WO2019051918A1 - 一种显示面板的制程及制程装置 - Google Patents

一种显示面板的制程及制程装置 Download PDF

Info

Publication number
WO2019051918A1
WO2019051918A1 PCT/CN2017/106291 CN2017106291W WO2019051918A1 WO 2019051918 A1 WO2019051918 A1 WO 2019051918A1 CN 2017106291 W CN2017106291 W CN 2017106291W WO 2019051918 A1 WO2019051918 A1 WO 2019051918A1
Authority
WO
WIPO (PCT)
Prior art keywords
alignment film
substrate
unit
display panel
reworked
Prior art date
Application number
PCT/CN2017/106291
Other languages
English (en)
French (fr)
Inventor
黄北洲
Original Assignee
惠科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 惠科股份有限公司 filed Critical 惠科股份有限公司
Publication of WO2019051918A1 publication Critical patent/WO2019051918A1/zh

Links

Images

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1337Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers

Definitions

  • the present application relates to the field of display technologies, and more particularly to a process and a process device for a display panel.
  • the liquid crystal display has many advantages such as thin body, power saving, no radiation, and has been widely used.
  • Most of the liquid crystal displays on the market are backlight type liquid crystal displays, which include a liquid crystal panel and a backlight module.
  • the working principle of the liquid crystal panel is to place liquid crystal molecules in two parallel glass substrates, and apply a driving voltage on the two glass substrates to control the rotation direction of the liquid crystal molecules to refract the light of the backlight module to generate a picture.
  • a thin film transistor liquid crystal display includes a liquid crystal panel including a color filter substrate (CF Substrate, also referred to as a color filter substrate), and a thin film transistor array substrate (Thin Film Transistor Substrate, TFT Substrate). And a mask, a transparent electrode is present on the opposite inner side of the substrate. A layer of liquid crystal molecules (LC) is sandwiched between the two substrates.
  • CF Substrate also referred to as a color filter substrate
  • TFT Substrate Thin Film Transistor Substrate, TFT Substrate
  • the technical problem to be solved by the present application is to provide a process for a display panel having low rework cost and high production efficiency.
  • the present application also provides a process device for a display panel.
  • a process for displaying a panel comprising the steps of:
  • the alignment film unit to be reworked is removed using an alignment film release agent.
  • wet etch is an etching method that mainly engraves the suede on a relatively flat film surface, thereby increasing the optical path, reducing the reflection of light, and etching the diluted hydrochloric acid.
  • Wet etching is a technique of immersing an etching material in an etching solution for etching. It is a purely etched etching and has excellent selectivity. The film is stopped after etching, without damaging the underlying layer. Films of other materials. Wet etching is generally used for wafer preparation, cleaning, etc., which do not involve graphics in front of the process.
  • the step of coating the initial alignment film on the surface of the substrate further comprises the steps of:
  • the initial alignment film is coated by inkjet coating
  • Inkjet that is, ink coating (INK)
  • INK ink coating
  • Pre bake achieves pre-bake solvent (solvent for improving the solubility and printability of the alignment film), smoothing the alignment film, and evaporating the solvent as much as possible.
  • Post bake circulates the alignment film, and can use far infrared heating, hot air circulation heating, hot plate heating, and the like.
  • the step of coating the initial alignment film on the surface of the substrate further comprises the steps of:
  • the substrate is dried by heating. It is ensured that the substrate is kept clean and dry before coating the alignment film, which facilitates the setting of the alignment film.
  • the first substrate is provided with a color filter layer and a transparent electrode layer
  • the first substrate and The second substrate is opposite to each other
  • the first surface of the first substrate is opposite to the first surface of the second substrate
  • the spacer unit and the liquid crystal molecule are disposed between the first substrate and the second substrate .
  • COT CF on TFT
  • POT POT
  • a spacer photo spacer, PS is interposed between the two substrates to keep the two at a certain interval, which is convenient for boxing.
  • the initial alignment film is heated and hardened in an infrared heating furnace.
  • the alignment film release agent is N-methylpyrrolidone.
  • the initial alignment film is heated in a infrared heating furnace for pre-baking.
  • the application also discloses a process for displaying a display panel.
  • a process for displaying a panel comprising the steps of:
  • Coating an initial alignment film on the first surface of the substrate coating the initial alignment film by inkjet, and pre-baking the initial alignment film by heating;
  • the first substrate is provided with a color filter layer and a transparent electrode layer
  • the first substrate and the second substrate are opposed to each other
  • the first surface of the first substrate and the second substrate are A surface is opposed to each other
  • a spacer unit and liquid crystal molecules are disposed between the first substrate and the second substrate.
  • a process device for a display panel comprising:
  • An alignment film coating unit configured to apply an initial alignment film on the substrate of the display panel
  • An alignment film detecting unit for detecting defects of the initial alignment film, and determining an alignment film unit to be reworked;
  • An alignment film stripping unit for removing the alignment film unit to be reworked, the alignment film stripping unit comprising an alignment film release agent.
  • the alignment film stripping unit comprises a wet etching machine
  • the wet etching machine is engraved by wet etching
  • the reticle mode removes the alignment film unit to be reworked.
  • the specific equipment can be selected for the alignment film release unit.
  • the alignment film coating unit comprises an alignment film baking furnace, and the alignment film baking furnace heats the initial alignment film to perform pre-baking and hardening.
  • the specific film coating unit can be selected for the specific equipment.
  • the alignment film detecting unit includes a charge coupled device camera, and the charge coupled device camera continuously captures the image to be inspected by scanning the initial alignment film, and then detects the image to be inspected and determines that it needs to be reworked.
  • Alignment membrane unit The charge coupled device camera includes a charge coupled device chip, and the image of the object is focused on a CCD (Charge Coupled Device) chip through a lens.
  • the CCD accumulates a corresponding proportion of charge according to the intensity of the light, and the charge accumulated in each pixel is controlled in video timing. Next, shifting point by point, after filtering and amplifying processing, forming a video signal output.
  • the alignment film baking furnace adopts an infrared heating furnace.
  • the present invention removes the alignment film unit to be reworked by using the alignment film release agent after detecting the initial alignment film setting, does not cause possible damage to the substrate of the display panel, and timely and effectively processes the rework alignment without adding additional process steps.
  • Membrane unit reduces rework costs and increases production efficiency.
  • FIG. 1 is a schematic flow chart of a process of a display panel according to an embodiment of the present application
  • FIG. 2 is a schematic flow chart of a process of a display panel according to an embodiment of the present application
  • FIG. 3 is a structural block diagram of a process device for a display panel according to an embodiment of the present application.
  • FIG. 4 is a structural block diagram of a process device for a display panel according to an embodiment of the present application.
  • FIG. 5 is a schematic structural diagram of a display panel according to an embodiment of the present application.
  • FIG. 6 is a schematic structural diagram of a display panel according to an embodiment of the present application.
  • FIG. 7 is a schematic structural diagram of a display panel according to an embodiment of the present application.
  • first and second are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, features defining “first” and “second” may include one or more of the features either explicitly or implicitly.
  • a plurality means two or more unless otherwise stated.
  • the term “comprises” and its variations are intended to cover a non-exclusive inclusion.
  • connection In the description of the present application, it should be noted that the terms “installation”, “connected”, and “connected” are to be understood broadly, and may be fixed or detachable, for example, unless otherwise explicitly defined and defined. Connected, or integrally connected; can be mechanical or electrical; can be directly connected, or indirectly connected through an intermediate medium, can be the internal communication of the two components.
  • Connected, or integrally connected can be mechanical or electrical; can be directly connected, or indirectly connected through an intermediate medium, can be the internal communication of the two components.
  • the specific meanings of the above terms in the present application can be understood in the specific circumstances for those skilled in the art.
  • the process of the display panel includes the steps of:
  • S11 providing two substrates: a first substrate 1 and a second substrate 2;
  • S15 removing the reticular alignment film unit to be reworked using an alignment film release agent.
  • the present invention removes the alignment film unit to be reworked by using the alignment film release agent after detecting the initial alignment film setting, does not cause possible damage to the substrate of the display panel, and timely and effectively processes the rework alignment without adding additional process steps.
  • Membrane unit reduces rework costs and increases production efficiency.
  • the alignment film can also be detected and removed in the initial alignment film setting step. Among them, Post bake circulates the alignment film, and can use far infrared heating, hot air circulation heating, hot plate heating, and the like. Generally, the temperature is high in the IR furnace (infrared heating furnace), so that the uniformity is better.
  • Hard film is a process of drying glass at a suitable temperature after development to remove moisture and enhance polymerization and strength, which enhances adhesion of the film to glass.
  • the temperature and time required to set the film should be based on the firmness of the film pattern and the principle of no deformation.
  • the material of the alignment film remover can be NMP (N-methylpyrrolidone), also known as 1-methyl-2-pyrrolidone or N-methyl-2-pyrrolidone.
  • NMP N-methylpyrrolidone
  • PS spacer unit 8
  • the use of dry etching to remove the alignment film requires higher requirements: it takes a short time to dissolve the alignment film, and it is not possible to cause aluminum (Al) or copper (Cu) corrosion on the array side. Damage to the CF side of the color filter substrate side, and can not damage the process mechanism, that is, PVC, PE, PP, PTFE (polytetrafluoroethylene), nylon-66, EPDM (ethylene propylene diene monomer) ), SUS304 (304 stainless steel) caused damage. Therefore, it is not convenient to use in the process, and it also needs to be not due to its Stripper. Processing creates new problems that affect process progress.
  • the process of the display panel includes the steps of:
  • the alignment film remover is used to remove the alignment film unit to be reworked, which does not cause possible damage to the substrate of the display panel, and timely and effectively processes the alignment film unit to be reworked without adding an additional process step. Reduce rework costs and increase production efficiency.
  • the alignment film can also be detected and removed in the initial alignment film setting step. Inkjet, that is, ink coating (INK), has a good effect, excellent adhesion performance, simple operation process, and is not prone to falling off and light leakage. Pre bake achieves pre-bake solvent (solvent for improving the solubility and printability of the alignment film), smoothing the alignment film, and evaporating the solvent as much as possible.
  • the method further comprises the steps of: cleaning the substrate; and heating and drying the substrate. It is ensured that the substrate is kept clean and dry before coating the alignment film, which facilitates the setting of the alignment film.
  • the substrate can be wet washed under a high pressure water column using a high density brush and a mixed lotion.
  • an atmospheric plasma (AP) substrate can be used to stabilize the surface tension when the ink droplets are dropped.
  • AP atmospheric plasma
  • UV excimer ultraviolet light
  • UV uses short-wavelength UV to cut the combination of the substrate and the organic matter, and decomposes into water and carbon dioxide, thereby achieving the effect of removing organic floating.
  • the infrared (IR) baking substrate is used in combination with the cooling plate so that the substrate is in a state of being dried with the alignment film to be coated.
  • the first substrate 1 is provided with a color filter layer 5 and a transparent electrode layer 6.
  • the first substrate 1 and the second substrate 2 are opposed to each other, and the first surface of the first substrate 1 and the second substrate
  • the first surface of the second substrate 2 is opposed to each other, and the spacer unit 8 and the liquid crystal molecules are disposed between the first substrate 1 and the second substrate 2.
  • COT CF on TFT
  • POT POT
  • a spacer spacer 8 photo spacer, PS is interposed between the two substrates to keep the two at a certain interval, which facilitates the formation of a cassette.
  • the first substrate 1 is subjected to processes such as physical vapor deposition, exposure, wet etching, chemical vapor deposition, dry etching, etc. in the Array factory; and the first substrate 1 is coated with color filter in the CF factory. Layer 5; then, the first substrate 1 is subjected to processes such as chemical vapor deposition, exposure, dry etching, physical vapor deposition, wet etching, etc. at the Array factory; and the first substrate 1 is overlaid on the CF factory.
  • Upper transparent conductive layer is
  • CVD Chemical Vapor Deposition
  • chemical vapor deposition chemical vapor deposition, developed in the gas phase at high temperatures, as a means of coating, but not only for the coating of heat-resistant substances, but also for the purification of high-purity metals, powder synthesis, semiconductors Film and the like.
  • the deposition temperature is low, the film composition is easy to control, the film thickness is proportional to the deposition time, the uniformity, the repeatability is good, and the step coverage is excellent.
  • PVD Physical Vapor Deposition
  • physical vapor deposition can also be used to realize the transfer of atoms by physical processes, and transfer atoms or molecules from the source to the surface of the substrate.
  • PVD vacuum evaporation, sputtering, ion plating (hollow cathode ion plating, hot cathode ion plating, arc ion plating, active reactive ion plating, radio frequency ion plating, DC discharge ion plating). As shown in FIG.
  • the process of the display panel includes the steps of: providing two substrates: a first substrate 1 and a second substrate 2; applying the initial alignment film by inkjet coating; Initially aligning the film to perform pre-baking; heating the initial alignment film to harden; detecting the initial alignment film setting, determining the reoriented film unit to be reworked; and removing the device by wet etching An alignment film unit that requires rework.
  • the alignment film remover is used to remove the alignment film unit to be reworked, which does not cause possible damage to the substrate of the display panel, and timely and effectively processes the alignment film unit to be reworked without adding an additional process step. Reduce rework costs and increase production efficiency.
  • the alignment film can also be detected and removed in the initial alignment film setting step.
  • Inkjet that is, ink coating (INK)
  • INK ink coating
  • Pre bake achieves pre-bake solvent (solvent for improving the solubility and printability of the alignment film), smoothing the alignment film, and evaporating the solvent as much as possible. It is usually carried out in a pre-drying furnace. The purpose of the pre-baking is to promote evaporation of the solvent in the applied photoresist film to increase the adhesion of the film to the surface of the glass substrate.
  • the infrared heating furnace is used for low temperature heating, so that it is in a state of being dry and not hardened. Thus, the photoresist can still undergo a chemical reaction during exposure.
  • Post bake circulates the alignment film, and can use far infrared heating, hot air circulation heating, hot plate heating, and the like.
  • the temperature is high in the IR furnace (infrared heating furnace), so that the uniformity is better.
  • Hard film is a process of drying glass at a suitable temperature after development to remove moisture and enhance polymerization and strength, which enhances adhesion of the film to glass. The temperature and time required to set the film should be based on the firmness of the film pattern and the principle of no deformation.
  • Wet etch is an etching method that mainly engraves the suede on a relatively flat film surface, thereby increasing the optical path, reducing the reflection of light, and etching the diluted hydrochloric acid.
  • Wet etching is a technique of immersing an etching material in an etching solution for etching. It is a purely etched etching and has excellent selectivity. The film is stopped after etching, without damaging the underlying layer. Films of other materials.
  • Wet etching is generally used for wafer preparation, cleaning, etc., which do not involve graphics in front of the process.
  • the step of coating the initial alignment film on the surface of the substrate further includes the steps of:
  • the substrate can be wet washed under a high pressure water column using a high density brush and a mixed lotion.
  • an atmospheric plasma (AP) substrate can be used to stabilize the surface tension when the ink droplets are dropped.
  • UV excimer ultraviolet light
  • UV uses short-wavelength UV to cut the combination of the substrate and the organic matter, and decomposes into water and carbon dioxide, thereby achieving the effect of removing organic floating.
  • IR infrared
  • the first substrate 1 is provided with a color filter layer 5 and a transparent electrode layer 6.
  • the first substrate 1 and the second substrate 2 are opposed to each other.
  • the first surface of the substrate 1 and the second surface of the second substrate 2 are opposed to each other, and a spacer unit 8 and liquid crystal molecules are disposed between the first substrate 1 and the second substrate 2.
  • COT CF on TFT
  • POT POT
  • a spacer spacer 8 photo spacer, PS is interposed between the two substrates to keep the two at a certain interval, which facilitates the formation of a cassette.
  • the first substrate 1 is subjected to processes such as physical vapor deposition, exposure, wet etching, chemical vapor deposition, dry etching, etc. in the Array factory; and the first substrate 1 is coated with color filter in the CF factory. Layer 5; then, the first substrate 1 is subjected to processes such as chemical vapor deposition, exposure, dry etching, physical vapor deposition, wet etching, etc. at the Array factory; and the first substrate 1 is overlaid on the CF factory.
  • Upper transparent conductive layer As shown in FIG.
  • the process device of the display panel includes: an alignment film coating unit for coating an initial alignment film on a substrate of the display panel; and an alignment film detection a unit for detecting defects of the initial alignment film, and determining an alignment film unit to be reworked; an alignment film release unit for removing the alignment film unit to be reworked, wherein the alignment film release unit includes an alignment film release unit Membrane.
  • the alignment film unit is used to remove the alignment film unit to be reworked, and the substrate of the display panel is not damaged, and the additional processing steps are not added, and the timely and effective processing needs to be reworked.
  • the aligning membrane unit reduces rework costs and increases production efficiency.
  • the process device of the display panel includes: an alignment film coating unit for coating an initial alignment film on a substrate of the display panel; and an alignment film detection a unit for detecting defects of the initial alignment film and determining an alignment film unit to be reworked; an alignment film release unit for removing the alignment film unit to be reworked, wherein the alignment film release unit includes Film release agent.
  • the alignment film unit is used to remove the alignment film unit to be reworked, and the substrate of the display panel is not damaged, and the additional processing steps are not added, and the timely and effective processing needs to be reworked.
  • the aligning membrane unit reduces rework costs and increases production efficiency.
  • the alignment film coating unit includes an alignment film baking furnace, and the alignment film baking furnace heats the initial alignment film to perform pre-baking and hardening.
  • the alignment film baking furnace comprises an IR furnace (infrared heating furnace), and the film thickness of the inkjet coating is firstly heated in the IR furnace to achieve pre-baked solvent (solvent for improving the solubility and printing of the alignment film).
  • the alignment film is flattened, the solvent can be volatilized as much as possible, and the alignment film is circulated by high temperature action in the IR furnace.
  • the alignment film detecting unit includes a charge coupled device camera, and the charge coupled device camera continuously captures the image to be inspected by scanning the initial alignment film, and then detects the image to be inspected and determines the alignment to be reworked. Membrane unit.
  • the charge coupled device camera includes a charge coupled device chip, and the image of the object is focused on a CCD (Charge Coupled Device) chip through a lens.
  • the CCD accumulates a corresponding proportion of charge according to the intensity of the light, and the charge accumulated in each pixel is controlled in video timing. Next, shifting point by point, after filtering and amplifying processing, forming a video signal output.
  • the alignment film detecting unit detects defects of the initial alignment film, and the defects include defects on the substrate after the foreign matter is applied on the film, in the film or in the pre-step step, causing uneven film thickness or failure of the repair of the precursor step, stabbing ( The glass is pierced by sharp foreign objects, which may be related to high temperature processes, making the glass brittle and vulnerable), scratches (due to friction caused by objects above the glass path) and Mura.
  • the use of the alignment film detecting unit may be performed not only after the hardening process but also between the pre-baking and the hardening process.
  • the process device of the display panel includes: an alignment film coating unit for coating an initial alignment film on a substrate of the display panel; and an alignment film detecting unit for detecting the Determining the defect of the initial alignment film, determining the alignment film unit to be reworked; the alignment film release unit: for removing the alignment film unit to be reworked, the alignment film release unit comprising a wet etching machine, the wet The etching machine removes the alignment film unit to be reworked by wet etching.
  • the alignment film coating unit includes an alignment film baking furnace, and the alignment film baking furnace heats the initial alignment film to perform pre-baking and hardening.
  • the alignment film baking furnace comprises an IR furnace, and the film thickness of the inkjet coating is firstly heated in the IR furnace to achieve pre-baked solvent (solvent for improving the solubility and printability of the alignment film), so that the alignment
  • solvent solvent for improving the solubility and printability of the alignment film
  • the alignment film detecting unit includes a charge coupled device camera, and the charge coupled device camera continuously captures the image to be inspected by scanning the initial alignment film, and then detects the image to be inspected and determines the alignment to be reworked.
  • Membrane unit is a charge coupled device camera, and the charge coupled device camera continuously captures the image to be inspected by scanning the initial alignment film, and then detects the image to be inspected and determines the alignment to be reworked.
  • the charge coupled device camera includes a charge coupled device chip, and the image of the object is focused on a CCD (Charge Coupled Device) chip through a lens.
  • the CCD accumulates a corresponding proportion of charge according to the intensity of the light, and the charge accumulated in each pixel is controlled in video timing. Next, shifting point by point, after filtering and amplifying processing, forming a video signal output.
  • the alignment film detecting unit detects defects of the initial alignment film, and the defects include defects on the substrate after the foreign matter is applied on the film, in the film or in the pre-step step, causing uneven film thickness or failure of the repair of the precursor step, stabbing ( The glass is pierced by sharp foreign objects, which may be related to high temperature processes, making the glass brittle and vulnerable), scratches (due to friction caused by objects above the glass path) and Mura.
  • the use of the alignment film detecting unit may be performed not only after the hardening process but also between the pre-baking and the hardening process.
  • the material of the substrate may be glass, plastic or the like.
  • the display panel includes a liquid crystal panel, an OLED (Organic Light-Emitting Diode) panel, a curved panel, a plasma panel, etc.
  • the liquid crystal panel includes an array substrate (Thin Film Transistor Substrate, TFT Substrate) and a color filter substrate (CF Substrate), the array substrate is disposed opposite to the color filter substrate, and a liquid crystal and a spacer (PS) are disposed between the array substrate and the color filter substrate, and the array substrate A thin film transistor (TFT) is disposed on the color film substrate, and a color filter layer is disposed on the color filter substrate.
  • TFT Thin Film Transistor Substrate
  • CF Substrate color filter substrate
  • PS liquid crystal and a spacer
  • the color filter substrate may include a TFT array
  • the color film and the TFT array may be formed on the same substrate
  • the array substrate may include a color filter layer
  • the display panel of the present application may be a curved type panel.

Abstract

一种显示面板的制程及制程装置,该制程包括步骤:提供两块基板:第一基板(1)和第二基板(2)(S11);在基板的第一表面上涂布初始配向膜(S12);对该初始配向膜加热进行坚膜(S13);检测该初始配向膜的设置,确定其中的需返工的配向膜单元(S14);使用配向膜脱膜剂去除需返工的配向膜单元(S15)。

Description

一种显示面板的制程及制程装置 【技术领域】
本申请涉及显示技术领域,更具体的说,涉及一种显示面板的制程及制程装置。
【背景技术】
液晶显示器具有机身薄、省电、无辐射等众多优点,得到了广泛的应用。现有市场上的液晶显示器大部分为背光型液晶显示器,其包括液晶面板及背光模组(backlightmodule)。液晶面板的工作原理是在两片平行的玻璃基板当中放置液晶分子,并在两片玻璃基板上施加驱动电压来控制液晶分子的旋转方向,以将背光模组的光线折射出来产生画面。
其中,薄膜晶体管液晶显示器(Thin Film Transistor-Liquid Crystal Display,TFT-LCD)由于具有低的功耗、优异的画面品质以及较高的生产良率等性能,目前已经逐渐占据了显示领域的主导地位。同样,薄膜晶体管液晶显示器包含液晶面板和背光模组,液晶面板包括彩膜基板(Color Filter Substrate,CF Substrate,也称彩色滤光片基板)、薄膜晶体管阵列基板(Thin Film Transistor Substrate,TFT Substrate)和光罩(Mask),上述基板的相对内侧存在透明电极。两片基板之间夹一层液晶分子(Liquid Crystal,LC)。
然而配向膜在显示面板的涂布设置中,不免会遇到返工等情况,对配向膜的脱膜却不能及时有效的处理,这样往往不仅影响产能的提高,还常常因脱膜破坏基板造成更大的工作量以及成本损失。
【发明内容】
本申请所要解决的技术问题是提供一种的返工成本低、生产效率高的显示面板的制程。
此外,本申请还提供一种显示面板的制程装置。
本申请的目的是通过以下技术方案来实现的:
一种显示面板的制程,所述制程包括步骤:
提供两块基板:第一基板和第二基板;
在所述基板的第一表面上涂布初始配向膜;
对所述初始配向膜加热进行坚膜;
检测所述初始配向膜的设置,确定其中的需返工的配向膜单元;
使用配向膜脱膜剂去除所述需返工的配向膜单元。
其中,使用湿法刻蚀的方式去除所述需返工的配向膜单元。湿法刻蚀(Wet etch)是一种刻蚀方法,主要在较为平整的膜面上刻出绒面,从而增加光程,减少光的反射,刻蚀可用稀释的盐酸等。湿法刻蚀是将刻蚀材料浸泡在腐蚀液内进行腐蚀的技术,它是一种纯化学刻蚀,具有优良的选择性,刻蚀完当前薄膜就会停止,而不会损坏下面一层其他材料的薄膜。湿法刻蚀一般被用于工艺流程前面的晶圆片准备、清洗等不涉及图形的环节。
其中,在所述基板的表面上涂布初始配向膜的步骤中还包括步骤:
通过喷墨的方式涂布设置所述初始配向膜;
对所述初始配向膜加热进行前烘;
喷墨也即油墨涂布(INK)的方式效果佳,粘附性能优异,操作工艺简单,不容易出现脱落和漏光的现象。前烘(pre bake)实现预烤去溶剂(solvent,用于提升配向膜的溶解性和可印刷性)、使得配向膜平整化,能尽可能的挥发掉溶剂。坚膜(Post bake)将配向膜固靠环化,可采用远红外线加热、热风循环加热、热板加热等。
其中,在所述基板的表面上涂布初始配向膜的步骤之前还包括步骤:
清洗所述基板;
加热干燥所述基板。保证基板在涂布配向膜之前保持清洁干燥的状态,便于配向膜的设置。
其中,所述第一基板上设置有彩色滤光层和透明电极层,所述第一基板和 所述第二基板对置,所述第一基板的第一表面和所述第二基板的第一表面对置,所述第一基板和所述第二基板之间设置有间隔单元和液晶分子。这里是COT(CF on TFT)、POT(PS on TFT)的实施方式。两块基板之间散布间隔单元(photo spacer,PS)用来使两者保持一定的间隔,这样便于成盒。
其中,在红外线加热炉中对所述初始配向膜加热进行坚膜。
其中,所述配向膜脱膜剂采用N-甲基吡咯烷酮。
其中,在红外线加热炉中对所述初始配向膜加热进行前烘。
本申请还公开了一种显示面板的制程。
一种显示面板的制程,所述制程包括步骤:
提供两块基板:第一基板和第二基板;
在所述基板的第一表面上涂布初始配向膜:通过喷墨的方式涂布设置所述初始配向膜,对所述初始配向膜加热进行前烘;
对所述初始配向膜加热进行坚膜;
检测所述初始配向膜的设置,确定其中的需返工的配向膜单元;
使用配向膜脱膜剂去除所述需返工的配向膜单元;
其中,所述第一基板上设置有彩色滤光层和透明电极层,所述第一基板和所述第二基板对置,所述第一基板的第一表面和所述第二基板的第一表面对置,所述第一基板和所述第二基板之间设置有间隔单元和液晶分子。
本申请还公开了一种显示面板的制程装置。一种显示面板的制程装置,所述制程装置包括:
配向膜涂布单元:用以在所述显示面板的基板上涂布设置初始配向膜;
配向膜检测单元:用以检测所述初始配向膜的缺陷、确定需返工的配向膜单元;
配向膜脱膜单元:用以去除所述需返工的配向膜单元,所述配向膜脱膜单元包括配向膜脱膜剂。
其中,所述配向膜脱膜单元包括湿法刻蚀机,所述湿法刻蚀机通过湿法刻 蚀的方式去除所述需返工的配向膜单元。配向膜脱膜单元可以用的具体设备选择。
其中,所述配向膜涂布单元包括配向膜烘烤炉,所述配向膜烘烤炉对所述初始配向膜加热进行前烘、坚膜。配向膜涂布单元可以用的具体设备选择。
其中,所述配向膜检测单元包括电荷耦合器件摄像机,所述电荷耦合器件摄像机通过扫描的方式对所述初始配向膜连续拍摄采集待检图像,再对所述待检图像进行检测、确定需返工的配向膜单元。电荷耦合器件摄像机包括电荷耦合器件芯片,被摄物体的图像经过镜头聚焦至CCD(Charge Coupled Device)芯片上,CCD根据光的强弱积累相应比例的电荷,各个像素积累的电荷在视频时序的控制下,逐点外移,经滤波、放大处理后,形成视频信号输出。
其中,所述配向膜烘烤炉采用红外线加热炉。
本申请由于检测初始配向膜的设置后使用配向膜脱膜剂去除需返工的配向膜单元,不对显示面板的基板造成可能的破坏,不增加额外的制程步骤的同时及时有效的处理需返工的配向膜单元,降低返工成本、提高生产效率。
【附图说明】
所包括的附图用来提供对本申请实施例的进一步的理解,其构成了说明书的一部分,用于例示本申请的实施方式,并与文字描述一起来阐释本申请的原理。显而易见地,下面描述中的附图仅仅是本申请的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动性的前提下,还可以根据这些附图获得其他的附图。在附图中:
图1是本申请实施例一种显示面板的制程的流程示意图;
图2是本申请实施例一种显示面板的制程的流程示意图;
图3是本申请实施例一种显示面板的制程装置的结构框图;
图4是本申请实施例一种显示面板的制程装置的结构框图;
图5是本申请实施例一种显示面板的结构示意图;
图6是本申请实施例一种显示面板的结构示意图;
图7是本申请实施例一种显示面板的结构示意图。
【具体实施方式】
这里所公开的具体结构和功能细节仅仅是代表性的,并且是用于描述本申请的示例性实施例的目的。但是本申请可以通过许多替换形式来具体实现,并且不应当被解释成仅仅受限于这里所阐述的实施例。
在本申请的描述中,需要理解的是,术语“中心”、“横向”、“上”、“下”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本申请和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本申请的限制。此外,术语“第一”、“第二”仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本申请的描述中,除非另有说明,“多个”的含义是两个或两个以上。另外,术语“包括”及其任何变形,意图在于覆盖不排他的包含。
在本申请的描述中,需要说明的是,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体地连接;可以是机械连接,也可以是电连接;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通。对于本领域的普通技术人员而言,可以具体情况理解上述术语在本申请中的具体含义。
这里所使用的术语仅仅是为了描述具体实施例而不意图限制示例性实施例。除非上下文明确地另有所指,否则这里所使用的单数形式“一个”、“一项”还意图包括复数。还应当理解的是,这里所使用的术语“包括”和/或“包含”规定所陈述的特征、整数、步骤、操作、单元和/或组件的存在,而不排除存在 或添加一个或更多其他特征、整数、步骤、操作、单元、组件和/或其组合。
下面结合附图和较佳的实施例对本申请作进一步详细说明。
作为本申请的一个实施例,如图1所示,所述显示面板的制程包括步骤:
S11:提供两块基板:第一基板1和第二基板2;
S12:在所述基板的第一表面上涂布初始配向膜;
S13:对所述初始配向膜加热进行坚膜;
S14:检测所述初始配向膜的设置,确定其中的需返工的配向膜单元;
S15:使用配向膜脱膜剂去除所述需返工的配向膜单元。本申请由于检测初始配向膜的设置后使用配向膜脱膜剂去除需返工的配向膜单元,不对显示面板的基板造成可能的破坏,不增加额外的制程步骤的同时及时有效的处理需返工的配向膜单元,降低返工成本、提高生产效率。在初始配向膜设置的步骤中也可以对配向膜进行检测和去除。其中,坚膜(Post bake)将配向膜固靠环化,可采用远红外线加热、热风循环加热、热板加热等。一般在IR炉(红外线加热炉)内高温,这样均匀性更好。坚膜是在显影后以适当的温度烘干玻璃以除去水分并增强其聚合,提高强度的工艺,它增强了胶膜与玻璃的粘附性。设定坚膜所需的温度与时间,应以膜层图形的牢固性和不致变形为原则。
其中,配向膜脱膜剂材料可采用NMP(N-甲基吡咯烷酮),又称1-甲基-2吡咯烷酮、N-甲基-2-吡咯烷酮。无色透明油状液体,微有胺的气味。能与水、醇、醚、酯、酮、卤代烃、芳烃和蓖麻油互溶。挥发度低,热稳定性、化学稳定性均佳,能随水蒸气挥发。有吸湿性。对光敏感。相比较,利用干法刻蚀脱去配向膜(Stripper)会影响间隔单元8(PS)厚度造成成盒有重力不均问题。同时,利用干法刻蚀脱去配向膜(Stripper)的要求较高:需要短时间溶解配向膜,不可对阵列基板侧(array side)造成铝(Al)或者铜(Cu)腐蚀,也不可以对彩膜基板侧(CF side)压克立造成伤害,也不能伤害制程机构,即不可以对PVC、PE、PP、PTFE(聚四氟乙烯)、尼龙-66、EPDM(三元乙丙橡胶)、SUS304(304不锈钢)造成伤害。因此在制程中并不能方便使用、同时还需要不因它的Stripper 处理产生新的问题而影响制程进展。
作为本申请的又一个实施例,如图2所示,所述显示面板的制程包括步骤:
S21:提供两块基板:第一基板1和第二基板2;
S22:通过喷墨的方式涂布设置所述初始配向膜;
S23:对所述初始配向膜加热进行前烘;
S24:对所述初始配向膜加热进行坚膜;
S25:检测所述初始配向膜的设置,确定其中的需返工的配向膜单元;
S26:使用配向膜脱膜剂去除所述需返工的配向膜单元。
检测初始配向膜的设置后使用配向膜脱膜剂去除需返工的配向膜单元,不对显示面板的基板造成可能的破坏,不增加额外的制程步骤的同时及时有效的处理需返工的配向膜单元,降低返工成本、提高生产效率。在初始配向膜设置的步骤中也可以对配向膜进行检测和去除。喷墨也即油墨涂布(INK)的方式效果佳,粘附性能优异,操作工艺简单,不容易出现脱落和漏光的现象。前烘(pre bake)实现预烤去溶剂(solvent,用于提升配向膜的溶解性和可印刷性)、使得配向膜平整化,能尽可能的挥发掉溶剂。一般在预干燥炉进行。前烘的目的是促使已涂的光刻胶膜内的溶剂挥发以增加胶膜与玻璃基板表面的粘附性。一般多采用红外线加热炉低温加热,使其处于既干燥又未硬化的状态。这样,进行曝光时光刻胶仍可发生化学反应。具体的,在所述基板的表面上涂布初始配向膜的步骤之前还包括步骤:清洗所述基板;加热干燥所述基板。保证基板在涂布配向膜之前保持清洁干燥的状态,便于配向膜的设置。可以采用高密度的毛刷配合混合洗剂在高压水柱下对基板进行湿洗。另外还可以采用大气电浆(AP)作用基板,使得墨滴滴下时表面张力安定化。使用准分子紫外光(UV)利用短波长的UV来切断基板与有机物的结合,分解为水和二氧化碳会发,达到去除有机浮游的效果。使用红外线(IR)烘烤基板结合冷却板使得基板处于干燥的待涂布配向膜的状态。
其中,如图5-7所示(其中,包括配向膜3、缺陷4和薄膜晶体管7),所述 第一基板1上设置有彩色滤光层5和透明电极层6,所述第一基板1和所述第二基板2对置,所述第一基板1的第一表面和所述第二基板2的第一表面对置,所述第一基板1和所述第二基板2之间设置有间隔单元8和液晶分子。这里是COT(CF on TFT)、POT(PS on TFT)的实施方式。两块基板之间散布间隔单元8(photo spacer,PS)用来使两者保持一定的间隔,这样便于成盒。在Array工厂对第一基板1进行诸如物理气相沉积、曝光、湿法刻蚀、化学气相沉积法、干法刻蚀等工序处理;再在CF工厂将第一基板1上覆设上彩色滤光层5;接着在Array工厂对第一基板1进行诸如化学气相沉积、曝光、干法刻蚀、物理气相沉积法、湿法刻蚀等工序处理;再在CF工厂将第一基板1上覆设上透明导电层。CVD(Chemical Vapor Deposition)化学气相沉积法,在高温下的气相反应,作为涂层的手段而开发,但不只应用于耐热物质的涂层,而且应用于高纯度金属的精制、粉末合成、半导体薄膜等。沉积温度低,薄膜成份易控,膜厚与淀积时间成正比,均匀性,重复性好,台阶覆盖性优良。同样也可以采用PVD(Physical Vapor Deposition)物理气相沉积法,利用物理过程实现物质转移,将原子或分子由源转移到基材表面上的过程。它的作用是可以使某些有特殊性能(强度高、耐磨性、散热性、耐腐性等)的微粒喷涂在性能较低的母体上,使得母体具有更好的性能。PVD基本方法:真空蒸发、溅射、离子镀(空心阴极离子镀、热阴极离子镀、电弧离子镀、活性反应离子镀、射频离子镀、直流放电离子镀)。如图5所示,经过检测发现第一基板1或者第二基板2有问题的需对基板返工,返工后的Array or CF必须回厂Recycle to bare glass(原玻璃),造成产能及成本损失;接着,如图6-7所示,经检测发现配向膜有问题(比如膜上有缺陷的情况)便需对配向膜返工或者仅仅去除存在的缺陷。
作为本申请的又一个实施例,所述显示面板的制程包括步骤:提供两块基板:第一基板1和第二基板2;通过喷墨的方式涂布设置所述初始配向膜;对所述初始配向膜加热进行前烘;对所述初始配向膜加热进行坚膜;检测所述初始配向膜的设置,确定其中的需返工的配向膜单元;使用湿法刻蚀的方式去除所 述需返工的配向膜单元。检测初始配向膜的设置后使用配向膜脱膜剂去除需返工的配向膜单元,不对显示面板的基板造成可能的破坏,不增加额外的制程步骤的同时及时有效的处理需返工的配向膜单元,降低返工成本、提高生产效率。在初始配向膜设置的步骤中也可以对配向膜进行检测和去除。喷墨也即油墨涂布(INK)的方式效果佳,粘附性能优异,操作工艺简单,不容易出现脱落和漏光的现象。前烘(pre bake)实现预烤去溶剂(solvent,用于提升配向膜的溶解性和可印刷性)、使得配向膜平整化,能尽可能的挥发掉溶剂。一般在预干燥炉进行。前烘的目的是促使已涂的光刻胶膜内的溶剂挥发以增加胶膜与玻璃基板表面的粘附性。一般多采用红外线加热炉低温加热,使其处于既干燥又未硬化的状态。这样,进行曝光时光刻胶仍可发生化学反应。坚膜(Post bake)将配向膜固靠环化,可采用远红外线加热、热风循环加热、热板加热等。一般在IR炉(红外线加热炉)内高温,这样均匀性更好。坚膜是在显影后以适当的温度烘干玻璃以除去水分并增强其聚合,提高强度的工艺,它增强了胶膜与玻璃的粘附性。设定坚膜所需的温度与时间,应以膜层图形的牢固性和不致变形为原则。湿法刻蚀(Wet etch)是一种刻蚀方法,主要在较为平整的膜面上刻出绒面,从而增加光程,减少光的反射,刻蚀可用稀释的盐酸等。湿法刻蚀是将刻蚀材料浸泡在腐蚀液内进行腐蚀的技术,它是一种纯化学刻蚀,具有优良的选择性,刻蚀完当前薄膜就会停止,而不会损坏下面一层其他材料的薄膜。湿法刻蚀一般被用于工艺流程前面的晶圆片准备、清洗等不涉及图形的环节。
具体的,在所述基板的表面上涂布初始配向膜的步骤之前还包括步骤:
清洗所述基板;加热干燥所述基板。保证基板在涂布配向膜之前保持清洁干燥的状态,便于配向膜的设置。可以采用高密度的毛刷配合混合洗剂在高压水柱下对基板进行湿洗。另外还可以采用大气电浆(AP)作用基板,使得墨滴滴下时表面张力安定化。使用准分子紫外光(UV)利用短波长的UV来切断基板与有机物的结合,分解为水和二氧化碳会发,达到去除有机浮游的效果。使用红外线(IR)烘烤基板结合冷却板使得基板处于干燥的待涂布配向膜的状态。
其中,如图5-7所示,所述第一基板1上设置有彩色滤光层5和透明电极层6,所述第一基板1和所述第二基板2对置,所述第一基板1的第一表面和所述第二基板2的第二表面对置,所述第一基板1和所述第二基板2之间设置有间隔单元8和液晶分子。这里是COT(CF on TFT)、POT(PS on TFT)的实施方式。两块基板之间散布间隔单元8(photo spacer,PS)用来使两者保持一定的间隔,这样便于成盒。在Array工厂对第一基板1进行诸如物理气相沉积、曝光、湿法刻蚀、化学气相沉积法、干法刻蚀等工序处理;再在CF工厂将第一基板1上覆设上彩色滤光层5;接着在Array工厂对第一基板1进行诸如化学气相沉积、曝光、干法刻蚀、物理气相沉积法、湿法刻蚀等工序处理;再在CF工厂将第一基板1上覆设上透明导电层。如图5所示,经过检测发现第一基板1或者第二基板2有问题的需对基板返工,返工后的Array or CF必须回厂Recycle to bare glass(原玻璃),造成产能及成本损失;接着,如图6-7所示,经检测发现配向膜有问题(比如膜上有缺陷的情况)便需对配向膜返工或者仅仅去除存在的缺陷。
作为本申请的又一个实施例,如图3所示,所述显示面板的制程装置包括:配向膜涂布单元:用以在所述显示面板的基板上涂布设置初始配向膜;配向膜检测单元:用以检测所述初始配向膜的缺陷、确定需返工的配向膜单元;配向膜脱膜单元:用以去除所述需返工的配向膜单元,所述配向膜脱膜单元包括配向膜脱膜剂。通过配向膜检测单元检测初始配向膜的设置后使用配向膜脱膜剂去除需返工的配向膜单元,不对显示面板的基板造成可能的破坏,不增加额外的制程步骤的同时及时有效的处理需返工的配向膜单元,降低返工成本、提高生产效率。
作为本申请的又一个实施例,如图4所示,所述显示面板的制程装置包括:配向膜涂布单元:用以在所述显示面板的基板上涂布设置初始配向膜;配向膜检测单元:用以检测所述初始配向膜的缺陷、确定需返工的配向膜单元;配向膜脱膜单元:用以去除所述需返工的配向膜单元,所述配向膜脱膜单元包括配 向膜脱膜剂。通过配向膜检测单元检测初始配向膜的设置后使用配向膜脱膜剂去除需返工的配向膜单元,不对显示面板的基板造成可能的破坏,不增加额外的制程步骤的同时及时有效的处理需返工的配向膜单元,降低返工成本、提高生产效率。所述配向膜涂布单元包括配向膜烘烤炉,所述配向膜烘烤炉对所述初始配向膜加热进行前烘、坚膜。
所述配向膜烘烤炉包括IR炉(红外线加热炉),经喷墨涂布配向膜厚先在IR炉内低温加热实现预烤去溶剂(solvent,用于提升配向膜的溶解性和可印刷性)、使得配向膜平整化,能尽可能的挥发掉溶剂,再在IR炉内高温作用将配向膜固靠环化。所述配向膜检测单元包括电荷耦合器件摄像机,所述电荷耦合器件摄像机通过扫描的方式对所述初始配向膜连续拍摄采集待检图像,再对所述待检图像进行检测、确定需返工的配向膜单元。电荷耦合器件摄像机包括电荷耦合器件芯片,被摄物体的图像经过镜头聚焦至CCD(Charge Coupled Device)芯片上,CCD根据光的强弱积累相应比例的电荷,各个像素积累的电荷在视频时序的控制下,逐点外移,经滤波、放大处理后,形成视频信号输出。配向膜检测单元检测初始配向膜的缺陷,缺陷包括由异物在膜上、膜内或者前序步骤作用后的基板上的缺陷,造成膜厚不均或者前序步骤修复失败的颗粒,刺伤(玻璃被尖锐异物刺穿,可能和高温制程有关,使玻璃较脆易损坏),刮伤(由于玻璃行经路线上方的物体摩擦造成的)以及Mura。另外,配向膜检测单元的使用不只在坚膜工序后,也可以在前烘和坚膜工序之间。
作为本申请的又一个实施例,所述显示面板的制程装置包括:配向膜涂布单元:用以在所述显示面板的基板上涂布设置初始配向膜;配向膜检测单元:用以检测所述初始配向膜的缺陷、确定需返工的配向膜单元;配向膜脱膜单元:用以去除所述需返工的配向膜单元,所述配向膜脱膜单元包括湿法刻蚀机,所述湿法刻蚀机通过湿法刻蚀的方式去除所述需返工的配向膜单元。通过配向膜检测单元检测初始配向膜的设置后使用湿法刻蚀的方式去除需返工的配向膜单元,不对显示面板的基板造成可能的破坏,不增加额外的制程步骤的同时及时 有效的处理需返工的配向膜单元,降低返工成本、提高生产效率。所述配向膜涂布单元包括配向膜烘烤炉,所述配向膜烘烤炉对所述初始配向膜加热进行前烘、坚膜。所述配向膜烘烤炉包括IR炉,经喷墨涂布配向膜厚先在IR炉内低温加热实现预烤去溶剂(solvent,用于提升配向膜的溶解性和可印刷性)、使得配向膜平整化,能尽可能的挥发掉溶剂,再在IR炉内高温作用将配向膜固靠环化。所述配向膜检测单元包括电荷耦合器件摄像机,所述电荷耦合器件摄像机通过扫描的方式对所述初始配向膜连续拍摄采集待检图像,再对所述待检图像进行检测、确定需返工的配向膜单元。电荷耦合器件摄像机包括电荷耦合器件芯片,被摄物体的图像经过镜头聚焦至CCD(Charge Coupled Device)芯片上,CCD根据光的强弱积累相应比例的电荷,各个像素积累的电荷在视频时序的控制下,逐点外移,经滤波、放大处理后,形成视频信号输出。配向膜检测单元检测初始配向膜的缺陷,缺陷包括由异物在膜上、膜内或者前序步骤作用后的基板上的缺陷,造成膜厚不均或者前序步骤修复失败的颗粒,刺伤(玻璃被尖锐异物刺穿,可能和高温制程有关,使玻璃较脆易损坏),刮伤(由于玻璃行经路线上方的物体摩擦造成的)以及Mura。另外,配向膜检测单元的使用不只在坚膜工序后,也可以在前烘和坚膜工序之间。
需要说明的是,在上述实施例中,所述基板的材料可以选用玻璃、塑料等。
在上述实施例中,显示面板包括液晶面板、OLED(Organic Light-Emitting Diode)面板、曲面面板、等离子面板等,以液晶面板为例,液晶面板包括阵列基板(Thin Film Transistor Substrate,TFT Substrate)和彩膜基板(Color Filter Substrate,CF Substrate),所述阵列基板与彩膜基板相对设置,所述阵列基板与彩膜基板之间设有液晶和间隔单元(PS,photo spacer),所述阵列基板上设有薄膜晶体管(TFT,Thin Film Transistor),彩膜基板上设有彩色滤光层。
在上述实施例中,彩膜基板可包括TFT阵列,彩膜及TFT阵列可形成于同一基板上,阵列基板可包括彩色滤光层。
在上述实施例中,本申请的显示面板可为曲面型面板。
以上内容是结合具体的优选实施方式对本申请所作的进一步详细说明,不能认定本申请的具体实施只局限于这些说明。对于本申请所属技术领域的普通技术人员来说,在不脱离本申请构思的前提下,还可以做出若干简单推演或替换,都应当视为属于本申请的保护范围。

Claims (16)

  1. 一种显示面板的制程,包括步骤:
    提供两块基板:第一基板和第二基板;
    在所述基板的第一表面上涂布初始配向膜;
    对所述初始配向膜加热进行坚膜;
    检测所述初始配向膜的设置,确定其中的需返工的配向膜单元;
    使用配向膜脱膜剂去除所述需返工的配向膜单元。
  2. 如权利要求1所述的显示面板的制程,其中使用湿法刻蚀的方式去除所述需返工的配向膜单元。
  3. 如权利要求1所述的显示面板的制程,其中在所述基板的表面上涂布初始配向膜的步骤中还包括步骤:
    通过喷墨的方式涂布设置所述初始配向膜;
    对所述初始配向膜加热进行前烘。
  4. 如权利要求1所述的显示面板的制程,其中在所述基板的表面上涂布初始配向膜的步骤之前还包括步骤:
    清洗所述基板;
    加热干燥所述基板。
  5. 如权利要求3所述的显示面板的制程,其中在所述基板的表面上涂布初始配向膜的步骤之前还包括步骤:
    清洗所述基板;
    加热干燥所述基板。
  6. 如权利要求1所述的显示面板的制程,其中所述第一基板上设置有彩色滤光层和透明电极层,所述第一基板和所述第二基板对置,所述第一基板的第一表面和所述第二基板的第一表面对置,所述第一基板和所述第二基板之间设置有间隔单元和液晶分子。
  7. 如权利要求1所述的显示面板的制程,其中在红外线加热炉中对所述初始配向膜加热进行坚膜。
  8. 如权利要求1所述的显示面板的制程,其中所述配向膜脱膜剂采用N-甲基吡咯烷酮。
  9. 如权利要求3所述的显示面板的制程,其中在红外线加热炉中对所述初始配向膜加热进行前烘。
  10. 一种显示面板的制程,包括步骤:
    提供两块基板:第一基板和第二基板;
    在所述基板的第一表面上涂布初始配向膜:通过喷墨的方式涂布设置所述初始配向膜,对所述初始配向膜加热进行前烘;
    对所述初始配向膜加热进行坚膜;
    检测所述初始配向膜的设置,确定其中的需返工的配向膜单元;
    使用配向膜脱膜剂去除所述需返工的配向膜单元;
    其中,所述第一基板上设置有彩色滤光层和透明电极层,所述第一基板和所述第二基板对置,所述第一基板的第一表面和所述第二基板的第一表面对置,所述第一基板和所述第二基板之间设置有间隔单元和液晶分子。
  11. 一种显示面板的制程装置,包括:
    配向膜涂布单元:用以在所述显示面板的基板上涂布设置初始配向膜;
    配向膜检测单元:用以检测所述初始配向膜的缺陷、确定需返工的配向膜单元;
    配向膜脱膜单元:用以去除所述需返工的配向膜单元,所述配向膜脱膜单元包括配向膜脱膜剂。
  12. 如权利要求11所述的显示面板的制程装置,其中所述配向膜脱膜单元包括湿法刻蚀机,所述湿法刻蚀机通过湿法刻蚀的方式去除所述需返工的配向膜单元。
  13. 如权利要求11所述的显示面板的制程装置,其中所述配向膜涂布单元 包括配向膜烘烤炉,所述配向膜烘烤炉对所述初始配向膜加热进行前烘、坚膜。
  14. 如权利要求11所述的显示面板的制程装置,其中所述配向膜检测单元包括电荷耦合器件摄像机,所述电荷耦合器件摄像机通过扫描的方式对所述初始配向膜连续拍摄采集待检图像,再对所述待检图像进行检测、确定需返工的配向膜单元。
  15. 如权利要求11所述的显示面板的制程装置,其中所述配向膜脱膜单元包括湿法刻蚀机,所述湿法刻蚀机通过湿法刻蚀的方式去除所述需返工的配向膜单元;
    所述配向膜涂布单元包括配向膜烘烤炉,所述配向膜烘烤炉对所述初始配向膜加热进行前烘、坚膜;
    所述配向膜检测单元包括电荷耦合器件摄像机,所述电荷耦合器件摄像机通过扫描的方式对所述初始配向膜连续拍摄采集待检图像,再对所述待检图像进行检测、确定需返工的配向膜单元。
  16. 如权利要求15所述的显示面板的制程装置,其中所述配向膜烘烤炉采用红外线加热炉。
PCT/CN2017/106291 2017-09-18 2017-10-16 一种显示面板的制程及制程装置 WO2019051918A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201710838185.7A CN107577089A (zh) 2017-09-18 2017-09-18 一种显示面板的制程及制程装置
CN201710838185.7 2017-09-18

Publications (1)

Publication Number Publication Date
WO2019051918A1 true WO2019051918A1 (zh) 2019-03-21

Family

ID=61032813

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2017/106291 WO2019051918A1 (zh) 2017-09-18 2017-10-16 一种显示面板的制程及制程装置

Country Status (2)

Country Link
CN (1) CN107577089A (zh)
WO (1) WO2019051918A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109739035B (zh) * 2019-03-20 2020-12-25 深圳市华星光电半导体显示技术有限公司 剥离检测系统及液晶面板的剥离检测方法
CN110687703B (zh) * 2019-10-16 2022-05-31 深圳市华星光电半导体显示技术有限公司 液晶配向膜的修补装置及修补液晶配向膜的方法
CN112599711B (zh) * 2020-12-10 2022-07-29 深圳市华星光电半导体显示技术有限公司 Oled器件的制备方法及oled器件
CN113035099A (zh) * 2021-03-18 2021-06-25 深圳市联测光电科技有限公司 液晶面板的色斑修复方法及所用系统测试架构与de-mura设备

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040105511A (ko) * 2003-06-09 2004-12-16 주식회사 넥스컴 러빙상태 측정장치 및 측정방법
CN102103291A (zh) * 2010-12-17 2011-06-22 深圳市华星光电技术有限公司 配向膜修补设备及其修补方法
CN102253506A (zh) * 2010-05-21 2011-11-23 京东方科技集团股份有限公司 液晶显示基板的制造方法及检测修补设备
CN102402074A (zh) * 2011-12-05 2012-04-04 深圳市华星光电技术有限公司 取向膜修复系统
CN104914133A (zh) * 2015-06-19 2015-09-16 合肥京东方光电科技有限公司 摩擦缺陷检测装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100949641B1 (ko) * 2006-05-16 2010-03-26 샤프 가부시키가이샤 표시 패널의 제조 방법, 표시 패널의 제조 장치, 및 표시 패널
CN100582897C (zh) * 2006-12-29 2010-01-20 群康科技(深圳)有限公司 液晶面板制造方法
CN101290417A (zh) * 2007-04-18 2008-10-22 奇美电子股份有限公司 液晶显示面板及其基板的制造方法
JP2011170142A (ja) * 2010-02-19 2011-09-01 Seiko Epson Corp 液晶装置の製造方法
CN102792215B (zh) * 2010-04-07 2015-09-16 夏普株式会社 液晶面板的制造方法、液晶面板以及修复装置
WO2012086158A1 (ja) * 2010-12-21 2012-06-28 シャープ株式会社 膜欠損修正方法及びそれを用いた液晶表示パネルの製造方法
CN102662273A (zh) * 2012-05-11 2012-09-12 昆山天卓贸易有限公司 一种配向微尘清洁装置
CN103576389B (zh) * 2013-11-18 2015-12-09 京东方科技集团股份有限公司 配向层组及其制造方法、基板和显示装置
CN105116620A (zh) * 2015-08-21 2015-12-02 昆山龙腾光电有限公司 显示基板的摩擦配向方法
CN105629587A (zh) * 2016-03-25 2016-06-01 京东方科技集团股份有限公司 显示面板及其制备方法、显示装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040105511A (ko) * 2003-06-09 2004-12-16 주식회사 넥스컴 러빙상태 측정장치 및 측정방법
CN102253506A (zh) * 2010-05-21 2011-11-23 京东方科技集团股份有限公司 液晶显示基板的制造方法及检测修补设备
CN102103291A (zh) * 2010-12-17 2011-06-22 深圳市华星光电技术有限公司 配向膜修补设备及其修补方法
CN102402074A (zh) * 2011-12-05 2012-04-04 深圳市华星光电技术有限公司 取向膜修复系统
CN104914133A (zh) * 2015-06-19 2015-09-16 合肥京东方光电科技有限公司 摩擦缺陷检测装置

Also Published As

Publication number Publication date
CN107577089A (zh) 2018-01-12

Similar Documents

Publication Publication Date Title
WO2019051918A1 (zh) 一种显示面板的制程及制程装置
US10082705B2 (en) Liquid crystal display device and method of manufacturing the same
KR100928928B1 (ko) 액정표시패널의 제조방법
JP5111015B2 (ja) 感光性有機物及びその塗布方法並びにこれを用いた有機膜パターンの形成方法及びこの有機膜を有する表示装置
WO2015169081A1 (zh) Ito膜层刻蚀方法和包含使用该方法形成的电极层的阵列基板
CN104834118A (zh) 液晶显示装置的制造方法和制造装置
US20060144822A1 (en) Apparatus and method for wet-etching
WO2013082846A1 (zh) 取向膜修复系统
CN104051311B (zh) 基板传送装置及适用于湿制程的强酸或强碱刻蚀工艺
CN107346727B (zh) 基板清洗方法及成膜方法
CN101630084A (zh) 制作显示面板的方法
KR20070009407A (ko) 배향막을 제조하는 제조 장치, 액정 장치, 및 전자 기기
US7515234B2 (en) Alignment method using ion beam irradiation
JP2008179850A (ja) アモルファスito膜の成膜方法およびその装置
WO2013174107A1 (zh) 前烘设备及其排气方法
WO2020037947A1 (zh) 清洗光罩的装置及方法
WO2020042869A1 (zh) 液晶显示面板的聚酰亚胺涂布方法
US20120060870A1 (en) Cleansing Apparatus for Substrate and Cleansing Method for the Same
CN101038351B (zh) 彩色滤光片基板的返工方法
KR100830129B1 (ko) 듀얼 에어 나이프가 설치된 건조 장치
JP2008049221A (ja) 着色フォトレジストの塗布方法及び塗布装置並びにカラーフィルタの製造方法
JP2010046980A (ja) 印刷装置及び印刷物の製造方法
WO2019041630A1 (zh) 阵列基板的制作方法及其制作设备
JP2008225091A (ja) 液晶表示パネルの製造方法、及び、液晶表示装置の製造方法
JP2011039327A (ja) 洗浄力評価方法及び液晶表示装置の製造方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17924786

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 17924786

Country of ref document: EP

Kind code of ref document: A1