WO2019095542A1 - Led 光源的封装结构 - Google Patents

Led 光源的封装结构 Download PDF

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Publication number
WO2019095542A1
WO2019095542A1 PCT/CN2018/072496 CN2018072496W WO2019095542A1 WO 2019095542 A1 WO2019095542 A1 WO 2019095542A1 CN 2018072496 W CN2018072496 W CN 2018072496W WO 2019095542 A1 WO2019095542 A1 WO 2019095542A1
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positive
negative
aluminum substrate
negative electrode
electrode member
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PCT/CN2018/072496
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English (en)
French (fr)
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朱衡
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湖南粤港模科实业有限公司
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Publication of WO2019095542A1 publication Critical patent/WO2019095542A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements

Definitions

  • the utility model relates to an LED light source structure, in particular to a package structure of an LED light source with good heat dissipation performance.
  • the LED light source is usually composed of an LED chip, a chip holder, a circuit board and a heat dissipation substrate (mostly an aluminum substrate).
  • the LED chip is fixed on the chip holder, and the positive and negative electrodes of the LED chip 1 are respectively soldered on the circuit board by corresponding welding.
  • the closest LED light source in the prior art is composed of an LED chip and an aluminum substrate on which the LED chip is mounted.
  • the LED chip is fixed in a cup cavity disposed in the center of the aluminum substrate, and then the LED chip is positively and negatively subjected to a soldering process.
  • the poles are respectively soldered to the inner ends of the corresponding electrical pins.
  • this packaging method has the following disadvantages:
  • the technical problem to be solved by the utility model is to provide a package structure of an LED light source which can effectively improve the welding reliability and ensure the stable operation of the LED chip and the external circuit conductive path.
  • the package structure of the LED light source of the present invention comprises an LED chip, wherein the LED chip is embedded in a cup cavity disposed in the center of the aluminum substrate, and the aluminum substrate is divided into two parts, a positive plate and a negative plate, in the positive electrode.
  • An insulating spacer is disposed at a position where the plate is in contact with the negative electrode plate, and a positive electrode electrical pin and a negative electrode electrical pin extending outside the aluminum substrate are respectively fixed on the positive electrode plate and the negative electrode plate, and the LED chip is The positive and negative electrodes are respectively soldered to the corresponding positive or negative plate by wires.
  • the ratio of the area of the positive electrode plate to the negative electrode plate was 9:1.
  • the negative electrode plate is disposed on a side of the aluminum substrate, and has an outer shape of a U shape.
  • An insulating mat having the same shape and size as the aluminum substrate is fixed to a bottom surface of the aluminum substrate, and the insulating spacer is an insulating base integrally formed by the insulating mat and extending upward.
  • the aluminum substrate has a thickness of 0.8 mm to 1.5 mm and a maximum outer diameter of 15 mm to 18 mm, and has a circular, elliptical or regular polygonal shape.
  • One end of the positive electrode electrical pin and the negative electrode electrical pin is fixed to the corresponding positive or negative plate by a screw connection, a snap connection, a tight fit connection, a conductive adhesive bond or a riveted connection.
  • the utility model designs an aluminum substrate which receives the LED chip and dissipates the heat of the chip, and is designed as a separate part of the positive electrode plate and the negative electrode plate, and the insulation between the positive electrode plate and the negative electrode plate is made of plastic insulating material.
  • the spacer is insulated.
  • the positive and negative electrodes of the LED chip are respectively soldered to the positive electrode plate and the negative electrode plate.
  • the welding method can improve the welding margin of the solder joint and improve the welding efficiency, and can also increase the welding.
  • the spot area increases the reliability and stability of the solder joint.
  • the positive and negative electrical pins are firmly fixed to the corresponding positive or negative plates in a variety of quick connection manners.
  • the utility model can not only solve the heat dissipation problem of the chip, but also improve the package quality, effectively improve the welding quality of the conduction line in the LED chip packaging process, and effectively prevent the welding, offset or falling off of the welding wire.
  • Figure 1 is a schematic front view of the present invention.
  • Figure 2 is a plan view of Figure 1.
  • Fig. 3 is a cross-sectional view taken along line A-A of Fig. 2;
  • FIG. 4 is a schematic exploded view of FIG. 1.
  • LED chip 1 bonding wire 11, pad 12, aluminum substrate 2, cup cavity 21, positive electrode plate 3, negative electrode plate 4, electrical pin 5, insulating spacer 6, insulating pad 7, insulating base 71, and LED light source 8.
  • the package structure of the LED light source of the present invention is suitable for directly mounting the LED chip 1 in an LED light source structure with the aluminum substrate 2 as a heat sink.
  • the heat dissipation substrate, the chip bonding wire (also called the conduction wire, the gold wire) 11, the positive electrode electrical pin 5, the negative electrode electrical pin 5, and the positive and negative electrode plates 4 are mainly separated by the LED chip 1 and the aluminum substrate 2.
  • the insulation component is constructed.
  • the conventional chip in the prior art may be a chip of a formal structure or a chip of a flip-chip structure, and the LED chip 1 is fixed by silver glue in an annular cup cavity 21 disposed at the center of the aluminum substrate 2, This structure can effectively improve the heat dissipation effect of the LED chip 1, that is, the heat generated by it is quickly absorbed by the aluminum substrate 2 and is radiated to the surrounding space.
  • the aluminum substrate 2 has a thickness of 0.8 mm to 1.5 mm and a maximum outer diameter of 15 mm to 18 mm, and has a circular, elliptical or regular polygonal shape.
  • the mirror aluminum is integrally formed by stamping, and the center thereof is a circular pit, which is referred to as a cup cavity 21.
  • the aluminum substrate 2 is directly divided into two parts, one part being the positive electrode plate 3 and the other part being the negative electrode plate 4.
  • the area of the positive electrode plate 3 accounts for 90% of the area of the aluminum substrate 2
  • the area of the negative electrode plate 4 accounts for 10% of the area of the aluminum substrate 2. This ratio allows the heat generated by the LED chip to be quickly absorbed by the aluminum substrate (LED chip is fixed) In the annular cup chamber 21 disposed in the center of the positive electrode plate).
  • the negative electrode plate 4 has a horizontal outline of a "U” shape, and is disposed on the side of the aluminum substrate 2, and its inner portion of the "U” shape is bordered with the cup cavity 21.
  • the utility model adopts the following two ways to provide an insulating partition 6 between the positive electrode plate 3 and the negative electrode plate 4:
  • the insulating sheath provided separately is made of a plastic material, and the edge of the negative electrode plate 4 is sleeved from below or above the negative electrode plate 4, and the portion of the insulating sheath opposite to the front and back surfaces of the negative electrode plate 4 is open. In order to solder the bonding wire 11 connecting the negative electrode of the LED chip 1 to the negative electrode plate 4.
  • An insulating pad 7 is fixed on the bottom surface of the aluminum substrate 2 by gluing, riveting or snapping.
  • the shape and size of the insulating pad 7 are the same as the shape and size of the aluminum substrate 2.
  • An insulating base 71 is integrally formed on the insulating pad 7 corresponding to the negative electrode plate 4, and the base is a cavity having an upwardly extending side wall, and the positive electrode plate 3 and the negative electrode plate 4 are placed on the insulating pad 7 In the upper case, the side wall of the insulating base 71 is inserted into the gap where the positive electrode plate 3 and the negative electrode plate 4 are in contact with each other, thereby functioning to separate the positive and negative electrodes.
  • the position of the electric pin 5 is fixed on the positive electrode plate 3 and the negative electrode plate 4, and the pinhole can be opened on the positive and negative plates 4, and the upper end of the electric pin 5 is tightly fitted to the opened needle.
  • the electric pin 5 can also be fixed on the lower surface of the positive and negative plates 4 by means of a conductive adhesive bonding, welding or riveting, and the electric pin 5 can be fixed by other carding structures.
  • a through hole allowing the electrical pin 5 to pass through is provided at a corresponding position on the insulating mat 7.
  • the positive and negative electrical pins 5 extend downward and can be inserted on the peripheral board.
  • the chip bonding wire 11 is soldered with the gold wire to the positive electrode terminal and the negative electrode terminal of the LED chip 1 and the corresponding positive electrode plate 3 and the pad 12 on the negative electrode plate 4, respectively.
  • the greatest advantage of the present invention is that the selection of the position of the pad 12 does not need to take into account the position of the electrical pin 5, and therefore, the operational margin of the soldering will be greatly improved.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

一种LED光源(8)的封装结构，其中的LED芯片(1)被嵌入设置于铝基板(2)中央的杯腔(21)中，铝基板(2)被分割为正极板(3)和负极板(4)两部分，在正极板(3)与负极板(4)相接之处设有绝缘隔衬(6)，在正极板(3)与负极板(4)上分别固接有向铝基板(2)之外延伸的正极电插针(5)和负极电插针(5)，LED芯片(1)的正负极分别通过导线焊接在对应的正极板(3)或负极板(4)上。此焊接方式既可提高焊点焊接裕度，又可提高焊接效率，还可通过增加焊点面积提高焊接点的可靠性和稳定性。同时，将正、负极电插针(5)以多种快速的连接方式牢靠地固接在对应的正极板(3)或负极板(4)上。既能解决LED芯片(1)散热问题，又能提高封装质量，有效改善LED芯片(1)焊线(11)的焊接质量。

Description

LED光源的封装结构 技术领域
本实用新型涉及一种LED光源结构，尤其涉及一种散热性能良好的LED光源的封装结构。
 背景技术
LED光源通常由LED芯片、芯片支架、电路板和散热基板（多为铝基板）构成，LED芯片固接在芯片支架上，LED芯片1的正负极分别通过导线焊接在电路板上对应的焊盘上。 负极现有技术中最接近的LED光源由LED芯片和安装该LED芯片的铝基板构成，通常，LED芯片固定在设置于铝基板中央的杯腔中，然后通过焊接工艺将该LED芯片的正负极分别与对应的电插针的内端焊接在一起。但该封装方式存在以下不足：
1）采用自动焊接时，若电插针的待焊端插置不到位或产生倾斜，则在将导线与该待焊端焊接时会出现焊线偏移不良。
2）将焊线与待焊端进行点对点焊接，很容易出现虚焊现象，严重时导致焊点脱落。
 技术问题
本实用新型要解决的技术问题是提供一种能有效提高焊接可靠性，确保LED芯片与外电路导电通路稳定工作的LED光源的封装结构。
 技术解决方案
为了解决上述技术问题，本实用新型采用的技术方案为：
本实用新型的LED光源的封装结构，包括LED芯片，其特征在于：所述LED芯片被嵌入设置于铝基板中央的杯腔中，该铝基板被分割为正极板和负极板两部分，在正极板与负极板相接之处设有绝缘隔衬，在所述正极板与负极板上分别固接有向该铝基板之外延伸的正极电插针和负极电插针，所述LED芯片的正负极分别通过导线焊接在对应的正极板或负极板上。
所述正极板与负极板的面积之比为9：1。
所述负极板设置在所述铝基板的边侧，其外形轮廓为“U”形。
在所述铝基板的底面固接有与该铝基板形状及大小相同的绝缘垫，所述绝缘隔衬为由该绝缘垫一体成形且向上延伸的绝缘底座。
所述铝基板的厚度为0.8mm-1.5mm，其最大外径为15mm-18mm，其形状为圆形、椭圆形或正多边形。
所述正极电插针和负极电插针的一个端部通过螺纹连接、卡扣连接、紧配合连接、导电胶粘接或铆接连接固定在对应的正极板或负极板上。
 有益效果
与现有技术相比，本实用新型将承接LED芯片并将芯片热量散发出去的铝基板设计成分离设置的正极板与负极板两部分，正极板与负极板之间采用塑胶绝缘材料制作的绝缘隔衬进行绝缘，之后，将LED芯片的正负极分别通过焊线焊接到正极板和负极板上，该焊接方式既可提高焊点焊接裕度，又可提高焊接效率，还可通过增加焊点面积提高焊接点的可靠性和稳定性。同时，将正负极电插针以多种快速的连接方式牢靠地固接在对应的正极板或负极板上。
本实用新型既能解决芯片散热问题，又能提高封装质量，有效改善LED芯片封装过程中导通线的焊接质量，有效杜绝焊线的虚焊、偏移或脱落现象。
 附图说明
图1为本实用新型的正向示意图。
图2为图1的俯视图。
图3为图2的A-A向剖视图。
图4为图1的爆炸示意图。
附图标记如下：
LED芯片1、焊线11、焊盘12、铝基板2、杯腔21、正极板3、负极板4、电插针5、绝缘隔衬6、绝缘垫7、绝缘底座71、LED光源8。
 本发明的最佳实施方式
如图1－4所示，本实用新型的LED光源的封装结构适用于直接将LED芯片1安装在以铝基板2为散热件的LED光源结构中。
其主要由LED芯片1、铝基板2制作的散热基板、芯片焊线（也称导通线、金线）11、正极电插针5、负极电插针5和将正负极板4隔离开的绝缘部件构成。
1、LED芯片1
为现有技术中的常规芯片，可以为正装结构的芯片，也可为倒装结构的芯片，该LED芯片1通过银胶固接在设置于所述铝基板2中央的环形杯腔21中，该结构可有效提高LED芯片1的散热效果，即其产生的热量很快被铝基板2吸收并散发至周围空间。
2、铝基板2
所述铝基板2的厚度为0.8mm-1.5mm，其最大外径为15mm-18mm，其形状为圆形、椭圆形或正多边形。
采用镜面铝经冲压一体化成形，其中央为圆环形的凹坑，简称杯腔21。
冲压时，直接将该铝基板2分割为两部分，一部分为正极板3，另一部分为负极板4。优选正极板3的面积占该铝基板2面积的90%，负极板4的面积占该铝基板2面积的10%，该比例可使LED芯片产生的热量快速被铝基板吸收（LED芯片固接在设置于正极板中央的所述环形杯腔21中）。
负极板4的外形轮廓似卧式的“U”形，其设置于铝基板2的边侧，其“U”形的内侧部与所述杯腔21接壤。
3、绝缘部件
本实用新型采用以下两种方式在正极板3与负极板4之间设置绝缘隔衬6：
1）采用塑胶材料制作独立设置的绝缘护套，由负极板4的下方或上方将该负极板4的边缘套起来，而该绝缘护套上与负极板4正面和背面相对的部分为敞口，以便于将连接LED芯片1负极的焊线11焊接在该负极板4上。
2）在所述铝基板2的底面采用胶粘、铆接或卡扣连接方式，固接一块绝缘垫7，该绝缘垫7的形状及大小与该铝基板2形状及大小相同。在与所述负极板4对应位置的该绝缘垫7上，一体成形一个绝缘底座71，该底座为具有向上延伸侧壁的腔座，当将正极板3与负极板4放置在该绝缘垫7上时，所述绝缘底座71的侧壁正好插置于正极板3与负极板4相接的缝隙中，从而起到正负极绝缘相隔的作用。
4、正负极电插针5
按照设计要求，在上述正极板3和负极板4上设置固定电插针5的位置，可以在正负极板4上开针孔，将电插针5的上端紧配合安装在所开设的针孔中，也可采用导电胶粘结连接方式、焊接方式或铆接方式将电插针5固接在正负极板4的下表面上，还可通过其它卡装结构将电插针5固定在正负极板4底面上。
若采用带有绝缘底座71的绝缘垫7，则需在该绝缘垫7上对应的位置开设允许电插针5穿过的通孔。
正负极电插针5向下延伸，可插置于外设的电路板上。
5、芯片焊线11采用金线将LED芯片1的正极端和负极端分别与对应的正极板3和负极板4上的焊盘12焊接在一起。本实用新型最大的好处是，焊盘12位置的选择无需考虑电插针5的设置位置，因此，其焊接的操作裕度将大大提高。

Claims (6)

  1. 一种LED光源的封装结构，包括LED芯片（1），其特征在于：所述LED芯片（1）被嵌入设置于铝基板（2）中央的杯腔（21）中，该铝基板（2）被分割为正极板（3）和负极板（4）两部分，在正极板（3）与负极板（4）相接之处设有绝缘隔衬（6），在所述正极板（3）与负极板（4）上分别固接有向该铝基板（2）之外延伸的正极电插针（5）和负极电插针（5），所述LED芯片（1）的正负极分别通过导线焊接在对应的正极板（3）或负极板（4）上。
  2. 根据权利要求1所述的LED光源的封装结构，其特征在于：所述正极板（3）与负极板（4）的面积之比为9：1。
  3. 根据权利要求2所述的LED光源的封装结构，其特征在于：所述负极板（4）设置在所述铝基板（2）的边侧，其外形轮廓为“U”形。
  4. 在此处键入权利要求项4根据权利要求2所述的LED光源的封装结构，其特征在于：在所述铝基板（2）的底面固接有与该铝基板（2）形状及大小相同的绝缘垫（7），所述绝缘隔衬（6）为由该绝缘垫（7）一体成形且向上延伸的绝缘底座（71）。
  5. 根据权利要求2所述的LED光源的封装结构，其特征在于：所述铝基板（2）的厚度为0.8mm-1.5mm，其最大外径为15mm-18mm，其形状为圆形、椭圆形或正多边形。
  6. 根据权利要求2所述的LED光源的封装结构，其特征在于：所述正极电插针（5）和负极电插针（5）的一个端部通过螺纹连接、卡扣连接、紧配合连接、导电胶粘接或铆接连接固定在对应的正极板（3）或负极板（4）上。
PCT/CN2018/072496 2017-11-20 2018-01-12 Led 光源的封装结构 WO2019095542A1 (zh)

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CN110260198A (zh) * 2019-04-30 2019-09-20 上海智光慧芯照明科技有限公司 一种led模组
CN110145696A (zh) * 2019-04-30 2019-08-20 上海智光慧芯照明科技有限公司 一种led模组

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