KR20080073072A - Camera module having radiating means - Google Patents

Camera module having radiating means Download PDF

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Publication number
KR20080073072A
KR20080073072A KR1020070011608A KR20070011608A KR20080073072A KR 20080073072 A KR20080073072 A KR 20080073072A KR 1020070011608 A KR1020070011608 A KR 1020070011608A KR 20070011608 A KR20070011608 A KR 20070011608A KR 20080073072 A KR20080073072 A KR 20080073072A
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South Korea
Prior art keywords
camera module
heat
image sensor
pcb
camera
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KR1020070011608A
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Korean (ko)
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서필기
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엘지이노텍 주식회사
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Priority to KR1020070011608A priority Critical patent/KR20080073072A/en
Publication of KR20080073072A publication Critical patent/KR20080073072A/en

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B30/00—Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/55—Details of cameras or camera bodies; Accessories therefor with provision for heating or cooling, e.g. in aircraft

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Studio Devices (AREA)

Abstract

A camera module having a radiation unit is provided to cool high temperature heat generated on the image sensor and PCB using the radiation unit, thereby extending the life span and preventing a photographed image from being damaged by heat. A camera module(A) includes a lens unit(10), a camera housing(20), an IR(Infrared) filter(30), an image sensor(40), and a PCB(Printed Circuit Board,50). A radiation unit(60) is installed in the inner walls of the camera housing to cool high temperature heat generated on the image sensor and the PCB. The radiation unit includes a first radiation plate(61) and plural second radiation plates(62). The first radiation plate is made of thermally conductive materials, and is attached to the inner wall of the camera housing. The plural second radiation plates are made of thermally conductive materials, and disposed at regular intervals on the first radiation plate.

Description

방열수단이 구비된 카메라모듈{CAMERA MODULE HAVING RADIATING MEANS}Camera module with heat dissipation means {CAMERA MODULE HAVING RADIATING MEANS}

도 1은 종래 기술에 따른 카메라모듈의 내부 결합구조를 나타낸 단면도이다.1 is a cross-sectional view showing the internal coupling structure of the camera module according to the prior art.

도 2는 본 발명의 일 실시예에 따른 카메라모듈의 구성을 나타낸 분해 사시도이다.2 is an exploded perspective view showing the configuration of a camera module according to an embodiment of the present invention.

도 3은 본 발명의 일 실시예에 따른 카메라모듈의 내부 결합구조를 나타낸 단면도이다.Figure 3 is a cross-sectional view showing the internal coupling structure of the camera module according to an embodiment of the present invention.

도 4는 본 발명의 다른 실시예에 따른 카메라모듈의 구성을 나타낸 분해 사시도이다.4 is an exploded perspective view showing the configuration of a camera module according to another embodiment of the present invention.

* 도면 중 주요부분에 대한 부호의 설명** Explanation of symbols for main parts of the drawings *

I - 카메라모듈 10 - 렌즈부I-Camera Module 10-Lens Section

20 - 카메라하우징 30 - IR필터20-Camera Housing 30-IR Filter

40 - 이미지센서 50 - PCB40-Image sensor 50-PCB

60,60' - 방열수단 61 - 제 1방열판60,60 '-Heat dissipation means 61-First heat sink

62 - 제 2방열판 62a - 관통공62-2nd heat sink 62a-Through hole

63 - 냉각호스 63-cooling hose

본 발명은 방열수단이 구비된 카메라모듈에 관한 것이다.The present invention relates to a camera module having a heat radiating means.

일반적으로 카메라모듈(100)은 도 1의 도시와 같이 렌즈부(110)와, 카메라하우징(120)과, IR필터(130)와, 이미지센서(140) 및, PCB(150)로 구성되어 피사체의 광이미지를 렌즈부(110)가 수광받아 IR필터(130)로 전달하고, IR필터(130)는 수광된 광이미지에서 적외선을 차단한 후 이미지센서(140)로 조사하게 되며, 이미지센서(140)는 조사된 광이미지를 전기적인 신호로 변환하여 PCB(150)를 통해 출력되는 구조를 갖는다.In general, the camera module 100 includes a lens unit 110, a camera housing 120, an IR filter 130, an image sensor 140, and a PCB 150 as illustrated in FIG. 1. After receiving the optical image of the lens unit 110 receives the IR filter 130, the IR filter 130 blocks the infrared rays from the received optical image and irradiates the image sensor 140, the image sensor ( 140 has a structure in which the irradiated optical image is converted into an electrical signal and output through the PCB 150.

여기서, PCB(150)에는 이미지센서(140) 이외에 여러 부품들이 실장되는바, 이들 부품이 동작하면서 열이 발생되고, 발생된 열은 주위 공기와 카메라하우징(120)의 온도를 높이게 된다.Here, the PCB 150, in addition to the image sensor 140, the various components are mounted, heat is generated while these components are operating, the generated heat increases the temperature of the ambient air and the camera housing 120.

특히, 이미지센서(140)는 고유 특성으로 고온상태에서 픽셀의 암 전류가 형성되며, 이미지센서(140)에 노이즈가 발생된다. 이 경우 노이즈를 감소하는 방법으로 베이스 밴드 칩(Base Band Chip)에서 이미지센서(140)의 AMP GAin, Color Gain, Suppression기능으로 온도 감지기능을 활용하지만, 기구적으로 이를 대처할 별도의 방법이 마련되어 있지 못하다.In particular, the image sensor 140 has a unique characteristic that a dark current of the pixel is formed at a high temperature, and noise is generated in the image sensor 140. In this case, the temperature reduction function is used as the AMP GAIN, Color Gain, and Suppression function of the image sensor 140 in the base band chip as a method of reducing noise, but there is no separate method to cope with this mechanically. Can not do it.

따라서, 이미지센서(140) 및 PCB(150)에서 발생되는 열을 효과적으로 제거하 지 못하기 때문에 이미지센서(140) 및 PCB(150)에 영향을 주어 부품들의 오작동을 유발할 수 있고, 성능이 저하되는 문제점이 있게 된다.Therefore, since the heat generated from the image sensor 140 and the PCB 150 may not be removed effectively, the image sensor 140 and the PCB 150 may be affected, which may cause malfunctions of components, and performance may be degraded. There is a problem.

따라서, 본 발명은 전술한 종래의 제반 문제점을 해결하기 위하여 안출된 것으로, 이러한 본 발명의 목적은 카메라모듈의 이미지센서 및 PCB에 의해 발생되는 열을 효과적으로 방열시켜 열로 인한 영향으로부터 카메라모듈 내 부품들을 보호하고, 카메라모듈의 신뢰성을 높일 수 있는 카메라모듈을 제공함에 있다.Accordingly, the present invention has been made to solve the above-mentioned conventional problems, an object of the present invention is to effectively dissipate heat generated by the image sensor and PCB of the camera module to effectively remove the components in the camera module from the effects of heat. It is to provide a camera module to protect and increase the reliability of the camera module.

이러한, 본 발명은 렌즈부와, 카메라하우징과, IR필터와, 이미지센서 및, PCB로 구성되는 카메라모듈에 있어서, 상기 카메라하우징의 내부 양측 벽면에는 상기 이미지센서 및 PCB에서 발생되는 고온의 열을 냉각시키기 위한 방열수단이 설치된다.The present invention is a camera module consisting of a lens unit, a camera housing, an IR filter, an image sensor, and a PCB, wherein the high temperature heat generated from the image sensor and the PCB is provided on both inner walls of the camera housing. Heat dissipation means for cooling is installed.

이하, 본 발명의 속하는 기술분야에서 통상의 지식을 가진 자가 본 발명을 용이하게 실시할 수 있을 정도로 본 발명의 바람직한 실시 예를 첨부된 도면을 참조하여 상세하게 설명하면 다음과 같다.Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings such that those skilled in the art may easily implement the present invention.

도 2는 본 발명의 일 실시예에 따른 카메라모듈의 구성을 나타낸 분해 사시도이고, 도 3은 본 발명의 일 실시예에 따른 카메라모듈의 내부 결합구조를 나타낸 단면도이며, 도 4는 본 발명의 다른 실시예에 따른 카메라모듈의 구성을 나타낸 분해 사시도이다.2 is an exploded perspective view showing the configuration of a camera module according to an embodiment of the present invention, Figure 3 is a cross-sectional view showing the internal coupling structure of the camera module according to an embodiment of the present invention, Figure 4 is another of the present invention An exploded perspective view showing the configuration of the camera module according to the embodiment.

도 2 내지 도 4의 도시와 같이 본 발명에 따른 카메라모듈(A)은 카메라하우징(20)의 내부 양측 벽면에 설치되는 방열수단(60)을 포함하여 구성된다.2 to 4, the camera module A according to the present invention includes heat dissipation means 60 installed on both inner wall surfaces of the camera housing 20.

먼저, 본 발명에 따른 카메라모듈(A)은 렌즈부(10)와, 카메라하우징(20)과, IR필터(30)와, 이미지센서(40) 및, PCB(50)를 포함하여 구성되어 상기 렌즈부(10)는 카메라하우징(20)의 상부에 나사체결방식에 의해 체결 조립되고, 이미지센서(40)는 PCB(50)의 상면에 탑재되며, 카메라하우징(20)은 에폭시 등과 같은 접착제를 이용하여 PCB(50)의 상면에 밀봉 조립되는 등 종래의 카메라모듈과 동일한 구조 및 동일한 방법으로 조립된다.First, the camera module A according to the present invention includes a lens unit 10, a camera housing 20, an IR filter 30, an image sensor 40, and a PCB 50. The lens unit 10 is fastened and assembled to the upper part of the camera housing 20 by a screw fastening method, the image sensor 40 is mounted on the upper surface of the PCB 50, and the camera housing 20 uses an adhesive such as epoxy. It is assembled by the same structure and the same method as the conventional camera module, such as sealed to the upper surface of the PCB 50 by using.

이때, 카메라하우징(20)의 내부 양측 벽면에는 이미지센서(40) 및 PCB(50)에서 발생되는 고온의 열을 효과적으로 방열시키기 위한 소정의 방열수단(60)이 설치된다.In this case, predetermined heat dissipation means 60 is installed on both inner walls of the camera housing 20 to effectively dissipate high temperature heat generated from the image sensor 40 and the PCB 50.

이는 본 발명의 특징을 이루는 부분으로 이미지센서(40) 및 PCB(50)에서 발생되는 고온의 열기가 방열수단(60)을 통해 냉각되도록 하는 것이다.This is to make the heat of the high temperature generated in the image sensor 40 and the PCB 50 as a part of the feature of the present invention through the heat dissipation means (60).

이러한, 방열수단(60)은 카메라하우징(20)의 내부 벽면에 부착되는 판체형의 제 1방열판(61)과, 제 1방열판(61)의 외측에 일정 간격을 두고 이격 배치되는 다수의 제 2방열판(62)으로 구성된다.The heat dissipation means 60 may include a plate-shaped first heat dissipation plate 61 attached to an inner wall of the camera housing 20 and a plurality of second spaced apart from the first heat dissipation plate 61 at regular intervals. The heat sink 62 is comprised.

이때, 제 2방열판(62)은 방열효율을 향상시킬 수 있도록 하단에서 상단으로 점차 길어지는 구조를 가지며, 그 형태는 평판형으로 구성되거나, 곡선형의 형태로 구성될 수 있다.In this case, the second heat dissipation plate 62 may have a structure that gradually increases from the lower end to the upper end so as to improve heat dissipation efficiency, and may have a flat shape or a curved shape.

여기서, 제 2방열판(62)이 곡선형으로 형성되는 경우에는 도 4의 도시와 같이 방열에 대한 전용면적이 넓어져 열을 많이 흡수할 수 있기 때문에 열의 분산이 적절하게 이루어질 수 있는 장점이 있게 된다.Here, when the second heat dissipation plate 62 is formed in a curved shape, as shown in FIG. 4, since a dedicated area for heat dissipation is expanded to absorb a lot of heat, heat dissipation may be properly performed. .

이와 같은 방열수단(60)은 열전도성이 우수한 재질, 예를 들면 은(AG), 동(CU), 금(AU), 알루미늄(Al), 텅스텐(W) 중 어느 하나로 구성되거나, 이들의 조합으로 구성될 수 있다.The heat dissipation means 60 is composed of a material having excellent thermal conductivity, for example, silver (AG), copper (CU), gold (AU), aluminum (Al), tungsten (W), or a combination thereof. It may be configured as.

한편, 방열수단(60)에는 소정의 냉각호스(63)가 추가적으로 구비되어 이미지센서(40) 및 PCB(50)의 온도 상승률 둔화를 더욱 효과적으로 구현할 수 있게 된다.On the other hand, the heat dissipation means 60 is provided with a predetermined cooling hose 63 is able to more effectively implement the temperature increase rate slowing of the image sensor 40 and the PCB 50.

즉, 방열수단(60)을 구성하는 제 2방열판(62)에는 길이 방향에 수직한 방향으로 동일한 중심축을 갖는 관통공(62a)이 구비되고, 이 관통공(62a)에는 내부에 소정의 냉각수가 저장된 냉각호스(63)가 설치되는 것으로, 냉각호스(63)가 각각의 제 2방열판(62)들을 연결하면서 설치되기 때문에 이미지센서(40) 및 PCB(50)의 온도 상승시 상기 제 1,2방열판(61)(62) 자체의 냉각과, 냉각호스(63)에 의한 추가적인 냉각으로 인하여 더욱 효율적인 냉각효율을 기대할 수 있게 된다.That is, the second heat dissipation plate 62 constituting the heat dissipation means 60 is provided with a through hole 62a having the same central axis in the direction perpendicular to the longitudinal direction, and the through hole 62a has predetermined cooling water therein. The stored cooling hose 63 is installed, and since the cooling hose 63 is installed while connecting the respective second heat sinks 62, the first and second temperatures are increased when the temperature of the image sensor 40 and the PCB 50 rises. Due to the cooling of the heat sinks 61 and 62 itself and the additional cooling by the cooling hose 63, more efficient cooling efficiency can be expected.

이상, 본 발명을 바람직한 실시예를 사용하여 상세히 설명하였으나, 본 발명의 범위는 특정 실시예에 한정되는 것은 아니며, 첨부된 특허청구범위에 의하여 해석되어야 할 것이다. 또한, 이 기술분야에서 통상의 지식을 습득한 자라면, 본 발명의 범위에서 벗어나지 않으면서도 많은 수정과 변형이 가능함을 이해하여야 할 것이다.As mentioned above, although this invention was demonstrated in detail using the preferable Example, the scope of the present invention is not limited to a specific Example and should be interpreted by the attached Claim. In addition, those skilled in the art should understand that many modifications and variations are possible without departing from the scope of the present invention.

상술한 바와 같이 본 발명에 따른 카메라모듈에 의하면, 카메라모듈의 이미지센서 및 PCB에서 발생되는 고온의 열을 효과적으로 냉각시킬 수 있기 때문에 카메라모듈을 장시간 사용하여도 자체적으로 발생되는 열을 냉각시킬 수 있기 때문에 카메라모듈의 원활한 촬영을 기대할 수 있고, 열에 의하여 촬영 영상이 손상되지 않도록 할 수 있게 되는 등의 효과를 제공한다.As described above, according to the camera module according to the present invention, since the high temperature heat generated from the image sensor and the PCB of the camera module can be effectively cooled, the heat generated by itself can be cooled even when the camera module is used for a long time. Therefore, it is possible to expect a smooth shooting of the camera module, and to provide an effect such that the captured image is not damaged by heat.

Claims (6)

렌즈부와, 카메라하우징과, IR필터와, 이미지센서 및, PCB로 구성되는 카메라모듈에 있어서,In the camera module consisting of a lens unit, a camera housing, an IR filter, an image sensor, and a PCB, 상기 카메라하우징의 내부 양측 벽면에는 상기 이미지센서 및 PCB에서 발생되는 고온의 열을 냉각시키기 위한 방열수단이 설치되는 카메라모듈.Camera modules provided with heat dissipation means for cooling the high temperature heat generated from the image sensor and the PCB on both inner walls of the camera housing. 제 1 항에 있어서,The method of claim 1, 상기 방열수단은,The heat dissipation means, 열전도가 가능한 재질로 형성되며, 카메라 하우징의 내부 벽면에 부착 설치되는 열전도 재질의 제 1방열판과,A first heat radiation plate formed of a heat conductive material and attached to an inner wall of the camera housing; 열전도가 가능한 재질로 형성되며, 상기 제 1방열판의 외측에 일정 거리를 두고 이격 배치되는 다수의 제 2방열판으로 구성되는 카메라모듈.The camera module is formed of a material capable of thermal conduction, and comprises a plurality of second heat sinks spaced apart from each other at a predetermined distance to the outside of the first heat sink. 제 2 항에 있어서,The method of claim 2, 상기 제 2방열판은,The second heat sink is, 평판형의 날개로 구성되는 카메라모듈.Camera module consisting of a flat wing. 제 2 항에 있어서,The method of claim 2, 상기 제 2방열판은,The second heat sink is, 곡선형의 날개로 구성되는 카메라모듈.Camera module consisting of curved wings. 제 2 항에 있어서,The method of claim 2, 상기 제 2방열판은 하단에서 상단으로 점차 길이가 길어지도록 구성되는 카메라모듈.The second heat sink is a camera module configured to gradually increase in length from the bottom to the top. 제 1 항 또는 제 2 항에 있어서,The method according to claim 1 or 2, 상기 방열수단에는,The heat dissipation means, 내부에 냉각수가 충전된 냉각호스가 추가적으로 설치되는 카메라모듈.Camera module that is installed with additional cooling hose filled with coolant inside.
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KR20100127569A (en) * 2009-05-26 2010-12-06 엘지이노텍 주식회사 Cube type lens holder and camera module using the same
KR101148584B1 (en) * 2009-11-04 2012-05-25 히다치 막셀 가부시키가이샤 Imaging device
WO2014178539A1 (en) * 2013-04-29 2014-11-06 주식회사 뷰웍스 Image photographing apparatus
KR20150094433A (en) * 2014-02-11 2015-08-19 재단법인 다차원 스마트 아이티 융합시스템 연구단 Camera system for applying heat insulating function
KR101693308B1 (en) * 2016-10-12 2017-01-11 주식회사 현대콘트롤전기 The camera housing in which the cooling device is built
KR101879661B1 (en) * 2011-08-31 2018-07-19 엘지이노텍 주식회사 Camera module
CN109462972A (en) * 2018-12-28 2019-03-12 中科和光（天津）应用激光技术研究所有限公司 A kind of heat radiating type core shell structure
CN110184149A (en) * 2019-06-21 2019-08-30 池爱芬 A kind of brewing system proportioner
KR20190122014A (en) 2018-04-19 2019-10-29 (주)미래컴퍼니 Camera module with lens base integrated with heat sink
CN110389357A (en) * 2018-04-19 2019-10-29 韩商未来股份有限公司 Use the camera of the light source with subject eye protection function
CN110703541A (en) * 2019-09-20 2020-01-17 浙江华睿科技有限公司 Heat dissipation mechanism and industrial camera
US10944892B2 (en) 2017-03-20 2021-03-09 Rosenberger Hochfrequenztechnik Gmbh Housing part for a camera housing

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100127569A (en) * 2009-05-26 2010-12-06 엘지이노텍 주식회사 Cube type lens holder and camera module using the same
KR101148584B1 (en) * 2009-11-04 2012-05-25 히다치 막셀 가부시키가이샤 Imaging device
KR101879661B1 (en) * 2011-08-31 2018-07-19 엘지이노텍 주식회사 Camera module
US9628731B2 (en) 2013-04-29 2017-04-18 Vieworks Co., Ltd. Image capture apparatus
WO2014178539A1 (en) * 2013-04-29 2014-11-06 주식회사 뷰웍스 Image photographing apparatus
KR20150094433A (en) * 2014-02-11 2015-08-19 재단법인 다차원 스마트 아이티 융합시스템 연구단 Camera system for applying heat insulating function
KR101693308B1 (en) * 2016-10-12 2017-01-11 주식회사 현대콘트롤전기 The camera housing in which the cooling device is built
US10944892B2 (en) 2017-03-20 2021-03-09 Rosenberger Hochfrequenztechnik Gmbh Housing part for a camera housing
KR20190122014A (en) 2018-04-19 2019-10-29 (주)미래컴퍼니 Camera module with lens base integrated with heat sink
CN110389357A (en) * 2018-04-19 2019-10-29 韩商未来股份有限公司 Use the camera of the light source with subject eye protection function
US10481470B2 (en) 2018-04-19 2019-11-19 Meerecompany Inc. Camera using light source having subject eye protection function
CN109462972A (en) * 2018-12-28 2019-03-12 中科和光（天津）应用激光技术研究所有限公司 A kind of heat radiating type core shell structure
CN109462972B (en) * 2018-12-28 2024-03-29 中科和光（天津）应用激光技术研究所有限公司 Heat dissipation type core shell structure
CN110184149A (en) * 2019-06-21 2019-08-30 池爱芬 A kind of brewing system proportioner
CN110184149B (en) * 2019-06-21 2022-05-20 绍兴白塔酿酒有限公司 Batching device for wine making system
CN110703541B (en) * 2019-09-20 2021-07-20 浙江华睿科技有限公司 Heat dissipation mechanism and industrial camera
CN110703541A (en) * 2019-09-20 2020-01-17 浙江华睿科技有限公司 Heat dissipation mechanism and industrial camera

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