CN112469252B

CN112469252B - Efficient cooling assembly suitable for micro-miniature photoelectric pod electronic unit

Info

Publication number: CN112469252B
Application number: CN202011438254.3A
Authority: CN
Inventors: 迟圣威; 余黎明; 芦敏; 胡海涛
Original assignee: Wuxi Institute of Technology
Current assignee: Wuxi Guanya Constant Temperature Refrigeration Technology Co ltd
Priority date: 2020-12-11
Filing date: 2020-12-11
Publication date: 2023-01-24
Anticipated expiration: 2040-12-11
Also published as: CN112469252A

Abstract

The invention discloses an efficient cooling assembly suitable for a micro-miniature photoelectric pod electronic unit, which comprises an optical cabin and an azimuth shaft system, wherein the azimuth shaft system is arranged at the top of the optical cabin, the top of the azimuth shaft system is provided with a special-shaped main board, both sides of the special-shaped main board are respectively provided with a comprehensive processing board and a servo control board, and the center of the special-shaped main board is provided with a fan I; the azimuth axis system is provided with an azimuth cover, and the top of the azimuth cover is provided with an azimuth cover plate; the center of the top of the azimuth cover plate is provided with a radiating fin, the bottom of the radiating fin is provided with a heat conduction matching piece, and the heat conduction matching piece penetrates through the azimuth cover plate and is positioned between the comprehensive processing plate and the servo control plate; the cooling assembly is combined with the self structural characteristics of the miniature photoelectric pod and has a high-efficiency heat dissipation effect.

Description

Efficient cooling assembly suitable for micro-miniature photoelectric pod electronic unit

Technical Field

The invention relates to the technical field of photoelectric pod heat dissipation, in particular to an efficient cooling assembly suitable for a micro photoelectric pod electronic unit.

Background

With the continuous upgrading of the photoelectric pod technology, the micro-miniature photoelectric pod is seriously troubled by the problem of SWAP (size, importance and power consumption), the same performance requirements of the traditional large-sized medium-sized pod (multi-sensor integration such as a television, a thermal imager and the like, high-definition image display and processing, multi-sensor image switching, follow-up, disturbance suppression and tracking, stable aiming and image transmission on a target) need to be met, meanwhile, the micro-miniature photoelectric pod does not have the redundant space of the traditional size pod, a heat dissipation means can be effectively arranged, and the heat dissipation problem in a narrow space becomes a restriction on the reliability and even the usability of the photoelectric pod. The micro-miniature photoelectric pod is limited by the use environment and cost, the main means depends on heat dissipation of conduction and air cooling, but the heat dissipation effect is not ideal, namely, the function is reduced (the power consumption of an electronic unit is reduced), and the space requirement is not reduced (the size and the weight are increased).

Disclosure of Invention

The invention aims to ensure that a refrigeration assembly designed by combining the structural characteristics of a micro photoelectric pod has a high-efficiency heat dissipation effect under the original function and space size conditions.

In order to solve the technical problems, the invention provides the following technical scheme: a high-efficiency cooling assembly suitable for a micro-miniature photoelectric pod electronic unit comprises an optical cabin and an azimuth shaft system, wherein the azimuth shaft system is installed at the top of the optical cabin, a special-shaped main board is arranged at the top of the azimuth shaft system, a comprehensive processing board and a servo control board are respectively arranged on two sides of the special-shaped main board, and a fan I is arranged in the center of the special-shaped main board; the azimuth axis system is provided with an azimuth cover, and the top of the azimuth cover is provided with an azimuth cover plate; the center of the top of the azimuth cover plate is provided with a radiating fin, the bottom of the radiating fin is provided with a heat conduction matching piece, and the heat conduction matching piece penetrates through the azimuth cover plate and is positioned between the comprehensive processing plate and the servo control plate; a plurality of fan supports are uniformly distributed on the circumference of the top of the azimuth cover plate, and a fan II is arranged on each fan support.

Further, the heat-conduction fitting piece includes the fixing base, through the fix with screw between fixing base and the radiating fin, two spout I and two spout II have been seted up on the fixing base, two sliding connection has a slider I, two in the spout I respectively sliding connection has slider II, two in the spout II respectively sliding connection has a connecting rod between slider I respectively and the slider II that corresponds, two slider I respectively with a linear motor's output fixed connection, two linear motor fix the both sides at the fixing base through a mounting bracket respectively, two II bottoms of slider are connected with the conducting strip respectively, and two conducting strips are located the inboard of comprehensive treatment board, servo control board respectively.

Furthermore, the two ends of the connecting rod are respectively rotatably arranged on the corresponding sliding block I and the sliding block II.

Furthermore, the high-power chip on the comprehensive treatment plate and the high-power chip on the servo control plate are respectively arranged on one side of the comprehensive treatment plate opposite to the servo control plate, and the two high-power chips are respectively provided with heat-conducting silicone grease.

Furthermore, the number of the fans II is four, and the four fans II face the periphery of the radiating fins respectively.

Furthermore, two sides of the top of the special-shaped mainboard are respectively provided with a slot, and the comprehensive processing board and the servo control board are respectively inserted into the two slots.

Compared with the prior art, the invention has the following beneficial effects:

1. based on the self structural characteristics of the micro-miniature photoelectric pod, the cooling assembly in the invention is skillfully combined with an azimuth shaft system, an azimuth cover plate and the like, and an effective heat dissipation mode of the micro-miniature photoelectric pod is provided on the premise of not enlarging the space size;

2. the cooling assembly provided by the invention provides multiple heat dissipation matching modes, and can select the most reasonable heat dissipation means according to different use conditions and working states.

3. Based on the heat dissipation efficiency and the heat dissipation path, the high-power chip is taken as a heat dissipation object, and heat dissipation is performed through the sequence of convection, conduction heat dissipation and turbulent flow convection according to the heat dissipation efficiency, so that a high-efficiency heat dissipation effect is obtained.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic view of the overall cross-sectional structure of the present invention;

FIG. 3 is a schematic view showing the installation of a heat-conduction fitting of the present invention;

FIG. 4 is a schematic view of the fan I installation of the present invention;

FIG. 5 is a schematic view of a thermally conductive fitting of the present invention;

in the figure: 1. an optical compartment; 2. an azimuth axis; 3. an azimuth cover; 31. an azimuth cover plate; 4. a fan bracket; 41. a fan II; 5. a heat dissipating fin; 6. a special-shaped main board; 61. a comprehensive treatment plate; 62. a servo control board; 7. heat-conducting silicone grease; 8. a heat conductive mating member; 81. a linear motor; 82. a sliding block I; 83. a fixed seat; 831. a chute I; 832. a chute II; 84. a sliding block II; 85. a connecting rod; 86. a heat conductive sheet; 87. a mounting frame; 9. fan I.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.

Referring to fig. 1-5, the present invention provides the following technical solutions: a high-efficiency cooling assembly suitable for a micro-miniature photoelectric pod electronic unit comprises an optical cabin 1 and an azimuth axis system 2, wherein the azimuth axis system 2 is fixedly installed at the top of the optical cabin 1, a special-shaped main board 6 is arranged at the top of the azimuth axis system 2, a comprehensive processing board 61 and a servo control board 62 are respectively arranged on two sides of the special-shaped main board 6, and a fan I9 is arranged in the center of the special-shaped main board 6; the azimuth axis system 2 is provided with an azimuth cover 3, the azimuth cover 3 is connected with the azimuth axis system 2 through screws, the top of the azimuth cover 3 is provided with an azimuth cover plate 31, and the azimuth cover plate 31 is connected with the azimuth cover 3 through screws; the center of the top of the azimuth cover plate 31 is provided with a heat radiating fin 5, the bottom of the heat radiating fin 5 is provided with a heat conduction matching part 8, and the heat conduction matching part 8 penetrates through the azimuth cover plate 31 and is positioned between the comprehensive processing plate 61 and the servo control plate 62; a plurality of fan supports 4 are uniformly distributed on the top circumference of the azimuth cover plate 31, and a fan II 41 is respectively arranged on each fan support 4. The high-power chip on the comprehensive processing plate 61 and the high-power chip on the servo control plate 62 are respectively arranged on one side of the comprehensive processing plate 61 opposite to the servo control plate 62, the two high-power chips are respectively provided with heat-conducting silicone grease 7, and the heat conduction of the two high-power chips is facilitated by arranging the heat-conducting silicone grease 7.

A circular hole is formed in the center of the special-shaped main board 6, and the fan I9 is fixed in the circular hole; when the fan I9 works, the wind direction is upward, the air flow is accelerated, convection is formed, heat on the high-power chip is transferred to the azimuth cover plate 31 and the radiating fins 5 on the azimuth cover plate 31, the mode of heat transfer in a narrow pod space is accelerated only through the fan I9, and the photoelectric pod heat transfer device can be only applied to the stage that the working time in the photoelectric pod is short and the internal temperature is not high, or the full-function service time of the photoelectric pod is short.

The heat conduction matching piece 8 comprises a fixed seat 83, the fixed seat 83 is fixed with the radiating fins 5 through screws, two sliding grooves I831 and two sliding grooves II 832 are formed in the fixed seat 83, the sliding grooves I831 and the sliding grooves II 832 are vertically arranged, a sliding block I82 is respectively and slidably connected in the two sliding grooves I831, sliding blocks II 84 are respectively and slidably connected in the two sliding grooves II 832, a connecting rod 85 is respectively connected between the two sliding blocks I82 and the corresponding sliding blocks II 84, the two sliding blocks I82 are respectively and fixedly connected with the output end of a linear motor 81, the two linear motors 81 are respectively fixed on two sides of the fixed seat 83 through a mounting frame 87, heat conducting fins 86 are respectively connected to the bottoms of the two sliding blocks II 84, the two heat conducting fins 86 are respectively positioned on one side of the comprehensive processing plate 61 and one side of the servo control plate 62, and the heat conducting fins 86 are graphite sheets or aluminum sheets and can play a good heat conduction role; the two linear motors 81 are controlled to respectively drive the two sliders I82 connected with the linear motors to respectively move towards the center of the fixed seat 83, under the combined action of the connecting rod 85, the sliding groove II 832 and the like, the two sliders II 84 are driven to both move towards the direction far away from the center of the fixed seat 83, so that the two heat conducting fins 86 are driven to respectively move towards the comprehensive processing plate 61 and the servo control plate 62 until being respectively contacted with the heat conducting silicone grease 7 on the two high-power chips, at the moment, the heat of the two high-power chips can be conducted to the two heat conducting fins 86, and the heat conducting fins 86 are matched with a mode that the fan I9 accelerates the air flow to form convection for use, so that the heat on the two heat conducting fins 86 can be quickly and efficiently transmitted to the heat radiating fins 5 and further transmitted to the azimuth cover plate 31, and the matched heat radiating mode is suitable for the situation that the heat of the high-power chips on the comprehensive processing plate 61 and the servo control plate 62 continuously increases or the photoelectric pod runs at full load.

Two ends of the connecting rod 85 are respectively rotatably arranged on the corresponding sliding block I82 and the corresponding sliding block II 84, and the connecting rod 85 can drive the corresponding sliding block II 84 to move in a rotating connection mode when the sliding block I82 moves, so that the two heat-conducting fins 86 are respectively attached to the two heat-conducting silicone greases 7.

The quantity of fan II 41 is four, and four fan II 41 are respectively towards radiating fin 5 all around, and four fan II 41 during operation respectively blow to radiating fin 5's four sides, through two liang of blowing of fan II 41, form the torrent, are convenient for dispel the heat that accumulates on position apron 31 and radiating fin 5, improve the radiating effect. When the photoelectric pod has long service life, the high-power chips on the comprehensive processing board 61 and the servo control board 62 have high heat, which results in high internal heat density of the photoelectric pod, and the heat accumulated on the azimuth cover plate 31 and the radiating fins 5 cannot be timely dissipated by the heat conduction way and the heat dissipation way of the fan I9 for accelerating air flow, at this time, the four fans II 41 can be driven, so that a large amount of heat accumulated on the azimuth cover plate 31 and the radiating fins 5 can be rapidly exchanged to the surrounding air.

The two sides of the top of the special-shaped main board 6 are respectively provided with a slot, the comprehensive processing board 61 and the servo control board 62 are respectively inserted into the two slots, and the comprehensive processing board 61 and the servo control board 62 are convenient to install through the arrangement of the slots, the micro photoelectric pod electronic unit circuit board is divided into two parts, namely the comprehensive processing board 61 and the servo control board 62, the comprehensive processing board 61 is used for processing images, managing a computer and the like, and the servo control board 62 is used for processing functions of servo driving, controlling and the like.

The working principle is as follows: when the working time in the photoelectric hanging cabin is short and the internal temperature is not high, or the full-function service time of the photoelectric hanging cabin is short, the mode of heat transfer in a narrow hanging cabin space can be accelerated only through the fan I9, the fan I9 blows air flow upwards to accelerate air flow to form convection, so that heat on the high-power chip is quickly transferred to the azimuth cover plate 31 and the heat dissipation fins 5 on the azimuth cover plate 31, and then the heat is exchanged into the surrounding air;

when the heat of the high-power chips on the integrated processing board 61 and the servo control board 62 is continuously increased or the photoelectric pod function is started to run at full load, the two linear motors 81 are controlled to respectively drive the two sliding blocks I82 connected with the two linear motors to respectively move towards the center of the fixed seat 83, and under the combined action of the connecting rod 85, the sliding groove II 832 and the like, the two sliding blocks II 84 are driven to respectively move towards the direction away from the center of the fixed seat 83, so that the two heat-conducting fins 86 are driven to respectively move towards the integrated processing board 61 and the servo control board 62 until the two heat-conducting fins are respectively contacted with the heat-conducting silicone grease 7 on the two high-power chips, at the moment, the heat of the two high-power chips can be conducted to the two heat-conducting fins 86, and simultaneously the fan I9 is matched to blow air flow upwards, so that the heat can be more quickly and efficiently transmitted to the heat-radiating fins 5 and further transmitted to the azimuth cover plate 31 and the azimuth cover 3, and finally the heat is exchanged to the surrounding air;

finally, when the photoelectric pod is used for a long time, the heat of the two efficient chips is very high, so that the internal heat density of the photoelectric pod is very high, the heat accumulated on the azimuth cover plate 31 and the radiating fins 5 cannot be timely dissipated through the heat conduction mode of the heat conducting sheet 86 and the heat dissipation mode of the fan I9 for accelerating air flow, at the moment, the four fans II 41 are driven, every two of the fans II 41 blow oppositely to form turbulence, and a large amount of heat accumulated on the azimuth cover plate 31 and the radiating fins 5 can be conveniently and quickly exchanged into the surrounding air by matching the heat conduction mode of the heat conducting sheet 86 and the heat transfer mode of the fan I9 for accelerating heat transfer;

this radiator unit can select different radiating mode according to the photoelectricity nacelle actual working condition, the mode of accessible I9 acceleration heat transfer uses with the heat-conduction mode cooperation of conducting strip 86 and improves the radiating effect, still can form the turbulent effect that convection current mode, the heat-conduction mode of conducting strip 86 and four fan II 41 formed through I9 of fan, go in exchanging the air around fast with a large amount of heats that accumulate on position apron 31 and radiating fin 5.

It should be noted that, in this document, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described above, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. An efficient cooling assembly for a miniature electro-optical pod electronics unit, comprising: the optical axis system comprises an optical cabin (1) and an azimuth axis system (2), wherein the azimuth axis system (2) is installed at the top of the optical cabin (1), a special-shaped main board (6) is arranged at the top of the azimuth axis system (2), a comprehensive processing board (61) and a servo control board (62) are respectively arranged on two sides of the special-shaped main board (6), and a fan I (9) is arranged in the center of the special-shaped main board (6); the azimuth shaft system (2) is provided with an azimuth cover (3), and the top of the azimuth cover (3) is provided with an azimuth cover plate (31); the center of the top of the azimuth cover plate (31) is provided with a heat radiating fin (5), the bottom of the heat radiating fin (5) is provided with a heat conduction fitting piece (8), and the heat conduction fitting piece (8) penetrates through the azimuth cover plate (31) and is positioned between the comprehensive processing plate (61) and the servo control plate (62); a plurality of fan supports (4) are uniformly distributed on the circumference of the top of the azimuth cover plate (31), and a fan II (41) is arranged on each fan support (4);

the heat conduction matching piece (8) comprises a fixing seat (83), the fixing seat (83) and the heat dissipation fins (5) are fixed through screws, two sliding grooves I (831) and two sliding grooves II (832) are formed in the fixing seat (83), a sliding block I (82) is respectively connected in the two sliding grooves I (831) in a sliding mode, sliding blocks II (84) are respectively connected in the two sliding grooves II (832) in a sliding mode, a connecting rod (85) is connected between the two sliding blocks I (82) and the corresponding sliding block II (84) respectively, the two sliding blocks I (82) are fixedly connected with the output end of a linear motor (81), the two linear motors (81) are respectively fixed on the two sides of the fixing seat (83) through a mounting frame (87), the bottoms of the two sliding blocks II (84) are respectively connected with heat conduction pieces (86), and the two heat conduction pieces (86) are respectively located on the inner sides of the comprehensive processing plate (61) and the servo control plate (62);

the high-power chip on the comprehensive processing plate (61) and the high-power chip on the servo control plate (62) are respectively arranged on one side of the comprehensive processing plate (61) opposite to the servo control plate (62), and the two high-power chips are respectively provided with heat-conducting silicone grease (7).

2. The efficient cooling assembly for electronic units of miniature optoelectronic pods as recited in claim 1, further comprising: two ends of the connecting rod (85) are respectively rotatably arranged on the corresponding sliding block I (82) and the sliding block II (84).

3. The efficient cooling assembly for electronic units of miniature optoelectronic pods as recited in claim 1, further comprising: the number of the fans II (41) is four, and the four fans II (41) face the periphery of the radiating fin (5) respectively.

4. The efficient cooling assembly for electronic units of miniature optoelectronic pods as recited in claim 1, further comprising: two sides of the top of the special-shaped main board (6) are respectively provided with a slot, and the comprehensive processing board (61) and the servo control board (62) are respectively inserted into the two slots.