WO2019075713A1 - 指纹封装芯片及封装方法、指纹模组及移动终端 - Google Patents

指纹封装芯片及封装方法、指纹模组及移动终端 Download PDF

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Publication number
WO2019075713A1
WO2019075713A1 PCT/CN2017/107000 CN2017107000W WO2019075713A1 WO 2019075713 A1 WO2019075713 A1 WO 2019075713A1 CN 2017107000 W CN2017107000 W CN 2017107000W WO 2019075713 A1 WO2019075713 A1 WO 2019075713A1
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WO
WIPO (PCT)
Prior art keywords
fingerprint
chip
bare chip
package
mobile terminal
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Application number
PCT/CN2017/107000
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English (en)
French (fr)
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WO2019075713A9 (zh
Inventor
邓涛
古蒋林
彭旭
刘海永
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to PCT/CN2017/107000 priority Critical patent/WO2019075713A1/zh
Priority to CN201780067544.1A priority patent/CN109983573A/zh
Publication of WO2019075713A1 publication Critical patent/WO2019075713A1/zh
Publication of WO2019075713A9 publication Critical patent/WO2019075713A9/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

Definitions

  • the embodiments of the present invention relate to the field of mobile terminal technologies, and in particular, to a fingerprint package chip and a packaging method, and a fingerprint module and a mobile terminal including the fingerprint package chip.
  • fingerprint recognition provides great convenience to the user, the user can wake up the mobile terminal with a single touch, completely eliminating the cumbersome steps of inputting the password. Therefore, fingerprint recognition has become a standard feature of mobile devices. As such, fingerprint devices are generally provided in existing mobile devices.
  • the current pre-fingerprint solution sets the fingerprint module on the front side of the mobile terminal, so that the peripheral area of the display screen of the mobile terminal needs to leave a certain space to create a fingerprint module. Therefore, the front fingerprint module is not conducive to improving the movement.
  • the screen ratio of the terminal Therefore, the design of the high screen ratio of mobile terminals using the pre-fingerprint scheme is a big challenge.
  • the embodiment of the present application provides a fingerprint encapsulation chip and a packaging method, a fingerprint module, and a mobile terminal.
  • a first aspect of the present application provides a method for packaging a fingerprint package chip, including:
  • the fingerprint bare chip is etched with a through hole penetrating the front side of the fingerprint bare chip, the through hole communicating with the pad on the front surface of the fingerprint bare chip, along the surface of the through hole and the a metal wiring layer is formed on the back surface of the fingerprint bare chip, the metal wiring layer is in communication with the pad, the through hole is filled with a solder resist layer, and a solder resist layer is formed on the back surface of the fingerprint bare chip.
  • the solder resist layer on the back surface of the fingerprint bare chip does not cover the metal wiring layer formed on the back surface of the fingerprint bare chip;
  • solder ball Forming a solder ball on a back surface of the fingerprint bare chip, the solder ball being in communication with the metal wiring layer;
  • the layer of encapsulating material surrounding the bottom of the solder ball is removed until the solder ball is exposed.
  • the encapsulation method further includes:
  • a protective layer is formed on a front surface of the fingerprint bare chip.
  • the forming a protection layer on a front surface of the fingerprint bare chip includes:
  • a protective layer is applied on the front side of the fingerprint bare chip by a printing or spin coating process.
  • the forming a protection layer on the front side of the fingerprint bare chip includes:
  • the encapsulating material While encapsulating the fingerprint bare chip with an encapsulating material, the encapsulating material also covers the front side of the fingerprint bare chip, thereby forming a protective layer of encapsulating material on the front side of the fingerprint bare chip.
  • the second aspect of the present application provides a package structure of a fingerprint package chip, including:
  • a fingerprint bare chip wherein the fingerprint bare chip is etched with a through hole penetrating the front side of the fingerprint bare chip, the through hole communicating with a pad on the front surface of the fingerprint bare chip, along the surface of the through hole and the fingerprint a metal wiring layer is formed on the back surface of the bare chip, the metal wiring layer is in communication with the pad, the through hole is filled with a solder resist layer, and a solder resist layer is formed on the back surface of the fingerprint bare chip.
  • the solder resist layer on the back surface of the fingerprint bare chip does not cover the metal wiring layer formed on the back surface of the fingerprint bare chip;
  • solder ball formed on a back surface of the fingerprint bare chip, the solder ball being in communication with the metal wiring layer;
  • the package structure further includes:
  • a protective layer formed on the front side of the fingerprint bare chip.
  • the protective layer is formed by a printing or spin coating process.
  • the protective layer and the package are integrally formed.
  • the third aspect of the present application provides a fingerprint module, comprising: the fingerprint encapsulating chip of any of the possible implementations of the second aspect or the second aspect of the present application.
  • the fingerprint module further includes:
  • a connecting board under the fingerprint encapsulating chip the connecting board and the fingerprint encapsulating chip being soldered together by solder balls on the fingerprint encapsulating chip, and electrically connecting.
  • the fingerprint module further includes: a reinforcing plate located below the connecting board.
  • the size of the connecting board is smaller than the size of the fingerprint encapsulating chip, and The connection board is located near the central area of the fingerprint package chip.
  • the fingerprint module further includes a solder ball wrapped around the fingerprint package chip. Filling glue.
  • the fingerprint module further includes: a chip located above the front surface of the fingerprint package chip Package structure cover.
  • a fourth aspect of the present disclosure provides a mobile terminal, including: a display screen and a cover area located at a periphery of the display screen, wherein the cover area is provided with any possible implementation manner of the third aspect or the third aspect of the present application.
  • the fingerprint module is located between the cover plates.
  • the cover area further includes a decorative ring around the fingerprint module, and the decorative ring is fixedly connected to the cover.
  • the decoration The ring extends along a lower edge of the thickness direction of the mobile terminal toward the middle of the fingerprint module.
  • a display connection line is further disposed in the cover area, and the display is The screen connection line is located below the fingerprint module along the thickness direction of the mobile terminal.
  • the fingerprint encapsulating sheet obtained by the encapsulation method provided by the embodiment of the present application does not include a substrate, and the fingerprint encapsulating chip in the prior art generally has a substrate. Therefore, compared with the prior art, the embodiment of the present application provides The thickness of the fingerprint package chip is thin, and the thickness of the fingerprint module made of the fingerprint package chip is also thin. In this manner, in the mobile terminal adopting the pre-fingerprint scheme, the fingerprint module formed by the fingerprint encapsulating chip provided by the embodiment of the present application is idle along the lower space of the thickness direction of the mobile terminal in the case that the thickness of the mobile terminal is constant. Therefore, the display connection line for connecting the display screen and the main board can be disposed in the free area without increasing the thickness of the mobile terminal.
  • the position of the display connection line and the fingerprint module can overlap or overlap in the thickness direction of the mobile terminal, thus reducing the space occupied by the display connection line occupying the plane of the mobile terminal, thereby saving the display connection line.
  • the flat space can be used to make a display screen. Therefore, with the fingerprint module made by the fingerprint package chip provided by the embodiment of the present application, the display screen of the mobile terminal can be relatively increased, thus improving the screen ratio of the mobile terminal.
  • Figure 1 is a front view of a conventional mobile phone
  • Figure 2 is a cross-sectional structural view of the cover region 3 taken along the direction B-B' shown in Figure 1;
  • FIG. 3 is a schematic view showing a laminated structure of a conventional fingerprint module in the field
  • FIG. 4 is a schematic cross-sectional structural view of a fingerprint encapsulating chip in the prior art
  • FIG. 5 is a cross-sectional structural view of another fingerprint encapsulating chip existing in the art.
  • FIG. 6 is a schematic flowchart diagram of a specific implementation manner of a fingerprint chip packaging method according to an embodiment of the present disclosure
  • FIGS. 7A to 7E are schematic cross-sectional structural views of a series of processes in a specific embodiment of a fingerprint chip packaging method according to an embodiment of the present application.
  • FIG. 8 is a schematic flowchart diagram of another specific implementation manner of a fingerprint chip encapsulation method according to an embodiment of the present disclosure.
  • FIG. 9A to FIG. 9E are schematic cross-sectional structural diagrams of a series of processes in another specific implementation manner of a fingerprint chip packaging method according to an embodiment of the present disclosure.
  • FIG. 10 is a schematic flowchart diagram of still another specific implementation manner of a fingerprint chip packaging method according to an embodiment of the present disclosure.
  • FIG. 12 is a schematic cross-sectional view of a fingerprint module according to an embodiment of the present application.
  • Figure 14 is a cross-sectional structural view of the cover region 132 taken along the line B-B' in Figure 13 .
  • a packaged chip refers to a bare chip having a package structure, that is, a structure formed after the bare chip package is a packaged chip.
  • the inventors of the present invention analyzed the cross-sectional structure of the cover region 3 in the B-B' direction shown in Fig. 1, and the cross-sectional view in the B-B' direction is as shown in Fig. 2.
  • the internal structure of the cover area 3 includes:
  • the fingerprint module 31 is sandwiched between the cover plates 33, and the display screen connection line 32 and the fingerprint module 31 are arranged in parallel on the plane of the mobile phone display screen. This is designed to control the overall thickness of the mobile terminal.
  • the fingerprint module 31 is used to implement the fingerprint recognition function of the mobile phone, and the display connection line 32 is used to connect the display screen (not shown) with the main board (not shown in the figure, the main board may also be referred to as a hardware core processing module) ), there is no direct connection relationship with the fingerprint module 31.
  • the display cable 32 can display the touch control signal and the display control signal sent by the motherboard The number is transmitted to the display and the return signal sent from the display to the main board can be transmitted to the main board. Therefore, the display connection line 32 can also be referred to as a signal transmission line. It should be noted that since there are many kinds of signals between the main board and the display screen of the mobile terminal, the display connection line 32 has many strips, and therefore, the distribution in the cover area 3 is very dense. For the sake of brevity, Figure 2 shows only one display connection line. In fact, a plurality of densely distributed display screen connections are arranged in the cover area 3.
  • the stacking structure of the fingerprint module 31 is as shown in FIG. 3 , and includes a fingerprint package chip 311 , which is a core component of the fingerprint module 31 , and a solder ball 313 is disposed on the back surface of the fingerprint package chip 311 .
  • the fingerprint package chip 311 is soldered to the connection board 312 by the solder ball 313, and an electrical connection between the two is achieved.
  • a filling adhesive 314 is further filled between the fingerprint encapsulating chip 311 and the connecting plate 312, and the filling adhesive 314 is wrapped around the solder ball 313.
  • the connecting board 312 is usually a soft board. Therefore, in order to improve the mechanical strength, the fingerprint module 31 further includes a reinforcing board 315 disposed under the connecting board 312.
  • the front side of the fingerprint encapsulating chip 311 is further A chip cover 316 is disposed, and the fingerprint package chip 311 and the chip cover 316 are bonded together by an adhesive 317.
  • a fingerprint package 311 is disposed around the fingerprint package chip 311.
  • the decorative ring 318 is fixedly bonded to the connecting plate 312 by an adhesive 319.
  • the inventors of the present application analyzed the thickness of each component that affects the thickness of the fingerprint module.
  • the components that affect the thickness of the fingerprint module include, in order from top to bottom, a chip cover 316, a fingerprint package chip 311, a connection plate 312, and a reinforcing plate 315.
  • the thickness of the chip cover 316, the connecting plate 312, and the reinforcing plate 315 is generally between 0.1 mm and 0.2 mm. To ensure reliability, the thickness of the compression of these components is small, and the thickness of the fingerprint package chip 311 is generally 0.6.
  • the ultra-thin fingerprint encapsulation chip is realized by compressing the thickness of the fingerprint encapsulation chip 311, thereby realizing an ultra-thin fingerprint module, thereby realizing a high screen ratio of the mobile phone.
  • FIG. 4 the structure of a conventional fingerprint package chip is shown in FIG.
  • the fingerprint bare chip 41 is bonded and fixed to the lower substrate 43 by the adhesive 42, and the pad 44 on the front surface of the fingerprint bare chip 41 passes through the lead 45 and the front surface of the substrate 43.
  • the upper pads 46 are electrically connected, and the pads 47 on the back side of the substrate are electrically connected to the pads 46 on the front side of the substrate through internal traces of the substrate 43.
  • the fingerprint bare chip 41, the leads 45, and the pads 46 are all wrapped by the package 48 encapsulated by the package material.
  • the components that affect the thickness of the package structure include a package body 48, a fingerprint bare chip 41, an adhesive 42 and a substrate 43.
  • the thickness of the package 48, the fingerprint bare chip 41, the adhesive 42 and the substrate 43 may be 0.08 mm, 0.36 mm, 0.03 mm, and 0.21 mm, respectively, and the total thickness is 0.6. Between mm and 0.7 mm.
  • the fingerprint bare chip 51 In order to compress the total thickness of the fingerprint package chip, the structure of the fingerprint package chip shown in FIG. 5 appeared later.
  • the fingerprint bare chip 51 etches the fingerprint bare chip 51 from the back side of the fingerprint bare chip 51 through a through-silicon via (English full name: Through Silicon Via, TSV for short) process.
  • a deep via hole 53 is formed on the pad 52 on the front side of the fingerprint bare chip, and a metal wiring layer 54 is formed on the surface of the deep via hole 53 and the back surface of the fingerprint bare chip, and the metal wiring layer 54 pads the front surface of the fingerprint bare chip 51. 52 is taken to the back of the fingerprint bare chip 51.
  • the metal wiring layer 54 formed on the back surface of the fingerprint bare chip 51 is used for the pads on the back surface of the fingerprint bare chip 51.
  • the back surface of the fingerprint bare chip 51 is covered with a solder resist layer 55.
  • the solder resist layer 55 does not cover the metal wiring layer 54 on the back surface.
  • the solder resist layer 55 is filled deep. Through hole 53.
  • the fingerprint bare chip 51 is soldered to the substrate 56 through the back surface pad 55. When soldering, a solder ball 57 is formed therebetween, and the solder ball 57 is electrically connected to the back metal wiring layer 54.
  • the pads 58 on the back side of the substrate 56 are electrically connected to the solder balls 57 through the internal traces of the substrate 56.
  • both the fingerprint bare chip 51 and the solder ball 57 are wrapped by the package 59 encapsulated by the packaging material.
  • the components that affect the thickness of the package structure include a fingerprint bare chip 51, a solder ball 57, and a substrate 56.
  • the thickness of the fingerprint bare chip 51, the solder balls 57, and the substrate 56 may be 0.18 mm, 0.03 mm, and 0.21 mm, respectively, and the total thickness is between 0.4 mm and 0.5 mm.
  • the total thickness of the fingerprint package chip is at least 0.4 mm or more, and the package structure cannot be packaged under the premise of ensuring reliability.
  • the total thickness of the structure is compressed to less than 0.3 mm. Therefore, the demand for ultra-thin fingerprint modules cannot be met.
  • the thickness of the substrate is about 0.2 mm, so the thickness of the substrate contributes a lot to the total thickness of the fingerprint package chip. Therefore, if the substrate is removed from the fingerprint packaged chip, the thickness of the compressed fingerprint package chip will be greatly reduced.
  • the substrate plays two main roles in the fingerprint package chip: one is to improve the mechanical strength of the fingerprint package chip, and the other is to realize the electrical connection between the fingerprint bare chip and the printed circuit board.
  • a structure of a fingerprint package chip capable of not using a substrate is designed, the mechanical strength thereof satisfies the requirement, and the electrical connection between the fingerprint bare chip and the printed circuit board can be realized, the same as the fingerprint package chip using the substrate can be achieved.
  • the effect can greatly reduce the thickness of the fingerprint package chip.
  • the embodiment of the present application provides a method for packaging a fingerprint chip.
  • the metal wiring layer is formed along the surface of the TSV through hole and the back surface of the fingerprint bare chip.
  • the metal wiring layer can lead the pad on the front side of the fingerprint bare chip to the back of the fingerprint bare chip, and on the back of the fingerprint bare chip.
  • the surface forms a solder ball that communicates with the metal wiring layer.
  • the bottom of the solder ball is not wrapped by the package material, and thus the fingerprint package chip can be electrically connected to other components through the solder ball.
  • the package encapsulating the fingerprint bare chip can enhance the mechanical strength of the fingerprint bare chip.
  • the bare chip of the fingerprint does not need to be soldered to the substrate, so that the mechanical strength can meet the demand. And electrical connection to the printed circuit board can be achieved. Therefore, compared with the package structure in which the fingerprint bare chip and the substrate are soldered together in the prior art, the influence of the substrate on the total thickness of the package structure is reduced, and the thickness of the fingerprint package chip can be less than 0.3 mm.
  • an ultra-thin fingerprint encapsulating chip is obtained, thereby realizing an ultra-thin fingerprint module, thereby realizing a high-screen ratio of the mobile terminal of the pre-fingerprint scheme.
  • FIG. 6 is a schematic flowchart diagram of a specific implementation manner of a fingerprint chip packaging method according to an embodiment of the present application.
  • 7A to 7E are schematic cross-sectional structural views of a series of processes in a specific embodiment of a fingerprint chip packaging method according to an embodiment of the present application.
  • the packaging method includes the following steps:
  • S601 providing a wafer 70 processed by the TSV process, the wafer 70 is formed with a plurality of fingerprint bare chips 71, each of the fingerprint bare chips 71 includes a through hole 72 etched through the front and back sides of the wafer 70, the through hole 72 is in communication with the pad 73 on the front surface of the fingerprint bare chip 71.
  • a metal wiring layer 74 is formed along the surface of the via hole 72 and the back surface of the wafer 70. The metal wiring layer 74 communicates with the pad 74, thereby leading the pad 74.
  • a solder resist layer 75 is formed on the back surface of the wafer 70. The solder resist layer 75 does not cover the metal wiring layer 74 on the back surface of the wafer 70, and the via hole 72 is filled with the solder resist layer 75.
  • the wafer 70 may be a silicon wafer.
  • wafer 70 can be etched from the backside of the wafer by TSV process etching until etched onto pad 73 on the front side of the wafer.
  • a metal wiring layer 74 is formed along the surface of the via hole 72 and the back surface of the wafer 70, and the metal wiring layer 74 is connected to the pad 73, thereby passing the pad 75 through.
  • the hole 72 is led out to the back of the fingerprint bare chip 71.
  • the through hole 72 is filled with the solder resist layer 75, and a solder resist layer 75 is also formed on the back surface of the fingerprint bare chip 71.
  • the solder resist is soldered.
  • Layer 75 does not cover second pad 74.
  • S602 Cutting the wafer processed by the TSV process into a plurality of single fingerprint chips 71 by mechanical or laser processing techniques.
  • the cross-sectional structure of the single fingerprint chip 71 formed by cutting is as shown in Fig. 7B.
  • a solder ball 76 is formed on the back surface of the fingerprint bare chip, wherein the solder ball 76 is in communication with the metal wiring layer 74 disposed on the back surface of the fingerprint bare chip 71.
  • FIG. 7C A schematic diagram of the corresponding cross-sectional structure performed in this step is shown in FIG. 7C.
  • the fingerprint encapsulation chip formed by the package is used for manufacturing a fingerprint module.
  • the fingerprint encapsulation chip needs to be connected with a connection board such as an FPC board, and electrical connection is realized.
  • the formed solder balls 76 function to achieve this physical connection as well as electrical connections.
  • the fingerprint package chip can be conveniently realized by the formed solder ball 76 Physical connection and electrical connection to the connection board.
  • FIG. 7D A schematic diagram of the corresponding cross-sectional structure performed in this step is shown in FIG. 7D.
  • the encapsulating material used is generally a molding compound.
  • the embodiment of the present application further provides a specific implementation manner of a fingerprint package chip.
  • a schematic cross-sectional view of the fingerprint package chip is shown in FIG. 7E above.
  • the fingerprint package chip includes:
  • the fingerprint bare chip 71 is etched with a through hole 72 penetrating the front and back sides of the fingerprint bare chip 71.
  • the through hole 72 communicates with the pad 73 on the front surface of the fingerprint bare chip 71, along the surface of the through hole 72 and the crystal.
  • a metal wiring layer 74 is formed on the back surface of the circle 70.
  • the metal wiring layer 74 communicates with the pad 74 to lead the pad 74 to the back surface of the wafer 70.
  • the back surface of the wafer 70 is formed with a solder resist layer 75.
  • the layer 75 does not cover the metal wiring layer 74 on the back surface of the wafer 70, and the via hole 72 is filled with the solder resist layer 75;
  • solder ball 76 formed on the back surface of the fingerprint bare chip 71, the solder ball 76 is in communication with the metal wiring layer 74 on the back side of the fingerprint bare chip 71;
  • the fingerprint bare chip 71 can be directly soldered to the connection plate in the fingerprint module through the solder ball 76 formed under the specific embodiment, and the electrical connection can be realized.
  • the pad on the front side of the fingerprint bare chip 71 is electrically connected to the connection board. Therefore, in the fingerprint package chip formed by the embodiment of the present application, the fingerprint bare chip 71 is not required to be soldered together with the connection board through the substrate, and is additionally wrapped in the fingerprint bare chip.
  • the package on the side of the 71 and the solder balls 76 can function to enhance the mechanical strength of the fingerprint packaged chip. Therefore, the fingerprint package chip formed by the embodiment of the present application does not need to adopt a substrate at all.
  • the fingerprint encapsulation chip eliminates the substrate, thereby greatly reducing the thickness of the fingerprint package chip.
  • the fingerprint encapsulating chip formed by the specific embodiment of the present application the component contributing to the total thickness of the fingerprint encapsulating chip is the bottom of the fingerprint bare chip 71 and the package 77.
  • the fingerprint The thickness of the bottom of the bare chip 71 and the package 77 may be 0.25 mm and 0.04 mm, respectively.
  • the total thickness is 0.29 mm.
  • the total thickness is much smaller than the total thickness (0.4-0.5 mm and 0.6-0.7 mm) of the fingerprint package chip shown in FIG. 4 or FIG.
  • the fingerprint package chip a plurality of chip structures are formed on the front surface of the fingerprint bare chip. These chip structures are easily scratched or damaged during the process in the packaging process or are corroded during use, in order to protect the fingerprint from being formed.
  • the chip structure on the front side of the chip can also form a protective layer on the front side of the fingerprint bare chip.
  • the protective layer please refer to the following embodiments.
  • the encapsulation method includes the following steps:
  • a protective layer 90 is formed on the front surface of the wafer processed by the TSV process.
  • the protective layer 90 is used to protect the front structure of the wafer.
  • the protective layer 90 may form a protective layer 90 on the front side of the wafer 70 processed by the TSV process by a printing or spin coating process.
  • the material of the protective layer 90 may be polyimide.
  • the protective layer 90 formed on the front surface of the wafer may affect the sensitivity during the fingerprint signal acquisition process. Therefore, the thickness of the protective layer 90 should be as small as possible while the process conditions permit and protect the chip structure. As an example, the protective layer 90 may have a thickness of 0.01 mm.
  • S803 The TSV-processed wafer formed with the protective layer 90 is cut into a plurality of single fingerprint chips 71 by mechanical or laser processing techniques.
  • the cross-sectional structure of the single fingerprint chip 71 formed by cutting is as shown in Fig. 9B.
  • a solder ball 76 is formed on the back surface of the fingerprint bare chip, wherein the solder ball 76 is in communication with the metal wiring layer 74 disposed on the back surface of the fingerprint bare chip.
  • FIG. 9C A schematic diagram of the corresponding cross-sectional structure performed in this step is shown in FIG. 9C.
  • the solder ball 76 is used to solder the fingerprint package chip to the connection board when the fingerprint package chip is used as a fingerprint module.
  • S805 encapsulating the fingerprint bare chip 71 and the solder ball 76 with a packaging material to form a package 77 surrounding the solder ball 76 and the fingerprint bare chip 71.
  • FIG. 9D A schematic diagram of the corresponding cross-sectional structure performed in this step is shown in FIG. 9D.
  • the encapsulating material used is generally a molding compound.
  • FIG. 9E A schematic diagram of the corresponding cross-sectional structure performed in this step is shown in FIG. 9E.
  • the embodiment of the present application further provides another specific implementation manner of a fingerprint package chip.
  • the fingerprint package A schematic cross-sectional view of the chip is shown in Figure 9E above. As shown in FIG. 9E, the fingerprint package chip includes:
  • the fingerprint bare chip 71 is etched with a through hole 72 penetrating the front and back sides of the fingerprint bare chip 71.
  • the through hole 72 communicates with the pad 73 on the front surface of the fingerprint bare chip 71, along the surface of the through hole 72 and the crystal.
  • a metal wiring layer 74 is formed on the back surface of the circle 70.
  • the metal wiring layer 74 communicates with the pad 74 to lead the pad 74 to the back surface of the wafer 70.
  • the back surface of the wafer 70 is formed with a solder resist layer 75.
  • the layer 75 does not cover the metal wiring layer 74 on the back surface of the wafer 70, and the via hole 72 is filled with the solder resist layer 75;
  • solder ball 76 formed on the back surface of the fingerprint bare chip 71, the solder ball 76 is in communication with the metal wiring layer 74;
  • a package 77 encasing the solder ball 76 and the side of the fingerprint bare chip 71, wherein the bottom of the solder ball 76 is not wrapped by the package 77.
  • the substrate is also omitted, and therefore, the thickness of the fingerprint package chip can be greatly reduced.
  • the fingerprint encapsulating chip formed by the specific embodiment of the present application the component contributing to the total thickness of the fingerprint encapsulating chip is the protective layer 90, the fingerprint bare chip 71, the bottom of the package 77, and a typical lamination of the fingerprint encapsulating chip.
  • the thickness of the protective layer 90, the fingerprint bare chip 71, and the bottom of the package 77 may be 0.01 mm, 0.25 mm, and 0.04 mm, respectively.
  • the total thickness is 0.3 mm.
  • the total thickness is much smaller than the total thickness (0.4-0.5 mm and 0.6-0.7 mm) of the fingerprint package chip shown in FIG. 4 or FIG. 5, and therefore, the total thickness of the fingerprint package chip can be 0.3 by this specific embodiment.
  • an ultra-thin fingerprint package chip can be obtained, and an ultra-thin fingerprint module can be realized by using the ultra-thin fingerprint package chip.
  • the front surface of the fingerprint bare chip 71 is formed with a protective layer 90 for protecting the chip structure on the front surface of the fingerprint bare chip 71, and the protective layer 90 can prevent the front chip structure of the fingerprint bare chip 71 from being in the packaging process. It is scratched or corroded during use. Therefore, the fingerprint packaged chip made by the specific embodiment has the characteristics of more stable performance and longer service life.
  • the encapsulating material is an insulating material, and its performance is also relatively stable. Therefore, the layer structure formed by the encapsulating material can also protect the chip structure on the front side of the fingerprint bare chip 71. Therefore, in order to simplify the packaging process, another specific implementation of the present application is provided.
  • the protective layer for protecting the chip structure on the front side of the fingerprint bare chip 71 can be simultaneously formed in the packaging process, that is, the protective layer formed on the front surface of the fingerprint bare chip 71 can be a part of the package and integrated with the package body. Molded structure. For specific implementation of this embodiment, please refer to FIG. 10 to FIG. 11B.
  • FIG. 10 is a schematic flowchart diagram of still another specific implementation manner of a fingerprint chip packaging method according to an embodiment of the present application.
  • 11A to FIG. 11B are schematic cross-sectional structural views of a series of processes in another embodiment of the fingerprint chip packaging method according to the embodiment of the present application.
  • the fingerprint chip packaging method includes the following steps:
  • Steps S1001 to S1003 are the same as steps S601 to S03 described above, and are not described herein again for the sake of brevity.
  • S1004 encapsulating the fingerprint bare chip 71 and the solder ball 76 with a packaging material to form a package solder ball 76 and a bare fingerprint The package 77' of the chip 71.
  • FIG. 11A A schematic diagram of the corresponding cross-sectional structure performed in this step is shown in FIG. 11A.
  • the fingerprint bare chip 71 and the solder ball 76 are integrally packaged by using a packaging material, and the formed package 77' includes not only the side surface of the fingerprint bare chip 71 but also the front surface of the fingerprint bare chip.
  • a protective layer composed of an encapsulating material is formed on the front surface of the fingerprint bare chip.
  • the protective layer is part of the package.
  • the thickness of the encapsulating material layer formed on the front surface of the fingerprint bare chip 71 is at least 0.05 mm, limited by the existing packaging process and the packaging material. The thickness is greater than the thickness of the protective layer 90. Therefore, the specific embodiment of forming the protective layer 90 is more advantageous for the collection of fingerprint signals, and the touch sensitivity during the fingerprint signal acquisition process is higher.
  • the encapsulating material used is generally a molding compound.
  • FIG. 11B A schematic diagram of the corresponding cross-sectional structure performed in this step is shown in FIG. 11B.
  • the above is another embodiment of the fingerprint chip packaging method provided by the embodiment of the present application.
  • the fingerprint chip package structure obtained by the specific embodiment is as shown in FIG. 11B, and includes:
  • the fingerprint bare chip 71 is etched with a through hole 72 penetrating the front and back sides of the fingerprint bare chip 71.
  • the through hole 72 communicates with the pad 73 on the front surface of the fingerprint bare chip 71, along the surface of the through hole 72 and the crystal.
  • a metal wiring layer 74 is formed on the back surface of the circle 70.
  • the metal wiring layer 74 communicates with the pad 74 to lead the pad 74 to the back surface of the wafer 70.
  • the back surface of the wafer 70 is formed with a solder resist layer 75.
  • the layer 75 does not cover the metal wiring layer 74 on the back surface of the wafer 70, and the via hole 72 is filled with the solder resist layer 75;
  • solder ball 76 formed on the back surface of the fingerprint bare chip 71, the solder ball 76 is in communication with the metal wiring layer 74;
  • a package 77 encasing the solder ball 76 and the front side and the side of the fingerprint bare chip 71, wherein the bottom of the solder ball 76 is not wrapped by the package 77.
  • the fingerprint encapsulation chip obtained by the further embodiment of the fingerprint chip encapsulation method provided by the embodiment of the present application is similar to the above two embodiments, and the fingerprint encapsulation chip obtained in the specific embodiment is also omitted.
  • the substrate is used to greatly reduce the thickness of the fingerprint package chip.
  • the fingerprint encapsulating chip formed by the specific embodiment of the present application, the component contributing to the total thickness of the fingerprint encapsulating chip is a front encapsulating material layer, a fingerprint bare chip 71, a back encapsulating material layer, and a typical lamination of the fingerprint encapsulating chip.
  • the thickness of the front encapsulating material layer, the fingerprint bare chip 71, and the back encapsulating material layer may be 0.05 mm, 0.23 mm, and 0.02 mm, respectively.
  • the total thickness is 0.3 mm.
  • the total thickness is much smaller than the total thickness (0.4-0.5 mm and 0.6-0.7 mm) of the fingerprint package chip shown in FIG. 4 or FIG. 5, and therefore, the total thickness of the fingerprint package chip can be 0.3 by this specific embodiment.
  • an ultra-thin fingerprint package chip can be obtained, and an ultra-thin fingerprint module can be realized by using the ultra-thin fingerprint package chip.
  • the package material is integrally packaged with the fingerprint bare chip 71.
  • the formed package encloses the fingerprint bare chip 71.
  • the front side of the fingerprint bare chip 71 is formed with a protective bare chip 71.
  • a package material of a chip structure on the front side which can prevent the front chip structure of the fingerprint bare chip 71 from being scratched during the packaging process or being corroded during use.
  • the specific implementation manner of integrally packaging the fingerprint bare chip provided by the present application is simpler and more advantageous. Reduce process costs and increase production efficiency.
  • the fingerprint package chip provided by the embodiment of the present application, compared with the structure of the existing fingerprint package chip, the biggest difference is that the substrate is removed, the thickness of the fingerprint package chip is reduced, and the thickness can be less than 0.3 mm.
  • the ultra-thin fingerprint package chip can meet the needs of ultra-thin fingerprint modules.
  • the embodiment of the present application further provides a fingerprint module made of the fingerprint encapsulating chip. See the following examples for details.
  • FIG. 12 is a schematic cross-sectional view of a fingerprint module according to an embodiment of the present application. As shown in FIG. 12, the fingerprint module 120 includes:
  • the fingerprint package chip 121 is a fingerprint package chip packaged by any of the above embodiments. As shown in any of the above embodiments, the fingerprint package chip 121 includes a solder ball 76 at the bottom thereof, and the bottom of the solder ball 76 is not covered by the package material, so that the fingerprint package chip 121 can be easily passed through the solder ball 76 and the connection plate 122. Welding is performed.
  • a connecting board 122 is disposed under the fingerprint encapsulating chip 121.
  • the connecting board 122 and the fingerprint encapsulating chip 121 are soldered together by solder balls 76 on the fingerprint encapsulating chip 121 to achieve a fixed connection and electrical connection.
  • the connecting board 122 may be a hard printed circuit board, that is, a PCB board, or a soft connecting board FPC.
  • the connecting board 122 is an FPC board, in order to enhance the mechanical strength of the connecting board 122, the fingerprint module is further A reinforcing plate 123 located below the connecting plate 122 may be included.
  • the fingerprint module may further include a filling glue 124 wrapped around the solder balls 76 in the fingerprint package chip 121.
  • the fingerprint module may further include: a chip package structure cover plate 125 located above the front surface of the fingerprint package chip 121, between the chip package structure cover plate 125 and the fingerprint package chip 121 They are joined together by an adhesive 126.
  • the size of the connection board 122 is smaller than the size of the fingerprint package chip 121, and the connection board 122 is located near the central area of the fingerprint package chip 121.
  • the size of the reinforcing plate 123 located below the connecting plate 122 is also smaller than the size of the fingerprint package chip 121, and the size and shape of the reinforcing plate 123 are exactly the same as the size and shape of the connecting plate 122.
  • the connecting plate 122 and the reinforcing plate 123 are both retracted relative to the fingerprint package chip, so that the thickness of the subsequent fingerprint module is reduced.
  • the thickness of the fingerprint package chip 121 can be less than 0.3 mm, so that the fingerprint package chip is made by the fingerprint package chip.
  • the thickness of the formed fingerprint module is also reduced accordingly, thereby achieving the purpose of the ultra-thin fingerprint module.
  • the embodiment of the present application further provides a mobile terminal.
  • a mobile terminal For details, refer to the following embodiments.
  • FIG. 13 is a front elevational view of a mobile terminal according to an embodiment of the present application. As shown in FIG. 13, the mobile terminal includes:
  • a fingerprint module 120 is disposed in the cover region 132.
  • the cover area 132 may be located in a side area of any direction of the display screen 131 for the convenience of the user.
  • the cover area 132 in which the fingerprint module is disposed is generally located in a lower area of the display screen 131.
  • Figure 14 is a cross-sectional structural view of the cover region 132 taken along the line B-B' in Figure 13 . As shown in FIG. 14 , a fingerprint module 120 and a cover 141 are disposed in the cover area 132 , and the fingerprint module 120 is sandwiched between the cover plates 141 .
  • a decorative ring 142 may be disposed in the cover area 132 around the fingerprint module 120, and the decorative ring 142 and the cover 141 The rooms can be joined together by adhesive 143.
  • the decorative ring 142 is along the lower edge (lower skirt) of the thickness direction of the mobile terminal.
  • the lower edge of the decorative ring 142 does not occupy the z-direction space of the fingerprint module, that is, the space in the thickness direction of the mobile terminal, which is beneficial to reducing the total area of the cover area and the mobile terminal. thickness.
  • the fingerprint package chip of the fingerprint module 120 can be bonded to the decoration by the adhesive 144.
  • a fixed connection of the fingerprint module 120 to the decorative ring 142 is achieved.
  • a display screen connection line 145 is also disposed in the cover area 132.
  • the display screen connection line 145 is used to connect the display screen and the main board, and has no direct connection relationship with the fingerprint module 120. Since the total thickness of the fingerprint module 120 is reduced, the display module connection line 144 can be used along the space below the thickness direction of the mobile terminal by using the fingerprint module 120 without increasing the total thickness of the cover area and the mobile terminal.
  • the fingerprint module 120 is disposed below the thickness direction of the mobile terminal, so that the display screen connection line 144 and the fingerprint module 120 form a laminated structure along the thickness direction of the mobile terminal, so that the display screen connection line 144 is no longer
  • the space on the plane of the cover plate area is occupied separately, and thus the width of the cover plate region 132 can be reduced.
  • the embodiment of the present application can shorten the length B of the cover plate region 132 to within 7 mm.
  • the saved planar space can be used to make a display screen, thereby achieving the effect of increasing the proportion of the screen of the mobile terminal, thereby realizing the design of the high screen ratio of the mobile terminal.

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Abstract

一种指纹封装芯片及其封装方法、指纹模组以及移动终端。该指纹封装芯片不包括基板，因此，相较于现有技术，该指纹封装芯片的厚度较薄，进而由该指纹封装芯片制成的指纹模组的厚度也较薄。如此，在采用前置指纹方案的移动终端中，在移动终端厚度不变的情形下，采用该指纹封装芯片制成的指纹模组沿移动终端厚度方向的下方空间就被空闲出，因而，能够将用于连接显示屏与主板的显示屏连接线设置在该空闲区域内。如此，减少了显示屏连接线占用移动终端所在平面上的空间，因此，采用该指纹封装芯片制成的指纹模组，移动终端的显示屏可以相对增大，提高了移动终端的屏占比。

Description

指纹封装芯片及封装方法、指纹模组及移动终端 技术领域
本申请实施例涉及移动终端技术领域，尤其涉及一种指纹封装芯片及封装方法，以及包括该指纹封装芯片的指纹模组以及移动终端。
背景技术
随着科技的不断发展，智能手机、平板电脑等各种类型的移动设备已经日益融入了人们的日常生活和工作中，给人们的生活和工作带来极大便利。而且，随着移动终端的发展，用户对移动终端的外观要求越来越高，高屏占比的移动终端越来越得到用户的青睐。
另外，因指纹识别给用户提供了极大的便利，用户手指轻轻一触碰即可唤醒移动终端，完全省去了输入密码的繁琐步骤。因此，指纹识别功能已经成为移动设备的标配功能。如此，现有的移动设备中一般均设置有指纹模组。
当前流行的前置指纹方案将指纹模组设置在移动终端正面，如此移动终端的显示屏的周边区域需要留出一定空间来制作指纹模组，因而，该前置的指纹模组不利于提高移动终端的屏占比。因此，采用前置指纹方案的移动终端的高屏占比的设计是一个很大的挑战。
发明内容
有鉴于此，为了提高采用前置指纹方案的移动终端的屏占比，本申请实施例提供了一种指纹封装芯片及封装方法、指纹模组以及移动终端。
本申请第一方面提供一种指纹封装芯片的封装方法，包括：
提供指纹裸芯片，所述指纹裸芯片上刻蚀有贯穿指纹裸芯片正背面的通孔，所述通孔与所述指纹裸芯片正面上的焊盘连通，沿所述通孔表面以及所述指纹裸芯片背面上形成有金属布线层，所述金属布线层与所述焊盘连通，所述通孔内填充有阻焊层，且所述指纹裸芯片的背面形成有阻焊层，形成于所述指纹裸芯片背面上的阻焊层未覆盖形成于所述指纹裸芯片背面上的金属布线层；
在所述指纹裸芯片的背面制作焊球，所述焊球与所述金属布线层连通；
采用封装材料封装所述指纹裸芯片，形成至少包裹所述焊球以及所述指纹裸芯片的侧面的封装体；
去除包裹所述焊球底部的封装材料层，直至露出所述焊球。
结合第一方面，在第一种可能的实现方式中，所述封装方法还包括：
在所述指纹裸芯片的正面形成保护层。
结合第一方面第一种可能的实现方式，在第二种可能的实现方式中，所述在所述指纹裸芯片的正面形成保护层，具体包括：
采用印刷或旋涂工艺在所述指纹裸芯片的正面涂覆保护层。
结合第一方面第一种可能的实现方式，在第三种可能的实现方式中，所述在指纹裸芯片的正面形成保护层，具体包括：
在采用封装材料封装所述指纹裸芯片的同时，封装材料还覆盖指纹裸芯片的正面，从而在指纹裸芯片的正面形成封装材料保护层。
本申请第二方面提供一种指纹封装芯片的封装结构，包括：
指纹裸芯片，所述指纹裸芯片上刻蚀有贯穿指纹裸芯片正背面的通孔，所述通孔与所述指纹裸芯片正面上的焊盘连通，沿所述通孔表面以及所述指纹裸芯片背面上形成有金属布线层，所述金属布线层与所述焊盘连通，所述通孔内填充有阻焊层，且所述指纹裸芯片的背面形成有阻焊层，形成于所述指纹裸芯片背面上的阻焊层未覆盖形成于所述指纹裸芯片背面上的金属布线层；
形成于所述指纹裸芯片背面的焊球，所述焊球与所述金属布线层连通；
包裹在所述焊球以及所述指纹裸芯片侧面的封装体，其中，所述焊球的底部未被所述封装体包裹。
结合本申请第二方面，在第一种可能的实现方式中，所述封装结构还包括：
形成于所述指纹裸芯片正面的保护层。
结合本申请第二方面第一种可能的实现方式，在第二种可能的实现方式中，所述保护层采用印刷或旋涂工艺形成。
结合本申请第二方面第一种可能的实现方式，在第三种可能的实现方式中，所述保护层与所述封装体为一体成型结构。
本申请第三方面提供一种指纹模组，包括：本申请第二方面或第二方面任一可能的实现方式的指纹封装芯片。
结合本申请第三方面，在第一种可能的实现方式中，所述指纹模组还包括：
位于所述指纹封装芯片下方的连接板，所述连接板与所述指纹封装芯片通过所述指纹封装芯片上的焊球焊接在一起，并且实现电气连接。
结合本申请第三方面第一种可能的实现方式，在第二种可能的实现方式中，所述指纹模组还包括：位于所述连接板下方的补强板。
结合本申请第三方面第一种可能的实现方式或第二种可能的实现方式，在第三种可能的实现方式中，所述连接板的尺寸小于所述指纹封装芯片的尺寸，且所述连接板位于所述指纹封装芯片的靠近中心区域。
结合本申请第三方面第一种至第三种任一种可能的实现方式，在第四种可能的实现方式中，所述指纹模组还包括包裹在所述指纹封装芯片中的焊球周围的填充胶。
结合本申请第三方面或者第一种至第四种任一种可能的实现方式，在第五种可能的实现方式中，所述指纹模组还包括：位于所述指纹封装芯片正面上方的芯片封装结构盖板。
本申请第四方面提供一种移动终端，包括：显示屏以及位于所述显示屏外围的盖板区域，所述盖板区域内设置有本申请第三方面或者第三方面任一种可能实现方式中的指纹模组，所述指纹模组位于盖板之间。
结合本申请第四方面，在第一种可能的实现方式中，所述盖板区域内还包括位于所述指纹模组周围的装饰环，所述装饰环与所述盖板固定连接。
结合本申请第四方面第一种可能的实现方式，在第二种可能的实现方式中，所述装饰 环沿所述移动终端厚度方向的下边缘向所述指纹模组的中间延伸。
结合本申请第四方面或者第四方面的第一种或第二种可能的实现方式，在第三种可能的实现方式中，所述盖板区域内还设置有显示屏连接线，所述显示屏连接线位于所述指纹模组沿所述移动终端厚度方向的下方。
相较于现有技术，本申请实施例具有以下有益效果：
通过本申请实施例提供的封装方法得到的指纹封装片中，其不包括基板，而现有技术中的指纹封装芯片中一般均具有基板，因此，相较于现有技术，本申请实施例提供的指纹封装芯片的厚度较薄，进而由该指纹封装芯片制成的指纹模组的厚度也较薄。如此，在采用前置指纹方案的移动终端中，在移动终端厚度不变的情形下，采用本申请实施例提供的指纹封装芯片制成的指纹模组沿移动终端厚度方向的下方空间就被空闲出，因而，在不增加移动终端厚度的前提下，能够将用于连接显示屏与主板的显示屏连接线设置在该空闲区域内。如此，显示屏连接线与指纹模组的位置可以沿移动终端厚度方向上交叠或者重叠，如此，减少了显示屏连接线占用移动终端所在平面上的空间，因而，由显示屏连接线节省出的平面空间可以用于制作显示屏，因此，采用本申请实施例提供的指纹封装芯片制成的指纹模组，移动终端的显示屏可以相对增大，如此，提高了移动终端的屏占比。
附图说明
图1是现有的手机正面示意图；
图2是沿图1所示的B-B’方向剖开的盖板区域3的剖面结构示意图；
图3本领域现有的指纹模组的叠层结构示意图；
图4是本领域现有的一种指纹封装芯片的剖面结构示意图；
图5是本领域现有的另一种指纹封装芯片的剖面结构示意图；
图6是本申请实施例提供的指纹芯片封装方法的一种具体实施方式的流程示意图；
图7A至图7E是本申请实施例提供的指纹芯片封装方法的一种具体实施方式中的一系列制程对应的剖面结构示意图。
图8是本申请实施例提供的指纹芯片封装方法的另一种具体实施方式的流程示意图；
图9A至图9E是本申请实施例提供的指纹芯片封装方法的另一种具体实施方式中的一系列制程对应的剖面结构示意图；
图10是本申请实施例提供的指纹芯片封装方法的又一种具体实施方式的流程示意图；
图11A至图11B是本申请实施例提供的指纹芯片封装方法的又一种具体实施方式中的一系列制程对应的剖面结构示意图；
图12是本申请实施例提供的指纹模组剖面结构示意图；
图13是本申请实施例提供的移动终端的正面示意图；
图14是沿图13中的B-B’方向剖开的盖板区域132的剖面结构示意图。
附图标记：
1：指纹模组，2：显示屏，3：盖板区域；
31：指纹模组，32：显示屏连接线，33：盖板
311：指纹封装芯片，312：连接板，313：焊球，314：填充胶，315：补强板，316：芯片盖板，317、319：粘接胶，318：装饰环；
41：指纹裸芯片，42：粘接胶，43：基板，44：焊盘，45：引线，46：基板正面焊盘，47：基板背面焊盘，48：封装体；
51：指纹裸芯片，52：指纹裸芯片正面的焊盘，53：深通孔，54：金属布线层，55：阻焊层，56：基板，57：焊球，58：基板56背面上的焊盘，59：封装体；
70：晶圆，71：指纹裸芯片，72：通孔，73：指纹裸芯片71正面上的焊盘，74：金属布线层，75：阻焊层，76：焊球，77、77’：封装体；
90：保护层。
具体实施方式
在详细描述本申请具体实施方式之前，首先介绍描述本申请具体实施方式时用到的一些技术术语。
裸芯片是指半导体元器件制造完成，封装之前的产品形式，通常是大圆片形式(wafer form)或单颗芯片(die form)的形式存在，封装后成为半导体元件、集成电路、或更复杂电路(混合电路)的组成部分。
封装芯片是指具有封装结构的裸芯片，也就是说，裸芯片封装后形成的结构为封装芯片。
本申请实施例以智能手机作为移动终端的示例来描述本申请的具体实施方式。应该理解，本申请实施例所述的移动终端不限于手机，其还可以为平板电脑等等其它便携式电子设备。
现有的智能手机，为了方便用户操作，前置的指纹模组一般设置在手机显示屏下方。如此，前置指纹方案中的指纹模组占用了手机显示屏下方的边框区域(手机显示屏的“下巴”区域)。作为示例，图1示出了手机的正面图。该图1中，指纹模组1位于显示屏2下方的盖板区域3内。由图1可见，前置指纹方案中的指纹模组占用了手机的“下巴”区域，导致手机的“下巴”较长。
为了设计出具有高屏占比的具有前置指纹方案的移动终端，本申请发明人对具有前置指纹方案的智能手机的内部结构进行了研究分析。
本申请发明人对图1所示的B-B’方向上的盖板区域3的剖面结构进行了分析，该B-B’方向上的剖面图如图2所示。该盖板区域3的内部结构包括：
指纹模组31和显示屏连接线32；
其中，指纹模组31夹在盖板33之间，显示屏连接线32与指纹模组31并行排列在手机显示屏所在平面上。如此设计，是为了控制移动终端的整体厚度。
其中，指纹模组31用于实现手机的指纹识别功能，显示屏连接线32用于连接显示屏(图中未示出)与主板(图中未示出，主板也可以称为硬件核心处理模块)，与指纹模组31无直接连接关系。该显示屏连接线32能够将主板发出的触控控制信号以及显示控制信 号传输至显示屏，并且能够将由显示屏向主板发出的回传信号传输至主板。因此，该显示屏连接线32也可以称为信号传输线。需要说明，因移动终端的主板与显示屏之间存在很多种信号，因此，显示屏连接线32有很多条，因此，其在盖板区域3内的分布非常密集。为了简要起见，图2仅示出了一条显示屏连接线。实际上，盖板区域3内布置有很多条密集分布的显示屏连接线。
其中，指纹模组31的叠层结构如图3所示，其包括：指纹封装芯片311，该指纹封装芯片311为指纹模组31的核心部件，在指纹封装芯片311的背面设置有焊球313，通过焊球313实现指纹封装芯片311焊接在连接板312上，并且实现两者之间的电气连接。
为了提高可靠性，在指纹封装芯片311与连接板312之间还填充有填充胶314，该填充胶314包裹在焊球313的周围。另外，连接板312通常为软板，因此，为了提高机械强度，指纹模组31还包括设置在连接板312下方的补强板315，为了达到良好的外观效果，在指纹封装芯片311的正面还设置有芯片盖板316，指纹封装芯片311与芯片盖板316之间通过粘接胶317粘接在一起，此外，为了提升盖板区域3的外观效果，在指纹封装芯片311的周围还设置有一装饰环318，该装饰环318通过粘接胶319固定粘接在连接板312上。
从上述图2所示的盖板区域3的内部叠层结构来看，为了将手机“下巴”长度A缩短，提高屏占比，可以将显示屏连接线32置于指纹模组31沿手机厚度方向上的下方空间，但是如此设计需要增加盖板区域3的厚度或者减小指纹模组31的厚度，而增加盖板区域3的厚度则会增加手机的整机厚度，这与目前手机朝着轻薄方向发展的趋势相违背，因而增加盖板区域3的厚度的结果是难以接受的。因此，为了实现高屏占比的设计，只能压缩指纹模组31的厚度，将显示屏连接线32置于厚度压缩后的指纹模组沿手机厚度方向的下方空间内。
为了压缩指纹模组31的厚度，本申请发明人对影响指纹模组厚度的各个部件的厚度进行了分析。在图3所示的指纹模组31的叠层结构中，影响指纹模组厚度的部件自上而下依次包括：芯片盖板316、指纹封装芯片311、连接板312以及补强板315。而芯片盖板316、连接板312以及补强板315的厚度一般在0.1mm至0.2mm之间，为保证可靠性，这些部件的厚度压缩空间很小，而指纹封装芯片311的厚度一般在0.6至0.7mm之间，因此，相较于芯片盖板316、连接板312以及补强板315，指纹封装芯片311的厚度具有较大的可压缩空间。因此，通过压缩指纹封装芯片311的厚度实现超薄指纹封装芯片，从而能够实现超薄指纹模组，进而能够实现手机的高屏占比。
因此，基于上述分析，为了实现手机的高屏占比，需要压缩指纹封装芯片的厚度，得到超薄指纹封装芯片。
为了得到超薄指纹封装芯片，本申请发明人对现有的指纹封装芯片的结构进行了研究分析。具体如下：
在指纹芯片封装行业，传统的指纹封装芯片的结构如图4所示。在图4所示的指纹封装芯片的结构中，指纹裸芯片41通过粘接胶42与下方的基板43粘接固定在一起，指纹裸芯片41正面上的焊盘44通过引线45与基板43正面上的焊盘46实现电气连接，基板背面上的焊盘47通过基板43的内部走线与基板正面上的焊盘46实现电气连接。为了保证指纹 裸芯片的可靠性，指纹裸芯片41、引线45、焊盘46均被由封装材料封装成的封装体48所包裹。
针对图4所示的指纹封装芯片中，影响封装结构的厚度的部件包括：封装体48、指纹裸芯片41、粘接胶42以及基板43。在指纹封装芯片的一个典型的叠层结构中，封装体48、指纹裸芯片41、粘接胶42以及基板43的厚度可以分别为0.08mm、0.36mm、0.03mm以及0.21mm，总厚度在0.6mm至0.7mm之间。
为了压缩指纹封装芯片的总厚度，后来出现了图5所示的指纹封装芯片的结构。在图5所示的指纹封装芯片的结构中，指纹裸芯片51通过硅通孔(英文全称为Through Silicon Via，英文简称为TSV)工艺从指纹裸芯片51的背面刻蚀指纹裸芯片51到设置在指纹裸芯片正面的焊盘52，形成深通孔53，深通孔53的表面上以及指纹裸芯片背面形成有一层金属布线层54，该金属布线层54将指纹裸芯片51正面的焊盘52引出到指纹裸芯片51的背面。形成在指纹裸芯片51的背面上的金属布线层54用于指纹裸芯片51背面上的焊盘。为保证绝缘性，指纹裸芯片51的背面覆盖有阻焊层55，为了便于电气连接，阻焊层55未覆盖背面的金属布线层54，此外，为保证绝缘性，阻焊层55填满深通孔53。指纹裸芯片51通过背面焊盘55与基板56焊接在一起，焊接时，在两者之间形成焊球57，该焊球57与背面金属布线层54实现电气连接。基板56背面上的焊盘58通过基板56的内部走线与焊球57之间实现电气连接。
此外，为了保证指纹裸芯片51的可靠性，指纹裸芯片51与焊球57均被由封装材料封装成的封装体59所包裹。
针对图5所示的指纹封装芯片中，影响封装结构的厚度的部件包括：指纹裸芯片51、焊球57以及基板56。在该指纹封装芯片的一个典型的叠层结构中，指纹裸芯片51、焊球57以及基板56的厚度可以分别为0.18mm、0.03mm以及0.21mm，总厚度在0.4mm至0.5mm之间。
从图4和图5所示的现有的两种指纹封装芯片的结构中，指纹封装芯片的总厚度均至少在0.4mm以上，在保证可靠性前提下，这两种封装结构均无法将封装结构的总厚度压缩至0.3mm以下。从而无法满足超薄指纹模组的需求。
从上述现有的两种指纹封装芯片的结构中发现，两者均需要将指纹裸芯片与基板焊接在一起。而基板的厚度大约为0.2mm，所以，该基板厚度对指纹封装芯片的总厚度的贡献较大。因此，如果将基板从指纹封装芯片中去除，则将大幅减小压缩指纹封装芯片的厚度。
发明人研究发现，基板在指纹封装芯片中主要起两个作用：一个是提高指纹封装芯片的机械强度，另一个是实现指纹裸芯片与印刷电路板的电气连接。
因此，如果设计出一种能够在不采用基板的指纹封装芯片的结构，其机械强度满足需求，且能够实现指纹裸芯片与印刷电路板的电气连接，则可以达到与采用基板的指纹封装芯片相同的效果，且可以大幅降低指纹封装芯片的厚度。
基于此，本申请实施例提供了一种指纹芯片的封装方法，该封装方法在形成贯穿指纹裸芯片正背面的TSV通孔后，沿TSV通孔表面以及指纹裸芯片的背面形成金属布线层，该金属布线层能够将指纹裸芯片正面上的焊盘引出到指纹裸芯片背面，并且在指纹裸芯片背 面形成与金属布线层连通的焊球。最终形成的指纹封装芯片的封装结构中，焊球底部不被封装材料包裹，因而，指纹封装芯片能够通过焊球与其它部件形成电气连接。另外，包裹指纹裸芯片的封装体能够增强指纹裸芯片的机械强度，如此，通过该封装方法得到的指纹封装芯片中，指纹裸芯片不需要与基板进行焊接，即可使得其机械强度满足需求，且能够实现与印刷电路板的电气连接。因而，相较于现有技术中需要将指纹裸芯片与基板焊接在一起的封装结构，减少了基板给封装结构的总厚度带来的影响，该指纹封装芯片的厚度可以做到0.3mm以下，从而得到超薄指纹封装芯片，进而实现超薄指纹模组，进而实现前置指纹方案的移动终端的高屏占比。
下面结合附图对本申请实施例提供的指纹芯片封装方法的具体实施方式进行详细描述。
请参阅图6至图7E。图6是本申请实施例提供的指纹芯片封装方法的一种具体实施方式的流程示意图。图7A至图7E是本申请实施例提供的指纹芯片封装方法的一种具体实施方式中的一系列制程对应的剖面结构示意图。
如图6所示，该封装方法包括以下步骤：
S601：提供经过TSV工艺加工后的晶圆70，该晶圆70上形成有多颗指纹裸芯片71，每颗指纹裸芯片71包括刻蚀有贯穿晶圆70正背面的通孔72，通孔72与指纹裸芯片71正面上的焊盘73连通，沿通孔72表面以及晶圆70的背面上形成有金属布线层74，该金属布线层74与焊盘74连通，从而将焊盘74引出到晶圆70背面，晶圆70的背面形成有阻焊层75，该阻焊层75未覆盖晶圆70背面上的金属布线层74，通孔72内被阻焊层75填满。
在本申请实施例中，晶圆70可以为硅晶圆。
如图7A所示，可以通过TSV工艺刻蚀从晶圆背面刻蚀晶圆70，直到刻蚀到晶圆正面上的焊盘73。为了将焊盘73引出到指纹裸芯片71背面，沿通孔72的表面以及晶圆70背面形成一层金属布线层74，该金属布线层74与焊盘73连接，从而将焊盘75经过通孔72引出到指纹裸芯片71的背面。
为了保证绝缘性，通孔72内被阻焊层75填满，并且在指纹裸芯片71的背面也形成有阻焊层75，为了方便指纹裸芯片71后续与其它部件电连接在一起，阻焊层75未覆盖第二焊盘74。
S602：采用机械或者激光加工技术将经过TSV工艺加工后的晶圆切割成多个单颗指纹芯片71。
切割形成的单颗指纹芯片71的剖面结构如图7B所示。
S603：在指纹裸芯片的背面制作焊球76，其中，焊球76与设置在指纹裸芯片71背面的金属布线层74连通。
该步骤执行完对应的剖面结构示意图如图7C所示。
需要说明，封装形成的指纹封装芯片用于制作指纹模组，在制作指纹模组时，指纹封装芯片需要与连接板如FPC板连接在一起，并且实现电气连接。形成的焊球76的作用就是为了实现该物理连接以及电气连接。通过该形成的焊球76可以很方便地实现指纹封装芯片 与连接板的物理连接以及电气连接。
S604：采用封装材料封装指纹裸芯片71以及焊球76，形成包裹焊球76以及指纹裸芯片71四周的封装体77。
该步骤执行完对应的剖面结构示意图如图7D所示。
在本申请实施例中，采用的封装材料一般为塑封料。
S605：打磨包裹焊球76底部的封装材料，直至露出焊球76，便于焊球76后续与指纹模组上的连接板焊接。
为了实现指纹裸芯片71与指纹模组上的连接板的连接以及电气连接，需要将形成于指纹裸芯片71背面上的焊球76的底部露出，通过该焊球76实现上述连接以及电气连接。因此，需要将包裹焊球76底部的封装材料打磨掉。
该步骤执行完对应的剖面结构示意图如图7E所示。
以上为本申请实施例提供的指纹芯片的封装方法的一种具体实施方式。通过该具体实施方式，本申请实施例还提供了一种指纹封装芯片的具体实施方式。该指纹封装芯片的剖面结构示意图如上述图7E所示。如图7E所示，该指纹封装芯片包括：
指纹裸芯片71，所述指纹裸芯片71上刻蚀有贯穿指纹裸芯片71正背面的通孔72，通孔72与指纹裸芯片71正面上的焊盘73连通，沿通孔72表面以及晶圆70的背面上形成有金属布线层74，该金属布线层74与焊盘74连通，从而将焊盘74引出到晶圆70背面，晶圆70的背面形成有阻焊层75，该阻焊层75未覆盖晶圆70背面上的金属布线层74，通孔72内被阻焊层75填满；
形成于所述指纹裸芯片71背面的焊球76，所述焊球76与指纹裸芯片71背面的金属布线层74连通；
包裹在所述焊球76以及所述指纹裸芯片71侧面的封装体77，其中，所述焊球76的底部未被所述封装体77包裹。
由上可知，在该具体实施方式形成的指纹封装芯片中，指纹裸芯片71通过形成于其下方的焊球76能够与指纹模组中的连接板直接焊接在一起，并实现电气连接，进而能够将指纹裸芯片71正面上的焊盘与连接板实现电气连接，因而，本申请实施例形成的指纹封装芯片中，指纹裸芯片71无需通过基板与连接板焊接在一起，另外包裹在指纹裸芯片71以及焊球76侧面的封装体能够起到增强指纹封装芯片的机械强度的作用。因此，本申请实施例形成的指纹封装芯片完全不需要采用基板。所以，相较于现有技术中的指纹封装芯片，该指纹封装芯片省去了基板，从而大幅减小了指纹封装芯片的厚度。通过本申请具体实施方式形成的指纹封装芯片，对指纹封装芯片的总厚度有贡献的部件为指纹裸芯片71、封装体77的底部，在该指纹封装芯片的一个典型的叠层结构中，指纹裸芯片71、封装体77的底部的厚度分别可以为0.25mm以及0.04mm。总厚度为0.29mm。该总厚度远小于图4或图5所示的指纹封装芯片的总厚度(0.4～0.5mm以及0.6～0.7mm)，因此，通过该具体实施方式，能够将指纹封装芯片的总厚度做到0.3mm以下，因而，基于该具体实施方式，能够得到超薄指纹封装芯片，利用该超薄指纹封装芯片能够实现超薄指纹模组。
需要说明，在指纹封装芯片中，指纹裸芯片正面上形成有很多芯片结构，这些芯片结构在封装过程中很容易在制程中被划伤损坏或者在使用过程中被腐蚀，为了保护形成于指纹裸芯片正面上的芯片结构，还可以在指纹裸芯片正面上形成保护层。该形成保护层的具体实施方式请参见以下实施方式。
请参见图8至图9E。图8是本申请实施例提供的指纹芯片封装方法的另一种具体实施方式的流程示意图。图9A至图9E是本申请实施例提供的指纹芯片封装方法的另一种具体实施方式中的一系列制程对应的剖面结构示意图。
如图8所示，该封装方法包括以下步骤：
S801与上述具体实施方式中的步骤S601相同，为了简要起见，在此不再详细描述。此外，该步骤对应的经过TSV工艺加工后的晶圆70的结构与图7A所示的结构相同。
S802：在经过TSV工艺加工后的晶圆正面上形成保护层90。
如图9A所示，在经过TSV工艺加工后的晶圆正面上形成保护层90。该保护层90用于保护晶圆正面结构。作为示例，该保护层90可以通过印刷或者旋涂(Spining Coating)工艺在经过TSV工艺加工后的晶圆70正面上形成保护层90。作为示例，该保护层90的材料可以为聚酰亚胺。
另外，在使用过程中，用户手指触控指纹裸芯片的正面时，指纹封装芯片采集指纹信号，因此，形成于晶圆正面上的保护层90会影响指纹信号采集过程中的灵敏度。因此，在工艺条件允许以及对芯片结构起到保护作用的前提下，保护层90的厚度要尽可能地小。作为示例，保护层90的厚度可以为0.01mm。
S803：采用机械或者激光加工技术将形成有保护层90的经过TSV工艺加工后的晶圆切割成多个单颗指纹芯片71。
切割形成的单颗指纹芯片71的剖面结构如图9B所示。
S804：在指纹裸芯片的背面制作焊球76，其中，焊球76与设置在指纹裸芯片背面的金属布线层74连通。
该步骤执行完对应的剖面结构示意图如图9C所示。制作的焊球76用于在指纹封装芯片制成指纹模组时，将指纹封装芯片焊接在连接板上。
S805：采用封装材料封装指纹裸芯片71以及焊球76，形成包裹焊球76以及指纹裸芯片71四周的封装体77。
该步骤执行完对应的剖面结构示意图如图9D所示。
在本申请实施例中，采用的封装材料一般为塑封料。
S806：打磨包裹焊球76底部的封装材料，直至露出焊球76，便于焊球76后续与指纹模组中的连接板焊接。
该步骤执行完对应的剖面结构示意图如图9E所示。
以上为本申请实施例提供的指纹芯片的封装方法的另一种具体实施方式。通过该具体实施方式，本申请实施例还提供了一种指纹封装芯片的另一种具体实施方式。该指纹封装 芯片的剖面结构示意图如上述图9E所示。如图9E所示，该指纹封装芯片包括：
指纹裸芯片71，所述指纹裸芯片71上刻蚀有贯穿指纹裸芯片71正背面的通孔72，通孔72与指纹裸芯片71正面上的焊盘73连通，沿通孔72表面以及晶圆70的背面上形成有金属布线层74，该金属布线层74与焊盘74连通，从而将焊盘74引出到晶圆70背面，晶圆70的背面形成有阻焊层75，该阻焊层75未覆盖晶圆70背面上的金属布线层74，通孔72内被阻焊层75填满；
形成于所述指纹裸芯片正面的保护层90；
形成于所述指纹裸芯片71背面的焊球76，所述焊球76与金属布线层74连通；
包裹在所述焊球76以及所述指纹裸芯片71侧面的封装体77，其中，所述焊球76的底部未被所述封装体77包裹。
在该具体实施方式中形成的指纹封装芯片中，与上述具体实施方式类似，也省去了基板，因此，能够大幅减小了指纹封装芯片的厚度。通过本申请具体实施方式形成的指纹封装芯片，对指纹封装芯片的总厚度有贡献的部件为保护层90、指纹裸芯片71、封装体77的底部，在该指纹封装芯片的一个典型的叠层结构中，保护层90、指纹裸芯片71、封装体77的底部的厚度分别可以为0.01mm、0.25mm以及0.04mm。总厚度为0.3mm。该总厚度远小于图4或图5所示的指纹封装芯片的总厚度(0.4～0.5mm以及0.6～0.7mm)，因此，通过该具体实施方式，能够将指纹封装芯片的总厚度做到0.3mm以下，因而，基于该具体实施方式，能够得到超薄指纹封装芯片，利用该超薄指纹封装芯片能够实现超薄指纹模组。
此外，在本申请具体实施方式中，指纹裸芯片71的正面形成有用于保护指纹裸芯片71正面上的芯片结构的保护层90，该保护层90能够防止指纹裸芯片71正面芯片结构在封装过程中被划伤或者在使用过程中被腐蚀。因此，该具体实施方式制成的指纹封装芯片还具有性能更稳定，使用寿命更长的特点。
在上述具体实施方式中，为了保护指纹裸芯片71正面的芯片结构，需要专门在指纹裸芯片71的正面上形成一层保护层90。
另外，封装材料为绝缘材料，其性能也较为稳定，因此，由封装材料形成的层结构也能够保护指纹裸芯片71正面的芯片结构，因此，为了简化封装工艺，作为本申请的另一具体实施方式，用于保护指纹裸芯片71正面的芯片结构的保护层可以在封装过程中同时形成，也就是说，形成于指纹裸芯片71正面的保护层可以为封装体的一部分，与封装体为一体成型结构。该具体实施方式的具体实现请参见图10至图11B。
图10是本申请实施例提供的指纹芯片封装方法的又一种具体实施方式的流程示意图。图11A至图11B是本申请实施例提供的指纹芯片封装方法的又一种具体实施方式中的一系列制程对应的剖面结构示意图。
如图10所示，该指纹芯片封装方法包括以下步骤：
步骤S1001至S1003与上述步骤S601至S03相同，为了简要起见，在此不再赘述。
S1004：采用封装材料封装指纹裸芯片71以及焊球76，形成包裹焊球76以及指纹裸 芯片71的封装体77’。
该步骤执行完对应的剖面结构示意图如图11A所示。需要说明，在该步骤中，采用封装材料对指纹裸芯片71以及焊球76进行整体封装，形成的封装体77’不仅包括指纹裸芯片71的侧面，还包裹指纹裸芯片的正面。如此在指纹裸芯片的正面形成了一层由封装材料组成的保护层。该保护层为封装体的一部分。受现有封装工艺以及封装材料的限制，形成于指纹裸芯片71正面上的封装材料层的厚度至少为0.05mm。该厚度大于上述保护层90的厚度，因此，上述形成保护层90的具体实施方式更有利于指纹信号的采集，指纹信号采集过程中的触控灵敏度更高。
在本申请实施例中，采用的封装材料一般为塑封料。
S1005：打磨包裹焊球76底部的封装材料，直至露出焊球76，便于焊球76后续与连接板焊接。
该步骤执行完对应的剖面结构示意图如图11B所示。
以上为本申请实施例提供的指纹芯片封装方法的又一种具体实施方式，由该具体实施方式得到的指纹芯片封装结构如图11B所示，其包括：
指纹裸芯片71，所述指纹裸芯片71上刻蚀有贯穿指纹裸芯片71正背面的通孔72，通孔72与指纹裸芯片71正面上的焊盘73连通，沿通孔72表面以及晶圆70的背面上形成有金属布线层74，该金属布线层74与焊盘74连通，从而将焊盘74引出到晶圆70背面，晶圆70的背面形成有阻焊层75，该阻焊层75未覆盖晶圆70背面上的金属布线层74，通孔72内被阻焊层75填满；
形成于所述指纹裸芯片71背面的焊球76，所述焊球76与金属布线层74连通；
包裹在所述焊球76以及所述指纹裸芯片71正面和侧面的封装体77，其中，所述焊球76的底部未被所述封装体77包裹。
由上可知，通过本申请实施例提供的该指纹芯片封装方法的又一种具体实施方式得到的指纹封装芯片，与上述两种实施方式类似，该具体实施方式中得到的指纹封装芯片也省去了基板，从而大幅减小了指纹封装芯片的厚度。通过本申请具体实施方式形成的指纹封装芯片，对指纹封装芯片的总厚度有贡献的部件为正面封装材料层、指纹裸芯片71、背面封装材料层，在该指纹封装芯片的一个典型的叠层结构中，正面封装材料层、指纹裸芯片71、背面封装材料层的厚度分别可以为0.05mm、0.23mm以及0.02mm。总厚度为0.3mm。该总厚度远小于图4或图5所示的指纹封装芯片的总厚度(0.4～0.5mm以及0.6～0.7mm)，因此，通过该具体实施方式，能够将指纹封装芯片的总厚度做到0.3mm以下，因而，基于该具体实施方式，能够得到超薄指纹封装芯片，利用该超薄指纹封装芯片能够实现超薄指纹模组。
此外，在该封装结构中，封装材料对指纹裸芯片71进行整体封装，如此，形成的封装体将指纹裸芯片71全部包裹起来，如此，指纹裸芯片71的正面形成有用于保护指纹裸芯片71正面上的芯片结构的封装材料，该封装材料能够防止指纹裸芯片71正面芯片结构在封装过程中被划伤或者在使用过程中被腐蚀。相较于上述需要专门形成保护层90的具体实施方式，本申请提供的对指纹裸芯片进行整体封装的具体实施方式，制程更简单，有利于 减少工艺成本，提高生产效率。
综上，本申请实施例提供的指纹封装芯片中，与现有的指纹封装芯片的结构相比，最大的区别点是去除了基板，减小了指纹封装芯片的厚度，能够得到厚度小于0.3mm的超薄指纹封装芯片，该超薄指纹封装芯片能够满足超薄指纹模组的需求。
基于上述实施例提供的指纹封装芯片，本申请实施例还提供了由该指纹封装芯片制成的指纹模组。具体参见以下实施例。
图12是本申请实施例提供的指纹模组剖面结构示意图。如图12所示，该指纹模组120包括：
指纹封装芯片121；该指纹封装芯片121为上述任一具体实施方式封装成的指纹封装芯片。由上述任一具体实施方式可知，指纹封装芯片121包括位于其底部的焊球76，并且该焊球76的底部未被封装材料覆盖，如此可以方便指纹封装芯片121通过焊球76与连接板122进行焊接。
位于所述指纹封装芯片121下方的连接板122，所述连接板122与所述指纹封装芯片121之间通过指纹封装芯片121上的焊球76焊接在一起，实现固定连接并且实现电气连接。
在本申请实施例中，连接板122可以为硬印刷线路板即PCB板，也可以为软连接板FPC，当连接板122为FPC板时，为了增强连接板122的机械强度，指纹模组还可以包括位于所述连接板122下方的补强板123。
为了提高可靠性，所述指纹模组还可以包括包裹在所述指纹封装芯片121中的焊球76周围的填充胶124。
为了达到良好的美观效果，所述指纹模组还可以包括：位于所述指纹封装芯片121正面上方的芯片封装结构盖板125，所述芯片封装结构盖板125与所述指纹封装芯片121之间通过粘结胶126连接在一起。
另外，为了减小指纹模组的尺寸，所述连接板122的尺寸小于所述指纹封装芯片121的尺寸，且所述连接板122位于所述指纹封装芯片121的靠近中心区域。如此，相适应地，位于连接板122下方的补强板123的尺寸也小于指纹封装芯片121的尺寸，且补强板123的尺寸与形状与连接板122的尺寸与出形状完全相同。换句话说，连接板122与补强板123相对于指纹封装芯片都是内缩的，如此设计方便后续指纹模组厚度的减小。
以上为本申请实施例提供的指纹模组的具体实施方式，在该具体实施方式中，因指纹封装芯片121的厚度较薄，其厚度可以做到小于0.3mm，如此，由该指纹封装芯片制成的指纹模组的厚度也相应减小，从而实现了超薄指纹模组的目的。
基于上述实施例提供的超薄指纹模组，本申请实施例还提供了一种移动终端，具体参见以下实施例。
图13是本申请实施例提供的移动终端的正面示意图。如图13所示，该移动终端包括：
显示屏131以及位于所述显示屏131外围的盖板区域132。在该盖板区域132内设置有指纹模组120。
需要说明，在本申请实施例中，盖板区域132可以位于显示屏131任一方向的侧边区域内，为了方便用户操作。该内部设置有指纹模组的盖板区域132通常位于显示屏131的下方区域。
图14是沿图13中的B-B’方向剖开的盖板区域132的剖面结构示意图。如图14所示，所述盖板区域132内设置有指纹模组120以及盖板141，所述指纹模组120夹在盖板141之间，
为了提升盖板区域132的外观效果，作为本申请的一可选实施例，在盖板区域132内还可以在指纹模组120的四周设置有装饰环142，该装饰环142与盖板141之间可以通过粘结胶143连接在一起，
当指纹模组120中的连接板122与补强板123都是内缩的情形下，为了减少盖板区域132的厚度，装饰环142沿所述移动终端厚度方向的下边缘(下方裙边)可以向所述指纹模组120的中间延伸，如此，装饰环142的下边缘不占用指纹模组的z向空间即移动终端厚度方向上的空间，有利于减小盖板区域以及移动终端的总厚度。
当装饰环142沿所述移动终端厚度方向的下边缘(下方裙边)可以向所述指纹模组120的中间延伸时，指纹模组120的指纹封装芯片可以通过粘接胶144粘接在装饰环142的下边缘上，从而实现指纹模组120与装饰环142的固定连接。
所述盖板区域132内还设置有显示屏连接线145，该显示屏连接线145用于连接显示屏与主板，其与指纹模组120没有直接的连接关系。因指纹模组120的总厚度减小，因此，在不增加盖板区域以及移动终端的总厚度的前提下，可以利用指纹模组120沿移动终端厚度方向下方的空间，将显示屏连接线144置于所述指纹模组120沿所述移动终端厚度方向的下方，使得显示屏连接线144与指纹模组120沿移动终端厚度方向上形成叠层结构，如此，显示屏连接线144就不再单独占用盖板区域所在平面上的空间，因而能够减小盖板区域132的宽度，作为示例，本申请实施例能够将盖板区域132的长度B缩短到7mm以内。该节省出来的平面空间可以用来制作显示屏，进而达到提高移动终端屏占比的效果，从而实现移动终端高屏占比的设计。
以上为本申请实施例提供的具体实施方式。

Claims (18)

  1. 一种指纹封装芯片的封装方法，其特征在于，包括：
    提供指纹裸芯片，所述指纹裸芯片上刻蚀有贯穿指纹裸芯片正背面的通孔，所述通孔与所述指纹裸芯片正面上的焊盘连通，沿所述通孔表面以及所述指纹裸芯片背面上形成有金属布线层，所述金属布线层与所述焊盘连通，所述通孔内填充有阻焊层，且所述指纹裸芯片的背面形成有阻焊层，形成于所述指纹裸芯片背面上的阻焊层未覆盖形成于所述指纹裸芯片背面上的金属布线层；
    在所述指纹裸芯片的背面制作焊球，所述焊球与所述金属布线层连通；
    采用封装材料封装所述指纹裸芯片，形成至少包裹所述焊球以及所述指纹裸芯片的侧面的封装体；
    去除包裹所述焊球底部的封装材料层，直至露出所述焊球。
  2. 根据权利要求1所述的封装方法，其特征在于，所述封装方法还包括：
    在所述指纹裸芯片的正面形成保护层。
  3. 根据权利要求2所述的封装方法，其特征在于，所述在所述指纹裸芯片的正面形成保护层，具体包括：
    采用印刷或旋涂工艺在所述指纹裸芯片的正面涂覆保护层。
  4. 根据权利要求2所述的封装方法，其特征在于，所述在指纹裸芯片的正面形成保护层，具体包括：
    在采用封装材料封装所述指纹裸芯片的同时，封装材料还覆盖指纹裸芯片的正面，从而在指纹裸芯片的正面形成封装材料保护层。
  5. 一种指纹封装芯片的封装结构，其特征在于，包括：
    指纹裸芯片，所述指纹裸芯片上刻蚀有贯穿指纹裸芯片正背面的通孔，所述通孔与所述指纹裸芯片正面上的焊盘连通，沿所述通孔表面以及所述指纹裸芯片背面上形成有金属布线层，所述金属布线层与所述焊盘连通，所述通孔内填充有阻焊层，且所述指纹裸芯片的背面形成有阻焊层，形成于所述指纹裸芯片背面上的阻焊层未覆盖形成于所述指纹裸芯片背面上的金属布线层；
    形成于所述指纹裸芯片背面的焊球，所述焊球与所述金属布线层连通；
    包裹在所述焊球以及所述指纹裸芯片侧面的封装体，其中，所述焊球的底部未被所述封装体包裹。
  6. 根据权利要求5所述的封装结构，其特征在于，所述封装结构还包括：
    形成于所述指纹裸芯片正面的保护层。
  7. 根据权利要求6所述的封装结构，其特征在于，所述保护层采用印刷或旋涂工艺形成。
  8. 根据权利要求6所述的封装结构，其特征在于，所述保护层与所述封装体为一体成型结构。
  9. 一种指纹模组，其特征在于，包括：如权利要求5-8任一项所述的指纹封装芯片。
  10. 根据权利要求9所述的指纹模组，其特征在于，所述指纹模组还包括：
    位于所述指纹封装芯片下方的连接板，所述连接板与所述指纹封装芯片通过所述指纹封装芯片上的焊球焊接在一起，并且实现电气连接。
  11. 根据权利要求10所述的指纹模组，其特征在于，所述指纹模组还包括：位于所述连接板下方的补强板。
  12. 根据权利要求10或11所述的指纹模组，其特征在于，所述连接板的尺寸小于所述指纹封装芯片的尺寸，且所述连接板位于所述指纹封装芯片的靠近中心区域。
  13. 根据权利要求9-12任一项所述的指纹模组，其特征在于，所述指纹模组还包括包裹在所述指纹封装芯片中的焊球周围的填充胶。
  14. 根据权利要求9-13任一项所述的指纹模组，其特征在于，所述指纹模组还包括：位于所述指纹封装芯片正面上方的芯片封装结构盖板。
  15. 一种移动终端，其特征在于，包括：显示屏以及位于所述显示屏外围的盖板区域，所述盖板区域内设置有权利要求9-14任一项所述的指纹模组，所述指纹模组位于盖板之间。
  16. 根据权利要求15所述的移动终端，其特征在于，所述盖板区域内还包括位于所述指纹模组周围的装饰环，所述装饰环与所述盖板固定连接。
  17. 根据权利要求16所述的移动终端，其特征在于，所述装饰环沿所述移动终端厚度方向的下边缘向所述指纹模组的中间延伸。
  18. 根据权利要求15-17任一项所述的移动终端，其特征在于，所述盖板区域内还设置有显示屏连接线，所述显示屏连接线位于所述指纹模组沿所述移动终端厚度方向的下方。
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