be provided. Then, the one-side second electrode of the second electronic component 23 provided on the first connector 60 and the internal exposed portion 116 may be electrically connected by the connecting portion 180 . A conductive adhesive such as solder may be provided between the one-side second electrode and the connecting portion 180 and between the internal exposed portion 116 and the connecting portion 180 . Moreover, when the second substrate 21 is not provided in this manner, the second connector 70 may be provided so as to abut on the first conductor layer 12 as shown in FIG. may be provided so as to abut on the

Fourth Embodiment Next, a fourth embodiment of the present invention will be described.

In the present embodiment, as shown in FIGS. 15 and 16, the connector section 100 includes a first lateral connector section 100a provided on the first lateral side of the sealing section 80 and a ( and a second lateral connector portion 100b provided on a second lateral side (different from the first lateral side). Other configurations are the same as those of the above-described embodiments, and all aspects described in the above-described embodiments can be adopted. The members described in each of the above embodiments are described using the same reference numerals.

As shown in FIG. 15, the first side connector portion 100a and the second side connector portion 100b may be provided on opposite sides when viewed along the first direction (in plan view). As shown in 16, the first side connector portion 100a and the second side connector portion 100b may be provided on adjacent sides. The connector section 100 also has a third side connector section and a fourth side connector section, and when viewed along the first direction, the first side connector section 100a, the second side connector section 100b, Each of the third side connector portion and the fourth side connector portion may be provided on different sides. In the embodiment having the first substrate 11 and the second substrate 21, when this aspect is employed, the first substrate 11 and/or the second substrate 21 can be prevented from being distorted by the connector portions 100 provided on each side. . In addition, the connector section 100 has a first side connector section 100a, a second side connector section 100b and a third side connector section, and when viewed along the first direction, these three sides correspond to each other. A mode in which the first side connector portion 100a, the second side connector portion 100b, and the third side connector portion are provided may be adopted.

Fifth Embodiment Next, a fifth embodiment of the present invention will be described.

In the present embodiment, as shown in FIGS. 17 and 18, the connector portion 100 has a connector main body portion 220 and a protruding portion 210 protruding from the connector main body portion 220, and an external connector connected to the connector portion 100. The device has a mating portion 310 comprising a recess corresponding to the protrusion 210 . In the embodiment shown in FIG. 17(a), the connector section 100 has projections 210 on each of the top, bottom, right, and left sides of FIG. There are two mating portions 310 (see FIG. 17(b)). Other configurations are the same as those of the above-described embodiments, and all aspects described in the above-described embodiments can be adopted. The members described in each of the above embodiments are described using the same reference numerals.

When a mode like this embodiment is adopted, the connector section 100 and the external device 300 can be easily and reliably connected.

The external device 300 has an external connector main body portion 360 and an external terminal portion 350 embedded in the external connector main body portion 360 and electrically connected to the externally exposed portion 117 . 17 and 18, the external connector main body 360 is provided with an opening 320 through which the external terminal 350 is exposed from the external connector main body 360. As shown in FIG. Then, the connector main body 220 is inserted into the opening 320 of the external connector main body 360, and each of the protruding portions 210 is inserted into the corresponding fitting portion 310 (see FIG. 18(b)), so that the externally exposed portion 117 and the external terminal portion 350 are brought into contact with each other so that the external device 300 and the electronic module can be electrically connected.

The description of each embodiment and the disclosure of the drawings described above are only examples for explaining the invention described in the claims, and the description of the embodiments and the disclosure of the drawings described in the claims are The invention is not limited. In addition, the descriptions of the claims as originally filed are only examples, and the descriptions of the claims can be changed as appropriate based on the descriptions of the specification, drawings, and the like.

11 First substrate 12 First conductor layer 13 First electronic component 21 Second substrate 22 Second conductor layer 23 Second electronic component 60 First connector 70 Second connector 80 Sealing portion 100 Connector portion 100a First side Connector portion 100b Second side connector portion 110 Connector terminal portion 116 Inside exposed portion (exposed portion)
117 externally exposed part (exposed part)
118 extension part 126 other side inner exposed part (other side exposed part)
127 other side externally exposed portion (other side exposed portion)
136 one side internal exposed part (one side exposed part)
137 one side external exposure part (one side exposure part)
150 connector resin portion 180 connecting portion

Claims (16)

a first substrate;
an electronic component provided on one side of the first substrate;
a connector portion partially provided on one side of the first substrate, the connector portion having a connector resin portion and a connector terminal portion provided on the connector resin portion;
a sealing portion that seals a part of the electronic component and the connector;
with
the connector terminal portion has an exposed portion exposed from the connector resin portion, and electrically connects the electronic component and an external device via the exposed portion;
The connector terminal portion includes an internally exposed portion exposed from the connector resin portion within the sealing portion, an externally exposed portion exposed from the connector resin portion outside the sealing portion, and an internally exposed portion within the connector resin portion. and an extension portion extending between the externally exposed portion,
a plurality of the internally exposed portion, the externally exposed portion, and a plurality of extension portions extending between the internally exposed portion and the externally exposed portion;
The electronic module , wherein at least some of the plurality of extension portions extend at different positions in the thickness direction of the connector resin portion . a first substrate;
an electronic component provided on one side of the first substrate;
a connector portion partially provided on one side of the first substrate, the connector portion having a connector resin portion and a connector terminal portion provided on the connector resin portion;
a sealing portion that seals a part of the electronic component and the connector;
a second substrate provided on one side of the electronic component;
with
the connector terminal portion has an exposed portion exposed from the connector resin portion, and electrically connects the electronic component and an external device via the exposed portion ;
The connector terminal portion includes an internally exposed portion exposed from the connector resin portion within the sealing portion, an externally exposed portion exposed from the connector resin portion outside the sealing portion, and an internally exposed portion within the connector resin portion. and an extension portion extending between the externally exposed portion,
An electronic module in which the connector resin portion is provided between the first substrate and the second substrate. a first substrate;
an electronic component provided on one side of the first substrate;
a connector portion partially provided on one side of the first substrate, the connector portion having a connector resin portion and a connector terminal portion provided on the connector resin portion;
a sealing portion that seals a part of the electronic component and the connector;
with
the connector terminal portion has an exposed portion exposed from the connector resin portion, and electrically connects the electronic component and an external device via the exposed portion ;
The electronic component has a first electronic component and a second electronic component,
An electronic module in which a first connector is provided on one side of the first electronic component and on the other side of the second electronic component. a first substrate;
an electronic component provided on one side of the first substrate;
a connector portion partially provided on one side of the first substrate, the connector portion having a connector resin portion and a connector terminal portion provided on the connector resin portion;
a sealing portion that seals a part of the electronic component and the connector;
with
the connector terminal portion has an exposed portion exposed from the connector resin portion, and electrically connects the electronic component and an external device via the exposed portion;
The connector terminal portion includes an internally exposed portion exposed from the connector resin portion within the sealing portion, an externally exposed portion exposed from the connector resin portion outside the sealing portion, and an internally exposed portion within the connector resin portion. and an extension portion extending between the externally exposed portion,
The electronic module, wherein the connector terminal portion has a one-side exposed portion exposed on one side from the connector resin portion and a other-side exposed portion exposed on the other side from the connector resin portion. a first substrate;
an electronic component provided on one side of the first substrate;
a connector portion partially provided on one side of the first substrate, the connector portion having a connector resin portion and a connector terminal portion provided on the connector resin portion;
a sealing portion that seals a part of the electronic component and the connector;
with
the connector terminal portion has an exposed portion exposed from the connector resin portion, and electrically connects the electronic component and an external device via the exposed portion ;
The connector terminal portion has a one-side exposed portion exposed on one side from the connector resin portion and a other-side exposed portion exposed on the other side from the connector resin portion,
The one-side exposed portion has a one-side internal exposed portion exposed from the connector resin portion within the sealing portion and a one-side externally exposed portion exposed from the connector resin portion outside the sealing portion,
The other-side exposed portion has a second-side internal exposed portion exposed from the connector resin portion within the sealing portion and a second-side externally exposed portion exposed from the connector resin portion outside the sealing portion. Further comprising a first conductor layer provided on the first substrate ,
5. The electronic module according to any one of claims 1, 2 and 4, wherein the internal exposed portion is electrically connected to the first conductor layer. The connector terminal portion includes an internally exposed portion exposed from the connector resin portion within the sealing portion, an externally exposed portion exposed from the connector resin portion outside the sealing portion, and an internally exposed portion within the connector resin portion. and an extension portion extending between the externally exposed portion. a plurality of the internally exposed portion, the externally exposed portion, and a plurality of extension portions extending between the internally exposed portion and the externally exposed portion;
8. The electronic module according to claim 7 , wherein at least some of the plurality of extension portions extend at different positions in the thickness direction of the connector resin portion. Further comprising a second substrate provided on one side of the electronic component,
9. The electronic module according to any one of claims 1, 3, 4, 5, 7 and 8, wherein said connector resin portion is provided between said first substrate and said second substrate. 10. The connector resin portion is sandwiched between the first substrate or a first conductor layer provided on the first substrate and the second substrate or a second conductor layer provided on the second substrate. The electronic module described in . The electronic component has a first electronic component and a second electronic component,
6. The electronic module according to any one of claims 1, 2, 4 and 5, wherein a first connector is provided on one side of said first electronic component and on the other side of said second electronic component. The second electronic component has a one-side second electrode provided on one side,
The connector terminal portion has an internal exposed portion exposed on one side from the connector resin portion within the sealing portion,
12. The electronic module according to claim 11 , further comprising a connecting portion that extends along the in-plane direction and connects the one-side second electrode and the internal exposed portion. 9. The connector terminal portion according to any one of claims 1 to 3, 7 and 8, wherein the connector terminal portion has a one-side exposed portion exposed on one side from the connector resin portion and a other-side exposed portion exposed on the other side from the connector resin portion. or 1. The electronic module according to claim 1. The one-side exposed portion has a one-side internal exposed portion exposed from the connector resin portion within the sealing portion and a one-side externally exposed portion exposed from the connector resin portion outside the sealing portion,
13. The other-side exposed portion has a second-side internal exposed portion exposed from the connector resin portion within the sealing portion, and a second-side externally exposed portion exposed from the connector resin portion outside the sealing portion. The electronic module described in . The connector resin portion is made of a first resin material,
15. The electronic module according to any one of claims 1 to 14 , wherein said sealing portion is made of a second resin material different from said first resin material. The connector section comprises a first side connector section provided on the first side of the sealing section and a second side connector section provided on the second side of the sealing section. 16. An electronic module as claimed in any one of the preceding claims.

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