EP4122008A1 - Connexion de composants - Google Patents

Connexion de composants

Info

Publication number
EP4122008A1
EP4122008A1 EP21711504.7A EP21711504A EP4122008A1 EP 4122008 A1 EP4122008 A1 EP 4122008A1 EP 21711504 A EP21711504 A EP 21711504A EP 4122008 A1 EP4122008 A1 EP 4122008A1
Authority
EP
European Patent Office
Prior art keywords
connection
component
connecting element
nanowires
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP21711504.7A
Other languages
German (de)
English (en)
Inventor
Olav Birlem
Florian DASSINGER
Sebastian Quednau
Farough ROUSTAIE
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nanowired GmbH
Original Assignee
Nanowired GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE102020107511.1A external-priority patent/DE102020107511A1/de
Priority claimed from DE102020107513.8A external-priority patent/DE102020107513A1/de
Application filed by Nanowired GmbH filed Critical Nanowired GmbH
Publication of EP4122008A1 publication Critical patent/EP4122008A1/fr
Pending legal-status Critical Current

Links

Classifications

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
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Definitions

  • the present invention relates to a method and a connecting element for connecting a first component to a second component as well as an arrangement of two components connected to one another, in particular with regard to components from electronics.
  • the present invention further relates to a method and a use of a connecting element for connecting a first contact surface to a second contact surface and an arrangement with two interconnected contact surfaces, in particular with regard to components from electronics.
  • connection techniques of gluing, screwing and riveting are room temperature processes.
  • Welding, soft and hard soldering, on the other hand, are hot processes in which liquid metal is generated, which fills the volume and inserts itself into the joint in a metallically interacting manner.
  • welding Due to its considerable temperature input of regularly up to 1400 ° C, welding has the disadvantage that, on the one hand, it heats the affected body to a considerable extent, so that there is a risk of igniting combustible materials. stands. Optical changes to the surface of the bodies to be connected can also occur, which can be problematic in particular in the case of pretreated surfaces with lacquers, foils or coatings. In addition, many materials cannot be welded.
  • Brazing of copper for example, due to its considerable thermal energy input, can also cause the components involved in the connection to heat up considerably (in particular to over 400 ° C). This can cause flammable materials to ignite.
  • Soft soldering of copper can have the disadvantage that, on the one hand, the shear strength of the connection is lower than required and, on the other hand, that with soft solders, temperature fluctuations lead to the segregation of the metal and thus to an embrittlement of the connection. This can lead to failure of the connection. Furthermore, soft solders have the disadvantage that they have a significantly higher contact resistance of the connection than, for example, pure copper. Another disadvantage of soft solder connections is their low mechanical fatigue strength, which usually only exists up to around 120 ° C. The corrosion resistance of such a connection to acidic media is also often inadequate.
  • a method for connecting a first component to a second component comprises: a) providing a connection element with a respective plurality of nanowires on a first connection surface on a first side of the connection element and on a second connection surface on a second side of the connection element opposite the first side, wherein the first connection surface and the second connection surface are electrically isolated from one another, b) merging a contact surface of the first component with the first connection surface of the connection element, and c) merging a contact surface of the second component with the second connection surface of the connection element.
  • the first component and the second component are preferably electronic components such as semiconductor components, computer chips, microprocessors or circuit boards.
  • the first component and / or the second component are preferably at least partially thermally conductive.
  • the first component and / or the second component can be completely or partially electrically conductive or electrically insulating. Due to the electrical insulation between the connection surfaces, electrically conductive components are also not connected to one another in an electrically conductive manner.
  • the first connection surface and the second connection surface should in any case be regarded as electrically isolated from one another if an electrical resistance between the first connection surface and the second connection surface is measured to be at least 100 ko under the following conditions with a four-point measurement: room temperature, air humidity 20%, measurement at constant voltage (i.e. not with AC voltage), measurement with a respective electrode on the first connection surface and on the second connection surface, the electrodes touching the respective connection surface with an area of 1 cm 2.
  • the method described is not restricted to applications in the field of electronics.
  • a component such as a sensor (as a first component) on a wall or bracket (as a second component) according to the method described.
  • the method described enables, in particular, a mechanically stable, electrically insulating and preferably thermally conductive connection to be formed between the first component and the second component.
  • the method described can thus be used in all areas in which a corresponding connection between two components is required.
  • the method described is also not limited to a specific size of the components.
  • the method described is suitable for use in the field of electronics, in particular microelectronics, or for connecting significantly larger components on a macroscopic level.
  • the components can be connected to the connecting element via respective contact surfaces.
  • a contact area is, in particular, a spatially marked area of a surface of the respective component.
  • the contact surfaces are characterized by the formation of the connection. This means that the contact surface does not initially differ from the rest of the surface of the component and only emerges when the connection is formed in such a way that the contact surface is the surface on which the connection is formed. In this case, the contact area is initially only conceptually delimited from the rest of the surface of the component. In the area of the contact surfaces the nanowires of the connecting element can come into contact with the respective component.
  • the contact surfaces are preferably each simply connected areas of the surface of the respective component.
  • the respective contact surface of the first component and / or of the second component can be subdivided into several separate sub-areas of the surface of the respective component.
  • a contact surface can comprise two or more separate sections of the surface of the respective component.
  • the contact surfaces can be electrically and / or thermally conductive or insulating. Because of the electrical insulation between the connection surfaces, the connection is in any case electrically insulating.
  • the components are preferably designed to be rigid or have at least one rigid surface on which the respective contact surface is provided.
  • the components or at least the contact surfaces
  • the components are preferably not flexible.
  • a connection can be formed particularly well according to the method described. For example, if one of the components were designed to be flexible, the connection could break due to stress on the nanowires.
  • the method described can also be used advantageously with flexible components or contact surfaces.
  • connections between the first components and the connecting element are formed via a large number of nanowires.
  • a nanowire is understood here to mean any material body that has a wire-like shape and a size in the range from a few nanometers to a few micrometers.
  • a nanowire can, for example, have a circular, oval or polygonal base In particular, a nanowire can have a hexagonal base. All nanowires involved in the connection are preferably formed from the same material. Electrical insulation between the contact surfaces of the components to be connected is also due to the design of the connecting element given when the nanowires come from one electrically conductive material are formed. It is thus possible for the nanowires to be formed from an electrically conductive and / or from an electrically insulating material.
  • the nanowires on the first connection surface are preferably formed from the same material as the nanowires on the second connection surface. Alternatively, it is preferred that the nanowires on the first connection surface and the nanowires on the second connection surface are formed from different materials.
  • the nanowires on the first connection surface and / or the nanowires on the second connection surface are formed from a respective metal. Furthermore, it is preferred that the nanowires on the first connection surface are formed from the material of the contact surface of the first component and / or that the nanowires on the second connection surface are formed from the material of the contact surface of the second component.
  • connection can have different properties.
  • the mechanical strength and the thermal conductivity of the connection are influenced by the material of the nanowires.
  • the nanowires are made of different materials on the two connection surfaces, two connections with different properties can be formed.
  • the connecting element can also be viewed as an intermediary between the two components to be connected to the extent that two components that are otherwise not or only poorly connectable to one another can be connected to one another via the connecting element.
  • the nanowires preferably have a length in the range from 100 nm [nanometers] to 100 ⁇ m [micrometers], in particular in the range from 500 nm to 30 ⁇ m. Furthermore, the nanowires preferably have a diameter in the range from 10 nm to 10 ⁇ m, in particular in the range from 30 nm to 2 ⁇ m.
  • the term diameter refers to a circular base area, with a comparable definition of a diameter being used for a base area that differs therefrom. It is particularly preferred that all nanowires used have the same length and the same diameter.
  • the components are connected to one another indirectly via the connecting element. This has the advantage that nanowires do not have to be provided on any of the components.
  • the nanowires are present on the connecting element.
  • the connecting element is preferably designed to be flexible. Alternatively, it is preferred that the connecting element is rigid.
  • the connecting element can be designed as a solid metal plate.
  • the electrical insulation between the connection surfaces can in this case be achieved by one or more coatings.
  • the connecting element is formed from a plastic.
  • the connecting element can be formed from a polymer, in particular from polycarbonate, PVC, polyester, polyethylene, polyamide and / or PET.
  • the connecting element can also be formed from a ceramic material, silicon, aluminum oxide or glass, for example.
  • the connecting element can be made of stainless steel, aluminum or non-ferrous metal. It is also preferred that the connecting element is formed from a composite material comprising several of the materials mentioned.
  • a connecting element which has two connecting surfaces. Both connection surfaces each have a large number of nanowires.
  • the first connection surface is arranged on the first side of the connection element, the second connection surface on the second side of the connection element.
  • the first side and the second side of the connecting element are arranged opposite one another.
  • the first side of the fastener is the side of the Connection element which, after the connection has been formed, faces the first component.
  • the second side of the connecting element is the side of the connecting element which faces the second component after the connection has been formed.
  • the components can therefore be connected by the method described to the extent that, after the connection has been formed, the contact surfaces of the two components are arranged opposite one another on the two sides of the connecting element. A distance between the two contact surfaces is only a result of the thickness of the connecting element and the space occupied by the nanowires.
  • the connecting element is provided.
  • a connecting element designed as described is created as part of the method.
  • the nanowires can be applied to the connecting surfaces as part of the method, in particular by galvanic growth.
  • the provision also includes using a connecting element on which the nanowires are already present at the connecting surfaces.
  • a suitably prepared connecting element can be obtained from a supplier and used for the method described.
  • Such a covering of a prepared connection element is also a provision of a connection element in the sense used here.
  • the nanowires are preferably provided on the connection surfaces in such a way that they are essentially perpendicular (preferably perpendicular) to the respective connection surface.
  • the entirety of the nanowires on a connection surface can in particular be referred to as a lawn of nanowires.
  • the nanowires can also be provided on the connecting surfaces in any orientation. It is also possible for a connection surface to be subdivided into a plurality of subregions (connected to one another or separated from one another), the nanowires being oriented differently in the various subregions. In this way, a particularly stable connection can be realized which, in particular, can also withstand shear forces particularly well.
  • the nanowires it is possible for the nanowires to be designed differently at different points on the connection surfaces, in particular with regard to their length, diameter, material. rial and density (where the density of the nanowires indicates how many nanowires are provided per area).
  • the connecting element can in particular be understood as a mediator of the connection between the first component and the second component.
  • any physical object that is suitable for connecting the components between the contact surfaces of the components can be considered as a connecting element.
  • connection surface is in particular a spatially distinguished area of a surface of the connection element on the respective side of the connection element.
  • the connection surfaces are distinguished by forming the connection. This means that the connection surfaces do not initially differ from the rest of the surface of the connection element and only emerge when the connection is formed in such a way that the connection surfaces are the surfaces on which the connection is formed. In this case, the connection surfaces are only conceptually delimited from the remaining part of the surface of the connection element before the connection is formed.
  • a connecting surface of a flat connecting element can be characterized in that a flat connection to the respective component is formed over a limited area of the connecting element (i.e. over the connecting surface).
  • the connecting surfaces are preferably as large as the corresponding contact surface and, in particular, preferably have its shape. However, it is also possible for the contact areas to be larger or smaller than the corresponding connection areas and / or for the contact areas and the corresponding connection area to have different shapes.
  • the connecting surfaces are preferably each simply connected areas of the surface of the connecting element.
  • the first connection surface and / or the second connection surface can be subdivided into a plurality of sub-areas of the surface of the connection element that are separate from one another.
  • a connecting surface can thus comprise two or more mutually separate sections of the surface of the connecting element.
  • connection is formed in that the nanowires, in particular their ends facing the respective contact surface, connect to the contact surface.
  • This connection is formed at the atomic level.
  • the atomic process is similar to that during sintering.
  • the connection obtained can in particular be so tight for gases and / or liquids that corrosion of the connection and / or the interconnected components in the area of the connection can be prevented or at least restricted.
  • the connection formed can be viewed as being fully metallic.
  • the process described can also be referred to as “Velcro welding”. This expresses the fact that the connection is obtained by a large number of nanowires and thus by a large number of elongated, hair-like structures and by heating A large number of nanowires can be used to level out unevenness and roughness in the contact surfaces.
  • the surface area of the connection (ie the area over which forces such as the van der Waals force act at the atomic level) is particularly large.
  • the connection can thus be particularly good thermally conductive and / or mechanically stable.
  • the nanowires are formed from a thermally conductive material.
  • the use of copper is particularly preferred here.
  • the contact surfaces are also preferably formed from a thermally conductive material, in particular with copper. As described above, the use of copper is not possible, especially for welded connections. Due to the large surface area of the connection obtained by the method described, a thermal conductivity of the connection can be particularly high. A particularly good thermal conductivity of the connection, for example, the cooling of the Improve the connection of the components involved.
  • the use of copper for the nanowires and / or for the contact surfaces is particularly preferred for this purpose.
  • connection described can also be formed particularly easily and without tools. Only the components to be connected and the connecting element need to be brought together. Warming up and exertion of pressure can take place optionally, but are not absolutely necessary.
  • steps a) to c) are preferably carried out in the specified sequence, in particular one after the other.
  • step a) is preferably carried out before the start of steps b) and c).
  • the contact surface of the first component can first be brought together with the first connection surface, that is to say the first component with the connection element (step b)). Subsequently, the connecting element merged with the first component according to step b) can be merged with the second component in such a way that the contact surface of the second component and the second connecting surface are merged (step c)).
  • Steps b) and c) can alternatively be carried out simultaneously, overlapping in time or one after the other. This is possible, for example, in that the connecting element is held between the two components and these are moved towards the connecting element from both sides at the same time.
  • step b) and / or steps) are carried out at room temperature.
  • connection between the contact surfaces and the connecting surfaces can already be formed at room temperature. It is preferred that the two components are pressed against one another to form the connection.
  • the pressure used here is preferably in the range of 3 MPa and 200 MPa, in particular in the range of 15 MPa and 70 MPa. A pressure of 20 MPa is particularly preferred. It is preferred that no heating takes place even after steps b) and c) have been completed. In this way, damage to the components due to the effects of temperature can be prevented.
  • the method further comprises: d) heating at least the contact surfaces to a temperature of at least 90 ° C.
  • the contact surfaces are heated to a temperature of at least 90 ° C (as the minimum temperature), preferably to a temperature of at least 150 ° C (as the minimum temperature).
  • the temperature is preferably 200 ° C.
  • the heating is preferably carried out to a temperature of a maximum of 270.degree. C., in particular a maximum of 240.degree.
  • steps b) and / or c) are carried out at room temperature. This means that the heating does not take place until after the connection has been formed in accordance with steps b) and c).
  • the connection thus formed is strengthened by the heating.
  • the nanowires connect particularly well to the contact areas. Accordingly, it is sufficient that only the contact surfaces are heated. In practice, in the case of such heating, it is usually not possible to differentiate whether the contact surfaces, the nanowires, the connecting element, the first component are partially or entirely and / or the second component is partially or entirely heated. This is particularly the case when thermally conductive materials are used.
  • a (co-) heating of components other than the contact surfaces is not necessary for the formation of the connection, but it is also not a hindrance.
  • the heating according to step d) can in particular take place in that the first component, the second component and the connecting element are heated as a whole, for example in an oven. Alternatively, however, it is also possible to introduce heat locally into the area of the connection, in particular into the area of the contact surfaces.
  • the described minimum temperature is reached once, at least for a short time. It is not necessary to maintain the minimum temperature. However, it is preferred that the temperature to which is heated according to step d) for at least ten seconds, preferably at least is held for at least 30 seconds. It can thus be ensured that the connection is formed as desired. Maintaining the temperature for a longer period is generally not harmful.
  • Steps b) and c) as well as step d) can be carried out at least partially so as to overlap in time.
  • preheating can take place before or during steps b) and c), which can be regarded as part of step d).
  • step d) can also begin before step b) or c).
  • step d) is carried out to the extent that the temperature required according to step d) is present at least temporarily even after step b) or c) has been completed.
  • a connection between two components can be obtained without a temperature occurring at the same level as, for example, during welding or brazing.
  • this advantage can be used in that heating is dispensed with to an extent that is not required. In this way, damage to the components, for example, can be avoided.
  • the low temperatures described can also prevent flammable materials from igniting. Accordingly, it is particularly preferred that at no point in time of the described method does a temperature of the first component and / or the second component exceed 270 ° C., in particular 240 ° C.
  • step b) and / or c) the connection element, the first component and / or the second component are acted upon with ultrasound.
  • the connecting element and the first component are preferably acted upon in step b) with ultrasound.
  • the action with ultrasound can take place in such a way that a delimitation is hardly or not at all possible, whether on the connecting element, on the first component and / or acted on the second component. Accordingly, it is also preferred that in step b) and / or in step c) the connecting element, the first component and the second component are acted upon with ultrasound.
  • the first component and the second component are at least during part of the heating with a pressure of at least 3 MPa, in particular at least 15 MPa, and / or at most 200 MPa, in particular 70 MPa , pressed against the connecting element. This can take place in particular in that the two components are pressed towards one another while the connecting element is arranged between the two components.
  • the pressure used is preferably in the range of 3 MPa and 200 MPa, in particular in the range of 15 MPa and 70 MPa. A pressure of 20 MPa is particularly preferred.
  • the pressure is preferably above the specified lower limit at least for a period of time in which the temperature exceeds the lower limit specified for this.
  • the nanowires and the contact surface are exposed to both a corresponding pressure and a corresponding temperature, at least in this time segment.
  • the connection can be formed by the action of pressure and temperature.
  • first connection surface and the second connection surface are designed opposite one another.
  • the first connection surface and the second connection surface are preferably arranged parallel to one another.
  • the connecting element can be arranged between two components to be connected.
  • the connecting element (apart from the formation of the connection) only has the effect that the contact surfaces are not directly adjacent to one another, but in particular around the material. strength of the connecting element are arranged spaced from each other. An orientation of the contact surfaces relative to one another remains unaffected by the connecting element.
  • first connecting surface and the second connecting surface can also be provided, for example, at different points on the respective, in particular planar, surface of the connecting element.
  • first component can be connected to the connecting element at a first of these locations and the second component at a second of these locations.
  • connection element provided in step a) furthermore has a respective plurality of nanowires on a third connection surface on the first side of the connection element and on a fourth connection surface on the second side of the connection element, wherein the third connection surface and the fourth connection surface are connected to one another in an electrically conductive manner
  • the method further comprises the following steps: b ') bringing together a contact surface of a third component with the third connection surface of the connection element, and c') Merging a contact surface of a fourth component with the fourth connecting surface of the connecting element.
  • the method can also be referred to as a "method of connecting four components".
  • Steps b), b '), c) and c') can be carried out simultaneously, overlapping in time or one after the other in any order.
  • an electrically insulating connection is formed between the first component and the second component and an electrically conductive connection between the third component and the fourth component.
  • the first connection surface is preferably electrically conductively insulated from all other connection surfaces.
  • the second connection surface is preferably electrically conductively insulated from all other connection surfaces.
  • the present embodiment can be used, for example, to electrically isolate a transistor such as a MOSFET or IGBT as the first component with a heat sink as the second component and to connect a microcontroller as the third component to a data line as the fourth component.
  • a transistor such as a MOSFET or IGBT
  • a heat sink as the second component
  • a microcontroller as the third component to a data line as the fourth component.
  • the third connecting surface and the fourth connecting surface are preferably each simply connected areas of the surface of the connecting element.
  • the third connection surface and / or the fourth connection surface can be subdivided into a plurality of mutually separate sub-areas of the surface of the connection element.
  • a connecting surface can comprise two or more mutually separate sections of the surface of the connecting element. This makes it possible, for example, to connect a microcontroller as a third component via a large number of connections to a multi-pole data line as a fourth component.
  • the first connecting surface and the third connecting surface are preferably arranged at a distance from one another on the first surface of the connecting element.
  • the second connecting surface and the fourth connecting surface are preferably arranged at a distance from one another on the second surface of the connecting element.
  • the first connection surface is preferably opposite the second connection surface.
  • the third connection surface is preferably opposite the fourth connection surface.
  • the connecting element is preferably basically formed from an electrically insulating material.
  • the electrically conductive connection between the third connecting surface and the fourth connecting surface can be implemented by one or more connecting lines which pass through the connecting element in the area of the third connecting surface and the fourth connecting surface.
  • the connecting lines can be formed from copper, for example. They can be obtained lithographically.
  • a connecting element for connecting a first component to a second component is presented.
  • the connecting element has a plurality of nanowires in each case on a first connecting surface on a first side of the connecting element and on a second connecting surface on a second side of the connecting element opposite the first side.
  • the first connection area and the second connection area are electrically isolated from one another.
  • the connecting element is designed like a film.
  • a film-like configuration is to be understood as meaning that the connecting element has a thickness which is very much smaller than the extent of the connecting element in the other directions.
  • the connecting element has a thickness of at most 5 mm.
  • the thickness of the connecting element is preferably in the range of 0.005 mm and 5 mm [millimeters], in particular in the range of 0.01 mm and 1 mm.
  • the connecting element is designed in the form of a band.
  • the first side and the opposite second side of the connecting element in this embodiment are the two surfaces of the belt which have a considerably larger surface area than all other surfaces (which result from the material thickness of the belt).
  • the tape material can be provided as a roll.
  • the nanowires can already be provided on the strip material and can be protected, for example, by a protective varnish. Before using the connecting element, the protective varnish can be removed and the nanowires exposed. A part of the strip material required in each case can be separated from the roll for use.
  • the connecting element can also be referred to as a “connecting tape” and in particular as a “Velcro welding tape”.
  • a specific electrical resistance of the material of the connecting element in the area between the first connecting surface and the second connecting surface is at least 10 5 ⁇ m, preferably at least 10 8 ⁇ m, at room temperature.
  • the specific electrical resistance of the material of the connection element is at least 10 5 ⁇ m, in particular at least 10 8 ⁇ m, at least in the area between the first connection surface and the second connection surface at room temperature.
  • the specific electrical resistance of the connecting element is also outside this range, particularly preferably continuously at all points of the connecting element, at room temperature at least 10 5 ⁇ m, in particular at least 10 8 ⁇ m.
  • the specification described for the specific electrical resistance of the material of the connecting element relates to a measurement at constant voltage.
  • the stated value of at least 10 5 ⁇ m, preferably at least 10 8 ⁇ m, relates to the material of the connecting element.
  • the specific resistance of various materials is available in the specialist literature, for example in tables. Reference is made here to such information. If the connecting element is formed continuously from a specific material, the specific resistance of the material of the connecting element to be used here is the value given in the specialist literature for this specific material. This definition excludes all effects that do not result from the material but, for example, from the shape of the connecting element. If the connecting element is made up of different materials, the specific resistance of the individual materials is to be determined from the specialist literature and the total specific resistance of the material of the connecting element, ie the composition of the materials, is to be determined. There is no value for the in the specialist literature specific resistance of the material used, this can be determined by measurement.
  • the connecting element is formed from a ceramic material in the area between the first connecting surface and the second connecting surface.
  • the connecting element is formed from a ceramic material at least in the area between the first connecting surface and the second connecting surface.
  • the connecting element is preferably also formed from a ceramic material outside this area, particularly preferably continuously at all points of the connecting element.
  • a connecting element formed from a ceramic material can have the specific electrical resistance described.
  • the connecting element is at least partially thermally conductive.
  • connection formed can be particularly good thermally conductive.
  • the connecting element has a respective plurality of nanowires on a third connecting surface on the first side of the connecting element and on a fourth connecting surface on the second side of the connecting element, the third connecting surface and the fourth connecting surface being electrically conductively connected to one another .
  • first component which is connected to the connecting element by means of a multiplicity of nanowires via a first connecting surface on a first side of a connecting element
  • second component which is connected to the connecting element by means of a multiplicity of nanowires via a second connecting surface on a second side of the connecting element opposite the first side
  • the first connection area and the second connection area are electrically isolated from one another.
  • the connecting element is preferably designed as described.
  • the arrangement is preferably produced by the method described.
  • the assembly be manufactured by a method which comprises:
  • the nanowires are not made available on the connecting element, but rather on the first component and on the second component.
  • This has the advantage that the production of the connecting element is particularly simple.
  • the arrangement is produced by a method which comprises: i) providing a connection element with a plurality of nanowires on a first connection surface on a first side of the connection element and with a second connection surface on one of the first Side opposite second side of the connecting element, wherein the first connecting surface and the second connecting surface are electrically isolated from one another, ii) providing a plurality of nanowires on a contact surface of the second component, iii) merging the contact surface of the first component with the first connection - connection surface of the connecting element, and iv) merging of the contact surface of the second component with the second connecting surface of the connecting element.
  • the nanowires are provided for one of the connections on the connecting element and for the other of the connections on the component.
  • the nanowires on the contact surface of the component that is involved in a connection or on the corresponding connection surface. Accordingly, there is the possibility of providing the nanowires on both connecting surfaces of the connecting element (as is the case with the method comprising steps a) to c)), and providing the nanowires on the contact surfaces of both components (as is the case with the method comprising steps A) to D) is the case) or to provide the nanowires on one of the connecting surfaces of the connecting element and on a contact surface of the components (as is the case with the method comprising steps i) to iv)). In all of the methods it is also preferred to provide the nanowires both on a connection area and on the associated contact area. In that case, the connection between the nanowires is established.
  • an arrangement which comprises: - a first component,
  • a second connecting element the first component being connected to a first connecting surface of the first connecting element via a plurality of nanowires
  • the functional element being connected on a first side to a second connecting surface of the first connecting element via a plurality of nanowires and is connected on a second side via a plurality of nanowires to a first connection surface of the second connection element
  • the second component being connected to a second connection surface of the second connection element via a plurality of nanowires
  • the first connection surface and the second Connection surface of the first connection element are electrically isolated from one another
  • the first connection surface and the second connection surface of the second connection element are electrically isolated from one another.
  • the particular advantages and design features of the method, the connecting element and the previously described arrangement described above can be used and transferred to the presently described arrangement.
  • the arrangement is preferably produced using the method described twice.
  • the two connecting elements are preferably designed as described.
  • the functional element can in particular be part of a functional layer of an electronic device.
  • the functional element preferably serves one or more of the following functions: dissipation of heat, insulation of vibrations, mechanical stabilization.
  • the functional element can be formed from a textile, for example.
  • the functional element can also be part of a housing.
  • a method for connecting a first contact area to a second contact area comprises: a) providing a connection element with a plurality of nanowires on a first connection surface and on a second connection surface, wherein the first connecting surface and the second connecting surface are arranged on the same side of the connecting element, b) merging the first contact surface with the first connecting surface of the connecting element, and c) merging the second contact surface with the second connecting surface of the connecting element.
  • the first contact surface and the second contact surface can be arranged on the same component or on different components.
  • the one component or the two components can in particular be an electronic component or two electronic components such as semiconductor components, computer chips, microprocessors or circuit boards.
  • the component is or the components are preferably at least partially electrically and / or thermally conductive.
  • electrical and / or thermal conductivity in the sense used here is present in particular in the case of metals such as copper, for example, which are generally referred to as “electrically conductive” or, equivalently, as “electrically conductive” or “thermally conductive” or “thermally conductive”.
  • materials that are generally considered to be electrically or thermally insulating should not be viewed here as being electrically or thermally conductive.
  • the method described is not restricted to applications in the field of electronics.
  • the method described enables, in particular, a mechanically stable, electrically and / or thermally conductive connection to be formed between the first contact surface and the second contact surface.
  • the method described can thus be used in all areas in which a connection between two contact surfaces with one or more of these properties is required.
  • the method described is also not limited to a specific size of the components.
  • the method described is suitable for use in (micro) electronics or for connecting significantly larger contact surfaces on a macroscopic level.
  • a contact area is, in particular, a spatially marked area of a surface of a component. In particular, it is preferable that the contact areas are distinguished by forming the connection.
  • the contact surfaces do not initially differ from the rest of the surface of the component (as described below with the exception of the respective other contact surface) and only emerge when the connection is formed in such a way that the contact surfaces are the surface on which the Connection is formed.
  • the contact areas are conceptually (ie without spatial distinction) delimited from the remaining part of the surface of the component.
  • a contact surface of a planar electrical conductor can be characterized in that a planar connection to a second electrical conductor is formed over a limited area of the planar conductor (ie over the contact surface).
  • the contact areas are preferably each simply connected areas of the surface of the same component or of a respective component.
  • first contact surface and / or the second contact surface can be subdivided into a plurality of mutually separate sub-regions of the surface of the one component or of the respective component.
  • a contact surface can comprise two or more sections of the surface that are separated from one another.
  • the two contact surfaces to be connected can already be delimited from one another before the connection is formed. If a connection area provided with nanowires is connected to a contact area, this cannot be understood as a connection between two contact areas insofar as the one contact area is arbitrarily divided into two contact areas.
  • the two contact surfaces to be connected using the method described can preferably be functionally delimited from one another. Thus, it cannot be understood as a connection of two contact areas if a contact area consisting of several partial areas is brought into contact with nanowires of a connection area as long as the individual partial areas of the contact area all serve the same function. An electrical contact in particular comes into consideration as a function.
  • the two contact surfaces to be connected using the method described are preferably electrically isolated from one another.
  • connection By forming the connection with the connecting element, an electrical connection can be established between the contact surfaces.
  • the contact surfaces can be electrically and / or thermally conductive or insulating. It is preferred that the contact surfaces are electrically and / or thermally conductive, so that an electrically and / or thermally conductive connection can be formed.
  • the contact surfaces are preferably designed to be rigid. This means that the surface of the respective component on which the contact surface is located is designed to be rigid, at least in the area of the contact surface.
  • the contact surfaces are therefore not flexible.
  • a connection according to the method described can be formed particularly well between rigid contact surfaces. For example, if one of the contact surfaces were made flexible, the connection could break due to stress on the nanowires. Depending on the precise circumstances, the method described can also be used advantageously with flexible contact surfaces.
  • connection between the first contact area and the second contact area is formed via a multiplicity of nanowires.
  • a nanowire is understood here to mean any material body that has a wire-like shape and a size in the range from a few nanometers to a few micrometers.
  • a nanowire can, for example, have a circular, oval or polygonal base In particular, a nanowire can have a hexagonal base area.
  • all of the nanowires involved in the connection are formed from the same material. It is particularly preferred that the nanowires are formed entirely from an electrically and / or thermally conductive material are.
  • the nanowires on the first connection surface are preferably formed from the same material as the nanowires on the second connection surface. Alternatively, it is preferred that the nanowires on the first connection surface and the nanowires on the second connection surface are formed from different materials.
  • the nanowires on the first connection surface and / or the nanowires on the second connection surface from a respective Metal are formed. Furthermore, it is preferred that the nanowires on the first connection area are formed from the material of the first contact area and / or that the nanowires on the second connection area are formed from the material of the second contact area.
  • connection can have different properties.
  • the mechanical strength and the electrical and / or thermal conductivity of the connection are influenced by the material of the nanowires.
  • the nanowires are formed from different materials on the two connection surfaces, two connections with different properties can be formed.
  • the connecting element can also be viewed as an intermediary between the two contact surfaces to be connected to the extent that two contact surfaces that are otherwise not or only poorly connectable to one another can be connected to one another via the connecting element.
  • the nanowires preferably have a length in the range from 100 nm [nanometers] to 100 ⁇ m [micrometers], in particular in the range from 500 nm to 60 ⁇ m. Furthermore, the nanowires preferably have a diameter in the range from 10 nm to 10 ⁇ m, in particular in the range from 30 nm to 2 ⁇ m.
  • the term diameter refers to a circular base area, with a comparable definition of a diameter being used for a base area that differs therefrom. It is particularly preferred that all nanowires used have the same length and the same diameter.
  • the contact surfaces are connected to one another indirectly via the connecting element.
  • This has the advantage that nanowires do not have to be provided on any of the contact surfaces. It is sufficient that the nanowires are present on the connecting element. This can make it easier to carry out the method and, in particular, it can also expand the area of application of the method to those contact surfaces which are not or only poorly accessible to the growth of the nanowires. Furthermore, the growth of the nanowires can take place locally separately from the contact surfaces. However, it is an alternative it is preferred that a respective multiplicity of nanowires is also provided on the first contact area and / or on the second contact area.
  • the connecting element is preferably designed to be flexible. Alternatively, it is preferred that the connecting element is rigid.
  • the connecting element can be designed as a solid metal plate.
  • the connecting element is formed from a plastic.
  • the connecting element can be formed from a polymer, in particular from polycarbonate, PVC, polyester, polyethylene, polyamide and / or PET.
  • the connecting element can also be formed from a ceramic material, silicon, aluminum oxide or glass, for example.
  • the connecting element can be made of stainless steel, aluminum or non-ferrous metal. It is also preferred that the connecting element is formed from a composite material comprising several of the materials mentioned.
  • a connecting element which has two connecting surfaces. Both connection surfaces each have a large number of nanowires.
  • the first connecting surface and the second connecting surface are arranged on the same side of the connecting element. This means that the two connecting surfaces are next to each other.
  • the connecting surfaces can touch one another, that is to say merge into one another.
  • the connecting surfaces can be designed at a distance from one another.
  • contact surfaces lying next to one another can in particular be connected to one another.
  • the contact surfaces can touch each other.
  • the two contact surfaces are separated from one another in such a way that the two contact surfaces can also be delimited before the connection is formed.
  • the contact surfaces are preferably formed at a distance from one another. In this case, the contact surfaces are separated from one another by a spatial separation and, to that extent, can be delimited from one another.
  • the connecting element is provided.
  • a connecting element designed as described is created as part of the method.
  • the nanowires can be applied to the connecting surfaces as part of the method, in particular by galvanic growth.
  • the provision also includes the fact that a connecting element is used on which the nanowires are already present at the connecting surfaces.
  • a suitably prepared connecting element can be obtained from a supplier and used for the method described.
  • Such a covering of a prepared connection element is also a provision of a connection element in the sense used here.
  • the nanowires are preferably provided on the connection surfaces in such a way that they are essentially perpendicular (preferably perpendicular) to the respective connection surface.
  • the entirety of the nanowires on a connection surface can in particular be referred to as a lawn of nanowires.
  • the nanowires can also be provided on the connecting surfaces in any orientation. It is also possible for a connection surface to be subdivided into a plurality of subregions (connected to one another or separated from one another), the nanowires being oriented differently in the various subregions. In this way, a particularly stable connection can be realized which, in particular, can also withstand shear forces particularly well.
  • the nanowires it is possible for the nanowires to be designed differently at different points on the connection areas, in particular with regard to their length, diameter, material and density (the density of the nanowires indicating how many nanowires are provided per area).
  • the connecting element can in particular be understood as a mediator of the connection between the first component and the second component.
  • any physical object that is suitable for connecting the components to cover the two contact surfaces can be considered as a connecting element.
  • connection surface is in particular a spatially distinguished area of a surface of the connection element on the respective side of the connection element.
  • the connection surfaces are distinguished by forming the connection. This means that the connecting surfaces do not initially differ from the remaining surface of the connecting element and only emerge when the connection is formed in such a way that the connecting surfaces are the surfaces on which the connection is trained. In this case, the connection surfaces are only conceptually delimited from the remaining part of the surface of the connection element before the connection is formed.
  • a connection surface of a planar connection element can be characterized in that a planar connection to the respective contact surface is formed over a limited area of the connection element (ie over the connection surface).
  • the connecting surfaces are preferably as large as the corresponding contact surface and, in particular, preferably have its shape. However, it is also possible for the contact areas to be larger or smaller than the corresponding connection areas and / or for the contact areas and the corresponding connection areas to have different shapes.
  • the connecting surfaces are preferably each simply connected areas of the surface of the connecting element.
  • the first connection surface and / or the second connection surface can be subdivided into a plurality of sub-areas of the surface of the connection element that are separate from one another.
  • a connecting surface can thus comprise two or more mutually separate sections of the surface of the connecting element.
  • steps b) and c) the contact surfaces are brought together with the connecting surfaces, that is to say moved towards one another.
  • the nanowires on the connection surfaces come into contact with the respective contact surface.
  • the nanowires are connected to the corresponding contact surface, whereby the corresponding connection is formed between the components and the connecting element.
  • connection is formed in that the nanowires, in particular their ends facing the respective contact surface, connect to the contact surface.
  • This connection is formed at the atomic level.
  • the atomic process is similar to that during sintering.
  • the connection obtained can in particular be so tight for gases and / or liquids that corrosion of the connection and / or the interconnected components in the area of the connection can be prevented or at least restricted.
  • the connection formed can be viewed as being fully metallic. That described- The bene method can also be referred to as "KlettWelding". This expresses the fact that the connection is achieved by a large number of nanowires and thus by a large number of elongated, hair-like structures and by heating. The large number of nanowires can create unevenness and roughness of the contact surfaces are compensated.
  • the surface area of the connection i.e. the area over which forces such as the van der Waals force act at the atomic level
  • the connection can thus be particularly good electrically and / or thermally conductive and / or mechanically stable.
  • the nanowires are formed from an electrically and / or thermally conductive material.
  • the use of copper is particularly preferred here.
  • the contact surfaces are also preferably formed from an electrically and / or thermally conductive material, in particular with copper. As described above, the use of copper is not possible, especially for welded connections.
  • an electrical and / or thermal conductivity of the connection can be particularly high.
  • a particularly good thermal conductivity of the connection can, for example, improve the cooling of the components involved in the connection.
  • the use of copper for the nanowires and / or for the contact surfaces is preferred.
  • connection described can also be formed particularly easily and without tools. Only the contact surfaces to be connected and the connecting element have to be brought together. Warming up and exertion of pressure can be optional, but are not absolutely necessary.
  • steps a) to c) are preferably carried out in the specified sequence, in particular one after the other.
  • step a) is preferably carried out before the start of steps b) and c).
  • the first contact surface can first be brought together with the first connection surface (step b)). Then the connecting element together with the component on which the first contact surface is located, are brought together with the second contact surface (step c)). This is possible in particular when the first contact surface and the second contact surface are arranged on different components.
  • Steps b) and c) can alternatively be carried out simultaneously, overlapping in time or one after the other. This is possible, for example, in that the connecting element is moved towards the two contact surfaces at the same time. This is possible in particular with two contact surfaces lying next to one another, especially when both contact surfaces are formed on the same component.
  • first connection surface and the second connection surface are connected to one another in an electrically conductive manner.
  • first component and the second component can be connected to one another in an electrically conductive manner.
  • first connection area and the second connection area are electrically insulated from one another.
  • the connecting element can furthermore have a multiplicity of nanowires on a third connecting surface and on a fourth connecting surface, the third connecting surface and the fourth connecting surface being arranged on the same side of the connecting element. This can be the side on which the first connection surface and the second connection surface are also arranged.
  • first connection surface and the second connection surface can be arranged on a different side of the connection element than the third connection surface and the fourth connection surface.
  • the method preferably further comprises: b ′) merging a third contact surface with the third connecting surface of the connecting element, and c ') merging a fourth contact surface with the fourth connecting surface of the connecting element.
  • the method can also be referred to as a “method for connecting four contact surfaces”.
  • Steps b), b '), c) and c') can be carried out simultaneously, overlapping in time or one after the other in any order.
  • the four connecting surfaces can be connected to one another in any combination in an electrically conductive or electrically insulating manner.
  • the third connection area and the fourth connection area can be connected to one another in an electrically conductive manner and all other pairs of connection areas can be electrically isolated from one another.
  • the first connecting surface and the second connecting surface can be connected to one another in an electrically conductive manner
  • the third connecting surface and the fourth connecting surface can be connected to one another in an electrically conductive manner
  • all other pairs of connecting surfaces can be electrically isolated from one another.
  • All connection surfaces can also be connected to one another in an electrically conductive manner. All connection surfaces can also be electrically isolated from one another.
  • the connecting element is formed in step a) by severing it from a starting body.
  • the nanowires can be grown on a substrate.
  • the substrate can serve as a starting body from which the connecting element is separated.
  • the starting body preferably has a multiplicity of nanowires in individual areas that are separate from one another.
  • the starting body can have one or more strips with nanowires. Several such strips are separated from one another by strips without nanowires.
  • the connecting element can be produced, for example, by cutting out a part of the starting body.
  • the separated part, which forms the connecting element preferably has a width such that the connecting element has a strip of the nanowires in the middle and, on both sides thereof, a respective part of the strips without nanowires.
  • the connecting element can also have several strips of the nanowires. The length of this part can be selected as required.
  • step b) and / or step c) are carried out at room temperature.
  • connection between the contact surfaces and the connecting surfaces can already be formed at room temperature. It is preferred that the connecting element is pressed against the contact surfaces to form the connection.
  • the pressure used here is preferably in the range of 3 MPa and 200 MPa, in particular in the range of 15 MPa and 70 MPa. A pressure of 20 MPa is particularly preferred.
  • the method further comprises: d) heating at least the contact surfaces to a temperature of at least 150.degree.
  • the contact surfaces are heated to a temperature of at least 150 ° C (as the minimum temperature), preferably to a temperature of at least 170 ° C (as the minimum temperature).
  • the temperature is preferably 200 ° C.
  • the heating is preferably carried out to a temperature of a maximum of 270.degree. C., in particular a maximum of 240.degree.
  • steps b) and / or c) are carried out at room temperature. This means that the heating does not take place until after the connection has been formed in accordance with steps b) and c).
  • the connection thus formed is strengthened by the heating.
  • the nanowires connect particularly well to the contact areas. Accordingly, it is sufficient that only the contact surfaces are heated. In practice, in the case of such heating, there is usually no distinction between whether the contact surfaces, the nanowires, the connecting element and / or the one component or the two components are heated partially or entirely. This is particularly the case when thermally conductive materials are used. be det.
  • a (co-) For the formation of the connection a (co-)
  • Heating of components other than the contact surfaces is not necessary, but also not a hindrance.
  • the heating according to step d) can in particular take place in that the one component or the two components of the connecting element are heated as a whole, for example in an oven.
  • the described minimum temperature is reached once, at least for a short time. It is not necessary to maintain the minimum temperature. However, it is preferred that the temperature to which the heating is carried out in accordance with step d) is maintained for at least 2 seconds, preferably at least 30 seconds. It can thus be ensured that the connection is formed as desired. Maintaining the temperature for a longer period is generally not harmful.
  • Steps b) and c) as well as step d) can be carried out at least partially so as to overlap in time.
  • preheating can take place before or during steps b) and c), which can be regarded as part of step d).
  • step d) can also begin before step b) or c).
  • step d) is carried out to the extent that the temperature required according to step d) is present at least temporarily even after step b) or c) has been completed.
  • a connection between two contact surfaces can be obtained without a temperature occurring at the same level as, for example, during welding or brazing.
  • this advantage can be used in that heating is dispensed with to an extent that is not required. In this way, damage to the components involved can be avoided, for example.
  • the low temperatures described can also prevent flammable materials from igniting. It is de- Accordingly, it is particularly preferred that at no point in time of the described method does a temperature of the first contact surface and / or the second contact surface exceed 270.degree. C., in particular 240.degree.
  • the connecting element is at least during part of the heating with a pressure of at least 3 MPa, in particular at least 15 MPa, and / or of at most 200 MPa, in particular of 70 MPa, to the first contact surface and / or pressed against the second contact surface. This can take place in particular in that the connecting element is pressed against the one component or the two components.
  • the pressure used is preferably in the range of 3 MPa and 200 MPa, in particular in the range of 15 MPa and 70 MPa. A pressure of 20 MPa is particularly preferred.
  • the pressure is preferably above the specified lower limit at least for a period of time in which the temperature exceeds the lower limit specified for this.
  • the nanowires and the contact surface are exposed to both a corresponding pressure and a corresponding temperature, at least in this time segment.
  • the connection can be formed by the action of pressure and temperature.
  • a connecting element for connecting a first contact surface to a second contact surface has a respective plurality of nanowires on a first connecting surface and on a second connecting surface.
  • the first connecting surface and the second connecting surface are arranged on the same side of the connecting element.
  • the connecting element is preferably designed to be electrically and / or thermally conductive.
  • the contact surfaces can be connected to one another in an electrically and / or thermally conductive manner.
  • this be the first Connection surface and the second connection surface are electrically isolated from one another.
  • the first connection surface and the second connection surface should in any case be considered to be electrically isolated from one another if an electrical resistance between the first connection surface and the second connection surface is measured to be at least 100 ko under the following conditions with a four-point measurement: room temperature, air humidity 20%, Measurement with constant voltage (i.e. not with alternating voltage), measurement with a respective electrode on the first connection surface and on the second connection surface, the electrodes touching the respective connection surface with an area of 1 cm 2.
  • connection surfaces are electrically isolated from one another, an electrically insulating, but mechanically stable and optionally also thermally conductive connection can be formed between the contact surfaces.
  • a specific electrical resistance of the material of the connecting element in the area between the first connecting surface and the second connecting surface at room temperature is preferably at least 10 5 ⁇ m, preferably at least 10 8 ⁇ m.
  • the specification described for the specific electrical resistance of the material of the connecting element relates to a measurement at constant voltage.
  • the stated value of at least 10 5 ⁇ m, preferably at least 10 8 ⁇ m, relates to the material of the connecting element.
  • the specific resistance of various materials is available in the specialist literature, for example in tables. Reference is made here to such information. If the connecting element is formed continuously from a specific material, the specific resistance of the material of the connecting element to be used here is the value given in the specialist literature for this specific material. This definition excludes all effects that do not result from the material but, for example, from the shape of the connecting element. If the connecting element is made up of different materials, the specific resistance of the individual materials must be determined from the specialist literature and the whole to determine the specific resistance of the material of the connecting element, i.e. the composition of the materials. If there is no value for the specific resistance of the material used in the specialist literature, this can be determined by measurement.
  • the first contact surface is arranged in a first region of a component and the second contact surface is arranged in a second region of the component.
  • both contact surfaces are formed on the same component.
  • the component is divided into at least two different areas.
  • the individual areas can be delimited from one another on the basis of structural features.
  • the individual areas can preferably be functionally delimited from one another.
  • the individual areas can be zones into which an electronic component is subdivided to simplify construction and assembly.
  • the first connection surface is arranged at a distance from the second connection surface.
  • connection surfaces can be distinguished by the formation of the connection.
  • nanowires can also be provided between the connection surfaces to be delimited as described. This can facilitate the growth of the nanowires because no measures have to be taken to prevent the growth of the nanowires between the connecting surfaces.
  • the positioning of the connecting element can also be made considerably easier because the connecting surfaces and contact surfaces do not have to be placed on top of one another with an exact fit. Instead, when they are brought into contact with the respective contact area, the connection surfaces are formed exactly where they are needed.
  • the connecting element also does not have to be produced specifically for a specific application.
  • a connecting element can be used flexibly for a wide variety of applications.
  • the nanowires between the connection areas can remain unused or can form connections to surface areas outside the contact area.
  • the first contact surface and the second contact surface are connected to one another in an electrically conductive, thermally conductive and / or mechanical manner by the connecting element.
  • an electrically conductive, thermally conductive and / or mechanical connection can be formed between the contact surfaces, in particular if the nanowires are formed from an electrically conductive, thermally conductive and / or mechanically stable material.
  • the first contact area and the second contact area are preferably connected to one another in an electrically conductive and / or thermally conductive manner.
  • the electrically and / or thermally conductive connection between the connection surfaces can be formed by the material of the connection element. It is sufficient here that the surface of the connection element on which the nanowires are arranged is electrically and / or thermally conductive.
  • the nanowires are connected to the connecting element by means of a layer, the layer being formed continuously between the first connecting surface and the second connecting surface.
  • the layer is preferably used for galvanic growth of the nanowires.
  • the layer is preferably formed from the material of the nanowires. In this way, a substrate can be coated with the material of the nanowires, whereby the layer is preserved.
  • the nanowires can then be grown onto the layer.
  • the growth of the nanowires can be limited to the layer. If the layer is structured by a lithographic intermediate step before the growth of the nanowires, the growth of the nanowires can be limited locally. In this way, a starting body can be obtained in which the nanowires are provided in strip form, for example.
  • the layer is thermally conductive, electrically conductive and / or designed to form a mechanical connection.
  • the connection surfaces can be thermally conductive, electrically conductive and / or mechanically connected to one another via such a layer.
  • the layer is preferably electrically conductive and / or thermally conductive. If the nanowires are also electrically and / or thermally conductive, an electrically and / or thermally conductive connection can be established between the contact surfaces.
  • the connecting element is designed like a film.
  • a film-like configuration is to be understood as meaning that the connecting element has a thickness which is very much smaller than the extent of the connecting element in the other directions.
  • the connecting element has a thickness of at most 5 mm.
  • the thickness of the connecting element is preferably in the range of 0.005 mm and 5 mm [millimeters], in particular in the range of 0.01 mm and 1 mm.
  • a film-like connecting element is preferably designed to be flexible.
  • the connecting element is designed in the form of a band.
  • the connecting surfaces are arranged on one of the two surfaces of the belt which have a considerably larger surface area than all other surfaces (which result from the material thickness of the belt).
  • the tape material can be provided as a roll.
  • the nanowires can already be provided on the strip material and can be protected, for example, by a protective varnish. Before using the connecting element, the protective varnish can be removed and the nanowires exposed. A part of the strip material required in each case can be separated from the roll for use.
  • the connecting element can also be referred to as a "connecting tape” and in particular as a “KlettWelding tape”.
  • an arrangement which has a connecting element and a component.
  • the component has: a first contact surface which is connected to a first connection surface of the connecting element by means of a multiplicity of nanowires, and
  • a second contact surface which is connected to a second connecting surface of the connecting element by means of a plurality of nanowires, the first connecting surface and the second connecting surface being arranged on the same side of the connecting element.
  • FIG. 1 an illustration of a method according to the invention for connecting two components
  • FIG. 2 an illustration of a method according to the invention for connecting two components
  • FIG. 2 an illustration of an arrangement according to the invention of two components connected to one another according to the method from FIG. 1, and FIG. 1
  • FIG. 3 an illustration of a further arrangement according to the invention
  • FIG. 4 an illustration of a further arrangement according to the invention
  • FIG. 5 an illustration of a method according to the invention for connecting two contact surfaces
  • FIG. 6 a side view of a first arrangement according to the invention with a component with two contact surfaces connected to one another according to the method from FIG. 5,
  • FIG. 7 a view from below of the connecting element from FIG. 6,
  • FIGS. 6 and 7 a view from below of an output body from which the connecting element from FIGS. 6 and 7 can be obtained.
  • 9 a view from below of a second embodiment of a connecting element
  • FIG. 11 a side view of a further arrangement according to the invention with a component with two contact surfaces connected to one another according to the method from FIG. 5.
  • FIG. 1 shows a method for connecting a first component 2 to a second component 3.
  • the reference symbols used relate to FIG a first connection surface 7 on a first side 10 of the connection element 6 and on a second connection surface 8 on a second side 11 of the connection element 6 opposite the first side 10, the first connection surface 7 and the second connection surface 8 being electrically isolated from one another, b) merging a contact surface 4 of the first component 2 with the first connection surface 7 of the connection element 6, and c) merging of a contact surface 5 of the second component 3 with the second connection surface 8 of the connection element 6.
  • Steps b) and / or c) are preferably carried out at room temperature.
  • the method can furthermore comprise the following optional step indicated in FIG. 1 by a dashed box: d) Heating at least the contact surfaces 4, 5 to a temperature of at least 150.degree.
  • FIG. 2 shows an arrangement 9 which can be obtained with the method from FIG. 1.
  • the arrangement 9 comprises a first component 2, which is connected to the connecting element 6 by means of a multiplicity of nanowires 1 via a first connecting surface 7 on a first side 10 of a connecting element 6.
  • the arrangement 9 comprises a second component 3, which is connected by means of a multiplicity of nanowires 1 via a second connecting surface 8 on one of the first side 10.
  • the opposite second side 11 of the connecting element 6 is connected to the connecting element 6.
  • the first component 2 and the second component 3 have a respective contact surface 4, 5.
  • the first connection area 7 and the second connection area 8 are electrically isolated from one another.
  • the connecting element 6 is formed from a ceramic material at least in the area between the first connecting surface 7 and the second connecting surface 8, so that a specific electrical resistance of the connecting element 6 at least in this area is at least 10 10 ⁇ m.
  • the connecting element 6 is formed like a film. A thickness of the connecting element 6 is at most 5 mm. The thickness of the connecting element 6 can be seen in FIG. 2 as the expansion of the connecting element 6 in a vertical direction.
  • the third shows an arrangement 12 with a first component 2, a functional element 13, a second component 3, a first connecting element 6 and a second connecting element 14.
  • the first component 2 is a plurality of nanowires 1 with a first connecting surface 7 of the first connecting element 6 connected.
  • the functional element 13 is connected on a first side via a plurality of nanowires 1 to a second connection surface 8 of the first connection element 6 and on a second side via a plurality of nanowires 1 to a first connection surface 7 of the second connection element 14.
  • the second component 3 is connected to a second connecting surface 8 of the second connecting element 14 via a multiplicity of nanowires 1.
  • the connecting surfaces 7, 8 of the connecting elements 6, 14 are each electrically isolated from one another.
  • the arrangement 12 shown in FIG. 3 can be produced by applying the method from FIG. 1 twice.
  • the fourth component 17 shows an arrangement 15 with a first component 2, a second component 3, a third component 16 and a fourth component 17.
  • the first component 2 is by means of a plurality of nanowires 1 via a first connecting surface 7 on a first side 10 of a connecting element 6 connected to the connecting element 6.
  • the second component 3 is connected to the connecting element 6 by means of a multiplicity of nanowires 1 via a second connecting surface 8 on a second side 11 of the connecting element 6 opposite the first side 10.
  • the first th connecting surface 7 and the second connecting surface 8 are electrically isolated from one another.
  • the third component 16 is connected to the connecting element 6 by means of a multiplicity of nanowires 1 via a third connecting surface 20 on the first side 10 of the connecting element 6.
  • the fourth component 17 is connected to the connecting element 6 by means of a multiplicity of nanowires 1 via a fourth connecting surface 21 on the second side 11 of the connecting element 6.
  • the third connection surface 20 and the fourth connection surface 21 are connected to one another in an electrically conductive manner.
  • a respective contact surface 4, 5, 18, 19 of the components 2, 3, 16, 17 is also drawn in.
  • the method comprises: a) Providing a connecting element 106 with a plurality of nanowires 101 on a first connecting surface 107 and on a second connection surface 108, the first connection surface 107 and the second connection surface 108 being arranged on the same side of the connection element 106, b) merging the first contact surface 102 with the first connection surface 107 of the connection element 106, and c ) Merging the second contact surface 103 with the second connecting surface 108 of the connecting element 106.
  • the connecting element 106 can be formed in step a) by separating it from the starting body 112 shown in FIG. 8.
  • Steps b) and / or c) are preferably carried out at room temperature.
  • the method can furthermore comprise the following optional step indicated in FIG. 5 by a dashed box: d) Heating at least the contact surfaces 102, 103 to a temperature of at least 150.degree.
  • FIG. 6 shows an arrangement 109 having a connecting element 106 and a component 110.
  • the component 110 has a first contact surface 102 and a second contact surface 103.
  • the first contact surface 102 is connected to a first connecting surface 107 of the connecting element 106 by means of a multiplicity of nanowires 101 tied together.
  • the second contact surface 103 is connected to a second connecting surface 108 of the connecting element 106 by means of a multiplicity of nanowires 101.
  • the first connection surface 107 and the second connection surface 108 are arranged on the same side of the connection element 106. In the example shown in FIG. 6, this is the downward-facing side of the connecting element 106.
  • the first contact surface 102 is arranged in a first region 104 of the component 110.
  • the second contact surface 103 is arranged in a second region 105 of the component 110.
  • the connecting surfaces 107, 108 are arranged at a distance from one another.
  • the nanowires 101 are connected to the connecting element 106 by means of a layer 111.
  • the layer 111 is formed continuously between the first connection surface 107 and the second connection surface 108.
  • the layer 111 is electrically and thermally conductive.
  • the nanowires 101 are formed from an electrically and thermally conductive material. To this extent, the contact surfaces 102, 103 are connected to one another in an electrically and thermally conductive manner.
  • FIG. 7 shows a view from below of the connecting element 106 from FIG. 6, which can be used in the method from FIG. 5.
  • the layer 111 can be seen.
  • FIG. 7 shows the situation before the connection is formed, so that no connection areas have yet been defined.
  • FIG. 8 shows a starting body 112 with a multiplicity of strips of the layer 111. These strips with nanowires 101 are spaced from one another by strips without nanowires 101. Dashed lines indicate how the connecting element 106 can be obtained by cutting out of the preferably film-like starting body 112. The extension of the connecting element 106 along the strip of the layer 111 can be selected as required. A connecting element 106 can also be formed with more than one strip of the layer 111. A multiplicity of connecting elements 106 can be separated from the starting body 112. The connecting element 106 drawn in dashed lines is a first of these that is cut off at a corner in the example shown. Alternatively, for example, the entire output body 112 can also be used as a connecting element ment 106 can be used.
  • the strips of the layer 111 are arranged regularly as in the embodiment shown.
  • An irregular pattern with different widths of the strips, with different distances between adjacent strips, with different lengths of the strips (in the right-left direction in FIG. 8) and / or with different orientations of the strips is also possible.
  • FIGS. 9 and 10 show two embodiments of connecting elements 6 with a different arrangement of the layer 111.
  • the connecting element 106 comprises a strip of the layer 111, the width of which decreases continuously.
  • This connecting element 6 can in particular be used to connect a large contact area (on the left side of the connecting element 106) with a small contact area (right).
  • the connecting element 6 according to FIG. 10 comprises four strips of the layer 111.
  • the strips have different lengths.
  • the connecting element 106 can be used to form four connections, the respective first contact surfaces being arranged on a line and the respective second contact surfaces being arranged on a line inclined to this.
  • FIG. 11 shows a second arrangement 109 of interconnected contact surfaces 102, 103.
  • This arrangement 109 differs from the arrangement 109 from FIG. 6 in that the contact surfaces 2, 3 are not arranged on different areas 104, 105 of a component 110. Instead, the first contact surface 102 is arranged on a first component 110 and the second contact surface 103 on a second component 113.
  • the two components 110, 113 are not arranged parallel to one another. It is shown as an example that the two components enclose an angle of 90 ° with one another. An arrangement at a different angle is also possible.
  • the feature that there are separate components 110, 113 and the feature that the contact surfaces 102, 103 are not aligned parallel to one another are independent of one another.
  • regions 104, 105 of a component 110 can also enclose an angle with one another.
  • the two components 110, 113 form an angular arrangement, on the inner side of which the connecting element 106 is arranged.
  • the connecting element 106 can also be arranged on an outside of the angle arrangement.
  • the outside of the angle arrangement is formed by the left side of the first component 110 and the lower side of the second component 113.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Wire Bonding (AREA)
  • Secondary Cells (AREA)

Abstract

L'invention concerne un élément de liaison (6) permettant de relier un premier composant (2) et un deuxième composant (3) présente sur une première surface de liaison (7) d'un premier côté (10) de l'élément de liaison (6) et sur une deuxième surface de liaison (8) d'un deuxième côté (11), opposé au premier côté (10), de l'élément de liaison (6) respectivement une pluralité de nanofils (1), la première surface de liaison (7) et la deuxième surface de liaison (8) étant électriquement isolées l'une de l'autre. Un procédé permettant de lier un premier composant (2) à un deuxième composant (3) comprend les étapes consistant à : a) fournir un élément de connexion (6) comprenant une pluralité respective de nanofils (1) sur une première surface de connexion (7) d'un premier côté (10) de l'élément de connexion (6) et sur une seconde surface de connexion (8) d'un deuxième côté (11) de l'élément de connexion (6), opposé au premier côté (10), la première surface de connexion (7) et la seconde surface de connexion (8) étant électriquement isolées l'une de l'autre; b) assemblage d'une surface de contact (4) du premier composant (2) avec la première surface de connexion (7) de l'élément de connexion (6); c) et assemblage d'une surface de contact (5) du second composant (3) avec la seconde surface de connexion (8) de l'élément de connexion (6). L'élément de liaison (6) peut également avoir une pluralité respective de nanofils (1) sur une troisième surface de liaison (20) du premier côté (10) de l'élément de liaison (6) et sur une quatrième surface de liaison (21) du deuxième côté (11) de l'élément de liaison (6), la troisième surface de liaison (20) et la quatrième surface de liaison (21) étant reliées de manière électroconductrice, et le procédé comprenant également les étapes suivantes : b') assemblage d'une surface de contact (18) d'un troisième composant (16) avec la troisième surface de liaison (20) de l'élément de liaison (6), et c') assemblage d'une surface de contact (19) d'un quatrième composant (17) avec la quatrième surface de liaison (21) de l'élément de liaison (6). L'élément de liaison (6) peut être conçu sous forme de film. L'élément de liaison (6) peut être formé dans la zone située entre la première surface de liaison (7) et la deuxième surface de liaison (8) dans un matériau céramique. Un ensemble (12) peut comprendre : un premier composant (2), un premier élément de liaison (6), un élément fonctionnel (13), un deuxième élément de liaison (14) et un deuxième composant (3), l'élément fonctionnel (13) sert à au moins une des fonctions suivantes : dissipation de chaleur, amortissement de vibrations, stabilisation mécanique. En variante, un procédé de liaison d'une première surface de contact (2) et d'une deuxième surface de contact (3) comprend les étapes consistant à : a) fournir un élément de liaison (6) avec une pluralité de nanofils (1) sur une première surface de liaison (7) et sur une deuxième surface de liaison (8), la première surface de liaison (7) et la deuxième surface de liaison (8) étant disposés du même côté de l'élément de liaison (6), b) assemblage de la première surface de contact (2) avec la première surface de liaison (7) de l'élément de liaison (6), et c) assemblage de la deuxième surface de contact (3) avec la deuxième surface de liaison (8) de l'élément de liaison (6). Les nanofils (1) peuvent par l'intermédiaire d'une couche (11) être en liaison avec l'élément de liaison (6), la couche (11) étant formée en continu entre la première surface de liaison (7) et la deuxième surface de liaison (8) et étant électroconductrice et thermoconductrice. La largeur de la couche (11) peut diminuer en continu. L'élément de liaison (6) peut également comporter quatre bandes de la couche (11), qui sont de longueurs différentes. L'élément de liaison (6) peut à l'étape a) être formé par la séparation d'un corps de départ (12). La première surface de liaison (7) peut être disposée à une certaine distance de la deuxième surface de liaison (8). La première surface de contact (2) et la deuxième surface de contact (3) peuvent par l'intermédiaire de l'élément de liaison (6) être électroconductrices, thermoconductrices et/ou être mécaniquement reliées l'une à l'autre. La première surface de contact (2) et la deuxième surface de contact (3) peuvent être disposées sur le même composant (10) ou sur des composants différents (10, 13), les deux composants (10, 13) ne peuvent pas être disposés parallèlement les uns aux autres, par exemple, les deux composants peuvent former ensemble un angle de 90°. Dans le cas des deux composants (2, 3, 10, 13), il peut s'agir d'un composant électronique ou de deux composants électroniques comme, par exemple, d'éléments semi-conducteurs, de puces, de microprocesseurs ou de platines. Il est également possible de monter un composant comme un capteur (en tant que premier composant (2)) sur une paroi ou un support (en tant que deuxième composant (3)).
EP21711504.7A 2020-03-18 2021-03-08 Connexion de composants Pending EP4122008A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102020107511.1A DE102020107511A1 (de) 2020-03-18 2020-03-18 Verbinden von zwei Bauteilen mittels Klettwelding-Tape
DE102020107513.8A DE102020107513A1 (de) 2020-03-18 2020-03-18 Verbindung von zwei Kontaktflächen
PCT/EP2021/055802 WO2021185618A1 (fr) 2020-03-18 2021-03-08 Connexion de composants

Publications (1)

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EP4122008A1 true EP4122008A1 (fr) 2023-01-25

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EP (1) EP4122008A1 (fr)
JP (1) JP2023518076A (fr)
KR (1) KR20230021636A (fr)
TW (1) TW202145390A (fr)
WO (1) WO2021185618A1 (fr)

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WO2023202931A1 (fr) 2022-04-21 2023-10-26 Biotronik Se & Co. Kg Jonction à énergie réduite et automatisable au moyen d'un nanocâblage pour la mise en contact de composants électriques et mécaniques d'implants actifs et de surveillance

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US10791651B2 (en) * 2016-05-31 2020-09-29 Carbice Corporation Carbon nanotube-based thermal interface materials and methods of making and using thereof
DE102017126724A1 (de) * 2017-11-14 2019-05-16 Nanowired Gmbh Verfahren und Verbindungselement zum Verbinden von zwei Bauteilen sowie Anordnung von zwei verbundenen Bauteilen

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KR20230021636A (ko) 2023-02-14
TW202145390A (zh) 2021-12-01
WO2021185618A1 (fr) 2021-09-23

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