KR20190122014A - Camera module with lens base integrated with heat sink - Google Patents

Abstract

The present invention relates to a camera module applied with a lens base to which a heat sink is integrated. The camera module comprises: a heat sink/lens base integrated module to which a heat sink and a lens base are integrated; a lens module coupled to a lens coupling part provided in the heat sink/lens base integrated module; a light source board coupled to a first surface of the heat sink/lens base integrated module; and a control board positioned on a second surface of the heat sink/lens base integrated module. According to the present invention, the heat sink and the lens base are integrated to simplify a product manufacturing process, the product manufacturing time is reduced while reducing product manufacturing costs, and the product can be miniaturized and heat dissipation efficiency can be improved.

Description

CAMERA MODULE WITH LENS BASE INTEGRATED WITH HEAT SINK}

The present invention relates to a camera module using a lens base in which a heat sink is integrated. More specifically, the present invention can integrate the heat sink and the lens base to simplify the product manufacturing process, reduce the product manufacturing time, reduce the product manufacturing cost, and at the same time reduce the size of the product and improve the heat dissipation efficiency. It relates to a camera module to which a lens base integrated with a heat sink is applied.

In general, a camera module is manufactured by using an optical unit including an image sensor module, a housing, and a lens barrel in which an image sensor such as a CCD or a CMOS is mounted on a substrate, and focuses an image of a subject through the image sensor. And stored as data on a memory in the device, and the stored data is displayed as an image on a display medium such as an LCD or a PC monitor in the device.

Unlike conventional RGB cameras used in mobile phones, sensor cameras such as time-of-flight (ToF) cameras using light sources require continuous shooting of a subject and send out the image information. In addition, the trend of the product is small and thin while maintaining the product performance, it is necessary to develop a product that can achieve efficient heat dissipation while satisfying the product performance.

1 is a view showing a conventional camera module.

Referring to FIG. 1, a conventional camera module includes a light source board 1 on which components such as a light source are mounted, a heat sink 2 that emits heat generated from the light source board, and a lens base 5 to which the lens module 5 is coupled. 6), the control board 7 for controlling the overall operation of the camera module, and other coupling members (3-1, 3-2, 3-3, 3-4).

As described above, according to the conventional camera module, since the heat sink 2 and the lens base 6 are each provided as separate components, the manufacturing process of the camera module becomes complicated, and manufacturing time and manufacturing cost increase.

In addition, due to the space occupied by the heat sink 2 and the lens base 6 provided as separate components, it is difficult to miniaturize the product, and there is a problem in that heat dissipation efficiency is lowered due to structural limitations.

Republic of Korea Patent Publication No. 10-2014-0000078 (published date: January 02, 2014, name: camera module) Republic of Korea Patent Publication No. 10-2010-0098879 (published date: September 10, 2010, name: camera module) Republic of Korea Patent Publication No. 10-2008-0073072 (published date: August 08, 2008, name: camera module with a heat dissipation means)

The present invention simplifies the product manufacturing process by integrating the heat sink and the lens base, shortens the product manufacturing time, reduces the product manufacturing cost, and at the same time integrates the heat sink capable of miniaturizing the product and improving heat dissipation efficiency. It is a technical problem to provide a camera module to which a lens base is applied.

The camera module to which the heat sink integrated lens base according to the present invention for solving the above technical problem is provided in the heat sink / lens base integrated module in which the heat sink and the lens base are integrated, and the heat sink / lens base integrated module. A lens module coupled to the coupled lens coupling portion, a light source board coupled to the first surface of the heat sink / lens base integrated module, and a control board positioned on the second surface of the heat sink / lens base integrated module.

The camera module to which the heat sink integrated lens base according to the present invention is applied further comprises an image sensor board coupled to be in contact with the second surface of the heat sink / lens base integrated module.

In the camera module to which the heat sink integrated lens base according to the present invention is applied, the light sink board is coupled to one side of the first surface of the heat sink / lens base integrated module, and the heat sink / lens base is contacted. A heat dissipation pattern is formed in the other region of the first surface of the integrated module to increase heat dissipation efficiency, and the lens module is formed between the one region and the other region of the heat sink / lens base integrated module. It is characterized in that coupled to.

The camera module to which the lens base integrated with the heat sink according to the present invention is applied is coupled / supported for coupling and supporting the control board and the image sensor board in contact with the second surface of the heat sink / lens base integrated module in a spaced apart state. It further comprises support means.

In the camera module to which the heatsink integrated lens base according to the present invention is applied, at least one of the control board or the image sensor board coupled to the coupling / support means is responsive to light in a portion corresponding to the coupling / support means. It is characterized in that the material that can recognize the position is applied.

The camera module to which the heatsink integrated lens base according to the present invention is applied further comprises a flexible printed circuit (FPC) electrically connecting the light source board and the control board.

The camera module to which the lens base integrated with the heat sink according to the present invention is applied further includes a board to board (BTOB) connector for electrically connecting the image sensor board and the control board.

In the camera module to which the heat sink integrated lens base according to the present invention is applied, the heat sink / lens base integrated module is injection molded integrally.

According to the present invention, a heat sink capable of integrating a heat sink and a lens base simplifies a product manufacturing process, shortens a product manufacturing time, reduces a product manufacturing cost, reduces the size of a product, and improves heat dissipation efficiency. The camera module to which the integrated lens base is applied is provided.

1 is a view showing a camera module provided with a conventional heat sink and a lens base separately,
2 is a combined perspective view of a camera module using a lens base in which a heat sink is integrated according to an embodiment of the present invention;
3 is an exploded perspective view of a camera module using a lens base in which a heat sink is integrated according to an embodiment of the present invention;
4 is a cross-sectional view taken along the AA ′ direction of the camera module using the lens base in which the heat sink is integrated, according to an embodiment of the present invention;
5 is a front view of a camera module using a lens base in which a heat sink is integrated according to an embodiment of the present invention;
6 is a rear view of a camera module using a lens base in which a heat sink is integrated according to an embodiment of the present invention;
7 is a top view of a camera module using a lens base integrated with a heat sink according to an embodiment of the present invention.
8 is a bottom view of a camera module using a lens base in which a heat sink is integrated according to an embodiment of the present invention;
9 is a left side view of a camera module using a lens base in which a heat sink is integrated according to an embodiment of the present invention;
10 is a right side view of a camera module using a lens base in which a heat sink is integrated according to an embodiment of the present invention.

Specific structural or functional descriptions of the embodiments according to the inventive concept disclosed herein are provided only for the purpose of describing the embodiments according to the inventive concept. It may be embodied in various forms and is not limited to the embodiments described herein.

Embodiments according to the inventive concept may be variously modified and have various forms, so embodiments are illustrated in the drawings and described in detail herein. However, this is not intended to limit the embodiments in accordance with the concept of the invention to the specific forms disclosed, it includes all changes, equivalents, or substitutes included in the spirit and scope of the present invention.

Terms such as first or second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another, for example without departing from the scope of the rights according to the inventive concept, and the first component may be called a second component and similarly the second component. The component may also be referred to as the first component.

When a component is said to be "connected" or "connected" to another component, it may be directly connected to or connected to that other component, but it may be understood that other components may exist in the middle. Should be. On the other hand, when a component is said to be "directly connected" or "directly connected" to another component, it should be understood that no other component exists in the middle. Other expressions describing the relationship between components, such as "between" and "immediately between" or "neighboring to" and "directly neighboring", should be interpreted as well.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this specification, terms such as "comprise" or "have" are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described herein, but one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art, and are not construed in ideal or excessively formal meanings unless expressly defined herein. Do not.

Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the present invention.

2 is a combined perspective view of a camera module using a lens base integrated with a heat sink according to an embodiment of the present invention, FIG. 3 is an exploded perspective view thereof, FIG. 4 is a sectional view taken along the AA ′ direction of FIG. 2 is a front view of FIG. 2, FIG. 6 is a rear view of FIG. 2, FIG. 7 is a top view of FIG. 2, FIG. 8 is a bottom view of FIG. 2, FIG. 9 is a left side view of FIG. 2, and FIG. 10 is It is a right side view of FIG.

2 to 10, a camera module using a lens base integrated with a heat sink according to an embodiment of the present invention includes a heat sink / lens base integrated module 10, a lens module 20, and a light source board 30. ), Control board 40, image sensor board 50, coupling / support means (61, 62, 63, 64), board to board (BTOB) connector 70, flexible printed circuit (FPC) 80 and images Sensor 100.

The heat sink / lens base integrated module 10 is provided to have a structure in which the heat sink and the lens base are integrated.

The heat sink / lens base integrated module 10 functions as a lens base providing a structural base to which the lens module 20 is coupled, and at the same time, the light source board 30 and the image sensor board 50 to be described later. It performs the function of a heat sink to release heat generated from the components included.

Although the prior art has been described with reference to FIG. 1, according to the prior art, since the lens base providing the structural base to which the heat sink performing the heat dissipation function and the lens module 20 are coupled is provided as a separate component, There is a problem that the manufacturing process of the camera module becomes complicated, and the manufacturing time and manufacturing cost increase. In addition, due to the space occupied by the heat sink and the lens base provided as separate components, it is difficult to miniaturize the product, and there is a problem that the heat dissipation efficiency is lowered due to structural limitations.

However, according to an embodiment of the present invention, since the heat sink / lens base integrated module 10 has a structure in which the heat sink and the lens base are integrated, the product manufacturing process can be simplified and the product manufacturing time can be shortened. In addition, the product manufacturing cost can be reduced, the product can be downsized, and the heat dissipation efficiency can be improved.

For example, the heat sink / lens base integrated module 10 may be configured to be integrally injection molded. According to this configuration, the heat sink and the lens base, which are two conventional parts, can be manufactured in a single process through injection molding, and the entire manufacturing process of the camera module is simplified because the joining process of these parts is unnecessary, Manufacturing time can be shortened, manufacturing cost can be reduced, and a product can be miniaturized.

For example, in one region of the first surface of the heat sink / lens base integrated module 10, a light source board 30 having components for controlling light sources is mounted so as to be in contact with each other, and a heat sink / lens base integrated module ( The heat dissipation pattern 14 for improving heat dissipation efficiency is formed in the other region of 10), and the lens module 20 is formed between one region of the heat sink / lens base integrated module 10 and the other region. It may be configured to be coupled to the lens coupling portion 12. According to this configuration, the heat sink / lens base integrated module 10 can efficiently emit heat generated from the light source board 30 which is the main heat source, and compact the necessary parts without wasting the internal space of the camera module. Because of the combination of these components, the heat dissipation efficiency and product miniaturization can be realized simultaneously. In particular, the heat dissipation pattern 14 formed in the other region is formed to widen the area where the heat sink / lens base integrated module 10 is in contact with air, thereby further increasing heat dissipation efficiency. For example, the first surface of the heat sink / lens base integrated module 10 may be an area where the lens module 20 and the light source board 30 are coupled, and the second surface may be an area opposite to the first surface. have.

The lens module 20 is coupled to the lens coupling part 12 provided in the heat sink / lens base integrated module 10, and is mounted on the image sensor board 50 to collect external light for a subject and be described later. It performs a function of transmitting to the image sensor 100. For example, the coupling method of the lens module 20 and the heat sink / lens base integrated module 10 through the lens coupling unit 12 may be implemented by screw coupling methods 12 and 22, but is not limited thereto. And any combination may be applied, including fitting and the like.

The light source board 30 is coupled to one region of the first surface of the heat sink / lens base integrated module 10, that is, the region opposite to the other region where the heat radiation pattern 14 is formed. The light source board 30 includes components including a control chip for controlling the light source and passive elements, and is a main source of heat generated from the camera module. Therefore, the embodiment of the present invention maximizes heat dissipation efficiency by directly contacting the light source board 30 with the heat sink / lens base integrated module 10.

The control board 40 is located on the second surface of the heat sink / lens base integrated module 10 and performs overall control of the components of the camera module according to an embodiment of the present invention.

The image sensor board 50 is coupled to contact the second surface of the heat sink / lens base integrated module 10.

The image sensor board 50 includes an image sensor 100 for collecting external light to a subject, an image sensor processing (ISP) chip for processing an electrical signal output from the image sensor 100, a passive element, and the like. The parts are mounted. For example, the image sensor 100 mounted on the image sensor board 50 may be a charge coupled device (CCD) or a complementary metal oxide semiconductor (CMOS), which is an electromagnetic coupling device, but is not limited thereto. Does not.

The coupling / supporting means 61, 62, 63, and 64 are spaced apart from the image sensor board 50 in contact with the control board 40 and the second surface of the heat sink / lens base integrated module 10. To combine and support. In the figure, the engagement / support means 61, 62, 63, 64 are the first engagement / support means 61, the second engagement / support means 62, the third engagement / support means 63, the fourth engagement. Although expressed as being comprised of / support means 64, this is only one example. In addition, in order to enable mass production of the camera module, the coupling / support means 61, 62, 63, 64 are formed on the control board, for example, so that it can be quickly coupled to the control board 40 or the like by the factory automation means. It can be quickly combined by automation means by applying a material that can recognize a position in response to light in or around the coupling hole.

The BTOB connector 70 performs a function of electrically connecting the image sensor board 50 and the control board 40, and the FPC 80 electrically connects the light source board 30 and the control board 40. Do this.

As described in detail above, according to the present invention, the heat sink and the lens base are integrated to simplify the product manufacturing process, reduce the product manufacturing time, reduce the product manufacturing cost, and at the same time reduce the product size and improve the heat dissipation efficiency. There is an effect that the camera module is applied to the lens base is integrated with a heat sink that can be improved.

10: heat sink / lens base integrated module
12: lens coupling portion
14: heat dissipation pattern
20: lens module
30: light source board
40: control board
50: image sensor board
61: first engagement / support means
62: second engagement / support means
63: third engagement / support means
64: fourth engagement / support means
70: Board TO Board (BTOB) connector
80: Flexible Printed Circuit (FPC)
100: image sensor

Claims (8)

A heat sink / lens base integrated module in which the heat sink and the lens base are integrated;
A lens module coupled to a lens coupling part provided in the heat sink / lens base integrated module;
A light source board coupled to a first surface of the heat sink / lens base integrated module; And
And a control board located on a second surface of the heat sink / lens base integrated module.
The method of claim 1,
And an image sensor board coupled to contact the second surface of the heat sink / lens base integrated module.
The method of claim 1,
One side of the first surface of the heat sink / lens base integrated module is coupled to contact the light source board,
A heat dissipation pattern is formed in the other region of the first surface of the heat sink / lens base integrated module to increase heat dissipation efficiency.
And the lens module is coupled to a lens coupling portion formed between one region and the other region of the heat sink / lens base integrated module.
The method of claim 2,
And a coupling / support means for coupling and supporting the control board and the image sensor board in contact with the second surface of the heat sink / lens base integrated module in a spaced apart state. Camera module with lens base.
The method of claim 4, wherein
At least one of a control board or an image sensor board coupled to the coupling / support means is coated with a material capable of recognizing a position in response to light on a portion corresponding to the coupling / support means. Module with integrated lens base.
The method of claim 1,
And a flexible printed circuit (FPC) for electrically connecting the light source board and the control board.
The method of claim 2,
And a board to board (BTOB) connector for electrically connecting the image sensor board and the control board.
The method of claim 1,
And the heat sink / lens base integrated module is injection molded integrally, the camera module to which the heat sink is integrated is applied.

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