WO2019000295A1 - 芯片拾取装置 - Google Patents
芯片拾取装置 Download PDFInfo
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- WO2019000295A1 WO2019000295A1 PCT/CN2017/090693 CN2017090693W WO2019000295A1 WO 2019000295 A1 WO2019000295 A1 WO 2019000295A1 CN 2017090693 W CN2017090693 W CN 2017090693W WO 2019000295 A1 WO2019000295 A1 WO 2019000295A1
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- chip
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- This application relates to the field of chip testing and, more particularly, to a chip picking device.
- the chip After the chip is tested, it needs to be removed from the test stage. Generally, the operator takes the finger cot and removes the chip. However, for a relatively thin chip, the chip and the test stage are closely attached. Direct chip retrieval is inefficient, and due to the fragile chip, the chip removal method may cause chip damage.
- the embodiment of the present application provides a chip picking device, which can improve the efficiency of taking a film.
- a chip picking apparatus comprising: a test stage provided with a through hole, the through hole being located below a placement position of the chip on the test stage; and a control device including a driving device and a switch And an air outlet, the switch is for controlling opening and closing of the air outlet, the air outlet is located below the through hole; and the control device is configured to remove the chip from the test carrier And compressing the gas by the driving device to open the switch, so that gas is ejected from the air outlet, and the gas ejected from the air outlet is blown from the lower side of the through hole to the chip. The chip is lifted from the upper surface of the test stage.
- the control device can control the switch for opening the air outlet by the driving device when the picking operation needs to be performed, so that the gas is ejected from the air outlet and ejected from the air outlet.
- the gas is blown toward the chip through the through hole on the test stage, so that the chip is lifted from the upper surface of the test stage, thereby facilitating the difficulty of picking up the chip and improving the picking efficiency.
- control device is further configured to: receive a control signal sent by the loading and unloading control system, where the control signal is that the loading and unloading control system is Transmitted when the chip is tested; when the control signal is received Next, it is determined that the chip needs to be removed from the test stage.
- the loading and unloading control system can send a control signal to the control device after the chip test is completed, instructing the control device to perform a subsequent taking operation.
- the control device receives the control signal, it is determined that the film taking operation needs to be performed, and then the switch for controlling the opening of the air outlet is controlled, and the gas is discharged from the air outlet to blow the gas discharged from the air outlet through the through hole.
- the chip thereby realizing the separation of the chip and the test stage, so that the surface of the chip forms a certain angle with the upper surface of the test stage, which is advantageous for performing the subsequent taking operation.
- control device is specifically configured to: control a pressure of a gas ejected from the air outlet to cause the chip to be from the test stage
- the lifting angle ⁇ of the surface satisfies the following condition: ⁇ ⁇ ⁇ ⁇ 45, where ⁇ is an angle threshold.
- the tilt angle ⁇ needs to be larger than a certain angle threshold, which is beneficial to chip picking, and ⁇ 45, which is beneficial to avoid the chip tilt angle. Large, causing the problem of flipping.
- control device is further configured to: when the chip is taken from the test carrier, control the driving device to close the switch .
- the drive device is a cylinder and the switch is a gas valve switch.
- a chip picking device comprising: a test stage provided with a through hole, the through hole having a built-in slider, the slider being located below a placement position of the chip on the test stage; a control device for controlling the slider to move upward when the chip needs to be removed from the test stage such that an upper end of the slider is higher than an upper surface of the test stage, so that The chip is lifted from the upper surface of the test stage.
- the control device can control the slider to move upward to be higher than the upper surface of the test stage by the driving device when the sheet taking operation needs to be performed, thereby causing the chip to pass the test stage
- the upper surface is tilted up, so it is beneficial to reduce the difficulty of chip picking and improve the efficiency of taking the film.
- control device is further configured to: when the film is taken from the test stage, control the slider to move downward The upper end of the slider is not higher than the upper surface of the test stage.
- the slider is located at Below the edge of the chip.
- control device is specifically configured to: control an upper end of the slider to be higher than a height of an upper surface of the test carrier, so that the chip is The lifting angle ⁇ of the upper surface of the test stage satisfies the following condition: ⁇ ⁇ ⁇ ⁇ 45, where ⁇ is an angle threshold.
- control device satisfies the following condition by controlling the tilt angle ⁇ of the chip from the upper surface of the test stage: ⁇ ⁇ ⁇ ⁇ 45, which can balance the difficulty of picking up the chip and the flipping of the chip.
- the control device includes a switch and a driving device, and the driving device is connected to the slider; the control device is specifically configured to: With the chip removed from the test stage, the switch is opened, and the slider is controlled to move upward by the driving device such that an upper end of the slider is higher than an upper surface of the test stage; When the film is taken from the test stage, the switch is turned off, and the slider is controlled to move downward by the driving device so that the upper end of the slider is not higher than the upper surface of the test stage .
- the chip picking device of the embodiment of the present application has a through hole disposed under the placement position of the chip on the test stage, and when the chip needs to be removed from the test carrier, the gas is sprayed through the through hole to the chip. Or controlling the upward movement of the slider in the through hole, so that the chip is lifted from the upper surface of the test stage, thereby facilitating the pickup of the chip, thereby improving the efficiency of taking the film.
- FIG. 1 is a schematic block diagram of a chip pick-up device in accordance with an embodiment of the present application.
- FIG. 2 is a schematic flow chart of a chip picking process.
- FIG. 3 is a schematic block diagram of a chip pickup device according to another embodiment of the present application.
- FIG. 4 is a schematic flow chart of a chip picking process.
- the chip in the embodiment of the present application may be a strip chip, a circular chip, or the like.
- the embodiment of the present application does not specifically limit this.
- the following is only a strip chip as an example to introduce the chip picking of the embodiment of the present application.
- the device should not be construed as limiting the embodiments of the present application.
- the chip pick-up device 100 includes:
- the test stage 110 is provided with a through hole 111, which is located below the placement position of the chip on the test stage;
- the control device 120 includes a driving device 121 and a switch 122 for controlling opening and closing of the air outlet 123, and the air outlet 123 is located below the through hole 111;
- the control device 120 is configured to, when the chip needs to be removed from the test carrier, open the switch by compressing gas through the driving device, so that gas is ejected from the air outlet, and Gas ejected from the air outlet is blown toward the chip through the lower side of the through hole to lift the chip from the upper surface of the test stage.
- the through hole 111 may be a straight hole, or may be a slant hole, or a hollow structure of other shapes, and FIG. 1 only takes the through hole 111 as a straight hole as an example, instead of
- the embodiment of the present application should be arbitrarily limited as long as the test stage 110 has a hollow structure, and it is possible to blow a gas from the hollow structure to the chip.
- the embodiments of the present application are not specifically limited to the number, size, and shape of the through holes, and the number of through holes on the test stage may be one or more, and the positions of the through holes may be It can also be set according to the actual situation.
- four through holes can be set on the test stage, corresponding to the four corners of the strip chip, or two through holes can be set on the test stage, respectively corresponding to the strip chips.
- the two sides which can be adjacent or parallel.
- the size and number of the through holes 111 shown in FIG. 1 are merely examples.
- the through holes 111 may be circular holes, square holes, or other shapes of through holes, etc., and the size of the through holes 111 is less than The size of the chip 130 is sufficient.
- the control device 120 blows gas to the chip 130 through the through hole 111, the chip 130 is lifted from the upper surface of the test stage 110, and therefore, the chip 130 is placed on the test stage 110.
- the position needs to partially overlap or completely overlap with the position of the through hole 111, that is, the through hole 111 may be completely below the placement position of the chip 130, or the through hole 111 may partially expose the test stage.
- the upper surface of 110, or the chip 130 can completely cover the position of the through hole 111 when the chip 130 is placed on the test stage, The position of the through hole 111 may be partially covered.
- the chip 130 when the chip 130 is placed on the test stage 110 and the gas is blown into the chip 130 through the through hole 111, at least a part of the gas can reach the surface of the chip 130, so that the chip 130 can be taken from the test stage 110.
- the surface is blown, that is, the chip 130 and the upper surface of the test stage 110 can be separated.
- the operator can perform the picking up of the chip, or the picking up of the chip by the robot.
- the embodiment of the present application does not limit the subsequent picking mode. Because the chip is picked up on the test stage when the chip is picked up, that is, the surface of the chip and the surface of the test stage have a certain angle, so that the difficulty of taking the film can be reduced, and the efficiency of taking the film can be improved.
- the scenario in which the chip needs to be removed from the test carrier includes, but is not limited to, a scenario in which the chip is tested, and other scenarios in which the chip needs to be removed from the test carrier.
- the chip pick-up device is also suitable.
- the control device 120 may employ a prior art cylinder control valve, that is, the drive device 121 may be a cylinder device, and the switch 122 may be a gas valve switch.
- the control device 120 can control the cylinder to compress the gas and open the gas valve switch, thereby opening the air outlet on the control device, so that the gas is ejected from the air outlet, and the air outlet of the control device is aligned. Below the hole, such that the gas ejected from the gas outlet is blown toward the surface of the chip, so that the chip can be lifted from the upper surface of the test stage, that is, the chip and the gas can be sprayed into the chip. Test the separation of the stage.
- the lifting of the chip from the upper surface of the test stage may include the chip being lifted or completely tilted from the upper surface portion of the test stage, for example, the chip A corner is lifted from the upper surface of the test stage, or the three sides of the chip are lifted from the upper surface of the test stage, etc., and the embodiment of the present application does not specifically limit the chip from the test load.
- control device may control the driving device to close the switch when the chip is not required to be taken off, that is, close the air outlet of the control device, and stop blowing the gas under the through hole.
- the control device can pass The pressure of the ejected gas is controlled to control the tilt angle of the chip from the upper surface of the test stage.
- the tilting angle ⁇ of the chip from the upper surface of the test stage may satisfy the following condition: ⁇ 45 degrees, wherein ⁇ is an angle threshold, and ⁇ may be an angle value greater than zero.
- ⁇ is an angle threshold
- ⁇ may be an angle value greater than zero.
- the tilt angle ⁇ needs to be larger than a certain angle threshold, which is beneficial to the chip picking, and ⁇ 45 degrees, which is beneficial to avoid the chip tilt angle. Large, causing the problem of flipping.
- control device 120 is further configured to:
- the loading and unloading control system can send a control signal to the control device to instruct the control device to perform a subsequent chip taking operation when the chip test is completed.
- the control device receives the control signal, it is determined that the film taking operation needs to be performed, and then the switch for controlling the opening of the air outlet is controlled, and the gas is discharged from the air outlet to blow the gas discharged from the air outlet through the through hole.
- the chip thereby realizing the separation of the chip and the test stage, so that the surface of the chip forms a certain angle with the upper surface of the test stage, which is advantageous for performing the subsequent taking operation.
- the loading and unloading control system 140 receives the test completion signal, where the test completion signal is used to indicate that the chip test is completed, and a subsequent chip taking operation needs to be performed.
- the loading and unloading control system 140 sends a control signal to the control device 120 for instructing the control device 120 to perform a subsequent taking operation.
- the control device 120 compresses the gas by the driving device 121, opens the switch 122 of the air outlet 123, opens the air outlet 123, and injects gas from the air outlet 123 from the outlet.
- the gas ejected from the port 123 is blown from the lower side of the through hole 111 toward the surface of the chip 130, so that the chip 130 is lifted from the upper surface of the test stage 110, that is, the upper surface of the chip 130 and the test stage 110 form a certain angle.
- the control device can control the switch for opening the air outlet by the driving device when the picking operation needs to be performed, so that the gas is ejected from the air outlet and ejected from the air outlet.
- the gas is blown toward the chip through the through hole on the test stage, so that the chip is lifted from the upper surface of the test stage, thereby facilitating the difficulty of picking up the chip and improving the picking efficiency.
- the chip pick-up device 300 includes:
- the test stage 310 is provided with a through hole 311, and the through hole has a built-in slider 312, and the slider 312 is located below the placement position of the chip 330 on the test stage;
- control device 320 for controlling the slider 312 to move upward when the chip needs to be removed from the test carrier such that an upper end of the slider is higher than an upper surface of the test carrier, so that The chip is lifted from the upper surface of the test stage 310.
- test stage 310 in the embodiment of the present application shown in FIG. 3, and the height or thickness of the chip 330, and the distance between the control device 320 and the test stage 310 are merely exemplary descriptions, and should not be dealt with. This application constitutes any limitation.
- the through hole 311 may be a straight hole or may be a slant hole.
- FIG. 3 only uses the through hole 311 as an oblique hole as an example, and should not constitute any embodiment of the present application. It is defined that as long as the test stage 310 has a hollow structure, a slider can be provided in the hollow structure, and the slider can be protruded from the upper surface of the test stage by controlling the movement of the slider.
- the embodiments of the present application are not specifically limited to the number, size, and shape of the through holes, and the number of through holes on the test stage may be one or more, and the positions of the through holes may be It can also be set according to the actual situation.
- four through holes can be set on the test stage, corresponding to the four corners of the strip chip, or two through holes can be set on the test stage, respectively corresponding to the strip chips.
- the two sides which can be adjacent or parallel.
- the size and number of the through holes 311 shown in FIG. 3 are merely examples.
- the through holes 311 may be circular holes, square holes, or other shapes of through holes, etc., and the size of the through holes 311 is smaller than The size of the chip 330 is sufficient.
- the number, shape, and size of the sliders 312 of the embodiment of the present application are merely examples and are not limited. Since the number of through holes may be one or more, correspondingly, the number of the sliders may also be one or For example, four through holes may be disposed on the test stage, respectively corresponding to the four corners of the strip chip, and one of the four through holes may be respectively provided with a slider, or may also be in the test stage Two through holes are disposed on the two sides, corresponding to two sides of the strip chip, and a slider or the like is respectively disposed in the two through holes.
- the shape of the slider 312 may be an elongated shape, a triangle shape, a spherical shape, or the like. This embodiment of the present application is not particularly limited as long as the upper end of the slider 312 can lift the chip from the upper surface of the test stage. Just fine.
- the slider may be located below the edge position of the chip.
- the position of the slider can be set below the edge position of the chip.
- the position of the slider from the upper surface of the test stage corresponds to the edge position of the chip, so that the slider moves upward.
- the position in contact with the slider is the edge position of the chip. Since the edge position of the chip belongs to the frame structure of the chip, that is, it does not belong to the effective position of the chip, it is beneficial to avoid the chip when the slider is jacked up. Damage.
- control device 320 is further configured to:
- the slider is controlled to move downward so that the upper end of the slider is not higher than the upper surface of the test stage.
- control device 320 can control the slider 312 not to protrude from the upper surface of the test stage, so that the presence of the slider 312 can be prevented from affecting other operations performed on the test stage 310.
- control device 320 is specifically configured to:
- control device 320 can control the height of the upper surface of the test stage by controlling the slider to achieve the purpose of controlling the tilt angle of the chip on the upper surface of the test stage, for example, if the tilt angle of the chip is desired.
- the slider can be controlled to have a higher height of the upper surface of the test stage, or if the tilt angle to the chip is small, the slider can be controlled to have a lower height of the upper surface of the test stage.
- control device satisfies the following condition by controlling the tilt angle ⁇ of the chip from the upper surface of the test stage: ⁇ ⁇ ⁇ ⁇ 45, which can balance the pickup difficulty of the chip and the flipping of the chip. problem.
- control device 320 includes a switch 321 and a driving device 322, and the driving device 322 is connected to the slider 312;
- the control device 320 is specifically configured to:
- the switch In the case where it is necessary to remove the chip from the test stage, the switch is opened, and the slider is controlled to move upward by the driving device such that the upper end of the slider is higher than the upper side of the test stage a surface; in the case of taking a sheet from the test stage, closing the switch, and controlling the slider to move downward by the driving device such that an upper end of the slider is not higher than the test stage Upper surface.
- control device 120 is further configured to:
- control device 120 may be such that upon receiving a control signal from the loading and unloading control system, the control slider is moved upward such that the chip is lifted from the upper surface of the test stage.
- the loading and unloading control system 340 receives the test completion signal, where the test completion signal is used to indicate that the chip test is completed, and a subsequent chip taking operation needs to be performed.
- the loading and unloading control system 340 sends a control signal to the control device 320 for instructing the control device to perform a subsequent taking operation.
- the control device opens the switch 321, and controls the slider 312 to move upward by the driving device 322 such that the upper end of the slider 312 is higher than the test stage 310.
- the upper surface such that the chip 330 is lifted from the upper surface of the test stage 310, that is, the chip 330 and the upper surface of the test stage 310 form an angle.
- the control device can control the slider to move upward to be higher than the upper surface of the test stage by the driving device when the sheet taking operation needs to be performed, thereby causing the chip to pass the test stage
- the upper surface is tilted up, so it is beneficial to reduce the difficulty of chip picking and improve the efficiency of taking the film.
- the disclosed system, apparatus, and method may be implemented in other manners.
- the device embodiments described above are merely illustrative.
- the division of the unit is only a logical function division.
- there may be another division manner for example, multiple units or components may be combined or Can be integrated into another system, or some features can be ignored or not executed.
- the mutual coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection through some interface, device or unit, and may be in an electrical, mechanical or other form.
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Abstract
一种芯片拾取装置（100），能够提升取片效率，该芯片拾取装置（100）包括：测试载台（110），设置有通孔（111），所述通孔（111）位于芯片在所述测试载台（110）上的放置位置的下方；控制装置（120），包括驱动装置（121）和开关（122），所述开关用于控制出气口的开启和关闭，所述出气口（123）位于所述通孔（111）的下方；所述控制装置（120），用于在需要将芯片从所述测试载台（110）取下的情况下，通过所述驱动装置（121）压缩气体开启所述开关（122），以使气体从所述出气口（123）往外喷出，并将从所述出气口（123）喷出的气体通过所述通孔（111）的下方吹向所述芯片，以使所述芯片从所述测试载台（110）的上表面翘起。
Description
本申请涉及芯片测试领域，并且更具体地，涉及一种芯片拾取装置。
目前，随着半导体行业的发展，集成电路(Integrated Circuit，IC)芯片的厚度越做越薄，超薄芯片的出现，增加各个测试环节的操作难度。
例如，芯片测试完毕后，需要从测试载台上取下，一般由操作员带上指套，将芯片取下，但是，对于比较薄的芯片而言，由于芯片和测试载台贴合很紧密，直接取片效率低，并且由于芯片较脆弱，采用这种取片方式可能会导致芯片损伤。
因此，需要一种芯片拾取装置，能够解决上述问题。
发明内容
本申请实施例提供一种芯片拾取装置，能够提升取片效率。
第一方面，提供了一种芯片拾取装置，包括：测试载台，设置有通孔，所述通孔位于芯片在所述测试载台上的放置位置的下方；控制装置，包括驱动装置、开关和出气口，所述开关用于控制出气口的开启和关闭，所述出气口位于所述通孔的下方；所述控制装置，用于在需要将芯片从所述测试载台取下的情况下，通过所述驱动装置压缩气体开启所述开关，以使气体从所述出气口往外喷出，并将从所述出气口喷出的气体从所述通孔的下方吹向所述芯片，以使所述芯片从所述测试载台的上表面翘起。
因此，本申请实施例的芯片拾取装置，所述控制装置能够在需要执行取片操作时，通过驱动装置控制开启出气口的开关，以使气体从出气口往外喷出，从出气口喷出的气体通过测试载台上的通孔吹向所述芯片，从而使得芯片从所述测试载台的上表面翘起，因此，有利于降低芯片拾取的难度，提升取片效率。
结合第一方面，在第一方面的一种可能的实现方式中，所述控制装置还用于：接收上下料控制系统发送的控制信号，所述控制信号是所述上下料控制系统在所述芯片测试完毕的情况下发送的；在接收到所述控制信号的情况
下，确定需要将所述芯片从所述测试载台取下。
也就是说，上下料控制系统可以在芯片测试完毕的情况下，向控制装置发送控制信号，指示所述控制装置执行后续的取片操作。所述控制装置接收到所述控制信号时，确定需要执行取片操作，进而控制驱动装置开启出气口的开关，通过出气口往外喷出气体，将从出气口喷出的气体通过通孔吹向芯片，从而实现芯片和测试载台的分离，即使得芯片的表面与测试载台的上表面形成一定的夹角，有利于执行后续的取片操作。
结合第一方面，在第一方面的一种可能的实现方式中，所述控制装置具体用于：控制从所述出气口喷出的气体的压力使得所述芯片从所述测试载台的上表面的翘起角度α满足如下条件：β<α≤45，其中，β为角度阈值。
当α小于β时，可以认为角度过小，不利于芯片的拾取，因此，翘起角度α需要大于一定的角度阈值，有利于芯片的拾取，同时α≤45，有利于避免芯片翘起角度过大，导致翻转的问题。
结合第一方面，在第一方面的一种可能的实现方式中，所述控制装置还用于：在从所述测试载台上取片完毕的情况下，控制所述驱动装置关闭所述开关。
结合第一方面，在第一方面的一种可能的实现方式中，所述驱动装置为气缸，所述开关为气阀开关。
第二方面，提供了一种芯片拾取装置，包括：测试载台，设置有通孔，所述通孔内置滑块，所述滑块位于芯片在所述测试载台上的放置位置的下方；控制装置，用于需要将芯片从所述测试载台取下的情况下，控制所述滑块往上移动使得所述滑块的上端高于所述测试载台的上表面，以使所述芯片从所述测试载台的上表面翘起。
因此，本申请实施例的芯片拾取装置，所述控制装置能够在需要执行取片操作时，通过驱动装置控制滑块向上移动至高于测试载台的上表面，从而使得芯片从所述测试载台的上表面翘起，因此，有利于降低芯片拾取的难度，提升取片效率。
结合第二方面，在第二方面的一种可能的实现方式中，所述控制装置还用于：在从所述测试载台上取片完毕的情况下，控制所述滑块往下移动以使所述滑块的上端不高于所述测试载台的上表面。
结合第二方面，在第二方面的一种可能的实现方式中，所述滑块位于所
述芯片的边缘位置的下方。
结合第二方面，在第二方面的一种可能的实现方式中，所述控制装置具体用于：控制所述滑块的上端高出所述测试载台的上表面的高度使得所述芯片从所述测试载台的上表面的翘起角度α满足如下条件：β<α≤45，其中，β为角度阈值。
因此，所述控制装置通过控制所述芯片从所述测试载台的上表面的翘起角度α满足如下条件：β<α≤45，能够兼顾芯片的拾取难度和芯片的翻转的问题。
结合第二方面，在第二方面的一种可能的实现方式中，所述控制装置包括开关和驱动装置，所述驱动装置与所述滑块连接；所述控制装置具体用于：在需要将芯片从所述测试载台取下的情况下，打开所述开关，通过所述驱动装置控制所述滑块往上移动使得所述滑块的上端高于所述测试载台的上表面；在从所述测试载台上取片完毕的情况下，关闭所述开关，通过所述驱动装置控制所述滑块往下移动使得所述滑块的上端不高于所述测试载台的上表面。
基于上述技术方案，本申请实施例的芯片拾取装置，在测试载台上芯片的放置位置的下方设置通孔，在需要将芯片从测试载体取下的情况下，通过通孔向芯片喷吹气体，或者控制通孔中的滑块向上移动的方式，使芯片从测试载台的上表面翘起，从而有利于芯片的拾取，进而提升取片效率。
图1是根据本申请一实施例的芯片拾取装置的示意性框图。
图2是芯片拾取过程的示意性流程图。
图3是根据本申请另一实施例的芯片拾取装置的示意性框图。
图4是芯片拾取过程的示意性流程图。
下面结合附图，对本申请实施例进行描述。
需要说明的是，本申请实施例中的芯片可以为条状芯片，或圆形芯片等，本申请实施例对此不作特别限定，以下仅以条状芯片为例介绍本申请实施例的芯片拾取装置，而不应对本申请实施例构成任何限定。
图1是根据本申请一实施例的芯片拾取装置的剖视图，如图1所示，该芯片拾取装置100包括：
测试载台110，设置有通孔111，所述通孔位于芯片在所述测试载台上的放置位置的下方；
控制装置120，包括驱动装置121和开关122，所述开关用于控制出气口123的开启和关闭，所述出气口123位于所述通孔111的下方；
所述控制装置120，用于在需要将芯片从所述测试载台取下的情况下，通过所述驱动装置压缩气体开启所述开关，以使气体从所述出气口往外喷出，并将从所述出气口喷出的气体通过所述通孔的下方吹向所述芯片，以使所述芯片从所述测试载台的上表面翘起。
需要说明的是，图1所示的本申请实施例中的测试载台110，以及芯片130的高度或厚度，以及控制装置120和测试载台110的距离，控制装置120上的开关122的位置等仅为示例性说明，而不应对本申请构成任何限定。
可选地，在本申请实施例中，所述通孔111可以为直孔，或者也可以为斜孔，或者其他形状的中空结构，图1仅以通孔111为直孔作为示例，而不应对本申请实施例构成任何限定，只要所述测试载台110具有中空结构，能够从所述中空结构向芯片喷吹气体即可。
应理解，本申请实施例对于所述通孔的数量、尺寸和形状等特征并不特定限定，所述测试载台上的通孔的数量可以为一个，也可以为多个，通孔的位置也可以根据实际情况设置，例如，可以在测试载台上设置四个通孔，分别对应条状芯片的四个角，或者也可以在测试载台上设置两个通孔，分别对应条状芯片的两个边，这两个边可以为相邻边，也可以为平行边。图1所示的通孔111的尺寸和数量等仅为示例，例如，所述通孔111可以为圆孔，方孔，或其他形状的通孔等，所述通孔111的尺寸只要小于所述芯片130的尺寸即可。
需要说明的是，由于所述控制装置120是通过通孔111向芯片130喷吹气体，从而使得芯片130从测试载台110的上表面翘起的，因此，芯片130在测试载台110的放置位置需要与所述通孔111的位置部分重叠或全部重叠，即所述通孔111可以完全位于所述芯片130的放置位置的下方，或者所述通孔111也可以部分露出所述测试载台110的上表面，或者说，所述芯片130放置于测试载台上时，所述芯片130可以完全覆盖通孔111的位置，也
可以部分覆盖通孔111的位置。这样，当芯片130放置在测试载台110上，通过通孔111向芯片130喷吹气体时，至少有一部分气体能够达到芯片130的表面，从而可以将芯片130从所述测试载台110的上表面吹起，即能够使得芯片130和测试载台110的上表面分离。后续，操作人员可以进行芯片的拾取，或者也可以通过机械手进行芯片的拾取等，本申请实施例不限定后续的拾取方式。由于，进行芯片拾取时，芯片在测试载台上是翘起状态，即芯片表面和测试载台的表面是具有一定的角度的，因此，能够降低取片难度，提升取片效率。
应理解，在本申请实施例中，需要将芯片从测试载台上取下的场景包括但不限于芯片测试完毕的场景，其他需要将芯片从测试载台取下的场景，本申请实施例的芯片拾取装置同样适用。
作为示例而非限定，所述控制装置120可以采用现有技术中的气缸控制气阀的装置，也就是说，所述驱动装置121可以为气缸装置，所述开关122可以为气阀开关。在需要取片时，所述控制装置120可以通过控制气缸压缩气体，开启气阀开关，从而打开控制装置上的出气口，使得气体从出气口往外喷出，将控制装置的出气口对准通孔的下方，这样，从所述出气口喷出的气体吹向芯片的表面，从而能够使得芯片从所述测试载台的上表面翘起，即通过向芯片喷吹气体的方式能够实现芯片和测试载台的分离。
需要说明的是，在本申请实施例中，所述芯片从测试载台的上表面翘起可以包括所述芯片从测试载台的上表面部分翘起或者全部翘起，例如，所述芯片的一角从所述测试载台的上表面翘起，或者也可以是所述芯片的三条边从所述测试载台的上表面翘起等，本申请实施例并不特别限定芯片从所述测试载台的上表面翘起的状态。
可选地，在不需要取片时，所述控制装置可以控制驱动装置关闭开关，即关闭所述控制装置的出气口，停止向通孔的下方喷吹气体。
进一步地，如果芯片从测试载台的上表面的翘起角度过大，有可能引发芯片从所述测试载台的上表面发生翻转，从而导致芯片损伤的问题，因此，所述控制装置可以通过控制喷出的气体的压力，控制芯片从测试载台的上表面的翘起角度。
优选地，所述芯片从所述测试载台的上表面的翘起角度α可以满足如下条件：β<α≤45度，其中，β为角度阈值，β可以为大于零的角度值，当
α小于β时，可以认为角度过小，不利于芯片的拾取，因此，翘起角度α需要大于一定的角度阈值，有利于芯片的拾取，同时α≤45度，有利于避免芯片翘起角度过大，导致翻转的问题。
可选地，在一些实施例中，所述控制装置120还用于：
接收上下料控制系统140发送的控制信号，所述控制信号是所述上下料控制系统140在所述芯片测试完毕的情况下发送的；
在接收到所述控制信号的情况下，确定需要将所述芯片从所述测试载台取下。
也就是说，上下料控制系统可以在芯片测试完毕的情况下，向控制装置发送控制信号，用于指示所述控制装置执行后续的取片操作。所述控制装置接收到所述控制信号时，确定需要执行取片操作，进而控制驱动装置开启出气口的开关，通过出气口往外喷出气体，将从出气口喷出的气体通过通孔吹向芯片，从而实现芯片和测试载台的分离，即使得芯片的表面与测试载台的上表面形成一定的夹角，有利于执行后续的取片操作。
以下，结合图2，介绍从测试载台上拾取芯片的详细过程。
S21，芯片测试完成后，上下料控制系统140接收测试完成信号，所述测试完成信号用于指示芯片测试完毕，需要执行后续的取片操作。
S22，上下料控制系统140向控制装置120发送控制信号，用于指示所述控制装置120执行后续的取片操作。
S23，所述控制装置120接收到所述控制信号后，通过驱动装置121压缩气体，开启出气口123的开关122，打开出气口123，从所述出气口123往外喷吹气体，从所述出气口123喷出的气体从通孔111的下方吹向芯片130的表面，从而使得所述芯片130从测试载台110的上表面翘起，即芯片130和测试载台110的上表面形成一定的角度。
S24，操作人员或机械手将翘起的芯片从测试载台的上表面取走，完成取片操作。
因此，本申请实施例的芯片拾取装置，所述控制装置能够在需要执行取片操作时，通过驱动装置控制开启出气口的开关，以使气体从出气口往外喷出，从出气口喷出的气体通过测试载台上的通孔吹向所述芯片，从而使得芯片从所述测试载台的上表面翘起，因此，有利于降低芯片拾取的难度，提升取片效率。
图3是根据本申请另一实施例的芯片拾取装置的剖视图，如图3所示，该芯片拾取装置300包括：
测试载台310，设置有通孔311，所述通孔内置滑块312，所述滑块312位于芯片330在所述测试载台上的放置位置的下方；
控制装置320，用于需要将芯片从所述测试载台取下的情况下，控制所述滑块312往上移动使得所述滑块的上端高于所述测试载台的上表面，以使所述芯片从所述测试载台310的上表面翘起。
需要说明的是，图3所示的本申请实施例中的测试载台310，以及芯片330的高度或厚度，以及控制装置320和测试载台310的距离等仅为示例性说明，而不应对本申请构成任何限定。
可选地，在本申请实施例中，所述通孔311可以为直孔，或者也可以为斜孔，图3仅以通孔311为斜孔作为示例，而不应对本申请实施例构成任何限定，只要所述测试载台310具有中空结构，在所述中空结构中能够设置滑块，通过控制滑块的移动能够使得滑块凸出所述测试载台的上表面即可。
应理解，本申请实施例对于所述通孔的数量、尺寸和形状等特征并不特定限定，所述测试载台上的通孔的数量可以为一个，也可以为多个，通孔的位置也可以根据实际情况设置，例如，可以在测试载台上设置四个通孔，分别对应条状芯片的四个角，或者也可以在测试载台上设置两个通孔，分别对应条状芯片的两个边，这两个边可以为相邻边，也可以为平行边。图3所示的通孔311的尺寸和数量等仅为示例，例如，所述通孔311可以为圆孔，方孔，或其他形状的通孔等，所述通孔311的尺寸只要小于所述芯片330的尺寸即可。
需要说明的是，本申请实施例的滑块312的数量、形状和尺寸仅为示例而非限定，由于通孔的数量可以为一个或多个，对应地，滑块的数量也可以为一个或多个，例如，可以在测试载台上设置四个通孔，分别对应条状芯片的四个角，在所述四个通孔中，可以分别设置一个滑块，或者也可以在测试载台上设置两个通孔，分别对应条状芯片的两个边，在所述两个通孔中，分别设置一个滑块等。所述滑块312的形状可以为长条形，三角形或球形等，本申请实施例对此不作特别限定，只要所述滑块312的上端能够将芯片从所述测试载台的上表面顶起即可。
进一步地，所述滑块可以位于所述芯片的边缘位置的下方。
也就是说，可以将滑块的位置设置在芯片的边缘位置的下方，换句话说，滑块的位置从测试载台的上表面的伸出位置对应芯片的边缘位置，这样，滑块向上移动，顶起芯片时，跟滑块接触的位置为芯片的边缘位置，由于芯片的边缘位置属于芯片的框架结构，即不属于芯片的有效位置，因此，有利于避免滑块顶起芯片时对芯片的损伤。
可选地，在一些实施例中，所述控制装置320还用于：
在从所述测试载台上取片完毕的情况下，控制所述滑块往下移动以使所述滑块的上端不高于所述测试载台的上表面。
即不进行取片时，所述控制装置320可以控制滑块312不凸出所述测试载台的上表面，从而能够避免所述滑块312的存在影响在测试载台310上执行其他操作。
进一步地，所述控制装置320具体用于：
控制所述滑块的上端高出所述测试载台的上表面的高度使得所述芯片从所述测试载台的上表面的翘起角度α满足如下条件：β<α≤45，其中，β为角度阈值。
即所述控制装置320可以通过控制滑块凸出所述测试载台的上表面的高度，达到控制芯片在测试载台的上表面的翘起角度的目的，例如，若想芯片的翘起角度大，可以控制滑块凸出测试载台的上表面的高度较高，或者若向芯片的翘起角度小，可以控制滑块凸出所述测试载台的上表面的高度较低。
跟前述实施例类似，所述控制装置通过控制所述芯片从所述测试载台的上表面的翘起角度α满足如下条件：β<α≤45，能够兼顾芯片的拾取难度和芯片的翻转的问题。
可选地，在一些实施例中，所述控制装置320包括开关321和驱动装置322，所述驱动装置322与所述滑块312连接；
所述控制装置320具体用于：
在需要将芯片从所述测试载台取下的情况下，打开所述开关，通过所述驱动装置控制所述滑块往上移动使得所述滑块的上端高于所述测试载台的上表面；在从所述测试载台上取片完毕的情况下，关闭所述开关，通过所述驱动装置控制所述滑块往下移动使得所述滑块的上端不高于所述测试载台的上表面。
可选地，作为一个实施例，所述控制装置120还用于：
接收上下料控制系统发送的控制信号，所述控制信号是所述上下料控制系统在所述芯片测试完毕的情况下发送的；
在接收到所述控制信号的情况下，确定需要将所述芯片从所述测试载台取下。
跟前述实施例类似，所述控制装置120可以是在接收到上下料控制系统的控制信号的情况下，控制滑块向上移动使得芯片从所述测试载台的上表面翘起的。
以下，结合图4，介绍从测试载台上拾取芯片的详细过程。
S41，芯片测试完成后，上下料控制系统340接收测试完成信号，所述测试完成信号用于指示芯片测试完毕，需要执行后续的取片操作。
S42，上下料控制系统340向控制装置320发送控制信号，用于指示所述控制装置执行后续的取片操作。
S43，所述控制装置320接收到所述控制信号后，所述控制装置打开开关321，通过驱动装置322控制滑块312向上移动使得所述滑块312的上端高于所述测试载台310的上表面，从而使得所述芯片330从测试载台310的上表面翘起，即芯片330和测试载台310的上表面形成一定的角度。
S44，操作人员或机械手将翘起的芯片从测试载台的上表面取走，完成取片操作。
因此，本申请实施例的芯片拾取装置，所述控制装置能够在需要执行取片操作时，通过驱动装置控制滑块向上移动至高于测试载台的上表面，从而使得芯片从所述测试载台的上表面翘起，因此，有利于降低芯片拾取的难度，提升取片效率。
本申请所提供的几个实施例中，应该理解到，所揭露的系统、装置和方法，可以通过其它的方式实现。例如，以上所描述的装置实施例仅仅是示意性的，例如，所述单元的划分，仅仅为一种逻辑功能划分，实际实现时可以有另外的划分方式，例如多个单元或组件可以结合或者可以集成到另一个系统，或一些特征可以忽略，或不执行。另一点，所显示或讨论的相互之间的耦合或直接耦合或通信连接可以是通过一些接口，装置或单元的间接耦合或通信连接，可以是电性，机械或其它的形式。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易
想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以所述权利要求的保护范围为准。
Claims (11)
- 一种芯片拾取装置，其特征在于，包括：测试载台，设置有通孔，所述通孔位于芯片在所述测试载台上的放置位置的下方；控制装置，包括驱动装置和开关，所述开关用于控制出气口的开启和关闭，所述出气口位于所述通孔的下方；所述控制装置，用于在需要将芯片从所述测试载台取下的情况下，通过所述驱动装置压缩气体开启所述开关，以使气体从所述出气口往外喷出，并将从所述出气口喷出的气体通过所述通孔的下方吹向所述芯片，以使所述芯片从所述测试载台的上表面翘起。
- 根据权利要求1所述的芯片拾取装置，其特征在于，所述控制装置还用于：接收上下料控制系统发送的控制信号，所述控制信号是所述上下料控制系统在所述芯片测试完毕的情况下发送的；在接收到所述控制信号的情况下，确定需要将所述芯片从所述测试载台取下。
- 根据权利要求1或2所述的芯片拾取装置，其特征在于，所述控制装置具体用于：控制从所述出气口喷出的气体的压力使得所述芯片从所述测试载台的上表面的翘起角度α满足如下条件：β<α≤45，其中，β为角度阈值。
- 根据权利要求1至3中任一项所述的芯片拾取装置，其特征在于，所述控制装置还用于：在从所述测试载台上取片完毕的情况下，控制所述驱动装置关闭所述开关。
- 根据权利要求1至4中任一项所述的芯片拾取装置，其特征在于，所述驱动装置为气缸，所述开关为气阀开关。
- 一种芯片拾取装置，其特征在于，包括：测试载台，设置有通孔，所述通孔内置滑块，所述滑块位于芯片在所述测试载台上的放置位置的下方；控制装置，用于需要将芯片从所述测试载台取下的情况下，控制所述滑块往上移动使得所述滑块的上端高于所述测试载台的上表面，以使所述芯片 从所述测试载台的上表面翘起。
- 根据权利要求6所述的芯片拾取装置，其特征在于，所述控制装置还用于：在从所述测试载台上取片完毕的情况下，控制所述滑块往下移动以使所述滑块的上端不高于所述测试载台的上表面。
- 根据权利要求6或7所述的芯片拾取装置，其特征在于，所述滑块位于所述芯片的边缘位置的下方。
- 根据权利要求6至8中任一项所述的芯片拾取装置，其特征在于，所述控制装置具体用于：控制所述滑块的上端高出所述测试载台的上表面的高度使得所述芯片从所述测试载台的上表面的翘起角度α满足如下条件：β<α≤45度，其中，β为角度阈值。
- 根据权利要求6至9中任一项所述的芯片拾取装置，其特征在于，所述控制装置包括开关和驱动装置，所述驱动装置与所述滑块连接；所述控制装置具体用于：在需要将芯片从所述测试载台取下的情况下，打开所述开关，通过所述驱动装置控制所述滑块往上移动使得所述滑块的上端高于所述测试载台的上表面；在从所述测试载台上取片完毕的情况下，关闭所述开关，通过所述驱动装置控制所述滑块往下移动使得所述滑块的上端不高于所述测试载台的上表面。
- 根据权利要求6至10中任一项所述的芯片拾取装置，其特征在于，所述控制装置还用于：接收上下料控制系统发送的控制信号，所述控制信号是所述上下料控制系统在所述芯片测试完毕的情况下发送的；在接收到所述控制信号的情况下，确定需要将所述芯片从所述测试载台取下。
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