JP2020092133A - Electronic module - Google Patents

Abstract

To provide a terminal that connects electronic components 13 and 23 in a sealing portion 80 to an external device by a completely different idea from the conventional one.SOLUTION: An electronic module includes a first substrate 11, electronic components 13 and 23 provided on one side of the first substrate 11, a connector portion 100, a part of which is provided on one side of the first substrate 11, and which includes a connector resin portion 150 and a connector terminal portion 110 provided in the connector resin portion 150, and a sealing portion 80 that seals a part of the electronic components 13 and 23 and the connector portion 100. The connector portion 100 includes exposed portions 116 and 117 exposed from the connector resin portion 150, and electrically connects the electronic components 13 and 23 to an external device via the exposed portions 116 and 117.SELECTED DRAWING: Figure 1

Description

The present invention relates to an electronic module having an electronic component inside a sealing portion.

2. Description of the Related Art Conventionally, a mode has been known in which electronic components such as electronic elements, capacitors, and resistors are provided on a substrate and these electronic components are connected to terminals. For example, Patent Document 1 discloses a substrate, an electronic element mounted on the substrate, and a mold resin portion that seals the electronic element. The electronic element in such a mold resin portion is electrically connected to the external device via the connection terminal.

As shown in Patent Document 1, connection between an electronic device such as an electronic element and an external device is generally performed by a connection terminal having an elongated shape.

WO2017/134774

The present invention provides a terminal for connecting an electronic component in an encapsulation portion to an external device, based on a completely different idea from the conventional one.

The electronic module according to the present invention comprises
A first substrate,
An electronic component provided on one side of the first substrate,
A connector part that is partially provided on one side of the first board, the connector part having a connector resin part and a connector terminal part provided in the connector resin part,
A sealing portion for sealing a part of the electronic component and the connector portion,
Equipped with
The connector terminal portion may have an exposed portion exposed from the connector resin portion, and the electronic component and an external device may be electrically connected via the exposed portion.

The electronic module according to the present invention comprises
Further comprising a first conductor layer provided on the first substrate,
The exposed portion has an internal exposed portion exposed on the other side from the connector resin portion in the sealing portion,
The inner exposed portion may be electrically connected to the first conductor layer.

In the electronic module according to the present invention,
The connector terminal portion has an internal exposed portion exposed from the connector resin portion inside the sealing portion, an external exposed portion exposed from the connector resin portion outside the sealing portion, and the internal exposed portion inside the connector resin portion. And an extending portion extending between the external exposed portion and the external exposed portion.

In the electronic module according to the present invention,
A plurality of the inner exposed portion, the outer exposed portion and a plurality of extending portions extending between the inner exposed portion and the outer exposed portion are provided.
At least a part of the plurality of extending portions may extend at different positions in the thickness direction of the connector resin portion.

The electronic module according to the present invention comprises
Further comprising a second substrate provided on one side of the electronic component,
The connector resin portion may be provided between the first substrate and the second substrate.

In the electronic module according to the present invention,
The connector resin portion may be sandwiched by the first substrate or a first conductor layer provided on the first substrate and the second substrate or a second conductor layer provided on the second substrate.

In the electronic module according to the present invention,
The electronic component has a first electronic component and a second electronic component,
A first connector may be provided on one side of the first electronic component and the other side of the second electronic component.

In the electronic module according to the present invention,
The second electronic component has one side second electrode provided on one side,
The connector terminal portion has an internal exposed portion exposed on one side from the connector resin portion in the sealing portion,
A connection portion may be provided that extends along the in-plane direction and connects the one-side second electrode and the internal exposed portion.

In the electronic module according to the present invention,
The connector terminal portion may have one side exposed portion exposed from the connector resin portion on one side and the other exposed portion exposed from the connector resin portion on the other side.

In the electronic module according to the present invention,
The one-side exposed portion has one-side internal exposed portion exposed from the connector resin portion in the sealing portion, and one side external exposed portion exposed from the connector resin portion outside the sealing portion,
The other-side exposed portion may have the other-side internal exposed portion exposed from the connector resin portion inside the sealing portion, and the other-side external exposed portion exposed from the connector resin portion outside the sealing portion. Good.

In the electronic module according to the present invention,
The connector resin portion is made of a first resin material,
The sealing portion may be made of a second resin material different from the first resin material.

In the electronic module according to the present invention,
The connector section includes a first lateral connector section provided on the first lateral side of the sealing section and a second lateral connector section provided on the second lateral side of the sealing section. You may have.

In the present invention, when a connector portion having a connector resin portion and a connector terminal portion provided in the connector resin portion is adopted, the electronic component in the sealing portion and the external device are separated by a completely different idea from the conventional one. It is possible to provide a member having a terminal function for connection.

FIG. 1 is a vertical cross-sectional view of an electronic module that can be used in the first embodiment of the present invention. FIG. 2 is a vertical cross-sectional view of an electronic module that can be used in the first embodiment of the present invention, and is a vertical cross-sectional view in a direction different from FIG. FIG. 3 is a vertical cross-sectional view in the width direction of a connector portion that can be used in the first embodiment of the present invention. FIG. 4 is a vertical cross-sectional view in the width direction of the connector portion that can be used in the first embodiment of the present invention, and is a vertical cross-sectional view at a portion different from FIG. 3 (a portion where the exposed portion is not provided). is there. FIG. 5 is a plan view seen from one side or the other side of the connector part that can be used in the first embodiment of the present invention, showing the relationship between the sealing part and the internal exposed part and the external exposed part. It is a figure. FIG. 6 is a vertical cross-sectional view of an electronic module of another aspect that can be used in the first embodiment of the present invention. FIG. 7 is a vertical cross-sectional view of an electronic module according to still another aspect that can be used in the first embodiment of the present invention. FIG. 8 is a plan view of a MOSFET as an electronic component that can be used in the first embodiment of the present invention. FIG. 9 is a vertical cross-sectional view of an electronic module that can be used in the second embodiment of the present invention. FIG. 10 is a vertical cross-sectional view of an electronic module of another aspect that can be used in the second embodiment of the present invention. FIG. 11 is a vertical cross-sectional view of an electronic module according to still another aspect that can be used in the second embodiment of the present invention. FIG. 12 is a vertical cross-sectional view of an electronic module that can be used in the third embodiment of the present invention. FIG. 13 is a vertical cross-sectional view of another mode of electronic module that can be used in the third embodiment of the present invention. FIG. 14 is a vertical cross-sectional view of an electronic module according to still another aspect that can be used in the third embodiment of the present invention. FIG. 15 is a plan view of an electronic module that can be used in the fourth embodiment of the present invention, viewed from one side. FIG. 16 is a plan view of an electronic module of another aspect which can be used in the fourth embodiment of the present invention, as seen from one side. FIG. 17(a) is a view of a connector portion that can be used in the fifth embodiment of the present invention as seen from the front side (right side of FIG. 18(a)), and FIG. 17(b) shows an external device. It is the figure which looked at the external connector main part from the front side (left side of Drawing 18 (a)). 18A is a side sectional view showing a connector unit and an external device that can be used in the fifth embodiment of the present invention, and FIG. 18B is shown in FIG. 18A. It is a side sectional view showing the mode which connected the connector part and the external device.

First embodiment <<configuration>>
In the present embodiment, “one side” means the upper side in FIG. 1, and “other side” means the lower side in FIG. The up-down direction in FIG. 1 is referred to as the “first direction”, the left-right direction is referred to as the “second direction”, and the front-back direction of the paper surface (the left-right direction in FIG. 2) is referred to as the “third direction”. The in-plane direction including the second direction and the third direction is called "in-plane direction".

As shown in FIG. 2, the electronic module according to the present embodiment includes a first substrate 11, electronic components 13 and 23 provided on one side of the first substrate 11, and a part of the electronic component on one side of the first substrate 11. May be provided, and the sealing part 80 which seals a part of electronic parts 13 and 23 and the connector part 100 may be provided. The connector part 100 may include a connector resin part 150 and a connector terminal part 110 (see FIGS. 3 and 4) provided on the connector resin part 150.

As shown in FIGS. 1 and 2, the connector terminal portion 110 has exposed portions 116 and 117 exposed from the connector resin portion 150, and the electronic components 13 and 23 and the external device are connected via the exposed portions 116 and 117. It may be electrically connected. The connector resin portion 150 may be made of an electrically insulating material. As the exposed portion, a mode in which it projects from the side surface of the connector resin portion 150 may be adopted.

As shown in FIGS. 1 and 2, a first conductor layer 12 made of copper or the like may be provided on one surface of the first substrate 11. The exposed portions 116 and 117 have an inner exposed portion 116 exposed on the other side from the connector resin portion 150 in the sealing portion 80, and the inner exposed portion 116 may be electrically connected to the first conductor layer 12. ..

As shown in FIG. 2, the connector terminal portion 110 may have an external exposed portion 117 exposed from the connector resin portion 150 outside the sealing portion 80. In addition, an extending portion 118 may be provided in the connector resin portion 150 so as to extend between the inner exposed portion 116 and the outer exposed portion 117.

As shown in FIGS. 2 and 3, a plurality of inner exposed portions 116, outer exposed portions 117, and a plurality of extending portions 118 extending between the inner exposed portions 116 and the outer exposed portions 117 may be provided. A plurality of extending portions 118 may be provided, and at least some of the extending portions 118 may extend at different positions in the thickness direction (first direction) of the connector resin portion 150.

As shown in FIGS. 1 and 2, the second substrate 21 may be provided on one side of the electronic components 13 and 23. The connector resin portion 150 may be provided between the first substrate 11 and the second substrate 21. A second conductor layer 22 made of copper or the like may be provided on the other surface of the second substrate 21.

The connector resin portion 150 may be sandwiched between the first substrate 11 and the second substrate 21. In this case, the gap between the first substrate 11 and the second substrate 21 matches the thickness of the connector resin portion 150 (thickness in the first direction). Further, unlike this mode, as shown in FIGS. 1 and 2, the connector resin portion 150 may be sandwiched between the first conductor layer 12 and the second conductor layer 22.

As shown in FIG. 2, the electronic components 13 and 23 may have the first electronic component 13 provided on the first substrate 11 side and the second electronic component 23 provided on the second substrate 21 side. Good. The first electronic component 13 is provided on the first substrate 11 or the first conductor layer 12 via a conductive adhesive agent such as solder, and the first electronic component 13 is provided on the second substrate 21 or the second conductor layer 22 via a conductive adhesive agent such as solder. The second electronic component 23 may be provided.

The connector terminal portion 110 may have one-side exposed portions 136 and 137 exposed on one side from the connector resin portion 150 and other-side exposed portions 126 and 127 exposed on the other side from the connector resin portion 150. However, the present invention is not limited to this, and it is possible that only the one-side exposed portions 136 and 137 are provided and the other-side exposed portions 126 and 127 are not provided (see FIG. 7), and the other-side exposed portions 126 and 127. It is not necessary to provide only the one-side exposed portions 136 and 137 (see FIG. 6). When only the one-side exposed portions 136 and 137 are provided, or when only the other-side exposed portions 126 and 127 are provided, a part of the connector terminal portion 110 projects from the side surface of the connector resin portion 150, and the projected portion causes Connection to external devices or electronic components 13, 23 may be made.

As shown in FIG. 5, the one-side exposed portions 136 and 137 are exposed from the connector resin portion 150 inside the sealing portion 80 and the one-side inner exposed portion 136 outside the sealing portion 80 from the connector resin portion 150. One side external exposed portion 137 may be included. The other-side exposed portions 126 and 127 include the other-side inner exposed portion 126 exposed from the connector resin portion 150 inside the sealing portion 80, and the other-side outer exposed portion 127 exposed from the connector resin portion 150 outside the sealing portion 80. May have.

The connector resin portion 150 may be made of a first resin material, and the sealing portion 80 may be made of a second resin material different from the first resin material. However, the present invention is not limited to such an aspect, and the first resin material forming the connector resin portion 150 and the second resin material forming the sealing portion 80 may be made of the same material.

As the first substrate 11 and the second substrate 21, a ceramic substrate, an insulating resin layer or the like can be adopted. As the conductive adhesive, besides solder, a material containing Ag or Cu as a main component can be used.

The electronic components 13 and 23 may be switching elements, resistance components, capacitors, ICs, or the like. When the electronic components 13 and 23 are composed of switching elements, the switching elements may be MOSFETs or IGBTs. The electronic components 13 and 23 may be made of a semiconductor material, and the semiconductor material may be silicon, silicon carbide, gallium nitride, or the like. When the electronic components 13 and 23 are MOSFETs, as shown in FIG. 8, the source electrodes 13s and 23s and the gate electrodes 13g and 23g are provided on the same surface side, and the drain electrodes (not shown) are provided on different surfaces. It may be provided on the side (the back side of the plane of FIG. 8). As an example, the source electrodes 13s and 23s and the gate electrodes 13g and 23g may be provided on one surface and the drain electrode may be provided on the other surface, or the source electrodes 13s and 23s and the gate electrode 13g, 23g may be provided on the other surface and the drain electrode may be provided on the one surface. Further, the first electronic component 13 composed of the MOSFET and the second electronic component 23 composed of the MOSFET may have the same electrode arrangement mode or different electrode arrangement modes. That is, the source electrodes 13s and 23s and the gate electrodes 13g and 23g may be provided on the same surface side in both the first electronic component 13 and the second electronic component 23, or the first electronic component 13 and the second electronic component may be provided. In 23, the source electrodes 13s and 23s and the gate electrodes 13g and 23g are provided on the opposite surface sides, and in the first electronic component 13, for example, the source electrode 13s and the gate electrode 13g are provided on one surface, and the second electron In the component 23, for example, the source electrode 23s and the gate electrode 23g may be provided on the other surface.

As the substrates 11 and 12 on which the conductor layers 12 and 22 are provided, it is possible to use a metal substrate on which circuit patterning is performed. In this case, the substrates 11 and 21 also serve as the conductor layers 12 and 22.

As shown in FIGS. 1 and 2, a first heat dissipation plate 91 made of a copper plate or the like may be provided on the other side of the first substrate 11. A second heat dissipation plate 92 composed of a copper plate or the like may be provided on one side of the second substrate 21.

As shown in FIG. 2, a separate terminal portion 190 different from the connector terminal portion 110 provided on the connector resin portion 150 may be provided. However, such a single terminal section 190 may not be provided, and all the functions as terminals connected to an external device may be realized by the connector terminal section 110. Unlike the aspect shown in FIG. 2, the single terminal portion 190 may be bent to one side or the other side.

Each of the first substrate 11 and the second substrate 21 may have a substantially rectangular shape when viewed along the first direction. Also, the sealing portion 80 may have a substantially rectangular shape when viewed along the first direction.

"effect"
Next, an example of the effect of the present embodiment having the above-described configuration will be described. It should be noted that any aspect described in “Effect” can be adopted in the above configuration.

When the connector unit 100 as in this embodiment is adopted, the electronic components 13 and 23 provided in the sealing unit 80 and the external device can be electrically connected using the connector terminal unit 110. it can. Since the connector portion 100 has the connector resin portion 150 and the connector terminal portion 110 is embedded in the connector resin portion 150, the connector terminal portion 110 can be positioned at the position fixed by the connector resin portion 150. .. As a result, a fine wiring structure can be adopted.

Especially when a large number of electronic components 13 and 23 are present, a large number of terminals are required. As the number of terminals increases, it becomes necessary to increase the size of the electronic module in the in-plane direction, and as a result, the electronic module becomes larger. In this respect, by adopting the connector terminal portion 110 as in the present embodiment, it is possible to provide the connector terminal portion 110 at a position overlapping in the in-plane direction but different in the thickness direction (see FIG. 3 ). That is, by adopting the connector terminal portion 110 as in the present embodiment, the connector terminal portion 110 can be arranged three-dimensionally, and eventually the size of the electronic module in the in-plane direction is prevented from increasing. it can.

As shown in FIGS. 1 and 2, the exposed portions 116 and 117 of the connector terminal portion 110 have the other-side inner exposed portion 126 exposed on the other side from the connector resin portion 150 in the sealing portion 80. When the aspect in which the inner exposed portion 126 is electrically connected to the first conductor layer 12 is adopted, the other side inner exposed portion 126 is simply placed on one surface of the first conductor layer 12 to form the connector terminal. This is advantageous in that the portion 110 and the first conductor layer 12 can be electrically connected. The other-side inner exposed portion 126 and the first conductor layer 12 may be connected to each other via a conductive adhesive such as solder. The other-side inner exposed portion 126 and the first conductor layer 12 may be connected without any material. It may be directly connected.

A mode may be adopted in which the one-side inner exposed portion 136 is electrically connected to the second conductor layer 22. In this case, it is advantageous in that the connector terminal portion 110 and the second conductor layer 22 can be electrically connected only by placing the one-side inner exposed portion 136 on the other side surface of the second conductor layer 22. .. The one-side inner exposed portion 136 and the second conductor layer 22 may be connected to each other via a conductive adhesive such as solder. The one-side inner exposed portion 136 and the second conductor layer 22 may be connected without any material. It may be directly connected.

As shown in FIG. 2, the inside exposed portion 116 exposed from the connector resin portion 150 inside the sealing portion 80 and the outside exposed portion 117 exposed from the connector resin portion 150 outside the sealing portion 80 are inside the connector resin portion 150. When the extending portion 118 to be connected is provided, the electronic components 13 and 23 in the sealing portion 80 and the internal exposed portion 116 are electrically connected by the extending portion 118, and the external portion outside the sealing portion 80 is connected. It is advantageous in that the electronic components 13 and 23 in the sealing portion 80 and the external device can be electrically connected only by electrically connecting the device and the externally exposed portion 117. Further, by providing the extending portion 118 by embedding it in the connector resin portion 150, it is possible to reduce the risk of current flowing to an unexpected location.

As shown in FIGS. 3 and 4, a plurality of extending portions 118 are provided, and at least a part of the plurality of extending portions 118 extends at different positions in the thickness direction (first direction) of the connector resin portion 150. In the case of adopting the aspect described above, the extending portion 118 can be provided without considering the position in the in-plane direction of the extending portion 118 at different positions in the thickness direction, and the degree of freedom in design can be increased. It is beneficial in terms. Further, according to this aspect, even when the number of electronic components 13 and 23 provided in the sealing portion 80 of the electronic module increases, a large number of connector terminal portions 110 can be formed without taking a large area in the in-plane direction. It is also advantageous in that it can be provided.

As shown in FIGS. 3 and 4, the connector resin portion 150 may include a plurality of connector resin layers 151, and the extending portion 118 may be provided between the connector resin layers 151. If it is limited, the extending portion 118 may be provided between the connector resin layers 151. In this case, it is advantageous in that more connector terminal portions 110 can be provided in the thickness direction in a simple manner. 3 and 4, the connector resin portion 150 is composed of four connector resin layers 151, but the present invention is not limited to this, and the connector resin portion 150 has two, three, or five or more connectors. It may be composed of the resin layer 151.

As shown in FIG. 3, the extending portion 118 and the one-side exposed portions 136 and 137 may be connected by a connecting portion 119 that penetrates the connector resin layer 151. Similarly, the extending portion 118 and the other-side exposed portions 126 and 127 may be connected by a connecting portion 119 that penetrates the connector resin layer 151. By such a connecting portion 119, the extension portion 118 and the one-side exposed portions 136 and 137 and/or the other-side exposed portions 126 and 127 are electrically connected. In addition, as shown in FIG. 2, such a connecting portion 119 may not be provided.

When the connector portion 100 (for example, the connector resin portion 150) is sandwiched between the first substrate 11 or the first conductor layer 12 and the second substrate 21 or the second conductor layer 22, the connector portion 100 is used to This is advantageous in that the gap between the first substrate 11 and the second substrate 21 in the thickness direction can be determined, and the jig required for producing the electronic module can be reduced or eliminated.

In the case where the connector terminal portion 110 has the one-side exposed portions 136 and 137 and the other-side exposed portions 126 and 127, both the one-side surface and the other-side surface of the connector resin portion 150 are used. It is possible to connect the electronic components 13 and 23 in the sealing portion 80 and an external device.

One side exposed portion 136, 137 has one side inner exposed portion 136 and one side outer exposed portion 137, and the other side exposed portion 126, 127 has the other side inner exposed portion 126 and the other side outer exposed portion 127. When adopted, both inside and outside of the sealing portion 80, by using both the one side surface and the other side surface of the connector resin portion 150, the electronic components 13 and 23 inside the sealing portion 80 and the outside It is advantageous in that it can be connected to a device.

When the first resin material forming the connector resin portion 150 and the second resin material forming the sealing portion 80 are different, it is possible to adopt a mode according to each characteristic. For example, when the first resin material is made of a material having a higher insulation property than the second resin material, the insulation property between the plurality of connector terminal portions 110 can be enhanced. Further, when the second resin material is made of a material having a higher heat dissipation property than the first resin material, a high heat dissipation property can be realized by the second resin material.

Second Embodiment Next, a second embodiment of the present invention will be described.

In the present embodiment, as shown in FIGS. 9 to 11, the first connector 60 is provided on one side of the first electronic component 13 and on the other side of the second electronic component 23. A conductive adhesive such as solder may be provided between the first electronic component 13 and the first connecting body 60 and between the second electronic component 23 and the first connecting body 60, respectively. However, a conductive adhesive such as solder is not provided, and the first electronic component 13 and the first connecting body 60 are in direct contact with each other, and the two electronic components 13 and 23 and the first connecting body 60 are in direct contact with each other. May be Other configurations are the same as those in the first embodiment, and all aspects described in the first embodiment can be adopted. The members described in the first embodiment will be described using the same reference numerals.

In the mode in which the first connection body 60 is provided as in the present embodiment, the first substrate 11 and the second substrate 21 are directly or indirectly supported by both the connector unit 100 and the first connection body 60. It is possible to prevent the first substrate 11 and/or the second substrate 21 from being distorted.

The total thickness of the first connection body 60, the first electronic component 13 provided with the first connection body 60, and the second electronic component 23 provided on the first connection body 60 is the thickness of the connector portion 100 (for example, connector resin). Part 150). It is said that the total value of the thicknesses of the first connection body 60, the first electronic component 13 provided with the first connection body 60, and the second electronic component 23 provided on the first connection body 60 corresponds to the thickness of the connector portion 100. Is the total value of the thicknesses of the first connection body 60, the first electronic component 13 provided with the first connection body 60 and the second electronic component 23 provided on the first connection body 60, and the thickness of the connector portion 100. Means that the difference is within 5% of the thickness of the connector portion 100.

A mode in which the total value of the thicknesses of the first connector 60, the first electronic component 13 provided with the first connector 60, and the second electronic component 23 provided on the first connector 60 corresponds to the thickness of the connector portion 100. When adopting, the first electronic component 13, the first connecting body 60, and the second electronic component 23 can support the first substrate 11 and the second substrate 21 with substantially the same thickness. This is advantageous in that the first substrate 11 and/or the second substrate 21 can be more reliably prevented from being distorted.

As shown in FIG. 9, the first connecting body 60 may have a first head portion and a first column portion extending from the first head portion to the other side, and the cross section of the first connecting body 60 is substantially the same. It may be T-shaped. A metal such as Cu can be used as the material of the first connector 60.

The second electronic component 23 may have a one-side second electrode provided on one side. When the second electronic component 23 is a MOSFET, the one-side second electrode may be, for example, the gate electrode 23g, the source electrode 23s, or the gate electrode shown in FIG.

As shown in FIG. 10, a connecting portion 180 that extends in the in-plane direction and that connects the one-side second electrode and the internal exposed portion 116 may be provided.

As shown in FIG. 11, the second substrate 21 may not be provided. Then, the one-side second electrode of the second electronic component 23 provided in the first connection body 60 and the internal exposed portion 116 may be electrically connected by the connection portion 180. A conductive adhesive such as solder may be provided between the one-side second electrode and the connecting portion 180 and between the inner exposed portion 116 and the connecting portion 180, respectively.

The connection portion 180 may be formed of a plate-shaped member that extends linearly in the in-plane direction. However, the connection portion 180 is not limited to such an aspect, and the connection portion 180 may have a staircase shape or may be inclined along the in-plane direction.

Third Embodiment Next, a third embodiment of the present invention will be described.

In the present embodiment, as shown in FIGS. 12 to 14, the first connection body 60 is provided on one side of the first electronic component 13 and the other side of the second electronic component 23. The second connector 70 is provided on one side. Other configurations are similar to those of the first embodiment or the second embodiment, and all aspects described in the first embodiment and the second embodiment can be adopted. The members described in the first embodiment and the second embodiment will be described using the same reference numerals.

In the aspect in which the first connecting body 60 and the second connecting body 70 are provided as in the present embodiment, the first connecting body 60 and the first connecting body 60 and the second connecting body 70 directly or indirectly The substrate 11 and the second substrate 21 can be supported, and the first substrate 11 and/or the second substrate 21 can be prevented from being distorted.

The total thickness of the first connection body 60, the second connection body 70, the first electronic component 13 provided with the first connection body 60 and the second electronic component 23 provided on the first connection body 60 is the connector portion 100. May correspond to the thickness (for example, the connector resin portion 150). The total thickness of the first connection body 60, the second connection body 70, the first electronic component 13 provided with the first connection body 60, and the second electronic component 23 provided on the first connection body 60 is the connector portion 100. Corresponds to the thickness of the first connection body 60, the second connection body 70, the first electronic component 13 provided with the first connection body 60 and the second electronic component 23 provided on the first connection body 60. It means that the difference between the total value of the thickness of the connector and the thickness of the connector portion 100 is within 5% of the thickness of the connector portion 100.

The total thickness of the first connection body 60, the second connection body 70, the first electronic component 13 provided with the first connection body 60, and the second electronic component 23 provided on the first connection body 60 is the connector portion 100. If a mode corresponding to the thickness of the first electronic component 13, the first electronic component 13, the first connecting body 60, the second electronic component 23, and the second connecting body 70 is used, the first portion having substantially the same thickness is adopted. This is advantageous in that the substrate 11 and the second substrate 21 can be supported, and the first substrate 11 and/or the second substrate 21 can be more reliably prevented from being distorted.

Unlike the illustrated embodiment, the second connecting body 70 includes a second head portion and a second pillar extending from the second head portion to the other side, like the first connecting body 60 of the second embodiment. The second connector 70 may have a section, and the second connector 70 may have a substantially T-shaped cross section. A metal such as Cu can be used as the material of the second connector 70.

As shown in FIG. 13, also in the present embodiment, a connecting portion 180 that extends along the in-plane direction and that connects the one-side second electrode and the internal exposed portion 116 may be provided.

As shown in FIG. 14, the second substrate 21 may not be provided. Then, the one-side second electrode of the second electronic component 23 provided in the first connection body 60 and the internal exposed portion 116 may be electrically connected by the connection portion 180. A conductive adhesive such as solder may be provided between the one-side second electrode and the connecting portion 180 and between the inner exposed portion 116 and the connecting portion 180, respectively. When the second substrate 21 is not provided in this way, the second connector 70 may be provided so as to contact the first conductor layer 12 as shown in FIG. May be provided so as to abut.

Fourth Embodiment Next, a fourth embodiment of the present invention will be described.

In the present embodiment, as shown in FIGS. 15 and 16, the connector section 100 includes a first side connector section 100 a provided on the first side of the sealing section 80 and a sealing section 80 ( The second side connector portion 100b is provided on the second side (different from the first side). Other configurations are the same as those in each of the above-described embodiments, and all aspects described in each of the above-described embodiments can be adopted. The members described in each of the above embodiments will be described using the same reference numerals.

As shown in FIG. 15, when viewed along the first direction (in plan view), the first lateral connector portion 100a and the second lateral connector portion 100b may be provided on opposite sides, or As shown in 16, the first lateral connector portion 100a and the second lateral connector portion 100b may be provided on adjacent sides. The connector unit 100 also has a third lateral connector unit and a fourth lateral connector unit, and when viewed along the first direction, the first lateral connector unit 100a, the second lateral connector unit 100b, Each of the third lateral connector portion and the fourth lateral connector portion may be provided on different sides. When this mode is adopted in the mode having the first substrate 11 and the second substrate 21, it is possible to prevent the first substrate 11 and/or the second substrate 21 from being distorted by the connector portions 100 provided on each side. .. Further, the connector part 100 has a first side connector part 100a, a second side connector part 100b and a third side connector part, which correspond to three sides when viewed along the first direction. A mode in which the first side connector section 100a, the second side connector section 100b, and the third side connector section may be provided may be adopted.

Fifth Embodiment Next, a fifth embodiment of the present invention will be described.

In the present embodiment, as shown in FIGS. 17 and 18, the connector unit 100 has a connector main body 220 and a protrusion 210 protruding from the connector main body 220, and is connected to the connector unit 100. The device has a mating portion 310 composed of a concave portion provided corresponding to the protruding portion 210. In the mode shown in FIG. 17A, the connector part 100 has one protrusion 210 on each of the upper, lower, left and right sides of FIG. 17A, and the external device 300 is provided corresponding to the protrusion 210. Two mating portions 310 are provided (see FIG. 17(b)). Other configurations are the same as those in each of the above-described embodiments, and all aspects described in each of the above-described embodiments can be adopted. The members described in each of the above embodiments will be described using the same reference numerals.

When the aspect as in this embodiment is adopted, the connector portion 100 and the external device 300 can be easily and surely joined.

The external device 300 includes an external connector main body 360 and an external terminal portion 350 embedded in the external connector main body 360 and electrically connected to the external exposed portion 117. In the embodiment shown in FIGS. 17 and 18, the external connector body 360 is provided with the opening 320, and the external terminal portion 350 is exposed from the external connector body 360 through the opening 320. Then, the connector main body 220 is inserted into the opening 320 of the external connector main body 360, and each of the protrusions 210 is inserted into the corresponding mating portion 310 (see FIG. 18B), so that the external exposed portion is exposed. 117 and the external terminal portion 350 come into contact with each other, so that the external device 300 and the electronic module can be electrically connected.

The above description of each embodiment and the disclosure of the drawings are merely examples for explaining the invention described in the claims, and are described in the claims by the description of the above-described embodiments or the disclosure of the drawings. The invention is not limited. Further, the description of the claims at the beginning of the application is merely an example, and the description of the claims can be appropriately changed based on the description of the specification, drawings and the like.

11 1st board|substrate 12 1st conductor layer 13 1st electronic component 21 2nd substrate 22 2nd conductor layer 23 2nd electronic component 60 1st connection body 70 2nd connection body 80 Sealing part 100 Connector part 100a 1st side Connector part 100b Second side connector part 110 Connector terminal part 116 Internal exposed part (exposed part)
117 Externally exposed part (exposed part)
118 extension part 126 other side inside exposed part (other side exposed part)
127 Other side external exposed portion (other side exposed portion)
136 one side exposed part (one side exposed part)
137 One side exposed portion (one side exposed portion)
150 Connector resin part 180 Connection part

Claims (12)

A first substrate,
An electronic component provided on one side of the first substrate,
A connector part that is partially provided on one side of the first board, the connector part having a connector resin part and a connector terminal part provided in the connector resin part,
A sealing portion for sealing a part of the electronic component and the connector portion,
Equipped with
An electronic module in which the connector terminal portion has an exposed portion exposed from the connector resin portion and electrically connects the electronic component and an external device through the exposed portion. Further comprising a first conductor layer provided on the first substrate,
The exposed portion has an internal exposed portion that is exposed on the other side from the connector resin portion in the sealing portion,
The electronic module according to claim 1, wherein the exposed internal portion is electrically connected to the first conductor layer. The connector terminal portion has an internal exposed portion exposed from the connector resin portion inside the sealing portion, an external exposed portion exposed from the connector resin portion outside the sealing portion, and the internal exposed portion inside the connector resin portion. The electronic module according to claim 1, further comprising: an extension portion extending between the external exposure portion and the external exposure portion. A plurality of the inner exposed portion, the outer exposed portion and a plurality of extending portions extending between the inner exposed portion and the outer exposed portion are provided.
The electronic module according to claim 3, wherein at least some of the plurality of extending portions extend at different positions in the thickness direction of the connector resin portion. Further comprising a second substrate provided on one side of the electronic component,
The electronic module according to claim 1, wherein the connector resin portion is provided between the first substrate and the second substrate. 6. The connector resin portion is sandwiched by the first substrate or a first conductor layer provided on the first substrate and the second substrate or a second conductor layer provided on the second substrate. The electronic module described in. The electronic component has a first electronic component and a second electronic component,
7. The electronic module according to claim 1, wherein a first connector is provided on one side of the first electronic component and the other side of the second electronic component. The second electronic component has one side second electrode provided on one side,
The connector terminal portion has an internal exposed portion exposed on one side from the connector resin portion in the sealing portion,
The electronic module according to claim 7, further comprising a connecting portion that extends along the in-plane direction and that connects the one-side second electrode and the internal exposed portion. 9. The connector terminal portion according to claim 1, wherein the connector terminal portion has one side exposed portion exposed on one side from the connector resin portion and the other side exposed portion exposed on the other side from the connector resin portion. Electronic module described. The one-side exposed portion has one-side internal exposed portion exposed from the connector resin portion in the sealing portion, and one side external exposed portion exposed from the connector resin portion outside the sealing portion,
The said other side exposed part has the other side internal exposed part exposed from the said connector resin part inside the said sealing part, and the other side external exposed part exposed from the said connector resin part outside the said sealed part. The electronic module described in. The connector resin portion is made of a first resin material,
The electronic module according to claim 1, wherein the sealing portion is made of a second resin material different from the first resin material. The connector section includes a first lateral connector section provided on the first lateral side of the sealing section and a second lateral connector section provided on the second lateral side of the sealing section. The electronic module according to any one of claims 1 to 11, comprising.