WO2019033473A1 - Oled触控显示面板及oled触控显示器 - Google Patents

Oled触控显示面板及oled触控显示器 Download PDF

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Publication number
WO2019033473A1
WO2019033473A1 PCT/CN2017/100691 CN2017100691W WO2019033473A1 WO 2019033473 A1 WO2019033473 A1 WO 2019033473A1 CN 2017100691 W CN2017100691 W CN 2017100691W WO 2019033473 A1 WO2019033473 A1 WO 2019033473A1
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Prior art keywords
layer
disposed
oled
conductive
conductive layer
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French (fr)
Inventor
李鹏
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Priority to US15/572,166 priority Critical patent/US20190051707A1/en
Publication of WO2019033473A1 publication Critical patent/WO2019033473A1/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means

Definitions

  • the present invention relates to the field of OLED display, and in particular to an OLED touch display panel and an OLED touch display.
  • a general flexible OLED touch display screen includes a flexible OLED display screen and a touch screen disposed on the flexible OLED display screen.
  • the touch screen generally includes a glass substrate and a touch circuit disposed on the glass substrate. The manner in which the touch screen is disposed on the flexible OLED display causes the flexible OLED touch display panel to be thick.
  • An object of the present invention is to provide an OLED touch display integrated panel and an OLED touch display to reduce the thickness of the OLED touch display panel.
  • the invention provides an OLED touch display integrated panel, comprising:
  • An encapsulation layer disposed on the OLED layer and the array substrate;
  • a touch structure layer disposed on the package layer.
  • the touch structure layer is a projected capacitive touch structure, and the touch structure layer includes a first conductive layer, a first insulating layer, a second conductive layer, and Second insulating layer;
  • the first conductive layer is disposed on the first conductive layer
  • the second conductive layer is disposed on the first insulating layer
  • the second conductive layer is disposed on the first conductive layer
  • An insulating layer is disposed on the second conductive layer.
  • the pixel structure layer includes a pixel circuit layer and an OLED anode layer, the OLED anode layer is disposed on the pixel circuit layer, and the pixel circuit layer is disposed on the flexible layer On the substrate;
  • the driving circuit layer is electrically connected to the first conductive layer and the pixel structure layer, and the driving circuit layer is configured to drive the pixel structure layer and the first conductive layer.
  • the encapsulation layer is provided with a through hole to expose the driving circuit layer of the array substrate, and the first conductive layer passes through the through hole and the driving circuit
  • the layers are in contact and electrically connected.
  • the first conductive layer and the second conductive layer are made of a transparent conductive material.
  • the touch structure layer is a lateral capacitive touch structure
  • the touch structure layer includes a third conductive layer disposed on the package layer and a setting a fourth insulating layer on the third conductive layer.
  • the OLED touch display integrated panel of the present invention further includes a polarizing plate and a first adhesive layer;
  • the first adhesive layer is disposed on the touch circuit structure layer, and the polarizer is disposed on the first adhesive layer.
  • the OLED touch display integrated panel of the present invention further includes a cover plate and a second adhesive layer, wherein the second adhesive layer is disposed on the polarizing plate, and the cover plate is disposed on the On the second adhesive layer.
  • the OLED layer includes a hole injection layer, an electroluminescent layer, an electron injection layer, and a cathode layer;
  • the hole injection layer is disposed on the array substrate, the electroluminescent layer is disposed on the hole injection layer, the electron injection layer is disposed on the electroluminescent layer, and the cathode layer is disposed on the electron injection layer on.
  • the present invention also provides an OLED touch display, comprising the OLED touch display integrated panel according to any of the above.
  • the present invention can reduce the thickness of the OLED touch display panel by disposing the touch structure layer directly on the package layer without using a special glass substrate.
  • FIG. 1 is a cross-sectional structural view of a display area of an OLED touch display integrated panel in a preferred embodiment of the present invention.
  • FIG. 2 is a cross-sectional structural view showing an output end of a non-display area touch driving circuit layer of an OLED touch display integrated panel in a preferred embodiment of the present invention.
  • FIG 3 is a schematic structural view of a touch structure layer in a preferred embodiment of the present invention.
  • FIG. 4 is a schematic structural view of a touch structure layer in another preferred embodiment of the present invention.
  • FIG. 1 is a cross-sectional structural view of a display area of an OLED touch display integrated panel in a preferred embodiment of the present invention
  • FIG. 2 is an OLED touch display integrated panel in a preferred embodiment of the present invention. Schematic diagram of the cross-sectional structure of the output end of the non-display area touch drive circuit layer.
  • the OLED touch display integrated panel includes an array substrate 10 , an OLED layer 20 , an encapsulation layer 30 , a touch structure layer 40 , a polarizing plate 50 , and a cover plate 60 .
  • the OLED layer 20 is disposed on the array substrate 10; the encapsulation layer 30 is disposed on the OLED layer 20 and the array substrate 10; and the touch structure layer 40 is disposed on the encapsulation layer 30.
  • the polarizing plate 50 is disposed on the touch structure layer 40.
  • the cover plate 60 is disposed on the polarizing plate 50.
  • the array substrate 10 includes a flexible substrate 11 and an array structure 12 disposed on the flexible substrate 11.
  • the array structure 12 includes a third insulating layer 121, a driver circuit layer 122 (in FIG. 2), and a pixel structure layer 123 (in FIG. 1).
  • the third insulating layer 121 is disposed on the flexible substrate 11.
  • the driving circuit layer 122 and the pixel structure layer 123 are disposed on the third insulating layer 121.
  • the package layer 30 is disposed on the driving circuit layer 122 and the OLED layer 20 on.
  • the driving circuit layer 122 is located in a non-display area of the OLED touch display integrated panel, and the pixel structure layer 123 is located in a display area of the OLED touch display integrated panel.
  • the third insulating layer 121 is made of a material such as silicon nitride or silicon oxide by chemical vapor deposition.
  • the driving circuit layer 122 and the pixel structure 123 layer adopt LTPS TFT technology production.
  • the OLED layer 20 is disposed on the array structure 12. Specifically, the OLED layer 20 is disposed on a region of the encapsulation layer 30 opposite to the pixel structure layer 123.
  • the pixel structure layer 123 includes a pixel circuit layer 123a and an OLED anode layer 123b.
  • the pixel circuit layer 123a is disposed on the third insulating layer 121, and the OLED anode layer 123b is disposed on the pixel circuit layer 123a.
  • the OLED layer 20 includes a hole injection layer, an electroluminescent layer, an electron injection layer, and a cathode layer.
  • the hole injecting layer is disposed on the OLED anode, and the electroluminescent layer is disposed on the hole injecting layer.
  • the electron injecting layer is disposed on the electroluminescent layer, and the cathode layer is disposed on the electron injecting layer.
  • the encapsulation layer 30 is a thin film encapsulation layer made of a hydrophobic material and having oxygen barrier properties. It can be understood that the encapsulation layer 30 can also be a silicon nitride insulating layer combined with a thin film encapsulation layer.
  • the encapsulation layer 30 covers the drive circuit layer 122 of the array structure 12 and the cathode layer of the OLED layer 20.
  • the OLED touch display integrated panel further includes a first adhesive layer 100 for connecting the polarizing plate and the touch circuit layer; the first adhesive layer 100 is disposed on the touch structure layer, and the polarizing plate is disposed on the first layer On the adhesive layer 100.
  • the cover plate 60 can be a glass cover plate or a film with a strong scratch resistance.
  • the OLED touch display integrated panel further includes a second adhesive layer 100 for connecting the polarizing plate 50 and the cover plate 60.
  • the second adhesive layer 100 is disposed on the polarizing plate 50, and the cover plate 60 is disposed on the second adhesive layer.
  • the touch structure layer 40 is configured to collect a touch operation signal of the user.
  • the driving circuit layer 122 includes a display driving circuit layer and a touch driving circuit layer, and the display driving circuit layer and the touch driving circuit layer are in the same layer; the touch driving circuit layer is electrically connected to the touch structure layer 40, The display driving circuit layer is electrically connected to the pixel structure layer 123a.
  • the driving circuit layer 122 is used to drive the pixel structure layer 123a and the touch structure layer 40.
  • the touch control driving layer in the driving circuit layer 122 on the array substrate 10 can also be used to drive the touch structure layer 40.
  • the touch structure layer 40 is electrically connected to the output end of the touch driving circuit layer in the driving circuit layer 122, as shown in FIG.
  • the touch circuit layer 40 includes a first conductive layer 41 , a first insulating layer 42 , a second conductive layer 43 , and a second insulating layer 44 .
  • the touch driving circuit layer is electrically connected to the first conductive layer 41 of the touch structure layer 40 , and the driving circuit layer 122 is used to drive the pixel structure layer 123 and the first conductive layer 41 of the touch circuit layer 40 .
  • the first conductive layer 41 is disposed on the first conductive layer 41
  • the second conductive layer 43 is disposed on the first insulating layer 42
  • the second insulating layer 44 is disposed on the first conductive layer 41.
  • the first conductive layer 41 and the second conductive layer 43 are all made of a transparent conductive material, for example, indium tin oxide.
  • the first conductive layer 41 is formed on the encapsulation layer 30 by physical vapor deposition, and the first conductive layer 41 is patterned by a photolithography process to form a plurality of first touch electrodes.
  • a second conductive layer 43 is formed on the first insulating layer 42 by physical vapor deposition, and the second conductive layer 43 is patterned by a photolithography process to form a plurality of second touch electrodes.
  • the plurality of first touch electrodes are in one-to-one correspondence with the plurality of second touch electrodes and face each other, and a plurality of touch capacitors are formed at a position opposite to each other.
  • Each of the first insulating layer 42 and the second insulating layer 44 may be formed by a chemical vapor deposition method using an insulating material such as silicon nitride or silicon oxide.
  • a through hole 300 is formed in the output end of the touch driving circuit in the encapsulating layer 30 and the driving circuit layer 122, The first conductive layer 41 is in contact with and electrically connected to the output end of the touch driving circuit in the driving circuit layer 122 through the through hole 300.
  • the touch structure layer 40 can also be a lateral capacitive touch structure.
  • the touch structure layer 40 includes a third conductive layer 45 disposed on the package layer 30 and a fourth insulating layer 46 disposed on the third conductive layer 45.
  • the third conductive layer 45 is made of a transparent conductive material such as indium tin oxide or the like.
  • the third conductive layer 45 is formed on the encapsulation layer 30 by physical vapor deposition, and the conductive layer 45 is patterned by a photolithography process to form a plurality of touch electrodes.
  • the plurality of touch electrodes and the adjacent touch electrodes form a plurality of sensing capacitors for sensing a touch operation of the user.
  • the present invention can reduce the thickness of the OLED touch display panel by disposing the touch structure layer directly on the package layer without using a special glass substrate.
  • the embodiment of the invention further provides an OLED touch display, which comprises the OLED touch display integrated panel in the above embodiment.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种OLED触控显示面板及OLED触控显示器。该OLED触控显示面板包括：一阵列基板(10)；OLED层(20)，其设置于所述阵列基板(10)上；封装层(30)，其设置于所述OLED层(20)以及所述阵列基板(10)上；触控结构层(40)，其设置于所述封装层(30)上。其通过将触控结构层(40)直接设置在封装层(30)上而无需专门的玻璃基板，因此可以减小OLED触控显示面板的厚度。

Description

OLED触控显示面板及OLED触控显示器 技术领域
本发明涉及OLED显示领域，特别是涉及一种OLED触控显示面板及OLED触控显示器。
 背景技术
目前，一般柔性OLED触控显示屏包括柔性OLED显示屏以及设置于该柔性OLED显示屏上的触控屏。触控屏一般均包括玻璃基板以及设于玻璃基板上的触控电路。采用在柔性OLED显示屏上设置触控屏的方式导致该柔性OLED触控显示面板较厚。
因此，现有技术存在缺陷，急需改进。
 技术问题
本发明的目的在于提供一种OLED触控显示集成面板及OLED触控显示器，以减小OLED触控显示面板的厚度。
 技术解决方案
为解决上述问题，本发明提供的技术方案如下：
本发明提供一种OLED触控显示集成面板，包括：
一阵列基板；
OLED层，其设置于所述阵列基板上；
封装层，其设置于所述OLED层以及所述阵列基板上；
触控结构层，其设置于所述封装层上。
在本发明所述的OLED触控显示集成面板中，所述触控结构层为投射电容式触控结构，所述触控结构层包括第一导电层、第一绝缘层、第二导电层以及第二绝缘层；
所述第一导电层设置于所述封装层上，所述第一绝缘层设置于所述第一导电层上，所述第二导电层设置于所述第一绝缘层上，所述第二绝缘层设置于所述第二导电层上。
在本发明所述的OLED触控显示集成面板中，所述像素结构层包括像素电路层以及OLED阳极层，所述OLED阳极层设置于所述像素电路层上，所述像素电路层设置于柔性基板上；
所述驱动电路层与所述第一导电层电以及像素结构层电连接，所述驱动电路层用于驱动所述像素结构层以及所述第一导电层。
在本发明所述的OLED触控显示集成面板中，所述封装层开设有通孔从而将所述阵列基板的驱动电路层露出，所述第一导电层通过所述通孔与所述驱动电路层接触并电连接。
在本发明所述的OLED触控显示集成面板中，所述第一导电层以及所述第二导电层为透明导电材料制成。
在本发明所述的OLED触控显示集成面板中，所述触控结构层为侧向电容式触控结构，所述触控结构层包括设置于所述封装层上的第三导电层以及设置于所述第三导电层上的第四绝缘层。
在本发明所述的OLED触控显示集成面板中，还包括偏光板以及第一粘合层；
所述第一粘合层设置于所述触控电路结构层上，所述偏光板设置于所述第一粘合层上。
在本发明所述的OLED触控显示集成面板中，还包括盖板以及第二粘合胶层，所述第二粘合胶层设置于所述偏光板上，所述盖板设置于所述第二粘合胶层上。
在本发明所述的OLED触控显示集成面板中，所述OLED层包括空穴注入层、电致发光层、电子注入层、阴极层；
所述空穴注入层设置于所述阵列基板上，所述电致发光层设置于空穴注入层上，所述电子注入层设置于电致发光层上，所述阴极层设置于电子注入层上。
本发明还提供了一种OLED触控显示器，包括上述任一项所述的OLED触控显示集成面板。
 有益效果
本发明相对于现有技术，通过将触控结构层直接设置在封装层上而无需专门的玻璃基板，因此可以减小OLED触控显示面板的厚度。
 附图说明
图1是本发明一优选实施例中的OLED触控显示集成面板的显示区域的剖面结构示意图。
图2是本发明一优选实施例中的OLED触控显示集成面板的非显示区域触控驱动电路层的输出端的剖面结构示意图。
图3是本发明一优选实施例中的触控结构层的结构示意图。
图4是本发明另一优选实施例中的触控结构层的结构示意图。
 本发明的最佳实施方式
以下各实施例的说明是参考附加的图式，用以例示本发明可用以实施的特定实施例。本发明所提到的方向用语，例如「上」、「下」、「前」、「后」、「左」、「右」、「内」、「外」、「侧面」等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。
在图中，结构相似的模块是以相同标号表示。
请参照图1以及图2，图1是本发明一优选实施例中的OLED触控显示集成面板的显示区域的剖面结构示意图，图2是本发明一优选实施例中的OLED触控显示集成面板的非显示区域触控驱动电路层的输出端的剖面结构示意图。
其中，该OLED触控显示集成面板包括阵列基板10、OLED层20、封装层30、触控结构层40、偏光板50以及盖板60。其中，OLED层20设置于阵列基板10上；封装层30设置于OLED层20以及阵列基板10上；触控结构层40设置于封装层30上。偏光板50设置于该触控结构层40上。该盖板60设置于该偏光板50上。
在本发明实施例中，该阵列基板10包括柔性基板11以及设置于该柔性基板11上的阵列结构12。该阵列结构12包括第三绝缘层121、驱动电路层122（图2中）、像素结构层123（图1中）。该第三绝缘层121设置于柔性基板11上，该驱动电路层122以及该像素结构层123均设置于该第三绝缘层121上，该封装层30设置于该驱动电路层122以及OLED层20上。该驱动电路层122位于OLED触控显示集成面板的非显示区域，该像素结构层123位于OLED触控显示集成面板的显示区域。
其中，该第三绝缘层121采用氮化硅和氧化硅等材料，通过化学气相沉淀制成。该驱动电路层122以及像素结构123层均采用LTPS TFT技术制作。
该OLED层20设置于该阵列结构12上。具体地，该OLED层20设置于该封装层30与像素结构层123相对的区域上。该像素结构层123包括像素电路层123a、OLED阳极层123b。该像素电路层123a设置于第三绝缘层121上，该OLED阳极层123b设置于该像素电路层123a上。该OLED层20包括空穴注入层、电致发光层、电子注入层以及阴极层。该该空穴注入层设置于该OLED阳极上，该电致发光层设置于该空穴注入层上，该电子注入层设置于该电致发光层上，该阴极层设置于电子注入层上。
该封装层30为薄膜封装层，其采用疏水材料制成,并具有隔绝氧气的性能。可以理解地，该封装层30还可以为氮化硅绝缘层与薄膜封装层组合。该封装层30覆盖于该阵列结构12的驱动电路层122以及该OLED层20的阴极层上。
该OLED触控显示集成面板还包括用于连接该偏光板与触控电路层的第一粘合层100；第一粘合层100设置于触控结构层上，偏光板设置于所述第一粘合层100上。
该盖板60可以采用玻璃盖板或耐刮较强的薄膜。该OLED触控显示集成面板还包括用于连接偏光板50与盖板60的第二粘合胶层100，第二粘合胶层100设置于偏光板50上，盖板60设置于第二粘合胶层200上。
该触控结构层40用于收集用户的触控操作信号。
在本实施例中，驱动电路层122包括显示驱动电路层与触控驱动电路层，显示驱动电路层与触控驱动电路层位于同一层；触控驱动电路层与触控结构层40电连接，显示驱动电路层与像素结构层123a电连接。驱动电路层122用于驱动所述像素结构层123a以及触控结构层40。
在本实施例中，还可以采用阵列基板10上的驱动电路层122中的触控驱动电路层来驱动触控结构层40。该触控结构层40与该驱动电路层122中的触控驱动电路层的输出端电连接，如图2。
请同时参照图3，该触控结构层40的优选结构之一为投射电容式触控结构。该触控电路层40包括第一导电层41、第一绝缘层42、第二导电层43以及第二绝缘层44。
触控驱动电路层与触控结构层40的第一导电层41电连接，驱动电路层122用于驱动像素结构层123以及触控电路层40的第一导电层41。
其中，第一导电层41设置于封装层30上，第一绝缘层42设置于第一导电层41上，第二导电层43设置于第一绝缘层42上，第二绝缘层44设置于第二导电层43上。
其中，该第一导电层41以及第二导电层43均采用透明导电材料制成，例如，氧化铟锡。实际制作过程中，采用物理气相沉淀法在该封装层30上形成第一导电层41，并采用光刻工艺对该第一导电层41进行图形化处理，形成多个第一触控电极。采用物理气相沉淀法在该第一绝缘层42上形成第二导电层43，并采用光刻工艺对该第二导电层43进行图形化处理，形成多个第二触控电极。该多个第一触控电极与该多个第二触控电极一一对应并相互正对，正对位置形成多个触控电容。
该第一绝缘层42以及第二绝缘层44均可以采用氮化硅或氧化硅等绝缘材料并通过化学气相沉淀法形成。
为了实现该第一导电层41与该驱动电路层122中的触控驱动电路输出端的电连接，在该封装层30与驱动电路层122中的触控驱动电路输出端处开设有通孔300，该第一导电层41通过该通孔300与该驱动电路层122中的触控驱动电路输出端接触并电连接。
另外，请同时参照图4，在另一些实施例中，触控结构层40还可以为侧向电容式触控结构。触控结构层40包括设置于封装层30上的第三导电层45以及设置于第三导电层45上的第四绝缘层46。该第三导电层45采用透明导电材料制成，例如氧化铟锡等。制造时，采用物理气相沉积法在该封装层30上形成第三导电层45，并采用光刻工艺对该导电层45进行图形化处理，从而形成多个触控电极。该多个触控电极与邻近的触控电极形成多个感应电容，以用于感应用户的触控操作。
本发明相对于现有技术，通过将触控结构层直接设置在封装层上而无需专门的玻璃基板，因此可以减小OLED触控显示面板的厚度。
本发明实施例还提供了一种OLED触控显示器，其包括上述实施例中的OLED触控显示集成面板。
综上所述，虽然本发明已以优选实施例揭露如上，但上述优选实施例并非用以限制本发明，本领域的普通技术人员，在不脱离本发明的精神和范围内，均可作各种更动与润饰，因此本发明的保护范围以权利要求界定的范围为准。

Claims (13)

  1. 一种OLED触控显示面板，其包括：
    一阵列基板；
    OLED层，其设置于所述阵列基板上；
    封装层，其设置于所述OLED层以及所述阵列基板上；
    触控结构层，其设置于所述封装层上。
  2. 根据权利要求1所述的OLED触控显示面板，其中所述触控结构层为投射电容式触控结构，所述触控结构层包括第一导电层、第一绝缘层、第二导电层以及第二绝缘层；
    所述第一导电层设置于所述封装层上，所述第一绝缘层设置于所述第一导电层上，所述第二导电层设置于所述第一绝缘层上，所述第二绝缘层设置于所述第二导电层上。
  3. 根据权利要求2所述的OLED触控显示面板，其中所述阵列基板包括柔性基板、设置于柔性基板上的驱动电路层以及像素结构层；
    所述像素结构层包括像素电路层以及OLED阳极层，所述OLED阳极层设置于所述像素电路层上，所述像素电路层设置于柔性基板上；
    所述驱动电路层与所述第一导电层电以及像素结构层电连接，所述驱动电路层用于驱动所述像素结构层以及所述第一导电层。
  4. 根据权利要求3所述的OLED触控显示面板，其中所述封装层开设有通孔从而将所述阵列基板的驱动电路层露出，所述第一导电层通过所述通孔与所述驱动电路层接触并电连接。
  5. 根据权利要求2所述的OLED触控显示面板，其中所述第一导电层以及所述第二导电层为透明导电材料制成。
  6. 根据权利要求3所述的OLED触控显示面板，其中所述第一导电层以及所述第二导电层为透明导电材料制成。
  7. 根据权利要求4所述的OLED触控显示面板，其中所述第一导电层以及所述第二导电层为透明导电材料制成。
  8. 根据权利要求1所述的OLED触控显示面板，其中所述触控结构层为侧向电容式触控结构，所述触控结构层包括设置于所述封装层上的第三导电层以及设置于所述第三导电层上的第四绝缘层。
  9. 根据权利要求2所述的OLED触控显示面板，其中所述OLED触控显示面板还包括偏光板以及第一粘合层；
    所述第一粘合层设置于所述触控电路结构层上，所述偏光板设置于所述第一粘合层上。
  10. 根据权利要求9所述的OLED触控显示面板，其中所述OLED触控显示面板还包括盖板以及第二粘合胶层，所述第二粘合胶层设置于所述偏光板上，所述盖板设置于所述第二粘合胶层上。
  11. 根据权利要求1所述的OLED触控显示面板，其中所述OLED层包括空穴注入层、电致发光层、电子注入层、阴极层；
    所述空穴注入层设置于所述阵列基板上，所述电致发光层设置于空穴注入层上，所述电子注入层设置于电致发光层上，所述阴极层设置于电子注入层上。
  12. 一种OLED触控显示面板，其包括：
    一阵列基板；
    OLED层，其设置于所述阵列基板上；
    封装层，其设置于所述OLED层以及所述阵列基板上；
    触控结构层，其设置于所述封装层上；
    所述触控结构层为投射电容式触控结构，所述触控结构层包括第一导电层、第一绝缘层、第二导电层以及第二绝缘层；
    所述第一导电层设置于所述封装层上，所述第一绝缘层设置于所述第一导电层上，所述第二导电层设置于所述第一绝缘层上，所述第二绝缘层设置于所述第二导电层上；
    所述阵列基板包括柔性基板、设置于柔性基板上的驱动电路层以及像素结构层；
    所述像素结构层包括像素电路层以及OLED阳极层，所述OLED阳极层设置于所述像素电路层上，所述像素电路层设置于柔性基板上；
    所述驱动电路层与所述第一导电层电以及像素结构层电连接，所述驱动电路层用于驱动所述像素结构层以及所述第一导电层；
    所述封装层开设有通孔从而将所述阵列基板的驱动电路层露出，所述第一导电层通过所述通孔与所述驱动电路层接触并电连接；
    所述第一导电层以及所述第二导电层为透明导电材料制成；
    所述触控结构层为侧向电容式触控结构，所述触控结构层包括设置于所述封装层上的第三导电层以及设置于所述第三导电层上的第四绝缘层；
    所述OLED层包括空穴注入层、电致发光层、电子注入层、阴极层；
    所述空穴注入层设置于所述阵列基板上，所述电致发光层设置于空穴注入层上，所述电子注入层设置于电致发光层上，所述阴极层设置于电子注入层上。
  13. 一种OLED触控显示器，其包括权利要求1所述的OLED触控显示面板。
PCT/CN2017/100691 2017-08-14 2017-09-06 Oled触控显示面板及oled触控显示器 Ceased WO2019033473A1 (zh)

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CN109671744B (zh) * 2018-12-07 2021-04-16 上海天马有机发光显示技术有限公司 一种有机电致发光显示面板、其制造方法及显示装置
CN110058738B (zh) * 2019-04-11 2020-09-25 清华大学深圳研究生院 一种离子型的柔性触控传感器
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