NL2019860B1 - Device comprising a sandwiched electronic unit comprising a heat sink - Google Patents

Device comprising a sandwiched electronic unit comprising a heat sink Download PDF

Info

Publication number
NL2019860B1
NL2019860B1 NL2019860A NL2019860A NL2019860B1 NL 2019860 B1 NL2019860 B1 NL 2019860B1 NL 2019860 A NL2019860 A NL 2019860A NL 2019860 A NL2019860 A NL 2019860A NL 2019860 B1 NL2019860 B1 NL 2019860B1
Authority
NL
Netherlands
Prior art keywords
components
hole
metal body
opposite
heat
Prior art date
Application number
NL2019860A
Other languages
English (en)
Dutch (nl)
Inventor
Roelof Brink Dirk
Original Assignee
Aecorsis B V
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aecorsis B V filed Critical Aecorsis B V
Priority to NL2019860A priority Critical patent/NL2019860B1/en
Priority to PCT/EP2018/079948 priority patent/WO2019091856A1/fr
Application granted granted Critical
Publication of NL2019860B1 publication Critical patent/NL2019860B1/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20236Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718Forced ventilation of a gaseous coolant
    • H05K7/20727Forced ventilation of a gaseous coolant within server blades for removing heat from heat source
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763Liquid cooling without phase change
    • H05K7/20772Liquid cooling without phase change within server blades for removing heat from heat source
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20Indexing scheme relating to G06F1/20
    • G06F2200/201Cooling arrangements using cooling fluid

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
NL2019860A 2017-11-07 2017-11-07 Device comprising a sandwiched electronic unit comprising a heat sink NL2019860B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
NL2019860A NL2019860B1 (en) 2017-11-07 2017-11-07 Device comprising a sandwiched electronic unit comprising a heat sink
PCT/EP2018/079948 WO2019091856A1 (fr) 2017-11-07 2018-11-01 Dispositif comprenant une unité électronique prise en sandwich comprenant un dissipateur thermique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL2019860A NL2019860B1 (en) 2017-11-07 2017-11-07 Device comprising a sandwiched electronic unit comprising a heat sink

Publications (1)

Publication Number Publication Date
NL2019860B1 true NL2019860B1 (en) 2019-05-13

Family

ID=60766107

Family Applications (1)

Application Number Title Priority Date Filing Date
NL2019860A NL2019860B1 (en) 2017-11-07 2017-11-07 Device comprising a sandwiched electronic unit comprising a heat sink

Country Status (2)

Country Link
NL (1) NL2019860B1 (fr)
WO (1) WO2019091856A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2081606A1 (fr) * 1991-10-31 1993-05-01 Hugh M. Collins Bloc electronique
CA2081607A1 (fr) * 1991-10-31 1993-05-01 Tristano F. Nicoletta Dispositifs electroniques
EP0862210A2 (fr) * 1997-01-31 1998-09-02 Thermalloy Incorporated Assemblage d'un dissipateur de chaleur
WO2010019517A1 (fr) * 2008-08-11 2010-02-18 Green Revolution Cooling, Inc. Support de serveur informatique horizontal submergé dans un liquide, systèmes et procédés de refroidissement d’un tel support de serveur
WO2016008509A1 (fr) * 2014-07-15 2016-01-21 Abb Technology Ltd Module électrique pour gestion thermique améliorée dans des équipements électriques

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2081606A1 (fr) * 1991-10-31 1993-05-01 Hugh M. Collins Bloc electronique
CA2081607A1 (fr) * 1991-10-31 1993-05-01 Tristano F. Nicoletta Dispositifs electroniques
EP0862210A2 (fr) * 1997-01-31 1998-09-02 Thermalloy Incorporated Assemblage d'un dissipateur de chaleur
WO2010019517A1 (fr) * 2008-08-11 2010-02-18 Green Revolution Cooling, Inc. Support de serveur informatique horizontal submergé dans un liquide, systèmes et procédés de refroidissement d’un tel support de serveur
WO2016008509A1 (fr) * 2014-07-15 2016-01-21 Abb Technology Ltd Module électrique pour gestion thermique améliorée dans des équipements électriques

Also Published As

Publication number Publication date
WO2019091856A1 (fr) 2019-05-16

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