JP2019087775A - Monitor camera - Google Patents

Abstract

To provide a monitor camera that can maintain imaging performance over a long period of time.SOLUTION: A first heat transfer member (45) for thermally connecting the inner wall surface of a front case (11) and an imaging device (21) is provided in a front case (11) constituting a housing (7), where a first heat dissipation system (41) is constituted for dissipating the heat of the imaging device (21) to the outside by causing the front case (11) itself to function as a heat dissipation means. A heat dissipation hole (75) is formed in a rear case (13) constituting the housing (7), and a second heat transfer member (57) thermally connected to an ASIC (39) and exposed to the outside air through the heat dissipation hole (75) is provided in the rear case (13), where a second heat dissipation system (43) is constituted that causes the second heat transfer member (57) to function as a heat dissipation means to dissipate the heat of the ASIC (39) to the outside.SELECTED DRAWING: Figure 3

Description

  The technology of the present disclosure relates to a surveillance camera that captures a predetermined place for a long time.

  2. Description of the Related Art Conventionally, a camera generates two heats: an imaging device such as a complementary metal oxide semiconductor (CMOS) image sensor and an integrated circuit such as an application specific integrated circuit (ASIC) provided on a circuit substrate. It has a source, and how to dissipate heat of these two heat sources is considered as a problem. About this, it is known that heat dissipation of an image pick-up element and an integrated circuit is performed together by one heat dissipation path (for example, refer to patent documents 1 and 2).

JP 2007-208614 A JP, 2013-093697, A

  However, in the case of a surveillance camera, unlike a digital camera mainly for still image shooting and a home-use video camera expected to shoot for a relatively short period of time, it is used to perform continuous shooting for 24 hours over a long period of time As a result, the amount of heat generation of the imaging device and the integrated circuit increases. In particular, since the calorific value of the integrated circuit increases and is easily accumulated, if heat dissipation of the imaging device and the integrated circuit is performed in one heat radiation path as in the conventional heat countermeasure, the two heat sources generate heat dissipation May not be in time. In this case, the heat generated in the integrated circuit is transmitted to the imaging device, which adversely affects the imaging device due to the heat damage, which may result in a decrease in imaging performance such as image quality.

  The technique of the present disclosure has been made in view of the foregoing, and an object thereof is to provide a surveillance camera capable of maintaining imaging performance for a long period of time.

  In order to achieve the above object, in the technology of the present disclosure, the heat dissipation of the imaging device and the heat dissipation of the integrated circuit are performed by different heat dissipation systems separately provided before and after the housing.

  Specifically, the technology of the present disclosure is directed to a monitoring camera in which an imaging element and an integrated circuit, each of which generates heat in response to a shooting operation, are housed in a housing.

  The surveillance camera according to the technology of the present disclosure has a structure in which a housing is configured of a front case disposed on the front side and a rear case disposed on the rear side. A first heat transfer member is provided in the front case to thermally connect the inner wall surface of the front case to the imaging device, and the front case itself functions as a heat dissipation means to dissipate the heat of the imaging device to the outside A first heat dissipation system is configured. On the other hand, a heat dissipation hole is formed in the rear case. A second heat transfer member thermally connected to the integrated circuit and exposed to the outside air through the heat dissipation hole is provided in the rear case, and the second heat transfer member functions as a heat dissipation means to perform the integrated circuit. A second heat dissipation system is configured to dissipate the heat of the outside to the outside. The term "thermally connected" as used herein means connected so as to enable heat transfer by heat conduction. Moreover, "being thermally connected" includes the case where both are physically and directly connected, as well as the case where both are connected via an object (member) that does not interfere with heat conduction. In other words, it means that heat transfer by heat conduction is possible.

  According to this configuration, the first heat dissipation system is provided on the front side of the casing, and the second heat dissipation system is provided on the back side of the casing, the heat dissipation of the imaging element is performed by the first heat dissipation system, and the heat dissipation of the integrated circuit is achieved. Since the heat dissipation system is used, heat dissipation of the imaging device and heat dissipation of the integrated circuit can be efficiently performed by different heat dissipation systems. Moreover, in consideration of the fact that the calorific value of the integrated circuit is larger than the calorific value of the imaging device, the second heat transfer member is used as a heat dissipation means to cool the second heat dissipation system more than the first heat dissipation system. As the heat generation amount of the integrated circuit is increased due to the photographing operation for a long time because the image pickup operation is performed for a long time, the heat generated in the integrated circuit is suppressed from being transmitted to the image pickup element, and the heat damage to the image pickup element It can be avoided. Thereby, the imaging performance of the surveillance camera can be maintained for a long time.

  According to this configuration, since the heat generated in the integrated circuit is directly conducted to the second heat transfer member, heat transfer (heat transfer) from the integrated circuit to the second heat transfer member is promoted. Heat dissipation of the integrated circuit can be efficiently performed by the second heat dissipation system.

  Further, it is preferable that the front case is not formed with an air intake hole.

  According to this configuration, it is possible to prevent dust from invading the inside of the front case because the air intake hole that is an entrance for dust is not opened in the front case. Thus, it is possible to prevent the image quality of the monitoring camera from being degraded by preventing the dust from adhering to the imaging device. On the other hand, if there is no air intake hole, the air in the front case is not actively ventilated, so the heat generated by the imaging device is easily dissipated. The technique of the present disclosure is particularly effective in the case of having the above-described front case configuration because the heat dissipation of the imaging element is actively performed in the first heat dissipation system.

  The heat dissipation holes may be formed in the upper and lower portions of the rear case. In this case, it is preferable that the rear case be provided with an air flow path connecting the upper heat dissipation hole and the lower heat dissipation hole, and the second heat transfer member be exposed to the air flow path.

  According to this configuration, the air flow path having the heat dissipation holes on the upper and lower sides is provided in the rear case, and the second heat transfer member is exposed to the air flow path. When the air in the flow path is heated, a phenomenon called a chimney effect occurs, and the air warmed in the air flow path rises while the external air is drawn into the air flow path from the lower heat dissipation hole and the upper side Released from the heat release holes of the The second heat transfer member is air cooled by the wind coming off the air flow path due to the chimney effect, and the heat dissipation of the integrated circuit can be efficiently performed by the second heat dissipation system.

  Furthermore, a plurality of heat dissipation holes may be formed on the rear surface of the rear case. In this case, the monitoring camera preferably includes, as the second heat transfer member, a plate-like member facing the plurality of heat dissipation holes formed in the rear surface of the rear case.

  According to this configuration, the plurality of heat dissipation holes are formed in the rear surface portion of the rear case, and the second heat transfer member formed of the plate-like member is made to face the plurality of heat dissipation holes. It is exposed to the outside air through a plurality of heat radiation holes in a relatively large area. Then, when the chimney effect described above occurs, air is drawn into the air flow path also from the heat dissipation hole of the rear case rear surface portion, and the flow rate of air flowing in the air flow path increases, so the second heat transfer member Can enhance the cooling effect of Thus, the heat dissipation of the integrated circuit by the second heat dissipation system can be efficiently performed.

  According to the above surveillance camera, the imaging performance can be maintained for a long time.

It is the perspective view which looked at the combined state with the support apparatus of the surveillance camera which concerns on embodiment from the front side. It is a rear view of the surveillance camera concerning an embodiment. It is sectional drawing of the surveillance camera in the III-III line of FIG. It is sectional drawing of the surveillance camera in the IV-IV line of FIG.

  Hereinafter, exemplary embodiments will be described in detail based on the drawings. In the following embodiments, for convenience of explanation, regarding the monitoring camera, the front side in the shooting direction is referred to as “front” and the back side as “rear”, and the upper side in the camera height direction is “upper” and the lower side. The lower side is referred to as "lower side", the left side is referred to as "left", and the right side is referred to as "right".

  In this embodiment, the technology of the present disclosure will be described by taking, as an example, a monitoring camera for a factory that monitors a process on a production line of the factory.

  FIG. 1 is a perspective view of the combination of the monitoring camera 1 according to this embodiment and the support device 3 as viewed from the front. FIG. 2 shows a rear view of the monitoring camera 1. FIG. 3 shows a cross-sectional view of the surveillance camera 1 taken along line III-III in FIG. 4 shows a cross-sectional view of the monitoring camera 1 taken along line IV-IV in FIG.

  The surveillance camera 1 is installed in a factory and used to monitor any process in a production line. Although not shown, in the production line, a sensor for detecting the state of the work and a PLC (Programmable Logic Controller) connected to the sensor are installed. The surveillance camera 1 is connected to the PLC via a cable. PLC can be made common to a plurality of surveillance cameras 1 installed at various places in a production line.

  The PLC determines the abnormality of the work based on the signal from the sensor, and outputs a trigger signal to the monitoring camera 1 when there is an abnormality in the work. The monitoring camera 1 is configured to start capturing an image of a process to be monitored when the power is turned on, and to record an image captured over a predetermined time after that, when a trigger signal from the PLC is input. There is.

  The surveillance camera 1 is installed at an arbitrary position in combination with the support device 3 as shown in FIG. The support device 3 is a support device such as a camera platform, and one end thereof is attached by screwing to the back surface of the surveillance camera 1, and the flange 5 provided on the other end is a bolt etc. It is installed by fixing it with a fastener. And this support apparatus 3 has a rotation mechanism which makes the direction (photographing direction) of the surveillance camera 1 variable, and the orientation of the surveillance camera 1 can be freely changed according to the installation place.

  As shown in FIG. 2, the monitoring camera 1 includes a resin case 7 which is a rectangular parallelepiped having a substantially square shape in a front view, and a camera module 9 accommodated in the case 7. Two heat sources such as an imaging device 21 and an application specific integrated circuit (ASIC) 39 constituting the image forming unit 9 are incorporated.

  The housing 7 is composed of a front case 11 located on the front side and a rear case 13 located on the rear side. The front case 11 has a relatively long depth and has a lens hole 15 on the front side. The rear case 13 has a relatively short depth and is fixed by fastening the four corners with screws 17 in a state where the front case 11 and the opening peripheral edge are butted.

  The front case 11 has no air intake hole. This prevents dust from entering the front case 11. According to this, it is possible to prevent the deterioration of the image quality of the monitoring camera 1 by preventing the dust from adhering to the imaging device 21. On the other hand, if there is no air intake hole, the air in the front case 11 is not actively ventilated, and the heat generated by the imaging device 21 is easily dissipated. Particularly significant.

  The camera module 9 includes a lens unit 19, an imaging device 21 that converts an image formed by the lens unit 19 into an electrical signal, and a printed circuit board 23 that processes a signal from the imaging device 21. The lens unit 19 includes a lens group including the photographing lens 25 and a lens holder 27 for holding the lens group. The lens unit 19 is assembled to the front wall portion of the front case 11 through the lens hole 15. The photographing lens 25 positioned at the front end of the lens unit 19 is exposed to the outside from the lens hole 15.

  The imaging element 21 is, for example, a CMOS image sensor, and has a property of generating heat in response to the photographing operation of the surveillance camera 1. The imaging element 21 is assembled on the rear side of the lens unit 19 and is connected to the printed circuit board 23 via a flexible printed circuit (FPC) 29. The FPC 29 is configured to input an electrical signal output from the imaging device 21 to a circuit provided on the printed circuit board 23. The printed circuit board 23 is fixed to a boss 31 provided in the front case 11 at a plurality of places by being screwed with a screw 33.

  On the front of the printed circuit board 23, a LAN connector 37 for connection with a LAN (Local Area Network) cable, a card socket (not shown) in which a memory card such as an SD card is attached for recording a captured moving image, PLC A modular connector for connection and power supply is implemented. The card insertion port of the card socket is exposed to the outside from an opening formed on the side surface of the housing 7. The LAN connector 37 and the modular connector are exposed to the outside on the lower surface of the housing 7.

  The rear surface of the printed circuit board 23 is provided with an ASIC 39 which is a main integrated circuit constituting the circuit and other electronic circuit components. The ASIC 39 is an electronic circuit that controls the operation of the surveillance camera 1, and has a property of generating heat in response to the photographing operation of the surveillance camera 1. Not only the heat generation of the imaging device 21 itself, but also the heat generation of the ASIC 39 adversely affects the heat transmission to the imaging device 21 due to the heat damage, leading to problems such as a decrease in imaging performance of the monitoring camera 1 and a malfunction.

  Therefore, in the monitoring camera 1 of this embodiment, a heat countermeasure is taken so that the heat of the imaging device 21 and the ASIC 39 is dissipated to the outside, and the heat radiation of the imaging device 21 and the heat radiation of the ASIC 39 are performed by different heat radiation systems. Specifically, as shown in FIG. 3, the heat dissipation of the imaging element 21 is performed by the first heat dissipation system 41 configured in the front case 11, and the heat dissipation of the ASIC 39 is configured in the rear case 13. It is supposed to be done in 43.

  In the front case 11, a first heat transfer member 45 that thermally connects the inner wall surface of the front case 11 and the imaging device 21 is provided. The first heat transfer member 45 is a heat transfer plate 47, a heat transfer film 49, and a heat transfer sheet 51.

  The heat transfer plate 47 is made of, for example, a metal having high thermal conductivity such as aluminum, and is fixed at a plurality of places by fastening it to the boss 31 provided in the front case 11 like the printed circuit board 23 with screws 33. . The upper portion of the heat transfer plate 47 is formed with a receiving recess 53 for receiving the imaging device 21 together with the lens unit 19. The lower portion of the heat transfer plate 47 depends from the opening lower edge of the receiving recess 53 and is disposed along the front wall of the front case 11.

  The heat conductive film 49 is made of a resin such as silicone or acrylic resin, and has high flexibility and excellent heat conductivity. The heat conductive film 49 is attached to the surface of the FPC 29 opposite to the imaging device 21, and is thermally connected to the imaging device 21 via the FPC 29. The heat conductive film 49 is attached to the rear surface of the heat transfer plate 47 through the opening 55 formed in the bottom of the recess 53 of the heat transfer plate 47, and the heat received from the imaging device 21 through the FPC 29 Is transferred to the heat transfer plate 47.

  The heat conductive sheet 51 is made of, for example, a resin similar to the heat conductive film 49, and has high flexibility and excellent heat conductivity. The heat conductive sheet 51 is sandwiched between the lower portion of the heat transfer plate 47 and the inner surface (inner wall surface) of the front wall portion of the front case 11, and the heat of the heat transfer plate 47 is transferred to the front case Transmit to the 11 front wall.

  The first heat radiation system 41 is constituted by the heat transfer plate 47, the heat conduction film 49, the heat conduction sheet 51, and the front case 11, and causes the front case 11 itself to function as a heat radiation means to heat the imaging device 21. It is designed to dissipate outside.

  Further, a second heat transfer member 57 for dissipating the heat of the ASIC 39 to the outside is provided in the rear case 13. The second heat transfer member 57 is a heat transfer plate 59 and a heat transfer sheet 61.

  The heat transfer plate 59 is made of a metal having high thermal conductivity such as aluminum, and is disposed along the whole of the rear surface of the rear case 13 facing the internal space in the vertical direction. The heat conductive sheet 61 is made of resin such as silicone or acrylic resin, and has high flexibility and excellent thermal conductivity. The heat conductive sheet 61 is sandwiched between the ASIC 39 and the heat transfer plate 59 and is thermally connected to the ASIC 39 to transfer the heat of the ASIC 39 to the heat transfer plate 59 by heat conduction.

  The rear portion of the rear case 13 is provided with an attachment portion 63 to which the support device 5 is attached. The mounting portion 63 is disposed at a central position or a position near the center of the rear surface of the rear case 13, and is set near the center of gravity of the surveillance camera 1. The mounting portion 63 includes a recessed portion 65 recessed toward the inside of the rear case 13 and a screw receiving component 67 embedded in the recessed portion 65. The recessed portion 65 forms a protruding portion 69 which protrudes inward of the rear case 13.

  Further, in the rear surface portion of the rear case 13, a portion excluding the peripheral portion is a longitudinal bar 71 extending in the vertical direction from the mounting portion 63 (recessed portion 65), and a plurality of horizontal bars extending in the lateral direction from the mounting portion 63 and the vertical bar 71. It consists of 73 and. The vertical bars 71 and the horizontal bars 73 function as reinforcing portions that support the mounting portion 63 at the periphery. The vertical bars 71 and the horizontal bars 73 define a plurality of heat radiation holes 75 in the back of the rear case 13. The plurality of heat radiation holes 75 are vertically aligned on the left and right sides of the longitudinal bar 71.

  The longitudinal bar 71 is formed relatively thick, and supports the heat transfer plate 59 with the upper and lower edge portions of the rear case 13 on the inner surface. On the other hand, the cross bar 73 is formed relatively thin, and forms an air flow path 77 with the heat transfer plate 59. The air flow passage 77 is divided into right and left portions by a vertical bar 71. Further, the heat radiation holes 75 are also formed in the upper edge and the lower edge of the rear surface of the rear case 13. The air flow passage 77 connects the heat radiation holes 75 formed at the upper and lower edge portions.

  A boss 79 projecting inward of the case is provided on the periphery of the rear surface of the rear case 13 and around the attachment portion 63, specifically on the left and right sides of the attachment portion 63. The heat transfer plate 59 has a fitting hole 81 having a shape corresponding to the protrusion 69, and the fitting hole 81 is fitted to the protrusion 69 and fixed to the bosses 79 with screws 83. The inner space of 7 is closed behind. The heat transfer plate 59 disposed in this manner faces the plurality of heat dissipation holes 75 partitioned by the vertical bars 71 and the horizontal bars 73, and forms the front wall surface of the air flow path 77. That is, the rear surface of the heat transfer plate 59 is exposed to the air flow passage 77, and is exposed to the outside air through the heat dissipation holes 75.

  The second heat radiation system 43 is configured by the heat transfer plate 59 and the heat conduction sheet 61, and causes the heat transfer plate 59 to function as a heat release means to dissipate the heat of the ASIC 39 to the outside.

  When the temperature of the air in the air flow passage 77 is raised by the heat dissipation effect of the heat transfer plate 59, a phenomenon called chimney effect occurs. That is, as shown by a two-dot chain line in FIG. 4, the outside air is warmed by the air flow passage 77 while drawing the external air into the air flow passage 77 from the lower heat release holes 75 including the heat release holes 75 in the rear case 13 rear portion. The air rises and is released from the upper heat radiation holes 75. The heat transfer plate 59 is air cooled by the wind coming off the air flow passage 77 due to the chimney effect. As a result, as the amount of heat generation of the ASIC 39 increases, the heat dissipation of the ASIC 39 by the second heat dissipation system is efficiently performed.

  In the housing 7, in addition to the camera module 9, a speaker and an LED (Light Emitting Diode), not shown, are assembled to the front case 11 and accommodated. The speaker is incorporated in the monitoring camera 1 facing a plurality of pores (not shown) formed in the front portion of the front case 11. The LEDs constitute a lamp portion (not shown) provided on the front surface of the front case 11. When the trigger signal from the PLC is input, the monitoring camera 1 sounds a speaker or causes the lamp unit to emit light to notify of an abnormality of the work.

  According to the monitoring camera 1 according to this embodiment, the first heat dissipation system 41 is provided on the front side of the housing 7 and the second heat dissipation system 43 is provided on the rear side of the housing 7 to dissipate heat of the imaging device 21 as the first heat dissipation system. Since the heat dissipation of the ASIC is performed by the second heat dissipation system 43, the heat dissipation of the imaging device 21 and the heat dissipation of the ASIC 39 can be efficiently performed by different heat dissipation systems. Moreover, in consideration of the fact that the heat generation amount of the ASIC 39 is larger than the heat generation amount of the imaging device 21, the cooling performance of the second heat radiation system 43 is higher than that of the first heat radiation system 41 by using the heat transfer plate 59 as a heat radiation means. As the heat generation amount of the ASIC 39 is increased due to the photographing operation for a long time, the heat generated in the ASIC 39 is prevented from being transmitted to the image pickup device 21 and the heat damage to the image pickup device 21 is caused. It can be avoided. Thereby, the imaging performance of the surveillance camera 1 can be maintained for a long time.

  As described above, the preferred embodiments have been described as examples of the technology disclosed herein. However, the technology disclosed herein is not limited to this, and is also applicable to embodiments in which changes, replacements, additions, omissions, and the like are made as appropriate. Further, among the components described in the attached drawings and the detailed description, components which are not essential for solving the problem may be included. Therefore, the fact that those non-essential components are described in the attached drawings and the detailed description should not immediately mean that those non-essential components are essential.

  For example, the above-described embodiment may be configured as follows.

  In the above-described embodiment, the rear surface portion of the housing 7 has a portion formed of the vertical bars 71 and the horizontal bars 73, and the plurality of heat dissipation holes 75 are defined by the vertical bars 71 and the horizontal bars 73. But it is not limited to this. The back surface portion of the housing 7 may be a flat plate-like portion provided with the mounting portion 63. Also in this case, the heat dissipation holes 75 are respectively formed at the upper and lower edge portions of the housing 7 and between the flat plate-like portion of the back surface portion of the housing 7 and the heat transfer plate 59 Preferably, an air passage 77 connecting the two is provided. By doing so, as described in the above embodiment, it is possible to obtain the air cooling effect of the heat transfer plate 59 by the chimney effect.

  Moreover, in the said embodiment, although the form by which the heat transfer plate 47, the heat conductive film 49, and the heat conductive sheet 51 were provided in the front case 11 was illustrated as the 1st heat-transfer member 45, it does not restrict to this. The first heat transfer member 45 provided in the front case 11 may be only the heat transfer plate 47 or may be only the heat conduction sheet 51. As the first heat transfer member 45, any member capable of heat transfer by heat conduction can be employed. The point is that a heat transfer member is provided so as to thermally connect the inner wall surface of the front case 11 and the imaging device 21, and the first heat dissipation system 41 may be configured.

  Moreover, in the said embodiment, although the form in which the heat-transfer plate 59 and the heat-conduction sheet | seat 61 were provided was illustrated as a 2nd heat-transfer member 57, it does not restrict to this. The second heat transfer member 57 provided in the rear case 13 may be only the heat transfer plate 59 disposed with a space between the second heat transfer member 57 and the ASIC 39. As the second heat transfer member 57, any member capable of heat transfer by heat conduction can be employed. The point is that a heat transfer member that is capable of exchanging heat with the heat generated by the ASIC 39 and that functions as a heat dissipation means is provided, and the second heat dissipation system 43 may be configured.

  In the above-mentioned embodiment, although surveillance camera 1 which supervises a factory production line was mentioned as an example and explained about a surveillance camera concerning art of this indication, it does not restrict to this. The surveillance camera 1 for a plant is only an example, and the surveillance camera according to the technology of the present disclosure is a camera used for measuring traffic flow and controlling speeding on a highway, etc., and public facilities such as stores and stations. It is possible to apply to various surveillance cameras known not only in applications such as cameras used for crime prevention and disaster prevention, but also for any purpose.

  As described above, the technology of the present disclosure is useful for a surveillance camera that captures a predetermined place for a long time.

DESCRIPTION OF SYMBOLS 1 ... Surveillance camera, 3 ... Support apparatus, 5 ... Flange, 7 ... Housing | casing, 9 ... Camera module,
11 ... front case, 13 ... rear case, 15 ... lens hole, 17 ... screw
19: lens unit, 21: imaging device, 23: printed circuit board, 25: photographing lens,
27 Lens holder, 29 FPC, 31 boss, 33 screw, 37 LAN connector
39 ... ASIC (integrated circuit), 41 ... first heat dissipation system, 43 ... second heat dissipation system,
45: first heat transfer member, 47: heat transfer plate, 49: heat conductive film, 51: heat conductive sheet,
53: Receiving recess, 55: Opening, 57: Second heat transfer member, 59: Heat transfer plate,
61: heat conductive sheet, 63: mounting portion, 65: concave portion, 67: screw receiving part, 69: projecting portion,
71 ... vertical bar, 73 ... horizontal bar, 75 ... heat radiation hole, 77 ... air flow path, 79 ... boss, 81 ... fitting hole,
83: Screw

Claims (4)

A surveillance camera in which an imaging device and an integrated circuit are housed in a casing as heat sources that generate heat in response to a photographing operation,
The housing is composed of a front case disposed on the front side and a rear case disposed on the rear side,
In the front case, a first heat transfer member is provided which thermally connects the inner wall surface of the front case to the imaging device, and the front case itself functions as a heat dissipation means to thermally transfer the imaging device. A first heat dissipation system that dissipates
A heat dissipation hole is formed in the rear case, and a second heat transfer member thermally connected to the integrated circuit and exposed to the outside air through the heat dissipation hole is provided in the rear case, A surveillance camera comprising a second heat dissipation system which causes a second heat transfer member to function as a heat dissipation means to dissipate the heat of the integrated circuit to the outside. In the surveillance camera according to claim 1,
A surveillance camera characterized in that no air intake hole is formed in the front case. The surveillance camera according to claim 1 or 2
The heat dissipation holes are formed in the upper and lower portions of the rear case,
The rear case is provided with an air flow path connecting the upper heat dissipation hole and the lower heat dissipation hole;
The second heat transfer member is exposed to the air flow path. In the surveillance camera according to claim 3,
A plurality of the heat dissipation holes are formed on the rear surface of the rear case,
A surveillance camera comprising a plate-like member facing the plurality of heat dissipation holes formed in the rear surface of the rear case as the second heat transfer member.

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