WO2019000257A1 - 电路板与电路板拼板 - Google Patents

电路板与电路板拼板 Download PDF

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Publication number
WO2019000257A1
WO2019000257A1 PCT/CN2017/090467 CN2017090467W WO2019000257A1 WO 2019000257 A1 WO2019000257 A1 WO 2019000257A1 CN 2017090467 W CN2017090467 W CN 2017090467W WO 2019000257 A1 WO2019000257 A1 WO 2019000257A1
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WO
WIPO (PCT)
Prior art keywords
circuit
region
circuit board
conductive
wire
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PCT/CN2017/090467
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English (en)
French (fr)
Inventor
胡小冬
Original Assignee
深圳市柔宇科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 深圳市柔宇科技有限公司 filed Critical 深圳市柔宇科技有限公司
Priority to CN201780060305.3A priority Critical patent/CN109791176A/zh
Priority to PCT/CN2017/090467 priority patent/WO2019000257A1/zh
Publication of WO2019000257A1 publication Critical patent/WO2019000257A1/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits

Definitions

  • the present invention relates to the field of circuit board testing technology, and in particular, to a testing technology for a circuit board in a circuit board development and generation process.
  • circuit boards have been widely used in various fields of electronic devices, such as mobile phones, computers and other consumer electronics fields, refrigerators, air conditioners and other living appliances.
  • the circuit board carries a plurality of functional circuits and conductive traces connecting the functional circuits.
  • the circuit board needs to be tested for conductive traces and functional circuits with electronic components. Then it is necessary to solder the test circuit to the conductive traces on the board and the signal transmission ends of the functional circuits.
  • the conductive traces on the board are large and the settings are very dense.
  • the present invention provides a circuit board with high test reliability.
  • circuit board panel including the aforementioned circuit board is provided.
  • a circuit board comprising a first circuit region provided with a conductive line and at least one second circuit region, the first circuit region being connected to the second circuit region by a first fracture region, and the second circuit The region is separated from the first circuit region as the first fracture zone breaks.
  • the second circuit region includes at least one conductive end, the first fracture region includes at least one wire, and the conductive end is electrically connected to the conductive line in the first circuit region through the wire.
  • a circuit board assembly comprising at least two of the foregoing circuit boards, the two circuit boards being connected to each other along a first direction by a second fracture zone, the second fracture zone comprising a plurality of through holes, The through hole facilitates the fracture of the second fracture zone under the action of an external force.
  • the external test circuit passes through the conductive end disposed in the second circuit region,
  • the wires of a fracture zone are electrically connected to the functional circuit or the conductive circuit of the first circuit region, and are tested for the functional circuit or the conductive circuit.
  • the first fracture zone is broken by the external force, so that the second circuit zone and the first circuit zone are separated from each other, thereby completing the fabrication and testing of the first circuit zone. Since the test circuit is electrically connected to the first circuit region through the second circuit region, that is, the test circuit does not need to be directly disposed in the first circuit region, that is, the test circuit does not affect any wires or circuit settings in the first circuit. Improve test efficiency and reliability.
  • FIG. 1 is a schematic plan view showing the structure of a circuit board assembly according to an embodiment of the present invention.
  • FIG. 2 is a schematic plan view showing the structure of the first circuit board shown in FIG. 1.
  • FIG. 3 is a schematic enlarged view of two adjacent wires as shown in FIG. 2.
  • FIG. 1 is a schematic plan view of a circuit board assembly according to a first embodiment of the present invention.
  • the circuit panel assembly 10 includes two circuit boards which are spliced together, and the two circuit boards are respectively defined as a first circuit board P1 and a second circuit board P2, and the first circuit board P1 and the second circuit.
  • the boards P2 are spliced to each other.
  • a plane rectangular coordinate system composed of two mutually perpendicular first directions X and second directions Y is defined.
  • the first circuit board P1 and the second circuit board P2 are adjacently arranged along the second direction Y, and are spliced to each other in the first direction X.
  • the support frame is generally not provided with a conductive circuit or a circuit structure, and is separated from the circuit board after the components on the circuit board are completed.
  • the first circuit board P1 and the second circuit board P2 have the same structure and are centrally symmetric with each other, that is, the first circuit board P1 and the second circuit board P2 are rotated by 180°.
  • the first circuit board P1 may be connected to the second circuit board P2 in an axisymmetric manner, and is not limited thereto.
  • the first circuit board P1 includes a first circuit region 100 and a second circuit region 200 arranged along a first direction X.
  • the first circuit region 100 passes through the first and second circuit regions 200 and 200 along the second circuit region 200.
  • Direction Y is connected.
  • the second circuit board P2 and the first circuit board P1 further include a second fracture zone B2 extending along the first direction X, wherein the second fracture zone B2 includes a plurality of through holes, and the through holes facilitate the second fold
  • the splitting zone B2 is broken by an external force, thereby separating the first circuit board P1 and the second circuit board P2 from each other.
  • the second fracture zone B2 includes a plurality of first through holes H1 and a plurality of second through holes H2, wherein the first through holes H1 are circular, and the second through holes H2 are generally elongated and along The opposite ends of the first direction X are curved.
  • the second fracture zone B2 has a notch formed by the arcuate end points of the second through hole H2 at opposite ends of the first direction X.
  • FIG. 2 is a schematic diagram of the planar structure of the first circuit board P1 as shown in FIG.
  • the first circuit region 100 and the second circuit region 200 are arranged adjacent to each other in the first direction X, and are mutually mutually along the second direction Y through the first fracture region B1. connection.
  • the first circuit board P1 further includes a support region 300 and a third fracture region B3, wherein the support region 300 and the second circuit region 200 are juxtaposed in the first direction X, and pass through the third fracture region B3.
  • the first circuit region 100 is connected along the second direction.
  • the support region 300 and the second circuit region 200 are respectively located at opposite ends of the first circuit region 100 along the first direction X.
  • the functional circuit 101 can be a micro processing integrated circuit, a storage circuit, a signal transceiving circuit, or the like.
  • the conductive line 102 can be a wire that connects the functional circuit 101.
  • the second circuit region 200 includes a connection region 201 including a plurality of conductive ends 202 that are insulated from each other and disposed at a distance from the second direction Y.
  • the connection region 201 is used to receive circuit components or conductive wires (not shown) electrically connected to the conductive terminals 202.
  • circuit elements or circuits connected by conductive lines can be test circuits for functional testing of functional circuit 101 or conductive line 102.
  • the conductive end 202 is for electrically connecting to the external test circuit. Among them, electrical connection can be made by soldering or the like.
  • the second circuit region 200 further includes a registration hole 203 and a tool hole 204.
  • the alignment holes 203 are disposed adjacent to the tool holes 204 and are disposed at one end of the second circuit region 200 along the second direction Y.
  • the registration hole 203 is used to identify the position of the first circuit board P1.
  • the tool hole 204 is for connection with other fixed devices to be fixed for the first circuit board P1.
  • the first cleavage region B1 includes a plurality of wires 41 extending along the first direction X and spaced apart along the second direction Y.
  • the wires 41 are electrically connected to the plurality of conductive ends 202 in the connection region 201, respectively.
  • the function circuit 101 or the conductive line 102 in the first circuit area 100 that is, the wire 41 can be electrically connected to the conductive end 202 and the functional circuit 101, respectively, or the conductive end 202 and the conductive line 102 can be electrically connected.
  • the first fracture zone B1 has a first dimension L1 along the second direction, and the first circuit zone 100 and the second circuit zone 200 have a second dimension L2 along the first direction, the first dimension L1 being smaller than the second dimension L2 .
  • the first fracture zone B1 has at least one curved notch OP in the second direction Y.
  • the first fracture zone B1 has one of the arcs at opposite ends of the second direction Y. Notch OP.
  • the arcuate notch OP is used to facilitate breakage when the first fracture zone B1 receives an external force, thereby separating the second circuit zone 200 from the first circuit zone 100.
  • FIG. 3 is a schematic enlarged view of any two adjacent wires 41 as shown in FIG. 2 .
  • any two adjacent ones of the plurality of wires 41 are defined as a first wire 41a and a second wire 41b, respectively, and a spacing between the first wire 41a and the second wire 42b along the second direction Y is At a distance S1, the first wire 41a has a first width W1 in the second direction Y.
  • the second wire 41b has a second width W2 in the second direction Y, wherein the first distance S1 is greater than twice the minimum size of the first width W1 and the second width W2 to prevent the adjacent two wires 41 from being shorted And the width of the first fracture zone B1 can be made smaller.
  • the second width W2 is smaller than the first width W1, whereby the size of the first distance S1 is larger than twice the size of the second width W2.
  • the first distance S1 is greater than the largest of the first width W1 and the second width W2. 2 times, in this way, shorting between adjacent two wires 41 can be prevented.
  • the first circuit region 100 is adjacent to the first fracture region B1 and includes a clearance region 103.
  • the clearance region 103 includes only the extension wires of the plurality of wires 41, and is not provided with other conductive elements to avoid being the first When the fracture zone B1 is broken, the wire 41 is electrically connected to other conductive elements in the first circuit zone 100 to cause a short circuit.
  • the external test circuit can pass the electricity.
  • the plurality of conductive ends 201 of the second circuit region 200 are electrically connected to the functional circuit 101 or the conductive circuit 102 of the first circuit region 100.
  • the test circuit can implement data exchange with the functional circuit 101 or the conductive line 102 and test in parallel. When the test circuit is tested for the functional circuit 101 or the conductive line 102, the first fracture zone B1 is broken by an external force, thereby separating the second circuit region 200 from the first circuit region 100.
  • the second circuit region 200 Since the second circuit region 200 does not need to be provided with other circuit components, it has sufficient space to set the conductive terminals 202 and has a sufficiently large distance between the conductive terminals 202, thereby effectively preventing the adjacent conductive terminals 202 from being external.
  • the test circuit is short-circuited during soldering. Therefore, when the test circuit is electrically connected to the first circuit region 100 through the second circuit region 200, that is, the test circuit does not need to be disposed in the first circuit region 100 to be electrically connected to the functional circuit 101 or the conductive circuit 102, that is, the test circuit does not. It affects any wire or circuit settings in the first circuit 100, improving test efficiency and reliability.
  • the support region 300 is not provided with a conductive end and other conductive lines, and only a matching hole (not labeled) and a positioning hole (not labeled), and a third fold between the support region 300 and the first circuit region 100 are disposed.
  • the shape and structure of the split zone B3 may be the same as that of the first fracture zone B1, and each includes a plurality of first through holes H1 and second through holes H2.
  • the third fracture zone B3 has a notch formed by the arcuate end points of the second through hole H2 at opposite ends of the second direction Y.
  • the third fracture zone B3 can be easily along the second direction. Y breaks open, thereby separating the support region 300 from the first circuit region 100.
  • circuit board assembly 10 The fabrication and testing process of the circuit board assembly 10 and the first circuit board P1 will now be specifically described with reference to FIGS. 1 and 2.
  • the board panel 10 is formed from the original sheet material as shown in FIG. 1, for example, a structure in which the first circuit board P1 and the second circuit board P2 are connected to each other.
  • the first circuit board P1 is connected to the second circuit board P2
  • the second fracture zone B2 is connected along the first direction X.
  • Each of the circuit boards P1 is respectively disposed with a second circuit region 200 and a support region 300 at two ends of the first circuit region 100 along the first direction X.
  • the second circuit region 200 is provided with a conductive end for testing, and the support region 300 is not provided.
  • a conductive line or component is provided for supporting and fixing the board panel 10.
  • the first circuit region 100 is provided with a functional circuit 101 and a conductive line 102.
  • the conductive line 102 is electrically connected to the conductive end 202 of the second circuit region 200 through a wire passing through the first fracture region B1.
  • the external test circuit is soldered to the conductive end 202 of the second circuit region 200 such that the external test circuit is electrically conducted through the conductive terminal 202, the wire 41, and the functional circuit 101 and the conductive line 102.
  • the test circuit is activated to cause the test circuit to interact with the functional circuit 101 or the conductive line 102 for testing against the functional circuit 101 or the conductive line 102.
  • the third fracture zone B3 between the support zone 300 and the first circuit zone 100 is broken by the aforementioned manner, so that the support zone 300 and the first circuit zone 100 are separated from each other in the second direction Y.
  • the splitting of the support region 300 may be at any time, for example, before the first circuit board P1 is separated from the second P2, or after the first circuit board P1 and the second P2 are separated, or the first circuit 100 and the second circuit area are separated. 200 can be used before and after separation, and is not limited.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

一种电路板(P1,P2)以及包括所述电路板(P1,P2)的电路板拼板(10)。所述电路板(P1,P2)包括设置有导电线路(102)的第一电路区(100)与至少一个第二电路区(200)，所述第一电路区(100)通过第一折裂区(B1)与所述第二电路区(200)连接，且所述第二电路区(200)随着所述第一折裂区(B1)的断裂与所述第一电路区(100)分离。所述第二电路区(200)包括有至少一个导电端(202)，所述第一折裂区(B1)包括至少一条导线(41)，所述导电端(202)通过所述导线(41)与所述第一电路区(100)中的所述的导电线路(102)电性连接。所述电路板(P1,P2)中通过可分离的电路区域上设置导电端(202)，使得测试电路无需直接设置于包括有导电线路(102)的第一电路区(100)上，使得针对第一电路区(100)中导电线路(102)的测试效率与可靠性较高。

Description

电路板与电路板拼板 技术领域
本发明涉及电路板测试技术领域，尤其涉及一种在电路板研发、生成过程中的针对电路板的测试技术。
背景技术
目前电路板已经广泛地应用于多领域的电子装置中，例如手机、电脑等消费性电子领域、冰箱、空调等生活电器等。电路板上承载有多个功能性的电路与连接所述功能性电路的导电走线。通常，电路板在制作完导电走线后以及贴片安装完电子元件后，需要针对导电走线以及有电子元件构成的功能性电路进行测试。那么就需要将测试电路与电路板上的导电走线以及功能电路的信号传输端进行焊接。随着电路板集成度的快速增加，导致电路板上导电走线较多且设置非常密集。由此，当直接将测试电路直接与电路板上的导电走线进行焊接，导电走线之间经常出现短路，从而导致电路板上导电走线出现损坏，甚至与导电走线电性连接的功能电路以及整个电路板损坏。
发明内容
为解决前述技术问题，本发明提供一种测试可靠性较高的电路板。
进一步，提供一种包括前述电路板的电路板拼板。
一种电路板，包括设置有导电线路的第一电路区与至少一个第二电路区，所述第一电路区通过第一折裂区与所述第二电路区连接，且所述第二电路区随着所述第一折裂区的断裂与所述第一电路区分离。所述第二电路区包括有至少一个导电端，所述第一折裂区包括至少一条导线，所述导电端通过所述导线与所述第一电路区中的所述导电线路电性连接。
一种电路板拼板，包括至少两个前述电路板，所述两个电路板沿着第一方向通过第二折裂区相互连接，所述第二折裂区包括多个通孔，所述通孔便于所述第二折裂区在外力作用下的断裂。
相较于现有技术，外部的测试电路通过设置于第二电路区中的导电端、第 一折裂区的导线电性连接第一电路区的功能电路或者导电线路，并且针对功能电路或者导电线路进行测试。当测试完成后，第一折裂区在外力作用下断裂，从而使得第二电路区与第一电路区相互分离，从而完成了第一电路区的制作与测试。由于测试电路通过第二电路区与第一电路区电性连接，也就是说测试电路无需直接设置到第一电路区，也就是测试电路不会对第一电路中的任何导线或者电路设置产生影响，提高了测试效率与可靠性。
附图说明
为了更清楚地说明本发明实施例的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本发明一实施例中电路板拼板的平面结构示意图。
图2为如图1所示第一电路板的平面结构示意图。
图3为如图2所示相邻两条导线的放大结构示意图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有付出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
请参阅图1，其为本发明第一实施方式中电路板拼板的平面结构示意图。
如图1所示，电路平板拼板10包括两个相互拼接的电路板，所述两个电路板分别定义为第一电路板P1与第二电路板P2，第一电路板P1与第二电路板P2相互拼接。为了便于说明，本实施例中定义由两个相互垂直的第一方向X与第二方向Y构成的平面直角坐标系。其中，第一电路板P1与第二电路板P2沿着第二方向Y相邻排列，并在第一方向X上相互拼接。
需要说明的是，在电路板生产工艺中，为了提高电路板制程工艺的效率，通常将多个电路板拼在一起进行元件的制作，多个电路板固定在采用与电路板 相同的材料制成的支撑边框内。其中，支撑边框上一般并未设置有导电线路或者电路结构，并且在电路板上的元件制作完成后自电路板上切断分离。
请继续参阅图1，第一电路板P1与第二电路板P2结构完全相同且相互中心对称，也就是说第一电路板P1与第二电路板P2旋转180°重合。当然，在本发明其他实施例中，第一电路板P1也可以与第二电路板P2以轴对称的方式连接，并不以此为限。
其中，第一电路板P1包括沿着第一方向X排列的第一电路区100与第二电路区200，第一电路区100通过第一折裂区B1与第二电路区200沿着第二方向Y连接。当然，因为第二电路板P2与第一电路板P1结构相同，本处就不再赘述。第二电路板P2与第一电路板P1之间还包括沿着第一方向X延伸的第二折裂区B2，其中，第二折裂区B2包括多个通孔，通孔便于第二折裂区B2在外力作用下断裂，进而使得第一电路板P1与第二电路板P2相互分离。
其中，第二折裂区B2包括多个第一通孔H1与多个第二通孔H2，其中，第一通孔H1为圆形，第二通孔H2整体呈长条状，且沿着第一方向X的相对的两端为弧形。较佳地，第二折裂区B2沿着第一方向X的相对两端具有第二通孔H2的圆弧形端点构成的缺口。由此，通过第一通孔H1与第二通孔H2的设置，当接收到垂直于第二折裂区B2所在平面方向的外力时，第二折裂区B2能够较容易沿着第一方向X断裂开。
请进一步参阅图2，其为如1所示第一电路板P1的平面结构示意图。
可以理解，当第二折裂区B2在外力作用下断裂开后，第一电路板P1与第二电路板P2(图1)就相互分离开形成相互独立的电路板结构。
如图2所示，在第一电路板P1中，第一电路区100与第二电路区200在第一方向X相邻排列设置，并且通过第一折裂区B1沿着第二方向Y相互连接。本实施例中，第一电路板P1还包括支撑区300与第三折裂区B3，其中，支撑区300与第二电路区200在第一方向X并列设置，并且通过第三折裂区B3沿着第二方向与第一电路区100相连接。支撑区300与第二电路区200分别位于第一电路区100沿着第一方向X的相对两端。
具体地，第一电路区100中设置有多个功能电路101与导电线路102。所述功能电路101可以为微处理集成电路、存储电路、信号收发电路等。导电线路102可以为连接所述功能电路101的导线。
第二电路区200包括有连接区201，连接区201内包括多个相互绝缘且沿着第二方向Y间隔一定距离设置的导电端202。连接区201用于承接与导电端202电性连接的电路元件或者导电线(图未示)。当然，电路元件或者通过导电线连接的电路可以为测试电路，以用于针对功能电路101或者导电线路102进行功能性测试。导电端202用于与所述的外部测试电路电性连接。其中，可以通过焊接等方式进行电性连接。
第二电路区200还包括对位孔203与工具孔204。对位孔203与工具孔204相邻设置，且均设置于第二电路区200沿着第二方向Y的一端。对位孔203用于对第一电路板P1的位置进行标识。工具孔204用于与其他固定设备连接以针对所述第一电路板P1进行固定。
第一折裂区B1包括多条沿着第一方向X延伸并且沿着第二方向Y间隔一定距离排列设置的导线41，导线41分别电性连接所述连接区201内的多个导电端202以及第一电路区100内的功能电路101或者导电线路102，也即是说，导线41可以分别电性连接导电端202与功能电路101，也可以分别电性连接导电端202与导电线路102。
第一折裂区B1沿着第二方向具有第一尺寸L1，第一电路区100与第二电路区200沿着第一方向具有第二尺寸L2，所述第一尺寸L1小于第二尺寸L2。具体而言，第一折裂区B1在第二方向Y上具有至少一个弧形缺口OP，较佳地，第一折裂区B1在第二方向Y的相对两端分别具有一个所述弧形缺口OP。所述弧形缺口OP用于在第一折裂区B1收到外力作用时便于断裂，从而使得第二电路区200与第一电路区100分离开。
请一并参阅图2-3，图3为如图2所示任意相邻两条导线41的放大结构示意图。如图3所示，多条导线41中任意相邻两条分别定义为第一导线41a与第二导线41b，第一导线41a与第二导线42b之间沿着第二方向Y的间距为第一距离S1，第一导线41a在第二方向Y具有第一宽度W1。第二导线41b在第二方向Y具有第二宽度W2，其中，第一距离S1大于第一宽度W1与第二宽度W2二者中最小尺寸的两倍，以防止相邻两个导线41短接，且可让第一折裂区B1的宽度较小。例如，如图3所示，第二宽度W2小于第一宽度W1，由此，第一距离S1的尺寸大于第二宽度W2尺寸的两倍。较佳地，在另一实施方式中，第一距离S1大于第一宽度W1与第二宽度W2二者中最大尺寸的 2倍，如此，可防止相邻两导线41之间出现短接。
进一步，第一电路区100邻近第一折裂区B1包括与有净空区103，净空区103仅包括有所述多条导线41的延长线，而并非设置其他的导电元件，以避免当第一折裂区B1断裂时，导线41与第一电路区100内的其他其导电元件电性连接而出现短路现象。
请继续参阅图2，由于多个导电端201、多条导线41以及第一电路区100内的功能电路101或者导电线路102电性连接并且导通，由此，外部的测试电路则可通过电性连接设置于第二电路区200的多个导电端201而与第一电路区100的功能电路101或者导电线路102电性导通。测试电路即可实现与功能电路101或者导电线路102的数据交换并且并行测试。当测试电路针对功能电路101或者导电线路102的测试完成后，第一折裂区B1在外力作用下断裂，从而使得第二电路区200与第一电路区100相互分离。由于第二电路区200无需设置其他的电路元件，因此其具有足够的空间来设置导电端202，并且使得导电端202之间具有足够大的距离，因此能够有效防止相邻的导电端202在于外部的测试电路焊接时出现短路现象。故而测试电路通过第二电路区200与第一电路区100电性连接时，也就是说测试电路无需设置于第一电路区100与功能电路101或者导电线路102电性连接，也就是测试电路不会对第一电路100中的任何导线或者电路设置产生影响，提高了测试效率与可靠性。
对应地，支撑区300上未设置有导电端与其他导电线路，仅设置有对位孔(未标示)与定位孔(未标示)，支撑区300与第一电路区100之间的第三折裂区B3的形状与结构可以与第一折裂区B1相同，均包括有多个第一通孔H1与第二通孔H2。较佳地，第三折裂区B3沿着第二方向Y的相对两端具有第二通孔H2的圆弧形端点构成的缺口。由此，通过第一通孔H1与第二通孔H2的设置，当接收到垂直于第三折裂区B3所在平面方向的外力时，第三折裂区B3能够较容易沿着第二方向Y断裂开，从而使得支撑区300与第一电路区100相互分离。
现在结合图1与图2具体说明电路板拼板10与第一电路板P1的制作与测试过程。
首先，电路板拼板10从原始板材形成如图1所示的有例如第一电路板P1与第二电路板P2相互连接的结构。其中，第一电路板P1与第二电路板P2通 过第二折裂区B2沿着第一方向X连接。每个电路板P1在第一电路区100沿着第一方向X的两端分别设置第二电路区200以及支撑区300，第二电路区200上设置测试用的导电端，支撑区300上未设置有导电线路或者元件，仅用于支撑固定该电路板拼板10。并且第一电路区100上设置有功能性电路101与导电线路102，导电线路102通过穿过第一折裂区B1的导线与第二电路区200的导电端202电性连接。
其次，施加垂直于第一电路板P2与第二电路板P2所在平面方向的外力至第二折裂区B2，使得第二折裂区B2沿着第一方向X断裂，从而将第一电路板P2与第二电路板P2沿着第一方向X进行了分离。
再次，将外部的测试电路与第二电路区200的导电端202进行焊接，使得外部的测试电路通过导电端202、导线41与功能电路101以及导电线路102电性导通。启动测试电路工作，使得测试电路与功能电路101或者导电线路102进行数据交互，以针对功能电路101或者导电线路102进行测试。
最后，当测试电路完成针对功能电路101或者导电线路102的测试后，施加垂直于第一电路板P1所在平面方向的外力至第一折裂区B1，使得第一折裂区B1沿着第二方向Y断裂，从而将第二电路区200与第一电路区100沿着第二方向Y进行了分离。
同理，支撑区300与第一电路区100之间的第三折裂区B3通过前述的方式发生断裂，从而使得支撑区300与第一电路区100在第二方向Y相互分离。其中，支撑区300的分裂可以在任何时候，例如在第一电路板P1与第二P2分离前、或者在第一电路板P1与第二P2分离后、或者第一电路100与第二电路区200分离前后都可以，并不进行限定。
可以理解，以上所揭露的仅为本发明的较佳实施例而已，当然不能以此来限定本发明之权利范围，本领域普通技术人员可以理解实现上述实施例的全部或部分流程，并依本发明权利要求所作的等同变化，仍属于发明所涵盖的范围。

Claims (10)

  1. 一种电路板，包括设置有导电线路的第一电路区与至少一个第二电路区，所述第一电路区通过第一折裂区与所述第二电路区连接，且所述第二电路区随着所述第一折裂区的断裂与所述第一电路区分离，其特征在于，所述第二电路区包括有至少一个导电端，所述第一折裂区包括至少一条导线，所述导电端通过所述导线与所述第一电路区中的所述导电线路电性连接。
  2. 根据权利要求1所述的电路板，其特征在于，所述第一电路区、所述第一折裂区以及所述第二电路区沿着第一方向排列设置，所述第一折裂区沿着与所述第一方向垂直的第二方向具有第一尺寸，所述第一电路区与所述第二电路区沿着所述第二方向具有第二尺寸，所述第一尺寸小于所述第二尺寸。
  3. 根据权利要求2所述的电路板，其特征在于，所述第一折裂区在所述第二方向上包括至少一个弧形缺口。
  4. 根据权利要求3所述的电路板，其特征在于，所述第一折裂区在所述第二方向上相对的两端分别具有一个所述弧形缺口。
  5. 根据权利要求2所述的电路板，其特征在于，所述至少一条导线中任意相邻两条导线定义为第一导线与第二导线，所述第一导线与所述第二导线之间沿着第二方向的间距为第一距离，所述第一导线在所述第二方向具有第一宽度，所述第二导线在所述第二方向具有第二宽度，其中，所述第一距离大于所述第一宽度与第二宽度中最小尺寸的两倍。
  6. 根据权利要求5所述的电路板，其特征在于，所述第一电路区包括邻近所述第一折裂区设置的净空区，所述净空区仅包括有所述至少一条导线沿着所述第一方向的延长线。
  7. 根据权利要求5所述的电路板，其特征在于，所述第二电路区包括连接区，所述至少一个导电端均设置于所述连接区内，所述连接区用于承接与所述导电端电性连接的电子元件或者导电线。
  8. 根据权利要求7所述的电路板，其特征在于，所述至少一个导电端用于与所述电路板外部的测试电路电性连接，所述测试电路通过所述导电端、所述导线与所述导电线路电性导通并且进行数据交换以针对所述导电线路进行测试，当针对所述导电线路的测试完成后，所述第一折裂区在外力作用下的断裂，所述第二电路区与所述第一电路区分离。
  9. 根据权利要求5所述的电路板，其特征在于，所述第二电路区还包括对位孔与工具孔，所述对位孔与所述工具孔设置于所述第二电路区沿着第二方向的一端，所述对位孔用于对所述电路板的位置进行标识，所述工具孔用于与其他固定设备连接以针对所述电路板进行固定。
  10. 一种电路板拼板，其特征在于，包括至少两个如权利要求2-9任意一项所述的电路板，所述两个电路板通过沿着第一方向设置的第二折裂区相互连接，所述第二折裂区包括多个通孔，所述通孔便于所述第二折裂区在外力作用下的断裂。
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