WO2019136991A1 - 一种半导体封装模具用螺旋式下转进注胶组件 - Google Patents

一种半导体封装模具用螺旋式下转进注胶组件 Download PDF

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Publication number
WO2019136991A1
WO2019136991A1 PCT/CN2018/099969 CN2018099969W WO2019136991A1 WO 2019136991 A1 WO2019136991 A1 WO 2019136991A1 CN 2018099969 W CN2018099969 W CN 2018099969W WO 2019136991 A1 WO2019136991 A1 WO 2019136991A1
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Prior art keywords
injection
mold
rod
template
handed
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PCT/CN2018/099969
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English (en)
French (fr)
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顾贤
梁晓龙
陈世斌
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南通斯迈尔精密设备有限公司
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Publication of WO2019136991A1 publication Critical patent/WO2019136991A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/47—Means for plasticising or homogenising the moulding material or forcing it into the mould using screws
    • B29C45/48—Plasticising screw and injection screw comprising two separate screws
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/03—Injection moulding apparatus

Definitions

  • the utility model relates to a component of a semiconductor packaging mold, in particular to a spiral down-flow injection glue assembly for a semiconductor packaging mold.
  • thermosetting plastics green epoxy resins
  • semiconductor packaging molds are important equipments in semiconductor manufacturing processes. Stability and reliability directly affect the quality of semiconductor component products.
  • the purpose of the utility model is to overcome the defects of the prior art, and provide a spiral type down-injecting and injection-injecting component for a semiconductor packaging mold, which adopts a spiral injection structure, effectively solves the phenomenon of the card material and the card group, and is disposed at right and left.
  • the rotation forces are offset each other to ensure the stability of the moving platen.
  • a spiral down-injection injection molding assembly for a semiconductor package mold comprising a mold bottom plate, an injection molding cylinder mounted on opposite sides of the mold bottom plate, and a support guide column on the four corners of the mold bottom plate, fixed to the injection molding by a cylinder connection flange
  • the movable template at the top of the cylinder, and the four corners of the movable template are set on the support guiding column, the lower template fixed on the top of the supporting guiding column, the lower mold box fixed on the lower template, the upper template fixed on the top surface of the pressing machine, and fixed on the upper template
  • the upper mold box of the lower end surface of the upper mold forms a complete mold cavity with the lower mold box in a mold clamping state
  • the upper surface of the movable mold plate is mounted with a rod seat on which a plurality of left-handed injection rods and a plurality of right-handed injections are mounted Rod, and is right ⁇ left ⁇ right ⁇ left or left ⁇ right ⁇ left ⁇ right interval setting, the left-hand injection rod and the right
  • the movable template has a guiding hole at four corners, and a linear ball guiding sleeve is embedded in the guiding hole, and the movable template is set on the supporting guiding column through the linear ball guiding sleeve.
  • the left-handed injection rod and the right-handed injection rod bottom are mounted on the rod seat by an injection rod spring, and the upper end has a spiral structure.
  • the lower template is provided with a penetrating groove, and the left-handed injection rod and the right-handed injection rod provided by the rod seat pass through the penetration groove of the lower template.
  • the injection cylinders are equally spaced on the lower mold box, and the spacing is the same as the distance between the injection rods on the rod seat, and the injection plastic tube is vertically penetrated, and epoxy resin is placed inside.
  • the utility model discloses a spiral type down-turn injection glue assembly for a semiconductor package mold, which has the following advantages:
  • the injection rod is designed as a spiral structure, and the spiral propellant epoxy resin is injected during the injection, so that the epoxy resin is smoothly injected into the cavity, and no jamming or jamming occurs, which is the reverse generated in the spiral propulsion engineering.
  • the left spiral and the right spiral are arranged.
  • the bottom of the left spiral produces a rightward rotational force to the movable template
  • the bottom of the right spiral simultaneously generates a rotational force to the left, and the two forces cancel each other out. Therefore, the movable template is not inclined due to uneven force, ensuring the stability of the injection molding; the linear ball guide sleeve guiding fit between the movable template and the supporting guide column can effectively reduce the wear problem during the guiding.
  • the assembly is simple in structure and simple in operation, and can effectively improve the stability during injection molding, and can solve the problem of long-term jamming and jamming, improve the yield of the packaged product, reduce the maintenance cost of the mold, and improve the processing quality.
  • Figure 1 is a side cross-sectional view showing the structure of the present invention.
  • a spiral down-injection injection molding assembly for a semiconductor package mold disclosed in the present invention includes a mold base plate 1 , a support guide rod 2 , an injection molding cylinder 3 , a movable template 4 , and a lower template 8 .
  • Template 14 where:
  • the injection cylinders 3 are fixed on opposite sides of the mold base 1, and the support guides 2 are arranged to be fixed around the bottom of the mold.
  • the movable template 4 is fixed on the top of the injection cylinder through the cylinder connecting flange 5, and is driven up and down by the injection cylinder, the uniformly arranged guide holes are arranged around the movable template, and the linear ball guide sleeve 17 is embedded in the guiding hole, and the movable template is inserted.
  • the linear ball guide sleeve is set on the support guide rod to realize the guiding when moving up and down. The linear ball guide sleeve effectively reduces the wear between the movable template and the support guide rod, and is favorable for the vertical movement of the movable template 4.
  • a rod seat 6 is mounted on the upper surface of the movable template, and a plurality of left-handed injection rods 9 and a right-handed injection rod 10 are fixed on the rod base 6, and the left-handed injection rod and the right-handed injection rod bottom are fixed on the rod base 6 by the injection rod spring 7.
  • the left end of the left-handed injection rod and the right-handed injection rod have a spiral structure, and the left-handed injection rod and the right-handed injection rod are arranged in a line on the rod seat, and are right ⁇ left ⁇ right ⁇ left or left ⁇ right ⁇
  • the left-to-right interval setting because the reverse rotation force is generated at the bottom when the glue is injected, the form of the left and right spacing can form a mutual offset of the forces, so that the smoothness of the movable template is not affected.
  • the lower template 8 is fixed on the top of the support guide bar 2, and is in an immovable fixed form.
  • the position of the injection rod is provided with a penetration groove 18 for the left-hand injection rod and the right-hand injection rod to pass through, and on the lower template.
  • the lower mold box 12 is fixedly located above the penetrating groove, and the lower mold box is embedded with the penetrating injection cylinder 11, and the spacing between the injection cylinders 11 is consistent with the spacing between the injection rods on the rod seat, so that the rod A plurality of injection rods on the seat are inserted into the corresponding injection barrels.
  • the die bottom plate 1 is fixed on the top surface of the vertical semiconductor injection molding machine, and the upper die plate 14 is fixed on the top surface of the press machine, and the bottom plate is fixed with the upper mold box 13 at a position opposite to the lower mold box, and the press table can be moved up and down, the upper template and the upper template When the lower template is closed, a complete cavity is formed between the upper mold and the lower mold.
  • the utility model discloses a spiral type downward-injection injection molding assembly for a semiconductor packaging mold, which works by placing an epoxy resin material 15 in an injection cylinder and clamping the upper mold box and the lower mold box.
  • the injection molding cylinder is controlled to move the movable template upward, and the left-hand injection rod and the right-hand injection rod push the epoxy material in the injection barrel to be injected into the cavity.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

本申请是一种半导体封装模具用螺旋式下转进注胶组件，包括模具底板，安装在模具底板中心的注塑油缸以及位于一侧的支撑导向柱，通过油缸连接法兰固定在注塑油缸顶部的动模板，且动模板一侧套装在支撑导向柱上，固定在模架上的下模板同时固定在支撑导向柱顶部，固定在下模板上的下模盒，固定在模架上的上模板以及固定在上模板下端面的上模盒，所述动模板上表面安装有杆座，杆座上安装有多个左旋注射杆和多个右旋注射杆，且间隔设置。本申请能有效解决卡料及卡阻的现象，确保动模板稳定性。

Description

一种半导体封装模具用螺旋式下转进注胶组件 技术领域
本实用新型涉及一种半导体封装模具的组件，尤其涉及一种半导体封装模具用螺旋式下转进注胶组件。
背景技术
目前，随着人们环保意识的增强，无铅环保型热固性塑料(绿色环氧树脂)在半导体器件产品封装中的使用越来越广泛，半导体封装模具作为半导体生产过程中的重要装备，其运行的稳定性、可靠性直接影响到半导体元器件产品的质量。
封装模具多料筒下注胶转进系统作为封装模具最重要的运动组件，由于环保型环氧树脂的脱模性较差，使用现有传统的注射杆结构，其长期存在卡料、卡死现象，造成注射杆连接的转进注塑动模板运行过程中倾斜，运行不稳定，注射压力降低等影响产品质量的问题。
实用新型内容
本实用新型的目的在于克服现有技术的缺陷，提供一种半导体封装模具用螺旋式下转进注胶组件，采用螺旋式的注射结构，有效解决卡料及卡组的现象，且左右错位设置，使得旋转力相互抵消，确保动模板稳定性。
为实现上述目的，本实用新型提出如下技术方案：
一种半导体封装模具用螺旋式下转进注胶组件，包括模具底板，安装在模具底板相对两侧的注塑油缸以及位于模具底板四个角上的支撑导向柱，通过油缸连接法兰固定在注塑油缸顶部的动模板，且动模板四个角套装在支撑导向柱上，固定在支撑导向柱顶部的下模板，固定在下模板上的下模盒，固定在压机顶面的上模板以及固定在上模板下端面的上模盒，与下模盒在合模状态时形成完整 模腔，所述动模板上表面安装有杆座，杆座上安装有多个左旋注射杆和多个右旋注射杆，且呈右→左→右→左或左→右→左→右间隔设置，所述左旋注射杆及右旋注射杆顶端穿插在嵌装在下模盒的注射料筒内，随着动模板的升起，将注射料筒内的环氧树脂注入模腔内。
作为优选，所述动模板四个角上具有导向孔，且导向孔内嵌装有直线滚珠导套，动模板通过直线滚珠导套套装在支撑导向柱上。
作为优选，所述左旋注射杆和右旋注射杆底部通过注射杆弹簧安装在杆座上，上端为螺旋式结构。
作为优选，所述下模板上开设有穿透槽，杆座设置的左旋注射杆及右旋注射杆穿过下模板的穿透槽。
作为优选，所述注射料筒等间隔嵌装在下模盒上，且间距与杆座上注射杆的间距一致，且注塑料筒上下贯通，内部放置有环氧树脂。
与现有技术相比，本实用新型揭示的一种半导体封装模具用螺旋式下转进注胶组件，具有如下有益之处：
将注射杆设计成螺旋式结构，在进行注射时是螺旋推进环氧树脂，使得环氧树脂顺畅的注入模腔内，不会出现卡料或卡阻的情况，针对螺旋推进工程中产生的反向作用力，我们采用了左螺旋和右螺旋间隔设置的结构形式，当左螺旋底部对动模板产生朝右的旋转力时，右螺旋底部同时产生朝左的旋转力，两个力进行相互抵消，使得动模板不会因为受力不均而倾斜，确保注塑的稳定性；对于动模板与支撑导向柱之间采用直线滚珠导套导向配合，可以有效降低导向时的磨损问题。
本组件结构简单，操作简便，可以有效提高注胶时的稳定性，同时可以解决长期卡料，卡死的情况，提高封装产品的成品率，也降低了模具的维护成本，提高加工品质。
附图说明
图1是本实用新型的结构侧视剖视图。
具体实施方式
下面将结合本实用新型的附图，对本实用新型实施例的技术方案进行清楚、完整的描述。
如图1所示，本实用新型所揭示的一种半导体封装模具用螺旋式下转进注胶组件，包括模具底板1，支撑导向杆2，注塑油缸3，动模板4，下模板8，上模板14，其中：
注塑油缸3固定在模具底板1的相对两侧边上，而支撑导向柱2布置在固定在模具底板四周位置。
动模板4通过油缸连接法兰5固定在注塑油缸顶部，且由注塑油缸带动实现上下移动，动模板的四周具有均布的导向孔，且导向孔内嵌装有直线滚珠导套17，动模板通过直线滚珠导套套装在支撑导向杆上，实现上下移动时的导向，直线滚珠导套有效降低动模板与支撑导向杆之间的磨损，且有利于动模板4上下运动平稳。
动模板上表面安装有杆座6，而杆座6上固定有多个左旋注射杆9和右旋注射杆10，左旋注射杆和右旋注射杆底部通过注射杆弹簧7固定在杆座6上，且左旋注射杆和右旋注射杆上端为螺旋结构，所述左旋注射杆和右旋注射杆在杆座上为一字排开设置，且呈右→左→右→左或左→右→左→右间隔设置，由于 在旋转注胶时会在底部产生反向旋转力，左右间隔设置的形式可以形成作用力的相互抵消，从而不会影响动模板的平稳性。
所述下模板8固定在支撑导向杆2顶部，为不可动的固定形式，其针对注射杆的位置设置有穿透槽18，实现左旋注射杆和右旋注射杆的穿出，而在下模板上固定有下模盒12位于穿透槽上方，且下模盒内嵌装有贯通的注射料筒11，且注射料筒11之间的间距与杆座上注射杆之间的间距一致，使得杆座上的多个注射杆穿插在对应的注射料筒内。
模具底板1固定在立式半导体注塑压机台面上，上模板14固定在压机顶面上，其底面相对下模盒的位置固定有上模盒13，压机台可上下移动，上模板与下模板合模时，上模盒与下模盒之间形成完整的模腔。
本实用新型所揭示的一种半导体封装模具用螺旋式下转进注胶组件，其工作原理为：在注射料筒内放入环氧树脂材料15，将上模盒与下模盒进行合模，控制注塑油缸将动模板上移，由左旋注射杆和右旋注射杆推动注射料筒内的环氧树脂材料，从而注入模腔内。
本实用新型的技术内容及技术特征已揭示如上，然而熟悉本领域的技术人员仍可能基于本实用新型的教示及揭示而作种种不背离本实用新型精神的替换及修饰，因此，本实用新型保护范围应不限于实施例所揭示的内容，而应包括各种不背离本实用新型的替换及修饰，并为本专利申请权利要求所涵盖。

Claims (5)

  1. 一种半导体封装模具用螺旋式下转进注胶组件，包括模具底板，安装在模具底板相对两侧的注塑油缸以及位于模具底板四个角上的支撑导向柱，通过油缸连接法兰固定在注塑油缸顶部的动模板，且动模板四个角套装在支撑导向柱上，固定在支撑导向柱顶部的下模板，固定在下模板上的下模盒，固定在压机顶面的上模板以及固定在上模板下端面的上模盒，与下模盒在合模状态时形成完整模腔，其特征在于：所述动模板上表面安装有杆座，杆座上安装有多个左旋注射杆和多个右旋注射杆，且呈右→左→右→左或左→右→左→右间隔设置，所述左旋注射杆及右旋注射杆顶端穿插在嵌装在下模盒的注射料筒内，随着动模板的升起，将注射料筒内的环氧树脂注入模腔内。
  2. 根据权利要求1所述的半导体封装模具用螺旋式下转进注胶组件，其特征在于：所述动模板四个角上具有导向孔，且导向孔内嵌装有直线滚珠导套，动模板通过直线滚珠导套套装在支撑导向柱上。
  3. 根据权利要求1所述的半导体封装模具用螺旋式下转进注胶组件，其特征在于：所述左旋注射杆和右旋注射杆底部通过注射杆弹簧安装在杆座上，上端为螺旋式结构。
  4. 根据权利要求1所述的半导体封装模具用螺旋式下转进注胶组件，其特征在于：所述下模板上开设有穿透槽，杆座设置的左旋注射杆及右旋注射杆穿过下模板的穿透槽。
  5. 根据权利要求1所述的半导体封装模具用螺旋式下转进注胶组件，其特征在于：所述注射料筒等间隔嵌装在下模盒上，且间距与杆座上注射杆的间距一致，且注塑料筒上下贯通，内部放置有环氧树脂。
PCT/CN2018/099969 2018-01-09 2018-08-10 一种半导体封装模具用螺旋式下转进注胶组件 WO2019136991A1 (zh)

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CN112701208A (zh) * 2020-12-26 2021-04-23 广州荣哲科技有限公司 一种半导体发光二极管制造用胶体快速成型装置
CN113571624A (zh) * 2021-07-19 2021-10-29 盐城金意光电科技有限公司 多层远距式涂布荧光粉的led封装单元、模具及制备方法

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CN112701208A (zh) * 2020-12-26 2021-04-23 广州荣哲科技有限公司 一种半导体发光二极管制造用胶体快速成型装置
CN112701208B (zh) * 2020-12-26 2021-12-17 江苏永鼎股份有限公司 一种半导体发光二极管制造用胶体快速成型装置
CN113571624A (zh) * 2021-07-19 2021-10-29 盐城金意光电科技有限公司 多层远距式涂布荧光粉的led封装单元、模具及制备方法

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