WO2019080003A1 - 用于测试芯片的方法、测试平台和测试系统 - Google Patents

用于测试芯片的方法、测试平台和测试系统

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Publication number
WO2019080003A1
WO2019080003A1 PCT/CN2017/107654 CN2017107654W WO2019080003A1 WO 2019080003 A1 WO2019080003 A1 WO 2019080003A1 CN 2017107654 W CN2017107654 W CN 2017107654W WO 2019080003 A1 WO2019080003 A1 WO 2019080003A1
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WO
WIPO (PCT)
Prior art keywords
version
core board
backplane
firmware
chip
Prior art date
Application number
PCT/CN2017/107654
Other languages
English (en)
French (fr)
Inventor
刘金涛
曹岚健
Original Assignee
深圳市汇顶科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市汇顶科技股份有限公司 filed Critical 深圳市汇顶科技股份有限公司
Priority to PCT/CN2017/107654 priority Critical patent/WO2019080003A1/zh
Priority to CN201780001875.5A priority patent/CN110023770A/zh
Publication of WO2019080003A1 publication Critical patent/WO2019080003A1/zh

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere

Definitions

  • the present application relates to the field of electronic product testing, and more particularly to a method, a test platform and a test system for testing a chip.
  • chip detection is a very important task, and it is necessary to test whether the operation of the chip is normal through the test platform.
  • test platform needs to manually burn the firmware; it also needs to design a test board containing the MCU for each chip under test, which leads to high cost and large workload; in addition, the traditional test platform also needs the user to have corresponding expertise.
  • Test tools including software and hardware development. Therefore, the traditional test platform needs to manually burn the firmware; it also needs to design a test board containing the MCU for each chip under test, which leads to high cost and large workload; in addition, the traditional test platform also needs the user to have corresponding expertise.
  • the present application provides a method, test platform and test system for testing a chip, which can simplify the test platform used in the chip test process.
  • a test platform in a first aspect, includes: a core board and a plurality of bottom boards, wherein different kinds of bottom boards of the plurality of bottom boards correspond to different chips, and a first bottom board of the plurality of bottom boards includes a connection a test interface of the chip to be tested, the chip to be tested is a chip corresponding to the first backplane; the core board is configured to test the chip to be tested through the first backplane.
  • the test platform of the embodiment of the present application includes a core board and a plurality of backplanes, and different kinds of backplanes correspond to different chips, and different base boards can be selected for different chips, and the core board parts can be reused without manually burning firmware.
  • the terminal device connected through the test platform ensures that the core board firmware and the backplane are matched with the chip to be tested, that is, the user does not need to consider the cooperation problem between the driver, the firmware, the software, etc., which simplifies the use process and is convenient for the user. operating.
  • the expensive core board parts are reused separately, and only a cheap supporting bottom board is needed for each type of tested chip, which can reduce the cost of the test platform.
  • a method for testing a chip is provided, the method being core of a test platform Execution of the board, the test platform includes the core board and a plurality of backplanes, wherein different ones of the plurality of backplanes correspond to different chips, and the first backplane of the plurality of backplanes includes a test interface for connecting the chip to be tested, the chip to be tested a chip corresponding to the first backplane, the core board is configured to test the chip to be tested by using the first backplane, the method comprising: receiving, by the core board, firmware version indication information sent by the terminal device; Firmware version indication information, sending firmware version information to the terminal device, the firmware version information is used to indicate a current version of the firmware in the core board; when the current version of the firmware matches the chip to be tested, the core board receives the terminal The test indication information sent by the device; the core board tests the chip to be tested through the first backplane according to the test indication information.
  • the method for testing a chip in the embodiment of the present application uses a test platform including a core board and a plurality of backplanes, wherein different types of backplanes correspond to different chips, and different base boards are selected for different chips, and the core is selected.
  • the board part can be reused without having to manually burn the firmware, and the terminal device connected through the test platform ensures that the core board firmware and the backplane are matched with the chip to be tested, that is, the user does not need to consider between the driver, the firmware, and the software.
  • the cooperation problem simplifies the use process and is convenient for the user to operate. And the expensive core board parts are reused separately, and only a cheap supporting bottom board is needed for each type of tested chip, which can reduce the cost of the test platform.
  • a method for testing a chip comprising: determining a current version of firmware in a core board of a test platform, the test platform including the core board and a plurality of backplanes, wherein the plurality of backplanes
  • the first type of the plurality of boards corresponds to different chips
  • the first board of the plurality of boards includes a test interface for connecting the chip to be tested, the chip to be tested is a chip corresponding to the first backplane, and the core board is used to pass the first
  • the bottom board tests the chip to be tested; determines the backplane version information of the backplane currently connected to the core board; determines that the current version of the firmware matches the chip to be tested, and the bottom board currently connected to the core board is the first backplane
  • the test indication information is sent to the core board, and the test indication information is used to indicate that the core board tests the chip to be tested through the first backplane.
  • the method can be performed by the terminal device.
  • the method for testing a chip in the embodiment of the present application may be connected to a test platform by using a terminal device, where the test platform includes a core board and a plurality of backplanes, wherein different kinds of backplanes correspond to different chips, and different chips are selected for different chips.
  • the backplane, and the core board portion can be reused without manually programming the firmware, and the terminal device connected through the test platform ensures that the core board firmware and the backplane are matched with the chip to be tested, that is, the user does not need to consider the driver, the firmware, and
  • the cooperation problem between the software and the like simplifies the use process and is convenient for the user to operate. And the expensive core board parts are independently reused. For each type of tested chip, only a cheap supporting bottom board is needed, which can reduce the test level. Taiwan cost.
  • a test system which can include a test platform and a test module, the test platform being used to perform the method in any of the possible implementations of the second aspect or the second aspect, the test module can be used The method of any of the possible implementations of the third aspect or the third aspect is performed.
  • test module can be located in the terminal device.
  • a terminal device comprising: a storage unit and a processor, the storage unit is configured to store an instruction, the processor is configured to execute an instruction stored by the memory, and when the processor executes the instruction stored by the memory The execution causes the processor to perform the method of any of the third aspect or any of the possible implementations of the third aspect.
  • a computer readable medium for storing a computer program comprising instructions for performing the method of any of the second aspect or any of the possible implementations of the second aspect.
  • a computer readable medium for storing a computer program comprising instructions for performing the method of any of the third aspect or any of the possible implementations of the third aspect.
  • FIG. 1 is a schematic diagram of a test platform in accordance with an embodiment of the present application.
  • FIG. 2 is a schematic flow chart of a method for testing a chip in accordance with an embodiment of the present application.
  • FIG. 3 is another schematic flowchart of a method for testing a chip according to an embodiment of the present application.
  • FIG. 4 is still another schematic flow chart of a method for testing a chip according to an embodiment of the present application.
  • FIG. 5 is still another schematic flowchart of a method for testing a chip according to an embodiment of the present application.
  • FIG. 6 is a schematic block diagram of a test system in accordance with an embodiment of the present application.
  • FIG. 7 is a schematic block diagram of a terminal device according to an embodiment of the present application.
  • the embodiment of the present application provides a test platform, including a core board and a plurality of backplanes, wherein different ones of the plurality of backplanes correspond to different chips, and the first one of the plurality of backplanes includes a chip for connecting to the chip to be tested.
  • a test interface the chip to be tested is a chip corresponding to the first backplane, and the core board is used The chip to be tested is tested through the first backplane.
  • FIG. 1 shows a schematic diagram of a test platform 100 in accordance with an embodiment of the present application.
  • the test platform may include multiple bottom boards, and different types of bottom boards correspond to different chips.
  • the chip to be tested corresponds to the first one of the plurality of bottom boards included in the test platform 100.
  • the bottom plate 110 includes a communication interface corresponding to the chip to be tested, and is connected to the chip to be tested through the communication interface for testing.
  • first backplane 110 and the core board 120 may also be connected through a communication interface.
  • the core board 120 may access related information of the first backplane 110 through a GPIO interface, for example, version information of the first backplane 110 and the like.
  • the first bottom plate 110 and the core plate 120 may be a universal detachable structure, so that the core plate 120 can be connected to each of the plurality of bottom plates.
  • the core board when the test platform is tested, for example, when testing any chip to be tested, the core board only includes firmware for one type of chip, and the core board is only connected to one backplane, and the same type of chip to be tested is used. carry out testing.
  • the core board 120 in the test platform 100 is connected to the terminal device through a communication interface, for example, through a USB interface.
  • the core board 120 has a USB slave function and is connected to the terminal device.
  • the test platform 100 and the terminal device are tested with a chip to be tested.
  • FIG. 2 shows a schematic flowchart of a method 200 for testing a chip according to an embodiment of the present application. The method 200 is performed by the test platform 100, wherein The test platform 100 is tested by the test module in the terminal device, and the embodiment of the present application is not limited thereto.
  • the test platform 100 and the terminal device are taken as an example for description.
  • the method 200 includes: S210, the core board receives firmware version indication information sent by the terminal device; S220, the core board sends firmware version information to the terminal device according to the firmware version indication information, The firmware version information is used to indicate the current version of the firmware in the core board; S230, the core board receives the test indication information sent by the terminal device when the current version of the firmware matches the chip to be tested; S240, the core board The chip to be tested is tested by the first backplane according to the test indication information.
  • the terminal device involved in the embodiments of the present application may be a computer, a mobile phone, a tablet, a computer with wireless transceiver function, a virtual reality (VR) terminal device, and augmented reality ( Augmented reality, AR) wireless equipment in terminal equipment, industrial control, and transport safety Line terminal and so on.
  • VR virtual reality
  • AR Augmented reality
  • the user or the test chip personnel when testing the chip to be tested, selects one of the plurality of bottom plates included in the test platform according to the chip to be tested, and the bottom plate includes the chip to be tested.
  • a corresponding interface connects the chip to be tested to the backplane.
  • the user selects a backplane corresponding to the chip to be tested, or selects a backplane arbitrarily when it is determined that the backplane corresponds to the chip to be tested, or still uses the backplane used in the previous test, and does not replace,
  • the application embodiment is not limited to this.
  • the backplane and the chip to be tested are connected, and at the same time, the backplane is also connected to the core board through an interface, for example, through a GPIO interface.
  • the core board can also be connected to the terminal device through a communication interface, for example, the core board can be connected to the terminal device through a USB interface.
  • the test is started. Specifically, the terminal device first determines version information of the firmware in the core board in the test platform, and determines whether the version information matches the chip to be tested.
  • the core board receives the firmware version indication information sent by the terminal device, and determines the current version of the firmware in the core board according to the firmware version indication information.
  • the core board includes a bootloader that continuously polls the core board for USB data and waits for commands from the terminal device.
  • the core board determines the current version of the firmware according to the version number and/or model number of the firmware therein, for example, the current version of the firmware is the first version.
  • the core board sends firmware version information to the terminal device, where the firmware version information is used to indicate the current version of the firmware in the core board.
  • the firmware version information may include the first version.
  • the terminal device may determine according to the firmware version information.
  • the current version of the firmware in this core board is the first version.
  • each chip to be tested has dedicated test software, the test object is unique for a single software. Therefore, for the chip to be tested, there is a corresponding test software for testing the chip to be tested, and there is also The firmware of the chip to be tested matches.
  • the terminal device determines whether the current version (first version) of the firmware of the core board indicated in the firmware version information matches the chip to be tested. If the first version matches the chip to be tested, the terminal device determines the core board.
  • the current firmware matches the chip to be tested, and continues the related process; if the first version does not match the chip to be tested, the terminal device determines that the version of the firmware matching the chip to be tested is the second version, and Sending the second version to the core board, so that the core board replaces the version of the firmware with the second version, so that the core board is solid The pieces match the chip to be tested.
  • the terminal device determines that the current version of the firmware of the core board matches the chip to be tested, and may continue the related process.
  • the terminal device may determine that the core board completes the firmware version replacement in multiple manners, for example, the core board sends the firmware version to the terminal device after replacing the firmware version. Confirming the information, the terminal device determines, according to the confirmation information, that the core board completes the firmware version replacement; or the terminal device sends the firmware version indication information to the core board to indicate that the core board sends the current version of the firmware, so that the terminal device can It is determined whether the core board completes the firmware version replacement, but the embodiment of the present application is not limited thereto.
  • the terminal device may further send the second version directly to the core board, that is, the terminal device does not need to send the firmware version indication information to the core board.
  • the terminal device determines the version of the firmware of the core board according to the chip to be tested, for example, determining that the chip to be tested matches the firmware of the second version, and the terminal device sends the second version to the core board, so as to facilitate the core board.
  • the firmware version is replaced with the second version, and the terminal device does not need to send the firmware version indication information to obtain the firmware version of the core board, and directly sends the matching firmware version to match the firmware of the core board with the chip to be tested.
  • the terminal device further determines a version of the backplane currently installed in the test platform, and determines whether the backplane matches the chip to be tested. Specifically, the terminal device sends the backplane version indication information to the core board, and the core board continuously polls the USB data through the bootloader to obtain the backplane version indication information. The core board obtains the version of the backplane currently connected to the core board according to the backplane version indication information. The core board sends the backplane version information to the terminal device, where the backplane version information is used to indicate the version of the current backplane, and the terminal device can determine whether the current backplane matches the chip to be tested according to the backplane version information.
  • the core board can read the version number and/or model of the current backplane by using a GPIO interface with the current backplane, determine the version of the backplane, and send the backplane version information to the terminal device, where the backplane version information includes the current The version of the backplane.
  • the terminal device may prompt to be replaced according to the backplane version information. Base plate.
  • the terminal device displays the prompt information of the backplane replacement.
  • the terminal device is a computer, and the prompt information of the backplane replacement is displayed on the computer screen, and the prompt information of the backplane is used to prompt to replace the current backplane with the chip to be tested.
  • the first bottom plate the user or the tester can perform the replacement of the base plate according to the information of the replacement of the base plate, and select the first bottom plate matched with the chip to be tested from the plurality of bottom plates included in the test platform, and the first bottom plate and the core plate respectively
  • the chips to be tested are connected to facilitate testing of the chip to be tested.
  • the terminal device may directly display the prompt information of the backplane replacement, that is, the terminal device does not need to obtain the backplane version information of the backplane through the core board and determine whether it corresponds to the chip to be tested. Specifically, the terminal device determines a version of the corresponding backplane according to the chip to be tested, for example, determining that the chip to be tested corresponds to the first backplane, and the terminal device directly displays the backplane replacement prompt of the backplane version information including the first backplane to the user. The information is used to facilitate the user to directly use the first backplane corresponding to the chip to be tested according to the backplane replacement prompt information, and then pass the first backplane and the core board to test the chip to be tested.
  • the version replacement may be performed, and the terminal device may determine whether the firmware information of the core board and the backplane are matched with the chip to be tested multiple times. Until the firmware information of the core board and the version information of the backplane match the chip to be tested.
  • the terminal device determines that the current version of the firmware in the core board of the test platform matches the chip to be tested, and after the bottom plate of the test platform is matched with the chip to be tested, the test of the chip to be tested is performed. Specifically, the terminal device tests the chip to be tested through the core board and the current backplane.
  • the specific performance test procedure of the chip to be tested may be consistent with the prior art, and different chips are used in different manners, but the embodiment of the present application is not limited thereto.
  • the method for testing a chip in the embodiment of the present application can reuse the core board part in the test platform, and select different bottom boards for different chips, so that the firmware does not need to be manually burned, and the core board is guaranteed by the terminal equipment.
  • the firmware and the backplane are matched with the chip to be tested, that is, the user does not need to consider the cooperation problem between the driver, the firmware, and the software, which simplifies the use process and is convenient for the user to operate.
  • the expensive core board parts are reused separately, and only a cheap supporting bottom board is needed for each type of tested chip, which can reduce the cost of the test platform.
  • the method 300 includes: S310, determining the core of the test platform
  • the current version of the device includes the core board and a plurality of backplanes, wherein different ones of the plurality of backplanes correspond to different chips, and the first of the plurality of backplanes includes a test interface for connecting the chip to be tested
  • the chip to be tested is a chip corresponding to the first backplane, and the core board is configured to test the chip to be tested through the first backplane; and
  • S320 determining a backplane version information of a backplane currently connected to the core board;
  • S330 After the current version of the firmware is matched with the chip to be tested, and the backplane currently connected to the core board is the first backplane, test indication information is sent to the core board, where the test indication information is used
  • the method for testing a chip in the embodiment of the present application can reuse the core board part in the test platform, and select different bottom boards for different chips, so that the firmware does not need to be manually burned, and the core board is guaranteed by the terminal equipment.
  • the firmware and the backplane are matched with the chip to be tested, that is, the user does not need to consider the cooperation problem between the driver, the firmware, and the software, which simplifies the use process and is convenient for the user to operate.
  • the expensive core board parts are reused separately, and only a cheap supporting bottom board is needed for each type of tested chip, which can reduce the cost of the test platform.
  • determining a current version of the firmware in the core board of the test platform including: sending firmware version indication information to the core board, the firmware version indication information is used to indicate that the core board determines a current version of the firmware; and receiving the core board The firmware version information sent, which is used to indicate the current version of the firmware.
  • the firmware version information is used to indicate that the current version of the firmware is the first version, and the first version matches the chip to be tested.
  • the firmware version information is used to indicate that the current version of the firmware is the first version, and the first version does not match the chip to be tested, and determining that the current version of the firmware matches the chip to be tested, including: When the first version does not match the chip to be tested, determining a second version that matches the chip to be tested; sending the second version to the core board, so that the core board replaces the current version of the firmware with the first version. Second version; when the current version of the firmware is the second version, it is determined that the current version of the firmware matches the chip to be tested.
  • determining the backplane version information of the backplane currently connected to the core board including: sending the backplane version indication information to the core board, where the backplane version indication information is used to indicate that the core board determines a backplane version of the backplane currently connected thereto Information; receiving the backplane version information sent by the core board.
  • determining that the backplane currently connected to the core board is the first backplane comprises: determining, according to the backplane version information, if the backplane currently connected to the core board is the first backplane, determining that the current backplane is connected to the coreboard a bottom plate corresponding to the chip to be tested; according to the version information of the bottom plate, if current and The bottom board connected to the core board is the second bottom board of the plurality of bottom boards, and the backplane replacement prompt information is displayed, wherein the backplane replacement prompt information is used to prompt to replace the bottom board currently connected with the core board, and the second bottom board is the chip to be tested. Does not correspond to the bottom plate.
  • the method is performed by a terminal device, and the terminal device communicates with the core board through a communication interface.
  • the communication interface is a USB interface.
  • the terminal device in the method 300 can correspond to the terminal device in the method 200.
  • the test platform in the method 300 can correspond to the test platform in the method 200, and the test platform can be the test platform 100 as shown in FIG. This will not be repeated here.
  • the method for testing a chip in the embodiment of the present application can reuse the core board part in the test platform, and select different bottom boards for different chips, so that the firmware does not need to be manually burned, and the core board is guaranteed by the terminal equipment.
  • the firmware and the backplane are matched with the chip to be tested, that is, the user does not need to consider the cooperation problem between the driver, the firmware, and the software, which simplifies the use process and is convenient for the user to operate.
  • the expensive core board parts are reused separately, and only a cheap supporting bottom board is needed for each type of tested chip, which can reduce the cost of the test platform.
  • FIG. 4 shows a schematic flow diagram of a method 400 for testing a chip in accordance with an embodiment of the present application.
  • the method 400 can be performed by a terminal device that can communicate with the test platform through a USB interface to facilitate testing of the chip to be tested.
  • the test platform includes a core board and a plurality of bottom boards, wherein different kinds of bottom boards of the plurality of bottom boards correspond to different chips, and for any one of the plurality of bottom boards, for example, the first bottom board, the first bottom board includes
  • the chip to be tested is a chip corresponding to the first backplane, and the first backplane can be used to test the chip to be tested.
  • the test of the chip to be tested is taken as an example for description.
  • the step may further include connecting the terminal device to the core board of the test platform through a USB interface.
  • the test platform is started, and the core board in the test platform is connected to the backplane.
  • the backplane can be any one of the test platforms.
  • a backplane can be randomly selected, or the first corresponding to the chip to be tested can be selected.
  • the firmware version information of the core board is read through the USB, that is, the terminal device determines the version information of the firmware in the core board through the USB interface.
  • the terminal device may send firmware version indication information to the core board, and the core board receives the firmware version indication information, and determines a current version of the firmware in the core board according to the firmware version indication information, for example, the core board determines the current version of the firmware.
  • the core board sends firmware version information to the terminal device, the firmware version information is used to indicate the current version of the firmware of the core board, for example, the firmware version information may include the version of the firmware being the first version.
  • the terminal device can determine the current version of the firmware of the core board according to the firmware version information.
  • S403. Determine whether the firmware matches the chip to be tested, that is, the terminal device determines whether the current version of the firmware of the core board matches the chip to be tested. If it matches, the process proceeds to S405. If there is no match, the process proceeds to S404.
  • the terminal device determines, according to the firmware version information, that the current version of the firmware of the core board is the first version, and determines whether the first version matches the chip to be tested. If the first version matches the chip to be tested, proceed to S405, and if not, continue to execute S404.
  • the firmware version is replaced, that is, the terminal device instructs the core board to replace the firmware version.
  • the core board replaces the firmware version with the version that matches the chip to be tested, and continues to execute S405.
  • the terminal device determines that the current version of the firmware of the core board does not match the chip to be tested, and determines a version of the firmware that matches the chip to be tested. For example, the terminal device may determine that the second version matches the chip to be tested. The device may send the second version to the core board, so that the core board replaces the current version of the firmware with the second version according to the second version.
  • the terminal device sends the backplane version indication information to the core board, and the core board reads the version number and/or model of the backplane currently connected to the core board according to the backplane version indication information, and determines the backplane version information of the backplane.
  • the core board sends the backplane version information to the terminal device, where the backplane version information is the backplane version information of the backplane.
  • S406. Determine whether the backplane is matched with the chip to be tested, that is, the terminal device determines, by the core board, whether the current backplane matches the chip to be tested. If yes, continue to execute S408. If not, proceed to S407.
  • the terminal device determines, according to the backplane version information, the backplane version information of the current backplane. For example, if the terminal device determines that the current backplane is the first backplane according to the backplane version information, and the first backplane is the backplane matching the chip to be tested, proceed to S408; if it is determined that the current backplane is the second backplane, the second If the bottom plate is a bottom plate that does not match the chip to be tested, the process proceeds to S407.
  • the terminal device can display the prompt information of the backplane through the screen, prompting the user to replace the bottom plate with the first bottom plate that matches the chip to be tested, and after the user completes the replacement of the substrate, continue to execute S405.
  • S408 Start testing the chip.
  • the core chip and the backplane may be tested by the core board and the bottom board to test whether the chip to be tested is a qualified chip.
  • the test process can be the same as the prior art, and details are not described herein again.
  • the method for testing a chip in the embodiment of the present application can reuse the core board part in the test platform, and select different bottom boards for different chips, so that the firmware does not need to be manually burned, and the core board is guaranteed by the terminal equipment.
  • the firmware and the backplane are matched with the chip to be tested, that is, the user does not need to consider the cooperation problem between the driver, the firmware, and the software, which simplifies the use process and is convenient for the user to operate.
  • the expensive core board parts are reused separately, and only a cheap supporting bottom board is needed for each type of tested chip, which can reduce the cost of the test platform.
  • FIG. 5 shows a schematic flowchart of a method 500 for testing a chip according to an embodiment of the present application.
  • the method 500 may be performed by a test platform, for example, may be a test platform as shown in FIG. 1 .
  • the platform includes a core board and a plurality of backplanes, and the method 500 can be performed by a core board, wherein different ones of the plurality of bottom boards correspond to different chips, and for any one of the plurality of bottom boards, for example, the first bottom board, the The first backplane includes an interface corresponding to the chip to be tested, and the chip to be tested is a chip corresponding to the first backplane, and the first backplane can be used to test the chip to be tested.
  • test of the chip to be tested is taken as an example here.
  • the powering on the test platform includes connecting the core board in the test platform to the bottom board, and the bottom board is any one of a plurality of bottom boards included in the test platform, for example, randomly selecting a bottom board, or selecting and testing The corresponding bottom plate of the chip; and connecting the chip to be tested to the bottom plate.
  • the core board of the test platform is connected to the terminal device through a USB interface.
  • USB OUT command that is, the core board in the test platform reads the USB output (OUT) command.
  • the core board may include a bootloader through which the USB data is polled. Wait for the command sent by the terminal device.
  • S503 determines the firmware version indication information, that is, the core board determines whether the command sent by the terminal device is firmware version indication information.
  • the core board receives the information sent by the terminal device, and if it is determined that the information is the firmware version indication information, proceed to S504, if not, proceed to S505, where the firmware version indication information is used to indicate that the core board provides firmware.
  • the current version is the firmware version indication information used to indicate that the core board provides firmware.
  • the firmware version information of the core board is sent, that is, the core board determines the firmware version indication information sent by the receiving terminal device, and determines the current version information of the firmware in the core board according to the firmware version indication information, and sends the firmware version information to the terminal device. Information indicating the current version of the core board firmware. And continue to execute S502.
  • the current version of the firmware in the core board is the first version
  • the core board may determine firmware version information, where the firmware version information includes a first version, where the firmware version information is used to indicate that the current version of the firmware in the core board is the first version.
  • a version. The core board sends the firmware version information to the terminal device.
  • S505 Determine the backplane version indication information, that is, the core board determines whether the command sent by the terminal device is the backplane version indication information.
  • the core board can receive the information sent by the terminal device. If the information is determined to be the backplane version indication information, proceed to S506. If not, proceed to S508, where the backplane version indication information is used to indicate that the core board provides the information. The backplane version information of the current backplane.
  • S506 Read the version information of the backplane, that is, the core board determines the backplane version indication information sent by the receiving terminal device, and reads the backplane version information of the backplane currently connected to the core board according to the backplane version indication information.
  • the core board reads the version number and/or model of the current backplane through the GPIO interface, determines the version of the current backplane, for example, determines that the current backplane is the first backplane.
  • S507 Send the backplane version information, and the core board sends the backplane version information for indicating the version of the current backplane to the terminal device. And continue to execute S502.
  • the core board may send the backplane version information to the terminal device, where the backboard version information is used to indicate the version of the current backplane.
  • the backplane version information is used to indicate that the current backplane is the first backplane.
  • the core board passes the board that is currently connected to the core board, and the chip to be tested is Test to test whether the chip under test can work normally.
  • test processes are used to test different chips by using existing test methods, and details are not described herein.
  • the method for testing a chip in the embodiment of the present application can reuse the core board part in the test platform, and select different bottom boards for different chips, so that the firmware does not need to be manually burned, and the core board is guaranteed by the terminal equipment.
  • the firmware and the backplane are matched with the chip to be tested, that is, the user does not need to consider the cooperation problem between the driver, the firmware, and the software, which simplifies the use process and is convenient for the user to operate.
  • the expensive core board parts are reused separately, and only a cheap supporting bottom board is needed for each type of tested chip, which can reduce the cost of the test platform.
  • the size of the sequence numbers of the foregoing processes does not mean the order of execution sequence, and the order of execution of each process should be determined by its function and internal logic, and should not be applied to the embodiment of the present application.
  • the implementation process constitutes any limitation.
  • the test system 600 includes a test platform 610 and a test module 620.
  • the test module 620 specifically includes: a determining unit 621 and a sending unit 622.
  • the receiving unit 623 may further include a receiving unit 623. .
  • the test platform 610 includes a core board and a plurality of bottom boards, wherein different ones of the plurality of bottom boards correspond to different chips, and the first one of the plurality of bottom boards includes a test interface for connecting the chips to be tested, and the test is to be tested.
  • the chip is a chip corresponding to the first bottom plate; the core board is configured to test the chip to be tested through the first bottom plate.
  • the test platform 610 can be the test platform 100 as shown in FIG. 1 , and the test platform 610 can execute the corresponding process of the test platform in each method in FIG. 1 to FIG. 5 , for the sake of brevity, no longer Narration.
  • test module 620 is located in the terminal device, or the test module is a terminal device, and the terminal device may be a terminal device as shown in FIG. 1 , and the corresponding processes of the terminal devices in each method in FIG. 1 to FIG. 5 are performed. For the sake of brevity, we will not repeat them here.
  • the determining unit 620 in the testing module 620 is configured to: determine a current version of the firmware in the core board of the testing platform; the determining unit 621 is further configured to: determine a bottom board currently connected to the core board in the testing platform.
  • Backplane version information; the sending unit 622 is configured to: The element 621 determines that the current version of the firmware matches the chip to be tested, and after the backplane currently connected to the core board is the first backplane, sends test indication information to the core board, where the test indication information is used to indicate the core board.
  • the chip to be tested is tested by the first backplane.
  • the sending unit 622 is further configured to: send firmware version indication information to the core board, where the firmware version indication information is used to indicate that the core board determines a current version of the firmware; and the receiving unit 623 is configured to: receive the core board The firmware version information sent, which is used to indicate the current version of the firmware.
  • the firmware version information is used to indicate that the current version of the firmware is the first version, and the first version does not match the chip to be tested.
  • the determining unit 621 is specifically configured to: in the first version and the to-be-tested When the chip does not match, determining a second version that matches the chip to be tested; the sending unit 622 is further configured to: send the second version to the core board, so that the core board replaces the current version of the firmware with the The second version; when the determining unit 621 determines that the current version of the firmware is the second version, sending the test indication information to the core board.
  • the sending unit 622 is further configured to: send the backplane version indication information to the core board, where the backplane version indication information is used to indicate that the core board determines the backplane version information of the backplane currently connected thereto; and the receiving unit 623 is configured to: Receive the backplane version information sent by the core board.
  • the determining unit 621 is configured to: determine, according to the backplane version information, that the bottom board currently connected to the core board is the first backplane, and determine that the bottom board currently connected to the core board corresponds to the chip to be tested; According to the backplane version information, if the bottom board currently connected to the core board is the second bottom board of the plurality of bottom boards, the floor replacement prompt information is displayed, and the floor replacement prompt information is used to prompt to replace the bottom board currently connected with the core board.
  • the second bottom plate is a bottom plate that does not correspond to the chip to be tested.
  • test module 620 in the test system is a terminal device, or the test module 620 is located in the terminal device.
  • test module 620 is located in a terminal device, and the terminal device can communicate with the core board through a communication interface.
  • the communication interface is a USB interface.
  • test system 600 may correspond to the method 200 and the method 400 in the embodiment of the present application, wherein the test module 620 may correspond to the methods 300 and 400 in the embodiment of the present application, and test
  • the above and other operations and/or functions of the various units in module 620 are respectively implemented to implement terminal devices or test modules in the various methods of FIGS. 1 through 5.
  • the corresponding process, for the sake of brevity, will not be described here.
  • the terminal device in the embodiment of the present application can be tested with the test platform to be tested.
  • the test platform can include a core board and a plurality of backplanes, and different types of backplanes correspond to different chips, and different motherboards are selected for different chips.
  • the core board portion can be reused without manually programming the firmware, and the terminal device determines the matching between the core board firmware and the backplane and the chip to be tested, that is, the user does not need to consider the cooperation between the driver, the firmware, and the software.
  • the problem simplifies the use process and is easy for the user to operate. And the expensive core board parts are reused separately, and only a cheap supporting bottom board is needed for each type of tested chip, which can reduce the cost of the test platform.
  • FIG. 7 shows a schematic block diagram of a terminal device 700 according to an embodiment of the present application.
  • the terminal device 700 includes a processor 710 and a transceiver 720.
  • the processor 710 is connected to the transceiver 720, and is optional.
  • the terminal device 700 also includes a memory 730 that is coupled to the processor 710.
  • the processor 710, the memory 730 and the transceiver 720 communicate with each other through an internal connection path, and the memory 730 can be used to store instructions.
  • the processor 710 is configured to execute the memory 730 for storing the control and/or data signals.
  • An instruction to control the transceiver 720 to send information or signals the processor 710 is configured to: determine a current version of the firmware in the core board of the test platform, the test platform includes the core board and a plurality of backplanes, wherein the plurality of backplanes Different kinds of bottom plates correspond to different chips, and the first bottom plate of the plurality of bottom plates includes a test interface for connecting a chip to be tested, the chip to be tested is a chip corresponding to the first bottom plate, and the core plate is used to pass the first bottom plate Testing the chip to be tested; determining the backplane version information of the backplane currently connected to the core board; determining that the current version of the firmware matches the chip to be tested, and the backplane currently connected to the core board is the first backplane Sending test indication information to the core board, where the test indication information is used to indicate that the core board tests the chip to be tested through the first backplane .
  • the terminal device in the embodiment of the present application can be tested with the test platform to be tested.
  • the test platform can include a core board and a plurality of backplanes, and different types of backplanes correspond to different chips, and different motherboards are selected for different chips.
  • the core board portion can be reused without manually programming the firmware, and the terminal device determines the matching between the core board firmware and the backplane and the chip to be tested, that is, the user does not need to consider the cooperation between the driver, the firmware, and the software.
  • the problem simplifies the use process and is easy for the user to operate. And the expensive core board parts are reused separately, and only a cheap supporting bottom board is needed for each type of tested chip, which can reduce the cost of the test platform.
  • the transceiver 720 is configured to: send firmware version indication information to the core board, where the firmware version indication information is used to indicate that the core board determines a current version of the firmware. Receiving firmware version information sent by the core board, the firmware version information is used to indicate the current version of the firmware.
  • the processor 710 is configured to: the firmware version information is used to indicate that the current version of the firmware is the first version, and the first version does not match the chip to be tested.
  • the firmware version information is used to indicate that the current version of the firmware is the first version, the first version does not match the chip to be tested, and the processor 710 is configured to: in the first version Determining a second version matching the chip to be tested when the chip to be tested does not match; the transceiver 720 is configured to: send the second version to the core board, so that the core board releases the current version of the firmware The second version is replaced; when the processor 710 determines that the current version of the firmware is the second version, the test indication information is sent to the core board.
  • the transceiver 720 is configured to: send, to the core board, the backplane version indication information, where the bottom board version indication information is used to indicate that the core board determines the backplane version information of the backplane currently connected thereto; The backplane version information sent by the core board.
  • the processor 710 is configured to determine, according to the backplane version information, that the bottom board currently connected to the core board is the first backplane, and determine a bottom board currently connected to the core board, and the to-be-tested Corresponding to the chip; according to the backplane version information, if the bottom board currently connected to the core board is the second bottom board of the plurality of bottom boards, the floor replacement prompt information is displayed, and the floor replacement prompt information is used to prompt to replace the current and the core board a connected bottom plate, the second bottom plate being a bottom plate that does not correspond to the chip to be tested.
  • the terminal device communicates with the core board through a communication interface.
  • the communication interface is a USB interface.
  • the terminal device 700 may correspond to the test module 620 in the test system 600 in the embodiment of the present application, and may correspond to executing the corresponding body in the methods 300 and 400 according to the embodiments of the present application.
  • the above-mentioned and other operations and/or functions of the respective units in the terminal device 700 are respectively omitted in order to implement the corresponding processes of the terminal devices in the respective methods in FIG. 1 to FIG. 5 for brevity.
  • the terminal device in the embodiment of the present application can be tested with the test platform to be tested.
  • the test platform can include a core board and a plurality of backplanes. Different kinds of backplanes correspond to different kinds of chips, and different boards are selected for different chips.
  • the core board portion can be reused without manually programming the firmware, and the core device firmware and the bottom board and the chip to be tested are determined by the terminal device. The user does not need to consider the cooperation between the driver, the firmware, and the software, which simplifies the use process and is convenient for the user to operate. And the expensive core board parts are reused separately, and only a cheap supporting bottom board is needed for each type of tested chip, which can reduce the cost of the test platform.

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Abstract

用于测试芯片的方法、测试平台和测试系统，该测试平台（100）包括：核心板（120）和多种底板（110），其中，该多种底板（110）中不同种底板（110）对应不同芯片，该多种底板（110）中的第一底板（110）包括用于连接待测芯片的测试接口，该待测芯片为与该第一底板（110）对应的芯片；该核心板（120）用于通过该第一底板（110）对该待测芯片进行测试。该用于测试芯片的方法、测试平台和测试系统，针对不同的芯片，选择不同的底板（110），而该核心板（120）部分可以重用，通过测试平台（100）连接的终端设备保证核心板（120）的固件以及底板（110）与待测芯片之间相匹配，使用者不需要考虑驱动、固件以及软件等之间的配合问题，简化了使用过程，便于使用者操作。

Description

用于测试芯片的方法、测试平台和测试系统 技术领域
本申请涉及电子产品测试领域，尤其涉及用于测试芯片的方法、测试平台和测试系统。
背景技术
在芯片生产过程中，芯片检测是一项非常重要的工作，需要通过测试平台检测芯片的工作情况是否正常。
由于芯片的种类或者用途不同，例如各种传感器芯片、微控制单元(microcontroller unit，MCU)等，在传统的测试方法中，会对各种不同的芯片中每种被测芯片研发一款新的测试工具，包括软件及硬件的开发。因此，传统测试平台需要手动烧录固件；还需要为每种被测芯片设计一块包含MCU的测试板，导致其成本高，工作量大；另外，传统测试平台还具有需要使用者具备相应专业知识的弊端。
发明内容
本申请提供了一种用于测试芯片的方法、测试平台和测试系统，能够简化芯片测试过程中使用的测试平台。
第一方面，提供了一种测试平台，该测试平台包括：核心板和多种底板，其中，该多种底板中不同种底板对应不同芯片，该多种底板中的第一底板包括用于连接待测芯片的测试接口，该待测芯片为与该第一底板对应的芯片；该核心板用于通过该第一底板对该待测芯片进行测试。
因此，本申请实施例的测试平台，包括核心板和多种底板，不同种底板对应不同芯片，可以针对不同的芯片，选择不同的底板，而该核心板部分可以重用，而无需手动烧录固件，并且通过测试平台连接的终端设备保证核心板固件以及底板与待测芯片之间相匹配，即使用者不需要考虑驱动、固件以及软件等之间的配合问题，简化了使用过程，便于使用者操作。并且将昂贵的核心板部分独立出来重用，对于每种被测芯片只需设计廉价的配套底板，可以降低测试平台成本。
第二方面，提供了一种用于测试芯片的方法，该方法由测试平台的核心 板执行，该测试平台包括该核心板和多种底板，该多种底板中不同种底板对应不同芯片，该多种底板中第一底板包括用于连接待测芯片的测试接口，该待测芯片为与该第一底板对应的芯片，该核心板用于通过该第一底板对该待测芯片进行测试，该方法包括：该核心板接收终端设备发送的固件版本指示信息；该核心板根据该固件版本指示信息，向该终端设备发送固件版本信息，该固件版本信息用于指示该核心板中固件的当前版本；在该固件的当前版本与待测芯片相匹配时，该核心板接收该终端设备发送的测试指示信息；该核心板根据该测试指示信息，通过该第一底板对该待测芯片进行测试。
因此，本申请实施例的用于测试芯片的方法，使用包括核心板和多种底板的测试平台，该测试平台中不同种底板对应不同芯片，针对不同的芯片，选择不同的底板，而该核心板部分可以重用，而无需手动烧录固件，并且通过测试平台连接的终端设备保证核心板固件以及底板与待测芯片之间相匹配，即使用者不需要考虑驱动、固件以及软件等之间的配合问题，简化了使用过程，便于使用者操作。并且将昂贵的核心板部分独立出来重用，对于每种被测芯片只需设计廉价的配套底板，可以降低测试平台成本。
第三方面，提供了一种用于测试芯片的方法，该方法包括：确定测试平台的核心板中固件的当前版本，该测试平台包括该核心板和多种底板，其中，该多种底板中不同种底板对应不同芯片，该多种底板中的第一底板包括用于连接待测芯片的测试接口，该待测芯片为与该第一底板对应的芯片，该核心板用于通过该第一底板对该待测芯片进行测试；确定当前与该核心板连接的底板的底板版本信息；确定该固件的当前版本与待测芯片相匹配，且当前与该核心板连接的底板为该第一底板后，向该核心板发送测试指示信息，该测试指示信息用于指示该核心板通过该第一底板对该待测芯片进行测试。
可选的，该方法可以由终端设备执行。
因此，本申请实施例的用于测试芯片的方法，可以使用终端设备连接测试平台，该测试平台包括核心板和多种底板，其中，不同种底板对应不同芯片，针对不同的芯片，选择不同的底板，而该核心板部分可以重用，而无需手动烧录固件，并且通过测试平台连接的终端设备保证核心板固件以及底板与待测芯片之间相匹配，即使用者不需要考虑驱动、固件以及软件等之间的配合问题，简化了使用过程，便于使用者操作。并且将昂贵的核心板部分独立出来重用，对于每种被测芯片只需设计廉价的配套底板，可以降低测试平 台成本。
第四方面，提供了一种测试系统，该测试系统可以包括测试平台和测试模块，该测试平台用于执行第二方面或第二方面的任意可能的实现方式中的方法，该测试模块可以用于执行第三方面或第三方面的任意可能的实现方式中的方法。
可选地，该测试模块可以位于终端设备中。
第五方面，提供了一种终端设备，包括：存储单元和处理器，该存储单元用于存储指令，该处理器用于执行该存储器存储的指令，并且当该处理器执行该存储器存储的指令时，该执行使得该处理器执行第三方面或第三方面的任意可能的实现方式中的方法。
第六方面，提供了一种计算机可读介质，用于存储计算机程序，该计算机程序包括用于执行第二方面或第二方面的任意可能的实现方式中的方法的指令。
第七方面，提供了一种计算机可读介质，用于存储计算机程序，该计算机程序包括用于执行第三方面或第三方面的任意可能的实现方式中的方法的指令。
附图说明
图1是根据本申请实施例的测试平台的示意图。
图2是根据本申请实施例的用于测试芯片的方法的示意性流程图。
图3是根据本申请实施例的用于测试芯片的方法的另一示意性流程图。
图4是根据本申请实施例的用于测试芯片的方法的再一示意性流程图。
图5是根据本申请实施例的用于测试芯片的方法的再一示意性流程图。
图6是根据本申请实施例的测试系统的示意性框图。
图7是根据本申请实施例的终端设备的示意性框图。
具体实施方式
下面将结合附图，对本申请实施例中的技术方案进行描述。
本申请实施例提出了一种测试平台，包括核心板和多种底板，其中，该多种底板中不同种底板对应不同芯片，该多种底板中的第一底板包括用于连接待测芯片的测试接口，该待测芯片为与第一底板对应的芯片，该核心板用 于通过该第一底板对该待测芯片进行测试。
可选地，作为一个实施例，图1示出了根据本申请实施例的测试平台100的示意图。具体地，该测试平台可以包括多种底板，不同种底板对应不同的芯片，例如，对于某一种待测芯片，该待测芯片对应于该测试平台100中包括的多个底板中的第一底板110，该第一底板110包括与该待测芯片对应的通信接口，并通过该通信接口与待测芯片相连进行测试。
另外，该第一底板110与核心板120也可以通过通信接口相连，例如，该核心板120可以通过GPIO接口访问该第一底板110的相关信息，例如该第一底板110的版本信息等。其中，该第一底板110与核心板120之间可以为通用的可拆卸结构，使得核心板120可以与多种底板中每种底板相连。可选地，该测试平台在进行测试时，例如对任意一个待测芯片进行测试时，核心板中仅包括对于一类芯片的固件，该核心板只与一个底板连接，对同一类待测芯片进行测试。
应理解，如图1所示，该测试平台100中的核心板120通过通信接口与终端设备相连接，例如通过USB接口连接。具体地，该核心板120具有USB从设备(Slave)功能，与终端设备连接。该测试平台100与终端设备对待测芯片进行测试，例如，图2示出了根据本申请实施例的用于测试芯片的方法200的示意性流程图，该方法200由该测试平台100执行，其中，该测试平台100通过该终端设备中的测试模块对待测芯片进行测试，本申请实施例并不限于此。为了便于描述，这里以该测试平台100与终端设备为例进行说明。
具体地，如图2所示，该方法200包括：S210，该核心板接收终端设备发送的固件版本指示信息；S220，该核心板根据该固件版本指示信息，向该终端设备发送固件版本信息，该固件版本信息用于指示该核心板中固件的当前版本；S230，在该固件的当前版本与待测芯片相匹配时，该核心板接收该终端设备发送的测试指示信息；S240，该核心板根据该测试指示信息，通过该第一底板对该待测芯片进行测试。
应理解，本申请实施例所涉及到的终端设备可以是电脑、手机(mobile phone)、平板电脑(Pad)、带无线收发功能的电脑、虚拟现实(virtual reality，VR)终端设备、增强现实(augmented reality，AR)终端设备、工业控制(industrial control)中的无线终端、运输安全(transportation safety)中的无 线终端等等。
在本申请实施例中，在需要对待测芯片进行测试时，用户或测试芯片人员根据该待测芯片，在测试平台包括的多种底板中选择一种底板安装，该底板包括与该待测芯片对应的接口，将该待测芯片与该底板连接。可选地，用户选择与该待测芯片对应的底板，或者，在不确定哪个底板与该待测芯片对应时，任意选择一个底板，或者仍然采用上一次测试使用的底板，不进行更换，本申请实施例并不限于此。
在本申请实施例中，连接底板与待测芯片，同时，该底板也通过接口与核心板连接，例如，通过GPIO接口连接。另外，核心板也可以通过通信接口与终端设备连接，例如，该核心板可以通过USB接口与终端设备连接。
在本申请实施例中，将待测芯片、测试平台以及终端设备连接后，开始测试。具体地，终端设备先确定该测试平台中核心板中固件的版本信息，判断该版本信息是否与该待测芯片相匹配。
具体地，核心板接收终端设备发送的固件版本指示信息，根据该固件版本指示信息，确定核心板中固件的当前版本。例如，核心板包括启动装载(bootloader)，该bootloader不断轮询核心板的USB数据，等待终端设备的命令。当该bootloader获取USB的数据为该固件版本指示信息时，该核心板根据其中固件的版本号和/或型号，确定该固件的当前版本，例如，该固件的当前版本为第一版本。
核心板向终端设备发送固件版本信息，该固件版本信息用于指示该核心板中固件的当前版本，例如该固件版本信息可以包括第一版本，对应的，终端设备可以根据该固件版本信息，确定该核心板中固件的当前版本为第一版本。
由于每种待测芯片都有专用的测试软件，所以对于单一软件，其测试对象是唯一的，因此，对于待测芯片，存在对应的一种测试软件用于测试该待测芯片，也存在与待测芯片匹配的固件。终端设备判断固件版本信息中指示的核心板的固件的当前版本(第一版本)与待测芯片是否相匹配，若该第一版本与该待测芯片相匹配，则该终端设备确定核心板中当前固件与待测芯片相匹配，并继续之后的相关流程；若该第一版本与该待测芯片不匹配，则终端设备确定与该待测芯片相匹配的固件的版本为第二版本，并向核心板发送该第二版本，使得核心板将固件的版本更换为第二版本，使得该核心板的固 件与待测芯片相匹配。可选地，核心板的固件更换为第二版本后，终端设备确定该核心板的固件当前版本与待测芯片相匹配，并可以继续之后的相关流程。
应理解，若核心板根据终端设备发送的第二版本更换固件的版本，终端设备可以通过多种方式确定该核心板完成固件版本更换，例如，该核心板在更换固件版本后，向终端设备发送确认信息，终端设备根据该确认信息，确定该核心板完成固件版本更换；或者，该终端设备再次向核心板发送固件版本指示信息，用于指示核心板发送固件的当前版本，从而使得终端设备可以确定该核心板是否完成固件版本更换，但本申请实施例并不限于此。
可选地，作为一个实施例，终端设备还可以直接向核心板发送第二版本，也就是该终端设备无需向核心板发送固件版本指示信息。具体地，终端设备根据待测芯片，确定核心板的固件的版本，例如确定该待测芯片与第二版本的固件相匹配，则终端设备向核心板发送该第二版本，以便于该核心板将固件的版本更换为第二版本，而无需终端设备通过发送固件版本指示信息，获取核心板的固件版本，直接通过发送相匹配的固件的版本，使得核心板的固件与待测芯片相匹配。
在本申请实施例中，终端设备还确定该测试平台中当前安装的底板的版本，确定该底板是否与该待测芯片相匹配。具体地，该终端设备向核心板发送底板版本指示信息，核心板通过bootloader不断轮询USB数据，获取该底板版本指示信息。该核心板根据该底板版本指示信息，获取当前与该核心板相连的底板的版本。核心板向终端设备发送底板版本信息，该底板版本信息用于指示当前底板的版本，则终端设备可以根据该底板版本信息，确定当前底板是否与待测芯片相匹配。
具体地，核心板可以通过与当前底板之间的GPIO接口读取该当前底板的版本号和/或型号，确定该底板的版本，并向终端设备发送底板版本信息，该底板版本信息包括该当前底板的版本。
可选地，若终端设备接收该底板版本信息，确定当前底板为第一底板，该第一底板为与待测芯片相匹配的底板，则该终端设备确定当前底板与待测芯片相匹配，并继续执行相关流程；若终端设备根据该底板版本信息，确定当前底板不是第一底板，而是第二底板，该第二底板为与待测芯片不匹配的任意底板，则终端设备可以提示需要更换底板。
可选地，终端设备显示底板更换提示信息，例如，该终端设备为电脑，通过电脑屏幕显示该底板更换提示信息，该底板更换提示信息用于提示将当前底板更换为与待测芯片相匹配的第一底板。对应的，用户或测试人员可以根据该底板更换提示信息，进行底板更换，从测试平台包括的多种底板中选择与待测芯片相匹配的第一底板，将该第一底板分别与核心板以及待测芯片相连接，以便于对待测芯片进行测试。
可选地，作为一个实施例，终端设备还可以直接显示底板更换提示信息，也就是该终端设备无需通过核心板获取底板的底板版本信息并判断是否与待测芯片对应。具体地，该终端设备根据待测芯片，确定对应的底板的版本，例如确定该待测芯片与第一底板相对应，则终端设备直接向用户显示包括第一底板的底板版本信息的底板更换提示信息，以便于用户根据该底板更换提示信息，直接使用与待测芯片对应的第一底板，并继而通过该第一底板与核心板，对该待测芯片进行测试。
应理解，在核心板的固件或者底板的版本信息与待测芯片不相匹配时，可以进行版本更换，并且终端设备可以多次确定核心板的固件与底板的版本信息是否与待测芯片相匹配，直至核心板的固件和底板的版本信息均与待测芯片相匹配。
在本申请实施例中，终端设备确定该测试平台的核心板中固件的当前版本与待测芯片相匹配，且该测试平台的底板与待测芯片也匹配后，进行待测芯片的测试。具体地，终端设备通过该核心板以及当前底板对待测芯片进行测试。可选地，对待测芯片的具体的性能测试流程可以与现有技术一致，对不同芯片采用不同方式进行，但本申请实施例并不限于此。
因此，本申请实施例的用于测试芯片的方法，可以对测试平台中的核心板部分进行重用，针对不同的芯片，选择不同的底板，使得无需手动烧录固件，并且通过终端设备保证核心板固件以及底板与待测芯片之间相匹配，即使用者不需要考虑驱动、固件以及软件等之间的配合问题，简化了使用过程，便于使用者操作。并且将昂贵的核心板部分独立出来重用，对于每种被测芯片只需设计廉价的配套底板，可以降低测试平台成本。
图3示出了根据本申请实施例的用于测试芯片的方法300的示意性流程图，该方法300可以由终端设备执行，例如，可以由该终端设备中的测试模块执行。如图3所示，该方法300包括：S310，确定测试平台的核心板中固 件的当前版本，该测试平台包括该核心板和多种底板，其中，该多种底板中不同种底板对应不同芯片，该多种底板中的第一底板包括用于连接待测芯片的测试接口，该待测芯片为与该第一底板对应的芯片，该核心板用于通过该第一底板对该待测芯片进行测试；S320，确定当前与该核心板连接的底板的底板版本信息；S330，确定该固件的当前版本与待测芯片相匹配，且当前与该核心板连接的底板为该第一底板后，向该核心板发送测试指示信息，该测试指示信息用于指示该核心板通过该第一底板对该待测芯片进行测试。
因此，本申请实施例的用于测试芯片的方法，可以对测试平台中的核心板部分进行重用，针对不同的芯片，选择不同的底板，使得无需手动烧录固件，并且通过终端设备保证核心板固件以及底板与待测芯片之间相匹配，即使用者不需要考虑驱动、固件以及软件等之间的配合问题，简化了使用过程，便于使用者操作。并且将昂贵的核心板部分独立出来重用，对于每种被测芯片只需设计廉价的配套底板，可以降低测试平台成本。
可选的，确定测试平台的核心板中固件的当前版本，包括：向该核心板发送固件版本指示信息，该固件版本指示信息用于指示该核心板确定该固件的当前版本；接收该核心板发送的固件版本信息，该固件版本信息用于指示该固件的当前版本。
可选的，该固件版本信息用于指示该固件的当前版本为第一版本，该第一版本与该待测芯片匹配。
可选的，该固件版本信息用于指示该固件的当前版本为第一版本，该第一版本与该待测芯片不匹配，确定该固件的当前版本与待测芯片相匹配，包括：在该第一版本与该待测芯片不匹配时，确定与该待测芯片相匹配的第二版本；向该核心板发送该第二版本，以使该核心板将该固件的当前版本更换为该第二版本；在该固件的当前版本为该第二版本时，确定该固件的当前版本与待测芯片相匹配。
可选的，确定当前与该核心板连接的底板的底板版本信息，包括：向该核心板发送底板版本指示信息，该底板版本指示信息用于指示该核心板确定当前与其连接的底板的底板版本信息；接收该核心板发送的底板版本信息。
可选的，确定当前与该核心板连接的底板为该第一底板，包括：根据该底板版本信息，若当前与该核心板连接的底板为该第一底板，确定当前与该核心板连接的底板与该待测芯片相对应；根据该底板版本信息，若当前与该 核心板连接的底板为该多种底板中的第二底板，显示底板更换提示信息，该底板更换提示信息用于提示更换当前与该核心板连接的底板，该第二底板为与该待测芯片不对应的底板。
可选的，该方法由终端设备执行，该终端设备通过通信接口与该核心板进行通信。
可选的，该通信接口为USB接口。
应理解，该方法300中的终端设备可以对应方法200中的终端设备，方法300中的测试平台可以对应方法200中的测试平台，该测试平台可以为如图1所示的测试平台100，在此不再赘述。
因此，本申请实施例的用于测试芯片的方法，可以对测试平台中的核心板部分进行重用，针对不同的芯片，选择不同的底板，使得无需手动烧录固件，并且通过终端设备保证核心板固件以及底板与待测芯片之间相匹配，即使用者不需要考虑驱动、固件以及软件等之间的配合问题，简化了使用过程，便于使用者操作。并且将昂贵的核心板部分独立出来重用，对于每种被测芯片只需设计廉价的配套底板，可以降低测试平台成本。
下面结合具体实施例从终端设备的角度，描述本申请实施例的用于测试芯片的方法。具体地，图4示出了根据本申请实施例的用于测试芯片的方法400的示意性流程图。
应理解，该方法400可以通过终端设备执行，该终端设备可以通过USB接口与测试平台进行通信，以便于对待测芯片进行测试。其中，该测试平台包括核心板和多种底板，其中，该多种底板中不同种底板对应不同芯片，对于该多种底板中的任意一种底板，例如第一底板，该第一底板包括用于连接待测芯片的接口，该待测芯片为与该第一底板对应的芯片，该第一底板可以用于测试该待测芯片。这里以对待测芯片进行测试为例进行说明。
S401，启动终端设备，即通过终端设备控制开始测试流程。可选地，该步骤还可以包括将终端设备与测试平台的核心板通过USB接口连接。
对应的，启动测试平台，将测试平台中的核心板与底板连接，该底板可以为测试平台中的任意一种底板，例如，可以随机选择一种底板，或者选择与待测芯片对应的第一底板；并将待测芯片与该底板连接。
S402，通过USB读取核心板的固件版本信息，即终端设备通过USB接口，确定核心板中固件的版本信息。
具体地，终端设备可以向核心板发送固件版本指示信息，核心板接收该固件版本指示信息，并根据该固件版本指示信息，确定核心板中固件的当前版本，例如该核心板确定固件的当前版本为第一版本，核心板向终端设备发送固件版本信息，该固件版本信息用于指示该核心板的固件的当前版本，例如该固件版本信息可以包括固件的版本为第一版本。则终端设备可以根据该固件版本信息，确定该核心板的固件的当前版本。
S403，确定固件是否与待测芯片匹配，即终端设备确定该核心板的固件当前版本是否与待测芯片相匹配。若匹配则继续执行S405，若不匹配，则继续执行S404。
具体地，终端设备根据固件版本信息，确定该核心板的固件当前版本为第一版本，判断该第一版本与待测芯片是否匹配。若该第一版本与待测芯片相匹配，则继续执行S405，若不匹配，则继续执行S404。
S404，更换固件版本，即终端设备指示核心板更换固件版本。核心板将固件版本更换为与待测芯片相匹配的版本，并继续执行S405。
具体地，终端设备确定核心板的固件当前版本与待测芯片不匹配，则确定与该待测芯片相匹配的固件的版本，例如终端设备可以确定第二版本与待测芯片相匹配，该终端设备可以向核心板发送该第二版本，以便于核心板根据该第二版本，将固件当前版本更换为第二版本。
S405，确定底板的版本信息，即终端设备通过核心板确定当前底板的底板版本信息。
具体地，终端设备向核心板发送底板版本指示信息，核心板根据该底板版本指示信息，读取当前与该核心板连接的底板的版本号和/或型号，确定该底板的底板版本信息。核心板向终端设备发送底板版本信息，该底板版本信息为该底板的底板版本信息。
S406，确定底板是否与待测芯片匹配，即终端设备通过核心板确定当前底板是否与待测芯片相匹配。若匹配则继续执行S408，若不匹配，则继续执行S407。
具体地，终端设备根据该底板版本信息，确定当前底板的底板版本信息。例如，若终端设备根据该底板版本信息，确定当前底板为第一底板，该第一底板为与待测芯片相匹配的底板，则继续执行S408；若确定当前底板为第二底板，该第二底板为与待测芯片不匹配的底板，则继续执行S407。
S407，提示更换底板，即终端设备向用户提示更换当前的底板。
具体地，终端设备可以通过屏幕显示底板更换提示信息，提示用户更换底板为与待测芯片相匹配的第一底板，并在用户完成底板更换后，继续执行S405。
S408，开始测试芯片，当终端设备确定核心板的固件与底板的版本信息均与待测芯片相匹配时，可以通过核心板与底板，对待测芯片进行测试，测试该待测芯片是否为合格芯片。该测试过程可以与现有技术相同，在此不再赘述。
因此，本申请实施例的用于测试芯片的方法，可以对测试平台中的核心板部分进行重用，针对不同的芯片，选择不同的底板，使得无需手动烧录固件，并且通过终端设备保证核心板固件以及底板与待测芯片之间相匹配，即使用者不需要考虑驱动、固件以及软件等之间的配合问题，简化了使用过程，便于使用者操作。并且将昂贵的核心板部分独立出来重用，对于每种被测芯片只需设计廉价的配套底板，可以降低测试平台成本。
下面结合具体实施例从测试平台的角度，描述本申请实施例的用于测试芯片的方法。具体地，图5示出了根据本申请实施例的用于测试芯片的方法500的示意性流程图，该方法500可以由测试平台执行，例如可以为如图1所示的测试平台，该测试平台包括核心板和多种底板，该方法500可以由核心板执行，其中，该多种底板中不同种底板对应不同芯片，对于该多种底板中的任意一种底板，例如第一底板，该第一底板包括用于连接待测芯片对应的接口，该待测芯片为与该第一底板对应的芯片，该第一底板可以用于测试该待测芯片。
具体地，这里以对待测芯片进行测试为例进行说明。
S501，上电启动测试平台。
具体地，测试平台上电启动包括将测试平台中的核心板与底板连接，该底板为测试平台包括的多种底板中的任意一种底板，例如，随机选择一种底板，或者选择与待测芯片对应的底板；并将待测芯片与底板连接。另外，还包括测试平台的核心板通过USB接口与终端设备连接。
S502，读取USB OUT命令，即测试平台中的核心板读取USB输出(OUT)命令。
例如，该核心板可以包括bootloader，通过该bootloader轮询USB数据， 等待终端设备发送的命令。
S503，S503判断为固件版本指示信息，即核心板判断终端设备发送的命令是否为固件版本指示信息。
例如，该核心板接收该终端设备发送的信息，若确定该信息为固件版本指示信息，则继续执行S504，若不是，则继续执行S505，其中，该固件版本指示信息用于指示核心板提供固件的当前版本。
S504，发送核心板的固件版本信息，即核心板确定接收终端设备发送的固件版本指示信息，并根据该固件版本指示信息，确定该核心板中固件当前的版本信息，并向终端设备发送用于指示该核心板固件当前版本的信息。并继续执行S502。
具体地，核心板中固件当前的版本为第一版本，则核心板可以确定固件版本信息，该固件版本信息包括第一版本，该固件版本信息用于指示该核心板中固件当前的版本为第一版本。核心板向终端设备发送该固件版本信息。
S505，判断为底板版本指示信息，即核心板判断终端设备发送的命令是否为底板版本指示信息。
例如，该核心板可以接收该终端设备发送的信息，若确定该信息为底板版本指示信息，则继续执行S506，若不是，则继续执行S508，其中，该底板版本指示信息用于指示核心板提供当前底板的底板版本信息。
S506，读取底板的版本信息，即核心板确定接收终端设备发送的底板版本指示信息，并根据该底板版本指示信息，读取当前与核心板连接的底板的底板版本信息。
具体地，核心板通过GPIO接口读取当前的底板的版本号和/或型号，确定当前底板的版本，例如，确定当前的底板为第一底板。
S507，发送底板版本信息，核心板向终端设备发送用于指示当前底板的版本的底板版本信息。并继续执行S502。
具体地，核心板可以向终端设备发送底板版本信息，该底板版本信息用于指示当前底板的版本，例如，该底板版本信息用于指示当前底板为第一底板。
S508，确定启动测试流程，即核心板确定终端设备发送的命令是否为指示启动测试流程，若是，则执行S509，若不是，则执行S502。
S509，开始测试，核心板通过当前与核心板连接的底板，对待测芯片进 行测试，测试该待测芯片是否可以正常工作。
可选地，利用现有测试方法对不同芯片，采用不同的测试流程进行测试，在此不再赘述。
因此，本申请实施例的用于测试芯片的方法，可以对测试平台中的核心板部分进行重用，针对不同的芯片，选择不同的底板，使得无需手动烧录固件，并且通过终端设备保证核心板固件以及底板与待测芯片之间相匹配，即使用者不需要考虑驱动、固件以及软件等之间的配合问题，简化了使用过程，便于使用者操作。并且将昂贵的核心板部分独立出来重用，对于每种被测芯片只需设计廉价的配套底板，可以降低测试平台成本。
应理解，在本申请的各种实施例中，上述各过程的序号的大小并不意味着执行顺序的先后，各过程的执行顺序应以其功能和内在逻辑确定，而不应对本申请实施例的实施过程构成任何限定。
上文中结合图1至图5，详细描述了根据本申请实施例的用于测试芯片的方法，下面将结合图6至图7，描述根据本申请实施例的测试系统和终端设备。
如图6所示，根据本申请实施例的测试系统600包括测试平台610和测试模块620，其中，测试模块620具体包括：确定单元621和发送单元622，可选的，还可以包括接收单元623。
具体地，该测试平台610包括核心板和多个底板，该多种底板中不同种底板对应不同芯片，该多种底板中的第一底板包括用于连接待测芯片的测试接口，该待测芯片为与该第一底板对应的芯片；该核心板用于通过该第一底板对该待测芯片进行测试。
可选地，该测试平台610可以为如图1所示的测试平台100，该测试平台610可以执行图1至图5中的各个方法中的测试平台的相应流程，为了简洁，在此不再赘述。
另外，该测试模块620位于终端设备中，或者该测试模块为终端设备，该终端设备可以为如图1所示的终端设备，执行图1至图5中的各个方法中的终端设备的相应流程，为了简洁，在此不再赘述。
具体地，该测试模块620中的该确定单元620用于：确定该测试平台的核心板中固件的当前版本；该确定单元621还用于：确定该测试平台中当前与该核心板连接的底板的底板版本信息；该发送单元622用于：在该确定单 元621确定该固件的当前版本与待测芯片相匹配，且当前与该核心板连接的底板为该第一底板后，向该核心板发送测试指示信息，该测试指示信息用于指示该核心板通过该第一底板对该待测芯片进行测试。
可选的，该发送单元622还用于：向该核心板发送固件版本指示信息，该固件版本指示信息用于指示该核心板确定该固件的当前版本；接收单元623用于：接收该核心板发送的固件版本信息，该固件版本信息用于指示该固件的当前版本。
可选的，该固件版本信息用于指示该固件的当前版本为第一版本，该第一版本与该待测芯片不匹配，该确定单元621具体用于：在该第一版本与该待测芯片不匹配时，确定与该待测芯片相匹配的第二版本；该发送单元622还用于：向该核心板发送该第二版本，以使该核心板将该固件的当前版本更换为该第二版本；在该确定单元621确定该固件的当前版本为该第二版本时，向该核心板发送该测试指示信息。
可选的，该发送单元622还用于：向该核心板发送底板版本指示信息，该底板版本指示信息用于指示该核心板确定当前与其连接的底板的底板版本信息；接收单元623用于：接收该核心板发送的底板版本信息。
可选的，该确定单元621具体用于：根据该底板版本信息，若当前与该核心板连接的底板为该第一底板，确定当前与该核心板连接的底板与该待测芯片相对应；根据该底板版本信息，若当前与该核心板连接的底板为该多种底板中的第二底板，显示底板更换提示信息，该底板更换提示信息用于提示更换当前与该核心板连接的底板，该第二底板为与该待测芯片不对应的底板。
可选的，该测试系统中的测试模块620为终端设备，或者，该测试模块620位于终端设备中。
可选地，该测试模块620位于终端设备中，该终端设备可以通过通信接口与该核心板进行通信。
可选的，该通信接口为USB接口。
应理解，根据本申请实施例的测试系统600可对应于执行本申请实施例中的方法200和方法400，其中，测试模块620可对应于执行本申请实施例中的方法300和400，并且测试模块620中的各个单元的上述和其它操作和/或功能分别为了实现图1至图5中的各个方法中的终端设备或测试模块的 相应流程，为了简洁，在此不再赘述。
因此，本申请实施例的终端设备，可以与测试平台对待测芯片进行检测，该测试平台可以包括核心板和多种底板，不同种底板对应不同芯片，针对不同的芯片，选择不同的底板，而该核心板部分可以重用，而无需手动烧录固件，并且通过该终端设备确定核心板固件以及底板与待测芯片之间相匹配，即使用者不需要考虑驱动、固件以及软件等之间的配合问题，简化了使用过程，便于使用者操作。并且将昂贵的核心板部分独立出来重用，对于每种被测芯片只需设计廉价的配套底板，可以降低测试平台成本。
图7示出了根据本申请实施例的终端设备700的示意性框图，如图7所示，该终端设备700包括：处理器710和收发器720，处理器710和收发器720相连，可选地，该终端设备700还包括存储器730，存储器730与处理器710相连。其中，处理器710、存储器730和收发器720之间通过内部连接通路互相通信，传递控制和/或数据信号，该存储器730可以用于存储指令，该处理器710用于执行该存储器730存储的指令，以控制收发器720发送信息或信号，该处理器710用于：确定测试平台的核心板中固件的当前版本，该测试平台包括该核心板和多种底板，其中，该多种底板中不同种底板对应不同芯片，该多种底板中的第一底板包括用于连接待测芯片的测试接口，该待测芯片为与该第一底板对应的芯片该核心板用于通过该第一底板对该待测芯片进行测试；确定当前与该核心板连接的底板的底板版本信息；确定该固件的当前版本与待测芯片相匹配，且当前与该核心板连接的底板为该第一底板后，向该核心板发送测试指示信息，该测试指示信息用于指示该核心板通过该第一底板对该待测芯片进行测试。
因此，本申请实施例的终端设备，可以与测试平台对待测芯片进行检测，该测试平台可以包括核心板和多种底板，不同种底板对应不同芯片，针对不同的芯片，选择不同的底板，而该核心板部分可以重用，而无需手动烧录固件，并且通过该终端设备确定核心板固件以及底板与待测芯片之间相匹配，即使用者不需要考虑驱动、固件以及软件等之间的配合问题，简化了使用过程，便于使用者操作。并且将昂贵的核心板部分独立出来重用，对于每种被测芯片只需设计廉价的配套底板，可以降低测试平台成本。
可选的，作为一个实施例，该收发器720用于：向该核心板发送固件版本指示信息，该固件版本指示信息用于指示该核心板确定该固件的当前版 本；接收该核心板发送的固件版本信息，该固件版本信息用于指示该固件的当前版本。
可选的，作为一个实施例，该处理器710用于：该固件版本信息用于指示该固件的当前版本为第一版本，该第一版本与该待测芯片不匹配。
可选的，作为一个实施例，该固件版本信息用于指示该固件的当前版本为第一版本，该第一版本与该待测芯片不匹配，该处理器710用于：在该第一版本与该待测芯片不匹配时，确定与该待测芯片相匹配的第二版本；该收发器720用于：向该核心板发送该第二版本，以使该核心板将该固件的当前版本更换为该第二版本；在该处理器710确定该固件的当前版本为该第二版本时，向该核心板发送该测试指示信息。
可选的，作为一个实施例，该收发器720用于：向该核心板发送底板版本指示信息，该底板版本指示信息用于指示该核心板确定当前与其连接的底板的底板版本信息；接收该核心板发送的底板版本信息。
可选的，作为一个实施例，该处理器710用于：根据该底板版本信息，若当前与该核心板连接的底板为该第一底板，确定当前与该核心板连接的底板与该待测芯片相对应；根据该底板版本信息，若当前与该核心板连接的底板为该多种底板中的第二底板，显示底板更换提示信息，该底板更换提示信息用于提示更换当前与该核心板连接的底板，该第二底板为与该待测芯片不对应的底板。
可选的，作为一个实施例，该终端设备通过通信接口与该核心板进行通信。
可选的，作为一个实施例，该通信接口为USB接口。
应理解，根据本申请实施例的终端设备700可对应于本申请实施例中的测试系统600中的测试模块620，并可以对应于执行根据本申请实施例的方法300和400中的相应主体，并且终端设备700中的各个单元的上述和其它操作和/或功能分别为了实现图1至图5中的各个方法中终端设备的相应流程，为了简洁，在此不再赘述。
因此，本申请实施例的终端设备，可以与测试平台对待测芯片进行检测，该测试平台可以包括核心板和多种底板，不同种底板对应不同种芯片，针对不同的芯片，选择不同的底板，而该核心板部分可以重用，而无需手动烧录固件，并且通过该终端设备确定核心板固件以及底板与待测芯片之间相匹 配，即使用者不需要考虑驱动、固件以及软件等之间的配合问题，简化了使用过程，便于使用者操作。并且将昂贵的核心板部分独立出来重用，对于每种被测芯片只需设计廉价的配套底板，可以降低测试平台成本。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以所述权利要求的保护范围为准。

Claims (19)

  1. 一种测试平台，其特征在于，包括：核心板和多种底板，
    其中，所述多种底板中不同种底板对应不同芯片，所述多种底板中的第一底板包括用于连接待测芯片的测试接口，所述待测芯片为与所述第一底板对应的芯片；
    所述核心板用于通过所述第一底板对所述待测芯片进行测试。
  2. 根据权利要求1所述的测试平台，其特征在于，所述核心板用于：
    接收终端设备发送的固件版本指示信息；
    根据所述固件版本指示信息，向所述终端设备发送固件版本信息，所述固件版本信息用于指示所述核心板中固件的当前版本；
    在所述固件的当前版本与待测芯片相匹配时，接收所述终端设备发送的测试指示信息；
    根据所述测试指示信息，通过所述第一底板对所述待测芯片进行测试。
  3. 根据权利要求2所述的测试平台，其特征在于，所述固件版本信息用于指示所述固件的当前版本为第一版本，所述第一版本与所述待测芯片不匹配，
    所述核心板用于在所述固件的当前版本与待测芯片相匹配时，接收所述终端设备发送的测试指示信息，具体包括：
    接收所述终端设备发送的与所述待测芯片相匹配的所述固件的第二版本；
    将所述固件的当前版本更换为所述第二版本；
    接收所述终端设备确定所述固件的当前版本为所述第二版本时发送的所述测试指示信息。
  4. 根据权利要求2或3所述的测试平台，其特征在于，所述核心板具体用于：
    在接收所述终端设备发送的所述测试指示信息之前，接收所述终端设备发送的底板版本指示信息；
    根据所述底板版本指示信息，确定底板版本信息，所述底板版本信息为当前与所述核心板连接的底板的底板版本信息；
    向所述终端设备发送所述底板版本信息。
  5. 根据权利要求4所述的测试平台，其特征在于，当前与所述核心板 连接的底板为所述第一底板。
  6. 一种测试系统，其特征在于，所述测试系统包括如权利要求1-5中任一项所述的测试平台以及测试模块，其中，所述测试模块包括：
    确定单元，用于确定所述测试平台的核心板中固件的当前版本；
    所述确定单元还用于：确定所述测试平台中当前与所述核心板连接的底板的底板版本信息；
    发送单元，用于在所述确定单元确定所述固件的当前版本与待测芯片相匹配，且当前与所述核心板连接的底板为所述第一底板后，向所述核心板发送测试指示信息，所述测试指示信息用于指示所述核心板通过所述第一底板对所述待测芯片进行测试。
  7. 根据权利要求6所述的测试系统，其特征在于，所述发送单元还用于：
    向所述核心板发送固件版本指示信息，所述固件版本指示信息用于指示所述核心板确定所述固件的当前版本；
    所述测试模块还包括：
    接收单元，用于接收所述核心板发送的固件版本信息，所述固件版本信息用于指示所述固件的当前版本。
  8. 根据权利要求7所述的测试系统，其特征在于，所述固件版本信息用于指示所述固件的当前版本为第一版本，所述第一版本与所述待测芯片不匹配，
    所述确定单元具体用于：
    在所述第一版本与所述待测芯片不匹配时，确定与所述待测芯片相匹配的第二版本；
    所述发送单元还用于：
    向所述核心板发送所述第二版本，以使所述核心板将所述固件的当前版本更换为所述第二版本；
    在所述确定单元确定所述固件的当前版本为所述第二版本时，向所述核心板发送所述测试指示信息。
  9. 根据权利要求6至8中任一项所述的测试系统，其特征在于，所述发送单元还用于：
    向所述核心板发送底板版本指示信息，所述底板版本指示信息用于指示 所述核心板确定当前与其连接的底板的底板版本信息；
    所述测试模块还包括：
    接收单元，用于接收所述核心板发送的底板版本信息。
  10. 根据权利要求9所述的测试系统，其特征在于，所述确定单元具体用于：
    根据所述底板版本信息，若当前与所述核心板连接的底板为所述第一底板，确定当前与所述核心板连接的底板与所述待测芯片相对应；
    根据所述底板版本信息，若当前与所述核心板连接的底板为所述多种底板中的第二底板，显示底板更换提示信息，所述底板更换提示信息用于提示更换当前与所述核心板连接的底板，所述第二底板为与所述待测芯片不对应的底板。
  11. 一种用于测试芯片的方法，其特征在于，所述方法由测试平台的核心板执行，所述测试平台包括所述核心板和多种底板，所述多种底板中不同种底板对应不同芯片，所述多种底板中第一底板包括用于连接待测芯片的测试接口，所述待测芯片为与所述第一底板对应的芯片，所述核心板用于通过所述第一底板对所述待测芯片进行测试，所述方法包括：
    所述核心板接收终端设备发送的固件版本指示信息；
    所述核心板根据所述固件版本指示信息，向所述终端设备发送固件版本信息，所述固件版本信息用于指示所述核心板中固件的当前版本；
    在所述固件的当前版本与待测芯片相匹配时，所述核心板接收所述终端设备发送的测试指示信息；
    所述核心板根据所述测试指示信息，通过所述第一底板对所述待测芯片进行测试。
  12. 根据权利要求11所述的方法，其特征在于，所述固件版本信息用于指示所述固件的当前版本为第一版本，所述第一版本与所述待测芯片不匹配，
    在所述固件的当前版本与待测芯片相匹配时，所述核心板接收所述终端设备发送的测试指示信息，包括：
    所述核心板接收所述终端设备发送的与所述待测芯片相匹配的所述固件的第二版本；
    所述核心板将所述固件的当前版本更换为所述第二版本；
    所述核心板接收所述终端设备确定所述固件的当前版本为所述第二版本时发送的所述测试指示信息。
  13. 根据权利要求11或12所述的方法，其特征在于，在所述核心板接收所述终端设备发送的所述测试指示信息之前，所述方法还包括：
    所述核心板接收所述终端设备发送的底板版本指示信息；
    所述核心板根据所述底板版本指示信息，确定底板版本信息，所述底板版本信息为当前与所述核心板连接的底板的底板版本信息；
    所述核心板向所述终端设备发送所述底板版本信息。
  14. 根据权利要求13所述的方法，其特征在于，
    在所述固件的当前版本与待测芯片相匹配时，所述核心板接收所述终端设备发送的测试指示信息，包括：
    在所述固件的当前版本与所述待测芯片相匹配且当前与所述核心板连接的底板为所述第一底板时，所述核心板接收所述终端设备发送的所述测试指示信息。
  15. 一种用于测试芯片的方法，其特征在于，包括：
    确定测试平台的核心板中固件的当前版本，所述测试平台包括所述核心板和多种底板，其中，所述多种底板中不同种底板对应不同芯片，所述多种底板中的第一底板包括用于连接待测芯片的测试接口，所述待测芯片为与所述第一底板对应的芯片，所述核心板用于通过所述第一底板对所述待测芯片进行测试；
    确定当前与所述核心板连接的底板的底板版本信息；
    确定所述固件的当前版本与待测芯片相匹配，且当前与所述核心板连接的底板为所述第一底板后，向所述核心板发送测试指示信息，所述测试指示信息用于指示所述核心板通过所述第一底板对所述待测芯片进行测试。
  16. 根据权利要求15所述的方法，其特征在于，确定测试平台的核心板中固件的当前版本，包括：
    向所述核心板发送固件版本指示信息，所述固件版本指示信息用于指示所述核心板确定所述固件的当前版本；
    接收所述核心板发送的固件版本信息，所述固件版本信息用于指示所述固件的当前版本。
  17. 根据权利要求16所述的方法，其特征在于，所述固件版本信息用 于指示所述固件的当前版本为第一版本，所述第一版本与所述待测芯片不匹配，
    确定所述固件的当前版本与待测芯片相匹配，包括：
    在所述第一版本与所述待测芯片不匹配时，确定与所述待测芯片相匹配的第二版本；
    向所述核心板发送所述第二版本，以使所述核心板将所述固件的当前版本更换为所述第二版本；
    在所述固件的当前版本为所述第二版本时，确定所述固件的当前版本与待测芯片相匹配。
  18. 根据权利要求15至17中任一项所述的方法，其特征在于，确定当前与所述核心板连接的底板的底板版本信息，包括：
    向所述核心板发送底板版本指示信息，所述底板版本指示信息用于指示所述核心板确定当前与其连接的底板的底板版本信息；
    接收所述核心板发送的底板版本信息。
  19. 根据权利要求18所述的方法，其特征在于，确定当前与所述核心板连接的底板为所述第一底板，包括：
    根据所述底板版本信息，若当前与所述核心板连接的底板为所述第一底板，确定当前与所述核心板连接的底板与所述待测芯片相对应；
    根据所述底板版本信息，若当前与所述核心板连接的底板为所述多种底板中的第二底板，显示底板更换提示信息，所述底板更换提示信息用于提示更换当前与所述核心板连接的底板，所述第二底板为与所述待测芯片不对应的底板。
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