CN219417970U - Camera structure and aerial camera - Google Patents

Abstract

The utility model discloses a camera structure and a aerial camera, which belong to the technical field of shooting equipment, wherein the camera structure comprises a camera main board, the camera main board comprises a plurality of circuit boards which are all provided with heating elements, and the camera main board also comprises a heat dissipation assembly for cooling the heating elements, wherein the heat dissipation assembly comprises a heat pipe, a fin assembly and a forced cooling assembly; the heat pipes are multiple, and each circuit board is provided with a heat pipe for radiating heat of a heating element on the circuit board; the heat absorption ends of the heat pipes are in heat conduction connection with the corresponding heating elements, and the heat dissipation ends of all the heat pipes are in heat conduction connection with the same fin assembly; the forced cooling component is used for forcedly radiating the fin component. The aerial camera includes the camera structure. By adopting the camera form provided by the scheme, under the condition that the volume of the heat dissipation structure is smaller, the forced heat dissipation can be carried out on a plurality of heating positions.

Description

Camera structure and aerial camera

Technical Field

The utility model relates to the technical field of shooting equipment, in particular to a camera structure and a aerial camera.

Background

Currently, aerial photography, mapping and the like are increasingly widely applied to various fields. The camera is an important component of the aerial camera, and in actual operation, the camera is often mounted on the cradle head, so that the camera angle adjustment is realized through rotation of the cradle head, and a required shooting view angle is obtained.

The camera is a device for forming an image by using an optical imaging principle, and the main components of the camera include a lens, a shutter, an image sensor, a main board (back circuit board) and the like.

Along with the increasing functions of cameras, the total area of a main board is also increased for carrying related electronic components, circuit structures and electronic components connected to the circuit structures are distributed on the main board, and when the cameras work, the energy dissipation components generate heat, so that the main board part becomes a main heat source of the cameras. According to the functional division of each functional module on the main board, the system comprises functional modules for completing system operation, image data processing, functional control, data transmission, data display and the like, and the heating conditions of different functional modules are different. When the temperature of the relevant part increases due to heat generation, the shooting speed of the camera, the data storage speed and the shooting quality (thermal noise) of the photo are directly affected, so that reliable heat dissipation of the camera is very important. For example, patent application document CN201721317767.2 provides a heat dissipation structure, a camera and a mobile platform; the patent application document with the application number of CN202223451216.9 provides a refrigerating camera based on loop heat pipe heat dissipation, in the scheme, a heat pipe with excellent heat conduction capacity is applied to camera heat dissipation.

In the existing camera structural design, in order to meet the camera size design requirement, the camera structural design is generally divided into a plurality of layers of circuit boards, and due to technical limitations, the main heating functional modules are also scattered on each layer of circuit and each layer of circuit board.

Further improvements in camera architecture are necessary to address camera heat dissipation issues.

Disclosure of Invention

Aiming at the problem of heat dissipation of a camera, the utility model provides a camera structure and a aerial camera, wherein the aerial camera comprises the camera.

The aim of the utility model is mainly realized by the following technical scheme:

the camera structure comprises a camera main board, wherein the camera main board comprises a plurality of circuit boards provided with heating elements, and a heat dissipation assembly for cooling the heating elements, and the heat dissipation assembly comprises a heat pipe, a fin assembly and a forced cooling assembly;

the heat pipes are multiple, and each circuit board is provided with a heat pipe for radiating heat of a heating element on the circuit board;

the heat absorption ends of the heat pipes are in heat conduction connection with the corresponding heating elements, and the heat dissipation ends of all the heat pipes are in heat conduction connection with the same fin assembly;

the forced cooling component is used for forcedly radiating the fin component.

As one skilled in the art will readily appreciate, a camera motherboard includes a plurality of circuit boards each provided with a heating element, namely: in order to control the area of a single circuit board, a camera main board serving a camera is divided into a plurality of circuit boards, and in practical application, the circuit boards are electrically connected and connected by signals, and the heating element is an electronic component which can generate heat on the circuit board when the camera works. The scheme is aimed at the camera structure of the type of the camera mainboard, and a corresponding heat dissipation assembly is configured for realizing: under the condition that the volume of the heat dissipation structure is smaller, the purpose of forced heat dissipation can be achieved for a plurality of heating positions.

Specifically, through the heat conduction connection established between the heat absorption end of the heat pipe and the heating element and the heat conduction connection established between the heat dissipation end of the heat pipe and the fin assembly, heat generated by the heating element can be efficiently conducted to the fin assembly through the heat pipe, and the fin assembly dissipates heat under the action of the forced cooling assembly so as to maintain the cooling capacity of the heating element. In addition, this scheme is to the camera mainboard including the structural style decision of polylith circuit board need gather heat or carry out radiating characteristics to a plurality of positions in a plurality of positions, sets up to the quantity of heat pipe and is many, like this, single heat pipe can set up to only be responsible for the cooling of single position in the camera mainboard cavity or be responsible for the cooling of partial position, to comparatively limited installation space in the camera casing, the shape structure of heat pipe is simpler under this kind of mode, conveniently accomplishes the heat pipe and be in lay or walk the type design in the cavity. The heat dissipation structure adopts the structural design that the heat dissipation ends of all the heat pipes are in heat conduction connection with the same fin assembly, and aims to enable the heat dissipation of heating elements on all circuit boards to be assisted only by adopting one fin assembly in the scheme, namely, the scheme with smaller heat dissipation structure volume is provided.

As a person skilled in the art, the heat conduction connection means that the heat pipe and the heating element, and the heat pipe and the fin assembly can transfer heat, and in order to ensure heat transfer efficiency, a connection mode is generally adopted for contact heat transfer. The contact heat transfer may be direct contact heat transfer, such as a heat pipe in direct contact with a heating element and a heat pipe in direct contact with a fin assembly, although indirect contact heat transfer may be provided, if necessary, such as a heat conducting plate between the heat pipe and the heating element and between the heat pipe and the fin assembly, through which heat is transferred.

The further technical scheme is as follows:

in a specific application scheme, the fin assembly is of a box type structure with a partition plate inside, and the partition plate divides a cavity inside the fin assembly into a plurality of sub-cavities;

the fin assembly is also provided with a cooling air port, and one end of each sub-cavity is connected with the cooling air port;

the forced cooling component is a fan with the end part being in butt joint with the cooling air port;

the heat dissipation end of the heat pipe is attached to the outer wall of the fin component;

the cooling air port is a cooling air inlet or a cooling air outlet;

when the cooling air inlet is formed, the air outlet end of the fan is in butt joint with the cooling air inlet; in the case of a cooling air outlet, the air inlet end of the fan is in butt joint with the cooling air outlet. The above provides a specific fin assembly structural form, and specific forced cooling assemblies are configured for that form. In a specific scheme, each sub-cavity is used as an independent air flow channel in the fin assembly, and the fan is used as a blowing device or an air extracting device according to the set cooling air flow direction by being arranged to further comprise a cooling air port and a fan, so that the distribution of air in the fin assembly is restrained by the sub-cavities, each position of the fin assembly is provided with relatively uniform air flow, and the air flow generated by the fan can cool the fin assembly better and efficiently. During specific application, the heat dissipation ends of the different heat pipes are fixed at different positions of the fin assembly, and the heat dissipation ends of the different heat pipes are enabled to be: the outer wall of any sub-cavity is adhered with the heat dissipation end of the heat pipe. In this scheme, the baffle can be regarded as the radiating fin on the fin subassembly, of course, because the baffle is located the inside of fin subassembly, in order to utilize natural air convection better to realize the fin subassembly cooling, can set up radiating fin in the outside of fin subassembly, the same as following scheme, also can be for this scheme configuration temperature sensor, only when natural air convection does not satisfy the cooling capacity to the fin subassembly, start the fan in order to dispel the heat to the fin subassembly by force.

In a specific application scheme, as a technical scheme parallel to the scheme of the heat dissipation component, the forced cooling component is a semiconductor refrigeration sheet;

the fin assembly comprises a first heat-conducting plate and radiating fins arranged on the first heat-conducting plate;

the heat dissipation ends of the semiconductor refrigerating sheets and the heat pipes are attached to the first heat conducting plate. In this scheme, radiating fin is used for increasing the radiating area of fin subassembly, reaches the purpose that utilizes natural air convection to realize the fin subassembly cooling better, and semiconductor refrigeration piece is used for realizing forcing the cooling to the fin subassembly promptly.

Both schemes have the characteristics of small volume and forced heat dissipation capability of the heat dissipation component. In the specific implementation, whether the forced cooling component is started or not is selected according to the heat dissipation requirement required by the current heating element.

In a specific application, the device further comprises a temperature sensor for detecting the temperature of the first heat conducting plate. The method and the device are the same as the scheme, and whether the forced cooling component needs to be started or not can be judged by checking the temperature of the first heat-conducting plate. As an equivalent scheme, the temperature sensor can also directly detect the temperature of the heating element, but the temperature sensor can be arranged at a position and at an angle determined by the overall structure of the camera, and the temperature sensor can detect the temperature of the first heat conducting plate more easily.

In one specific implementation, each circuit board is configured with an independent heat pipe. The scheme is as follows: the single heat pipe is only responsible for heat dissipation of a single circuit board, and the single circuit board can be provided with two or more heat pipes according to the needs. Alternatively, a single heat pipe may be responsible for heat dissipation from more than one circuit board. By adopting the scheme, the structure of the single heat pipe is simpler, and the heat pipe is convenient to arrange and run in the limited space in the camera. When the heat pipe is particularly used, the heat pipe can be provided with two or more heat absorption sections for completing heat dissipation at different positions on the corresponding circuit board.

In a specific application scheme, the circuit boards are arranged in layers, and the circuit boards are parallel to each other;

the heat pipe is a flat pipe, and the thickness direction of the heat pipe is parallel to the thickness direction of the circuit board. The scheme is a scheme which aims at the existing circuit board layout form, heating elements are generally positioned on the end face of the circuit board, and the heat pipe installation can be completed by utilizing a certain gap between adjacent circuit boards or under the condition that the gap is reduced.

In a specific application scheme, the heat pipe further comprises a second heat conducting plate attached to the heating element, and the heat absorbing end of the heat pipe is in heat conducting connection with the second heat conducting plate. The scheme provides a specific heat conduction connection realization form, namely indirect contact type heat conduction as proposed above. The scheme is characterized in that: the plurality of heating elements may be acted upon by a single second heat-conducting plate, if desired, i.e. the second heat-conducting plate is capable of serving the plurality of heating elements in that area; so that the heat pipe is not in direct contact with the heat generating element to reduce the likelihood of stress from the heat pipe causing damage to the heat generating element.

In a specific application scheme, in the two end faces of the second heat conducting plate, one end face is attached to the heating element, a sleeve is attached to the other end face, and the heat pipe is in heat conducting connection with the heating element through the heat pipe inserted into the sleeve. The scheme provides a accomplish heat pipe and second heat conduction board heat conduction through the mode of pegging graft and is connected, and specific characteristics include: the plug connection mode does not need other fasteners, and the circuit board and the heat pipe are conveniently and sequentially installed in the limited installation space of the camera main board in the camera; the plug connection is in a detachable connection form, so that the heat pipe and the like can be conveniently maintained in the later period; compared with the locking of the heat pipe and the second heat conducting plate by adopting the screw, when the camera is applied to the aerial camera, the connection failure of the heat pipe and the second heat conducting plate caused by shaking is not easy.

In a specific application scheme, further, at normal temperature, the external dimension of the heat absorbing end of the heat pipe is consistent with the external dimension of the pipe hole on the sleeve;

the thermal expansion coefficient of the heat pipe is larger than that of the sleeve;

different side surfaces of the sleeve are in smooth transition, and different side hole wall surfaces of a pipe hole on the sleeve are in smooth transition. In the scheme, the external dimension is consistent under the condition of 25 ℃ at normal temperature, namely the bonding area of the heat pipe and the sleeve is ensured to ensure the heat transfer capability between the heat pipe and the sleeve. Regarding the limitation of the thermal expansion coefficient, it is intended to achieve that after the temperature is higher than normal temperature, the tight fit between the heat pipe and the sleeve is maintained to secure the bonding area. Smooth transition of different sides and smooth transition of different measurement and control wall surfaces are that edges of the side surfaces of the sleeve and the side surfaces of the pipe hole are smooth chamfer edges, so that sleeve tearing caused by stress concentration at edge positions after materials are heated and expanded is avoided.

The scheme also discloses a aerial camera comprising the camera structure according to any one of the above, namely an aerial camera adopting the camera structure.

In summary, compared with the prior art, the utility model has the following beneficial effects:

this scheme is to the camera mainboard including the heat or carry out radiating characteristics to a plurality of positions at a plurality of positions of needs that the structural style of polylith circuit board decided, sets up to the quantity of heat pipe and is many, like this, single heat pipe can set up to only be responsible for the cooling of single position or the cooling of responsible for partial position in the camera mainboard cavity, to comparatively limited installation space in the camera casing, the shape structure of heat pipe is simpler under this kind of mode, conveniently accomplishes the heat pipe and be in lay or walk type design in the cavity.

The heat dissipation structure adopts the structural design that the heat dissipation ends of all the heat pipes are in heat conduction connection with the same fin assembly, and aims to enable the heat dissipation of heating elements on all circuit boards to be assisted only by adopting one fin assembly in the scheme, namely, the scheme with smaller heat dissipation structure volume is provided.

Drawings

The accompanying drawings, which are included to provide a further understanding of embodiments of the utility model and are incorporated in and constitute a part of this application, illustrate embodiments of the utility model. In the drawings:

FIG. 1 is a front view of one embodiment of a camera structure according to the present utility model, in which the camera back end housing is not shown;

FIG. 2 is a schematic perspective view of a camera structure according to an embodiment of the present utility model, in which a camera back-end housing is not shown;

FIG. 3 is a schematic perspective view of a heat dissipating assembly according to an embodiment of the camera structure of the present utility model;

FIG. 4 is a schematic perspective view of a heat dissipating assembly according to an embodiment of the camera structure of the present utility model, which is different from FIG. 3, and has different view port positions, wherein arrows indicate cooling air flow directions;

fig. 5 is a schematic structural diagram showing a heat pipe and a heat generating element in a heat conducting connection implementation manner according to an embodiment of the camera structure of the present utility model.

The correspondence between the reference numerals and the technical terms in the above schematic drawings is: 1. fan 2, camera mainboard, 3, heat pipe, 4, heating element, 5, fin subassembly, 6, second heat-conducting plate, 7, sleeve pipe.

Detailed Description

For the purpose of making apparent the objects, technical solutions and advantages of the present utility model, the present utility model will be further described in detail with reference to the following examples and the accompanying drawings, wherein the exemplary embodiments of the present utility model and the descriptions thereof are for illustrating the present utility model only and are not to be construed as limiting the present utility model.

Example 1:

as shown in fig. 1 to 5, the present embodiment relates to a camera structure, including a camera main board 2, where the camera main board 2 includes a plurality of circuit boards each provided with a heating element 4, and further includes a heat dissipation assembly for cooling the heating element 4, where the heat dissipation assembly includes a heat pipe 3, a fin assembly 5, and a forced cooling assembly;

the heat pipes 3 are multiple, and each circuit board is provided with the heat pipe 3 for radiating the heat of the heating element 4;

the heat absorption ends of the heat pipes 3 are in heat conduction connection with the corresponding heating elements 4, and the heat dissipation ends of all the heat pipes 3 are in heat conduction connection with the same fin assembly 5;

the forced cooling component is used for forcedly radiating heat of the fin component 5.

As will be readily appreciated by those skilled in the art, the camera motherboard 2 comprises a plurality of circuit boards each provided with a heating element 4, namely: the camera motherboard 2 serving the camera is divided into a plurality of circuit boards for controlling the area of the single circuit board, and in practical application, the circuit boards are electrically connected and signal connected, and the heating element 4 is an electronic component which generates heat on the circuit board when the camera works. The scheme is aimed at the camera structure of the type 2 of the camera main board, and is provided with a corresponding heat dissipation component for realizing: under the condition that the volume of the heat dissipation structure is smaller, the purpose of forced heat dissipation can be achieved for a plurality of heating positions.

Specifically, through the heat conduction connection established between the heat absorbing end of the heat pipe 3 and the heating element 4 and the heat conduction connection established between the heat dissipating end of the heat pipe 3 and the fin component 5, heat generated by the heating element 4 can be efficiently conducted to the fin component 5 through the heat pipe 3, and the fin component 5 dissipates heat under the action of the forced cooling component so as to maintain the cooling capability of the heating element 4. In addition, this scheme is to the camera mainboard 2 including the heat or carry out radiating characteristics to a plurality of positions in the needs of the structural style decision of polylith circuit board, sets up to the quantity of heat pipe 3 be many, like this, single heat pipe 3 can set up to only be responsible for the cooling of single position or the cooling of responsible for partial position in the camera mainboard 2 cavity, and to the comparatively limited installation space in the camera casing, the shape structure of heat pipe 3 is simpler under this kind of mode, conveniently accomplishes the heat pipe 3 and lay or walk the type design in the cavity. The heat dissipation structure adopts the structural design that the heat dissipation ends of all the heat pipes 3 are in heat conduction connection with the same fin assembly 5, and aims to enable the heat dissipation of the heating element 4 on all the circuit boards to be assisted only by adopting one fin assembly 5 in the scheme, namely, the scheme with smaller heat dissipation structure volume is provided.

As a person skilled in the art, the heat-conducting connection means that the heat pipe 3 and the heating element 4, and the heat pipe 3 and the fin assembly 5 can transfer heat, and in order to ensure heat transfer efficiency, a contact type heat transfer is generally adopted as a connection mode. The contact heat transfer may be a direct contact heat transfer, such as the heat pipe 3 is in direct contact with the heating element 4, and the heat pipe 3 is in direct contact with the fin assembly 5, and of course, if necessary, an indirect contact heat transfer may be provided, such as a heat conducting plate between the heat pipe 3 and the heating element 4, and between the heat pipe 3 and the fin assembly 5, through which heat is transferred.

Example 2:

this example was further refined and refined on the basis of example 1:

the fin assembly 5 is of a box type structure with a partition plate inside, and the partition plate divides a cavity inside the fin assembly 5 into a plurality of sub-cavities;

the fin assembly 5 is also provided with a cooling air port, and one end of each sub-cavity is connected with the cooling air port;

the forced cooling component is a fan 1 with the end part butted with the cooling air port;

the radiating end of the heat pipe 3 is attached to the outer wall of the fin component 5;

the cooling air port is a cooling air inlet or a cooling air outlet;

in the case of a cooling air inlet, the air outlet end of the fan 1 is in butt joint with the cooling air inlet; in the case of a cooling air outlet, the air inlet end of the fan 1 is in butt joint with the cooling air outlet. The above provides a specific fin assembly 5 configuration and specific forced cooling assemblies are configured for that configuration. In a specific scheme, each sub-cavity is used as an independent air flow channel in the fin assembly 5, and by arranging the cooling air flow channel to further comprise a cooling air port and a fan 1, according to the arranged cooling air flow direction, the fan 1 is used as a blowing device or an air extracting device to restrict the distribution of air in the fin assembly 5 by using the sub-cavities, so that each position of the fin assembly 5 has relatively uniform air flow, and the air flow generated by the fan 1 can cool the fin assembly 5 better and efficiently. In specific application, the heat dissipation ends of the different heat pipes 3 are fixed at different positions of the fin assembly 5, and the heat dissipation ends are as follows: the outer wall of any sub-cavity is adhered with the heat dissipation end of the heat pipe 3. In this solution, the partition plate may be regarded as a heat dissipation fin on the fin assembly 5, and, of course, since the partition plate is located inside the fin assembly 5, in order to better utilize natural air convection to achieve cooling of the fin assembly 5, the heat dissipation fin may be disposed outside the fin assembly 5, which is the same as the following solution, and a temperature sensor may be configured for this solution, and only when natural air convection does not satisfy the cooling capability of the fin assembly 5, the fan 1 is started to perform forced heat dissipation on the fin assembly 5.

Example 3:

this example was further refined and refined on the basis of example 1:

as a technical scheme parallel to the scheme of the heat dissipation assembly in the embodiment 2, the forced cooling assembly is a semiconductor refrigeration sheet;

the fin assembly 5 includes a first heat conductive plate and a heat radiating fin provided on the first heat conductive plate;

the semiconductor refrigerating sheet and the radiating end of the heat pipe 3 are attached to the first heat conducting plate. In this scheme, radiating fin is used for increasing the radiating area of fin subassembly 5, reaches the purpose that utilizes natural air convection to realize the cooling of fin subassembly 5 better, and semiconductor refrigeration piece is used for realizing forcing the cooling to fin subassembly 5 promptly.

Example 4:

this example was further refined and refined on the basis of example 3:

and a temperature sensor for detecting the temperature of the first heat conduction plate. The method and the device are the same as the scheme, and whether the forced cooling component needs to be started or not can be judged by checking the temperature of the first heat-conducting plate. As an equivalent scheme, the temperature sensor can also directly detect the temperature of the heating element 4, but the temperature sensor can be arranged at a position and at an angle determined by the overall structure of the camera, and the temperature sensor can detect the temperature of the first heat conducting plate more easily.

Example 5:

this example was further refined and refined on the basis of example 1:

each circuit board is provided with a separate heat pipe 3. The scheme is as follows: the single heat pipe 3 is only responsible for heat dissipation of a single circuit board, and two or more heat pipes 3 can be configured according to the needs of the single circuit board. Alternatively, a single heat pipe 3 may be responsible for heat dissipation from more than one circuit board. By adopting the scheme, the structure of the single heat pipe 3 is simpler, and the layout and the running of the heat pipe 3 in the limited space in the camera can be conveniently completed. In specific application, the heat pipe 3 can be provided with two or more heat absorption sections for completing heat dissipation at different positions on the corresponding circuit board.

Example 6:

this example was further refined and refined on the basis of example 1:

the circuit boards are arranged in layers and are parallel to each other;

the heat pipe 3 is a flat pipe, and the thickness direction of the heat pipe 3 is parallel to the thickness direction of the circuit board. The scheme is a scheme which aims at the existing circuit board layout form, the heating element 4 is generally positioned on the end face of the circuit board, and the heat pipe 3 can be installed by utilizing a certain gap between adjacent circuit boards or under the condition that the gap is reduced, and compared with the round heat pipe 3, the scheme is beneficial to controlling the volume of a camera.

Example 7:

this example was further refined and refined on the basis of example 1:

the heat pipe further comprises a second heat-conducting plate 6 attached to the heating element 4, and the heat absorbing end of the heat pipe 3 is in heat-conducting connection with the second heat-conducting plate 6. The scheme provides a specific heat conduction connection realization form, namely indirect contact type heat conduction as proposed above. The scheme is characterized in that: the plurality of heating elements 4 may be acted upon by a single second heat-conducting plate 6, if desired, i.e. the second heat-conducting plate 6 is capable of serving a plurality of heating elements 4 in that area; so that the heat pipe 3 is not in direct contact with the heat generating element 4 to reduce the likelihood of stress from the heat pipe 3 causing damage to the heat generating element 4.

Example 8:

this example was further refined and refined on the basis of example 7:

one of the two end surfaces of the second heat-conducting plate 6 is attached to the heating element 4, the other end surface is attached to the sleeve 7, and the heat pipe 3 and the heating element 4 are in heat-conducting connection through the heat pipe 3 inserted into the sleeve 7. The scheme provides a accomplish heat pipe 3 and heat conduction of second heat-conducting plate 6 through the mode of pegging graft and is connected, and specific characteristics include: the plug connection mode does not need other fasteners, and the circuit board and the heat pipe 3 are conveniently and sequentially installed in the limited installation space of the camera main board 2 in the camera; the plug connection is in a detachable connection form, so that the heat pipe 3 and the like can be conveniently maintained in the later period; compared with the locking of the heat pipe 3 and the second heat conducting plate 6 by adopting the screw, when the camera is applied to the aerial camera, the connection failure of the heat pipe 3 and the second heat conducting plate 6 caused by shaking is not easy.

Example 9:

this example was further refined and refined on the basis of example 8:

further, at normal temperature, the external dimension of the heat absorbing end of the heat pipe 3 is consistent with the external dimension of the pipe hole on the sleeve 7;

the thermal expansion coefficient of the heat pipe 3 is larger than that of the sleeve 7;

different side surfaces of the sleeve 7 are in smooth transition, and different side hole wall surfaces of the pipe hole on the sleeve 7 are in smooth transition. In this scheme, be 25 ℃ under the normal atmospheric temperature condition promptly, the overall dimension is unanimous promptly be used for guaranteeing the laminating area of heat pipe 3 and sleeve pipe 7 in order to ensure the heat transfer ability between heat pipe 3 and the sleeve pipe 7. Regarding the limitation of the thermal expansion coefficient, it is intended to achieve that after the temperature is higher than normal temperature, the tight fit between the heat pipe 3 and the sleeve 7 is maintained to secure the bonding area. Smooth transition of different sides and smooth transition of different measurement and control wall surfaces are that edges of the side surface of the sleeve 7 and the side surface of the pipe hole are smooth chamfer edges, so that the sleeve 7 is prevented from being torn due to stress concentration at edge positions after the materials are heated and expanded.

Example 10:

the present embodiment provides a aerial camera including the camera structure, that is, an aerial camera employing the camera structure, on the basis of any one of embodiments 1 to 9.

The foregoing description of the embodiments has been provided for the purpose of illustrating the general principles of the utility model, and is not meant to limit the scope of the utility model, but to limit the utility model to the particular embodiments, and any modifications, equivalents, improvements, etc. that fall within the spirit and principles of the utility model are intended to be included within the scope of the utility model.

Claims (10)

1. The camera structure comprises a camera main board (2), wherein the camera main board (2) comprises a plurality of circuit boards provided with heating elements (4) and a heat dissipation assembly for cooling the heating elements (4), and is characterized in that the heat dissipation assembly comprises a heat pipe (3), a fin assembly (5) and a forced cooling assembly;

the heat pipes (3) are multiple, and each circuit board is provided with the heat pipe (3) for radiating the heating element (4) on the circuit board;

the heat absorption ends of the heat pipes (3) are in heat conduction connection with the corresponding heating elements (4), and the heat dissipation ends of all the heat pipes (3) are in heat conduction connection with the same fin assembly (5);

the forced cooling component is used for forcedly radiating the fin component (5).

2. Camera structure according to claim 1, characterized in that the fin assembly (5) is a box-type structure having a partition inside, which partitions divide the cavity inside the fin assembly (5) into a plurality of sub-cavities;

a cooling air port is also arranged on the fin component (5), and one end of each sub-cavity is connected with the cooling air port;

the forced cooling component is a fan (1) with the end part being in butt joint with the cooling air port;

the radiating end of the heat pipe (3) is attached to the outer wall of the fin component (5);

the cooling air port is a cooling air inlet or a cooling air outlet;

when the cooling air inlet is formed, the air outlet end of the fan (1) is in butt joint with the cooling air inlet; in the case of a cooling air outlet, the air inlet end of the fan (1) is in butt joint with the cooling air outlet.

3. The camera structure of claim 1, wherein the forced cooling component is a semiconductor refrigeration piece;

the fin assembly (5) comprises a first heat-conducting plate and radiating fins arranged on the first heat-conducting plate;

the heat dissipation ends of the semiconductor refrigerating sheets and the heat pipes (3) are respectively attached to the first heat conducting plate.

4. A camera structure as recited in claim 3, further comprising a temperature sensor for detecting a temperature of the first thermally conductive plate.

5. Camera structure according to claim 1, characterized in that each circuit board is provided with a separate heat pipe (3).

6. The camera structure of claim 1, wherein the circuit boards are arranged in layers, the circuit boards being parallel to each other;

the heat pipe (3) is a flat pipe, and the thickness direction of the heat pipe (3) is parallel to the thickness direction of the circuit board.

7. Camera structure according to claim 1, characterized in that it further comprises a second heat-conducting plate (6) attached to the heating element (4), the heat-absorbing end of the heat pipe (3) being in heat-conducting connection with the second heat-conducting plate (6).

8. Camera structure according to claim 7, characterized in that, in the two end faces of the second heat-conducting plate (6), one of the end faces is in contact with the heating element (4), and the other end face is provided with a sleeve (7), and the heat pipe (3) and the heating element (4) are in heat-conducting connection by means of the heat pipe (3) being inserted into said sleeve (7).

9. The camera structure according to claim 8, characterized in that the external dimension of the heat absorbing end of the heat pipe (3) is identical to the external dimension of the pipe hole on the sleeve (7) at normal temperature;

the thermal expansion coefficient of the heat pipe (3) is larger than that of the sleeve (7);

different side surfaces of the sleeve (7) are in smooth transition, and different side hole wall surfaces of the upper pipe hole of the sleeve (7) are in smooth transition.

10. Aerial camera, characterized in that it comprises a camera structure according to any one of claims 1 to 9.