WO2019057962A1 - Dispositif thermoélectrique, notamment pour moyen de climatisation d'un véhicule automobile - Google Patents

Dispositif thermoélectrique, notamment pour moyen de climatisation d'un véhicule automobile Download PDF

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Publication number
WO2019057962A1
WO2019057962A1 PCT/EP2018/075783 EP2018075783W WO2019057962A1 WO 2019057962 A1 WO2019057962 A1 WO 2019057962A1 EP 2018075783 W EP2018075783 W EP 2018075783W WO 2019057962 A1 WO2019057962 A1 WO 2019057962A1
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WO
WIPO (PCT)
Prior art keywords
spring force
thermoelectric
substrate
thermoelectric device
thermal interaction
Prior art date
Application number
PCT/EP2018/075783
Other languages
German (de)
English (en)
Inventor
Jürgen Grünwald
Michael Moser
Thomas PFADLER
Joachim Treier
Siegmar THISLER
Original Assignee
Mahle International Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mahle International Gmbh filed Critical Mahle International Gmbh
Publication of WO2019057962A1 publication Critical patent/WO2019057962A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/81—Structural details of the junction
    • H10N10/813—Structural details of the junction the junction being separable, e.g. using a spring
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/023—Mounting details thereof

Definitions

  • thermoelectric device in particular for an air conditioning system of a motor vehicle, as well as an air conditioning device with at least one such thermoelectric device.
  • Motor vehicles have a variety of surfaces in the vehicle interior, which strongly heat the vehicle interior due to their high surface temperature when the vehicle is exposed to prolonged period of intense sunshine. Said surfaces must therefore be initially cooled at least superficially by an air conditioning system of the motor vehicle in order to produce acceptable environmental conditions for the occupants of the motor vehicle. It is therefore desirable to have a technology which, even in the first few seconds after the air-conditioning system has been put into operation, causes a rapid cooling of the surfaces of the vehicle interior.
  • the cooling of the interior is accomplished exclusively by means of evaporative cooling by transfer of cold air flowing into the interior air. Warm surfaces that radiate into the interior are thus only gradually cooled by convective transfer of heat to the flowing air.
  • DE 195 03 291 C2 discloses a heating-cooling mat for a vehicle seat. This comprises an air conditioning mat, in which a plurality of Peltier elements are arranged, which can be connected to the power supply to an electrical system of a motor vehicle.
  • thermoelectric generator having a thermoelectric substrate and a plurality of thermocouples, each thermocouple having a first thermoelectric conductor of a first thermoelectric active material and a second thermoelectric conductor of a second thermoelectric active material.
  • thermoelectric element which comprises electrically conductive threads, thread tufts or filaments. These are formed by a carrier in the form of conductive strands.
  • EP 1 340 060 B1 deals with a method for producing thermoelectric converters with a plurality of thermoelectric elements arranged in series. These are formed by interweaving electrically conductive wires of two different materials, arranged in parallel and alternately, with wires of electrically insulating material.
  • a disadvantage of the use of conventional Peltier elements for the active cooling of a vehicle interior proves that they are not suitable for cooling large surfaces.
  • thermoelectric device which has a large surface area and yet can be assembled easily, in particular automatically.
  • thermoelectrically active elements of a thermoelectric device which typically comprise a p- or n-doped material
  • thermoelectric device typically comprise a p- or n-doped material
  • an electrically conductive spring force device on a substrate.
  • This allows a simple and automated assembly of a large number of thermoelectric elements. After mounting in the respective spring force device, this exerts a spring force on the relevant thermoelectric element, so that it is stably held on the substrate.
  • any occurring thermomechanical stresses can be compensated by the respective spring force device, so that any malfunctions caused by said thermo-mechanical stresses can be avoided.
  • thermoelectric devices are also designed to be electrically conductive, they are not only used as fastening means for the thermoelectric elements, but also act as an electrical connection for the respective, held by the spring force device thermoelectric element. This facilitates the electrical Wiring of the thermoelectric elements.
  • a thermoelectric device can be produced with a large surface area.
  • thermoelectric device comprises a substrate on which at least two thermoelectric elements are arranged.
  • the at least two thermoelectric elements are each fastened to the substrate by means of a spring force device arranged on the substrate made of an electrically conductive material.
  • the electrically conductive material is preferably a metal, particularly preferably copper or a copper alloy.
  • the spring force devices exert spring force on the respective thermoelectric element, so that it is mechanically clamped in the spring force device and at the same time electrically connected to the spring force device.
  • the at least two spring force devices in turn are electrically connected to each other by means of a suitable electrical conduction path.
  • the electrical conduction path may be formed by a suitable electrical conductor.
  • the electrical conduction path comprises at least one thermal interaction zone, which is set up for thermal coupling to the environment of the thermoelectric device. Said thermal interaction zone can thus function either as a hot side or cold side of the thermoelectric device.
  • the spring force device has two spring force elements, between which sandwiched the thermoelectric element is clamped. This measure allows a stable fixation of the thermoelectric element in the spring force device. At the same time, a simple mounting of the thermoelectric element on the spring force device is made possible.
  • at least one spring force element of at least one spring force device is biased against the thermoelectric element held by this spring force device. In this way, thermo-mechanical stresses can be particularly effectively prevented. This preferably applies to both spring force elements of at least one spring force device, particularly preferably to several or all of the spring force devices present in the thermoelectric device with their respective spring force elements.
  • thermoelectric element with its two end faces on each one of the two spring force elements.
  • the two end sides may extend transversely, preferably orthogonally, to an upper side or lower side of the substrate.
  • a particularly stable fixation of the thermoelectric element is achieved at the spring force device.
  • an advantageous, end-side electrical contacting of the thermoelectric elements is possible.
  • At least one electrical conduction path connects a first spring force element of a first spring force device, which exerts spring force on a first thermoelectric element, with a second spring force element of a second spring force device, which exerts spring force on a second thermoelectric element.
  • the electrical connection between the two spring force devices is realized such that the thermal interaction zone of the electrical line path is arranged electrically between the two spring force devices.
  • This measure allows a particularly simple electrical wiring of the individual thermoelectric elements to one another, in which a hot or cold side of the thermoelectric device is formed between each two thermoelectric elements.
  • a first spring force element of at least one spring force device is electrically connected to an interaction zone forming the hot side of the thermoelectric device.
  • a second spring force element of the same spring force device in this embodiment is electrically connected to an interaction zone forming the cold side of the thermoelectric device.
  • At least one thermal interaction zone is arranged on an upper side of the substrate and at least one further thermal interaction zone is arranged on an underside of the substrate. In this way, the top and the bottom can be used to form the hot and cold sides of the thermoelectric device, respectively.
  • thermoelectric elements are arranged on the upper side or, alternatively, on the underside of the substrate.
  • This further development variant allows an assembly of all thermoelectric elements in the respective spring force devices by a worker or automatically from the same side, ie in particular either from above or from below.
  • at least one spring force device with an associated thermoelectric element on an upper side of the substrate and at least one further spring force device with an associated thermoelectric element are arranged on an underside of the substrate.
  • This further development variant with a two-sided arrangement of the thermoelectric elements on the substrate, ie both on its upper side and on its lower side makes particularly effective use of the installation space provided by the substrate for the attachment of the thermoelectric elements.
  • At least one spring force element has a substantially L-shaped geometry with a first leg and an angular, preferably rectangular, protruding from the first leg second leg.
  • the first leg is mounted on the substrate.
  • the second leg exerts spring force on the relevant thermoelectric element.
  • the two legs can be formed integrally with each other.
  • the spring force element is formed in one piece or in one piece.
  • At least one opening is formed in the substrate, through which the electrical conduction path for electrically connecting two thermal interaction zones is led together.
  • a plurality of such apertures are provided in the substrate in order to form an electrical series connection of the thermoelectric elements in this way. This allows a simple way of establishing an electrical connection between the arranged on the top and bottom thermal interaction zones.
  • the electrical conduction path can be formed at least in the region of the aperture as an electrical circular conductor.
  • the respective provided in the substrate breakthrough can be provided with a small diameter, so that only little space is needed.
  • the spring force devices and the electrical conduction paths are alternately electrically connected in series with respective thermal interaction zones, the thermal interaction zones of said series electrical circuit being alternately referred to as Hot side and act as a cold side.
  • the thermal interaction zones of said series electrical circuit being alternately referred to as Hot side and act as a cold side.
  • At least one thermal interaction zone can be formed like a pad. This development allows a planar coverage of the substrate with the thermal interaction zones.
  • the thermal interaction zones as a cover plate or cover layer of an electrically conductive material, preferably of a metal, most preferably made of copper, which partially covers the substrate, in particular the top or bottom of the substrate.
  • a plurality of interaction zones are arranged on the upper side and, alternatively or additionally, on the underside of the substrate, in each case at a distance from one another. An unwanted electrical short circuit between two adjacent interaction zones can be avoided in this way.
  • thermoelectric device with particularly high efficiency can be realized when the thermal interaction zones cover at least 80%, preferably at least 90%, most preferably at least 95% of each of the hot side and / or the cold side.
  • the thermoelectric elements may be secured by means of an electrically insulating adhesive on the top or bottom of the substrate. This ensures a durable and stable attachment of the thermoelectric elements to the substrate, even under the influence of external mechanical shocks or shocks.
  • the spring force elements consist of a metal, preferably of copper or of a copper alloy, or comprise an electrically conductive material, preferably copper or a copper alloy.
  • the substrate comprises a first substrate body and a second substrate body, between which, preferably sandwiched, a thermal insulation is arranged.
  • at least one thermal interaction zone is arranged on an upper side of the first substrate body facing away from the second substrate body.
  • at least one thermal interaction zone is arranged on an underside of the second substrate body facing away from the first substrate body.
  • the at least one, arranged on the top thermal interaction zone serves as a cold side de thermoelectric device, whereas the disposed on the bottom, at least one thermal interaction zone can act as a hot side, or vice versa.
  • the at least one electrical conduction path is formed at least in sections by a conductor track arranged in or on the substrate, which preferably consists of an electrically insulating material.
  • the substrate is a printed circuit board or comprises such a printed circuit board. This makes it possible to use in the thermoelectric device so-called PCB technology for electrical and electronic circuits. In this way it is possible to arrange electrical capacitors and other electrical / electronic components in a manner analogous to the thermoelektnschen elements on the circuit board and fasten there. It is conceivable, in particular, to use for electrical / electronic components, in particular for electrical capacitors, also the spring force elements essential to the invention for fastening.
  • thermoelektnschen element preferably with several thermoelektnschen elements, most preferably with all thermoelektnschen elements, the thermoelektnschen device.
  • thermoelektnschen device it is particularly possible to provide an electronic control for driving the thermoelektnschen elements directly on the substrate, in particular on the circuit board. This simplifies the construction of the thermoelektnschen device considerably, resulting in turn space and cost advantages.
  • the electronic circuitry may include an electronic control unit for controlling the at least one thermoelectric element or, alternatively, may be such an electronic control unit or, alternatively, may be part of such an electronic control unit.
  • an electronic control unit for controlling the at least one thermoelectric element or, alternatively, may be such an electronic control unit or, alternatively, may be part of such an electronic control unit.
  • a separate electronic control unit for driving the thermoelektnschen elements is unnecessary, resulting in cost advantages.
  • the invention further relates to an air conditioning device with a previously presented thermoelectric device. The above-explained advantages of the thermoelectric device are therefore also transferred to the air conditioning device according to the invention.
  • thermoelectric device 1 shows an example of a thermoelectric device with thermoelectric elements in a schematic, highly simplified representation, and in a longitudinal section
  • thermoelectric device of Figure 1 in a plan view
  • thermoelectric device 3 shows a first development of the thermoelectric device according to FIGS. 1 and 2
  • 4 shows a second development of the thermoelekthsche device according to Figures 1 and 2
  • Fig. 5 is a detailed view of a single spring force device.
  • thermoelectric device 1 illustrates an example of a thermoelectric device 1 according to the invention in a longitudinal section, Figure 2 in a plan view.
  • the thermoelectric device 1 comprises a substrate 2, on each of which thermoelectric elements 3 are arranged at a distance from one another.
  • the substrate 2 is made of an electrically insulating and preferably flexible material, such as a fiber-reinforced plastic.
  • the substrate 2 can also be formed by a printed circuit board made of a flexible plastic.
  • thermoelectric elements 3 are arranged on an upper side 20 of the substrate 2 at a distance from one another.
  • the thermoelectric elements 3 are each held on the substrate 2 by means of spring force devices 4 arranged on the substrate 2 made of an electrically conductive material.
  • the spring force devices 4 exert spring force F on their associated thermoelectric element 3, so that it is mechanically fixed in the spring force device 4 and also electrically connected to the spring force device 4.
  • the thermoelectric elements 3 may additionally be fixed on the upper side 20 of the substrate 2 by means of an electrically insulating adhesive.
  • Two spring force devices 4 are electrically connected to each other by means of an electrical line path 5. In this way, an electrical series connection of the thermoelectric elements 3 desired for the thermoelectric device 1 is realized.
  • Figure 5 shows a single spring force device 4 separately and in a detailed view.
  • the spring force device 4 has two spring force elements 4a, 4b, between which a thermoelectric element 3 is sandwiched.
  • the thermoelectric element 3 rests with its two end faces 14a, 14b respectively against a spring force element 4a, 4b.
  • the two end faces 14a, 14b extend transversely, preferably orthogonally as shown in FIG. 5, to the upper side 20 of the substrate 2.
  • the spring force elements 4a, 4b of the spring force device 4 can be used to prevent thermomechanical stresses against the thermoelectric element held by the spring force elements 4a, 4b Element 3 to be biased.
  • the spring force elements 4a, 4b may consist of a metal, preferably copper or a copper alloy.
  • the two spring force elements 4a, 4b exert spring force F in the opposite direction on the thermoelectric element 3 arranged or clamped between them. In this way, the desired clamping effect is generated.
  • the spring force elements 4a, 4b each comprise a substantially L-shaped geometry with a first leg 9a and an angularly, preferably at right angles, second leg 9b projecting from the first leg 9a.
  • the second leg 9b is preferably integrally formed on the first leg 9a, so that the first and the second spring force element 4a, 4b are each formed integrally.
  • the first leg 9a is fixed on the substrate 2 according to FIG.
  • the first leg 9a is glued to the substrate 2.
  • the second leg 9b exerts spring force F on the thermoelectric element 3.
  • the second leg 9b may be biased against the recorded in the spring force means 4 thermoelectric element 3.
  • the end 10 of the second limb 9a facing away from the first limb 9a can be curved so as to permit the assembly of the thermoelectric element 3 between the two spring force elements 4a, 4b. easier.
  • a recess or recess may be provided in the second leg 9b, in which the respective thermoelectric element 3 is accommodated.
  • an electrical conduction path 5 connects a first spring force element 4a.1 of a first spring force device 4.1, which exerts spring force F on a first thermoelectric element 3.1, with a second spring force element 4b.2 of a second spring force device 4.2.
  • each electrical conduction path 5 has a thermal interaction zone 6, which is designed to be thermally coupled to the environment 8 of the thermoelectric device 1.
  • Said thermal interaction zones 6 are arranged between two spring force devices 4 and electrically connected thereto.
  • a thermal interaction zone 6 is electrically connected to the first spring force element 4a.1 of the first spring force device 4.1 and to the second spring force element 4b.2 of the second spring force device 4.2.
  • the thermal interaction zones 6 are arranged alternately on the upper side 20 and an underside 21 of the substrate 2 opposite the upper side 20.
  • the terms “top” and “bottom” refer in the example of the figures without limiting the generality of a possible position of use of the thermoelectric device. 1
  • the thermal interaction zones 6 arranged on the upper side 20 can act as the hot side 18 and the thermal interaction zones 6 arranged on the lower side 21 as the cold side 19 of the thermoelectric device 1, or vice versa. So that between two electrically adjacent thermal interaction zones 6 arranged thermoelectric elements 3 can generate an electrical thermal voltage, the spring force devices 4 are arranged with their thermoelectric elements 3 electrically alternately between acting as a hot side 18 interaction zone 6 and acting as a cold side 19 thermal interaction zone 6.
  • the first spring force element 4 a of a specific spring force device 4 is thus electrically connected to the interaction zone 6 acting as the hot side 18.
  • the second spring force element 4b of the same spring force device 6 is correspondingly electrically connected to the interaction zone 6 acting as cold side 19.
  • the spring force devices 4 and the electrical conduction paths 5 with the thermal interaction zones 6 are alternately connected electrically in series.
  • a spring force device 4 with a thermoelectric element 3 is followed by an electrical conduction path 5 with a thermal interaction zone 6, which in turn is followed by a further spring force device 4 with a thermoelectric element 3.
  • apertures 7 are provided in the substrate 2, through which the electrical conductive paths 5 are led through the substrate 2 , In particular in the area of the apertures 7, it makes sense to form the electrical conduction paths 5 as electrical circular conductors.
  • the substrate 2 preferably consists of an electrically insulating material, particularly preferably of a flexible plastic.
  • the substrate 2 the Use of a printed circuit board made of an electrically insulating material, preferably of a flexible plastic, in which the electrical conduction paths 5 of the thermoelectric device 1 at least partially as interconnects of an electrically conductive material, preferably made of a metal, most preferably made of copper or of a Copper alloy, are realized.
  • thermoelectric elements 3 are arranged on the upper side 20 of the substrate 2. This facilitates the assembly of the thermoelectric elements 3 in the spring force devices 4.
  • all spring force devices 4 are arranged on the underside 21 of the substrate 2 (not shown in Figure 1).
  • a plurality of interaction zones 6 can each be arranged on the upper side 20 and on the lower side 21 of the substrate 2.
  • the material for the interaction zones 6 is a metal, in particular copper or a copper alloy, into consideration.
  • the thermal interaction zones 6 may be formed as so-called pads 13.
  • the individual interaction zones 6 as a cover plate 11 or cover layer 12 of an electrically conductive material, preferably of a metal, most preferably made of copper or a copper alloy, which the substrate 2, in particular its top 20 and / or bottom 21st each partially covered.
  • a plate thickness of the cover plate 1 1 or a layer thickness of the cover layer 12 between 100 ⁇ and 500 ⁇ amount.
  • FIG. 3 shows a development of the example of FIG. 1.
  • the substrate 2 comprises a first substrate body 2a and a second substrate body 2b, between which a thermal insulation 2c is sandwiched.
  • the thermal insulation 2c can be formed, for example, by a textile layer, which is coated in particular with polyurethane.
  • the thermal interaction zones 6 forming the hot side 18 are arranged on the upper side 16 of the first substrate body 2 a facing away from the second substrate body 2 b.
  • the cold interaction side 19 forming thermal interaction zones 6 are arranged on the side facing away from the first substrate body 2a underside 17 of the second substrate body 2b.
  • the upper side 16 of the first substrate body 2a forms the upper side 20 of the substrate 2
  • the underside 17 of the second substrate body 2b forms the underside 21 of the substrate 2.
  • the spring force devices 4 can be arranged both on the upper side 20 and on the lower side 21 of the substrate 2.
  • the electrical connection between the spring force devices 4 on the upper side 20 and those on the lower side 21 - in an analogous manner to, for example, FIG. 1 - takes place via the apertures 7 formed in the substrate 2.
  • the substrate 2 is a printed circuit board
  • the thermoelectric device 1 so-called PCB technology for electrical and electronic circuits.
  • electrical capacitors and other electrical / electronic components in a manner analogous to the thermoelectric elements 3 on the circuit board and fasten there.
  • electrical / electronic components in particular for electrical capacitors, to use the spring force device 4 essential to the invention with the spring force elements 4a, 4b for attachment to the printed circuit board.
  • thermoelectric elements On the substrate may also be arranged one or more electronic circuit arrangements (not shown) with electrical and / or electronic components that are electrically connected to the thermoelectric elements 3.
  • the electronic circuitry (s) may include an electronic control unit for controlling the thermoelectric elements 3.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne un dispositif thermoélectrique (1), destiné en particulier à un système de climatisation d'un véhicule automobile. le dispositif thermoélectrique comprend - un substrat (2) sur lequel sont disposés des éléments thermoélectriques (3), - au moins deux éléments thermoélectriques (3) étant fixés chacun au substrat (2) à l'aide d'un moyen à force de ressort (4) en matériau électriquement conducteur qui est disposé sur le substrat (2), le moyen à force à ressort (4) exerçant une force de ressort (F) sur l'élément thermoélectrique respectif (3) de manière à fixer celui-ci mécaniquement dans le moyen à force de ressort (4) et à le relier électriquement au dispositif à force de ressort (4), - les au moins deux moyens à force de ressort (4) étant reliés électriquement entre eux au moyen d'un chemin de conduction électrique (5) qui comporte au moins une zone d'interaction thermique (6) adaptée au couplage thermique avec l'environnement (8) du dispositif thermoélectrique (1).
PCT/EP2018/075783 2017-09-22 2018-09-24 Dispositif thermoélectrique, notamment pour moyen de climatisation d'un véhicule automobile WO2019057962A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102017216832.3A DE102017216832A1 (de) 2017-09-22 2017-09-22 Thermoelektrische Vorrichtung, insbesondere für eine Klimatisierungseinrichtung eines Kraftfahrzeugs
DE102017216832.3 2017-09-22

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WO2019057962A1 true WO2019057962A1 (fr) 2019-03-28

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Families Citing this family (1)

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DE102019217054A1 (de) * 2019-11-06 2021-05-06 Robert Bosch Gmbh Temperierungsvorrichtung

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19503291A1 (de) * 1995-02-02 1996-08-08 Fichtel & Sachs Ag Klimatisierungsvorrichtung für einen Fahrzeugsitz
EP1340060B1 (fr) 2000-12-01 2008-07-09 Institut Francais Du Petrole Procede de fabrication de convertisseurs thermo-electriques
JP2011014737A (ja) * 2009-07-02 2011-01-20 Fujitsu Ltd 熱電変換モジュール
WO2011042263A1 (fr) * 2009-10-09 2011-04-14 O-Flexx Technologies Gmbh Module avec plusieurs éléments thermoélectriques
DE102013110254A1 (de) 2012-09-18 2014-03-20 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Thermoelektrisches Element aus "Leonischen Waren" und seine Herstellung
DE102012018387A1 (de) 2012-09-18 2014-03-20 Evonik Degussa Gmbh Textiler thermoelektrischer Generator

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL283717A (fr) * 1961-11-28
JP2008270618A (ja) * 2007-04-23 2008-11-06 Toyota Motor Corp 熱電発電モジュール
JP2008288535A (ja) * 2007-05-21 2008-11-27 Toyota Motor Corp 熱電発電モジュール
KR101068647B1 (ko) * 2009-03-13 2011-09-28 한국기계연구원 스프링 구조를 갖는 열전에너지 변환모듈
DE102015224020B4 (de) * 2015-12-02 2019-05-23 Deutsches Zentrum für Luft- und Raumfahrt e.V. Thermoelektrisches Modul

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19503291A1 (de) * 1995-02-02 1996-08-08 Fichtel & Sachs Ag Klimatisierungsvorrichtung für einen Fahrzeugsitz
DE19503291C2 (de) 1995-02-02 1998-06-10 Mannesmann Sachs Ag Heizungs-Kühlmatte für einen Fahrzeugsitz
EP1340060B1 (fr) 2000-12-01 2008-07-09 Institut Francais Du Petrole Procede de fabrication de convertisseurs thermo-electriques
JP2011014737A (ja) * 2009-07-02 2011-01-20 Fujitsu Ltd 熱電変換モジュール
WO2011042263A1 (fr) * 2009-10-09 2011-04-14 O-Flexx Technologies Gmbh Module avec plusieurs éléments thermoélectriques
DE102013110254A1 (de) 2012-09-18 2014-03-20 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Thermoelektrisches Element aus "Leonischen Waren" und seine Herstellung
DE102012018387A1 (de) 2012-09-18 2014-03-20 Evonik Degussa Gmbh Textiler thermoelektrischer Generator

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