CN109983573A - 指纹封装芯片及封装方法、指纹模组及移动终端 - Google Patents

指纹封装芯片及封装方法、指纹模组及移动终端 Download PDF

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Publication number
CN109983573A
CN109983573A CN201780067544.1A CN201780067544A CN109983573A CN 109983573 A CN109983573 A CN 109983573A CN 201780067544 A CN201780067544 A CN 201780067544A CN 109983573 A CN109983573 A CN 109983573A
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China
Prior art keywords
fingerprint
chip
bare chip
mould group
encapsulation
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Pending
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CN201780067544.1A
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English (en)
Inventor
邓涛
古蒋林
彭旭
刘海永
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Huawei Technologies Co Ltd
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Huawei Technologies Co Ltd
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Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Publication of CN109983573A publication Critical patent/CN109983573A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Image Input (AREA)

Abstract

一种指纹封装芯片及其封装方法、指纹模组以及移动终端。该指纹封装芯片不包括基板，因此，相较于现有技术，该指纹封装芯片的厚度较薄，进而由该指纹封装芯片制成的指纹模组的厚度也较薄。如此，在采用前置指纹方案的移动终端中，在移动终端厚度不变的情形下，采用本申请实施例提供的指纹封装芯片制成的指纹模组沿移动终端厚度方向的下方空间就被空闲出，因而，能够将用于连接显示屏与主板的显示屏连接线设置在该空闲区域内。如此，减少了显示屏连接线占用移动终端所在平面上的空间，因此，采用本申请实施例提供的指纹封装芯片制成的指纹模组，移动终端的显示屏可以相对增大，提高了移动终端的屏占比。

Description

PCT国内申请，说明书已公开。

Claims (18)

  1. PCT国内申请，权利要求书已公开。
CN201780067544.1A 2017-10-20 2017-10-20 指纹封装芯片及封装方法、指纹模组及移动终端 Pending CN109983573A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2017/107000 WO2019075713A1 (zh) 2017-10-20 2017-10-20 指纹封装芯片及封装方法、指纹模组及移动终端

Publications (1)

Publication Number Publication Date
CN109983573A true CN109983573A (zh) 2019-07-05

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CN201780067544.1A Pending CN109983573A (zh) 2017-10-20 2017-10-20 指纹封装芯片及封装方法、指纹模组及移动终端

Country Status (2)

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CN (1) CN109983573A (zh)
WO (1) WO2019075713A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111126215A (zh) * 2019-12-13 2020-05-08 维沃移动通信有限公司 功能模组及电子设备

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009295880A (ja) * 2008-06-06 2009-12-17 Oki Semiconductor Co Ltd 半導体装置、半導体装置の製造方法、半導体装置の検査方法
CN106095195A (zh) * 2016-08-16 2016-11-09 广东欧珀移动通信有限公司 输入组件及终端
CN106252345A (zh) * 2016-09-20 2016-12-21 苏州科阳光电科技有限公司 指纹传感器模组及其制作方法
CN206363343U (zh) * 2017-01-10 2017-07-28 广东欧珀移动通信有限公司 指纹模组及具有其的终端
CN107123602A (zh) * 2017-06-12 2017-09-01 江阴长电先进封装有限公司 一种指纹识别芯片的封装结构及其制造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN205644554U (zh) * 2016-03-30 2016-10-12 比亚迪股份有限公司 指纹检测识别装置和具有其的电子设备

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009295880A (ja) * 2008-06-06 2009-12-17 Oki Semiconductor Co Ltd 半導体装置、半導体装置の製造方法、半導体装置の検査方法
CN106095195A (zh) * 2016-08-16 2016-11-09 广东欧珀移动通信有限公司 输入组件及终端
CN106252345A (zh) * 2016-09-20 2016-12-21 苏州科阳光电科技有限公司 指纹传感器模组及其制作方法
CN206363343U (zh) * 2017-01-10 2017-07-28 广东欧珀移动通信有限公司 指纹模组及具有其的终端
CN107123602A (zh) * 2017-06-12 2017-09-01 江阴长电先进封装有限公司 一种指纹识别芯片的封装结构及其制造方法

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WO2019075713A1 (zh) 2019-04-25
WO2019075713A9 (zh) 2019-07-04

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Application publication date: 20190705

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