WO2019050195A3 - 폴딩 안정성이 우수한 점착제의 선정방법 - Google Patents
폴딩 안정성이 우수한 점착제의 선정방법Info
- Publication number
- WO2019050195A3 WO2019050195A3 PCT/KR2018/009727 KR2018009727W WO2019050195A3 WO 2019050195 A3 WO2019050195 A3 WO 2019050195A3 KR 2018009727 W KR2018009727 W KR 2018009727W WO 2019050195 A3 WO2019050195 A3 WO 2019050195A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- folding stability
- adhesive
- stability
- folding
- excellent folding
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1804—C4-(meth)acrylate, e.g. butyl (meth)acrylate, isobutyl (meth)acrylate or tert-butyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1808—C8-(meth)acrylate, e.g. isooctyl (meth)acrylate or 2-ethylhexyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N11/00—Investigating flow properties of materials, e.g. viscosity, plasticity; Analysing materials by determining flow properties
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/08—Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/20—Investigating strength properties of solid materials by application of mechanical stress by applying steady bending forces
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
- G06F17/10—Complex mathematical operations
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F7/00—Methods or arrangements for processing data by operating upon the order or content of the data handled
- G06F7/38—Methods or arrangements for performing computations using exclusively denominational number representation, e.g. using binary, ternary, decimal representation
- G06F7/48—Methods or arrangements for performing computations using exclusively denominational number representation, e.g. using binary, ternary, decimal representation using non-contact-making devices, e.g. tube, solid state device; using unspecified devices
- G06F7/544—Methods or arrangements for performing computations using exclusively denominational number representation, e.g. using binary, ternary, decimal representation using non-contact-making devices, e.g. tube, solid state device; using unspecified devices for evaluating functions by calculation
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Abstract
본 발명은 폴딩(folding) 안정성이 우수한 점착제의 개발을 위해 폴딩 안정성에 영향을 주는 유변물성 유의인자를 도출하고 이를 통해 폴딩 안정성을 예측하는 방법에 관한 것으로서, 상기 유의인자로서 초기 스트레스(initial stress) 및 변형 회복률(strain recovery)을 측정하여 이로부터 예측 폴딩 안정성(예측 폴딩 횟수)을 계산함으로써 폴딩 안정성이 우수한 점착제를 선정할 수 있다.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16/478,408 US11649384B2 (en) | 2017-09-11 | 2018-08-23 | Method for selecting adhesive with excellent folding stability |
CN201880005984.9A CN110168037B (zh) | 2017-09-11 | 2018-08-23 | 用于选择具有优异的折叠稳定性的粘合剂的方法 |
EP18854897.8A EP3543309B1 (en) | 2017-09-11 | 2018-08-23 | Method for selecting adhesive with excellent folding stability |
JP2019535318A JP6849172B2 (ja) | 2017-09-11 | 2018-08-23 | フォールディング安定性に優れた粘着剤の選定方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2017-0116016 | 2017-09-11 | ||
KR1020170116016A KR102156470B1 (ko) | 2017-09-11 | 2017-09-11 | 폴딩 안정성이 우수한 점착제의 선정방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2019050195A2 WO2019050195A2 (ko) | 2019-03-14 |
WO2019050195A3 true WO2019050195A3 (ko) | 2019-05-02 |
Family
ID=65634427
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2018/009727 WO2019050195A2 (ko) | 2017-09-11 | 2018-08-23 | 폴딩 안정성이 우수한 점착제의 선정방법 |
Country Status (6)
Country | Link |
---|---|
US (1) | US11649384B2 (ko) |
EP (1) | EP3543309B1 (ko) |
JP (1) | JP6849172B2 (ko) |
KR (1) | KR102156470B1 (ko) |
CN (1) | CN110168037B (ko) |
WO (1) | WO2019050195A2 (ko) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102156470B1 (ko) * | 2017-09-11 | 2020-09-15 | 주식회사 엘지화학 | 폴딩 안정성이 우수한 점착제의 선정방법 |
JP2020164619A (ja) * | 2019-03-29 | 2020-10-08 | 三菱ケミカル株式会社 | 粘着シート、それを用いた積層シート及び画像表示装置 |
Citations (4)
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KR20130130698A (ko) * | 2010-08-18 | 2013-12-02 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 응력 제거 광학 접착제를 포함하는 광학 조립체 및 그의 제조 방법 |
WO2016196576A1 (en) * | 2015-06-03 | 2016-12-08 | 3M Innovative Properties Company | Acrylic block copolymer-based assembly layer for flexible displays |
KR20170070370A (ko) * | 2015-12-11 | 2017-06-22 | 삼성에스디아이 주식회사 | 점착시트 및 이를 포함하는 광학표시장치 |
KR20170097854A (ko) * | 2016-02-19 | 2017-08-29 | 주식회사 엘지화학 | 폴더블(foldable) 디스플레이용 점착제 조성물 |
Family Cites Families (18)
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WO2000023484A1 (fr) | 1998-10-19 | 2000-04-27 | Denki Kagaku Kogyo Kabushiki Kaisha | Copolymere d'ethylene/vinyle aromatique et son procede de production |
JP3897477B2 (ja) | 1999-03-25 | 2007-03-22 | トヨタ自動車株式会社 | 応力−ひずみ関係シミュレート方法およびスプリングバック量予測方法 |
JP2007113944A (ja) | 2005-10-18 | 2007-05-10 | Lintec Corp | 粘弾性測定装置および粘弾性測定方法 |
US9261444B1 (en) * | 2013-07-30 | 2016-02-16 | The Boeing Company | Apparatus, system, and method for in situ strength testing of a bonded joint |
TWI651387B (zh) * | 2013-09-30 | 2019-02-21 | 漢高智慧財產控股公司 | 用於大型晶粒半導體封裝之導電黏晶薄膜及供其製備之組合物 |
JP2015190847A (ja) | 2014-03-28 | 2015-11-02 | 住友金属鉱山株式会社 | 高分子ポリマーの架橋度の評価方法 |
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KR102156470B1 (ko) | 2017-09-11 | 2020-09-15 | 주식회사 엘지화학 | 폴딩 안정성이 우수한 점착제의 선정방법 |
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-
2017
- 2017-09-11 KR KR1020170116016A patent/KR102156470B1/ko active IP Right Grant
-
2018
- 2018-08-23 CN CN201880005984.9A patent/CN110168037B/zh active Active
- 2018-08-23 WO PCT/KR2018/009727 patent/WO2019050195A2/ko unknown
- 2018-08-23 JP JP2019535318A patent/JP6849172B2/ja active Active
- 2018-08-23 US US16/478,408 patent/US11649384B2/en active Active
- 2018-08-23 EP EP18854897.8A patent/EP3543309B1/en active Active
Patent Citations (4)
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KR20130130698A (ko) * | 2010-08-18 | 2013-12-02 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 응력 제거 광학 접착제를 포함하는 광학 조립체 및 그의 제조 방법 |
WO2016196576A1 (en) * | 2015-06-03 | 2016-12-08 | 3M Innovative Properties Company | Acrylic block copolymer-based assembly layer for flexible displays |
KR20170070370A (ko) * | 2015-12-11 | 2017-06-22 | 삼성에스디아이 주식회사 | 점착시트 및 이를 포함하는 광학표시장치 |
KR20170097854A (ko) * | 2016-02-19 | 2017-08-29 | 주식회사 엘지화학 | 폴더블(foldable) 디스플레이용 점착제 조성물 |
Non-Patent Citations (1)
Title |
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KIM, HYORIN ET AL.: "Improvement of Bending Recovery of Polyester Film via Physical Aging Treatment", POLYMER, vol. 39, no. 4, 2015, pages 593 - 600, XP055598290, ISSN: 0379-153X, DOI: 10.7317/pk.2015.39.4.593 * |
Also Published As
Publication number | Publication date |
---|---|
KR102156470B1 (ko) | 2020-09-15 |
EP3543309B1 (en) | 2022-04-13 |
CN110168037B (zh) | 2020-10-23 |
JP2020504298A (ja) | 2020-02-06 |
EP3543309A4 (en) | 2020-01-22 |
WO2019050195A2 (ko) | 2019-03-14 |
KR20190029006A (ko) | 2019-03-20 |
EP3543309A2 (en) | 2019-09-25 |
JP6849172B2 (ja) | 2021-03-24 |
US11649384B2 (en) | 2023-05-16 |
US20190376884A1 (en) | 2019-12-12 |
CN110168037A (zh) | 2019-08-23 |
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