WO2019119365A1 - Camera, photographing device and unmanned aerial vehicle - Google Patents

Camera, photographing device and unmanned aerial vehicle Download PDF

Info

Publication number
WO2019119365A1
WO2019119365A1 PCT/CN2017/117822 CN2017117822W WO2019119365A1 WO 2019119365 A1 WO2019119365 A1 WO 2019119365A1 CN 2017117822 W CN2017117822 W CN 2017117822W WO 2019119365 A1 WO2019119365 A1 WO 2019119365A1
Authority
WO
WIPO (PCT)
Prior art keywords
camera
heat sink
lens assembly
rear end
outer casing
Prior art date
Application number
PCT/CN2017/117822
Other languages
French (fr)
Chinese (zh)
Inventor
王平
Original Assignee
深圳市大疆创新科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市大疆创新科技有限公司 filed Critical 深圳市大疆创新科技有限公司
Priority to CN201780027060.4A priority Critical patent/CN109076722A/en
Priority to PCT/CN2017/117822 priority patent/WO2019119365A1/en
Publication of WO2019119365A1 publication Critical patent/WO2019119365A1/en

Links

Images

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff

Definitions

  • the present invention relates to the field of imaging device technologies, and in particular, to a camera, a camera device, and a drone.
  • Existing cameras usually use a heat source that is thermally coupled to the outer casing through a structural member for heat dissipation.
  • a heat pipe between the heat source of the camera and the casing or a method of using a fan to enhance air convection within the camera to achieve heat dissipation.
  • the above-mentioned existing heat dissipation design for the camera has high space requirements, complicated structure, and high cost.
  • the technical problem to be solved by the present invention is how to provide a heat dissipation design for a camera with low space requirements, simple structure, and low cost.
  • the present invention adopts the following technical solutions:
  • a camera comprising a housing, a lens assembly, a sensor module, and at least one heat sink.
  • the lens assembly is disposed inside the outer casing.
  • the sensor module is disposed inside the casing and disposed at a rear end of the lens assembly, the sensor module includes a circuit board and an imaging sensor, and the imaging sensor is disposed in front of the circuit board facing the lens assembly surface.
  • the heat sink includes a first end and a second end remote from the first end, the first end is connected to the circuit board, and the second end abuts against an inner wall of the outer casing for the Heat from the sensor module is transferred to the outer casing via the heat sink.
  • the first end of the heat sink is coupled to a front surface of the circuit board.
  • the first end of the heat sink is in contact with the front surface of the circuit board.
  • the heat sink is spaced apart from the imaging sensor.
  • the second end of the heat sink has a bent structure, and the second end of the heat sink is attached to the inner wall of the outer casing.
  • the outer casing is provided with a mounting port through which the sensor module and the lens assembly are loaded in a mounting direction; wherein the heat sink is second End bend The folding direction is opposite to the mounting direction.
  • the heat sink further includes a connecting portion connected between the first end and the second end, and the connecting portion is provided with a notch.
  • the camera includes a plurality of the fins, and the plurality of fins are spaced apart at a periphery of the circuit board.
  • the heat sink is a graphite sheet.
  • the rear end of the lens assembly has a rear end plate, and the rear end of the lens assembly has a rear end plate, the rear end plate is provided with an opening, and the opening is provided with a filter sheet.
  • the rear end plate is provided with a groove, the opening is disposed in the groove, the groove is for receiving the imaging sensor, and the filter is In contrast to the imaging sensor, the circuit board is attached to the rear end plate.
  • the rear end plate is provided with a plurality of first mounting holes, and the circuit board is provided with a plurality of second mounting holes respectively corresponding to the plurality of the first mounting holes,
  • the sensor module is coupled to the rear end plate of the lens assembly by a connector that is disposed through the first mounting hole and the second mounting hole.
  • the connector is a screw, a rivet or a locating pin.
  • the rear end of the outer casing is provided with a rear port for the sensor module and the lens assembly to be loaded into the outer casing via the rear port; wherein the inner wall of the outer casing is provided a root mounting tube, the peripheral edge of the rear end plate is provided with a plurality of third mounting holes respectively corresponding to the plurality of mounting tubes, and the lens assembly passes through a connecting member that is disposed through the mounting tube and the third mounting hole Connected to the outer casing.
  • the connector is a screw, a rivet or a locating pin.
  • the position of the heat sink abutting against the inner wall of the outer casing is spaced from the position of the inner wall of the outer casing where the mounting tube is disposed.
  • an image pickup apparatus includes a camera and a head mounted to the camera, the camera being the camera described in the above embodiment, and the head is connected to the camera The outer casing of the camera.
  • a drone including a body and a camera, the camera being coupled to the body through a pan/tilt head, the camera being described in the above embodiment
  • the camera is coupled between the body and the housing of the camera.
  • the camera, the camera device and the drone according to the present invention connect the first end of the heat sink to the circuit board of the sensor module by providing a heat sink on the sensor module, and the second end of the heat sink abuts the camera shell.
  • the inner wall is designed to transfer the heat generated by the sensor module of the sensor module to the outside via the circuit board and the heat sink.
  • the shell in order to achieve the effect of heat dissipation.
  • the above heat dissipation design of the invention has the characteristics of simple structure, small space requirement and low cost.
  • FIG. 1 is an assembled view of a lens assembly and a sensor module of a camera according to an exemplary embodiment
  • FIG. 2 is a schematic structural view of a sensor module of the camera shown in FIG. 1;
  • FIG. 3 is an assembled view of a lens assembly with a sensor module and a housing of the camera shown in FIG. 1;
  • FIG. 4 is a schematic structural diagram of a camera and a pan/tilt head of a drone according to an exemplary embodiment.
  • FIG. 1 a partial structural diagram of a camera capable of embodying the principles of the present invention is representatively shown, specifically showing an assembly diagram of a lens assembly and a sensor module of the camera.
  • the camera proposed by the present invention is described by taking an example of an image pickup apparatus with a pan/tilt head or a drone with a pan/tilt head. It will be readily understood by those skilled in the art that various modifications, additions, substitutions, deletions or other modifications are made to the specific embodiments described below in order to apply the related design of the camera to other types of camera devices or drones. Variations, these variations are still within the scope of the principles of the camera proposed by the present invention.
  • the camera 100 proposed by the present invention mainly includes a housing 110 , a lens assembly 120 , a sensor module 130 , and two fins 140 .
  • 2 is a schematic diagram showing the structure of a sensor module 130 of a camera 100 capable of embodying the principles of the present invention
  • FIG. 3 representatively shows a lens with a sensor module 130 of a camera 100 capable of embodying the principles of the present invention.
  • Assembly diagram of assembly 120 and housing 110 The structure, connection mode and functional relationship of the main components of the camera 100 proposed by the present invention will be described in detail below with reference to the above drawings.
  • the lens assembly 120 and the sensor module 130 are both mounted in the inner cavity 111 of the outer casing 110 , and the sensor module 130 is mounted on the rear end of the lens assembly 120 . That is, when the lens assembly 120 and the sensor module 130 are loaded into the inner cavity 111 of the outer casing 110, the sensor module 130 is closer to the rear port 112 of the outer casing 110 than the lens assembly 120.
  • the sensor module 130 mainly includes a circuit board 131 and an imaging sensor 132.
  • Circuit board 131 For example, a PCB board, the imaging sensor 132 is disposed on a front surface of the circuit board 131 facing the lens assembly 120, and the imaging sensor 132 is located substantially in the middle of the circuit board 131.
  • the rear end of the lens assembly 120 has a rear end plate 121 , and the rear end plate 121 defines three first mounting holes 1211 , and the circuit board 131 of the sensor module 130 is opened. There are three second mounting holes 1311, and three second mounting holes 1311 respectively correspond to the three first mounting holes 1211.
  • the sensor module 130 is connected to the lens by screws penetrating the first mounting hole 1211 and the second mounting hole 1311.
  • the rear end plate 121 of the assembly 120 is connected to the lens by screws penetrating the first mounting hole 1211 and the second mounting hole 1311.
  • the lens assembly 120 is not limited to having the structure of the rear end plate 121, that is, the sensor module 130 can be attached to other structures at the rear end of the lens assembly 120.
  • the number of the first mounting holes 1211, the second mounting holes 1311, and the screws is not limited to three, and the number of the three may be plural, and the number of the three is equal.
  • the sensor module 130 may also be connected to the rear end plate 121 of the lens assembly 120 through other types of connectors provided on the first mounting hole 1211 and the second mounting hole 1311, and the connector may be, for example, a rivet or a positioning pin.
  • the design of connecting the sensor module 130 and the lens assembly 120 based on the rear end plate 121 can further facilitate the adjustment of the mounting position of the sensor module 130.
  • the rear surface of the rear end plate 121 is further provided with a plurality of glue injection grooves 1214 , and the glue injection groove 1214 is filled with glue, and the sensor module 130 is connected to the rear end.
  • the adhesive tape is bonded between the rear end plate 121 and the circuit board 131 to achieve an auxiliary connection effect.
  • the above-mentioned adhesive may preferably be a thermal conductive adhesive having good thermal conductivity and electrical insulating properties such as a thermal conductive silica gel, thereby further improving the effect of assisting heat dissipation.
  • the lens assembly 120 further includes a filter 122 disposed on one side of the front surface of the rear end plate 121.
  • An opening 1212 is defined in the middle of the rear end plate 121, and the filter 122 is installed in the opening 1212.
  • the rear end plate 121 is provided with a groove 123, and the opening 1212 is opened in the groove 123, for example, at the groove bottom of the groove 123.
  • the rear end of the outer casing 110 is open with a rear port 112 communicating with the inner cavity 111 thereof, so that the sensor module 130 and the lens assembly 120 are loaded into the outer casing 110 via the rear port 112. .
  • the inner wall of the outer casing 110 is provided with a plurality of mounting tubes 113.
  • the periphery of the rear end plate 121 defines a plurality of third mounting holes 1213, and the plurality of third mounting holes 1213 respectively correspond to the plurality of mounting tubes 113, and the lens assembly 120 passes Screws that are passed through the mounting tube 113 and the third mounting hole 1213 are connected to the outer casing 110.
  • the outer casing 110 is not limited to having the structure of the mounting tube 113, that is, the lens assembly 120 can be coupled to the outer casing 110 by other means.
  • the lens assembly 120 may also be coupled to the outer casing 110 of the camera 100 through other types of connectors provided in the mounting tube 113 and the third mounting hole 1213, which may be, for example, rivets or locating pins.
  • the heat sink 140 may preferably be a graphite sheet and the number of the heat sinks 140 is two.
  • the two heat sinks 140 are respectively connected to the upper and lower ends of the sensor module 130 .
  • each of the fins 140 may be roughly divided into a first end 141, a second end 142, and a connecting portion 143.
  • the first end 141 of the heat sink 140 is connected to the circuit board 131 of the sensor module 130.
  • the second end 142 extends away from the first end 141, and when the sensor module 130 and the lens assembly 12 are inserted into the inner cavity 111 of the outer casing 110, the second end 142 abuts against the inner wall of the outer casing 110, and the second end 142 abuts The position of the inner wall of the outer casing 110 is spaced from the position of the inner wall of the outer casing 110 where the above-described mounting tube 113 is disposed.
  • the connecting portion 143 is connected between the first end 141 and the second end 142.
  • the first end 141 of the heat sink 140 is not in contact with the imaging sensor 132, that is, the heat sink 140 is spaced apart from the imaging sensor 132 on the front surface of the circuit board 131.
  • the direction of heat transfer during the heat dissipation process is roughly: imaging sensor 132 ⁇ circuit board 131 ⁇ heat sink 140 (first end 141 ⁇ connecting portion 143 ⁇ second end 142) ⁇ outer casing 110, thereby ensuring heat dissipation effect
  • the heat dissipation structure is prevented from directly contacting the imaging sensor 132 to affect its normal operation.
  • the first end 141 of the heat sink 140 and the front surface of the circuit board 131 are connected by a bonding.
  • the contact area between the heat sink 140 and the circuit board 131 can be increased, thereby improving the heat dissipation efficiency, and the connection strength between the heat sink 140 and the circuit board 131 can be enhanced by the surface contact connection.
  • the second end 142 of the heat sink 140 is designed to be bendable.
  • the second end 142 of the heat sink 140 is bent relative to the first end 141 (or the connecting portion 143), and the second end 142 is The bending direction is substantially opposite to the mounting direction X, so that the second end 142 is bent and then abuts against the inner wall of the outer casing 110 in a surface contact manner.
  • the contact area between the heat sink 140 and the inner wall of the outer casing 110 can be increased, thereby improving the heat dissipation efficiency, and at the same time, the heat sink 140 can be abutted against the inner wall of the outer casing 110 by utilizing the elastic recovery tendency of the bent structure. Ensures tight thermal contact.
  • the bending direction of the second end 142 is opposite to the mounting direction X, during the process of loading the sensor module 130 and the lens assembly 120 into the outer casing 110, the heat dissipation fins 140 and the inner wall of the outer casing 110 can be prevented from being jammed, thereby lifting the sensor.
  • the connecting portion 143 of the heat sink 140 is provided with a notch 1431.
  • the notch 1431 on the connecting portion 143 of the heat sink 140 can be used to connect the components.
  • the cable, the connector (such as a screw) or the protruding structure of the connecting member itself is passed through to prevent the heat sink 140 from interfering with the above structure.
  • the notch 1431 on the connecting portion 143 of the heat sink 140 can be flexibly designed according to the position and shape of the structure in which interference may occur, and is not limited to the embodiment.
  • the notch 1431 is provided on the connecting portion 143 of each of the fins 140, and the number and shape of the notches 1431 provided in each of the fins 140 are not unique. Moreover, since the connecting portion 143 is only a region defined on the heat sink 140 according to the difference of the connected structure, when the heat sink 140 does not have the connecting portion 143, the notch 1431 may be selectively disposed at the first end 141 thereof. Or the second end 142, that is, any position on the heat sink 140 can be opened as needed.
  • the number and distribution of the heat sinks 140 are not unique.
  • the number of the heat sinks 140 may be one, two or more depending on the shape and structure of the camera and the connection relationship of the various components. That is, the camera proposed by the present invention includes at least one heat sink 140.
  • the distribution manner thereof may preferably be spaced apart at the periphery of the circuit board 131 of the sensor module 130, that is, the portions of the inner surface of the circuit board 131 near the outer circumference are spaced apart and extend outward.
  • the camera of the present invention is configured by disposing a heat sink on the sensor module, connecting the first end of the heat sink to the circuit board of the sensor module, and abutting the second end of the heat sink against the inner wall of the camera housing.
  • the heat generated by the imaging sensor of the sensor module can be transmitted to the outer casing via the circuit board and the heat sink, thereby achieving the heat dissipation effect.
  • the above heat dissipation design of the invention has the characteristics of simple structure, small space requirement and low cost.
  • an exemplary embodiment of an image pickup apparatus proposed by the present invention will be described below.
  • the imaging device proposed by the present invention will be described based on an imaging device having a pan/tilt and a camera. It will be readily understood by those skilled in the art that various modifications, additions, substitutions, deletions, or other changes are made to the specific embodiments described below, in order to apply the design in this embodiment to an imaging device of another configuration. The variation is still within the scope of the principle of the image pickup apparatus proposed by the present invention.
  • the display device proposed by the present invention mainly includes a camera and a pan/tilt connected to the camera.
  • the camera is the camera described in the above embodiment, and the pan/tilt is connected to the outer casing of the camera.
  • the circuit board is further provided with a connection port for connecting with other components of the image pickup device, for example, connecting the camera control elements, thereby controlling functions such as zooming and focusing of the camera.
  • the present invention provides an image pickup apparatus.
  • the heat dissipation design of the image pickup apparatus has the characteristics of simple structure, small space requirement, and low cost.
  • FIG. 4 a partial structural diagram of a drone capable of embodying the principle of the present invention is representatively shown, and a schematic structural view of a combination of a camera and a pan/tilt head of the drone is specifically shown.
  • the drone proposed by the present invention is described as an example of a drone equipped with a camera through a pan/tilt head. It will be readily understood by those skilled in the art that various modifications, additions, substitutions, and deletions are made to the specific embodiments described below in order to apply the related design of the drone to other types of aircraft with camera functions. Or other variations, these variations are still within the scope of the principles of the drone proposed by the present invention.
  • the drone proposed by the present invention mainly includes a body and a camera.
  • the camera is the camera 100 described in the above embodiment, and the camera 100 is connected to the body through the pan/tilt axis 200 , and the pan/tilt head 200 is connected between the body and the outer casing 110 of the camera 100 .
  • the display device proposed by the present invention mainly includes a camera and a pan/tilt connected to the camera.
  • the camera is the camera described in the above embodiment, and the pan/tilt is connected to the outer casing of the camera.
  • the circuit board 131 of the camera 100 is further provided with two connection ports 1312 for respectively connecting with other components of the camera or the drone, for example, respectively with the camera control component. It is connected to the body of the drone to control the zoom and focus of the camera.
  • the present invention proposes a drone, and by adopting the camera proposed by the present invention, the heat dissipation design of the drone has the characteristics of simple structure, small space requirement and low cost.

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Studio Devices (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)

Abstract

A camera (100), a photographing device and an unmanned aerial vehicle, the camera (100) comprising a housing (110), a lens assembly (120), a sensor module (130) and at least one heat-dissipation fin (140). The lens assembly (120) is disposed inside of the housing (110). The sensor module (130) is disposed inside of the housing (110) and disposed at the rear end of the lens assembly (120); the sensor module (130) comprises a circuit board (131) and an imaging sensor (132), and the imaging sensor (132) is disposed on the front surface of the circuit board (131) facing the lens assembly (120). The heat-dissipation fin (140) comprises a first end (141) and a second end (142) far away from the first end (141); the first end (141) is connected to the circuit board (131), and the second end (142) abuts against the inner wall of the housing (110) so as to deliver heat from the sensor module (130) to the housing (110) by means of the heat-dissipation fin (140).

Description

相机、摄像装置以及无人机Camera, camera and drone 技术领域Technical field
本发明涉及成像设备技术领域,具体而言,涉及一种相机、摄像装置以及无人机。The present invention relates to the field of imaging device technologies, and in particular, to a camera, a camera device, and a drone.
背景技术Background technique
现有相机通常采用热源与外壳通过结构件连接而进行导热的散热设计。例如,在相机的热源与外壳之间设置热管的方式,或者采用风扇增强相机内空气对流而实现散热的方式。然而,上述针对相机的现有散热设计,对空间要求高、结构复杂、成本较高。Existing cameras usually use a heat source that is thermally coupled to the outer casing through a structural member for heat dissipation. For example, a way of providing a heat pipe between the heat source of the camera and the casing, or a method of using a fan to enhance air convection within the camera to achieve heat dissipation. However, the above-mentioned existing heat dissipation design for the camera has high space requirements, complicated structure, and high cost.
发明内容Summary of the invention
本发明所要解决的技术问题是如何提供一种对空间要求较低、结构简单且成本较低的相机的散热设计。The technical problem to be solved by the present invention is how to provide a heat dissipation design for a camera with low space requirements, simple structure, and low cost.
本发明的额外方面和优点将部分地在下面的描述中阐述,并且部分地将从描述中变得显然,或者可以通过本发明的实践而习得。The additional aspects and advantages of the present invention will be set forth in part in the description which follows in
为实现上述目的,本发明采用如下技术方案:To achieve the above object, the present invention adopts the following technical solutions:
根据本发明的一个方面,提供一种相机,所述相机包括外壳、镜头组件、传感器模块以及至少一片散热片。所述镜头组件设于所述外壳内部。所述传感器模块设于所述外壳内部并设于所述镜头组件的后端,所述传感器模块包括电路板以及成像传感器,所述成像传感器设于所述电路板的朝向所述镜头组件的前表面。所述散热片包括第一端和远离所述第一端的第二端,所述第一端连接于所述电路板,所述第二端抵接于所述外壳的内壁,以供所述传感器模块的热量经由所述散热片传递至所述外壳。According to an aspect of the invention, a camera is provided, the camera comprising a housing, a lens assembly, a sensor module, and at least one heat sink. The lens assembly is disposed inside the outer casing. The sensor module is disposed inside the casing and disposed at a rear end of the lens assembly, the sensor module includes a circuit board and an imaging sensor, and the imaging sensor is disposed in front of the circuit board facing the lens assembly surface. The heat sink includes a first end and a second end remote from the first end, the first end is connected to the circuit board, and the second end abuts against an inner wall of the outer casing for the Heat from the sensor module is transferred to the outer casing via the heat sink.
根据本发明的其中一个实施方式,所述散热片的第一端连接于所述电路板的前表面。According to one of the embodiments of the present invention, the first end of the heat sink is coupled to a front surface of the circuit board.
根据本发明的其中一个实施方式,所述散热片的第一端与所述电路板的前表面相贴合。According to one of the embodiments of the present invention, the first end of the heat sink is in contact with the front surface of the circuit board.
根据本发明的其中一个实施方式,所述散热片与所述成像传感器间隔分布。According to one of the embodiments of the present invention, the heat sink is spaced apart from the imaging sensor.
根据本发明的其中一个实施方式,所述散热片的第二端呈弯折结构,而使所述散热片的第二端与所述外壳的内壁贴合。According to one embodiment of the present invention, the second end of the heat sink has a bent structure, and the second end of the heat sink is attached to the inner wall of the outer casing.
根据本发明的其中一个实施方式,所述外壳开设有安装端口,所述传感器模块和镜头组件是经由所述安装端口并沿一安装方向装入所述外壳;其中,所述散热片的第二端的弯 折方向与所述安装方向相反。According to one embodiment of the present invention, the outer casing is provided with a mounting port through which the sensor module and the lens assembly are loaded in a mounting direction; wherein the heat sink is second End bend The folding direction is opposite to the mounting direction.
根据本发明的其中一个实施方式,所述散热片还包括连接部,所述连接部连接于所述第一端和第二端之间,所述连接部上开设有缺口。According to one embodiment of the present invention, the heat sink further includes a connecting portion connected between the first end and the second end, and the connecting portion is provided with a notch.
根据本发明的其中一个实施方式,所述相机包括多片所述散热片,多片所述散热片在所述电路板的周缘间隔分布。According to one of the embodiments of the present invention, the camera includes a plurality of the fins, and the plurality of fins are spaced apart at a periphery of the circuit board.
根据本发明的其中一个实施方式,所述散热片为石墨片。According to one of the embodiments of the present invention, the heat sink is a graphite sheet.
根据本发明的其中一个实施方式,所述镜头组件的后端具有后端板,所述镜头组件的后端具有后端板,所述后端板开设有开口,所述开口内安装有滤光片。According to one embodiment of the present invention, the rear end of the lens assembly has a rear end plate, and the rear end of the lens assembly has a rear end plate, the rear end plate is provided with an opening, and the opening is provided with a filter sheet.
根据本发明的其中一个实施方式,所述后端板设有凹槽,所述开口设置在所述凹槽内,所述凹槽用于收容所述成像传感器,使所述滤光片与所述成像传感器相对,所述电路板贴合于所述后端板。根据本发明的其中一个实施方式,所述后端板开设有多个第一安装孔,所述电路板开设有分别对应于多个所述第一安装孔的多个第二安装孔,所述传感器模块通过穿设于所述第一安装孔和第二安装孔的连接件连接于所述镜头组件的后端板。According to one embodiment of the present invention, the rear end plate is provided with a groove, the opening is disposed in the groove, the groove is for receiving the imaging sensor, and the filter is In contrast to the imaging sensor, the circuit board is attached to the rear end plate. According to one embodiment of the present invention, the rear end plate is provided with a plurality of first mounting holes, and the circuit board is provided with a plurality of second mounting holes respectively corresponding to the plurality of the first mounting holes, The sensor module is coupled to the rear end plate of the lens assembly by a connector that is disposed through the first mounting hole and the second mounting hole.
根据本发明的其中一个实施方式,所述连接件为螺钉、铆钉或定位销。According to one of the embodiments of the invention, the connector is a screw, a rivet or a locating pin.
根据本发明的其中一个实施方式,所述外壳的后端开设有后端口,以供所述传感器模块和镜头组件经由所述后端口装入所述外壳;其中,所述外壳的内壁设有多根安装管,所述后端板的周缘开设有分别对应于多根所述安装管的多个第三安装孔,所述镜头组件通过穿设于所述安装管和第三安装孔的连接件连接于所述外壳。According to one embodiment of the present invention, the rear end of the outer casing is provided with a rear port for the sensor module and the lens assembly to be loaded into the outer casing via the rear port; wherein the inner wall of the outer casing is provided a root mounting tube, the peripheral edge of the rear end plate is provided with a plurality of third mounting holes respectively corresponding to the plurality of mounting tubes, and the lens assembly passes through a connecting member that is disposed through the mounting tube and the third mounting hole Connected to the outer casing.
根据本发明的其中一个实施方式,所述连接件为螺钉、铆钉或定位销。According to one of the embodiments of the invention, the connector is a screw, a rivet or a locating pin.
根据本发明的其中一个实施方式,所述散热片抵接于所述外壳内壁的位置与所述外壳内壁的设置所述安装管的位置相间隔。According to one of the embodiments of the present invention, the position of the heat sink abutting against the inner wall of the outer casing is spaced from the position of the inner wall of the outer casing where the mounting tube is disposed.
根据本发明的另一个方面,提供一种摄像装置,所述摄像装置包括相机以及连接于所述相机的云台,所述相机为上述实施方式中所述的相机,所述云台连接于所述相机的外壳。According to another aspect of the present invention, an image pickup apparatus includes a camera and a head mounted to the camera, the camera being the camera described in the above embodiment, and the head is connected to the camera The outer casing of the camera.
根据本发明的再一个方面,提供一种无人机,所述无人机包括机身以及相机,所述相机通过云台轴连接于所述机身,所述相机为上述实施方式中所述的相机,所述云台轴连接于所述机身与所述相机的外壳之间。According to still another aspect of the present invention, a drone is provided, the drone including a body and a camera, the camera being coupled to the body through a pan/tilt head, the camera being described in the above embodiment The camera is coupled between the body and the housing of the camera.
由上述技术方案可知,本发明的有益效果是:It can be seen from the above technical solutions that the beneficial effects of the present invention are:
本发明提出的相机、摄像装置以及无人机,通过在传感器模块上设置散热片,将散热片的第一端连接于传感器模块的电路板,并将散热片的第二端抵接于相机外壳内壁的设计,能够将传感器模块的成像传感器产生的热量经由电路板和散热片传递至外 壳,从而达成散热的效果。本发明的上述散热设计具有结构简单、对空间要求小且成本较低的特点。The camera, the camera device and the drone according to the present invention connect the first end of the heat sink to the circuit board of the sensor module by providing a heat sink on the sensor module, and the second end of the heat sink abuts the camera shell. The inner wall is designed to transfer the heat generated by the sensor module of the sensor module to the outside via the circuit board and the heat sink. The shell, in order to achieve the effect of heat dissipation. The above heat dissipation design of the invention has the characteristics of simple structure, small space requirement and low cost.
本发明中通过以下参照附图对优选实施例的说明,本发明的上述以及其它目的、特征和优点将更加明显。The above and other objects, features and advantages of the present invention will become more apparent from
附图说明DRAWINGS
图1是根据一示例性实施方式示出的一种相机的镜头组件和传感器模块的组装示意图;1 is an assembled view of a lens assembly and a sensor module of a camera according to an exemplary embodiment;
图2是图1示出的相机的传感器模块的结构示意图;2 is a schematic structural view of a sensor module of the camera shown in FIG. 1;
图3是图1示出的相机的带有传感器模块的镜头组件和外壳的组装示意图;3 is an assembled view of a lens assembly with a sensor module and a housing of the camera shown in FIG. 1;
图4是根据一示例性实施方式示出的一种无人机的相机和云台轴的结构示意图。FIG. 4 is a schematic structural diagram of a camera and a pan/tilt head of a drone according to an exemplary embodiment.
其中,附图标记说明如下:Among them, the reference numerals are as follows:
100.相机;100. camera;
110.外壳;110. outer casing;
111.内腔;111. lumen;
112.后端口;112. After port;
113.安装管;113. Install the pipe;
120.镜头组件;120. lens assembly;
121.后端板;121. The back end board;
1211.第一安装孔;1211. First mounting hole;
1212.开口;1212. Opening;
1213.第三安装孔;1213. The third mounting hole;
1214.注胶槽;1214. Injection tank;
122.滤光片;122. Filter;
123.凹槽;123. Groove;
130.传感器模块;130. a sensor module;
131.电路板;131. circuit board;
1311.第二安装孔;1311. Second mounting hole;
1312.连接端口1312. Connection port
132.成像传感器; 132. imaging sensor;
140.散热片;140. heat sink;
141.第一端;141. The first end;
142.第二端;142. Second end;
143.连接部;143. Connection;
1431.缺口;1431. Gap;
200.云台轴;200. PTZ axis;
X.安装方向。X. Installation direction.
具体实施方式Detailed ways
现在将参考附图更全面地描述示例实施方式。然而,示例实施方式能够以多种形式实施,且不应被理解为限于在此阐述的实施方式;相反,提供这些实施方式使得本发明将全面和完整,并将示例实施方式的构思全面地传达给本领域的技术人员。图中相同的附图标记表示相同或类似的结构,因而将省略它们的详细描述。Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be embodied in a variety of forms and should not be construed as being limited to the embodiments set forth herein. To those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed description will be omitted.
相机实施方式Camera implementation
参阅图1,图1中代表性地示出了能够体现本发明的原理的相机的部分结构示意图,具体示出了相机的镜头组件和传感器模块的组装示意图。在该示例性实施方式中,本发明提出的相机是以应用于带有云台的摄像装置或带有云台轴的无人机为例进行说明。本领域技术人员容易理解的是,为将该相机的相关设计应用于其他类型的摄像装置或无人机,而对下述的具体实施方式做出多种改型、添加、替代、删除或其他变化,这些变化仍在本发明提出的相机的原理的范围内。Referring to FIG. 1, a partial structural diagram of a camera capable of embodying the principles of the present invention is representatively shown, specifically showing an assembly diagram of a lens assembly and a sensor module of the camera. In the exemplary embodiment, the camera proposed by the present invention is described by taking an example of an image pickup apparatus with a pan/tilt head or a drone with a pan/tilt head. It will be readily understood by those skilled in the art that various modifications, additions, substitutions, deletions or other modifications are made to the specific embodiments described below in order to apply the related design of the camera to other types of camera devices or drones. Variations, these variations are still within the scope of the principles of the camera proposed by the present invention.
如图1所示,同时配合参阅图2和图3,在本实施方式中,本发明提出的相机100主要包括外壳110、镜头组件120、传感器模块130以及两片散热片140。图2中代表性地示出了能够体现本发明原理的相机100的传感器模块130的结构示意图;图3中代表性地示出了能够体现本发明原理的相机100的带有传感器模块130的镜头组件120和外壳110的组装示意图。以下结合上述附图,对本发明提出的相机100的各主要组成部分的结构、连接方式和功能关系进行详细说明。As shown in FIG. 1 , with reference to FIG. 2 and FIG. 3 , in the present embodiment, the camera 100 proposed by the present invention mainly includes a housing 110 , a lens assembly 120 , a sensor module 130 , and two fins 140 . 2 is a schematic diagram showing the structure of a sensor module 130 of a camera 100 capable of embodying the principles of the present invention; FIG. 3 representatively shows a lens with a sensor module 130 of a camera 100 capable of embodying the principles of the present invention. Assembly diagram of assembly 120 and housing 110. The structure, connection mode and functional relationship of the main components of the camera 100 proposed by the present invention will be described in detail below with reference to the above drawings.
如图1至图3所示,在本实施方式中,镜头组件120和传感器模块130均安装在外壳110的内腔111中,且传感器模块130安装在镜头组件120的后端。即,镜头组件120和传感器模块130装入外壳110的内腔111时,传感器模块130较镜头组件120靠近外壳110的后端口112。传感器模块130主要包括电路板131以及成像传感器132。电路板131 可以例如为PCB板,成像传感器132设置在电路板131的朝向镜头组件120的前表面,且成像传感器132大致位于电路板131的中部。As shown in FIGS. 1 to 3 , in the present embodiment, the lens assembly 120 and the sensor module 130 are both mounted in the inner cavity 111 of the outer casing 110 , and the sensor module 130 is mounted on the rear end of the lens assembly 120 . That is, when the lens assembly 120 and the sensor module 130 are loaded into the inner cavity 111 of the outer casing 110, the sensor module 130 is closer to the rear port 112 of the outer casing 110 than the lens assembly 120. The sensor module 130 mainly includes a circuit board 131 and an imaging sensor 132. Circuit board 131 For example, a PCB board, the imaging sensor 132 is disposed on a front surface of the circuit board 131 facing the lens assembly 120, and the imaging sensor 132 is located substantially in the middle of the circuit board 131.
进一步地,如图1所示,在本实施方式中,镜头组件120的后端具有后端板121,该后端板121开设有三个第一安装孔1211,传感器模块130的电路板131上开设有三个第二安装孔1311,且三个第二安装孔1311分别对应于三个第一安装孔1211,传感器模块130通过穿设于第一安装孔1211和第二安装孔1311的螺钉连接于镜头组件120的后端板121。Further, as shown in FIG. 1 , in the embodiment, the rear end of the lens assembly 120 has a rear end plate 121 , and the rear end plate 121 defines three first mounting holes 1211 , and the circuit board 131 of the sensor module 130 is opened. There are three second mounting holes 1311, and three second mounting holes 1311 respectively correspond to the three first mounting holes 1211. The sensor module 130 is connected to the lens by screws penetrating the first mounting hole 1211 and the second mounting hole 1311. The rear end plate 121 of the assembly 120.
在其他实施方式中,镜头组件120并不限于具有后端板121的结构,即传感器模块130可以连接在镜头组件120后端的其他结构上。第一安装孔1211、第二安装孔1311和螺钉的数量并不限于三个,三者的数量分别可为多个,且三者的数量相等。另外,传感器模块130亦可通过设于第一安装孔1211和第二安装孔1311的其他类型的连接件连接于镜头组件120的后端板121,该连接件可以例如为铆钉或定位销。再者,基于后端板121将传感器模块130与镜头组件120连接起来的设计,能够进一步便于调节传感器模块130的安装位置。In other embodiments, the lens assembly 120 is not limited to having the structure of the rear end plate 121, that is, the sensor module 130 can be attached to other structures at the rear end of the lens assembly 120. The number of the first mounting holes 1211, the second mounting holes 1311, and the screws is not limited to three, and the number of the three may be plural, and the number of the three is equal. In addition, the sensor module 130 may also be connected to the rear end plate 121 of the lens assembly 120 through other types of connectors provided on the first mounting hole 1211 and the second mounting hole 1311, and the connector may be, for example, a rivet or a positioning pin. Moreover, the design of connecting the sensor module 130 and the lens assembly 120 based on the rear end plate 121 can further facilitate the adjustment of the mounting position of the sensor module 130.
另外,如图1所示,在本实施方式中,后端板121的后表面还开设有多个注胶槽1214,注胶槽1214内灌注有粘胶,而在传感器模块130连接于后端板121时,利用粘胶粘接在后端板121与电路板131之间,达成辅助连接的效果。进一步地,上述粘胶可以优选采用导热硅胶等导热性能较好且具有电绝缘性能的导热胶,从而进一步提升辅助散热的效果。In addition, as shown in FIG. 1 , in the embodiment, the rear surface of the rear end plate 121 is further provided with a plurality of glue injection grooves 1214 , and the glue injection groove 1214 is filled with glue, and the sensor module 130 is connected to the rear end. In the case of the plate 121, the adhesive tape is bonded between the rear end plate 121 and the circuit board 131 to achieve an auxiliary connection effect. Further, the above-mentioned adhesive may preferably be a thermal conductive adhesive having good thermal conductivity and electrical insulating properties such as a thermal conductive silica gel, thereby further improving the effect of assisting heat dissipation.
如图1所示,在本实施方式中,镜头组件120还包括设置在后端板121的前表面一侧的滤光片122。后端板121中部开设有开口1212,滤光片122安装于该开口1212中。进一步地,后端板121设置有凹槽123,上述开口1212即开设在凹槽123内,例如设置在凹槽123的槽底。传感器模块130安装在镜头组件120的后端板121时,成像传感器132被收容在该凹槽123内,滤光片122与成像传感器132相对,且电路板131(包括散热片140)与后端板121相贴合。通过上述设计,成像传感器132产生的热量能够经由电路板131传递至后端板121,从而利用后端板121达成辅助散热的效果。As shown in FIG. 1, in the present embodiment, the lens assembly 120 further includes a filter 122 disposed on one side of the front surface of the rear end plate 121. An opening 1212 is defined in the middle of the rear end plate 121, and the filter 122 is installed in the opening 1212. Further, the rear end plate 121 is provided with a groove 123, and the opening 1212 is opened in the groove 123, for example, at the groove bottom of the groove 123. When the sensor module 130 is mounted on the rear end plate 121 of the lens assembly 120, the imaging sensor 132 is housed in the recess 123, the filter 122 is opposed to the imaging sensor 132, and the circuit board 131 (including the heat sink 140) and the rear end The plates 121 are attached. With the above design, the heat generated by the imaging sensor 132 can be transmitted to the rear end plate 121 via the circuit board 131, thereby achieving the effect of assisting heat dissipation by the rear end plate 121.
进一步地,如图3所示,在本实施方式中,外壳110的后端开设有连通于其内腔111的后端口112,以供传感器模块130和镜头组件120经由后端口112装入外壳110。外壳110的内壁设有多根安装管113,后端板的121的周缘开设有多个第三安装孔1213,且多个第三安装孔1213分别对应于多根安装管113,镜头组件120通过穿设于安装管113和第三安装孔1213的螺钉与外壳110连接。通过上述设计,成像传感器132传递至后端板 121的部分热量能够经由螺钉和安装管113进一步传递至外壳110,从而优化辅助散热的效果。Further, as shown in FIG. 3, in the present embodiment, the rear end of the outer casing 110 is open with a rear port 112 communicating with the inner cavity 111 thereof, so that the sensor module 130 and the lens assembly 120 are loaded into the outer casing 110 via the rear port 112. . The inner wall of the outer casing 110 is provided with a plurality of mounting tubes 113. The periphery of the rear end plate 121 defines a plurality of third mounting holes 1213, and the plurality of third mounting holes 1213 respectively correspond to the plurality of mounting tubes 113, and the lens assembly 120 passes Screws that are passed through the mounting tube 113 and the third mounting hole 1213 are connected to the outer casing 110. Through the above design, the imaging sensor 132 is transmitted to the rear end board A portion of the heat of 121 can be further transferred to the outer casing 110 via screws and mounting tubes 113 to optimize the effect of assisting heat dissipation.
在其他实施方式中,外壳110并不限于具有安装管113的结构,即镜头组件120可以通过其他方式与外壳110连接。另外,镜头组件120亦可通过设于安装管113和第三安装孔1213的其他类型的连接件与相机100的外壳110连接,该连接件可以例如为铆钉或定位销。In other embodiments, the outer casing 110 is not limited to having the structure of the mounting tube 113, that is, the lens assembly 120 can be coupled to the outer casing 110 by other means. In addition, the lens assembly 120 may also be coupled to the outer casing 110 of the camera 100 through other types of connectors provided in the mounting tube 113 and the third mounting hole 1213, which may be, for example, rivets or locating pins.
如图1至图3所示,在本实施方式中,散热片140可以优选为石墨片且散热片140的数量为两片,两片散热片140分别连接在传感器模块130的上、下两端。具体而言,每片散热片140可大致划分为第一端141、第二端142以及连接部143。其中,散热片140的第一端141连接在传感器模块130的电路板131上。第二端142远离第一端141延伸,且当传感器模块130和镜头组件12装入外壳110的内腔111时,第二端142抵接在外壳110的内壁,且第二端142抵接于外壳110内壁的位置与外壳110内壁的设置上述安装管113的位置相间隔。连接部143连接在第一端141和第二端142之间。通过上述结构设计,传感器模块130的成像传感器132产生的热量能够经由电路板131和散热片140传递到外壳110,从而实现散热的效果。As shown in FIG. 1 to FIG. 3 , in the embodiment, the heat sink 140 may preferably be a graphite sheet and the number of the heat sinks 140 is two. The two heat sinks 140 are respectively connected to the upper and lower ends of the sensor module 130 . . Specifically, each of the fins 140 may be roughly divided into a first end 141, a second end 142, and a connecting portion 143. The first end 141 of the heat sink 140 is connected to the circuit board 131 of the sensor module 130. The second end 142 extends away from the first end 141, and when the sensor module 130 and the lens assembly 12 are inserted into the inner cavity 111 of the outer casing 110, the second end 142 abuts against the inner wall of the outer casing 110, and the second end 142 abuts The position of the inner wall of the outer casing 110 is spaced from the position of the inner wall of the outer casing 110 where the above-described mounting tube 113 is disposed. The connecting portion 143 is connected between the first end 141 and the second end 142. Through the above structural design, the heat generated by the imaging sensor 132 of the sensor module 130 can be transmitted to the outer casing 110 via the circuit board 131 and the heat sink 140, thereby achieving the effect of heat dissipation.
进一步地,如图2所示,在本实施方式中,散热片140的第一端141不与成像传感器132接触,即散热片140与成像传感器132间隔分布在电路板131的前表面上。通过上述结构设计,散热过程中热量传递的方向大致为:成像传感器132→电路板131→散热片140(第一端141→连接部143→第二端142)→外壳110,从而在保证散热效果的同时,避免散热结构与成像传感器132直接接触而影响其正常运行。Further, as shown in FIG. 2, in the present embodiment, the first end 141 of the heat sink 140 is not in contact with the imaging sensor 132, that is, the heat sink 140 is spaced apart from the imaging sensor 132 on the front surface of the circuit board 131. Through the above structural design, the direction of heat transfer during the heat dissipation process is roughly: imaging sensor 132 → circuit board 131 → heat sink 140 (first end 141 → connecting portion 143 → second end 142) → outer casing 110, thereby ensuring heat dissipation effect At the same time, the heat dissipation structure is prevented from directly contacting the imaging sensor 132 to affect its normal operation.
进一步地,如图2所示,在本实施方式中,散热片140的第一端141与电路板131的前表面是采用贴合的连接方式。通过上述结构设计,能够增大散热片140与电路板131的接触面积,从而提高散热效率,同时能够利用面接触的连接方式增强散热片140与电路板131的连接强度。Further, as shown in FIG. 2, in the present embodiment, the first end 141 of the heat sink 140 and the front surface of the circuit board 131 are connected by a bonding. With the above-described structural design, the contact area between the heat sink 140 and the circuit board 131 can be increased, thereby improving the heat dissipation efficiency, and the connection strength between the heat sink 140 and the circuit board 131 can be enhanced by the surface contact connection.
进一步地,如图1至图3所示,在本实施方式中,散热片140的第二端142设计为可弯折的结构。当带有传感器模块130的镜头组件120沿一安装方向X装入外壳110中时,散热片140的第二端142相对第一端141(或连接部143)弯折,且第二端142的弯折方向与安装方向X大致相反,从而使第二端142弯折后仍以面接触的方式抵接于外壳110的内壁。通过上述结构设计,能够增大散热片140与外壳110内壁的接触面积,从而提高散热效率,同时能够利用弯折结构的弹性恢复趋势使散热片140抵接在外壳110的内壁, 保证紧密的散热接触。另外,由于第二端142的弯折方向与安装方向X相反,在传感器模块130和镜头组件120装入外壳110的过程中,能够避免散热片140与外壳110的内壁产生卡顿,从而提升传感器模块130和镜头组件120装入外壳110时的顺畅度。Further, as shown in FIGS. 1 to 3, in the present embodiment, the second end 142 of the heat sink 140 is designed to be bendable. When the lens assembly 120 with the sensor module 130 is loaded into the housing 110 in a mounting direction X, the second end 142 of the heat sink 140 is bent relative to the first end 141 (or the connecting portion 143), and the second end 142 is The bending direction is substantially opposite to the mounting direction X, so that the second end 142 is bent and then abuts against the inner wall of the outer casing 110 in a surface contact manner. Through the above structural design, the contact area between the heat sink 140 and the inner wall of the outer casing 110 can be increased, thereby improving the heat dissipation efficiency, and at the same time, the heat sink 140 can be abutted against the inner wall of the outer casing 110 by utilizing the elastic recovery tendency of the bent structure. Ensures tight thermal contact. In addition, since the bending direction of the second end 142 is opposite to the mounting direction X, during the process of loading the sensor module 130 and the lens assembly 120 into the outer casing 110, the heat dissipation fins 140 and the inner wall of the outer casing 110 can be prevented from being jammed, thereby lifting the sensor. The smoothness of the module 130 and the lens assembly 120 when the housing 110 is loaded.
进一步地,如图2所示,在本实施方式中,散热片140的连接部143上开设有缺口1431。通过上述结构设计,当传感器模块130安装到镜头组件120上,或者带有传感器模块130的镜头组件120安装到外壳110内时,散热片140的连接部143上的缺口1431可供连接元件之间的线缆、连接件(例如螺钉)或连接元件自身的凸出结构穿过,避免散热片140与上述结构产生干涉。容易理解的是,散热片140的连接部143上的缺口1431可根据可能产生干涉的结构的位置和形状等灵活设计,并不以本实施方式为限。因此,并非每片散热片140的连接部143上均设置缺口1431,且每片散热片140上设置的缺口1431的数量和形状并不唯一。再者,由于连接部143仅是根据所连接结构的区别而在散热片140上划分出的区域,因此当散热片140不具有连接部143时,缺口1431亦可选择设置在其第一端141或第二端142上,即散热片140上任何位置均可依需开设缺口1431。Further, as shown in FIG. 2, in the present embodiment, the connecting portion 143 of the heat sink 140 is provided with a notch 1431. Through the above structural design, when the sensor module 130 is mounted on the lens assembly 120, or the lens assembly 120 with the sensor module 130 is mounted into the housing 110, the notch 1431 on the connecting portion 143 of the heat sink 140 can be used to connect the components. The cable, the connector (such as a screw) or the protruding structure of the connecting member itself is passed through to prevent the heat sink 140 from interfering with the above structure. It is easily understood that the notch 1431 on the connecting portion 143 of the heat sink 140 can be flexibly designed according to the position and shape of the structure in which interference may occur, and is not limited to the embodiment. Therefore, not only the notch 1431 is provided on the connecting portion 143 of each of the fins 140, and the number and shape of the notches 1431 provided in each of the fins 140 are not unique. Moreover, since the connecting portion 143 is only a region defined on the heat sink 140 according to the difference of the connected structure, when the heat sink 140 does not have the connecting portion 143, the notch 1431 may be selectively disposed at the first end 141 thereof. Or the second end 142, that is, any position on the heat sink 140 can be opened as needed.
需要说明的是,在其他实施方式中,散热片140的数量和分布并不唯一。根据相机的外形、结构及各部分元件的连接关系,散热片140的数量可以为一片、两片或两片以上,即本发明提出的相机包括至少一片散热片140。其中,散热片140的数量为多片时,其分布方式可以优选为在传感器模块130的电路板131的周缘间隔分布,即在电路板131的内表面靠近外周的部分间隔分布且向外延伸。It should be noted that in other embodiments, the number and distribution of the heat sinks 140 are not unique. The number of the heat sinks 140 may be one, two or more depending on the shape and structure of the camera and the connection relationship of the various components. That is, the camera proposed by the present invention includes at least one heat sink 140. Wherein, when the number of the heat sinks 140 is a plurality of pieces, the distribution manner thereof may preferably be spaced apart at the periphery of the circuit board 131 of the sensor module 130, that is, the portions of the inner surface of the circuit board 131 near the outer circumference are spaced apart and extend outward.
综上所述,本发明提出的相机通过在传感器模块上设置散热片,将散热片的第一端连接于传感器模块的电路板,并将散热片的第二端抵接于相机外壳内壁的设计,能够将传感器模块的成像传感器产生的热量经由电路板和散热片传递至外壳,从而达成散热的效果。本发明的上述散热设计具有结构简单、对空间要求小且成本较低的特点。In summary, the camera of the present invention is configured by disposing a heat sink on the sensor module, connecting the first end of the heat sink to the circuit board of the sensor module, and abutting the second end of the heat sink against the inner wall of the camera housing. The heat generated by the imaging sensor of the sensor module can be transmitted to the outer casing via the circuit board and the heat sink, thereby achieving the heat dissipation effect. The above heat dissipation design of the invention has the characteristics of simple structure, small space requirement and low cost.
摄像装置实施方式Camera device implementation
以下对本发明提出的摄像装置的一示例性实施方式进行说明。在本实施方式中,本发明提出的摄像装置是基于具有云台和相机的摄像装置为例进行说明。本领域技术人员容易理解的是,为将该实施方式中的设计应用于其他结构的摄像装置,而对下述的具体实施方式做出多种改型、添加、替代、删除或其他变化,这些变化仍在本发明提出的摄像装置的原理的范围内。An exemplary embodiment of an image pickup apparatus proposed by the present invention will be described below. In the present embodiment, the imaging device proposed by the present invention will be described based on an imaging device having a pan/tilt and a camera. It will be readily understood by those skilled in the art that various modifications, additions, substitutions, deletions, or other changes are made to the specific embodiments described below, in order to apply the design in this embodiment to an imaging device of another configuration. The variation is still within the scope of the principle of the image pickup apparatus proposed by the present invention.
在本实施方式中,本发明提出的显示装置主要包括相机以及连接于相机的云台。其中,该相机为上述实施方式所述的相机,且云台连接于相机的外壳。 In the present embodiment, the display device proposed by the present invention mainly includes a camera and a pan/tilt connected to the camera. Wherein, the camera is the camera described in the above embodiment, and the pan/tilt is connected to the outer casing of the camera.
另外,在本实施方式中,电路板的上还设置有连接端口,用于与摄像装置的其他元件连接,例如连接相机控制元件,从而控制相机的变焦和调焦等功能。In addition, in the present embodiment, the circuit board is further provided with a connection port for connecting with other components of the image pickup device, for example, connecting the camera control elements, thereby controlling functions such as zooming and focusing of the camera.
综上所述,本发明提出摄像装置,通过采用本发明提出的相机,使摄像装置的散热设计具有结构简单、对空间要求小且成本较低的特点。In summary, the present invention provides an image pickup apparatus. By adopting the camera proposed by the present invention, the heat dissipation design of the image pickup apparatus has the characteristics of simple structure, small space requirement, and low cost.
无人机实施方式UAV implementation
参阅图4,图4中代表性地示出了能够体现本发明的原理的无人机的部分结构示意图,具体示出了无人机的相机和云台轴组合后的结构示意图。在该示例性实施方式中,本发明提出的无人机是以通过云台轴安装有相机的无人机为例进行说明。本领域技术人员容易理解的是,为将该无人机的相关设计应用于其他类型的带有摄像功能的飞行器,而对下述的具体实施方式做出多种改型、添加、替代、删除或其他变化,这些变化仍在本发明提出的无人机的原理的范围内。Referring to FIG. 4, a partial structural diagram of a drone capable of embodying the principle of the present invention is representatively shown, and a schematic structural view of a combination of a camera and a pan/tilt head of the drone is specifically shown. In the exemplary embodiment, the drone proposed by the present invention is described as an example of a drone equipped with a camera through a pan/tilt head. It will be readily understood by those skilled in the art that various modifications, additions, substitutions, and deletions are made to the specific embodiments described below in order to apply the related design of the drone to other types of aircraft with camera functions. Or other variations, these variations are still within the scope of the principles of the drone proposed by the present invention.
在本实施方式中,本发明提出的无人机主要包括机身以及相机。其中,如图4所示,该相机为上述实施方式所述的相机100,且相机100通过云台轴200连接于机身,云台轴200连接于机身与相机100的外壳110之间。In the present embodiment, the drone proposed by the present invention mainly includes a body and a camera. As shown in FIG. 4 , the camera is the camera 100 described in the above embodiment, and the camera 100 is connected to the body through the pan/tilt axis 200 , and the pan/tilt head 200 is connected between the body and the outer casing 110 of the camera 100 .
在本实施方式中,本发明提出的显示装置主要包括相机以及连接于相机的云台。其中,该相机为上述实施方式所述的相机,且云台连接于相机的外壳。In the present embodiment, the display device proposed by the present invention mainly includes a camera and a pan/tilt connected to the camera. Wherein, the camera is the camera described in the above embodiment, and the pan/tilt is connected to the outer casing of the camera.
另外,在本实施方式中,配合参阅图1,相机100的电路板131的上还设置有两个连接端口1312,分别用于与相机或无人机的其他元件连接,例如分别与相机控制元件和无人机的机身连接,从而控制相机的变焦和调焦等功能。In addition, in the present embodiment, referring to FIG. 1 , the circuit board 131 of the camera 100 is further provided with two connection ports 1312 for respectively connecting with other components of the camera or the drone, for example, respectively with the camera control component. It is connected to the body of the drone to control the zoom and focus of the camera.
综上所述,本发明提出无人机,通过采用本发明提出的相机,使无人机的散热设计具有结构简单、对空间要求小且成本较低的特点。In summary, the present invention proposes a drone, and by adopting the camera proposed by the present invention, the heat dissipation design of the drone has the characteristics of simple structure, small space requirement and low cost.
虽然已参照几个典型实施例描述了本发明,但应当理解,所用的术语是说明和示例性、而非限制性的术语。由于本发明能够以多种形式具体实施而不脱离发明的精神或实质,所以应当理解,上述实施例不限于任何前述的细节,而应在随附权利要求所限定的精神和范围内广泛地解释,因此落入权利要求或其等效范围内的全部变化和改型都应为随附权利要求所涵盖。 While the invention has been described with respect to the exemplary embodiments illustrated embodiments The present invention may be embodied in a variety of forms without departing from the spirit or scope of the invention. It is to be understood that the invention is not limited to the details. All changes and modifications that come within the scope of the claims or the equivalents thereof are intended to be covered by the appended claims.

Claims (18)

  1. 一种相机,包括:A camera that includes:
    外壳;shell;
    镜头组件,设于所述外壳内部;a lens assembly disposed inside the outer casing;
    传感器模块,设于所述外壳内部并设于所述镜头组件的后端,所述传感器模块包括电路板以及成像传感器,所述成像传感器设于所述电路板的朝向所述镜头组件的前表面;以及a sensor module disposed inside the casing and disposed at a rear end of the lens assembly, the sensor module includes a circuit board and an imaging sensor, and the imaging sensor is disposed on a front surface of the circuit board facing the lens assembly ;as well as
    至少一片散热片,所述散热片包括第一端和远离所述第一端的第二端,所述第一端连接于所述电路板,所述第二端抵接于所述外壳的内壁,以供所述传感器模块的热量经由所述散热片传递至所述外壳。At least one fin, the fin includes a first end and a second end remote from the first end, the first end is connected to the circuit board, and the second end abuts against an inner wall of the outer casing The heat for the sensor module is transferred to the outer casing via the heat sink.
  2. 根据权利要求1所述的相机,所述散热片的第一端连接于所述电路板的前表面。The camera of claim 1 wherein the first end of the heat sink is coupled to a front surface of the circuit board.
  3. 根据权利要求2所述的相机,所述散热片的第一端与所述电路板的前表面相贴合。The camera of claim 2, the first end of the heat sink being in conformity with the front surface of the circuit board.
  4. 根据权利要求2所述的相机,所述散热片与所述成像传感器间隔分布。The camera of claim 2, said heat sink being spaced apart from said imaging sensor.
  5. 根据权利要求1所述的相机,所述散热片的第二端呈弯折结构,而使所述散热片的第二端与所述外壳的内壁贴合。The camera according to claim 1, wherein the second end of the heat sink has a bent structure, and the second end of the heat sink is attached to an inner wall of the outer casing.
  6. 根据权利要求5所述的相机,所述外壳开设有安装端口,所述传感器模块和镜头组件是经由所述安装端口并沿一安装方向装入所述外壳;其中,所述散热片的第二端的弯折方向与所述安装方向相反。The camera according to claim 5, wherein said housing is provided with a mounting port, said sensor module and lens assembly being mounted through said mounting port and in a mounting direction; wherein said heat sink is second The bending direction of the end is opposite to the mounting direction.
  7. 根据权利要求1所述的相机,所述散热片还包括连接部,所述连接部连接于所述第一端和第二端之间,所述连接部上开设有缺口。The camera according to claim 1, wherein the heat sink further comprises a connecting portion connected between the first end and the second end, and the connecting portion is provided with a notch.
  8. 根据权利要求1所述的相机,所述相机包括多片所述散热片,多片所述散热片在所述电路板的周缘间隔分布。 A camera according to claim 1, said camera comprising a plurality of said heat sinks, a plurality of said heat sinks being spaced apart at a periphery of said circuit board.
  9. 根据权利要求1~8任一项所述的相机,所述散热片为石墨片。The camera according to any one of claims 1 to 8, wherein the heat sink is a graphite sheet.
  10. 根据权利要求1~8任一项所述的相机,所述镜头组件的后端具有后端板,所述镜头组件的后端具有后端板,所述后端板开设有开口,所述开口内安装有滤光片。The camera according to any one of claims 1 to 8, wherein a rear end of the lens assembly has a rear end plate, a rear end of the lens assembly has a rear end plate, and the rear end plate is provided with an opening, the opening A filter is installed inside.
  11. 根据权利要求10所述的相机,其特征在于,所述后端板设有凹槽,所述开口设置在所述凹槽内,所述凹槽用于收容所述成像传感器,使所述滤光片与所述成像传感器相对,所述电路板贴合于所述后端板。The camera according to claim 10, wherein said rear end plate is provided with a recess, said opening being disposed in said recess, said recess for receiving said imaging sensor, said filter A light sheet is opposite the imaging sensor, and the circuit board is attached to the rear end plate.
  12. 根据权利要求10所述的相机,所述后端板开设有多个第一安装孔,所述电路板开设有分别对应于多个所述第一安装孔的多个第二安装孔,所述传感器模块通过穿设于所述第一安装孔和第二安装孔的连接件连接于所述镜头组件的后端板。The camera of claim 10, wherein the rear end plate is provided with a plurality of first mounting holes, and the circuit board is provided with a plurality of second mounting holes respectively corresponding to the plurality of the first mounting holes, The sensor module is coupled to the rear end plate of the lens assembly by a connector that is disposed through the first mounting hole and the second mounting hole.
  13. 根据权利要求12所述的相机,所述连接件为螺钉、铆钉或定位销。The camera of claim 12, the connector being a screw, a rivet or a locating pin.
  14. 根据权利要求10所述的相机,所述外壳的后端开设有后端口,以供所述传感器模块和镜头组件经由所述后端口装入所述外壳;其中,所述外壳的内壁设有多根安装管,所述后端板的周缘开设有分别对应于多根所述安装管的多个第三安装孔,所述镜头组件通过穿设于所述安装管和第三安装孔的连接件连接于所述外壳。The camera according to claim 10, wherein a rear end of the outer casing is provided with a rear port for the sensor module and the lens assembly to be loaded into the outer casing via the rear port; wherein an inner wall of the outer casing is provided a root mounting tube, the peripheral edge of the rear end plate is provided with a plurality of third mounting holes respectively corresponding to the plurality of mounting tubes, and the lens assembly passes through a connecting member that is disposed through the mounting tube and the third mounting hole Connected to the outer casing.
  15. 根据权利要求14所述的相机,所述连接件为螺钉、铆钉或定位销。The camera of claim 14 wherein the connector is a screw, rivet or locating pin.
  16. 根据权利要求14所述的相机,所述散热片抵接于所述外壳内壁的位置与所述外壳内壁的设置所述安装管的位置相间隔。The camera according to claim 14, wherein a position at which the heat sink abuts against an inner wall of the outer casing is spaced apart from a position at which the inner wall of the outer casing is provided with the mounting tube.
  17. 一种摄像装置,包括相机以及连接于所述相机的云台,所述相机为权利要求1~16任一项所述的相机,所述云台连接于所述相机的外壳。An image pickup apparatus comprising a camera and a head mounted to the camera, the camera being the camera according to any one of claims 1 to 16, the head mounted to a casing of the camera.
  18. 一种无人机,包括机身以及相机,所述相机通过云台轴连接于所述机身,所述相 机为权利要求1~16任一项所述的相机,所述云台轴连接于所述机身与所述相机的外壳之间。 A drone including a body and a camera, the camera being coupled to the body by a pan/tilt shaft, the phase The camera of any one of claims 1 to 16, wherein the pan/tilt head is coupled between the body and a casing of the camera.
PCT/CN2017/117822 2017-12-21 2017-12-21 Camera, photographing device and unmanned aerial vehicle WO2019119365A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201780027060.4A CN109076722A (en) 2017-12-21 2017-12-21 Camera, photographic device and unmanned plane
PCT/CN2017/117822 WO2019119365A1 (en) 2017-12-21 2017-12-21 Camera, photographing device and unmanned aerial vehicle

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2017/117822 WO2019119365A1 (en) 2017-12-21 2017-12-21 Camera, photographing device and unmanned aerial vehicle

Publications (1)

Publication Number Publication Date
WO2019119365A1 true WO2019119365A1 (en) 2019-06-27

Family

ID=64822101

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2017/117822 WO2019119365A1 (en) 2017-12-21 2017-12-21 Camera, photographing device and unmanned aerial vehicle

Country Status (2)

Country Link
CN (1) CN109076722A (en)
WO (1) WO2019119365A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110602360B (en) * 2019-09-03 2021-08-31 Oppo广东移动通信有限公司 Camera module, camera device and electronic equipment

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101212871A (en) * 2006-12-27 2008-07-02 索尼株式会社 Electronic equipment enclosure and electronic equipment having the enclosure
CN203120020U (en) * 2013-01-15 2013-08-07 上海莫仕连接器有限公司 Camera device and electronic device
JP2014239395A (en) * 2013-06-10 2014-12-18 キヤノン株式会社 Imaging apparatus
WO2015198598A1 (en) * 2014-06-26 2015-12-30 京セラ株式会社 Image-capturing device and vehicle
JP2017005455A (en) * 2015-06-09 2017-01-05 オリンパス株式会社 Cooling structure of photoelectric conversion element
CN206212140U (en) * 2016-11-30 2017-05-31 纮华电子科技(上海)有限公司 Image sensor module
CN206294256U (en) * 2016-12-27 2017-06-30 未来现实(武汉)科技有限公司 A kind of camera sensor module
CN107000840A (en) * 2016-01-26 2017-08-01 深圳市大疆创新科技有限公司 Unmanned vehicle and many mesh imaging systems
CN206743393U (en) * 2017-05-17 2017-12-12 广东欧珀移动通信有限公司 Imaging device, imaging device component and electronic installation

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102291528A (en) * 2011-09-05 2011-12-21 天津天地伟业数码科技有限公司 Infrared camera
KR101354884B1 (en) * 2012-04-13 2014-01-27 티티엠주식회사 Backlight unit
CN102854714A (en) * 2012-08-16 2013-01-02 浙江宇视科技有限公司 Heat dissipation device of zoom camera
CN203708743U (en) * 2014-01-26 2014-07-09 天津天地伟业数码科技有限公司 Heating and heat dissipation apparatus of integrated camera core
CN203761746U (en) * 2014-03-12 2014-08-06 昆山莹帆精密五金有限公司 Heat dissipation structure of monitoring camera
CN207885067U (en) * 2017-12-21 2018-09-18 深圳市大疆创新科技有限公司 Camera, photographic device and unmanned plane

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101212871A (en) * 2006-12-27 2008-07-02 索尼株式会社 Electronic equipment enclosure and electronic equipment having the enclosure
CN203120020U (en) * 2013-01-15 2013-08-07 上海莫仕连接器有限公司 Camera device and electronic device
JP2014239395A (en) * 2013-06-10 2014-12-18 キヤノン株式会社 Imaging apparatus
WO2015198598A1 (en) * 2014-06-26 2015-12-30 京セラ株式会社 Image-capturing device and vehicle
JP2017005455A (en) * 2015-06-09 2017-01-05 オリンパス株式会社 Cooling structure of photoelectric conversion element
CN107000840A (en) * 2016-01-26 2017-08-01 深圳市大疆创新科技有限公司 Unmanned vehicle and many mesh imaging systems
CN206212140U (en) * 2016-11-30 2017-05-31 纮华电子科技(上海)有限公司 Image sensor module
CN206294256U (en) * 2016-12-27 2017-06-30 未来现实(武汉)科技有限公司 A kind of camera sensor module
CN206743393U (en) * 2017-05-17 2017-12-12 广东欧珀移动通信有限公司 Imaging device, imaging device component and electronic installation

Also Published As

Publication number Publication date
CN109076722A (en) 2018-12-21

Similar Documents

Publication Publication Date Title
US9838558B2 (en) Digital video camera
WO2020125388A1 (en) Time-of-flight module and electronic device
US10250785B2 (en) Electronic apparatus capable of efficient and uniform heat dissipation
CN105519245A (en) Image capturing module
WO2018152909A1 (en) Cradle head device and unmanned aerial vehicle
WO2019134385A1 (en) Camera assembly and unmanned aerial vehicle
CN109257526A (en) Picture pick-up device
WO2020006871A1 (en) Heat dissipation assembly and remote controller
WO2019119365A1 (en) Camera, photographing device and unmanned aerial vehicle
JP5832234B2 (en) Imaging device
CN110536062B (en) Camera module, camera module assembling process and electronic equipment
JP2016019005A (en) Imaging device
JP2019087775A (en) Monitor camera
JP2020108004A (en) Electronic device heat dissipation structure and heat dissipation method
WO2018018637A1 (en) Heat dissipation device, unmanned aerial vehicle, and movable device
CN213754650U (en) Image acquisition device and vehicle
EP3599493B1 (en) Imaging apparatus
WO2021217365A1 (en) Fill light structure, photography apparatus, and movable platform
JP5925053B2 (en) Imaging device
JP2011138912A (en) Electronic apparatus
US20190377244A1 (en) Dashboard camera
CN220067542U (en) Image acquisition device and electronic equipment
CN216599766U (en) Camera module
CN219417970U (en) Camera structure and aerial camera
CN114355709B (en) Surgical field camera

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17935159

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 17935159

Country of ref document: EP

Kind code of ref document: A1