WO2019111547A1 - Electronic component and method for producing electronic component - Google Patents

Electronic component and method for producing electronic component Download PDF

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Publication number
WO2019111547A1
WO2019111547A1 PCT/JP2018/038622 JP2018038622W WO2019111547A1 WO 2019111547 A1 WO2019111547 A1 WO 2019111547A1 JP 2018038622 W JP2018038622 W JP 2018038622W WO 2019111547 A1 WO2019111547 A1 WO 2019111547A1
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WIPO (PCT)
Prior art keywords
layer
ceramic
resin
electronic component
external electrode
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PCT/JP2018/038622
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French (fr)
Japanese (ja)
Inventor
中野　悟
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株式会社村田製作所
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Publication of WO2019111547A1 publication Critical patent/WO2019111547A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors

Definitions

  • the present invention relates to an electronic component and a method of manufacturing the electronic component.
  • Patent Document 1 discloses an electronic component in which an LTCC substrate is a capacitor portion and a resin substrate is a coil portion.
  • a conductor layer is formed on a ceramic green sheet which is a material of the LTCC substrate, and a laminate in which the ceramic green sheet on which the conductor layer is formed is laminated is manufactured. Then, constraining sheets are disposed above and below the laminate, and firing is performed at a temperature at which the ceramic green sheets sinter.
  • the constraining sheet is a sheet containing, as a main component, an inorganic material that does not substantially sinter at a temperature at which the ceramic green sheet sinters. Since the constraining sheet does not substantially sinter during firing, it does not shrink and acts on the laminate to suppress shrinkage in the main surface direction. As a result, the dimensional accuracy of the finally obtained electronic component can be enhanced.
  • the constraining sheet After firing, the constraining sheet is removed from the LTCC substrate by a process such as sand blasting. Then, a resin insulating layer and a conductor layer are provided on the surface of the LTCC substrate from which the constraining sheet has been removed, and the conductor layer is etched to form a conductor pattern of the coil portion. Further, the resin substrate is formed by repeating the formation of the resin insulating layer and the conductor layer and the pattern formation by etching. Thus, after the resin substrate is provided on the LTCC substrate, an electronic component is manufactured by forming an external electrode so as to straddle the boundary between the LTCC substrate and the resin substrate in the thickness direction.
  • the resin insulating layer may be peeled off from the surface of the LTCC substrate at the boundary between the LTCC substrate and the resin substrate.
  • the resin insulating layer peels off the surface of the LTCC substrate, when forming an external electrode across the boundary between the LTCC substrate and the resin substrate in the thickness direction, a base electrode for forming the external electrode is not easily formed. Therefore, there is a problem that it becomes difficult to form an external electrode at a portion where the resin insulating layer is peeled off from the surface of the LTCC substrate.
  • the present invention has been made to solve the above problems, and there is no peeling between the LTCC substrate and the resin insulating layer formed on the LTCC substrate, and an electronic component in which the external electrode is formed without problems. Intended to be provided.
  • Another object of the present invention is to provide a method of manufacturing an electronic component capable of preventing peeling between an LTCC substrate and a resin insulating layer formed on the LTCC substrate.
  • the electronic component of the present invention comprises a ceramic part comprising a low temperature sintered ceramic material; A resin portion comprising a resin insulating layer and a conductor pattern laminated on the upper major surface of the ceramic portion; It is an electronic component provided with the external electrode provided straddling the boundary of the said ceramic part and the said resin part, Comprising: A barrier layer is provided at a portion of the boundary between the ceramic portion and the resin portion and located below the external electrode.
  • the barrier layer is preferably a silver electrode or a silver-palladium alloy electrode.
  • the barrier layer preferably contains glass as a main component.
  • the method of manufacturing an electronic component of the present invention is Preparing a ceramic green sheet containing a raw material of a low temperature sintered ceramic material; Providing a barrier layer at a planned formation position of an external electrode around the upper major surface of the uppermost ceramic green sheet to be laminated on the uppermost layer among the ceramic green sheets; The composite is obtained by laminating the ceramic green sheets and placing a compression sheet, which does not substantially sinter at the temperature at which the ceramic green sheets sinter, onto the upper major surface of the topmost ceramic green sheet and pressing the composite.
  • the present invention it is possible to provide an electronic component in which there is no peeling between the LTCC substrate and the resin insulating layer formed on the LTCC substrate, and the external electrode is formed without any problem. Moreover, the manufacturing method of the electronic component which can prevent peeling between the LTCC board
  • FIG. 1 is a perspective view schematically showing an example of an electronic component according to an embodiment of the present invention.
  • FIG. 2 is an exploded perspective view of a ceramic portion and a resin portion in the electronic component shown in FIG. 3 (a), 3 (b), 3 (c) and 3 (d) show ceramic parts when it is intended to manufacture an electronic component having a ceramic part and a resin part without providing a barrier layer. It is process drawing which shows typically a mode that peeling arises in the boundary of and the resin part.
  • FIGS. 4 (a), 4 (b), 4 (c) and 4 (d) schematically show how a barrier layer is provided at the boundary between the ceramic part and the resin part to manufacture the electronic component of the present invention. It is process drawing shown to.
  • FIGS. 5 (a) and 5 (b) are top views schematically showing examples of barrier layer formation positions when the barrier layer is provided on the top layer ceramic green sheet.
  • FIG. 1 is a perspective view schematically showing an example of an electronic component according to an embodiment of the present invention.
  • the resin portion 40 is stacked on the ceramic portion 30, and the external electrode (first end face) straddles the boundary between the ceramic portion 30 and the resin portion 40 (indicated by a two-dot chain line M).
  • An external electrode 23, a second end face external electrode 24, a first side face external electrode 25, and a second side face external electrode 26) are formed.
  • the electronic component 1 has a substantially rectangular parallelepiped shape as a whole.
  • the laminated component 10 has the first end surface 13 and the second end surface 13 opposite to each other in the length direction (x direction) And the first main surface 11 and the second main surface 12 opposite to the height direction (z direction) orthogonal to the length direction, and the width direction (y The first side 15 and the second side 16 opposite to the direction).
  • an external electrode provided on the first side surface 15 of the laminated component 10 is a first side external electrode 25, and an external electrode provided on the second side surface 16 of the laminated component 10 is a second side external electrode 26
  • An external electrode provided on the first end face 13 of the laminated component 10 is a first end external electrode 23, and an external electrode provided on the second end surface 14 of the laminated component 10 is a second end external electrode 24.
  • the first side external electrode 25 is provided on the first side 15 of the laminated component 10 and extends to the first major surface 11 and the second major surface 12.
  • the second side outer electrode 26 is provided on the second side 16 of the laminated component 10 and extends to the first major surface 11 and the second major surface 12.
  • the first end face external electrode 23 is provided on the first end face 13 of the laminated component 10, extends to the first main surface 11 and the second main surface 12, and has the first side surface 15 and the second side surface. It extends to the side surface 16.
  • the second end face external electrode 24 is provided on the second end face 14 of the laminated component 10, extends to the first main surface 11 and the second main surface 12, and has a first side surface 15 and a second side surface. It extends to the side surface 16.
  • these external electrodes be electrodes formed by applying Ni plating and Sn plating to a base electrode formed by depositing a metal film such as NiCr or NiCu by a method such as sputtering.
  • FIG. 2 is an exploded perspective view of a ceramic portion and a resin portion in the electronic component shown in FIG.
  • the ceramic portion 30 is formed by laminating a plurality of ceramic layers containing a low-temperature sintered ceramic material in the z direction.
  • the ceramic portion 30 comprises a lower layer outer layer portion 31 located in the lowermost layer, an upper layer outer layer portion 32 located in the uppermost layer, and an inner layer portion 33 located between the lower layer outer layer portion 31 and the upper layer outer layer portion 32.
  • the ceramic layers constituting the lower layer outer layer portion 31 and the upper layer outer layer portion 32 are ceramic layers as an insulating layer not provided with the internal electrode layer, and made of a low temperature sintered ceramic material.
  • the ceramic layer constituting the lower layer outer layer portion 31 and the upper layer outer layer portion 32 may be a single layer or a plurality of layers.
  • a barrier layer 70 is provided around the uppermost ceramic layer 36 among the ceramic layers constituting the upper outer layer portion 32. The role, material, formation position, and the like of the barrier layer 70 will be described in detail later.
  • the inner layer portion is formed by alternately laminating ceramic layers 34 and ceramic layers 35.
  • the ceramic layer 34 and the ceramic layer 35 each have an internal electrode layer formed on a ceramic sheet made of a low temperature sintered ceramic material.
  • the internal electrode layer 34a of the ceramic layer 34 has a lead-out portion 34b on the first side
  • the internal electrode layer 35a of the ceramic layer 35 has a lead-out portion 35b on the second side. Since a ceramic sheet made of a low-temperature sintered ceramic material which is a dielectric is sandwiched between the internal electrode layer 34a and the internal electrode layer 35a, a capacitance is generated, and the inner layer portion functions as a capacitor.
  • the lead-out portion 34 b is electrically connected to the first side outer electrode 25, and the lead-out portion 35 b is electrically connected to the second side outer electrode 26.
  • the number of ceramic layers constituting the inner layer portion is not particularly limited.
  • the ceramic portion comprises a low temperature sintered ceramic material.
  • the low-temperature sintered ceramic material means, among ceramic materials, a material which can be sintered at a firing temperature of 1000 ° C. or less and can be co-fired with copper, silver or the like.
  • a low temperature sintered ceramic material for example, a glass composite low temperature sintered ceramic material formed by mixing a borosilicate glass with a ceramic material such as quartz, alumina, forsterite, etc., ZnO-MgO-Al 2 O 3 -SiO 2 system Glass-based low-temperature sintered ceramic material, BaO-Al 2 O 3 -SiO 2 -based ceramic material, Al 2 O 3 -CaO-SiO 2 -MgO-B 2 O 3 -based ceramic material, etc.
  • Non-glass-based low-temperature sintered ceramic materials and the like using The internal electrode layer is preferably made of copper, silver, gold, palladium or an alloy thereof.
  • the resin portion 40 is formed by laminating a resin layer in which a conductor pattern is provided as a coil pattern on a resin insulating layer.
  • a resin layer four layers of a resin layer 41, a resin layer 42, a resin layer 43 and a resin layer 44 are laminated from the bottom.
  • the resin layer 41 is provided with a conductor pattern 41a and a conductor pattern 41b. One end of the conductor pattern 41a is connected to the via hole conductor 41c, and the other end is a lead portion 41e. One end of the conductor pattern 41b is connected to the via hole conductor 41d, and the other end is a lead portion 41f.
  • the resin layer 42 is provided with a conductor pattern 42a and a conductor pattern 42b, one end of the conductor pattern 42a is connected to the conductor pattern 41a via the via hole conductor 41c, and the other end is connected to the via hole conductor 42c .
  • One end of the conductor pattern 42b is connected to the conductor pattern 41b via the via hole conductor 41d, and the other end is connected to the via hole conductor 42d.
  • a conductor pattern 43a and a conductor pattern 43b are provided on the resin layer 43.
  • One end of the conductor pattern 43a is connected to the conductor pattern 42a via the via hole conductor 42c, and the other end is connected to the via hole conductor 43c .
  • One end of the conductor pattern 43b is connected to the conductor pattern 42b via the via hole conductor 42d, and the other end is connected to the via hole conductor 43d.
  • the resin layer 44 is provided with a conductor pattern 44a and a conductor pattern 44b.
  • One end of the conductor pattern 44a is connected to the conductor pattern 43a via the via hole conductor 43c, and the other end is a lead portion 44e.
  • One end of the conductor pattern 44b is connected to the conductor pattern 43b via the via hole conductor 43d, and the other end is a lead portion 44e.
  • the resin portion functions as a coil.
  • the lead portion 41 e is electrically connected to the first end face external electrode 23, and the lead portion 41 f is electrically connected to the second end face external electrode 24.
  • the lead portion 44 e is electrically connected to the first side outer electrode 25. Since the lead-out portion 34 b of the capacitor portion is also electrically connected to the first side external electrode 25, the coil and the capacitor are electrically connected at the first side external electrode 25.
  • the upper layer outer layer portion 45 is provided in the uppermost layer of the resin portion 40, and the upper layer outer layer portion 45 is formed of a resin insulating layer in which a coil pattern is not provided.
  • the upper outer layer portion 45 may be a single resin insulating layer or a plurality of resin insulating layers.
  • the number of layers of the resin layer which comprises a coil is not limited to four layers.
  • Polyimide resin etc. are mentioned as resin which comprises a resin insulating layer.
  • the conductor pattern provided on the resin layer is preferably made of silver, palladium or a silver-palladium alloy.
  • the barrier layer provided at the boundary between the ceramic portion and the resin portion will be described.
  • the case where the barrier layer is not provided and the case where the barrier layer is provided will be described with reference to the drawings in the case of producing an electronic component having a ceramic portion and a resin portion. .
  • 3 (a), 3 (b), 3 (c) and 3 (d) show ceramic parts when it is intended to manufacture an electronic component having a ceramic part and a resin part without providing a barrier layer. It is process drawing which shows typically a mode that peeling arises in the boundary of and the resin part.
  • FIG. 3 (a) when producing the ceramic part, the composite sheet 60 was produced by pressure bonding the constraining sheet 50 on the top layer ceramic green sheet 136 which is formed by laminating the ceramic green sheets and further laminating on the top layer. It shows the situation.
  • FIG. 3A the configuration of the lower layer than the top layer ceramic green sheet 136 is omitted.
  • only one end of the peripheral portion (peripheral portion) of each layer is shown enlarged.
  • the composite is fired at a temperature at which the ceramic green sheet is sintered.
  • the low temperature sintered ceramic material constituting the ceramic green sheet is sintered by firing to form a ceramic portion.
  • the constraining sheet reacts with the top layer ceramic green sheet to form a reaction layer at the boundary between the constraining sheet and the ceramic portion.
  • This reaction layer is a thin and fragile layer (porous layer).
  • the constrained sheet is removed from the fired composite by a process such as sand blasting. Even after removing the constraining sheet, the reaction layer remains thin on the surface of the ceramic part.
  • FIG. 3B schematically shows a state in which the reaction layer 51 is left on the uppermost ceramic layer 36.
  • the resin insulating layer 141 and the conductor layer 142 on the resin insulating layer 141 are provided.
  • a conductor pattern (indicated by reference numeral 41a in FIG. 3D) is formed on the conductor layer 142 by etching using an etching solution.
  • an etching solution an acid etching solution such as nitric acid is used.
  • the etching solution reacts with the reaction layer 51 remaining thinly between the uppermost ceramic layer 36 and the resin insulation layer 141, and the etching solution may enter between the uppermost ceramic layer 36 and the resin insulation layer 141. is there.
  • the resin insulating layer 141 is peeled off from the ceramic layer 36 of the uppermost layer.
  • the base electrode As described above, in a state where the resin insulating layer is peeled from the uppermost ceramic layer, when it is intended to form the base electrode for forming the external electrode by a film forming method such as sputtering, it is hidden by the peeled resin insulating layer. In the place where the base electrode is formed, the base electrode becomes a discontinuous film because film formation is not performed at the place. If the underlying electrode is a discontinuous film, the deposition rate of plating is slowed at the places where the film is not formed during the subsequent plating step, so the external electrode is also discontinuous, and an external electrode of a desired shape is obtained. There is no such thing. Therefore, it becomes difficult to form the external electrode at the portion where the resin layer is peeled off from the surface of the LTCC substrate.
  • FIGS. 4 (a), 4 (b), 4 (c) and 4 (d) schematically show how a barrier layer is provided at the boundary between the ceramic part and the resin part to manufacture the electronic component of the present invention. It is process drawing shown to.
  • FIG. 4A when producing the ceramic part, the barrier layer 70 is provided on the outer periphery of the top layer ceramic green sheet 136, and the constraining sheet 50 is crimped onto the top layer ceramic green sheet 136 to form a composite. It shows how the body 60 is obtained.
  • the peripheral portion peripheral portion of each layer is shown enlarged.
  • the barrier layer is made of a material that does not react with the etchant used to form the conductor pattern, and is a layer for preventing the infiltration of the etchant. By providing the barrier layer, it is possible to prevent the etchant from entering the boundary between the ceramic portion and the resin portion and reacting with the reaction layer.
  • the barrier layer is preferably a material that does not react with the strong acid assumed as an etchant, and is preferably a material that does not react with nitric acid.
  • the barrier layer may also react with the strong acid only slightly.
  • it may be a material which is highly reactive with nitric acid but high in nitric acid resistance.
  • metal materials such as silver and silver palladium alloys can be used. These metal materials do not pass through the etching solution, and can be formed as an electrode by printing on the top layer ceramic green sheet.
  • the material which has glass as a main component means the material whose content of glass is 50 weight% or more.
  • a metal material such as silver or silver-palladium alloy, the surface is densified to exhibit desirable characteristics as a barrier layer.
  • FIG. 4B schematically shows a state in which the reaction layer 51 is left on the uppermost ceramic layer 36 but the reaction layer is not present on the barrier layer 70.
  • the resin insulating layer 141 and the conductor layer 142 on the resin insulating layer 141 are provided.
  • a conductor pattern (indicated by reference numeral 41a in FIG. 4D) is formed on the conductor layer 142 by etching using an etching solution.
  • the barrier layer 70 is provided at the boundary between the ceramic portion and the resin insulating layer and in the portion which is in contact with the etching solution, the etching solution may enter the boundary between the ceramic portion and the resin portion and react with the reaction layer 51 It is prevented and etching liquid is prevented from entering between the ceramic layer 36 of the uppermost layer and the resin insulating layer 141.
  • FIG. 4D shows that the conductor pattern 41a is formed without the resin insulating layer 141 being peeled off from the uppermost ceramic layer 36, and the resin layer 41 is provided.
  • the underlying electrode for forming the external electrode is hidden when it is intended to be formed by a film forming method such as sputtering. Since there are no places, the base electrode does not become a discontinuous film. Therefore, since there is no location where the deposition rate of plating slows down in the subsequent plating step, an external electrode of a desired shape can be obtained.
  • FIGS. 5 (a) and 5 (b) are top views schematically showing examples of barrier layer formation positions when the uppermost layer ceramic green sheet is provided with a barrier layer.
  • the barrier layer may be provided at least at the planned formation position of the external electrode on the periphery of the upper major surface of the topmost ceramic green sheet.
  • FIG. 5A shows an example in which the barrier layer 70 is provided all around the top layer ceramic green sheet 136.
  • FIG. 5 (b) shows an example in which the barrier layer is provided only at the planned formation position of the external electrode in the periphery of the top layer ceramic green sheet 136.
  • the position of the barrier layer 73 corresponds to the position of the first end face external electrode 23, and the position of the barrier layer 74 corresponds to the second end face external electrode 24.
  • the position of the barrier layer 75 corresponds to the position of the first side outer electrode 25, and the position of the barrier layer 76 corresponds to the position of the second side outer electrode 26.
  • the length (length in the x direction) of the barrier layer is the outside intended to be formed. It is preferable to match the length of the electrode (length in the x direction) or to be larger than the length of the external electrode.
  • the resin insulating layer is prevented from being peeled off from the ceramic portion by the etching solution, so when forming an external electrode across the ceramic portion and the resin portion at the position where the barrier layer is formed.
  • the base electrode for forming the external electrode is formed without any problem. Therefore, by forming a barrier layer located under the external electrode at the boundary between the ceramic portion and the resin portion, it is possible to manufacture an electronic component in which the external electrode is formed without any problem.
  • a powder of the low temperature sintered ceramic material is mixed with a binder, a plasticizer and the like to prepare a ceramic slurry, which is formed into a sheet and dried to obtain a ceramic green sheet.
  • a pattern of an internal electrode layer is formed on the ceramic green sheet to be an inner layer portion using a conductive paste by a screen printing method or a photolithography method.
  • the uppermost layer ceramic green sheet to be laminated on the uppermost layer is provided with a barrier layer at a planned formation position of the external electrode around the upper main surface.
  • the barrier layer can be provided by a method of forming a predetermined pattern by a screen printing method or a photolithography method using a conductive paste.
  • a restraint sheet is mounted on the upper and lower sides of a layered product, and a composite is produced by pressure-bonding with a hydrostatic press etc.
  • the constraining sheet is made of a material that does not substantially sinter at the temperature at which the ceramic green sheet sinters, and is preferably made of alumina. In this process, a constraining sheet is placed on the topmost ceramic green sheet.
  • the composite is fired at a temperature at which the ceramic green sheet is sintered and the constraining sheet is not sintered. Then, when the constraining sheet is removed from the fired composite by a process such as sand blasting, a ceramic part is obtained.
  • On the upper main surface of this ceramic portion that is, on the surface of the uppermost ceramic layer of the ceramic layers constituting the ceramic portion, there is a reaction layer generated by the reaction of the constraining sheet and the uppermost layer ceramic green sheet. However, no reaction layer is present at the location where the barrier layer is provided.
  • a resin insulating layer made of polyimide resin or the like is provided on the upper main surface of the ceramic portion, and a conductor layer is provided on the resin insulating layer. At this time, a resin insulating layer is provided on the upper main surface of the ceramic portion, and then a conductor layer is formed on the resin insulating layer.
  • the resin insulating layer can be formed, for example, by photolithography of a photosensitive polyimide resin. Then, a conductor layer made of silver, palladium, a silver-palladium alloy or the like can be formed on the resin insulating layer by a film formation method such as sputtering or vapor deposition.
  • a resin layer (a lowermost resin layer) comprising a layer and a conductor pattern is provided.
  • an electrode serving as a lead-out portion and a via hole conductor is provided at a necessary place.
  • the barrier layer is provided at the planned formation position of the external electrode. Therefore, in the etching step, the etching solution is a portion between the ceramic portion and the resin portion at the position where the barrier layer is provided. It does not infiltrate the boundary. Therefore, the occurrence of peeling between the ceramic portion and the resin insulation layer at the position where the barrier layer is provided is prevented.
  • the formation of the resin insulating layer and the conductor layer, and the formation of the conductor pattern are repeated to form a resin layer by laminating, thereby providing a resin portion.
  • the resin insulating layer is pierced and filled with a conductive material at a portion to be a via hole conductor to form a via hole conductor.
  • a laminated component in which the resin part is formed on the ceramic part is obtained.
  • peeling of the resin insulating layer does not occur at the planned formation position of the external electrode at the boundary between the ceramic portion and the resin portion.
  • An external electrode is formed at the planned formation position of the external electrode for this laminated component, but the external electrode is formed to cross the position where the barrier layer is provided at the boundary between the ceramic portion and the resin portion.
  • the external electrode can be formed by depositing a metal film of NiCr, NiCu or the like by sputtering or the like to form a base electrode, and applying Ni plating and Sn plating on the base electrode. Since peeling does not occur between the ceramic portion and the resin insulating layer at the position where the base electrode is formed, the base electrode does not become a discontinuous film. Therefore, by plating the base electrode, the external electrode can be formed without any problem.

Abstract

An electronic component which is provided with: a ceramic part that contains a low-temperature sintered ceramic material; a resin part that is superposed on the upper main surface of the ceramic part, while being composed of a resin insulating layer and a conductor pattern; and an external electrode that is provided so as to straddle the boundary between the ceramic part and the resin part. This electronic component is characterized in that a barrier layer is provided in a position below the external electrode at the boundary between the ceramic part and the resin part.

Description

電子部品及び電子部品の製造方法Electronic component and method of manufacturing electronic component
本発明は、電子部品及び電子部品の製造方法に関する。 The present invention relates to an electronic component and a method of manufacturing the electronic component.
電子部品として、ＬＴＣＣ（Ｌｏｗ　Ｔｅｍｐｅｒａｔｕｒｅ　Ｃｏ－ｆｉｒｅｄ　Ｃｅｒａｍｉｃｓ：低温焼結セラミック）基板の上に樹脂基板を積層してなる部品が知られている。
このような電子部品として、特許文献１には、ＬＴＣＣ基板がコンデンサ部となり、樹脂基板がコイル部となる電子部品が開示されている。 As an electronic component, there is known a component obtained by laminating a resin substrate on a low temperature co-fired ceramic (LTCC) substrate.
As such an electronic component, Patent Document 1 discloses an electronic component in which an LTCC substrate is a capacitor portion and a resin substrate is a coil portion.
特開２０１１－２３８８３９号公報JP, 2011-238839, A
特許文献１に記載されたような電子部品を製造する場合、ＬＴＣＣ基板を製造した後に、ＬＴＣＣ基板の上に樹脂層及び導体層を設け、導体層に対するパターン形成を行い、さらに上層の樹脂層及び導体層を積層していく方法を採用することがある。 In the case of manufacturing an electronic component as described in Patent Document 1, after the LTCC substrate is manufactured, a resin layer and a conductor layer are provided on the LTCC substrate, pattern formation is performed on the conductor layer, and a resin layer in the upper layer and A method of laminating conductor layers may be adopted.
ＬＴＣＣ基板を製造する際には、ＬＴＣＣ基板の材料となるセラミックグリーンシートに導体層を形成し、導体層を形成したセラミックグリーンシートを積層した積層体を作製する。そして、この積層体の上下に拘束シートを配置し、セラミックグリーンシートが焼結する温度での焼成を行う。 In manufacturing an LTCC substrate, a conductor layer is formed on a ceramic green sheet which is a material of the LTCC substrate, and a laminate in which the ceramic green sheet on which the conductor layer is formed is laminated is manufactured. Then, constraining sheets are disposed above and below the laminate, and firing is performed at a temperature at which the ceramic green sheets sinter.
拘束シートは、セラミックグリーンシートが焼結する温度では実質的に焼結しない無機材料を主成分として含むシートである。
拘束シートは、焼成時において実質的に焼結しないので収縮が生じず、積層体に対して主面方向での収縮を抑制するように作用する。その結果、最終的に得られる電子部品の寸法精度を高めることができる。 The constraining sheet is a sheet containing, as a main component, an inorganic material that does not substantially sinter at a temperature at which the ceramic green sheet sinters.
Since the constraining sheet does not substantially sinter during firing, it does not shrink and acts on the laminate to suppress shrinkage in the main surface direction. As a result, the dimensional accuracy of the finally obtained electronic component can be enhanced.
焼成後、拘束シートはサンドブラスト等の処理によりＬＴＣＣ基板から除去される。
そして、ＬＴＣＣ基板の拘束シートが除去された面に樹脂絶縁層及び導体層を設け、導体層をエッチングすることによりコイル部の導体パターンを形成する。
さらに樹脂絶縁層及び導体層の形成とエッチングによるパターン形成を繰り返すことで、樹脂基板が形成される。
このようにしてＬＴＣＣ基板の上に樹脂基板が設けられたのち、ＬＴＣＣ基板と樹脂基板の境界部を厚さ方向に跨ぐように外部電極を形成することにより電子部品が製造される。 After firing, the constraining sheet is removed from the LTCC substrate by a process such as sand blasting.
Then, a resin insulating layer and a conductor layer are provided on the surface of the LTCC substrate from which the constraining sheet has been removed, and the conductor layer is etched to form a conductor pattern of the coil portion.
Further, the resin substrate is formed by repeating the formation of the resin insulating layer and the conductor layer and the pattern formation by etching.
Thus, after the resin substrate is provided on the LTCC substrate, an electronic component is manufactured by forming an external electrode so as to straddle the boundary between the LTCC substrate and the resin substrate in the thickness direction.
このような工程を経て得られる電子部品において、ＬＴＣＣ基板と樹脂基板の境界部において、樹脂絶縁層がＬＴＣＣ基板の表面から剥がれることがあった。
樹脂絶縁層がＬＴＣＣ基板の表面から剥がれてしまうと、ＬＴＣＣ基板と樹脂基板の境界部を厚さ方向に跨ぐ外部電極を形成する際に、外部電極を形成するための下地電極が形成されにくい。そのため、樹脂絶縁層がＬＴＣＣ基板の表面から剥がれてしまった部位においては外部電極を形成することが難しくなるという問題があった。 In the electronic component obtained through such a process, the resin insulating layer may be peeled off from the surface of the LTCC substrate at the boundary between the LTCC substrate and the resin substrate.
When the resin insulating layer peels off the surface of the LTCC substrate, when forming an external electrode across the boundary between the LTCC substrate and the resin substrate in the thickness direction, a base electrode for forming the external electrode is not easily formed. Therefore, there is a problem that it becomes difficult to form an external electrode at a portion where the resin insulating layer is peeled off from the surface of the LTCC substrate.
本発明は上記の問題を解決するためになされたものであり、ＬＴＣＣ基板とＬＴＣＣ基板上に形成された樹脂絶縁層との間の剥がれが無く、外部電極が問題なく形成されている電子部品を提供することを目的とする。
また、ＬＴＣＣ基板とＬＴＣＣ基板上に形成された樹脂絶縁層との間の剥がれを防止することのできる、電子部品の製造方法を提供することを目的とする。 The present invention has been made to solve the above problems, and there is no peeling between the LTCC substrate and the resin insulating layer formed on the LTCC substrate, and an electronic component in which the external electrode is formed without problems. Intended to be provided.
Another object of the present invention is to provide a method of manufacturing an electronic component capable of preventing peeling between an LTCC substrate and a resin insulating layer formed on the LTCC substrate.
本発明の電子部品は、低温焼結セラミック材料を含むセラミック部と、
上記セラミック部の上側主面に積層された樹脂絶縁層及び導体パターンからなる樹脂部と、
上記セラミック部と上記樹脂部との境界を跨って設けられている外部電極と、を備える電子部品であって、
上記セラミック部と上記樹脂部の境界であって、上記外部電極の下に位置する部位において、バリヤ層が設けられていることを特徴とする。 The electronic component of the present invention comprises a ceramic part comprising a low temperature sintered ceramic material;
A resin portion comprising a resin insulating layer and a conductor pattern laminated on the upper major surface of the ceramic portion;
It is an electronic component provided with the external electrode provided straddling the boundary of the said ceramic part and the said resin part, Comprising:
A barrier layer is provided at a portion of the boundary between the ceramic portion and the resin portion and located below the external electrode.
本発明の電子部品において、上記バリヤ層は銀電極又は銀パラジウム合金電極であることが好ましい。 In the electronic component of the present invention, the barrier layer is preferably a silver electrode or a silver-palladium alloy electrode.
本発明の電子部品において、上記バリヤ層はガラスを主成分として含むことが好ましい。 In the electronic component of the present invention, the barrier layer preferably contains glass as a main component.
本発明の電子部品の製造方法は、
低温焼結セラミック材料の原料を含むセラミックグリーンシートを準備する工程と、
上記セラミックグリーンシートのうち、最上層に積層する最上層セラミックグリーンシートの上側主面の周囲の、外部電極の形成予定位置にバリヤ層を設ける工程と、
上記セラミックグリーンシートを積層し、上記最上層セラミックグリーンシートの上側主面に、上記セラミックグリーンシートが焼結する温度では実質的に焼結しない拘束シートを載置して圧着することにより複合体を作製する工程と、
上記セラミックグリーンシートが焼結し、上記拘束シートが焼結しない温度で、上記複合体を焼成する工程と、
焼成後の上記複合体から上記拘束シートを除去してセラミック部を得る工程と、
上記セラミック部の上側主面に樹脂絶縁層を設け、上記樹脂絶縁層上に導体層を設ける工程と、
上記導体層に対してエッチング液を用いたエッチングを行って導体パターンを形成することによって、上記樹脂絶縁層及び上記導体パターンからなる樹脂部を設けるエッチング工程と、
上記セラミック部と上記樹脂部との境界において上記バリヤ層を設けた位置を跨ぐように外部電極を形成する工程とを行うことを特徴とする。 The method of manufacturing an electronic component of the present invention is
Preparing a ceramic green sheet containing a raw material of a low temperature sintered ceramic material;
Providing a barrier layer at a planned formation position of an external electrode around the upper major surface of the uppermost ceramic green sheet to be laminated on the uppermost layer among the ceramic green sheets;
The composite is obtained by laminating the ceramic green sheets and placing a compression sheet, which does not substantially sinter at the temperature at which the ceramic green sheets sinter, onto the upper major surface of the topmost ceramic green sheet and pressing the composite. A process of producing
Firing the composite at a temperature at which the ceramic green sheet is sintered and the constraining sheet is not sintered;
Removing the constraining sheet from the composite after firing to obtain a ceramic part;
Providing a resin insulation layer on the upper major surface of the ceramic part and providing a conductor layer on the resin insulation layer;
Etching the conductive layer using an etching solution to form a conductive pattern, thereby providing a resin portion comprising the resin insulating layer and the conductive pattern;
And forming an external electrode across the position where the barrier layer is provided at the boundary between the ceramic portion and the resin portion.
本発明によれば、ＬＴＣＣ基板とＬＴＣＣ基板上に形成された樹脂絶縁層との間の剥がれが無く、外部電極が問題なく形成されている電子部品を提供することができる。
また、ＬＴＣＣ基板とＬＴＣＣ基板上に形成された樹脂絶縁層との間の剥がれを防止することのできる、電子部品の製造方法を提供することができる。 According to the present invention, it is possible to provide an electronic component in which there is no peeling between the LTCC substrate and the resin insulating layer formed on the LTCC substrate, and the external electrode is formed without any problem.
Moreover, the manufacturing method of the electronic component which can prevent peeling between the LTCC board | substrate and the resin insulating layer formed on the LTCC board | substrate can be provided.
図１は、本発明の一実施形態に係る電子部品の一例を模式的に示す斜視図である。FIG. 1 is a perspective view schematically showing an example of an electronic component according to an embodiment of the present invention. 図２は、図１に示す電子部品におけるセラミック部及び樹脂部の分解斜視図である。FIG. 2 is an exploded perspective view of a ceramic portion and a resin portion in the electronic component shown in FIG. 図３（ａ）、図３（ｂ）、図３（ｃ）及び図３（ｄ）は、バリヤ層を設けずにセラミック部と樹脂部とを備える電子部品を製造しようとした場合にセラミック部と樹脂部の境界に剥がれが生じる様子を模式的に示す工程図である。3 (a), 3 (b), 3 (c) and 3 (d) show ceramic parts when it is intended to manufacture an electronic component having a ceramic part and a resin part without providing a barrier layer. It is process drawing which shows typically a mode that peeling arises in the boundary of and the resin part. 図４（ａ）、図４（ｂ）、図４（ｃ）及び図４（ｄ）は、セラミック部と樹脂部の境界にバリヤ層を設けて本発明の電子部品を製造する様子を模式的に示す工程図である。FIGS. 4 (a), 4 (b), 4 (c) and 4 (d) schematically show how a barrier layer is provided at the boundary between the ceramic part and the resin part to manufacture the electronic component of the present invention. It is process drawing shown to. 図５（ａ）及び図５（ｂ）は、最上層セラミックグリーンシートにバリヤ層を設ける際のバリヤ層形成位置の例を模式的に示す上面図である。FIGS. 5 (a) and 5 (b) are top views schematically showing examples of barrier layer formation positions when the barrier layer is provided on the top layer ceramic green sheet.
以下、本発明の電子部品について説明する。
しかしながら、本発明は、以下の構成に限定されるものではなく、本発明の要旨を変更しない範囲において適宜変更して適用することができる。なお、以下において記載する本発明の個々の望ましい構成を２つ以上組み合わせたものもまた本発明である。 Hereinafter, the electronic component of the present invention will be described.
However, the present invention is not limited to the following configurations, and can be appropriately modified and applied without departing from the scope of the present invention. In addition, what combined two or more each desired structure of this invention described below is also this invention.
図１は、本発明の一実施形態に係る電子部品の一例を模式的に示す斜視図である。
図１に示す電子部品１は、セラミック部３０の上に樹脂部４０が積層されてなり、セラミック部３０と樹脂部４０の境界(２点鎖線Ｍで示す）を跨って外部電極（第１端面外部電極２３、第２端面外部電極２４、第１側面外部電極２５及び第２側面外部電極２６）が形成されている。 FIG. 1 is a perspective view schematically showing an example of an electronic component according to an embodiment of the present invention.
In the electronic component 1 shown in FIG. 1, the resin portion 40 is stacked on the ceramic portion 30, and the external electrode (first end face) straddles the boundary between the ceramic portion 30 and the resin portion 40 (indicated by a two-dot chain line M). An external electrode 23, a second end face external electrode 24, a first side face external electrode 25, and a second side face external electrode 26) are formed.
電子部品１は全体として略直方体形状である。
電子部品１から外部電極を除いた、セラミック部３０及び樹脂部４０からなる積層部品１０を考えたときに、積層部品１０は長さ方向（ｘ方向）に相対する第１の端面１３及び第２の端面１４と、長さ方向に直交する高さ方向（ｚ方向）に相対する第１の主面１１及び第２の主面１２と、長さ方向及び高さ方向に直交する幅方向（ｙ方向）に相対する第１の側面１５及び第２の側面１６とを有する。
外部電極のうち、積層部品１０の第１の側面１５に設けられた外部電極が第１側面外部電極２５、積層部品１０の第２の側面１６に設けられた外部電極が第２側面外部電極２６、積層部品１０の第１の端面１３に設けられた外部電極が第１端面外部電極２３、積層部品１０の第２の端面１４に設けられた外部電極が第２端面外部電極２４である。 The electronic component 1 has a substantially rectangular parallelepiped shape as a whole.
When considering the laminated component 10 including the ceramic portion 30 and the resin portion 40 excluding the external electrode from the electronic component 1, the laminated component 10 has the first end surface 13 and the second end surface 13 opposite to each other in the length direction (x direction) And the first main surface 11 and the second main surface 12 opposite to the height direction (z direction) orthogonal to the length direction, and the width direction (y The first side 15 and the second side 16 opposite to the direction).
Among the external electrodes, an external electrode provided on the first side surface 15 of the laminated component 10 is a first side external electrode 25, and an external electrode provided on the second side surface 16 of the laminated component 10 is a second side external electrode 26 An external electrode provided on the first end face 13 of the laminated component 10 is a first end external electrode 23, and an external electrode provided on the second end surface 14 of the laminated component 10 is a second end external electrode 24.
これらの外部電極はいずれも、セラミック部３０と樹脂部４０の境界(２点鎖線Ｍで示す）を跨って設けられている。
第１側面外部電極２５は、積層部品１０の第１の側面１５に設けられ、第１の主面１１及び第２の主面１２に延びている。
第２側面外部電極２６は、積層部品１０の第２の側面１６に設けられ、第１の主面１１及び第２の主面１２に延びている。
第１端面外部電極２３は、積層部品１０の第１の端面１３に設けられ、第１の主面１１及び第２の主面１２に延びており、かつ、第１の側面１５及び第２の側面１６に延びている。
第２端面外部電極２４は、積層部品１０の第２の端面１４に設けられ、第１の主面１１及び第２の主面１２に延びており、かつ、第１の側面１５及び第２の側面１６に延びている。
また、これらの外部電極はＮｉＣｒ、ＮｉＣｕ等の金属膜をスパッタリング等の方法で成膜して形成した下地電極に、Ｎｉめっき及びＳｎめっきを施して形成された電極であることが好ましい。 All of these external electrodes are provided across the boundary between the ceramic portion 30 and the resin portion 40 (indicated by a two-dot chain line M).
The first side external electrode 25 is provided on the first side 15 of the laminated component 10 and extends to the first major surface 11 and the second major surface 12.
The second side outer electrode 26 is provided on the second side 16 of the laminated component 10 and extends to the first major surface 11 and the second major surface 12.
The first end face external electrode 23 is provided on the first end face 13 of the laminated component 10, extends to the first main surface 11 and the second main surface 12, and has the first side surface 15 and the second side surface. It extends to the side surface 16.
The second end face external electrode 24 is provided on the second end face 14 of the laminated component 10, extends to the first main surface 11 and the second main surface 12, and has a first side surface 15 and a second side surface. It extends to the side surface 16.
In addition, it is preferable that these external electrodes be electrodes formed by applying Ni plating and Sn plating to a base electrode formed by depositing a metal film such as NiCr or NiCu by a method such as sputtering.
図２は、図１に示す電子部品におけるセラミック部及び樹脂部の分解斜視図である。
セラミック部３０は、低温焼結セラミック材料を含むセラミック層がｚ方向に複数層積層されてなる。
セラミック部３０は、最下層に位置する下層外層部３１、最上層に位置する上層外層部３２と、下層外層部３１及び上層外層部３２の間に位置する内層部３３からなる。
下層外層部３１及び上層外層部３２を構成するセラミック層は内部電極層が設けられていない、絶縁層としてのセラミック層であり、低温焼結セラミック材料からなる。
下層外層部３１及び上層外層部３２を構成するセラミック層は１層であっても複数層であってもよい。
上層外層部３２を構成するセラミック層のうち最上層のセラミック層３６には、その周囲にバリヤ層７０が設けられている。バリヤ層７０の役割、材質、形成位置等については後で詳しく説明する。 FIG. 2 is an exploded perspective view of a ceramic portion and a resin portion in the electronic component shown in FIG.
The ceramic portion 30 is formed by laminating a plurality of ceramic layers containing a low-temperature sintered ceramic material in the z direction.
The ceramic portion 30 comprises a lower layer outer layer portion 31 located in the lowermost layer, an upper layer outer layer portion 32 located in the uppermost layer, and an inner layer portion 33 located between the lower layer outer layer portion 31 and the upper layer outer layer portion 32.
The ceramic layers constituting the lower layer outer layer portion 31 and the upper layer outer layer portion 32 are ceramic layers as an insulating layer not provided with the internal electrode layer, and made of a low temperature sintered ceramic material.
The ceramic layer constituting the lower layer outer layer portion 31 and the upper layer outer layer portion 32 may be a single layer or a plurality of layers.
A barrier layer 70 is provided around the uppermost ceramic layer 36 among the ceramic layers constituting the upper outer layer portion 32. The role, material, formation position, and the like of the barrier layer 70 will be described in detail later.
内層部は、セラミック層３４とセラミック層３５が交互に積層されてなる。セラミック層３４とセラミック層３５は、いずれも低温焼結セラミック材料からなるセラミックシートの上に形成された内部電極層を有する。
セラミック層３４の有する内部電極層３４ａは第１の側面側に引出部３４ｂを有し、セラミック層３５の有する内部電極層３５ａは第２の側面側に引出部３５ｂを有する。内部電極層３４ａと内部電極層３５ａの間には誘電体である低温焼結セラミック材料からなるセラミックシートが挟まっているため、静電容量が発生し、内層部がコンデンサとして機能する。引出部３４ｂは第１側面外部電極２５に電気的に接続され、引出部３５ｂは第２側面外部電極２６に電気的に接続される。
内層部を構成するセラミック層の層数は特に限定されるものではない。 The inner layer portion is formed by alternately laminating ceramic layers 34 and ceramic layers 35. The ceramic layer 34 and the ceramic layer 35 each have an internal electrode layer formed on a ceramic sheet made of a low temperature sintered ceramic material.
The internal electrode layer 34a of the ceramic layer 34 has a lead-out portion 34b on the first side, and the internal electrode layer 35a of the ceramic layer 35 has a lead-out portion 35b on the second side. Since a ceramic sheet made of a low-temperature sintered ceramic material which is a dielectric is sandwiched between the internal electrode layer 34a and the internal electrode layer 35a, a capacitance is generated, and the inner layer portion functions as a capacitor. The lead-out portion 34 b is electrically connected to the first side outer electrode 25, and the lead-out portion 35 b is electrically connected to the second side outer electrode 26.
The number of ceramic layers constituting the inner layer portion is not particularly limited.
セラミック部は、低温焼結セラミック材料を含む。
低温焼結セラミック材料とは、セラミック材料のうち、１０００℃以下の焼成温度で焼結可能であり、銅や銀等との同時焼成が可能である材料を意味する。 The ceramic portion comprises a low temperature sintered ceramic material.
The low-temperature sintered ceramic material means, among ceramic materials, a material which can be sintered at a firing temperature of 1000 ° C. or less and can be co-fired with copper, silver or the like.
低温焼結セラミック材料としては、例えば、クオーツやアルミナ、フォルステライト等のセラミック材料にホウ珪酸ガラスを混合してなるガラス複合系低温焼結セラミック材料、ＺｎＯ－ＭｇＯ－Ａｌ２Ｏ３－ＳｉＯ２系の結晶化ガラスを用いた結晶化ガラス系低温焼結セラミック材料、ＢａＯ－Ａｌ２Ｏ３－ＳｉＯ２系セラミック材料やＡｌ２Ｏ３－ＣａＯ－ＳｉＯ２－ＭｇＯ－Ｂ２Ｏ３系セラミック材料等を用いた非ガラス系低温焼結セラミック材料等が挙げられる。
内部電極層は、銅、銀、金、パラジウムやこれらの合金からなることが好ましい。 As a low temperature sintered ceramic material, for example, a glass composite low temperature sintered ceramic material formed by mixing a borosilicate glass with a ceramic material such as quartz, alumina, forsterite, etc., ZnO-MgO-Al 2 O 3 -SiO 2 system Glass-based low-temperature sintered ceramic material, BaO-Al 2 O 3 -SiO 2 -based ceramic material, Al 2 O 3 -CaO-SiO 2 -MgO-B 2 O 3 -based ceramic material, etc. Non-glass-based low-temperature sintered ceramic materials and the like using
The internal electrode layer is preferably made of copper, silver, gold, palladium or an alloy thereof.
樹脂部４０は、樹脂絶縁層の上に導体パターンがコイルパターンとして設けられた樹脂層が積層されてなる。樹脂層として下から樹脂層４１、樹脂層４２、樹脂層４３及び樹脂層４４の４層が積層されている。 The resin portion 40 is formed by laminating a resin layer in which a conductor pattern is provided as a coil pattern on a resin insulating layer. As the resin layer, four layers of a resin layer 41, a resin layer 42, a resin layer 43 and a resin layer 44 are laminated from the bottom.
樹脂層４１には導体パターン４１ａ及び導体パターン４１ｂが設けられており、導体パターン４１ａは一端がビアホール導体４１ｃと接続され他端が引出部４１ｅとなっている。導体パターン４１ｂは一端がビアホール導体４１ｄと接続され他端が引出部４１ｆとなっている。 The resin layer 41 is provided with a conductor pattern 41a and a conductor pattern 41b. One end of the conductor pattern 41a is connected to the via hole conductor 41c, and the other end is a lead portion 41e. One end of the conductor pattern 41b is connected to the via hole conductor 41d, and the other end is a lead portion 41f.
樹脂層４２には導体パターン４２ａ及び導体パターン４２ｂが設けられており、導体パターン４２ａは一端がビアホール導体４１ｃを介して導体パターン４１ａと接続されており、他端がビアホール導体４２ｃと接続されている。導体パターン４２ｂは一端がビアホール導体４１ｄを介して導体パターン４１ｂと接続されており、他端がビアホール導体４２ｄと接続されている。 The resin layer 42 is provided with a conductor pattern 42a and a conductor pattern 42b, one end of the conductor pattern 42a is connected to the conductor pattern 41a via the via hole conductor 41c, and the other end is connected to the via hole conductor 42c . One end of the conductor pattern 42b is connected to the conductor pattern 41b via the via hole conductor 41d, and the other end is connected to the via hole conductor 42d.
樹脂層４３には導体パターン４３ａ及び導体パターン４３ｂが設けられており、導体パターン４３ａは一端がビアホール導体４２ｃを介して導体パターン４２ａと接続されており、他端がビアホール導体４３ｃと接続されている。導体パターン４３ｂは一端がビアホール導体４２ｄを介して導体パターン４２ｂと接続されており、他端がビアホール導体４３ｄと接続されている。 A conductor pattern 43a and a conductor pattern 43b are provided on the resin layer 43. One end of the conductor pattern 43a is connected to the conductor pattern 42a via the via hole conductor 42c, and the other end is connected to the via hole conductor 43c . One end of the conductor pattern 43b is connected to the conductor pattern 42b via the via hole conductor 42d, and the other end is connected to the via hole conductor 43d.
樹脂層４４には導体パターン４４ａ及び導体パターン４４ｂが設けられており、導体パターン４４ａは一端がビアホール導体４３ｃを介して導体パターン４３ａと接続されており、他端が引出部４４ｅとなっている。導体パターン４４ｂは一端がビアホール導体４３ｄを介して導体パターン４３ｂと接続されており、他端が引出部４４ｅとなっている。 The resin layer 44 is provided with a conductor pattern 44a and a conductor pattern 44b. One end of the conductor pattern 44a is connected to the conductor pattern 43a via the via hole conductor 43c, and the other end is a lead portion 44e. One end of the conductor pattern 44b is connected to the conductor pattern 43b via the via hole conductor 43d, and the other end is a lead portion 44e.
各樹脂層における導体パターンはコイルパターンとなっているため、樹脂部がコイルとして機能する。
引出部４１ｅは第１端面外部電極２３に電気的に接続され、引出部４１ｆは第２端面外部電極２４に電気的に接続される。
引出部４４ｅは第１側面外部電極２５に電気的に接続される。
第１側面外部電極２５にはコンデンサ部における引出部３４ｂも電気的に接続されているため、第１側面外部電極２５でコイルとコンデンサが電気的に接続されることになる。 Since the conductor pattern in each resin layer is a coil pattern, the resin portion functions as a coil.
The lead portion 41 e is electrically connected to the first end face external electrode 23, and the lead portion 41 f is electrically connected to the second end face external electrode 24.
The lead portion 44 e is electrically connected to the first side outer electrode 25.
Since the lead-out portion 34 b of the capacitor portion is also electrically connected to the first side external electrode 25, the coil and the capacitor are electrically connected at the first side external electrode 25.
樹脂部４０の最上層には、上層外層部４５が設けられており、上層外層部４５はコイルパターンが設けられていない樹脂絶縁層からなる。上層外層部４５は１層の樹脂絶縁層であっても複数層の樹脂絶縁層であってもよい。 The upper layer outer layer portion 45 is provided in the uppermost layer of the resin portion 40, and the upper layer outer layer portion 45 is formed of a resin insulating layer in which a coil pattern is not provided. The upper outer layer portion 45 may be a single resin insulating layer or a plurality of resin insulating layers.
なお、ここまで樹脂部として４層の樹脂層によりコイルが構成された例を示したが、コイルを構成する樹脂層の層数は４層に限定されるものではない。 In addition, although the example in which the coil was comprised by the resin layer of 4 layers as a resin part so far was shown, the number of layers of the resin layer which comprises a coil is not limited to four layers.
樹脂絶縁層を構成する樹脂としては、ポリイミド樹脂等が挙げられる。
樹脂層に設けられる導体パターンは、銀、パラジウム又は銀パラジウム合金からなることが好ましい。 Polyimide resin etc. are mentioned as resin which comprises a resin insulating layer.
The conductor pattern provided on the resin layer is preferably made of silver, palladium or a silver-palladium alloy.
続いて、セラミック部と樹脂部の境界に設けられるバリヤ層について説明する。
バリヤ層の役割を説明するために、セラミック部と樹脂部とを備える電子部品を製造する場合にバリヤ層を設けない場合とバリヤ層を設けた場合を対比して、図面を参照して説明する。 Subsequently, the barrier layer provided at the boundary between the ceramic portion and the resin portion will be described.
In order to explain the role of the barrier layer, the case where the barrier layer is not provided and the case where the barrier layer is provided will be described with reference to the drawings in the case of producing an electronic component having a ceramic portion and a resin portion. .
図３（ａ）、図３（ｂ）、図３（ｃ）及び図３（ｄ）は、バリヤ層を設けずにセラミック部と樹脂部とを備える電子部品を製造しようとした場合にセラミック部と樹脂部の境界に剥がれが生じる様子を模式的に示す工程図である。
図３（ａ）は、セラミック部を作製する際に、セラミックグリーンシートを積層し、さらに最上層に積層する最上層セラミックグリーンシート１３６の上に拘束シート５０を圧着して複合体６０を作製した様子を示している。
図３（ａ）には最上層セラミックグリーンシート１３６より下層の構成は省略している。
また、以下の各図面には各層の周辺部（外周部）の一端のみを拡大して示している。 3 (a), 3 (b), 3 (c) and 3 (d) show ceramic parts when it is intended to manufacture an electronic component having a ceramic part and a resin part without providing a barrier layer. It is process drawing which shows typically a mode that peeling arises in the boundary of and the resin part.
In FIG. 3 (a), when producing the ceramic part, the composite sheet 60 was produced by pressure bonding the constraining sheet 50 on the top layer ceramic green sheet 136 which is formed by laminating the ceramic green sheets and further laminating on the top layer. It shows the situation.
In FIG. 3A, the configuration of the lower layer than the top layer ceramic green sheet 136 is omitted.
In each of the following drawings, only one end of the peripheral portion (peripheral portion) of each layer is shown enlarged.
続いて、この複合体に対し、セラミックグリーンシートが焼結する温度での焼成を行う。焼成によりセラミックグリーンシートを構成する低温焼結セラミック材料が焼結してセラミック部となる。焼成の際に、拘束シートは最上層セラミックグリーンシートと反応して、拘束シートとセラミック部との境界部分に反応層が形成される。この反応層は、薄くて脆い層（ポーラスな層）である。
次に、焼成後の複合体からサンドブラスト等の処理により拘束シートを除去する。
拘束シートを除去した後にも、反応層はセラミック部の表面に薄く残った状態となる。
図３（ｂ）には最上層のセラミック層３６の上に反応層５１が残った状態を模式的に示している。 Subsequently, the composite is fired at a temperature at which the ceramic green sheet is sintered. The low temperature sintered ceramic material constituting the ceramic green sheet is sintered by firing to form a ceramic portion. During firing, the constraining sheet reacts with the top layer ceramic green sheet to form a reaction layer at the boundary between the constraining sheet and the ceramic portion. This reaction layer is a thin and fragile layer (porous layer).
Next, the constrained sheet is removed from the fired composite by a process such as sand blasting.
Even after removing the constraining sheet, the reaction layer remains thin on the surface of the ceramic part.
FIG. 3B schematically shows a state in which the reaction layer 51 is left on the uppermost ceramic layer 36.
続いて、図３（ｃ）に示すように、樹脂絶縁層１４１及び樹脂絶縁層１４１上の導体層１４２を設ける。
そして、導体層１４２に対してエッチング液を用いたエッチングを用いて導体パターン（図３（ｄ）に参照符号４１ａで示す）を形成する。
エッチング液としては硝酸等の酸エッチング液が用いられる。
このエッチング液は、最上層のセラミック層３６と樹脂絶縁層１４１の間に薄く残っている反応層５１と反応し、エッチング液が最上層のセラミック層３６と樹脂絶縁層１４１の間に入り込むことがある。
すると、図３（ｄ）に示すように、樹脂絶縁層１４１が最上層のセラミック層３６から剥がれてしまう。 Subsequently, as shown in FIG. 3C, the resin insulating layer 141 and the conductor layer 142 on the resin insulating layer 141 are provided.
Then, a conductor pattern (indicated by reference numeral 41a in FIG. 3D) is formed on the conductor layer 142 by etching using an etching solution.
As an etching solution, an acid etching solution such as nitric acid is used.
The etching solution reacts with the reaction layer 51 remaining thinly between the uppermost ceramic layer 36 and the resin insulation layer 141, and the etching solution may enter between the uppermost ceramic layer 36 and the resin insulation layer 141. is there.
Then, as shown in FIG. 3D, the resin insulating layer 141 is peeled off from the ceramic layer 36 of the uppermost layer.
このように樹脂絶縁層が最上層のセラミック層から剥がれた状態では、外部電極を形成するための下地電極をスパッタリング等の成膜方法により形成しようとした場合に、剥がれた樹脂絶縁層により隠れてしまう箇所が生じて、その箇所には成膜がされないため、下地電極が不連続な膜となる。
下地電極が不連続な膜であるとその後のめっき工程の際に膜が形成されていない箇所でめっきの析出速度が遅くなるので外部電極も不連続になり、所望の形状の外部電極が得られないことがある。
そのため、樹脂層がＬＴＣＣ基板の表面から剥がれてしまった部位においては外部電極を形成することが難しくなる。 As described above, in a state where the resin insulating layer is peeled from the uppermost ceramic layer, when it is intended to form the base electrode for forming the external electrode by a film forming method such as sputtering, it is hidden by the peeled resin insulating layer. In the place where the base electrode is formed, the base electrode becomes a discontinuous film because film formation is not performed at the place.
If the underlying electrode is a discontinuous film, the deposition rate of plating is slowed at the places where the film is not formed during the subsequent plating step, so the external electrode is also discontinuous, and an external electrode of a desired shape is obtained. There is no such thing.
Therefore, it becomes difficult to form the external electrode at the portion where the resin layer is peeled off from the surface of the LTCC substrate.
一方、本発明の電子部品ではセラミック部と樹脂部の境界にバリヤ層が設けられているため、樹脂絶縁層が最上層のセラミック層から剥離することが防止される。
図４（ａ）、図４（ｂ）、図４（ｃ）及び図４（ｄ）は、セラミック部と樹脂部の境界にバリヤ層を設けて本発明の電子部品を製造する様子を模式的に示す工程図である。
図４（ａ）は、セラミック部を作製する際に、最上層セラミックグリーンシート１３６の外周部にバリヤ層７０を設けておき、最上層セラミックグリーンシート１３６の上に拘束シート５０を圧着して複合体６０を得た様子を示している。
なお、以下の各図面には各層の周辺部（外周部）の一端のみを拡大して示している。 On the other hand, in the electronic component of the present invention, since the barrier layer is provided at the boundary between the ceramic portion and the resin portion, peeling of the resin insulating layer from the uppermost ceramic layer is prevented.
FIGS. 4 (a), 4 (b), 4 (c) and 4 (d) schematically show how a barrier layer is provided at the boundary between the ceramic part and the resin part to manufacture the electronic component of the present invention. It is process drawing shown to.
In FIG. 4A, when producing the ceramic part, the barrier layer 70 is provided on the outer periphery of the top layer ceramic green sheet 136, and the constraining sheet 50 is crimped onto the top layer ceramic green sheet 136 to form a composite. It shows how the body 60 is obtained.
In each of the following drawings, only one end of the peripheral portion (peripheral portion) of each layer is shown enlarged.
バリヤ層は、導体パターンの形成に用いられるエッチング液と反応しない材料からなり、エッチング液の浸入を防止するための層である。
バリヤ層を設けることにより、エッチング液がセラミック部と樹脂部の境界に浸入して反応層と反応することを防止することができる。 The barrier layer is made of a material that does not react with the etchant used to form the conductor pattern, and is a layer for preventing the infiltration of the etchant.
By providing the barrier layer, it is possible to prevent the etchant from entering the boundary between the ceramic portion and the resin portion and reacting with the reaction layer.
バリヤ層は、エッチング液として想定される強酸と反応しない材料であることが好ましく、硝酸と反応しない材料であることが好ましい。なお、バリヤ層が少しだけ強酸と反応してもよい。また、硝酸と少しだけ反応するものの耐硝酸性が高いといえる材料であってもよい。
具体的には、銀、銀パラジウム合金といった金属材料を使用することができる。これらの金属材料はエッチング液を通すことがなく、また、最上層セラミックグリーンシートに印刷することにより電極として形成することができる。
また、ガラスを主成分として含む材料であることも好ましい。ガラスを主成分とすると、ダイシング時にダレが発生したり、ダイシング刃の側面にバリヤ層が付着することが防止される。なお、ガラスを主成分として含む材料とは、ガラスの含有量が５０重量％以上である材料を意味する。
また、銀、銀パラジウム合金といった金属材料は表面をブラスト処理することで表面が緻密化されて、バリヤ層として好ましい特性を発揮することができる。 The barrier layer is preferably a material that does not react with the strong acid assumed as an etchant, and is preferably a material that does not react with nitric acid. The barrier layer may also react with the strong acid only slightly. In addition, it may be a material which is highly reactive with nitric acid but high in nitric acid resistance.
Specifically, metal materials such as silver and silver palladium alloys can be used. These metal materials do not pass through the etching solution, and can be formed as an electrode by printing on the top layer ceramic green sheet.
Moreover, it is also preferable that it is a material which contains glass as a main component. When glass is used as the main component, the occurrence of sagging during dicing and the adhesion of the barrier layer to the side surfaces of the dicing blade are prevented. In addition, the material which has glass as a main component means the material whose content of glass is 50 weight% or more.
In addition, by blasting the surface of a metal material such as silver or silver-palladium alloy, the surface is densified to exhibit desirable characteristics as a barrier layer.
続いて、この複合体に対し、セラミックグリーンシートが焼結する温度での焼成を行うと、セラミック部が形成され、拘束シートとセラミック部との境界部分に反応層が形成される。但し、バリヤ層が形成されている部分では拘束シートとセラミックグリーンシートは反応しないので反応層が形成されない。
次に、焼成後の複合体からサンドブラスト等の処理により拘束シートを除去する。
拘束シートを除去した後にも、バリヤ層が形成されている部分以外では、反応層はセラミック部の表面に薄く残った状態となる。
図４（ｂ）には最上層のセラミック層３６の上に反応層５１が残っているが、バリヤ層７０の上には反応層が存在していない状態を模式的に示している。 Subsequently, when the composite is fired at a temperature at which the ceramic green sheet is sintered, a ceramic portion is formed, and a reaction layer is formed at the boundary between the constraining sheet and the ceramic portion. However, since the constraining sheet and the ceramic green sheet do not react in the portion where the barrier layer is formed, the reaction layer is not formed.
Next, the constrained sheet is removed from the fired composite by a process such as sand blasting.
Even after removing the constraining sheet, the reaction layer remains thin on the surface of the ceramic portion except for the portion where the barrier layer is formed.
FIG. 4B schematically shows a state in which the reaction layer 51 is left on the uppermost ceramic layer 36 but the reaction layer is not present on the barrier layer 70.
続いて、図４（ｃ）に示すように、樹脂絶縁層１４１及び樹脂絶縁層１４１上の導体層１４２を設ける。
そして、導体層１４２に対してエッチング液を用いたエッチングを用いて導体パターン（図４（ｄ）に参照符号４１ａで示す）を形成する。
セラミック部と樹脂絶縁層の境界であって、エッチング液が触れる部位にバリヤ層７０が設けられていると、エッチング液がセラミック部と樹脂部の境界に浸入して反応層５１と反応することが防止され、かつ、エッチング液が最上層のセラミック層３６と樹脂絶縁層１４１の間に入り込むことが防止される。そのため、エッチング液を使用した後にも樹脂絶縁層１４１が最上層のセラミック層３６から剥がれることが防止される。
図４（ｄ）には樹脂絶縁層１４１が最上層のセラミック層３６から剥がれることなく導体パターン４１ａが形成され、樹脂層４１が設けられた様子を示している。 Subsequently, as shown in FIG. 4C, the resin insulating layer 141 and the conductor layer 142 on the resin insulating layer 141 are provided.
Then, a conductor pattern (indicated by reference numeral 41a in FIG. 4D) is formed on the conductor layer 142 by etching using an etching solution.
When the barrier layer 70 is provided at the boundary between the ceramic portion and the resin insulating layer and in the portion which is in contact with the etching solution, the etching solution may enter the boundary between the ceramic portion and the resin portion and react with the reaction layer 51 It is prevented and etching liquid is prevented from entering between the ceramic layer 36 of the uppermost layer and the resin insulating layer 141. Therefore, the resin insulating layer 141 is prevented from being peeled off from the uppermost ceramic layer 36 even after using the etching solution.
FIG. 4D shows that the conductor pattern 41a is formed without the resin insulating layer 141 being peeled off from the uppermost ceramic layer 36, and the resin layer 41 is provided.
このように樹脂絶縁層が最上層のセラミック層から剥がれることなく導体パターンを形成できた場合、外部電極を形成するための下地電極をスパッタリング等の成膜方法により形成しようとした場合に隠れてしまう箇所がないので、下地電極が不連続な膜となることはない。
従って、その後のめっき工程の際にめっきの析出速度が遅くなる箇所も生じないので所望の形状の外部電極が得られる。 As described above, when the conductor pattern can be formed without peeling the resin insulating layer from the uppermost ceramic layer, the underlying electrode for forming the external electrode is hidden when it is intended to be formed by a film forming method such as sputtering. Since there are no places, the base electrode does not become a discontinuous film.
Therefore, since there is no location where the deposition rate of plating slows down in the subsequent plating step, an external electrode of a desired shape can be obtained.
図５（ａ）及び図５（ｂ）は、最上層セラミックグリーンシートにバリヤ層を設ける際のバリヤ層形成位置の例を模式的に示す上面図である。
バリヤ層は、最上層セラミックグリーンシートの上側主面の周囲のうち、外部電極の形成予定位置に少なくとも設けられていればよい。
図５（ａ）には最上層セラミックグリーンシート１３６の周囲全体にバリヤ層７０を設けた例を示している。
一方、図５（ｂ）には最上層セラミックグリーンシート１３６の周囲のうち、外部電極の形成予定位置にのみバリヤ層を設けた例を示している。
バリヤ層の位置と図１に示す各外部電極の位置の対応を示すと、バリヤ層７３の位置は第１端面外部電極２３の位置に対応し、バリヤ層７４の位置は第２端面外部電極２４の位置に対応し、バリヤ層７５の位置は第１側面外部電極２５の位置に対応し、バリヤ層７６の位置は第２側面外部電極２６の位置に対応している。
なお、バリヤ層７５及びバリヤ層７６のように、バリヤ層が最上層セラミックグリーンシートの辺の一部に設けられる場合には、バリヤ層の長さ（ｘ方向の長さ）は形成予定の外部電極の長さ（ｘ方向の長さ）と一致しているか、外部電極の長さよりも大きいことが好ましい。 FIGS. 5 (a) and 5 (b) are top views schematically showing examples of barrier layer formation positions when the uppermost layer ceramic green sheet is provided with a barrier layer.
The barrier layer may be provided at least at the planned formation position of the external electrode on the periphery of the upper major surface of the topmost ceramic green sheet.
FIG. 5A shows an example in which the barrier layer 70 is provided all around the top layer ceramic green sheet 136.
On the other hand, FIG. 5 (b) shows an example in which the barrier layer is provided only at the planned formation position of the external electrode in the periphery of the top layer ceramic green sheet 136.
The position of the barrier layer 73 corresponds to the position of the first end face external electrode 23, and the position of the barrier layer 74 corresponds to the second end face external electrode 24. The position of the barrier layer 75 corresponds to the position of the first side outer electrode 25, and the position of the barrier layer 76 corresponds to the position of the second side outer electrode 26.
When the barrier layer is provided on a part of the side of the top layer ceramic green sheet, as in the case of the barrier layer 75 and the barrier layer 76, the length (length in the x direction) of the barrier layer is the outside intended to be formed. It is preferable to match the length of the electrode (length in the x direction) or to be larger than the length of the external electrode.
バリヤ層が形成された位置においては、樹脂絶縁層がエッチング液によりセラミック部から剥がれることが防止されるので、バリヤ層が形成された位置にセラミック部と樹脂部を跨ぐ外部電極を形成する場合には、外部電極を形成するための下地電極は問題なく形成される。
そのため、セラミック部と樹脂部の境界であって、外部電極の下に位置するバリヤ層を形成することにより、外部電極が問題なく形成されている電子部品を製造することができる。 At the position where the barrier layer is formed, the resin insulating layer is prevented from being peeled off from the ceramic portion by the etching solution, so when forming an external electrode across the ceramic portion and the resin portion at the position where the barrier layer is formed. The base electrode for forming the external electrode is formed without any problem.
Therefore, by forming a barrier layer located under the external electrode at the boundary between the ceramic portion and the resin portion, it is possible to manufacture an electronic component in which the external electrode is formed without any problem.
以下に、本発明の電子部品を製造するための方法について説明する。
［セラミック部の作製］
低温焼結セラミック材料の粉末とバインダ、可塑剤等を混合してセラミックスラリーを調製し、シート状に成形して乾燥させてセラミックグリーンシートを得る。
セラミックグリーンシートのうち、内層部となるべきセラミックグリーンシートには、導電性ペーストを用いてスクリーン印刷法やフォトリソグラフィ法により内部電極層のパターンを形成する。
また、セラミックグリーンシートのうち、最上層に積層する最上層セラミックグリーンシートには、その上側主面の周囲の、外部電極の形成予定位置にバリヤ層を設ける。
バリヤ層は、導電性ペーストを用いてスクリーン印刷法やフォトリソグラフィ法により所定のパターンを形成する方法により設けることができる。 Below, the method for manufacturing the electronic component of this invention is demonstrated.
[Fabrication of ceramic part]
A powder of the low temperature sintered ceramic material is mixed with a binder, a plasticizer and the like to prepare a ceramic slurry, which is formed into a sheet and dried to obtain a ceramic green sheet.
Among the ceramic green sheets, a pattern of an internal electrode layer is formed on the ceramic green sheet to be an inner layer portion using a conductive paste by a screen printing method or a photolithography method.
Further, among the ceramic green sheets, the uppermost layer ceramic green sheet to be laminated on the uppermost layer is provided with a barrier layer at a planned formation position of the external electrode around the upper main surface.
The barrier layer can be provided by a method of forming a predetermined pattern by a screen printing method or a photolithography method using a conductive paste.
下層外層部となる内部電極層を形成していないセラミックグリーンシート、内層部となる内部電極層を形成したセラミックグリーンシート、上層外層部となる内部電極層を形成していないセラミックグリーンシート、及び、バリヤ層を設けた最上層セラミックグリーンシートを順に積層して積層体とする。 A ceramic green sheet not having the internal electrode layer to be the lower layer outer layer portion, a ceramic green sheet having the internal electrode layer to be the inner layer portion formed, a ceramic green sheet not having the internal electrode layer to be the upper layer outer layer portion, A top layer ceramic green sheet provided with a barrier layer is sequentially laminated to form a laminate.
そして、積層体の上下に拘束シートを載置して、静水圧プレス等により圧着することにより複合体を作製する。
拘束シートは、セラミックグリーンシートが焼結する温度では実質的に焼結しない材料からなり、アルミナからなることが好ましい。
この工程において最上層セラミックグリーンシートの上には拘束シートが載置される。 And a restraint sheet is mounted on the upper and lower sides of a layered product, and a composite is produced by pressure-bonding with a hydrostatic press etc.
The constraining sheet is made of a material that does not substantially sinter at the temperature at which the ceramic green sheet sinters, and is preferably made of alumina.
In this process, a constraining sheet is placed on the topmost ceramic green sheet.
続いて、セラミックグリーンシートが焼結し、拘束シートが焼結しない温度で、複合体を焼成する。そして、焼成後の複合体からサンドブラスト等の処理により拘束シートを除去すると、セラミック部が得られる。
このセラミック部の上側主面、すなわちセラミック部を構成するセラミック層のうち最上層のセラミック層の表面には、拘束シートと最上層セラミックグリーンシートが反応して生じた反応層が存在する。ただし、バリヤ層を設けた箇所には反応層が存在しない。 Subsequently, the composite is fired at a temperature at which the ceramic green sheet is sintered and the constraining sheet is not sintered. Then, when the constraining sheet is removed from the fired composite by a process such as sand blasting, a ceramic part is obtained.
On the upper main surface of this ceramic portion, that is, on the surface of the uppermost ceramic layer of the ceramic layers constituting the ceramic portion, there is a reaction layer generated by the reaction of the constraining sheet and the uppermost layer ceramic green sheet. However, no reaction layer is present at the location where the barrier layer is provided.
［樹脂部の積層］
セラミック部の上側主面に、ポリイミド樹脂等からなる樹脂絶縁層を設け、樹脂絶縁層上に導体層を設ける。
この際、セラミック部の上側主面に樹脂絶縁層を設け、その後に樹脂絶縁層の上に導体層を形成する。
樹脂絶縁層の形成は、例えば感光性ポリイミド樹脂のフォトリソグラフィにより行うことができる。そして、樹脂絶縁層の上に銀、パラジウム、銀パラジウム合金等からなる導体層をスパッタリング、蒸着等の成膜手法により形成することができる。 [Lamination of resin part]
A resin insulating layer made of polyimide resin or the like is provided on the upper main surface of the ceramic portion, and a conductor layer is provided on the resin insulating layer.
At this time, a resin insulating layer is provided on the upper main surface of the ceramic portion, and then a conductor layer is formed on the resin insulating layer.
The resin insulating layer can be formed, for example, by photolithography of a photosensitive polyimide resin. Then, a conductor layer made of silver, palladium, a silver-palladium alloy or the like can be formed on the resin insulating layer by a film formation method such as sputtering or vapor deposition.
続いて、導体層上に感光性レジストを塗布した後、マスクを介して露光し、エッチング液を用いたエッチングを行って導体層の一部をエッチングし、導体パターンを形成することによって、樹脂絶縁層及び導体パターンからなる樹脂層（最下層の樹脂層）を設ける。
導体パターンの形成の際に、必要な箇所に引出部とビアホール導体となる電極を設ける。
セラミック部と樹脂部との境界で、外部電極の形成予定位置にはバリヤ層が設けられているため、エッチング工程において、バリヤ層が設けられている位置ではエッチング液はセラミック部と樹脂部との境界に浸入しない。
そのため、バリヤ層が設けられている位置においてセラミック部と樹脂絶縁層の間の剥離が生じることは防止される。 Subsequently, after applying a photosensitive resist on the conductor layer, exposure is performed through a mask, and etching using an etching solution is performed to etch a part of the conductor layer, thereby forming a conductor pattern, thereby resin insulation A resin layer (a lowermost resin layer) comprising a layer and a conductor pattern is provided.
When forming a conductor pattern, an electrode serving as a lead-out portion and a via hole conductor is provided at a necessary place.
At the boundary between the ceramic portion and the resin portion, the barrier layer is provided at the planned formation position of the external electrode. Therefore, in the etching step, the etching solution is a portion between the ceramic portion and the resin portion at the position where the barrier layer is provided. It does not infiltrate the boundary.
Therefore, the occurrence of peeling between the ceramic portion and the resin insulation layer at the position where the barrier layer is provided is prevented.
最下層の樹脂層の形成後、さらに樹脂絶縁層と導体層の形成、導体パターンの形成を繰り返して樹脂層を積層して形成することで、樹脂部を設ける。
樹脂層の積層の際に、ビアホール導体となる部位については樹脂絶縁層の穴あけと導電材料の充填を行い、ビアホール導体を形成する。 After the formation of the lowermost resin layer, the formation of the resin insulating layer and the conductor layer, and the formation of the conductor pattern are repeated to form a resin layer by laminating, thereby providing a resin portion.
When laminating the resin layer, the resin insulating layer is pierced and filled with a conductive material at a portion to be a via hole conductor to form a via hole conductor.
このようにして、セラミック部の上に樹脂部が形成された積層部品が得られる。
この積層部品においてセラミック部と樹脂部の境界で、外部電極の形成予定位置には樹脂絶縁層の剥離は生じていない。
この積層部品に対し、外部電極の形成予定位置に外部電極を形成するが、外部電極は、セラミック部と樹脂部との境界においてバリヤ層を設けた位置を跨ぐように形成する。 Thus, a laminated component in which the resin part is formed on the ceramic part is obtained.
In this laminated component, peeling of the resin insulating layer does not occur at the planned formation position of the external electrode at the boundary between the ceramic portion and the resin portion.
An external electrode is formed at the planned formation position of the external electrode for this laminated component, but the external electrode is formed to cross the position where the barrier layer is provided at the boundary between the ceramic portion and the resin portion.
外部電極の形成は、ＮｉＣｒ、ＮｉＣｕ等の金属膜をスパッタリング等の方法で成膜して下地電極を形成し、下地電極上にＮｉめっき及びＳｎめっきを施すことによって行うことができる。
下地電極を形成する位置においてセラミック部と樹脂絶縁層の間に剥離は生じていないため、下地電極が不連続な膜になることはない。
そのため、下地電極に対してめっきを行うことによって外部電極を問題なく形成することができる。 The external electrode can be formed by depositing a metal film of NiCr, NiCu or the like by sputtering or the like to form a base electrode, and applying Ni plating and Sn plating on the base electrode.
Since peeling does not occur between the ceramic portion and the resin insulating layer at the position where the base electrode is formed, the base electrode does not become a discontinuous film.
Therefore, by plating the base electrode, the external electrode can be formed without any problem.
１　電子部品
１０　積層部品
１１　第１の主面
１２　第２の主面
１３　第１の端面
１４　第２の端面
１５　第１の側面
１６　第２の側面
２３　第１端面外部電極
２４　第２端面外部電極
２５　第１側面外部電極
２６　第２側面外部電極
３０　セラミック部
３１　下層外層部
３２　上層外層部
３３　内層部
３４、３５　セラミック層
３４ａ、３５ａ　内部電極層
３４ｂ、３５ｂ　引出部
３６　最上層のセラミック層
４０　樹脂部
４１、４２、４３、４４　樹脂層
４１ａ、４１ｂ、４２ａ、４２ｂ、４３ａ、４３ｂ、４４ａ、４４ｂ　導体パターン
４１ｃ、４１ｄ、４２ｃ、４２ｄ、４３ｃ、４３ｄ　ビアホール導体
４１ｅ、４１ｆ、４４ｅ　引出部
４５　上層外層部
５０　拘束シート
５１　反応層
６０　複合体
７０、７３、７４、７５、７６　バリヤ層
１３６　最上層セラミックグリーンシート
１４１　樹脂絶縁層
１４２　導体層 DESCRIPTION OF SYMBOLS 1 electronic component 10 laminated component 11 1st main surface 12 2nd main surface 13 1st end surface 14 2nd end surface 15 1st side 16 2nd side 23 1st end surface external electrode 24 2nd end surface external electrode 25 first side outer electrode 26 second side outer electrode 30 ceramic portion 31 lower outer layer portion 32 upper outer layer portion 33 inner layer portion 34, 35 ceramic layer 34a, 35a internal electrode layer 34b, 35b lead portion 36 uppermost ceramic layer 40 resin Portions 41, 42, 43, 44 Resin layers 41a, 41b, 42a, 42b, 43a, 43b, 44a, 44b Conductor patterns 41c, 41d, 42c, 42d, 43c, 43d Via hole conductors 41e, 41f, 44e Leading portion 45 Upper layer outer layer Part 50 Restraint sheet 51 Reaction layer 60 Composite 70, 73, 74, 75, 76 Barrier layer 136 Top layer ceramic green sheet Gate 141 resin insulation layer 142 conductor layer

Claims (4)

  1. 低温焼結セラミック材料を含むセラミック部と、
    前記セラミック部の上側主面に積層された樹脂絶縁層及び導体パターンからなる樹脂部と、
    前記セラミック部と前記樹脂部との境界を跨って設けられている外部電極と、を備える電子部品であって、
    前記セラミック部と前記樹脂部の境界であって、前記外部電極の下に位置する部位において、バリヤ層が設けられていることを特徴とする電子部品。     A ceramic part comprising a low temperature sintered ceramic material,
    A resin portion comprising a resin insulating layer and a conductor pattern laminated on the upper major surface of the ceramic portion;
    It is an electronic component provided with the external electrode provided straddling the boundary of the said ceramic part and the said resin part, Comprising:
    An electronic component characterized in that a barrier layer is provided at a part of the boundary between the ceramic part and the resin part and located below the external electrode.
  2. 前記バリヤ層は銀電極又は銀パラジウム合金電極である請求項１に記載の電子部品。 The electronic component according to claim 1, wherein the barrier layer is a silver electrode or a silver palladium alloy electrode.
  3. 前記バリヤ層はガラスを主成分として含む請求項１に記載の電子部品。 The electronic component according to claim 1, wherein the barrier layer contains glass as a main component.
  4. 低温焼結セラミック材料の原料を含むセラミックグリーンシートを準備する工程と、
    前記セラミックグリーンシートのうち、最上層に積層する最上層セラミックグリーンシートの上側主面の周囲の、外部電極の形成予定位置にバリヤ層を設ける工程と、
    前記セラミックグリーンシートを積層し、前記最上層セラミックグリーンシートの上側主面に、前記セラミックグリーンシートが焼結する温度では実質的に焼結しない拘束シートを載置して圧着することにより複合体を作製する工程と、
    前記セラミックグリーンシートが焼結し、前記拘束シートが焼結しない温度で、前記複合体を焼成する工程と、
    焼成後の前記複合体から前記拘束シートを除去してセラミック部を得る工程と、
    前記セラミック部の上側主面に樹脂絶縁層を設け、前記樹脂絶縁層上に導体層を設ける工程と、
    前記導体層に対してエッチング液を用いたエッチングを行って導体パターンを形成することによって、前記樹脂絶縁層及び前記導体パターンからなる樹脂部を設けるエッチング工程と、
    前記セラミック部と前記樹脂部との境界において前記バリヤ層を設けた位置を跨ぐように外部電極を形成する工程とを行うことを特徴とする電子部品の製造方法。     Preparing a ceramic green sheet containing a raw material of a low temperature sintered ceramic material;
    Providing a barrier layer at a planned formation position of an external electrode around the upper major surface of the uppermost ceramic green sheet to be laminated on the uppermost layer among the ceramic green sheets;
    The composite is obtained by laminating the ceramic green sheets, and placing and pressing a constraining sheet that does not substantially sinter at the temperature at which the ceramic green sheets sinter on the upper major surface of the topmost ceramic green sheet. A process of producing
    Firing the composite at a temperature at which the ceramic green sheet sinters and the constraining sheet does not sinter;
    Removing the constraining sheet from the composite after firing to obtain a ceramic part;
    Providing a resin insulation layer on the upper major surface of the ceramic part, and providing a conductor layer on the resin insulation layer;
    Etching the conductive layer using an etching solution to form a conductive pattern, thereby providing a resin portion including the resin insulating layer and the conductive pattern;
    And a step of forming an external electrode across the position where the barrier layer is provided at the boundary between the ceramic portion and the resin portion.
PCT/JP2018/038622 2017-12-04 2018-10-17 Electronic component and method for producing electronic component WO2019111547A1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022107764A1 (en) * 2020-11-23 2022-05-27 パナソニックＩｐマネジメント株式会社 Magnetic sensor

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005071745A1 (en) * 2004-01-27 2005-08-04 Murata Manufacturing Co., Ltd. Laminated electronic part and its manufacturing method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005071745A1 (en) * 2004-01-27 2005-08-04 Murata Manufacturing Co., Ltd. Laminated electronic part and its manufacturing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022107764A1 (en) * 2020-11-23 2022-05-27 パナソニックＩｐマネジメント株式会社 Magnetic sensor

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