WO2019065044A1 - 蓄電モジュール - Google Patents

蓄電モジュール Download PDF

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Publication number
WO2019065044A1
WO2019065044A1 PCT/JP2018/031682 JP2018031682W WO2019065044A1 WO 2019065044 A1 WO2019065044 A1 WO 2019065044A1 JP 2018031682 W JP2018031682 W JP 2018031682W WO 2019065044 A1 WO2019065044 A1 WO 2019065044A1
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WIPO (PCT)
Prior art keywords
terminal
electrode terminal
storage element
positive electrode
negative electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2018/031682
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English (en)
French (fr)
Inventor
茂生 森野
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Taiyo Yuden Co Ltd
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Taiyo Yuden Co Ltd
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Filing date
Publication date
Application filed by Taiyo Yuden Co Ltd filed Critical Taiyo Yuden Co Ltd
Priority to CN201880062255.7A priority Critical patent/CN111133544B/zh
Priority to US16/650,322 priority patent/US20200219666A1/en
Priority to KR1020207011480A priority patent/KR20200055080A/ko
Publication of WO2019065044A1 publication Critical patent/WO2019065044A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
    • H01G11/74—Terminals, e.g. extensions of current collectors
    • H01G11/76—Terminals, e.g. extensions of current collectors specially adapted for integration in multiple or stacked hybrid or EDL capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
    • H01G11/10—Multiple hybrid or EDL capacitors, e.g. arrays or modules
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
    • H01G11/22—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/04—Mountings specially adapted for mounting on a chassis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/26—Structural combinations of electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices with each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H01M50/502—Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing
    • H01M50/503—Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing characterised by the shape of the interconnectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H01M50/502—Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing
    • H01M50/509—Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing characterised by the type of connection, e.g. mixed connections
    • H01M50/51—Connection only in series
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H01M50/502—Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing
    • H01M50/514—Methods for interconnecting adjacent batteries or cells
    • H01M50/516—Methods for interconnecting adjacent batteries or cells by welding, soldering or brazing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H01M50/543—Terminals
    • H01M50/552—Terminals characterised by their shape
    • H01M50/559—Terminals adapted for cells having curved cross-section, e.g. round, elliptic or button cells
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistors by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10037—Printed or non-printed battery
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Definitions

  • the present invention relates to a storage module in which a plurality of storage elements each having a positive electrode terminal and a negative electrode terminal are connected in series.
  • a storage element such as an electric double layer capacitor (EDLC) has a positive electrode terminal and a negative electrode terminal, and has a rated voltage of about 2.5 V to 3 V as a single body. Therefore, when the rated voltage of the storage element alone is insufficient for the required voltage, as described in Patent Document 1, a plurality of storage elements are connected in series on the printed circuit board, and the housing is It is often used as a stored power storage module.
  • EDLC electric double layer capacitor
  • FIG. 5 is an example of such a storage module, and is a perspective view of the storage module in which two storage elements are mounted on a printed circuit board.
  • FIG. 6 is a side view showing a soldered state of the storage element in the storage module of FIG.
  • the storage module shown in FIG. 5 has the first storage element 2 and the second storage element 3 mounted on one surface of the printed circuit board 4.
  • the positive electrode terminal and the negative electrode terminal of the storage element are inserted through the through holes provided in the printed circuit board 4 and fixed to the other surface of the printed circuit board 4 by the solder 7.
  • the positive electrode terminal and the negative electrode terminal located at both ends of the printed circuit board 4 are respectively drawn from the through holes of the printed circuit board 4 and used as the external terminals 5 of the storage module 1.
  • the positive electrode terminal and the negative electrode terminal of the storage element located inside the external terminal 5 are electrically connected by the metal pattern formed on the printed circuit board 4.
  • the terminal located inside the external terminal 5 is cut and soldered to a length slightly projecting from the printed circuit board 4 in order to suppress the length projecting from the other surface of the printed circuit board 4 Ru.
  • the height of the soldered portion can be suppressed to the height of the filled solder 7.
  • the present invention has been made in view of such circumstances, and it is an object of the present invention to provide a storage module in which the soldered state of a terminal of a storage element can be easily confirmed visually.
  • the present invention includes the following aspects (1) to (3).
  • a storage module in which a plurality of storage elements each having a positive electrode terminal and a negative electrode terminal are electrically connected in series, wherein the plurality of storage elements are disposed on one surface of a substrate, the positive electrode The terminal and the negative electrode terminal are inserted through the through holes provided in the substrate and soldered to the other surface of the substrate, and among the positive electrode terminal and the negative electrode terminal, they are electrically connected to the negative electrode terminal of the other storage element.
  • the tip of the negative electrode terminal electrically connected to the positive electrode terminal connected to the positive electrode terminal and the positive electrode terminal of the other storage element is bent at the other surface side of the substrate, and protrudes from the solder and is visible. I assume.
  • the tip portion is bent so as not to protrude from the outer edge of the substrate in a plan view.
  • the electrical storage module which can confirm the soldering state of the terminal of an electrical storage element easily visually can be provided.
  • FIG. 1 is a perspective view of the storage module 1 of the embodiment.
  • the storage module 1 of the embodiment has a first storage element 2 having a positive electrode terminal and a negative electrode terminal and a second storage element 3 mounted in series on a printed board 4 as a substrate and integrated.
  • An electric double layer capacitor (EDLC) can be used for the 1st, 2nd electrical storage elements 2 and 3. For example, two EDLCs of the same rated voltage are used.
  • First storage element 2 and second storage element 3 are arranged side by side on one side of printed circuit board 4.
  • the printed board 4 is provided with through holes through which positive and negative terminals of the first and second storage elements 2 and 3 are inserted, and each terminal is fixed to the other surface of the printed board 4 by the solder 7. Ru.
  • the positive electrode terminal of the first storage element 2 and the negative electrode terminal of the second storage element 3 are drawn out from the through hole of the printed board 4 and used as the external terminal 5 of the storage module 1. Further, the negative terminal of the first storage element 2 located inside the external terminal 5 and the positive terminal of the second storage element 3 are the terminals 6 electrically connected by the metal pattern of the printed board 4, The first storage element 2 and the second storage element 3 are connected in series by electrically connecting the negative electrode terminal of the storage element 2 of 1 and the positive electrode terminal of the second storage element 3.
  • FIG. 2 is a view showing the soldered state of the storage element, and shows the soldered portion of the terminal 6 of the second storage element 3 from the side.
  • FIG. 3 is a view schematically showing the state of the tip portion by removing the solder 7 from the soldered portion of the terminal 6.
  • the terminal 6 of the embodiment protrudes to the other surface of the printed circuit board 4, and the tip of the protruding terminal 6 is bent substantially parallel along the other surface of the printed circuit board 4. There is.
  • the soldering is performed at the bent portion of the terminal 6, and as shown in FIGS. 1 and 2, the tip of the terminal 6 protrudes from the solder 7 embedded in the printed circuit board 4 in the bent direction.
  • the states of the terminals 6 and the solder 7 in the soldered portion can be confirmed from the appearance, the quality of the soldering can be easily judged visually. In addition, if a defective soldering area is found, correction using a soldering iron or the like can be easily performed.
  • the tip of the terminal 6 is bent along the other surface of the printed circuit board 4, so even if the length of the terminal 6 is a length projecting from the solder 7, the tip of the terminal 6 is It projects along the other side and does not project in the thickness direction.
  • the height of the soldered portion of the terminal 6 is about the height of the solder 7 embedded in the printed circuit board 4 as in the conventional case.
  • the tip end of the terminal 6 has a length that fits in the plane of the printed circuit board 4 without protruding from the outer edge of the printed circuit board 4 in plan view. Therefore, even if the length of the terminal 6 protruding from the solder 7 is small, the space required is small and the influence on the miniaturization of the storage module is small.
  • the substrate 4 is held between the main body of the storage element 3 and the terminal 6 by bending, which stabilizes and improves the efficiency of the soldering operation. be able to.
  • the bending process of the tip end portion of the terminal 6 may be performed after inserting the terminal 6 into the through hole of the printed circuit board 4, and a storage element having the terminal 6 with the bent end portion is prepared.
  • the bent terminal 6 may be inserted into the through hole.
  • FIGS. 1 and 2 illustrate the exposed state of the soldered portion of the storage element for the purpose of explanation, the terminal 6 and the solder 7 or the like may be used as an insulating material for the purpose of preventing a short circuit and protecting the soldered portion.
  • the storage module 1 may be housed in a housing or the like.
  • FIG. 4 is a perspective view of a storage module 1 according to another embodiment of the present invention.
  • Another embodiment is one in which three storage elements are mounted in series on the printed circuit board 4 and integrated, for example, a storage module in which three EDLCs of the same rated voltage are connected in series.
  • the positive electrode terminal of the first storage element 2 and the negative electrode terminal of the second storage element 3 are drawn out from the through hole of the printed board 4 and used as the external terminal 5 of the storage module 1.
  • the negative terminal of the first storage element 2 disposed inside the external terminal 5, the positive terminal of the second storage element 3, and the positive terminal and the negative terminal of the third storage element 8 are other adjacent storage elements.
  • the first to third storage elements 2, 3 and 8 are connected in series by the metal pattern provided on the printed circuit board 4 and the terminal 6 electrically connected to the positive electrode terminal or the negative electrode terminal.
  • the tip of the terminal 6 protruding from the other surface of the printed circuit board 4 is substantially along the other surface of the printed circuit board 4. It is bent in parallel and soldered to the printed circuit board 4 at the bent portion. Since the terminal 6 is bent in the same direction and the tip of the terminal 6 protrudes in the direction bent from the solder 7 placed on the printed circuit board 4 and is visible, it is easy to find the goodness of the soldering Can.
  • the polarity of the terminal 6 of the third storage element 8 can be determined even after the bent terminal 6 is inserted into the through hole of the printed circuit board 4.
  • the bending direction of the terminal 6 inserted into the printed circuit board is 180 degrees opposite. It is easy to find.
  • the storage module of the present invention can visually determine the quality of the soldering, the soldering workability is improved. Can improve the reliability of the soldered portion.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Connection Of Batteries Or Terminals (AREA)
  • Electric Double-Layer Capacitors Or The Like (AREA)
  • Battery Mounting, Suspending (AREA)

Abstract

【課題】複数の蓄電素子が電気的に直列に接続された蓄電モジュールにおいて、蓄電素子の端子のはんだ付け状態を、目視で容易に確認することができる蓄電モジュールを提供する。【解決手段】複数の蓄電素子は基板の一方の面上に配置され、正極端子と負極端子は基板に設けられた貫通孔を挿通し、基板の他方の面にはんだ付けされる。正極端子と負極端子のなかで、他の蓄電素子の負極端子と電気的に接続される正極端子、および他の蓄電素子の正極端子と電気的に接続される負極端子は、基板の他方の面側で折り曲げられ、先端部をはんだから突出させ目視可能とする。外観から端子のはんだ付け部を確認できるので、はんだ付けの良否を容易に 確認できる。

Description

蓄電モジュール
本発明は、正極端子と負極端子を有する蓄電素子を、複数個直列に接続した蓄電モジュールに関する。
電気二重層キャパシタ（Electric　double　layer　capacitor：ＥＤＬＣ）などの蓄電素子は、正極端子と負極端子を有し、単体で通常２．５Ｖ～３Ｖ程度の定格電圧を持つ。このため、必要とされる電圧に対して蓄電素子単体の定格電圧が不足する場合は、特許文献１に記載されるように、プリント基板上に複数の蓄電素子を直列に接続し、筐体に収納した蓄電モジュールとして使用することが多い。　
図５はこのような蓄電モジュールの例であり、プリント基板に２個の蓄電素子が実装された蓄電モジュールの斜視図である。図６は図５の蓄電モジュールにおける蓄電素子のはんだ付け状態を、側面から示した図である。図５に示す蓄電モジュールは、プリント基板４の一方の面に第１の蓄電素子２と第２の蓄電素子３が搭載されている。蓄電素子の正極端子と負極端子はプリント基板４に設けられた貫通孔を挿通し、プリント基板４の他方の面にはんだ７で固定される。プリント基板４の両端に位置する正極端子と負極端子は、それぞれプリント基板４の貫通孔から引き出され、蓄電モジュール１の外部端子５として利用される。　
一方、外部端子５の内側に位置する蓄電素子の正極端子と負極端子は、プリント基板４に形成された金属パターンにより電気的に接続される。このとき、外部端子５の内側に位置する端子は、プリント基板４の他方の面から突出する長さを抑制するため、プリント基板４から僅かに突出する程度の長さにカットされてはんだ付けされる。端子の長さを短くすることにより、はんだ付け部の高さは盛られたはんだ７の高さに抑えられる。
実開昭５８－１５３４３号公報
しかしながら、はんだ７の量が多くなる場合、あるいは端子の長さが短くカットされる場合、端子の先端部は図５、６に示すようにはんだ７に埋もれた状態となり、外観からは確認できない。このため、端子のはんだ付け状態を目視で確認することができず、はんだ付けの不具合を発見することが困難となる。本発明はこのような事情に鑑みてなされたものであり、蓄電素子の端子のはんだ付け状態を、目視で容易に確認することができる蓄電モジュールを提供することを目的とする。
本発明は以下の（１）から（３）の態様を含む。（１）正極端子と負極端子とをそれぞれ有する複数の蓄電素子が、電気的に直列に接続された蓄電モジュールであって、前記複数の蓄電素子は基板の一方の面上に配置され、前記正極端子と負極端子は前記基板に設けられた貫通孔を挿通し、前記基板の他方の面にはんだ付けされており、前記正極端子と負極端子のなかで、他の蓄電素子の負極端子と電気的に接続される正極端子および他の蓄電素子の正極端子と電気的に接続される負極端子の先端部は、前記基板の他方の面側で折り曲げられ、かつはんだから突出し目視可能であることを特徴とする。（２）（１）において、前記先端部は、前記基板の他方の面に沿って折り曲げられていることを特徴とする。（３）（１）または（２）において、前記先端部は、平面視で前記基板の外縁から突出しないように折り曲げられていることを特徴とする。
本発明によれば、蓄電素子の端子のはんだ付け状態を、目視で容易に確認することができる蓄電モジュールを提供することができる。
実施形態の蓄電モジュールの斜視図である。 蓄電素子のはんだ付け状態を示す図である。 折り曲げられた端子を模式的に示す図である。 他の実施形態の蓄電モジュールの斜視図である。 従来の蓄電モジュールの斜視図である。 蓄電素子のはんだ付け状態を示す図である。
以下、本発明の蓄電モジュールの実施形態を、図を参照して説明する。　
図１は実施形態の蓄電モジュール１の斜視図である。実施形態の蓄電モジュール１は、正極端子と負極端子を有する第１の蓄電素子２と第２の蓄電素子３を、基板であるプリント基板４上に直列に実装し一体化したものである。第１、第２の蓄電素子２、３は、電気二重層キャパシタ（ＥＤＬＣ）を用いることができ、例えば同じ定格電圧のＥＤＬＣを２個用いる。　
第１の蓄電素子２と第２の蓄電素子３は、プリント基板４の一方の面に並んで配置される。プリント基板４には第１、第２の蓄電素子２、３の正極端子と負極端子を挿通する貫通孔が設けられており、各端子はプリント基板４の他方の面に、はんだ７で固定される。　
第１の蓄電素子２の正極端子と第２の蓄電素子３の負極端子は、プリント基板４の貫通孔から引き出され、蓄電モジュール１の外部端子５として用いられる。また、外部端子５の内側に位置する第１の蓄電素子２の負極端子と第２の蓄電素子３の正極端子は、プリント基板４の金属パターンにより電気的に接続される端子６であり、第１の蓄電素子２の負極端子と第２の蓄電素子３の正極端子が電気的に接続されることにより、第１の蓄電素子２と第２の蓄電素子３は直列に接続される。　
図２は蓄電素子のはんだ付け状態を示す図であり、第２の蓄電素子３の端子６のはんだ付け部を側面から示している。図３は端子６のはんだ付け部からはんだ７を取り除き、先端部の状態を模式的に示した図である。実施形態の端子６は、図２、３に示すように、プリント基板４の他方の面に突出し、突出した端子６の先端部はプリント基板４の他方の面に沿って略平行に折り曲げられている。はんだ付けは端子６の折り曲げられた部分で行われ、図１、図２に示されるように、端子６の先端部はプリント基板４に盛られたはんだ７から折り曲げられた方向に突出する。はんだ付け部の端子６とはんだ７の状態を外観から確認することができるので、目視によりはんだ付けの良否を容易に判断することができる。また、はんだ付け不良部を見つけた場合、はんだごてなどによる修正も容易に行える。　
端子６の先端部は、プリント基板４の他方の面に沿って折り曲げられているので、端子６の長さを、はんだ７から突出する長さとしても、端子６の先端部はプリント基板４の他方の面に沿って突出し、厚さ方向には突出しない。端子６のはんだ付け部の高さは、従来と同様プリント基板４に盛られたはんだ７の高さ程度である。また、平面的には端子６の先端部は平面視でプリント基板４の外縁から突出することなく、プリント基板４の平面内に収まる長さとされている。このため、端子６をはんだ７から突出する長さにしても、必要とするスペースは僅かであり、蓄電モジュールの小型化に与える影響は小さい。　
また、はんだ付け作業の前に、端子６の先端部は折り曲げられているので、折り曲げることで基板４が蓄電素子３の本体と端子６に挟まれることで安定し、はんだ付け作業の効率を上げることができる。端子６の先端部の折り曲げ加工は、プリント基板４の貫通孔に端子６を挿通した後に行ってもよく、先端部が折り曲げ加工された端子６を有する蓄電素子を準備して、プリント基板４の貫通孔に折り曲げ加工された端子６を挿通してもよい。　なお、図１、２では説明のために蓄電素子のはんだ付け部が露出した状態を図示しているが、短絡防止やはんだ付け部の保護のために、端子６やはんだ７などを、絶縁材料で覆ってもよく、また蓄電モジュール１を筐体などに収納してもよい。　
図４は、本発明の他の実施形態の蓄電モジュール１の斜視図である。他の実施形態は、プリント基板４上に３個の蓄電素子を直列に実装し一体化したものであり、例えば同じ定格電圧のＥＤＬＣを３個直列に接続した蓄電モジュールである。他の実施形態においては、第１の蓄電素子２の正極端子と第２の蓄電素子３の負極端子は、プリント基板４の貫通孔から引き出され、蓄電モジュール１の外部端子５として用いられる。外部端子５の内側に配置された第１の蓄電素子２の負極端子、第２の蓄電素子３の正極端子、および第３の蓄電素子８の正極端子と負極端子は、隣接する他の蓄電素子の正極端子または負極端子と電気的に接続される端子６であり、プリント基板４に設けられた金属パターンにより、第１から第３の蓄電素子２、３、８は直列に接続される。　
他の実施形態においても端子６のはんだ付け部は図２、３に示されるように、プリント基板４の他方の面から突出した端子６の先端部がプリント基板４の他方の面に沿って略平行に折り曲げられ、折り曲げられた部分でプリント基板４にはんだ付けされている。端子６は同じ方向に折り曲げられており、端子６の先端部はプリント基板４に盛られたはんだ７から折り曲げられた方向に突出しており目視可能であるので、はんだ付けの良否を容易に見つけることができる。　
第３の蓄電素子８に、予め折り曲げ加工された端子６を有する蓄電素子を準備し、プリント基板４の貫通孔に挿通する場合、端子６の折り曲げ方向を正極端子と負極端子に対して決めておけば、プリント基板４の貫通孔に折り曲げ加工された端子６を挿通した後でも、第３の蓄電素子８の端子６の極性を判別できる。例えば図４において、第３の蓄電素子８の端子６をプリント基板４に取り付ける際、誤って極性を逆に挿通した場合、プリント基板に挿通した端子６の折り曲げ方向は、１８０度逆の向きになるので容易に見つけることが可能である。　
直列に接続する蓄電素子の数が多くなれば、端子６のはんだ付け箇所の数は増えるが、本発明の蓄電モジュールは目視によりはんだ付けの良否を判定できるので、はんだ付けの作業性を向上させることができ、はんだ付け部の信頼性を高めることができる。　
以上、本発明の好ましい実施形態について詳述したが、本発明は上述した実施形態に限定されるものではなく、特許請求の範囲に記載された本発明の要旨の範囲内において、種々の変形、変更が可能である。
１　　　　蓄電モジュール２　　　　第１の蓄電素子３　　　　第２の蓄電素子４　　　　プリント基板５　　　　外部端子６　　　　端子７　　　　はんだ８　　　　第３の蓄電素子

Claims (3)

  1. 正極端子と負極端子とをそれぞれ有する複数の蓄電素子が、電気的に直列に接続された蓄電モジュールであって、　前記複数の蓄電素子は基板の一方の面上に配置され、前記正極端子と負極端子は前記基板に設けられた貫通孔を挿通し、前記基板の他方の面にはんだ付けされており、　前記正極端子と負極端子のなかで、他の蓄電素子の負極端子と電気的に接続される正極端子および他の蓄電素子の正極端子と電気的に接続される負極端子の先端部は、前記基板の他方の面側で折り曲げられ、かつはんだから突出し目視可能であることを特徴とする蓄電モジュール。
  2. 前記先端部は、前記基板の他方の面に沿って折り曲げられていることを特徴とする請求項１に記載の蓄電モジュール。
  3. 前記先端部は、平面視で前記基板の外縁から突出しないように折り曲げられていることを特徴とする請求項１または２に記載の蓄電モジュール。
PCT/JP2018/031682 2017-09-26 2018-08-28 蓄電モジュール Ceased WO2019065044A1 (ja)

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