WO2019073567A1 - Substrat non flexible ayant une couche de base, dispositif d'affichage flexible et son procédé de production - Google Patents

Substrat non flexible ayant une couche de base, dispositif d'affichage flexible et son procédé de production Download PDF

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Publication number
WO2019073567A1
WO2019073567A1 PCT/JP2017/036986 JP2017036986W WO2019073567A1 WO 2019073567 A1 WO2019073567 A1 WO 2019073567A1 JP 2017036986 W JP2017036986 W JP 2017036986W WO 2019073567 A1 WO2019073567 A1 WO 2019073567A1
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Prior art keywords
resin layer
flexible substrate
inorganic film
layer
resin
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PCT/JP2017/036986
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English (en)
Japanese (ja)
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哲憲 田中
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シャープ株式会社
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Priority to US16/754,626 priority Critical patent/US11239453B2/en
Priority to PCT/JP2017/036986 priority patent/WO2019073567A1/fr
Publication of WO2019073567A1 publication Critical patent/WO2019073567A1/fr
Priority to US17/553,111 priority patent/US11751419B2/en

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to a non-flexible substrate provided with a base layer, a flexible display, and a method of manufacturing the flexible display.
  • organic EL Electro Luminescence
  • OLED Organic Light Emitting Diodes
  • inorganic EL displays provided with inorganic light emitting diodes.
  • organic light emitting diodes, inorganic light emitting diodes and the like as display elements provided in EL display devices etc have reliability problems such as shortening of the life due to penetration of foreign matter such as water and oxygen. Active research is being conducted to prevent the penetration of foreign substances such as water and oxygen into the display elements of the above.
  • the first polyimide resin layer and an inorganic film formed by a CVD (Chemical Vapor Deposition) method or the like as a base layer on a substrate for example, silicon oxide, silicon nitride, silicon oxynitride or the like
  • CVD Chemical Vapor Deposition
  • a flexible display device having a structure in which a laminated film in which two polyimide resins are laminated in this order is provided has two layers of polyimide resin layers having a high effect of preventing the penetration of foreign substances such as water and oxygen Bathed in
  • FIG. 10 is a diagram for explaining a schematic configuration of the conventional base layer 102 and problems of the conventional base layer 102. As shown in FIG.
  • a first resin layer 102 a made of, for example, a polyimide resin is formed on the surface on one side of the glass substrate 101 (non-flexible substrate).
  • the inorganic film 102b is formed on the entire surface excluding the end region, and is formed on the entire surface of the glass substrate 101 so as to cover the first resin layer 102a by the CVD method or the like.
  • a second resin layer 102c made of, for example, a polyimide resin is formed on the inorganic film 102b so as to cover other than the end region of the inorganic film 102b.
  • the adhesion between the glass substrate 101 and the first resin layer 102a is high.
  • the adhesion between the inorganic film 102 b and the first resin layer 102 a and the adhesion between the inorganic film 102 b and the glass substrate 101 are good.
  • the adhesion between the inorganic film 102b and the second resin layer 102c is low.
  • the adhesion between the inorganic film 102b and the second resin layer 102c is low, for example, film peeling occurs between the inorganic film 102b and the second resin layer 102c in the cleaning step and the like included in the later steps. It is easy to occur.
  • FIG. 11 is a view for explaining a Laser Lift Off step (also referred to as an LLO step) required to manufacture a flexible organic EL display device including the conventional base layer 102 shown in FIG.
  • a Laser Lift Off step also referred to as an LLO step
  • the first resin layer 102a, the inorganic film 102b, and the second resin layer 102 are formed on the surface 101a on one side of the glass substrate 101 except for the end region of the glass substrate 101.
  • the base layer 102 in which the resin layer 102c is laminated is formed.
  • a moisture-proof layer 103 is formed on the base layer 102, and a TFT array layer 104 composed of a thin film transistor element (TFT element) and an insulating film is formed on the moisture-proof layer 103.
  • TFT element thin film transistor element
  • a red light emitting organic EL element 105R On the TFT array layer 104, a red light emitting organic EL element 105R, a green light emitting organic EL element 105G and a blue light emitting organic EL element 105B are formed as display elements.
  • the red light emitting organic EL element 105R A sealing film 106 is formed to cover the EL element 105G and the blue light emitting organic EL element 105B.
  • Each of the red light emitting organic EL element 105R, the green light emitting organic EL element 105G, and the blue light emitting organic EL element 105B is, for example, not shown, but a first electrode patterned in correspondence with each pixel; It is a laminate of a hole injection layer, a hole transport layer, a light emitting layer of each color, an electron transport layer, an electron injection layer, and a second electrode.
  • the laser light is irradiated from the side of the glass substrate 101 so that the interface between the first resin layer 102a constituting the base layer 102 and the glass substrate 101. Ablation occurs, and as shown in FIG. 11B, the glass substrate 101 is peeled off from the first resin layer 102a.
  • the back film 111 is a first resin layer 102 a through the adhesive layer 110 provided on the surface 111 a of the back film 111 which is a flexible substrate. Paste to a flexible organic EL display device.
  • the inorganic film 102 b and the second resin layer 102 c Since film peeling easily occurs between the film 102c and the film 102c, the yield of the flexible organic EL display device is lowered.
  • the present invention has been made in view of the above problems, and provides a non-flexible substrate provided with a base layer capable of suppressing occurrence of film peeling during a manufacturing process, a flexible display device with high yield, and It aims at providing the manufacturing method.
  • the first resin layer, the inorganic film, and the second resin layer are laminated in this order on the non-flexible substrate in order to solve the above problems.
  • a method of manufacturing a flexible display device comprising the step of forming a base layer, wherein the step of forming the base layer is performed by forming the first resin layer inside the end region of the non-flexible substrate. Forming the inorganic film on at least a portion of the first resin layer so as to expose at least one of a portion of the non-flexible substrate and a portion of the first resin layer.
  • the step of attaching the flexible substrate is characterized in that it further comprises.
  • a flexible display device with high yield can be manufactured.
  • the non-flexible substrate provided with the base layer of the present invention comprises a non-flexible substrate and a base layer provided on the non-flexible substrate, in order to solve the problems described above.
  • the base layer includes a portion in which a first resin layer, an inorganic film, and a second resin layer are laminated in this order, and an end of the base layer is a non-flexible substrate.
  • the second resin layer is formed in contact with the non-flexible substrate or the first resin layer.
  • the flexible display device of the present invention comprises a flexible substrate, a base layer provided on the flexible substrate, and a display element provided on the base layer, in order to solve the problems described above. It is a flexible display apparatus containing,
  • the said base layer contains the part by which the 1st resin layer, the inorganic film, and the 2nd resin layer were laminated
  • the edge part of the said base layer is
  • the second resin layer is formed in contact with the flexible substrate via the first resin layer or the adhesive layer.
  • a non-flexible substrate provided with a base layer capable of suppressing occurrence of film peeling during a manufacturing process, a flexible display device with high yield, and a method of manufacturing the same.
  • FIG. 1 is a plan view of a non-flexible substrate provided with the base layer illustrated in FIG. 1;
  • FIG. 7 is a plan view of a non-flexible substrate provided with a base layer of Embodiment 2; It is a figure for demonstrating the manufacturing process of the non-flexible substrate provided with the base layer of Embodiment 3.
  • FIG. FIG. 5 is a plan view of a non-flexible substrate with the base layer illustrated in FIG. 4; FIG.
  • FIG. 10 is a plan view of a non-flexible substrate provided with the base layer of Embodiment 4; It is a figure for demonstrating the manufacturing process of the non-flexible substrate provided with the base layer of Embodiment 5.
  • FIG. FIG. 8 is a plan view of a non-flexible substrate provided with the base layer illustrated in FIG. 7;
  • FIG. 16 is a plan view of a non-flexible substrate provided with the base layer of Embodiment 6; It is a figure for demonstrating the schematic structure of the conventional base layer, and the problem of the conventional base layer. It is a figure for demonstrating the Laser Lift Off process (it is also called a LLO process) required in order to manufacture the flexible organic electroluminescence display provided with the conventional base layer illustrated in FIG.
  • a LLO process Laser Lift Off process
  • a flexible organic EL display device including a red light emitting organic EL element, a green light emitting organic EL element and a blue light emitting organic EL element as a display element is described as an example.
  • the display element may be, for example, a reflective liquid crystal display element, an inorganic light emitting diode, or a quantum dot light emitting diode (QLED). It may be.
  • Embodiment 1 A first embodiment of the present invention will be described based on FIGS. 1 and 2.
  • the shape of the base layer 2 is different from the shape of the conventional base layer 102 described above based on FIG. 10 and FIG.
  • FIG. 1 is a view for explaining a manufacturing process of a non-flexible substrate 10 provided with a base layer 2.
  • the first resin layer 2 a made of, for example, polyimide resin is removed on the surface on one side of the glass substrate 1 and the end region DR of the glass substrate 1 is removed. It formed on the whole surface.
  • the first resin layer 2a was heat-treated.
  • the heat treatment of the first resin layer 2a is performed twice, that is, the pre-baking which is a relatively low temperature process and the post-baking which is a relatively high temperature process.
  • the heat treatment of the first resin layer 2a may be performed once or three or more times.
  • the glass substrate 1 as the non-flexible substrate will be described as an example, but a process of forming a thin film transistor element (TFT element) and an organic EL element which are post-processes at relatively high temperatures.
  • the substrate is not limited to the glass substrate as long as it is a substrate that can withstand the forming process and has good adhesion to the first resin layer 2a and the second resin layer 2c described later.
  • a polyimide resin not containing a photosensitive material is used as the first resin layer 2a, and the application region is adjusted using a slit coater or the like, and the end region DR of the glass substrate 1 is adjusted.
  • the 1st resin layer 2a was formed in the whole surface except for was mentioned as an example, it is not limited to this, for example, while using the polyimide resin containing a photosensitive material as the 1st resin layer 2a, After the first resin layer 2a is formed on the entire surface of the glass substrate 1 using a spin coater or the like, the first resin layer 2a remains on the entire surface excluding the end region DR of the glass substrate 1 through exposure and development steps. It may be formed as follows.
  • the 1st resin layer 2a is mentioned as an example, it is not limited to this, and it can use for the Laser Lift Off process (LLO process).
  • the type is not particularly limited as long as the resin has good adhesion to the glass substrate 1.
  • the inorganic film 2b is formed on the entire surface of the glass substrate 1 by the CVD (Chemical Vapor Deposition) method or the like, and the first resin layer 2a is covered by the inorganic film 2b. I did it.
  • CVD Chemical Vapor Deposition
  • an oxide film formed by a CVD method It may be a silicon film, a silicon oxynitride film, or the like.
  • the inorganic film 2b an inorganic film formed by a method other than the CVD method may be used.
  • the resist film 3 having the opening 3a is formed, and dry etching is performed using the resist film 3 as a mask, thereby illustrating in (b) of FIG.
  • the inorganic film 2 b was formed into the shape of the inorganic film 2 b ′.
  • the inorganic film 2b illustrated in FIG. 1B is formed so as to cover the first resin layer 2a and also cover the entire end region DR of the glass substrate 1, but dry etching was performed.
  • the subsequent inorganic film 2b ' is removed such that only the portion covering the first resin layer 2a is left in the end region DR of the glass substrate 1, and the other portion is exposed so as to expose the glass substrate 1.
  • the inorganic film 2 b ′ is removed so that only the portion covering the first resin layer 2 a is left in the end region DR of the glass substrate 1, and the other portion is exposed so as to expose the glass substrate 1.
  • the case where it is carried out is mentioned as an example, it is not limited to this.
  • the second resin layer 2c described later may be in direct contact with the glass substrate 1 in the end region DR of the glass substrate 1, for example, in the dry etching process illustrated in (c) of FIG. A part of the inorganic film 2b formed in the partial region DR may be removed, or the whole may be removed.
  • the inorganic film 2b illustrated in FIG. 1 may be formed in advance so as to expose a part or all of the end region DR of the glass substrate 1 using a deposition mask. In this case, the dry etching process using the resist film 3 illustrated in (c) of FIG. 1 as a mask can be omitted.
  • the inorganic film 2b ′ is covered, and it is in direct contact with a part of the end region DR of the exposed glass substrate 1 ((e of FIG. A) and B)), and the second resin layer 2c was formed.
  • the second resin layer 2c was heat-treated.
  • the heat treatment of the second resin layer 2c is performed twice, that is, the pre-baking which is a relatively low temperature process and the post-baking which is a relatively high temperature process.
  • the heat treatment of the second resin layer 2c may be performed once or three or more times.
  • the slit coating machine etc. was used and the application area was adjusted and the 2nd resin layer 2c was formed.
  • the present invention is not limited thereto.
  • the second resin layer 2c a polyimide resin containing a photosensitive material is used, and a spin coater or the like is used on the entire surface of the glass substrate 1. After forming the second resin layer 2c, the second resin layer 2c may be formed in a predetermined pattern through exposure and development steps.
  • the polyimide resin which is the same material as the 1st resin layer 2a in which adhesiveness with the glass substrate 1 is favorable is used as the 2nd resin layer 2c
  • this is this.
  • a material different from the first resin layer 2a may be used.
  • FIG. 2 is a plan view of a non-flexible substrate 10 provided with the base layer 2 illustrated in FIG. 1 (e).
  • the case where one large base layer 2 is formed on the glass substrate 1 is taken as an example.
  • the invention is not limited thereto, and a plurality of island-shaped base layers may be formed on the glass substrate 1 as in the second embodiment described later.
  • a base layer 2 including a laminated film of a first resin layer 2a, an inorganic film 2b 'and a second resin layer 2c.
  • the adhesion between the second resin layer 2c and the inorganic film 2b ' is weak, but the second resin layer 2c has a good adhesion in the end region DR of the glass substrate 1 I am in direct contact with
  • the adhesion between the second resin layer 2c and the base film is weak on the inner side of the end region DR of the glass substrate 1, but in the end region DR of the glass substrate 1, the second resin layer 2c is not. Adhesion is good.
  • the non-flexible substrate 10 provided with the base layer 2 for example, in the cleaning step and the like included in the post-process, it is possible to suppress the progress of peeling of the second resin layer 2c from the end.
  • a step of forming a moisture-proof layer on the base layer 2 a step of forming a TFT array layer comprising a thin film transistor element (TFT element) and an insulating film, and an organic EL element as a display element on the TFT array layer. Since the process of forming the sealing film, the process of forming the sealing film covering the organic EL element, and the LLO process are the same as the contents described above with reference to FIG.
  • the second resin layer 2 c is formed in contact with the glass substrate 1 at the end of the base layer 2.
  • the second resin layer 2 c is in contact with the back film 111 which is a flexible substrate via the adhesive layer 110 at the end of the base layer 2.
  • the flexible display device provided with the base layer 2 may be divided into a plurality of pieces, so that a dividing step of dividing by a laser or the like inside the base layer 2 is included.
  • the second resin layer 2c cuts off a portion in contact with the back surface film 111 which is a flexible substrate through the adhesive layer 110, depending on the division location. There are cases where this part is not included. In this case, only the portion in which the first resin layer 2a is in contact with the back film 111, which is a flexible substrate, remains with the adhesive layer 110 interposed therebetween.
  • the inorganic film 2 b ′ completely covers the first resin layer 2 a is described as an example, but the present invention is limited thereto.
  • the second resin layer 2c is in direct contact with the glass substrate 1 having good adhesion in the end region DR of the glass substrate 1, and also in direct contact with the first resin layer 2a.
  • flexible display devices with high yield can be manufactured.
  • the width of the end region DR is secured relatively wide, but it is limited to this If the second resin layer need not be formed in the end region DR of the glass substrate 1 as in the third embodiment described later, the width of the end region DR may be as narrow as possible. .
  • Embodiment 2 of the present invention will be described based on FIG.
  • the non-flexible substrate 20 of the present embodiment differs from the first embodiment in that a plurality of island-shaped base layers 2 'are formed on the glass substrate 1, and the other embodiments are different from the first embodiment.
  • members having the same functions as the members shown in the drawings of Embodiment 1 are given the same reference numerals, and descriptions thereof will be omitted.
  • FIG. 3 is a plan view of a non-flexible substrate 20 provided with a plurality of island-shaped base layers 2 '.
  • base layers 2 ′ having the same shape as the base layer 2 in the first embodiment described above are separated by a predetermined distance in the form of islands. And a plurality (four in the present embodiment) are provided.
  • the base layer 2 ′ is formed in an island shape on the glass substrate 1 in each of the A region, the B region, the C region, and the D region.
  • a plurality (four in the present embodiment) of first resin layers 2 a are formed in an island shape inside the end region DR of the glass substrate 1.
  • the plurality of inorganic films 2b ' are formed in islands (four in the present embodiment) so that the glass substrate 1 is exposed. ) Is formed.
  • the second resin layer 2c is formed in a plurality of island shapes (four in the present embodiment) so as to be in contact with the glass substrate 1 exposed from the plurality of inorganic films 2b 'formed in a plurality of island shapes. ing.
  • the inorganic film is formed to cover each of the plurality of first resin layers 2a formed in a plurality of islands and the glass substrate 1, and then the inorganic film formed directly on the glass substrate 1 Although the glass substrate 1 is exposed from the inorganic film 2b 'outside each of the plurality of island-shaped first resin layers 2a by removing the above, the present invention is not limited to this.
  • Each of the plurality of island-shaped base layers 2 ′ provided on the glass substrate 1 has the same shape as the base layer 2 in the first embodiment described above, and thus includes the plurality of island-shaped base layers 2 ′.
  • the non-flexible substrate 20 for example, in the cleaning step and the like included in the post-process, it is possible to suppress the progress of peeling of the second resin layer 2c from the end.
  • each step (from the step of forming a moisture-proof layer to the step of LLO) in Embodiment 1 described above is additionally performed on the non-flexible substrate 20 provided with the plurality of island-shaped base layers 2 '
  • a display device can be realized.
  • the respective end portions of the plurality of base layers 2 ′ are the second A resin layer 2 c is formed in contact with the glass substrate 1.
  • the flexible display device provided with a plurality of base layers 2 ′ comprises each of A region, B region, C region and D region.
  • the second resin layer 2c is in contact with the back film 111 which is a flexible substrate via the adhesive layer 110 at the end of the base layer 2 '.
  • the flexible display device provided with a plurality of base layers 2 'is divided inside each area of A area, B area, C area and D area and separated into a plurality of pieces
  • the portion in which the second resin layer 2c is in contact with the back film 111, which is a flexible substrate is cut off via the adhesive layer 110. It may not contain a part.
  • Embodiment 3 of the present invention will be described based on FIGS. 4 and 5.
  • the inorganic film 2 b ′ ′ is formed so that the region in the vicinity of the end region DR of the glass substrate 1 in the first resin layer 2 a is exposed.
  • the layer 2c differs from the first embodiment in that the layer 2c is in direct contact with the exposed first resin layer 2a, and the other portions are as described in the first embodiment.
  • members having the same functions as the members shown in the drawings of Embodiment 1 are given the same reference numerals, and descriptions thereof will be omitted.
  • FIG. 4 is a view for explaining the manufacturing process of the non-flexible substrate 30 provided with the base layer 12.
  • the resist film 4 having the opening 4 a is formed, and dry etching is performed using the resist film 4 as a mask to illustrate in (b) of FIG. 4.
  • the inorganic film 2b was formed into the shape of the inorganic film 2b ′ ′.
  • the inorganic film 2b illustrated in FIG. 4B is formed to cover the first resin layer 2a and also to cover the entire end region DR of the glass substrate 1, but after dry etching is performed.
  • the inorganic film 2 b ′ ′ exposes the region in the vicinity of the end region DR of the glass substrate 1 in the first resin layer 2 a, that is, the outer edge portion of the first resin layer 2 a, and in the end region DR of the glass substrate 1. It has been removed.
  • the inorganic film 2 b ′ ′ is completely removed in the end region DR of the glass substrate 1 by way of example.
  • the present invention is not limited to this, and the inorganic film 2 b ′ is not limited thereto. If 'can expose a region in the vicinity of the end region DR of the glass substrate 1 in the first resin layer 2a, the inorganic film 2b' 'remains partially or entirely in the end region DR of the glass substrate 1 May be
  • the inorganic film 2b is formed on the entire surface of the glass substrate 1, dry etching is performed using the resist film 4 as a mask.
  • the deposition mask is not limited to the above.
  • the inorganic film 2b may be formed in a shape that exposes the region in the vicinity of the end region DR of the glass substrate 1 in the resin layer 2a. In this case, the dry etching process using the resist film 4 illustrated in (c) of FIG. 4 as a mask can be omitted.
  • the resist film 4 is peeled to form the first resin layer 2 a and a region in the vicinity of the end region DR of the glass substrate 1 in the first resin layer 2 a.
  • the glass substrate 1 provided with the inorganic film 2b ′ ′ formed to be exposed can be realized.
  • the inorganic film 2b ′ ′ is covered, and it is in direct contact with the exposed first resin layer 2a (a portion C in FIG.
  • the second resin layer 2c ' was formed.
  • FIG. 5 is a plan view of a non-flexible substrate 30 provided with the base layer 12 illustrated in FIG. 4 (e).
  • the present embodiment in order to realize a relatively large flexible display device, as shown in FIG. 5, the case where one large base layer 12 is formed on the glass substrate 1 is taken as an example.
  • the present invention is not limited thereto, and a plurality of island-shaped base layers may be formed on the glass substrate 1 as in the fourth embodiment described later.
  • the materials of the first resin layer 2a, the inorganic film 2b '' and the second resin layer 2c ' are the materials of the first resin layer 2a, the inorganic film 2b' and the second resin layer 2c in the first and second embodiments described above. Since the same material as that of can be used, the description thereof is omitted here.
  • the base layer 12 including the laminated film of the first resin layer 2 a, the inorganic film 2 b ′ ′, and the second resin layer 2 c ′
  • the adhesion between the second resin layer 2c ′ and the inorganic film 2b ′ ′ is weak, but the second resin layer 2c ′ is in the region near the end region DR of the glass substrate 1, It is in direct contact with the first resin layer 2a having high adhesion.
  • the second resin layer 2 c ′ has higher adhesion to the first resin layer 2 a than adhesion to the glass substrate 1.
  • the second resin layer 2c ′ has poor adhesion to the underlying film, but in the region in contact with the first resin layer 2a, adhesion to the underlying film Sex is high.
  • the non-flexible substrate 30 provided with the base layer 12 for example, it is possible to suppress the progress of peeling of the second resin layer 2c 'from the end in the cleaning step or the like included in the post-process.
  • a step of forming a moisture-proof layer on the base layer 12 a step of forming a TFT array layer comprising a thin film transistor element (TFT element) and an insulating film, and an organic EL element as a display element on the TFT array layer. Since the process of forming the sealing film, the process of forming the sealing film covering the organic EL element, and the LLO process are the same as the contents described above with reference to FIG.
  • the end portion of the base layer 12 is formed such that the first resin layer 2a and the second resin layer 2c 'are in contact with each other.
  • the end of the base layer 12 may be formed such that the first resin layer 2a and the second resin layer 2c 'are in contact with each other.
  • some pieces may be separated
  • the portion where the first resin layer 2a and the second resin layer 2c 'are formed in contact may be cut off and may not include this portion. In this case, only the portion in which the first resin layer 2a is in contact with the back film 111, which is a flexible substrate, remains with the adhesive layer 110 interposed therebetween.
  • Embodiment 4 A fourth embodiment of the present invention will now be described based on FIG.
  • the non-flexible substrate 40 of this embodiment is different from the third embodiment in that a plurality of island-shaped base layers 12 'are formed on the glass substrate 1, and the third embodiment is otherwise described.
  • members having the same functions as the members shown in the drawings of Embodiment 3 are given the same reference numerals, and descriptions thereof will be omitted.
  • FIG. 6 is a plan view of a non-flexible substrate 40 with a plurality of island-shaped base layers 12 '.
  • base layers 12 ′ having the same shape as the base layer 12 in the above-described third embodiment have predetermined intervals in an island shape. And a plurality (four in the present embodiment) are provided.
  • the base layer 12 ′ is formed in an island shape on the glass substrate 1 in each of the A region, the B region, the C region, and the D region.
  • a plurality (four in the present embodiment) of first resin layers 2 a are formed in an island shape inside the end region DR of the glass substrate 1.
  • the plurality of inorganic films 2b ′ ′ are island-shaped so that the first resin layer 2a is exposed (this embodiment) 4) are formed.
  • the plurality of second resin layers 2c ' are formed like islands (four in the present embodiment) so as to be in contact with the first resin layers 2a exposed from the plurality of inorganic films 2b' 'formed in a plurality of islands. ) Are formed.
  • the inorganic film after forming the inorganic film so as to cover each of the plurality of island-shaped first resin layers 2a and the glass substrate 1, at least the outer edge portion of each of the first resin layers 2a is formed.
  • the first resin layer 2a is exposed from the inorganic film 2b ′ ′ at each outer edge of the first resin layer 2a by removing the inorganic film directly formed on the upper surface of the first resin layer 2a. Absent.
  • Each of the plurality of island-shaped base layers 12 ′ provided on the glass substrate 1 has the same shape as the base layer 12 in the third embodiment described above, and thus includes the plurality of island-shaped base layers 12 ′.
  • the non-flexible substrate 40 for example, in the cleaning step and the like included in the post-process, it is possible to suppress that the second resin layer 2c 'is peeled off from the end.
  • each step (from the step of forming the moisture-proof layer to the step of LLO) in the third embodiment described above is additionally performed on the non-flexible substrate 40 provided with the plurality of island-shaped base layers 12 '.
  • the dividing step it is possible to suppress the progress of peeling from the end portion of the second resin layer 2c 'in each of the above steps, so that the yield is high. Can be realized.
  • each end of the plurality of base layers 12 ′ is the first The resin layer 2a and the second resin layer 2c 'are formed in contact with each other.
  • the flexible display provided with a plurality of base layers 12 ′ comprises each of A region, B region, C region and D region.
  • the end portion of the base layer 12 ' is formed such that the first resin layer 2a and the second resin layer 2c' are in contact with each other.
  • the portion where the first resin layer 2a and the second resin layer 2c 'are formed in contact with each other may be cut off and may not include this portion. In this case, only the portion in which the first resin layer 2a is in contact with the back film 111, which is a flexible substrate, remains with the adhesive layer 110 interposed therebetween.
  • the inorganic film 2 b ′ ′ ′ exposes the region in the vicinity of the end region DR of the glass substrate 1 in the first resin layer 2 a and the end region of the glass substrate 1
  • the third embodiment differs from the third embodiment in that the DR is formed in contact with the glass substrate 1 so as to cover the end of the first resin layer 2a, and the others are as described in the third embodiment.
  • members having the same functions as the members shown in the drawings of Embodiment 3 are given the same reference numerals, and descriptions thereof will be omitted.
  • FIG. 7 is a view for explaining the manufacturing process of the non-flexible substrate 50 provided with the base layer 22. As shown in FIG.
  • the resist film 5 having the opening 5 a is formed, and dry etching is performed using the resist film 5 as a mask to illustrate in (b) of FIG. 5.
  • the inorganic film 2b was formed into the shape of the inorganic film 2b ′ ′ ′.
  • the inorganic film 2b illustrated in FIG. 7B is formed so as to cover the first resin layer 2a and also cover the entire end region DR of the glass substrate 1, but after dry etching is performed.
  • the inorganic film 2b ′ ′ ′ exposes the first resin layer 2a inside the region near the end region DR of the glass substrate 1 in the first resin layer 2a, ie, inside the outer edge portion of the first resin layer 2a.
  • the outer edge portion of the first resin layer 2 a is formed in contact with the glass substrate 1.
  • the resist film 5 is peeled to form the first resin layer 2 a and a region near the end region DR of the glass substrate 1 in the first resin layer 2 a. It is possible to realize the glass substrate 1 including the inorganic film 2b ′ ′ ′ having a shape that is exposed and in contact with the glass substrate 1 in the end region DR of the glass substrate 1 and that covers the end of the first resin layer 2a.
  • the inorganic film 2b ′ ′ ′ is covered, and it is in direct contact with the exposed first resin layer 2a (E portion in (e of FIG. 7). And F part), 2nd resin layer 2c 'was formed.
  • FIG. 8 is a plan view of a non-flexible substrate 50 provided with the base layer 22 illustrated in FIG. 7 (e).
  • the present invention in order to realize a relatively large flexible display device, as shown in FIG. 8, the case where one large base layer 22 is formed on the glass substrate 1 is taken as an example.
  • the present invention is not limited to this, and a plurality of island-shaped base layers may be formed on the glass substrate 1 as in the sixth embodiment described later.
  • the materials of the first resin layer 2a, the inorganic film 2b ′ ′ ′ and the second resin layer 2c ′ are the same as those of the first resin layer 2a, the inorganic film 2b ′ and the second resin layer 2c in the first and second embodiments described above. Since the same material as the material can be used, the description thereof is omitted here.
  • the base layer 22 including the laminated film of the first resin layer 2a, the inorganic film 2b ′ ′ ′, and the second resin layer 2c ′ is provided.
  • the inorganic film 2b ′ ′ ′ is formed in contact with the glass substrate 1 in the end region DR of the glass substrate 1 so as to cover the end of the first resin layer 2a. .
  • the adhesion between the first resin layer 2a and the glass substrate 1 is significantly improved by the formation of the inorganic film 2b shown in FIG. 7 (b). This is because the end region DR of the glass substrate 1 includes a portion formed in contact with the glass substrate 1 so as to cover the end of the first resin layer 2a.
  • Such an effect is obtained by exposing a region in the vicinity of the end region DR of the glass substrate 1 in the first resin layer 2a in advance using the vapor deposition mask, and at the end region DR of the glass substrate 1 with the glass substrate 1 It is obtained similarly when forming the inorganic film 2b in the shape which covers the edge part of the 1st resin layer 2a in contact.
  • the first resin layer 2 a can be maintained in a state in which the first resin layer 2 a is hardly peeled off from the glass substrate 1 in the cleaning step and the like included in the post process.
  • the end of the base layer 22 is formed such that the first resin layer 2a and the second resin layer 2c 'are in contact with each other.
  • the end of the base layer 22 may be formed such that the first resin layer 2a and the second resin layer 2c 'are in contact with each other.
  • the part In order to divide the flexible display device including the base layer 22 into a plurality of pieces, in the case where the parting step of dividing with a laser or the like is included inside the base layer 22, the part may be separated depending on the parting point In the flexible display after conversion, the portion where the first resin layer 2a and the second resin layer 2c 'are formed in contact may be cut off and may not include this portion. In this case, only the portion in which the first resin layer 2a is in contact with the back film 111, which is a flexible substrate, remains with the adhesive layer 110 interposed therebetween.
  • the non-flexible substrate 60 of the present embodiment differs from the fifth embodiment in that a plurality of base layers 22 'are formed on the glass substrate 1, and the others are described in the fifth embodiment. That's right.
  • members having the same functions as the members shown in the drawings of Embodiment 5 are given the same reference numerals, and descriptions thereof will be omitted.
  • FIG. 9 is a plan view of a non-flexible substrate 60 with a plurality of base layers 22 '.
  • a plurality of base layers 22 ′ having the same shape as the base layer 22 in the fifth embodiment described above are formed on the glass substrate 1 (this embodiment) 4) are provided.
  • the base layer 22 ' is formed in an island shape in each of the A region, the B region, the C region, and the D region.
  • a plurality (four in the present embodiment) of first resin layers 2 a are formed in an island shape inside the end region DR of the glass substrate 1.
  • first resin layer 2a is exposed and the outer edge portion of the first resin layer 2a is in contact with the glass substrate 1 inside the outer edge portion of each of the plurality of island-shaped first resin layers 2a.
  • An inorganic film 2 b ′ ′ ′ is formed to cover it.
  • the plurality (four in the present embodiment) of the second resin layers 2c ' are formed in an island shape so as to be in contact with the first resin layers 2a exposed from the inorganic film 2b' ''.
  • the inorganic film is formed so as to cover each of the plurality of island-shaped first resin layers 2a and the glass substrate 1, and then the inner side of the outer edge of each of the first resin layers 2a.
  • the first resin layer 2a is exposed from the inorganic film 2b '' 'at the inner side than the outer edge portion of each of the first resin layer 2a.
  • each of the plurality of base layers 22 ′ provided on the glass substrate 1 has the same shape as the base layer 22 in the fifth embodiment described above, a non-flexible substrate provided with the plurality of base layers 22 ′ In 60, for example, the first resin layer 2a can be maintained in a state in which the first resin layer 2a is not easily peeled off from the glass substrate 1 in the cleaning step or the like included in the subsequent step.
  • each process from the process of forming the moisture-proof layer to the process of LLO) in Embodiment 5 described above, and additionally a dividing process by laser etc.
  • the first resin layer 2a can be maintained in a state in which film peeling is unlikely to occur from the glass substrate 1 in each of the steps described above. Can be realized.
  • the inorganic film 2b ′ ′ ′ is formed without being separated on the outside of each of the A region, B region, C region, and D region.
  • the present invention is not limited to this, and the inorganic film 2b ′ ′ ′ may not be formed at the dividing portion in the dividing step by the above-described laser or the like.
  • the respective end portions of the plurality of base layers 22 ′ are the first The resin layer 2a and the second resin layer 2c 'are formed in contact with each other.
  • the flexible display provided with a plurality of base layers 22 ′ comprises each of A region, B region, C region and D region.
  • the end of the base layer 22 ' is formed by bringing the first resin layer 2a and the second resin layer 2c' into contact with each other.
  • the flexible display device including the base layer 22 ′ is divided inside of each of the A area, B area, C area and D area, and then separated into a plurality of pieces.
  • the portion where the first resin layer 2a and the second resin layer 2c 'are formed in contact with each other may be cut off and may not include this portion.
  • the portion in which the first resin layer 2a is in contact with the back film 111, which is a flexible substrate, remains with the adhesive layer 110 interposed therebetween.
  • the first resin layer, the inorganic film, and the second resin layer are formed on a non-flexible substrate in order to solve the above problems.
  • a method of manufacturing a flexible display device comprising the step of forming a base layer laminated in this order, wherein the step of forming the base layer comprises the step of forming the first resin layer at the end of the non-flexible substrate.
  • the inorganic film at least the first resin layer so as to expose at least one of a first step of forming inside the partial region and a portion of the inflexible substrate and a portion of the first resin layer And contacting the second resin layer with at least one of the part of the non-flexible substrate exposed from the inorganic film and the part of the first resin layer. Forming the third substrate, and peeling off the non-flexible substrate and attaching the flexible substrate through the adhesive layer. A step of applying, and further comprising.
  • a flexible display device with high yield can be manufactured.
  • the non-flexible substrate in the second step, is exposed outside the first resin layer,
  • the inorganic film may be formed, and in the third step, the second resin layer may be formed in contact with the non-flexible substrate exposed from the inorganic film.
  • a flexible display device with high yield can be manufactured.
  • the inorganic film covers the first resin layer and the non-flexible substrate in the second aspect.
  • the non-flexible substrate may be exposed from the inorganic film outside the first resin layer by removing the inorganic film directly formed on the non-flexible substrate.
  • a flexible display device with high yield can be manufactured.
  • the first resin layer is exposed at the outer edge portion of the first resin layer.
  • the inorganic film may be formed, and in the third step, the second resin layer may be formed in contact with the first resin layer exposed from the inorganic film.
  • a flexible display device with high yield can be manufactured.
  • the inorganic film covers the first resin layer and the non-flexible substrate in the second aspect.
  • the first resin layer is exposed from the inorganic film at the outer edge of the first resin layer by removing the inorganic film formed directly on at least the outer edge of the first resin layer.
  • a flexible display device with high yield can be manufactured.
  • the first resin layer is exposed inside the outer edge portion of the first resin layer.
  • the inorganic film may be formed, and in the third step, the second resin layer may be formed in contact with the first resin layer exposed from the inorganic film.
  • a flexible display device with high yield can be manufactured.
  • the inorganic film covers the first resin layer and the non-flexible substrate in the second aspect. After the formation, by removing the inorganic film directly formed on the first resin layer inside the outer edge portion of the first resin layer, the first inside the outer edge portion of the first resin layer can be removed. The resin layer may be exposed from the inorganic film.
  • a flexible display device with high yield can be manufactured.
  • the first resin layer is formed inward from the end region of the non-flexible substrate.
  • the inorganic film is formed into an island so that the non-flexible substrate is exposed outside each of the plurality of island-shaped first resin layers in the second step.
  • the plurality of second resin layers may be formed in an island so as to be in contact with the non-flexible substrate exposed from the plurality of inorganic films formed in the plurality of islands.
  • a flexible display device with high yield can be manufactured.
  • each of the first resin layers in which a plurality of the inorganic films are formed in the island shape in the second step After forming so as to cover the non-flexible substrate, each of the plurality of island-shaped first resin layers is formed by removing the inorganic film directly formed on the non-flexible substrate. Outside the, the non-flexible substrate may be exposed from the inorganic film.
  • a flexible display device with high yield can be manufactured.
  • the first resin layer is formed inward from the end region of the non-flexible substrate.
  • the inorganic film is formed such that the first resin layer is exposed at the outer edge of each of the first resin layers formed in a plurality of islands.
  • the plurality of islands are formed in the form of islands, and in the third step, the second resin layer is formed in the form of islands so as to be in contact with the first resin layer exposed from the inorganic film formed in the plurality of islands. You may form more than one.
  • a flexible display device with high yield can be manufactured.
  • each of the first resin layers in which a plurality of the inorganic films are formed in the island shape in the second step After forming so as to cover the non-flexible substrate, by removing the inorganic film formed directly on at least the outer edge of each of the first resin layers, the outer edge of each of the first resin layers is removed.
  • the first resin layer may be exposed from the inorganic film.
  • a flexible display device with high yield can be manufactured.
  • the method for manufacturing a flexible display device is the method according to aspect 1, wherein in the first step, the first resin layer is formed inward from the end region of the non-flexible substrate. In the second step, the inorganic material is formed such that the first resin layer is exposed inside the outer edge of each of the first resin layers formed in a plurality of islands. A film may be formed, and in the third step, the plurality of second resin layers may be formed in an island shape so as to be in contact with each of the first resin layers exposed from the inorganic film.
  • a flexible display device with high yield can be manufactured.
  • each of the first resin layers in which a plurality of the inorganic films are formed in the island shape in the second step After forming so as to cover the non-flexible substrate, removing the inorganic film directly formed on the first resin layer on the inner side from the outer edge portion of each of the first resin layers, the The first resin layer may be exposed from the inorganic film inside the outer edge of each resin layer.
  • a flexible display device with high yield can be manufactured.
  • the non-flexible substrate is peeled off, and at least the second through the adhesive layer.
  • the second resin layer formed to be in contact with the non-flexible substrate is also included, and the flexible substrate is attached via the adhesive layer. It is also good.
  • a flexible display device with high yield can be manufactured.
  • the non-flexible substrate is peeled off, and at least the second through the adhesive layer.
  • the flexible substrate may be attached only to the first resin layer via the adhesive layer.
  • a flexible display device with high yield can be manufactured.
  • the non-flexible substrate is peeled off, and at least the first resin layer is made flexible via an adhesive layer.
  • the flexible film may be attached via the adhesive layer, including the inorganic film formed to be in contact with the non-flexible substrate.
  • a flexible display device with high yield can be manufactured.
  • any of the above aspects 1 to 16 after the step of attaching the flexible substrate, the flexible substrate provided with the base layer And the step of dividing the flexible substrate including the base layer, the plurality of flexible display devices being divided by dividing the flexible substrate including the base layer. It is preferable to obtain.
  • a flexible display device with high yield can be manufactured.
  • a non-flexible substrate provided with a base layer according to aspect 18 of the present invention comprises a non-flexible substrate and a base layer provided on the non-flexible substrate in order to solve the problems described above.
  • a non-flexible substrate comprising a base layer, the base layer comprising a portion in which a first resin layer, an inorganic film, and a second resin layer are laminated in this order, the base layer The second resin layer is formed in contact with the non-flexible substrate or the first resin layer.
  • the non-flexible substrate provided with the base layer according to aspect 19 of the present invention, in the above-mentioned aspect 18, in the base layer, the first resin layer, the inorganic film, and the second resin layer
  • the sequentially laminated portion is inside the end region of the non-flexible substrate, and the end of the base layer is the second resin layer in the end region of the non-flexible substrate. It may be formed in contact with the non-flexible substrate.
  • the first resin layer, the inorganic film, and the second resin layer in the base layer are The sequentially laminated portion is inside the end region of the non-flexible substrate, and the inorganic film exposes the end of the first resin layer inside the end region of the non-flexible substrate. Even if the second resin layer is formed in contact with the first resin layer, the end of the base layer is formed on the inner side of the end region of the non-flexible substrate. Good.
  • the first resin layer, the inorganic film, and the second resin layer in the base layer, the first resin layer, the inorganic film, and the second resin layer
  • the sequentially laminated portion is inside the end region of the inflexible substrate, and the inorganic film exposes a part of the first resin layer inside the end region of the inflexible substrate.
  • the second resin layer may be formed in contact with the first resin layer inside the end region of the non-flexible substrate.
  • a plurality of the above-mentioned base layers may be formed in any of the above aspects 18 to 21.
  • a plurality of the base layers may be formed in an island shape.
  • the first resin layer and the second resin layer are made of a material containing a polyimide resin. It may be formed.
  • a flexible display according to aspect 25 of the present invention is provided on a flexible substrate, a base layer provided on the flexible substrate, and the base layer in order to solve the problems described above.
  • the base layer includes a portion in which a first resin layer, an inorganic film, and a second resin layer are laminated in this order, and the flexible display device includes the display element.
  • the end portion is characterized in that the second resin layer is formed in contact with the flexible substrate via the first resin layer or the adhesive layer.
  • the first resin layer and the second resin layer may be formed of a material containing a polyimide resin.
  • the present invention can be applied to a flexible display device and a method of manufacturing the flexible display device.

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Abstract

Un substrat non flexible (10) ayant une couche de base (2) selon la présente invention est configuré de sorte que : la couche de base (2) a une partie dans laquelle une première couche de résine (2a), un film inorganique (2b') et une seconde couche de résine (2c) sont séquentiellement stratifiés dans cet ordre ; et le bord de la couche de base (2) est formé de sorte que la seconde couche de résine (2c) est en contact avec un substrat de verre (1).
PCT/JP2017/036986 2017-10-12 2017-10-12 Substrat non flexible ayant une couche de base, dispositif d'affichage flexible et son procédé de production WO2019073567A1 (fr)

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US16/754,626 US11239453B2 (en) 2017-10-12 2017-10-12 Non-flexible substrate having base layer including inorganic film between resin layers, flexible display device and method for producing same
PCT/JP2017/036986 WO2019073567A1 (fr) 2017-10-12 2017-10-12 Substrat non flexible ayant une couche de base, dispositif d'affichage flexible et son procédé de production
US17/553,111 US11751419B2 (en) 2017-10-12 2021-12-16 Flexible display device having non-flexible substrate having base layer including inorganic film between resin layers

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