JP2014011758A - Heat radiation mechanism - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat radiation mechanism which efficiently radiates heat occurring therein using a heat pipe and enables the heat pipe to be disposed so as to avoid other electronic components and contact with a heat radiation portion without bending the heat pipe.SOLUTION: A heat radiation mechanism includes a heat pipe and a heat conduction part. In the heat radiation mechanism, a thickness of the heat conduction part is set so as to be equal to or higher than a height of an electronic component, which has the highest height from a ground surface, from among all electronic components on a side of a substrate on which the heat conduction part is installed. The heat pipe is disposed so as to contact with the heat conduction part and a heat sink.

Description

The present invention relates to a heat dissipation mechanism.

Conventionally, there has been proposed an imaging apparatus configured to capture an image formed by a photographing lens or the like using a solid-state imaging element. Such an imaging device acquires a captured image by recording an image signal output from a solid-state imaging device on a recording medium.

In recent years, solid-state image sensors that are often used in image pickup devices have been increased in the number of pixels. Therefore, an electric load on a drive circuit is large, and a large amount of heat is generated during driving.

The heat generated in the solid-state imaging device as described above increases the dark current and causes degradation of image quality.

Therefore, conventionally, in order to prevent deterioration in image quality due to an increase in dark current due to an increase in temperature of the solid-state image sensor, a heat dissipation mechanism for the solid-state image sensor has been studied.

As a heat dissipation mechanism for a solid-state image sensor, a method is known in which a heat-dissipating member is provided in contact with the solid-state image-capturing element, and heat generated in a drive circuit is dissipated to a camera housing or the like via the heat-dissipating member.

For example, there is a method of radiating an object with a heat pipe that radiates heat using convection due to thermal expansion of a liquid.

JP 2000-138486 A

In the invention described in Patent Document 1, the step processed portion of the heat pipe is joined to the MPU to be cooled via the thermal elastomer, and the wing portion serves as a heat sink through the step bent portion extending from the step processed portion. Heat is dissipated by joining to the metal plate.

In this case, when the heat pipe is bent, a dent is generated in the step bent portion, and the heat dissipation efficiency is lowered by reducing the cross-sectional area by the amount of the dent in the step bent portion. In the invention, the thickness of the stepped bent portion is increased to compensate for the cross-sectional area that is reduced due to the formation of the dent, so that the heat dissipation treatment is performed without reducing the efficiency.

However, as described above, the invention described in Patent Document 1 has a shape in which the center portion in the longitudinal direction of the heat pipe is bent so as to have a concave shape, and is in contact with the object to be cooled and the heat radiating portion. .

When the heat pipe is bent in the form as described above, there is a problem that the cooling efficiency is lowered even if the reduction of the cross-sectional area is prevented.

When the heat pipe is bent, the heat dissipation efficiency decreases because the flow resistance in the heat pipe increases and heat resistance against heat transfer occurs, affecting the function of moving the working fluid from the condenser to the evaporator. This is because a sufficient amount of hydraulic fluid is not supplied to the evaporation section, heat conductivity is impaired, and heat transport capability is hindered.

In addition, increasing the thickness of the inclined portion caused by bending by bending the heat pipe or increasing the thickness of the stepped bending portion reduces the mountable area on the substrate. There was also a problem.

Therefore, it is desirable to use the heat pipe without bending as much as possible.

However, on most substrates, electronic parts other than the object to be cooled are installed.

Therefore, in order to place the cooling object and the heat radiating part in contact with the heat pipe while avoiding electronic parts other than the cooling object, the heat pipe is bent as in the invention described in Patent Document 1. 4 had to be arranged as shown in FIG.

Therefore, in order to solve the above-mentioned problem, the first invention is a heat dissipation mechanism having a heat pipe and a heat conduction part, wherein the heat conduction part is a substrate on the surface opposite to the surface on which the object to be cooled is arranged. The heat conduction part is disposed on the opposite side of the surface on which the object to be cooled is disposed and the heat pipe so as to face the object to be cooled across the substrate. The thickness of the heat conduction part is set to be equal to or higher than the height of the highest one from the ground plane among all electronic components on the substrate on the side where the heat conduction part is installed, and the heat The pipe is arranged so as to be in contact with the heat conducting part and the heat sink.

Moreover, 2nd invention is a thermal radiation mechanism which has a heat pipe and a heat conductive part, The said heat conductive part penetrates the opening part of the board | substrate which has arrange | positioned the cooling target object, The said cooling target object and the said heat pipe The thickness of the heat conducting part is set so that all the electronic components installed on the surface of the substrate having the cooling object on the side opposite to the side on which the cooling object is installed. Among them, the height from the parallel line of the surface where the cooling target and the substrate having the cooling target are in contact is set to be equal to or higher than the highest height, and the heat pipe is connected to the heat conducting portion. The heat dissipating mechanism is characterized by being arranged so as to be in contact with the heat sink.

According to a third aspect of the present invention, the cooling object is a solid-state imaging device, and the substrate on which the cooling object is arranged is an imaging device substrate. It was.

According to a fourth aspect of the present invention, there is provided the heat dissipation mechanism according to any one of claims 1 to 3, wherein the heat sink is a metal part constituting a device having a heat dissipation mechanism.

According to the present invention, the generated heat is efficiently dissipated using a heat pipe, and the heat pipe is brought into contact with the heat dissipating part while avoiding other electronic parts without bending the heat pipe. A heat dissipation mechanism that can be arranged can be provided.

Sectional drawing of the imaging device which has an image pick-up element heat dissipation mechanism comprised by applying the 1st Example of this invention in the image pick-up element board | substrate which does not have an opening part. An exploded perspective view of an image sensor heat dissipation mechanism configured by applying the first embodiment of the present invention to an image sensor substrate having no opening. Schematic of an image sensor heat dissipation mechanism configured by applying the first embodiment of the present invention to an image sensor substrate having no opening. Schematic diagram of an image sensor heat dissipation mechanism having a conventional heat dissipation structure using a heat pipe on an image sensor substrate having no opening Sectional drawing of the imaging device which has an image pick-up element heat dissipation mechanism comprised by applying the 2nd Example of this invention in the image pick-up element board | substrate which has an opening part. An exploded perspective view of an image sensor heat dissipation mechanism configured by applying the second embodiment of the present invention to an image sensor substrate having an opening. Schematic of an image sensor heat dissipation mechanism configured by applying the second embodiment of the present invention to an image sensor substrate having an opening. Schematic diagram of an image sensor heat dissipation mechanism having a conventional heat dissipation structure using a heat pipe on an image sensor substrate having an opening.

FIG. 1 is a cross-sectional view of an image pickup apparatus having an image pickup element heat dissipation mechanism configured by applying the first embodiment of the present invention. Hereinafter, the configuration of the image sensor heat dissipation mechanism of Embodiment 1 will be described with reference to FIG.

In FIG. 1, a camera housing 1 is an external housing of a camera made of a metal such as aluminum. A lens barrel 2 to be described later is disposed on the front surface of the camera housing 1, and a display device such as a liquid crystal (not shown) and operation buttons for setting shooting conditions and the like are disposed on the back surface.

The lens barrel 2 is a lens device for forming a photographed image on an imager 5 described later. The lens barrel 2 has an optical system composed of a plurality of optical elements (not shown), a fixed barrel, a cam barrel, and the like.

The lens base 3 is a metal part that supports and fixes an optical system including an optical element (not shown). The lens base 3 determines the position of the lens system.

The imager base 4 is a part that supports and fixes an imager 5 described later. When the imager base 4 and the lens base 3 are screwed together, the positional relationship between the imager 5 and the lens system is determined.

The imager 5 is a solid-state imaging device such as a CMOS or CCD that converts light detected through an optical system in the lens barrel 2 into an image signal and acquires a captured image.

The imager substrate 6 is a substrate on which the imager 5 is arranged. On the imager substrate 6, the imager 5 is supplied with power by a power circuit (not shown) or the like.

The electronic part 7 is an electronic part other than the imager 5 disposed on the imager substrate 6. For example, a capacitor or a resistor corresponds to this.

The heat conduction part 8 is a plate-shaped heat conduction member such as a sheet-shaped heat radiation silicone that can radiate heat from the surface by heat conduction in the plate thickness direction.

The thickness of the sheet of the heat conducting unit 8 is set so that the height from the grounding surface of the imager substrate 6 is higher than the height of the electronic part 7.

The heat pipe 9 is obtained by vacuum-sealing a small amount of liquid in a sealed container and having a capillary structure on the inner wall. By giving a temperature difference to both ends of the heat pipe 9, the working fluid in the heat pipe 9 circulates and heat transfer occurs. Due to this heat transfer, the heat pipe 9 of the first embodiment dissipates heat to the heat sink and cools the imager 5.

Next, heat radiation of the imager 5 in the first embodiment will be described with reference to FIG.

FIG. 2 is an exploded perspective view of an image sensor heat dissipation mechanism configured by applying the first embodiment.

As shown in FIG. 2, the imaging device heat dissipation mechanism configured by applying the first embodiment includes, in order from the subject side, the lens base 3, the imager base 4, the imager 5, the imager substrate 6, the electronic parts 7, and the heat. The conducting portion 8 and the heat pipe 9 are arranged in this order.

The heat generated by the imager 5 moves to the heat conducting unit 8 through the imager substrate 6 that is in contact with the back surface of the light receiving surface of the imager 5.

The heat transferred to the heat conduction unit 8 further moves to the heat pipe 9.

The heat transferred to the heat pipe 9 moves from the 9x plane and 9y plane of the heat pipe 9 to the 3x plane and 3y plane of the lens base 3.

As can be seen from FIG. 1, both ends of the heat pipe 9 are in contact with the lens base 3. Thereby, the lens base 3 serves as a heat sink.

Next, the sheet of the heat conducting unit 8 is set so that the height of the sheet of the heat conducting unit 8 from the grounding surface of the imager substrate 6 is equal to or higher than the height of the electronic part 7 from the grounding surface of the imager substrate 6. The reason why the thickness is set will be described below.

FIG. 4 is a schematic view of an image sensor heat radiation mechanism having a conventional heat radiation structure using a heat pipe in an image sensor substrate having no opening.

As shown in FIG. 4, in order to place the heat pipe by bringing the object to be cooled and the heat radiating portion into contact with the heat pipe while avoiding other parts, the heat pipe is bent and shaped as shown in FIG. In the heat pipe must be arranged.

In the configuration shown in FIG. 4, since the heat pipe 9 is bent to avoid the electronic part 7, as described above, an increase in flow resistance in the heat pipe and thermal resistance to heat transfer occur, The function of moving the working fluid from the condensing unit to the evaporating unit is affected, and a sufficient amount of working fluid is not supplied to the evaporating unit, thereby impairing thermal conductivity and hindering heat transport capacity. There is a problem that the mounting area is lowered, and a component on the board is hindered by the arranged heat pipe, and the mountable area is reduced.

Further, in the configuration shown in FIG. 4, the heat pipe 9 cannot contact the entire surface of the heat conducting portion 8 that conducts heat conducted from the imager 5 that is a cooling target through the imager substrate 6.

Regarding this point, as a solution, it is conceivable that the bending of the heat pipe 9 is 90 degrees so as to contact the entire surface of the heat conducting portion 8 while avoiding contact with the electronic part 7.

However, if the bending of the heat pipe 9 is set to 90 degrees, the wick (capillary structure) in the heat pipe 9 may be destroyed, the internal liquid cannot be circulated, and normal heat transfer may not be possible.

Therefore, in order to arrange the heat pipe 9 so as to be in contact with the entire surface of the heat conducting part 8 while avoiding contact with the electronic part 7 without bending the heat pipe 9 at 90 degrees, It must be separated from the conductive part 8. Therefore, in this case, the arranged heat pipe 9 obstructs the components on the board, and the adverse effect that the mountable area is reduced is unavoidable.

Next, the case where thickness is set so that the sheet | seat of the heat conductive part 8 may become higher than the height of the electronic part 7 from the ground surface of the imager board | substrate 6 is demonstrated using FIG.

As can be seen from FIG. 3, the heat conducting part 8 is so formed that the height of the sheet of the heat conducting part 8 from the grounding surface of the imager substrate 6 is higher than the height of the electronic part 7 from the grounding surface of the imager board 6. A thickness of 8 sheets is set.

Accordingly, the heat pipe 9 is brought into contact with the heat pipe 9 by conducting the heat conducted through the imager substrate 6 from the imager 5 that is the object to be cooled without bending the heat pipe 9. Can be arranged.

In addition, as shown in FIG. 3, the heat pipe 9 can be in contact with the entire surface of the heat conducting unit 8 that conducts heat conducted from the imager 5 that is the object to be cooled through the imager substrate 6.

Therefore, in the configuration of the first embodiment, the heat generated in the solid-state imaging device is efficiently dissipated using a heat pipe, and the heat pipe is avoided while avoiding other parts without bending the heat pipe. It is possible to provide a heat dissipating mechanism for the image sensor substrate, in which the pipe can be disposed in contact with the solid-state image sensor and the heat dissipating portion.

Further, in the first embodiment, the thickness of the sheet of the heat conducting unit 8 is set so that the height of the sheet of the heat conducting unit 8 from the ground plane of the imager substrate 6 is higher than the height of the electronic part 7. Although set, the thickness of the sheet of the heat conducting unit 8 may be set so as to be the same as the height of the electronic part 7.

However, when the thickness of the sheet of the heat conducting unit 8 is set so that the height of the sheet of the heat conducting unit 8 from the ground plane of the imager substrate 6 is the same as the height of the electronic part 7, the heat pipe 9 Even if the heat pipe 9 can be brought into contact with the heat radiating portion without being bent, there is a possibility that other limitations and risks may occur.

Explain these restrictions and risks.

As such a restriction, for example, an electronic part that causes a problem when a surface other than the substrate grounding surface comes into contact with the metal part cannot be used as the electronic part 7, and therefore, restriction of the selection of the electronic part 7 can be considered. In addition, even if the electronic part 7 can contact the metal part, the heat conduction part 8 requires that the heat conduction part 8 needs a hardness higher than that assumed in the first embodiment of the present invention. There may be restrictions on selection. This is to suppress the pressure applied to the contacting electronic part 7 as much as possible. Further, in this case, a product having a high density is required for the heat conduction portion 8 to be in close contact between the heat pipe 9 and the imager substrate 6. This is because the pressure applied to the heat conducting unit 8 is low and the heat conducting efficiency is not lowered even if the heat conducting unit 8 is not compressed as much as possible. This is because, since the applied pressure is reduced, in order to compensate for this and increase the heat conduction efficiency of the heat conduction part 8, the heat conduction part 8 itself must have a high density.

Further, as a risk, for example, since the heat conducting unit 8 is in close contact with the heat pipe 9 and the imager substrate 6 by applying pressure, the height of the sheet of the heat conducting unit 8 is applied by applying pressure. When the height is the same as that of the electronic part 7 on the substrate 6, there is a risk that pressure is applied to the electronic part 7, causing a burden on the electronic part 7.

Therefore, in the first embodiment, the height of the sheet of the heat conducting unit 8 from the ground surface of the imager substrate 6 is the same as the height of the electronic part 7 from the ground surface of the imager substrate 6. Although the thickness of the sheet of the conduction part 8 may be set, the height of the sheet of the heat conduction part 8 from the grounding surface of the imager substrate 6 is different from the grounding surface of the imager substrate 6 of the electronic part 7. It is more preferable that the thickness of the sheet of the heat conducting portion 8 is set to be higher than the height.

Next, a second embodiment of the present invention will be described below.

FIG. 5 is a cross-sectional view of an image pickup apparatus having an image pickup device heat dissipation mechanism configured by applying the second embodiment of the present invention. Hereinafter, the configuration of the imaging element heat dissipation mechanism of Example 2 will be described with reference to FIG. However, the description of the same parts as in the first embodiment is omitted.

In FIG. 5, an imager substrate 6 is a substrate on which the imager 5 is arranged. Such an imager substrate 6 has an opening smaller than the size of the imager 5 at a portion where the imager 5 is disposed.

As shown in FIG. 5, the heat conducting unit 8 is installed so as to be in contact with the back surface of the light receiving surface of the imager 5 and the heat pipe 9 through the opening of the imager substrate 6.

Next, heat radiation of the imager 5 in the second embodiment will be described with reference to FIG.

FIG. 6 is an exploded perspective view of an image sensor heat dissipation mechanism constructed by applying the second embodiment.

As shown in FIG. 6, the image sensor heat dissipation mechanism configured by applying the second embodiment, in order from the subject side, lens base 3, imager base 4, imager 5, imager substrate 6, electronic part 7, heat The conducting portion 8 and the heat pipe 9 are arranged in this order.

The heat generated by the imager 5 moves from the back surface of the light receiving surface of the imager 5 to the heat conducting unit 8. This is because, as shown in FIGS. 5 and 6, the heat conducting portion 8 is inserted through the opening of the imager substrate 6 and is in contact with the back surface of the light receiving surface of the imager 5 and the heat pipe 9. .

The heat transferred to the heat conducting unit 8 further moves to the heat pipe 9 from the back surface of the surface where the heat conducting unit 8 is in contact with the imager 5.

The heat transferred to the heat pipe 9 moves from the 9x plane and 9y plane of the heat pipe 9 to the 3x plane and 3y plane of the lens base 3.

As can be seen from FIG. 5, both ends of the heat pipe are in contact with the lens base 3. Thereby, the lens base 3 serves as a heat sink.

Next, the reason why the thickness of the sheet of the heat conducting unit 8 is set so that the back surface of the light receiving surface of the imager 5 is higher than the height of the electronic part 7 from the parallel line of the surface in contact with the imager substrate 6. Is described below.

FIG. 8 is a schematic diagram of an image sensor heat radiation mechanism having a conventional heat radiation structure using a heat pipe in an image sensor substrate having an opening.

As shown in FIG. 8, in order to make the object to be cooled and the heat radiating part contact the heat pipe while avoiding other electronic parts, the heat pipe is bent and the heat pipe is arranged as shown in FIG. There must be.

In the configuration shown in FIG. 8, since the heat pipe 9 is bent to avoid contact with the electronic part 7, as described above, the flow resistance in the heat pipe is increased and the heat resistance against heat transfer is increased. This affects the function of moving the working fluid from the condensing unit to the evaporating unit, and a sufficient amount of working fluid is not supplied to the evaporating unit, impairing the thermal conductivity, impairing the heat transport capability, and cooling. There is a problem that efficiency is lowered and a mountable area on the substrate is reduced.

Further, in the configuration shown in FIG. 8, the heat pipe 9 cannot contact the entire surface of the heat conducting unit 8 that conducts heat from the imager 5 that is the object to be cooled.

In this regard, it is conceivable that the bending of the heat pipe 9 is 90 degrees so as to contact the entire surface of the heat conducting portion 8 while avoiding contact with the electronic part 7.

However, if the bending of the heat pipe 9 is set to 90 degrees, the wick (capillary structure) in the heat pipe 9 may be destroyed, the internal liquid cannot be circulated, and normal heat transfer may not be possible.

Therefore, in order to arrange the heat pipe 9 so as to be in contact with the entire surface of the heat conducting portion 8 while avoiding contact with the electronic part 7 without bending the heat pipe 9 at 90 degrees, the arrangement of the electronic part 7 is cooled. It must be separated from the heat conducting part 8 as the object. Therefore, in this case, the arranged heat pipe 9 obstructs the components on the board, and the adverse effect that the mountable area is reduced is unavoidable.

Next, when the thickness of the sheet of the heat conducting unit 8 is set so that the back surface of the light receiving surface of the imager 5 is higher than the height of the electronic part 7 from the parallel line of the surface in contact with the imager substrate 6 Will be described with reference to FIG.

As can be seen from FIG. 7, the thickness of the sheet of the heat conducting unit 8 is set such that the installation height of the sheet of the heat conduction unit 8 is the electronic part 7 when the imager substrate 6 is inserted through the opening of the imager substrate 6. The back surface of the light receiving surface of the imager 5 is set to be higher than the height from the parallel line of the surface in contact with the imager substrate 6.

As a result, the heat pipe 9 can be disposed by abutting the heat conducting portion 8 that conducts heat conducted from the imager 5, which is an object to be cooled, on the heat pipe 9 without bending the heat pipe 9. .

In addition, as shown in FIG. 7, the heat pipe 9 can be in contact with the entire surface of the heat conducting portion 8 that conducts heat from the imager 5 that is the object to be cooled.

Therefore, in the configuration of the second embodiment, the heat generated in the solid-state imaging device is efficiently dissipated using a heat pipe, and the heat pipe is avoided while avoiding other parts without bending the heat pipe. It is possible to provide a heat dissipating mechanism for an image sensor substrate in which a pipe can be disposed in contact with a solid-state image sensor and a heat radiating portion.

In the second embodiment, the thickness of the sheet of the heat conducting unit 8 is such that the installation height of the electronic part 7 from the parallel line of the surface where the back surface of the light receiving surface of the imager 5 is in contact with the imager substrate 6. Although the height of the sheet of the heat conducting unit 8 is set so as to be higher than the height, the installation height of the sheet from the parallel line of the surface where the back surface of the light receiving surface of the imager 5 is in contact with the imager substrate 6 is set. It may be set to be the same as the height of the part 7.

However, the thickness of the sheet of the heat conducting unit 8 is set to the same height as the height of the electronic part 7 from the parallel line of the surface where the back surface of the light receiving surface of the imager 5 is in contact with the imager substrate 6. In this case, the heat pipe 9 can be brought into contact with the solid-state imaging device and the heat radiating part without bending the heat pipe 9, but there is a possibility that other limitations and risks may occur.

Explain these restrictions and risks.

As such a restriction, for example, an electronic part that causes a problem when a surface other than the substrate grounding surface comes into contact with the metal part cannot be used as the electronic part 7, and therefore, restriction of the selection of the electronic part 7 can be considered. Moreover, even if the electronic part 7 can contact with a metal part, the heat conduction part 8 requires that the heat conduction part 8 needs a hardness higher than that assumed in the second embodiment of the present invention. There may be restrictions on selection. This is to suppress the pressure applied to the contacting electronic part 7 as much as possible. Furthermore, in this case, a product having a high density is required for the heat conducting portion 8 to be closely adhered between the heat pipe 9 and the imager 5. This is because the pressure applied to the heat conducting unit 8 is low and the heat conducting efficiency is not lowered even if the heat conducting unit 8 is not compressed as much as possible. This is because, since the applied pressure is reduced, in order to compensate for this and increase the heat conduction efficiency of the heat conduction part 8, the heat conduction part 8 itself must have a high density.

Further, as a risk, for example, since the heat conducting unit 8 is brought into close contact with the heat pipe 9 and the imager 5 by applying pressure, when the pressure is applied to the same height as the electronic part 7, There may be a risk that pressure is applied and the electronic part 7 is burdened.

Therefore, in the second embodiment, the thickness of the sheet of the heat conducting unit 8 is such that the installation height of the electronic part 7 from the parallel line of the surface where the back surface of the light receiving surface of the imager 5 is in contact with the imager substrate 6. Although the thickness may be set to be the same as the height, the thickness of the sheet of the heat conducting portion 8 is set so that the installation height is parallel to the surface where the back surface of the light receiving surface of the imager 5 contacts the imager substrate 6. It is more preferable that it is set to be higher than the height of the electronic part 7 from the line.

In the embodiment of the present invention, the lens base 3 is used as a heat sink. However, the heat sink is not limited to the lens base 3, and other metal having a heat capacity equal to or higher than the heat generation amount of the imager 5. Parts made of metal are also acceptable.

DESCRIPTION OF SYMBOLS 1 Camera housing 2 Lens barrel 3 Lens base 4 Imager base 5 Imager 6 Imager board 7 Electronic part 8 Heat conduction part 9 Heat pipe

Claims (4)

Heat pipes,
In a heat dissipation mechanism having a heat conducting part,
The heat conduction part is disposed on the substrate on the surface opposite to the surface on which the object to be cooled is disposed so as to face the object to be cooled with the substrate interposed therebetween.
The heat conducting unit is installed so as to abut on the heat pipe and the substrate on the surface opposite to the surface on which the object to be cooled is disposed,
The thickness of the heat conduction part is set to be equal to or higher than the height of the highest one from the ground plane among all electronic components on the substrate on the side where the heat conduction part is installed,
The heat pipe is disposed so as to be in contact with the heat conducting portion and the heat sink. Heat pipes,
In a heat dissipation mechanism having a heat conducting part,
The heat conduction part is installed so as to pass through the opening of the substrate on which the object to be cooled is disposed, and to contact the object to be cooled and the heat pipe,
The thickness of the heat conduction part is the cooling target and the cooling among all the electronic components installed on the surface of the substrate having the cooling target on the side opposite to the side where the cooling target is installed. The height from the parallel line of the surface in contact with the substrate having the object is set to be higher than the height of the highest one,
The heat pipe is disposed so as to be in contact with the heat conducting portion and the heat sink. The cooling object is a solid-state image sensor,
The heat dissipating mechanism according to claim 1, wherein the substrate on which the cooling target is arranged is an image sensor substrate. 4. The heat dissipation mechanism according to claim 1, wherein the heat sink is a metal part constituting a device having a heat dissipation mechanism. 5.

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