WO2019091856A1 - Dispositif comprenant une unité électronique prise en sandwich comprenant un dissipateur thermique - Google Patents

Dispositif comprenant une unité électronique prise en sandwich comprenant un dissipateur thermique Download PDF

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Publication number
WO2019091856A1
WO2019091856A1 PCT/EP2018/079948 EP2018079948W WO2019091856A1 WO 2019091856 A1 WO2019091856 A1 WO 2019091856A1 EP 2018079948 W EP2018079948 W EP 2018079948W WO 2019091856 A1 WO2019091856 A1 WO 2019091856A1
Authority
WO
WIPO (PCT)
Prior art keywords
hole
components
faces
metal body
side faces
Prior art date
Application number
PCT/EP2018/079948
Other languages
English (en)
Inventor
Dirk Roelof BRINK
Original Assignee
Aecorsis B.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aecorsis B.V. filed Critical Aecorsis B.V.
Publication of WO2019091856A1 publication Critical patent/WO2019091856A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20727—Forced ventilation of a gaseous coolant within server blades for removing heat from heat source
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid

Definitions

  • Device comprising a sandwiched electronic unit comprising a heat sink
  • the invention relates to a device comprising a plurality of heat producing electronic components, said components being in contact with at least one heatsink arranged to discharge heat generated by said components, wherein said at least one heatsink comprises a metal body which is sandwiched between at least two of said components, said metal body having six faces, comprising two mutually opposite heat transfer faces to which the processing units are attached, two mutually opposite first side faces substantially perpendicular thereto, and two mutually opposite second side faces substantially perpendicular to the heat transfer faces and the first side faces.
  • Such sandwiched processor unit are known, for instance the water cooled ZOTACTM GeForceTM GTX 295 Infinity graphics card, wherein the metal body is provided with an internal conduit for cooling water and two external connectors for water hoses.
  • the current invention in particular, but not exclusively, relates to a computing device using submersion cooling wherein the flow of the cooling fluid is caused by convection.
  • Submersion cooling of electronic components is a well known technology. Oil, or any other suitable dielectric fluid may be used as a cooling liquid. In order to efficiently cool the components the oil must flow along the components and along a cool heat exchanging surface for transferring the heat from the cooling liquid. Especially in datacentres an energy efficient system of cooling is required.
  • the invention may also be applicable in non-submerged systems, for instance wherein the cooling fluid is air which is blown along the electronic components by a fan.
  • the invention aims at a compact, energy efficient, cost effective and/or reliable solution for an electronic device, suitable for use with convection cooling, in particular in a submerged electronic device.
  • said metal body comprises a central through hole which extends between the two first side faces, to allow fluid to flow from the interior of the computer device into an opening of said through hole at one first side face and out of an opening of said through hole at the opposite first side face into the interior of the computer device.
  • said central through hole having a cross section sufficiently large so that during use said fluid flowing through said through hole accounts for at least the largest part of the cooling capacity for the metal body of said heat sink and thereby said components.
  • said through hole has a substantially rectangular cross section, wherein the long edges of said rectangular cross section extend parallel to said heat transfer faces.
  • metal cooling fins extend from the walls of said through hole into the interior of said through hole, wherein said cooling fins extend parallel to the axis of the through hole, such that they do not obstruct the flow.
  • Said cooling fins preferably divide said through hole in a plurality of substantially separated sub through holes.
  • interruptions are formed in said cooling fins, in order to lower the Darcy friction of the flow.
  • said metal body is preferably comprised of two separate halves, each halve comprising one of said heat transfer faces and one halve of the through flow opening, which are mounted together such that the halves of the through flow opening face each other.
  • a PCB is mounted on each of said components, wherein said metal body is sandwiched between at least two of said PCBs extending parallel to each other.
  • said components are graphics processing units, central processing units, chips or electronic components.
  • the invention is of particular advantage if said computing device is a submerged computing device wherein said fluid is a liquid, such as oil, and if said computing device comprises a plurality of sandwiched heat sink and components, wherein the axes of said through holes of said heat sinks are aligned, such that fluid is allowed to flow through said holes along their common axis.
  • the axis of said through hole extends vertically.
  • Said metal is preferably copper or aluminum.
  • the thickness of said heat sink between said components is preferably smaller than 4 cm.
  • the invention furthermore relates to a sandwiched electronic unit comprising at least two heat producing components being in contact with a heatsink arranged to discharge heat generated by said components, wherein said heatsink comprises a metal body which is sandwiched between said at least two components, said metal body having six faces, comprising two mutually opposite heat transfer faces to which the components are attached, two mutually opposite first side faces substantially perpendicular thereto, and two mutually opposite second side faces substantially perpendicular to the heat transfer faces and the first side faces, wherein said metal body comprises a central through hole which extends between the two first side faces, to allow fluid to flow from the interior of a computer device into an opening of said through hole at one first side face and out of an opening of said through hole at the opposite first side face into the interior of said computer device.
  • the invention furthermore relates to a heatsink arranged to discharge heat generated by heat producing components, wherein said heatsink comprises a metal body, said metal body having six faces, comprising two mutually opposite heat transfer faces to which the components can be attached, two mutually opposite first side faces substantially perpendicular thereto, and two mutually opposite second side faces substantially perpendicular to the heat transfer faces and the first side faces, wherein said metal body comprises a central through hole which extends between the two first side faces, to allow fluid to flow from the interior of a computer device into an opening of said through hole at one first side face and out of an opening of said through hole at the opposite first side face into the interior of said computer device.
  • Figure 1 is a perspective view of a sandwiched processor unit with a heat sink in accordance with the invention
  • Figure 2 is a perspective view of the heat sink as used in the sandwiched processor unit of figure 1
  • Figure 3 is a perspective view of the lower half of the heat sink of figure 2
  • Figure 4 is a connecting part as used in the heat sink of figure 2;
  • Figure 5 is a frontal view of the heat sink of figure 2.
  • Figure 6 is a perspective view of a frame for a computer device comprising a plurality of sandwiched processor units of figure 1.
  • a sandwiched processor unit such as a graphics processing unit (GPU) comprises two printed circuit boards (PCBs) 1, 2 extending parallel to each other, on each of which a processor (not shown) and other electronic components 3 and connectors 4 are mounted.
  • a heat sink 5 extends between the boards 1 , 2, such that the processor of each board is in an optimised heat exchanging communication therewith.
  • the heatsink 5 is comprised of two identical halves 51, 52, which are mounted together by means of a spacer 53.
  • the halves 51, 52 of the heatsink have a generally rectangular or square box shape.
  • a solid rectangular plate shaped part 511, 521 of each of the halves 51, 52 is provided with mutually parallel cooling fins 512, 522 and mounting bushings 513, 523 extending the same distance from one side of said plate shaped part 511, 521 and being formed integral therewith.
  • the halves 51, 52 are made of copper or aluminium.
  • Two arrays of interruptions 514, 524 are formed in said cooling fins 512, 522.
  • the cylindrical spacers 53 are inserted in matching cylindrical holes of each pair of opposite bushings 513.
  • a widened ring shaped part 531 is provided which causes a small gap to exist between the assembled two halves 51, 52.
  • the cooling fins 512, 522 and the plate shaped parts 511, 521 form substantially enclosed (sub) through holes 54 extending in parallel between the two opposite side faces of the assembled heat sink 5 (the through holes 54 may together also be considered as one central through hole having a profile formed by said cooling fins 512, 522 so as to form sub-holes 54).
  • the interruptions 514, 524 form through holes 55 extending in parallel between the other two opposite side faces of the assembled heat sink 5.
  • a frame 6 of a submerged computing device is provided with a plurality of sandwiched processing units 1, 2, 5 (in this example four).
  • the frame 6 with the processing units is designed to be inserted vertically into a enclosed housing filled with a cooling liquid such as oil.
  • the heat sinks 5 are oriented such that the through holes 54 of the heat sinks 5 all extend vertically. It may be advantageous if the heat sinks are orientated such that the through holes 54 of the lower units 1, 2, 5 are aligned with the through hole 54 of the adjacent units 1, 2, 5 extending above, such that an unobstructed convection flow of the cooling liquid from the bottom to the top is possible.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne un dispositif informatique qui comprend une pluralité de composants électroniques produisant de la chaleur, lesdits composants étant en contact avec au moins un dissipateur thermique agencé pour évacuer la chaleur générée par lesdits composants, ledit dissipateur thermique comprenant un corps métallique qui est pris en sandwich entre au moins deux desdits composants, ledit corps métallique ayant six faces, comprenant deux faces de transfert de chaleur mutuellement opposées auxquelles les composants sont fixés, deux premières faces latérales mutuellement opposées sensiblement perpendiculaires correspondantes, et deux secondes faces latérales mutuellement opposées sensiblement perpendiculaires aux faces de transfert de chaleur et aux premières faces latérales, ledit corps métallique comprenant un trou traversant central qui s'étend entre les deux premières faces latérales, pour permettre au fluide de s'écouler de l'intérieur du dispositif informatique dans une ouverture dudit trou traversant au niveau d'une première face latérale et hors d'une ouverture dudit trou traversant au niveau de la première face latérale opposée à l'intérieur du dispositif informatique.
PCT/EP2018/079948 2017-11-07 2018-11-01 Dispositif comprenant une unité électronique prise en sandwich comprenant un dissipateur thermique WO2019091856A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL2019860A NL2019860B1 (en) 2017-11-07 2017-11-07 Device comprising a sandwiched electronic unit comprising a heat sink
NL2019860 2017-11-07

Publications (1)

Publication Number Publication Date
WO2019091856A1 true WO2019091856A1 (fr) 2019-05-16

Family

ID=60766107

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2018/079948 WO2019091856A1 (fr) 2017-11-07 2018-11-01 Dispositif comprenant une unité électronique prise en sandwich comprenant un dissipateur thermique

Country Status (2)

Country Link
NL (1) NL2019860B1 (fr)
WO (1) WO2019091856A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2081607A1 (fr) * 1991-10-31 1993-05-01 Tristano F. Nicoletta Dispositifs electroniques
CA2081606A1 (fr) * 1991-10-31 1993-05-01 Hugh M. Collins Bloc electronique
EP0862210A2 (fr) * 1997-01-31 1998-09-02 Thermalloy Incorporated Assemblage d'un dissipateur de chaleur
WO2010019517A1 (fr) * 2008-08-11 2010-02-18 Green Revolution Cooling, Inc. Support de serveur informatique horizontal submergé dans un liquide, systèmes et procédés de refroidissement d’un tel support de serveur
WO2016008509A1 (fr) * 2014-07-15 2016-01-21 Abb Technology Ltd Module électrique pour gestion thermique améliorée dans des équipements électriques

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2081607A1 (fr) * 1991-10-31 1993-05-01 Tristano F. Nicoletta Dispositifs electroniques
CA2081606A1 (fr) * 1991-10-31 1993-05-01 Hugh M. Collins Bloc electronique
EP0862210A2 (fr) * 1997-01-31 1998-09-02 Thermalloy Incorporated Assemblage d'un dissipateur de chaleur
WO2010019517A1 (fr) * 2008-08-11 2010-02-18 Green Revolution Cooling, Inc. Support de serveur informatique horizontal submergé dans un liquide, systèmes et procédés de refroidissement d’un tel support de serveur
WO2016008509A1 (fr) * 2014-07-15 2016-01-21 Abb Technology Ltd Module électrique pour gestion thermique améliorée dans des équipements électriques

Also Published As

Publication number Publication date
NL2019860B1 (en) 2019-05-13

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