CN110168037B - 用于选择具有优异的折叠稳定性的粘合剂的方法 - Google Patents
用于选择具有优异的折叠稳定性的粘合剂的方法 Download PDFInfo
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- CN110168037B CN110168037B CN201880005984.9A CN201880005984A CN110168037B CN 110168037 B CN110168037 B CN 110168037B CN 201880005984 A CN201880005984 A CN 201880005984A CN 110168037 B CN110168037 B CN 110168037B
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1804—C4-(meth)acrylate, e.g. butyl (meth)acrylate, isobutyl (meth)acrylate or tert-butyl (meth)acrylate
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1808—C8-(meth)acrylate, e.g. isooctyl (meth)acrylate or 2-ethylhexyl (meth)acrylate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N11/00—Investigating flow properties of materials, e.g. viscosity, plasticity; Analysing materials by determining flow properties
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/08—Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/20—Investigating strength properties of solid materials by application of mechanical stress by applying steady bending forces
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
- G06F17/10—Complex mathematical operations
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F7/00—Methods or arrangements for processing data by operating upon the order or content of the data handled
- G06F7/38—Methods or arrangements for performing computations using exclusively denominational number representation, e.g. using binary, ternary, decimal representation
- G06F7/48—Methods or arrangements for performing computations using exclusively denominational number representation, e.g. using binary, ternary, decimal representation using non-contact-making devices, e.g. tube, solid state device; using unspecified devices
- G06F7/544—Methods or arrangements for performing computations using exclusively denominational number representation, e.g. using binary, ternary, decimal representation using non-contact-making devices, e.g. tube, solid state device; using unspecified devices for evaluating functions by calculation
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2017-0116016 | 2017-09-11 | ||
KR1020170116016A KR102156470B1 (ko) | 2017-09-11 | 2017-09-11 | 폴딩 안정성이 우수한 점착제의 선정방법 |
PCT/KR2018/009727 WO2019050195A2 (ko) | 2017-09-11 | 2018-08-23 | 폴딩 안정성이 우수한 점착제의 선정방법 |
Publications (2)
Publication Number | Publication Date |
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CN110168037A CN110168037A (zh) | 2019-08-23 |
CN110168037B true CN110168037B (zh) | 2020-10-23 |
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Application Number | Title | Priority Date | Filing Date |
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CN201880005984.9A Active CN110168037B (zh) | 2017-09-11 | 2018-08-23 | 用于选择具有优异的折叠稳定性的粘合剂的方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US11649384B2 (ko) |
EP (1) | EP3543309B1 (ko) |
JP (1) | JP6849172B2 (ko) |
KR (1) | KR102156470B1 (ko) |
CN (1) | CN110168037B (ko) |
WO (1) | WO2019050195A2 (ko) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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KR102156470B1 (ko) * | 2017-09-11 | 2020-09-15 | 주식회사 엘지화학 | 폴딩 안정성이 우수한 점착제의 선정방법 |
JP2020164619A (ja) * | 2019-03-29 | 2020-10-08 | 三菱ケミカル株式会社 | 粘着シート、それを用いた積層シート及び画像表示装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20170097854A (ko) * | 2016-02-19 | 2017-08-29 | 주식회사 엘지화학 | 폴더블(foldable) 디스플레이용 점착제 조성물 |
Family Cites Families (21)
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WO2000023484A1 (fr) | 1998-10-19 | 2000-04-27 | Denki Kagaku Kogyo Kabushiki Kaisha | Copolymere d'ethylene/vinyle aromatique et son procede de production |
JP3897477B2 (ja) | 1999-03-25 | 2007-03-22 | トヨタ自動車株式会社 | 応力−ひずみ関係シミュレート方法およびスプリングバック量予測方法 |
JP2007113944A (ja) | 2005-10-18 | 2007-05-10 | Lintec Corp | 粘弾性測定装置および粘弾性測定方法 |
US20130136874A1 (en) | 2010-08-18 | 2013-05-30 | 3M Innovative Properties Company | Optical assemblies including stress-relieving optical adhesives and methods of making same |
US9261444B1 (en) * | 2013-07-30 | 2016-02-16 | The Boeing Company | Apparatus, system, and method for in situ strength testing of a bonded joint |
TWI651387B (zh) * | 2013-09-30 | 2019-02-21 | 漢高智慧財產控股公司 | 用於大型晶粒半導體封裝之導電黏晶薄膜及供其製備之組合物 |
JP2015190847A (ja) | 2014-03-28 | 2015-11-02 | 住友金属鉱山株式会社 | 高分子ポリマーの架橋度の評価方法 |
CN106715623B (zh) * | 2014-09-30 | 2020-01-21 | 株式会社Lg化学 | 偏光板和包括其的显示装置 |
KR101721744B1 (ko) | 2015-01-29 | 2017-03-31 | 삼성에스디아이 주식회사 | 점착필름 및 이를 포함하는 디스플레이 부재 |
ITUB20150555A1 (it) | 2015-02-12 | 2016-08-12 | Tecres Spa | Miscela ternaria per cemento osseo e metodo per la sua realizzazione |
KR20160100122A (ko) | 2015-02-13 | 2016-08-23 | 동우 화인켐 주식회사 | 감온성 점착제 조성물 및 이를 포함하는 감온성 점착 테이프 |
KR101975004B1 (ko) | 2015-04-30 | 2019-05-03 | 주식회사 엘지화학 | 고분자 가공의 예측 방법 |
CN107683314A (zh) | 2015-06-03 | 2018-02-09 | 3M创新有限公司 | 用于柔性显示器的基于丙烯酸系嵌段共聚物的组件层 |
CN107683313B (zh) * | 2015-06-03 | 2021-02-05 | 3M创新有限公司 | 用于柔性显示器的组件层 |
KR101814249B1 (ko) * | 2015-07-16 | 2018-01-05 | 삼성에스디아이 주식회사 | 점착필름, 이를 포함하는 광학부재 및 이를 포함하는 광학표시장치 |
JP2017102443A (ja) | 2015-11-20 | 2017-06-08 | 日東電工株式会社 | 光学積層体および該光学積層体を用いた有機エレクトロルミネセンス表示装置 |
KR20170070370A (ko) * | 2015-12-11 | 2017-06-22 | 삼성에스디아이 주식회사 | 점착시트 및 이를 포함하는 광학표시장치 |
KR102069482B1 (ko) | 2016-02-19 | 2020-01-23 | 주식회사 엘지화학 | 폴더블(foldable) 디스플레이용 점착제 조성물 |
KR102156470B1 (ko) | 2017-09-11 | 2020-09-15 | 주식회사 엘지화학 | 폴딩 안정성이 우수한 점착제의 선정방법 |
WO2021025475A1 (ko) * | 2019-08-05 | 2021-02-11 | 주식회사 엘지화학 | 점착 필름, 이의 제조 방법 및 이를 포함하는 폴더블 디스플레이 장치 |
JP2022063198A (ja) * | 2020-10-09 | 2022-04-21 | 三菱ケミカル株式会社 | ストレッチ包装用フィルム |
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2017
- 2017-09-11 KR KR1020170116016A patent/KR102156470B1/ko active IP Right Grant
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2018
- 2018-08-23 CN CN201880005984.9A patent/CN110168037B/zh active Active
- 2018-08-23 WO PCT/KR2018/009727 patent/WO2019050195A2/ko unknown
- 2018-08-23 JP JP2019535318A patent/JP6849172B2/ja active Active
- 2018-08-23 US US16/478,408 patent/US11649384B2/en active Active
- 2018-08-23 EP EP18854897.8A patent/EP3543309B1/en active Active
Patent Citations (1)
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KR20170097854A (ko) * | 2016-02-19 | 2017-08-29 | 주식회사 엘지화학 | 폴더블(foldable) 디스플레이용 점착제 조성물 |
Also Published As
Publication number | Publication date |
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KR102156470B1 (ko) | 2020-09-15 |
EP3543309B1 (en) | 2022-04-13 |
JP2020504298A (ja) | 2020-02-06 |
EP3543309A4 (en) | 2020-01-22 |
WO2019050195A2 (ko) | 2019-03-14 |
KR20190029006A (ko) | 2019-03-20 |
EP3543309A2 (en) | 2019-09-25 |
JP6849172B2 (ja) | 2021-03-24 |
WO2019050195A3 (ko) | 2019-05-02 |
US11649384B2 (en) | 2023-05-16 |
US20190376884A1 (en) | 2019-12-12 |
CN110168037A (zh) | 2019-08-23 |
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