WO2019020741A9 - Procédé pour le perçage ou le découpage par laser d'une pièce à l'aide d'un liquide de protection - Google Patents

Procédé pour le perçage ou le découpage par laser d'une pièce à l'aide d'un liquide de protection Download PDF

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Publication number
WO2019020741A9
WO2019020741A9 PCT/EP2018/070279 EP2018070279W WO2019020741A9 WO 2019020741 A9 WO2019020741 A9 WO 2019020741A9 EP 2018070279 W EP2018070279 W EP 2018070279W WO 2019020741 A9 WO2019020741 A9 WO 2019020741A9
Authority
WO
WIPO (PCT)
Prior art keywords
nanoparticles
laser
liquid
microparticles
workpiece
Prior art date
Application number
PCT/EP2018/070279
Other languages
German (de)
English (en)
Other versions
WO2019020741A1 (fr
Inventor
Csaba Laszlo SAJTI
Andreas Schwenke
Claudia UNGER
Jürgen Koch
Original Assignee
Laser Zentrum Hannover E.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Laser Zentrum Hannover E.V. filed Critical Laser Zentrum Hannover E.V.
Priority to EP18752102.6A priority Critical patent/EP3658326A1/fr
Publication of WO2019020741A1 publication Critical patent/WO2019020741A1/fr
Publication of WO2019020741A9 publication Critical patent/WO2019020741A9/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/706—Protective screens

Definitions

  • the invention relates to a method for laser boring or laser cutting of a workpiece, wherein electromagnetic radiation emitted by a laser strikes the workpiece and on a side of the workpiece facing away from the laser is a liquid in which particles are contained, so that the electromagnetic radiation emitted by the laser hits the particles when the electromagnetic radiation has penetrated the workpiece.
  • pulsed lasers with high pulse energy are required. After the electromagnetic radiation emitted by these pulsed lasers has penetrated the workpiece, it poses a danger to other materials and / or persons located in the beam path. Especially when there is further material opposite the borehole outlet side, only a small amount of material will be present This material is usually damaged by the emerging laser radiation.
  • the drilling or cutting process can not be aborted before the damage occurs since the passage hole in the workpiece must still be brought to the required shape after opening. The damage that occurs is unacceptable for many applications, such as laser drilling of injection nozzles or the creation of cooling holes in turbine blades.
  • the problem can also occur when cutting tube material with a small inside diameter, for example, when deploying medical stents.
  • the use of solids to trap the electromagnetic radiation has some disadvantages.
  • the hollow space between the workpiece to be cut on the rear side must be easily accessible from the outside.
  • the intermediate solid is removed and must either be pushed or renewed.
  • the removal particles of the solid, which are replaced by the electromagnetic radiation of the laser must be easily removed from the cavity at the end of the drilling process.
  • WO 2000/69594 A1 and US Pat. No. 6,365,891 B1 suggest using a liquid in which dyestuffs are present. These dyes can be selected in such a way that they in particular absorb photons which have the wavelength of the laser light. This leads to an electronic excitation in the dye molecules, in which electrons are raised to higher energy levels.
  • the disadvantage is that such dyes fade relatively quickly and become transparent to the electromagnetic radiation of the laser. In addition, they usually have only a relatively small absorption cross-section.
  • microparticles may be contained in the liquid which scatter the incident laser light and thus reduce the energy density of the electromagnetic radiation, so that it is no longer sufficient, in particular in combination with the absorption by the dye, to remove material in undesired places.
  • the particle concentration in the liquid must be very high. This leads to a high viscosity, which prevents a high flow velocity in narrow cavities. This has the disadvantage, on the one hand, that the highly viscous liquid is difficult to remove from, in particular, narrow cavities, and, on the other hand, if the flow velocity is low, there is a risk that the electromagnetic radiation locally vaporizes the liquid and thus does not in this area Protection is more for underlying materials. Bubbles are created through which the laser radiation can pass through almost unhindered.
  • spherical gold nanoparticles with a particle size of 3 nm to 10 nm excellently absorb in the laser wavelength range of 515 nm to 532 nm, but do not provide any backspace protection for laser wavelengths in the near infrared range, for example at 1030 nm and 1064 nm.
  • Classical laser wavelengths for cutting and However, drilling is near infrared.
  • Larger gold nanoparticles with a diameter of about 100 nm to 150 nm have a collective absorption of electromagnetic radiation with a
  • Wavelength of about 1000 nm to 1100 nm.
  • These gold nanoparticles are fragmented by the absorbed energy into smaller nanoparticles with a diameter of one nm to 20 nm, so that the larger gold nanoparticles with their diameter of 100 nm to 150 nm no time-stable back space contactor.
  • the invention is therefore based on the object, a method according to the preamble of claim 1 as known for example from DE 10 2013 212 665, To further develop such that for electromagnetic radiation in the near-infrared range at wavelengths of, for example, 1030 nm and 1064 nm as well as for electromagnetic radiation in the green visible range at wavelengths of, for example, 515 nm and 532 nm, a temporally stable back-space contactor is possible becomes. This is advantageous since, for example, pulsed near-infrared lasers are converted by additional structures into a frequency-doubled laser. For founded-le applications, it is therefore of great advantage to use a material as back space protection, which covers both wavelength ranges stable over time.
  • the invention achieves the stated object by a method according to the preamble of claim 1, characterized in that the particles contain nanoparticles of a first material which are adsorbed on microparticles, the microparticles being aggregated nanoparticles of a second material.
  • microparticles and nanoparticles The interaction of microparticles and nanoparticles in a single suspension is known in the art.
  • the nanoparticles are responsible for the absorption of the electromagnetic radiation and the microparticles for the scattering of the radiation.
  • the arrangement of nanoparticles on scattering micro-particles can already be found in DE 10 2013 212 665 A1.
  • microparticles which are aggregated nanoparticles are used according to the invention. This solution has some surprising advantages. First of all, it is surprising that such agglomerated nanoparticles, which form microparticles that are struck by the incident electromagnetic radiation of the pulsed laser, survive this radiation without damage.
  • the division of the tasks known hitherto from the prior art into absorption of the electromagnetic radiation by the nanoparticles and scattering of the electromagnetic radiation by the microparticles does not appear to be sustained by the embodiment according to the invention. Rather, it has been shown, for example, that gold nanoparticles which exhibit a plasmon resonance at an energy which corresponds to an electromagnetic radiation of a wavelength of less than 600 nm, in an inventive method have excellent backspace characteristics. Protective properties also in electromagnetic laser radiation with a wavelength of 1030 nm shows. Consequently, laser radiation can be absorbed for which the nanoparticles alone would not be suitable.
  • the first material is different from the second material.
  • the electromagnetic radiation has a wavelength between at least 500 nm and at most 1100 nm, preferably between at least 1030 nm and at most 1064 nm.
  • the first material is a metal, preferably gold, silver, platinum, palladium or copper, in particular in the form of copper selenide, or carbon, in particular in the form of carbon black, which is also referred to as "carbon", or a Selenide, especially copper selenide, or sulfite.
  • the material may contain all or some of the substances mentioned or from one
  • the optimal material can be adapted to the shape, in particular the geometric contour of the nanoparticles and, of course, to the laser wave length to be absorbed. In a preferred embodiment, at least a majority of the
  • Nanoparticles of the first material preferably all nanoparticles of the first material as a particle size between 1 nm and 99 nm, preferably between 2 nm and 50 nm.
  • the second material contains titanium dioxide, aluminum dioxide, silicon dioxide, silicon carbide, barium sulfate, calcium phosphate or zinc oxide or consists thereof or of a combination of several of the substances mentioned.
  • the liquid is water or oil, especially a mineral oil. It is also possible to use natural, for example vegetable oils or mixtures of different oils. In particular, for static methods in which the liquid is not or hardly moved and thus long influenced by the electromagnetic radiation, the use of an oil has proven to be advantageous because water evaporates by the incident laser energy which greatly reduces or completely destroys the protective effect.
  • the microparticles have a mean size of between 0.1 pm and 1 ⁇ m, preferably between 0.2 pm and 0.4 pm, preferably of 0.3 pm, and preferably have the nanoparticles of the second material have a particle size between 1 nm and 99 nm.
  • the concentration of microparticles in the liquid is between 50mg / ml and 500mg / ml, preferably between 100mg / ml and 200mg / ml.
  • a proportion of the first material to a total amount of the particles contained in the liquid less than 30 mass percent, preferably between 3 and 15 percent by mass, particularly preferably 5 percent by mass.
  • the microparticles are produced by dispersing aggregated, powdery nanoparticles of the second material in the liquid by the use of ultrasound and are preferably present as nanoparticle aggregates having an average particle size in the range of 0.3 ⁇ m ,
  • the invention also achieves the stated object by a liquid for use in such a method, which is characterized in that it contains particles which contain nanoparticles of a first material, which are adsorbed on microparticles, wherein the microparticles aggregated nanoparticles of the second material.
  • the inventive configuration of the method and the liquid ensures that the liquid contains a large number, preferably only, of microparticles, and hardly or preferably no nanoparticles are contained which are not adsorbed on microparticles. As a result, a better separability of the particles contained after drilling or cutting is achieved if necessary.
  • the preferably used aggregated nanoparticles, which form the microparticles of the second material are preferably composed of nanoparticles having a primary particle size between 1 nm and 99 nm.
  • the term "Agg regat" describes firmly interconnected primary particles, which can not be broken by the use of known methods, such as ultrasound.
  • FIG. 1 shows the schematic representation of a back wall damage during laser drilling
  • FIG. 2 shows the transmitted laser power as a function of time during the execution of a method according to a first exemplary embodiment of the present invention
  • FIG. 3 shows the transmitted laser power as a function of time for different fluids used
  • FIG. 4 shows the transmitted laser power as a function of time for different test liquids
  • Figure 5 the schematic representation of different particles in different liquids.
  • FIG. 1 shows a workpiece 2, inside which a cavity 4 is located.
  • a through hole 6 is to be drilled, for which purpose a front side 8 of the workpiece 2 is irradiated with laser radiation 10.
  • the through-hole 6 is already opened, so that the laser radiation 10 penetrates into the workpiece 2.
  • the laser radiation 10 strikes a back space material 12 in the rear space and leads here to damage 14. This is to be avoided with the method according to the present invention.
  • FIG. 2 shows an irradiation time in seconds on the x-axis. It is the duration that the liquid in which the particles are contained is irradiated with the laser's electro-magnetic radiation.
  • the transmitted power is plotted in mW.
  • a picosecond laser with a wavelength of 1030 nm, a repetition rate of 200 kHz and a pulse duration of 7 ps was used.
  • the beam of the laser has a diameter of 3mm, the maximum power of the laser is 50W.
  • the diagrams shown were produced at a laser power of 35%, ie an irradiated power of 17.5W. The laser beam went through focused
  • the illustration shown in FIG. 2 shows the transmitted laser power as a function of the irradiation duration.
  • the liquid used was water.
  • the first material of the nanoparticles was copper selenide, the second material titanium dioxide.
  • Liquid can not move in the test cuvette, it is therefore a static experimental setup. Therefore, the liquid, so the water begins to evaporate in this temporal range, whereby the back space protection is greatly weakened and therefore the transmitted laser power increases sharply.
  • colloids of the nanoparticles of the first material are mixed with water.
  • these have an average particle size of about 10 nm.
  • aggregates which are composed of titanium dioxide nanoparticles and have an average aggregate size of 0.3 pm used.
  • This second part liquid is added to the first part liquid, which contains the copper selenide particles contained in water, and shaken.
  • adsorption of the copper selenide nanoparticles on the surface of the molecule occurs without further ado Titanium dioxide. After adsorption, preferably no free nanoparticles are found in the solution. The adsorption is advantageously 100%.
  • FIG. 3 likewise shows the transmitted laser power on the y-axis in mW as a function of the irradiation time in seconds, in the case of irradiation with a picosecond laser with a wavelength of 1030 nm.
  • the particles which have been used are gold nanoparticles which have been used Microparticles are adsorbed from titanium dioxide.
  • a solid line shows the result of a first test liquid in which the liquid is water.
  • the dashed line represents a second test liquid in which the liquid is oil.
  • FIG. 4 again shows the transmitted laser power in mW as a function of the irradiation time in seconds, in this case irradiated with a picosecond laser having a wavelength of 1030 nm.
  • the result of a test liquid which does not contain any nanoparticles of the first material is shown by a solid line but includes only microparticles that are aggregated nanoparticles of titanium dioxide. Not shown is the result of exclusively gold nanoparticles in water with an average particle size of 10 nm and a concentration of 4 mg / ml. With this liquid, the transmitted laser power is above one watt, so that no effective backspace protection is achieved.
  • a dashed line shows the result for a test liquid containing gold nanoparticles in addition to these microparticles.
  • the test fluid was, however, added with a relatively large amount of sodium citrate, so that adsorption of the gold nanoparticles on the surface of the titanium dioxide was prevented. Only with the dotted line, the result for a liq fluid is shown, which can be used in a method according to the invention. It contains 50mg / ml particles consisting of 1.5 mg / ml gold nanoparticles with an average size of 10 nm, which are arranged on 48.5 mg / ml microparticles with an average particle size of 0.3 ⁇ m from aggregated titanium dioxide nanoparticles ,
  • FIG. 5 schematically shows different particle configurations.
  • three microparticles 16 are shown, each of which is aggregated from nanoparticles 18 of a second material.
  • additional nanoparticles 20 of a first material have been added to this microparticle 16, but they are arranged side by side in isolation.
  • the right-hand illustration schematically shows a liquid which can be used in a method according to an embodiment of the present invention.
  • the nanoparticles 20 of the first material are absorbed on the microparticles 16 of nanoparticles 18 of the second material.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Powder Metallurgy (AREA)

Abstract

L'invention concerne un procédé pour le perçage ou le découpage par laser d'une pièce (2), un rayonnement électromagnétique (10) émis par un laser rencontrant la pièce (2) et un liquide, qui contient des particules, se trouvant sur le côté opposé au laser de la pièce (2), de telle sorte que le rayonnement électromagnétique (10) émis par le laser rencontre les particules lorsque le rayonnement électromagnétique (10) a traversé la pièce (2), les particules contenant des nanoparticules d'un premier matériau qui sont adsorbées sur des microparticules et les microparticules étant des nanoparticules agglomérées d'un deuxième matériau.
PCT/EP2018/070279 2017-07-26 2018-07-26 Procédé pour le perçage ou le découpage par laser d'une pièce à l'aide d'un liquide de protection WO2019020741A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP18752102.6A EP3658326A1 (fr) 2017-07-26 2018-07-26 Procédé pour le perçage ou le découpage par laser d'une pièce à l'aide d'un liquide de protection

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102017116943.1A DE102017116943B4 (de) 2017-07-26 2017-07-26 Verfahren zum Laserbohren oder Laserschneiden eines Werkstückes
DE102017116943.1 2017-07-26

Publications (2)

Publication Number Publication Date
WO2019020741A1 WO2019020741A1 (fr) 2019-01-31
WO2019020741A9 true WO2019020741A9 (fr) 2019-06-27

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EP (1) EP3658326A1 (fr)
DE (1) DE102017116943B4 (fr)
WO (1) WO2019020741A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102020201530A1 (de) * 2020-02-07 2021-08-12 Robert Bosch Gesellschaft mit beschränkter Haftung Laserbohren oder Laserschneiden mit verbessertem Rückraumschutz

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5866898A (en) 1996-07-12 1999-02-02 The Board Of Trustees Of The Leland Stanford Junior University Time domain multiplexed amplified sensor array with improved signal to noise ratios
US6303901B1 (en) 1997-05-20 2001-10-16 The Regents Of The University Of California Method to reduce damage to backing plate
WO2000069594A1 (fr) 1999-05-18 2000-11-23 United States Enrichment Corporation Usinage au laser de pieces sur fond liquide et appareil a cet effet
US20070175872A1 (en) 2006-01-27 2007-08-02 Rhoades Lawrence J Laser back wall protection by particulate shading
JP5168445B2 (ja) * 2007-01-11 2013-03-21 住友金属鉱山株式会社 接合体およびその製造方法
DE102010063342A1 (de) * 2010-12-17 2012-06-21 Laser Zentrum Hannover E.V. Verfahren zur Herstellung von mikro-nanokombinierten Wirksystemen
DE102013212665B4 (de) 2013-06-28 2015-06-25 Laser Zentrum Hannover E.V. Verfahren zum Laserbohren oder Laserschneiden eines Werkstücks
DE102013218196A1 (de) * 2013-09-11 2015-03-12 Robert Bosch Gmbh Verfahren zum Laserbohren eines Bauteils
DE102015209261A1 (de) * 2015-05-21 2016-11-24 Robert Bosch Gmbh Verfahren zum Laserbohren oder Laserschneiden eines Werkstücks und System zum Laserbohren oder Laserschneiden

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Publication number Publication date
EP3658326A1 (fr) 2020-06-03
DE102017116943B4 (de) 2019-04-11
DE102017116943A1 (de) 2019-01-31
WO2019020741A1 (fr) 2019-01-31

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