WO2021117462A1 - Imaging device - Google Patents

Abstract

Provided is an imaging device that makes it possible to reduce increases in temperature in imaging elements. The imaging device 201 comprises: a housing 1a; imaging elements 2a, 2b accommodated in the housing 1a; circuit elements 6-8 accommodated in the housing 1a; first heat transfer members 110a, 110b that connect the imaging elements 2a, 2b and the housing 1a and transfer heat; and a second heat transfer member 190 that connects the circuit elements 6-8 and the housing 1a and transfers heat. The imaging device 201 is characterized in that the first heat transfer members 110a, 110b are connected to the housing 1a at first connection sections 111a, 111b in the housing 1a and the second heat transfer member 190 is connected to the housing 1a at a second connection section 191 in the housing 1a.

Description

Imaging device

The present invention relates to an imaging device.

Conventionally, inventions relating to an imaging device mounted on a vehicle or the like have been known (for example, Patent Document 1).

Patent Document 1 describes an image pickup apparatus including an image pickup optical system, an image pickup element, at least two circuit boards, a housing, a first heat transfer member, and a second heat transfer member. .. The image pickup device described in Patent Document 1 captures a subject image imaged via an image pickup optical system. The at least two circuit boards include at least a first circuit board on which the image sensor is mounted and a second circuit board on which at least electronic components are mounted. The housing has an opening in which the image pickup optical system is exposed to the subject, and holds the image pickup optical system, the image pickup element, and the circuit board.

Further, in the image pickup apparatus described in Patent Document 1, the first heat transfer member is integrally formed on the inner wall of the housing so that the first heat transfer member extends from any of the circuit boards in a direction away from the image pickup optical system. It is molded. The second heat transfer member propagates the heat generated from both the image pickup device and the electronic component to the first heat transfer member. Patent Document 1 describes that an image pickup apparatus having such a configuration can enhance the heat dissipation effect from the inside of the housing to the outside.

JP-A-2018-50311

The image pickup apparatus described in Patent Document 1 transfers heat generated from both the image pickup element and the electronic component to the first heat transfer member integrally molded on the inner wall of the housing via the second heat transfer member. By communicating, heat is dissipated from the inside of the housing to the outside. However, when the electronic component is the main heat source, in the image pickup apparatus described in Patent Document 1, heat is transferred from the image sensor to the second heat transfer member by heat transfer from the electronic component to the second heat transfer member. The heat is inhibited and it may be difficult to reduce the temperature rise of the image sensor.

The present invention has been made in view of the above, and an object of the present invention is to provide an image pickup apparatus capable of reducing a temperature rise of an image pickup device.

In order to solve the above problems, the image pickup apparatus according to the present invention includes a housing, an image pickup element housed in the housing, a circuit element housed in the housing, and the image pickup element and the housing. It has a first heat transfer member that connects between the two to propagate heat, and a second heat transfer member that connects between the circuit element and the housing to propagate heat, and the first heat transfer member. The member is connected to the housing at the first connection portion of the housing, and the second heat transfer member is connected to the housing at the second connection portion of the housing.

According to the present invention, it is possible to provide an image pickup apparatus capable of reducing a temperature rise of the image pickup device.
Issues, configurations and effects other than the above will be clarified by the description of the following embodiments.

The figure which shows the appearance of the image pickup apparatus which concerns on 1st Embodiment. A perspective view of the main internal configuration of the image pickup apparatus shown in FIG. 1 as seen through from diagonally above to the right in front. An exploded perspective view of the image pickup apparatus shown in FIG. 1 as viewed from diagonally above to the right behind. FIG. 4 (a) is an enlarged view of a main part of the image pickup device shown in FIG. 1 viewed from the rear, and FIG. 4 (b) is a cross section of the image pickup device cut along the line AA shown in FIG. 4 (a). Figure. The figure which shows the temperature distribution of a housing. It is a figure which looked at the general image pickup apparatus from the rear, and is the figure which shows the positional relationship between a circuit board, an image pickup element, an image pickup element substrate, and a first support member. It is a figure which looked at the image pickup apparatus shown in FIG. 1 from the rear, and is the figure which shows the positional relationship between a circuit board, an image pickup element, an image pickup element substrate, and a first support member. The ratio of the length L from the center of the circuit board in the left-right direction to the left end of the circuit board and the length L1 from the support position by the first support member of the circuit board to the left end of the circuit board is the vibration displacement D. The figure which showed the influence on. An exploded perspective view of the image pickup apparatus according to the second embodiment as viewed from diagonally above right at the rear. FIG. 9 is a view of the image pickup apparatus shown in FIG. 9 viewed from the rear, showing the positional relationship between the circuit board, the image pickup device, the image pickup device substrate, and the first support member. 11 (a) is an enlarged view of a main part of the image pickup device shown in FIG. 9 viewed from the rear, and FIG. 11 (b) is a cross section of the image pickup device cut along the line EE shown in FIG. 11 (a). Figure. An exploded perspective view of the image pickup apparatus according to the third embodiment as viewed from diagonally above right at the rear. 13 (a) is an enlarged view of a main part of the image pickup device shown in FIG. 12 viewed from the rear, and FIG. 13 (b) is a cross section of the image pickup device cut along the line FF shown in FIG. 13 (a). Figure. FIG. 14 (a) is an enlarged view of a main part of a view of the image pickup apparatus according to the fourth embodiment viewed from the rear, and FIG. 14 (b) shows the image pickup apparatus cut along the GG line shown in FIG. 14 (a). Cross-sectional view. It is an exploded perspective view which looked at the 1st camera module which concerns on 5th Embodiment from the rear left obliquely lower part, and is the figure for demonstrating the relationship between the 1st image sensor substrate, and the holder which holds the 1st lens. FIG. 16 (a) is an enlarged view of a main part of a view of the image pickup apparatus according to the fifth embodiment viewed from the rear, and FIG. 16 (b) shows the image pickup apparatus cut along the line HH shown in FIG. 16 (a). Cross-sectional view. An exploded perspective view of the image pickup apparatus according to the sixth embodiment as viewed from diagonally above right at the rear. FIG. 18 (a) is an enlarged view of a main part of the image pickup device shown in FIG. 17 viewed from the rear, and FIG. 18 (b) is a cross section of the image pickup device cut along the line II shown in FIG. 18 (a). Figure. An exploded perspective view of the image pickup apparatus according to the seventh embodiment as viewed from diagonally above right at the rear. 20 (a) is an enlarged view of a main part of the image pickup device shown in FIG. 19 viewed from the rear, and FIG. 20 (b) is a cross section of the image pickup device cut along the JJ line shown in FIG. 20 (a). Figure. The figure which shows the appearance of the image pickup apparatus which concerns on 8th Embodiment. 22 (a) is an enlarged view of a main part of the image pickup device shown in FIG. 21 viewed from the rear, and FIG. 22 (b) is a cross section of the image pickup device cut along the KK line shown in FIG. 22 (a). Figure. FIG. 23 (a) is an enlarged view of a main part of a view of the image pickup apparatus according to the ninth embodiment viewed from the rear, and FIG. 23 (b) shows the image pickup apparatus cut along the line PP shown in FIG. 23 (a). Cross-sectional view. FIG. 5 is a perspective view of the main internal configuration of the image pickup apparatus according to the tenth embodiment as seen through from diagonally upper right and above.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that the configurations with the same reference numerals have the same functions, and therefore, unless otherwise specified, the description thereof will be omitted if they have already been described. Further, in the necessary drawings, a Cartesian coordinate axis including an x-axis, a y-axis, and a z-axis is described in order to clarify the description of the position of each part.

(First Embodiment)
The first embodiment of the present invention will be described with reference to FIGS. 1 to 8.

FIG. 1 is a diagram showing the appearance of the image pickup apparatus 201 according to the first embodiment. FIG. 2 is a perspective view of the main internal configuration of the image pickup apparatus 201 shown in FIG. 1 as seen through from diagonally upper right and above. FIG. 3 is an exploded perspective view of the image pickup apparatus 201 shown in FIG. 1 as viewed from diagonally upward to the right rearward. FIG. 4A is an enlarged view of a main part of the image pickup apparatus 201 shown in FIG. 1 as viewed from the rear. FIG. 4B is a cross-sectional view of the image pickup apparatus 201 cut along the line AA shown in FIG. 4A. In FIG. 3, the first support members 18a to 18d that support the circuit board 9 on the housing 1a and the support portion of the housing 1a on which the circuit board 9 is supported are not shown. In FIGS. 3 to 4 (b), the illustration of the second support member that supports the propagation members 12a and 12b on the housing 1a and the support portion of the housing 1a on which the propagation members 12a and 12b are supported is omitted. There is. In FIG. 4A, the cover 14 is not shown, and the circuit board 9 is shown by a chain double-dashed line. The arrows in FIGS. 4 (a) and 4 (b) indicate the main heat dissipation paths 19a of the heat generated in the first image sensor 2a. The same applies to the heat dissipation path on the second image sensor 2b side.

FIG. 5 is a diagram showing the temperature distribution of the housing 1a. The thick line in FIG. 5 indicates the contour line 15 of the surface temperature of the housing 1a. FIG. 6 is a rear view of a general image pickup device 201, showing the positional relationship between the circuit board 9, the image pickup elements 2a, 2b, the image pickup element substrates 3a, 3a, and the first support members 17a to 17d. It is a figure. FIG. 7 is a view of the image pickup device 201 shown in FIG. 1 as viewed from the rear, showing the positional relationship between the circuit board 9, the image pickup elements 2a and 2b, the image pickup element substrates 3a and 3a, and the first support members 18a to 18d. It is a figure which shows. In FIGS. 6 and 7, the cover 14 is omitted. FIG. 8 shows the length L from the center of the circuit board 9 in the left-right direction to the left end of the circuit board 9, and the length L from the support positions of the first support members 18b and 18d of the circuit board 9 to the left end of the circuit board 9. It is a figure which showed the influence which the ratio with the length L1 has on the vibration displacement D.

The image pickup device 201 is installed inside the windshield glass of a vehicle such as an automobile toward the front in the traveling direction, and is a stereo camera that captures a subject image of a road, a preceding vehicle, an oncoming vehicle, a pedestrian, an obstacle, or the like. Is. The image pickup apparatus 201 can simultaneously capture a subject image with a pair of camera modules 5a and 5b, obtain parallax from the acquired pair of images, and measure a distance to the subject, a relative velocity, and the like. The image pickup device 201 is electrically connected to the vehicle control device connected to the electric connector by being wired to the electric connector inside the vehicle through an opening (not shown) provided on the rear side of the housing 1a. Be connected.

In the present embodiment, the front-rear direction of the image pickup device 201 (that is, the optical axis direction of the camera modules 5a and 5b) is the traveling direction of the vehicle and corresponds to the x-axis direction in each drawing. Positive in the x-axis direction is the front direction in the traveling direction of the vehicle. The vertical direction (that is, the direction along the direction of gravity) of the image pickup apparatus 201 is the height direction of the vehicle, and corresponds to the y-axis direction in each drawing. Positive in the y-axis direction is the direction opposite to the ground. The left-right direction of the image pickup apparatus 201 (that is, the direction connecting the pair of camera modules 5a and 5b) is the width direction of the vehicle and corresponds to the z-axis direction in each drawing. Positive in the z-axis direction is the direction on the right side when the vehicle is viewed from the rear to the front.

As shown in FIGS. 1 to 3, the image sensor 201 includes a first image sensor 2a, a second image sensor 2b, a first image sensor substrate 3a on which the first image sensor 2a is mounted, and a second image sensor 2b. It is provided with a second image sensor substrate 3b on which the above is mounted. Further, the image pickup apparatus 201 is a circuit board on which the first circuit element 6, the second circuit element 7, the third circuit element 8, the first circuit element 6, the second circuit element 7, and the third circuit element 8 are mounted. It is equipped with 9. Further, the image pickup device 201 includes a housing 1a that internally houses the first image pickup device substrate 3a, the second image pickup device substrate 3b, and the circuit board 9.

The first image sensor 2a and the second image sensor 2b are composed of image sensors such as CMOS (complementary metal oxide semiconductor) and CCD (charge coupled device).

The first image sensor 2a is attached to the housing 1a as a set of the first camera module 5a provided with the first image sensor substrate 3a and the first lens 4a. The first lens 4a is an image pickup optical system of the first camera module 5a, and forms a subject image on a light receiving surface of the first image pickup element 2a. Similarly, the second image sensor 2b is attached to the housing 1a as a set of the second camera module 5b provided with the second image sensor substrate 3b and the second lens 4b. The second lens 4b is an image pickup optical system of the second camera module 5b, and forms a subject image on the light receiving surface of the second image pickup element 2b.

The first image sensor substrate 3a includes an element mounting surface on which the first image sensor 2a is mounted and a back surface arranged on the opposite side of the element mounting surface in a direction substantially orthogonal to the element mounting surface. The second image sensor substrate 3b includes an element mounting surface on which the second image sensor 2b is mounted, and a back surface arranged on the opposite side of the element mounting surface in a direction substantially orthogonal to the element mounting surface.

The first image sensor substrate 3a and the second image sensor substrate 3b have their respective element mounting surfaces orthogonal to the optical axis direction (front-back direction) of the imaging optical system such as the first lens 4a and the second lens 4b. Is placed in. The first image sensor substrate 3a and the second image sensor substrate 3b are arranged with their respective element mounting surfaces facing forward. The first image sensor substrate 3a and the second image sensor substrate 3b are arranged so that their respective element mounting surfaces are along the direction of gravity. These element mounting surfaces correspond to the yz plane in each drawing.

The first image sensor substrate 3a and the second image sensor substrate 3b are arranged at intervals along the element mounting surface of the first image sensor substrate 3a and the element mounting surface of the second image sensor substrate 3b. For example, the first image sensor substrate 3a and the second image sensor substrate 3b are arranged at both ends of the image pickup device 201 in the left-right direction. That is, the pair of image pickup elements 2a and 2b composed of the first image pickup element 2a and the second image pickup element 2b are arranged at intervals along the mounting surface of these elements.

The first circuit element 6 is a circuit element such as a microcomputer for processing an image signal, a signal processing element, or an FPGA (Field Programmable Gate Array). The second circuit element 7 is a circuit element such as a memory used for temporary storage of data. The third circuit element 8 is a circuit element that performs various signal processing such as an MPU (Micro Processing Unit). The first circuit element 6 is a circuit element having a large amount of heat generation that requires heat dissipation in the housing 1a, the cover 14, or the like, and is the first image sensor 2a, the second image sensor 2b, the second circuit element 7, or the second circuit element 7. The amount of heat generated (power consumption) is larger than that of the three-circuit element 8. The first circuit element 6, the second circuit element 7, and the third circuit element 8 are not limited to the above-mentioned elements.

The circuit board 9 is arranged on the element mounting surface on which the first circuit element 6, the second circuit element 7, and the third circuit element 8 are mounted, and on the opposite side of the element mounting surface in a direction substantially orthogonal to the element mounting surface. Includes the back and is.

The circuit board 9 is arranged behind the first image sensor substrate 3a and the second image sensor substrate 3b in substantially parallel to the first image sensor substrate 3a and the second image sensor substrate 3b. The circuit board 9 is arranged so that its element mounting surface faces forward and follows the direction of gravity. That is, the element mounting surface of the circuit board 9 is arranged so as to face the back surfaces of the first image sensor substrate 3a and the second image sensor substrate 3b. The back surfaces of the first image sensor substrate 3a and the second image sensor substrate 3b are the rear surfaces of the first image sensor substrate 3a and the second image sensor substrate 3b, respectively.

The first circuit element 6, the second circuit element 7, and the third circuit element 8 mounted on the circuit board 9 are arranged between the pair of image pickup elements 2a and 2b when viewed from the optical axis direction. Each of the first circuit element 6, the second circuit element 7, and the third circuit element 8 is located at a position deviated from each of the pair of image pickup elements 2a and 2b when viewed from the optical axis direction. Specifically, when viewed from the above optical axis direction, each of the first circuit element 6, the second circuit element 7, and the third circuit element 8 has their center positions of the pair of image pickup elements 2a and 2b, respectively. It is deviated from the center position and is deviated to the center side in the left-right direction of the housing 1a.

In the present embodiment, the first image sensor 2a and the second image sensor 2b are collectively referred to as image sensors 2a and 2b. The first image sensor substrate 3a and the second image sensor substrate 3b are collectively referred to as image sensor substrates 3a and 3b. The first circuit element 6, the second circuit element 7, and the third circuit element 8 are collectively referred to as circuit elements 6 to 8. Similarly, the first lens 4a and the second lens 4b are collectively referred to as lenses 4a and 4b. The first camera module 5a and the second camera module 5b are collectively referred to as camera modules 5a and 5b.

A heat radiating fin 10 is provided on the outer surface of the housing 1a. A plurality of heat radiating plates 10a extending in the first direction are arranged at intervals along the second direction of the heat radiating fins 10. The first direction is one of the directions along the element mounting surfaces of the image sensor substrates 3a and 3b, and is, for example, the vertical direction in FIG. The second direction is the other one of the directions along the element mounting surfaces of the image sensor substrates 3a and 3b, and is, for example, the left-right direction in FIG. The heat radiation fin 10 shown in FIG. 1 is formed so as to allow air to pass in the vertical direction and perpendicular to the element mounting surfaces of the first image sensor substrate 3a, the second image sensor substrate 3b, and the circuit board 9. There is. The housing 1a is formed in a plate shape in which the heat radiating fins 10 extend in the first direction (vertical direction), so that the flow velocity of air becomes faster due to the effect of convection and the housing 1a takes in fresh air from below the housing 1a. The structure is such that it can be easily discharged upward from the body 1a. Therefore, the heat dissipation performance of the housing 1a can be improved. The housing 1a is made of metal such as aluminum die-casting, and the cover 14 for sealing the housing 1a containing each substrate from the rear is made of metal such as an aluminum plate to prevent dust and electromagnetic noise. The shielding effect and the heat dissipation effect can be improved.

Further, the image pickup device 201 connects between the image pickup elements 2a and 2b and the housing 1a to propagate heat between the first heat transfer members 110a and 110b, and between the circuit elements 6 to 8 and the housing 1a. It is provided with a second heat transfer member 190 that is connected to propagate heat.

The first heat transfer members 110a and 110b are provided for one and the other of the pair of image pickup elements 2a and 2b, respectively. The first heat transfer member 110a is a first heat transfer member provided for the first image pickup element 2a, which is one of the pair of image pickup elements 2a and 2b. The first heat transfer member 110b is a first heat transfer member provided for the second image pickup element 2b, which is the other of the pair of image pickup elements 2a and 2b.

The first heat transfer member 110a includes a heat conductive member 11a connected to a first image sensor substrate 3a on which the first image sensor 2a is mounted, and a heat conductive member 11a from the first image sensor 2a and the first image sensor substrate 3a. Includes a propagation member 12a that propagates the heat propagated through the housing 1a to the housing 1a. The first heat transfer member 110b includes a heat conductive member 11b connected to a second image sensor substrate 3b on which the second image sensor 2b is mounted, and a heat conductive member 11b from the second image sensor 2b and the second image sensor substrate 3b. Includes a propagation member 12b that propagates the heat propagated through the housing 1a to the housing 1a.

The heat conductive members 11a and 11b are composed of members having high heat conductivity and elasticity such as grease, gel, sheet, or leaf spring having high heat conductivity. The heat conductive members 11a and 11b are connected to the back surfaces of the image sensor substrates 3a and 3b.

The propagation members 12a and 12b are formed in a plate shape and are composed of a metal plate having high thermal conductivity or the like. The propagation members 12a and 12b are arranged so as to face the back surfaces of the image sensor substrates 3a and 3b. The propagation members 12a and 12b are connected to the rear surfaces of the heat conductive members 11a and 11b connected to the back surfaces of the image sensor substrates 3a and 3b. The propagation members 12a and 12b are arranged in front of the circuit board 9 so as to form a gap with the circuit board 9 in the optical axis direction, that is, in the front-rear direction. As a result, in the propagation members 12a and 12b, it is possible to suppress the heat propagated from the circuit elements 6 to 8 to the circuit board 9 and directly propagate to the propagation members 12a and 12b. Therefore, in the first heat transfer members 110a and 110b including the propagation members 12a and 12b, the heat radiated from the first heat transfer members 110a and 110b to the housing 1a propagates from the circuit elements 6 to 8 to the circuit board 9. It is possible to suppress being inhibited by. The propagation members 12a and 12b constrain the positions of the heat conductive members 11a and 11b with the heat conductive members 11a and 11b sandwiched between the propagation members 12a and 12b and the image sensor substrates 3a and 3b.

The propagation member 12a is connected to the end of the housing 1a located in the direction from the circuit elements 6 to 8 toward the first image pickup device 2a when viewed from the optical axis direction. The propagation member 12b is connected to the end of the housing 1a located in the direction from the circuit elements 6 to 8 toward the second image pickup device 2b when viewed from the optical axis direction. The direction from the circuit elements 6 to 8 toward the first image sensor 2a is the right direction in the present embodiment, and the direction from the circuit elements 6 to 8 toward the second image sensor 2b is the left direction in the present embodiment. is there.

Specifically, the lower end of the propagation member 12a is connected to the end 13a located to the right of the housing 1a. The lower end of the propagation member 12b is connected to the end 13b located to the left of the housing 1a. The ends 13a and 13b of the housing 1a are ends located below the image sensor 2a and 2b, preferably below the image sensor substrates 3a and 3b. The propagation members 12a and 12b propagate the heat propagated from the image pickup elements 2a and 2b and the image pickup element substrates 3a and 3b through the heat conduction members 11a and 11b to the end portions 13a and 13b of the housing 1a.

In the present embodiment, the portion of the housing 1a to which the first heat transfer members 110a and 110b are connected is also referred to as the first connection portion 111a and 111b. In this case, the first connection portion 111a is located in the direction (right direction) from the circuit elements 6 to 8 toward one of the pair of image pickup elements 2a and 2b (first image pickup element 2a) when viewed from the optical axis direction. Corresponds to the end portion 13a. Similarly, the first connection portion 111b is located in the direction (left direction) from the circuit elements 6 to 8 toward the other (second image sensor 2b) of the pair of image pickup elements 2a and 2b when viewed from the optical axis direction. Corresponds to the end portion 13b.

That is, the first connection portion 111a is located in the direction (right direction) from the circuit elements 6 to 8 toward one of the pair of image pickup elements 2a and 2b (first image pickup element 2a) when viewed from the optical axis direction. It can be said that the housing 1a is provided at the end portion 13a, which is the end portion (first end portion). The first connection portion 111b is an end portion (second end portion) of the housing 1a located in the direction (left direction) from the circuit elements 6 to 8 toward the other (second image pickup element 2b) of the pair of image pickup elements 2a and 2b. ), It can be said that it is provided at the end portion 13b. Then, when the first heat transfer member 110a provided for one of the pair of image pickup elements 2a and 2b (first image pickup element 2a) is connected to the housing 1a at the end portion 13a which is the first end portion. I can say. It can be said that the first heat transfer member 110b provided for the other of the pair of image pickup elements 2a and 2b (second image pickup element 2b) is connected to the housing 1a at the end portion 13b which is the second end portion.

The second heat transfer member 190 is not particularly limited as long as it is a member that connects between the circuit elements 6 to 8 and the housing 1a to propagate heat. The second heat transfer member 190 may be made of grease, gel, sheet, or the like having thermal conductivity. In the present embodiment, the portion of the housing 1a to which the second heat transfer member 190 is connected is also referred to as the second connection portion 191. The second connecting portion 191 may be the central portion of the housing 1a located between the end portion 13a and the end portion 13b, for example, as shown in FIG. That is, the second connection portion 191 is located at a portion separated from the first connection portions 111a and 111b. Therefore, the heat propagated from the circuit elements 6 to 8 to the housing 1a via the second heat transfer member 190 serves as a heat dissipation path for the image pickup elements 2a and 2b, and the first connection portions 111a and 111b and the first heat transfer member. It becomes difficult to propagate to 110a and 110b, and it is possible to suppress that heat dissipation from the image pickup elements 2a and 2b to the housing 1a is hindered.

Here, when the number of pixels of the image pickup devices 2a and 2b is small as in the conventional image pickup device 201, the calorific value of the image pickup elements 2a and 2b is small and the temperature rise is also small. However, as the number of pixels of the image pickup devices 2a and 2b increases with the improvement of the performance of the image pickup apparatus 201 such as high angle of view, high accuracy, and high speed correspondence, the calorific value (power consumption) increases significantly. Further, as the surface area of the housing 1a decreases with the miniaturization of the image pickup device 201, the temperature rise of the image pickup devices 2a and 2b may increase.

In particular, the image pickup elements 2a and 2b, which are important in the image pickup apparatus 201, often have a lower upper limit temperature for guaranteeing operation as compared with other parts, and it is more important to reduce the temperature rise of the image pickup elements 2a and 2b. When the temperature of the image pickup devices 2a and 2b becomes high, the noise component of the signal becomes large and the measurement accuracy is lowered.

In response to such a problem, the image pickup apparatus 201 according to the present embodiment includes first heat transfer members 110a and 110b that connect between the image pickup elements 2a and 2b and the housing 1a to propagate heat.
Then, the first heat transfer members 110a and 110b are connected to the housing 1a at the first connecting portions 111a and 111b of the housing 1a. Therefore, in the image pickup device 201, the heat of the image pickup elements 2a and 2b propagates to the housing 1a and is dissipated to the outside, so that the temperature rise of the image pickup elements 2a and 2b can be reduced. The image pickup device 201 can reduce the noise component due to the temperature by reducing the temperature rise of the picture pickup elements 2a and 2b, and can be a device with high measurement accuracy and high reliability.

On the other hand, the main circuit elements 6 to 8 having a large amount of heat generated by the circuit board 9 are thermally connected to the housing 1a by the second heat transfer member 190, and heat is dissipated on the surface of the housing 1a. Therefore, in the image pickup apparatus 201, as shown in FIG. 5, the temperature in the vicinity of the circuit elements 6 to 8 becomes high, and the temperature becomes low as the distance from the circuit elements 6 to 8 increases in the vertical direction and the horizontal direction. Here, the vicinity of the circuit elements 6 to 8 is, for example, a range of lengths from the centers of the circuit elements 6 to 8 in each direction, and is the lengths of the circuit elements 6 to 8 in each direction. Refers to the range of 2 to 5 times the length of. On top of that, in the image pickup apparatus 201, by forming the heat radiation fins 10 of the housing 1a in a plate shape extending in the vertical direction, the air flow 16 is directed in the vertical direction, the flow velocity of the air is increased, and the housing is The structure is such that fresh air can be easily taken in from below 1a and discharged to above the housing 1a.

Due to the structure of the heat radiation fin 10, the temperature on the upper side of the housing 1a can be high and the temperature on the lower side can be low. In the vicinity of the image pickup elements 2a and 2b, the temperature difference between the upper side and the lower side of the housing 1a is large, and the portion where the temperature is low is the lower end portions 13a and 13b of the housing 1a. Therefore, in the image pickup apparatus 201, the lower ends 13a and 13b of the housing 1a are used as the first connection portions 111a and 111b, and the first heat transfer members 110a and 110b are connected to each other. Here, the vicinity of the image sensors 2a and 2b refers to, for example, a portion of the housing 1a to which the camera modules 5a and 5b on which the image sensors 2a and 2b are mounted are mounted.

Generally, as shown in FIG. 6, the circuit board 9 is supported by the housing 1a at both ends in the left-right direction by using first support members 17a to 17d composed of fastening members such as screws. To. Therefore, the heat of the circuit elements 6 to 8 mounted on the circuit board 9 is propagated from the circuit board 9 to the housing 1a via the first support members 17a to 17d. Therefore, in the vicinity of the image pickup elements 2a and 2b, the heat directly propagated from the circuit elements 6 to 8 to the housing 1a by the second heat transfer member 190 and the circuit boards 9 and the first support from the circuit elements 6 to 8 are present. The temperature of the image pickup devices 2a and 2b also rises due to being sandwiched by the heat propagating to the housing 1a via the members 17a to 17d.

In order to reduce the influence of heat from the circuit board 9, in the present embodiment, as shown in FIG. 7, the first support members 18a to 18d that support the circuit board 9 on the housing 1a are mounted on the image pickup devices 2a and 2b. It is provided on the center side of the housing 1a in the left-right direction. That is, the first support members 18a to 18d of the present embodiment support the circuit board 9 between the image pickup elements 2a and 2b and the circuit elements 6 to 8 when viewed from the optical axis direction. Like the first support members 17a to 17d, the first support members 18a to 18d are composed of fastening members such as screws.

As a result, the heat propagated to the circuit board 9 is likely to propagate to the housing 1a via the first support members 18a to 18d before reaching the vicinity of the image pickup devices 2a and 2b. Therefore, in the vicinity of the image pickup elements 2a and 2b, the heat directly propagated from the circuit elements 6 to 8 to the housing 1a by the second heat transfer member 190 and the circuit boards 9 and the first support from the circuit elements 6 to 8 are present. It can be prevented from being pinched by the heat propagating to the housing 1a via the members 18a to 18d. By supporting the circuit board 9 by the first support members 18a to 18d, it is possible to reduce the temperature in the vicinity of the image pickup elements 2a and 2b and the temperature of the housing 1a in the vicinity of the image pickup elements 2a and 2b. The temperature reduction effect of the image pickup devices 2a and 2b by the heat transfer members 110a and 110b can be increased.

Further, a heat conduction member or the like connected to the cover 14 from the rear of the circuit board 9 can be provided to add a heat dissipation path. As a result, heat propagates from the circuit elements 6 to 8 to the cover 14 via the circuit board 9, so that the amount of heat transferred from the circuit elements 6 to 8 and the circuit board 9 to the housing 1a is reduced, and the temperature of the housing 1a rises. descend. As a result, the temperature reduction effect of the image pickup devices 2a and 2b can be increased. Since the first support members 18a to 18d have an effect of suppressing the heat from the circuit elements 6 to 8 having a large calorific value from propagating to the image pickup devices 2a and 2b, the first circuit element 6 having a large calorific value is particularly effective. By arranging the first support members 18b and 18d for supporting the circuit board 9 between the first image sensor 2b and the second image sensor 2b having a short distance from the first circuit element 6, the temperature of the second image sensor 2b can be adjusted. It can be reduced.

On the other hand, as shown in FIG. 8, if the first support members 18a to 18d are too close to the center side in the left-right direction of the housing 1a, the left-right end portion of the circuit board 9 tends to be a free end. In this case, for example, the circuit board 9 is excited by a vibration mode in which the left end portion of the circuit board 9 is bent and deformed with the first support members 18b and 18d as fulcrums, and the vibration displacement D of this end portion becomes large. When the vibration displacement D becomes large, the strain of the solder portion in the vicinity of the circuit elements 6 to 8 mounted on the circuit board 9 also becomes large, which may cause cracks or peeling of the solder. Therefore, in order to make the vibration displacement D equal to or less than the vibration displacement Db that can ensure the reliability of the solder, for example, the length L from the center to the left end of the circuit board 9 in the left-right direction and the first support of the circuit board 9 The ratio of the length L1 from the support position by the members 18b and 18d to the left end portion of the circuit board 9 needs to be 0.5 or less. In other words, L is the length from the end portion of the circuit board 9 in the longitudinal direction to the center of the circuit board 9. L1 is the length from the end portion of the circuit board 9 in the longitudinal direction to the support position of the circuit board 9 with respect to the housing 1a and the support position closest to the end portion. Then, the circuit board 9 is supported by the housing 1a at a support position where the value of L1 with respect to L is 0.5 or less.

According to the present embodiment configured as described above, since the image pickup device 201 can reduce the temperature rise of the image pickup devices 2a and 2b, the noise component due to the temperature rise can be reduced. Therefore, the image pickup device 201 can be a device with high measurement accuracy and high reliability.

(Second Embodiment)
A second embodiment of the present invention will be described with reference to FIGS. 9 to 11 (b). In the present embodiment, only the differences from the first embodiment will be described, and in the drawings used in the present embodiment, the same members as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

FIG. 9 is an exploded perspective view of the image pickup apparatus 202 according to the second embodiment as viewed from diagonally upward to the right rearward. FIG. 10 is a rear view of the image pickup device 202 shown in FIG. 9, showing the positional relationship between the circuit board 9, the image pickup elements 2a and 2b, the image pickup element substrates 3a and 3b, and the first support members 28a to 28d. It is a figure which shows. FIG. 11A is an enlarged view of a main part of the image pickup apparatus 202 shown in FIG. 9 as viewed from the rear. In FIGS. 10 and 11 (a), the cover 14 is not shown. In FIG. 11A, the circuit board 9 is shown by a chain double-dashed line. FIG. 11B is a cross-sectional view of the image pickup apparatus 202 cut along the line EE shown in FIG. 11A. The arrows in FIGS. 11 (a) and 11 (b) indicate the main heat dissipation paths 19b of the heat generated in the first image sensor 2a. The same applies to the heat dissipation path on the second image sensor 2b side.

The feature of the second embodiment is that the support portions 22a and 22b of the housing 1b on which the propagation members 21a and 21b for propagating the heat of the image pickup elements 2a and 2b to the housing 1b are supported at a position where the temperature of the housing 1b is low. It is a point to be provided in. Further, the feature of the second embodiment is that the heat conductive members 11a and 11b are reduced in size and the workability of the coating work is improved.

That is, in the second embodiment, the first connection portion 121a of the housing 1b to which the first heat transfer member 120a that connects between the first image sensor 2a and the housing 1b and propagates heat is connected to the housing. It is provided at a position where the temperature of the body 1b is low. Similarly, a feature of the second embodiment is the first connection portion 121b of the housing 1b to which the first heat transfer member 120b that connects between the second image sensor 2b and the housing 1b and propagates heat is connected. However, it is provided at a position where the temperature of the housing 1b is low.

Specifically, in FIGS. 9 to 11 (b), as in the first embodiment, both ends in the left-right direction on the lower side of the housing 1b are portions separated from the circuit elements 6 to 8. The number temperature is low. Therefore, the support portion 22a of the housing 1b on which the propagation member 21a included in the first heat transfer member 120a is supported is transferred from the circuit elements 6 to 8 to one of the pair of image pickup elements 2a and 2b (first image pickup element 2a). It is an end portion (first end portion) of the housing 1b located in the direction toward the direction (right direction) and is provided below the first image sensor 2a. The support portion 22b of the housing 1b on which the propagation member 21b included in the first heat transfer member 120b is supported is directed from the circuit elements 6 to 8 toward the other of the pair of image pickup elements 2a and 2b (second image pickup element 2b). It is an end portion (second end portion) of the housing 1b located in the (left direction) and is provided below the second image sensor 2b. If the support portions 22a and 22b are provided at both ends of the housing 1b in the left-right direction and below the image pickup elements 2a and 2b, the temperatures of the image pickup elements 2a and 2b can be reduced. The support portions 22a and 22b are the first connection portions 121a and 121b in the present embodiment. The propagation members 21a and 21b are supported by the housing 1b by using the second support members 27a and 27b composed of fastening members such as screws.

Further, in the image pickup apparatus 202 according to the second embodiment, as shown in FIG. 9, in order to lower the temperature of the support portions 22a and 22b on which the propagation members 21a and 21b are supported, the circuit board 9 is supported on the lower side. The support portions 23a and 23b are arranged closer to the center in the left-right direction than the upper support portions 23c and 23d. The circuit board 9 is supported by the housing 1b by using first support members 28a to 28d composed of fastening members such as screws.

That is, in the image pickup device 202, the first connection portions 121a and 121b are provided at both ends of the housing 1b in the left-right direction and below the image pickup elements 2a and 2b. In this case, in the image pickup device 202, the first support members 28a and 28b that support the circuit board 9 on the housing 1b below the image pickup elements 2a and 2b of the circuit board 9 are from the image pickup elements 2a and 2b of the circuit board 9. The first connection portion 121a is in the direction (left direction or right direction) from the image pickup elements 2a and 2b to the circuit elements 6 to 8 than the first support members 28c and 28d that support the circuit board 9 on the housing 1b on the upper side. , 121b.

As a result, in the image pickup apparatus 202, the temperature of the support portions 22a and 22b on which the propagation members 21a and 21b are supported, that is, the first connection portions 121a and 121b can be reduced, and the image pickup element 2a by the first heat transfer members 120a and 120b can be reduced. , 2b can increase the temperature reduction effect.

Further, in the image pickup apparatus 202, as shown in FIGS. 9, 11 (a) and 11 (b), notches 25a and 25b and holes are provided in the upper portions of the propagation members 21a and 21b. As a result, in the image pickup apparatus 202, after the propagation members 21a and 21b are attached, the heat conduction members 11a and 11b can be applied between the image sensor substrates 3a and 3b and the propagation members 21a and 21b through the notches 25a and 25b. become. As a result, the image pickup apparatus 202 can improve the workability of assembly.

Further, in the image pickup apparatus 202, the lower portions of the propagation members 21a and 21b are subjected to processing such as drawing and plate bending to provide recesses 26a and 26b recessed to the front side, and rib processing and the like are applied to the front side. A protruding portion may be provided. As a result, in the image pickup apparatus 202, the positions of the heat conductive members 11a and 11b can be constrained, and the heat conductive members 11a and 11b can be shaped so as not to protrude downward or to the left or right and adhere to an unintended position. .. As a result, in the image pickup apparatus 202, the amount of the heat conductive members 11a and 11b used does not become excessively large, and the cost increase can be suppressed.

Further, in general, the image pickup elements 2a and 2b are vulnerable to external force (distortion), and there is a problem that the output signal deteriorates when distortion occurs. In response to this problem, in the propagation members 21a and 21b, the width W2 in the vicinity of the support portions 22a and 22b is shortened with respect to the width W1 in the vicinity of the image pickup elements 2a and 2b, and the spring is formed in the vicinity of the support portions 22a and 22b. It is possible to have a structure that weakens the property (reduces the spring constant). As a result, in the image pickup device 202, the external force (distortion) on the image pickup elements 2a and 2b can be reduced, and the deterioration of the output signal can be suppressed.

In the propagation member 21a, the width W1 in the vicinity of the first image sensor 2a refers to, for example, the length of the first region 24a facing the back surface of the first image sensor substrate 3a in the left-right direction. In the propagation member 21a, the width W2 in the vicinity of the support portion 22a projects from a part of the first region 24a toward the second support member 27a (support portion 22a), and the housing 1b is formed by the second support member 27a. Refers to the lateral length of the second region 29a supported by. In the example of FIG. 11a, the protruding direction of the second region 29a with respect to the first region 24a is the downward direction and the direction intersecting the left-right direction. That is, the width W1 is the length of the first region 24a in the direction intersecting the protruding direction of the second region 29a, and the width W2 is the length of the second region 29a in the direction intersecting the protruding direction of the second region 29a. That's right. In other words, in the first heat transfer member 120a including the propagation member 21a, the length W2 of the second region 29a is shorter than the length W1 of the first region 24a in the direction intersecting the protruding direction of the second region 29a. It can be said that.

According to the present embodiment configured as described above, the image pickup apparatus 202 can reduce the temperature rise of the image pickup devices 2a and 2b as in the first embodiment, and thus reduces the noise component due to the temperature rise. be able to. Therefore, the image pickup device 202 can be a device with high measurement accuracy and high reliability.

(Third Embodiment)
A third embodiment of the present invention will be described with reference to FIGS. 12 to 13 (b). In the present embodiment, only the differences from the first embodiment will be described, and in the drawings used in the present embodiment, the same members as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

FIG. 12 is an exploded perspective view of the image pickup apparatus 203 according to the third embodiment as viewed from diagonally upward to the right rearward. FIG. 13A is an enlarged view of a main part of the image pickup apparatus 203 shown in FIG. 12 as viewed from the rear. In FIG. 13A, the cover 14 is not shown, and the circuit board 9 is shown by a chain double-dashed line. 13 (b) is a cross-sectional view of the image pickup apparatus 203 cut along the line FF shown in FIG. 13 (a). The arrows in FIGS. 13 (a) and 13 (b) indicate the main heat dissipation paths 19c of the heat generated in the first image sensor 2a. The same applies to the heat dissipation path on the second image sensor 2b side.

The feature of the third embodiment is that the support portions of the housing 1c on which the propagation member 31a that propagates the heat of the first image sensor 2a to the housing 1c are supported are provided at two places of the support portions 32a and 32b. (Ii) By providing the support portions of the housing 1c on which the propagation member 31b for propagating the heat of the image sensor 2b to the housing 1c is provided at two locations of the support portions 32c and 32d, the propagation members 31a and 31b can be stably attached. This is a point in which the property is increased and the heat dissipation path 19c is increased.

That is, in the third embodiment, the first connection portion of the housing 1c to which the first heat transfer member 130a that connects between the first image sensor 2a and the housing 1c and propagates heat is connected is first. It is provided at two locations, the connection portions 131a and 131b. Similarly, in the third embodiment, the first connection portion of the housing 1c to which the first heat transfer member 130b that connects between the second image sensor 2b and the housing 1c and propagates heat is connected is the first. It is provided at two locations, one connection portion 131c and 131d. At that time, the first connection portions 131a and 131b are provided on the right end portion of the housing 1c and on the lower side and the upper side of the first image sensor 2a. The first connection portions 131c and 131d are provided on the left end portion of the housing 1c and on the lower side and the upper side of the second image pickup element 2b. As a result, in the third embodiment, the mounting stability of the first heat transfer members 130a and 130b can be increased, and the heat dissipation path 19c can be increased.

Specifically, in FIGS. 12 to 13 (b), as in the first embodiment, the lower portions of both ends of the housing 1c in the left-right direction are portions separated from the circuit elements 6 to 8 and have a temperature. Is low. Further, the temperature of the upper side of both ends of the housing 1c in the left-right direction is also lower than that of the image pickup elements 2a and 2b. Therefore, the support portions 32a and 32b of the housing 1c on which the propagation member 31a included in the first heat transfer member 130a is supported are one of the pair of image pickup elements 2a and 2b from the circuit elements 6 to 8 (first image pickup element 2a). ) Is provided on the lower side and the upper side of the end portion (first end portion) of the housing 1c located in the direction (right direction). The support portions 32c and 32d of the housing 1c on which the propagation member 31b included in the first heat transfer member 130b is supported are transferred from the circuit elements 6 to 8 to the other of the pair of image pickup elements 2a and 2b (second image pickup element 2b). It is provided on the lower side and the upper side of the end portion (second end portion) of the housing 1c located in the facing direction (left direction). When the support portions 32a and 32b are provided on the lower side and the upper side of the right end portion of the housing 1c, the mounting stability of the propagation member 31a can be increased and the temperature of the first image sensor 2a can be reduced. When the support portions 32c and 32d are provided on the lower side and the upper side of the left end portion of the housing 1c, the mounting stability of the propagation member 31b can be increased and the temperature of the second image pickup element 2b can be reduced. The support portions 32a to 32d are the first connection portions 131a to 131d in the present embodiment. The propagation members 31a and 31b are supported by the housing 1c by using the second support members 37a to 37d composed of fastening members such as screws.

Further, in the image pickup apparatus 203, as shown in FIGS. 12 to 13B, notches 34a and 34b are provided in the vicinity of the support portions 32a and 32b in the propagation member 31a, and the support portions 32c in the propagation member 31b are provided. Notches 34c and 34d are provided in the vicinity of 32d. The cutouts 34a to 34d are provided in the vicinity of the support portions 32a to 32d of the propagation members 31a and 31b, and are provided on the side closer to the circuit elements 6 to 8, that is, on the central side in the left-right direction. As a result, the propagation members 31a and 31b can reduce the heat transferred from the circuit board 9, efficiently transfer the heat of the image pickup device substrates 3a and 3b to the housing 1c, and increase the temperature reduction effect of the image pickup devices 2a and 2b. Can be done. Here, the vicinity of the support portions 32a and 32b of the propagation member 31a is, for example, the range from the support portion 32a to the first image sensor 2a of the propagation member 31a and the vicinity of the support portion 32b to the first image sensor 2a of the propagation member 31a. Refers to the range up to. Here, the vicinity of the support portions 32c and 32d of the propagation member 31b includes, for example, the range from the support portion 32c to the second image pickup element 2b of the propagation member 31b and the support portions 32d to the second image pickup element 2b of the propagation member 31b. Refers to the range up to. Since the propagating member 31a and the propagating member 31b have a symmetrical shape, the parts can be shared, so that the number of parts can be reduced and misuse of the parts can be prevented.

Here, the support portions 32a and 32b of the housing 1c on which the propagation member 31a is supported are above the end portion of the housing 1b located in the direction (right direction) from the circuit elements 6 to 8 toward the first image pickup element 2a. And provided on the lower side. The width of the vicinity of the first image sensor 2a in the propagation member 31a is longer toward the center than the vicinity of the support portions 32a and 32b in the propagation member 31a. As a result, the propagation member 31a has a spring property in the range from the support portions 32a and 32b to the first image pickup device 2a, and the spring constant can be reduced. Here, the vicinity of the first image sensor 2a refers to, for example, the range of the first image sensor substrate 3a on which the first image sensor 2a is mounted. That is, it is possible to reduce the force applied from the propagation member 31a to the first image pickup device 2a via the heat conduction member 11a and the first image pickup device substrate 3a. The same applies to the propagation member 31b.

Generally, the image pickup devices 2a and 2b are vulnerable to external force (distortion), and there is a problem that the output signal deteriorates when distortion occurs. To solve this problem, the vicinity of the image pickup elements 2a and 2b of the propagation members 31a and 31b is extended toward the center side in the left-right direction of the housing 1c to weaken the springiness of the propagation members 31a and 31b (reduce the spring constant). ) Can be a structure. As a result, in the image pickup apparatus 203, the external force (distortion) on the image pickup elements 2a and 2b can be reduced, and the deterioration of the output signal can be suppressed.

According to the present embodiment configured as described above, the image pickup apparatus 203 can reduce the temperature rise of the image pickup devices 2a and 2b as in the first embodiment, and thus reduces the noise component due to the temperature rise. be able to. Therefore, the image pickup apparatus 203 can be an apparatus having high measurement accuracy and high reliability. Further, since the image pickup device 203 can reduce the performance variation due to the stable attachment of the propagation members 31a and 31b, the image pickup device 203 can be a device with higher measurement accuracy and higher reliability. Further, the image pickup apparatus 203 can be a highly reliable apparatus capable of cost reduction because the number of parts can be reduced and misuse can be prevented by sharing the parts.

(Fourth Embodiment)
A fourth embodiment of the present invention will be described with reference to FIGS. 14 (a) and 14 (b). In the present embodiment, only the differences from the first embodiment will be described, and in the drawings used in the present embodiment, the same members as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

FIG. 14A is an enlarged view of a main part of the image pickup apparatus 204 according to the fourth embodiment as viewed from the rear. In FIG. 14A, the cover 14 is not shown, and the circuit board 9 is shown by a chain double-dashed line. FIG. 14 (b) is a cross-sectional view of the image pickup apparatus 204 cut along the line GG shown in FIG. 14 (a). The arrows in FIGS. 14 (a) and 14 (b) indicate the main heat dissipation paths 19d of the heat generated in the first image sensor 2a. The same applies to the heat dissipation path on the second image sensor 2b side.

A feature of the fourth embodiment is that, for example, support portions of the housing 1d on which the propagation member 41a for propagating the heat of the first image sensor 2a to the housing 1d are provided at two locations of the support portions 42a and 42b. As a result, the mounting stability of the propagation member 41a is increased and the heat dissipation path 19d is increased. Further, a support portion 42b, which is one of the two support portions of the propagation member 41a, is provided at an end portion on the right side of the first image sensor substrate 3a of the housing 1d, and a side surface portion on the right side of the housing 1d. The point is that the heat dissipation area was increased by actively dissipating heat from the ground. Although not shown in FIGS. 14 (a) and 14 (b), the same applies to the propagation member on the second image sensor 2b side and the support portion of the housing 1d.

That is, in the fourth embodiment, the first connection portion of the housing 1d to which the first heat transfer member 140a that connects between the first image sensor 2a and the housing 1d and propagates heat is connected is the first. It is provided at two locations, the connection portions 141a and 141b. Further, the first connection portion 141b, which is one of the two first connection portions 141a and 141b, is provided at the end on the right side of the first image sensor substrate 3a of the housing 1d. In other words, the first connection portion 141a is provided at the end of the housing 1c and below the first image sensor 2a. The first connection portion 141b is provided between the side surface portion of the housing 1d located in the direction (right direction) from the circuit elements 6 to 8 toward the first image pickup element 2a and the first image pickup element 2a. As a result, in the fourth embodiment, the mounting stability of the first heat transfer member 140a can be increased, the heat dissipation path 19d can be increased, and the heat dissipation area can also be increased. The same applies to the first heat transfer member and the first connection portion on the second image sensor 2b side.

Specifically, in FIGS. 14 (a) and 14 (b), as in the first embodiment, the lower side of both ends of the housing 1d in the left-right direction is a portion separated from the circuit elements 6 to 8. Yes, the temperature is low.
Further, the temperatures of both side surfaces of the housing 1d in the left-right direction are lower than those of the image pickup elements 2a and 2b. Therefore, the support portions 42a and 42b of the housing 1d on which the propagation member 41a included in the first heat transfer member 140a is supported go from the circuit elements 6 to 8 to one of the pair of image pickup elements (first image pickup element 2a). It is an end portion (first end portion) of the housing 1d located in the direction (right direction), and is provided on the lower side and the right side of the first image sensor substrate 3a. As a result, the mounting stability of the propagation member 41a can be increased, and the side surface portion of the housing 1d is used as a heat dissipation surface on the first image sensor 2a side, so that the temperature reduction effect of the first image sensor 2a is increased, and the first (1) The temperature of the image sensor 2a can be significantly reduced. The support portions 42a and 42b are the first connection portions 141a and 141b in the present embodiment. The propagation member 41a is supported by the housing 1d by using the second support members 47a and 47b composed of fastening members such as screws.

Similarly, the two support portions of the housing 1d in which the propagation member included in the first heat transfer member on the second image pickup element 2b side is supported are the other of the pair of image pickup elements from the circuit elements 6 to 8 (the first). (Ii) An end portion (second end portion) of the housing 1d located in a direction (left direction) toward the second image sensor 2b), which is provided below and to the left of the second image sensor substrate 3b. As a result, the mounting stability of the propagation member on the second image sensor 2b side can be increased, and the side surface portion of the housing 1d is used as a heat radiation surface on the second image sensor 2b side to reduce the temperature of the second image sensor 2b. The effect is increased, and the temperature of the second image sensor 2b can be greatly reduced. The two support portions on the second image sensor 2b side are also the first connection portions in the present embodiment. The propagation member on the second image pickup device 2b side is also supported by the housing 1d by using a second support member composed of a fastening member such as a screw.

According to the present embodiment configured as described above, the image pickup apparatus 204 can reduce the temperature rise of the image pickup devices 2a and 2b as in the first embodiment, and thus reduces the noise component due to the temperature rise. be able to. Therefore, the image pickup apparatus 204 can be an apparatus with high measurement accuracy and high reliability. Further, since the image pickup device 204 can reduce the performance variation due to the stable attachment of the propagation member, the image pickup device 204 can be a device with higher measurement accuracy and higher reliability. Further, the image pickup apparatus 204 can be a highly reliable apparatus capable of cost reduction because the number of parts can be reduced and misuse can be prevented by sharing the parts.

(Fifth Embodiment)
A fifth embodiment of the present invention will be described with reference to FIGS. 15 to 16 (b). In the present embodiment, only the differences from the first embodiment will be described, and in the drawings used in the present embodiment, the same members as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

FIG. 15 is an exploded perspective view of the first camera module 5a according to the fifth embodiment as viewed diagonally from the lower left side of the rear, showing the first image sensor substrate 3a and the holder 57a holding the first lens 4a. It is a figure for demonstrating the relationship. FIG. 16A is an enlarged view of a main part of the image pickup apparatus 205 according to the fifth embodiment as viewed from the rear. In FIG. 16A, the cover 14 is not shown, and the circuit board 9 is shown by a chain double-dashed line. FIG. 16B is a cross-sectional view of the image pickup apparatus 205 cut along the line HH shown in FIG. 16A. The arrows in FIGS. 16A and 16B indicate the main heat dissipation paths 19e of the heat generated in the first image sensor 2a. The same applies to the heat dissipation path on the second image sensor 2b side.

The feature of the fifth embodiment is that, for example, the propagation member 51a that propagates the heat of the first image sensor 2a to the housing 1e is brought into contact with the holder 57a that holds the first lens 4a. .. Although not shown in FIGS. 15 to 16 (b), the same applies to the propagation member on the second image sensor 2b side and the second camera module 5b.

That is, in the fifth embodiment, the first heat transfer member 150a that connects between the first image sensor 2a and the housing 1e to propagate heat is in contact with the holder 57a of the first camera module 5a. .. Similarly, in the fifth embodiment, the first heat transfer member that connects between the second image sensor 2b and the housing 1e to propagate heat is in contact with the holder of the second camera module 5b.

Specifically, in the first camera module 5a, the first image sensor substrate 3a inserts the protrusions 58a to 58c of the holder 57a holding the first lens 4a into the holes 59a to 59c of the first image sensor substrate 3a. It is connected by gluing. The protrusions 58a to 58c of the holder 57a have a convex shape so as to protrude from the first image sensor substrate 3a in the direction opposite to the holder 57a side of the first image sensor substrate 3a.

Generally, the image pickup elements 2a and 2b are vulnerable to external force (distortion), and there is a problem that the output signal deteriorates when distortion occurs. To solve this problem, for example, on the first image sensor 2a side, the protrusions 58a to 58c of the holder 57a are projected to the rear of the first image sensor substrate 3a and come into contact with specific parts 54a to 54c of the propagation member 51a. In this state, the first camera module 5a is attached to the housing 1e. The specific portions 54a to 54c of the propagation member 51a are portions formed so that the spring property is weakened (the spring constant becomes small), and has, for example, a leaf spring shape. In the image pickup apparatus 205, by bringing the propagation member 51a and the holder 57a into contact with each other, more heat of the first image sensor 2a can be propagated to the housing 1e via the propagation member 51a, and the first image pickup can be performed. The temperature rise of the element 2a can be effectively reduced. At that time, if the material of the holder 57a is a resin having high thermal conductivity or a metal part such as aluminum die casting, the temperature rise of the first image sensor 2a can be reduced more effectively.

Further, the cross-sectional shape of the protrusions 58a to 58c of the holder 57a or the shapes of the holes 59a to 59c of the first image sensor substrate 3a are lengthened so as to accommodate adjustment and variation in the mounting positions of the first camera module 5a and the propagation member 51a. It may be a circle, and the shape may be such that the holder 57a and the propagation member 51a are surely in contact with each other even if variations occur. Further, as shown in FIG. 15, the protrusions 58a to 58c of the holder 57a are arranged at two points on the upper side and one point on the lower side in the vertical direction, and the heat conductive member 11a protrudes downward or left and right to an unintended position. It can be shaped so that it does not adhere. As a result, in the image pickup apparatus 205, the amount of the heat conductive member 11a used does not become excessively large, and the cost increase can be suppressed. Further, bringing the propagation member 51a into contact with the holder 57a of the first camera module 5a is used as a temporary holding when the first camera module 5a is attached to the housing 1e with an adhesive or the like after the positioning of the first camera module 5a. It is also effective in that the first camera module 5a can be firmly fixed to the housing 1e.

Similar to the propagation member 51a on the first image sensor 2a side, the propagation member on the second image sensor 2b side also has a structure of being in contact with the holder of the second camera module 5b. More heat can be propagated to the housing 1e via the propagation member, and the temperature rise of the second image sensor 2b can be effectively reduced.

In the fifth embodiment, the first connection portion 151a of the housing 1e to which the first heat transfer member 150a that connects between the first image sensor 2a and the housing 1e to propagate heat is connected is propagated. It is a support portion 52a of the housing 1e in which the member 51a is supported. The propagation member 51a is supported by the housing 1e by using a second support member 55a composed of a fastening member such as a screw. The same applies to the first connection portion on the second image sensor 2b side.

According to the present embodiment configured as described above, the image pickup apparatus 205 can reduce the temperature rise of the image pickup devices 2a and 2b as in the first embodiment, and thus reduces the noise component due to the temperature rise. be able to. Further, since the image pickup device 205 can reduce the external force (distortion) on the image pickup devices 2a and 2b, deterioration of the output signal can be suppressed. Therefore, the image pickup device 205 can be a device with higher measurement accuracy and higher reliability.

(Sixth Embodiment)
A sixth embodiment of the present invention will be described with reference to FIGS. 17 to 18 (b). In the present embodiment, only the differences from the first embodiment will be described, and in the drawings used in the present embodiment, the same members as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

FIG. 17 is an exploded perspective view of the image pickup apparatus 206 according to the sixth embodiment as viewed from diagonally upward to the right rearward. In FIG. 17, the first support members 28a to 28d that support the circuit board 65 on the housing 1f and the support portions 23a to 23d of the housing 1f on which the circuit board 65 is supported are not shown.
FIG. 18A is an enlarged view of a main part of the image pickup apparatus 206 shown in FIG. 17 as viewed from the rear. FIG. 18B is a cross-sectional view of the image pickup apparatus 206 cut along the line II shown in FIG. 18A.
The arrows in FIGS. 18A and 18B indicate the main heat dissipation paths 19f of the heat generated in the first image sensor 2a. The same applies to the heat dissipation path on the second image sensor 2b side.

The feature of the sixth embodiment is that the propagation members 63a and 63b for propagating the heat of the image pickup elements 2a and 2b to the housing 1f are configured as a part of the cover 61.

That is, in the sixth embodiment, the first heat transfer members 160a and 160b that connect between the image pickup elements 2a and 2b and the housing 1f to propagate heat are a part of the cover 61 that seals the housing 1f. It is configured as. In the sixth embodiment, the first connection portion 161 of the housing 1e to which the first heat transfer members 160a and 160b are connected is the connection surface of the cover 61 of the housing 1f.

Specifically, the cover 61 has bent portions 64a and 64b that are bent forward from the lower side of both end portions in the left-right direction of the main body portion 62. The bent portions 64a and 64b are arranged above the lower end surface of the main body portion 62, and are formed so as to form a step when viewed from the rear. Plate-shaped propagation members 63a and 63b extending upward from their front ends are erected on the bent portions 64a and 64b. The bent portions 64a and 64b and the propagation members 63a and 63b are integrally formed with the main body portion 62 of the cover 61, and are formed as a part of the cover 61.

The propagation members 63a and 63b are arranged so as to face the back surfaces of the image sensor substrates 3a and 3b, and are connected to the heat conduction members 11a and 11b connected to the back surfaces to constrain the positions of the heat conduction members 11a and 11b. The propagation members 63a and 63b propagate the heat propagated from the image pickup elements 2a and 2b and the image pickup element substrates 3a and 3b through the heat conduction members 11a and 11b to the bending portions 64a and 64b.

The circuit board 65 is arranged between the main body 62 and the propagation members 63a and 63b so as to form a gap in the front-rear direction between the cover 61 and the main body 62 and between the propagation members 63a and 63b, respectively. Will be done. The circuit board 65 may be supported by the housing 1f by using the first support members 28a to 28d similar to those in the second embodiment. The support portion of the housing 1f on which the circuit board 65 is supported may also be the support portions 23a to 23d similar to those in the second embodiment.

The heat propagated from the propagation members 63a and 63b to the bent portions 64a and 64b propagates to the lower side of the image sensor substrates 3a and 3b of the housing 1f, is dissipated from the lower side of the housing 1f, and is dissipated from the lower side of the housing 1f. It propagates a lot to and is dissipated backward from the main body 62. Further, the heat propagated to the main body 62 propagates from the upper part of the main body 62 to the upper side of the image sensor substrates 3a and 3b of the housing 1f, and is also dissipated from the upper side of the housing 1f. As a result, in the image pickup device 206, the temperature rise of the image pickup devices 2a and 2b can be effectively reduced. Further, by forming the propagation members 63a and 63b as a part of the cover 61, it is possible to reduce the cost by reducing the number of parts.

Here, in order to improve the positioning of the bent portions 64a and 64b of the cover 61 and the propagation members 63a and 63b and the workability of attaching the cover 61, the ribs 66a to the lower side of the image sensor substrates 3a and 3b of the housing 1f 66d may be provided. In FIG. 17, two ribs 66a to 66d are provided for each of both ends of the housing 1f in the left-right direction, but two or more ribs 66a to 66d may be provided. As a result, in the image pickup apparatus 206, the bent portions 64a and 64b and the propagation members 63a and 63b can be positioned by simply inserting the cover 61 from the lower side to the upper side of the housing 1f. Further, the circuit board 65 is provided with cutouts 67a and 67b under the image pickup elements 2a and 2b in order to shorten the insertion distance of the bent portions 64a and 64b of the cover 61 and the propagation members 63a and 63b and improve workability. It may be in the shape of the shape.

According to the present embodiment configured as described above, the image pickup apparatus 206 can efficiently reduce the temperature rise of the image pickup devices 2a and 2b as in the first embodiment, so that the noise component due to the temperature rise is generated. Can be reduced. Therefore, the image pickup device 206 can be a device with high measurement accuracy and high reliability.

(Seventh Embodiment)
A seventh embodiment of the present invention will be described with reference to FIGS. 19 to 20 (b). In the present embodiment, only the differences from the sixth embodiment will be described, and in the drawings used in the present embodiment, the same members as those in the sixth embodiment are designated by the same reference numerals, and the description thereof will be omitted.

FIG. 19 is an exploded perspective view of the image pickup apparatus 207 according to the seventh embodiment as viewed from diagonally upward to the right rearward. In FIG. 19, the first support members 28a to 28d for supporting the circuit board 75 on the housing 1g and the support portions 23a to 23d for the housing 1g on which the circuit board 75 is supported are not shown. FIG. 20A is an enlarged view of a main part of the image pickup apparatus 207 shown in FIG. 19 as viewed from the rear. FIG. 20 (b) is a cross-sectional view of the image pickup apparatus 207 cut along the line JJ shown in FIG. 20 (a). The arrows in FIGS. 20 (a) and 20 (b) indicate the main heat dissipation paths 19 g of the heat generated in the first image sensor 2a. The same applies to the heat dissipation path on the second image sensor 2b side.

Similar to the sixth embodiment, the seventh embodiment has a structure in which the propagation members 73a and 73b for propagating the heat of the image pickup elements 2a and 2b to the housing 1g are formed as a part of the cover 71. The cover 71 has a larger area than the sixth embodiment and has a structure with improved heat dissipation performance.

That is, in the seventh embodiment, as in the sixth embodiment, the first heat transfer members 170a and 170b that connect between the image pickup elements 2a and 2b and the housing 1g to propagate heat transfer the housing 1g. It is configured as part of the sealing cover 71. In the seventh embodiment, the first connection portion 171 of the housing 1g to which the first heat transfer members 170a and 170b are connected is the connection surface of the cover 71 of the housing 1g.

Specifically, the cover 71 has bent portions 74a and 74b bent forward from the lower ends of both ends in the left-right direction of the main body portion 72. The bent portions 74a and 74b are arranged at the same positions in the vertical direction as the lower end surface of the main body portion 72. Plate-shaped propagation members 73a and 73b extending upward from their front ends are erected on the bent portions 74a and 74b. The bent portions 74a and 74b and the propagation members 73a and 73b are integrally formed with the main body portion 72 of the cover 71, and are formed as a part of the cover 71. The cover 71 has a shape in which the bent portions 64a and 64b of the sixth embodiment are extended downward to the lower end surface of the main body portion 72, and the heat dissipation area of the main body portion 72 is larger than that of the cover 61 of the sixth embodiment. It has increased.

The propagation members 73a and 73b are arranged so as to face the back surfaces of the image sensor substrates 3a and 3b, and are connected to the heat conduction members 11a and 11b connected to the back surfaces to constrain the positions of the heat conduction members 11a and 11b. The propagation members 73a and 73b propagate the heat propagated from the image pickup elements 2a and 2b and the image pickup element substrates 3a and 3b through the heat conduction members 11a and 11b to the bent portions 74a and 74b.

The circuit board 75 is arranged between the main body 72 and the propagation members 73a and 73b so as to form a gap in the front-rear direction between the cover 71 and the main body 72 and between the propagation members 73a and 73b, respectively. Will be done. The circuit board 75 may be supported by the housing 1g by using the first support members 28a to 28d similar to those in the second embodiment. The support portion of the housing 1g on which the circuit board 75 is supported may also be the support portions 23a to 23d similar to those in the second embodiment.

The heat propagated from the propagation members 73a and 73b to the bent portions 74a and 74b is dissipated through the heat dissipation path 19g similar to that of the sixth embodiment, but since the heat dissipation area of the cover 71 is increased, the heat is dissipated from the main body portion 72 to the rear. Heat dissipation to is promoted. As a result, in the image pickup device 207, the temperature rise of the image pickup devices 2a and 2b can be reduced more effectively. Further, by forming the propagation members 73a and 73b as a part of the cover 71, it is possible to reduce the cost by reducing the number of parts.

Here, in order to improve the positioning of the bent portions 74a and 74b of the cover 71 and the propagation members 63a and 63b and the workability of attaching the cover 71, the extending portion 77a is placed on the lower side of the image sensor substrates 3a and 3b of the housing 1g. , 77b may be provided. As a result, in the image pickup apparatus 207, the bent portions 74a and 74b and the propagation members 73a and 73b can be positioned by simply inserting the cover 71 from the lower side to the upper side of the housing 1g. Further, the circuit board 75 is provided with cutouts 76a and 76b under the image pickup elements 2a and 2b in order to shorten the insertion distance of the bent portions 74a and 74b of the cover 71 and the propagation members 73a and 73b and improve workability. It may be in the shape of the shape.

According to the present embodiment configured as described above, the image pickup apparatus 207 can efficiently reduce the temperature rise of the image pickup devices 2a and 2b as in the sixth embodiment, so that the noise component due to the temperature rise is generated. Can be reduced. Therefore, the image pickup device 207 can be a device with high measurement accuracy and high reliability.

(Eighth embodiment)
The eighth embodiment of the present invention will be described with reference to FIGS. 21 to 22 (b). In the present embodiment, only the differences from the first embodiment will be described, and in the drawings used in the present embodiment, the same members as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

FIG. 21 is a diagram showing the appearance of the image pickup apparatus 208 according to the eighth embodiment. FIG. 22A is an enlarged view of a main part of the image pickup apparatus 208 shown in FIG. 21 as viewed from the rear. In FIG. 22A, the cover 14 is not shown, and the circuit board 9 is shown by a chain double-dashed line. 22 (b) is a cross-sectional view of the image pickup apparatus 208 cut along the KK line shown in FIG. 22 (a). The arrows in FIGS. 22 (a) and 22 (b) indicate the main heat dissipation paths 19h of the heat generated in the first image sensor 2a. The same applies to the heat dissipation path on the second image sensor 2b side.

The feature of the eighth embodiment is that the image pickup elements 2a and 2b are arranged below the intermediate position in the vertical direction of the housing 1h to improve the heat dissipation performance of the housing 1h above the image pickup elements 2a and 2b. It is a point. The feature of the eighth embodiment is that by arranging the image pickup elements 2a and 2b below the intermediate position in the vertical direction of the housing 1h, it is possible to arrange the parts along the windshield glass of the vehicle, and the space is increased. This is a point that has been effectively used and the image sensor 208 can be miniaturized.

That is, in the eighth embodiment, the image pickup devices 2a and 2b are in the first direction from the intermediate position of the housing 1h in the first direction (vertical direction) in which the heat radiation plate 10a extends when viewed from the optical axis direction. It is placed on one side (lower side).

Specifically, the camera modules 5a and 5b on which the image sensors 2a and 2b are mounted are arranged below the intermediate position in the vertical direction. The heat radiating plates 83a and 83b in the vicinity of the image pickup elements 2a and 2b of the heat radiating plates 10a are extended to the same positions as the heat radiating plates 10a other than the heat radiating plates 83a and 83b in the vertical direction. Also extends upwards. As a result, the heat dissipation area is expanded as much as possible on the upper side of the housing 1h above the image pickup elements 2a and 2b, and the heat dissipation performance is improved. Here, the vicinity of the image sensors 2a and 2b refers to, for example, a portion of the housing 1h to which the camera modules 5a and 5b on which the image sensors 2a and 2b are mounted are mounted.

Further, the propagation member 81a that propagates the heat of the first image sensor 2a to the housing 1h is supported at least above the first image sensor 2a of the housing 1h. That is, the support portion 82a of the housing 1h on which the propagation member 81a is supported is provided above the first image sensor 2a provided with the heat radiating plate 83a. Therefore, the image pickup apparatus 208 has a structure in which the heat transfer performance from the propagation member 81a to the housing 1h is improved. The support portion 82a is the first connection portion 181a in the present embodiment. The propagation member 81a is supported by the housing 1h by using a second support member 84a composed of a fastening member such as a screw. Although not shown in FIGS. 22 (a) and 22 (b), the same applies to the propagation member on the second image sensor 2b side, the support portion of the housing 1h, and the second support member.

That is, in the eighth embodiment, for example, the first connection portion 181a of the housing 1h to which the first heat transfer member 180a that connects between the first image sensor 2a and the housing 1h and propagates heat is connected. , Is provided at an end located on the other side (upper side) of the first image sensor 2a in the first direction. The end portion provided with the first connection portion 181a is an end portion (first end portion) of the housing 1h located in the direction (right direction) from the circuit elements 6 to 8 toward the first image pickup element 2a. The same applies to the first heat transfer member and the first connection portion on the second image sensor 2b side.

With such a structure, in the image pickup device 208, the heat dissipation performance on the upper side of the image pickup elements 2a and 2b is improved, and for example, the heat propagated from the first image pickup element 2a and the first image pickup element substrate 3a to the propagation member 81a is generated. It propagates to the heat radiating plate 83a having high heat radiating performance on the upper side of the first image sensor 2a of the housing 1h and radiates heat. The same applies to the propagation member on the second image sensor 2b side and the heat radiating plate 83b. As a result, the image pickup device 208 can effectively reduce the temperature rise of the image pickup devices 2a and 2b.

Here, the temperatures of both side surfaces of the housing 1h in the left-right direction are also lower than those of the image sensors 2a and 2b. Therefore, in the image pickup device 208, as in the fourth embodiment, for example, the support portion of the housing 1h on which the propagation member 81a is supported is not only the support portion 82a provided on the upper side of the first image pickup element 2a, but also the first support portion 82a. A support portion 82b may also be provided on the right side of the image sensor 2a. As a result, the mounting stability of the propagation member 81a can be increased, and the side surface portion of the housing 1h is used as a heat radiating surface on the first image sensor 2a side, so that the temperature reduction effect of the first image sensor 2a is increased. (1) The temperature of the image sensor 2a can be significantly reduced. The support portion 82b is the first connection portion 181b in the present embodiment. That is, in the present embodiment, the first connection portion 181b is a side surface portion of the housing 1h located in the direction (right direction) from the circuit elements 6 to 8 toward the first image sensor 2a, and the first image sensor 2a. It may be provided between them. The propagation member 81a may be supported by the housing 1h by using not only the second support member 84a but also the second support member 84b composed of a fastening member such as a screw. Although not shown in FIGS. 22 (a) and 22 (b), the propagation member on the second image sensor 2b side, the support portion and the second support member of the housing 1h, the first heat transfer member, and the first The same applies to the connection part.

According to the present embodiment configured as described above, the image pickup apparatus 208 can reduce the temperature rise of the image pickup devices 2a and 2b as in the first embodiment, and thus reduces the noise component due to the temperature rise. be able to. Therefore, the image pickup apparatus 208 can be an apparatus with high measurement accuracy and high reliability. Further, since the image pickup device 208 can reduce the performance variation due to the stable attachment of the propagation member, the image pickup device 208 can be a device with higher measurement accuracy and higher reliability. Further, the image pickup device 208 can be a miniaturized device because the parts can be arranged along the windshield glass of the vehicle.

(Ninth Embodiment)
A ninth embodiment of the present invention will be described with reference to FIGS. 23 (a) and 23 (b). In this embodiment, only the differences from the eighth embodiment will be described, and in the drawings used in this embodiment, the same members as those in the eighth embodiment are designated by the same reference numerals, and the description thereof will be omitted.

FIG. 23A is an enlarged view of a main part of the image pickup apparatus 209 according to the ninth embodiment as viewed from the rear. In FIG. 23A, the cover 14 is not shown, and the circuit board 9 is shown by a chain double-dashed line. FIG. 23 (b) is a cross-sectional view of the image pickup apparatus 209 cut along the line PP shown in FIG. 23 (a). The arrows in FIGS. 23 (a) and 23 (b) indicate the main heat dissipation paths 19i of the heat generated in the first image sensor 2a. The same applies to the heat dissipation path on the second image sensor 2b side.

A feature of the ninth embodiment is that, for example, a support portion in which a propagation member 85a for propagating the heat of the first image sensor 2a to the housing 1i is supported by the housing 1i is provided on the upper side of the first image sensor 2a. The point is that the image sensor 209 is downsized by providing it only in one place of the portion 86a. Although not shown in FIGS. 23 (a) and 23 (b), the same applies to the propagation member on the second image sensor 2b side and the support portion of the housing 1i.

That is, in the ninth embodiment, the first connection portion of the housing 1i to which the first heat transfer member 185a that connects between the first image sensor 2a and the housing 1i and propagates heat is connected is the first. It is provided only at one place of the first connection portion 186a provided on the upper side of the image sensor 2a. The same applies to the first heat transfer member and the first connection portion on the second image sensor 2b side.

Specifically, in the image pickup apparatus 209, for example, in the image pickup apparatus 209, for example, the first camera module 5a on which the first image pickup element 2a is mounted is arranged below the intermediate position in the vertical direction, and the housing 1i A heat radiating plate 83a having improved heat radiating performance is provided above the first image sensor 2a. The support portion 86a of the housing 1i on which the propagation member 85a is supported is provided above the first image sensor 2a provided with the heat dissipation plate 83a. Therefore, the image pickup apparatus 209 has a structure in which the heat transfer effect of the propagation member 85a is improved. The support portion 86a is the first connection portion 186a in the present embodiment. The propagation member 85a is supported by the housing 1i by using a second support member 87a composed of a fastening member such as a screw. Although not shown in FIGS. 23 (a) and 23 (b), the same applies to the propagation member on the second imaging element 2b side, the support portion of the housing 1i, and the second support member.

Therefore, in the image pickup device 209, for example, the support portion of the housing 1i on which the propagation member 85a is supported is not on the right side of the first image pickup element 2a as in the eighth embodiment, and the side surface portion of the housing 1i is the first. It is possible to sufficiently reduce the temperature rise of the first image sensor 2a without using it as a heat radiation surface on the image sensor 2a side. Therefore, in the image pickup device 209, the space required for providing the support portion of the housing 1i on which the propagation member 85a is supported on the right side of the first image pickup element 2a can be reduced. The same applies to the second image sensor 2b side, and the space required for providing the support portion of the housing 1i on which the propagation member is supported on the left side of the second image sensor 2b can be reduced.
Therefore, in the image pickup apparatus 209, the dimensions of the housing 1i in the left-right direction can be shortened as compared with the eighth embodiment, so that the size can be reduced.

According to the present embodiment configured as described above, the image pickup apparatus 209 can reduce the noise component by reducing the temperature rise of the image pickup devices 2a and 2b as in the eighth embodiment. Therefore, the image pickup device 209 can be a device with high measurement accuracy and high reliability. Further, since the image pickup device 209 can shorten the dimension of the housing 1i in the left-right direction, it can be a smaller device.

(10th Embodiment)
A tenth embodiment of the present invention will be described with reference to FIG. 24. In the present embodiment, only the differences from the first embodiment will be described, and in the drawings used in the present embodiment, the same members as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

FIG. 24 is a perspective view of the main internal configuration of the image pickup apparatus 210 according to the tenth embodiment as seen through from diagonally upper right in front.

The feature of the tenth embodiment is that the image pickup apparatus 210 is a so-called monocular camera. For example, the image pickup apparatus 210 may be an image pickup apparatus in which the second camera module 5b of the first embodiment is removed and the camera module is composed of only the first camera module 5a.

Specifically, the first image sensor substrate 3a on which the first image sensor 2a is mounted is one of the left and right directions (right direction) of the housing 1j when viewed from the above optical axis direction, as in the first embodiment. ) Is provided at the end. The first image sensor substrate 3a is arranged so that the back surface of the first image sensor substrate 3a faces the element mounting surface of the circuit board 9 in front of the element mounting surface of the circuit board 9 on which the circuit elements 6 to 8 are mounted. Will be done. That is, in the image pickup device 210, the first image pickup element 2a and the circuit elements 6 to 8 are located at different positions when viewed from the optical axis direction. Although not shown in FIG. 24, in the image pickup device 210, the first support member that supports the circuit board 9 on the housing 1j is the first image pickup when viewed from the optical axis direction as in the first embodiment. The circuit board 9 may be supported by the housing 1j between the element 2a and the circuit elements 6 to 8.

Further, the propagation member 12a that propagates the heat of the first image sensor 2a to the housing 1j is one end (right direction) of the housing 1j in the left-right direction, as in the first embodiment, and is the first imaging. It is connected to an end portion 13a located below the element 2a, preferably below the first image sensor substrate 3a.

That is, in the tenth embodiment, as in the first embodiment, the housing 1j to which the first heat transfer member 110a that connects between the first image sensor 2a and the housing 1j and propagates heat is connected. The first connection portion 111a is provided at the end portion 13a. The end portion 13a is an end portion of the housing 1j located in the direction (right direction) from the circuit elements 6 to 8 toward the first image pickup device 2a when viewed from the optical axis direction. Although not shown in FIG. 24, in the tenth embodiment, the second heat transfer member 190 and the second connecting portion 191 are provided as in the first embodiment.

According to the present embodiment configured as described above, the image pickup apparatus 210 can reduce the temperature rise of the image pickup devices 2a and 2b and reduce the noise component due to the temperature rise, as in the first embodiment. Therefore, the image pickup device 210 can be a device with high measurement accuracy and high reliability.

(Other variants, etc.)
In the image pickup apparatus 210 according to the tenth embodiment, the first image pickup element 2a and the circuit elements 6 to 8 are located at different positions when viewed from the optical axis direction. The image pickup device 210 does not have to be at a position where the first image pickup element 2a and the circuit elements 6 to 8 are displaced from each other when viewed from the optical axis direction.

Further, the image pickup devices 201 to 210 are not only stereo cameras installed toward the inside of the windshield glass of the vehicle, but also cameras installed toward the rear of the vehicle, left and right, and other directions other than the front. Is also applicable. Further, the imaging devices 201 to 210 are not limited to cameras installed in vehicles, and can be applied to cameras for other purposes such as surveillance cameras.

The present invention is not limited to the above embodiment, and includes various modifications. For example, the above-described embodiment has been described in detail in order to explain the present invention in an easy-to-understand manner, and is not necessarily limited to the one including all the described configurations. Further, it is possible to replace a part of the configuration of one embodiment with the configuration of another embodiment, and it is also possible to add the configuration of another embodiment to the configuration of one embodiment. Further, it is possible to add / delete / replace a part of the configuration of each embodiment with another configuration.

Further, each of the above configurations, functions, processing units, processing means, etc. may be realized by hardware by designing a part or all of them by, for example, an integrated circuit. Further, each of the above configurations, functions, and the like may be realized by software by the processor interpreting and executing a program that realizes each function. Information such as programs, tapes, and files that realize each function can be stored in a memory, a hard disk, a recording device such as an SSD (Solid State Drive), or a recording medium such as an IC card, an SD card, or a DVD.

In addition, the control lines and information lines indicate those that are considered necessary for explanation, and not all control lines and information lines are necessarily indicated on the product. In practice, it can be considered that almost all configurations are interconnected.

1a to 1j ... Housing 2a ... First image sensor 2b ... Second image sensor 3a ... First image sensor board 3b ... Second image sensor board 6 to 8 ... Circuit elements 9, 65, 75 ... Circuit board 10 ... Heat transfer fins 10a, 83a, 83b ... Heat transfer plate 13a, 13b ... Ends 14, 61, 71 ... Covers 18a to 18d, 28a to 28d ... First support member 24a ... First area 29a ... Second area 27a, 27b, 37a to 37d , 47a, 47b, 55a, 84a, 84b, 87a ... Second support member 110a, 110b, 120a, 120b, 130a, 130b, 140a, 150a, 160a, 160b, 170a, 170b, 180a, 185a ... First heat transfer member 111a, 111b, 121a, 121b, 131a, 131b, 131c, 131d, 141a, 141b, 151a, 161, 171, 181a, 181b, 186a ... First connection part 190 ... Second heat transfer member 191 ... Second connection part 201 ~ 210 ... Image sensor

Claims (14)

1. With the housing
   The image sensor housed in the housing and
   The circuit element housed in the housing and
   A first heat transfer member that connects between the image sensor and the housing to propagate heat,
   It has a second heat transfer member that connects between the circuit element and the housing and propagates heat.
   The first heat transfer member is connected to the housing at the first connection portion of the housing.
   The image pickup apparatus, wherein the second heat transfer member is connected to the housing at a second connection portion of the housing.
2. The circuit element is located at a position deviated from the image pickup element when viewed from the optical axis direction of the image pickup optical system that forms a subject image on the image pickup element.
   The image pickup apparatus according to claim 1, wherein the first connection portion is provided at an end portion of the housing located in a direction from the circuit element to the image pickup element when viewed from the optical axis direction. ..
3. The image sensor is mounted on the element mounting surface of the image sensor substrate, and is mounted on the element mounting surface.
   The circuit element is mounted on a circuit board arranged so as to face the back surface of the image pickup device substrate, which is a surface opposite to the element mounting surface.
   The image pickup element is composed of a pair of image pickup elements arranged at intervals along the element mounting surface.
   The circuit element is arranged between the pair of image pickup elements when viewed from the optical axis direction.
   The first heat transfer member is provided for each of one and the other of the pair of image pickup devices.
   The first connection portion is a first end portion located in a direction from the circuit element toward one of the pair of image pickup devices when viewed from the optical axis direction, and from the circuit element to the other of the pair of image pickup devices. It is provided at the second end located in the direction of the direction,
   The first heat transfer member provided for one of the pair of image pickup devices is connected at the first end portion.
   The image pickup apparatus according to claim 2, wherein the first heat transfer member provided for the other of the pair of image pickup elements is connected at the second end portion.
4. The image sensor is mounted on the element mounting surface of the image sensor substrate, and is mounted on the element mounting surface.
   The circuit element is mounted on a circuit board arranged so as to face the back surface of the image pickup device substrate, which is a surface opposite to the element mounting surface.
   The circuit board is supported by the housing by using the first support member.
   The image pickup apparatus according to claim 2, wherein the first support member supports the circuit board between the image pickup element and the circuit element when viewed from the optical axis direction.
5. The image sensor is arranged below the intermediate position in the vertical direction of the housing when viewed from the optical axis direction.
   The imaging device according to claim 2, wherein the first connection portion is provided above the intermediate position of the end portion of the housing.
6. Radiation fins are provided on the outer surface of the housing.
   In the heat radiating fins, a plurality of heat radiating plates extending in the vertical direction of the housing are arranged at intervals along the direction from the circuit element to the image pickup element.
   The image pickup apparatus according to claim 2, wherein the first connection portion is provided below the image pickup element at the end portion of the housing.
7. The image sensor is mounted on the element mounting surface of the image sensor substrate, and is mounted on the element mounting surface.
   The circuit element is mounted on a circuit board arranged so as to face the back surface of the image pickup device substrate, which is a surface opposite to the element mounting surface.
   The first connection portion is provided below the image pickup device at the end portion of the housing.
   The circuit board is supported by the housing by using the first support member.
   The first support member supports the first support member on the lower side that supports the circuit board on the lower side of the image pickup element of the circuit board, and the circuit board on the upper side of the image pickup element of the circuit board. Including the first support member on the upper side
   The lower first support member is arranged at a distance from the first connection portion in the direction from the image pickup element to the circuit element than the upper first support member. The imaging device according to claim 2.
8. The image pickup apparatus according to claim 2, wherein the first connection portion is provided on the upper side and the lower side of the image pickup element at the end portion of the housing.
9. The image pickup apparatus according to claim 2, wherein the first connection portion is provided between a side surface portion of the housing located in a direction from the circuit element toward the image pickup element and the image pickup element.
10. The image sensor is mounted on the element mounting surface of the image sensor substrate, and is mounted on the element mounting surface.
    The circuit element is mounted on a circuit board arranged so as to face the back surface of the image pickup device substrate, which is a surface opposite to the element mounting surface.
    The second aspect of the present invention is characterized in that the first heat transfer member is connected to the back surface of the image pickup device substrate and is arranged so as to form a gap between the first heat transfer member and the circuit board in the optical axis direction. The imaging device described.
11. The image sensor is mounted on the element mounting surface of the image sensor substrate, and is mounted on the element mounting surface.
    The circuit element is mounted on a circuit board arranged so as to face the back surface of the image pickup device substrate, which is a surface opposite to the element mounting surface.
    The first heat transfer member is supported by the housing by using the second support member.
    The first heat transfer member projects from a first region facing the back surface of the image sensor substrate and a part of the first region toward the second support member, and the housing is formed by the second support member. Including a second area supported by the body
    The imaging apparatus according to claim 2, wherein the length of the second region is shorter than the length of the first region in a direction intersecting the protruding direction of the second region.
12. The image sensor is mounted on the element mounting surface of the image sensor substrate, and is mounted on the element mounting surface.
    The circuit element is mounted on a circuit board arranged so as to face the back surface of the image pickup device substrate, which is a surface opposite to the element mounting surface.
    Let L be the length from the end of the circuit board in the longitudinal direction to the center of the circuit board.
    Let L1 be the length from the end of the circuit board in the longitudinal direction to the support position of the circuit board with respect to the housing and closest to the end.
    The imaging device according to claim 2, wherein the circuit board is supported at the support position where the ratio of L1 to L is 0.5 or less.
13. The image sensor is mounted on the element mounting surface of the image sensor substrate, and is mounted on the element mounting surface.
    The image sensor substrate is connected to a holder that holds the image pickup optical system.
    The imaging device according to claim 2, wherein the first heat transfer member is in contact with the holder.
14. The image sensor is mounted on the element mounting surface of the image sensor substrate, and is mounted on the element mounting surface.
    The circuit element is mounted on a circuit board arranged so as to face the back surface of the image pickup device substrate, which is a surface opposite to the element mounting surface.
    The image pickup apparatus according to claim 2, wherein the first heat transfer member is configured as a part of a cover for sealing the housing in which the circuit board and the image pickup device substrate are housed.

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