Classifications

• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
  • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
  • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
  • C23C14/568—Transferring the substrates through a series of coating stations
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
  • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
  • C23C14/50—Substrate holders
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
  • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
  • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
  • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
  • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
  • H01J37/32—Gas-filled discharge tubes
  • H01J37/32431—Constructional details of the reactor
  • H01J37/32715—Workpiece holder
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
  • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
  • H01J37/32—Gas-filled discharge tubes
  • H01J37/32431—Constructional details of the reactor
  • H01J37/32733—Means for moving the material to be treated
  • H01J37/32752—Means for moving the material to be treated for moving the material across the discharge
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
  • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
  • H01J37/32—Gas-filled discharge tubes
  • H01J37/32431—Constructional details of the reactor
  • H01J37/32733—Means for moving the material to be treated
  • H01J37/32752—Means for moving the material to be treated for moving the material across the discharge
  • H01J37/32761—Continuous moving
  • H01J37/32779—Continuous moving of batches of workpieces
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
  • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
  • H01J37/32—Gas-filled discharge tubes
  • H01J37/32431—Constructional details of the reactor
  • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
  • H01J37/32899—Multiple chambers, e.g. cluster tools
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/67005—Apparatus not specifically provided for elsewhere
  • H01L21/67011—Apparatus for manufacture or treatment
  • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
  • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
  • H01L21/67709—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
  • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
  • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
  • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
  • H01L21/6773—Conveying cassettes, containers or carriers
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
  • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
  • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
  • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
  • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
  • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
  • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
  • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
  • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

Definitions

• Embodiments of the present disclosure relate to an assembly for lifting or lowering of a carrier in a vacuum chamber, an apparatus for transportation of a carrier in a vacuum chamber, a system for vacuum processing of a substrate, and a method for lifting or lowering of a carrier.
• Embodiments of the present disclosure particularly relate to a vacuum processing system with at least one deposition source and with a path switch assembly configured to move a carrier between a first transport path and a second transport path, wherein the path switch assembly includes an assembly for lifting or lowering of the carrier.
• a vacuum processing system with at least one deposition source and with a path switch assembly configured to move a carrier between a first transport path and a second transport path, wherein the path switch assembly includes an assembly for lifting or lowering of the carrier.
• Techniques for layer deposition on a substrate include, for example, sputter deposition, evaporation, and chemical vapor deposition (CVD).
• a sputter deposition process can be used to deposit a material layer on the substrate, such as a layer of an insulating material or a conductor material.
• An in-line arrangement of processing modules can be used.
• An in-line processing system includes a plurality of subsequent processing modules, such as deposition modules and optionally further processing modules, e.g., cleaning modules and/or etching modules, wherein processing actions are subsequently conducted in the processing modules such that a plurality of substrates can continuously or quasi-continuously be processed in the in-line processing system.
• the substrate may be carried by a carrier, i.e. a carrying device for carrying the substrate.
• the carrier is typically transported through a vacuum chamber using one or more transport systems.
• the transport systems may be configured for conveying the carrier along one or more transport paths. At least two transport paths can be provided next to each other in the vacuum system, e.g. a first transport path for transporting the carrier in a forward direction and a second transport path for transporting the carrier in a return direction opposite to the forward direction.
• the transport systems can have rollers or other supports configured to support and convey the carrier along the transport paths and/or from one transport path to another transport path (also referred to as a "path switch” or “track switch”).
• Carriers may also be moved in an upward direction or in a downward direction (also referred to as a "lifting” or a “lowering” of a carrier), e.g. in order to correct or modify a vertical level of the carrier.
• the friction between the carrier and a carrier support during the movement of the carrier can generate particles that may negatively affect the vacuum conditions inside the vacuum system. The particles can contaminate the layers deposited on the substrates, and a quality of the deposited layers can be reduced.
• an assembly for lifting or lowering a carrier in a vacuum chamber includes a carrier support that is movable in an essentially vertical direction, and a holding device configured to contactlessly hold an upper portion of the carrier.
• the carrier support is configured to support the carrier, such that the carrier is lifted or lowered when the carrier support moves in an upward direction or in a downward direction.
• the holding device is configured to contactlessly hold the upper portion of the carrier during the lifting or lowering of the carrier.
• an apparatus for transportation of a carrier in a vacuum chamber is provided.
• the apparatus includes a first transport system provided along a first transport path in a transport direction, and a path switch assembly configured to move the carrier away from the first transport path in a path switch direction transverse to the transport direction.
• the path switch assembly includes a carrier support that is movable in an essentially vertical direction, and a holding device configured to contactlessly hold an upper portion of the carrier.
• a system for vacuum processing of a substrate includes a vacuum chamber, an assembly for lifting or lowering a carrier in the vacuum chamber according to any of the embodiments described herein, and one or more processing tools arranged in the vacuum chamber and selected from the group consisting of deposition sources, evaporation sources, sputter sources, surface treatment tools, heating devices, cleaning devices, etching tools, and combinations thereof.
• a method for lifting or lowering a carrier in a vacuum chamber includes placing a carrier on a carrier support, and moving the carrier support in an essentially vertical direction for lifting or lowering the carrier, wherein an upper portion of the carrier is contactlessly held by a holding device during the lifting or lowering of the carrier.
• Embodiments are also directed at apparatuses for carrying out the disclosed methods and include apparatus parts for performing each described method aspect. These method aspects may be performed by way of hardware components, a computer programmed by appropriate software, by any combination of the two or in any other manner. Furthermore, embodiments according to the disclosure are also directed at methods for operating the described apparatus. The methods for operating the described apparatus include method aspects for carrying out every function of the apparatus. BRIEF DESCRIPTION OF THE DRAWINGS
• FIG. 1 shows a schematic sectional view of an assembly for lifting or lowering a carrier according to embodiments described herein;
• FIGS. 2A-D show several stages of a method for lifting or lowering a carrier with an assembly according to embodiments described herein;
• FIG. 3 shows a schematic sectional view of an assembly for lifting or lowering a carrier according to embodiments described herein;
• FIGS. 4A-F show several stages performed by an apparatus for transportation of a carrier according to embodiments described herein;
• FIG. 5 shows a schematic sectional view of a system for vacuum processing of a substrate according to embodiments described herein;
• FIG. 6 is a flow diagram for illustrating a method for lifting or lowering of a carrier according to embodiments described herein;
• FIG. 7 is a flow diagram for illustrating a method for transportation of a carrier according to embodiments described herein.
• FIG. 1 shows a schematic sectional view of an assembly 100 for lifting or lowering a carrier 10 according to embodiments described herein.
• the assembly 100 includes a carrier support 20 that is movable in an upward direction or in a downward direction (also referred to herein as an "essentially vertical direction V").
• the assembly further includes a holding device 30 configured to contactlessly hold an upper portion of the carrier 10.
• the carrier 10 can be placed and supported on the carrier support 20.
• the carrier support 20 is movable in a downward direction for lowering the carrier 10 supported thereon.
• the carrier support 20 is movable in an upward direction for lifting the carrier supported thereon.
• the carrier support 20 may be movable both in an upward direction for lifting the carrier and in a downward direction for lowering the carrier.
• An actuator 25 may be provided for moving the carrier support 20.
• the carrier 10 includes a chucking device, e.g., a magnetic chuck or an electrostatic chuck for attracting the substrate 11 or another object toward a holding surface of the carrier 10.
• the carrier 10 may be configured to hold the substrate 11 in an essentially vertical orientation.
• an angle between a main surface of the substrate 11 and the gravity vector during the movement of the carrier is typically less than 20°.
• the angle between the main surface of the substrate and the gravity vector may be from -10° to +10°, particularly essentially 0°, wherein negative angles are meant to designate downwardly facing substrates.
• the carrier support 20 may be configured to support an essentially vertically oriented carrier 10 thereon. By moving the carrier support 20 in the vertical direction V, the essentially vertically oriented carrier can be lifted or lowered.
• the carrier 10 may be configured to carry a large-area substrate, particularly a large-area substrate for display manufacturing.
• the substrate 11 may have a surface area to be processed of 1 m 2 or more, particularly 5 m 2 or more, or even 10 m 2 or more.
• the carrier may have a substrate holding surface having a size of 1 m 2 or more, particularly 5 m 2 or more, or even 10 m 2 or more.
• the height of the carrier 10 may be 1 m or more, particularly 2 m or more, and/or the width of the carrier 10 may be 1 m or more, particularly 2 m or more.
• the height of the carrier may be understood as the vertical dimension of the carrier that is supported on the carrier support 20.
• An actuator 25 for moving the carrier support 20 in the vertical direction V may be provided.
• the actuator 25 may include a drive device, e.g. a motor, a hydraulic device or a pneumatic device for lifting or lowering the carrier support 20.
• the actuator 25 may be configured to move the carrier support 20 between a first vertical level and a second vertical level, wherein the first vertical level may be 5 mm or more above the second vertical level.
• the first vertical level may be 20 mm or more, particularly 40 mm or more, more particularly 100 mm or more above the second vertical level.
• the thickness of the carrier may be much smaller than the height and/or the width of the carrier. Accordingly, when the carrier is supported on the carrier support 20 in an essentially vertical orientation, there may be a risk of a tilting or a drop-off of the carrier from the carrier support. Accordingly, it may be beneficial to provide a holding device which stabilizes an upper portion of the carrier during the lifting or lowering.
• Mechanical holders such as spring mounted fingers or clamps may be provided for contacting and holding the upper portion of the carrier, in order to prevent a tilting or drop-off of the carrier from the carrier support.
• a mechanical holder may contact and grab the carrier from above.
• the holding force of a spring may decrease when the carrier moves away from a spring support.
• particles may be generated due to a mechanical sliding contact between the mechanical holder and the carrier which may negatively affect the vacuum conditions in the vacuum chamber.
• a mechanical holder for the upper portion of the carrier, wherein the mechanical holder is movably mounted in the vertical direction V.
• the mechanical holder can be lifted and lowered together with the carrier, maintaining an essentially constant holding force.
• a vertically movable holder may be complex and large. Further, particles may be generated in the vacuum chamber during the lifting, e.g. when the mechanical holder and the carrier support do not move synchronously and at the same speed.
• a holding device 30 for contactlessly holding the upper portion of the carrier 10 during the lifting or the lowering of the carrier is provided.
• the holding device 30 is configured to hold and stabilize the upper portion of the carrier without contacting the upper portion of the carrier. Accordingly, a tilting or a drop-off of the carrier 10 from the carrier support 20 can be prevented, while the generation of particles due to a frictional contact between the holding device and the carrier can be reduced or avoided.
• the holding device 30 may magnetically or electrostatically interact with the upper portion of the carrier.
• the holding device 30 can contactlessly stabilize a vertical orientation of the carrier during a vertical movement of the carrier, e.g., during a downward movement of the carrier.
• the holding device 30 may not move together with the carrier support 20 in the vertical direction V.
• the holding device 30 may be stationary during a vertical movement of the carrier support 20.
• the holding device 30 may be configured such that the upper portion of the carrier is contactlessly stabilized during a vertical movement of the carrier 10 relative to the holding device 30.
• a particle generation in the vacuum chamber can be reduced, and a simple and space-saving holding device is provided.
• the holding device 30 may be arranged essentially above the carrier support 20.
• a carrier transportation space for accommodating the carrier may vertically extend between the carrier support 20 and the holding device 30.
• the holding device 30 may be arranged more than 1 m above the carrier support 20, e.g., when the height of the carrier to be lifted or lowered is more than 1 m.
• the holding device 30 may be configured to contactlessly stabilize the upper portion of the carrier, particularly in a horizontal direction S (also referred to herein as a "track switch direction S").
• the holding device may exert a horizontally acting stabilizing force onto the upper portion of the carrier 10, e.g., to reduce the risk of a tilting movement of the carrier during the lifting or lowering of the carrier.
• An "upper portion of the carrier” may be understood as an upper part of a vertically oriented carrier 10, including the upper 50%, particularly the upper 20% of a height of the vertically oriented carrier.
• the holding device 30 may stabilize the upper end of the carrier, in order to prevent a tilting of the carrier.
• the holding device 30 may include at least one stabilization portion which contactlessly interacts with the upper portion of the carrier.
• a counterpart of the at least one stabilization portion configured for a contactless interaction may be fixed to the upper portion of the carrier.
• the holding device 30 may stabilize the carrier by applying oppositely directed horizontal stabilization forces from two opposite sides onto the carrier.
• the holding device 30 comprises two stabilization portions configured to contactlessly hold the upper portion of the carrier therebetween.
• a first stabilization portion 37 may be arranged on a first side of the carrier (i.e., on a first side of the carrier transportation space) and a second stabilization portion 38 may be arranged on a second side of the carrier (i.e., on a second side of the carrier transportation space) opposite the first side.
• the second side may correspond to a front side of the carrier where the substrate 11 is held, and the first side may correspond to a rear side of the carrier opposite the front side.
• a tilting of the carrier in both side directions can be prevented due to said two-sided stabilization of the carrier.
• the holding device 30 includes at least one magnet unit configured to magnetically interact with the upper portion of the carrier.
• a counterpart e.g. a magnetic counter-unit for magnetically interacting with the at least one magnet unit of the holding device, may be fixed to the upper part of the carrier.
• the upper portion of the carrier may be contactlessly stabilized via magnetic forces.
• a magnet unit is reliable, cost-efficient and can provide large stabilization forces.
• the at least one magnet unit may include a permanent magnet. The complexity of the holding device can be reduced and energy can be saved because a permanent magnet provides a magnetic force without an external power supply.
• the at least one magnet unit has a vertical extension of 30 mm or more, particularly 50 mm or more.
• a magnet unit with a large vertical extension may ensure a magnetic interaction between the carrier 10 and the holding device 30 at different relative vertical positions between the carrier and the holding device. Accordingly, the holding device 30 can remain at a constant vertical position during the vertical movement of the carrier support 20.
• the holding device 30 may include at least one magnet unit for exerting a repulsive magnetic force on the upper portion of the carrier.
• the holding device 30 includes a first magnet unit 33 for exerting repulsive magnetic force on the upper portion of the carrier 10 from a first side and a second magnet unit 34 for exerting a repulsive magnetic force on the upper portion of the carrier 10 from a second side opposite the first side.
• Magnetic counter-units may be fixed to the upper part of the carrier 10 such as to magnetically interact with the first magnet unit 33 and the second magnet unit 34, respectively.
• the first magnet unit 33 of the holding device 30 may exert a repulsive magnetic force on a first magnetic counter-unit 13 fixed to a first side of the carrier 10
• the second magnet unit 34 of the holding device 30 may exert a repulsive magnetic force on a second magnetic counter-unit 14 fixed to a second side of the carrier opposite to the first side.
• the carrier may be contactlessly urged toward a center area between the first magnet unit 33 and the second magnet unit 34. A contact between the carrier 10 and the holding device 30 can be avoided due to the repulsive magnetic forces acting on both sides of the carrier. A reliable and contactless stabilization of the carrier can be provided.
• a "cantilever arm” may be an elongate mounting device configured to bring a magnet unit of the holding device 30 in close proximity to a respective side of the carrier.
• the first magnet unit 33 may be arranged at a distal end of the first cantilever arm 31, and the first cantilever arm 31 may be configured to be brought in proximity to the upper portion of the carrier where the first magnetic counter-unit 13 is provided.
• the second magnet unit 34 may be arranged at a distal end of the second cantilever arm 32, and the second cantilever arm 32 may be configured to be brought in proximity to the upper portion of the carrier where the second magnetic counter-unit 14 is provided.
• the holding device 30 may be movable in a horizontal direction, particularly in the track switch direction S which may correspond to a thickness direction of the carrier.
• the holding device 30 may be movable in the horizontal direction in order to bring the holding device 30 close to the carrier for holding and stabilizing the upper portion of the carrier.
• the first cantilever arm 31 and the second cantilever arm 32 are movable in the horizontal direction, particularly independently of each other.
• a first drive for horizontally moving the first cantilever arm 31 (e.g., back and forth in the track switch direction S) may be provided at the proximal end of the first cantilever arm 31, e.g.
• a second drive for horizontally moving the second cantilever arm 32 (e.g., back and forth in the track switch direction S) may be provided at the proximal end of the second cantilever arm 32, e.g. outside the vacuum chamber.
• the first drive and the second drive may be arranged on the same side of the carrier transportation space, e.g. next to each other outside the vacuum chamber.
• the first drive and the second drive may be operable independently of each other.
• the first drive and the second drive may be configured to move the first cantilever arm and the second cantilever arm in opposite directions.
• the first drive and the second drive may be configured to synchronously move the first cantilever arm and the second cantilever arm in the same direction at a corresponding speed.
• the first stabilization portion 37 of the first cantilever arm 31 may be movable toward a first side of the carrier and the second stabilization portion 38 of the second cantilever arm 32 may be movable toward a second side of the carrier opposite the first side.
• the first cantilever arm 31 and the second cantilever arm 32 may be essentially L- shaped, respectively. A long leg of the first cantilever arm 31 may extend in an essentially horizontal direction.
• a short leg connected to the distal end of the long leg may extend in a downward direction and may include the first stabilization portion 37.
• a long leg of the second cantilever arm 32 may extend in an essentially horizontal direction above the carrier transportation space.
• a short leg connected to the distal end of the long leg may extend in a downward direction and may include the second stabilization portion 38.
• the long leg of the second cantilever arm 32 may be arranged above a vertical level of the long leg of the first cantilever arm 31, as is schematically depicted in FIG. 1.
• the holding device 30 may have at least two first cantilever arms and/or at least two second cantilever arms, which may be spaced apart from each other in a horizontal direction, respectively.
• At least one magnet unit configured to contactlessly stabilize the upper portion of the carrier may be provided at a distal end of each of the first and second cantilever arms. Accordingly, a stable and reliable stabilization of the carrier can be provided over the full width of the carrier.
• the carrier may be moved in the vertical direction utilizing the assembly 100 for at least one or more of the following reasons: (i) positioning the carrier at a predetermined vertical level, (ii) correcting or adjusting the vertical level of the carrier, (iii) controlling the vertical level of the carrier, e.g. via an active control, (iv) placing the carrier on a track of a transport system arranged at a specified vertical level, (v) lowering the carrier onto a path switch support for a performing a path switch, and (vi) lifting the carrier from a path switch support for placing the carrier back on a track of a transport system.
• FIGS. 2A-D show several stages of a method for lifting or lowering a carrier with an assembly 100 according to embodiments described herein.
• a carrier 10 is placed on a carrier support 20.
• the carrier support 20 is movable in an upward direction and/or in a downward direction with the carrier 10 supported thereon.
• the holding device 30 may be arranged spaced-apart from the upper portion of the carrier.
• the holding device 30 may be arranged at a retracted position where no stabilization force or a negligible stabilization force is exerted on the carrier by the holding device.
• a first stabilization portion 37 provided on a first side of the carrier e.g., the rear side of the carrier
• a second stabilization portion provided on a second side of the carrier (e.g., the front side of the carrier) is arranged at a distance of 10 cm or more from the carrier.
• the first stabilization portion 37 may be provided at a distal end of a first cantilever arm 31 that is movable in a horizontal direction, e.g. via a first drive
• the second stabilization portion 38 may be provided at a distal end of a second cantilever arm 32 that is movable in the horizontal direction, e.g. via a second drive, particularly independently of one another.
• the carrier support 20 When the carrier support 20 is vertically moved, e.g. in a downward direction, the upper portion of the carrier is held and stabilized by the holding device 30. Thus, the first stabilization portion 37 is moved toward the first side of the carrier, and the second stabilization portion 38 is moved toward the second side of the carrier.
• a distance between the holding device 30 and the upper portion of the carrier may be 5 cm or less, particularly 1 cm or less.
• the first stabilization portion 37 has moved close to the first side of the carrier
• the second stabilization portion 38 has moved close to the second side of the carrier.
• the holding device 30 does not contact the carrier due to the repulsive magnetic forces between magnet units provided at both stabilization portions and magnetic counter-units provided at both sides of the carrier. Accordingly, the upper portion of the carrier can be held and stabilized between the stabilization portions of the holding device.
• the carrier support 20 moves in a downward direction or in an upward direction. Accordingly, the carrier that is supported on the carrier support 20 is lowered or lifted. The carrier is stabilized during the lowering or lifting by the holding device 30.
• the magnet units provided at the holding device 30 and/or the magnetic counter-units provided at the carrier have a vertical extension that ensures a magnetic interaction between the holding device 30 and the upper portion of the carrier during a relative vertical movement between the holding device 30 and the carrier 10.
• the magnet units provided at the holding device and the magnetic counter-units provided at the carrier may overlap both in an upper vertical position of the carrier depicted in FIG. 2B and in a lower vertical position of the carrier depicted in FIG. 2C.
• the carrier may be lowered or lifted by 10 mm or more, 20 mm or more, 40 mm or more, or even 100 mm or more.
• the holding device 30 may remain stationary.
• the holding device 30 may move away from the carrier 10.
• the first stabilization portion 37 may move away from the first side of the carrier
• the second stabilization portion 38 may move away from the second side of the carrier.
• holding the upper portion of the carrier 10 by the holding device 30 may no longer be necessary, e.g., because a further carrier holding device (not depicted in FIG. 2D) or a magnetic levitation force provided by a magnetic levitation system may hold and stabilize the carrier at the lifted or lowered position.
• FIG. 3 is a sectional view of an assembly 200 for lifting or lowering a carrier according to embodiments described herein.
• the assembly 200 essentially corresponds to the assembly 100 of FIG. 1, such that reference can be made to the above explanations, which are not repeated here.
• the assembly 200 of FIG. 2 includes a first transport system 112 configured to transport the carrier 10 along a first transport path Tl in a transport direction.
• the transport direction is perpendicular to the paper plane of FIG. 2.
• the first transport system 112 may be configured to contactlessly transport the carrier in the transport direction, e.g. using a magnetic force.
• the first transport system may not use a mechanical force to transport the carrier. Instead, the first transport system may magnetically push or pull the carrier towards a new position along a transport path.
• contactless and “contactlessly moving” as used throughout the present disclosure can be understood in the sense that the carrier is not moved using a mechanical contact between the carrier and the first transport system, but is magnetically moved by a repulsive and/or an attractive magnetic force. There may be no mechanical contact between the apparatus and the carrier at all during the transportation along the first and/or second transport paths.
• the first transport system 112 may be a magnetic levitation system in some embodiments.
• the magnetic levitation system may include an upper track section 122 and a lower track section 121, wherein the carrier 10 may be transported in an essentially vertical orientation between the upper track section 122 and the lower track section 121.
• the upper track section 122 may be arranged above the lower track section 121.
• Magnets and/or drive units of the magnetic levitation system may be arranged at the upper track section 122 and/or at the lower track section 121.
• active magnetic units configured to contactlessly hold the carrier below the upper track section 122 may be arranged at the upper track section
• drive units e.g. linear motors, configured to move the carrier along the tracks may be arranged at the lower track section 121.
• the assembly further includes a carrier support 20 that is movable in the vertical direction V via an actuator 25 as well as a holding device 30 for holding an upper portion of the carrier 10 during a vertical movement of the carrier. Details of the holding device 30 are described with reference to FIG. 1, and are not repeated here.
• the carrier support 20 may be connected to or integrally formed with the lower track section 121 of the first transport system 112. In particular, as is schematically depicted in FIG. 3, the carrier support 20 is connected to the lower track section 121 such as to be movable in the vertical direction together with the lower track section 121.
• the magnetic levitation system may further provide a magnetic side stabilization of the carrier.
• the magnetic levitation system may provide magnetic forces acting on the carrier in a horizontal direction (particularly in the track switch direction S) which prevent a drift of the carrier away from the upper track section 122. Accordingly, during the transport of the carrier with the magnetic levitation system, the upper portion of the carrier can be held and stabilized in the horizontal direction by the magnetic levitation system.
• the magnetic side- stabilization of the magnetic levitation system typically acts on a specified vertical level. It may be challenging to hold and stabilize the upper portion of a vertically moving carrier.
• the holding device 30 configured to contactlessly hold the upper portion of the carrier during a vertical movement of the carrier.
• the holding device 30 may magnetically interact with the upper portion of a vertically moving carrier while the holding device 30 may remain at a constant vertical level.
• the magnetic levitation of the first transport system 112 can be switched off or reduced, and the carrier 10 can be lowered by moving the carrier support 20 in a downward direction.
• the distance between the upper track section 122 and the carrier 10 is increased by lowering the carrier. Due to the increased distance between the upper track section 122 and the carrier 10, the carrier 10 can then be moved away from the first transport path Tl in the path switch direction S.
• FIG. 4A-F show subsequent operation positions of an apparatus 400 for transportation of a carrier in a vacuum chamber according to embodiments described herein.
• the apparatus 400 includes a first transport system 112 provided along a first transport path Tl in a transport direction T, and a path switch assembly 150 configured to move the carrier away from the first transport path Tl in a path switch direction S essentially perpendicular to the transport direction T.
• the path switch assembly 150 includes a carrier support 20 that is movable in an essentially vertical direction V, and a holding device 30 configured to contactlessly hold an upper portion of the carrier.
• the holding device 30 may be configured in accordance with the holding device depicted in FIG. 1, such that reference can be made to the above explanations, which are not repeated here. In particular, the holding device 30 is configured to hold the upper portion of the carrier during a lifting or a lowering of the carrier that is supported on the carrier support.
• the track switch direction S may correspond to the horizontal direction in which the holding device 30 is movable.
• the track switch direction S may correspond to the direction of the stabilizing force that is exerted on the upper portion of the carrier by the holding device 30.
• the apparatus 400 for transportation of a carrier in a vacuum chamber can provide one, two or more transport paths, wherein the carrier can be moved or conveyed along the transport paths.
• a first transport path Tl may extend next to a second transport path T2, e.g., essentially parallel to the first transport path Tl.
• the first transport path Tl and/or the second transport path T2 may extend in a transport direction T, which may be a horizontal direction essentially perpendicular to the path switch direction S.
• the first transport path Tl and the second transport path T2 may be horizontally offset from each other in the path switch direction S.
• the distance between the first transport path Tl and the second transport path T2 in the path switch direction S may be 10 cm or more, particularly 20 cm or more, and/or 100 cm or less, particularly 50 cm or less.
• the apparatus 400 can be a part of a vacuum processing system, such as an in-line processing system, such that a substrate can be continuously or quasi-continuously processed.
• the apparatus 400 may be configured to displace or move the carrier away from the first transport path Tl to the second transport path T2 and/or to a processing position T3 in which the substrate can be processed.
• the apparatus 400 can laterally displace the carrier from a first position on the first transport path Tl to a second position away from the first track in the path switch direction S.
• the path switch direction S may be essentially perpendicular to the transport direction. When the carrier is moved from one transport path to another transport path in the path switch direction S, said movement can also be referred to as a "path switch" or a "track switch".
• the first transport system 112 may be configured to contactlessly transport the carrier 10 along the first transport path Tl in the transport direction T.
• the first transport system 112 may be a first magnetic levitation system configured for a contactless transport of the carrier along the first transport path Tl.
• the first transport system 112 includes a lower track section 121 and an upper track section 122.
• the carrier may be transported in a carrier transportation space between the lower track section 121 and the upper track section 122, particularly in an essentially vertical orientation.
• the carrier support 20 of the path switching assembly 150 is connected to or integrally formed with the lower track section 121 of the first transport system 112.
• the carrier support 20 may be movable in the vertical direction V together with the lower track section 121.
• an actuator 25 may be provided for vertically moving the lower track section 121 together with the carrier support 20.
• the upper track section 122 may be arranged essentially above the lower track section 121. Magnetic units of the first transport system 112 may be arranged at the lower track section 121 and/or at the upper track section 122. For example, a plurality of actively controlled magnetic units may be arranged at the upper track section 122 for contactlessly holding the carrier 10 below the upper track section 122.
• the upper track section 122 may be a part of an upper track configured as an upper guiding rail that extends along the first transport path Tl in the transport direction T.
• a gap between the upper track section 122 and the carrier may have a width of 5 mm or less, particularly about 2 mm.
• Active magnetic units and/or passive magnetic units of the first transport system 112 may be fixed at the upper track section 122.
• the lower track section 121 may be a part of a lower track configured as a lower guiding rail that extends along the first transport path Tl in the transport direction T.
• a gap between the lower track section 121 and the carrier may have a width of 5 mm or less, particularly about 2 mm.
• Drive units of the first transport system configured to contactlessly transport the carrier in the transport direction T may be fixed at the lower track section 121.
• the apparatus 400 further includes the path switch assembly 150.
• the path switch assembly 150 may be configured to move the carrier away from the first transport path Tl in the path switch direction S transverse to the transport direction T.
• the path switch assembly 150 may be configured to move the carrier from the first transport path Tl to the second transport path T2 in the path switch direction S.
• the path switch assembly 150 may be configured to move the carrier to a processing position T3 in which the carrier is processed, e.g. coated.
• the process position T3 may be horizontally offset from the first and second transport paths.
• a processing tool 105 may be arranged in the vacuum chamber for processing the substrate 11 held by the carrier 10, e.g. when the carrier is arranged at the processing position T3.
• the processing tool 105 can be a deposition source configured to deposit a coating material on the substrate.
• the path switch assembly 150 includes a path switch support 152.
• the path switch support 152 may be movable in the path switch direction S for transferring the carrier 10 in the path switch direction S.
• the carrier 10 may be supported on the path switch support 152.
• the path switch support 152 may hold the carrier from the side.
• the path switch support 152 may include a magnetic chuck for magnetically engaging with a side surface of the carrier.
• a drive device may be provided for moving the path switch support 152 in the path switch direction S for transferring the carrier from the first transport path Tl to the second transport path T2 and/or to the processing position T3.
• the drive device (not depicted in the figures) may be arranged outside the vacuum chamber, and the path switch support 152 may extend through a wall of the vacuum chamber. Alternatively, the drive device may be arranged inside the vacuum chamber.
• the drive device may be configured to move the path switch support 152 in the path switch direction S by a distance of 10 cm or more, particularly 25 cm or more, from the first transport path Tl to the second transport path T2 and/or to the processing position T3.
• a distance between the first transport path Tl and the second transport path T2 may be 25 cm or more and 100 cm or less.
• the path switch support 152 of the embodiment depicted in FIG. 4A includes a support surface for positioning the carrier on the support surface.
• the carrier 10 may be moved in a downward direction by the carrier support 20 and be positioned on the support surface of the path switch support 152.
• the path switch support 152 may be moved in the path switch direction S for transferring the carrier away from the first transport path Tl.
• a second transport system 114 may be provided for transporting the carrier 10 along a second transport path T2.
• the second transport system 114 may be a second magnetic levitation system provided along the second transport path T2.
• the second transport path T2 may be horizontally offset from the first transport path Tl.
• the path switch support 152 may be movable in the path switch direction S for transferring the carrier 10 from the first transport path Tl to the second transport path T3 and/or to the processing position T3, which is horizontally offset from both the first and second transport paths.
• the second transport system 114 may include a second lower track section 123 and a second upper track section 124, wherein the carrier can be transported along the second transport path T2 between the second lower track section 123 and the second upper track section 124.
• the second lower track section 123 may be movable in the vertical direction V. A carrier that is arranged on the second lower track section 123 can therefore be lifted and lowered by moving the second lower track section 123 in an upward direction or in a downward direction.
• the lower track section 121 of the first transport system 112 may be movable in the vertical direction V independently of the second lower track section 123 of the second transport system 114.
• a carrier is transported by the first transport system 112 along the first transport path Tl in the transport direction T.
• the transport may be a contactless transport.
• the carrier 10 may be held at a distance (e.g., a distance of about 2 mm) below the upper track section 122, and at a distance (e.g., a distance of about 2 mm) above the lower track section 121 by magnetic forces, e.g. repulsive magnetic forces acting from below and/or attractive magnetic forces acting from above.
• the carrier 10 is transported to a position on the first transport path Tl depicted in FIG. 4A where the path switch assembly 150 is arranged.
• the upper portion of the carrier may be held and stabilized by magnetic forces provided by the first transport system 112.
• the holding device 30 may be arranged spaced-apart from the upper portion of the carrier.
• the holding device 30 may be moved toward the carrier 10 in a horizontal direction.
• a first stabilization portion of the holding device 30 may be moved toward a first side of the carrier (e.g., the rear side of the carrier), and a second stabilization portion of the holding device 30 may be moved toward a second side of the carrier (e.g., the front side of the carrier).
• the carrier is then contactlessly held and stabilized by the holding device. Magnetic forces may act in the track switch direction S between the stabilization portions of the holding device 30 and the upper portion of the carrier.
• the magnetic levitation force may be switched- off or reduced for placing the carrier on the carrier support 20.
• the magnetic levitation force may be gradually reduced such that the carrier is smoothly placed on the carrier support 20.
• the upper portion of the carrier is contactlessly held by the holding device 30.
• the carrier support 20 may then be moved in a downward direction by the actuator 25, e.g. by a distance of 40 mm or more.
• the carrier 10 is lowered and placed on the path switch support 152.
• the holding device 30 may remain essentially stationary during the lowering of the carrier.
• the carrier support 20 may move further downward, in order to allow for an unobstructed path switch movement of the path switch support 152 in the path switch direction S.
• the carrier support 20 and the path switch support 152 of the path switch assembly 150 may be configured to support the carrier 10 from below.
• the bottom surface of the carrier 10 may first be placed on the substrate support (FIG.4B) and then on the path switch support 152 (FIG. 4C). Due to the downward movement of the carrier 10 supported on the carrier support 20, a distance between the carrier 10 and the upper track section 122 can be increased.
• a distance between the carrier and the lower track section 121 can be increased.
• a transfer movement of the carrier in the path switch direction S can be facilitated because the free space above the carrier 10 and below the carrier during the path switch is increased.
• the path switch support 152 with the carrier 10 supported thereon may be moved in the path switch direction S from the first transport path Tl to the second transport path T2 and/or to the processing position T3 (FIG. 4D) where the substrate may be processed by the processing tool 105.
• the holding device 30 is movable in the path switch direction S together with the path switch support 152. The holding device 30 may contactlessly hold and stabilize the upper portion of the carrier 10 during the movement of the carrier in the path switch direction S.
• the holding device 30 may be movable in the path switch direction S essentially synchronously with the path switch support 152 and at the same speed as the path switch support 152.
• the first cantilever arm 31 and the second cantilever arm 32 may move synchronously with the path switch support 152, and at the same speed as the path switch support 152 in the path switch direction S, in order to provide a reliable stabilization of the upper part of the carrier 10 during the path switch movement of the carrier.
• the upper portion of the carrier can be contactlessly held at a center position between the first magnet unit 33 and the second magnet unit 34 of the holding device 30.
• the carrier may be moved to the second transport path T2 by the path switch support 152, while the upper portion of the carrier is contactlessly held by the holding device 30.
• the holding device 30 may move at the same speed as the path switch support.
• the second transport system 114 may include a second lower track section 123 that is movable in the essentially vertical direction.
• a second carrier support configured to lift or lower the carrier supported on the second carrier support may be connected to or integrally formed with the second lower track section 123.
• the second lower track section 123 of the second transport system 114 may then be moved in an upward direction, until the carrier is lifted from the path switch support 152 and moved upward toward the second upper track section 124 of the second transport system 114.
• the upper portion of the carrier may be contactlessly held by the holding device 30.
• the magnetic levitation of the second transport system 114 may be switched on.
• the carrier may then be contactlessly held below the second upper track section 124 and above the second lower track section 123 by respective magnetic bearings of the second transport system 114.
• the magnetic forces of the second transport system 114 may also provide a side-stabilization of the upper portion of the carrier.
• the holding device 30 may be moved away from the carrier in a horizontal direction when a side stabilization of the upper portion of the carrier is provided by the magnetic levitation system.
• the carrier can then be contactlessly transported along the second transport path T2 in the transport direction T by the second transport system 114, e.g., toward a further processing module or back toward a carrier unloading chamber.
• FIG. 5 shows a schematic top view of a system 500 including an apparatus for transportation of a carrier according to embodiments described herein.
• the apparatus may correspond to the apparatus 400 depicted in FIGS. 4A-F, such that reference can be made to the above explanations, which are not repeated here.
• the system 500 for vacuum processing of a substrate according to embodiments described herein includes a vacuum chamber 101, an apparatus for transportation of a carrier according to any of the embodiments described herein, and one or more processing tools 105 arranged in the vacuum chamber 101.
• the one or more processing tools may be selected from the group consisting of deposition sources, sputter sources, evaporation sources, surface treatment tools, heating devices, cleaning devices, etching tools, and combinations thereof.
• a first transport path Tl and a second transport path T2 which is horizontally offset from the first transport path Tl extend at least partially through the vacuum chamber 101.
• a processing position T3 in which a substrate can be processed is provided horizontally offset from the first transport path Tl and the second transport path T2.
• a mask 12 is provided between the processing position T3 and the processing tool 105.
• the mask 12 may be, e.g., an edge exclusion mask or a fine metal mask.
• the mask 12 may prevent a portion of the substrate from being coated and/or the mask may have an opening pattern corresponding to a material pattern to be deposited on the substrate.
• the apparatus includes a first transport system 112 for contactlessly transporting the carrier 10 along the first transport path Tl, a second transport system 114 for contactlessly transporting the carrier 10 along the second transport path T2, and a path switch assembly 150 configured to transfer the carrier 10 from the first transport path Tl to the second transport path T2 and/or to the processing position T3 in the path switch direction S.
• the path switch assembly 150 includes a carrier support 20 (depicted in dashed lines in FIG. 5) that is movable in a vertical direction for lifting or lowering the carrier.
• the carrier support 20 may be arranged below the carrier transportation space, such that the carrier can be placed on the carrier support 20 by reducing a magnetic levitation force of the first transport system 112.
• the path switch assembly further 150 includes a path switch support 152 (depicted in dashed lines in FIG. 5) configured to support the carrier 10.
• the path switch support 152 is movable in the path switch direction S for transferring the carrier between the transport paths. Both the carrier support 20 and the path switch support 152 may be configured to support the carrier from below.
• two path switch supports 152 are provided which are spaced apart from each other in the transport direction T, e.g. by a distance of 1 m or more. More than two path switch supports may be provided in other embodiments.
• the path switch assembly 150 further includes a holding device 30 configured to contactlessly stabilize an upper portion of the carrier, particularly by exerting magnetic stabilization forces on the carrier from opposite sides of the carrier.
• the holding device 30 depicted in FIG. 6 includes two first cantilever arms 31 which are spaced apart from each other in the transport direction T, e.g. by a distance of 2 m or more and 4 m or less. At least one magnet unit configured to interact with the rear side of the carrier may be fixed to a distal end of each first cantilever arm 31.
• the two first cantilever arms may be movable in the path switch direction S toward the rear side of the carrier by a common drive unit or by two separate drive units. In other embodiments, more than two first cantilever arms may be provided.
• the holding device 30 depicted in FIG. 6 includes two second cantilever arms 32 which are spaced apart from each other in the transport direction T, e.g. by a distance of 50 cm or more and 150 cm or less. At least one magnet unit configured to interact with the front side of the carrier may be fixed to a distal end of each second cantilever arm 32.
• the two second cantilever arms may be movable in the path switch direction S toward the front side of the carrier by a common drive unit or by two separate drive units. In other embodiments, more than two second cantilever arms may be provided.
• the two path switch supports 152, the two first cantilever arms 31, and the two second cantilever arms 32 may be movable together and synchronously in the path switch direction S toward the processing tool 105.
• a quick and reliable path switch can be performed.
• FIG. 6 is a flow diagram illustrating a method of lifting or lowering a carrier in a vacuum chamber according to embodiments described herein.
• a carrier is placed on a carrier support.
• the carrier support may support the carrier from below.
• the carrier may be a vertically oriented carrier, particularly a substrate carrier which carries a large-area substrate in an essentially vertical orientation.
• the carrier may have a height of 1 m or more, particularly 2 m or more, a width of 1 m or more, particularly 2 m or more, and/or a thickness of 50 cm or less, particularly 20 cm or less.
• the "thickness" of a carrier may be the dimension of the carrier in a horizontal direction corresponding to the path switch direction S.
• a holding device 30 is moved in a horizontal direction toward the carrier that is supported on the carrier support.
• a first stabilization portion of the holding device may be moved toward a first side of the carrier and a second stabilization portion of the holding device may be moved toward a second side of the carrier opposite the first side.
• the second side may correspond to the front side of the carrier where the substrate is held.
• the first side may correspond to the rear side of the carrier. Accordingly, the carrier is held between the first stabilization portion and the second stabilization portion which may exert repulsive magnetic forces on the carrier from opposite sides thereof. Accordingly, the carrier may be magnetically stabilized at a center position between the first stabilization portion and the second stabilization portion.
• the substrate support may be moved in an essentially vertical direction for lifting or lowering the carrier.
• the upper portion of the carrier is contactlessly supported by the holding device.
• the holding device may remain essentially stationary during the lifting or lowering of the carrier.
• the holding device is moved away from the carrier in the horizontal direction.
• the first stabilization portion of the holding device is moved away from the first side of the carrier, and the second stabilization portion of the holding device is moved away from the second side of the carrier.
• the carrier may then be further transported, e.g., removed from the substrate support in the horizontal direction which may correspond to a path switch direction S.
• the carrier carries a large-area substrate for display manufacturing that is to be processed in the vacuum chamber.
• the substrate may have a size of 1 m 2 or more, particularly 5 m 2 or more.
• the substrate may be processed in the vacuum chamber by depositing a coating material on the substrate, e.g. by evaporation, by sputtering and/or by chemical vapor deposition.
• FIG. 7 is a flow diagram illustrating a method for transportation of a carrier in a vacuum chamber according to embodiments described herein.
• a carrier is contactlessly transported along a first transport path in a vacuum chamber by a first transport system, particularly by a first magnetic levitation system.
• the carrier is stopped at a position of the first transport path where a path switch assembly is arranged.
• the carrier may be arranged above a substrate support that is movable in a vertical direction.
• a holding device 30 is moved toward an upper portion of the carrier for contactlessly holding the upper portion, particularly for contactlessly stabilizing the upper portion of the carrier between two stabilization portions of the holding device.
• a magnetic levitation force of the first transport system may be switched off or reduced for placing the carrier on the substrate support, such that the carrier is in mechanical contact with the substrate support.
• the substrate support is moved in a vertical direction for lowering the carrier supported thereon.
• the holding device may exert a horizontal stabilization force on the carrier.
• the carrier may be lowered onto a path switch support that is movable in a path switch direction, particularly essentially perpendicular to the transport direction.
• the path switch support is moved in the path switch direction for transferring the carrier from the first transport path to a second transport path and/or to a processing position.
• the holding device moves together with, and synchronously with, the path switch support in the path switch direction.
• a substrate that is carried by the carrier can be processed, e.g. coated with a coating material.
• the carrier may be transferred to the second transport path where the carrier may be arranged above a vertically movable second lower track section of a second transport system.
• the second lower track section is moved in an upward direction, when the carrier is arranged on the second transport path.
• the carrier may be lifted from the path switch support by the upwardly moving second lower track section.
• the second lower track section may position the carrier at a predetermined vertical level where the upper end of the carrier may be arranged at a close distance from a second upper track section of the second transport system.
• the upper portion of the carrier is contactlessly held by the holding device.
• a magnetic levitation force of the second transport device provided along the second transport path may be switched on.
• the holding device may be removed from the upper portion of the carrier.
• the carrier may then be contactlessly transported along the second transport path in the transport direction by the second transport system.

Landscapes

• Engineering & Computer Science (AREA)
• Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Manufacturing & Machinery (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Chemical & Material Sciences (AREA)
• Analytical Chemistry (AREA)
• Plasma & Fusion (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Materials Engineering (AREA)
• Mechanical Engineering (AREA)
• Metallurgy (AREA)
• Organic Chemistry (AREA)
• Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
• Non-Mechanical Conveyors (AREA)
• Intermediate Stations On Conveyors (AREA)
• Specific Conveyance Elements (AREA)
• Physical Vapour Deposition (AREA)
• Chemical Vapour Deposition (AREA)

Priority Applications (5)

Applications Claiming Priority (1)

Publications (1)

Family

ID=59761946

Family Applications (1)

Country Status (5)

Families Citing this family (2)

Citations (6)

Family Cites Families (7)

• 2017
  • 2017-08-25 WO PCT/EP2017/071449 patent/WO2019037873A1/en active Application Filing
  • 2017-08-25 JP JP2018565841A patent/JP6766189B2/ja active Active
  • 2017-08-25 KR KR1020197000513A patent/KR102248738B1/ko active IP Right Grant
  • 2017-08-25 CN CN201780059041.XA patent/CN109790618B/zh active Active
• 2018
  • 2018-07-27 TW TW107126003A patent/TWI712102B/zh active

Patent Citations (6)

Also Published As

Similar Documents

Legal Events