WO2019065234A1 - Procédé de fabrication d'un substrat sur lequel sont formées des électrodes - Google Patents

Procédé de fabrication d'un substrat sur lequel sont formées des électrodes Download PDF

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Publication number
WO2019065234A1
WO2019065234A1 PCT/JP2018/033780 JP2018033780W WO2019065234A1 WO 2019065234 A1 WO2019065234 A1 WO 2019065234A1 JP 2018033780 W JP2018033780 W JP 2018033780W WO 2019065234 A1 WO2019065234 A1 WO 2019065234A1
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Prior art keywords
electrode
substrate
transparent substrate
transparent
insulating layer
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PCT/JP2018/033780
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English (en)
Japanese (ja)
Inventor
橋本大樹
高瀬皓平
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東レ株式会社
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Priority to JP2018549283A priority Critical patent/JPWO2019065234A1/ja
Priority to KR1020197037539A priority patent/KR20200058330A/ko
Priority to CN201880062226.0A priority patent/CN111133408A/zh
Publication of WO2019065234A1 publication Critical patent/WO2019065234A1/fr

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0016—Apparatus or processes specially adapted for manufacturing conductors or cables for heat treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

Definitions

  • the present invention relates to a method of manufacturing a substrate with an electrode having a transparent substrate, a first electrode, an insulating layer and a second electrode.
  • the touch panel includes a display unit such as a liquid crystal panel, and a touch panel sensor that detects information input to a specific position.
  • the touch panel methods are roughly classified into a resistive film method, a capacitance method, an optical method, an electromagnetic induction method, an ultrasonic method, and the like according to a detection method of an input position.
  • a capacitive touch panel is widely used for reasons of optically bright, excellent in design, simple in structure, and excellent in function.
  • the capacitive touch panel sensor has a second electrode which is orthogonal to the first electrode and the insulating layer, applies a voltage to the electrode on the touch panel surface, and the capacitance when a conductor such as a finger touches the electrode.
  • the contact position obtained by detecting the change is output as a signal.
  • a touch panel sensor used in the capacitance method for example, a structure in which two transparent substrates having a transparent electrode pattern formed on one surface of a transparent substrate are bonded, or electrodes are formed on both sides of one transparent substrate The structure formed etc. are known.
  • a wiring electrode used for a touch panel sensor a transparent wiring electrode was generally used from the viewpoint of making the wiring electrode difficult to see, but in recent years, metal materials have been used due to high sensitivity and large screens. The opaque wiring electrode is widespread.
  • a method for producing a transparent conductive laminate easy to align for example, at least a first transparent conductive layer and a second transparent conductive layer are formed on both sides of the transparent substrate layer, and the first transparent
  • a method of applying a resist on the surface of the conductive layer and the second transparent conductive layer and simultaneously exposing it, developing the resist and etching the first transparent conductive layer and the second transparent conductive layer has been proposed.
  • the transparent substrate layer needs to absorb the exposure light in order to avoid exposure of other than the desired resist by simultaneous exposure, and since the materials which can be used are limited, another method is desirable. It was rare.
  • a process of forming a first transparent electrode pattern on one side of a first transparent substrate, a process of forming at least a transparent conductive layer on one side of a second transparent substrate, and a process of forming the first transparent substrate A step in which the surface on which the transparent electrode pattern is not formed and the surface on which the transparent conductive layer of the second transparent substrate is not formed are opposed to each other and adhered with an adhesive layer, and the first transparent electrode pattern is used.
  • a method including the steps of adjusting the exposure position of patterning of the transparent conductive layer and forming a second transparent electrode pattern on the transparent conductive layer by patterning (see, for example, Patent Document 3).
  • the present invention has been made in view of the above-described circumstances, and provides a method of manufacturing a substrate with a high yield, which is difficult to be visually recognized, is excellent in positional accuracy even using a thin film transparent substrate, and can suppress moire.
  • the purpose is to
  • the present invention mainly has the following composition.
  • the method includes the steps of forming an electrode, forming an insulating layer on the surface of the transparent substrate on which the first electrode is formed, and forming a second electrode on the insulating layer, Forming the second electrode and heating the second electrode at a temperature of 100.degree. C. to 150.degree. C., the first electrode and / or the second electrode being opaque.
  • the present invention it is possible to obtain a substrate with an electrode which is hard to be recognized and which is excellent in positional accuracy even when using a thin film transparent substrate and which can suppress moire with high yield.
  • a substrate with an electrode based on the manufacturing method of the present invention has a first electrode, an insulating layer and a second electrode on a first transparent substrate. First, each of these layers will be described.
  • the first transparent substrate is a portion to be a base of the electrode-attached substrate, and is preferably transparent in the visible light region.
  • the transmittance of light having a wavelength of 550 nm is preferably 80% or more, and more preferably 85% or more.
  • the transmittance of the first transparent substrate at a wavelength of 550 nm can be measured using an ultraviolet-visible spectrophotometer (U-3310 manufactured by Hitachi High-Technologies Corporation).
  • a transparent substrate for example, quartz glass, soda glass, chemically tempered glass, "Pyrex” (registered trademark) glass, synthetic quartz plate, epoxy resin substrate, polyetherimide resin substrate, polyether ketone resin substrate, polysulfone resin substrate And transparent films made of resins such as polyethylene terephthalate film (hereinafter, "PET film”), cycloolefin polymer film, polyimide film, polyester film, aramid film, etc., and resin plates for optics.
  • PET films, cycloolefin polymer films, and polyimide films are preferable from the viewpoint of transparency, heat resistance, and strength when the thickness is 200 ⁇ m or less.
  • a plurality of these may be stacked and used, and for example, it can be used by bonding using a plurality of transparent substrates by an adhesive layer.
  • the functional film which has various functions, such as ultraviolet-ray cutability, gas-barrier property, anti-reflective property, as a transparent substrate is mentioned.
  • a functional film having an ultraviolet ray cutting property for example, a film made of a resin having an ultraviolet ray absorbing property such as polyethylene naphthalate or the transparent film exemplified above has a maximum absorption wavelength in the ultraviolet ray region of a wavelength of 300 to 380 nm.
  • surface or both surfaces to the transparent film illustrated above are mentioned.
  • the functional film having gas barrier properties include laminates in which a metal oxide layer such as silicon oxide is formed on the transparent film exemplified above.
  • Water vapor permeability of the functional film having a gas barrier property 1 ⁇ preferably 10 -1 g / m 2 ⁇ day or less, more preferably 1 ⁇ 10 -2 g / m 2 ⁇ day, 1 ⁇ 10 -3 g It is more preferable to use / m 2 ⁇ day or less.
  • the water vapor transmission rate can be measured at 40 ° C. in a 90% RH atmosphere using a water vapor transmission rate measuring device (MOCON PERMATRAN 3/21 manufactured by Modern Control Co., Ltd.).
  • the material for forming the low refractive index layer is preferably a low refractive index material having a refractive index of 1.6 or less at a wavelength of 550 nm, and examples thereof include silicon oxide and magnesium fluoride.
  • a high refractive material having a refractive index of 1.9 or more at a wavelength of 550 nm is preferable.
  • ITO indium oxide
  • ATO antimony-doped tin oxide
  • a middle refractive index layer having a refractive index of about 1.50 to 1.85 for example, a thin film made of titanium oxide or a mixture of the low refractive index material and the high refractive material May be formed.
  • the thickness of the first transparent substrate in the present invention is 200 ⁇ m or less in total.
  • the thickness of the first transparent substrate is thicker than 200 ⁇ m, the flexibility of the transparent substrate is small, so the transparent substrate on which the opaque wiring electrode is formed is bonded to two or more layers or other substrates.
  • misalignment does not easily occur.
  • the first electrode and / or the second electrode are opaque.
  • the transmittance of light with a wavelength of 365 nm is preferably 20% or less, and more preferably 10% or less.
  • the transmittance of the first electrode and the second electrode is measured by a micro-spectral spectral color difference meter (VSS 400: manufactured by Nippon Denshoku Kogyo Co., Ltd.) for an electrode of 0.1 mm square or more on the transparent substrate. can do.
  • the first electrode and the second electrode may be composed of the same material or may be composed of different materials.
  • one of the first electrode or the second electrode is opaque and the other is transparent. By having a transparent electrode, an electrode can be formed using existing production equipment without using expensive silver and the like.
  • the first electrode and the second electrode are more preferably a metal mesh that is made of metal and has a mesh-like pattern. Since the metal mesh has high conductivity, it can be easily miniaturized to a line width which is difficult to be visually recognized.
  • the thickness of the opaque electrode among the first electrode and the second electrode is preferably 0.01 ⁇ m or more, more preferably 0.05 ⁇ m or more, and still more preferably 0.1 ⁇ m or more.
  • the thickness of the opaque electrode is preferably 10 ⁇ m or less, more preferably 5 ⁇ m or less, and still more preferably 3 ⁇ m or less, from the viewpoint of forming finer wiring.
  • the line width of the patterns of the first electrode and the second electrode is preferably 1 ⁇ m or more, more preferably 1.5 ⁇ m or more, and still more preferably 2 ⁇ m or more, from the viewpoint of further improving the conductivity.
  • the line width of the patterns of the first electrode and the second electrode is preferably 10 ⁇ m or less, more preferably 7 ⁇ m or less, and still more preferably 6 ⁇ m or less, from the viewpoint of making the wiring electrode less visible.
  • a material which forms an opaque electrode among the first electrode and the second electrode for example, silver, gold, copper, platinum, lead, tin, nickel, aluminum, tungsten, molybdenum, chromium, titanium, indium, etc. Metals, alloys thereof and the like can be mentioned. Two or more of these may be used. Among these, conductive particles such as silver, copper and gold are preferable from the viewpoint of conductivity.
  • the primary particle diameter of the conductive particles is preferably 0.1 to 1.0 ⁇ m, more preferably 0.2 to 0.8 ⁇ m, in order to form a fine conductive pattern having desired conductivity.
  • the primary particle diameter of the conductive particles means that the electrode is physically collected with tweezers, adhesive tape, etc., the resin component is dissolved with an organic solvent such as tetrahydrofuran, the precipitated conductive particles are collected, and the box is The sample dried at 70 ° C. for 10 minutes using an oven was observed at a magnification of 25000 using an electron microscope, and the major and minor axes of the primary particles of 100 randomly selected conductive particles were measured. , And can be calculated by obtaining their number average value.
  • the organic solvent used to dissolve the resin component is not particularly limited as long as it can dissolve the resin component of the electrode.
  • the content thereof is preferably 60% by mass or more, more preferably 65% by mass or more, from the viewpoint of improving the conductivity. 70% by mass or more is more preferable.
  • the content of the conductive particles is preferably 95% by mass or less, more preferably 90% by mass or less, and still more preferably 85% by mass or less.
  • content of the electroconductive particle in an opaque electrode can be calculated
  • the opaque electrode preferably contains an organic compound together with the aforementioned metal.
  • alkali-soluble resin As an organic compound, alkali-soluble resin is preferable.
  • alkali-soluble resin resin etc. which have a hydroxyl group and / or a carboxyl group are mentioned, for example.
  • a resin having a hydroxy group for example, a phenol novolak resin having a phenolic hydroxy group, a novolak resin such as a cresol novolac resin, a polymer of a monomer having a hydroxy group, a monomer having a hydroxy group, styrene, acrylonitrile, an acrylic monomer, etc. And copolymers thereof.
  • the monomer having a hydroxy group for example, monomers having a phenolic hydroxy group such as 4-hydroxystyrene, hydroxyphenyl (meth) acrylate and the like; 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate , (Meth) acrylic acid 3-methyl-3-hydroxybutyl, (meth) acrylic acid 1,1-dimethyl-3-hydroxybutyl, (meth) acrylic acid 1,3-dimethyl-3-hydroxybutyl, (meth) 2,2,4-trimethyl-3-hydroxypentyl acrylate, 2-ethyl-3-hydroxyhexyl (meth) acrylate, glycerol mono (meth) acrylate, polypropylene glycol mono (meth) acrylate, polyethylene glycol mono (meth) acrylate Such as acrylate Monomers having a phenolic hydroxy group.
  • monomers having a phenolic hydroxy group such as 4-hydroxystyrene, hydroxy
  • resin which has a carboxyl group for example, carboxylic acid modified epoxy resin, carboxylic acid modified phenol resin, polyamic acid resin, carboxylic acid modified siloxane resin, polymer of monomer having carboxyl group, monomer having carboxyl group, styrene, acrylonitrile And copolymers with acrylic monomers and the like.
  • Examples of the monomer having a carboxyl group include acrylic acid, methacrylic acid, maleic acid, fumaric acid, crotonic acid, itaconic acid, citraconic acid, cinnamic acid and the like.
  • the resin having a hydroxy group and a carboxyl group a copolymer of a monomer having a hydroxy group and a monomer having a carboxy group, a monomer having a hydroxy group, a monomer having a carboxy group, styrene, acrylonitrile, an acrylic monomer, etc. Copolymers may be mentioned. Two or more of these may be contained.
  • resins containing a phenolic hydroxy group and a carboxyl group are preferred.
  • a quinone diazide compound is used as a photosensitizer by containing a phenolic hydroxy group, the phenolic hydroxy group and the quinone diazide compound form a hydrogen bond, and the developer in the unexposed area of the positive photosensitive light shielding composition layer
  • the solubility difference between the unexposed area and the exposed area is increased, and the development margin can be expanded.
  • the solubility to a developing solution improves, and adjustment of development time becomes easy by content of a carboxyl group.
  • conductivity can be exhibited at a lower temperature.
  • the acid value of the alkali-soluble resin having a carboxyl group is preferably 50 mg KOH / g or more from the viewpoint of solubility in a developing solution, and 250 mg KOH / g or less from the viewpoint of suppressing excessive dissolution of the unexposed area.
  • the acid value of the alkali-soluble resin having a carboxyl group can be measured according to JIS K 0070 (1992).
  • the opaque electrode is, if necessary, a dispersant, a photopolymerization initiator, a monomer having an unsaturated double bond, a photoacid generator, a thermal acid generator, a sensitization It may contain an agent, a pigment or dye that absorbs visible light, an adhesion improver, a surfactant, a polymerization inhibitor, and the like.
  • indium tin oxide ITO
  • indium zinc oxide IZO
  • zinc oxide ZnO
  • indium zinc tin oxide Substances IZTO
  • cadmium tin oxide CTO
  • PEDOT poly (3,4-ethylenedioxythiophene)
  • carbon nanotubes CNT
  • the thickness of the transparent electrode is preferably 16 nm or more, more preferably 18 nm or more, and still more preferably 20 nm or more.
  • the thickness of the transparent electrode is preferably 40 nm or less, more preferably 38 nm or less, and still more preferably 36 nm or less, from the viewpoint of transparency and color.
  • the surface resistance of the substrate with a transparent electrode is preferably 10 to 400 ⁇ / ⁇ .
  • 300 ohms / square or less are more preferable, and 270 ohms / square or less are further more preferable.
  • the insulating layer is a portion that secures insulation between the first electrode and the second electrode.
  • insulating resin materials such as polyimide resin, acrylic resin, cardo resin, epoxy resin, melamine resin, urethane resin, silicon resin, fluorine resin, etc., inorganic materials such as glass Etc. Two or more of these may be used.
  • An insulating resin material is preferable from the viewpoint of strength against bending and bending of the transparent substrate.
  • the insulating layer may be a multilayer including two or more layers.
  • the insulating layer preferably has a multilayer structure including an adhesive layer and a second transparent substrate. By having a multilayer structure including the adhesive layer and the second transparent substrate, a transparent substrate with high surface smoothness can be used, and the positional accuracy of the first electrode and the second electrode can be further improved.
  • the adhesive layer has a function to adhere a plurality of layers to be adhered in a short time with a slight pressure under room temperature and / or heating conditions.
  • the adhesive layer preferably has transparency.
  • the material constituting the adhesive layer include acrylic resin, silicone resin, urethane resin, polyamide resin, polyvinyl ether resin, vinyl acetate / vinyl chloride copolymer, modified polyolefin resin, fluorine resin, natural rubber, synthetic rubber, etc. Can be mentioned. Two or more of these may be used. Among these, acrylic resins are preferable from the viewpoint of excellent transparency, adhesion properties such as appropriate wettability, cohesion and adhesiveness, and excellent weather resistance and heat resistance.
  • the adhesive layer may contain, as necessary, a tackifier, a plasticizer, a filler, an antioxidant, an ultraviolet absorber, a silane coupling agent, and the like.
  • the thickness of the adhesive layer is preferably 1 ⁇ m or more, more preferably 3 ⁇ m or more, and still more preferably 5 ⁇ m or more. On the other hand, 100 micrometers or less are preferable, as for the thickness of an adhesion layer, 50 micrometers or less are more preferable, and 35 micrometers or less are more preferable.
  • the polarizing film refers to a film having a polarizing ability to transmit only polarized light in a certain vibration direction.
  • a polarizing film the film etc. which dyed and adsorb
  • the first transparent substrate and the second transparent substrate may be made of the same material or may be made of different materials.
  • the thickness of the insulating layer is preferably 0.1 ⁇ m to 300 ⁇ m, more preferably 0.5 ⁇ m to 200 ⁇ m, and still more preferably 0.8 ⁇ m to 150 ⁇ m, from the viewpoints of insulation, moist heat resistance, and transparency.
  • FIG. 1 schematically shows an electrode-equipped substrate having a first electrode, an opaque electrode 2 and an insulating layer 3 on a transparent substrate 1, and further having an opaque electrode 2 as a second electrode on an insulating layer 3.
  • FIG. 2 is a schematic view of a substrate with an electrode having the first electrode, the opaque electrode 2 and the insulating layer 3 on the transparent substrate 1 and the transparent electrode 4 as the second electrode on the insulating layer 3.
  • FIG. 3 schematically shows an electrode-equipped substrate having a transparent electrode 4 as a first electrode and an insulating layer 3 on a transparent substrate 1 and further having an opaque electrode 2 as a second electrode on the insulating layer 3.
  • FIGS. 4 to 6 are schematic views of a substrate with an electrode when the insulating layer 3 in FIGS. 1 to 3 is the adhesive layer 5 and the second transparent substrate 6.
  • a first electrode is formed on at least one side of a first transparent substrate.
  • the first electrode may be a transparent electrode or an opaque electrode.
  • the first electrode in the case of a transparent electrode, for example, dry coating such as PVD method such as sputtering or vapor deposition, CVD method, spin coating using a spinner, roll coating, spray coating, dip coating, etc.
  • dry coating such as PVD method such as sputtering or vapor deposition, CVD method, spin coating using a spinner, roll coating, spray coating, dip coating, etc.
  • the method include a method of forming a film formed into a pattern by a wet process or a dry process. From the viewpoint of patterning only the transparent electrode, a wet process is preferable, and a photolithography method is more preferable.
  • an opaque electrode for example, a method of forming a pattern by photolithography using a photosensitive conductive paste, a method of forming a pattern by screen printing, gravure printing, ink jet etc using a conductive paste, metal, metal composite, A method of forming a film of a complex of a metal and a metal compound, a metal alloy or the like and forming the film by a photolithography method using a resist can be mentioned.
  • the method of forming by a photolithographic method using a photosensitive conductive paste is preferable.
  • a film forming method for forming a transparent electrode dry coating is preferable and sputtering is more preferable because a thin film at the nanometer level can be easily formed.
  • a gas used for sputtering what has an inert gas as a main component is preferable, and mixed gas of argon and oxygen is more preferable.
  • a photoresist, a developer, an etchant, and a rinse agent used for etching can be arbitrarily selected and used so that a predetermined pattern can be formed without the transparent electrode being corroded.
  • the photosensitive conductive paste used to form the opaque electrode includes the above-mentioned conductive particles, an alkali-soluble resin, a dispersant, a photopolymerization initiator, a monomer having an unsaturated double bond, a photoacid generator, a thermal acid generator, A sensitizer, a pigment, a dye, an adhesion improver, a surfactant, a polymerization inhibitor, a solvent and the like can be contained as needed.
  • the photosensitive conductive paste for example, spin coating using a spinner, spray coating, roll coating, screen printing, offset printing, gravure printing, letterpress printing, flexo printing, blade coater, die coater, calendar coater, meniscus cove A method using a tar or a bar coater.
  • screen printing is preferable because it is excellent in the surface flatness of the composition film of the photosensitive conductive paste to be obtained, and the film thickness adjustment is easy by the selection of the screen plate.
  • the heating and drying apparatus may be one that heats by electromagnetic waves or microwaves, and examples thereof include an oven, a hot plate, an electromagnetic wave ultraviolet lamp, an infrared heater, a halogen heater and the like.
  • the heating temperature is preferably 50 ° C. or more, and more preferably 70 ° C. or more, from the viewpoint of suppressing the remaining of the solvent.
  • the heating temperature is preferably 130 ° C. or less, more preferably 110 ° C. or less, from the viewpoint of suppressing the deactivation of the photosensitizer.
  • the heating time is preferably 1 minute to several hours, more preferably 1 minute to 50 minutes.
  • a method of exposing and developing is preferable.
  • the unexposed area can be removed to form a desired pattern by developing the composition film of the exposed photosensitive conductive paste.
  • the exposure light preferably emits light in the ultraviolet region that matches the absorption wavelength of the photosensitive agent contained in the photosensitive conductive paste, that is, in the wavelength region of 200 nm to 450 nm.
  • a light source for obtaining such exposure light a mercury lamp, a halogen lamp, a xenon lamp, an LED lamp, a semiconductor laser, a KrF, an ArF excimer laser etc. are mentioned, for example.
  • the i-line (wavelength 365 nm) of a mercury lamp is preferable.
  • the exposure dose is preferably 50 mJ / cm 2 or more, more preferably 100 mJ / cm 2 or more, and still more preferably 200 mJ / cm 2 or more in terms of wavelength 365 nm from the viewpoint of solubility of the exposed portion in the developer.
  • an alkali developing solution As a developing solution, what does not inhibit the electroconductivity of a 1st electrode is preferable, and an alkali developing solution is preferable.
  • the alkali development include inorganic alkalis such as sodium hydroxide, potassium hydroxide, sodium carbonate, potassium carbonate, sodium silicate, sodium metasilicate and aqueous ammonia; primary amines such as ethylamine and n-propylamine; Secondary amines such as diethylamine and di-n-propylamine; tertiary amines such as triethylamine and methyl diethylamine; tetraalkyl ammonium hydroxides such as tetramethyl ammonium hydroxide (TMAH); quaternary ammonium salts such as choline Alcohol amines such as triethanolamine, diethanolamine, monoethanolamine, dimethylaminoethanol and diethylaminoethanol; pyrrole, piperidine, 1,8-diaza
  • a developing method for example, a method of spraying a developing solution on the surface of the composition film of the photosensitive conductive paste while allowing the substrate on which the composition film of the photosensitive conductive paste is formed to stand, rotate or transport the photosensitive conductive paste And a method of immersing the composition film of the photosensitive conductive paste in a developer while applying the ultrasonic wave.
  • the pattern obtained by development may be subjected to a rinse treatment with a rinse solution.
  • a rinse solution include water; aqueous solutions of alcohols such as ethanol and isopropyl alcohol; and aqueous solutions of esters such as ethyl lactate and propylene glycol monomethyl ether acetate.
  • the obtained transparent electrode or opaque electrode may be heated, preferably in air.
  • the heating temperature is preferably 100 ° C. or more, and more preferably 120 ° C. or more, from the viewpoint of sufficiently curing and improving the conductivity.
  • the heating temperature is preferably 150 ° C. or less, more preferably 140 ° C. or less, from the viewpoints of heat resistance of the transparent substrate and positional accuracy and visibility when using a thin film transparent substrate.
  • having the step of heating at a temperature of 100 ° C. or more and 150 ° C. or less is a position accuracy when using a conductive thin film transparent substrate And particularly preferred in view of visibility.
  • the method exemplified as the method of forming an opaque electrode using a photosensitive conductive paste may be mentioned.
  • the insulating layer has a pressure-sensitive adhesive layer and a second transparent substrate
  • a method of forming the pressure-sensitive adhesive layer for example, a method of transferring an adhesive onto a release liner and then transferring it to a transparent substrate (transfer method), transparent substrate Directly apply and dry the pressure-sensitive adhesive (direct printing method), co-extrusion and the like.
  • the first electrode and the second transparent substrate be attached to each other with the pressure-sensitive adhesive layer interposed therebetween.
  • defoaming is preferable. Since the surface smoothness of the second transparent substrate is improved by degassing, the positional accuracy of the first electrode and the second electrode can be further improved.
  • a degassing method methods, such as heating, pressurization, pressure reduction, are mentioned, for example.
  • the heating temperature is preferably 150 ° C. or less, more preferably 130 ° C. or less, and still more preferably 120 ° C. or less, from the viewpoint of further suppressing the thermal contraction of the transparent substrate and the adhesive layer.
  • the pressure at the time of heating and pressurizing is preferably 0.05 MPa or more, and more preferably 0.1 MPa or more from the viewpoint of degassing efficiency.
  • the pressure is preferably 2.0 MPa or less, more preferably 1.5 MPa or less, and still more preferably 1.0 MPa or less, from the viewpoint of further suppressing the bending of the substrate and the adhesive layer.
  • a second electrode is formed on the insulating layer.
  • the second electrode can be formed by the same method as the first electrode.
  • the method for producing a substrate with an electrode according to the present invention, in which the second electrode is formed on the insulating layer, is more prominent as the transparent substrate becomes thinner as compared to the method in which two or more substrates with electrodes are bonded. It is possible to suppress the positional deviation due to the flexibility of the above and improve the positional accuracy.
  • the insulating layer protects the first electrode, erosion of the developer on the first electrode in the developing step during formation of the second electrode and contact between the first electrode and equipment due to handling are suppressed. Thus, it is possible to improve the yield by suppressing defects such as wire breakage and disconnection.
  • alignment in patterning of the second electrode, alignment can be performed using the first electrode pattern already formed.
  • the first electrode pattern is detected using a camera, and the position of the first electrode pattern and the second electrode pattern is adjusted by adjusting the stage of the exposure apparatus. Deviation can be further suppressed, and position accuracy can be further improved.
  • the substrate with an electrode obtained by the manufacturing method of the present invention is difficult to be recognized visually, is excellent in positional accuracy, and can suppress moire, so it is suitable for, for example, a member for touch panel, a member for electromagnetic shielding, a member for transparent LED light, etc. It can be used for Above all, it can be suitably used as a member for a touch panel which is required to be more difficult to visually recognize the wiring electrode.
  • the materials used in each example are as follows.
  • the transmittance of the transparent substrate at a wavelength of 550 nm was measured using an ultraviolet-visible spectrophotometer (U-3310 manufactured by Hitachi High-Technologies Corporation).
  • Production Example 1 Carboxyl Group-Containing Acrylic Copolymer
  • DMEA diethylene glycol monoethyl ether acetate
  • EA ethyl acrylate
  • 2-EHMA 2-ethylhexyl methacrylate
  • St styrene
  • a mixture consisting of "AA” 0.8 g of 2,2-azobisisobutyronitrile
  • 10 g of diethylene glycol monoethyl ether acetate was added dropwise over 1 hour. After completion of the dropwise addition, the mixture was further stirred for 6 hours to carry out a polymerization reaction. Thereafter, 1 g of hydroquinone monomethyl ether was added to terminate the polymerization reaction.
  • the obtained 42 g of resin solution and 62.3 g of primary particles having a primary particle diameter of 0.4 ⁇ m are mixed and kneaded using a 3-roller EXAKT M50 (manufactured by EXAKT), and 7 g of DMEA is further added and mixed.
  • EXAKT M50 manufactured by EXAKT
  • DMEA 7 g of DMEA is further added and mixed.
  • the viscosity of the photosensitive conductive paste was 10,000 mPa ⁇ s. The viscosity was measured using a Brookfield viscometer at a temperature of 25 ° C. and a rotational speed of 3 rpm.
  • the positional deviation amount X is measured in the portion where the first electrode and the second electrode for positional accuracy evaluation shown in FIG.
  • the case where the amount of displacement was less than 10 ⁇ m was evaluated as A, and the case where the amount of displacement was 10 ⁇ m or more was evaluated as B.
  • the pattern for position accuracy evaluation was a circle with a diameter of 2 mm, and the width of the pattern was 240 ⁇ m.
  • Example 1 ⁇ Formation of first electrode (opaque electrode)>
  • the photosensitive conductive paste obtained in Production Example 2 was printed on a transparent substrate (a-1) by screen printing so as to have a thickness of 1 ⁇ m after drying, and dried at 100 ° C. for 10 minutes.
  • An exposure apparatus (PEM-6M; manufactured by Union Optics Co., Ltd.) was used for exposure at an exposure dose of 500 mJ / cm 2 (converted to a wavelength of 365 nm) through an exposure mask having a pattern of the shape shown in FIGS.
  • the mask opening width was 3 ⁇ m.
  • the insulating composition obtained by Production Example 3 is spin-coated at 1000 rpm for 5 seconds using a spin coater on a substrate on which the first electrode is formed, and then prebaked at 100 ° C. for 2 minutes using a hot plate, A pre-bake film was produced. Using a parallel light mask aligner, an ultrahigh pressure mercury lamp was used as a light source, and the pre-bake film was exposed through a desired exposure mask to form an insulating layer. The thickness of the insulating layer was 1 ⁇ m.
  • a second electrode (opaque electrode) was formed by the same operation as the first electrode, to obtain a substrate with an electrode.
  • the exposure mask one having a pattern of the shape shown in FIG. 7 and FIG. 9 was used. The results evaluated by the above-mentioned method are shown in Table 1.
  • Example 2 By the same operation as in Example 1, the first electrode (opaque electrode) and the insulating layer were formed on the transparent substrate (a-1).
  • Example 3 The first electrode (transparent electrode) was formed on the transparent substrate (a-1) by the same operation as the method of forming the second electrode (transparent electrode) in Example 2. However, as the exposure mask, one having a pattern of the shape shown in FIG. 7 and FIG. 8 was used. Furthermore, by the same operation as in Example 1, an insulating layer and a second electrode (opaque electrode) were formed to obtain a substrate with an electrode. The results evaluated by the above-mentioned method are shown in Table 1.
  • Example 4 A first electrode (opaque electrode), an insulating layer, and a second electrode (opaque electrode) were formed on the transparent substrate (a-2) in the same manner as in Example 1 to obtain a substrate with an electrode.
  • the results evaluated by the above-mentioned method are shown in Table 1.
  • Example 5 The first electrode (opaque electrode) was formed on the transparent substrate (a-1) in the same manner as in Example 1.
  • An adhesive sheet “Panaclean” registered trademark) PD-R5 (Panac) is made to face the first electrode of the substrate on which the first electrode is formed and the second transparent substrate (a-1) separately prepared.
  • Inc. Thiickness: 25 ⁇ m
  • bonding was carried out under the conditions of heating temperature: 50 ° C., pressure: 0.2 MPa, to form an insulating layer consisting of an adhesive layer and a second transparent substrate.
  • a second electrode (opaque electrode) was formed on the second transparent substrate by the same operation as in Example 1. The results evaluated by the above-mentioned method are shown in Table 1.
  • Example 6 An insulating layer comprising a first electrode (opaque electrode), an adhesive layer and a second transparent substrate in the same manner as in Example 5 with the first transparent substrate and the second transparent substrate as (a-2) The second electrode (opaque electrode) was formed to obtain a substrate with an electrode.
  • the results evaluated by the above-mentioned method are shown in Table 1.
  • Example 2 A substrate with an opaque electrode formed on the transparent substrate (a-1) by the same operation as in Example 1, and a transparent substrate by the same operation as in Example 2 on the transparent substrate (a-1) Substrates with a transparent electrode on which electrodes were formed were respectively produced.
  • An adhesive sheet "Panaclean” (registered trademark) PD-R5 (Panak Co., Ltd.) is made to face the surface of the substrate with opaque electrode on which the opaque electrode is formed and the surface of the substrate with transparent electrode on which the transparent electrode is not formed.
  • the first electrode (transparent electrode) was formed on the transparent substrate (a-1) by the same operation as the method of forming the second electrode (transparent electrode) in Example 2. However, as the exposure mask, one having a pattern of the shape shown in FIG. 4 and FIG. 5 was used. A pressure-sensitive adhesive sheet "Pana Clean” (Pana Clean) is made to face the surface of the substrate on which the first electrode (transparent electrode) is formed, on which the first electrode is not formed, and the second transparent substrate (a-1) separately prepared.
  • Example 5 A substrate with an electrode was obtained in the same manner as in Example 1 except that the first electrode and the second electrode were formed at a heating temperature of 160 ° C. after forming the electrode pattern.
  • the results evaluated by the above-mentioned method are shown in Table 1.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Thermal Sciences (AREA)
  • Position Input By Displaying (AREA)
  • Laminated Bodies (AREA)

Abstract

L'invention concerne un procédé de fabrication d'un substrat sur lequel sont formées des électrodes. La précision de position est excellente même lorsqu'un substrat transparent à film mince qui est difficile à voir est utilisé, les différences de transmittance et le moiré peuvent être supprimés, et le rendement est élevé. Ledit procédé de fabrication d'un substrat sur lequel sont formées des électrodes dans lequel une première électrode, une couche isolante, et une seconde électrode sont formées sur un premier substrat transparent ayant une épaisseur inférieure ou égale à 200 µm comprend : une étape de formation de la première électrode sur au moins une surface du premier substrat transparent ; une étape de formation de la couche isolante sur la surface sur laquelle est formée la première électrode du substrat transparent ; et une étape de formation de la seconde électrode sur la couche isolante, la première électrode et/ou la seconde électrode étant opaques.
PCT/JP2018/033780 2017-09-26 2018-09-12 Procédé de fabrication d'un substrat sur lequel sont formées des électrodes WO2019065234A1 (fr)

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JP2018549283A JPWO2019065234A1 (ja) 2017-09-26 2018-09-12 電極付き基板の製造方法
KR1020197037539A KR20200058330A (ko) 2017-09-26 2018-09-12 전극 부착 기판의 제조 방법
CN201880062226.0A CN111133408A (zh) 2017-09-26 2018-09-12 带电极基板的制造方法

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JP2014209332A (ja) * 2013-03-27 2014-11-06 富士フイルム株式会社 導電シートおよびその製造方法、タッチパネル
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