201221831 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種光源單元、具備該光源單元之背光 單元、及具備該背光單元之薄型顯示器裝置。 【先前技術】 以往’作為液晶顯示器裝置之背光單元，使用高亮度 且低價格之冷陰極管（以下，稱為CCFL)，然而，由於發光 二極體（以下，稱為LED)之高亮度化及低成本化之進展、且 CCFL亦具有含有水銀之問題，因此CCFL逐漸取代為LED。 作為液晶顯示器裝置之背光單元，使用LED者在當初 與CCFL同樣地’係常時點燈並藉由在液晶之光閘進行顏色 及明暗之調整。在最近，為了低耗電化及色再現性中漆黑 之實現，對部分LED進行ΟΝ/OFF控制之採用所謂區域調 光之方法之情形逐漸增加。 此處，「區域調光」係意指將背光單元之光出射面分 割成複數個區域，就各區域分別與影像對應來控制光之強 度之技術。201221831 SUMMARY OF THE INVENTION Technical Field The present invention relates to a light source unit, a backlight unit including the light source unit, and a thin display device including the same. [Prior Art] Conventionally, as a backlight unit of a liquid crystal display device, a high-brightness and low-priced cold cathode tube (hereinafter referred to as CCFL) is used. However, the luminance of the light-emitting diode (hereinafter referred to as LED) is high. And the development of low cost, and CCFL also has the problem of mercury, so CCFL is gradually replaced by LED. As the backlight unit of the liquid crystal display device, the LEDs are always turned on in the same manner as the CCFLs, and the color and brightness are adjusted by the liquid crystal shutters. Recently, in order to achieve low power consumption and realization of black lacquer in color reproducibility, a method of performing so-called area dimming for ΟΝ/OFF control of a part of LEDs has been increasing. Here, "area dimming" means a technique of dividing the light exit surface of the backlight unit into a plurality of areas, and controlling the intensity of light in correspondence with the images in each area.
實現液晶顯示器裝置之大型化與薄型化 牙尤早兀，能 之技術開發成為課 201221831 題。 在採用此種區域調光之背光單元，作為能實現液晶顯 示器裝置之大型化與薄型化之技術，考慮使配置在可:性 印刷配線板内之電路配線僅在包含緊鄰LED下方之附近區 域多層化配置之技術。 此種技術雖能實現液晶顯示器裝置之大型化與薄型 化，但隨著可撓性印刷配線板之多層化，中間樹脂層或接 著劑層增加。因此，LED驅動時產生之熱到達兼用為散熱 板之金屬支承體為止之熱阻抗增加，散熱性變差。因此， 具有兀件溫度上升而使亮度特性可能惡化之問題。 表示此種將LED作為背光使用之背光單元之習知技術 有例如下述專利文獻1、2。 專利文獻1:日本特開2〇〇4— 2 14094號公報 專利文獻2:日本特開2005 — 13 5862號公報 【發明内容】 上述專利文獻1之發明，係關於背光裝置及液晶顯示 裝置之發明，具有可抑制成本上昇、將來自光源之光高效 率導引至導光板且進-步提升光源之散熱效果之優點。 又，上述專利文獻2之發明，係關於光單元之發明， 具有可使來自光源之光高效率射入至導光板、使照射光從 該導光板照射至顯示面板以在顯示面板獲得明亮且良好之 顯示之優點。 然而’上述專利文獻 背光裝置及光單元。又， 1、2之發明皆非採用區域調光之 專利文獻1、2並無在採用區域調 201221831 光之是光單70能實現良好之散熱性與薄型化且能實現使用 採用區域調&之背光單元之液晶顯示器裝置之大型化之記 載或教示。 本發明之目的特別在於提供一種採用區域調光且能實 ，良好之散熱性與薄型化之光源單元、具備該光源單元之 者光單元、及具備該背光單元之薄型顯示器裝置。 根據本發明之第1形態，提供一種光源單元，具備： 一個至複數個光源；可撓性印刷配線板，具有用以構裝該 一個至複數個光源之一個至複數個配線層；以及金屬支承 體，具有用以安裝該可撓性印刷配線板之第丨面及第2面， 女裝該了撓性印刷配線板以促進散熱。可撓性印刷配線 板.包含緊鄰光源之下方之區域之光源附近區域、與 較光源附近區域遠離光源之光源遠方區域；光源附近區域 及光源遠方區域係設成分別與金屬支承體之第1面與第2 面接觸之狀態，一個至複數個配線層係分散設在光源附近 區域與光源遠方區域。 根據上述構成，在光源驅動時產生之熱可傳熱至金屬 支承體之第1面與第2面。因此，能設置往金屬支承體之 複數個散熱路徑，實現良好之散熱性。 又，藉由使一個至複數個配線層分散設在光源附近區 域與光源遠方區域，能使光源附近區域之熱阻抗變小。尤 其疋’在必須使配線層多層化之情形，相較於僅在光源附 近區域形成複數個配線層之構成，能使作為可撓性印刷配 線板整體之配線層之積層數減少，使光源附近區域之厚度 201221831 ’'、。因此’在光源驅動時產生之熱可迅速傳熱、散熱至 處於與光源附近區域接觸之狀態之金屬支承體。是以，即 使使配線層多層化之情形，亦可使在光源驅動時產生之熱 到達金屬支承體為止之熱阻抗變小，抑制光源之溫度上 升。其結果’能有效防止光源之亮度特性惡化。 又’尤其是’在必須使配線層多詹化之情形，能使作 為可撓性印刷配線板整體之配線層之積層數減少。藉此， 能使光源單元整體之大小小型化，實現光源單元之薄型化。 較佳為’一個至複數個配線層係設在可撓性印刷配線 板内’設在光源附近區域之配線層之層數係設定成設在光 源遠方區域之配線層之層數以下。 根據上述構成，能使要求往金屬支承體之迅速散熱性 之光源附近區域之厚度為光源遠方區域之厚度以下。 較佳為’金屬支承體為長方體’第1面為金屬支承體 之上面，第2面為金屬支承體之一側面，光源附近區域接 觸於金屬支承體之上面，光源遠方區域接觸於金屬支承體 之一側面。 根據上述構成’能使在光源產生之熱傳熱至金屬支承 體之上面與一側面之二面。因此，能形成複數個散熱路徑， 實現良好之散熱性。 較佳為’金屬支承體為長方體，第1面為金屬支承體 之上面’第2面為金屬支承體之兩側面’光源附近區域接 觸於金屬支承體之上面，光源遠方區域接觸於金屬支承體 之兩側面。 201221831 根據上述構成，能使在光源產生之熱傳熱至金屬支 ，盛费 | | . 與二侧面之三面。因此，能形成複數個散熱路徑， 實現良好之散熱性。 較佳為’一個至複數個光源形成分別由一個至複數個 光源構成之—個至複數個光源群，對各該光源群或各光源 分別進行〇N、〇FF控制。 彳’、 根據上述構成，在採用區域調光之光源單元，能實現 良好之散熱性與薄型化。 又，根據本發明之第2形態，提供一種背光單元，係 使用第1形態之光源單元。 ,、 根據上述構成，可構成能實 之背光單元。 可構成能實現良好之散熱性與薄型化 形態，提供一 又，根據本發明之第3形態 置，係使用第2形態之背光單元。 根據上述槿a . 也一，.uThe realization of the large-scale and thinning of the liquid crystal display device is particularly early, and the development of the technology can become the topic of 201221831. In the backlight unit using such a region dimming, as a technology for realizing the enlargement and thinning of the liquid crystal display device, it is considered that the circuit wiring disposed in the printable printed wiring board is only in the vicinity of the vicinity of the LED. The technology of configuration. Although such a technique can increase the size and thickness of the liquid crystal display device, the intermediate resin layer or the adhesive layer increases as the flexible printed wiring board is multilayered. Therefore, the heat generated when the LED is driven reaches the metal support which is also used as the heat sink, and the thermal resistance increases, and the heat dissipation property is deteriorated. Therefore, there is a problem that the temperature of the component rises and the luminance characteristics may deteriorate. A conventional technique for indicating such a backlight unit using an LED as a backlight is disclosed in, for example, Patent Documents 1 and 2 below. [Patent Document 1] Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. Hei. The utility model has the advantages that the cost increase can be suppressed, the light from the light source is efficiently guided to the light guide plate, and the heat dissipation effect of the light source is further improved. Moreover, the invention of the above-mentioned Patent Document 2 relates to the invention of the optical unit, which is capable of efficiently emitting light from a light source to the light guide plate and irradiating the illumination light from the light guide plate to the display panel to obtain a bright and good display panel. The advantages of the display. However, the above patent documents are a backlight device and a light unit. Moreover, the patents 1 and 2 of the inventions of the first and the second are not the regional dimming, and the use of the regional adjustment 201221831 is that the optical single 70 can achieve good heat dissipation and thinning, and can be used for regional adjustment & The description or teaching of the enlargement of the liquid crystal display device of the backlight unit. In particular, it is an object of the present invention to provide a light source unit which is capable of realizing heat dissipation and thinning by area dimming, a light unit including the light source unit, and a thin display device including the backlight unit. According to a first aspect of the present invention, a light source unit includes: one to a plurality of light sources; a flexible printed wiring board having one to a plurality of wiring layers for arranging the one to the plurality of light sources; and a metal support The body has a second surface and a second surface for mounting the flexible printed wiring board, and the flexible printed wiring board is used for the purpose of promoting heat dissipation. a flexible printed wiring board. The vicinity of the light source in a region immediately below the light source and the remote region away from the light source in the vicinity of the light source; the vicinity of the light source and the remote region of the light source are respectively connected to the first surface of the metal support In the state of contact with the second surface, one to a plurality of wiring layers are dispersed in a region near the light source and a distant region of the light source. According to the above configuration, the heat generated when the light source is driven can be transferred to the first surface and the second surface of the metal support. Therefore, a plurality of heat dissipation paths to the metal support can be provided to achieve good heat dissipation. Further, by disposing one to a plurality of wiring layers dispersed in a region near the light source and a distant region of the light source, the thermal impedance in the vicinity of the light source can be made small. In particular, when it is necessary to form a plurality of wiring layers in a layered manner, the number of layers of the wiring layer as a whole of the flexible printed wiring board can be reduced, and the vicinity of the light source can be reduced. The thickness of the area 201221831 '',. Therefore, the heat generated when the light source is driven can rapidly transfer heat and dissipate heat to the metal support in a state of being in contact with the vicinity of the light source. Therefore, even if the wiring layer is multi-layered, the thermal resistance of the heat generated when the light source is driven reaches the metal support can be reduced, and the temperature rise of the light source can be suppressed. As a result, it is possible to effectively prevent the deterioration of the luminance characteristics of the light source. In addition, in the case where it is necessary to increase the number of wiring layers, the number of layers of the wiring layer as a whole of the flexible printed wiring board can be reduced. Thereby, the size of the entire light source unit can be reduced, and the thickness of the light source unit can be reduced. Preferably, the number of layers of the wiring layer provided in the vicinity of the light source is set to be equal to or less than the number of layers of the wiring layer in the remote region of the light source. According to the above configuration, the thickness of the region near the light source which is required to rapidly dissipate heat to the metal support can be made less than or equal to the thickness of the remote region of the light source. Preferably, the 'metal support body is a rectangular parallelepiped', the first surface is the upper surface of the metal support body, the second surface is one side of the metal support body, the vicinity of the light source is in contact with the upper surface of the metal support body, and the far side of the light source is in contact with the metal support body. One side. According to the above configuration, heat generated in the light source can be transferred to both the upper surface and the one side surface of the metal supporting body. Therefore, a plurality of heat dissipation paths can be formed to achieve good heat dissipation. Preferably, the metal support is a rectangular parallelepiped, the first surface is the upper surface of the metal support, and the second surface is the two sides of the metal support. The vicinity of the light source is in contact with the upper surface of the metal support, and the remote region of the light source is in contact with the metal support. Both sides. According to the above configuration, the heat generated by the light source can be transferred to the metal branch, and the three sides of the two sides can be used. Therefore, a plurality of heat dissipation paths can be formed to achieve good heat dissipation. Preferably, the one to the plurality of light sources are formed by one to a plurality of light sources to a plurality of light source groups, and each of the light source groups or the light sources is controlled by 〇N and 〇FF. According to the above configuration, in the light source unit using the area dimming, good heat dissipation and thinning can be achieved. According to a second aspect of the present invention, a backlight unit is provided, and the light source unit according to the first aspect is used. According to the above configuration, a practical backlight unit can be constructed. According to the third aspect of the present invention, the backlight unit of the second aspect can be used. According to the above 槿a. Also, .u
裝置之大型化。 種薄型顯示器裝 可實現能實現良好之散熱性與薄型化 又，即使使配線層多層化之情形，亦 性惡化，藉此能實現薄型顯示器The size of the device is large. A thin display device can achieve good heat dissipation and thinning, and even if the wiring layer is multi-layered, it is deteriorated, thereby enabling a thin display.
源單元之背光單元、 具備該光源單元之背光單 之薄型顯示器裝置，尤其是在採用 能實現良好之散熱性與薄型化。 針對本發明之光源單 及具備該背光單元之薄 源皁元、具備該光 之薄型顯示器裝置 201221831 說明複數個實施形態。然而，以下之說明係本發明之實施 形態，並非限定申請專利範圍記載之内容。 首先，參照圖1〜圖3，針對本發明第丨實施形態之光 源單元100、具備該光源單元1〇〇之背光單元1、及具備該 背光單元1之薄型顯示器裝置進行說明。 如圖1所示，在液晶顯示器300之背面設有由4個光 源單元100及導光板200構成之背光單元卜導光板2〇〇與 液晶顯示器300之背面對向配置並使光往液晶顯示器3〇〇 射出。光源單元100係使光從導光板2〇〇之下端面往導光 板200内射入之所謂側光方式者。 如上述藉由採用側光方式能實現背光單元丨之薄型化。 又，藉由光源單元100與導光板2〇〇構成使光往液晶 顯示器300之背面射出之背光單元1β主要藉由此背光單元 1與液晶顯示器300構成顯示各種影像之詳細未圖示之薄型 顯示器裝置。 該各光源單元1〇〇係具備分別由i個至複數個光源i 1〇 構成之複數個光源群、就各光源群進行ON、〇FF控制之採 用所謂區域調光之光源單元。 各光源單元100 ’如圖2(a)所示’係由光源i丨〇、可撓 性印刷配線板120、金屬支承體13〇、及接著劑層140構成。 該光源110係透過焊料Η構裝於可撓性印刷配線板12〇 之上面。光源110係朝向導光板200照射光之發光元件。 本實施形態中’作為光源1 1 0係使用LED。 作為光源110使用LED，能實現省能量性優異且高壽 201221831 命之光源單元100。 又’本第1實施形態中，光源！ 10形成由i個至複數 個光源110構成之光源群。各光源群係藉由未圖示之控制 部被個別地ON、OFF控制。 更具體而言，本實施形態中，如圖丨、圖2(b)所示，以 分別由1個光源1 1 0構成之5個光源群p，Q，R，s，τ形成J 個光源單兀100。又，如圖1所示，4個光源單元1〇〇係配 置成朝向導光板200之下端面。 此外，配置成朝向導光板200之下端面之光源單元1〇〇 之數罝、構成光源單元1 〇〇之光源群之數量、構成光源群 之光源110之數量、配置位置等之構成並不限於本實施形 態，可適當變更。 上述可撓性印刷配線板120係具備將光源丨1〇與未圖 示之外部配線彼此加以電氣連接且用以使在光源群p，Q，R， S，T驅動時產生之熱散熱之功能之印刷基板。 本第1實施形態中，可撓性印刷配線板丨2 〇係在表面 背面兩面積層有導電性金屬箔之所謂兩面可撓性印刷配線 板。 又’可撓性印刷配線板120包含：包含緊鄰光源u 〇 之下方之光源附近區域N、與遠離光源11〇之光源遠方區域 F。可撓性印刷配線板120，如圖2(a)所示，隔著接著劑層 140以折曲狀態、亦即90度折曲之狀態安裝於金屬支承體 13 0。更具體而言，光源附近區域n係設成與作為金屬支承 體130之第1面之上面接觸之狀態，光源遠方區域ρ係設 201221831 成與作為金屬支承體130之第2 & &咕 側面接觸之狀態。 卜，此處，第1面、第2面係 ^ ^ ^ , h 、〜才曰構成金屬支承體 之面之中、設與光源附近區 u U 面為第1面、設與 该第1面不同之面為第2面之概令。 r ^ , rt 心亦即，例如金屬支承 體為長方體之情形，與光源附近區域N面接觸之面為上面 i δ ’ 外之面（侧面 '與上面相反側之 下面)為第2面。又’金屬支承體為多面體之情形，與光源 附近區域Ν接觸之面為^面，其餘之面為^面。例如， 金屬支承體為具有在下方開口且沿著長邊方向延伸之槽之 通道形狀亦可。 具有彎曲面之情 。此情形，與光 1面接線不同之 再者，上述概念為亦包含金屬支承體 形、例如金屬支承體為球體之情形之概念 源附近區域Ν接觸之面為第1面，與該第 面為第2面。 此可撓性印刷配線板120,如圖2(a)所示，係由基材層 121、配線層122、覆蓋膜層123構成。此等層121〜123在 光源附近區域N與金屬支承體130之第1面、亦即上面平 行延伸’在光源遠方區域F與金屬支承體130之第2面、 亦即側面平行延伸。 上述基材層121係作為可撓性印刷配線板丨2 〇之基 台，以絕緣性之樹脂膜形成。 作為樹脂膜，係使用由柔軟性優異之樹脂材料構成 者。只要為例如聚醯亞胺膜或聚酯膜等作為形成可撓性印 刷配線板之樹脂膜一般使用者，則何者皆可。 201221831 又，尤其是樹脂膜以除了柔軟性之外亦具有高耐熱性 為佳。可較佳使用例如聚醯胺系之樹脂膜、聚醯亞胺、聚 醯胺醯亞胺等聚醯亞胺系之樹脂膜、或聚萘二甲酸乙二醇 酉旨。 - 又作為财熱性樹脂，只要為聚醯亞胺樹脂、環氧樹 脂等作為形成可撓性印刷配線板之耐熱性樹脂一般使用 者，則何者皆可。 又，基材層121之厚度以3〜1〇〇 程度為佳。 上述配線層122係具備用以進行光源丨1〇與外部配線 之電器連接或各光源群之控制之電路配線之由導電性金屬 箔構成之層。 此配線層122係藉由在基材層121積層丨層至複數層 之導電性金屬箔而形成。 本第1實施形態中，在基材層12丨之表面背面分別積 層1層配線層122。積層在基材層121之表面之配線層122 為第1配線層122a’積層在基材層121之背面之配線層122 為第2配線層122b。 又’如圖2、圖3之一部分所示，在第i配線層 及第2配線層122b以能對各光源群分別控制光源群p，q，r， S，T之方式，設置與各光源群對應之複數個電路配線。更 具體而言，形成在第i配線層12以之電路配線之一部分係 作用為共通陰極電路配線，形成在第i配線層122a之電路 配線之一部分及形成在第2配線層122b之電路配線係作用 為控制光源群1(^11，8，丁之陽極電路配線。又，如圖3^) 201221831 之一部分所示’構成陽極電路配線之第！配線層丨22a與第 2配線層1 22b係透過盲導通孔b電氣連接。 再者’本第1實施形態中’如圖2(a)所示，配線層122 係分散a又在光源附近區域N與光源遠方區域F β更具體而 言，在設成與金屬支承體130之上面接觸之狀態之光源附 近區域Ν設有第1配線層122a之1層，在設成與金屬支承 體130之側面接觸之狀態之光源遠方區域F設有第1配線 層122a與第2配線層122b之2層。 藉由此種構成’在光源11()驅動時產生之熱可透過熱 傳導率高之配線層122傳熱至金屬支承體130之上面與一 側側面之2面。因此’能設置複數個散熱路徑，實現良好 之散熱性。 又，可撓性印刷配線板120，在圖3(a)、（b)假想線（一 點鏈線）所示之位置折曲，安裝於金屬支承體13(^因此， 如圖2(a)所示，能使對各光源群進行〇N/〇FF控制之陽極電 路配線之大部分配置在光源遠方區域F。因此，能使配置在 光源附近區域N之配線層122之積層數減少，能使光源附 近區域N之熱阻抗變小。 又’尤其是在必須使配線層丨22多層化之情形，相較 於僅在光源附近區域N形成複數個配線層之情形能使作 為可撓性印刷配線板12〇整體之配線層122之積層數減 使光源附近區域N之厚度變小。 因此，在光源1 10驅動時產生之熱町迅速傳熱、散熱 至處於與光源附近區域N接觸之狀態之金屬支承體130。是 ⑧ 12 201221831 以，即使使配線層122多層化之情形，亦可使在光源ΐι〇 驅動時產生之熱到達金屬支承體130為止之熱阻抗變小， 抑制光源之溫度上升。其結果’能有效防止光源丨1〇之亮 度特性惡化。 又’尤其是’在必須使配線層122多層化之情形，能 使作為可撓性印刷配線板120整體之配線層丨22之積層數 減少。藉此’能使光源單元100整體之大小小型化，實現 光源單元100之薄型化。 因此’在採用區域調光之光源單元1〇〇，能實現良好之 散熱性與薄型化。 上述效果’在使配置在構成光源單元丨〇〇之可撓性印 刷配線板120内之配線層122之積層數進一步增加之情形 變得更顯著。 此外’形成在第1配線層122a及第2導電層122b之電 路配線能使用將由積層在基材層121之兩面之導電性金屬 ’名構成之配線層122蝕刻等公知之形成方法來形成。 此外’本第1實施形態中，作為導電性金屬箔係使用 銅（Cu)。當然’導電性金屬箔之材料並不限於銅（Cu)，只要 為作為形成可撓性印刷配線板之配線層之導電性金屬笛一 般使用者，則何者皆可。 又’配線層122之厚度以35 " m程度為佳。 又’配線層12 2之層數或配置位置、電路配線之數或 配置位置等之構成亦不限於本第1實施形態，可適當變更。 例如’設在光源附近區域N之配線層122之層數與設 13 201221831 在光源遠方區域F之配線層12 2之層數相同亦可。又，設 在光源附近區域N之配線層1 22之層數與設在光源遠方區 域F之配線層122之層數不同亦可。然而，較佳為，設在 光源附近區域N之配線層122之層數為設在光源遠方區域ρ 之配線層122之層數以下。藉由此種構成，能使要求往金 屬支承體130之迅速散熱性之光源附近區域N之厚度為光 源遠方區域F之厚度以下。 上述覆蓋膜層123係形成可撓性印刷配線板120之絕 緣層之層。此覆蓋膜層12 3係藉由透過由例如熱硬化性接 著劑構成之未圖示之覆蓋膜接著劑將覆蓋膜黏貼在基材層 121及配線層122上而形成《又，在覆蓋膜層123，在與光 源11 0對應之位置形成有用以填充焊料Η之貫通孔。 此外，作為覆蓋膜，可使用例如聚醯亞胺膜、感光性 光阻、液狀光阻。 又’覆蓋膜層123之厚度以1〇〜2〇〇 " m程度為佳。 此外，本第1實施形態中，可撓性印刷配線板〖2 〇僅 由基材層12 1、配線層122、覆蓋膜層123形成，但未必限 於此構成。例如在可撓性印刷配線板12〇内不形成電路配 線’設置用以使光源1 1 〇驅動時產生之熱散熱之由導電性 金屬箔構成之散熱層亦可。 上述金屬支承體1 3 0 ’藉由安裝於可撓性印刷配線板 120能促進光源群p，q，R，s，τ驅動時產生之熱之散熱且作 為光源單元1〇〇之基台。 本第1實施形態中，作為金屬支承體13〇係使用鋁 201221831 (丨）备.、、、金屬支承體130之材料不限於鋁（A丨），只要為 作為構成光源單元之金屬支承體—般使用者’則何者皆可。 此外，=屬支承體130之厚度以2〜1〇mm程度為佳。 上述接著劑層140係、用以將構裝有光源、川之可挽性 印刷配線板120與金屬支承體13〇彼此安裝之層。 又’作為接著劑，可使用例如環氧系接著劑、丙烯酸 系接著劑。 又，接著劑層140之厚度以1〇〜1〇〇#m程度為佳。 上述導光板200係將來自光源單元1〇〇之光導向液晶 顯示器300射出者。 更具體而言，如圖i所示，從光源單元1〇〇射出之光 從光入射端面210射入至導光板2〇〇内。射入至導光板2〇〇 内之光，在板厚内全反射並同時從光出射端面22〇往朝向 液晶顯示器3 0 0之方向射出。 此外，作為導光板2〇〇之材質，只要為例如樹脂等作 為形成導光板之材質一般使用者，則使用任何材質皆可。 此外’本第1實施形態中’僅以光源單元10 〇及導光 板200形成背光單元卜但並不限於上述構成。將例如反射 片、光學片等作為構成背光單元之構件一般使用之構件與 光源單元100及導光板2〇〇組合來形成背光單元1亦可。 上述液晶顯示器3 0 0係在詳細未圖示之薄型顯示器裝 置顯示影像之顯示裝置。 此外’液晶顯示器300之大小、形狀等之構成並不限 於本第1實施形態，可適當變更。 15 201221831 此外，本第i實施形態中，採用區域調光之光源單元 100’係以就各光源群分別進行〇N、〇FF控制之方式構成。 更具體而言，以由1個光源i 10構成之5個光源群p，Q，R， s，τ構成1個光源單元10〇，且就各光源群p, Q，r，s, τ分 別進行ON、OFF控制《然而，並不限於此構成。 例如採用區域調光之光源單元係以分別由複數個光源 構成之複數個光源群形成亦可。此外，藉由將光源群内之 光源並聯’除了各光源群之ON、〇FF控制之外，對光源群 内之各光源分別進行ON、OFF控制亦可。藉由上述構成， 在採用區域調光之光源單元，能實現光源群間及光源群内 之光源間之亮度之均勻化與高散熱性。又，由於可提升照 明之自由度，因此可實現多彩之照明。 接著’參照圖4進一步說明在使配置在構成光源單元 之可撓性印刷配線板内之配線層之積層數進一步增加之情 形、亦即多層化之情形之本發明之效果。更具體而言，將 作為比較例之將由複數層構成之配線層僅配置在光源附近 區域之光源單元400與本發明第2實施形態之光源單元5〇〇 加以比較來說明本發明之效果。 本發明第2實施形態之光源單元5 0 0相對於上述本發 明第1實施形態之光源單元100，配線層之層數及形成在配 線層之電路配線之數量增加。 此外，針對光源單元400，500，對與上述本發明第j 貫施形態之光源單元1 〇 〇相同構件、達成相同效果者賦予 相同之末二位號碼及英文字母以省略其說明。 201221831 如圖4(a)所示，光源單元400具備僅在光源附近區域N 積層第1配線層422a〜第4配線層422d之4層之配線層422 而多層化之可撓性印刷配線板420。在光源單元4〇〇，僅在 光源附近區域N積層基材層421、配線層422、覆蓋膜層 423、及接著劑層424。 因此，光源4 10驅動時產生之熱到達金屬支承體43〇 為止之熱阻抗增加，光源i丨〇之元件溫度上升，光源i i 〇 之亮度特性有可能惡化。 相對於此’本發明第2實施形態之光源單元500中， 配線層522分散於光源附近區域N與光源遠方區域f。藉 此，能將配線層522之大部分配置在光源遠方區域F。 更八體而〇，此s又配置在光源附近區域N之配線層522 之層數為1層、配置在光源遠方區域F之配線層522之層 數為 3 層（522a，522b，522c)。 藉此，配置在光源附近區域N之配線層522之積層數 或形成在光源附近區域N之電路配線之數量減少。其結果， 能使光源附近區域N之厚度變小’能使光源附近區域N之 熱阻抗變小。 示，藉由採用本發明第2The backlight unit of the source unit and the thin display device including the backlight unit of the light source unit can achieve good heat dissipation and thinning, in particular. A plurality of embodiments will be described with respect to the light source unit of the present invention, a thin-source soap unit including the backlight unit, and a thin display device having the light 201221831. However, the following description is an embodiment of the present invention and is not intended to limit the scope of the claims. First, a light source unit 100 according to a first embodiment of the present invention, a backlight unit 1 including the light source unit 1A, and a thin display device including the backlight unit 1 will be described with reference to Figs. 1 to 3 . As shown in FIG. 1 , a backlight unit composed of four light source units 100 and a light guide plate 200 is disposed on the back surface of the liquid crystal display 300, and the light guide plate 2 〇〇 is disposed opposite to the back surface of the liquid crystal display 300 and the light is directed to the liquid crystal display 3 . Hey shot. The light source unit 100 is a so-called side light method in which light is incident from the lower end surface of the light guide plate 2 to the light guide plate 200. As described above, the backlight unit can be made thinner by using the side light method. Further, the backlight unit 1β configured to emit light to the back surface of the liquid crystal display 300 by the light source unit 100 and the light guide plate 2 is mainly composed of a backlight unit 1 and a liquid crystal display 300, and a thin display having a detailed image (not shown) for displaying various images. Device. Each of the light source units 1 includes a plurality of light source groups each of which is composed of i to a plurality of light sources i 1 , and a light source unit that uses a so-called area dimming for ON and FF control of each light source group. Each of the light source units 100' is composed of a light source i, a flexible printed wiring board 120, a metal support 13A, and an adhesive layer 140 as shown in Fig. 2(a). The light source 110 is mounted on the flexible printed wiring board 12A via a solder paste. The light source 110 is a light-emitting element that illuminates light toward the light guide plate 200. In the present embodiment, an LED is used as the light source 1 1 0. By using the LED as the light source 110, it is possible to realize the light source unit 100 which is excellent in energy efficiency and high in life. Further, in the first embodiment, the light source! 10 forms a light source group consisting of i to a plurality of light sources 110. Each of the light source groups is individually turned ON and OFF by a control unit (not shown). More specifically, in the present embodiment, as shown in FIG. 2 and FIG. 2(b), J light sources are formed by five light source groups p, Q, R, s, and τ each composed of one light source 1 10 . Single 兀100. Further, as shown in Fig. 1, four light source units 1 are arranged to face the lower end surface of the light guide plate 200. Further, the number of the light source units 1 that are disposed toward the lower end surface of the light guide plate 200, the number of the light source groups constituting the light source unit 1 , the number of the light sources 110 constituting the light source group, the arrangement position, and the like are not limited. This embodiment can be changed as appropriate. The flexible printed wiring board 120 is provided with a function of electrically connecting the light source 丨1〇 and an external wiring (not shown) to heat the heat generated when the light source groups p, Q, R, S, and T are driven. Printed substrate. In the first embodiment, the flexible printed wiring board 2 is a so-called double-sided flexible printed wiring board having a conductive metal foil on both surfaces of the front and back surfaces. Further, the flexible printed wiring board 120 includes a light source remote region F including a region N near the light source immediately below the light source u 、 and a light source 11 away from the light source 11 . As shown in Fig. 2(a), the flexible printed wiring board 120 is attached to the metal supporting body 130 in a state in which the adhesive layer 140 is bent in a bent state, that is, 90 degrees. More specifically, the region n near the light source is in contact with the upper surface of the first surface of the metal support 130, and the remote region ρ of the light source is provided with 201221831 as the second && The state of side contact. Here, the first surface and the second surface system ^ ^ ^ , h , and 曰 are formed on the surface of the metal support, and the U U surface adjacent to the light source is the first surface, and the first surface is provided. The difference is the general description of the second side. r ^ , rt is the case where, for example, the metal support is a rectangular parallelepiped, and the surface in contact with the N surface in the vicinity of the light source is the surface on the outer surface i δ ′ (the side surface 'below the opposite side from the upper side) is the second surface. Further, in the case where the metal supporting body is a polyhedron, the surface in contact with the region near the light source is a surface, and the other surface is a surface. For example, the metal support may have a channel shape having a groove that is open at the lower side and extends in the longitudinal direction. Has a curved face. In this case, the first aspect is different from the one-side wiring. The above concept is also a metal support body shape. For example, in the case where the metal support is a sphere, the contact area is the first surface in the vicinity of the concept source, and the first surface is the first surface. 2 sides. As shown in Fig. 2(a), the flexible printed wiring board 120 is composed of a base material layer 121, a wiring layer 122, and a cover film layer 123. The layers 121 to 123 extend in parallel with the first surface of the metal support 130 in the vicinity of the light source, i.e., the upper surface of the metal support 130. The light source remote region F extends parallel to the second surface of the metal support 130, that is, the side surface. The base material layer 121 is formed of an insulating resin film as a base of the flexible printed wiring board 丨2. As the resin film, a resin material excellent in flexibility is used. Any of them may be used as a resin film for forming a flexible printed wiring board, for example, a polyimide film or a polyester film. 201221831 Further, in particular, the resin film preferably has high heat resistance in addition to flexibility. For example, a polyimide film such as a polyamide film, a polyimide film such as polyimide or imide, or a polyethylene naphthalate film or polyethylene naphthalate can be preferably used. - As a heat-sensitive resin, any of them can be used as a heat-resistant resin for forming a flexible printed wiring board, such as a polyimide resin or an epoxy resin. Further, the thickness of the base material layer 121 is preferably from 3 to 1 Torr. The wiring layer 122 is provided with a layer made of a conductive metal foil for connecting the light source 丨1〇 to the external wiring or the circuit wiring for controlling the respective light source groups. This wiring layer 122 is formed by laminating a layer of tantalum layer to a plurality of layers of a conductive metal foil on the base material layer 121. In the first embodiment, one wiring layer 122 is laminated on the front and back surfaces of the base material layer 12A. The wiring layer 122 laminated on the surface of the base material layer 121 is the first wiring layer 122a. The wiring layer 122 laminated on the back surface of the base material layer 121 is the second wiring layer 122b. Further, as shown in a part of FIG. 2 and FIG. 3, the ith wiring layer and the second wiring layer 122b are provided so as to be capable of controlling the light source groups p, q, r, S, and T for each of the light source groups. A plurality of circuit wirings corresponding to the group. More specifically, one portion of the circuit wiring formed in the i-th wiring layer 12 functions as a common cathode circuit wiring, and one portion of the circuit wiring formed in the i-th wiring layer 122a and the circuit wiring system formed on the second wiring layer 122b The function is to control the light source group 1 (^11, 8, Ding's anode circuit wiring. Also, as shown in Figure 3). The wiring layer 22a and the second wiring layer 1 22b are electrically connected to each other through the blind via hole b. Further, in the first embodiment, as shown in FIG. 2(a), the wiring layer 122 is dispersed a, and in the vicinity of the light source region N and the light source remote region Fβ, more specifically, the metal support body 130 is provided. The first wiring layer 122a is provided in the vicinity of the light source in the state in which the upper surface is in contact with the first wiring layer 122a, and the first wiring layer 122a and the second wiring are provided in the light source remote region F in a state of being in contact with the side surface of the metal supporting body 130. Two layers of layer 122b. The heat generated by the light source 11 (?) is transmitted through the wiring layer 122 having a high thermal conductivity to the upper surface of the metal support 130 and the side surfaces of the one side. Therefore, a plurality of heat dissipation paths can be set to achieve good heat dissipation. Further, the flexible printed wiring board 120 is bent at a position indicated by the imaginary line (a dot chain line) in Figs. 3(a) and 3(b), and is attached to the metal supporting body 13 (^, therefore, as shown in Fig. 2(a) As shown in the figure, most of the anode circuit wirings for performing 〇N/〇FF control on each of the light source groups can be disposed in the remote region F of the light source. Therefore, the number of layers of the wiring layer 122 disposed in the region N near the light source can be reduced. The thermal resistance of the region N in the vicinity of the light source is made smaller. In particular, in the case where the wiring layer 22 must be multilayered, it can be used as a flexible printing as compared with the case where only a plurality of wiring layers are formed only in the vicinity N of the light source. The number of layers of the wiring layer 122 of the entire wiring board 12 is reduced, so that the thickness of the region N near the light source is reduced. Therefore, the heat generated in the driving of the light source 110 rapidly transfers heat and dissipates to a state in contact with the region N near the light source. The metal support body 130 is 8 12 201221831, so that even if the wiring layer 122 is multi-layered, the thermal resistance generated when the heat generated by the light source 〇ι is driven to the metal support body 130 is reduced, and the temperature of the light source is suppressed. Rise. The result 'can In addition, in the case where the wiring layer 122 must be multilayered, the number of layers of the wiring layer 22 as the entire flexible printed wiring board 120 can be reduced. The size of the entire light source unit 100 can be reduced, and the light source unit 100 can be made thinner. Therefore, in the light source unit 1 that uses the area dimming, good heat dissipation and thinning can be achieved. The number of layers of the wiring layer 122 in the flexible printed wiring board 120 constituting the light source unit 进一步 is further increased. Further, the circuit wiring formed in the first wiring layer 122a and the second conductive layer 122b is formed. It can be formed by a well-known formation method, such as etching of the wiring layer 122 which consists of a conductive metal of the both surfaces of the base material layer 121. Moreover, in this 1st embodiment, copper (Cu is used as a conductive metal foil system. Of course, the material of the conductive metal foil is not limited to copper (Cu), and is generally used as a conductive metal flute as a wiring layer for forming a flexible printed wiring board. The thickness of the wiring layer 122 is preferably 35 " m. The configuration of the number of layers of the wiring layer 12, the arrangement position, the number of circuit wirings, or the arrangement position is not limited to the first implementation. For example, the number of layers of the wiring layer 122 provided in the region N near the light source may be the same as the number of layers of the wiring layer 12 2 in the remote region F of the light source 13 201221831. The number of layers of the wiring layer 1 22 may be different from the number of layers of the wiring layer 122 provided in the remote region F of the light source. However, it is preferable that the number of layers of the wiring layer 122 provided in the region N near the light source is set to be distant from the light source. The number of layers of the wiring layer 122 of the region ρ is equal to or less. With such a configuration, the thickness of the region N near the light source required for rapid heat dissipation to the metal support 130 can be made equal to or less than the thickness of the light source remote region F. The cover film layer 123 is a layer forming an insulating layer of the flexible printed wiring board 120. The cover film layer 12 is formed by adhering a cover film to the base material layer 121 and the wiring layer 122 by a cover film adhesive (not shown) made of, for example, a thermosetting adhesive. 123. A through hole for filling the solder bump is formed at a position corresponding to the light source 110. Further, as the cover film, for example, a polyimide film, a photosensitive photoresist, or a liquid photoresist can be used. Further, the thickness of the cover film layer 123 is preferably 1 〇 to 2 〇〇 " m. Further, in the first embodiment, the flexible printed wiring board is formed of only the base material layer 12 1 , the wiring layer 122 , and the cover film layer 123 , but the configuration is not limited thereto. For example, a heat dissipation layer made of a conductive metal foil for dissipating heat generated when the light source 1 1 〇 is driven is not formed in the flexible printed wiring board 12A. The metal supporting body 1 30 ' is mounted on the flexible printed wiring board 120 to promote heat dissipation by heat generated when the light source groups p, q, R, s, and τ are driven, and serves as a base of the light source unit 1 . In the first embodiment, the metal support body 13 is made of aluminum 201221831, and the material of the metal support 130 is not limited to aluminum (A丨), and is a metal support body constituting the light source unit. The general user's can do anything. Further, the thickness of the genus support body 130 is preferably about 2 to 1 mm. The adhesive layer 140 is a layer for mounting a light source, a switchable printed wiring board 120, and a metal support 13 to each other. Further, as the adhesive, for example, an epoxy-based adhesive or an acrylic adhesive can be used. Further, the thickness of the adhesive layer 140 is preferably from 1 〇 to 1 〇〇 #m. The light guide plate 200 guides the light from the light source unit 1 to the liquid crystal display 300. More specifically, as shown in Fig. 1, light emitted from the light source unit 1 is incident from the light incident end surface 210 into the light guide plate 2A. The light incident into the light guide plate 2 is totally reflected in the thickness of the plate and simultaneously emitted from the light exit end face 22 toward the liquid crystal display 300. Further, as the material of the light guide plate 2, any material may be used as the material for forming the light guide plate, for example, a resin. Further, in the first embodiment, the backlight unit is formed only by the light source unit 10A and the light guide plate 200, but the configuration is not limited thereto. For example, a reflector, an optical sheet, or the like may be used as a member for generally constituting a backlight unit, and the light source unit 100 and the light guide plate 2 may be combined to form the backlight unit 1. The liquid crystal display 300 is a display device for displaying an image on a thin display device (not shown). Further, the configuration of the size, shape, and the like of the liquid crystal display 300 is not limited to the first embodiment, and can be appropriately changed. 15 201221831 Further, in the present embodiment, the light source unit 100' using the area dimming is configured to perform 〇N and 〇FF control for each of the light source groups. More specifically, the five light source groups p, Q, R, s, and τ composed of one light source i 10 constitute one light source unit 10 〇, and each of the light source groups p, Q, r, s, τ ON and OFF control are performed "However, it is not limited to this configuration. For example, the light source unit using the area dimming may be formed by a plurality of light source groups each composed of a plurality of light sources. Further, by connecting the light sources in the light source group in parallel, in addition to the ON and 〇FF control of the respective light source groups, each of the light sources in the light source group may be turned ON or OFF. According to the above configuration, the light source unit using the area dimming can achieve uniformity of luminance and high heat dissipation between the light source groups and between the light sources in the light source group. Moreover, since the freedom of illumination can be improved, colorful illumination can be realized. Next, the effect of the present invention in the case where the number of layers of the wiring layers disposed in the flexible printed wiring board constituting the light source unit is further increased, that is, multi-layered, will be further described with reference to Fig. 4 . More specifically, the light source unit 400 in which the wiring layer composed of the plurality of layers is disposed only in the vicinity of the light source is compared with the light source unit 5A according to the second embodiment of the present invention as a comparative example, and the effects of the present invention will be described. In the light source unit 100 according to the first embodiment of the present invention, the number of layers of the wiring layer and the number of circuit wirings formed in the wiring layer are increased. In the light source unit 400, 500, the same components as those of the light source unit 1 according to the above-described first embodiment of the present invention and the same effects are obtained, and the same last two digits and letters are given to omit the description. As shown in FIG. 4(a), the light source unit 400 includes a flexible printed wiring board 420 which is formed by stacking four wiring layers 422 of the first to fourth wiring layers 422a to 422d in the vicinity of the light source region N. . In the light source unit 4, the base material layer 421, the wiring layer 422, the cover film layer 423, and the adhesive layer 424 are laminated only in the region N near the light source. Therefore, the thermal resistance of the heat generated when the light source 4 10 is driven reaches the metal support 43A increases, and the temperature of the element of the light source i 上升 rises, and the luminance characteristic of the light source i i 有 may deteriorate. In the light source unit 500 according to the second embodiment of the present invention, the wiring layer 522 is dispersed in the light source vicinity region N and the light source remote region f. Thereby, most of the wiring layer 522 can be disposed in the remote region F of the light source. Further, the number of layers of the wiring layer 522 disposed in the vicinity of the light source N is one layer, and the number of layers of the wiring layer 522 disposed in the far region F of the light source is three layers (522a, 522b, 522c). Thereby, the number of layers of the wiring layer 522 disposed in the region N near the light source or the number of circuit wirings formed in the region N near the light source is reduced. As a result, the thickness of the region N in the vicinity of the light source can be made small, and the thermal resistance of the region N in the vicinity of the light source can be made small. Shown by using the second invention of the present invention
是以’如圖4(a)、（b)之箭頭所示， 實施形態之光源單元500之構成，相泰 使在光源驅動時產生之熱迅速傳熱、 17 201221831 藉由使用厚度小之可撓性印刷配線板520，如圖4(b)所示能 使光源單το 500之寬度w變小。是以，能實現光源單元5〇〇 之薄型化。 藉此’在採用區域調光之光源單元5〇〇，能實現良好之 散熱性與薄型化。再者’可實現採用所謂側光方式之背光 單元之薄型化。 又，即使是使配線層進一步多層化之情形，亦能有效 防止光源之亮度特性惡化。藉此，能實現未圖示之薄型顯 示器裝置之大型化。 又’在光源單元400與光源單元5〇〇在可撓性印刷配 線板内形成相同數量之電路配線之情形，在光源單元5〇〇， 能使每一層可形成之電路配線之數量較光源單元4〇〇之構 成增加。因此，能使作為可撓性印刷配線板整體之配線層 之層數減少。 更具體而言，假設配置在光源單元4〇〇，5〇〇之電路配 線之數量為圖4(a)、（b)圖示之僅16條之情形，在光源單元 400配線層422合計需4層，但在光源單元5〇〇配線層522 合計3層即可。因此，能構成低成本化、可容易製造之光 源單元5 0 0。 此外’光源單元400及光源單元5〇〇係使用將複數片 可撓性印刷配線板貼合之可撓性印刷配線板。亦即使用隔 著用以形成多層板之接著劑層424，524將2片可撓性印刷 配線板貼合之可撓性印刷配線板。當然，所謂多層板之構 成並不限於此構成。 18 201221831 又，作為形成接著劑層 如醯亞胺系接著劑、環氧系 使用片狀、膠狀等將複數片 所謂多層板而一般使用者。 424，524之接著劑，可使用例 接著劑。又，接著劑之性狀可 可撓性印刷配線板貼合、形成 接著，參照圖5說明本發明第3實施形態之光源單元 600 〇 本發明第3實施形態之光源單元_相對於上述本發 明第1實施形態之光源單元⑽，變更光源遠方區域之構 成。關於其他構成與本發明第丨實施形態相同。對相同構 件、達成相同效果者賦予相同之末二位號碼及英文字母以 省略其說明。 參照圖5，本發明第3實施形態之光源單元6〇〇，光源 遠方區域F係設在金屬支承體63〇之兩側。更具體而言， 光源附近區域N係設成與作為金屬支承體63〇之第1面之 上面接觸之狀態。光源遠方區域F係設成與作為金屬支承 體630之第2面之左右兩側面接觸之狀態。光源附近區域N 與光源遠方區域F分散設在配線層6 2 2。亦即，可撓性印刷 配線板620折曲成在下方開口之通道狀而安裝於金屬支承 體630之上面及兩側面。 藉由上述構成，能使光源6 1 0驅動時產生之熱傳熱至 金屬支承體630之上面與左右侧面之3面。因此，能使往 金屬支承體630之散熱路徑進一步增加。因此，在採用區 域調光之光源單元600 ’能進一步實現良好之散熱性。 又，即使是必須使配線層622多層化之情形，亦能在 19 201221831 左右之光源遠方區域F分散設置配線層622。因此，能使作 為可繞性印刷配線板620整體之配線層622之積層數進一 步減少。因此，能實現低成本化、可容易製造之光源單元 600 〇 又’可形成更多之電路配線，可進一步實現未圖示之 薄型顯示器裝置之大型化與薄型化。 此外’上述本發明第1〜第3實施形態之光源單元1〇〇, 5 00, 600皆為採用區域調光之光源單元之構成，但未必要限 於此構成’構裝於光源單元之光源之驅動方法可適當變更。 (實施例） 以下，藉由實施例進一步詳細說明本發明，但本發明 並不限於此實施例。 (本發明之實施例） 作為42型液晶顯示器裝置之光源單元，在上下分別排 列配置橫寬54cm之2條光源單元。在各光源單元之中作為 光源係配置52個LEE^ LED係每4個直接配線成光源群而 可一次控制。採用對此等13組光源群分別進行控制之方式 (區域調光）。 作為可撓性印刷配線板，使用將鋼箔厚35 β m之配線 層在光源附近區域配置1層、在光源遠方區域配置3層之 多層板。 作為金屬支承體，係使用寬度4mm、厚度4mm、長度 54cm之紹材。 可撓性印刷配線板，在光源附近區域與光源遠方區域 20 201221831 之間折曲之狀態下，隔著接著劑層設成光源附近區域與金 屬支承體t上面接觸之狀態、《源遠方區域與金屬支承體 之單側側面接觸之狀態。短邊方向之剖面圖成為與圖2(a) 類似之形狀。 此外’作為接著劑層’使用具有〇.2W/mK之熱傳導率、 25 y m之厚度之接著片。接著片係由環氧系接著劑構成。 作為比較用’準備本發明與實施例僅在以下條件不同 之光源單元。 (比較例1) 不使可撓性印刷配線板折曲，隔著接著劑層設成僅光 源附近區域與金屬支承體之上面接觸之狀態。 (比較例2) 作為可撓性印刷配線板，由4層構成之配線層僅積層 在光源附近區域。短邊方向之剖面圖成為與圖4(a)類似之形 狀。 (比較例3) 作為印刷基板，使用金屬PCB(Printed Circuit Board)， 由4層構成之配線層僅積層在光源附近區域。短邊方向之 剖面圖成為與圖4(a)類似之形狀。 (比較例4) 作為印刷基板，使用玻璃環氧基板（FR4 : Flame Retardant Type _ 4)，由4層構成之配線層僅積層在光源附 近區域。 以相同條件將上述本發明之實施例、比較例1〜4之光 21 201221831 從尚溫者 1、本發 源群局部地點燈以測定光源群之溫度。其結果， 起依序為比_ 4、比較你J 2、比較你"、比 明之實施例。 很儸以上結果 棺田採用本發明之構成，在採用 九原皁兀牝有效防止光源群之溫度上升且右 效防止光源之亮度特性惡化。 【圖式簡單說明】 ㈣圖1係顯示本發明第1實施形態之背光單元的整體立 圖。 圖2係顯示本發明帛丨實施形態之光源單元的剖面 圖’圖2⑷係短邊方向的剖面圖，圖2(b)係沿著圖2⑷之X —X線的剖面圖。 圖3係顯示構成本發明第丨實施形態之光源單元之可 :丨生印刷酉己線板之折曲前之狀態的圖，目3⑷係短邊方向的 °J面圖’圖3⑻係俯視圖，圖3(c)係沿著圖3(b)之Υ - γ線 的剖面圖》 圖4係以示意方式顯示光源單元中熱之移動的剖面 圖，圖 4(a、在 & I * ”乐彳乍為比較例顯示將由複數層構成之配線層僅配 晉 jfc 、、S Π/ 、 ''才近區域之構成之光源單元的圖’圖4(b)係顯示 本發明第2實施形態之光源單元的圖。 圖5係顯示本發明第3實施形態之光源單元的圖，為 光源單；^ > 4 之短邊方向的剖面圖。 【主要元件符號說明】 B盲導通孔 22 201221831 F 光源遠方區域 Η 焊料 光源單元 光源 可撓性印刷配線板 基材層 配線層 Ν 光源附近區域 P, Q, R, S, Τ光源群 1 背光單元 100, 400, 500, 600 110, 410, 510, 610 120, 420, 520, 620 121, 421, 521, 621 122, 422, 522, 622 122a, 622a 第1配線層 122b, 622b 第2配線層 123, 423, 523, 623 覆蓋膜層 130, 430, 530, 630 金屬支承體 140, 424, 440, 5 24, 5 40, 640 接著劑層 200 導光板 210 光入射端面 220 光出射端面 300 液晶顯示器 422a〜422d 第1配線層〜第4配線層 522a〜522c 第1配線層〜第3配線層 23According to the configuration of the light source unit 500 of the embodiment as shown by the arrows in Figs. 4(a) and 4(b), the heat generated by the light source when the light source is driven is rapidly transferred, 17 201221831 by using a small thickness. As shown in FIG. 4(b), the flexible printed wiring board 520 can reduce the width w of the light source unit το 500. Therefore, the thinning of the light source unit 5A can be achieved. Therefore, in the light source unit 5A using the area dimming, good heat dissipation and thinning can be achieved. Furthermore, the thinning of the backlight unit using the so-called side light type can be realized. Further, even in the case where the wiring layer is further multilayered, the deterioration of the luminance characteristics of the light source can be effectively prevented. Thereby, the size of the thin display device (not shown) can be increased. Further, in the case where the light source unit 400 and the light source unit 5 are formed in the same number of circuit wirings in the flexible printed wiring board, in the light source unit 5, the number of circuit wirings that can be formed in each layer can be made larger than that of the light source unit. The composition of 4〇〇 is increased. Therefore, the number of layers of the wiring layer as the entire flexible printed wiring board can be reduced. More specifically, it is assumed that the number of circuit wirings disposed in the light source unit 4A, 5〇〇 is only 16 in the illustration of FIGS. 4(a) and 4(b), and the wiring layer 422 of the light source unit 400 is required in total. Four layers may be used, but the light source unit 5 〇〇 wiring layer 522 may be a total of three layers. Therefore, it is possible to constitute a light source unit 500 which is low in cost and can be easily manufactured. Further, the light source unit 400 and the light source unit 5 are made of a flexible printed wiring board in which a plurality of flexible printed wiring boards are bonded together. That is, a flexible printed wiring board in which two flexible printed wiring boards are bonded together by using an adhesive layer 424, 524 for forming a multilayer board. Of course, the constitution of the so-called multilayer board is not limited to this configuration. 18 201221831 Further, as a binder layer, for example, a bismuth imide-based adhesive, an epoxy-based sheet, a gel, or the like, a plurality of so-called multilayer sheets are used as a general user. For the adhesive of 424, 524, an example of a subsequent agent can be used. In addition, the light source unit 600 according to the third embodiment of the present invention will be described with reference to FIG. 5. The light source unit according to the third embodiment of the present invention is the first embodiment of the present invention. In the light source unit (10) of the embodiment, the configuration of the remote region of the light source is changed. The other configuration is the same as that of the third embodiment of the present invention. For the same component and the same effect, the same last two digits and English letters are given to omit the description. Referring to Fig. 5, in the light source unit 6A according to the third embodiment of the present invention, the light source remote region F is provided on both sides of the metal support body 63. More specifically, the region N near the light source is in a state of being in contact with the upper surface of the first surface of the metal support 63. The light source remote region F is in a state of being in contact with the left and right side faces of the second surface of the metal support 630. The area N near the light source and the far area F of the light source are dispersed in the wiring layer 6 2 2 . In other words, the flexible printed wiring board 620 is bent into a channel shape opened downward and attached to the upper surface and both side surfaces of the metal supporting body 630. According to the above configuration, heat generated when the light source 610 is driven can be transferred to the upper surface of the metal support 630 and the three sides of the left and right side surfaces. Therefore, the heat dissipation path to the metal support body 630 can be further increased. Therefore, good heat dissipation can be further achieved in the light source unit 600' using the area dimming. Further, even in the case where the wiring layer 622 has to be multilayered, the wiring layer 622 can be dispersedly disposed in the light source remote region F around 19 201221831. Therefore, the number of layers of the wiring layer 622 as a whole of the flexible printed wiring board 620 can be further reduced. Therefore, it is possible to realize a light source unit 600 that can be easily manufactured at a lower cost, and more circuit wiring can be formed, and it is possible to further increase the size and thickness of a thin display device (not shown). Further, the light source units 1A, 5, and 600 of the first to third embodiments of the present invention are configured to use a light source unit of a region dimming, but it is not necessarily limited to the configuration of a light source that is constructed in the light source unit. The driving method can be changed as appropriate. (Embodiment) Hereinafter, the present invention will be described in further detail by way of examples, but the invention is not limited to this embodiment. (Embodiment of the Invention) As a light source unit of a 42-type liquid crystal display device, two light source units each having a width of 54 cm are arranged vertically. Among the light source units, 52 LEE^LED systems are arranged as a light source system, and each of the four LEE^LED systems is directly wired to a light source group, and can be controlled at one time. The method of controlling the 13 groups of light sources is used separately (area dimming). As the flexible printed wiring board, a wiring board having a steel foil thickness of 35 μm is disposed in one layer in the vicinity of the light source, and a multilayer board in which three layers are disposed in the remote region of the light source. As the metal support, a material having a width of 4 mm, a thickness of 4 mm, and a length of 54 cm was used. In the state in which the flexible printed wiring board is bent between the vicinity of the light source and the remote region 20 201221831, the adhesive layer is placed in a state in which the vicinity of the light source is in contact with the metal support t, and the source remote region and The state in which the one side of the metal support is in contact. The cross-sectional view in the short side direction has a shape similar to that of Fig. 2(a). Further, as the adhesive layer, a back sheet having a thermal conductivity of 〇.2 W/mK and a thickness of 25 μm was used. The sheet is then composed of an epoxy-based adhesive. As a comparison, the light source unit in which the present invention and the embodiment differ only in the following conditions is prepared. (Comparative Example 1) The flexible printed wiring board was not bent, and the adhesive layer was placed so that only the vicinity of the light source was in contact with the upper surface of the metal support. (Comparative Example 2) As the flexible printed wiring board, a wiring layer composed of four layers was laminated only in the vicinity of the light source. The cross-sectional view in the short side direction has a shape similar to that of Fig. 4(a). (Comparative Example 3) As a printed circuit board, a metal PCB (Printed Circuit Board) was used, and a wiring layer composed of four layers was laminated only in the vicinity of the light source. The cross-sectional view in the short side direction has a shape similar to that of Fig. 4(a). (Comparative Example 4) As a printed circuit board, a glass epoxy substrate (FR4: Flame Retardant Type _ 4) was used, and a wiring layer composed of four layers was laminated only in the vicinity of the light source. The above-described examples of the present invention and the light of the comparative examples 1 to 4 21 201221831 were subjected to the same conditions, and the temperature of the light source group was measured from the local temperature source. The result is in the order of _ 4, comparing you J 2, comparing you ", the embodiment of the comparison. The above results are very good. The present invention adopts the constitution of the present invention, and the use of the nine saponins effectively prevents the temperature of the light source group from rising and the right effect prevents the luminance characteristics of the light source from deteriorating. BRIEF DESCRIPTION OF THE DRAWINGS (4) Fig. 1 is a view showing an entire view of a backlight unit according to a first embodiment of the present invention. Fig. 2 is a cross-sectional view showing a light source unit according to an embodiment of the present invention. Fig. 2 (4) is a cross-sectional view in the short side direction, and Fig. 2 (b) is a cross-sectional view taken along line X - X of Fig. 2 (4). 3 is a view showing a state in which a light source unit according to a third embodiment of the present invention is in a state before bending of a twin printed wiring board, and FIG. 3 (4) is a plane in a short side direction, FIG. 3 (8) is a plan view. Figure 3 (c) is a cross-sectional view taken along line Υ - γ of Figure 3 (b). Figure 4 is a cross-sectional view showing the movement of heat in the light source unit in a schematic manner, Figure 4 (a, in & I * ” In the comparative example, the display of the light source unit in which the wiring layer composed of the plurality of layers is provided with only the jfc, S Π / , and ''near regions' is shown in FIG. 4(b) showing the second embodiment of the present invention. Fig. 5 is a view showing a light source unit according to a third embodiment of the present invention, and is a cross-sectional view of a light source unit; ? > 4 in the short side direction. [Description of main element symbols] B blind via hole 22 201221831 F Light source remote area 焊料 Solder light source unit Light source Flexible printed wiring board Base material layer wiring layer 附近 Near light source area P, Q, R, S, Xenon light source group 1 Backlight unit 100, 400, 500, 600 110, 410, 510 , 610 120, 420, 520, 620 121, 421, 521, 621 122, 422, 522, 622 122a, 622a first wiring layer 122b, 62 2b second wiring layer 123, 423, 523, 623 cover film layer 130, 430, 530, 630 metal support 140, 424, 440, 5 24, 5 40, 640 adhesive layer 200 light guide plate 210 light incident end face 220 light Output end face 300 Liquid crystal display 422a to 422d First to fourth wiring layers 522a to 522c First to third wiring layers 23