WO2018018637A1

WO2018018637A1 - Heat dissipation device, unmanned aerial vehicle, and movable device

Info

Publication number: WO2018018637A1
Application number: PCT/CN2016/092430
Authority: WO
Inventors: 唐尹; 杨飞虎
Original assignee: 深圳市大疆创新科技有限公司
Priority date: 2016-07-29
Filing date: 2016-07-29
Publication date: 2018-02-01
Also published as: CN107114000A; CN107114000B

Abstract

A heat dissipation device (100), comprising: a base plate (11) and a heat pipe (12). The heat pipe (12) forms a thermal contact with the base plate (11). The heat pipe (12) comprises an evaporating section (121) and a condensing section (122). The condensing section (122) protrudes from the base plate (11) to form a thermal contact with another external component.

Description

Radiators, unmanned aerial vehicles and mobile devices

Technical field

The present invention relates to a heat sink and an image pickup apparatus using the same, an unmanned aerial vehicle using the image pickup apparatus, and a movable apparatus.

Background technique

During the aerial photography operation, it is often necessary to use an electronic device such as a camera or a camera that is set on the unmanned aerial vehicle to shoot. These electronic devices, such as cameras, require an imaging sensor to acquire image data, but the imaging sensor emits a large amount of heat during operation, and if the heat is not dissipated in time, the temperature of the imaging sensor will rise, resulting in the imaging. The image quality of the sensor is reduced, which affects the camera's shooting. The imaging sensor is generally used to dissipate heat from a heat sink in the prior art. However, since the heat sink is usually disposed inside the camera, even if heat is transferred to the heat sink, heat is still collected inside the camera, thereby affecting heat dissipation efficiency.

Summary of the invention

In view of the above circumstances, it is necessary to provide a heat sink having a relatively good heat dissipation effect, and it is also necessary to provide an image pickup apparatus using the heat sink, an unmanned aerial vehicle using the image pickup apparatus, and a movable apparatus.

A heat sink includes a bottom plate and a heat pipe in thermal contact with the bottom plate, the heat pipe including an evaporation section and a condensation section, the condensation section protruding from the bottom plate to be in thermal contact with other external components.

An image acquisition device includes a body and a sensor module mounted in the body, the image acquisition device further includes a heat sink, and the heat sink is installed in the body to face the sensor module The group performs heat dissipation, and the heat sink includes:

Bottom plate;

a heat pipe, the heat pipe being in thermal contact with the bottom plate, the heat pipe comprising an evaporation section and a condensation section, the evaporation section being in thermal contact with the sensor module, the condensation section protruding from the bottom plate and the machine Hot contact.

A heat sink comprising a bottom plate and a heat pipe, the heat pipe being in thermal contact with the bottom plate, the heat pipe comprising an evaporation section, at least two connection sections connected to an end of the evaporation section, and condensation connected to each connection section And a segment extending from a corresponding one end of the evaporation section toward a direction away from the bottom plate, each condensation section protruding from the bottom plate at a predetermined angle to be in thermal contact with other external components.

A movable device, wherein the movable device is provided with an image acquisition device, the image acquisition device includes a body and a heat sink as described above, the heat sink is installed in the body, the heat sink The condensation section is in thermal contact with the fuselage.

An unmanned aerial vehicle is provided with an image acquisition device as described above.

The heat sink described above, by providing a heat pipe protruding from the bottom plate to facilitate thermal contact of the condensation section of the heat pipe with other external components, enables heat conducted to the heat pipe to be quickly conducted through the evaporation section to the condensation section and through the condensation section Thermal contact with other external components directly transfers heat to other external components, reducing heat buildup near the heat sink and improving heat dissipation efficiency.

DRAWINGS

FIG. 1 is a three-dimensional assembly diagram of a heat sink mounting sensor module according to an embodiment of the present invention.

FIG. 2 is a perspective view showing another perspective of the heat sink mounting sensor module shown in FIG. 1 .

3 is a schematic view showing the splitting of the heat sink and the sensor module shown in FIG. 1.

4 is a schematic view of another angle of the heat sink and the sensor module shown in FIG. 3.

FIG. 5 is a schematic exploded view of the heat sink shown in FIG. 1 installed in an image acquisition device.

Fig. 6 is a schematic view showing another angle of the image pickup apparatus shown in Fig. 5.

FIG. 7 is an assembled view of the image acquisition device shown in FIG. 5 installed in a pan/tilt of a mobile device.

FIG. 8 is a schematic diagram of splitting of the image acquisition device shown in FIG. 5 in a pan/tilt of a mobile device.

Main component symbol description

Radiator 100

Base plate 11

First side 111

Second side 112

Bump 113

Heat pipe 12

Evaporation section 121

Condensation section 122

Connection section 123

Heat sink fins 13

Radiator bracket 14

Boss 141

Image acquisition device 200

Lens 21

Body 22

Groove 221

Sensor module 23

Chip 231

Circuit board 232

Sealing ring 233

Perforation 234

Spring 235

Motherboard 24

Back cover 25

Back cover trim 26

Yuntai 300

The invention will be further illustrated by the following detailed description in conjunction with the accompanying drawings.

detailed description

The technical solutions in the embodiments of the present invention are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, but not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.

It should be noted that when a component is said to be "thermally contacted" with another component, it can be in direct contact with another component to conduct heat or a component that is centered can be thermally conductive. When a component is referred to as being "fixed" to another component, it can be directly on the other component or the component can be in the middle. When a component is considered to "connect" another component, it can be directly connected to another component or possibly a central component. When a component is considered to be "set to" another component, it can be placed directly on another component or possibly with a centered component. The terms "vertical," "horizontal," "left," "right," and the like, as used herein, are for illustrative purposes only.

All technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs, unless otherwise defined. The terminology used in the description of the present invention is for the purpose of describing particular embodiments and is not intended to limit the invention. The term "or/and" as used herein includes any and all combinations of one or more of the associated listed items.

The invention provides a heat sink comprising a bottom plate and a heat pipe, the heat pipe being in thermal contact with the bottom plate, the heat pipe comprising an evaporation section and a condensation section, the condensation section protruding from the bottom plate to be in thermal contact with other external components .

The invention also provides a heat sink comprising a bottom plate and a heat pipe, the heat pipe being in thermal contact with the bottom plate, the heat pipe comprising an evaporation section, at least two connecting sections connected to the end of the evaporation section, and connected to each a condensation section of the connecting section, each connecting section extending from a corresponding one end of the evaporation section toward a direction away from the bottom plate, each condensation section protruding at a predetermined angle to the bottom plate to be in thermal contact with other external components .

Some embodiments of the present invention are described in detail below with reference to the accompanying drawings. The features of the embodiments and examples described below can be combined with each other without conflict.

Referring to FIGS. 1 through 4, an embodiment of the present invention provides a heat sink 100 for dissipating heat from a heat-generating electronic component. In the present embodiment, the heat sink 100 is applied to an image acquisition device 200 (shown in FIG. 5), and the image acquisition device 200 is disposed on a movable device, such as an unmanned aerial vehicle (not shown). The aerial mission is performed during the flight of the unmanned aerial vehicle.

The heat sink 100 includes a bottom plate 11 and a heat pipe 12. Specifically in the illustrated embodiment, the heat pipe 12 is in thermal contact with the bottom plate 11.

The bottom plate 11 is substantially a rectangular plate including opposite first side faces 111 and second side faces 112. In the present embodiment, the first side faces 111 and the second side faces 112 are parallel to each other. The bottom plate 11 is made of a metal material such as copper, aluminum or the like which has good thermal conductivity or an alloy thereof.

The heat pipe 12 includes an evaporation section 121, a condensation section 122, and a connection section 123 connected between the evaporation section 121 and the condensation section 122.

The manner in which the heat pipe 12 is in thermal contact with the bottom plate 11 is not limited to one. In some embodiments, the evaporation section 121 of the heat pipe 12 is directly attached to the first side surface 111 of the bottom plate 11 through the evaporation section 121. The direct contact with the bottom plate 11 realizes the exchange of heat between the two; or a thermal paste is added between the two to accelerate the conduction of heat between the two through the thermal paste. In the present embodiment, the evaporation section 121 of the heat pipe 12 is directly embedded in the bottom plate 11. Specifically, the first side surface 111 of the bottom plate 11 is recessed inwardly to embed the evaporation section 121 of the heat pipe 12 from the first side surface 111 in the bottom plate 11 at a position where the evaporation section 121 is buried. The first side surface 111 of the bottom plate 11 is outwardly raised to a certain height so that the evaporation section 121 is completely buried in the bottom plate 11. In the present embodiment, the plane in which the evaporation section 121 is located is parallel to the plane in which the bottom plate 11 is located.

The center of the first side surface 111 of the bottom plate 11 further forms a bump 113. The protrusion 113 is substantially rectangular and can be integrally formed with the bottom plate 11. The provision of the bumps 113 enables the distance between the bottom plate 11 and the heat-generating electronic components that dissipate heat to be reduced, thereby making heat conduction closer to the heat-generating electronic components.

The number of the condensation sections 122 is at least one segment, and may of course be two segments, three segments, four segments, and the like. In the present embodiment, the number of the condensation sections 122 is two. The two-stage condensation section 122 is respectively located at two ends of the evaporation section 121, and each of the condensation sections 122 is connected to a corresponding one end of the evaporation section 121 through a corresponding one of the connection sections 123. At least one of the two sections of condensation section 122 protrudes from the bottom plate 11 so as to be in thermal contact with other external components.

When the number of the condensation sections 122 is greater than two sections, the distribution of the condensation sections 122 may be evenly spaced apart from each other and connected to the evaporation section 121, or may be distributed according to actual needs.

The manner in which the condensation section 122 protrudes from the bottom plate 11 is not limited to one. In some embodiments, the condensation section 122 continues to extend beyond the boundary of the bottom plate 11 in the plane in which the evaporation section 121 is located. Thereby protruding from the bottom plate 11; in other embodiments, the condensation section 122 forms a predetermined angle with the plane in which the evaporation section 121 is located so as to protrude from the bottom plate 11. In the present embodiment, the plane in which at least one of the two sections of the condensation section 122 is located is at a predetermined angle to the plane in which the evaporation section 121 is located. Specifically, at least one of the two sections of the condensation section 122 is located in a plane that is not parallel to the plane in which the evaporation section 121 is located, but has the predetermined angle between the plane in which the evaporation section 121 is located. The predetermined angle may be greater than 0 degrees and less than 180 degrees such that the condensation section 122 protrudes from the bottom plate 11.

In the present embodiment, the predetermined angle is 90°. The two sections of the condensation section 122 are perpendicular to the bottom plate 11 to protrude from the bottom plate 11 and thus in thermal contact with other external components.

Each connecting section 123 is arcually connected between the evaporation section 121 and the corresponding condensation section 122.

The evaporation section 121 of the heat pipe 12 is substantially located at the center of the bottom plate 11, and the evaporation section 121 is substantially parallel to the opposite sides of the bottom plate 11 (perpendicular to the other two opposite sides), thereby The evaporation section 121 located at the center position is in thermal contact with the heat generating electronic component as much as possible. Both ends of the evaporation section 121 are gradually curved to extend to the edge position of the bottom plate 11, so that the two sections of the condensation section 122 are respectively located at the edge positions of the bottom plate 11.

The bottom plate 11 is further provided with a plurality of heat dissipation fins 13. The heat dissipation fins 13 and the evaporation section are disposed on both sides of the bottom plate 11 . Each of the heat dissipation fins 13 is spaced apart from the adjacent heat dissipation fins 13 , and each of the heat dissipation fins 13 faces from a second side 112 of the bottom plate 11 toward a side away from the heat pipe 12 . Vertically protruding. Further, a flange is formed at the same position of each of the heat dissipation fins 13, and the flanges are overlapped with each other to fix the heat dissipation fins 13 to each other.

The direction of each of the heat dissipation fins 13 on the bottom plate 11 is at a predetermined angle to the direction of the evaporation section 121 on the bottom plate 11. In this embodiment, the direction of the heat dissipation fins 13 on the bottom plate 11 is substantially perpendicular to the direction of the evaporation section 121 at the central position, so that the heat conducted to the central position of the evaporation section 121 can be exhausted. It may be quickly dissipated to a central heat concentration away from the bottom plate 11.

The heat sink 100 further includes a heat sink bracket 14 fixedly coupled to the first side surface 111 of the bottom plate 11, that is, the bottom plate 11 is disposed on a side of the heat pipe 12, the heat sink A heat generating component is interposed between the bracket 14 and the bottom plate 11. In the embodiment shown in FIGS. 1 to 4, the heat generating electronic component is the sensor module 23.

Specifically, the heat sink bracket 14 has a substantially rectangular plate shape, and is connected to the bottom plate 11 in a detachable manner. In the present embodiment, the periphery of the heat sink bracket 14 is convexly formed to form three bosses 141, and the three bosses 141 are fixed to the bottom plate 11 by threading screws. Of course, in other embodiments, the heat sink bracket 14 and the bottom plate 11 can also be fixedly connected by other detachable means.

The heat pipe 12 of the heat sink 100 in an embodiment of the present invention has a condensation section 122 protruding from the bottom plate 11 to facilitate thermal contact of the condensation section 122 with other external components, thereby enabling conduction to the heat pipe The heat of 12 is rapidly conducted through the evaporation section 121 to the condensation section 122, and is in thermal contact with other external components through the condensation section 122 to directly conduct heat to other external components, reducing heat accumulation near the heat sink 100, and improving heat dissipation. effectiveness.

Further, since the condensation section 122 in the embodiment of the present invention protrudes perpendicularly from the bottom plate 11, the condensation section 122 can be thermally contacted with other external components by means of plugging, without using other auxiliary components for fixed connection. Condensation section 122 and other external components.

Referring to FIG. 5 to FIG. 6 simultaneously, an embodiment of the present invention provides an image acquisition device 200 for acquiring an image. In the present embodiment, the image acquisition device 200 is a camera. The image acquisition device 200 includes a lens 21 , a body 22 , a sensor module 23 mounted in the body 22 , a main board 24 , and the heat sink 100 described above. The lens 21 is mounted on one side of the body 22. The sensor module 23 is an imaging sensor for acquiring image data. The sensor module 23 is interposed in the heat sink 100. The main board 24 is mounted on the other side of the body 22 together with the sensor module 23 and the heat sink 100. In the embodiment, the image obtaining apparatus 200 further includes a back cover 25 and a rear cover garnish 26 which are sequentially mounted on the body 22. The rear cover 25 connects the main board 24 and the heat sink. 100 covers the fuselage 22, and the rear cover trim 26 covers the back cover 25 therein.

Please refer back to FIG. 3 , the sensor module 23 includes a chip 231 and a circuit board 232 . In the embodiment, the chip 231 is a sensor chip. The chip 231 is fixed and electrically connected to the circuit board 232. A seal ring 233 is surrounded around the chip 231. The sensor module 23 is interposed between the heat sink bracket 14 of the heat sink 100 and the bottom plate 11 .

Referring back to FIG. 4 again, the circuit board 232 is provided with a through hole 234, and the through hole 234 is located at the center of the circuit board 232. The through hole 234 is substantially rectangular and has a size smaller than that of the chip 231 such that the chip 231 completely covers the through hole 234. The through hole 234 can receive the protrusion 113 protruding from the bottom plate 11 of the heat sink 100, so that the protrusion 113 can penetrate into the through hole 234, and further with the sensor module 23 The chip 231 is close. In some embodiments, the bumps 113 are directly attached to the chip 231 through the through holes 234. In the embodiment, the through hole 234 is filled with a thermal conductive paste (not shown), and the chip 231 and the heat sink 100 are thermally contacted by the thermal conductive paste. Specifically, the chip 231 and the bump 113 in the center of the bottom plate 11 of the heat sink 100 accelerate heat conduction through the thermal grease to improve heat dissipation efficiency.

Returning to FIGS. 5 and 6, in the present embodiment, the body 22 is another external component that is in thermal contact with the heat pipe 12 of the heat sink 100. The body 22 is made of a metal material, and may be, for example, a metal such as copper or aluminum having good thermal conductivity or an alloy thereof. A recess 221 is defined in the fuselage 22, and the position, number and shape of the recess 221 are adapted to the condensation section 122 of the heat pipe 12 of the heat sink 100. In the present embodiment, the number of the grooves 221 is two, and both are opened along the axial direction of the fuselage 22 to facilitate the insertion of the condensation section 122. Further, the recess 221 is filled with a thermal conductive paste (not shown), and the condensation section 122 inserted into the recess 221 is in thermal contact with the fuselage 22 through the thermal paste.

During the installation, the chip 231 is first mounted on the circuit board 232, and the sealing ring 233 is sleeved around the chip 231 to form the sensor module 23, and the hole 234 is formed in the circuit board 232. Filling the thermal conductive paste, and attaching the sensor module 23 to the first side 111 of the bottom plate 11 of the heat sink 100, and mounting the heat sink bracket 14 on the bottom plate 11 to The sensor module 23 is interposed between the bottom plate 11 and the heat sink bracket 14 . Then, the condensation section 122 of the heat sink 100 is inserted into the recess 221 of the body 22, and the heat sink 100 equipped with the sensor module 23 is fixedly mounted to the image acquisition apparatus. In the fuselage 22 of 200. In the present embodiment, a plurality of elastic members, such as a spring 235, are disposed between the heat sink 100 and the body 22 for adjusting the mounting height of the heat sink 100 in the body 22. . Then, after the heat sink 100, the main board 24, the back cover 25 and the back cover garnish 26 are sequentially mounted on the body 22 and mounted on the other side of the body 22. The lens 21 is provided.

The image acquisition device 200 in the embodiment of the present invention is provided with the heat sink 100, and the heat sink 100 is provided with a heat pipe 12 protruding from the bottom plate 11 to facilitate the condensation section 122 of the heat pipe 12 and the image acquisition device 200. The fuselage 22 is in direct thermal contact so that heat conducted to the heat pipe 12 can be quickly conducted through the evaporation section 121 to the condensation section 122, and the heat is directly transmitted by the condensation section 122 to the fuselage 22 to directly conduct heat. The fuselage 22 is further distributed to the outside of the image pickup device 200, reducing the accumulation of heat in the vicinity of the heat sink 100, and improving the heat dissipation efficiency.

In the embodiment of the present invention, the image acquisition device may be a camera, but is not limited to a camera, but may be any device that can implement image acquisition, such as a video camera. The heat sink 100 is also not limited to dissipating heat for the sensor module 23, and can dissipate heat to other heat-generating electronic components.

The invention also provides an unmanned aerial vehicle (not shown), the unmanned aerial vehicle comprising a pan/tilt head 300. The UAV is used to carry an aerial photographing operation by carrying a load such as the image capturing apparatus 200 described above. Specifically, the image acquisition device 200 is installed on the unmanned aerial vehicle through the pan/tilt head 300.

In the embodiment of the present invention, the unmanned aerial vehicle is a rotor unmanned aerial vehicle, and is used for carrying an aerial photography operation by a camera, a camera, or the like. It can be understood that the UAV can also be used for map mapping, disaster investigation and rescue, air monitoring, transmission line inspection and the like. It will also be appreciated that the UAV may also be a fixed wing unmanned aerial vehicle.

It can be understood that the heat sink is not limited to the application in the unmanned aerial vehicle, and can also be applied to other mobile devices or remote control mobile devices such as unmanned vehicles and unmanned ships. Narration.

The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to be limiting, and the present invention will be described in detail with reference to the preferred embodiments of the present invention. Neither should the spirit and scope of the technical solutions of the present invention be deviated. Those skilled in the art can also make other variations and the like in the spirit of the present invention for use in the design of the present invention as long as it does not deviate from the technical effects of the present invention. All changes made in accordance with the spirit of the invention are intended to be included within the scope of the invention.

Claims

A heat sink comprising a bottom plate and a heat pipe, the heat pipe being in thermal contact with the bottom plate, the heat pipe comprising an evaporation section and a condensation section, wherein the condensation section protrudes from the bottom plate to be hot with other external components contact.
The heat sink according to claim 1, wherein said evaporation section of said heat pipe is directly attached to said bottom plate.
The heat sink according to claim 1, wherein said evaporation section of said heat pipe is embedded in said bottom plate.
A heat sink according to any one of claims 1 to 3, wherein the plane in which the condensation section is located is disposed at a predetermined angle to the plane in which the evaporation section is located.
The heat sink according to claim 4, wherein said predetermined angle is 90°.
The heat sink according to claim 5, wherein said heat pipe further comprises a connecting portion connected between said evaporation section and said condensation section, said connecting section being curved.
The heat sink according to any one of claims 1 to 6, wherein the condensation section comprises at least two sections, and at least two sections of the condensation section are respectively located at both ends of the evaporation section, and each section The condensing sections are each connected to a corresponding one end of the evaporation section through a corresponding one of the connecting sections.
A heat sink according to claim 7 wherein at least one of said at least two sections of said condensation section protrudes from said base plate and is adapted to be inserted into said other external component.
The heat sink according to any one of claims 1 to 8, wherein the bottom plate is further provided with a plurality of heat dissipation fins, and the plurality of heat dissipation fins and the evaporation section are respectively disposed on the bottom plate. side.
The heat sink according to claim 9, wherein each of the plurality of heat dissipation fins is spaced apart from an adjacent heat dissipation fin, and each of the heat dissipation fins faces away from the bottom plate One side of the heat pipe is vertically protruded.
The heat sink according to claim 10, wherein each of the heat radiating fins has a predetermined angle on a direction of the evaporation section on the bottom plate.
The heat sink according to any one of claims 1 to 11, further comprising a heat sink bracket fixedly coupled to a side of the bottom plate where the heat pipe is disposed, the heat sink bracket A heating element is interposed between the bottom plate and the bottom plate, and the heat sink and the heat sink bracket are made of a metal material.
The heat sink according to claim 12, wherein said heat sink bracket is detachably connected to said bottom plate.
The heat sink according to claim 13, wherein said heat sink bracket is coupled to said bottom plate by screws.
An image acquisition device includes a body and a sensor module mounted in the body, wherein the image acquisition device further includes a heat sink, and the heat sink is installed in the body to The sensor module performs heat dissipation, and the heat sink includes:

Bottom plate;

a heat pipe, the heat pipe being in thermal contact with the bottom plate, the heat pipe comprising an evaporation section and a condensation section, the evaporation section being in thermal contact with the sensor module, the condensation section protruding from the bottom plate and the machine Hot contact.
The image acquisition device according to claim 15, wherein said sensor module comprises a chip and a circuit board, said chip being fixed and electrically connected to said circuit board, said chip and said heat pipe The evaporation section is in thermal contact.
The image acquisition device according to claim 16, wherein a projection is protruded from the bottom plate, and a hole is formed in the circuit board to completely cover the chip on the through hole. Passing through the perforations is in thermal contact with the chip.
The image pickup apparatus according to claim 17, wherein said through hole is filled with a thermal conductive paste, and said chip and said bump of said heat sink are in thermal contact by said thermal conductive paste.
The image acquisition device according to claim 15, wherein the heat pipe further comprises a heat sink bracket, the heat sink bracket is fixedly connected to the bottom plate, and the sensor module is clamped to the heat sink Between the bracket and the bottom plate.
The image acquisition device according to any one of claims 15 to 19, wherein the evaporation section of the heat pipe is directly attached to the bottom plate.
An image acquisition apparatus according to any one of claims 15 to 20, wherein said evaporation section of said heat pipe is embedded in said bottom plate.
The image acquisition apparatus according to any one of claims 15 to 21, wherein a plane in which the condensation section is located is disposed at a predetermined angle to a plane in which the bottom plate is located.
The image acquisition apparatus according to claim 22, wherein said predetermined angle is 90, said heat pipe further comprises a connecting section, said connecting section being connected between said evaporation section and said condensation section, The connecting section is curved.
The image pickup apparatus according to claim 23, wherein said condensation section comprises at least two stages, and at least two of said condensation sections are respectively located at both ends of said evaporation section, and said condensation section of each section passes A corresponding one of the connecting segments is connected to one end of the evaporation section.
The image acquisition device according to claim 24, wherein at least one of said condensation sections protrudes perpendicularly from said bottom plate, and said fuselage of said image acquisition device corresponds to said condensation section A groove is formed in which the condensation section protruding from the bottom plate is inserted.
The image pickup device according to claim 25, wherein said groove is filled with a thermal paste, and said condensation section inserted in said groove is in thermal contact with said body through said thermal paste .
The image acquisition device according to any one of claims 15 to 26, wherein the heat sink and the body are both made of a metal material, and the bottom plate of the heat sink is further provided with a plurality of heat dissipation fins. a plurality of fins and the evaporation section are disposed on both sides of the bottom plate.
The image acquisition device according to claim 27, wherein a direction of each of the heat dissipation fins on the bottom plate is at a predetermined angle with a direction of the evaporation section on the bottom plate.
A heat sink comprising a bottom plate and a heat pipe, the heat pipe being in thermal contact with the bottom plate, the heat pipe comprising an evaporation section, at least two connection sections connected to an end of the evaporation section, and condensation connected to each connection section The segment is characterized in that each connecting segment extends from a corresponding one end of the evaporating section toward a direction away from the bottom plate, and each condensation section protrudes from the bottom plate at a predetermined angle to be in thermal contact with other external components. .
The heat sink according to claim 29, wherein the number of the condensation sections is two, and each condensation section is perpendicular to a plane in which the bottom plate is located.
The heat sink according to claim 29, wherein said evaporation section of said heat pipe is directly attached to said bottom plate.
The heat sink according to claim 29, wherein said evaporation section of said heat pipe is embedded in said bottom plate.
The heat sink according to claim 32, wherein a projection is formed on the bottom plate at a position where the evaporation section is buried.
The heat sink according to any one of claims 29 to 33, wherein the bottom plate is further provided with a plurality of heat dissipation fins, and the plurality of heat dissipation fins and the evaporation section are respectively disposed on the bottom plate. side.
The heat sink according to claim 34, wherein each of the plurality of heat dissipation fins is spaced apart from adjacent heat dissipation fins, and each of the heat dissipation fins faces away from the bottom plate One side of the heat pipe is vertically protruded.
The heat sink according to claim 35, wherein each of the heat radiating fins has a predetermined angle on a direction of the evaporation section on the bottom plate.
The heat sink according to any one of claims 29 to 36, further comprising a heat sink bracket fixedly coupled to a side of the bottom plate where the heat pipe is disposed, the heat sink bracket A heating element is interposed between the bottom plate and the bottom plate.
The heat sink according to claim 37, wherein said heat sink bracket is detachably coupled to said bottom plate.
A heat sink according to claim 38, wherein said heat sink bracket is connected to said bottom plate by screws.
A mobile device, wherein the mobile device is provided with an image acquisition device, wherein the image acquisition device comprises a body and a heat sink according to any one of claims 1-14, the heat dissipation The device is mounted in the fuselage, and the condensation section of the radiator is in thermal contact with the fuselage.
The mobile device according to claim 40, wherein a recess is formed in the fuselage, and the condensation section is inserted into the recess.
A movable device according to claim 41, wherein said groove is filled with a thermal paste, and said condensation section is in thermal contact with said body through said thermally conductive paste.
An unmanned aerial vehicle, characterized in that the unmanned aerial vehicle is provided with an image acquisition device according to any one of claims 15-27.
The UAV according to claim 43, wherein said unmanned aerial vehicle further comprises a cloud platform, and said image acquisition device is mounted on said cloud platform.
A mobile device, wherein the mobile device is provided with an image acquisition device, wherein the image acquisition device comprises a body and a heat sink according to any one of claims 29-39, the heat dissipation The device is mounted in the fuselage, and the condensation section of the radiator is in thermal contact with the fuselage.
A movable device according to claim 45, wherein said body is provided with a recess, and said condensation section is inserted into said recess.
A mobile device according to claim 46, wherein said recess is filled with a thermal paste, said condensation section being in thermal contact with said fuselage through said thermally conductive paste.