WO2019051817A1 - 一种半导体冷凝型空气净化加湿器 - Google Patents

一种半导体冷凝型空气净化加湿器 Download PDF

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Publication number
WO2019051817A1
WO2019051817A1 PCT/CN2017/101990 CN2017101990W WO2019051817A1 WO 2019051817 A1 WO2019051817 A1 WO 2019051817A1 CN 2017101990 W CN2017101990 W CN 2017101990W WO 2019051817 A1 WO2019051817 A1 WO 2019051817A1
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Prior art keywords
air
passage
water
semiconductor
casing
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PCT/CN2017/101990
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English (en)
French (fr)
Inventor
王元秀
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王元秀
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Priority to PCT/CN2017/101990 priority Critical patent/WO2019051817A1/zh
Publication of WO2019051817A1 publication Critical patent/WO2019051817A1/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F8/00—Treatment, e.g. purification, of air supplied to human living or working spaces otherwise than by heating, cooling, humidifying or drying
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
    • F24F13/28—Arrangement or mounting of filters
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F6/00—Air-humidification, e.g. cooling by humidification
    • F24F6/12—Air-humidification, e.g. cooling by humidification by forming water dispersions in the air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
    • Y02B30/70—Efficient control or regulation technologies, e.g. for control of refrigerant flow, motor or heating

Definitions

  • the invention belongs to the technical field of environmental protection and relates to a semiconductor condensation type air purification humidifier.
  • Air purifiers currently on the market usually use filtration technology to remove particulate suspended matter from the air for clean air. These air purifiers require regular replacement of the filter and are costly to use.
  • the air humidifier atomizes the water through an atomizing device and then discharges it into the air to achieve the purpose of humidifying the air.
  • the tap water contains a variety of bacteria, microorganisms, and fine dust particles, these substances will inevitably spread to the air as the water mist is discharged, causing illness.
  • the present invention discloses a semiconductor condensing type air purifying humidifier which can both humidify air and remove particulate suspended matter or smog in the air, and does not require a filter net, and has low noise and use.
  • the object of the present invention is to provide a semiconductor condensing type air purifying humidifier which, in the case of throwing away the conventional use of a filter net, invents a method capable of humidifying air and removing particulate suspended matter or smog in the air. Air purification humidifier.
  • a semiconductor condensing type air purifying humidifier comprises: a casing, an ultrasonic water atomizing component, an aerosol mixing and humidifying passage, a semiconductor condensation purification component, and an air condensation purification passage.
  • the housing is the base for all components of the semiconductor condensing air purification humidifier.
  • the ultrasonic water atomizing component and the semiconductor condensation purification component are fixed on the casing; the casing is provided with an air suction port and a clean air discharge port.
  • the air suction port communicates with the front end of the gas mist mixing and humidifying passage, and is used for sucking dirty air to be cleaned into the gas mist mixing and humidifying passage;
  • the clean air discharge port communicates with the end of the air condensation purification passage for condensing and purifying the air Clean air that is cleaned in the passage is exhausted.
  • the ultrasonic water atomizing component includes an ultrasonic power source, an ultrasonic generator, a water tank, a water supply passage, and a spray passage.
  • An ultrasonic water atomizing component is used to atomize water in the water tank.
  • the ultrasonic power supply is used for supplying the ultrasonic generator;
  • the water tank is a container for storing water, and the valve port is arranged at the bottom of the water tank, and the opening and closing of the valve port is controlled by a liquid level or a switch;
  • the beginning of the water supply passage is communicated with the valve port at the bottom of the water tank, and is used for
  • the water in the water tank is drained to the ultrasonic generator;
  • the spray channel is located at the beginning of the ultrasonic generator, and the end is connected to the gas mist mixing and humidifying passage through the spray port, and one or more spray ports are arranged; the water in the water tank sequentially passes through the valve port at the bottom of the water tank.
  • the water supply channel is drained to the ultrasonic generator, and then atomized by the ultrasonic generator to form a water mist. Finally, the water mist enters the gas mist mixing and humidifying passage through the spray port through the spray channel, and is mixed with the dirty air to be cleaned.
  • the aerosol mixing and humidifying passage is a passage formed by the casing and the deflector, or a passage formed by the casing, the water tank and the deflector; the deflector is a perforated or non-porous plate;
  • the front end of the mist mixing and humidifying passage communicates with the air suction port, and the end communicates with the front end of the air condensation purification passage, and the air enters the air condensation purification passage after being humidified.
  • the semiconductor condensation purification component includes a temperature controlled power supply, a semiconductor condensing assembly, and a water receiving tank.
  • the temperature-controlled power supply supplies power to the semiconductor condensing assembly;
  • the semiconductor condensing assembly includes one or more sets mounted on the casing; each set of semiconductor condensing components includes an array of semiconductor cooling fins, an insulating layer and heat dissipation arranged by a plurality of semiconductor cooling fins a plurality of semiconductor refrigerating sheets in the semiconductor refrigerating sheet array arranged in a plane or a curved surface, the insulating layer covering the outside of the semiconductor refrigerating sheet array;
  • the heat sink comprising a cold end fin and a hot end fin, the cold end fin And the hot end fins are respectively mounted on both sides of the insulating layer;
  • the sink is disposed below the semiconductor condensing unit for storing dirty water flowing from the semiconductor condensing unit.
  • the air condensing purification passage includes two sections, the front section is a passage formed by the casing and the cold end fins, and the rear section is a passage formed by the casing and the hot end fins.
  • the front end of the air condensing purification passage communicates with the gas mist mixing and humidifying passage, and then the passage formed along the casing and the cold end fins extends to the passage formed by the casing and the hot end fins, and the clean air row at the end of the passage and the casing Exports are connected.
  • Said A fan is provided in the aerosol mixing humidification passage and the air condensation purification passage for generating a gas pressure difference in the air flow passage to control the speed of the air flow and to thoroughly mix the air and the water mist in the aerosol mixing humidification passage.
  • the cold-end heat sink and the hot-end heat sink are in the form of a blade structure or a structure in which a wire mesh is embedded between the blades.
  • the air condensation purification passage adopts a polygonal line structure type, or a curved structure structure of bending, twisting, coiling, and spiral, including a U shape, an S shape, a Z shape, a W shape, or the like, or a combination of a polygonal line shape and a curved shape. Structure type.
  • the deflector can be replaced by a fan or agitating impeller installed in the air passage.
  • the water tank is designed as a container integrated with the casing, or as a separate container installed in the casing; the water tank is provided with a water injection port, the water injection port is designed as a separate opening, or is designed to be shared with the valve port at the bottom of the water tank. Or designed to be shared with the air intake on the casing;
  • the dirty air sucked by the air suction port is thoroughly mixed with the water mist formed by the ultrasonic water atomizing component; the gas mist mixing humidification passage communicates with the air condensation purification passage; in the air condensation purification passage, The dirty air sucked by the aerosol mixing and humidifying passage is in the air when passing through the passage formed by the cold end fins of the semiconductor condensing unit The water mist, together with the particulate suspension or smog, flows with the condensed droplets into the sink. Finally, the moist, clean air flows through the passage formed by the hot end fins of the semiconductor condensing assembly and is discharged.
  • the invention has the beneficial effects that the semiconductor condensation type air purifying humidifier disclosed by the invention can not only humidify air but also remove suspended particles or haze in the air, and does not need a filter net, and has low noise and low use cost.
  • FIG. 1 is an alternative structural diagram of a semiconductor condensing type air purifying humidifier.
  • FIG. 2 is a partial structural schematic view of a semiconductor condensing assembly.
  • Fig. 3 is a schematic view showing an alternative structure of a semiconductor condensing type air purifying humidifier.
  • FIG. 4 is a partial structural schematic view of a cold junction fin of a semiconductor condensing assembly.
  • Figure 5 is a partial structural view of a heat sink fin of a semiconductor condensing assembly.
  • Fig. 6 is a schematic view showing an alternative structure of a semiconductor condensing type air purifying humidifier.
  • Figure 7 is a partial schematic view of a semiconductor condensing assembly.
  • Figure 8 is a partially exploded perspective view of a cold junction fin of a semiconductor condensing assembly.
  • Fig. 9 is a block diagram showing an alternative structure of a semiconductor condensing type air purifying humidifier.
  • Figure 10 is a partial structural schematic view of a heat sink and an air condensation purification passage in a semiconductor condensing assembly.
  • 1 ultrasonic water atomizing component 1 casing; 3 air suction port; 4 diversion plate; 5 aerosol mixing humidification channel; 6 water mist mixed gas discharge port; 7 water mist mixed gas suction port; Air discharge port; 9 fan; 10 hot end heat sink; 11 insulation layer; 12 semiconductor refrigeration chip array; 13 cold end heat sink; 14 water tank; 15 air condensation purification channel; 16 spray channel; 17 water tank; 19 ultrasonic generator; 20 base; 21 communication hole; the arrow in the figure indicates the flow direction of the air.
  • the semiconductor condensation type air purification humidifier mainly comprises: a casing 2, an ultrasonic water atomizing component 1, an aerosol mixing humidification channel 5, a semiconductor condensation purification component, and an air condensation purification channel 15 as shown in FIG. Show. Due to the different design requirements of the product, such as the degree of purification of the exhaust air, the humidity of the exhaust air, the noise of the product, the energy consumption and the volumetric weight, etc., in practical applications, the specific structure type of the semiconductor condensing air purification humidifier will have Changed.
  • Several alternative structural examples of a semiconductor condensing type air purifying humidifier will be described below with reference to the accompanying drawings and the technical solution of the present invention. However, it should be noted here that the claims of the present invention are not limited to only the structures given in the embodiments.
  • FIG. 3 The basic structure of this embodiment is shown in FIG. 3, FIG. 4 and FIG.
  • the casing 2 is a base body on which all components of the semiconductor condensing type air purification humidifier are installed; the casing 2 has an air suction port 3 and a clean air discharge port 8.
  • the air suction port 3 communicates with the front end of the gas mist mixing and humidifying passage 5; the water mist mixed gas discharge port 6 is the end of the gas mist mixing and humidifying passage 5.
  • the air mist mixed gas suction port 7 communicates with the front end of the air condensation purification passage 15; the clean air discharge port 8 communicates with the end of the air condensation purification passage 15;
  • the water mist mixed gas discharge port 6 communicates with the water mist mixed gas suction port 7; in the air condensation purification passage 15, the dirty air is cleaned.
  • the ultrasonic water atomizing component includes an ultrasonic power source 18, an ultrasonic generator 19, a water tank 17, a spray passage 16, a water supply passage, and a base 20.
  • the base 20 is at the lower portion; the water tank 17 is mounted on the base 20 and is designed as a container integrated with the casing 2; the air suction port 3 is a water injection port of the water tank 17; the bottom of the water tank 17 has a valve port, and the opening and closing of the valve port is liquid Position control; ultrasonic power supply 18 is located in the base 20 to supply power to the two ultrasonic generators 19; the water supply passage is located on the base 20, which drains water from the valve port at the bottom of the water tank to the two ultrasonic generators 19; Channels 16 start at two ultrasonic generators 19, respectively, with a spray port at the end.
  • the aerosol mixing and humidifying passage 5 is a passage formed by the casing 2 and the deflector 4; the deflector 4 is a non-porous plate mounted on the casing 2; the aerosol mixing and humidifying passage 5, the front end and the machine
  • the air suction port 3 on the casing 2 communicates with the water mist mixed gas discharge port 6 at the end.
  • the semiconductor condensation purification component comprises a temperature control power supply, a semiconductor condensation component and a water tank 14; the temperature control power supply supplies power to the semiconductor condensation component; the semiconductor condensation component comprises two groups, which are mounted on the casing 2; each group of semiconductor condensation components, including more a semiconductor refrigerating chip array 12, an insulating layer 11, a hot end fin 10 and a cold end fin 13 in which semiconductor cooling fins are arranged; wherein a plurality of semiconductor refrigerating sheets in the semiconductor refrigerating sheet array 12 are arranged on the same plane
  • the insulating layer 11 is made of an insulating material and covers the outside of the semiconductor refrigerating sheet array 12; the hot end fins 10 and the cold end fins 13 are mounted on the outside of the insulating layer 11, and are formed by a blade structure, as shown in FIG. 4 and FIG. 5; the sink 14 is disposed below the semiconductor condensing assembly for storing dirty water flowing from the semiconductor condensing assembly.
  • the air condensing purification passage 15 is a passage formed by the casing 2 and the hot end fins 10 and the cold end fins 13 of the semiconductor condensing unit; the air condensing purification passage 15 is communicated with the water mist mixed gas suction port 7 at the front end, and then the edge
  • the passage formed by the cold end fins 13 of the two sets of semiconductor condensing assemblies extends to the passage formed by the hot end fins 10 of the two sets of semiconductor condensing assemblies, and finally reaches the clean air discharge port 8 on the casing 2.
  • two fans 9 are installed to control the speed of air flow in the air flow passages 5 and 15, while the air and water mist in the aerosol mixing humidification passage 5 are sufficiently mixed.
  • the semiconductor condensation type air purifying humidifier of this embodiment has a basic structure as shown in Figs. 1 and 2.
  • Example 1 is a main difference: difference component in the layout and shape, comprises:
  • the semiconductor condensing type air purifying humidifier of this embodiment has a shape such as a cylinder, and its basic structure is a schematic plan view as shown in Fig. 6.
  • Example 1 is a main difference: difference component in the layout and shape, comprises:
  • the air condensation purification passage 15 is external, and looks like a torus, enclosing the aerosol mixing and humidifying passage 5; (2) There is only one ultrasonic generator 19, only one spray channel 16, and the spray channel 16 is at the innermost part of the cylinder; (3) In the aerosol mixing and humidifying passage 5, the flow guiding plate adopts a perforated plate; (4) the semiconductor condensing assembly includes only one set, and a plurality of semiconductor refrigerating sheets in the semiconductor refrigerating sheet array 12 are arranged according to the curved surface, and the whole semiconductor refrigerating sheet The array 12 is shaped like a torus; the cold end fins 13 of the semiconductor condensation assembly are disposed adjacent to the aerosol mixing and humidifying passage 5, and the hot end fins 10 are disposed on the outer side, away from the aerosol mixing and humidifying passage 5; (5) the air condensation purification passage 15, using a meandering, curved curve structure, as shown in Figure 7 and Figure 8, where 21 is a communication hole, which condenses and purifies the air
  • the semiconductor condensing type air purifying humidifier of this embodiment has a shape such as a rectangular parallelepiped, and its basic structure is schematically shown in Fig. 9.
  • Example 1 is a main difference: difference component in the layout and shape, comprises:
  • the air condensing purification passage 15 is outside the two sides of the rectangular parallelepiped, and the aerosol mixing and humidifying passage 5 is inside; (2) There are four ultrasonic generators 19, four spray passages 16, and four spray passages 16 disposed around the air intake 3; (3) There is no flow guiding plate in the aerosol mixing and humidifying passage 5, and instead are six fans 9 mounted on the casing 2; (4)
  • the semiconductor condensation assembly includes two groups, which are respectively arranged on both sides of the rectangular parallelepiped, in each group. In the semiconductor condensing unit, the cold end fins 13 are disposed adjacent to the aerosol mixing and humidifying passage 5, and the hot end fins 10 are disposed outside, away from the mist mixing and humidifying passage 5.
  • the semiconductor condensing type air purifying humidifier of the present embodiment has a shape such as a cylinder, and has the same structural composition as that of Embodiment 3.
  • the main difference is: the air condensing purification passage 15 adopts a spatial spiral structure type, and correspondingly, the semiconductor
  • the structure and layout of the condensing unit heat sink are adjusted accordingly, as shown in Figure 10.

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  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
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  • Dispersion Chemistry (AREA)
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Abstract

一种半导体冷凝型空气净化加湿器，特征是：包括机壳（2）、超声波水雾化部件（1）、气雾混合加湿通道（5）、半导体冷凝净化部件和空气冷凝净化通道（15）。其中，超声波水雾化部件（1）包括超声波电源（18）、超声波发生器（19）、水箱（17）、供水通道和喷雾通道（16），作用是使水雾化；半导体冷凝净化部件包括温控电源、半导体冷凝组件和接水槽（14），作用是清洗空气；气雾混合加湿通道（5）和空气冷凝净化通道（15）连通。首先脏空气进入气雾混合加湿通道（5），变成空气和水雾的混合气体；然后进入空气冷凝净化通道（15），在流经半导体冷凝组件的冷端散热片（13）时，水雾连同悬浮颗粒被冷凝成水滴，流到接水槽（14）中；最后被清洗的空气经半导体冷凝组件的热端散热片（10）排出。

Description

一种半导体冷凝型空气净化加湿器
技术领域
本发明属于环保技术领域，涉及到一种半导体冷凝型空气净化加湿器。
背景技术
一方面，随着社会工业的发展，环境污染越来越严重，雾霾天明显增多。为了能呼吸到清洁的空气，科技人员开发了各种类型的空气净化器。现在市面上售卖的空气净化器，通常是采用过滤技术除去空气中的颗粒悬浮物，达到清洁空气的目的。这些空气净化器需要定期更换过滤网，使用成本高。
另一方面，随着环保意识的提高，人们对空气加湿器提出了更高的要求。空气加湿器通过雾化装置，将水进行雾化处理，然后排放到空气中去，以达到湿润空气的目的。但是，由于自来水中含有多种细菌、微生物和微尘颗粒，随着水雾的排出，这些物质也必然会随之传播到空气中，致使人生病。
为了解决上述问题，本发明公开了一种半导体冷凝型空气净化加湿器，它既能湿润空气，也能清除空气中的颗粒悬浮物或雾霾，而且不需要过滤网，兼具低噪声和使用成本低的优点。
发明内容
本发明目的在于提供一种半导体冷凝型空气净化加湿器，在抛开传统的利用过滤网的情况下，发明一种既能对空气进行加湿，又能清除空气中的颗粒悬浮物或雾霾的空气净化加湿器。
本发明的技术方案：
一种半导体冷凝型空气净化加湿器，结构上包括：机壳、超声波水雾化部件、气雾混合加湿通道、半导体冷凝净化部件和空气冷凝净化通道。
所述的 机壳是半导体冷凝型空气净化加湿器所有零部件安装的基体。超声波水雾化部件和半导体冷凝净化部件固定在机壳上；机壳上设有空气吸入口和清洁空气排出口。其中，空气吸入口与气雾混合加湿通道前端相通，用于将待清洗的脏空气吸入到气雾混合加湿通道中；清洁空气排出口与空气冷凝净化通道末端相通，用于将在空气冷凝净化通道中被清洗的干净空气排出。
所述的 超声波水雾化部件包括超声波电源、超声波发生器、水箱 、 供水通道 和 喷雾通道 ， 超声波水雾化部件用于将水箱中的水雾化。其中，超声波电源为超声波发生器供电；水箱是储水用的容器，水箱底部设置阀口，阀口的开闭由液位或开关控制；供水通道的始端与水箱底部的阀口相通，用于将水箱中的水引流到超声波发生器；喷雾通道始端位于超声波发生器，末端通过喷雾口与气雾混合加湿通道相通，喷雾口设置一个或多个；水箱中的水依次经过水箱底部的阀口、供水通道，被引流至超声波发生器，之后经超声波发生器雾化形成水雾，最终水雾通过喷雾通道经喷雾口进入气雾混合加湿通道，与待清洗的脏空气进行混合。
所述的 气雾混合加湿通道是由机壳和导流型板形成的通道，或者是由机壳、水箱和导流型板形成的通道；导流型板是有孔型板或无孔型板；气雾混合加湿通道的前端和空气吸入口相通，末端和空气冷凝净化通道的前端相通，空气经加湿后进入空气冷凝净化通道。
所述的 半导体冷凝净化部件包括温控电源、半导体冷凝组件和接水槽。温控电源为半导体冷凝组件供电；半导体冷凝组件包括一组或多组，安装在机壳上；每组半导体冷凝组件包括由多个半导体制冷片排列而成的半导体制冷片阵列、绝缘层和散热片；其中，半导体制冷片阵列中的多个半导体制冷片，按照平面或曲面布置，绝缘层覆盖在半导体制冷片阵列的外面；散热片包括冷端散热片和热端散热片，冷端散热片和热端散热片分别安装在绝缘层的两侧；接水槽设置在半导体冷凝组件的下方，用于存储从半导体冷凝组件上流下的脏水。
所述的 空气冷凝净化通道包括两段，前段是由机壳和冷端散热片形成的通道，后段是由机壳和热端散热片形成的通道。空气冷凝净化通道的前端和气雾混合加湿通道相通，之后沿着机壳和冷端散热片形成的通道，延伸至机壳和热端散热片形成的通道，通道末端和机壳上的清洁空气排出口相通。
所述的 气雾混合加湿通道和空气冷凝净化通道中设置风扇，用于在气流通道中产生气压差，以控制气流的速度，并使气雾混合加湿通道中的空气和水雾充分混合。
所述的冷端散热片和热端散热片采用叶片结构型式，或者采用在叶片间嵌入丝网的结构型式。
所述的空气冷凝净化通道采用折线形结构型式，或者弯曲、迂回、盘绕、螺旋的曲线形结构型式，包括U形、S形、Z形、W形等，或采用折线形和曲线形相结合的结构型式。
所述的 导流型板能被安装在 气流 通道中的风扇 或搅拌叶轮 所取代。
所述的水箱设计成与机壳一体的容器，或者设计成安装在机壳内的独立容器；水箱上设有注水口，注水口设计为独立的开口，或者设计为与水箱底部的阀口共用，或者设计为与机壳上的空气吸入口共用；
在气雾混合加湿通道中，由空气吸入口吸入的脏空气，和超声波水雾化部件形成的水雾充分混合；气雾混合加湿通道和空气冷凝净化通道连通；在空气冷凝净化通道中，从气雾混合加湿通道吸入的脏空气，在经过半导体冷凝组件的冷端散热片形成的通道时，空气中的 水雾连同 颗粒悬浮物或雾霾，随冷凝的小水滴流到接水槽中。最后，湿润干净的空气流经半导体冷凝组件的热端散热片形成的通道，被排出。
本发明的有益效果:本发明公开的半导体冷凝型空气净化加湿器，既能湿润空气，也能清除空气中的颗粒悬浮物或雾霾，而且不需要过滤网，兼具低噪声和使用成本低的优点。
附图说明
图1是半导体冷凝型空气净化加湿器的一种可选结构简图。
图2是一种半导体冷凝组件的局部结构示意图。
图3是半导体冷凝型空气净化加湿器的一种可选结构简图。
图4是一种半导体冷凝组件的冷端散热片局部结构示意图。
图5是一种半导体冷凝组件的热端散热片局部结构示意图。
图6是半导体冷凝型空气净化加湿器的一种可选结构简图。
图7是一种半导体冷凝组件的局部结构示意图。
图8是一种半导体冷凝组件冷端散热片的局部结构展开示意图。
图9是半导体冷凝型空气净化加湿器的一种可选结构简图。
图10是一种半导体冷凝组件中散热片和空气冷凝净化通道的局部结构示意图。
图中：1超声波水雾化部件；2机壳；3空气吸入口；4导流型板；5气雾混合加湿通道；6水雾混合气体排出口；7水雾混合气体吸入口；8清洁空气排出口；9风扇；10热端散热片；11绝缘层；12半导体制冷片阵列；13冷端散热片；14接水槽；15空气冷凝净化通道；16喷雾通道；17水箱；18超声波电源；19超声波发生器；20底座；21连通孔；图中的箭头表示空气的流动方向。
具体实施方式
半导体冷凝型空气净化加湿器，主要包括：机壳2、超声波水雾化部件1、气雾混合加湿通道5、半导体冷凝净化部件、以及空气冷凝净化通道15几个部分，如图1-10所示。由于对产品的设计要求不同，如排出空气的净化程度、排出空气的湿度、产品的噪音、能耗和体积重量等要求，在实际应用中，半导体冷凝型空气净化加湿器的具体结构型式将有所变化。下面结合附图和本发明的技术方案，阐述半导体冷凝型空气净化加湿器的几种可选结构实例。然而，这里需要指出的是：本发明的权利要求并不仅仅局限于实施例中给出的几种结构。
实施例1：
本实施例基本结构，如图3、图4和图5所示。
机壳2，是半导体冷凝型空气净化加湿器所有零部件安装的基体；机壳2上有空气吸入口3和清洁空气排出口8。
空气吸入口3，和气雾混合加湿通道5的前端相通；水雾混合气体排出口6，是气雾混合加湿通道5的末端。在气雾混合加湿通道5中，脏空气和水雾混合；水雾混合气体吸入口7，和空气冷凝净化通道15的前端相通；清洁空气排出口8，和空气冷凝净化通道15的末端相通；水雾混合气体排出口6和水雾混合气体吸入口7相通；在空气冷凝净化通道15中，脏空气被清洗。
超声波水雾化部件，包括超声波电源18、超声波发生器19、水箱17、喷雾通道16、供水通道和底座20。
底座20在下部；水箱17安装在底座20上，设计成和机壳2是一体的容器；空气吸入口3是水箱17的注水口；水箱17的底部有阀口，阀口的开闭由液位控制；超声波电源18位于底座20中，为两个超声波发生器19供电；供水通道，位于底座20上，它将水从水箱底部的阀口，引流至两个超声波发生器19；两个喷雾通道16，分别始于两个超声波发生器19，末端是喷雾口。
气雾混合加湿通道5，是由机壳2和导流型板4形成的通道；导流型板4采用无孔型板，安装在机壳2上；气雾混合加湿通道5，前端和机壳2上的空气吸入口3相通，末端是水雾混合气体排出口6。
半导体冷凝净化部件，包括温控电源、半导体冷凝组件和接水槽14；温控电源为半导体冷凝组件供电；半导体冷凝组件包括两组，安装在机壳2上；每组半导体冷凝组件，包括由多个半导体制冷片排列而成的半导体制冷片阵列12、绝缘层11、热端散热片10和冷端散热片13；其中，半导体制冷片阵列12中的多个半导体制冷片，布置在同一个平面内；绝缘层11由绝缘材料构成，覆盖在半导体制冷片阵列12的外面；热端散热片10和冷端散热片13，安装在绝缘层11的外面，采用叶片结构型式，如图4和图5所示；接水槽14设置在半导体冷凝组件的下方，用于存储从半导体冷凝组件上流下的脏水。
空气冷凝净化通道15，是由机壳2与半导体冷凝组件的热端散热片10和冷端散热片13形成的通道；空气冷凝净化通道15，前端和水雾混合气体吸入口7相通，之后沿着两组半导体冷凝组件的冷端散热片13形成的通道，延伸至两组半导体冷凝组件的热端散热片10形成的通道，最后到达机壳2上的清洁空气排出口8。
在 空气冷凝净化通道15中，安装两个风扇9，以控制气流通道5和15中空气流动的速度，同时使气雾混合加湿通道5中的空气和水雾充分混合。
实施例2：
本实施例 的半导体冷凝型空气净化加湿器， 基本结构如图1和图2所示。
在结构组成上，本实施例与实施例 1 基本相同，与实施例 1 的主要区别是：零部件在布局和形状上的差异，具体包括：
（ 1 ） 机壳2上的空气吸入口3、水雾混合气体排出口6、水雾混合气体吸入口7和清洁空气排出口8的位置不同；（2）水箱17被设计成是独立的容器，且水箱17底部的阀口和水箱17的注水口是同一个口；（3）半导体冷凝组件只有一组，且半导体制冷片阵列12中的多个半导体制冷片，按照'L'形布置；（4）半导体冷凝组件的热端散热片10和冷端散热片13，采用在叶片间嵌入丝网的结构型式，如图2所示。
实施例3：
本实施例的半导体冷凝型空气净化加湿器，外形如圆柱体，其基本 结构俯视简图如图6所示。
在结构组成上，本实施例与实施例 1 基本相同，与实施例 1 的主要区别是：零部件在布局和形状上的差异，具体包括：
（ 1 ） 空气冷凝净化通道15在外部，外形似圆环体，将气雾混合加湿通道5围在内部； （ 2 ） 超声波发生器19仅有一个、喷雾通道16仅有一个，且喷雾通道16在 圆柱体的 最内部 ；（ 3 ） 在 气雾混合加湿通道5中，导流型板采用有孔型板；（4）半导体冷凝组件仅包括一组，半导体制冷片阵列12中的多个半导体制冷片，按照曲面布置，整体半导体制冷片阵列12外形似圆环体；半导体冷凝组件的冷端散热片13临近气雾混合加湿通道5布置，热端散热片10布置在外侧，远离气雾混合加湿通道5；（5）空气冷凝净化通道15，采用迂回、弯曲的曲线结构型式，如图7和图8所示，其中21是连通孔，它将冷端散热片所形成的空气冷凝净化通道与热端散热片所形成的空气冷凝净化通道连通。
实施例4：
本实施例的半导体冷凝型空气净化加湿器，外形如长方体，其基本 结构俯视简图如图9所示。
在结构组成上，本实施例与实施例 1 基本相同，与实施例 1 的主要区别是：零部件在布局和形状上的差异，具体包括：
（ 1 ） 空气冷凝净化通道15在 长方体两侧的 外部，气雾混合加湿通道5在内部； （ 2 ） 超声波发生器19有四个，喷雾通道16有四个，且四个喷雾通道16围绕空气吸入口3布置 ；（ 3 ） 在 气雾混合加湿通道5中没有导流型板，取而代之的是安装在机壳2上的六个风扇9；（4）半导体冷凝组件包括两组，分别布置在 长方体的两侧，在每组 半导体冷凝组件中，冷端散热片13临近气雾混合加湿通道5布置，热端散热片10布置在外侧，远离气雾混合加湿通道5。
实施例5：
本实施例的半导体冷凝型空气净化加湿器，外形如圆柱体，在结构组成上，与实施例 3 基本相同，主要区别是： 空气冷凝净化通道15，采用空间螺旋的结构型式，相应地，半导体冷凝组件散热片的结构型式和布局进行相应的调整，如图10所示。

Claims (8)

  1. 一种半导体冷凝型空气净化加湿器，其特征在于，包括机壳、超声波水雾化部件、气雾混合加湿通道、半导体冷凝净化部件和空气冷凝净化通道；
    所述的机壳是半导体冷凝型空气净化加湿器所有零部件安装的基体，超声波水雾化部件和半导体冷凝净化部件固定在机壳上；机壳上设有空气吸入口和清洁空气排出口；其中，空气吸入口与气雾混合加湿通道前端相通，用于将待清洗的脏空气吸入到气雾混合加湿通道中；清洁空气排出口与空气冷凝净化通道末端相通，用于将在空气冷凝净化通道中被清洗的干净空气排出；
    所述的超声波水雾化部件包括超声波电源、超声波发生器、水箱、供水通道和喷雾通道，超声波水雾化部件用于将水箱中的水雾化；其中，超声波电源为超声波发生器供电；水箱是储水用的容器，水箱底部设置阀口，阀口的开闭由液位或开关控制；供水通道的始端与水箱底部的阀口相通，用于将水箱中的水引流到超声波发生器；喷雾通道始端位于超声波发生器，末端通过喷雾口与气雾混合加湿通道相通，喷雾口设置一个或多个；水箱中的水依次经过水箱底部的阀口、供水通道，被引流至超声波发生器，之后经超声波发生器雾化形成水雾，最终水雾通过喷雾通道经喷雾口进入气雾混合加湿通道，与待清洗的脏空气进行混合；
    所述的气雾混合加湿通道是由机壳和导流型板形成的通道，或者是由机壳、水箱和导流型板形成的通道；导流型板是有孔型板或无孔型板；气雾混合加湿通道的前端和空气吸入口相通，末端和空气冷凝净化通道的前端相通，空气经加湿后进入空气冷凝净化通道；
    所述的半导体冷凝净化部件包括温控电源、半导体冷凝组件和接水槽；温控电源为半导体冷凝组件供电；半导体冷凝组件包括一组或多组，安装在机壳上；每组半导体冷凝组件包括由多个半导体制冷片排列而成的半导体制冷片阵列、绝缘层和散热片；其中，半导体制冷片按照平面或曲面布置，绝缘层覆盖在半导体制冷片阵列的外面；散热片包括冷端散热片和热端散热片，冷端散热片和热端散热片分别安装在绝缘层的两侧；接水槽设置在半导体冷凝组件的下方，用于存储从半导体冷凝组件上流下的脏水；
    所述的空气冷凝净化通道包括两段，前段是由机壳和冷端散热片形成的通道，后段是由机壳和热端散热片形成的通道；空气冷凝净化通道的前端和气雾混合加湿通道相通，之后沿着机壳和冷端散热片形成的通道，延伸至机壳和热端散热片形成的通道，通道末端和机壳上的清洁空气排出口相通；
    所述的气雾混合加湿通道和空气冷凝净化通道中设置风扇，用于在气流通道中产生气压差，以控制气流的速度，并使气雾混合加湿通道中的空气和水雾充分混合。
  2. 根据权利要求1所述的一种半导体冷凝型空气净化加湿器，其特征在于，所述的冷端散热片和热端散热片采用叶片结构型式，或者采用在叶片间嵌入丝网的结构型式。
  3. 根据权利要求1或2所述的一种半导体冷凝型空气净化加湿器，其特征在于，所述的空气冷凝净化通道采用折线形结构型式，或者弯曲、迂回、盘绕、螺旋的曲线形结构型式，或两者相结合的结构型式。
  4. 根据权利要求1或2所述的一种半导体冷凝型空气净化加湿器，其特征在于，所述的导流型板能被安装在气流通道中的风扇或搅拌叶轮所取代。
  5. 根据权利要求3所述的一种半导体冷凝型空气净化加湿器，其特征在于，所述的导流型板能被安装在气流通道中的风扇或搅拌叶轮所取代。
  6. 根据权利要求1、2或5所述的一种半导体冷凝型空气净化加湿器，其特征在于，所述的水箱设计成与机壳一体的容器，或者设计成安装在机壳内的独立容器；水箱上设有注水口，注水口设计为独立的开口，或者设计为与水箱底部的阀口共用，或者设计为与机壳上的空气吸入口共用。
  7. 根据权利要求3所述的一种半导体冷凝型空气净化加湿器，其特征在于，所述的水箱设计成与机壳一体的容器，或者设计成安装在机壳内的独立容器；水箱上设有注水口，注水口设计为独立的开口，或者设计为与水箱底部的阀口共用，或者设计为与机壳上的空气吸入口共用。
  8. 根据权利要求4所述的一种半导体冷凝型空气净化加湿器，其特征在于，所述的水箱设计成与机壳一体的容器，或者设计成安装在机壳内的独立容器；水箱上设有注水口，注水口设计为独立的开口，或者设计为与水箱底部的阀口共用，或者设计为与机壳上的空气吸入口共用。
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CN206160337U (zh) * 2016-09-19 2017-05-10 杨儒铭 空气净化装置
CN106679009A (zh) * 2017-03-08 2017-05-17 嵊州亿源投资管理有限公司 一种具有高效率的净化器
CN107631386A (zh) * 2017-09-16 2018-01-26 王元秀 半导体冷凝型空气净化加湿器

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CN110180680A (zh) * 2019-06-22 2019-08-30 区永辉 带冷凝水自动清洗功能的电离式空气净化器
CN110836427A (zh) * 2019-12-12 2020-02-25 华南理工大学广州学院 一种采用半导体制冷技术的电梯空调
CN110836427B (zh) * 2019-12-12 2024-06-11 华南理工大学广州学院 一种采用半导体制冷技术的电梯空调
CN113764987A (zh) * 2021-08-31 2021-12-07 杭州宇诺电子科技有限公司 开关柜免排水主动智能除湿系统及方法

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