WO2019078656A3 - 점착 조성물 및 이의 경화물을 포함하는 점착 필름 - Google Patents

점착 조성물 및 이의 경화물을 포함하는 점착 필름 Download PDF

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Publication number
WO2019078656A3
WO2019078656A3 PCT/KR2018/012372 KR2018012372W WO2019078656A3 WO 2019078656 A3 WO2019078656 A3 WO 2019078656A3 KR 2018012372 W KR2018012372 W KR 2018012372W WO 2019078656 A3 WO2019078656 A3 WO 2019078656A3
Authority
WO
WIPO (PCT)
Prior art keywords
tacky
cured product
adhesive
adhesive composition
adhesive film
Prior art date
Application number
PCT/KR2018/012372
Other languages
English (en)
French (fr)
Other versions
WO2019078656A2 (ko
Inventor
홍재성
송호경
이슬
최준만
김장순
Original Assignee
주식회사 엘지화학
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 엘지화학 filed Critical 주식회사 엘지화학
Priority to CN201880054231.7A priority Critical patent/CN111032804B/zh
Priority to US16/648,106 priority patent/US11873425B2/en
Priority to JP2020508494A priority patent/JP7004393B2/ja
Publication of WO2019078656A2 publication Critical patent/WO2019078656A2/ko
Publication of WO2019078656A3 publication Critical patent/WO2019078656A3/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)

Abstract

본 명세서는 점착 조성물, 이의 경화물을 포함하는 점착 필름에 관한 것이다.
PCT/KR2018/012372 2017-10-20 2018-10-19 점착 조성물 및 이의 경화물을 포함하는 점착 필름 WO2019078656A2 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201880054231.7A CN111032804B (zh) 2017-10-20 2018-10-19 粘合剂组合物和包含其固化产物的粘合剂膜
US16/648,106 US11873425B2 (en) 2017-10-20 2018-10-19 Adhesive composition and adhesive film including cured product thereof
JP2020508494A JP7004393B2 (ja) 2017-10-20 2018-10-19 粘着組成物およびその硬化物を含む粘着フィルム

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020170136849A KR20190044426A (ko) 2017-10-20 2017-10-20 점착 조성물 및 이의 경화물을 포함하는 점착 필름
KR10-2017-0136849 2017-10-20

Publications (2)

Publication Number Publication Date
WO2019078656A2 WO2019078656A2 (ko) 2019-04-25
WO2019078656A3 true WO2019078656A3 (ko) 2019-06-06

Family

ID=66173765

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2018/012372 WO2019078656A2 (ko) 2017-10-20 2018-10-19 점착 조성물 및 이의 경화물을 포함하는 점착 필름

Country Status (6)

Country Link
US (1) US11873425B2 (ko)
JP (1) JP7004393B2 (ko)
KR (1) KR20190044426A (ko)
CN (1) CN111032804B (ko)
TW (1) TWI780241B (ko)
WO (1) WO2019078656A2 (ko)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008239872A (ja) * 2007-03-28 2008-10-09 Dic Corp 水分散型アクリル系粘着剤組成物及び両面粘着テープ
KR20110051150A (ko) * 2009-11-09 2011-05-17 닛토덴코 가부시키가이샤 광학용 점착 시트
KR20110111826A (ko) * 2010-04-05 2011-10-12 (주)엘지하우시스 터치 패널용 점착제 조성물, 점착필름 및 터치 패널
KR20120096462A (ko) * 2009-09-29 2012-08-30 린텍 코포레이션 점착제 및 점착 시트
KR20120134950A (ko) * 2011-06-03 2012-12-12 제일모직주식회사 점착제 조성물 및 이를 이용한 광학부재

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04145183A (ja) * 1990-10-05 1992-05-19 Japan Synthetic Rubber Co Ltd 粘着剤用組成物
JP2002285105A (ja) 2001-01-22 2002-10-03 Sony Chem Corp 粘着剤組成物及び粘着シート
JP5235001B2 (ja) * 2009-07-16 2013-07-10 日東電工株式会社 粘着シート
KR101938894B1 (ko) * 2010-03-18 2019-01-15 세키스이가가쿠 고교가부시키가이샤 광학 부재용 점착제 조성물 및 광학 부재용 점착 테이프
JP5885286B2 (ja) * 2011-03-29 2016-03-15 日東電工株式会社 粘着シートおよびその利用
JP5851166B2 (ja) 2011-09-20 2016-02-03 藤森工業株式会社 粘着剤組成物及び粘着フィルム
JP2014043546A (ja) * 2012-07-31 2014-03-13 Nitto Denko Corp 放射線硬化型粘着剤層及び放射線硬化型粘着シート
JP2014047254A (ja) * 2012-08-30 2014-03-17 Nitto Denko Corp 両面粘着シート、積層体、及び板の剥離方法
JP5836293B2 (ja) 2013-02-13 2015-12-24 藤森工業株式会社 粘着剤組成物及び粘着フィルム、表面保護フィルム、光学フィルム
WO2015005387A1 (ja) * 2013-07-09 2015-01-15 日東電工株式会社 粘着剤組成物
KR101866606B1 (ko) 2014-07-22 2018-06-12 주식회사 엘지화학 광경화성 점착제 조성물 및 점착 필름
KR101932489B1 (ko) 2014-07-30 2018-12-27 주식회사 엘지화학 광경화성 점접착제 조성물, 점접착 필름 및 점접착 필름의 제조 방법
KR101906638B1 (ko) 2014-09-30 2018-10-11 주식회사 엘지화학 터치패널용 점착제 조성물, 점착 필름 및 터치 패널
KR101888720B1 (ko) * 2014-09-30 2018-08-16 주식회사 엘지화학 터치패널용 점착제 조성물, 점착 필름 및 터치 패널

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008239872A (ja) * 2007-03-28 2008-10-09 Dic Corp 水分散型アクリル系粘着剤組成物及び両面粘着テープ
KR20120096462A (ko) * 2009-09-29 2012-08-30 린텍 코포레이션 점착제 및 점착 시트
KR20110051150A (ko) * 2009-11-09 2011-05-17 닛토덴코 가부시키가이샤 광학용 점착 시트
KR20110111826A (ko) * 2010-04-05 2011-10-12 (주)엘지하우시스 터치 패널용 점착제 조성물, 점착필름 및 터치 패널
KR20120134950A (ko) * 2011-06-03 2012-12-12 제일모직주식회사 점착제 조성물 및 이를 이용한 광학부재

Also Published As

Publication number Publication date
TWI780241B (zh) 2022-10-11
TW201923008A (zh) 2019-06-16
US11873425B2 (en) 2024-01-16
JP2020530870A (ja) 2020-10-29
JP7004393B2 (ja) 2022-01-21
US20200255691A1 (en) 2020-08-13
CN111032804A (zh) 2020-04-17
CN111032804B (zh) 2022-04-19
WO2019078656A2 (ko) 2019-04-25
KR20190044426A (ko) 2019-04-30

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