WO2019095287A1 - 一种具有散热结构的背光源用fpc - Google Patents
一种具有散热结构的背光源用fpc Download PDFInfo
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- WO2019095287A1 WO2019095287A1 PCT/CN2017/111675 CN2017111675W WO2019095287A1 WO 2019095287 A1 WO2019095287 A1 WO 2019095287A1 CN 2017111675 W CN2017111675 W CN 2017111675W WO 2019095287 A1 WO2019095287 A1 WO 2019095287A1
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- heat dissipation
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Planar Illumination Modules (AREA)
Abstract
Description
Claims (7)
- 一种具有散热结构的背光源用FPC,包括基材层,所述基材层上设有镀铜层,所述镀铜层上设有保护膜层,所述镀铜层上设有连接线路和若干对用于焊接LED的焊盘,所述焊盘向上贯穿所述保护膜层,其特征在于,每对所述焊盘包括分别与LED焊脚对应的左焊盘和右焊盘,所述左焊盘和所述右焊盘之间设有第一蚀刻区;所述镀铜层上设有连接相邻两颗LED的所述右焊盘和所述左焊盘的第一镀铜层;所述连接线路包括第一极性线路和与所述第一极性线路的极性相反的第二极性线路,所述第一极性线路与所述第二极性线路之间设有第二蚀刻区;所述第一极性线路连接最左端的左焊盘,所述第二极性线路连接最右端的右焊盘,所述第一极性线路与所述第一覆铜层之间设有第三蚀刻区,所述第一蚀刻区、所述第二蚀刻区和所述第三蚀刻区的宽度均为0.2~0.5mm;所述第一镀铜层、所述第一极性线路和所述第二极性电路均延伸至FPC的外边缘。
- 根据权利要求1所述的具有散热结构的背光源用FPC,其特征在于,所述保护膜层设有散热孔,所述散热孔向下贯穿于所述保护膜层并且截止于所述镀铜层。
- 根据权利要求2所述的具有散热结构的背光源用FPC,其特征在于,所述散热孔随机分布于所述保护膜层上。
- 根据权利要求1所述的具有散热结构的背光源用FPC,其特征在于,所述保护膜层包括延伸至所述焊盘前端的第一端部,所述第一端部与FPC上边缘之间设有反光层。
- 根据权利要求4所述的具有散热结构的背光源用FPC,其特征在于,所述第一端部与LED的发光面平齐。
- 根据权利要求4所述的具有散热结构的背光源用FPC,其特征在于,所述反光层为白色的导热双面胶。
- 根据权利要求4所述的具有散热结构的背光源用FPC,其特征在于,所述反光层为白色丝印油墨。
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CN101998759A (zh) * | 2010-11-26 | 2011-03-30 | 台龙电子(昆山)有限公司 | Led灯条的柔性线路板结构 |
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CN103346138A (zh) * | 2013-06-17 | 2013-10-09 | 广东美的集团芜湖制冷设备有限公司 | 智能功率模块及其制造方法 |
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CN103906353A (zh) * | 2012-12-25 | 2014-07-02 | 大连崇达电路有限公司 | 铝基hdi/bum印制电路板及光致蚀刻成孔方法 |
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CN105451439A (zh) * | 2015-12-09 | 2016-03-30 | 歌尔声学股份有限公司 | 一种柔性电路板及其制备方法 |
CN205504670U (zh) * | 2016-03-28 | 2016-08-24 | 苏州福莱盈电子有限公司 | 一种软质led灯条板 |
CN107995772A (zh) * | 2017-11-17 | 2018-05-04 | 盐城天顺机械科技有限公司 | 一种具有散热结构的背光源用fpc |
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2017
- 2017-11-17 WO PCT/CN2017/111675 patent/WO2019095287A1/zh active Application Filing
Patent Citations (11)
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CN102238809A (zh) * | 2010-04-23 | 2011-11-09 | 比亚迪股份有限公司 | 一种fpc镂空板及其制作方法 |
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CN203072249U (zh) * | 2012-11-20 | 2013-07-17 | 田茂福 | 用于安装led灯的铝基板 |
CN103906353A (zh) * | 2012-12-25 | 2014-07-02 | 大连崇达电路有限公司 | 铝基hdi/bum印制电路板及光致蚀刻成孔方法 |
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CN205504670U (zh) * | 2016-03-28 | 2016-08-24 | 苏州福莱盈电子有限公司 | 一种软质led灯条板 |
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